Ferroxcube RM cores and accessories RM4/ILP COIL FORMERS General data SMD coil former PARAMETER SPECIFICATION Coil former material phenolformaldehyde (PF), glass-reinforced, flame retardant in accordance with “UL 94V-0”; UL file number E41429 (M) Solder pad material copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated. Maximum operating temperature 155 C, “IEC 60085”, class F Resistance to soldering heat “IEC 60068-2-20”, Part 2, Test Tb, method 1B, 350 C, 3.5 s Solderability “IEC 60068-2-20”, Part 2, Test Ta, method 1 Winding data for RM4/ILP coil former (SMD) NUMBER OF SECTIONS NUMBER OF SOLDER PADS WINDING AREA (mm2) WINDING WIDTH (mm) AVERAGE LENGTH OF TURN (mm) TYPE NUMBER 1 8 3.75 3.0 20.7 CSVS-RM4/LP-1S-8PL