High Performance BGA Cooling Solutions w/ maxiGRIP™ Attachment ATS PART # ATS-53300K-C2-R0 D Features & Benefits » High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments » maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB » Designed specifically for BGAs and other surface mount packages » Meets Telcordia GR-63-Core Office Vibration; ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock Testing and Unpackaged Drop Testing standards » Comes preassembled with high performance, phase changing, thermal interface material C A B Thermal Performance *Image above is for illustration purposes only. Air Velocity Thermal Resistance FT/MIN M/S °C/W (UNDUCTED FLOW) °C/W (DUCTED FLOW) 200 1.0 6.9 4.3 300 1.5 5.5 400 2.0 4.8 500 2.5 4.3 600 3.0 3.9 700 3.5 3.6 800 4.0 3.4 Product Details DIMENSION A DIMENSION B DIMENSION C DIMENSION D INTERFACE MATERIAL FINISH 30 mm 30 mm 14.5 mm 30 mm Saint-gobain C1100F BLACK-ANODIZED Notes: 1) 2) 3) 4) 5) 6) Dimension C = heat sink height from bottom of the base to the top of the fin field. ATS-53300K-C1-R0 is a subsitute item available utilizing an equivalent phase change material (Chomerics T766). Thermal performance data are provided for reference only. Actual performance may vary by application. ATS reserves the right to update or change its products without notice to improve the design or performance. Optional maxiGRIP™ Installation/Removal Tool Set P/N: MGT300 Contact ATS to learn about custom options available. For more information, to find a distributor or to place an order, visit www.qats.com or call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe). REV1_0908