FPF1015/6/7/8 IntelliMAX TM tm 1V Rated Advanced Load Management Products Features General Description 0.8 to 1.8V Input Voltage Range The FPF1015/6/7/8 series is an IntelliMAX advanced slew rate loadswitch offering a very low operating voltage. These devices consist of a 34mΩ N-channel MOSFET that supports an input voltage up to 2.0V. These slew rate devices control the switch turn-on and prevent excessive in-rush current from the supply rails. The input voltage range operates from 0.8V to 1.8V to fulfill today's lowest Ultraportable Device's supply requirements. Switch control is via a logic input (ON) capable of interfacing directly with low voltage control signals. Typical RDS(ON) = 34mΩ @ VON - VIN = 2.0V Output Discharge Function Internal Pull down at ON Pin Accurate Slew Rate Controlled Turn-on time Low < 1µA Quiescent Current ESD Protected, above 8000V HBM, 2000V CDM RoHS Compliant The FPF1016 and FPF1018 have an On-Chip pull down allowing for quick and controlled output discharge when switch is turned off. The FPF1015/6/7/8 series is available in a space-saving 2X2 MLP-6L package. Free from Halogenated Compounds and Antimony Oxides Applications PDAs Cell Phones GPS Devices MP3 Players Digital Cameras Notebook Computers PIN 1 TOP BOTTOM Typical Application Circuit TO LOAD VOUT VIN FPF1015/6/7/8 OFF ON ON - COUT GND CIN Ordering Information Part Switch Turn-on Time Output Discharge ON Pin Activity Package FPF1015 34mΩ, NMOS 43us NA Active HI MLP 2x2 FPF1016 34mΩ, NMOS 43us 60Ω Active HI MLP 2x2 FPF1017 34mΩ, NMOS 165us NA Active HI MLP 2x2 FPF1018 34mΩ, NMOS 165us 60Ω Active HI MLP 2x2 ©2009 Fairchild Semiconductor Corporation FPF1015/6/7/8 Rev. D 1 www.fairchildsemi.com FPF1015/6/7/8 IntelliMAXTM 1V Rated Advanced Load Management Products June 2009 FPF1015/6/7/8 IntelliMAXTM 1V Rated Advanced Load Management Products Functional Block Diagram VIN CONTROL LOGIC ON Turn-on Slew Rate Controlled Driver VOUT ESD protection Output Discharge (Optional for FPF1016/18) FPF1015/6/7/8 GND Pin Configuration GND 6 1 ON VOUT 5 2 VIN VOUT 4 3 VIN MicroFET 2x2 6L BOTTOM VIEW Pin Description Pin Name 1 ON ON/OFF Control Input, 2nd Supply Function Supply Input: Input to the power switch 2, 3 VIN 4, 5 VOUT Switch Output. 6 GND Ground Absolute Maximum Ratings Parameter Min Max Unit VIN, VOUT to GND -0.3 2 V VON to GND -0.3 4.2 V 1.5 A Maximum Continuous Switch Current 1.2 W Operating Temperature Range Power Dissipation @ TA = 25°C (Note 1) -40 85 °C Storage Temperature -65 150 °C 86 °C/W Thermal Resistance, Junction to Ambient Electrostatic Discharge Protection HBM 8000 V CDM 2000 V Recommended Operating Range Parameter Min Max Unit VIN 0.8 1.8 V Ambient Operating Temperature, TA -40 85 °C Note 1: Package power dissipation on 1square inch pad, 2 oz. copper board FPF1015/6/7/8 Rev. D 2 www.fairchildsemi.com VIN = 0.8 to 1.8V, TA = -40 to +85°C unless otherwise noted. Typical values are at VIN = 1.8V and TA = 25°C. Parameter Symbol Conditions Min Typ Max Unit 1.8 V 1.8 2.8 4.0 V 2.8 3.8 Basic Operation Operating Voltage ON input Voltage 0.8 VIN VON(MIN) VIN = 0.8V 4.0 V ICC VIN = 1V, VON = 3.3V, VOUT = Open 1 µA Quiescent Current IQ VIN = 1V, VON = VOUT = Open 2 µA Off Switch Current ISWOFF VIN = 1.8V, VON = GND, VOUT = GND 2 µA Operating Current VON(MAX) VIN = 1.8V(Note2) On-Resistance RON Output Pull Down Resistance RPD ON Input Logic Low Voltage VIL VIN = 1V, VON = 3V, ILOAD = 1A, TA = 25°C 34 45 VIN = 1V, VON = 2.3V, ILOAD = 1A, TA = 25°C 41 55 VIN = 1V, VON = 0V, TA = 25°C, ILOAD = 1mA, FPF1016, FPF1018 60 120 VIN = 0.8V, RLOAD = 1KΩ 0.3 VIN = 1.8V, RLOAD = 1KΩ 0.8 VON = VIN or GND ON Input Leakage -1 1 mΩ Ω V µA Dynamic (VIN = 1.0V, VON = 3.0V, TA = 25°C) VOUT Rise Time Turn ON VOUT Fall Time Turn Off TR TON TF TOFF FPF1015, FPF1016, RL = 500Ω, CL = 0.1µF 28 FPF1017, FPF1018, RL = 500Ω, CL = 0.1µF 114 FPF1015, FPF1016, RL = 3.3Ω, CL = 10µF 38 FPF1017, FPF1018, RL = 3.3Ω, CL = 10µF 155 FPF1015, FPF1016, RL = 500Ω, CL = 0.1µF 43 FPF1017, FPF1018, RL = 500Ω, CL = 0.1µF 165 FPF1015, FPF1016, RL = 3.3Ω, CL = 10µF 58 FPF1017, FPF1018, RL = 3.3Ω, CL = 10µF 228 FPF1015, FPF1017, RL = 500Ω, CL = 0.1µF 105 FPF1016, FPF1018, RPD = 60Ω, RL = 500Ω, CL = 0.1µF 15 FPF1015, FPF1017, RL = 3.3Ω, CL = 10µF 80 FPF1016, FPF1018 RPD = 60Ω, RL = 3.3Ω, CL = 10µF 74 FPF1015, FPF1017, RL = 500Ω, CL = 0.1µF 150 FPF1016, FPF1018 RPD = 60Ω, RL = 500Ω, CL = 0.1µF 53 FPF1015, FPF1017, RL = 3.3Ω, CL = 10µF 102 FPF1016, FPF1018 RPD = 60Ω, RL = 3.3Ω, CL = 10µF 96 µs µs µs µs Note 2: VON(MAX) is limited by the absolute rating. FPF1015/6/7/8 Rev. D 3 www.fairchildsemi.com FPF1015/6/7/8 IntelliMAXTM 1V Rated Advanced Load Management Products Electrical Characteristics 12 0.02 0.018 VON = 0V 10 0.014 VON = 0V VOUT = Open VIN = 1.8V VIN = 1.0V 8 0.012 IQ (uA) Supply Current (uA) 0.016 0.01 0.008 4 VON =3.3V 0.006 6 0.004 2 0.002 VIN = 0.8V 0 0.8 1 1.2 1.4 1.6 0 -50 1.8 -25 0 Figure 1. Supply Current vs.VIN 9 VIN = 1.8V 8 ISWOFF ( uA) 0.12 0.1 ICC (uA) 75 100 125 100 125 10 VON = 3.3V VOUT = Open 0.14 0.08 VIN = 1.0V 0.06 0.04 VIN = 1.8V VON = 0V VOUT = 0V 7 6 5 4 3 2 0.02 1 VIN = 0.8V 0 -50 -25 0 25 50 75 100 0 -50 125 TJ, Junction Temperature (oC) -25 0 25 50 75 TJ, Junction Temperature oC Figure 3. Operating Current vs. Temperature Figure 4. Off Switch Current vs. Temperature 45 60 VIN = 1 V VON = 3 V IOUT = 1 A VON = 3V IOUT = 1A 55 On Resistance (mOhms) On Resistance (mOhms) 50 Figure 2. Quiescent Current vs. Temperature 0.16 40 25 TJ, Junction Temperature oC Supply Voltage (V) 35 30 25 50 45 40 35 30 25 20 -50 -25 0 25 50 75 100 20 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 125 TJ, Junction Temperature (oC) Figure 5. RON vs. Temperature FPF1015/6/7/8 Rev. D 2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 VON - VIN (V) Figure 6. RON vs. VON - VIN 4 www.fairchildsemi.com FPF1015/6/7/8 IntelliMAXTM 1V Rated Advanced Load Management Products Typical Characteristics 1.5 1.4 VIN = 1.8V On Threshold Voltage, VIL (V) On Threshold Voltage (V) 1.2 1 0.8 0.6 0.4 0.2 0 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.2 0.9 VIN = 1.0V 0.6 VIN = 0.8V 0.3 0 -50 1.8 -25 0 Figure 7. VIL vs. VIN VIN = 1V VON = 3V RL = 3.3 Ohm CL = 10uF 250 Turn ON/OFF Time (us) Rise/Fall Time (us) 75 100 125 300 FPF1017 / 18 TRISE 100 50 Figure 8. VIL vs. Temperature 200 150 25 TJ, Junction Temperature (oC) Supply Voltage (V) FPF1016 / 18 TFALL 50 -15 10 35 150 FPF1016 / 18 TOFF 100 50 FPF1015 / 16 TRISE 0 -40 200 FPF1017 / 18 TON VIN = 1V VON = 3V RL = 3.3 Ohm CL = 10uF 60 FPF1015 / 16 TON 0 -40 85 -15 TJ, Junction temperature (oC) Figure 9. TRISE/TFALL vs. Temperature VON 2V/DIV IOUT 500mA/DIV IOUT 500mA/DIV VOUT 500mV/DIV VIN = 1V VON = 2.6V CIN = 10uF CL= 10uF RL = 3.3Ω VIN 500mV/DIV VOUT 500mV/DIV 100us/DIV 60 85 VIN = 1V VON = 2.6V CIN = 10uF CL = 4.7uF RL = 1Ω 100us/DIV Figure 11. FPF1015 / 16 Turn ON response FPF1015/6/7/8 Rev. D 35 Figure 10. TON/TOFF vs. Temperature VON 2V/DIV VIN 500mV/DIV 10 TJ, Junction Temperature (oC) Figure 12. FPF1015 / 16 Turn ON response 5 www.fairchildsemi.com FPF1015/6/7/8 IntelliMAXTM 1V Rated Advanced Load Management Products Typical Characteristics VON 2V/DIV VON 2V/DIV IOUT 500mA/DIV IOUT 500mA/DIV VIN 500mV/DIV VOUT 500mV/DIV VIN = 1V VON = 2.6V CIN = 10uF CL = 10uF RL = 3.3Ω VIN 500mV/DIV VOUT 500mV/DIV 100us/DIV 100us/DIV Figure 13. FPF1017 / 18 Turn On response Figure 14. FPF1017 / 18 Turn On response VON 2V/DIV VON 2V/DIV IOUT 500mA/DIV IOUT 500mA/DIV VIN = 1V VON = 2.6V CIN = 10uF CL= 10uF RL = 3.3Ω IVIN 500mV/DIV VOUT 500mV/DIV VIN 500mV/DIV VOUT 500mV/DIV 100us/DIV Figure 16. FPF105 / 17 Turn OFF response VON 2V/DIV VON 2V/DIV IOUT 500mA/DIV IOUT 500mA/DIV VIN = 1V VON = 2.6V CIN = 10uF CL = 10uF RL = 3.3Ω VOUT 500mV/DIV VIN = 1V VON = 2.6V CIN = 10uF CL = 4.7uF RL = 1Ω VIN 500mV/DIV VOUT 500mV/DIV 100us/DIV 100us/DIV Figure 17. FPF1016 / 18 Turn OFF response FPF1015/6/7/8 Rev. D VIN = 1V VON = 2.6V CIN = 10uF CL = 47uF RL = 1Ω 100us/DIV Figure 15. FPF1015 / 17 Turn OFF response VIN 500mV/DIV VIN = 1V VON = 2.6V CIN = 10uF CL = 47uF RL = 1Ω Figure 18. FPF1016 / 18 Turn OFF response 6 www.fairchildsemi.com FPF1015/6/7/8 IntelliMAXTM 1V Rated Advanced Load Management Products Typical Characteristics FPF1015/6/7/8 IntelliMAXTM 1V Rated Advanced Load Management Products Typical Characteristics VON 2V/DIV VIN 500mV/DIV VOUT 500mV/DIV VIN = 1V VON = 2.6V CIN = 10uF RL = 499Ω 20us/DIV Figure 19. FPF1016 / 18 Output Pull Down response FPF1015/6/7/8 Rev. D 7 www.fairchildsemi.com Timing Diagram The FPF1015/6/7/8 are low RDS(ON) N-Channel load switches with controlled turn-on. The core of each device is a 34mΩ (VIN = 1V, VON = 3V) N-Channel MOSFET and is customized for a low input operating range of 0.8 to 1.8V. The ON pin controls the state of the switch. 90% VON The FPF1016 and FPF1018 contain a 60Ω(typ) on-chip resistor which is connected internally from VOUT to GND for quick output discharge when the switch is turned off. 10% 90% 90% VOUT 10% 10% tdON tR On/Off Control tdOFF tF tON The ON pin is active high and it controls the state of the switch. Applying a continuous high signal will hold the switch in the ON state. In order to minimize the switch on resistance, the ON pin voltage should exceed the input voltage by 2V. This device is compatible with a GPIO (General Purpose Input/Output) port, where the logic voltage level can be configured to 4V ≥ VON ≥ VIN+2V and power consumed is less than 1µA in steady state. where: tdON tR tON tdOFF tF tOFF = = = = = = tOFF Delay On Time VOUT Rise Time Turn On Time Delay Off Time VOUT Fall Time Turn Off Time Application Information Typical Application VOUT VIN VIN = 0.8-1.8V FPF1015/6/7/8 CIN OFF ON RL CL ON GND Input Capacitor Board Layout To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns-on, a capacitor must be placed between VIN and GND. For minimized voltage drop, especially when the operating voltage approaches 1V and a fast slew rate part (FPF1015 and FPF1016) is selected, a 10µF ceramic capacitor should be placed close to the VIN pins. Higher values of CIN can be used to further reduce the voltage drop during higher current modes of operation. For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short-circuit operation. Using wide traces or large copper planes for all pins (VIN, VOUT, ON and GND) will help minimize the parasitic electrical effects along with minimizing the case to ambient thermal impedance. Output Capacitor A 0.1µF capacitor, CL, should be placed between VOUT and GND. This capacitor will prevent parasitic board inductance from forcing VOUT below GND when the switch turns-off. If the application has a capacitive load, the FPF1016 and FPF1018 can be used to discharged that load through an on-chip output discharge path. FPF1015/6/7/8 Rev. D 8 www.fairchildsemi.com FPF1015/6/7/8 IntelliMAXTM 1V Rated Advanced Load Management Products Description of Operation Demo Board Layout An improper layout could result in higher junction temperature. This concern applies when the current is at its continuous maximum value and is then switched into a large capacitive load that introduces a large transient current. Since the FPF1015/6/7/8 does not have thermal shutdown capability, a proper layout is essential to improving power dissipation of the switch in transient events and prevents the switch from exceeding the maximum absolute power dissipation of 1.2W. FPF1015/6/7/8 Demo board has the components and circuitry to demonstrate FPF1015/6/7/8 load switches functions. Thermal performance of the board is improved using a few techniques recommended in the layout recommendations section of datasheet. The following techniques have been identified to improve the thermal performance of this family of devices. These techniques are listed in order of the significance of their impact. 1. Thermal performance of the load switch can be improved by connecting pin7 of the DAP (Die Attach Pad) to the GND plane of the PCB. 2. Embedding two exposed through-hole vias into the DAP (pin7) provides a path for heat to transfer to the back GND plane of the PCB. A drill size of Round, 14 mils (0.35mm) with 1-ounce copper plating is recommended to result in appropriate solder reflow. A smaller size hole prevents the solder from penetrating into the via, resulting in device lift-up. Similarly, a larger via-hole consumes excessive solder, and may result in voiding of the DAP. Figure 21. FPF1015/6/7/8 Demo board TOP, SST, ASTOP and DRL layers 1 4 M il 1 5 M il Figure 19: Two through hole open vias embedded in DAP 3. The VIN, VOUT and GND pins will dissipate most of the heat generated during a high load current condition. The layout suggested in Figure 20 provides each pin with adequate copper so that heat may be transferred as efficiently as possible out of the device. The ON pin trace may be laid-out diagonally from the device to maximize the area available to the ground pad. Placing the input and output capacitors as close to the device as possible also contributes to heat dissipation, particularly during high load currents. Figure 20: Proper layout of output, input and ground copper area FPF1015/6/7/8 Rev. D 9 www.fairchildsemi.com FPF1015/6/7/8 IntelliMAXTM 1V Rated Advanced Load Management Products Improving Thermal Performance FPF1015/6/7/8 IntelliMAXTM 1V Rated Advanced Load Management Products Dimensional Outline and Pad Layout FPF1015/6/7/8 Rev. D 10 www.fairchildsemi.com TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. 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Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. Rev. I41 © 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com