HP HCPL-0701 Low input current, high gain optocoupler Datasheet

Low Input Current, High Gain
Optocouplers
Technical Data
6N139
HCPL-0701
HCNW139
6N138
HCPL-0700
HCNW138
Features
Applications
Description
• High Current Transfer Ratio
– 2000% Typical (4500%
Typical for HCNW139/138)
• Low Input Current
Requirements – 0.5 mA
• TTL Compatible Output –
0.1 V VOL Typical
• Performance Guaranteed
over Temperature 0°C
to 70°C
• Base Access Allows Gain
Bandwidth Adjustment
• High Output Current –
60 mA
• Safety Approval
UL Recognized – 2500 V rms
for 1 Minute and 5000 V rms*
for 1 Minute per UL 1577
CSA Approved
VDE 0884 Approved with
VIORM = 1414 V peak for
HCNW139 and HCNW138
BSI Certified (HCNW139 and
HCNW138)
• Available in 8-Pin DIP or
SOIC-8 Footprint or
Widebody Package
•MIL-STD-1772 Version
Available (HCPL-5700/1)
• Ground Isolate Most Logic
Families – TTL/TTL, CMOS/
TTL, CMOS/CMOS, LSTTL/
TTL, CMOS/LSTTL
• Low Input Current Line
Receiver
• High Voltage Insulation
(HCNW139/138)
• EIA RS-232C Line Receiver
• Telephone Ring Detector
• 117 V ac Line Voltage Status
Indicator – Low Input Power
Dissipation
• Low Power Systems –
Ground Isolation
These high gain series couplers
use a Light Emitting Diode and an
integrated high gain photodetector to provide extremely high
current transfer ratio between
input and output. Separate pins
for the photodiode and output
stage result in TTL compatible
saturation voltages and high
speed operation. Where desired
the VCC and VO terminals may be
tied together to achieve conventional photodarlington operation.
A base access terminal allows a
gain bandwidth adjustment to be
made.
Functional Diagram
NC 1
8 VCC
ANODE 2
7 VB
CATHODE 3
6 VO
NC 4
TRUTH TABLE
LED
VO
ON
LOW
OFF
HIGH
5 GND
*5000 V rms/1 minute rating is for HCNW139/138 and Option 020 (6N139/138) products only.
A 0.1 µF bypass capacitor connected between pins 8 and 5 is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
2
The 6N139, HCPL-0701, and
CNW139 are for use in CMOS,
LSTTL or other low power applications. A 400% minimum current
transfer ratio is guaranteed over
0 to 70°C operating range for only
0.5 mA of LED current.
The 6N138, HCPL-0700, and
HCNW138 are designed for use
mainly in TTL applications.
Current Transfer Ratio (CTR) is
300% minimum over 0 to 70°C
for an LED current of 1.6 mA
(1 TTL Unit load ). A 300%
minimum CTR enables operation
with 1 TTL Load using a 2.2 kΩ
pull-up resistor.
Selection for lower input current
down to 250 µA is available upon
request.
The HCPL-0701 and HCPL-0700
are surface mount devices
packaged in an industry standard
SOIC-8 footprint.
The SOIC-8 does not require
“through holes” in a PCB. This
package occupies approximately
one-third the footprint area of the
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
The HCNW139 and HCNW138
are packaged in a widebody
encapsulation that provides creepage and clearance dimensions
suitable for safety approval by
regulatory agencies worldwide.
Selection Guide
8-Pin DIP
(300 Mil)
Small Outline SO-8
Single
Dual
Channel
Channel
Package
Package
HCPLHCPL-
Single
Channel
Package
Dual
Channel
Package
HCPL-
6N139
2731[1]
0701
6N138
2730[1]
HCPL-4701[1]
4731[1]
Widebody
Package
(400 mil)
Single
Channel
Package
Minimum
Input ON
Current
(IF )
Minimum
CTR
Absolute
Maximum
VCC
0731
HCNW139
0.5 mA
400%
18 V
0700
0730
HCNW138
1.6 mA
300%
7V
070A[1]
073A[1]
40 µA
800%
18 V
0.5 mA
300%
20 V
Note:
1. Technical data are on separate HP publications.
Hermetic
Single and
Dual
Channel
Packages
HCPL-
5701[1]
5700[1]
5731[1]
5730[1]
3
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
6N139#XXX
020 = 5000 V rms/1 Minute UL Rating Option*
300 = Gull Wing Surface Mount Option†
500 = Tape and Reel Packaging Option
Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for
information.
*For 6N139 and 6N138 only.
†Gull wing surface mount option applies to through hole parts only.
Schematic
VCC
8
ICC
2
ANODE
IF
+
VF
CATHODE
–
IO
3
6
5
SHIELD
IB
7
VB
VO
GND
4
Package Outline Drawings
8-Pin DIP Package (6N139/6N138)**
7.62 ± 0.25
(0.300 ± 0.010)
9.65 ± 0.25
(0.380 ± 0.010)
TYPE NUMBER
8
7
6
5
OPTION CODE*
6.35 ± 0.25
(0.250 ± 0.010)
DATE CODE
HP XXXXZ
YYWW RU
1
2
3
4
UL
RECOGNITION
1.78 (0.070) MAX.
1.19 (0.047) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
5° TYP.
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
0.65 (0.025) MAX.
1.080 ± 0.320
(0.043 ± 0.013)
DIMENSIONS IN MILLIMETERS AND (INCHES).
*MARKING CODE LETTER FOR OPTION NUMBERS
"L" = OPTION 020
OPTION NUMBERS 300 AND 500 NOT MARKED.
2.54 ± 0.25
(0.100 ± 0.010)
**JEDEC Registered Data.
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N139/6N138)
PAD LOCATION (FOR REFERENCE ONLY)
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
1.016 (0.040)
1.194 (0.047)
5
4.826 TYP.
(0.190)
6.350 ± 0.25
(0.250 ± 0.010)
1
2
3
9.398 (0.370)
9.906 (0.390)
4
1.194 (0.047)
1.778 (0.070)
1.19
(0.047)
MAX.
1.780
(0.070)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
4.19 MAX.
(0.165)
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.130
2.54
(0.025 ± 0.005)
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.381 (0.015)
0.635 (0.025)
0.635 ± 0.25
(0.025 ± 0.010)
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
12° NOM.
5
Small Outline SO-8 Package (HCPL-0701/HCPL-0700)
8
7
6
5
5.994 ± 0.203
(0.236 ± 0.008)
XXX
YWW
3.937 ± 0.127
(0.155 ± 0.005)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
PIN ONE 1
2
3
4
0.406 ± 0.076
(0.016 ± 0.003)
1.270 BSG
(0.050)
* 5.080 ± 0.127
(0.200 ± 0.005)
7°
3.175 ± 0.127
(0.125 ± 0.005)
45° X
0.432
(0.017)
0 ~ 7°
0.228 ± 0.025
(0.009 ± 0.001)
1.524
(0.060)
0.203 ± 0.102
(0.008 ± 0.004)
* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
0.305 MIN.
(0.012)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
8-Pin Widebody DIP Package (HCNW139/HCNW138)
11.00 MAX.
(0.433)
11.15 ± 0.15
(0.442 ± 0.006)
8
7
6
9.00 ± 0.15
(0.354 ± 0.006)
5
TYPE NUMBER
HP
HCNWXXXX
DATE CODE
YYWW
1
2
3
4
10.16 (0.400)
TYP.
1.55
(0.061)
MAX.
7° TYP.
+ 0.076
0.254 - 0.0051
+ 0.003)
(0.010 - 0.002)
5.10 MAX.
(0.201)
3.10 (0.122)
3.90 (0.154)
0.51 (0.021) MIN.
2.54 (0.100)
TYP.
1.78 ± 0.15
(0.070 ± 0.006)
0.40 (0.016)
0.56 (0.022)
DIMENSIONS IN MILLIMETERS (INCHES).
6
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW139/HCNW138)
11.15 ± 0.15
(0.442 ± 0.006)
6
7
8
PAD LOCATION (FOR REFERENCE ONLY)
5
6.15
(0.242)TYP.
9.00 ± 0.15
(0.354 ± 0.006)
12.30 ± 0.30
(0.484 ± 0.012)
1
3
2
4
1.3
(0.051)
0.9
(0.035)
12.30 ± 0.30
(0.484 ± 0.012)
1.55
(0.061)
MAX.
11.00 MAX.
(0.433)
4.00 MAX.
(0.158)
1.78 ± 0.15
(0.070 ± 0.006)
1.00 ± 0.15
(0.039 ± 0.006)
0.75 ± 0.25
(0.030 ± 0.010)
2.54
(0.100)
BSC
+ 0.076
0.254 - 0.0051
+ 0.003)
(0.010 - 0.002)
DIMENSIONS IN MILLIMETERS (INCHES).
7° NOM.
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
TEMPERATURE – °C
Solder Reflow Temperature Profile (HCPL-07XX and Gull Wing Surface Mount
Option 300 Parts)
260
240
220
200
180
160
∆T = 145°C, 1°C/SEC
∆T = 115°C, 0.3°C/SEC
140
120
100
80
60
40
20
0
∆T = 100°C, 1.5°C/SEC
0
1
2
3
4
5
6
7
8
9
10
11
12
TIME – MINUTES
Note: Use of nonchlorine activated fluxes is highly recommended.
7
Regulatory Information
The 6N139/138, HCNW139/138,
and HCPL-0701/0700 have been
approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
VDE
Approved according to VDE 0884/
06.92 (HCNW139/138 only).
BSI
Certification according to
BS415:1994,
(BS EN60065:1994);
BS EN60950:1992
(BS7002:1992) and
EN41003:1993 for Class II
applications (HCNW139/
HCNW138 only.)
Insulation and Safety Related Specifications
Parameter
Minimum External
Air Gap (External
Clearance)
Minimum External
Tracking (External
Creepage)
Minimum Internal
Plastic Gap
(Internal Clearance)
Minimum Internal
Tracking (Internal
Creepage)
Tracking Resistance
(Comparative
Tracking Index)
Isolation Group
Symbol
L(101)
8-Pin DIP
(300 Mil)
Value
7.1
SO-8
Value
4.9
L(102)
7.4
4.8
10.0
mm
0.08
0.08
1.0
mm
NA
NA
4.0
mm
200
200
200
Volts
IIIa
IIIa
IIIa
CTI
Widebody
(400 Mil)
Value
Units
9.6
mm
Conditions
Measured from input terminals
to output terminals, shortest
distance through air.
Measured from input terminals
to output terminals, shortest
distance path along body.
Through insulation distance,
conductor to conductor, usually
the direct distance between the
photoemitter and photodetector
inside the optocoupler cavity.
Measured from input terminals
to output terminals, along
internal cavity.
DIN IEC 112/VDE 0303 Part 1
Material Group
(DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
8
VDE 0884 Insulation Related Characteristics (HCNW139 and HCNW138)
Description
Installation Classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤ 600 V rms
for rated mains voltage ≤ 1000 V rms
Climatic Classification
Pollution Degree (DIN VDE 0110/1.89)
Maximum Working Insulation Voltage
Input to Output Test Voltage, Method b*
VPR = 1.875 x VIORM, 100% Production Test with tP = 1 sec,
Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
VPR = 1.5 x VIORM, Type and Sample Test,
tP = 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage*
(Transient Overvoltage, tini = 10 sec)
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 11, Thermal Derating curve.)
Case Temperature
Current (Input Current I F, PS = 0)
Output Power
Insulation Resistance at TS, VIO = 500 V
Symbol
Characteristic
Units
VIORM
I-IV
I-III
55/100/21
2
1414
V
peak
VPR
2652
V
peak
VPR
2121
V
peak
VIOTM
8000
V
peak
TS
IS,INPUT
PS,OUTPUT
RS
175
400
700
> 109
°C
mA
mW
Ω
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, (VDE 0884) for a
detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in
application.
9
Absolute Maximum Ratings* (No Derating Required up to 85°C)
Parameter
Storage Temperature
Operating Temperature**
Average Forward Input Current
Peak Forward Input Current
(50% Duty Cycle, 1 ms Pulse Width)
Peak Transient Input Current
(<1 µs Pulse Width, 300 pps)
Reverse Input Voltage
HCNW139/138
Input Power Dissipation
Output Current (Pin 6)
Emitter Base Reverse Voltage (Pin 5-7)
Symbol
TS
TA
IF(AVG)
IFPK
Supply Voltage and Output Voltage
(6N139, HCPL-0701, HCNW139)
Supply Voltage and Output Voltage
(6N138, HCPL-0700, HCNW138)
Output Power Dissipation
Total Power Dissipation
Lead Solder Temperature (for Through Hole Devices)
HCNW139/138
Reflow Temperature Profile
(for SOIC-8 and Option #300)
VCC
VCC
Min.
-55
-40
Max.
125
85
20
40
Units
°C
°C
mA
mA
IF(TRAN)
1.0
A
VR
5
3
35
60
0.5
V
V
mW
mA
V
-0.5
18
V
-0.5
7
V
PI
IO
VEB
PO
100
mW
PT
135
mW
260°C for 10 sec., 1.6 mm below seating plane
260°C for 10 sec., up to seating plane
See Package Outline Drawings section
*JEDEC Registered Data for 6N139 and 6N138.
**0°C to 70°C on JEDEC Registration.
Recommended Operating Conditions
Parameter
Power Supply Voltage
Forward Input Current (ON)
Forward Input Voltage (OFF)
Operating Temperature
Symbol
VCC
IF(ON)
VF(OFF)
TA
Min.
4.5
0.5
0
0
Max.
18
12.0
0.8
70
Units
V
mA
V
°C
10
Electrical Specifications
0°C ≤ TA ≤ 70°C, 4.5 V ≤ VCC ≤ 18 V, 0.5 mA ≤ IF(ON) ≤ 12 mA, 0 V ≤ VF(OFF) ≤ 0.8 V, unless otherwise
specified. All Typicals at TA = 25°C. See Note 7.
Parameter
Current Transfer
Ratio
Sym.
CTR
Device
Min. Typ.** Max. Units
Test Conditions
Fig. Note
6N139
400* 2000 5000 %
IF = 0.5 mA
VCC = 4.5 2, 3 1, 2,
HCPL-0701
VO = 0.4 V
4
HCNW139 400 4500
6N139
500* 1600 2600
IF = 1.6 mA
HCPL-0701
HCNW139 500 3000
300 1600
IF = 5.0 mA
200 850
IF = 12 mA
6N138
300* 1600 2600
IF = 1.6 mA
HCPL-0700
HCNW138
1500
Logic Low Output VOL
6N139
0.1
0.4
V
IF = 0.5 mA,
VCC = 4.5
1
2
Voltage
HCPL-0701
IO = 2 mA
HCNW139
IF = 1.6 mA,
IO = 8 mA
IF = 5.0 mA,
IO = 15 mA
0.2
IF = 12 mA,
IO = 24 mA
6N138
0.1
IF = 1.6 mA,
HCPL-0700
IO = 4.8 mA
HCNW138
Logic High
IOH
6N139
0.05 100 µA
VO = VCC = 18 V IF = 0 mA
2
Output Current
HCPL-0701
HCNW139
6N138
0.1 250
VO = VCC = 7 V
HCPL-0700
HCNW138
Logic Low Supply ICCL 6N138/139
0.4
1.5
mA IF = 1.6 mA, VO = Open,
10
2
Current
HCPL-0701/
VCC = 18 V
0700
HCNW139
0.5
2
HCNW138
Logic High
ICCH 6N138/139
0.01 10
µA
IF = 0 mA, VO = Open,
2
Supply Current
HCPL-0701/
VCC = 18 V
0700
HCNW139
1
HCNW138
Input Forward
VF
6N138
1.25 1.40 1.7*
V
TA = 25°C IF = 1.6 mA
4, 8
Voltage
6N139
HCPL-0701
1.75
HCPL-0700
HCNW139
1.0 1.45 1.85
TA = 25°C
HCNW138
0.95
1.95
Input Reverse
BVR
5.0*
V
IR = 10 µA, TA = 25°C
Breakdown
HCNW139
3.0
IR = 100 µA, TA = 25°C
Voltage
HCNW138
Temperature
∆VF
-1.8
mV/°C IF = 1.6 mA
8
Coefficient of
∆TA
Forward Voltage
Input
CIN
60
pF
f = 1 MHz, VF = 0 V
Capacitance
HCNW139
90
HCNW138
*JEDEC Registered Data for 6N139 and 6N138.
**All typical values at TA = 25°C and VCC = 5 V, unless otherwise noted.
11
Switching Specifications (AC)
Over recommended operating conditions (TA = 0 to 70°C), VCC = 5 V, unless otherwise specified.
Parameter
Propagation Delay
Time to Logic Low at
Output
Sym.
tPHL
Device
Min.
6N139
HCPL-0701
HCNW139
6N139
HCPL-0701
HCNW139
6N138
HCPL-0700
HCNW138
Propagation Delay
Time to Logic High
at Output
tPLH
HCNW138
6N139
HCPL-0701
HCNW139
HCNW139
6N139
HCPL-0701
HCNW139
HCNW139
6N138
HCPL-0700
HCNW138
6N138
HCPL-0700
HCNW139
Typ.** Max. Units Test Conditions
5
25*
µs
TA = 25°C
30
IF = 0.5 mA,
Rl = 4.7 kΩ
0.2
1*
µs
TA = 25°C
2
IF = 12 mA,
Rl = 270 Ω
1.1
1.6
10*
µs
TA = 25°C
IF = 1.6 mA,
15
Rl = 2.2 kΩ
11
18
60*
µs
TA = 25°C
90
IF = 0.5 mA,
Rl = 4.7 kΩ
115
2
7*
µs
TA = 25°C
10
IF = 12 mA,
Rl = 270 Ω
1.1
10
35*
µs
TA = 25°C
IF = 1.6 mA,
Rl = 2.2 kΩ
50
Fig. Note
5, 6, 2, 4
7, 9,
12
5, 6,
7, 9,
12
2, 4
13
5, 6
13
5, 6
70
Common Mode
Transient Immunity
at Logic High Output
|CMH |
1000
10000
V/µs
Common Mode
Transient Immunity
at Logic Low Output
|CML|
1000
10000
V/µs
*JEDEC Registered Data for 6N139 and 6N138.
**All typical values at TA = 25°C and VCC = 5 V, unless otherwise noted.
IF = 0 mA,
TA = 25°C
Rl = 2.2 kΩ
|VCM | = 10 Vp-p
IF = 1.6 mA,
TA = 25°C
Rl = 2.2 kΩ
|VCM | = 10 Vp-p
12
Package Characteristics
Parameter
Input-Output Momentary
Withstand Voltage†
Option 020
HCNW139
HCNW138
Resistance (Input-Output)
Sym.
VISO
Min. Typ.** Max. Units
2500
V rms
RI-O
1012
Ω
Capacitance (Input-Output)
CI-O
0.6
pF
Test Conditions
RH < 50%, t = 1 min.,
TA = 25°C
5000
Fig. Note
3, 8
3, 9
VI-O = 500 Vdc
RH < 45%
f = 1 MHz
3
3
**All typicals at TA = 25°C, unless otherwise noted.
†The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output
continuous voltage rating. For the continuous voltage rating refer to the VDE 0884 Insulation Characteristics Table (if applicable),
your equipment level safety specification or HP Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage.”
Notes:
1. DC CURRENT TRANSFER RATI0
(CTR) is defined as the ratio of output
collector current, I O, to the forward
LED input current, I F, times 100%.
2. Pin 7 Open.
3. Device considered a two-terminal
device. Pins 1, 2, 3, and 4 shorted
together and Pins 5, 6, 7, and 8 shorted
together.
4. Use of a resistor between pin 5 and 7
will decrease gain and delay time.
Significant reduction in overall gain can
occur when using resistor values below
47 kΩ. For more information, please
contact your local HP Components
representative.
5. Common mode transient immunity in a
Logic High level is the maximum toler-
able (positive) dVCM /dt of the common
mode pulse, VCM, to assure that the
output will remain in a Logic High state
(i.e., VO > 2.0 V). Common mode
transient immunity in a Logic Low level
is the maximum tolerable (negative)
dVCM/dt of the common mode pulse,
VCM, to assure that the output will
remain in a Logic Low state (i.e.,
VO < 0.8 V).
6. In applications where dV/dt may exceed
50,000 V/µs (such as static discharge) a
series resistor, RCC, should be included
to protect the detector IC from
destructively high surge currents. The
recommended value is RCC = 220 Ω.
7. Use of a 0.1 µF bypass capacitor
connected between pins 8 and 5
adjacent to the device is recommended.
8. In accordance with UL 1577, each
optocoupler is proof tested by applying
an insulation test voltage 3000 V rms
for 1 second (leakage detection current
limit, II-O < 5 µA). This test is performed before the 100% production test
shown in the VDE 0884 Insulation
Related Characteristics Table, if
applicable.
9. In accordance with UL 1577, each
optocoupler is proof tested by applying
an insulation test voltage > 6000 V rms
for 1 second (leakage detection current
limit, II-O < 5 µA). This test is performed before the 100% production test
for partial discharge (method b) shown
in the VDE 0884 Insulation Related
Characteristics Table, if applicable.
4.0 mA
A
1.5 m
25
1.0 mA
0.5 mA
VCC = 5 V
TA = 25° C
0
1.0
2.0
1200
800
400
TA = 85°C
TA = 70°C
TA = 25°C
0.01
TA = 0°C
TA = -40°C
1.3
1.4
1.5
tP – PROPAGATION DELAY – µs
IF – FORWARD CURRENT – mA
+
VF
–
1.2
0
0.1
35
1.0
Figure 4. Input Diode Forward
Current vs. Forward Voltage.
10
TA = 85° C
1.0
0.1
0.01
0.01
10
tPLH
25
20
15
10
tPHL
5
0
-60 -40 -20
1.6
100
TA = 70° C
TA = 25° C
TA = 0° C
TA = -40° C
0.1
10
1
IF – INPUT DIODE FORWARD CURRENT – mA
Figure 3. 6N138/6N139 Output
Current vs. Input Diode Forward
Current.
24
IF = 0.5 mA
RL = 4.7 kΩ
1/f = 50 µs
30
VF – FORWARD VOLTAGE – V
0
20
40 60
21
tPLH
15
12
9
6
tPHL
3
0
-60 -40 -20
80 100
Figure 5. Propagation Delay vs.
Temperature.
IF = 1.6 mA
RL = 2.2 kΩ
1/f = 50 µs
18
0
20
40 60
80 100
TA – TEMPERATURE – °C
TA – TEMPERATURE – °C
Figure 6. Propagation Delay vs.
Temperature.
1.6
IF = 12 mA
RL = 270 kΩ
1/f = 50 µs
3
VF – FORWARD VOLTAGE – V
4
tP – PROPAGATION DELAY – µs
VCC = 5 V
VO = 0.4 V
40
IF
0.1
0.001
1.1
-40°C
Figure 2. Current Transfer Ratio vs.
Forward Current 6N138/6N139.
10
1.0
70°C
IF – FORWARD CURRENT – mA
Figure 1. 6N138/6N139 DC Transfer
Characteristics.
100
25°C
1600
VO – OUTPUT VOLTAGE – V
1000
70°C
tP – PROPAGATION DELAY – µs
0
85°C
2000
IO – OUTPUT CURRENT – mA
A
3.5 m
A
3.0 m
A
2.5 m
A
2.0 m
tPLH
2
1
tPHL
0
-60 -40 -20
0
20
40 60
80 100
TA – TEMPERATURE – °C
Figure 7. Propagation Delay vs.
Temperature.
100
IF = 1.6 mA
TA = 25° C
tf
1.5
TIME – µs
IO – OUTPUT CURRENT – mA
5.0 mA
50 4.5 mA
CTR – CURRENT TRANSFER RATIO – %
13
1.4
tr
10
1.3
IF – ADJUSTED FOR VOL = 2 V
1.2
-60 -40 -20
0
20
40 60
80 100
TA – TEMPERATURE – °C
Figure 8. Forward Voltage vs.
Temperature.
1
0.1
1.0
10
RL – LOAD RESISTANCE – kΩ
Figure 9. Nonsaturated Rise and Fall
Times vs. Load Resistance.
OUTPUT POWER – PS, INPUT CURRENT – IS
ICCL – LOGIC LOW SUPPLY CURRENT – mA
14
0.8
0.7
0.6
0.5
VCC = 18 V
0.4
VCC = 5 V
0.3
0.2
0.1
0
0
4
2
6
8
10
12
14
16
WIDEBODY
1000
PS (mW)
900
IS (mA)
800
700
600
500
400
300
200
100
0
0
25
50
75
100 125 150 175
TS – CASE TEMPERATURE – °C
IF – FORWARD CURRENT
Figure 10. Logic Low Supply Current
vs. Forward Current.
Figure 11. Thermal Derating Curve,
Dependence of Safety Limiting Value
with Case Temperature per VDE 0884.
IF
0
5V
VO
(SATURATED
RESPONSE)
1.5 V
PULSE
GEN.
ZO = 50 Ω
t r = 5 ns
IF
10% DUTY CYCLE
I/f < 100 µs
1.5 V
1
8
2
7
3
6
VOL
t PHL
t PLH
+5 V
RL
VO
0.1 µF
I F MONITOR
4
5
CL = 15 pF*
RM
VO
(NON-SATURATED
RESPONSE)
5V
90%
10%
90%
10%
tf
Figure 12. Switching Test Circuit.
tr
* INCLUDES PROBE AND
FIXTURE CAPACITANCE
15
VCM
10 V
0 V 10%
IF
tr, tf = 16 ns
90%
90%
tr
VO
8
RCC (SEE NOTE 6)
+5 V
2
7
RL
3
6
4
5
B
10%
tf
A
5V
SWITCH AT A: IF = 0 mA
VO
1
VFF
VOL
SWITCH AT B: IF = 1.6 mA
VCM
+
–
PULSE GEN.
Figure 13. Test Circuit for Transient Immunity and Typical Waveforms.
VO
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Data subject to change.
Copyright © 1998 Hewlett-Packard Co.
Obsoletes 5965-3599E
Printed in U.S.A.
5968-1085E (7/98)