LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TAPE AND BOX TYPE LED LAMPS Pb Lead-Free Parts LHRF4843-PF/TBF-X DATA SHEET DOC. NO : QW0905-LHRF4843-PF/TBF-X REV. : C DATE : 31 - May - 2007 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHRF4843-PF/TBF-X Page 1/6 Package Dimensions △H P2 H2 W2 H1 H L W0 W1 P1 F D - + P T Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 3.8 LHRF4843-PF 3.0 3.8 1.5MAX 1.0 25.0MIN. □0.5 TYP 1.0MIN. 2.54TYP. + - W3 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHRF4843-PF/TBF-X Page 2/6 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT HRF Forward Current IF 30 mA Peak Forward Current Duty 1/10@10KHz IFP 90 mA Power Dissipation PD 75 mW Ir 10 μA Electrostatic Discharge( * ) ESD 2000 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Reverse Current @5V Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic * glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted LHRF4843-PF/TBF-X AlGaInP Red Forward Luminous Dominant Spectral Viewing voltage intensity wave angle halfwidth length △λ nm @20mA(V) @20mA(mcd) 2 θ 1/2 λDnm (deg) Min. Max. Min. Typ. Lens Water Clear 630 20 1.5 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. 2.4 90 160 120 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. L HRF4843/TBF-X Page 3/6 •Dimension Symbol Information SPECIFICATIONS OPTION SYMBOL CODE SYMBOL ITEMS Minimum inch mm Maximum inch mm Tape Feed Hole Diameter ------- Component Lead Pitch ------- F Front-To-Rear Deflection ------- △H Height Of Seating Plane ------- H 15.5 0.61 16.5 0.65 17.5 19.0 22.5 25.5 21.5 20.2 17.125 20.0 26 18.8 24.0 21.0 19.0 21.7 22.5 17.5 0.69 0.75 0.89 1.0 0.85 0.8 0.67 0.79 1.02 0.74 0.94 0.83 0.75 0.85 0.89 0.69 19.5 21.0 24.5 26.5 22.5 21.2 21.125 22.5 28 19.8 26.0 23.0 20.0 23.7 23.5 18.0 0.77 0.83 0.96 1.04 0.89 0.83 0.83 0.89 1.10 0.78 1.02 0.91 0.79 0.93 0.93 0.71 18.5 20.5 0.73 0.81 19.5 21.5 36 11 0.77 0.85 1.42 0.43 D TBF-1 TBF-2 TBF-3 TBF-4 TBF-5 TBF-6 TBF-7 TBF-8 TBF-9 TBF-10 TBF-11 TBF-12 TBF-13 TBF-14 TBF-15 TBF-16 Feed Hole To Bottom Of Component H1 TBF-17 TBF-18 Feed Hole To Overall Component Height 3.8 0.15 4.2 0.17 4.8 0.19 ------- ------- 5.8 2.0 0.23 0.08 ------------- H2 L ------- Lead Length After Component Height Feed Hole Pitch ------- P 12.4 0.49 13 0.51 Lead Location ------- P1 3.15 0.12 4.55 0.18 Center Of Component Location ------- P2 5.1 0.2 7.7 0.3 Overall Taped Package Thickness ------- T ------- ------- 1.42 0.06 Feed Hole Location ------- W0 8.5 0.33 9.75 0.38 Adhesive Tape Width ------- W1 14.5 0.57 15.5 0.61 Adhesive Tape Position ------- W2 0 0 4.0 0.16 Tape Width ------- W3 17.5 0.69 19 0.75 ------- W0 REMARK:TBF = Tape And Box Forming Leads • Package Dimensions • Dimensions Symbol Information Specification Description Symbol minimum maxmum mm inch mm inch Overall Length L 330 13.0 340 13.4 Overall Width W 265 10.4 275 10.8 Overall Thickness H 50 1.97 60 2.4 Part No. Quantity/Box LHRF4843-PF/TBF-X 2000PCS W L H LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page4/6 PART NO. LHRF4843-PF/TBF-X Typical Electro-Optical Characteristics Curve HRF CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 2.5 2.0 1.5 1.0 0.5 0 0.1 1.0 2.0 1.5 2.5 3.0 1.0 10 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 3.0 Relative Intensity@20mA Normalize@25℃ 1.2 Forward Voltage@20mA Normalize @25℃ 1000 Forward Current(mA) Forward Voltage(V) 1.1 1.0 0.9 0.8 -40 -20 -0 20 40 60 80 100 2.5 2.0 1.5 1.0 0.5 0 -40 -20 -0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 100 Fig.6 Directivity Radiation 1.0 0° -30° 0.5 30° -60° 0 550 600 650 Wavelength (nm) 700 100% 75% 50% 60° 25% 0 25% 50% 75% 100% 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHRF4843-PF/TBF-X Page 5/6 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 2° /sec max 0 Preheat 60 Seconds Max 50 100 Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHRF4843-PF/TBF-X Page 6/6 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃ &-40 ℃±5 ℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11