ON MC100EL90DWG -3.3 v / -5v triple ecl input to pecl output translator Datasheet

MC100EL90
-3.3 V / -5V Triple ECL
Input to PECL Output
Translator
Description
The MC100EL90 is a triple ECL to PECL translator. The device
receives either −3.3 V or −5 V differential ECL signals, determined by
the VEE supply level, and translates them to standard +5 V differential
PECL output signals.
To accomplish the level translation, the EL90 requires three power
rails. The VCC supply should be connected to the positive supply, and
the VEE pin should be connected to the negative power supply. The
GND pins, as expected, are connected to the system ground plane.
Both VEE and VCC should be bypassed to ground via 0.01 mF
capacitors.
Under open input conditions, the D input will be biased at VEE/2 and
the D input will be pulled to VEE. This condition will force the Q
output to a LOW, ensuring stability.
The VBB pin, an internally generated voltage supply, is available to
this device only. For single-ended input conditions, the unused
differential input is connected to VBB as a switching reference voltage.
VBB may also rebias AC coupled inputs. When used, decouple VBB
and VCC via a 0.01ĂmF capacitor and limit current sourcing or sinking
to 0.5 mA. When not used, VBB should be left open.
The 100 Series Contains Temperature Compensation
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SOIC−20 WB
DW SUFFIX
CASE 751D−05
MARKING DIAGRAM*
20
100EL90
AWLYYWWG
1
Features
• 500 ps Propagation Delays
• Operating Range:
VCC= 4.75 V to 5.25 V
VEE= −3.0 V to −5.5 V; GND= 0 V
Q Output will Default LOW with Inputs Open or at VEE
Internal Input Pulldown Resistors
ESD Protection:
♦ > 2 kV Human Body Model
♦ > 200 V Machine Model
Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
Moisture Sensitivity: Level 3 (Pb-Free)
(For Additional Information, see Application Note AND8003/D)
Flammability Rating: UL 94 V−0 @ 1.125 in,
Oxygen Index: 28 to 34
Transistor Count = 261 Devices
This Device is Pb-Free, Halogen Free and is RoHS Compliant
♦
•
•
•
•
•
•
•
•
♦
© Semiconductor Components Industries, LLC, 2016
July, 2016 − Rev. 4
1
A
WL
YY
WW
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb-Free Package
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
Device
MC100EL90DWG
Package
Shipping
SOIC−20 WB
(Pb-Free)
38 Units/Tube
Publication Order Number:
MC100EL90/D
MC100EL90
VCC
Q0
Q0
GND
Q1
Q1
20
19
18
17
16
15
GND Q2
14
PECL
ECL
ECL
ECL
1
2
3
VCC
D0
D0
4
5
6
D1
D1
VCC
12
11
7
8
9
10
ECL VBB
PECL
ECL VBB
PECL
13
Q2
D2
D2
VEE
Table 1. PIN DESCRIPTION
PIN
FUNCTION
Dn, Dn
Qn, Qn
ECL VBB
VCC
VEE
GND
ECL Inputs
PECL Outputs
ECL Reference Voltage Output
Positive Supply
Negative Supply
Ground
* All VCC pins are tied together on the die.
Warning: All VCC, VEE, and GND pins must be externally
connected to Power Supply to guarantee proper operation.
Figure 1. 20-Lead Pinout and Logic Diagram (Top View)
Table 2. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Mode Power Supply
VEE = 0 V
8 to 0
V
VEE
NECL Mode Power Supply
VCC = 0 V
−8 to 0
V
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
6 to 0
−6 to 0
V
Iout
Output Current
Continuous
Surge
50
100
mA
IBB
VBB Sink/Source
±0.5
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction-to-Ambient)
0 lfpm
500 lfpm
SOIC−20 WB
SOIC−20 WB
90
60
°C/W
qJC
Thermal Resistance (Junction-to-Case)
Standard Board
SOIC−20 WB
30 to 35
°C/W
Tsol
Wave Solder (Pb-Free)
265
°C
VI ≤ VCC
VI ≥ VEE
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 3. PECL DC CHARACTERISTICS (VCC = 5.0 V; VEE = −5 V; GND = 0 V (Note 1))
−40°C
Symbol
Characteristic
Min
Typ
25°C
Max
Min
24
85°C
Typ
Max
20
24
Min
Typ
Max
Unit
26
mA
ICC
VCC Power Supply Current
VOH
Output HIGH Voltage (Note 2)
3915
3995
4120
3975
4045
4120
3975
4050
4120
mV
VOL
Output LOW Voltage (Note 2)
3170
3305
3445
3190
3295
3380
3190
3295
3380
mV
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Output parameters vary 1:1 with VCC. VCC can vary ± 0.5 V.
2. Outputs are terminated through a 50 W resistor to VCC − 2.0V.
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2
MC100EL90
Table 4. NECL DC CHARACTERISTICS (VCC = 5.0 V; VEE = −5 V; GND = 0 V (Note 1))
−40°C
Symbol
Min
Characteristic
Typ
25°C
Max
Min
Max
6.0
8.0
Min
Typ
Max
Unit
8.0
mA
IEE
VEE Power Supply Current
VIH
Input HIGH Voltage
(Single-Ended)
−1165
−880
−1165
−880
−1165
−880
mV
VIL
Input LOW Voltage
(Single-Ended)
−1810
−1475
−1810
−1475
−1810
−1475
mV
ECL
VBB
Output Voltage Reference
−1.38
−1.26
−1.38
−1.26
−1.38
−1.26
V
VIHCMR
8.0
85°C
Typ
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 2)
Vpp < 500 Mv
Vpp y 500 mV
IIH
Input HIGH Current
IIL
Input LOW Current
V
VEE + 1.3
VEE + 1.5
−0.4
−0.4
VEE + 1.2
VEE + 1.4
−0.4
−0.4
150
VEE + 1.2
VEE + 1.4
−0.4
−0.4
150
0.5
0.5
150
0.5
mA
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input parameters vary 1:1 with GND. VEE can vary −3.0 V / −5.5 V.
2. VIHCMR min varies 1:1 with VEE. VIHCMR max varies 1:1 with GND.
Table 5. AC CHARACTERISTICS (VCC = 4.5 to 5.5 V; VEE = −3.0 to −5.5 V; GND = 0 V)
−40°C
Symbol
fmax
Maximum Toggle Frequency
tPLH
tPHL
Propagation Delay
D to Q
tSKEW
Min
Characteristic
Typ
25°C
Max
Min
590
640
420
370
560
Differential
S.E.
390
340
Skew
Output-to-Output (Note 1)
Part-to-Part
(Differential Configuration) (Note 1)
Duty Cycle
(Differential Configuration) (Note 2)
20
Typ
85°C
Max
Min
620
670
460
410
650
100
20
200
Typ
Max
700
100
MHz
660
710
20
200
100
ps
ps
200
25
25
25
TBD
TBD
TBD
tJITTER
Cycle-to-Cycle Jitter
VPP
Input Swing (Note 3)
150
1000
150
1000
150
1000
Output Rise/Fall Times Q (20%−80%)
230
500
230
500
230
500
tr
tf
Unit
ps
mV
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Skews are valid across specified voltage range, part-to-part skew is for a given temperature.
2. Duty cycle skew is the difference between a TPLH and TPHL propagation delay through a device.
3. VPP(min) is the minimum input swing for which AC parameters are guaranteed. The device has a DC gain of ≈40.
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3
MC100EL90
Q
Zo = 50 W
D
Receiver
Device
Driver
Device
Q
D
Zo = 50 W
50 W
50 W
VTT
VTT = VCC − 2.0 V
Figure 2. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices)
Resource Reference of Application Notes
AN1405/D
− ECL Clock Distribution Techniques
AN1406/D
− Designing with PECL (ECL at +5.0 V)
AN1503/D
− ECLinPSt I/O SPiCE Modeling Kit
AN1504/D
− Metastability and the ECLinPS Family
AN1568/D
− Interfacing Between LVDS and ECL
AN1672/D
− The ECL Translator Guide
AND8001/D
− Odd Number Counters Design
AND8002/D
− Marking and Date Codes
AND8020/D
− Termination of ECL Logic Devices
AND8066/D
− Interfacing with ECLinPS
AND8090/D
− AC Characteristics of ECL Devices
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4
MC100EL90
PACKAGE DIMENSIONS
SOIC−20 WB
DW SUFFIX
CASE 751D−05
ISSUE H
A
20
q
X 45 _
M
E
h
0.25
1
10
20X
B
b
0.25
M
T A
S
B
DIM
A
A1
b
c
D
E
e
H
h
L
q
S
A
L
H
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
11
B
M
D
18X
e
A1
SEATING
PLANE
c
T
RECOMMENDED
SOLDERING FOOTPRINT*
20X
20X
1.30
0.52
20
11
11.00
1
10
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
12.65
12.95
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0_
7_
MC100EL90
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