MC100EL90 -3.3 V / -5V Triple ECL Input to PECL Output Translator Description The MC100EL90 is a triple ECL to PECL translator. The device receives either −3.3 V or −5 V differential ECL signals, determined by the VEE supply level, and translates them to standard +5 V differential PECL output signals. To accomplish the level translation, the EL90 requires three power rails. The VCC supply should be connected to the positive supply, and the VEE pin should be connected to the negative power supply. The GND pins, as expected, are connected to the system ground plane. Both VEE and VCC should be bypassed to ground via 0.01 mF capacitors. Under open input conditions, the D input will be biased at VEE/2 and the D input will be pulled to VEE. This condition will force the Q output to a LOW, ensuring stability. The VBB pin, an internally generated voltage supply, is available to this device only. For single-ended input conditions, the unused differential input is connected to VBB as a switching reference voltage. VBB may also rebias AC coupled inputs. When used, decouple VBB and VCC via a 0.01ĂmF capacitor and limit current sourcing or sinking to 0.5 mA. When not used, VBB should be left open. The 100 Series Contains Temperature Compensation www.onsemi.com SOIC−20 WB DW SUFFIX CASE 751D−05 MARKING DIAGRAM* 20 100EL90 AWLYYWWG 1 Features • 500 ps Propagation Delays • Operating Range: VCC= 4.75 V to 5.25 V VEE= −3.0 V to −5.5 V; GND= 0 V Q Output will Default LOW with Inputs Open or at VEE Internal Input Pulldown Resistors ESD Protection: ♦ > 2 kV Human Body Model ♦ > 200 V Machine Model Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test Moisture Sensitivity: Level 3 (Pb-Free) (For Additional Information, see Application Note AND8003/D) Flammability Rating: UL 94 V−0 @ 1.125 in, Oxygen Index: 28 to 34 Transistor Count = 261 Devices This Device is Pb-Free, Halogen Free and is RoHS Compliant ♦ • • • • • • • • ♦ © Semiconductor Components Industries, LLC, 2016 July, 2016 − Rev. 4 1 A WL YY WW G = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION Device MC100EL90DWG Package Shipping SOIC−20 WB (Pb-Free) 38 Units/Tube Publication Order Number: MC100EL90/D MC100EL90 VCC Q0 Q0 GND Q1 Q1 20 19 18 17 16 15 GND Q2 14 PECL ECL ECL ECL 1 2 3 VCC D0 D0 4 5 6 D1 D1 VCC 12 11 7 8 9 10 ECL VBB PECL ECL VBB PECL 13 Q2 D2 D2 VEE Table 1. PIN DESCRIPTION PIN FUNCTION Dn, Dn Qn, Qn ECL VBB VCC VEE GND ECL Inputs PECL Outputs ECL Reference Voltage Output Positive Supply Negative Supply Ground * All VCC pins are tied together on the die. Warning: All VCC, VEE, and GND pins must be externally connected to Power Supply to guarantee proper operation. Figure 1. 20-Lead Pinout and Logic Diagram (Top View) Table 2. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC PECL Mode Power Supply VEE = 0 V 8 to 0 V VEE NECL Mode Power Supply VCC = 0 V −8 to 0 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V 6 to 0 −6 to 0 V Iout Output Current Continuous Surge 50 100 mA IBB VBB Sink/Source ±0.5 mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm 500 lfpm SOIC−20 WB SOIC−20 WB 90 60 °C/W qJC Thermal Resistance (Junction-to-Case) Standard Board SOIC−20 WB 30 to 35 °C/W Tsol Wave Solder (Pb-Free) 265 °C VI ≤ VCC VI ≥ VEE Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Table 3. PECL DC CHARACTERISTICS (VCC = 5.0 V; VEE = −5 V; GND = 0 V (Note 1)) −40°C Symbol Characteristic Min Typ 25°C Max Min 24 85°C Typ Max 20 24 Min Typ Max Unit 26 mA ICC VCC Power Supply Current VOH Output HIGH Voltage (Note 2) 3915 3995 4120 3975 4045 4120 3975 4050 4120 mV VOL Output LOW Voltage (Note 2) 3170 3305 3445 3190 3295 3380 3190 3295 3380 mV NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Output parameters vary 1:1 with VCC. VCC can vary ± 0.5 V. 2. Outputs are terminated through a 50 W resistor to VCC − 2.0V. www.onsemi.com 2 MC100EL90 Table 4. NECL DC CHARACTERISTICS (VCC = 5.0 V; VEE = −5 V; GND = 0 V (Note 1)) −40°C Symbol Min Characteristic Typ 25°C Max Min Max 6.0 8.0 Min Typ Max Unit 8.0 mA IEE VEE Power Supply Current VIH Input HIGH Voltage (Single-Ended) −1165 −880 −1165 −880 −1165 −880 mV VIL Input LOW Voltage (Single-Ended) −1810 −1475 −1810 −1475 −1810 −1475 mV ECL VBB Output Voltage Reference −1.38 −1.26 −1.38 −1.26 −1.38 −1.26 V VIHCMR 8.0 85°C Typ Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 2) Vpp < 500 Mv Vpp y 500 mV IIH Input HIGH Current IIL Input LOW Current V VEE + 1.3 VEE + 1.5 −0.4 −0.4 VEE + 1.2 VEE + 1.4 −0.4 −0.4 150 VEE + 1.2 VEE + 1.4 −0.4 −0.4 150 0.5 0.5 150 0.5 mA mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input parameters vary 1:1 with GND. VEE can vary −3.0 V / −5.5 V. 2. VIHCMR min varies 1:1 with VEE. VIHCMR max varies 1:1 with GND. Table 5. AC CHARACTERISTICS (VCC = 4.5 to 5.5 V; VEE = −3.0 to −5.5 V; GND = 0 V) −40°C Symbol fmax Maximum Toggle Frequency tPLH tPHL Propagation Delay D to Q tSKEW Min Characteristic Typ 25°C Max Min 590 640 420 370 560 Differential S.E. 390 340 Skew Output-to-Output (Note 1) Part-to-Part (Differential Configuration) (Note 1) Duty Cycle (Differential Configuration) (Note 2) 20 Typ 85°C Max Min 620 670 460 410 650 100 20 200 Typ Max 700 100 MHz 660 710 20 200 100 ps ps 200 25 25 25 TBD TBD TBD tJITTER Cycle-to-Cycle Jitter VPP Input Swing (Note 3) 150 1000 150 1000 150 1000 Output Rise/Fall Times Q (20%−80%) 230 500 230 500 230 500 tr tf Unit ps mV ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Skews are valid across specified voltage range, part-to-part skew is for a given temperature. 2. Duty cycle skew is the difference between a TPLH and TPHL propagation delay through a device. 3. VPP(min) is the minimum input swing for which AC parameters are guaranteed. The device has a DC gain of ≈40. www.onsemi.com 3 MC100EL90 Q Zo = 50 W D Receiver Device Driver Device Q D Zo = 50 W 50 W 50 W VTT VTT = VCC − 2.0 V Figure 2. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices) Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPSt I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1672/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices www.onsemi.com 4 MC100EL90 PACKAGE DIMENSIONS SOIC−20 WB DW SUFFIX CASE 751D−05 ISSUE H A 20 q X 45 _ M E h 0.25 1 10 20X B b 0.25 M T A S B DIM A A1 b c D E e H h L q S A L H NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 B M D 18X e A1 SEATING PLANE c T RECOMMENDED SOLDERING FOOTPRINT* 20X 20X 1.30 0.52 20 11 11.00 1 10 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 5 MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_ MC100EL90 ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. 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