ON LV5682P Multi-power supply system ic Datasheet

Ordering number : ENA1833D
LV5682P
Bi-CMOS LSI
Multi-Power Supply System IC
for Car Audio Systems
http://onsemi.com
Overview
The LV5682P is a multi-power supply system IC that provides four regulator outputs and two high side switches as well as
a number of protection functions including overcurrent protection and overheat protection. It is an optimal power supply
IC for car audio and car entertainment systems and similar products. It is possible to use it like the bus track etc. in the
vehicle whose voltage of the battery is 24V because there is a range of the power-supply voltage up to 32V.
Features
 Four regulator output systems
For microcontroller: 5.0V output voltage, 200mA maximum output current
For CD drive: 8.0V output voltage, 1300mA maximum output current
For illumination: 8 to 12V output voltage (output can be set with external resistors), 300mA maximum output current
For audio systems: 8 to 9V output voltage (output voltage can be set with external resistors), 300mA maximum
output current
 Two VCC-linked high side switch systems
EXT: 350mA maximum output current, 0.5V voltage difference between input and output.
ANT: 300mA maximum output current, 0.5V voltage difference between input and output.
 Two VDD 5V-linked high side switch systems
SW5V: 200mA maximum output current, 0.2V voltage difference between input and output.
ACC (accessory voltage detection output): 100mA maximum output current, 0.2V voltage difference between input
and output.
 Overcurrent protection function
 Overheat protection function, typ 175ºC
 On-chip accessory voltage detection circuit
 P-channel LDMOS used for power output block
(Warning) The protector functions only improve the IC’s tolerance and they do not guarantee the safety of the IC if used under the
conditions out of safety range or ratings. Use of the IC such as use under overcurrent protection range or thermal shutdown state may
degrade the IC’s reliability and eventually damage the IC.
HZIP25
ORDERING INFORMATION
See detailed ordering and shipping information on page 15 of this data sheet.
Semiconductor Components Industries, LLC, 2013
July, 2013
72413HK/50212SY/N0211SY 20111014-S00005/O2010SY/92210SY No.A1833-1/15
LV5682P
Specifications
Absolute Maximum Ratings at Ta = 25C
Parameter
Conditions
Supply voltage
VCC max
Allowable Power dissipation
Pd max
Peak supply voltage
VCC peak
Conditions
Ratings
Unit
36
V
2.7
W
With an infinity heat sink
65
W
Each output is a no load.
50
V
Ta  25C
Independent IC
See below for the waveform applied.
Junction temperature
Tj max
150
C
Operating ambient temperature
Topr
-40 to +85
C
Storage temperature
Tstg
-55 to +150
C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Allowable Operating range at Ta = 25C
Parameter
Conditions
Ratings
Unit
VDD output, SW output and ACC output total current  0.5A
7.5 to 30
V
VDD output, SW output and ACC output total current  0.4A
7.5 to 32
V
Operating supply voltage 2
ILM output at 10V
12 to 32
V
ILM output at 8V
10 to 32
V
Operating supply voltage 3
Audio output at 9V
10 to 32
V
Operating supply voltage 4
CD output (CD output current  1.3A)
10.5 to 24
V
CD output (CD output current  0.7A)
10 to 32
V
Operating supply voltage 1
* The area of safe operation of each output is shown in P13-15. Please perform a set design based on an area of safe operation.
Electrical Characteristics at VCC = 24V, Ta = 25°C (*1)
Ratings
Parameter
Symbol
Conditions
Unit
min
Current drain
ICC
typ
VDD no load, CTRL1/2 = L/L, ACC = 0V
max
400
800
A
CTRL1 Input
Low input voltage
VIL1
0.5
V
M1 input voltage
VIM11
0.8
0
1.1
1.4
V
M2 input voltage
VIM21
1.9
2.2
2.5
V
High input voltage
VIH1
2.9
3.3
5.5
V
Input impedance
RIH1
350
500
650
k
CTRL2 Input
Low input voltage
VIL2
0
0.5
V
M input voltage
VIM2
1.1
1.65
2.1
V
High input voltage
VIH2
2.5
3.3
5.5
V
Input impedance
RIH2
350
500
650
k
VDD 5V Output *2
Output voltage 1
The VDD 5V output supplies the output currents of SW 5V and ACC 5V.
VO1
IO1 = 200mA, IO7, IO8 = 0A
4.75
5.0
5.25
Output voltage 2
VO1’
IO1 = 200mA, IO7 = 200mA, IO8 = 100mA
4.75
5.0
5.25
Output total current
Ito1
VO1  4.75V, Ito1 = IO1+IO7+IO8
500
Line regulation
VOLN1
22V  VCC  32V, IO1 = 200mA *3
Load regulation
VOLD1
Dropout voltage 1
VDROP1
Dropout voltage 2
VDROP1’
Dropout voltage 3
Ripple rejection
V
V
mA
30
90
mV
1mA  IO1  200mA *3
70
150
mV
IO1 = 200mA *3
1.0
1.5
V
IO1 = 100mA *3
0.7
1.05
V
VDROP1”
IO1+IO7+IO8 = 500mA
2.5
3.75
V
RREJ1
f = 120Hz, IO1 = 200mA *3
40
50
dB
*1: All the specifications are provided for by the test by the fact that Tj(=25C) is almost equal. To suppress the rise of Tj in the joint part temperature as much
as possible, it tests by the pulse loading.
*2 : The VDD 5V output also supplies the output currents of SW 5V and ACC 5V. Therefore, the current supply capability of the VDD 5V output and its other
electrical characteristics are affected by the output statuses of SW 5V and ACC 5V.
*3 : SW 5V and ACC 5V are not subject to a load.
Continued on next page.
No.A1833-2/15
LV5682P
Continued from preceding page.
Ratings
Parameter
Symbol
Conditions
Unit
min
typ
max
CD Output ; CTRL2 = H
Output voltage
VO2
IO2 = 1000mA
Output current
IO2
VO2  7.6V
Line regulation
VOLN2
22V  VCC  32V, IO2 = 1000mA
50
100
mV
Load regulation
VOLD2
10mA  IO2  1000mA
100
200
mV
Dropout voltage 1
VDROP2
IO2 = 1000mA
1.0
1.5
V
0.5
0.75
Dropout voltage 2
VDROP2’
IO2 = 500mA
Ripple rejection
RREJ2
f = 120Hz, IO2 = 1000mA
7.6
8.0
8.4
1300
V
mA
V
40
50
dB
1.222
1.260
1.298
V
AUDIO (8-9V) Output ; CTRL2 = M
AUDIO_F pin voltage
VI 3
AUDIO_F pin inflow current
IIN3
1
A
AUDIO output voltage 1
VO3
IO3 = 200mA, R2 = 30k, R3 = 5.6k *4
7.65
8.0
8.35
V
AUDIO output voltage 2
VO3’
IO3 = 200mA, R2 = 27k, R3 = 4.7k *4
8.13
8.5
8.87
V
AUDIO output voltage 3
VO3”
IO3 = 200mA, R2 = 24k, R3 = 3.9k *4
8.6
9.0
9.4
AUDIO output current
IO3
Line regulation
VOLN3
Load regulation
VOLD3
1mA  IO3  200mA
Dropout voltage 1
VDROP3
IO3 = 200mA
Dropout voltage 2
VDROP3’
IO3 = 100mA
0.15
Ripple rejection
RREJ3
f = 120Hz, IO3 = 200mA
-1
300
22V  VCC  32V, IO3 = 200mA
V
mA
30
90
mV
70
150
mV
0.3
0.45
V
0.23
V
40
50
dB
1.222
1.260
1.298
V
V
ILM (8-12V) Output ; CTRL1 = M1
ILM_F pin voltage
VI4
ILM output voltage 1
VO4
IO4 = 200mA
11.4
12.0
12.6
ILM output voltage 2
VO4’
IO4 = 200mA, R1 = 270k *5
8.5
10.0
11.5
V
ILM output voltage 3
VO4”
IO4 = 200mA, R1 = 100k *5
6.8
8.0
9.2
V
ILM output current
IO4
R1 = 270k
300
Line regulation
VOLN4
22V  VCC  32V, IO4 = 200mA
30
90
mV
Load regulation
VOLD4
1mA  IO4  200mA
70
150
mV
Dropout voltage 1
VDROP4
IO4 = 200mA
0.7
1.05
V
0.35
0.53
mA
Dropout voltage 2
VDROP4’
IO4 = 100mA
Ripple rejection
RREJ4
f = 120Hz, IO4 = 200mA
Output voltage
VO5
IO5 = 350mA
Output current
IO5
VO5  VCC-1.0
Output voltage
VO6
IO6 = 300mA
Output current
IO6
VO6  VCC-1.0
Output voltage 1
VO7
IO7 = 1mA, IO1, IO8 = 0A *6
VO1-0.25
VO1
Output voltage 2
VO7’
IO7 = 200mA, IO1, IO8 = 0A *6
VO1-0.45
VO1-0.2
Output current
IO7
VO7  4.55
40
50
VCC-1.0
VCC-0.5
V
dB
Remoto (EXT) ; CTRL1 = M2
V
350
mA
ANT remoto ; CTRL1 = H
VCC-1.0
VCC-0.5
V
300
mA
SW 5V Output ; CTRL2 = M
V
V
200
mA
ACC Detection ; ACC Integration 5V output
ACC detection voltage
VTH8
2.8
3.0
3.2
Hysteresis width
VHIS8
0.2
0.3
0.4
V
Input impedance
ZI8
(Pull-down resistance internal)
42
60
78
k
ACC output voltage 1
VO8
IO8 = 0.5mA, IO1, IO7 = 0A *6
VO1-0.25
VO1
ACC output voltage 2
VO8’
IO8 = 100mA, IO1, IO7 = 0A *6
VO1-0.45
VO1-0.2
ACC output voltage
IO8
VO8  4.55
100
V
V
V
mA
*4 : When a component with a resistance accuracy of 1% is used
<Reference> When a component with a resistance accuracy of 0.5% is used, VO3” is 8.67V  9.0V  9.33V.
*5 : When a component with a resistance accuracy of 1% is used
The absolute accuracy of the internal resistance is 15%.
*6 : Since the SW 5V and ACC 5V are output from VDD 5V through the SW, the voltage drops by an amount equivalent to the ON resistance of the SW.
No.A1833-3/15
LV5682P
Package Dimensions
unit : mm (typ)
29.2
25.6
(22.8)
( 2.5)
4.5
14.5
(14.4)
(11.0)
21.7
18.6 max
(R1.7)
(5.0)
(12.3)
(8.5)
0.4
25
(2.6)
(1.0)
3.5
1
0.52
2.0
4.0
4.2
2.0
SANYO : HZIP25
• Allowable power dissipation derating curve
Pd max -- Ta
Allowable power dissipation, Pd max -- W
70
Infinite heat rediation
60
50
Heat sink mounting condition
tightening torque:39N-cm,
using silicone grease
40
30
20.8
5 C /W heat sink
20
11.4
10
10 C /W heat sink
0
-40
0
40
80
120
160
Ambient temperature, T
Ta ---- C
• Waveform applied during surge test
50V
90%
10%
16V
5msec
100msec
No.A1833-4/15
LV5682P
Block Diagram
+B
VCC
12
C2
+
C1
EXT
out
Remote EXT (VCC-0.5V)
D1 350mA
21
ANT
out
Start
up
+
Vref
+
C3
D2
ANT Remote (VCC-0.5V)
D3 300mA
20
+
D4
C4
5
ILM output (8V to 12V)
300mA
+
R1 C5
C6
6
ILM_F
+
CTRL1
(four-value control) 13
10
AUDIO output (8V to 9V)
300mA
+
R2 C7
C8
8
AUDIO_F
R3
OUTPUT
CTRL2
(three-value control) 11
Control
+
CD output (8V)
1300mA
+
C9
C10
7
+
Thermal
Shut Down
VDD output (5.0V)
200mA
17
+
C11
C12
GND
14
SW output (5V)
19
200mA
ACC
+
-
15
ACC output (5V)
16
Output Current Limit Circuit
100mA
Pin Function
Pin No.
Pin name
Description
1 to 4
N.C.
-
5
ILM
ILM output pin
ON when CTRL1 = M1, M2, H
Equivalent Circuit
-
12
VCC
12.0V/300mA
5
6
ILM_F
ILM output voltage adjustment pin
6
14
GND
Continued on next page.
No.A1833-5/15
LV5682P
Continued from preceding page.
Pin No.
7
Pin name
CD
Description
Equivalent Circuit
CD output pin
VCC
12
ON when CTRL2 = M, H
8.0V/1.3A
7
8
AUDIO_F
14
GND
12
VCC
AUIDO output voltage adjustment pin
10
9
N.C.
10
AUDIO
AUDIO output pin
8
ON when CTRL2 = M, H
14
11
CTRL2
CTRL2 input pin
three-value input
12
GND
VCC
11
14
12
VCC
13
CTRL1
GND
Supply terminal
CTRL1 input pin
four-value input
12
VCC
13
14
14
GND
GND
GND pin
Continued on next page.
No.A1833-6/15
LV5682P
Continued from preceding page.
Pin No.
15
Pin name
ACC
Description
Equivalent Circuit
Accessory input
VCC
12
15
14
16
ACC5V
GND
Accessory detection output
ON when ACC  3V
12
17
17
VDD5V
VDD5V output pin
5.0V/200mA
18
N.C.
-
19
SW5V
SW5V output pin
VCC
16
19
ON when CTRL2 = M, H
14
20
ANT
GND
ANT output pin
ON when CTRL1 = H
VCC
12
VCC-0.5V/300mA
20
21
EXT
EXT output pin
ON when CTRL1 = M2, H
14
GND
12
VCC
VCC-0.5V/350mA
21
14
22 to 25
N.C.
-
GND
-
No.A1833-7/15
LV5682P
CTRL Pin Output Truth Table
CTRL1
ANT
EXT
ILM
CTRL2
CD
AUDIO
SW5
L
OFF
OFF
OFF
L
OFF
OFF
OFF
M1
OFF
OFF
ON
M
OFF
ON
ON
M2
OFF
ON
ON
H
ON
ON
ON
H
ON
ON
ON
Timing Chart
36V
VCC
(12PIN)
VDD5V output
(17PIN)
CTRL1 input
(13PIN)
CTRL2 input
(11PIN)
CD output
(7PIN)
AUDIO output
(10PIN)
ILM output
(5PIN)
EXT output
(21PIN)
ANT output
(20PIN)
SW5V output
(19PIN)
ACC input
(15PIN)
3.0V
2.7V
ACC output
(16PIN)
No.A1833-8/15
LV5682P
Recommended Operation Circuit
ILM
R1
ACC5V
ACC
CTRL2
CTRL1
+
C1 + C2
C8
CD
N.C.
N.C.
N.C.
24
25
23
+
C3
SW5V
D1
R3
C9 + C10
22
21
R2
C5 + C6
N.C.
ANT
20
19
EXT
18
17
15
SW5V
16
N.C.
VDD5V
14
13
ACC5V
GND
VCC
12
11
ACC
10
9
CTRL1
8
7
CTRL2
AUDIO
AUDIO_F
N.C.
6
5
CD
ILM_F
N.C.
4
3
ILM
2
1
N.C.
N.C.
N.C.
LV5682P
AUDIO
C7
VCC
C11 + C12
VDD5V
D4 D3
+
C4
ANT
D2
EXT
Peripheral parts list
Name of part
Recommended value
Remarks
C1
Power supply bypass capacitor
100F or more
These capacitors must be placed near
C2
Oscillation prevention capacitor
0.22F or more
the VCC and GND pins.
C3
EXT output stabilization capacitor
2.2F or more
C4
ANT output stabilization capacitor
2.2F or more
C6, C9, C11, C13
Output stabilization capacitor
4.7F or more
Electrolytic capacitor *
C7, C10, C12, C14
Output stabilization capacitor
0.22F or more
Ceramic capacitor *
R1
Description
Resistor for ILM voltage adjustment
ILM output voltage
A resistor with resistance accuracy as
R1:without = 12.0V
low as less than 1% must be used.
:270k = 10.0V
R2/R3:30k/5.6k = 8.0V
R2, R3
Resistor for AUDIO voltage setting
:27k/4.7k = 8.5V
:24k/3.9k = 9.0V
D1, D2, D3, D4
Diode for internal device breakdown protection
A resistor with resistance accuracy as
low as less than 1% must be used.
Recommendation:
SBD1003M3(30V/1.0A)
* : In order to stabilize the regulator outputs, it is recommended that the electrolytic capacitor and ceramic capacitor be connected in parallel.
Moreover, the above-mentioned value doesn't guarantee the operation stability in use and the overcurrent protection operation by IOmax or more of the
regulator. Therefore, there is a possibility of oscillating by use conditions.
No.A1833-9/15
LV5682P
• ILM output voltage setting method
Formula for ILM voltage calculation
Z1  R2 //R3 
ILM
5
R2
ILM 
R3
Z1=R2/R3
1.26V
ILM_F
6
Z1 
R2  R3
R2  R3
1.26[V ]
 Z1  1.26[V ]
R1
ILM  1.26  R1
1.26
R3 
R2  Z 1
R2  Z 1
Example : ILM = 9V setting method
R1
Z1 
The ILM_F voltage is determined by the
internal band gap voltage of the IC (typ = 1.26V).
R3 
9V  1.26V  7kΩ  43kΩ
1.26V
59.67 kΩ  43kΩ
 153.9kΩ  150k
59.67 kΩ  43kΩ
When R3 = 150k, the ILM output voltage will be as follows:
59.67kΩ 150kΩ
Z1 
 42.69kΩ
59.67kΩ  150kΩ
ILM 
1.26V
 42.69kΩ  1.26V  8.94V
7 kΩ
• AUDIO output voltage setting method
Formula for AUDIO voltage calculation
AUDIO 
10
R1  AUDIO  1.26

R2
1.26
AUDIO
R1
1.26V
8
1.26[V ]
 R1  1.26[V ]
R2
AUDIO_F
R2
The AUDIO_F voltage is determined by the
internal band gap voltage of the IC (typ = 1.26V).
The circuit must be designed in such a way that the R1:R2 ratio
satisfies the formula given above for the AUDIO voltage that
has been set.
Example : AUDIO = 8.5V setting method
R1 8.5  1.26

 5.75
R2
1.26
R1 27 kΩ

 5.74
R2 4.7 kΩ
AUDIO  1.26V  5.74  1.26V  8.49V
Note : In the above, the typical values are given in all instances for the values used and, as such, they will vary due to the
effects of production-related variations of the IC and external resistors.
No.A1833-10/15
LV5682P
• CTRL1 Application Circuit Example
(1) 3.3V input: R1 = 4.7k, R2 = 10k
R1
A
R2
CTRL1
B
A
B
0V
0V
CTRL1
0V
0V
3.3V
1.05V
3.3V
0V
2.23V
3.3V
3.3V
3.20V
500kΩ
• CTRL2 Application Circuit Example
(1) 3.3V input: R3 = R4 = 4.7k
C
R3
R4
CTRL2
D
A
B
CTRL2
0V
0V
0V
0V
3.3V
1.61V
3.3V
0V
1.61V
3.3V
3.3V
3.29V
500kΩ
No.A1833-11/15
LV5682P
HZIP25 Heat sink attachment
Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to
the outer environment and dissipating that heat.
a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be
applied to the heat sink or tabs.
b.
Heat sink attachment
· Use flat-head screws to attach heat sinks.
· Use also washer to protect the package.
· Use tightening torques in the ranges 39-59Ncm(4-6kgcm) .
· If tapping screws are used, do not use screws with a diameter larger
than the holes in the semiconductor device itself.
· Do not make gap, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
· Take care a position of via hole .
· Do not allow dirt, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
· Verify that there are no press burrs or screw-hole burrs on the heat sink.
· Warping in heat sinks and printed circuit boards must be no more than
0.05 mm between screw holes, for either concave or convex warping.
· Twisting must be limited to under 0.05 mm.
· Heat sink and semiconductor device are mounted in parallel.
Take care of electric or compressed air drivers
· The speed of these torque wrenches should never exceed 700 rpm,
and should typically be about 400 rpm.
Binding head
machine screw
Countersunk head
mashine screw
Heat sink
gap
Via hole
c.
Silicone grease
· Spread the silicone grease evenly when mounting heat sinks.
· Recommends YG-6260 (Momentive Performance Materials Japan LLC)
d.
Mount
· First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board.
· When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening
up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin
doesn't hang.
e.
When mounting the semiconductor device to the heat sink using jigs, etc.,
· Take care not to allow the device to ride onto the jig or positioning dowel.
· Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device.
f.
Heat sink screw holes
· Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used.
· When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used.
A hole diameter about 15% larger than the diameter of the screw is desirable.
· When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about
15% smaller than the diameter of the screw is desirable.
g.
There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not
recommended because of possible displacement due to fluctuation of the spring force with time or vibration.
No.A1833-12/15
LV5682P
Caution for usage
When allowablepower dissipation and power supply voltage exceed absolute maximum ratings or depends on usage
conditions, LV5682P may be destroyed before Thermal Shut Down circuit operates.
Particularly caution is required for CD output. CD output can output high current and power dissipation is high. Therefore,
when electric potential of VCC is high, a risk for IC destruction increases. The following diagram dhows Area of Safety
Operation (ASO) CD output under the TYP conditions. However, it omly shpws the case where CD output is used
independently. IC destruction may occur due to usage conditions in your system or manufacturing process of the IC.
Therefore, your system should be designed with margin for a practical usage.
34
32
1msec
VCC[V]
30
*CD output is used independently with board
and without heatsink
28
ASO
26
24
Ta=25 C
DC
22
20
0.5
0.7
0.9
1.1
1.3
1.5
CD output current[A]
Other channel of Area of Safety Operation (ASO)
VDD5V output
34
AUDIO output
34
32
32
Ta=25 C
30
VCC[V]
VCC[V]
30
28
DC
ASO
26
24
22
20
0
Ta=25 C
28
DC
ASO
26
24
22
*Each output should not exceed IOmax
0.2
0.4
0.6
Total output current of VDD5V(VDD5V, SW5V, ACC5V)[A]
20
0
0.1
0.2
0.3
0.4
AUDIO output current[A]
No.A1833-13/15
LV5682P
ILM output
34
Ta=25 C
32
VCC[V]
30
DC
28
ASO
26
24
22
20
0
0.1
0.2
0.3
0.4
CD output current[A]
*Characteristics of output current vs. output voltage (output pin).
Evalution is performed with pulse load so that Tj and Ta become almost equal. Also, the following shows typical
characteristics with a standard sample. Characteristics may fluctuate depends on IC manufacturing process.
6
9
IO max
IO max
8
7
0C
-4
C
2
0C
5
-4
3
VCC=24V
6
C
4
85
CD output voltage[V]
VCC=24V
85
VDD5V output voltage[V]
5
4
25 C
3
2
1
1
25 C
0
0
0.2
0.4
0.6
0.8
0
0
1.0
0.5
1.0
10
2.5
IO max
C
25 C
12
25 C
6
5
4
3
10
-4
-4
ILM output voltage[V]
0C
VCC=24V
0C
85
8
8
VCC=24V
6
4
2
C
2
1
0
0
85
AUDIO output voltage[V]
2.0
14
IO max
9
7
1.5
CD output current[A]
VDD5V output current[A]
0.2
0.4
0.6
0.8
AUDIO output current[A]
1.0
1.2
0
0
0.2
0.4
0.6
0.8
1.0
ILM output current[A]
No.A1833-14/15
LV5682P
30
30
IO max
IO max
25
-40 C
ANT output voltage [V]
EXT output voltage [V]
25
20
85 C
VCC=24V
25 C
15
10
5
20
15
85 C
VCC=24V
10
5
0
0
500
1000
1500
0
0
2000
500
EXT output current [A]
6
1500
6
IO max
IO max
5
-40 C
ACC5V output voltage [V]
SW5V output voltage [V]
1000
ANT output current [A]
5
4
3
-40 C
25 C
VCC=24V
25 C
2
85 C
-40 C
4
3
VCC=24V
25 C
2
85 C
1
1
0
0
0.2
0.4
0.6
0.8
SW5V output current [A]
0
0
0.2
0.4
0.6
0.8
1.0
ACC5V output current [A]
ORDERING INFORMATION
Device
LV5682P-E
Package
HZIP25
(Pb-Free)
Shipping (Qty / Packing)
15 / Fan-Fold
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PS No.A1833-15/15
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