Microchip MCP73830LT-0BCI/MYY Single-cell li-ion/li-polymer battery charge management controllers in 2x2 tdfn Datasheet

MCP73830/L
Single-Cell Li-Ion/Li-Polymer Battery Charge Management
Controllers in 2x2 TDFN
Features:
Description:
• Complete Linear Charge Management Controller:
- Integrated Pass Transistor
- Integrated Current Sense
- Integrated Reverse Discharge Protection
• Constant Current/Constant Voltage Operation
• High Accuracy Preset Voltage Regulation:
– 4.20V + 0.75%
• Programmable Charge Current:
– MCP73830L: 20 mA – 200 mA
– MCP73830: 100 mA – 1000 mA
• Soft-Start to avoid In-Rush Current
• Preconditioning:
– 10% and no preconditioning
• Fixed Elapsed Timer: 4 Hours
• Fixed Preconditioning Timer: 1 Hour
• Automatic Recharge: No Auto-Recharge is also
available with Selected Options
• Automatic End-of-Charge Control Termination:
– 7.5% and 10%
• Automatic Power-Down when Input Power
Removed
• Undervoltage Lockout (UVLO)
• Chip/Charge Enable Pin (CE)
• Packaging:
– TDFN-6 (2x2 mm)
• Temperature Range: -40°C to +85°C
The MCP73830/L are highly integrated, Li-Ion battery
charge management controllers for use in spacelimited applications. The MCP73830/L devices provide
specific charge algorithms for single-cell Li-Ion/LiPolymer batteries to achieve optimal capacity and
safety in the shortest charging time possible. Along
with its small physical size, the low number of external
components makes the MCP73830/L ideally suitable
for portable applications.
The MCP73830L employs a constant current/constant
voltage charge algorithm. The minimum 20 mA
regulated constant, fast-charge current enables the
design in small Li-Ion batteries and low-supply current
applications. The fast-charge, constant current value is
set with one external resistor from 20 mA to 200 mA.
The MCP73830/L allows up to 1000 mA charge current
for applications that require faster constant current.
The MCP73830/L provides a thermal foldback function
that limits the charge current based on die temperature
during high-power or high-ambient conditions. This
thermal regulation optimizes the charge cycle time
while maintaining device reliability.
The MCP73830/L is fully specified over the ambient
temperature range of -40°C to +85°C. The
MCP73830/L is available in a 6 lead, TDFN package.
Package Types (Top View)
MCP73830/L
2x2 TDFN *
Applications:
•
•
•
•
VSS 1
Bluetooth Headsets
Portable Media Players
Rechargeable 3D Glasses
Toy and Gaming Controllers
STAT 2
6 PROG
EP
7
VBAT 3
5 CE
4 VDD
* Includes Exposed Thermal Pad (EP); see Table 3-1.
TABLE 1:
AVAILABLE FACTORY PRESET OPTIONS
Charge Voltage
Preconditioning Charge Current
End-of-Charge Control
Auto-Recharge
4.2V
10%/Disabled
7.5%/ 10%
Yes/No
 2011-2014 Microchip Technology Inc.
DS20005049D-page 1
MCP73830/L
Typical Application
MCP73830/L
4
VDD
VBAT
3
+
4.7 µF
4.7 µF
2
Regulated
wall cube
STAT
PROG
1 k
Lo Hi
1-Cell
Li-Ion
Battery
6
2 k
5 CE
VSS
-
1
Functional Block Diagram
Direction
Control
VDD
VBAT
PROG
G=0.001
+
CA
VREF
PRECONDITION
+
CHRG
VREF
VREF
+
-
VA
+
UVLO
+
-
CE
TERM
UVLO,
Reference,
Charge
Control,
Timer and
Status Logic
+
-
STAT
VREF
VREF
VREF
VDD
VSS
DS20005049D-page 2
 2011-2014 Microchip Technology Inc.
MCP73830/L
1.0
ELECTRICAL
CHARACTERISTICS
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification
is not implied. Exposure to maximum rating conditions
for extended periods may affect device reliability.
Absolute Maximum Ratings†
VDD...................................................................................7.0V
All Inputs and Outputs w.r.t. VSS ............... -0.3 to (VDD+0.3)V
Maximum Junction Temperature, TJ ............ Internally Limited
Storage temperature .....................................-65°C to +150°C
ESD protection on all pins
Human Body Model (1.5 kW in Series with 100 pF) 2 kV
Machine Model (200 pF, No Series Resistance) .............300V
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(Typical) + 0.3V] to 6V,
TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (Typical) + 1.0V]
Parameters
Sym.
Min.
Typ.
Max.
Input Voltage Range
VDD
Supply Current
ISS
Units
Conditions
3.75
—
6
V
—
0.6
2
µA
Shutdown;
VDD  VSTOP - 300 mV
—
500
900
µA
Charging
—
25
50
µA
Standby; CE = VDD
10
15
µA
Charge Complete;
VDD is Present
—
0.5
—
µA
Shutdown
(VDD  VBAT, or VDD < VSTOP)
—
0.5
—
µA
Standby; CE = VDD
Supply Input
Battery Discharge Current
Output Reverse
Leakage Current
IDISCHARGE
Undervoltage Lockout
UVLO Start Threshold
VSTART
3.45
3.6
3.75
V
VDD Low-to-High
UVLO Stop Threshold
VSTOP
3.15
3.3
3.45
V
VDD High-to-Low
UVLO Hysteresis
VHYS
—
300
—
mV
Voltage Regulation (Constant Voltage Mode)
Regulated Output
Voltage Options
VREG
—
4.20
—
V
VDD = [VREG(Typical)+1V]
IOUT = 30 mA
Output Voltage
Tolerance
VRTOL
-0.75
—
0.75
%
TA= -5°C to +55°C
Line Regulation
VBAT/VBAT)/
VDD|
—
0.2
0.3
%/V
Load Regulation
VBAT/VBAT|
—
0.2
0.3
%
IOUT = 30 mA - 150 mA
VDD = [VREG(Typical)+1V]
52
—
dB
IOUT = 30 mA, 10 Hz to 1 kHz
47
—
dB
IOUT = 30 mA, 10 Hz to 10 kHz
Supply Ripple
Attenuation
Note 1:
PSRR
VDD = [VREG(Typical)+1V] to
12V
IOUT = 30 mA
Not production tested. Ensured by design.
 2011-2014 Microchip Technology Inc.
DS20005049D-page 3
MCP73830/L
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(Typical) + 0.3V] to 6V,
TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (Typical) + 1.0V]
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Current Regulation (Fast Charge, Constant-Current Mode)
Fast Charge Current
Regulation
MCP73830L
IREG
Fast Charge Current
Regulation
MCP73830
IREG
Charge Current
Tolerance
IRTOL
20
—
200
mA
—
20
—
mA
PROG = 10 k
—
200
—
mA
PROG = 1 k
100
—
1000
mA
—
100
—
mA
PROG = 10 k
—
1000
—
mA
PROG = 1 k
—
10
—
%
VDD = 4.5V, TA = -5°C to +55°C
Preconditioning Current Regulation (Trickle Charge Constant Current Mode)
Precondition Current
Ratio
IPREG/IREG
—
10
—
Precondition Voltage
Threshold Ratio
VPTH/VREG
70
VPHYS
ITERM/IREG
—
%
PROG = 1 kto 10 k
100
—
%
No Preconditioning
72
75
%
VBAT Low-to-High
TA = -5°C to +55°C
—
100
—
mV
5.6
7.5
9.4
%
PROG = 1 kto 10 k
8
10
12
%
VDD = 4.5V, TA=-5°C to +55°C
94.5
96.5
98.5
%
—
0
—
%
VBAT High-to-Low
No Automatic Recharge
RDSON
—
500
—
m
Sink Current
ISINK
—
16
30
mA
Low Output Voltage
VOL
—
0.4
1
V
ISINK = 4 mA
Input Leakage Current
ILK
—
0.01
1
µA
High Impedance, VDD on Pin
RPROG
1
—
10
k
VPDENTRY
—
VBAT + 50 mV
—
V
VDD Falling
VPDEXIT
—
VBAT + 150 mV
—
V
VDD Rising
Input High Voltage
Level
TSD
1.5
—
—
V
Input Low Voltage
Level
VIL
—
—
0.8
V
Input Leakage Current
ILK
—
5
8
µA
Precondition
Hysteresis
Charge Termination
Charge Termination
Current Ratio
Automatic Recharge
Recharge Voltage
Threshold Ratio
VRTH/VREG
Pass Transistor ON-Resistance
ON-Resistance
VDD = 4.5V, TJ = 105°C (Note 1)
Status Indicator – STAT
PROG Input
Charge Impedance
Range
Automatic Power Down
Automatic Power
Down Entry Threshold
Automatic Power
Down Exit Threshold
Charge Enable (CE)
Note 1:
VDD = 5V
TA= -5°C to +55°C
Not production tested. Ensured by design.
DS20005049D-page 4
 2011-2014 Microchip Technology Inc.
MCP73830/L
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(Typical) + 0.3V] to 6V,
TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (Typical) + 1.0V]
Parameters
Sym.
Min.
Typ.
Max.
Units
Die Temperature
TSD
—
150
—
C
Die Temperature
Hysteresis
TSDHYS
—
10
—
C
Conditions
Thermal Shutdown
Note 1:
Not production tested. Ensured by design.
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits apply for VDD= [VREG(Typical)+0.3V] to 6V,
TA = -40°C to +85°C. Typical values are at +25°C, VDD= [VREG(Typical)+1.0V]
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
tELAPSED
3.5
4.0
4.5
Hours
tPRECHG
0.8
1
1.2
Hours
Status Output Turn-Off
tOFF
—
—
500
µs
ISINK = 1 mA to 0 mA (Note 1)
Status Output Turn-On
tON
—
—
500
µs
ISINK = 0 mA to 1 mA (Note 1)
Elapsed Timer
Elapsed Timer Period
Preconditioning Timer
Preconditioning Timer Period
Status Indicator
Note 1:
Not production tested. Ensured by design.
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (Typical) + 0.3V] to 6V.
Typical values are at +25°C, VDD = [VREG (Typical) + 1.0V]
Parameters
Sym.
Min.
Typ.
Max.
Units
Specified Temperature Range
TA
-40
—
+85
°C
Operating Temperature Range
TJ
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
JA
—
91
—
°C/W
JC
—
19
—
°C/W
Conditions
Temperature Ranges
Thermal Package Resistances
Thermal Resistance, TDFN-6 (2x2)
 2011-2014 Microchip Technology Inc.
4-Layer JC51-7 Standard
Board, Natural Convection
DS20005049D-page 5
MCP73830/L
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, VDD = [VREG(Typical) + 1V], IOUT = 30 mA and TA= +25°C, Constant Voltage mode.
FIGURE 2-1:
Battery Regulation Voltage
(VBAT) vs. Supply Voltage (VDD).
FIGURE 2-4:
Battery Regulation Voltage
(VBAT) vs. Charge Current (IOUT).
4.30
4.25
VREG (V)
4.20
4.15
4.10
4.05
IOUT = 100 mA
VDD = 5.2V
4.00
-45 -35 -25 -15 -5 5 15 25 35 45 55 65 75 85
Temp (°C)
FIGURE 2-2:
Battery Regulation Voltage
(VBAT) vs. Ambient Temperature (TA).
FIGURE 2-5:
Charge Current (IOUT) vs.
Programming Resistor (RPROG), MCP73830L.
4.30
4.25
IDIS (µA)
VREG (V)
4.20
4.15
4.10
4.05
IOUT = 30 mA
VDD = 5.2V
4.00
-45 -35 -25 -15 -5
5 15 25 35 45 55 65 75 85
Temp (°C)
FIGURE 2-3:
Battery Regulation Voltage
(VBAT) vs. Ambient Temperature (TA).
DS20005049D-page 6
5.0
4.8
4.6
4.4
4.2
4.0
3.8
3.6
3.4
34
3.2
3.0
VDD = VREG
VBAT = 3.2V
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
Temp (°C)
FIGURE 2-6:
Output Leakage Current
(IDISCHARGE) vs. Ambient Temperature (TA).
 2011-2014 Microchip Technology Inc.
MCP73830/L
7.0
6.6
6.2
5.8
5.4
5.0
4.6
4.2
3.8
38
3.4
3.0
300
VDD = VREG
VBAT = 4.0V
275
250
IREG (mA)
IDIS (µA)
Note: Unless otherwise indicated, VDD = [VREG(Typical) + 1V], IOUT = 10 mA and TA= +25°C, Constant Voltage mode.
225
200
175
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
Temp (°C)
VDD = 5.2V
RPROG = 4 kŸ
150
-45 -35 -25 -15 -5
5 15 25 35 45 55 65 75 85
Temp (°C)
FIGURE 2-7:
Output Leakage Current
(IDISCHARGE) vs. Ambient Temperature (TA).
FIGURE 2-10:
Charge Current (IOUT) vs.
Ambient Temperature (TA), MCP73830.
FIGURE 2-8:
Output Leakage Current
(IDISCHARGE) vs. Battery Regulation Voltage
(VBAT).
FIGURE 2-11:
Charge Current (IOUT) vs.
Supply Voltage (VDD), MCP73830.
1200
1100
IREG (mA)
1000
900
800
700
VDD = 5.2V
RPROG = 1 kŸ
-45 -35 -25 -15 -5 5 15 25 35 45 55 65 75 85
Temp (°C)
FIGURE 2-9:
Charge Current (IOUT) vs.
Ambient Temperature (TA), MCP73830.
 2011-2014 Microchip Technology Inc.
FIGURE 2-12:
Charge Current (IOUT) vs.
Supply Voltage (VDD), MCP73830.
DS20005049D-page 7
MCP73830/L
3.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLES
MCP73830/L
Symbol
I/O
Function
1
VSS
—
Battery management 0V reference.
2
STAT
O
Battery charge status output.
3
VBAT
I/O
Charge control output. Regulates the charge current and battery voltage.
The pin is disconnected during Shutdown mode.
4
VDD
I
Input power supply.
5
CE
I
Charge Enable pin. Pull the pin high to disable the device. It is internally
pulled down. Leave the pin float if not used.
6
PROG
I/O
Battery charge current regulation program.
7
EP
—
Exposed pad.
TDFN
3.1
Battery Management 0V Reference
(VSS)
Connect to the negative terminal of the battery and
input supply.
3.2
Current Regulation Set (PROG)
The fast charge current is set by placing a resistor from
PROG to VSS during Constant Current (CC) mode.
Refer to Section 5.4 “Constant Current Mode – Fast
Charge” for details.
Status Output (STAT)
STAT is an open-drain logic output for connection to an
LED for charge status indication in stand-alone
applications. Alternatively, a pull-up resistor can be
applied for interfacing to a host microcontroller. Refer to
Table 5-1 for a summary of the status output during a
charge cycle.
3.3
3.6
3.7
Exposed Pad (EP)
The Exposed Thermal Pad (EP) should be connected
to the exposed copper area on the Printed Circuit
Board (PCB) for thermal enhancement purposes.
Additional vias on the copper area under the
MCP73830/L device can improve the performance of
heat dissipation and simplify the assembly process.
Battery Charge Control Output
(VBAT)
Connect to the positive terminal of the battery. Bypass
to VSS with a minimum of 1 µF to ensure loop stability
when the battery is disconnected.
3.4
Battery Management Input Supply
(VDD)
A supply voltage of [VREG (Typical) + 0.3V] to 6.0V is
recommended. Bypass to VSS with a minimum of 1 µF.
3.5
Charge Enable (CE)
The MCP73830/L is always enabled with an internal
pull-down resistor. Pulling the CE pin high will enter
Standby mode.
DS20005049D-page 8
 2011-2014 Microchip Technology Inc.
MCP73830/L
4.0
DEVICE OVERVIEW
The MCP73830/L are simple, but fully integrated, linear
charge management controllers. Figure 4-1 depicts the
operational flow algorithm.
*Continuously monitored
SHUTDOWN MODE
VDD < (UVLO)
VDD < (VBAT)*
VBAT > 96.5% VREG
STAT = High Z
CE = Low
STANDBY MODE*
CE = High
STAT = High Z
PRE-TIMER FAULT
NO Charge Current
STAT = Flash (2 Hz)
Preconditioning Timer
Suspended
VBAT > VPTH
CE = Low
VBAT < VPTH
PRECONDITIONING
MODE
Charge Current = IREG
STAT = Low
VBAT >= VPTH
TIMER FAULT
NO Charge Current
STAT = High Z
Timer Suspended
CONSTANT CURRENT
MODE
Charge Current = IPREG
STAT = Low
Preconditioning Timer
Suspended
Elapsed Timer Enabled
VBAT = VREG
CONSTANT VOLTAGE
MODE
Charge Voltage = VREG
STAT = Low
IBAT < ITERM
No Auto-Recharge option
FIGURE 4-1:
CHARGE COMPLETE
MODE
NO Charge Current
STAT = High Z
Timer Reset
VBAT < VRTH
Recharge Mode
(available when selected device
has automatic recharge option).
The MCP73830/L Flowchart.
 2011-2014 Microchip Technology Inc.
DS20005049D-page 9
MCP73830/L
5.0
DETAILED DESCRIPTION
5.1
Undervoltage Lockout (UVLO)
An Internal Undervoltage Lockout (UVLO) circuit
monitors the input voltage and keeps the charger in
Shutdown mode until the input supply rises above the
UVLO threshold. In the event a battery is present when
the input power is applied, the input supply must rise
approximately 150 mV above the battery voltage
before the MCP73830/L devices become operational.
The UVLO circuit places the device in Shutdown mode
if the input supply falls to approximately 150 mV above
the battery voltage. The UVLO circuit is always active.
Any time the input supply is below the UVLO threshold,
or approximately 150 mV of the voltage at the VBAT pin,
the MCP73830/L devices are placed in Shutdown
mode.
5.2
Charge Qualification
When the input power is applied, the input supply must
rise 150 mV above the battery voltage before the
MCP73830/L becomes operational.
The automatic power-down circuit places the device in
Shutdown mode if the input supply falls to within
+50 mV of the battery voltage.
The automatic circuit is always active. Any time the
input supply is within +50 mV of the voltage at the
VBAT pin, the MCP73830/L is placed in Shutdown
mode.
For a charge cycle to begin, the automatic powerdown conditions must be met, and the charge enable
input must be above the input high threshold. The
battery voltage should be less than 96.5% of VREG.
5.2.1
BATTERY MANAGEMENT INPUT
SUPPLY (VDD)
The VDD input is the input supply to the MCP73830/L.
The MCP73830/L automatically enters Power-Down
mode if the voltage on the VDD input falls to within
+50 mV of the battery voltage. This feature prevents
draining the battery pack when the VDD supply is not
present.
5.2.2
5.2.3
BATTERY DETECTION
The MCP73830/L device detects the battery presence
by monitoring the voltage at VBAT. The charge flow will
initiate when the voltage on VBAT is pulled below the
VRECHARGE threshold. Refer to Section 1.0 “Electrical Characteristics” for VRECHARGE values. The value
will be the same for non-rechargeable devices.
When VBAT > VREG + Hysteresis, the charge will be
suspended or not started, depending on the condition,
to prevent the overcharge that may occur.
5.3
Preconditioning
If the voltage at the VBAT pin is less than the preconditioning threshold, the MCP73830/L devices enter
Preconditioning mode. The preconditioning threshold
is factory set. Refer to Section 1.0 “Electrical Characteristics” for preconditioning threshold options.
In this mode, the MCP73830/L devices supply 10% of
the fast charge current (established with the value of
the resistor connected to the PROG pin) to the battery.
When the voltage at the VBAT pin rises above the preconditioning threshold, the MCP73830/L device enters
the Constant Current (Fast Charge) mode.
Note:
5.3.1
The MCP73830/L devices also offer
options with no preconditioning.
TIMER EXPIRED DURING
PRECONDITIONING MODE
If the internal timer expires before the voltage threshold
is reached for Fast Charge mode, a timer fault is
indicated, and the charge cycle terminates. The
MCP73830/L devices remain in this condition until the
battery is removed, the input power is cycled, or CE is
toggled. If the battery is removed, the MCP73830/L
devices enter Standby mode, where they remain until a
battery is reinserted.
Note:
The typical preconditioning timers for the
MCP73830/L are 60 minutes.
BATTERY CHARGE CONTROL
OUTPUT (VBAT)
The battery charge control output is the drain terminal
of an internal P-channel MOSFET. The MCP73830/L
provides constant current and voltage regulation to the
battery pack by controlling this MOSFET in the linear
region. The battery charge control output should be
connected to the positive terminal of the battery pack.
DS20005049D-page 10
 2011-2014 Microchip Technology Inc.
MCP73830/L
5.4
Constant Current Mode – Fast
Charge
During Constant Current mode, the programmed
charge current is supplied to the battery or load.
The charge current is established using a single resistor from PROG to VSS. The program resistor and the
charge current are calculated using the following
equation:
EQUATION 5-1:
MCP73830L
200
IREG = -------------------RPROG
Refer to Section 1.0 “Electrical Characteristics” for
timer period value.
5.7
MCP73830/L devices with automatic recharge options
continuously monitor the voltage at the VBAT pin during
the Charge Complete mode. If the voltage drops below
the recharge threshold, another charge cycle begins,
and current is once again supplied to the battery or
load. The recharge threshold is factory set. Refer to
Section 1.0 “Electrical Characteristics” for recharge
threshold options.
Where:
Note:
RPROG
=
kilo-ohms (k)
IREG
=
milliampere (mA)
EQUATION 5-2:
MCP73830
1000
IREG = -------------------RPROG
Where:
RPROG
=
kilo-ohms (k)
IREG
=
milliampere (mA)
Constant Current mode is maintained until the voltage
at the VBAT pin reaches the regulation voltage, VREG.
When Constant Current mode is invoked, the internal
timer is reset.
5.4.1
Automatic Recharge
TIMER EXPIRED DURING
CONSTANT CURRENT – FAST
CHARGE MODE
The MCP73830/L also offer options with
no automatic recharge.
For the MCP73830/L with no recharge option, the
devices will go into Standby mode when a termination
condition is met. The charge will not restart until one of
the following conditions is met:
• Battery is removed from the system and inserted
again.
• VDD is removed and plugged in again.
• CE is cycled.
5.8
Thermal Regulation
The MCP73830/L should limit the charge currents
based on the die temperature. The thermal regulation
optimizes the charge cycle time while maintaining
device reliability. Figure 5-1 depicts the thermal
regulation for the MCP73830/L devices. Refer to
Section 1.0 “Electrical Characteristics” for thermal
package resistances, and Section 6.1.1.3 “Thermal
Considerations” for calculating power dissipation.
5.5
Constant Voltage Mode
When voltage at the VBAT pin reaches the regulation
voltage, VREG, the constant voltage regulation begins.
The regulation voltage is factory set to 4.2V, with a
tolerance of ±0.75%.
5.6
Charge Termination
Maximum Charge Current (mA)
.
If the internal 4-hour timer expires before the recharge
voltage threshold is reached, a timer fault is indicated
and the charge cycle terminates. The MCP73830/L
devices remain in this condition until the battery is
reinserted, or the input power or CE is cycled.
300
250
Maximum
Mimimum
200
150
100
50
0
0
30
60
90
120
150
Junction Temperature (C)
FIGURE 5-1:
Thermal Regulation.
The charge cycle is terminated when, during Constant
Voltage mode, the average charge current diminishes
below a threshold established with the value of 7.5%,
10% of fast charge current, or the internal timer has
expired. A 1 ms filter time on the termination comparator ensures that transient load conditions do not result
in premature charge cycle termination. The timer
period is factory set and no timer option is available.
 2011-2014 Microchip Technology Inc.
DS20005049D-page 11
MCP73830/L
5.9
Thermal Shutdown
The MCP73830/L suspends charging if the die temperature exceeds +150°C. Charging will resume when
the die temperature has cooled by approximately
10°C. The thermal shutdown is a secondary safety
feature in the event that there is a failure within the
thermal regulation circuitry.
5.10
Status Indicator
The charge status output of the MCP73830/L is opendrain, and, as such, has two different states: Low (L),
and High-Impedance (High Z). The charge status outputs can be used to illuminate the LEDs. Optionally,
the charge status output can be used as an interface
to a host microcontroller. The faulty indication of a preconditioning timer also indicates defective batteries,
when it fails to pass preconditioning threshold during
the given time.
Table 5-1 summarizes the state of the status outputs
during a charge cycle.
TABLE 5-1:
STATUS OUTPUTS
Charge Cycle State
STAT
Shutdown
High Z
No Battery Present
High Z
Preconditioning
L
Constant Current Fast Charge
L
Constant Voltage
L
Charge Complete
High Z
Timer Fault
Preconditioning Timer Fault
DS20005049D-page 12
High Z
Flashing
(2 Hz)
 2011-2014 Microchip Technology Inc.
MCP73830/L
6.0
APPLICATIONS
algorithm for dual Lithium-Ion or Lithium-Polymer cell’s
constant current, followed by constant voltage.
Figure 6-1 depicts a typical stand-alone application
circuit, while Figure 6-2 depicts the accompanying
charge profile.
The MCP73830 is designed to operate in conjunction
with a host microcontroller or in stand-alone applications. The MCP73830/L provides the preferred charge
4
VDD
VBAT
3
+
4.7 µF
4.7µF
2
Regulated
wall cube
STAT
PROG
1 k
Lo Hi
1-Cell
Li-Ion
Battery
6
2 k
5 CE
VSS
-
1
MCP73830/L
FIGURE 6-1:
Typical Application Circuit.
6.1.1.1
Charge Current
The preferred fast charge current for Li-Ion/Li-Poly cells
is below the 1C rate, with an absolute maximum current
at the 2C rate. The recommended fast charge
current should be obtained from the battery
manufacturer. For example, a 500 mAh battery pack
with 0.7C preferred fast charge current has a charge
current of 350 mA. Charging at this rate provides the
shortest charge cycle times without degradation to the
battery pack performance or life.
Note:
FIGURE 6-2:
(Li-Ion Battery).
6.1
Typical Charge Profile
Application Circuit Design
Due to the low efficiency of linear charging, the most
important factors are thermal design and cost, which
are a direct function of the input voltage, output current
and thermal impedance between the battery charger
and the ambient cooling air. The worst-case situation is
when the device has transitioned from Preconditioning
mode to Constant Current mode. In this situation, the
battery charger has to dissipate the maximum power. A
trade-off must be made between the charge current,
cost and thermal requirements of the charger.
6.1.1
6.1.1.2
Please consult with your battery supplier,
or refer to the battery data sheet, for the
preferred charge rate.
Input Over Voltage Protection
(IOVP)
Input over voltage protection must be used when the
input power source is hot-pluggable. This includes USB
cables and wall-type power supplies. The cabling of
these supplies acts as an inductor. When the supplies
are connected/disconnected from the system, large
voltage transients are created which may damage the
system circuitry. These transients should be snubbed
out. A transzorb - unidirectional or bidirectional - connected from the V+ input supply connector to the 0V
ground reference will snub the transients. An example
of this can be seen in Figure 6-3.
COMPONENT SELECTION
Selection of the external components in Figure 6-1 is
crucial to the integrity and reliability of the charging
system. The following discussion is intended as a guide
for the component selection process.
 2011-2014 Microchip Technology Inc.
DS20005049D-page 13
MCP73830/L
0.5
TVS
Regulated
Wall Cube
4
VDD
VBAT
STAT
PROG
3
CIN
2
SMAJ5.0A/AC
5
CE
6
VSS 1
2 mm x 2 mm DFN
MCP73830
FIGURE 6-3:
6.1.1.3
Input Over Voltage Protection Example.
Thermal Considerations
The worst-case power dissipation in the battery charger occurs when the input voltage is at the maximum
and the device has transitioned from Preconditioning
mode to Constant Current mode. In this case, the
power dissipation is:
EQUATION 6-1:
PowerDissipation =  V DDMAX – V PTHMIN   I REGMAX
Where:
VDDMAX
=
the maximum input voltage
IREGMAX
=
the maximum fast charge current
VPTHMIN
=
the minimum transition threshold
voltage
Power dissipation with a 5V, ±10% input voltage
source, 200 mA ±10%, and preconditioning threshold
voltage at 6V is:
EQUATION 6-2:
·
PowerDissipation =  5.5V – 3.0V   220mA = 0.55W
This power dissipation with the battery charger in the
2x2 TDFN-6 package will result in a temperature of
approximately 10.45C (PCB mounted) above room
temperature.
6.1.1.4
tions appear inductive at high frequencies. These
elements are in the control feedback loop during
Constant Voltage mode. Therefore, the bypass capacitance may be necessary to compensate for the
inductive nature of the battery pack.
A minimum of 16V rated 1 µF is recommended to apply
for output capacitor, and a minimum of 25V rated 1 µF
is recommended to apply for input capacitor for typical
applications.
TABLE 6-1:
MLCC CAPACITOR EXAMPLE
MLCC
Capacitors
Temperature
Range
Tolerance
X7R
-55C to + 125C
±15%
X5R
-55C to + 85C
±15%
Virtually any good quality output filter capacitor can be
used independent of the capacitor’s minimum Effective
Series Resistance (ESR) value. The actual value of the
capacitor (and its associated ESR) depends on the output load current. A 1 µF ceramic, tantalum or aluminum
electrolytic capacitor at the output is usually sufficient
to ensure stability.
6.1.1.5
Reverse-Blocking Protection
The MCP73830/L provides protection from a faulted or
shorted input. Without the protection, a faulted or
shorted input would discharge the battery pack through
the body diode of the internal pass transistor.
External Capacitors
The MCP73830 is stable with or without a battery load.
In order to maintain good AC stability in Constant Voltage mode, a minimum capacitance of 1 µF is
recommended to bypass the VBAT pin to VSS. This
capacitance provides compensation when there is no
battery load. In addition, the battery and interconnec-
DS20005049D-page 14
 2011-2014 Microchip Technology Inc.
MCP73830/L
6.2
PCB Layout Issues
For optimum voltage regulation, place the battery pack
as close as possible to the device’s VBAT and VSS pins,
which is recommended to minimize voltage drops
along the high current carrying PCB traces.
If the PCB layout is used as a heat sink, adding many
vias in the heat sink pad can help conduct more heat to
the backplane of the PCB, thus reducing the maximum
junction temperature. Figure 6-5 and Figure 6-6 depict
a typical layout with PCB heat sinking.
FIGURE 6-6:
FIGURE 6-4:
Typical Layout (Top).
FIGURE 6-5:
Typical Layout (Top Metal).
 2011-2014 Microchip Technology Inc.
Typical Layout (Bottom).
DS20005049D-page 15
MCP73830/L
7.0
PACKAGING INFORMATION
7.1
Package Marking Information
6-Lead TDFN (2x2 mm)
Example
Part Number
XXX
NNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS20005049D-page 16
Code
MCP73830T-2AAI/MYY
2AA
MCP73830LT-0AAI/MYY
0AA
MCP73830LT-0BCI/MYY
0BC
0AA
256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2011-2014 Microchip Technology Inc.
MCP73830/L
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2011-2014 Microchip Technology Inc.
DS20005049D-page 17
MCP73830/L
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20005049D-page 18
 2011-2014 Microchip Technology Inc.
MCP73830/L
APPENDIX A:
REVISION HISTORY
Revision D (July 2014)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
7.
Added the “Available Factory Preset
Options” table.
Removed any mention of Fixed Elapse Timer
having a disabled option.
Removed any mention of an option with no
precondition timer.
Corrected the flow-chart in Figure 4-1, specifying STAT = High Z in the Charge Complete
Mode text box.
Updated Table 5-1.
Added the Section 6.1.1.2, "Input Over Voltage Protection (IOVP)".
Added Figure 6-3.
Revision C (August 2013)
The following is the list of modifications:
1.
2.
Updated the “Temperature Specifications”
table.
Updated Section 6.1.1.3, "Thermal Considerations".
Revision B (December 2011)
The following is the list of modifications:
1.
2.
Updated Figure 4-1.
Removed the MCP73830 and MCP73830L
options from the “Product Identification System” section.
Revision A (September 2011)
• Original Release of this Document.
 2011-2014 Microchip Technology Inc.
DS20005049D-page 19
MCP73830/L
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
-XXX
Examples:
XX
Standard Temperature
Options
Range
a)
Package
b)
Single Cell Li-Ion/Li-Polymer Battery Device,
Tape and Reel
MCP73830LT: Single Cell Li-Ion/Li-Polymer Battery Device,
Tape and Reel
Standard
Options:
IREG
(mA)
VREG
(V)
VPRECONDITION
(%)
MCP73830T:
IPRECONDITION
(%)
Device:
ITERM
(%)
c)
RTH
(%)
MCP73830LT
0AA
200
4.2
10
71.5
7.5
96.5
MCP73830LT
0BC
200
4.2
100
71.5
10
96.5
MCP73830T
2AA
1000
4.2
10
71.5
7.5
96.5
Temperature
Range:
I
Package:
MY
MCP73830T-2AAI/MYY: Tape and Reel,
Single Cell
Li-Ion/Li-Polymer
Battery Device
MCP73830LT-0AAI/MYY: Tape and Reel,
Single Cell
Li-Ion/Li-Polymer
Battery Device
MCP73830LT-0BCI/MYY: Tape and Reel,
Single Cell
Li-Ion/Li-Polymer
Battery Device
= -40C to +85C (Industrial)
= Plastic Thin Dual Flat, No Lead Package, 2x2x0.8 mm
Body (TDFN), 6-Lead
* Y = nickel palladium gold manufacturing designator. Only available
on the TDFN package.
DS20005049D-page 20
 2011-2014 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2011-2014, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-63276-386-0
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2011-2014 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS20005049D-page 21
Worldwide Sales and Service
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DS20005049D-page 22
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