MC74VHC1G09 Product Preview 2-Input AND Gate with Open Drain Output The MC74VHC1G09 is an advanced high speed CMOS 2–input AND gate with open drain output fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation. The internal circuit is composed of three stages, including an open drain output which provides the capability to set output switching level. This allows the MC74VHC1G09 to be used to interface 5V circuits to circuits of any voltage between VCC and 7V using an external resistor and power supply. The MC74VHC1G09 input structure provides protection when voltages up to 7V are applied, regardless of the supply voltage. • High Speed: tPD = 4.3ns (Typ) at VCC = 5V • Low Internal Power Dissipation: ICC = 2µA (Max) at TA = 25°C • Power Down Protection Provided on Inputs • Pin and Function Compatible with Other Standard Logic Families • Latchup Performance Exceeds 300mA • ESD Performance: HBM > 2000V; MM > 200V, CDM > 1500V http://onsemi.com SC–88A / SOT–353 DF SUFFIX CASE 419A MARKING DIAGRAM VXd Pin 1 d = Date Code PIN ASSIGNMENT IN B 5 1 VCC OVT IN A 2 GND 3 4 1 IN B 2 IN A 3 GND 4 OUT Y 5 VCC OUT Y ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Figure 1. 5–Lead SOT–353 Pinout (Top View) LOGIC SYMBOL IN A IN B & FUNCTION TABLE Inputs OUT Y This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice. Semiconductor Components Industries, LLC, 1999 October, 1999 – Rev. 0.0 1 Output A B Y L L H H L H L H L L L Z Publication Order Number: MC74VHC1G09/D MC74VHC1G09 MAXIMUM RATINGS* Symbol Value Unit DC Supply Voltage Characteristics VCC –0.5 to +7.0 V DC Input Voltage VIN –0.5 to +7.0 V DC Output Voltage VOUT –0.5 to 7.0 V Input Diode Current IIK –20 mA IOK ±20 mA IOUT +25 mA DC Supply Current, VCC and GND ICC ±50 mA Power dissipation in still air, SC–88A † PD 200 mW Lead temperature, 1 mm from case for 10 s TL 260 °C Output Diode Current DC Output Current, per Pin Storage temperature Tstg –65 to +150 °C * Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. †Derating — SC–88A Package: –3 mW/_C from 65_ to 125_C RECOMMENDED OPERATING CONDITIONS Characteristics Symbol Min Max Unit DC Supply Voltage VCC 2.0 5.5 V DC Input Voltage VIN 0.0 5.5 V VOUT 0.0 7.0 V TA –55 +85 °C tr , tf 0 0 100 20 ns/V DC Output Voltage Operating Temperature Range Input Rise and Fall Time VCC = 3.3V ± 0.3V VCC = 5.0V ± 0.5V http://onsemi.com 2 MC74VHC1G09 DC ELECTRICAL CHARACTERISTICS VCC Symbol Parameter Test Conditions (V) Min 1.5 2.1 3.15 3.85 VIH Minimum High–Level Input Voltage 2.0 3.0 4.5 5.5 VIL Maximum Low–Level Input Voltage 2.0 3.0 4.5 5.5 VOH Minimum High–Level Output Voltage VIN = VIH or VIL VOL Maximum Low–Level Output Voltage VIN = VIH or VIL TA ≤ 85°C TA = 25°C Typ Max Min 1.5 2.1 3.15 3.85 0.5 0.9 1.35 1.65 VIN = VIH or VIL IOH = –50µA 2.0 3.0 4.5 1.9 2.9 4.4 VIN = VIH or VIL IOH = –4mA IOH = –8mA 3.0 4.5 2.58 3.94 VIN = VIH or VIL IOL = 50µA 2.0 3.0 4.5 VIN = VIH or VIL IOL = 4mA IOL = 8mA Max TA ≤ 125°C Min 1.5 2.1 3.15 3.85 0.5 0.9 1.35 1.65 2.0 3.0 4.5 Max V 0.5 0.9 1.35 1.65 1.9 2.9 4.4 1.9 2.9 4.4 2.48 3.80 2.34 3.66 Unit V V V 0.0 0.0 0.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 V V IIN Maximum Input Leakage Current VIN = 5.5V or GND 0 to 5.5 ±0.1 ±1.0 ±1.0 µA ICC Maximum Quiescent Supply Current VIN = VCC or GND 5.5 2.0 20 40 µA ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎ W ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ W ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎ W ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎ ÎÎ W ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎ IOPD Maximum Off–state Leakage Current VOUT = 5.5V 0 0.25 2.5 5.0 µA AC ELECTRICAL CHARACTERISTICS (Cload = 50 pF, Input tr = tf = 3.0ns) TA ≤ 85°C TA = 25°C Symbol tPZL tPLZ CIN Parameter Test Conditions Min Typ Max Min Max TA ≤ 125°C Min Max Unit ns Maximum Output Enable Time, Input A or B to Y VCC = 3.0 ± 0.3V RL = 1K CL = 15 pF CL = 50 pF 6.2 8.7 8.8 12.3 10.5 14.0 12.5 16.5 VCC = 5.0 ± 0.5V RL = 1K CL = 15 pF CL = 50 pF 4.3 5.8 5.9 7.9 7.0 9.0 9.0 11.0 Maximum Output Di bl Ti Disable Time VCC = 3.0 ± 0.3V, RL = 1K , CL = 50 pF 8.7 12.3 14.0 16.5 VCC = 5.0 ± 0.5V, RL = 1K , CL = 50 pF 5.8 7.9 9.0 11.0 6.0 10 10 10 Maximum Input Capacitance ns pF Typical @ 25°C, VCC = 5.0V CPD 18 Power Dissipation Capacitance (Note 1.) pF 1. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no–load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. A VCC VCC – 7V OVT RL B Figure 2. Output Voltage Mismatch Application http://onsemi.com 3 MC74VHC1G09 TEST POINT OUTPUT 50% VCC 50% Input A or B DEVICE UNDER TEST GND tPLH tPHL CL* VOH Output Y 50% VCC VOL *Includes all probe and jig capacitance Figure 3. Switching Waveforms Figure 4. Test Circuit DEVICE ORDERING INFORMATION Device Nomenclature Device Order Number Circuit Indicator Temp Range Identifier MC 74 MC74VHC1G09DFT1 Technology Device Function Package Suffix Tape & Reel Suffix Package Type Tape and Reel Size VHC1G 09 DF T1 SC–88A / SOT–353 7–Inch/3000 Unit PACKAGE DIMENSIONS SC–88A / SOT–353 DF SUFFIX 5–LEAD PACKAGE CASE 419A–01 ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MM. A G V 4 –B– S 1 2 3 D 5 PL 0.2 (0.008) M B MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC ––– 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 0.30 0.40 M 0.5 mm (min) N J C K 0.4 mm (min) H INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC ––– 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 0.012 0.016 http://onsemi.com 4 ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ 1.9 mm ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ ÉÉ 0.65 mm 0.65 mm 5 DIM A B C D G H J K N S V MC74VHC1G09 10 PITCHES CUMULATIVE TOLERANCE ON TAPE ±0.2 mm (±0.008”) P0 K P2 D t TOP COVER TAPE E A0 + K0 SEE NOTE 2 B1 SEE NOTE 2 F + B0 W + D1 FOR COMPONENTS 2.0 mm × 1.2 mm AND LARGER P EMBOSSMENT FOR MACHINE REFERENCE ONLY INCLUDING DRAFT AND RADII CONCENTRIC AROUND B0 CENTER LINES OF CAVITY USER DIRECTION OF FEED *TOP COVER TAPE THICKNESS (t1) 0.10 mm (0.004”) MAX. R MIN. TAPE AND COMPONENTS SHALL PASS AROUND RADIUS “R” WITHOUT DAMAGE EMBOSSED CARRIER BENDING RADIUS 100 mm (3.937”) MAXIMUM COMPONENT ROTATION 10° EMBOSSMENT 1 mm MAX TYPICAL COMPONENT CAVITY CENTER LINE TAPE 1 mm (0.039”) MAX TYPICAL COMPONENT CENTER LINE 250 mm (9.843”) CAMBER (TOP VIEW) ALLOWABLE CAMBER TO BE 1 mm/100 mm NONACCUMULATIVE OVER 250 mm Figure 5. Carrier Tape Specifications EMBOSSED CARRIER DIMENSIONS (See Notes 1 and 2) Tape Size B1 Max 8 mm 4.35 mm (0.171”) D D1 E F K P P0 P2 R T W 1.5 +0.1/ –0.0 mm (0.059 +0.004/ –0.0”) 1.0 mm Min (0.039”) 1.75 ±0.1 mm (0.069 ±0.004”) 3.5 ±0.5 mm (1.38 ±0.002”) 2.4 mm (0.094”) 4.0 ±0.10 mm (0.157 ±0.004”) 4.0 ±0.1 mm (0.156 ±0.004”) 2.0 ±0.1 mm (0.079 ±0.002”) 25 mm (0.98”) 0.3 ±0.05 mm (0.01 +0.0038/ –0.0002”) 8.0 ±0.3 mm (0.315 ±0.012”) 1. Metric Dimensions Govern–English are in parentheses for reference only. 2. A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to 0.50 mm max. The component cannot rotate more than 10° within the determined cavity http://onsemi.com 5 MC74VHC1G09 t MAX 13.0 mm ±0.2 mm (0.512” ±0.008”) 1.5 mm MIN (0.06”) A 20.2 mm MIN (0.795”) 50 mm MIN (1.969”) FULL RADIUS G Figure 6. Reel Dimensions REEL DIMENSIONS Tape Size 8 mm A Max G t Max 330 mm (13”) 8.400 mm, +1.5 mm, –0.0 (0.33”, +0.059”, –0.00) 14.4 mm (0.56”) DIRECTION OF FEED BARCODE LABEL POCKET Figure 7. Reel Winding Direction http://onsemi.com 6 HOLE MC74VHC1G09 CAVITY TAPE TOP TAPE TAPE TRAILER (Connected to Reel Hub) NO COMPONENTS 160 mm MIN COMPONENTS DIRECTION OF FEED Figure 8. Tape Ends for Finished Goods “T1” PIN ONE TOWARDS SPROCKET HOLE SC–88A/SOT–353 (5 Pin) DEVICE User Direction of Feed Figure 9. Reel Configuration http://onsemi.com 7 TAPE LEADER NO COMPONENTS 400 mm MIN MC74VHC1G09 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). 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