IPD60R170CFD7 MOSFET 600VCoolMOSªCFD7PowerTransistor DPAK CoolMOS™isarevolutionarytechnologyforhighvoltagepower MOSFETs,designedaccordingtothesuperjunction(SJ)principleand pioneeredbyInfineonTechnologies.ThelatestCoolMOS™CFD7isthe successortotheCoolMOS™CFD2seriesandisanoptimizedplatform tailoredtotargetsoftswitchingapplicationssuchasphase-shiftfull-bridge (ZVS)andLLC.Resultingfromreducedgatecharge(Qg),best-in-class reverserecoverycharge(Qrr)andimprovedturnoffbehaviorCoolMOS™ CFD7offershighestefficiencyinresonanttopologies.AspartofInfineon’s fastbodydiodeportfolio,thisnewproductseriesblendsalladvantagesof afastswitchingtechnologytogetherwithsuperiorhardcommutation robustness,withoutsacrificingeasyimplementationinthedesign-in process.TheCoolMOS™CFD7technologymeetshighestefficiencyand reliabilitystandardsandfurthermoresupportshighpowerdensity solutions.Altogether,CoolMOS™CFD7makesresonantswitching topologiesmoreefficient,morereliable,lighterandcooler. tab 1 2 3 Drain Pin 2, Tab Gate Pin 1 Features Source Pin 3 •Ultra-fastbodydiode •Lowgatecharge •Best-in-classreverserecoverycharge(Qrr) •ImprovedMOSFETreversediodedv/dtanddiF/dtruggedness •LowestFOMRDS(on)*QgandRDS(on)*Eoss •Best-in-classRDS(on)inSMDandTHDpackages Benefits •Excellenthardcommutationruggedness •Highestreliabilityforresonanttopologies •Highestefficiencywithoutstandingease-of-use/performancetradeoff •Enablingincreasedpowerdensitysolutions Potentialapplications SuiteableforSoftSwitchingtopologies Optimizedforphase-shiftfull-bridge(ZVS),LLCApplications–Server, Telecom,EVCharging ProductValidation:Qualifiedforindustrialapplicationsaccordingtothe relevanttestsofJEDEC47/20/22 Pleasenote:ForMOSFETparallelingtheuseofferritebeadsonthegate orseparatetotempolesisgenerallyrecommended. Table1KeyPerformanceParameters Parameter Value Unit VDS @ Tj,max 650 V RDS(on),max 170 mΩ Qg,typ 28 nC ID,pulse 51 A Eoss @ 400V 3.2 µJ Body diode diF/dt 1300 A/µs Type/OrderingCode Package IPD60R170CFD7 PG-TO 252-3 Final Data Sheet Marking 60R170F7 1 RelatedLinks see Appendix A Rev.2.1,2018-01-18 600VCoolMOSªCFD7PowerTransistor IPD60R170CFD7 TableofContents Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Test Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Final Data Sheet 2 Rev.2.1,2018-01-18 600VCoolMOSªCFD7PowerTransistor IPD60R170CFD7 1Maximumratings atTj=25°C,unlessotherwisespecified Table2Maximumratings Parameter Symbol Continuous drain current1) Values Unit Note/TestCondition 14 9 A TC=25°C TC=100°C - 51 A TC=25°C - - 60 mJ ID=3.7A; VDD=50V; see table 10 EAR - - 0.30 mJ ID=3.7A; VDD=50V; see table 10 Avalanche current, single pulse IAS - - 3.7 A - MOSFET dv/dt ruggedness dv/dt - - 120 V/ns VDS=0...400V Gate source voltage (static) VGS -20 - 20 V static; Gate source voltage (dynamic) VGS -30 - 30 V AC (f>1 Hz) Power dissipation Ptot - - 76 W TC=25°C Storage temperature Tstg -55 - 150 °C - Operating junction temperature Tj -55 - 150 °C - Mounting torque - - - - Ncm - IS - - 14 A TC=25°C Diode pulse current IS,pulse - - 51 A TC=25°C Reverse diode dv/dt3) dv/dt - - 70 V/ns VDS=0...400V,ISD<=14A,Tj=25°C see table 8 Maximum diode commutation speed diF/dt - - 1300 A/µs VDS=0...400V,ISD<=14A,Tj=25°C see table 8 Insulation withstand voltage VISO - - n.a. V Vrms,TC=25°C,t=1min Min. Typ. Max. ID - - Pulsed drain current2) ID,pulse - Avalanche energy, single pulse EAS Avalanche energy, repetitive Continuous diode forward current 2) 1) Limited by Tj,max. Pulse width tp limited by Tj,max 3) Identical low side and high side switch with identical RG 2) Final Data Sheet 3 Rev.2.1,2018-01-18 600VCoolMOSªCFD7PowerTransistor IPD60R170CFD7 2Thermalcharacteristics Table3Thermalcharacteristics Parameter Symbol Thermal resistance, junction - case Values Unit Note/TestCondition Min. Typ. Max. RthJC - - 1.65 °C/W - Thermal resistance, junction - ambient RthJA - - 62 °C/W device on PCB, minimal footprint Thermal resistance, junction - ambient RthJA for SMD version - 35 45 Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70µm thickness) copper area °C/W for drain connection and cooling. PCB is vertical without air stream cooling. Soldering temperature, wave- & reflow Tsold soldering allowed - - 260 °C Final Data Sheet 4 reflow MSL1 Rev.2.1,2018-01-18 600VCoolMOSªCFD7PowerTransistor IPD60R170CFD7 3Electricalcharacteristics atTj=25°C,unlessotherwisespecified Table4Staticcharacteristics Parameter Symbol Drain-source breakdown voltage Values Unit Note/TestCondition - V VGS=0V,ID=1mA 4 4.5 V VDS=VGS,ID=0.3mA - 7 1 37 µA VDS=600V,VGS=0V,Tj=25°C VDS=600V,VGS=0V,Tj=125°C IGSS - - 100 nA VGS=20V,VDS=0V Drain-source on-state resistance RDS(on) - 0.144 0.328 0.17 - Ω VGS=10V,ID=6.0A,Tj=25°C VGS=10V,ID=6.0A,Tj=150°C Gate resistance RG - 10.9 - Ω f=1MHz,opendrain Unit Note/TestCondition Min. Typ. Max. V(BR)DSS 600 - Gate threshold voltage V(GS)th 3.5 Zero gate voltage drain current1) IDSS Gate-source leakage current Table5Dynamiccharacteristics Parameter Symbol Input capacitance Values Min. Typ. Max. Ciss - 1199 - pF VGS=0V,VDS=400V,f=250kHz Output capacitance Coss - 22 - pF VGS=0V,VDS=400V,f=250kHz Effective output capacitance, energy related2) Co(er) - 40 - pF VGS=0V,VDS=0...400V Effective output capacitance, time related3) Co(tr) - 402 - pF ID=constant,VGS=0V,VDS=0...400V Turn-on delay time td(on) - 31 - ns VDD=400V,VGS=10V,ID=7.0A, RG=10.2Ω;seetable9 Rise time tr - 15 - ns VDD=400V,VGS=10V,ID=7.0A, RG=10.2Ω;seetable9 Turn-off delay time td(off) - 68 - ns VDD=400V,VGS=10V,ID=7.0A, RG=10.2Ω;seetable9 Fall time tf - 9 - ns VDD=400V,VGS=10V,ID=7.0A, RG=10.2Ω;seetable9 Unit Note/TestCondition Table6Gatechargecharacteristics Parameter Symbol Gate to source charge Values Min. Typ. Max. Qgs - 7 - nC VDD=400V,ID=7.0A,VGS=0to10V Gate to drain charge Qgd - 9 - nC VDD=400V,ID=7.0A,VGS=0to10V Gate charge total Qg - 28 - nC VDD=400V,ID=7.0A,VGS=0to10V Gate plateau voltage Vplateau - 5.7 - V VDD=400V,ID=7.0A,VGS=0to10V 1) Maximum specification is defined by calculated six sigma upper confidence bound Co(er)isafixedcapacitancethatgivesthesamestoredenergyasCosswhileVDSisrisingfrom0to400V 3) Co(tr)isafixedcapacitancethatgivesthesamechargingtimeasCosswhileVDSisrisingfrom0to400V 2) Final Data Sheet 5 Rev.2.1,2018-01-18 600VCoolMOSªCFD7PowerTransistor IPD60R170CFD7 Table7Reversediodecharacteristics Parameter Symbol Diode forward voltage Values Unit Note/TestCondition - V VGS=0V,IF=6.0A,Tj=25°C 89 134 ns VR=400V,IF=7A,diF/dt=100A/µs; see table 8 - 0.34 0.68 µC VR=400V,IF=7A,diF/dt=100A/µs; see table 8 - 6.8 - A VR=400V,IF=7A,diF/dt=100A/µs; see table 8 Min. Typ. Max. VSD - 1.0 Reverse recovery time trr - Reverse recovery charge Qrr Peak reverse recovery current Irrm Final Data Sheet 6 Rev.2.1,2018-01-18 600VCoolMOSªCFD7PowerTransistor IPD60R170CFD7 4Electricalcharacteristicsdiagrams Diagram1:Powerdissipation Diagram2:Safeoperatingarea 102 80 1 µs 101 10 µs 60 100 ID[A] Ptot[W] 100 µs 40 10-1 1 ms 10-2 10 ms 20 DC 10-3 0 0 25 50 75 100 125 10-4 150 100 101 TC[°C] 102 103 VDS[V] Ptot=f(TC) ID=f(VDS);TC=25°C;D=0;parameter:tp Diagram3:Safeoperatingarea Diagram4:Max.transientthermalimpedance 2 101 10 1 µs 101 10 µs 100 100 0.5 ZthJC[K/W] ID[A] 100 µs 10-1 1 ms 10-2 0.2 0.1 10-1 10 ms 0.05 0.02 0.01 DC single pulse -3 10 10-4 100 101 102 103 10-2 10-5 10-4 VDS[V] 10-2 10-1 tp[s] ID=f(VDS);TC=80°C;D=0;parameter:tp Final Data Sheet 10-3 ZthJC=f(tP);parameter:D=tp/T 7 Rev.2.1,2018-01-18 600VCoolMOSªCFD7PowerTransistor IPD60R170CFD7 Diagram5:Typ.outputcharacteristics Diagram6:Typ.outputcharacteristics 80 50 20 V 10 V 40 8V 60 20 V 10 V 8V 7V 40 ID[A] ID[A] 30 7V 20 6V 20 10 5.5 V 6V 0 4.5 V 5 V 0 5 10 5V 5.5 V 15 0 20 4.5 V 0 5 10 VDS[V] 15 20 VDS[V] ID=f(VDS);Tj=25°C;parameter:VGS ID=f(VDS);Tj=125°C;parameter:VGS Diagram7:Typ.drain-sourceon-stateresistance Diagram8:Drain-sourceon-stateresistance 0.460 2.5 20 V 0.420 5.5 V 6V 6.5 V 7 V 10 V RDS(on)[normalized] 2.0 RDS(on)[Ω] 0.380 0.340 1.5 1.0 0.300 0.260 0 10 20 30 40 50 0.5 -50 -25 0 25 ID[A] RDS(on)=f(ID);Tj=125°C;parameter:VGS Final Data Sheet 50 75 100 125 150 Tj[°C] RDS(on)=f(Tj);ID=6.0A;VGS=10V 8 Rev.2.1,2018-01-18 600VCoolMOSªCFD7PowerTransistor IPD60R170CFD7 Diagram9:Typ.transfercharacteristics Diagram10:Typ.gatecharge 80 10 9 25 °C 8 120 V 60 7 40 VGS[V] ID[A] 6 150 °C 400 V 5 4 3 20 2 1 0 0 2 4 6 8 10 0 12 0 5 10 VGS[V] 15 20 25 30 Qgate[nC] ID=f(VGS);VDS=20V;parameter:Tj VGS=f(Qgate);ID=7.0Apulsed;parameter:VDD Diagram11:Forwardcharacteristicsofreversediode Diagram12:Avalancheenergy 2 10 80 60 IF[A] EAS[mJ] 101 100 125 °C 20 25 °C 10-1 40 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0 25 50 VSD[V] 100 125 150 Tj[°C] IF=f(VSD);parameter:Tj Final Data Sheet 75 EAS=f(Tj);ID=3.7A;VDD=50V 9 Rev.2.1,2018-01-18 600VCoolMOSªCFD7PowerTransistor IPD60R170CFD7 Diagram13:Drain-sourcebreakdownvoltage Diagram14:Typ.capacitances 105 690 104 660 Ciss 103 C[pF] VBR(DSS)[V] 630 102 Coss 600 101 Crss 570 10 540 -50 -25 0 25 50 75 100 125 150 0 10-1 0 100 200 Tj[°C] 300 400 500 600 VDS[V] VBR(DSS)=f(Tj);ID=1mA C=f(VDS);VGS=0V;f=250kHz Diagram15:Typ.Cossstoredenergy 7 6 Eoss[µJ] 5 4 3 2 1 0 0 100 200 300 400 500 600 VDS[V] Eoss=f(VDS) Final Data Sheet 10 Rev.2.1,2018-01-18 600VCoolMOSªCFD7PowerTransistor IPD60R170CFD7 5TestCircuits Table8Diodecharacteristics Test circuit for diode characteristics Diode recovery waveform Rg1 VDS Rg 2 IF Rg1 = Rg 2 Table9Switchingtimes Switching times test circuit for inductive load Switching times waveform VDS 90% VDS VGS VGS 10% td(on) ton tr td(off) tf toff Table10Unclampedinductiveload Unclamped inductive load test circuit Unclamped inductive waveform V(BR)DS ID VDS VDS Final Data Sheet 11 ID VDS Rev.2.1,2018-01-18 600VCoolMOSªCFD7PowerTransistor IPD60R170CFD7 6PackageOutlines Figure1OutlinePG-TO252-3,dimensionsinmm/inches Final Data Sheet 12 Rev.2.1,2018-01-18 600VCoolMOSªCFD7PowerTransistor IPD60R170CFD7 7AppendixA Table11RelatedLinks • IFXCoolMOSCFD7Webpage:www.infineon.com • IFXCoolMOSCFD7applicationnote:www.infineon.com • IFXCoolMOSCFD7simulationmodel:www.infineon.com • IFXDesigntools:www.infineon.com Final Data Sheet 13 Rev.2.1,2018-01-18 600VCoolMOSªCFD7PowerTransistor IPD60R170CFD7 RevisionHistory IPD60R170CFD7 Revision:2018-01-18,Rev.2.1 Previous Revision Revision Date Subjects (major changes since last revision) 2.0 2017-08-25 Release of final version 2018-01-18 Raised diode current for dv/dt and dif/dt (table 2) to value of continuous drain current; Changed internal Rg (table 4); Renamed related links (table 11) 2.1 TrademarksofInfineonTechnologiesAG AURIX™,C166™,CanPAK™,CIPOS™,CoolGaN™,CoolMOS™,CoolSET™,CoolSiC™,CORECONTROL™,CROSSAVE™,DAVE™,DI-POL™,DrBlade™, EasyPIM™,EconoBRIDGE™,EconoDUAL™,EconoPACK™,EconoPIM™,EiceDRIVER™,eupec™,FCOS™,HITFET™,HybridPACK™,Infineon™, ISOFACE™,IsoPACK™,i-Wafer™,MIPAQ™,ModSTACK™,my-d™,NovalithIC™,OmniTune™,OPTIGA™,OptiMOS™,ORIGA™,POWERCODE™, PRIMARION™,PrimePACK™,PrimeSTACK™,PROFET™,PRO-SIL™,RASIC™,REAL3™,ReverSave™,SatRIC™,SIEGET™,SIPMOS™,SmartLEWIS™, SOLIDFLASH™,SPOC™,TEMPFET™,thinQ™,TRENCHSTOP™,TriCore™. TrademarksupdatedAugust2015 OtherTrademarks Allreferencedproductorservicenamesandtrademarksarethepropertyoftheirrespectiveowners. WeListentoYourComments Anyinformationwithinthisdocumentthatyoufeeliswrong,unclearormissingatall?Yourfeedbackwillhelpustocontinuously improvethequalityofthisdocument.Pleasesendyourproposal(includingareferencetothisdocument)to: [email protected] Publishedby InfineonTechnologiesAG 81726München,Germany ©2018InfineonTechnologiesAG AllRightsReserved. LegalDisclaimer Theinformationgiveninthisdocumentshallinnoeventberegardedasaguaranteeofconditionsorcharacteristics (“Beschaffenheitsgarantie”). Withrespecttoanyexamples,hintsoranytypicalvaluesstatedhereinand/oranyinformationregardingtheapplicationofthe product,InfineonTechnologiesherebydisclaimsanyandallwarrantiesandliabilitiesofanykind,includingwithoutlimitation warrantiesofnon-infringementofintellectualpropertyrightsofanythirdparty. Inaddition,anyinformationgiveninthisdocumentissubjecttocustomer’scompliancewithitsobligationsstatedinthis documentandanyapplicablelegalrequirements,normsandstandardsconcerningcustomer’sproductsandanyuseofthe productofInfineonTechnologiesincustomer’sapplications. Thedatacontainedinthisdocumentisexclusivelyintendedfortechnicallytrainedstaff.Itistheresponsibilityofcustomer’s technicaldepartmentstoevaluatethesuitabilityoftheproductfortheintendedapplicationandthecompletenessoftheproduct informationgiveninthisdocumentwithrespecttosuchapplication. Information Forfurtherinformationontechnology,deliverytermsandconditionsandpricespleasecontactyournearestInfineon TechnologiesOffice(www.infineon.com). Warnings Duetotechnicalrequirements,componentsmaycontaindangeroussubstances.Forinformationonthetypesinquestion, pleasecontactthenearestInfineonTechnologiesOffice. TheInfineonTechnologiescomponentdescribedinthisDataSheetmaybeusedinlife-supportdevicesorsystemsand/or automotive,aviationandaerospaceapplicationsorsystemsonlywiththeexpresswrittenapprovalofInfineonTechnologies,ifa failureofsuchcomponentscanreasonablybeexpectedtocausethefailureofthatlife-support,automotive,aviationand aerospacedeviceorsystemortoaffectthesafetyoreffectivenessofthatdeviceorsystem.Lifesupportdevicesorsystemsare intendedtobeimplantedinthehumanbodyortosupportand/ormaintainandsustainand/orprotecthumanlife.Iftheyfail,itis reasonabletoassumethatthehealthoftheuserorotherpersonsmaybeendangered. Final Data Sheet 14 Rev.2.1,2018-01-18