CY8C20x37/37S/47/47S/67/67S ® 1.8 V CapSense Controller with SmartSense™ Auto-tuning – 31 Buttons, 6 Sliders 1.8 V CapSense® Controller with SmartSense™ Auto-tuning Support Internal low-speed oscillator (ILO) at 32 kHz for watchdog and sleep timers ❐ RC crystal oscillator ❐ Clock input Features ■ ■ ❐ QuietZone™ Controller ❐ Patented Capacitive Sigma Delta PLUS (CSD PLUS™) sensing algorithm for robust performance ❐ High Sensitivity (0.1 pF) and best-in-class SNR performance to support: • Ideal for proximity solutions • Overlay thickness of 15 mm for glass and 5 mm plastic ❐ Superior noise immunity performance against conducted and radiated noise and ultra low radiated emissions • Reliable and robust touch performance in noisy environments ❐ Standardized user modules for overcoming noise Low power CapSense® block with SmartSense™ auto-tuning ❐ Supports a combination of up to 31 buttons or 6 sliders, proximity sensors ❐ Low average power consumption - 28 A for each sensor at runtime (wake from sleep and scan sensors every 125 ms) ❐ SmartSense auto-tuning • Sets and maintains optimal sensor performance during runtime • Eliminates system tuning during development and production • Compensates for variations in manufacturing process ■ Driven shield available on five GPIO pins ❐ Max load of 100 pF at 3 MHz ❐ Frequency range: 375 kHz to 3 MHz ❐ Delivers best-in class water tolerant designs ❐ Robust proximity sensing in the presence of metal objects ■ Powerful Harvard-architecture processor ❐ M8C CPU with a maximum speed of 24 MHz ❐ Operating range: 1.71 V to 5.5 V • Standby mode: 1.1 µA (typ) • Deep sleep: 0.1 µA (typ) ❐ Temperature range: –40 °C to +85 °C ■ Flexible on-chip memory ❐ 8 KB flash, 1 KB SRAM ❐ 16 KB flash, 2 KB SRAM ❐ 32 KB flash, 2 KB SRAM ❐ 50,000 flash erase/write cycles ❐ In-system programming capability ■ Four clock sources ❐ Internal main oscillator (IMO): 6/12/24 MHz ■ Programmable pin configurations ❐ Up to 32 general-purpose I/Os (GPIOs) ❐ Dual mode GPIO ❐ High sink current of 25 mA for each GPIO. Total 120 mA maximum sink current per chip ❐ 5 mA source current on port 0 and 1 and 1 mA on port 2,3 and 4 ❐ Configurable internal pull-up, high-Z, and open drain modes ❐ Selectable, regulated digital I/O on port 1 ❐ Configurable input threshold on port 1 ■ Versatile analog mux ❐ Common internal analog bus ❐ Simultaneous connection of I/O ❐ High power supply rejection ratio (PSRR) comparator ❐ Low-dropout voltage regulator for all analog resources ■ Additional system resources I2C slave: • Selectable to 50 kHz, 100 kHz, or 400 kHz • Selectable clock stretch or forced Nack mode • Implementation during sleep modes with less than 100 µA • I2C wake from sleep with hardware address validation ❐ 12 MHz SPI master and slave ❐ Three 16-bit timers ❐ Watchdog and sleep timers ❐ Internal voltage reference ❐ Integrated supervisory circuit ❐ 10-bit incremental analog-to-digital converter (ADC) ❐ Two general-purpose high speed, low power analog comparators ❐ ■ Complete development tools ❐ Free development tool (PSoC Designer™) ■ Package options ❐ 16-pin SOIC (150 mil) ❐ 16-pin QFN – 3 × 3 × 0.6 mm ❐ 24-pin QFN – 4 × 4 × 0.6 mm ❐ 32-pin QFN – 5 × 5 × 0.6 mm ❐ 48-pin QFN – 6 × 6 × 0.6 mm [1] ❐ 30-ball WLCSP Note 1. Contact your nearest Cypress sales office for details. Cypress Semiconductor Corporation Document Number: 001-69257 Rev. *F • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised July 3, 2012 CY8C20x37/37S/47/47S/67/67S Logic Block Diagram Port 4 Port 3 Port 2 Port 1 Port 0 1.8/2.5/3 V PWRSYS [2] LDO (Regulator) PSoC CORE SYSTEM BUS Global Analog Interconnect 1K/2 K SRAM Supervisory ROM (SROM) Interrupt Controller 8K/16K/32 K Flash Nonvolatile Memory Sleep and Watchdog CPU Core(M8C) 6/12/ 24 MHz Internal Main Oscillator ( IMO) Internal Low Speed Oscillator ( ILO) Multiple Clock Sources CAPSENSE SYSTEM Analog Reference CapSense Module Comparator #1 Analog Mux Comparator #2 SYSTEM BUS I2C Slave Internal Voltage References System Resets POR and LVD SPI Master/ Slave Three 16- Bit Programmable Timers Digital Clocks SYSTEM RESOURCES Note 2. Internal voltage regulator for internal circuitry Document Number: 001-69257 Rev. *F Page 2 of 39 CY8C20x37/37S/47/47S/67/67S Contents PSoC® Functional Overview ............................................ 4 PSoC Core .................................................................. 4 CapSense System ....................................................... 4 Additional System Resources ..................................... 5 Getting Started .................................................................. 5 Application Notes/Design Guides ................................ 5 Development Kits ........................................................ 5 Training ....................................................................... 5 CYPros Consultants .................................................... 5 Solutions Library .......................................................... 5 Technical Support ....................................................... 5 Designing with PSoC Designer ....................................... 6 Select Components ..................................................... 6 Configure Components ............................................... 6 Organize and Connect ................................................ 6 Generate, Verify, and Debug ....................................... 6 Pinouts .............................................................................. 7 16-pin SOIC (12 Sensing Inputs) ................................ 7 16-pin QFN (12 Sensing Inputs) .................................. 8 24-pin QFN (20 Sensing Inputs) .................................. 9 30-ball WLCSP (26 Sensing Inputs) .......................... 10 32-pin QFN (26 Sensing Inputs) ................................ 11 48-pin QFN (33 Sensing Inputs) ................................ 12 Electrical Specifications ................................................ 13 Absolute Maximum Ratings ....................................... 13 Operating Temperature ............................................. 13 DC Chip-Level Specifications .................................... 14 DC GPIO Specifications ............................................ 15 DC Analog Mux Bus Specifications ........................... 17 DC Low Power Comparator Specifications ............... 17 Comparator User Module Electrical Specifications ... 18 ADC Electrical Specifications .................................... 18 DC POR and LVD Specifications .............................. 19 DC Programming Specifications ............................... 19 DC I2C Specifications ............................................... 20 Shield Driver DC Specifications ................................ 20 Document Number: 001-69257 Rev. *F DC IDAC Specifications ............................................ 20 AC Chip-Level Specifications .................................... 21 AC General Purpose I/O Specifications .................... 22 AC Comparator Specifications .................................. 22 AC External Clock Specifications .............................. 22 AC Programming Specifications ................................ 23 AC I2C Specifications ................................................ 24 Packaging Information ................................................... 27 Thermal Impedances ................................................. 30 Capacitance on Crystal Pins ..................................... 30 Solder Reflow Peak Temperature ............................. 30 Development Tool Selection ......................................... 31 Software .................................................................... 31 Development Kits ...................................................... 31 Evaluation Tools ........................................................ 31 Device Programmers ................................................. 31 Accessories (Emulation and Programming) .............. 32 Third Party Tools ....................................................... 32 Build a PSoC Emulator into Your Board .................... 32 Ordering Information ...................................................... 33 Ordering Code Definitions ......................................... 34 Acronyms ........................................................................ 35 Reference Documents .................................................... 35 Document Conventions ............................................. 35 Units of Measure ....................................................... 35 Numeric Naming ........................................................ 36 Glossary .......................................................................... 36 Document History Page ................................................. 37 Sales, Solutions, and Legal Information ...................... 39 Worldwide Sales and Design Support ....................... 39 Products .................................................................... 39 PSoC Solutions ......................................................... 39 Page 3 of 39 CY8C20x37/37S/47/47S/67/67S PSoC® Functional Overview Figure 1. CapSense System Block Diagram The PSoC family consists of many devices with on-chip controllers. These devices are designed to replace multiple traditional MCU-based system components with one low-cost single-chip programmable component. A PSoC device includes configurable blocks of analog and digital logic, and programmable interconnect. This architecture makes it possible for you to create customized peripheral configurations, to match the requirements of each individual application. Additionally, a fast central processing unit (CPU), flash program memory, SRAM data memory, and configurable I/O are included in a range of convenient pinouts. CS1 IDAC The core ■ CapSense analog system ■ System resources Analog Global Bus Reference Buffer Comparator Mux Each CY8C20x37/47/67/S PSoC device includes a dedicated CapSense block that provides sensing and scanning control circuitry for capacitive sensing applications. Depending on the PSoC package, up to 34 GPIOs are also included. The GPIOs provide access to the MCU and analog mux. The analog system contains the capacitive sensing hardware. Several hardware algorithms are supported. This hardware performs capacitive sensing and scanning without requiring external components. The analog system is composed of the CapSense PSoC block and an internal 1 V or 1.2 V analog reference, which together support capacitive sensing of up to 31 inputs[3]. Capacitive sensing is configurable on each GPIO pin. Scanning of enabled CapSense pins is completed quickly and easily across multiple ports. SmartSense™ Auto-tuning Refs Cap Sense Counters CSCLK PSoC Core CapSense System Cexternal (P0[1] or P0[3]) Mux A common, versatile bus allows connection between I/O and the analog system. The PSoC core is a powerful engine that supports a rich instruction set. It encompasses SRAM for data storage, an interrupt controller, sleep and watchdog timers, and IMO and ILO. The CPU core, called the M8C, is a powerful processor with speeds up to 24 MHz. The M8C is a 4-million instructions per second (MIPS), 8-bit Harvard-architecture microprocessor. CSN Vr The architecture for this device family, as shown in the Logic Block Diagram on page 2, consists of three main areas: ■ CS2 IMO CapSense Clock Select Oscillator Analog Multiplexer System The analog mux bus can connect to every GPIO pin. Pins are connected to the bus individually or in any combination. The bus also connects to the analog system for analysis with the CapSense block comparator. Switch-control logic enables selected pins to precharge continuously under hardware control. This enables capacitive measurement for applications such as touch sensing. Other multiplexer applications include: ■ Complex capacitive sensing interfaces, such as sliders and touchpads. ■ Chip-wide mux that allows analog input from any I/O pin. ■ Crosspoint connection between any I/O pin combinations. SmartSense auto-tuning is an innovative solution from Cypress that removes manual tuning of CapSense applications. This solution is easy to use and provides robust noise immunity. It is the only auto-tuning solution that establishes, monitors, and maintains all required tuning parameters of each sensor during run time. SmartSense auto-tuning allows engineers to go from prototyping to mass production without retuning for manufacturing variations in PCB and/or overlay material properties. Note 3. 34 GPIOs = 31 pins for capacitive sensing+2 pins for I2C + 1 pin for modulator capacitor. Document Number: 001-69257 Rev. *F Page 4 of 39 CY8C20x37/37S/47/47S/67/67S Additional System Resources System resources provide additional capability, such as configurable I2C slave, SPI master/slave communication interface, three 16-bit programmable timers, various system resets supported by the M8C low voltage detection and poweron reset. The merits of each system resource are listed here: ■ ■ ■ The I2C slave/SPI master-slave module provides 50/100/ 400 kHz communication over two wires. SPI communication over three or four wires runs at speeds of 46.9 kHz to 3 MHz (lower for a slower system clock). The I2C hardware address recognition feature reduces the already low power consumption by eliminating the need for CPU intervention until a packet addressed to the target device is received. 2 The I C enhanced slave interface appears as a 32-byte RAM buffer to the external I2C master. Using a simple predefined protocol, the master controls the read and write pointers into the RAM. When this method is enabled, the slave does not stall the bus when receiving data bytes in active mode. For usage details, see the application note I2C Enhanced Slave Operation - AN56007. ■ Low-voltage detection (LVD) interrupts can signal the application of falling voltage levels, while the advanced poweron reset (POR) circuit eliminates the need for a system supervisor. ■ An internal reference provides an absolute reference for capacitive sensing. ■ A register-controlled bypass mode allows the user to disable the LDO regulator. Getting Started The quickest way to understand PSoC silicon is to read this datasheet and then use the PSoC Designer Integrated Development Environment (IDE). This datasheet is an overview of the PSoC integrated circuit and presents specific pin, register, and electrical specifications. For in depth information, along with detailed programming details, see the Technical Reference Manual for the CY8C20x37/ 47/67/S PSoC devices. For up-to-date ordering, packaging, and electrical specification information, see the latest PSoC device datasheets on the web at www.cypress.com/psoc. Application Notes/Design Guides Application notes and design guides are an excellent introduction to the wide variety of possible PSoC designs. They are located at www.cypress.com/gocapsense. Select Application Notes under the Related Documentation tab. Development Kits PSoC Development Kits are available online from Cypress at www.cypress.com/shop and through a growing number of regional and global distributors, which include Arrow, Avnet, DigiKey, Farnell, Future Electronics, and Newark. See Development Kits on page 31. Training Free PSoC and CapSense technical training (on demand, webinars, and workshops) is available online at www.cypress.com/training. The training covers a wide variety of topics and skill levels to assist you in your designs. CYPros Consultants Certified PSoC Consultants offer everything from technical assistance to completed PSoC designs. To contact or become a PSoC Consultant go to www.cypress.com/cypros. Solutions Library Visit our growing library of solution focused designs at www.cypress.com/solutions. Here you can find various application designs that include firmware and hardware design files that enable you to complete your designs quickly. Technical Support For assistance with technical issues, search KnowledgeBase articles and forums at www.cypress.com/support. If you cannot find an answer to your question, create a technical support case or call technical support at 1-800-541-4736. Document Number: 001-69257 Rev. *F Page 5 of 39 CY8C20x37/37S/47/47S/67/67S Designing with PSoC Designer Organize and Connect The PSoC development process can be summarized in the following four steps: 1. Select User Modules 2. Configure User Modules 3. Organize and Connect 4. Generate and Verify You build signal chains at the chip level by interconnecting user modules to each other and the I/O pins. You perform the selection, configuration, and routing so that you have complete control over all on-chip resources. Select Components PSoC Designer provides a library of pre-built, pre-tested hardware peripheral components called “user modules”. User modules make selecting and implementing peripheral devices, both analog and digital, simple. Configure Components Each of the User Modules you select establishes the basic register settings that implement the selected function. They also provide parameters and properties that allow you to tailor their precise configuration to your particular application. The user module parameters permit you to establish the pulse width and duty cycle. Configure the parameters and properties to correspond to your chosen application. Enter values directly or by selecting values from drop-down menus. All the user modules are documented in datasheets that may be viewed directly in PSoC Designer or on the Cypress website. These user module datasheets explain the internal operation of the User Module and provide performance specifications. Each datasheet describes the use of each user module parameter, and other information you may need to successfully implement your design. Document Number: 001-69257 Rev. *F Generate, Verify, and Debug When you are ready to test the hardware configuration or move on to developing code for the project, you perform the “Generate Configuration Files” step. This causes PSoC Designer to generate source code that automatically configures the device to your specification and provides the software for the system. The generated code provides application programming interfaces (APIs) with high-level functions to control and respond to hardware events at run time and interrupt service routines that you can adapt as needed. A complete code development environment allows you to develop and customize your applications in C, assembly language, or both. Page 6 of 39 CY8C20x37/37S/47/47S/67/67S Pinouts The CY8C20x37/47/67/S PSoC device is available in a variety of packages, which are listed and illustrated in the following tables. Every port pin (labeled with a “P”) is capable of digital I/O and connection to the common analog bus. However, VSS, VDD, and XRES are not capable of digital I/O. 16-pin SOIC (12 Sensing Inputs) Table 1. Pin Definitions – CY8C20237-24SXI, CY8C20247-24SXI Type Pin No. Digital Analog 1 I/O I P0[3] Integrating Input 2 I/O I P0[1] Integrating Input 3 I/O I P2[5] 4 I/O I P2[3] 5 I/O I P1[7] 6 I/O I P1[5] 7 I/O I P1[3] 8 I/O I P1[1] ISSP CLK[4], I2C SCL, SPI MOSI 9 Power Name VSS Description I/O I P1[0] ISSP DATA[4], I2C SDA, SPI CLK[5] 11 I/O I P1[2] Driven Shield Output (optional) 12 I/O I P1[4] Optional external clock (EXTCLK) 14 INPUT I/O 15 16 1 2 3 4 5 6 7 8 SOIC 16 15 14 13 12 11 10 9 P0[7], AI VDD P0[4], AI XRES P1[4], EXTCLK P1[2], AI P1[0], ISSP DATA, I2C SDA, SPI CLK, AI VSS XRES Active high external reset with internal pull-down I Power I/O AI, P0[3] AI, P0[1] AI, P2[5] AI, P2[3] AI, P1[7] AI, P1[5] AI, P1[3] AI, ISSP CLK, I2C SCL, SPI MOSI, P1[1] Ground connection 10 13 Figure 2. CY8C20237-24SXI, CY8C20247-24SXI Device P0[4] VDD I Supply voltage P0[7] LEGEND A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output. Notes 4. On power-up, the SDA(P1[0]) drives a strong high for 256 sleep clock cycles and drives resistive low for the next 256 sleep clock cycles. The SCL(P1[1]) line drives resistive low for 512 sleep clock cycles and both the pins transition to high impedance state. On reset, after XRES de-asserts, the SDA and the SCL lines drive resistive low for 8 sleep clock cycles and transition to high impedance state. Hence, during power-up or reset event, P1[1] and P1[0] may disturb the I2C bus. Use alternate pins if you encounter issues. 5. Alternate SPI clock. Document Number: 001-69257 Rev. *F Page 7 of 39 CY8C20x37/37S/47/47S/67/67S 16-pin QFN (12 Sensing Inputs) Table 2. Pin Definitions – CY8C20237, CY8C20247/S[6] I/O I P2[5] Crystal output (XOut) 2 I/O I P2[3] Crystal input (XIn) 3 IOHR I P1[7] I2C SCL, SPI SS 2 4 IOHR I P1[5] I C SDA, SPI MISO 5 IOHR I P1[3] SPI CLK 6 IOHR I P1[1] ISSP CLK[7], I2C SCL, SPI MOSI 7 Power VSS IOHR I P1[0] ISSP DATA[7], I2C SDA, SPI CLK[8] 9 IOHR I P1[2] Driven Shield Output (optional) 10 IOHR I P1[4] Optional external clock (EXTCLK) 12 13 Input IOH P0[1], AI P0[3], AI P0[7], AI VDD AI , XOut, P2[5] AI , XIn, P2[3] AI , I2 C SCL, SPI SS, P1[7] AI , I2 C SDA, SPI MISO, P1[5] Ground connection 8 11 Figure 3. CY8C20237, CY8C20247/S Device Description XRES Active high external reset with internal pull-down I P0[4] Power VDD 1 2 14 13 1 Name 16 15 Analog 12 11 (Top View) 10 3 9 4 QFN 5 6 7 8 Digital P0[4] , AI XRES P1[4] , EXTCLK, AI P1[2] , AI AI, SPI CLK , P1[3] AI, ISSP CLK, SPI MOSI, P1[1] VSS AI, ISSP DATA , I2C SDA, SPI CLK , P1[0] Type Pin No. Supply voltage 14 IOH I P0[7] 15 IOH I P0[3] Integrating input 16 IOH I P0[1] Integrating input LEGEND A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output. Notes 6. No center pad. 7. On power-up, the SDA(P1[0]) drives a strong high for 256 sleep clock cycles and drives resistive low for the next 256 sleep clock cycles. The SCL(P1[1]) line drives resistive low for 512 sleep clock cycles and both the pins transition to high impedance state. On reset, after XRES de-asserts, the SDA and the SCL lines drive resistive low for 8 sleep clock cycles and transition to high impedance state. Hence, during power-up or reset event, P1[1] and P1[0] may disturb the I2C bus. Use alternate pins if you encounter issues. 8. Alternate SPI clock. Document Number: 001-69257 Rev. *F Page 8 of 39 CY8C20x37/37S/47/47S/67/67S 24-pin QFN (20 Sensing Inputs) Table 3. Pin Definitions – CY8C20337, CY8C20347/S [9] 4 IOHR I P1[7] I C SCL, SPI SS 5 IOHR I P1[5] I2C SDA, SPI MISO 6 IOHR I P1[3] SPI CLK 7 IOHR I P1[1] ISSP CLK[10], I2C SCL, SPI MOSI NC No connection 8 9 Power VSS Ground connection 10 IOHR I P1[0] ISSP DATA[10], I2C SDA, SPI CLK[11] 11 IOHR I P1[2] Driven Shield Output (optional) 12 IOHR I P1[4] Optional external clock input (EXTCLK) 13 IOHR I P1[6] 14 Input I/O I P2[2] Driven Shield Output (optional) 16 I/O I P2[4] Driven Shield Output (optional) 17 IOH I P0[0] Driven Shield Output (optional) 18 IOH I P0[2] 19 IOH I P0[4] Power VDD IOH I P0[7] 22 IOH I P0[3] Integrating input VSS Ground connection P0[1] Integrating input VSS Center pad must be connected to ground 24 CP Power IOH Power 19 21 20 18 17 2 3 QFN 16 4 (Top View) 15 5 14 6 13 P0[2], AI P0[0], AI P2[4], AI P2[2], AI XRES P1[6], AI Supply voltage 21 23 AI, P2[1] AI, I2C SCL, SPI SS, P1[7] AI, I2C SDA, SPI MISO, P1[5] AI, SPI CLK, P1[3] 1 XRES Active high external reset with internal pull-down 15 20 AI, XOut, P2[5] AI, XIn, P2[3] 2 11 12 P2[1] AI, P1[2] AI, EXTCLK, P1[4] I 22 I/O 9 3 10 Crystal input (XIn) AI, ISSP DATA2, I2C SDA, SPI CLK, P1[0] Crystal output (XOut) P2[3] P0[1], AI VSS P0[3], AI P0[7], AI VDD P0[4], AI P2[5] I 24 I I/O 23 I/O 2 8 1 Figure 4. CY8C20337, CY8C20347/S Device 7 Description AI, ISSP CLK2, I2C SCL SPI MOSI, P1[1] NC VSS Type Pin No. Digital Analog Name I LEGEND A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output. Notes 9. The center pad (CP) on the QFN package must be connected to ground (VSS) for best mechanical, thermal, and electrical performance. If not connected to ground, it must be electrically floated and not connected to any other signal. 10. On power-up, the SDA(P1[0]) drives a strong high for 256 sleep clock cycles and drives resistive low for the next 256 sleep clock cycles. The SCL(P1[1]) line drives resistive low for 512 sleep clock cycles and both the pins transition to high impedance state. On reset, after XRES de-asserts, the SDA and the SCL lines drive resistive low for 8 sleep clock cycles and transition to high impedance state. Hence, during power-up or reset event, P1[1] and P1[0] may disturb the I2C bus. Use alternate pins if you encounter issues. 11. Alternate SPI clock. Document Number: 001-69257 Rev. *F Page 9 of 39 CY8C20x37/37S/47/47S/67/67S 30-ball WLCSP (26 Sensing Inputs) Table 4. Pin Definitions – CY8C20767, CY8C20747 30-ball Part Pinout (WLCSP) Type Pin No. Name Digital Analog A1 IOH I P0[2] A2 IOH I P0[6] A3 Power Description Bottom View 5 VDD Supply voltage Integrating Input A4 IOH I P0[1] A5 I/O I P2[7] B1 I/O I P4[2] B2 IOH I P0[0] B3 IOH I P0[4] B4 IOH I P0[3] Integrating Input B5 I/O I P2[5] Crystal Output (Xout) C1 I/O I P2[2] Driven Shield Output (optional) C2 I/O I P2[4] Driven Shield Output (optional) C3 I/O I P0[7] C4 IOH I P3[2] C5 I/O I P2[3] Crystal Input (Xin) D1 I/O I P2[0] Driven Shield Output (optional) D2 I/O I P3[0] D3 I/O I P3[1] D4 I/O I P3[3] D5 I/O I P2[1] E1 Input XRES 2 1 A C D E F Top View 1 2 3 4 5 A B C Active high external reset with internal pull-down IOHR I P1[6] IOHR I P1[4] Optional external clock input (EXT CLK) E4 IOHR I P1[7] I2C SCL, SPI SS E5 IOHR I P1[5] I2C SDA, SPI MISO F1 IOHR I P1[2] Driven Shield Output (optional) F2 IOHR I P1[0] ISSP DATA[12], I2C SDA, SPI CLK[13] VSS 3 Driven Shield Output (optional) E3 Power 4 B E2 F3 Figure 5. CY8C20767, CY8C20747 30-ball WLCSP D E F Supply ground F4 IOHR I P1[1] ISSP CLK[12], I2C SCL, SPI MOSI F5 IOHR I P1[3] SPI CLK LEGEND: A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output Notes 12. On power-up, the SDA(P1[0]) drives a strong high for 256 sleep clock cycles and drives resistive low for the next 256 sleep clock cycles. The SCL(P1[1]) line drives resistive low for 512 sleep clock cycles and both the pins transition to high impedance state. On reset, after XRES de-asserts, the SDA and the SCL lines drive resistive low for 8 sleep clock cycles and transition to high impedance state. Hence, during power-up or reset event, P1[1] and P1[0] may disturb the I2C bus. Use alternate pins if you encounter issues. 13. Alternate SPI clock. Document Number: 001-69257 Rev. *F Page 10 of 39 CY8C20x37/37S/47/47S/67/67S 32-pin QFN (26 Sensing Inputs) Table 5. Pin Definitions – CY8C20437, CY8C20447/S, CY8C20467/S [14] I I I I I I I I I I I Power IOH IOH I I Power Power P0[2], AI P0[0], AI I/O I/O I/O I/O I/O I/O I/O IOH IOH IOH IOH Input P0[4], AI 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 CP P1[6] XRES Active high external reset with internal pull-down P3[0] P3[2] P4[0] P4[2] P2[0] Driven Shield Output (optional) P2[2] Driven Shield Output (optional) P2[4] Driven Shield Output (optional) P0[0] Driven Shield Output (optional) P0[2] P0[4] P0[6] VDD P0[7] P0[3] Integrating input VSS Ground connection VSS Center pad must be connected to ground 26 25 I 15 16 IOHR AI, E XTCLK, P1[4] AI, P1[6] 16 17 28 27 P1[2] P1[4] QFN (Top View) 24 23 22 21 20 19 18 17 13 14 I I 1 2 3 4 5 6 7 8 30 29 IOHR IOHR AI , XOut ,P0[1] AI , XIn ,P2[5] AI ,P2[3] AI ,P2[1] AI ,P4[3] AI ,P3[3] AI ,P3[1] AI ,I2 C SCL, SPI SS,P1[7] A I,ISSP CLK , I2C SCL, SPI MOSI, P1[1] Vss AI , ISSP DATA , I2C SDA, SPI CLK, P1[0] AI, P1[2] 14 15 Vss P0[3], AI P0[7], AI VDD P0[6], AI VSS P1[0] I2C SCL, SPI SS I2C SDA, SPI MISO SPI CLK. ISSP CLK[15], I2C SCL, SPI MOSI. Ground connection ISSP DATA[15], I2C SDA, SPI CLK[16] Driven Shield Output (optional) Optional external clock input (EXTCLK) 32 31 Power IOHR I Integrating input Crystal output (XOut) Crystal input (XIn) Figure 6. CY8C20437, CY8C20447/S, CY8C20467/S Device 9 12 13 Description 10 11 12 P0[1] P2[5] P2[3] P2[1] P4[3] P3[3] P3[1] P1[7] P1[5] P1[3] P1[1] Name AI, I2C SDA, SPI MI SO, P1[5] AI, SPI CLK, P1[3] 1 2 3 4 5 6 7 8 9 10 11 Type Digital Analog IOH I I/O I I/O I I/O I I/O I I/O I I/O I IOHR I IOHR I IOHR I IOHR I Pin No. P2[4] , AI P2[2] , AI P2[0] , AI P4[2] , AI P4[0] , AI P3[2] , AI P3[0] , AI XRES LEGEND A = Analog, I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output. Notes 14. The center pad (CP) on the QFN package must be connected to ground (VSS) for best mechanical, thermal, and electrical performance. If not connected to ground, it must be electrically floated and not connected to any other signal. 15. On power-up, the SDA(P1[0]) drives a strong high for 256 sleep clock cycles and drives resistive low for the next 256 sleep clock cycles. The SCL(P1[1]) line drives resistive low for 512 sleep clock cycles and both the pins transition to high impedance state. On reset, after XRES de-asserts, the SDA and the SCL lines drive resistive low for 8 sleep clock cycles and transition to high impedance state. Hence, during power-up or reset event, P1[1] and P1[0] may disturb the I2C bus. Use alternate pins if you encounter issues. 16. Alternate SPI clock. Document Number: 001-69257 Rev. *F Page 11 of 39 CY8C20x37/37S/47/47S/67/67S 48-pin QFN (33 Sensing Inputs) I I I P3[0] P3[2] P3[4] 30 31 32 33 34 35 36 37 38 39 I/O I/O I/O I/O I/O I/O I I I I I I P3[6] P4[0] P4[2] P2[0] P2[2] P2[4] NC P0[0] P0[2] P0[4] IOH IOH IOH I I I P0[1], AI Vss P0[3], AI NC , P0[7], AI NC NC Vdd P0[6], AI P0[4], AI P0[2], AI P0[0], AI 48 47 46 45 44 43 42 41 40 39 38 37 QFN 13 14 15 16 17 18 19 20 21 22 23 24 (Top View) NC P2[4],AI P2[2],AI P2[0],AI P4[2],AI P4[0],AI P3[6],AI P3[4], AI P3[2],AI P3[0], AI XRES P1[6], AI Driven Shield Output (optional) Driven Shield Output (optional) Driven Shield Output (optional) No connection Driven Shield Output (optional) 40 41 42 43 44 45 46 47 48 CP IOH I Power IOH I IOH I Power IOH I Power Description I/O I/O I/O 7 8 9 10 11 12 36 35 34 33 32 31 30 29 28 27 26 25 Active high external reset with internal pull-down Pin No. 27 28 29 I2C SCL, SPI SS I2C SDA, SPI MISO No connection No connection SPI CLK ISSP CLK[17], I2C SCL, SPI MOSI Ground connection No connection No connection Supply voltage ISSP DATA[17], I2C SDA, SPI CLK[19] Driven Shield Output (optional) Optional external clock input (EXTCLK) 1 2 3 4 5 6 I2C SDA, SPI MISO, A I, P1[5] NC NC SPI CLK, AI, P1[3] AI, ISSP CLK, I2C SCL, SPI MOSI, P1[1] Vss NC NC Vdd AI, ISSP DATA1 , I2C SDA, SPI CLK, P1[0] AI, P 1[2] AI, EXTCLK, P1[4] P1[6] XRES NC AI ,P2[7] AI , XOut,P2[5] AI , XIn ,P2[3] AI ,P2[1] AI ,P4[3] AI ,P4[1] AI ,P3[7] AI ,P3[5] AI ,P3[3] AI P3[1] AI ,I2 C SCL, SPI SS,P1[7] Crystal output (XOut) Crystal input (XIn) Name IOHR I Input No connection Analog Power IOHR I IOHR I IOHR I NC P2[7] P2[5] P2[3] P2[1] P4[3] P4[1] P3[7] P3[5] P3[3] P3[1] P1[7] P1[5] NC NC P1[3] P1[1] VSS NC NC VDD P1[0] P1[2] P1[4] IOHR I IOHR I Power Description I I I I I I I I I I I I Name I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O IOHR IOHR Figure 7. CY8C20637, CY8C20647/S, CY8C20667/S Device Digital 25 26 Analog 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Digital Pin No. Table 6. Pin Definitions – CY8C20637, CY8C20647/S, CY8C20667/S[17, 18] P0[6] VDD NC NC P0[7] NC P0[3] VSS P0[1] VSS Supply voltage No connection No connection No connection Integrating input Ground connection Integrating input Center pad must be connected to ground LEGEND A = Analog, I = Input, O = Output, NC = No Connection H = 5 mA High Output Drive, R = Regulated Output. Notes 17. On power-up, the SDA(P1[0]) drives a strong high for 256 sleep clock cycles and drives resistive low for the next 256 sleep clock cycles. The SCL(P1[1]) line drives resistive low for 512 sleep clock cycles and both the pins transition to high impedance state. On reset, after XRES de-asserts, the SDA and the SCL lines drive resistive low for 8 sleep clock cycles and transition to high impedance state. Hence, during power-up or reset event, P1[1] and P1[0] may disturb the I2C bus. Use alternate pins if you encounter issues. 18. The center pad (CP) on the QFN package must be connected to ground (VSS) for best mechanical, thermal, and electrical performance. If not connected to ground, it must be electrically floated and not connected to any other signal. 19. Alternate SPI clock. Document Number: 001-69257 Rev. *F Page 12 of 39 CY8C20x37/37S/47/47S/67/67S Electrical Specifications This section presents the DC and AC electrical specifications of the CY8C20x37/47/67/S PSoC devices. For the latest electrical specifications, confirm that you have the most recent datasheet by visiting the web at http://www.cypress.com/psoc. Figure 8. Voltage versus CPU Frequency 5.5 V VDD Voltage li d ng Va rati n e io Op Reg 1.71 V 750 kHz 3 MHz CPU 24 MHz Frequency Absolute Maximum Ratings Exceeding maximum ratings may shorten the useful life of the device. User guidelines are not tested. Table 7. Absolute Maximum Ratings Symbol Description Conditions Min Typ Max Units TSTG Storage temperature Higher storage temperatures reduce data retention time. Recommended Storage Temperature is +25 °C ± 25 °C. Extended duration storage temperatures above 85 °C degrades reliability. –55 +25 +125 °C VDD Supply voltage relative to VSS – –0.5 – +6.0 V VIO DC input voltage – VSS – 0.5 – VDD + 0.5 V VIOZ DC voltage applied to tristate – VSS – 0.5 – VDD + 0.5 V IMIO Maximum current into any port pin – –25 – +50 mA ESD Electro static discharge voltage Human body model ESD 2000 – – V LU Latch up current In accordance with JESD78 standard – – 200 mA Min Typ Max Units – +85 °C 70 °C +100 °C Operating Temperature Table 8. Operating Temperature Symbol Description Conditions TA Ambient temperature – –40 TC Commercial temperature range – 0 TJ Operational die temperature The temperature rise from ambient to junction is package specific. See the Thermal Impedances on page 30. The user must limit the power consumption to comply with this requirement. Document Number: 001-69257 Rev. *F –40 – Page 13 of 39 CY8C20x37/37S/47/47S/67/67S DC Chip-Level Specifications The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 9. DC Chip-Level Specifications Symbol VDD [20, 21, 22] Description Supply voltage Conditions Min Typ Max Units See table DC POR and LVD Specifications on page 19 1.71 – 5.50 V IDD24 Supply current, IMO = 24 MHz Conditions are VDD 3.0 V, TA = 25 °C, CPU = 24 MHz. CapSense running at 12 MHz, no I/O sourcing current – 2.88 4.00 mA IDD12 Supply current, IMO = 12 MHz Conditions are VDD 3.0 V, TA = 25 °C, CPU = 12 MHz. CapSense running at 12 MHz, no I/O sourcing current – 1.71 2.60 mA IDD6 Supply current, IMO = 6 MHz Conditions are VDD 3.0 V, TA = 25 °C, CPU = 6 MHz. CapSense running at 6 MHz, no I/O sourcing current – 1.16 1.80 mA ISB0 Deep sleep current VDD 3.0 V, TA = 25 °C, I/O regulator turned off – 0.10 1.1 A ISB1 Standby current with POR, LVD VDD 3.0 V, TA = 25 °C, I/O regulator turned off and sleep timer – 1.07 1.50 A ISBI2C Standby current with I2C enabled – 1.64 – A Conditions are VDD = 3.3 V, TA = 25 °C and CPU = 24 MHz Notes 20. When VDD remains in the range from 1.71 V to 1.9 V for more than 50 µs, the slew rate when moving from the 1.71 V to 1.9 V range to greater than 2 V must be slower than 1 V/500 µs to avoid triggering POR. The only other restriction on slew rates for any other voltage range or transition is the SRPOWER_UP parameter. 21. If powering down in standby sleep mode, to properly detect and recover from a VDD brown out condition any of the following actions must be taken: a. Bring the device out of sleep before powering down. b. Assure that VDD falls below 100 mV before powering back up. c. Set the No Buzz bit in the OSC_CR0 register to keep the voltage monitoring circuit powered during sleep. d. Increase the buzz rate to assure that the falling edge of VDD is captured. The rate is configured through the PSSDC bits in the SLP_CFG register. For the referenced registers, refer to the Technical Reference Manual. In deep sleep/standby sleep mode, additional low power voltage monitoring circuitry allows VDD brown out conditions to be detected and resets the device when VDD goes lower than 1.1 V at edge rates slower than 1 V/ms. 22. For proper CapSense block functionality, if the drop in VDD exceeds 5% of the base VDD, the rate at which VDD drops should not exceed 200 mV/s. Base VDD can be between 1.8 V and 5.5 V. Document Number: 001-69257 Rev. *F Page 14 of 39 CY8C20x37/37S/47/47S/67/67S DC GPIO Specifications The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 3.0 V to 5.5 V and –40 °C TA 85 °C, 2.4 V to 3.0 V and –40 °C TA 85 °C, or 1.71 V to 2.4 V and –40 °C TA 85 °C, respectively. Typical parameters apply to 5 V and 3.3 V at 25 °C and are for design guidance only. Table 10. 3.0 V to 5.5 V DC GPIO Specifications Symbol Description Conditions Min Typ Max Units RPU Pull-up resistor – 4 5.60 8 k VOH1 High output voltage Port 2 or 3 pins IOH < 10 A, maximum of 10 mA source current in all I/Os VDD – 0.20 – – V VOH2 High output voltage Port 2 or 3 Pins IOH = 1 mA, maximum of 20 mA source current in all I/Os VDD – 0.90 – – V VOH3 High output voltage IOH < 10 A, maximum of 10 mA source Port 0 or 1 pins with LDO regulator Disabled current in all I/Os for port 1 VDD – 0.20 – – V VOH4 High output voltage IOH = 5 mA, maximum of 20 mA source Port 0 or 1 pins with LDO regulator Disabled current in all I/Os for port 1 VDD – 0.90 – – V VOH5 IOH < 10 A, VDD > 3.1 V, maximum of High output voltage Port 1 Pins with LDO Regulator Enabled for 4 I/Os all sourcing 5 mA 3 V out 2.85 VOH6 High output voltage IOH = 5 mA, VDD > 3.1 V, maximum of 20 mA Port 1 pins with LDO regulator enabled for source current in all I/Os 3 V out 2.20 VOH7 High output voltage IOH < 10 A, VDD > 2.7 V, maximum of 20 mA Port 1 pins with LDO enabled for 2.5 V out source current in all I/Os 2.35 VOH8 High output voltage IOH = 2 mA, VDD > 2.7 V, maximum of 20 mA Port 1 pins with LDO enabled for 2.5 V out source current in all I/Os 1.90 VOH9 High output voltage IOH < 10 A, VDD > 2.7 V, maximum of 20 mA Port 1 pins with LDO enabled for 1.8 V out source current in all I/Os 1.60 VOH10 High output voltage IOH = 1 mA, VDD > 2.7 V, maximum of 20 mA Port 1 pins with LDO enabled for 1.8 V out source current in all I/Os 1.20 – – V VOL Low output voltage IOL = 25 mA, VDD > 3.3 V, maximum of 60 mA sink current on even port pins (for example, P0[2] and P1[4]) and 60 mA sink current on odd port pins (for example, P0[3] and P1[5]) – – 0.75 V VIL Input low voltage – – – 0.80 V 3.00 3.30 – – 2.50 2.75 – – 1.80 2.10 V V V V V VIH Input high voltage – 2.00 – – V VH Input hysteresis voltage – – 80 – mV IIL Input leakage (Absolute Value) – – 0.00 1 1 A CPIN Pin capacitance Package and pin dependent Temp = 25 °C 0.50 1.70 7 pF VILLVT3.3 Input Low Voltage with low threshold enable Bit3 of IO_CFG1 set to enable low threshold set, Enable for Port1 voltage of Port1 input 0.8 V – – VIHLVT3.3 Input High Voltage with low threshold enable Bit3 of IO_CFG1 set to enable low threshold set, Enable for Port1 voltage of Port1 input 1.4 – – V VILLVT5.5 Input Low Voltage with low threshold enable Bit3 of IO_CFG1 set to enable low threshold set, Enable for Port1 voltage of Port1 input 0.8 V – – VIHLVT5.5 Input High Voltage with low threshold enable Bit3 of IO_CFG1 set to enable low threshold set, Enable for Port1 voltage of Port1 input 1.7 – – V Document Number: 001-69257 Rev. *F Page 15 of 39 CY8C20x37/37S/47/47S/67/67S Table 11. 2.4 V to 3.0 V DC GPIO Specifications Symbol Description Conditions Min Typ Max Units 4 5.60 8 k IOH < 10 A, maximum of 10 mA source VDD - 0.20 current in all I/Os – – V High output voltage Port 2 or 3 Pins IOH = 0.2 mA, maximum of 10 mA source current in all I/Os VDD - 0.40 – – V VOH3 High output voltage Port 0 or 1 pins with LDO regulator Disabled for port 1 IOH < 10 A, maximum of 10 mA source VDD - 0.20 current in all I/Os – – V VOH4 High output voltage Port 0 or 1 pins with LDO regulator Disabled for Port 1 IOH = 2 mA, maximum of 10 mA source VDD - 0.50 current in all I/Os – – V VOH5A High output voltage IOH < 10 A, VDD > 2.4 V, maximum of Port 1 pins with LDO enabled for 1.8 V 20 mA source current in all I/Os out 1.50 1.80 2.10 V VOH6A High output voltage IOH = 1 mA, VDD > 2.4 V, maximum of Port 1 pins with LDO enabled for 1.8 V 20 mA source current in all I/Os out 1.20 – – V VOL Low output voltage IOL = 10 mA, maximum of 30 mA sink current on even port pins (for example, P0[2] and P1[4]) and 30 mA sink current on odd port pins (for example, P0[3] and P1[5]) – – 0.75 V VIL Input low voltage – – – 0.72 V VIH Input high voltage – 1.40 – VH Input hysteresis voltage – – 80 – mV IIL Input leakage (absolute value) – – 1 1000 nA CPIN Capacitive load on pins Package and pin dependent Temp = 25 C 0.50 1.70 7 pF VILLVT2.5 Input Low Voltage with low threshold enable set, Enable for Port1 Bit3 of IO_CFG1 set to enable low threshold voltage of Port1 input 0.7 V – VIHLVT2.5 Input High Voltage with low threshold enable set, Enable for Port1 Bit3 of IO_CFG1 set to enable low threshold voltage of Port1 input 1.2 RPU Pull-up resistor – VOH1 High output voltage Port 2 or 3 pins VOH2 V – V Table 12. 1.71 V to 2.4 V DC GPIO Specifications Symbol Description Conditions Min Typ Max Units 4 RPU Pull-up resistor – 5.60 8 k VOH1 High output voltage Port 2 or 3 pins IOH = 10 A, maximum of 10 mA VDD – 0.20 source current in all I/Os – – V VOH2 High output voltage Port 2 or 3 pins IOH = 0.5 mA, maximum of 10 mA VDD – 0.50 source current in all I/Os – – V VOH3 High output voltage Port 0 or 1 pins with LDO regulator Disabled for Port 1 IOH = 100 A, maximum of 10 mA VDD – 0.20 source current in all I/Os – – V VOH4 High output voltage Port 0 or 1 Pins with LDO Regulator Disabled for Port 1 IOH = 2 mA, maximum of 10 mA source VDD – 0.50 current in all I/Os – – V Document Number: 001-69257 Rev. *F Page 16 of 39 CY8C20x37/37S/47/47S/67/67S Table 12. 1.71 V to 2.4 V DC GPIO Specifications (continued) Symbol Description Conditions Min Typ Max Units VOL Low output voltage IOL = 5 mA, maximum of 20 mA sink current on even port pins (for example, P0[2] and P1[4]) and 30 mA sink current on odd port pins (for example, P0[3] and P1[5]) – – 0.40 V VIL Input low voltage – – – 0.30 × VDD V VIH Input high voltage – 0.65 × VDD – – V VH Input hysteresis voltage – – 80 – mV IIL Input leakage (absolute value) – – 1 1000 nA CPIN Capacitive load on pins Package and pin dependent temp = 25 C 0.50 1.70 7 pF DC Analog Mux Bus Specifications The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 13. DC Analog Mux Bus Specifications Symbol Description Conditions Min Typ Max Units RSW Switch resistance to common analog bus – – – 800 RGND Resistance of initialization switch to VSS – – – 800 The maximum pin voltage for measuring RSW and RGND is 1.8 V DC Low Power Comparator Specifications The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 14. DC Comparator Specifications Symbol Description Conditions Min Typ Max Units 0.2 – 1.8 V – – 10 80 A – – 2.5 30 mV VLPC Low power comparator (LPC) common Maximum voltage limited to VDD mode ILPC LPC supply current VOSLPC LPC voltage offset Document Number: 001-69257 Rev. *F Page 17 of 39 CY8C20x37/37S/47/47S/67/67S Comparator User Module Electrical Specifications The following table lists the guaranteed maximum and minimum specifications. Unless stated otherwise, the specifications are for the entire device voltage and temperature operating range: –40 °C TA 85 °C, 1.71 V VDD 5.5 V. Table 15. Comparator User Module Electrical Specifications Symbol Min Typ Max Units 50 mV overdrive – 70 100 ns Offset Valid from 0.2 V to 1.5 V – 2.5 30 mV Current Average DC current, 50 mV overdrive – 20 80 µA Supply voltage > 2 V Power supply rejection ratio – 80 – dB Supply voltage < 2 V Power supply rejection ratio – 40 TCOMP PSRR Description Comparator response time Input range Conditions – 0.2 – dB 1.5 V ADC Electrical Specifications Table 16.ADC User Module Electrical Specifications Symbol Description Conditions Min Typ Max Units 0 – VREFADC V Input VIN Input voltage range CIIN Input capacitance – RIN Input resistance Equivalent switched cap input resistance for 8-, 9-, or 10-bit resolution ADC reference voltage FCLK – – – 5 pF 1/(500fF × data clock) 1/(400fF × data clock) 1/(300fF × data clock) – 1.14 – 1.26 V Data clock Source is chip’s internal main oscillator. See AC Chip-Level Specifications on page 21 for accuracy 2.25 – 6 MHz S8 8-bit sample rate Data clock set to 6 MHz. sample rate = 0.001/ (2^Resolution/Data Clock) – 23.43 – ksps S10 10-bit sample rate Data clock set to 6 MHz. sample rate = 0.001/ (2^resolution/data clock) – 5.85 – ksps Reference VREFADC Conversion Rate DC Accuracy RES Resolution Can be set to 8, 9, or 10 bit 8 – 10 bits DNL Differential nonlinearity – –1 – +2 LSB INL Integral nonlinearity – –2 – +2 LSB EOFFSET Offset error 8-bit resolution 0 3.20 19.20 LSB 10-bit resolution 0 12.80 76.80 LSB EGAIN Gain error For any resolution –5 – +5 %FSR IADC Operating current – – 2.10 2.60 mA PSRR Power supply rejection ratio Power Document Number: 001-69257 Rev. *F PSRR (VDD > 3.0 V) – 24 – dB PSRR (VDD < 3.0 V) – 30 – dB Page 18 of 39 CY8C20x37/37S/47/47S/67/67S DC POR and LVD Specifications The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 17. DC POR and LVD Specifications Symbol VPOR0 Description Conditions Min Typ Max Units 1.61 – 1.66 1.71 V 2.36 2.41 – 2.60 2.66 – 2.82 2.95 VPOR2 1.66 V selected in PSoC Designer VDD must be greater than or equal to 1.71 V 2.36 V selected in PSoC Designer during startup, reset from the XRES pin, or reset from watchdog. 2.60 V selected in PSoC Designer VPOR3 2.82 V selected in PSoC Designer VLVD0 2.45 V selected in PSoC Designer – 2.40 2.45 2.51 VLVD1 2.71 V selected in PSoC Designer 2.64[23] 2.71 2.78 VLVD2 2.92 V selected in PSoC Designer 2.85[24] 2.92 2.99 VLVD3 3.02 V selected in PSoC Designer 2.95[25] 3.02 3.09 VLVD4 3.13 V selected in PSoC Designer 3.06 3.13 3.20 VLVD5 1.90 V selected in PSoC Designer 1.84 1.90 2.32 VLVD6 1.80 V selected in PSoC Designer 1.75[26] 1.80 1.84 VLVD7 4.73 V selected in PSoC Designer 4.62 4.73 4.83 VPOR1 V DC Programming Specifications The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 18. DC Programming Specifications Symbol Description VDDIWRITE Supply voltage for flash write operations IDDP Supply current during programming or verify VILP Input low voltage during programming or verify VIHP Input high voltage during programming or verify IILP Input current when Applying VILP to P1[0] or P1[1] during programming or verify IIHP Input current when applying VIHP to P1[0] or P1[1] during programming or verify VOLP Output low voltage during programming or verify VOHP Output high voltage during programming or verify FlashENPB Flash write endurance FlashDR Flash data retention – Conditions Min 1.71 Typ – Max 5.25 Units V – – 5 25 mA See appropriate DC GPIO Specifications on page 15 See appropriate DC GPIO Specifications on page 15 Driving internal pull-down resistor – – VIL V VIH – – V – – 0.2 mA – – 1.5 mA – – VSS + 0.75 V VOH – VDD V 50,000 20 – – – – – Years Driving internal pull-down resistor See appropriate DC GPIO Specifications on page 15. For VDD > 3V use VOH4 in Table 10 on page 15. Erase/write cycles per block Following maximum Flash write cycles; ambient temperature of 55 °C Notes 23. Always greater than 50 mV above VPPOR1 voltage for falling supply. 24. Always greater than 50 mV above VPPOR2 voltage for falling supply. 25. Always greater than 50 mV above VPPOR3 voltage for falling supply. 26. Always greater than 50 mV above VPPOR0 voltage for falling supply. Document Number: 001-69257 Rev. *F Page 19 of 39 CY8C20x37/37S/47/47S/67/67S DC I2C Specifications The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 3.0 V to 5.5 V and –40 °C TA 85 °C, 2.4 V to 3.0 V and –40 °C TA 85 °C, or 1.71 V to 2.4 V and –40 °C TA 85 °C, respectively. Typical parameters apply to 5 V and 3.3 V at 25 °C and are for design guidance only. Table 19. DC I2C Specifications[27] Symbol VILI2C VIHI2C Description Input low level Input high level Conditions 3.1 V ≤ VDD ≤ 5.5 V Min – Typ – Max Units 0.25 × VDD V 2.5 V ≤ VDD ≤ 3.0 V – – 0.3 × VDD V 1.71 V ≤ VDD ≤ 2.4 V – – 0.3 × VDD V 1.71 V ≤ VDD ≤ 5.5 V 0.65 × VDD – – V Shield Driver DC Specifications The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 3.0 V to 5.5 V and –40 °C TA 85 °C, 2.4 V to 3.0 V and –40 °C TA 85 °C, or 1.71 V to 2.4 V and –40 °C TA 85 °C, respectively. Typical parameters apply to 5 V and 3.3 V at 25 °C and are for design guidance only. Table 20. Shield Driver DC Specifications Symbol VRef Description Reference buffer output Conditions 1.7 V ≤ VDD ≤ 5.5 V Min 0.942 Typ – Max 1.106 Units V VRefHi Reference buffer output 1.7 V ≤ VDD ≤ 5.5 V 1.104 – 1.296 V DC IDAC Specifications The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 21. DC IDAC Specifications (8-bit IDAC) Symbol Description Min Typ Max Units Notes IDAC_DNL Differential nonlinearity –1 – 1 LSB IDAC_DNL Integral nonlinearity –2 – 2 LSB IDAC_Current Range = 4x 138 – 169 µA DAC setting = 127 dec Range = 8x 138 – 169 µA DAC setting = 64 dec Table 22. DC IDAC Specifications (7-bit IDAC) Symbol Description Min Typ Max Units Notes IDAC_DNL Differential nonlinearity –1 – 1 LSB IDAC_DNL Integral nonlinearity –2 – 2 LSB IDAC_Current Range = 4x 137 – 168 µA DAC setting = 127 dec Range = 8x 138 – 169 µA DAC setting = 64 dec Note 27. Pull-up resistors on I2C interface cannot be connected to a supply voltage that is more than 0.7 V higher than the CY8C20xx7/S/H/L power supply. See the CY8C20xx7 Silicon Errata document for more details. Document Number: 001-69257 Rev. *F Page 20 of 39 CY8C20x37/37S/47/47S/67/67S AC Chip-Level Specifications The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 23. AC Chip-Level Specifications Min Typ Max Units FIMO24 Symbol IMO frequency at 24 MHz Setting Description – Conditions 22.8 24 25.2 MHz FIMO12 IMO frequency at 12 MHz setting – 11.4 12 12.6 MHz FIMO6 IMO frequency at 6 MHz setting – 5.7 6.0 6.3 MHz FCPU CPU frequency – 0.75 – 25.20 MHz F32K1 ILO frequency – 15 32 50 kHz F32K_U ILO untrimmed frequency – 13 32 82 kHz DCIMO Duty cycle of IMO – 40 50 60 % DCILO ILO duty cycle – 40 50 60 % VDD slew rate during power-up – – 250 V/ms After supply voltage is valid 1 – – ms Applies after part has booted 10 – – s SRPOWER_UP Power supply slew rate tXRST External reset pulse width at power-up tXRST2 tJIT_IMO External reset pulse width after [29] power-up[28] 6 MHz IMO cycle-to-cycle jitter (RMS) – – 0.7 6.7 ns 6 MHz IMO long term N cycle-to-cycle jitter (RMS); N = 32 – – 4.3 29.3 ns 6 MHz IMO period jitter (RMS) – – 0.7 3.3 ns 12 MHz IMO cycle-to-cycle jitter (RMS) – – 0.5 5.2 ns 12 MHz IMO long term N cycle-to-cycle jitter (RMS); N = 32 – –– 2.3 5.6 ns 12 MHz IMO period jitter (RMS) – – 0.4 2.6 ns 24 MHz IMO cycle-to-cycle jitter (RMS) – – 1.0 8.7 ns 24 MHz IMO long term N cycle-to-cycle jitter (RMS); N = 32 – – 1.4 6.0 ns 24 MHz IMO period jitter (RMS) – – 0.6 4.0 ns Note 28. The minimum required XRES pulse length is longer when programming the device (see Table 27 on page 23). 29. See the Cypress Jitter Specifications application note, Understanding Datasheet Jitter Specifications for Cypress Timing Products – AN5054 for more information. Document Number: 001-69257 Rev. *F Page 21 of 39 CY8C20x37/37S/47/47S/67/67S AC General Purpose I/O Specifications The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 24. AC GPIO Specifications Symbol FGPIO Description GPIO operating frequency Conditions Normal strong mode Port 0, 1 Min 0 0 tRISE23 tRISE23L tRISE01 tRISE01L tFALL tFALLL Rise time, strong mode, Cload = 50 pF Ports 2 or 3 Rise time, strong mode low supply, Cload = 50 pF, Ports 2 or 3 Rise time, strong mode, Cload = 50 pF Ports 0 or 1 Rise time, strong mode low supply, Cload = 50 pF, Ports 0 or 1 Fall time, strong mode, Cload = 50 pF all ports Fall time, strong mode low supply, Cload = 50 pF, all ports Typ Max Units – 6 MHz for MHz 1.71 V <VDD < 2.40 V – 12 MHz for MHz 2.40 V < VDD< 5.50 V – 80 ns VDD = 3.0 to 3.6 V, 10% to 90% 15 VDD = 1.71 to 3.0 V, 10% to 90% 15 – 80 ns VDD = 3.0 to 3.6 V, 10% to 90% LDO enabled or disabled VDD = 1.71 to 3.0 V, 10% to 90% LDO enabled or disabled VDD = 3.0 to 3.6 V, 10% to 90% 10 – 50 ns 10 – 80 ns 10 – 50 ns VDD = 1.71 to 3.0 V, 10% to 90% 10 – 70 ns Figure 9. GPIO Timing Diagram 90% GPIO Pin Output Voltage 10% TRise23 TRise01 TRise23L TRise01L TFall TFallL AC Comparator Specifications The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 25. AC Low Power Comparator Specifications Symbol tLPC Description Comparator response time, 50 mV overdrive Conditions 50 mV overdrive does not include offset voltage. Min Typ Max Units – – 100 ns AC External Clock Specifications The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 26. AC External Clock Specifications Symbol FOSCEXT Description Frequency (external oscillator frequency) Conditions – Min Typ Max Units 0.75 – 25.20 MHz High period – 20.60 – 5300 ns Low period – 20.60 – – ns Power-up IMO to switch – 150 – – s Document Number: 001-69257 Rev. *F Page 22 of 39 CY8C20x37/37S/47/47S/67/67S AC Programming Specifications Figure 10. AC Waveform SCLK (P1[1]) T RSCLK T FSCLK SDATA (P1[0]) TSSCLK T HSCLK TDSCLK The following table lists the guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 27. AC Programming Specifications Symbol tRSCLK tFSCLK tSSCLK tHSCLK FSCLK tERASEB tWRITE tDSCLK tDSCLK3 tDSCLK2 tXRST3 Description Rise time of SCLK Fall time of SCLK Data setup time to falling edge of SCLK Data hold time from falling edge of SCLK Frequency of SCLK Flash erase time (block) Flash block write time Data out delay from falling edge of SCLK Data out delay from falling edge of SCLK Data out delay from falling edge of SCLK External reset pulse width after power-up tXRES tVDDWAIT[30] tVDDXRES[30] tPOLL tACQ[30] XRES pulse length VDD stable to wait-and-poll hold off VDD stable to XRES assertion delay SDAT high pulse time “Key window” time after a VDD ramp acquire event, based on 256 ILO clocks. “Key window” time after an XRES event, based on 8 ILO clocks tXRESINI[30] Conditions – – – – – – – 3.6 VDD 3.0 VDD 3.6 1.71 VDD 3.0 Required to enter programming mode when coming out of sleep – – – – – – Min 1 1 40 40 0 – – – – – 300 Typ – – – – – – – – – – – Max 20 20 – – 8 18 25 60 85 130 – Units ns ns ns ns MHz ms ms ns ns ns s 300 0.1 14.27 0.01 3.20 – – – – – – 1 – 200 19.60 s ms ms ms ms 98 – 615 s Note 30. Valid from 5 to 50 °C. See the spec, CY8C20X66, CY8C20X46, CY8C20X36, CY7C643XX, CY7C604XX, CY8CTST2XX, CY8CTMG2XX, CY8C20X67, CY8C20X47, CY8C20X37, Programming Spec for more details. Document Number: 001-69257 Rev. *F Page 23 of 39 CY8C20x37/37S/47/47S/67/67S AC I2C Specifications The following table lists guaranteed maximum and minimum specifications for the entire voltage and temperature ranges. Table 28. AC Characteristics of the I2C SDA and SCL Pins Symbol Description fSCL tHD;STA SCL clock frequency Hold time (repeated) START condition. After this period, the first clock pulse is generated tLOW LOW period of the SCL clock HIGH Period of the SCL clock tHIGH Setup time for a repeated START condition tSU;STA tHD;DAT[31] Data hold time Data setup time tSU;DAT Setup time for STOP condition tSU;STO tBUF Bus free time between a STOP and START condition Pulse width of spikes are suppressed by the input filter tSP Standard Mode Min Max 0 100 4.0 – 4.7 4.0 4.7 20 250 4.0 4.7 – – – – 3.45 – – – – Fast Mode Min 0 0.6 Max 400 – 1.3 – 0.6 – 0.6 – 20 0.90 100[32] – 0.6 – 1.3 – 0 50 Units kHz µs µs µs µs µs ns µs µs ns Figure 11. Definition for Timing for Fast/Standard Mode on the I2C Bus Notes 31. To wake up from sleep using I2C hardware address match event, I2C interface needs 20 ns hold time on SDA line with respect to falling edge of SCL. See the CY8C20xx7 Silicon Errata document for more details. 32. A Fast-Mode I2C-bus device can be used in a standard mode I2C-bus system, but the requirement tSU;DAT 250 ns must then be met. This automatically be the case if the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line trmax + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released. Document Number: 001-69257 Rev. *F Page 24 of 39 CY8C20x37/37S/47/47S/67/67S Table 29. SPI Master AC Specifications Min Typ Max Units FSCLK Symbol SCLK clock frequency Description VDD 2.4 V VDD < 2.4 V Conditions – – – – 6 3 MHz MHz DC SCLK duty cycle – – 50 – % tSETUP MISO to SCLK setup time VDD 2.4 V VDD < 2.4 V 60 100 – – – – ns ns tHOLD SCLK to MISO hold time – 40 – – ns tOUT_VAL SCLK to MOSI valid time – – – 40 ns tOUT_H MOSI high time – 40 – – ns Figure 12. SPI Master Mode 0 and 2 SPI Master, modes 0 and 2 1/FSCLK THIGH TLOW SCLK (mode 0) SCLK (mode 2) TSETUP MISO (input) THOLD LSB MSB TOUT_SU TOUT_H MOSI (output) Figure 13. SPI Master Mode 1 and 3 SPI Master, modes 1 and 3 1/FSCLK THIGH TLOW SCLK (mode 1) SCLK (mode 3) TSETUP MISO (input) THOLD TOUT_SU MOSI (output) Document Number: 001-69257 Rev. *F LSB MSB TOUT_H MSB LSB Page 25 of 39 CY8C20x37/37S/47/47S/67/67S Table 30. SPI Slave AC Specifications Symbol FSCLK tLOW tHIGH tSETUP tHOLD tSS_MISO tSCLK_MISO tSS_HIGH tSS_CLK tCLK_SS Description SCLK clock frequency SCLK low time SCLK high time MOSI to SCLK setup time SCLK to MOSI hold time SS high to MISO valid SCLK to MISO valid SS high time Time from SS low to first SCLK Time from last SCLK to SS high Conditions Min – 42 42 30 50 – – 50 2/SCLK 2/SCLK – – – – – – – – – – Typ – – – – – – – – – – Max 4 – – – – 153 125 – – – Units MHz ns ns ns ns ns ns ns ns ns Figure 14. SPI Slave Mode 0 and 2 SPI Slave, modes 0 and 2 TSS_HIGH TCLK_SS TSS_CLK /SS 1/FSCLK THIGH TLOW SCLK (mode 0) SCLK (mode 2) TOUT_H TSS_MISO MISO (output) TSETUP MOSI (input) THOLD LSB MSB Figure 15. SPI Slave Mode 1 and 3 SPI Slave, modes 1 and 3 TSS_CLK TCLK_SS /SS 1/FSCLK THIGH TLOW SCLK (mode 1) SCLK (mode 3) TOUT_H TSCLK_MISO TSS_MISO MISO (output) MSB TSETUP MOSI (input) Document Number: 001-69257 Rev. *F LSB THOLD MSB LSB Page 26 of 39 CY8C20x37/37S/47/47S/67/67S Packaging Information This section illustrates the packaging specifications for the CY8C20x37/47/67 PSoC device, along with the thermal impedances for each package. Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of the emulation tools’ dimensions, refer to the document titled PSoC Emulator Pod Dimensions at http://www.cypress.com/design/MR10161. Figure 16. 16-pin (150 Mil) SOIC 51-85068 *D Figure 17. 16-pin QFN No Center Pad (3 x 3 x 0.6 mm) Package Outline (Sawn) 001-09116 *F Document Number: 001-69257 Rev. *F Page 27 of 39 CY8C20x37/37S/47/47S/67/67S Figure 18. 24-Pin (4 × 4 × 0.6 mm) QFN 001-13937 *D Figure 19. 32-Pin (5 × 5 × 0.6 mm) QFN 001-42168 *D Document Number: 001-69257 Rev. *F Page 28 of 39 CY8C20x37/37S/47/47S/67/67S Figure 20. 48-Pin (6 × 6 × 0.6 mm) QFN 001-57280 *C Important Notes ■ For information on the preferred dimensions for mounting QFN packages, see the following Application Note at http://www.amkor.com/products/notes_papers/MLFAppNote.pdf. ■ Pinned vias for thermal conduction are not required for the low power PSoC device. Document Number: 001-69257 Rev. *F Page 29 of 39 CY8C20x37/37S/47/47S/67/67S Thermal Impedances Table 31. Thermal Impedances per Package Package Typical JA [33] 16-Pin SOIC 95 C/W 16-Pin QFN 33 C/W 24-Pin QFN[34] 21 C/W 32-Pin QFN[34] 20 C/W 48-Pin QFN[34] 18 C/W 30-Ball WLCSP 54 C/W Capacitance on Crystal Pins Table 32. Typical Package Capacitance on Crystal Pins Package Package Capacitance 32-Pin QFN 3.2 pF 48-Pin QFN 3.3 pF Solder Reflow Peak Temperature Table 33 shows the solder reflow temperature limits that must not be exceeded. Table 33. Solder Reflow Peak Temperature Package Maximum Peak Temperature (TC) Maximum Time above TC – 5 C 16-pin SOIC 260 C 30 seconds 16-pin QFN 260 C 30 seconds 24-pin QFN 260 C 30 seconds 32-pin QFN 260 C 30 seconds 48-pin QFN 260 C 30 seconds 30-ball WLCSP 260 C 30 seconds Notes 33. TJ = TA + Power × JA. 34. To achieve the thermal impedance specified for the QFN package, the center thermal pad must be soldered to the PCB ground plane. Document Number: 001-69257 Rev. *F Page 30 of 39 CY8C20x37/37S/47/47S/67/67S Development Tool Selection Software PSoC Designer™ At the core of the PSoC development software suite is PSoC Designer, used to generate PSoC firmware applications. PSoC Designer is a Microsoft® Windows-based, integrated development environment for the Programmable System-onChip (PSoC) devices. The PSoC Designer IDE and application runs on Windows XP and Windows Vista. This system provides design database management by project, in-system programming support, and built-in support for thirdparty assemblers and C compilers. PSoC Designer also supports C language compilers developed specifically for the devices in the PSoC family. PSoC Designer is available free of charge at http://www.cypress.com/psocdesigner and includes a free C compiler. PSoC Designer Software Subsystems You choose a base device to work with and then select different onboard analog and digital components called user modules that use the PSoC blocks. Examples of user modules are ADCs, DACs, Amplifiers, and Filters. You configure the user modules for your chosen application and connect them to each other and to the proper pins. Then you generate your project. This prepopulates your project with APIs and libraries that you can use to program your application. The tool also supports easy development of multiple configurations and dynamic reconfiguration. Dynamic reconfiguration allows for changing configurations at run time. Code Generation Tools PSoC Designer supports multiple thirdparty C compilers and assemblers. The code generation tools work seamlessly within the PSoC Designer interface and have been tested with a full range of debugging tools. The choice is yours. Assemblers. The assemblers allow assembly code to be merged seamlessly with C code. Link libraries automatically use absolute addressing or are compiled in relative mode, and linked with other software modules to get absolute addressing. C Language Compilers. C language compilers are available that support the PSoC family of devices. The products allow you to create complete C programs for the PSoC family devices. The optimizing C compilers provide all the features of C tailored to the PSoC architecture. They come complete with embedded libraries providing port and bus operations, standard keypad and display support, and extended math functionality. PSoC Programmer PSoC Programmer is flexible enough and is used on the bench in development and is also suitable for factory programming. PSoC Programmer works either as a standalone programming application or operates directly from PSoC Designer. PSoC Programmer software is compatible with both PSoC ICE Cube in-circuit Emulator and PSoC MiniProg. PSoC programmer is available free of cost at http://www.cypress.com/psocprogrammer. Document Number: 001-69257 Rev. *F Development Kits All development kits are sold at the Cypress Online Store. Evaluation Tools All evaluation tools are sold at the Cypress Online Store. CY3210-MiniProg1 The CY3210-MiniProg1 kit allows you to program PSoC devices through the MiniProg1 programming unit. The MiniProg is a small, compact prototyping programmer that connects to the PC through a provided USB 2.0 cable. The kit includes: ■ MiniProg programming unit ■ MiniEval socket programming and evaluation board ■ 28-pin CY8C29466-24PXI PDIP PSoC device sample ■ 28-pin CY8C27443-24PXI PDIP PSoC device sample ■ PSoC Designer software CD ■ Getting Started guide ■ USB 2.0 cable CY3210-PSoCEval1 The CY3210-PSoCEval1 kit features an evaluation board and the MiniProg1 programming unit. The evaluation board includes an LCD module, potentiometer, LEDs, and plenty of breadboarding space to meet all of your evaluation needs. The kit includes: ■ Evaluation board with LCD module ■ MiniProg programming unit ■ Two 28-pin CY8C29466-24PXI PDIP PSoC device samples ■ PSoC Designer software CD ■ Getting Started guide ■ USB 2.0 cable Device Programmers All device programmers are purchased from the Cypress Online Store. CY3216 Modular Programmer The CY3216 Modular Programmer kit features a modular programmer and the MiniProg1 programming unit. The modular programmer includes three programming module cards and supports multiple Cypress products. The kit includes: ■ Modular programmer base ■ Three programming module cards ■ MiniProg programming unit ■ PSoC Designer software CD ■ Getting Started guide ■ USB 2.0 cable Page 31 of 39 CY8C20x37/37S/47/47S/67/67S CY3207ISSP In-System Serial Programmer (ISSP) The CY3207ISSP is a production programmer. It includes protection circuitry and an industrial case that is more robust than the MiniProg in a production-programming environment. Note CY3207ISSP needs special software and is not compatible with PSoC Programmer. The kit includes: ■ CY3207 programmer unit ■ PSoC ISSP software CD ■ 110 ~ 240 V power supply, Euro-Plug adapter ■ USB 2.0 cable Accessories (Emulation and Programming) Table 34. Emulation and Programming Accessories Part Number Pin Package Flex-Pod Kit[35] Foot Kit[36] Adapter[37] CY8C20237-24LKXI 16 QFN CY3250-20246QFN CY3250-20246QFN-POD See note 34 CY8C20247-24LKXI 16 QFN CY3250-20246QFN CY3250-20246QFN-POD See note 37 CY8C20337-24LQXI 24 QFN CY3250-20346QFN CY3250-20346QFN-POD See note 34 CY8C20347-24LQXI 24 QFN CY3250-20346QFN CY3250-20346QFN-POD See note 37 CY8C20437-24LQXI 32 QFN CY3250-20466QFN CY3250-20466QFN-POD See note 34 CY8C20447-24LQXI 32 QFN CY3250-20466QFN CY3250-20466QFN-POD See note 37 CY8C20467-24LQXI 32 QFN CY3250-20466QFN CY3250-20466QFN-POD See note 37 CY8C20637-24LQXI 48 QFN CY3250-20666QFN CY3250-20666QFN-POD See note 37 CY8C20647-24LQXI 48 QFN CY3250-20666QFN CY3250-20666QFN-POD See note 37 CY8C20667-24LQXI 48 QFN CY3250-20666QFN CY3250-20666QFN-POD See note 37 Third Party Tools Several tools have been specially designed by the following third-party vendors to accompany PSoC devices during development and production. Specific details for each of these tools can be found at http://www.cypress.com under Documentation > Evaluation Boards. Build a PSoC Emulator into Your Board For details on how to emulate your circuit before going to volume production using an on-chip debug (OCD) non-production PSoC device, see the Application Note Debugging - Build a PSoC Emulator into Your Board – AN2323. Notes 35. Flex-Pod kit includes a practice flex-pod and a practice PCB, in addition to two flex-pods. 36. Foot kit includes surface mount feet that can be soldered to the target PCB. 37. Programming adapter converts non-DIP package to DIP footprint. Specific details and ordering information for each of the adapters can be found at http://www.emulation.com. Document Number: 001-69257 Rev. *F Page 32 of 39 CY8C20x37/37S/47/47S/67/67S Ordering Information The following table lists the CY8C20x37/47/67/S PSoC devices' key package features and ordering codes. Table 35. PSoC Device Key Features and Ordering Information Ordering Code Package Flash SRAM CapSense Digital I/O Analog XRES ADC (Bytes) (Bytes) Sensors Pins Inputs [38] Pin CY8C20237-24SXI 16-pin SOIC 8K 1K 12 13 13 Yes Yes CY8C20247-24SXI 16-pin SOIC 16 K 2K 12 13 13 Yes Yes CY8C20247S-24SXI 16-pin SOIC 16 K 2K 12 13 13 Yes Yes CY8C20237-24LKXI 16-pin QFN 8K 1K 12 13 13 Yes Yes CY8C20237-24LKXIT 16-pin QFN (Tape and Reel) 8K 1K 12 13 13 Yes Yes CY8C20247-24LKXI 16-pin QFN 16 K 2K 12 13 13 Yes Yes CY8C20247-24LKXIT 16-pin QFN (Tape and Reel) 16 K 2K 12 13 13 Yes Yes CY8C20247S-24LKXI 16-pin QFN 16 K 2K 12 13 13 Yes Yes CY8C20247S-24LKXIT 16-pin QFN (Tape and Reel) 16 K 2K 12 13 13 Yes Yes CY8C20337-24LQXI 24-pin QFN 8K 1K 18 19 19 Yes Yes CY8C20337-24LQXIT 24-pin QFN (Tape and Reel) 8K 1K 18 19 19 Yes Yes CY8C20347-24LQXI 24-pin QFN 16 K 2K 18 19 19 Yes Yes CY8C20347-24LQXIT 24-pin QFN (Tape and Reel) 16 K 2K 18 19 19 Yes Yes CY8C20347S-24LQXI 24-pin QFN 16 K 2K 18 19 19 Yes Yes CY8C20347S-24LQXIT 24-pin QFN (Tape and Reel) 16 K 2K 18 19 19 Yes Yes CY8C20437-24LQXI 32-pin QFN 8K 1K 27 28 28 Yes Yes CY8C20437-24LQXIT 32-pin QFN (Tape and Reel) 8K 1K 27 28 28 Yes Yes CY8C20447-24LQXI 32-pin QFN 16 K 2K 27 28 28 Yes Yes CY8C20447-24LQXIT 32-pin QFN (Tape and Reel) 16 K 2K 27 28 28 Yes Yes CY8C20447S-24LQXI 32-pin QFN 16 K 2K 27 28 28 Yes Yes CY8C20447S-24LQXIT 32-pin QFN (Tape and Reel) 16 K 2K 27 28 28 Yes Yes CY8C20467-24LQXI 32-pin QFN 32 K 2K 27 28 28 Yes Yes CY8C20467-24LQXIT 32-pin QFN (Tape and Reel) 32 K 2K 27 28 28 Yes Yes CY8C20467S-24LQXI 32-pin QFN 32 K 2K 27 28 28 Yes Yes CY8C20467S-24LQXIT 32-pin QFN (Tape and Reel) 32 K 2K 27 28 28 Yes Yes CY8C20637-24LQXI 48-pin QFN 8K 1K 31 32 32 Yes Yes CY8C20637-24LQXIT 48-pin QFN (Tape and Reel) 8K 1K 31 32 32 Yes Yes CY8C20647-24LQXI 48-pin QFN 16 K 2K 31 32 32 Yes Yes CY8C20647-24LQXIT 48-pin QFN (Tape and Reel) 16 K 2K 31 32 32 Yes Yes CY8C20647S-24LQXI 48-pin QFN 16 K 2K 31 32 32 Yes Yes CY8C20647S-24LQXIT 48-pin QFN (Tape and Reel) 16 K 2K 31 32 32 Yes Yes CY8C20667-24LQXI 48-pin QFN 32 K 2K 31 32 32 Yes Yes CY8C20667-24LQXIT 48-pin QFN (Tape and Reel) 32 K 2K 31 32 32 Yes Yes Note 38. Dual-function Digital I/O Pins also connect to the common analog mux. Document Number: 001-69257 Rev. *F Page 33 of 39 CY8C20x37/37S/47/47S/67/67S Table 35. PSoC Device Key Features and Ordering Information (continued) Ordering Code Flash SRAM CapSense Digital I/O Analog XRES ADC (Bytes) (Bytes) Sensors Pins Inputs [38] Pin Package CY8C20667S-24LQXI 48-pin QFN 32 K 2K 31 32 32 Yes Yes CY8C20667S-24LQXIT 48-pin QFN (Tape and Reel) 32 K 2K 31 32 32 Yes Yes CY8C20747-24FDXC 30-pin WLCSP 16 K 1K 26 27 27 Yes Yes CY8C20747-24FDXCT 30-pin WLCSP (Tape and Reel) 16 K 1K 26 27 27 Yes Yes CY8C20767-24FDXC 30-pin WLCSP 32 K 2K 26 27 27 Yes Yes CY8C20767-24FDXCT 30-pin WLCSP (Tape and Reel) 32 K 2K 26 27 27 Yes Yes Ordering Code Definitions CY 8 C 20 XX7 X - 24 XX X X (T) Tape and reel Temperature range: X = C or I C = Commercial; I = Industrial Pb-free Package Types: XX = S, LK, LQ, or FD S = 16-pin SOIC LK = 16-pin QFN (no center pad) LQ = 24-pin QFN, 32-pin QFN, 48-pin QFN FD = 30-ball WLCSP Speed grade = 24 MHz S = SmartSense™ Auto-tuning Enabled Part Number Family Code Technology Code: C = CMOS Marketing Code: 8 = PSoC Company ID: CY = Cypress Document Number: 001-69257 Rev. *F Page 34 of 39 CY8C20x37/37S/47/47S/67/67S Acronyms Reference Documents The following table lists the acronyms that are used in this document. ■ Technical reference manual for CY20xx7 devices ■ In-system Serial Programming (ISSP) protocol for 20xx7 ■ Host Sourced Serial Programming for 20xx7 devices Table 36. Acronyms Used in this Document Acronym AC ADC API CMOS CPU DAC DC ESD FSR GPIO I 2C ICE ILO IMO I/O ISSP LCD LDO LED LPC LSB LVD MCU MIPS MISO MOSI MSB OCD PCB POR PSRR PWRSYS PSoC QFN SCLK SDA SDATA SOIC SPI SRAM SS USB WLCSP Description alternating current analog-to-digital converter application programming interface complementary metal oxide semiconductor central processing unit digital-to-analog converter direct current electrostatic discharge full scale range general purpose input/output inter-integrated circuit in-circuit emulator internal low speed oscillator internal main oscillator input/output in-system serial programming liquid crystal display low dropout (regulator) light-emitting diode low power comparator least-significant bit low voltage detect micro-controller unit million instructions per second master in slave out master out slave in most-significant bit on-chip debug printed circuit board power on reset power supply rejection ratio power system programmable system-on-chip quad flat no-lead serial I2C clock serial I2C data serial ISSP data small outline integrated circuit serial peripheral interface static random access memory slave select universal serial bus wafer level chip scale package Document Number: 001-69257 Rev. *F Document Conventions Units of Measure Table 37 lists all the abbreviations used to measure the PSoC devices. Table 37. Units of Measure Symbol °C dB kHz ksps k MHz A s mA mm ms mV nA ns % pF V W Unit of Measure degree Celsius decibel kilohertz kilo samples per second kilohm megahertz microampere microsecond milliampere millimeter millisecond millivolt nanoampere nanosecond ohm percent picofarad volt watt Page 35 of 39 CY8C20x37/37S/47/47S/67/67S Numeric Naming Hexadecimal numbers are represented with all letters in uppercase with an appended lowercase ‘h’ (for example, ‘14h’ or ‘3Ah’). Hexadecimal numbers may also be represented by a ‘0x’ prefix, the C coding convention. Binary numbers have an appended lowercase ‘b’ (for example, 01010100b’ or ‘01000011b’). Numbers not indicated by an ‘h’, ‘b’, or 0x are decimal. Glossary Crosspoint connection Connection between any GPIO combination via analog multiplexer bus. Differential non linearity Ideally, any two adjacent digital codes correspond to output analog voltages that are exactly one LSB apart. Differential non-linearity is a measure of the worst case deviation from the ideal 1 LSB step. Hold time Hold time is the time following a clock event during which the data input to a latch or flipflop must remain stable in order to guarantee that the latched data is correct. I2C It is a serial multi-master bus used to connect low speed peripherals to MCU. Integral nonlinearity It is a term describing the maximum deviation between the ideal output of a DAC/ADC and the actual output level. Latch-up current Current at which the latch-up test is conducted according to JESD78 standard (at 125 degree Celsius) Power supply rejection ratio (PSRR) The PSRR is defined as the ratio of the change in supply voltage to the corresponding change in output voltage of the device. Scan The conversion of all sensor capacitances to digital values. Setup time Period required to prepare a device, machine, process, or system for it to be ready to function. Signal-to-noise ratio The ratio between a capacitive finger signal and system noise. SPI Serial peripheral interface is a synchronous serial data link standard. Document Number: 001-69257 Rev. *F Page 36 of 39 CY8C20x37/37S/47/47S/67/67S Document History Page Document Title: CY8C20x37/37S/47/47S/67/67S, 1.8 V CapSense® Controller with SmartSense™ Auto-tuning 31 Buttons, 6 Sliders Document Number: 001-69257 Orig. of Submission Revision ECN Description of Change Change Date ** 3276782 DST 06/27/2011 New silicon and document *A 3327230 DST 07/28/2011 Changed 48-pin dimensions to 6 × 6 × 0.6 mm QFN Updated pins name in Table 3 on page 9 and removed USB column and updated dimensions for 48-pin parts in Table 35 on page 33 Updated Figure 20 on page 29 Removed ICE and Debugger sections. Removed CY3215 Development Kit and CY3280-20x66 UCC sections. Updated Ordering Information. *B 3403111 YVA 10/12/2011 Moved status from Advance to Preliminary. Updated Ordering Information Removed the row named “48-Pin (6 × 6 mm) QFN (OCD)”. Changed all 48-pin ordering code column from CY8C20XXX-24LTxx to CY8C20XXX-24LQxx. Updated 16-pin SOIC and 16-pin QFN package drawings. *C 3473317 DST 12/23/2011 Updated Features. Updated Pinouts (Removed PSoC in captions of Figure 2, Figure 3, Figure 4, Figure 6, and Figure 7). Updated DC Chip-Level Specifications under Electrical Specifications (Updated typical value of IDD24 parameter from 3.32 mA to 2.88 mA, updated typical value of IDD12 parameter from 1.86 mA to 1.71 mA, updated typical value of IDD6 parameter from 1.13 mA to 1.16 mA, updated maximum value of ISB0 parameter from 0.50 µA to 1.1 µA, added ISBI2C parameter and its details). Updated DC GPIO Specifications under Electrical Specifications (Added the parameters namely VILLVT3.3, VIHLVT3.3, VILLVT5.5, VIHLVT5.5 and their details in Table 10, added the parameters namely VILLVT2.5, VIHLVT2.5 and their details in Table 11). Added the following sections namely DC I2C Specifications, Shield Driver DC Specifications, and DC IDAC Specifications under Electrical Specifications. Updated AC Chip-Level Specifications (Added the parameter namely tJIT_IMO and its details). Updated Ordering Information (updated Table 35). *D 3510277 YVA/DST 02/16/2012 Added CY8C20x37/37S/47/47S/67/67S part numbers and changed title to “1.8 V CapSense® Controller with SmartSense™ Auto-tuning 31 Buttons, 6 Sliders” Updated Features. Modified comparator blocks in Logic Block Diagram. Replaced SmartSense with SmartSense auto-tuning. Added CY8C20xx7S part numbers in Pin Definitions. Added footnote for Table 19. Updated Table 20 and Table 21 and added Table 22. Updated F32K1 min value. Updated data hold time min values. Updated CY8C206x7 part information in Table 34. Updated Ordering Information. *E 3539259 DST 03/01/2012 Changed Datasheet status from Preliminary to Final. Updated all Pinouts to include Driven Shield Output (optional) information. Updated Min value for VLPC Table 14. Updated Offset and Input range in Table 15. Document Number: 001-69257 Rev. *F Page 37 of 39 CY8C20x37/37S/47/47S/67/67S Document History Page Document Title: CY8C20x37/37S/47/47S/67/67S, 1.8 V CapSense® Controller with SmartSense™ Auto-tuning 31 Buttons, 6 Sliders Document Number: 001-69257 *F 3645807 DST/BVI 07/03/2012 Updated FSCLK parameter in the Table 30, “SPI Slave AC Specifications,” on page 26 Changed tOUT_HIGH to tOUT_H in Table 29, “SPI Master AC Specifications,” on page 25 Updated Features section, “Programmable pin configurations” bullet: ■ Included the following sub-bullet point 5 mA source current on port 0 and 1 and 1 mA on port 2,3 and 4 ■ Changed the bullet point “High sink current of 25 mA for each GPIO” to “High sink current of 25 mA for each GPIO. Total 120 mA maximum sink current per chip” ® ■ Added “QuietZone™ Controller” bullet and updated “Low power CapSense block with SmartSense™ auto-tuning” bullet. Updated package diagrams 001-13937 to *D and 001-57280 to *C revisions. Document Number: 001-69257 Rev. *F Page 38 of 39 CY8C20x37/37S/47/47S/67/67S Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. 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Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document Number: 001-69257 Rev. *F Revised July 3, 2012 All products and company names mentioned in this document may be the trademarks of their respective holders. Page 39 of 39