Material Content Data Sheet Sales Product Name IDP45E60 MA# MA000734808 Package PG-TO220-2-1 Issued 29. August 2013 Weight* 1964.24 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material non noble metal noble metal non noble metal < 10% silicon phosphorus iron copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus antimony silver tin 7440-21-3 7723-14-0 7439-89-6 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-36-0 7440-22-4 7440-31-5 2.355 0.12 0.403 0.02 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.12 1199 1199 205 1.343 0.07 1341.263 68.29 68.38 682841 684 683729 5.480 0.28 0.28 2790 2790 5.980 0.30 3044 113.611 5.78 478.360 24.35 30.43 243534 57839 304418 14.487 0.74 0.74 7375 7375 0.198 0.01 0.000 0.00 0.076 0.00 0.190 0.01 0.495 0.03 101 0.01 2. 3. Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 101 97 0.04 Important Remarks: 1. 0 39 252 388 1000000