Material Content Data Sheet Sales Product Name IFX20002MB V33 MA# MA001042676 Package PG-SCT595-5-1 Issued Weight* Construction Element Material Group Substances chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon silicon titanium chromium copper gold carbon black brominated resin antimonytrioxide epoxy resin silicondioxide tin silver epoxy resin silver wire encapsulation leadfinish plating glue *deviation 29. August 2013 13.90 mg CAS# if applicable Weight [mg] Average Mass [%] 7440-21-3 7440-21-3 7440-32-6 7440-47-3 7440-50-8 7440-57-5 1333-86-4 1309-64-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 0.328 2.36 0.001 0.01 0.006 0.04 435 0.018 0.13 1305 6.019 43.32 43.50 433051 434878 0.027 0.19 0.19 1908 1908 0.055 0.39 3941 0.068 0.49 4926 0.137 0.99 9851 1.246 8.96 89647 5.340 38.42 49.25 384201 492566 0.335 2.41 2.41 24133 24133 0.142 1.02 1.02 10181 10181 0.031 0.22 0.146 1.05 Sum [%] Average Mass [ppm] Sum [ppm] 2.36 23574 23574 87 2233 1.27 10527 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 12760 1000000