LITEON LTL-30EDJ Through hole lamp Datasheet

Through Hole Lamp
Product Data Sheet
LTL-30EDJ
Spec No.: DS-20-94-0093
Effective Date: 05/24/2012
Revision: B
LITE-ON DCC
RELEASE
BNS-OD-FC001/A4
LITE-ON Technology Corp. / Optoelectronics
No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Features
* Yellow and Green chips are matched for uniform light output.
* T-1 3/4 type pakage.
* Long life-solid state reliability.
* Low power consumption.
* Lead (Pb) free product – RoHS compliant.
Package Dimensions
Part No.
Lens
Source Color
LTL-30EDJ
White Diffused
Yellow / Green
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm(.010") unless otherwise noted.
3. Protruded resin under flange is 1.0mm(.04") max.
4. Lead spacing is measured where the leads emerge from the package.
5. Specification are subject to change without notice.
Part No. : LTL-30EDJ
BNS-OD-C131/A4
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Absolute Maximum Ratings at TA=25°C
Parameter
Yellow
Green
Unit
60
100
mW
80
120
mA
Continuous Forward Current
20
30
mA
Derating Linear From 50°C
0.25
0.4
mA/°C
Power Dissipation
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
Operating Temperature Range
-40°C to + 100°C
Storage Temperature Range
-55°C to + 100°C
Lead Soldering Temperature
[1.6mm(.063") From Body]
Part No. : LTL-30EDJ
BNS-OD-C131/A4
260°C for 5 Seconds
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Electrical Optical Characteristics at TA=25°C
Parameter
Luminous Intensity
Symbol
Iv
Color
Min.
Typ.
Yellow
9.0
19.0
Green
12.6
40
Max.
Unit
Test Condition
IF = 20mA
mcd
IF = 20mA
Note 1,4
Viewing Angle
Peak Emission
2θ1/2
λp
Wavelength
Dominant Wavelength
Spectral Line Half-Width
Forward Voltage
Reverse Current
λd
Δλ
VF
IR
Yellow
30
Green
30
Yellow
585
Green
565
Note 2 (Fig.6)
nm
Measurement
@Peak (Fig.1)
Yellow
582
594
Green
566
576
Yellow
35
Green
30
Yellow
2.1
2.6
Green
2.1
2.6
Yellow
deg
nm
Note 3
nm
100
V
IF = 20mA
μA
VR = 5V
Green
Note: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE
(Commission International De L'Eclairage) eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single
wavelength which defines the color of the device.
4. The Iv guarantee should be added ±15%.
5. Reverse voltage (VR) condition is applied for IR test only. The device is not designed for
reverse operation.
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Typical Electrical / Optical Characteristics Curves
(25°C Ambient Temperature Unless Otherwise Noted)
Part No. : LTL-30EDJ
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Bin Table for reference.
Luminous Intensity Iv(mcd) Yellow
IF@ 20 mA
Bin Code
Min.
Max.
A
9.0
12.6
B
12.6
19.0
C
19.0
Note: Tolerance of each bin limit is ±15%
Luminous Intensity Iv(mcd) Green
Up
IF@ 20 mA
Bin Code
Min.
Max.
1
12.6
29.0
2
29.0
40.0
3
40.0
Up
Note: Tolerance of each bin limit is ±15%
Dominant wavelength ( nm ) Green / Yellow IF @ 20 mA
Yellow
Bin code
Green
Min.
Max
Bin code
Min
Max
H0A
582
586
H01
566
572
H0B
586
590
H02
572
576
H0C
590
594
-
-
-
Note: Tolerance of each bin limit is ± 1nm
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Packing Spec
1000,500, 200,100 pcs per packing bag
Standards per inner carton total 5000 pcs per inner carton
8 Inner cartons per outer carton total 40000 pcs per outer carton
In every shipping lot, only the last pack will be non-full packing
Remark : ( RoHS and Pb-Free Print on Label )
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CAUTIONS
1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment,
communication equipment and household applications).Consult Liteon’s Sales in advance for information on
applications in which exceptional reliability is required, particularly when the failure or malfunction of the
LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment,
medical and life support systems and safety devices).
2. Storage
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.
It is recommended that LEDs out of their original packaging are used within three months.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in
a sealed container with appropriate desiccant or in desiccators with nitrogen ambient.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
4. Lead Forming & Assembly
During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens.
Do not use the base of the lead frame as a fulcrum during forming.
Lead forming must be done before soldering, at normal temperature.
During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress.
5. Soldering
When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point.
Dipping the lens into the solder must be avoided.
Do not apply any external stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering conditions :
Soldering iron
Temperature
Soldering time
350°C Max.
3 sec. Max.
(one time only)
Wave soldering
Pre-heat
Pre-heat time
Solder wave
Soldering time
100°C Max.
60 sec. Max.
260°C Max.
10 sec. Max.
Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic
failure of the LED. IR reflow is not suitable process for through hole type LED lamp product.
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6. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs
connected in parallel in an application, it is recommended that a current limiting resistor be incorporated
in the drive circuit, in series with each LED as shown in Circuit A below.
Circuit model A
LED
Circuit model B
LED
(A) Recommended circuit
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics
of those LEDs
7. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:
 Use a conductive wrist band or anti- electrostatic glove when handling these LEDs
 All devices, equipment, and machinery must be properly grounded
 Work tables, storage racks, etc. should be properly grounded
 Use ion blower to neutralize the static charge which might have built up on surface of the LEDs
plastic lens as a result of friction between LEDs during storage and handing
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Suggested checking list :
Training and Certification
1. Everyone working in a static-safe area is ESD-certified?
2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
1. Static-safe workstation or work-areas have ESD signs?
2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
3. All ionizer activated, positioned towards the units?
4. Each work surface mats grounding is good?
Personnel Grounding
1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel strap or
conductive shoes with conductive flooring?
2. If conductive footwear used, conductive flooring also present where operator stand or walk?
3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?
4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?
5. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for Blue LED.
Device Handling
1. Every ESDS items identified by EIA-471 labels on item or packaging?
2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe
workstation?
3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
4. All flexible conductive and dissipative package materials inspected before reuse or recycle?
Others
1. Audit result reported to entity ESD control coordinator?
2. Corrective action from previous audits completed?
3. Are audit records complete and on file?
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8. Reliability Test
Classification
Test Item
Operation Life (LT)
Endurance
Test Condition
Ta = under room temperature
IF = per datasheet maximum drive current
*Test time = 1000 hrs
Ta = 60℃
High temperature/
High humidity storage RH = 90%
(THS)
Test time = 240hrs
Test
High temperature
storage
Ta = 105 ± 5 ℃
Test time = 1000 hrs
Low temperature
storage
Ta= -55 ± 5 ℃
Temperature cycling
Thermal
Shock
Environmental Solder resistance
Test
(no pre-condition)
Test time = 1000 hrs
100°C ~ 25°C ~ -40°C ~ 25°C
30 mins 5 mins 30 mins 5 mins
30 cycles
100 ± 5 ℃ ~ -30 ± 5 ℃
15 mins
15 mins
30 cycles (< 20 secs transfer)
T.sol = 260 ± 5℃
Dwell time = 10 ± 1 sec
3mm from the base of the epoxy buib
Reference Standard
MIL-STD-750D:1026 (1995)
MIL-STD-883G:1005 (2006)
MIL-STD-202G:103B (2002)
JEITA ED-4701:100 103 (2001)
MIL-STD-750D:1031 (1995)
MIL-STD-883G:1008 (2006)
JEITA ED-4701:200 201 (2001)
JEITA ED-4701: 200 202 (2001)
MIL-STD-750D:1051 (1995)
MIL-STD-883G:1010 (2006)
JEITA ED-4701:100 105 (2001)
JESD22-A104C (2005)
MIL-STD-750D:1056 (1995)
MIL-STD-883G:1011 (2006)
MIL-STD-202G:107G (2002)
JESD22-A106B (2004)
MIL-STD-750D:2031 (1995)
JEITA ED-4701: 300 302 (2001)
MIL-STD-750D:2026 (1995)
Solderability
(no pre-condition)
T.sol = 245 ± 5℃
Dwell time = 5 ± 0.5 sec
MIL-STD-883G:2003 (2006)
MIL-STD-202G:208H (2002)
IPC/EIA J-STD-002 (2004)
Soldering Iron
(no pre-condition)
T.sol = 350 ± 5℃
Dwell time = 3.5 ± 0.5 sec
MIL-STD-202G:208H (2002)
JEITA ED-4701: 300 302 (2001)
9. Others
The appearance and specifications of the product may be modified for improvement, without prior notice.
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