Renesas HD6433048B 8-bit single-chip microcomputer Datasheet

REJ09B0325-0300
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clicking the title page.
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be checked by referring to the relevant text.
H8/3048B Group
8
Hardware Manual
Renesas 8-Bit Single-Chip Microcomputer
H8 Family/H8/300H Series
H8/3048B
H8/3048F-ONE
Rev. 3.00
Revision Date: Sep 27, 2006
HD6433048B
HD6433048BV
HD64F3048B
HD64F3048BV
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and
more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corp. product best suited to the customer's application; they do not convey any license
under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or
a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any thirdparty's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corp. without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or
an authorized Renesas Technology Corp. product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising
from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means,
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Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
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system that is used under circumstances in which human life is potentially at stake. Please contact
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7. If these products or technologies are subject to the Japanese export control restrictions, they must
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Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
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contained therein.
Rev. 3.00 Sep 27, 2006 page ii of xxvi
General Precautions on Handling of Product
1. Treatment of NC Pins
Note: Do not connect anything to the NC pins.
The NC (not connected) pins are either not connected to any of the internal circuitry or are
used as test pins or to reduce noise. If something is connected to the NC pins, the
operation of the LSI is not guaranteed.
2. Treatment of Unused Input Pins
Note: Fix all unused input pins to high or low level.
Generally, the input pins of CMOS products are high-impedance input pins. If unused pins
are in their open states, intermediate levels are induced by noise in the vicinity, a passthrough current flows internally, and a malfunction may occur.
3. Processing before Initialization
Note: When power is first supplied, the product’s state is undefined.
The states of internal circuits are undefined until full power is supplied throughout the
chip and a low level is input on the reset pin. During the period where the states are
undefined, the register settings and the output state of each pin are also undefined. Design
your system so that it does not malfunction because of processing while it is in this
undefined state. For those products which have a reset function, reset the LSI immediately
after the power supply has been turned on.
4. Prohibition of Access to Undefined or Reserved Addresses
Note: Access to undefined or reserved addresses is prohibited.
The undefined or reserved addresses may be used to expand functions, or test registers
may have been be allocated to these addresses. Do not access these registers; the system’s
operation is not guaranteed if they are accessed.
Rev. 3.00 Sep 27, 2006 page iii of xxvi
Rev. 3.00 Sep 27, 2006 page iv of xxvi
Preface
The H8/3048B Group is a series of high-performance microcontrollers that integrate system
supporting functions together with an H8/300H CPU core. In addition, the H8/3048F-ONE is
2
equipped with an on-chip emulator (E10T)* .
The H8/300H CPU has a 32-bit internal architecture with sixteen 16-bit general registers, and a
concise, optimized instruction set designed for speed. It can address a 16-Mbyte linear address
space.
The on-chip emulator (E10T)* has functions that allow it to emulate directly a microcontroller
mounted on the user board. This makes possible on-board program debugging.
2
The on-chip supporting functions include ROM, RAM, a 16-bit integrated timer unit (ITU), a
programmable timing pattern controller (TPC), a watchdog timer (WDT), a serial communication
interface (SCI), an A/D converter, a D/A converter, I/O ports, a direct memory access controller
(DMAC), a refresh controller, and other facilities. Of the two SCI channels, one has been
expanded to support the ISO/IEC7816-3 smart card interface. Functions have also been added to
reduce power consumption in battery-powered applications: individual modules can be placed in
standby, and the frequency of the system clock supplied to the chip can be divided down under
software control.
The address space is divided into eight areas. The data bus width and access cycle length can be
selected independently in each area, simplifying the connection of different types of memory.
Seven operating modes (modes 1 to 7) are provided, offering a choice of data bus width and
address space size.
With these features, the H8/3048B Group can be used to implement compact, high-performance
systems easily.
Versions with either flash memory (F-ZTAT™* ) or mask ROM as the on-chip ROM are
available. This enables users to respond quickly and flexibly to changing application specifications
from the initial production stage through full-scale volume production.
1
This manual describes the H8/3048B Group hardware. For information on H8/3048 Group
products, please refer to the H8/3048 Group Hardware Manual. For details of the instruction set,
refer to the H8/300H Series Programming Manual.
Notes: 1. F-ZTAT (Flexible ZTAT) is a trademark of Renesas Technology Corp.
2. An on-chip emulator (E10T) is not provided in the mask ROM version.
Rev. 3.00 Sep 27, 2006 page v of xxvi
Notes on using the on-chip emulator (E10T) installed in the H8/3048F-ONE
H8/3048 Group products and H8/3048B Group products have different specifications regarding
the pin arrangement (pin 1, VCL), flash memory, and maximum operating frequency. Refer to
Comparison of H8/3048 Group Product Specifications for details of these differences.
Notes:
When using an on-chip emulator (E10T) for H8/3048 program development and debugging, the
following restrictions must be noted.
1. Only programs in the on-chip flash memory can be developed and debugged. Consequently,
emulation is not possible for programs in external memory or in the no-ROM mode.
2. Refresh controller and DMAC operation are not supported, so settings should not be made to
the registers for these modules.
3. During break mode of on-chip emulation, the watchdog timer stops counting. Accordingly, the
counter value may be invalid after resuming from the break mode.
4. The FWE (BRK) pin and pins P91, P93, and P95 are reserved for the E10T, and cannot be
used.
5. Area H'F7000 to H'F7FFF in 1-M address mode (area H'FF7000 to H'FF77FF in 16-M address
mode) is used by the E10T, and is not available to the user.
6. The initial program instructions following a reset should be initialize stack pointer (SP) and
read mode register (MDCR). (After initializing SP using the MOV.L instruction, use the
MOV.B instruction to read the MDCR register.)
7. Emulation of the hardware standby mode is not supported.
Rev. 3.00 Sep 27, 2006 page vi of xxvi
Comparison of H8/3048 Group Product Specifications
1
There are eight members of the H8/3048 Group; the H8/3048F-ZTAT (H8/3048F* , H8/3048F2
ONE* ), H8/3048ZTAT, H8/3048 mask ROM version, H8/3048B mask ROM version, H8/3047
mask ROM version, H8/3045 mask ROM version, and H8/3044 mask ROM version.
The specifications of each model is compared below.
Notes: 1. H8/3048F has dual power supply with flash memory installed.
2. H8/3048F-ONE has single power supply with flash memory and E10T installed.
Hardware
Manual
ROM Type
H8/3048 Group
(Rev. 7.0)
ZTAT
H8/3048B Group
(Rev. 3.0)
Mask ROM
F-ZTAT
Mask ROM
Model Type
H8/3048
H8/3048 mask ROM
version
H8/3047 mask ROM
version
H8/3045 mask ROM
version
H8/3044 mask ROM
version
H8/3048F
H8/3048F-ONE
Model Spec
PROM model
Mask ROM model
Dual power
supply, flash
memory is
installed
Mask ROM
Single power
model
supply, flash
memory installed,
internal stepdown (5 V
operation model),
high-speed
operation model
Refer to 1.4,
Differences
between
H8/3048F and
H8/3048F-ONE.
Refer to 1.4.3,
Differences
between
H8/3048F and
H8/3048F-ONE.
HD64F3048
HD64F3048B
(5 V operation
model)
HD6433048B
(5 V operation
model)
HD64F3048BV
(3 V operation
model)
HD6433048BV
(3 V operation
model)
Model Type
No.
Pin
Assignment
HD6473048
HD6433048
HD6433047
HD6433045
HD6433044
Refer to figure 1.2, Pin Arrangement of H8/3048ZTAT,
H8/3048 Mask ROM Version, H8/3047 Mask ROM
Version, H8/3045 Mask ROM Version, H8/3044 Mask
ROM Version, and H8/3048F (FP-100B or TFP-100B, Top
View), in section 1.
H8/3048B mask
ROM version
5-V operation models have a VCL pin
and an external capacitor must be
connected.
Refer to figure 1.3, H8/3048F-ONE
Pin Arrangement (FP-100B or TFP100B, Top View), in section 1.
Rev. 3.00 Sep 27, 2006 page vii of xxvi
Hardware
Manual
ROM Type
H8/3048 Group
(Rev. 7.0)
ZTAT
H8/3048B Group
(Rev. 3.0)
Mask ROM
F-ZTAT
RAM Capacity 4 kbytes
H8/3048: 4 kbytes
H8/3047: 4 kbytes
H8/3045: 2 kbytes
H8/3044: 2 kbytes
4 kbytes
4 kbytes
ROM Capacity 128 kbytes
H8/3048: 128 kbytes
H8/3047: 96 kbytes
H8/3045: 64 kbytes
H8/3044: 32 kbytes
128 kbytes
128 kbytes
Refer to section
19, Flash
Memory
(H8/3048F Dual
Power Supply).
Refer to section
18, ROM
(H8/3048F-ONE:
Single Power
Supply, H8/3048B
Mask ROM
Version)
Flash Memory
—
—
Mask ROM
—
Clock Pulse
Generator
Refer to section 20, Clock Pulse Generator.
Refer to section 19, Clock Pulse
Generator.
Power-Down
State
Refer to section 21, Power-Down State.
Refer to section 20, Power-Down
State.
Clock oscillator settling time: Waiting time of up to 131072 Clock oscillator settling time: Waiting
states
time of up to 262144 states
Electrical
Refer to table 22.1, Electrical Characteristics of H8/3048
Characteristics Group Products, in section 22.
(Clock Rate)
1 to 18 MHz
List of
Registers
1 to 16
MHz
Refer to table 21.1, Electrical
Characteristics of H8/3048 Group
and H8/3048B Group Products, in
section 21.
5 V operation models:
2 to 25 MHz,
3 V operation models:
2 to 25 MHz.
Refer to table B.1, Comparison of H8/3048 Group Internal I/O Register Specifications, in
appendix B.
Refer to appendix B.1, Addresses.
Notes on
Usage
—
—
—
Refer to section
1.4, Notes on
H8/3048F-ONE
(Single Power
Supply)
—
On-chip
Emulator
(E10T)
—
—
—
On-chip emulator
(E10T)
—
Rev. 3.00 Sep 27, 2006 page viii of xxvi
Main Revisions for This Edition
Item
Page
Revision (See Manual for Details)
All
—
• Notification of change in company name amended
(Before) Hitachi, Ltd. → (After) Renesas Technology Corp.
• Product naming convention amended
(Before) H8/3048B Series → (After) H8/3048B Group
1.3.1 Pin
Arrangement
8
Note: 1. For the 5 V operation product, this pin is used as the
VCL terminal, and for the 3 V operation models, this pin is used
as the VCC terminal that requires an external capacitor.
Figure 1.3 H8/3048B
Group Pin
Arrangement (FP100B or TFP-100B,
Top View)
1.3.3 Pin Functions
18, 19
Table 1.4 Pin
Functions
1.4.2 Product Type
Names and Markings
Table 1.5 Differences
in H8/3048F and
H8/3048F-ONE
Note amended
21
Table amended
Type
Symbol
Pin No.
I/O
Name and Function
A/D and D/A
converters
AVCC
76
Input
Power supply pin for the A/D and D/A
converters. Connect to the system power
supply (VCC) when not using the A/D and
D/A converters.
AVSS
86
Input
Ground pin for the A/D and D/A converters.
Connect to system ground (VSS).
VREF
77
Input
Reference voltage input pin for the A/D and
D/A converters. Connect to the system
power supply (VCC) when not using the A/D
and D/A converters.
Sample markings amended
Dual Power Supply
Model: H8/3048F
Sample
markings
H8/3048
3J1
HD
64F3048F16
Single Power Supply Model: H8/3048F-ONE
64F3048F25
64F3048VF25
H8/3048F-ONE
H8/3048F-ONE
PGM 5.0
PGM 3.3
BK80090
B
0021
B
0021
BK80090
Rev. 3.00 Sep 27, 2006 page ix of xxvi
Item
Page
Revision (See Manual for Details)
5.5.4 Usage Notes on 120
External Interrupts
Figure amended
Figure 5.9 IRQnF
Flag When Interrupt
Processing Is Not
Conducted
IRQaF
Read Write
1
0
Read Write
1
0
Read Write IRQb
1
1
Execution
Read
0
IRQbF
Write
0
Clear in error
Occurrence condition 1
10.2.3 Timer Mode
Register (TMDR)
335
Bit 6—Phase Counting
Mode Flag (MDF)
13.2.8 Bit Rate
Register (BRR)
Counting Direction
Down-Counting
TCLKA pin
↑
Low
↑
Up-Counting
492
Low
↓
High
Low
↑
High
↓
↓
Low
↑
High
↓
Table amended
φ (MHz)
Bit Rate
(bits/s)
n
110
150
3.6864
25
N
Error
(%)
n
1
212
0.03
1
155
0.16
300
1
77
0.16
1
95
0.00
600
0
155
0.16
0
191
0.00
1200
0
77
0.16
0
95
0.00
2400
0
38
0.16
0
47
4800
0
19
–2.34
0
9600
0
9
–2.34
19200
0
4
31250
0
38400
0
N
Error
(%)
n
N
Error
(%)
2
64
0.70
3
110
–0.02
1
191
0.00
3
80
0.47
2
162
–0.15
2
80
0.47
1
162
–0.15
0.00
1
80
0.47
23
0.00
0
162
–0.15
0
11
0.00
0
80
0.47
–2.34
0
5
0.00
0
40
–0.76
2
0.00
0
3
–7.84
0
24
0.00
1
22.07
0
2
0.00
0
19
1.73
Figure amended
1
Figure 13.8 Example
of SCI Receive
Operation (8-Bit Data
with Parity and One
Stop Bit)
High
3
Table 13.3 Examples
of Bit Rates and BRR
Settings in
Asynchronous Mode
13.3.2 Operation in
Asynchronous Mode
Table amended
TCLKB pin
473,
475
Occurrence condition 2
Start
bit
0
Parity Stop Start
bit
bit
bit
Data
D0
D1
D7
0/1
1
0
Parity Stop
bit
bit
Data
D0
D1
D7
0/1
1
1
Idle (mark)
state
RDRF
FER
RXI
request
1 frame
Rev. 3.00 Sep 27, 2006 page x of xxvi
RXI interrupt handler
reads data in RDR and
clears RDRF flag to 0
Framing error,
ERI request
Item
Page
13.3.3 Multiprocessor 495
Communication
Figure 13.11
Example of SCI
Transmit Operation
(8-Bit Data with
Multiprocessor Bit and
One Stop Bit)
Revision (See Manual for Details)
Figure amended
Multiprocessor
bit
Multiprocessor
bit
1
Start
bit
Stop Start
bit
bit
Data
D0
0
D1
D7
0/1
1
0
Stop
bit
Data
D0
D1
D7
0/1
1
1
Idle (mark)
state
TDRE
TEND
TXI
request
TXI interrupt handler
writes data in TDR and
clears TDRE flag to 0
TXI
request
TEI request
1 frame
13.3.4 Synchronous
Operation
500
An internal clock generated by the on-chip baud rate
generator or an external clock input from the SCK pin can be
selected by setting the C/A bit in SMR and the CKE1 and
CKE0 bits in SCR. See table 13.9.
Clock
14.2.3 Serial Mode
Register (SMR)
Description amended
521
Bit 7—GSM Mode
(GM)
Table amended
Bit 7: GM
Description
0
Using the regular smart card interface mode
1
•
The TEND flag is set 12.5 etu after the beginning of the start bit
•
Clock output on/off control only
(Initial value)
Using the GSM mode smart card interface mode
•
The TEND flag is set 11.0 etu after the beginning of the start bit
•
Clock output on/off and fixed-high/fixed-low control
(set by SCR)
18.5.1 Flash Memory
Control Register 1
(FLMCR1)
587
Note amended
Note: * Do not access flash memory while the E bit is set to 1.
Bit 1—Erase Bit (E)
Section 21 Electrical
Characteristics
Table 21.1 Electrical
Characteristics of
H8/3048 Group and
H8/3048B Group
Products
653,
654
Table amended
H8/3048B Group
Item
Absolute
maximum
ratings
Flash
memory
characteristics*4
VPP pin rating
H8/3048
ZTAT
H8/3048
F-ONE H8/3048B
Mask
(Single
ROM
Power
Supply)
Yes
—
—
—
See table
21.11
—
Rev. 3.00 Sep 27, 2006 page xi of xxvi
Item
Page
Revision (See Manual for Details)
21.2 Electrical
Characteristics of
H8/3048B (Mask
ROM)
675 to
689
Preliminary deleted
21.2.2 DC
Characteristics
678
Conditions amended
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V,
1
VREF = 3.0 V to AVCC, VSS = AVSS = 0 V* , Ta = –20°C to +75°C
(regular specifications), Ta = –40°C to +85°C (wide-range
specifications)
Table 21.13 DC
Characteristics (2)
B.1 Addresses (For
H8/3048F-ONE,
H8/3048B Mask ROM
Version)
742
B.3 Function
829
Note: 4. Byte data must be used to access FLMCR1,
FLMCR2, EBR, and RAMCR.
Registers FLMCR1, FLMCR2, EBR, and RAMCR are
implemented in the flash memory version only. The mask
ROM version does not have these registers.
ADCR
ADCR
Note amended
Table amended
H8/3048F-ONE
H8/3048F
H8/3048B mask ROM version
H8/3048ZTAT
H8/3048 mask ROM version
H8/3047 mask ROM version
H8/3045 mask ROM version
H8/3044 mask ROM version
829
Table amended
H8/3048F-ONE
H8/3048F
H8/3048B mask ROM version
H8/3048ZTAT
H8/3048 mask ROM version
H8/3047 mask ROM version
H8/3045 mask ROM version
H8/3044 mask ROM version
SYSCR
833
Not include this register
Include this register
Include this register
Not include this register
Table amended
Standby timer select 2 to 0
Bit 6 Bit 5 Bit 4
STS2 STS1 STS0
0
0
1
1
0
1
0
1
0
1
0
1
0
1
Standby Timer
H8/3048F-ONE
*
H8/3048B mask ROM version
Waiting time = 8,192 states
Waiting time = 8,192 states
Waiting time = 16,384 states
Waiting time = 16,384 states
Waiting time = 32,768 states
Waiting time = 32,768 states
Waiting time = 65,536 states
Waiting time = 65,536 states
Waiting time = 131,072 states Waiting time = 131,072 states
Waiting time = 262,144 states Waiting time = 1,024 states
Waiting time = 1,024 states
Illegal setting
Illegal setting
Illegal setting
Note: * H8/3048F
H8/3048ZTAT
H8/3048 mask ROM version
H8/3047 mask ROM version
H8/3045 mask ROM version
H8/3044 mask ROM version
Rev. 3.00 Sep 27, 2006 page xii of xxvi
Contents
Section 1 Overview .............................................................................................................
1.1
1.2
1.3
1.4
1.5
1.6
Overview...........................................................................................................................
Block Diagram ..................................................................................................................
Pin Description..................................................................................................................
1.3.1 Pin Arrangement ..................................................................................................
1.3.2 Pin Assignments in Each Mode ...........................................................................
1.3.3 Pin Functions .......................................................................................................
Notes on H8/3048F-ONE (Single Power Supply) ............................................................
1.4.1 Voltage Application .............................................................................................
1.4.2 Product Type Names and Markings.....................................................................
1.4.3 Differences between H8/3048F and H8/3048F-ONE ..........................................
1.4.4 VCL Pin..................................................................................................................
1.4.5 Note on Changeover to H8/3048 Group Mask ROM Version .............................
Setting Oscillation Settling Wait Time .............................................................................
Notes on Crystal Resonator Connection ...........................................................................
1
1
6
7
7
9
15
20
20
21
21
26
27
28
28
Section 2 CPU ...................................................................................................................... 29
2.1
2.2
2.3
2.4
2.5
2.6
2.7
Overview...........................................................................................................................
2.1.1 Features................................................................................................................
2.1.2 Differences from H8/300 CPU ............................................................................
CPU Operating Modes ......................................................................................................
Address Space...................................................................................................................
Register Configuration......................................................................................................
2.4.1 Overview..............................................................................................................
2.4.2 General Registers .................................................................................................
2.4.3 Control Registers .................................................................................................
2.4.4 Initial CPU Register Values.................................................................................
Data Formats.....................................................................................................................
2.5.1 General Register Data Formats ............................................................................
2.5.2 Memory Data Formats .........................................................................................
Instruction Set ...................................................................................................................
2.6.1 Instruction Set Overview .....................................................................................
2.6.2 Instructions and Addressing Modes .....................................................................
2.6.3 Tables of Instructions Classified by Function......................................................
2.6.4 Basic Instruction Formats ....................................................................................
2.6.5 Notes on Use of Bit Manipulation Instructions....................................................
Addressing Modes and Effective Address Calculation .....................................................
2.7.1 Addressing Modes ...............................................................................................
29
29
30
31
32
33
33
34
35
36
37
37
39
40
40
41
42
52
53
54
54
Rev. 3.00 Sep 27, 2006 page xiii of xxvi
2.8
2.9
2.7.2 Effective Address Calculation .............................................................................
Processing States...............................................................................................................
2.8.1 Overview..............................................................................................................
2.8.2 Program Execution State......................................................................................
2.8.3 Exception-Handling State ....................................................................................
2.8.4 Exception-Handling Sequences ...........................................................................
2.8.5 Bus-Released State...............................................................................................
2.8.6 Reset State............................................................................................................
2.8.7 Power-Down State ...............................................................................................
Basic Operational Timing .................................................................................................
2.9.1 Overview..............................................................................................................
2.9.2 On-Chip Memory Access Timing........................................................................
2.9.3 On-Chip Supporting Module Access Timing ......................................................
2.9.4 Access to External Address Space .......................................................................
58
62
62
62
63
64
65
66
66
67
67
67
68
69
Section 3 MCU Operating Modes .................................................................................. 71
3.1
3.2
3.3
3.4
3.5
3.6
Overview...........................................................................................................................
3.1.1 Operating Mode Selection ...................................................................................
3.1.2 Register Configuration.........................................................................................
Mode Control Register (MDCR) ......................................................................................
System Control Register (SYSCR) ...................................................................................
Operating Mode Descriptions ...........................................................................................
3.4.1 Mode 1 .................................................................................................................
3.4.2 Mode 2 .................................................................................................................
3.4.3 Mode 3 .................................................................................................................
3.4.4 Mode 4 .................................................................................................................
3.4.5 Mode 5 .................................................................................................................
3.4.6 Mode 6 .................................................................................................................
3.4.7 Mode 7 .................................................................................................................
Pin Functions in Each Operating Mode ............................................................................
Memory Map in Each Operating Mode ............................................................................
71
71
72
72
73
75
75
75
75
76
76
76
76
77
77
Section 4 Exception Handling ......................................................................................... 81
4.1
4.2
Overview...........................................................................................................................
4.1.1 Exception Handling Types and Priority...............................................................
4.1.2 Exception Handling Operation.............................................................................
4.1.3 Exception Vector Table .......................................................................................
Reset..................................................................................................................................
4.2.1 Overview..............................................................................................................
4.2.2 Reset Sequence ....................................................................................................
4.2.3 Interrupts after Reset............................................................................................
Rev. 3.00 Sep 27, 2006 page xiv of xxvi
81
81
81
82
84
84
84
87
4.3
4.4
4.5
4.6
Interrupts ...........................................................................................................................
Trap Instruction.................................................................................................................
Stack Status after Exception Handling..............................................................................
Notes on Stack Usage .......................................................................................................
88
89
89
90
Section 5 Interrupt Controller .......................................................................................... 91
5.1
5.2
5.3
5.4
5.5
Overview...........................................................................................................................
5.1.1 Features................................................................................................................
5.1.2 Block Diagram .....................................................................................................
5.1.3 Pin Configuration.................................................................................................
5.1.4 Register Configuration.........................................................................................
Register Descriptions ........................................................................................................
5.2.1 System Control Register (SYSCR) ......................................................................
5.2.2 Interrupt Priority Registers A and B (IPRA, IPRB).............................................
5.2.3 IRQ Status Register (ISR)....................................................................................
5.2.4 IRQ Enable Register (IER) ..................................................................................
5.2.5 IRQ Sense Control Register (ISCR) ....................................................................
Interrupt Sources...............................................................................................................
5.3.1 External Interrupts ...............................................................................................
5.3.2 Internal Interrupts.................................................................................................
5.3.3 Interrupt Vector Table..........................................................................................
Interrupt Operation............................................................................................................
5.4.1 Interrupt Handling Process...................................................................................
5.4.2 Interrupt Sequence ...............................................................................................
5.4.3 Interrupt Response Time......................................................................................
Usage Notes ......................................................................................................................
5.5.1 Contention between Interrupt and Interrupt-Disabling Instruction ......................
5.5.2 Instructions That Inhibit Interrupts ......................................................................
5.5.3 Interrupts during EEPMOV Instruction Execution..............................................
5.5.4 Usage Notes on External Interrupts .....................................................................
5.5.5 Notes on Non-Maskable Interrupts (NMI)...........................................................
91
91
92
93
93
94
94
95
102
103
104
105
105
107
107
111
111
116
117
118
118
119
119
119
121
Section 6 Bus Controller ................................................................................................... 123
6.1
6.2
Overview...........................................................................................................................
6.1.1 Features................................................................................................................
6.1.2 Block Diagram .....................................................................................................
6.1.3 Input/Output Pins .................................................................................................
6.1.4 Register Configuration.........................................................................................
Register Descriptions ........................................................................................................
6.2.1 Bus Width Control Register (ABWCR)...............................................................
6.2.2 Access State Control Register (ASTCR) .............................................................
123
123
124
125
126
126
126
127
Rev. 3.00 Sep 27, 2006 page xv of xxvi
6.3
6.4
6.2.3 Wait Control Register (WCR)..............................................................................
6.2.4 Wait State Controller Enable Register (WCER) ..................................................
6.2.5 Bus Release Control Register (BRCR) ................................................................
6.2.6 Chip Select Control Register (CSCR)..................................................................
Operation ..........................................................................................................................
6.3.1 Area Division .......................................................................................................
6.3.2 Chip Select Signals ..............................................................................................
6.3.3 Data Bus...............................................................................................................
6.3.4 Bus Control Signal Timing ..................................................................................
6.3.5 Wait Modes..........................................................................................................
6.3.6 Interconnections with Memory (Example) ..........................................................
6.3.7 Bus Arbiter Operation..........................................................................................
Usage Notes ......................................................................................................................
6.4.1 Connection to Dynamic RAM and Pseudo-Static RAM......................................
6.4.2 Register Write Timing .........................................................................................
6.4.3 BREQ Input Timing.............................................................................................
6.4.4 Transition To Software Standby Mode ................................................................
128
129
130
132
133
133
135
136
137
145
151
153
156
156
156
158
158
Section 7 Refresh Controller ............................................................................................ 159
7.1
7.2
7.3
7.4
7.5
Overview...........................................................................................................................
7.1.1 Features................................................................................................................
7.1.2 Block Diagram .....................................................................................................
7.1.3 Input/Output Pins .................................................................................................
7.1.4 Register Configuration.........................................................................................
Register Descriptions ........................................................................................................
7.2.1 Refresh Control Register (RFSHCR)...................................................................
7.2.2 Refresh Timer Control/Status Register (RTMCSR) ............................................
7.2.3 Refresh Timer Counter (RTCNT)........................................................................
7.2.4 Refresh Time Constant Register (RTCOR) .........................................................
Operation ..........................................................................................................................
7.3.1 Overview..............................................................................................................
7.3.2 DRAM Refresh Control .......................................................................................
7.3.3 Pseudo-Static RAM Refresh Control ...................................................................
7.3.4 Interval Timer ......................................................................................................
Interrupt Source ................................................................................................................
Usage Notes ......................................................................................................................
159
159
161
162
162
163
163
166
168
168
169
169
171
185
190
196
196
Section 8 DMA Controller ................................................................................................ 199
8.1
Overview........................................................................................................................... 199
8.1.1 Features................................................................................................................ 199
8.1.2 Block Diagram ..................................................................................................... 200
Rev. 3.00 Sep 27, 2006 page xvi of xxvi
8.2
8.3
8.4
8.5
8.6
8.1.3 Functional Overview............................................................................................
8.1.4 Input/Output Pins .................................................................................................
8.1.5 Register Configuration.........................................................................................
Register Descriptions (Short Address Mode)....................................................................
8.2.1 Memory Address Registers (MAR) .....................................................................
8.2.2 I/O Address Registers (IOAR) .............................................................................
8.2.3 Execute Transfer Count Registers (ETCR)..........................................................
8.2.4 Data Transfer Control Registers (DTCR) ............................................................
Register Descriptions (Full Address Mode)......................................................................
8.3.1 Memory Address Registers (MAR) .....................................................................
8.3.2 I/O Address Registers (IOAR) .............................................................................
8.3.3 Execute Transfer Count Registers (ETCR)..........................................................
8.3.4 Data Transfer Control Registers (DTCR) ............................................................
Operation ..........................................................................................................................
8.4.1 Overview..............................................................................................................
8.4.2 I/O Mode..............................................................................................................
8.4.3 Idle Mode.............................................................................................................
8.4.4 Repeat Mode ........................................................................................................
8.4.5 Normal Mode.......................................................................................................
8.4.6 Block Transfer Mode ...........................................................................................
8.4.7 DMAC Activation................................................................................................
8.4.8 DMAC Bus Cycle ................................................................................................
8.4.9 DMAC Multiple-Channel Operation ...................................................................
8.4.10 External Bus Requests, Refresh Controller, and DMAC .....................................
8.4.11 NMI Interrupts and DMAC..................................................................................
8.4.12 Aborting a DMA Transfer ...................................................................................
8.4.13 Exiting Full Address Mode..................................................................................
8.4.14 DMAC States in Reset State, Standby Modes, and Sleep Mode .........................
Interrupts ...........................................................................................................................
Usage Notes ......................................................................................................................
8.6.1 Note on Word Data Transfer................................................................................
8.6.2 DMAC Self-Access .............................................................................................
8.6.3 Longword Access to Memory Address Registers ................................................
8.6.4 Note on Full Address Mode Setup .......................................................................
8.6.5 Note on Activating DMAC by Internal Interrupts ...............................................
8.6.6 NMI Interrupts and Block Transfer Mode ...........................................................
8.6.7 Memory and I/O Address Register Values ..........................................................
8.6.8 Bus Cycle when Transfer Is Aborted ...................................................................
201
203
203
205
205
206
206
208
211
211
211
212
214
220
220
222
224
227
231
234
239
241
247
248
249
250
251
252
253
254
254
254
254
254
254
256
256
257
Section 9 I/O Ports .............................................................................................................. 259
9.1
Overview........................................................................................................................... 259
Rev. 3.00 Sep 27, 2006 page xvii of xxvi
9.2
Port 1.................................................................................................................................
9.2.1 Overview..............................................................................................................
9.2.2 Register Descriptions ...........................................................................................
9.3 Port 2.................................................................................................................................
9.3.1 Overview..............................................................................................................
9.3.2 Register Descriptions ...........................................................................................
9.4 Port 3.................................................................................................................................
9.4.1 Overview..............................................................................................................
9.4.2 Register Descriptions ...........................................................................................
9.5 Port 4.................................................................................................................................
9.5.1 Overview..............................................................................................................
9.5.2 Register Descriptions ...........................................................................................
9.6 Port 5.................................................................................................................................
9.6.1 Overview..............................................................................................................
9.6.2 Register Descriptions ...........................................................................................
9.7 Port 6.................................................................................................................................
9.7.1 Overview..............................................................................................................
9.7.2 Register Descriptions ...........................................................................................
9.8 Port 7.................................................................................................................................
9.8.1 Overview..............................................................................................................
9.8.2 Register Description.............................................................................................
9.9 Port 8.................................................................................................................................
9.9.1 Overview..............................................................................................................
9.9.2 Register Descriptions ...........................................................................................
9.10 Port 9.................................................................................................................................
9.10.1 Overview..............................................................................................................
9.10.2 Register Descriptions ...........................................................................................
9.11 Port A................................................................................................................................
9.11.1 Overview..............................................................................................................
9.11.2 Register Descriptions ...........................................................................................
9.11.3 Pin Functions .......................................................................................................
9.12 Port B ................................................................................................................................
9.12.1 Overview..............................................................................................................
9.12.2 Register Descriptions ...........................................................................................
9.12.3 Pin Functions .......................................................................................................
263
263
264
266
266
267
270
270
270
272
272
273
276
276
277
280
280
281
284
284
285
286
286
287
292
292
293
297
297
299
301
309
309
311
313
Section 10 16-Bit Integrated Timer Unit (ITU) ..........................................................
10.1 Overview...........................................................................................................................
10.1.1 Features................................................................................................................
10.1.2 Block Diagrams ...................................................................................................
10.1.3 Input/Output Pins .................................................................................................
319
319
319
322
327
Rev. 3.00 Sep 27, 2006 page xviii of xxvi
10.1.4 Register Configuration.........................................................................................
10.2 Register Descriptions ........................................................................................................
10.2.1 Timer Start Register (TSTR)................................................................................
10.2.2 Timer Synchro Register (TSNC) .........................................................................
10.2.3 Timer Mode Register (TMDR) ............................................................................
10.2.4 Timer Function Control Register (TFCR)............................................................
10.2.5 Timer Output Master Enable Register (TOER) ...................................................
10.2.6 Timer Output Control Register (TOCR) ..............................................................
10.2.7 Timer Counters (TCNT) ......................................................................................
10.2.8 General Registers A, B (GRA, GRB) ..................................................................
10.2.9 Buffer Registers A, B (BRA, BRB) .....................................................................
10.2.10 Timer Control Registers (TCR) ...........................................................................
10.2.11 Timer I/O Control Register (TIOR) .....................................................................
10.2.12 Timer Status Register (TSR)................................................................................
10.2.13 Timer Interrupt Enable Register (TIER) ..............................................................
10.3 CPU Interface....................................................................................................................
10.3.1 16-Bit Accessible Registers .................................................................................
10.3.2 8-Bit Accessible Registers ...................................................................................
10.4 Operation ..........................................................................................................................
10.4.1 Overview..............................................................................................................
10.4.2 Basic Functions....................................................................................................
10.4.3 Synchronization ...................................................................................................
10.4.4 PWM Mode..........................................................................................................
10.4.5 Reset-Synchronized PWM Mode.........................................................................
10.4.6 Complementary PWM Mode ...............................................................................
10.4.7 Phase Counting Mode ..........................................................................................
10.4.8 Buffering..............................................................................................................
10.4.9 ITU Output Timing ..............................................................................................
10.5 Interrupts ...........................................................................................................................
10.5.1 Setting of Status Flags .........................................................................................
10.5.2 Timing of Clearing of Status Flags ......................................................................
10.5.3 Interrupt Sources and DMA Controller Activation..............................................
10.6 Usage Notes ......................................................................................................................
328
331
331
332
334
337
339
341
342
343
344
345
348
350
352
353
353
356
357
357
359
367
369
373
376
385
387
392
395
395
398
398
400
Section 11 Programmable Timing Pattern Controller............................................... 415
11.1 Overview...........................................................................................................................
11.1.1 Features................................................................................................................
11.1.2 Block Diagram .....................................................................................................
11.1.3 TPC Pins ..............................................................................................................
11.1.4 Registers...............................................................................................................
11.2 Register Descriptions ........................................................................................................
415
415
416
417
418
419
Rev. 3.00 Sep 27, 2006 page xix of xxvi
11.2.1 Port A Data Direction Register (PADDR) ...........................................................
11.2.2 Port A Data Register (PADR) ..............................................................................
11.2.3 Port B Data Direction Register (PBDDR)............................................................
11.2.4 Port B Data Register (PBDR) ..............................................................................
11.2.5 Next Data Register A (NDRA) ............................................................................
11.2.6 Next Data Register B (NDRB).............................................................................
11.2.7 Next Data Enable Register A (NDERA)..............................................................
11.2.8 Next Data Enable Register B (NDERB) ..............................................................
11.2.9 TPC Output Control Register (TPCR) .................................................................
11.2.10 TPC Output Mode Register (TPMR) ...................................................................
11.3 Operation ..........................................................................................................................
11.3.1 Overview..............................................................................................................
11.3.2 Output Timing......................................................................................................
11.3.3 Normal TPC Output.............................................................................................
11.3.4 Non-Overlapping TPC Output .............................................................................
11.3.5 TPC Output Triggering by Input Capture ............................................................
11.4 Usage Notes ......................................................................................................................
11.4.1 Operation of TPC Output Pins .............................................................................
11.4.2 Note on Non-Overlapping Output........................................................................
419
419
420
420
421
423
425
426
427
429
431
431
432
433
435
437
438
438
438
Section 12 Watchdog Timer .............................................................................................
12.1 Overview...........................................................................................................................
12.1.1 Features................................................................................................................
12.1.2 Block Diagram .....................................................................................................
12.1.3 Pin Configuration.................................................................................................
12.1.4 Register Configuration.........................................................................................
12.2 Register Descriptions ........................................................................................................
12.2.1 Timer Counter (TCNT)........................................................................................
12.2.2 Timer Control/Status Register (TCSR) ................................................................
12.2.3 Reset Control/Status Register (RSTCSR) ............................................................
12.2.4 Notes on Register Rewriting ................................................................................
12.3 Operation ..........................................................................................................................
12.3.1 Watchdog Timer Operation .................................................................................
12.3.2 Interval Timer Operation .....................................................................................
12.3.3 Timing of Setting of Overflow Flag (OVF) .........................................................
12.3.4 Timing of Setting of Watchdog Timer Reset Bit (WRST) ..................................
12.4 Interrupts ...........................................................................................................................
12.5 Usage Notes ......................................................................................................................
12.6 Notes .................................................................................................................................
441
441
441
442
442
443
443
443
444
446
447
449
449
450
450
451
452
452
453
Rev. 3.00 Sep 27, 2006 page xx of xxvi
Section 13 Serial Communication Interface ................................................................ 455
13.1 Overview...........................................................................................................................
13.1.1 Features................................................................................................................
13.1.2 Block Diagram .....................................................................................................
13.1.3 Input/Output Pins .................................................................................................
13.1.4 Register Configuration.........................................................................................
13.2 Register Descriptions ........................................................................................................
13.2.1 Receive Shift Register (RSR) ..............................................................................
13.2.2 Receive Data Register (RDR) ..............................................................................
13.2.3 Transmit Shift Register (TSR) .............................................................................
13.2.4 Transmit Data Register (TDR).............................................................................
13.2.5 Serial Mode Register (SMR)................................................................................
13.2.6 Serial Control Register (SCR)..............................................................................
13.2.7 Serial Status Register (SSR) ................................................................................
13.2.8 Bit Rate Register (BRR) ......................................................................................
13.3 Operation ..........................................................................................................................
13.3.1 Overview..............................................................................................................
13.3.2 Operation in Asynchronous Mode .......................................................................
13.3.3 Multiprocessor Communication...........................................................................
13.3.4 Synchronous Operation........................................................................................
13.4 SCI Interrupts....................................................................................................................
13.5 Usage Notes ......................................................................................................................
455
455
457
458
458
459
459
459
460
460
461
464
468
472
481
481
483
492
499
508
509
Section 14 Smart Card Interface ..................................................................................... 515
14.1 Overview...........................................................................................................................
14.1.1 Features................................................................................................................
14.1.2 Block Diagram .....................................................................................................
14.1.3 Input/Output Pins .................................................................................................
14.1.4 Register Configuration.........................................................................................
14.2 Register Descriptions ........................................................................................................
14.2.1 Smart Card Mode Register (SCMR) ....................................................................
14.2.2 Serial Status Register (SSR) ................................................................................
14.2.3 Serial Mode Register (SMR)................................................................................
14.2.4 Serial Control Register (SCR)..............................................................................
14.3 Operation ..........................................................................................................................
14.3.1 Overview..............................................................................................................
14.3.2 Pin Connections ...................................................................................................
14.3.3 Data Format .........................................................................................................
14.3.4 Register Settings ..................................................................................................
14.3.5 Clock....................................................................................................................
14.3.6 Transmitting and Receiving Data ........................................................................
515
515
516
517
517
518
518
519
521
522
523
523
523
524
526
528
530
Rev. 3.00 Sep 27, 2006 page xxi of xxvi
14.4 Usage Notes ...................................................................................................................... 538
Section 15 A/D Converter ................................................................................................. 541
15.1 Overview...........................................................................................................................
15.1.1 Features................................................................................................................
15.1.2 Block Diagram .....................................................................................................
15.1.3 Input Pins .............................................................................................................
15.1.4 Register Configuration.........................................................................................
15.2 Register Descriptions ........................................................................................................
15.2.1 A/D Data Registers A to D (ADDRA to ADDRD)..............................................
15.2.2 A/D Control/Status Register (ADCSR) ...............................................................
15.2.3 A/D Control Register (ADCR) ............................................................................
15.3 CPU Interface....................................................................................................................
15.4 Operation ..........................................................................................................................
15.4.1 Single Mode (SCAN = 0) ....................................................................................
15.4.2 Scan Mode (SCAN = 1).......................................................................................
15.4.3 Input Sampling and A/D Conversion Time .........................................................
15.4.4 External Trigger Input Timing.............................................................................
15.5 Interrupts ...........................................................................................................................
15.6 Usage Notes ......................................................................................................................
541
541
542
543
544
545
545
546
548
549
550
550
552
554
555
556
556
Section 16 D/A Converter ................................................................................................. 561
16.1 Overview ............................................................................................................................
16.1.1 Features .................................................................................................................
16.1.2 Block Diagram .....................................................................................................
16.1.3 Input/Output Pins .................................................................................................
16.1.4 Register Configuration.........................................................................................
16.2 Register Descriptions ........................................................................................................
16.2.1 D/A Data Registers 0 and 1 (DADR0, DADR1) .................................................
16.2.2 D/A Control Register (DACR) ............................................................................
16.2.3 D/A Standby Control Register (DASTCR)..........................................................
16.3 Operation ..........................................................................................................................
16.4 D/A Output Control ..........................................................................................................
561
561
562
563
563
564
564
564
566
567
568
Section 17 RAM ..................................................................................................................
17.1 Overview...........................................................................................................................
17.1.1 Block Diagram .....................................................................................................
17.1.2 Register Configuration.........................................................................................
17.2 System Control Register (SYSCR) ...................................................................................
17.3 Operation ..........................................................................................................................
569
569
570
570
571
572
Rev. 3.00 Sep 27, 2006 page xxii of xxvi
Section 18 ROM (H8/3048F-ONE: Single Power Supply,
H8/3048B Mask ROM Version) ................................................................ 573
18.1 Flash Memory Overview ..................................................................................................
18.1.1 Notes on H8/3048F-ONE (Single Power Supply) ...............................................
18.1.2 Mode Pin Settings ................................................................................................
18.2 Flash Memory Features.....................................................................................................
18.2.1 Block Diagram .....................................................................................................
18.2.2 Mode Transitions .................................................................................................
18.2.3 On-Board Programming Modes...........................................................................
18.2.4 Flash Memory Emulation in RAM ......................................................................
18.2.5 Differences between Boot Mode and User Program Mode .................................
18.2.6 Block Configuration ............................................................................................
18.3 Flash Memory Pin Configuration......................................................................................
18.4 Flash Memory Register Configuration..............................................................................
18.5 Flash Memory Register Descriptions................................................................................
18.5.1 Flash Memory Control Register 1 (FLMCR1).....................................................
18.5.2 Flash Memory Control Register 2 (FLMCR2).....................................................
18.5.3 Erase Block Register (EBR) ................................................................................
18.5.4 RAM Control Register (RAMCR) .......................................................................
18.6 Flash Memory On-Board Programming Modes................................................................
18.6.1 Boot Mode ...........................................................................................................
18.6.2 User Program Mode.............................................................................................
18.7 Programming/Erasing Flash Memory ...............................................................................
18.7.1 Program Mode .....................................................................................................
18.7.2 Program-Verify Mode..........................................................................................
18.7.3 Erase Mode ..........................................................................................................
18.7.4 Erase-Verify Mode ..............................................................................................
18.8 Flash Memory Protection..................................................................................................
18.8.1 Hardware Protection ............................................................................................
18.8.2 Software Protection..............................................................................................
18.8.3 Error Protection....................................................................................................
18.8.4 NMI Input Disable Conditions.............................................................................
18.9 Flash Memory Emulation in RAM ...................................................................................
18.10 Flash Memory PROM Mode.............................................................................................
18.10.1 Socket Adapters and Memory Map .....................................................................
18.10.2 Notes on Use of PROM Mode .............................................................................
18.11 Notes on Flash Memory Programming/Erasing................................................................
18.12 Mask ROM (H8/3048B Mask ROM Version) Overviews................................................
18.12.1 Block Diagram .....................................................................................................
18.13 Notes on Ordering Mask ROM Version Chips .................................................................
573
573
574
575
576
576
579
581
582
583
583
584
584
584
588
589
590
592
593
598
600
602
603
607
607
609
609
611
612
614
615
616
617
618
619
625
625
626
Rev. 3.00 Sep 27, 2006 page xxiii of xxvi
18.14 Notes when Converting the F-ZTAT (Single Power Supply) Application Software
to the Mask-ROM Versions .............................................................................................. 627
Section 19 Clock Pulse Generator ..................................................................................
19.1 Overview...........................................................................................................................
19.1.1 Block Diagram .....................................................................................................
19.2 Oscillator Circuit...............................................................................................................
19.2.1 Connecting a Crystal Resonator...........................................................................
19.2.2 External Clock Input ............................................................................................
19.3 Duty Adjustment Circuit...................................................................................................
19.4 Prescalers ..........................................................................................................................
19.5 Frequency Divider ............................................................................................................
19.5.1 Register Configuration.........................................................................................
19.5.2 Division Control Register (DIVCR) ....................................................................
19.5.3 Usage Notes .........................................................................................................
629
629
630
630
630
633
636
636
636
637
637
638
Section 20 Power-Down State ......................................................................................... 639
20.1 Overview........................................................................................................................... 639
20.2 Register Configuration...................................................................................................... 641
20.2.1 System Control Register (SYSCR) ...................................................................... 641
20.2.2 Module Standby Control Register (MSTCR)....................................................... 643
20.3 Sleep Mode ....................................................................................................................... 645
20.3.1 Transition to Sleep Mode..................................................................................... 645
20.3.2 Exit from Sleep Mode.......................................................................................... 645
20.4 Software Standby Mode.................................................................................................... 645
20.4.1 Transition to Software Standby Mode ................................................................. 645
20.4.2 Exit from Software Standby Mode ...................................................................... 646
20.4.3 Selection of Waiting Time for Exit from Software Standby Mode...................... 646
20.4.4 Sample Application of Software Standby Mode.................................................. 648
20.4.5 Note...................................................................................................................... 648
20.5 Hardware Standby Mode .................................................................................................. 649
20.5.1 Transition to Hardware Standby Mode ................................................................ 649
20.5.2 Exit from Hardware Standby Mode ..................................................................... 649
20.5.3 Timing for Hardware Standby Mode ................................................................... 649
20.6 Module Standby Function ................................................................................................. 650
20.6.1 Module Standby Timing ...................................................................................... 650
20.6.2 Read/Write in Module Standby............................................................................ 650
20.6.3 Usage Notes ......................................................................................................... 651
20.7 System Clock Output Disabling Function......................................................................... 652
Rev. 3.00 Sep 27, 2006 page xxiv of xxvi
Section 21 Electrical Characteristics.............................................................................. 653
21.1 Electrical Characteristics of H8/3048F-ONE (Single-Power Supply) ..............................
21.1.1 Absolute Maximum Ratings ................................................................................
21.1.2 DC Characteristics ...............................................................................................
21.1.3 AC Characteristics ...............................................................................................
21.1.4 A/D Conversion Characteristics...........................................................................
21.1.5 D/A Conversion Characteristics...........................................................................
21.1.6 Flash Memory Characteristics .............................................................................
21.2 Electrical Characteristics of H8/3048B (Mask ROM) ......................................................
21.2.1 Absolute Maximum Ratings ................................................................................
21.2.2 DC Characteristics ...............................................................................................
21.2.3 AC Characteristics ...............................................................................................
21.2.4 A/D Conversion Characteristics...........................................................................
21.2.5 D/A Conversion Characteristics...........................................................................
21.3 Operational Timing ...........................................................................................................
21.3.1 Bus Timing ..........................................................................................................
21.3.2 Refresh Controller Bus Timing............................................................................
21.3.3 Control Signal Timing .........................................................................................
21.3.4 Clock Timing .......................................................................................................
21.3.5 TPC and I/O Port Timing.....................................................................................
21.3.6 ITU Timing ..........................................................................................................
21.3.7 SCI Input/Output Timing .....................................................................................
21.3.8 DMAC Timing.....................................................................................................
655
655
656
663
669
670
671
675
675
676
682
688
689
690
690
694
699
701
701
702
703
704
Appendix A Instruction Set .............................................................................................. 705
A.1
A.2
A.3
Instruction List .................................................................................................................. 705
Operation Code Map......................................................................................................... 720
Number of States Required for Execution ........................................................................ 723
Appendix B Internal I/O Register ................................................................................... 734
B.1
B.2
B.3
Addresses (For H8/3048F-ONE, H8/3048B Mask ROM Version) .................................. 735
Addresses (For H8/3048F, H8/3048ZTAT, H8/3048 Mask-ROM, H8/3047 Mask-ROM,
H8/3045 Mask-ROM, and H8/3044 Mask-ROM Versions) ............................................. 743
Function ............................................................................................................................ 751
Appendix C I/O Port Block Diagrams........................................................................... 837
C.1
C.2
C.3
C.4
C.5
Port 1 Block Diagram .......................................................................................................
Port 2 Block Diagram .......................................................................................................
Port 3 Block Diagram .......................................................................................................
Port 4 Block Diagram .......................................................................................................
Port 5 Block Diagram .......................................................................................................
837
838
839
840
841
Rev. 3.00 Sep 27, 2006 page xxv of xxvi
C.6
C.7
C.8
C.9
C.10
C.11
Port 6 Block Diagrams......................................................................................................
Port 7 Block Diagrams......................................................................................................
Port 8 Block Diagrams......................................................................................................
Port 9 Block Diagrams......................................................................................................
Port A Block Diagrams .....................................................................................................
Port B Block Diagrams .....................................................................................................
842
846
847
850
854
858
Appendix D Pin States ....................................................................................................... 862
D.1
D.2
Port States in Each Mode .................................................................................................. 862
Pin States at Reset ............................................................................................................. 865
Appendix E Timing of Transition to and Recovery from Hardware
Standby Mode............................................................................................... 868
Appendix F Product Code Lineup .................................................................................. 869
Appendix G Package Dimensions ................................................................................... 871
Rev. 3.00 Sep 27, 2006 page xxvi of xxvi
Section 1 Overview
Section 1 Overview
1.1
Overview
The H8/3048B Group is a series of microcontrollers (MCUs) that integrate system supporting
functions together with an H8/300H CPU core having an original Renesas Technology
2
architecture. In addition, the H8/3048F-ONE is equipped with an on-chip emulator (E10T)* .
The H8/300H CPU has a 32-bit internal architecture with sixteen 16-bit general registers, and a
concise, optimized instruction set designed for speed. It can address a 16-Mbyte linear address
space. Its instruction set is upward-compatible at the object-code level with the H8/300 CPU,
enabling easy porting of software from the H8/300 Series.
The on-chip system supporting functions include ROM, RAM, a 16-bit integrated timer unit
(ITU), a programmable timing pattern controller (TPC), a watchdog timer (WDT), a serial
communication interface (SCI), an A/D converter, a D/A converter, I/O ports, a direct memory
access controller (DMAC), a refresh controller, and other facilities.
The H8/3048B Group has 128 kbytes of on-chip ROM and 4 kbytes of on-chip RAM.
Seven MCU operating modes offer a choice of data bus width and address space size. The modes
(modes 1 to 7) include one single-chip mode and six expanded modes.
In addition to mask ROM products, the H8/3048B Group includes F-ZTAT™* version products
with on-chip user-programmable flash memory. It enables users to respond quickly and flexibly to
changing application specifications as well as to conditions when ramping up from initial to full
2
volume production. The on-chip emulator (E10T)* is capable of direct emulation of the
microcontroller when mounted in the user’s system, thereby making possible on-board program
debugging.
1
Table 1.1 summarizes the features of the H8/3048B Group.
Notes: 1. F-ZTAT (Flexible ZTAT) is a trademark of Renesas Technology Corp.
2. An on-chip emulator (E10T) is not provided in the mask ROM version.
Rev. 3.00 Sep 27, 2006 page 1 of 872
REJ09B0325-0300
Section 1 Overview
Table 1.1
Features
Feature
Description
CPU
Upward-compatible with the H8/300 CPU at the object-code level
•
General-register machine
 Sixteen 16-bit general registers
(also usable as sixteen 8-bit registers + eight 16-bit registers or eight 32bit registers)
•
High-speed operation (flash memory version)
 Maximum clock rate: 25 MHz
 Add/subtract: 80 ns
 Multiply/divide: 560 ns
 16-Mbyte address space
•
Instruction features
 8/16/32-bit data transfer, arithmetic, and logic instructions
 Signed and unsigned multiply instructions (8 bits × 8 bits, 16 bits × 16
bits)
 Signed and unsigned divide instructions (16 bits ÷ 8 bits, 32 bits ÷ 16
bits)
 Bit accumulator function
 Bit manipulation instructions with register-indirect specification of bit
positions
Memory
Interrupt
controller
Bus controller
•
ROM: 128 kbytes
•
RAM: 4 kbytes
•
Seven external interrupt pins: NMI, IRQ0 to IRQ5
•
30 internal interrupts
•
Three selectable interrupt priority levels
•
Address space can be partitioned into eight areas, with independent bus
specifications in each area
•
Chip select output available for areas 0 to 7
•
8-bit access or 16-bit access selectable for each area
•
Two-state or three-state access selectable for each area
•
Selection of four wait modes
•
Bus arbitration function
Rev. 3.00 Sep 27, 2006 page 2 of 872
REJ09B0325-0300
Section 1 Overview
Feature
Description
Refresh
controller
•
DRAM refresh
 Directly connectable to 16-bit-wide DRAM
 CAS-before-RAS refresh
 Self-refresh mode selectable
•
Pseudo-static RAM refresh
 Self-refresh mode selectable
DMA controller
(DMAC)
•
Usable as an interval timer
•
Short address mode
 Maximum four channels available
 Selection of I/O mode, idle mode, or repeat mode
 Can be activated by compare match/input capture A interrupts from ITU
channels 0 to 3, transmit-data-empty and receive-data-full interrupts from
SCI channel 0, or external requests
•
Full address mode
 Maximum two channels available
 Selection of normal mode or block transfer mode
 Can be activated by compare match/input capture A interrupts from ITU
channels 0 to 3, external requests, or auto-request
16-bit integrated
timer unit (ITU)
•
Five 16-bit timer channels, capable of processing up to 12 pulse outputs or
10 pulse inputs
•
One 16-bit timer counter (channels 0 to 4)
•
Two multiplexed output compare/input capture pins (channels 0 to 4)
•
Operation can be synchronized (channels 0 to 4)
•
PWM mode available (channels 0 to 4)
•
Phase counting mode available (channel 2)
•
Buffering available (channels 3 and 4)
•
Reset-synchronized PWM mode available (channels 3 and 4)
•
Complementary PWM mode available (channels 3 and 4)
•
DMAC can be activated by compare match/input capture A interrupts
(channels 0 to 3)
Rev. 3.00 Sep 27, 2006 page 3 of 872
REJ09B0325-0300
Section 1 Overview
Feature
Description
Programmable
timing pattern
controller (TPC)
•
Maximum 16-bit pulse output, using ITU as time base
•
Up to four 4-bit pulse output groups (or one 16-bit group, or two 8-bit groups)
•
Non-overlap mode available
•
Output data can be transferred by DMAC
Watchdog timer
(WDT),
1 channel
•
Reset signal can be generated by overflow
•
Usable as an interval timer
Serial
communication
interface (SCI),
2 channels
•
Selection of asynchronous or synchronous mode
•
Full duplex: can transmit and receive simultaneously
•
On-chip baud-rate generator
•
Smart card interface functions added (SCI0 only)
•
Resolution: 10 bits
•
Eight channels, with selection of single or scan mode
•
Variable analog conversion voltage range
•
Sample-and-hold function
•
A/D conversion can be externally triggered
•
Resolution: 8 bits
•
Two channels
•
D/A outputs can be sustained in software standby mode
•
70 input/output pins
•
8 input-only pins
•
Seven MCU operating modes
A/D converter
D/A converter
I/O ports
Operating
modes
Mode
Address Space
Address Pins
Initial Bus Width
Max. Bus Width
Mode 1
1 Mbyte
A19 to A0
8 bits
16 bits
Mode 2
1 Mbyte
A19 to A0
16 bits
16 bits
Mode 3
16 Mbytes
A23 to A0
8 bits
16 bits
Mode 4
16 Mbytes
A23 to A0
16 bits
16 bits
Mode 5
1 Mbyte
A19 to A0
8 bits
16 bits
Mode 6
16 Mbytes
A23 to A0
8 bits
16 bits
Mode 7
1 Mbyte
—
—
—
•
On-chip ROM is disabled in modes 1 to 4
Rev. 3.00 Sep 27, 2006 page 4 of 872
REJ09B0325-0300
Section 1 Overview
Feature
Description
Power-down
state
•
Sleep mode
•
Software standby mode
•
Hardware standby mode
•
Module standby function
•
Programmable system clock frequency division
Other features
•
On-chip clock pulse generator
Product lineup
Model (5 V)
Model (3 V)
Package
HD64F3048BTE HD64F3048BVTE 100-pin TQFP (TFP-100B)
HD64F3048BF
HD64F3048BVF
100-pin QFP (FP-100B)
HD6433048BTE HD6433048BVTE
100-pin TQFP (TFP-100B)
HD6433048BF
100-pin QFP (FP-100B)
HD6433048BVF
ROM
Remarks
Flash
E10T is
memory installed
Mask
ROM
E10T is not
installed
Rev. 3.00 Sep 27, 2006 page 5 of 872
REJ09B0325-0300
Section 1 Overview
1.2
Block Diagram
Port 3
P40/D0
P41/D1
P42/D2
P43/D3
P44/D4
P45/D5
P46/D6
P47/D7
P30/D8
P31/D9
P32/D10
P33/D11
P34/D12
P35/D13
P36/D14
P37/D15
VSS
VSS
VSS
VSS
VSS
VSS
VCC
*2
VCC
VCC
Figure 1.1 shows an internal block diagram.
Port 4
Address bus
Data bus (upper)
MD1
Data bus (lower)
Port 5
P53/A19
MD2
MD0
P52/A18
P51/A17
P50/A16
EXTAL
STBY
RES
P26/A14
H8/300H CPU
P25/A13
Port 2
φ
*1
NMI
Interrupt controller
P66/LWR
DMA controller
(DMAC)
P65/HWR
P62/BACK
ROM
(mask ROM,
or flash
memory)
P23/A11
P21/A9
P20/A8
P17/A7
P16/A6
P15/A5
P61/BREQ
Port 1
P63/AS
Port 6
P64/RD
P24/A12
P22/A10
Bus controller
RESO/FWE
P27/A15
Clock pulse
generator
XTAL
Refresh
controller
P60/WAIT
P14/A4
P13/A3
P12/A2
RAM
P11/A1
P84/CS0
P82/CS2/IRQ2
P81/CS3/IRQ1
Port 8
P83/CS1/IRQ3
P10/A0
Watchdog timer
(WDT)
16-bit integrated
timer unit
(ITU)
P80/RFSH/IRQ0
Serial communication
interface
(SCI) × 2 channels
P95/SCK1/IRQ5
Programmable
timing pattern
controller (TPC)
P94/SCK0/IRQ4
Port 9
A/D converter
D/A converter
P93/RxD1
P92/RxD0
P91/TxD1
P90/TxD0
P70/AN0
P71/AN1
P72/AN2
P73/AN3
P74/AN4
P75/AN5
P76/AN6/DA0
P77/AN7/DA1
AVSS
AVCC
VREF
PA0/TP0/TEND0/TCLKA
PA1/TP1/TEND1/TCLKB
Port 7
PA2/TP2/TIOCA0/TCLKC
PA3/TP3/TIOCB0/TCLKD
PA4/TP4/TIOCA1/A23/CS6
PA5/TP5/TIOCB1/A22/CS5
PA7/TP7/TIOCB2/A20
PA6/TP6/TIOCA2/A21/CS4
PB0/TP8/TIOCA3
PB1/TP9/TIOCB3
Port A
PB2/TP10/TIOCA4
PB3/TP11/TIOCB4
PB4/TP12/TOCXA4
PB5/TP13/TOCXB4
PB6/TP14/DREQ0/CS7
PB7/TP15/DREQ1/ADTRG
Port B
Notes: 1. This pin functions as the FWE (input) pin on the H8/3048F-ONE (single power supply on-chip flash memory version). On
H8/300H Series versions with on-chip mask ROM it functions as the RESO (output) pin, and on dual power supply flash
memory versions (VPP = 12 V) and on-chip PROM versions it functions as the RESO (output)/VPP (input) pin.
2. Pin 1 on the H8/3048B Group which operates at 5 V is not used as the VCC terminal, but is used as the VCL terminal; the
external capacitor must be connected. Pin 1 is the VCC pin on versions that operate on 3 V.
Figure 1.1 Block Diagram
Rev. 3.00 Sep 27, 2006 page 6 of 872
REJ09B0325-0300
Section 1 Overview
1.3
Pin Description
1.3.1
Pin Arrangement
Figure 1.3 shows the pin arrangement of the H8/3048B Group.
The pin arrangement of the H8/3048B Group is shown in figure 1.3. Differences in the H8/3048
Group pin arrangements are shown in table 1.2. The 5 V operation models of the H8/3048B Group
have a VCL pin. The 3 V operation models of the H8/3048B Group have pin 1, which is the VCC
power supply pin. See section 1.4, Notes on H8/3048F-ONE (Single Power Supply). Except for
the differences shown in table 1.2, the pin arrangements are the same.
Table 1.2
Comparison of H8/3048B Group and H8/3048 Group Pin Arrangements
H8/3048B
Mask ROM Version
H8/3048F-ONE
Package
FP-100B
(TFP-100B)
Pin
Number
3V
5V
3V
5V
Operation Operation Operation Operation
Model
Model
Model
Model
H8/3048
H8/3048F
ZTAT
H8/3048 H8/3047 H8/3045 H8/3044
Mask
Mask
Mask
Mask
ROM
ROM
ROM
ROM
Version Version Version Version
1
VCL
VCC
VCL
VCC
VCC
VCC
VCC
VCC
VCC
VCC
10
FWE
FWE
RESO
RESO
VPP/
RESO
VPP/
RESO
RESO
RESO
RESO
RESO
1 (VCL)
1 (VCC)
VCC
H8/3048B Group and
H8/3048F-ONE
5 V operation model
H8/3048B Group and
H8/3048F-ONE
3 V operation model
and H8/3048 Group
Figure 1.2 Connection of Pin 1
Rev. 3.00 Sep 27, 2006 page 7 of 872
REJ09B0325-0300
MD2
MD1
MD0
P66 /LWR
P65 /HWR
P64 /RD
P63 /AS
VCC
XTAL
EXTAL
VSS
NMI
RES
STBY
φ
P62 /BACK
P61 /BREQ
P60 /WAIT
VSS
P53 /A 19
P52 /A 18
P51 /A 17
P50 /A 16
P27 /A 15
P26 /A 14
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
Section 1 Overview
AVCC
76
50
A13/P25
VREF
77
49
A12/P24
P70/AN0
78
48
A11/P23
P71/AN1
79
47
A10/P22
P72/AN2
80
46
A9/P21
P73/AN3
81
45
A8/P20
P74/AN4
82
44
VSS
P75/AN5
83
43
A7/P17
P76/AN6/DA0
84
42
A6/P16
P77/AN7/DA1
85
41
A5/P15
AVSS
86
40
A4/P14
P80/RFSH/IRQ0
87
39
A3/P13
P81/CS3/IRQ1
88
38
A2/P12
P82/CS2/IRQ2
89
37
A1/P11
P83/CS1/IRQ3
90
36
A0/P10
P84/CS0
91
35
VCC
VSS
92
34
D15/P37
PA0/TP0/TEND0/TCLKA
93
33
D14/P36
PA1/TP1/TEND1/TCLKB
94
32
D13/P35
PA2/TP2/TIOCA0/TCLKC
95
31
D12/P34
PA3/TP3/TIOCB0/TCLKD
96
30
D11/P33
PA4/TP4/TIOCA1/A23/CS6
97
29
D10/P32
PA5/TP5/TIOCB1/A22/CS5
98
28
D9/P31
PA6/TP6/TIOCA2/A21/CS4
99
27
D8/P30
100
26
D7/P47
14
15
16
17
18
19
20
21
22
23
24
25
RxD0 /P9 2
RxD1 /P9 3
IRQ 4/SCK0 /P9 4
IRQ 5/SCK1 /P9 5
D0 /P4 0
D1 /P4 1
D2 /P4 2
D3 /P4 3
VSS
D4 /P4 4
D5 /P4 5
D6 /P4 6
9
ADTRG/DREQ 1 /TP15 /PB 7
13
8
CS7/DREQ 0 /TP14 /PB 6
TxD1 /P9 1
7
TOCXB4 /TP13 /PB 5
12
6
TOCXA4 /TP12 /PB 4
TxD0 /P9 0
5
TIOCB4 /TP11 /PB 3
11
4
TIOCA4 /TP10 /PB 2
VSS
3
TIOCB3 /TP 9 /PB 1
10
2
RESO/ FWE*2
1
VCC/VCL*1
(FP-100B, TFP-100B)
TIOCA3 /TP 8 /PB 0
PA7/TP7/TIOCB2/A20
Top view
1
0.1 µF
Notes: 1. For the 5 V operation product, this pin is used as the VCL terminal, and for the 3 V operation models,
this pin is used as the VCC terminal that requires an external capacitor.
2. (1) Pin 10 of the H8/3048F-ONE (single power supply version) functions as the FWE pin. The
H8/3048F-ONE has no RESO output. Pin 10 functions as the RESO pin in on-chip mask ROM
versions and as the RESO/VPP pin in on-chip PROM versions and dual power supply flash
memory versions.
(2) Do NOT apply 12 V to the H8/3048F-ONE (single power supply), or to H8/3048 Group or
H8/3048B Group mask ROM products as the chip will be destroyed.
Figure 1.3 H8/3048B Group Pin Arrangement (FP-100B or TFP-100B, Top View)
Rev. 3.00 Sep 27, 2006 page 8 of 872
REJ09B0325-0300
Section 1 Overview
1.3.2
Pin Assignments in Each Mode
Table 1.3 lists the pin assignments in each mode.
Table 1.3
Pin Assignments in Each Mode (FP-100B or TFP-100B)
Pin Name
Pin
No.
1*3
PROM Mode
Mode 1
Mode 2
Mode 3
Mode 4
Mode 5
Mode 6
Mode 7
EPROM Flash
Remarks
VCL (VCC)
VCL (VCC)
VCL (VCC)
VCL (VCC)
VCL (VCC)
VCL (VCC)
VCL (VCC)
—
Flash
memory
version
with
single
power
supply.
VCL
(VCC)
H8/3048
B maskROM
version
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
2
PB0/TP8/
TIOCA3
PB0/TP8/
TIOCA3
PB0/TP8/
TIOCA3
PB0/TP8/
TIOCA3
PB0/TP8/
TIOCA3
PB0/TP8/
TIOCA3
PB0/TP8/
TIOCA3
NC
NC
3
PB1/TP9/
TIOCB3
PB1/TP9/
TIOCB3
PB1/TP9/
TIOCB3
PB1/TP9/
TIOCB3
PB1/TP9/
TIOCB3
PB1/TP9/
TIOCB3
PB1/TP9/
TIOCB3
NC
NC
4
PB2/TP10/ PB2/TP10/ PB2/TP10/ PB2/TP10/ PB2/TP10/ PB2/TP10/ PB2/TP10/ NC
TIOCA4
TIOCA4
TIOCA4
TIOCA4
TIOCA4
TIOCA4
TIOCA4
NC
5
PB3/TP11/ PB3/TP11/ PB3/TP11/ PB3/TP11/ PB3/TP11/ PB3/TP11/ PB3/TP11/ NC
TIOCB4
TIOCB4
TIOCB4
TIOCB4
TIOCB4
TIOCB4
TIOCB4
NC
6
PB4/TP12/ PB4/TP12/ PB4/TP12/ PB4/TP12/ PB4/TP12/ PB4/TP12/ PB4/TP12/ NC
TOCXA4 TOCXA4 TOCXA4 TOCXA4 TOCXA4 TOCXA4 TOCXA4
NC
7
PB5/TP13/ PB5/TP13/ PB5/TP13/ PB5/TP13/ PB5/TP13/ PB5/TP13/ PB5/TP13/ NC
TOCXB4 TOCXB4 TOCXB4 TOCXB4 TOCXB4 TOCXB4 TOCXB4
NC
H8/3048
Group,
Mask
ROM
version,
PROM
version
and flash
memory
version
with dual
power
supply.
Rev. 3.00 Sep 27, 2006 page 9 of 872
REJ09B0325-0300
Section 1 Overview
Pin Name
Pin
No.
PROM Mode
Mode 1
Mode 2
Mode 3
Mode 4
Mode 5
Mode 6
Mode 7
EPROM Flash
8
PB6/TP14/ PB6/TP14/ PB6/TP14/ PB6/TP14/ PB6/TP14/ PB6/TP14/ PB6/TP14/ NC
DREQ0/ DREQ0/ DREQ0/ DREQ0/ DREQ0/ DREQ0/ DREQ0
CS7
CS7
CS7
CS7
CS7
CS7
NC
9
PB7/TP15/ PB7/TP15/ PB7/TP15/ PB7/TP15/ PB7/TP15/ PB7/TP15/ PB7/TP15/ NC
DREQ1/ DREQ1/ DREQ1/ DREQ1/ DREQ1/ DREQ1/ DREQ1/
ADTRG ADTRG ADTRG ADTRG ADTRG ADTRG ADTRG
NC
10*4 FWE
Remarks
FWE
FWE
FWE
FWE
FWE
FWE
—
FWE
Flash
memory
version
with
single
power
supply.
RESO
RESO
RESO
RESO
RESO
RESO
RESO
VPP
VPP
Mask
ROM
version,
PROM
version
and flash
memory
version
with dual
power
supply.
11
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
12
P90/TxD0 P90/TxD0 P90/TxD0 P90/TxD0 P90/TxD0 P90/TxD0 P90/TxD0 NC
NC
13
P91/TxD1 P91/TxD1 P91/TxD1 P91/TxD1 P91/TxD1 P91/TxD1 P91/TxD1 NC
NC
14
P92/RxD0 P92/RxD0 P92/RxD0 P92/RxD0 P92/RxD0 P92/RxD0 P92/RxD0 NC
NC
15
P93/RxD1 P93/RxD1 P93/RxD1 P93/RxD1 P93/RxD1 P93/RxD1 P93/RxD1 NC
NC
16
P94/SCK0/ P94/SCK0/ P94/SCK0/ P94/SCK0/ P94/SCK0/ P94/SCK0/ P94/SCK0/ NC
IRQ4
IRQ4
IRQ4
IRQ4
IRQ4
IRQ4
IRQ4
NC
17
P95/SCK1/ P95/SCK1/ P95/SCK1/ P95/SCK1/ P95/SCK1/ P95/SCK1/ P95/SCK1/ NC
IRQ5
IRQ5
IRQ5
IRQ5
IRQ5
IRQ5
IRQ5
NC
18
P40/D0*1
P40/D0*2
P40/D0*1
P40/D0*2
P40/D0*1
P40/D0*1
P40
NC
NC
19
P4 /D *1
P4 /D *2
P4 /D *1
P4 /D *2
P4 /D *1
P4 /D *1
P41
NC
NC
20
P42/D2*1
P42/D2*2
P42/D2*1
P42/D2*2
P42/D2*1
P42/D2*1
P42
NC
NC
21
P4 /D *1
P4 /D *2
P4 /D *1
P4 /D *2
P4 /D *1
P4 /D *1
P43
NC
NC
22
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
1
3
1
3
1
3
1
3
1
3
1
3
1
3
1
3
Rev. 3.00 Sep 27, 2006 page 10 of 872
REJ09B0325-0300
1
3
1
3
1
3
1
3
Section 1 Overview
Pin Name
PROM Mode
Pin
No.
Mode 1
Mode 2
Mode 3
Mode 4
Mode 5
Mode 6
Mode 7
EPROM Flash
23
P44/D4*
P44/D4*
P44/D4*
P44/D4*
P44/D4*
P44/D4*
1
P44
NC
NC
24
P4 /D *1
P4 /D *2
P4 /D *1
P4 /D *2
P4 /D *1
P4 /D *1
P45
NC
NC
25
P46/D6*1
P46/D6*2
P46/D6*1
P46/D6*2
P46/D6*1
P46/D6*1
P46
NC
NC
26
P4 /D *1
P4 /D *2
P4 /D *1
P4 /D *2
P4 /D *1
P4 /D *1
P47
NC
NC
27
D8
D8
D8
D8
D8
D8
P30
EO0
I/O0
28
D9
D9
D9
D9
D9
D9
P31
EO1
I/O1
29
D10
D10
D10
D10
D10
D10
P32
EO2
I/O2
30
D11
D11
D11
D11
D11
D11
P33
EO3
I/O3
31
D12
D12
D12
D12
D12
D12
P34
EO4
I/O4
32
D13
D13
D13
D13
D13
D13
P35
EO5
I/O5
33
D14
D14
D14
D14
D14
D14
P36
EO6
I/O6
34
D15
D15
D15
D15
D15
D15
P37
EO7
I/O7
35
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
36
A0
A0
A0
A0
P10/A0
P10/A0
P10
EA0
A0
37
A1
A1
A1
A1
P11/A1
P11/A1
P11
EA1
A1
38
A2
A2
A2
A2
P12/A2
P12/A2
P12
EA2
A2
39
A3
A3
A3
A3
P13/A3
P13/A3
P13
EA3
A3
40
A4
A4
A4
A4
P14/A4
P14/A4
P14
EA4
A4
41
A5
A5
A5
A5
P15/A5
P15/A5
P15
EA5
A5
42
A6
A6
A6
A6
P16/A6
P16/A6
P16
EA6
A6
43
A7
A7
A7
A7
P17/A7
P17/A7
P17
EA7
A7
44
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
45
A8
A8
A8
A8
P20/A8
P20/A8
P20
EA8
A8
46
A9
A9
A9
A9
P21/A9
P21/A9
P21
OE
OE
47
A10
A10
A10
A10
P22/A10
P22/A10
P22
EA10
A10
48
A11
A11
A11
A11
P23/A11
P23/A11
P23
EA11
A11
49
A12
A12
A12
A12
P24/A12
P24/A12
P24
EA12
A12
50
A13
A13
A13
A13
P25/A13
P25/A13
P25
EA13
A13
51
A14
A14
A14
A14
P26/A14
P26/A14
P26
EA14
A14
52
A15
A15
A15
A15
P27/A15
P27/A15
P27
CE
CE
53
A16
A16
A16
A16
P50/A16
P50/A16
P50
VCC
VCC
54
A17
A17
A17
A17
P51/A17
P51/A17
P51
VCC
VCC
5
7
1
5
7
5
7
2
5
7
5
7
1
5
7
5
7
2
5
7
5
7
1
5
7
5
7
5
7
Remarks
Rev. 3.00 Sep 27, 2006 page 11 of 872
REJ09B0325-0300
Section 1 Overview
Pin Name
PROM Mode
Pin
No.
Mode 1
Mode 2
Mode 3
Mode 4
Mode 5
Mode 6
Mode 7
EPROM Flash
55
A18
A18
A18
A18
P52/A18
P52/A18
P52
NC
56
A19
A19
A19
A19
P53/A19
P53/A19
P53
NC
NC
57
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
58
P60/
WAIT
P60/
WAIT
P60/
WAIT
P60/
WAIT
P60/
WAIT
P60/
WAIT
P60
EA15
A15
59
P61/
BREQ
P61/
BREQ
P61/
BREQ
P61/
BREQ
P61/
BREQ
P61/
BREQ
P61
NC
NC
60
P62/
BACK
P62/
BACK
P62/
BACK
P62/
BACK
P62/
BACK
P62/
BACK
P62
NC
NC
61
φ
φ
φ
φ
φ
φ
φ
NC
NC
62
STBY
STBY
STBY
STBY
STBY
STBY
STBY
VSS
VCC
63
RES
RES
RES
RES
RES
RES
RES
NC
RES
64
NMI
NMI
NMI
NMI
NMI
NMI
NMI
EA9
A9
65
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
66
EXTAL
EXTAL
EXTAL
EXTAL
EXTAL
EXTAL
EXTAL
NC
EXTAL
67
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
XTAL
NC
XTAL
68
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
69
AS
AS
AS
AS
AS
AS
P63
NC
A16
70
RD
RD
RD
RD
RD
RD
P64
NC
NC
71
HWR
HWR
HWR
HWR
HWR
HWR
P65
NC
VCC
72
LWR
LWR
LWR
LWR
LWR
LWR
P66
NC
NC
73
MD0
MD0
MD0
MD0
MD0
MD0
MD0
VSS
VSS
74
MD1
MD1
MD1
MD1
MD1
MD1
MD1
VSS
VSS
75
MD2
MD2
MD2
MD2
MD2
MD2
MD2
VSS
VSS
76
AVCC
AVCC
AVCC
AVCC
AVCC
AVCC
AVCC
VCC
VCC
77
VREF
VREF
VREF
VREF
VREF
VREF
VREF
VCC
VCC
78
P70/AN0
P70/AN0
P70/AN0
P70/AN0
P70/AN0
P70/AN0
P70/AN0
NC
NC
79
P71/AN1
P71/AN1
P71/AN1
P71/AN1
P71/AN1
P71/AN1
P71/AN1
NC
NC
80
P72/AN2
P72/AN2
P72/AN2
P72/AN2
P72/AN2
P72/AN2
P72/AN2
NC
NC
81
P73/AN3
P73/AN3
P73/AN3
P73/AN3
P73/AN3
P73/AN3
P73/AN3
NC
NC
82
P74/AN4
P74/AN4
P74/AN4
P74/AN4
P74/AN4
P74/AN4
P74/AN4
NC
NC
83
P75/AN5
P75/AN5
P75/AN5
P75/AN5
P75/AN5
P75/AN5
P75/AN5
NC
NC
Rev. 3.00 Sep 27, 2006 page 12 of 872
REJ09B0325-0300
NC
Remarks
Section 1 Overview
Pin Name
Pin
No.
PROM Mode
Mode 1
Mode 2
Mode 3
Mode 4
Mode 5
Mode 6
Mode 7
EPROM Flash
84
P76/AN6/
DA0
P76/AN6/
DA0
P76/AN6/
DA0
P76/AN6/
DA0
P76/AN6/
DA0
P76/AN6/
DA0
P76/AN6/
DA0
NC
NC
85
P77/AN7/
DA1
P77/AN7/
DA1
P77/AN7/
DA1
P77/AN7/
DA1
P77/AN7/
DA1
P77/AN7/
DA1
P77/AN7/
DA1
NC
NC
86
AVSS
AVSS
AVSS
AVSS
AVSS
AVSS
AVSS
VSS
VSS
87
P80/
RFSH/
IRQ0
P80/
RFSH/
IRQ0
P80/
RFSH/
IRQ0
P80/
RFSH/
IRQ0
P80/
RFSH/
IRQ0
P80/
RFSH/
IRQ0
P80/IRQ0
EA16
NC
88
P81/CS3/
IRQ1
P81/CS3/
IRQ1
P81/CS3/
IRQ1
P81/CS3/
IRQ1
P81/CS3/
IRQ1
P81/CS3/
IRQ1
P81/IRQ1
PGM
NC
89
P82/CS2/
IRQ2
P82/CS2/
IRQ2
P82/CS2/
IRQ2
P82/CS2/
IRQ2
P82/CS2/
IRQ2
P82/CS2/
IRQ2
P82/IRQ2
NC
VCC
90
P83/CS1/
IRQ3
P83/CS1/
IRQ3
P83/CS1/
IRQ3
P83/CS1/
IRQ3
P83/CS1/
IRQ3
P83/CS1/
IRQ3
P83/IRQ3
NC
WE
91
P84/CS0
P84/CS0
P84/CS0
P84/CS0
P84/CS0
P84/CS0
P84
NC
NC
92
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
93
PA0/TP0/
TEND0/
TCLKA
PA0/TP0/
TEND0/
TCLKA
PA0/TP0/
TEND0/
TCLKA
PA0/TP0/
TEND0/
TCLKA
PA0/TP0/
TEND0/
TCLKA
PA0/TP0/
TEND0/
TCLKA
PA0/TP0/
TEND0/
TCLKA
NC
NC
94
PA1/TP1/
TEND1/
TCLKB
PA1/TP1/
TEND1/
TCLKB
PA1/TP1/
TEND1/
TCLKB
PA1/TP1/
TEND1/
TCLKB
PA1/TP1/
TEND1/
TCLKB
PA1/TP1/
TEND1/
TCLKB
PA1/TP1/
TEND1/
TCLKB
NC
NC
95
PA2/TP2/
TIOCA0/
TCLKC
PA2/TP2/
TIOCA0/
TCLKC
PA2/TP2/
TIOCA0/
TCLKC
PA2/TP2/
TIOCA0/
TCLKC
PA2/TP2/
TIOCA0/
TCLKC
PA2/TP2/
TIOCA0/
TCLKC
PA2/TP2/
TIOCA0/
TCLKC
NC
NC
96
PA3/TP3/
TIOCB0/
TCLKD
PA3/TP3/
TIOCB0/
TCLKD
PA3/TP3/
TIOCB0/
TCLKD
PA3/TP3/
TIOCB0/
TCLKD
PA3/TP3/
TIOCB0/
TCLKD
PA3/TP3/
TIOCB0/
TCLKD
PA3/TP3/
TIOCB0/
TCLKD
NC
NC
97
PA4/TP4/
TIOCA1/
CS6
PA4/TP4/
TIOCA1/
CS6
PA4/TP4/
TIOCA1/
CS6
PA4/TP4/
TIOCA1/
CS6
PA4/TP4/
TIOCA1/
CS6
PA4/TP4/
TIOCA1/
A23/CS6
PA4/TP4/
TIOCA1
NC
NC
98
PA5/TP5/
TIOCB1/
CS5
PA5/TP5/
TIOCB1/
CS5
PA5/TP5/
TIOCB1/
CS5
PA5/TP5/
TIOCB1/
CS5
PA5/TP5/
TIOCB1/
CS5
PA5/TP5/
TIOCB1/
A22/CS5
PA5/TP5/
TIOCB1
NC
NC
99
PA6/TP6/
TIOCA2/
CS4
PA6/TP6/
TIOCA2/
CS4
PA6/TP6/
TIOCA2/
CS4
PA6/TP6/
TIOCA2/
CS4
PA6/TP6/
TIOCA2/
CS4
PA6/TP6/
TIOCA2/
A21/CS4
PA6/TP6/
TIOCA2
NC
NC
100
PA7/TP7/
TIOCB2
PA7/TP7/
TIOCB2
A20
A20
PA7/TP7/
TIOCB2
A20
PA7/TP7/
TIOCB2
NC
NC
Remarks
Rev. 3.00 Sep 27, 2006 page 13 of 872
REJ09B0325-0300
Section 1 Overview
Notes: Pins marked NC should be left unconnected.
For details on PROM mode see section 18, ROM (H8/3048F-ONE: Single Power Supply,
H8/3048B Mask ROM Version).
1. In modes 1, 3, 5, and 6 the P40 to P47 functions of pins P40/D0 to P47/D7 are selected
after a reset, but they can be changed by software.
2. In modes 2 and 4 the D0 to D7 functions of pins P40/D0 to P47/D7 are selected after a
reset, but they can be changed by software.
3. For the H8/3048B Group which operates at 5 V, this pin is also used as the VCL terminal,
and for those at 3 V, VCC terminal. For the H8/3048 ZTAT version, H8/3048F version,
H8/3048 mask ROM version, H8/3047 mask ROM version, H8/3045 mask ROM
version, and H8/3044 mask ROM version, this pin is also used as the VCC terminal.
4. This pin functions as the FWE pin on the single power supply on-chip flash memory
version. Under no circumstances should 12 V be applied to the single power supply onchip flash memory version (H8/3048F-ONE), or to H8/3048 Group or H8/3048B Group
mask ROM products. Doing so will destroy the chip. This pin functions as an overview
control signal in modes 5, 6, and 7. The pin functions as the RESO pin in on-chip mask
ROM versions, on-chip PROM versions, and dual power supply flash memory versions.
Rev. 3.00 Sep 27, 2006 page 14 of 872
REJ09B0325-0300
Section 1 Overview
1.3.3
Pin Functions
Table 1.4 summarizes the pin functions. For the H8/3048B Group which operates at 5 V, the
external capacitor is required for the VCL pin.
Table 1.4
Pin Functions
Type
Symbol
Pin No.
I/O
Name and Function
Power
VCC
1* , 35, 68
Input
Power: For connection to the power supply.
Connect all VCC pins to the system power
supply.
VSS
11, 22, 44,
57, 65, 92
Input
Ground: For connection to ground (0 V).
Connect all VSS pins to the 0-V system
power supply.
VCL
1*
Output
The external capacitor must be connected
between the VCL and GND (0 V). Do not
connect to VCC.
Internal stepdown pin
1
2
VCL
0.1 µF
Clock
XTAL
67
Input
For connection to a crystal resonator.
For examples of crystal resonator and
external clock input, see section 19, Clock
Pulse Generator.
EXTAL
66
Input
For connection to a crystal resonator or
input of an external clock signal. For
examples of crystal resonator and external
clock input, see section 19, Clock Pulse
Generator.
φ
61
Output
System clock: Supplies the system clock
to external devices.
Rev. 3.00 Sep 27, 2006 page 15 of 872
REJ09B0325-0300
Section 1 Overview
Type
Symbol
Operating mode MD2 to MD0
control
System control
Pin No.
I/O
Name and Function
75 to 73
Input
Mode 2 to mode 0: For setting the
operating mode, as follows. Inputs at these
pins must not be changed during operation.
MD2
MD1
MD0
Operating Mode
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
—
Mode 1
Mode 2
Mode 3
Mode 4
Mode 5
Mode 6
Mode 7
RES
63
Input
Reset input: When driven low, this pin
resets the chip
RESO
10
Output
Reset output: For the mask ROM version,
outputs a reset signal to external devices
Also used as a power supply for on-board
programming of the flash memory version
with dual power supply.
(RESO/VPP)
3
FWE*
10
Input
Write enable signal: Write-control signal
for writing to flash memory for the flash
memory version with single power supply
STBY
62
Input
Standby: When driven low, this pin forces a
transition to hardware standby mode
BREQ
59
Input
Bus request: Used by an external bus
master to request the bus right
BACK
60
Output
Bus request acknowledge: Indicates that
the bus has been granted to an external bus
master
NMI
64
Input
Nonmaskable interrupt: Requests a
nonmaskable interrupt
IRQ5 to
IRQ0
17, 16,
90 to 87
Input
Interrupt request 5 to 0: Maskable
interrupt request pins
Address bus
A23 to A0
97 to 100,
56 to 45,
43 to 36
Output
Address bus: Outputs address signals
Data bus
D15 to D0
34 to 23,
21 to 18
Input/
output
Data bus: Bidirectional data bus
Interrupts
Rev. 3.00 Sep 27, 2006 page 16 of 872
REJ09B0325-0300
Section 1 Overview
Type
Symbol
Pin No.
I/O
Name and Function
Bus control
CS7 to CS0
8, 97 to 99,
88 to 91
Output
Chip select: Select signals for areas 7 to 0
AS
69
Output
Address strobe: Goes low to indicate valid
address output on the address bus
RD
70
Output
Read: Goes low to indicate reading from
the external address space
HWR
71
Output
High write: Goes low to indicate writing to
the external address space; indicates valid
data on the upper data bus (D15 to D8).
LWR
72
Output
Low write: Goes low to indicate writing to
the external address space; indicates valid
data on the lower data bus (D7 to D0).
WAIT
58
Input
Wait: Requests insertion of wait states in
bus cycles during access to the external
address space
Refresh
controller
RFSH
87
Output
Refresh: Indicates a refresh cycle
CS3
88
Output
Row address strobe RAS:
RAS Row address
strobe signal for DRAM connected to area 3
RD
70
Output
Column address strobe CAS:
CAS Column
address strobe signal for DRAM connected
to area 3; used with 2WE DRAM.
Write enable WE:
WE Write enable signal for
DRAM connected to area 3; used with
2CAS DRAM.
HWR
71
Output
Upper write UW:
UW Write enable signal for
DRAM connected to area 3; used with 2WE
DRAM.
Upper column address strobe UCAS:
UCAS
Column address strobe signal for DRAM
connected to area 3; used with 2CAS
DRAM.
LWR
72
Output
Lower write LW:
LW Write enable signal for
DRAM connected to area 3; used with 2WE
DRAM.
Lower column address strobe LCAS:
LCAS
Column address strobe signal for DRAM
connected to area 3; used with 2CAS
DRAM.
Rev. 3.00 Sep 27, 2006 page 17 of 872
REJ09B0325-0300
Section 1 Overview
Type
Symbol
Pin No.
I/O
Name and Function
DMA controller
(DMAC)
DREQ1,
DREQ0
9, 8
Input
DMA request 1 and 0: DMAC activation
requests
TEND1,
TEND0
94, 93
Output
Transfer end 1 and 0: These signals
indicate that the DMAC has ended a data
transfer
16-bit integrated TCLKD to
timer unit (ITU) TCLKA
96 to 93
Input
Clock input D to A: External clock inputs
TIOCA4 to
TIOCA0
4, 2, 99,
97, 95
Input/
output
Input capture/output compare A4 to A0:
GRA4 to GRA0 output compare or input
capture, or PWM output
TIOCB4 to
TIOCB0
5, 3, 100,
98, 96
Input/
output
Input capture/output compare B4 to B0:
GRB4 to GRB0 output compare or input
capture
TOCXA4
6
Output
Output compare XA4: PWM output
TOCXB4
7
Output
Output compare XB4: PWM output
Programmable TP15 to TP0
timing pattern
controller (TPC)
9 to 2,
100 to 93
Output
TPC output 15 to 0: Pulse output
Serial
communication
interface (SCI)
TxD1, TxD0
13, 12
Output
Transmit data (channels 0 and 1):
SCI data output
RxD1, RxD0
15, 14
Input
Receive data (channels 0 and 1):
SCI data input
Input/
output
Serial clock (channels 0 and 1):
SCI clock input/output
SCK1, SCK0 17, 16
A/D converter
AN7 to AN0
85 to 78
Input
Analog 7 to 0: Analog input pins
ADTRG
9
Input
A/D trigger: External trigger input for
starting A/D conversion
D/A converter
DA1, DA0
85, 84
Output
Analog output: Analog output from the D/A
converter
A/D and D/A
converters
AVCC
76
Input
Power supply pin for the A/D and D/A
converters. Connect to the system power
supply (VCC) when not using the A/D and
D/A converters.
AVSS
86
Input
Ground pin for the A/D and D/A converters.
Connect to system ground (VSS).
Rev. 3.00 Sep 27, 2006 page 18 of 872
REJ09B0325-0300
Section 1 Overview
Type
Symbol
Pin No.
I/O
Name and Function
A/D and D/A
converters
VREF
77
Input
Reference voltage input pin for the A/D and
D/A converters. Connect to the system
power supply (VCC) when not using the A/D
and D/A converters.
I/O ports
P17 to P10
43 to 36
Input/
output
Port 1: Eight input/output pins.
The direction of each pin can be selected in
the port 1 data direction register (P1DDR).
P27 to P20
52 to 45
Input/
output
Port 2: Eight input/output pins.
The direction of each pin can be selected in
the port 2 data direction register (P2DDR).
P37 to P30
34 to 27
Input/
output
Port 3: Eight input/output pins.
The direction of each pin can be selected in
the port 3 data direction register (P3DDR).
P47 to P40
26 to 23,
21 to 18
Input/
output
Port 4: Eight input/output pins.
The direction of each pin can be selected in
the port 4 data direction register (P4DDR).
P53 to P50
56 to 53
Input/
output
Port 5: Four input/output pins. The direction
of each pin can be selected in the port 5
data direction register (P5DDR).
P66 to P60
72 to 69,
60 to 58
Input/
output
Port 6: Seven input/output pins. The
direction of each pin can be selected in the
port 6 data direction register (P6DDR).
P77 to P70
85 to 78
Input
Port 7: Eight input pins
P84 to P80
91 to 87
Input/
output
Port 8: Five input/output pins. The direction
of each pin can be selected in the port 8
data direction register (P8DDR).
P95 to P90
17 to 12
Input/
output
Port 9: Six input/output pins. The direction
of each pin can be selected in the port 9
data direction register (P9DDR).
PA7 to PA0
100 to 93
Input/
output
Port A: Eight input/output pins. The
direction of each pin can be selected in the
port A data direction register (PADDR).
PB7 to PB0
9 to 2
Input/
output
Port B: Eight input/output pins. The
direction of each pin can be selected in the
port B data direction register (PBDDR).
Notes: 1. For H8/3048 Group products and H8/3048B Group models operating at 3 V.
2. For the H8/3048B Group which operates at 5 V.
3. Do NOT apply 12 V to the H8/3048B Group as the chip will be destroyed.
Rev. 3.00 Sep 27, 2006 page 19 of 872
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Section 1 Overview
1.4
Notes on H8/3048F-ONE (Single Power Supply)
There are two models of the H8/3048F-ZTAT with on-chip flash memory: a dual power supply
model (H8/3048F) and single power supply model (H8/3048F-ONE). Points to be noted when
using the single power supply H8/3048F-ONE are given below.
1.4.1
Voltage Application
12 V must not be applied to the H8/3048F-ONE (single power supply), as this will permanently
damage the device.
The flash memory programming power source for the H8/3048F-ONE (single power supply) is
VCC.
The programming power source for the dual power supply model was the VPP pin (12 V), but there
is no VPP pin in the single power supply models. In the H8/3048F-ONE the FWE pin is provided at
the same pin position as the VPP pin in the dual power supply model, but FWE is not a power
source pin-it is used to control flash memory write enabling.
Also, in boot mode, 12 V must be applied to the MD2 pin in the dual power supply model, but this
is not necessary in the H8/3048F-ONE (single power supply).
The maximum rating of the FWE and MD2 pins in the H8/3048F-ONE (single power supply) is
VCC +0.3 V. Applying a voltage in excess of the maximum rating will permanently damage the
device.
Do not select the HN28F101 programmer setting for the H8/3048F-ONE (single power supply). If
this setting is made by mistake, 12.0 V may be applied to the FWE pin, causing permanent
damage to the device.
When using a PROM programmer to program the on-chip flash memory in the H8/3048F-ONE
model (single power supply), use a PROM programmer that supports Renesas Technology
microcomputer device types with 128-kbyte on-chip flash memory.
Rev. 3.00 Sep 27, 2006 page 20 of 872
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Section 1 Overview
1.4.2
Product Type Names and Markings
Table 1.5 shows examples of product type names and markings for the H8/3048F (dual power
supply model), H8/3048F-ONE (single power supply), and the differences in flash memory
programming power source.
Table 1.5
Differences in H8/3048F and H8/3048F-ONE
Product type
name
Dual Power Supply
Model: H8/3048F
Single Power Supply Model: H8/3048F-ONE
HD64F3048F16
HD64F3048BF25
Sample
markings
H8/3048
3J1
HD
64F3048F16
64F3048F25
64F3048VF25
H8/3048F-ONE
H8/3048F-ONE
PGM 5.0
PGM 3.3
B
0021
BK80090
Flash memory VPP power source
programming (12.0 ±0.6 V)
power source
1.4.3
HD64F3048BVF25
B
0021
BK80090
VCC power source
(5.0 ±10%)
VCC power source
(3.0 to 3.6 V)
Differences between H8/3048F and H8/3048F-ONE
Table 1.6 shows the differences between the H8/3048F (dual power supply model) and H8/3048FONE (single power supply model).
Rev. 3.00 Sep 27, 2006 page 21 of 872
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Section 1 Overview
Table 1.6
Differences between H8/3048F and H8/3048F-ONE
Item
Pin
specifications
Models with Dual Power Supply:
1
H8/3048F*
Models with Single Power Supply:
H8/3048F-ONE
Pin 1: VCC
Pin 1: VCL (when a model which
operates at 5 V is used)
Connected to VSS with 0.1 µF externally
applied. Pin 1 becomes VCC when a
model which operates at 3 V is used.
Pin 10: VPP/RESO
Pin 10: FWE
ROM/RAM
128-kbyte flash memory with dual
power supply, RAM: 4 kbytes
128-kbyte flash memory with single
power supply, RAM: 4 kbytes
Units of onboard writing
Writing in 1-byte units
Writing in 128-byte units
Write/erase
voltage
12 V is externally applied from VPP pin
Application of 12 V is not required.
VCC single power supply
VPP pin functions Multiplexes with RESO
FWE function only (no RESO function)
Boot mode
settings
FWE = 1
RESO = 12 V
MD2
MD1
12 V
0
12 V
1
12 V
1
Cancelled by reset
Mode 5
Mode 6
Mode 7
Settings for
user program
mode
MD0
1
0
1
RESO = 12 V
MD2
MD1
1
0
1
1
1
1
Cancelled by reset
Mode 5
Mode 6
Mode 7
MD2
MD1
0
0
0
1
0
1
Set to mode 1 in mode 5
Set to mode 2 in mode 6
Set to mode 3 in mode 7
Cancelled by reset
Mode 5
Mode 6
Mode 7
MD0
1
0
1
FWE = 1
MD0
1
0
1
MD2
MD1
1
0
1
1
1
1
Cancelled by reset
Mode 5
Mode 6
Mode 7
MD0
1
0
1
Prewrite
processing
Necessary before erasing
Not necessary
Erasing blocks
More than one block can be erased at
the same time (verifies in block units
and erases only the unerased blocks)
Erases in one block units. More than
one block cannot be erased at the same
time (the erasing flow is different)
Rev. 3.00 Sep 27, 2006 page 22 of 872
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Section 1 Overview
Item
Models with Dual Power Supply:
1
H8/3048F*
Models with Single Power Supply:
H8/3048F-ONE
Write
processing
Before writing, sets the block with the
address to be written to EBR1/EBR2
No setting
FLMCR
FLMCR (H'FF40)
FLMCR1 (H'FF40)
VPP VPPE


EV
PV
E
P
FWE SWE ESU PSU
EV
PV
E
P




FLMCR2 (H'FF41)
FLER
EBR
LB6
LB5


EBR (H'FF42)
EBR1 (H'FF42)
LB7

LB4
LB3
LB2
LB1
LB0
EBR2 (H'FF43)
SB7 SB6 SB5 SB4 SB3 SB2 SB1 SB0
EB7 EB6 EB5 EB4 EB3 EB2 EB1 EB0
Only one block can be selected(setting
for erasing)
More than one block can be selected
(setting for writing/erasing)
RAMCR
RAMCR (H'FF48)
FLER
Division of
flash memory
block



RAMCR (H'FF47)
RAMS RAM2 RAM1 RAM0
Division in 16 blocks
16 kbytes × 7: LB0 to LB6
12 kbytes × 1: LB7
512 kbytes × 8: SB0 to SB7
Flash memory
LB0 (16 kbytes)
LB1 (16 kbytes)
LB2 (16 kbytes)
LB3 (16 kbytes)
LB4 (16 kbytes)
LB5 (16 kbytes)
LB6 (16 kbytes)
LB7 (12 kbytes)
SB0 (512 bytes)
SB1 (512 bytes)
SB2 (512 bytes)
SB3 (512 bytes)
SB4 (512 bytes)
SB5 (512 bytes)
SB6 (512 bytes)
SB7 (512 bytes)



 RAMS RAM2 RAM1 —
Division in 8 blocks
1 kbyte × 4: EB0 to EB3
28 kbytes × 1: EB4
32 kbytes × 3: EB5 to EB7
Flash memory
H'00000
H'00000
EB0 (1 kbyte)
EB1 (1 kbyte)
EB2 (1 kbyte)
EB3 (1 kbyte)
EB4 (28 kbytes)
EB5 (32 kbytes)
EB6 (32 kbytes)
EB7 (32 kbytes)
H'1FFFF
H'1FFFF
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Section 1 Overview
Item
Models with Dual Power Supply:
1
H8/3048F*
Division of RAM
emulation block
On-chip RAM
Flash memory
H'EF10
Models with Single Power Supply:
H8/3048F-ONE
On-chip RAM
Flash memory
H'00000
H'F000
H'F1FF
H'EF10
H'00000
H'00400
H'F000
H'00800
H'00C00
H'1EFFF
H'1F000
H'F3FF
H'01000
H'1F200
H'1F400
H'FF0F
H'1F600
H'FF0F
H'1F800
H'1FA00
H'1FC00
H'1FE00
H'1FFFF
H'1FFFF
Reset during
operation
The RES signal must be kept low during The RES signal must be kept low during
at least 6 system clock (6φ) cycles.
at least 20 system clock (20φ) cycles.
(RES pulse width tRESW = min. 6.0 tcyc)
(RES pulse width tRESW = min. 20 tcyc)
A/D ADCR
ADCR (H'FFE9)
ADCR (H'FFE9)
Initial value: H'7F
Initial value: H'7E
Only bit 7 can be read or written.
Only bit 7 can be read or written.
Other bits are reserved and always read Bit 0 is reserved and must not be set to
1.
as 1; writing to these bits is invalid.
Other bits are reserved and always read
as 1; writing to these bits is invalid.
WDT RSTCSR
RSTCSR (H'FFAB)
RSTCSR (H'FFAB)
Initial value: H'3F
Initial value: H'3F
Only bits 7 and 6 can be read or written. Only bit 7 can be read or written.
Other bits are reserved and always read Bit 6 is reserved and must not be set to
1.
as 1; writing to these bits is invalid.
Other bits are reserved and always read
as 1; writing to these bits is invalid.
Rev. 3.00 Sep 27, 2006 page 24 of 872
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Section 1 Overview
Item
Clock oscillator
settling time
(SYSCR STS2
to STS0)
Models with Dual Power Supply:
1
H8/3048F*
Models with Single Power Supply:
H8/3048F-ONE
Setting of standby timer select
bits 2 to 0
Setting of standby timer select
bits 2 to 0
STS2 STS1 STS0
0
1
Description
0
0
8,192 states
1
1
0
16,384 states
32,768 states
1
65,536 states
0
131,072 states
1
1,024 states
Illegal setting
0
1

STS2
STS1
STS0
0
0
0
8,192 states
1
1
0
16,384 states
32,768 states
1
65,536 states
0
131,072 states
1
262,144 states
0
1
1,024 states
Illegal setting
1
0
1
Description
Details on flash Refer to section 19, Flash Memory
memory
(H8/3048F, Dual Power Supply).
Refer to section 18, ROM (H8/3048FONE: Single Power Supply, H8/3048B
Mask ROM Version)
Electrical
characteristics
(clock rate)
Clock rate: 1 to 16 MHz
Clock rate: 2 to 25 MHz
Refer to section 22, Table 22.1
Electrical Characteristics of H8/3048
2
Group Products.*
Refer to section 21, Table 21.1
Electrical Characteristics of H8/3048
Group and H8/3048B Group Products.
List of registers Refer to appendix B, Table B.1
Comparison of H8/3048 Group Internal
2
I/O Register Specifications*
On-chip
emulator
Refer to appendix B, Table B.1
Comparison of H8/3048 Group Internal
2
I/O Register Specifications*
Refer to appendix B.2, Addresses
(For H8/3048F, H8/3048ZTAT,
H8/3048 Mask-ROM, H8/3047 MaskROM, H8/3045 Mask-ROM, and
2
H8/3044 Mask-ROM Versions)*
Refer to appendix B.1, Addresses
(For H8/3048F-ONE, H8/3048B Mask
2
ROM Version)*
—
On-chip emulator (E10T)
Notes: 1. Refer to the “H8/3048 Group, H8/3048F-ZTAT™ Hardware Manual” for information
about H8/3048F.
2. H8/3048F and H8/3048F-ONE can be referred to also on this manual.
Rev. 3.00 Sep 27, 2006 page 25 of 872
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Section 1 Overview
1.4.4
VCL Pin
The H8/3048B Group 5 V operation models have a VCL (internal step-down) pin, to which a 0.1 µF
internal voltage stabilization capacitor must be connected.
The method of connecting the external capacitor is shown in figure 1.4.
Do not connect the VCC power supply to the VCL pin. (Connect the VCC power supply to other VCC
pins as usual.) Note that the VCL output pin occupies the same location as a VCC pin in the
H8/3048F, H8/3048ZTAT and on-chip mask ROM models (H8/3048, H8/3047, H8/3045, and
H8/3044).
VCC power
supply
External
capacitor
0.1 µF
VCL (Pin 1)
VCC (Pin 1)
H8/3048B Group
(5 V operation model)
H8/3048B Group (3 V operation model)
H8/3048 Group
Do not connect the VCC power supply to
the VCL pin. (Connect the VCC power
supply to other VCC pins as usual.)
Place the capacitor close to the pin.
These versions have a VCC power supply
pin in the same pin position as a VCC pin in
the H8/3048F-ONE.
Figure 1.4 Method of Connecting H8/3048B Group VCL Capacitor
The 3 V operation models of the H8/3048B Group do not have a VCL pin. The 3 V operation
models have a VCC power supply pin at the location of the VCL pin in the 5 V operation models.
Therefore, 3 V operation models do not require connection of an external capacitor, and this pin
should be connected to the power supply in the same way as other VCC pins.
Rev. 3.00 Sep 27, 2006 page 26 of 872
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Section 1 Overview
VCC power
supply
External
capacitor
VCL
VCC
0.1 µF
3 V operation model
5 V operation model
Figure 1.5 Difference between 5 V and 3 V Operation Models
1.4.5
Note on Changeover to H8/3048 Group Mask ROM Version
Care is required when changing from the H8/3048F-ONE with on-chip flash memory to a model
with on-chip H8/3048 Group mask ROM (H8/3048, H8/3047, H8/3045, or H8/3044).
An external capacitor must be connected to the VCL pin of the H8/3048F-ONE (5 V model). This
VCL pin occupies the same location as a VCC pin in the on-chip mask ROM versions. Changeover to
a mask ROM version must therefore be taken into account when undertaking pattern design, etc.,
in the board design stage.
H8/3048F-ONE
(5 V operation model)
VCC power
supply
VCC pin
VCL pin
← Land pattern for mask ROM version
(0 Ω resistance mounted)
← Land pattern for H8/3048F-ONE
(5 V operation model)
(0.1 µF capacitor mounted)
Figure 1.6 Example of Board Pattern Providing for External Capacitor
Rev. 3.00 Sep 27, 2006 page 27 of 872
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Section 1 Overview
1.5
Setting Oscillation Settling Wait Time
When software standby mode is used, after exiting software standby mode a wait period must be
provided to allow the clock to stabilize. Select the length of time for which the CPU and
peripheral functions are to wait by setting bits STS2 to STS0 in the system control register
(SYSCR) and bits DIV1 and DIV0 in the division ratio control register (DIVCR) according to the
operating frequency of the chip.
For the H8/3048B Group, ensure that the oscillation settling wait time is at least 0.1 ms when
operating on an external clock.
For setting details, see section 20.4.3, Selection of Waiting Time for Exit from Software Standby
Mode.
1.6
Notes on Crystal Resonator Connection
The H8/3048B Group support an operating frequency of up to 25 MHz. If a crystal resonator with
a frequency higher than 20 MHz is connected, attention must be paid to circuit constants such as
external load capacitance values. For details see section 19.2.1, Connecting a Crystal Resonator.
Rev. 3.00 Sep 27, 2006 page 28 of 872
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Section 2 CPU
Section 2 CPU
2.1
Overview
The H8/300H CPU is a high-speed central processing unit with an internal 32-bit architecture that
is upward-compatible with the H8/300 CPU. The H8/300H CPU has sixteen 16-bit general
registers, can address a 16-Mbyte linear address space, and is ideal for realtime control.
2.1.1
Features
The H8/300H CPU has the following features.
• Upward compatibility with H8/300 CPU
Can execute H8/300 Series object programs
• General-register architecture
Sixteen 16-bit general registers (also usable as sixteen 8-bit registers or eight 32-bit registers)
• Sixty-two basic instructions
 8/16/32-bit data transfer and arithmetic and logic instructions
 Multiply and divide instructions
 Powerful bit-manipulation instructions
• Eight addressing modes
 Register direct [Rn]
 Register indirect [@ERn]
 Register indirect with displacement [@(d:16, ERn) or @(d:24, ERn)]
 Register indirect with post-increment or pre-decrement [@ERn+ or @–ERn]
 Absolute address [@aa:8, @aa:16, or @aa:24]
 Immediate [#xx:8, #xx:16, or #xx:32]
 Program-counter relative [@(d:8, PC) or @(d:16, PC)]
 Memory indirect [@@aa:8]
• 16-Mbyte linear address space
• High-speed operation
 All frequently-used instructions execute in two to four states
 Maximum clock frequency:
25 MHz (H8/3048B Group)
 8/16/32-bit register-register add/subtract: 80 ns @ 25 MHz/125 ns @ 16 MHz
 8 × 8-bit register-register multiply:
560 ns @ 25 MHz/875 ns @ 16 MHz
 16 ÷ 8-bit register-register divide:
560 ns @ 25 MHz/875 ns @ 16 MHz
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Section 2 CPU
 16 × 16-bit register-register multiply:
880 ns @ 25 MHz/1,375 ns @ 16 MHz
 32 ÷ 16-bit register-register divide:
880 ns @ 25 MHz/1,375 ns @ 16 MHz
• Two CPU operating modes
 Normal mode (not available in the H8/3048B Group)
 Advanced mode
• Low-power mode
Transition to power-down state by SLEEP instruction
2.1.2
Differences from H8/300 CPU
In comparison to the H8/300 CPU, the H8/300H has the following enhancements.
• More general registers
Eight 16-bit registers have been added.
• Expanded address space
 Advanced mode supports a maximum 16-Mbyte address space.
 Normal mode supports the same 64-kbyte address space as the H8/300 CPU.
(Normal mode is not available in the H8/3048B Group.)
• Enhanced addressing
The addressing modes have been enhanced to make effective use of the 16-Mbyte address
space.
• Enhanced instructions
 Data transfer, arithmetic, and logic instructions can operate on 32-bit data.
 Signed multiply/divide instructions and other instructions have been added.
Rev. 3.00 Sep 27, 2006 page 30 of 872
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Section 2 CPU
2.2
CPU Operating Modes
The H8/300H CPU has two operating modes: normal and advanced. Normal mode supports a
maximum 64-kbyte address space. Advanced mode supports up to 16 Mbytes. See figure 2.1.
The H8/3048B Group can be used only in advanced mode. (Information from this point on will
apply to advanced mode unless otherwise stated.)
Normal mode
Maximum 64 kbytes, program
and data areas combined
Advanced mode
Maximum 16 Mbytes, program
and data areas combined
CPU operating modes
Figure 2.1 CPU Operating Modes
Rev. 3.00 Sep 27, 2006 page 31 of 872
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Section 2 CPU
2.3
Address Space
The maximum address space of the H8/300H CPU is 16 Mbytes. The H8/3048B Group has
various operating modes (MCU modes), some providing a 1-Mbyte address space, the others
supporting the full 16 Mbytes.
Figure 2.2 shows the address ranges of the H8/3048B Group. For further details see section 3.6,
Memory Map in Each Operating Mode.
The 1-Mbyte operating modes use 20-bit addressing. The upper 4 bits of effective addresses are
ignored.
H'00000
H'000000
H'FFFFF
H'FFFFFF
a. 1-Mbyte modes
b. 16-Mbyte modes
Figure 2.2 Memory Map
Rev. 3.00 Sep 27, 2006 page 32 of 872
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Section 2 CPU
2.4
Register Configuration
2.4.1
Overview
The H8/300H CPU has the internal registers shown in figure 2.3. There are two types of registers:
general registers and control registers.
General Registers (ERn)
15
0 7
0 7
0
ER0
E0
R0H
R0L
ER1
E1
R1H
R1L
ER2
E2
R2H
R2L
ER3
E3
R3H
R3L
ER4
E4
R4H
R4L
ER5
E5
R5H
R5L
ER6
E6
R6H
R6L
ER7
E7
R7H
R7L
(SP)
Control Registers (CR)
23
0
PC
7 6 5 4 3 2 1 0
CCR I UI H U N Z V C
Legend:
SP: Stack pointer
PC: Program counter
CCR: Condition code register
Interrupt mask bit
I:
User bit or interrupt mask bit
UI:
Half-carry flag
H:
User bit
U:
Negative flag
N:
Zero flag
Z:
Overflow flag
V:
Carry flag
C:
Figure 2.3 CPU Internal Registers
Rev. 3.00 Sep 27, 2006 page 33 of 872
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Section 2 CPU
2.4.2
General Registers
The H8/300H CPU has eight 32-bit general registers. These general registers are all functionally
alike and can be used without distinction between data registers and address registers. When a
general register is used as a data register, it can be accessed as a 32-bit, 16-bit, or 8-bit register.
When the general registers are used as 32-bit registers or as address registers, they are designated
by the letters ER (ER0 to ER7).
The ER registers divide into 16-bit general registers designated by the letters E (E0 to E7) and R
(R0 to R7). These registers are functionally equivalent, providing a maximum sixteen 16-bit
registers. The E registers (E0 to E7) are also referred to as extended registers.
The R registers divide into 8-bit general registers designated by the letters RH (R0H to R7H) and
RL (R0L to R7L). These registers are functionally equivalent, providing a maximum sixteen 8-bit
registers.
Figure 2.4 illustrates the usage of the general registers. The usage of each register can be selected
independently.
• Address registers
• 32-bit registers
• 16-bit registers
• 8-bit registers
E registers
(extended registers)
E0 to E7
RH registers
R0H to R7H
ER registers
ER0 to ER7
R registers
R0 to R7
RL registers
R0L to R7L
Figure 2.4 Usage of General Registers
Rev. 3.00 Sep 27, 2006 page 34 of 872
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Section 2 CPU
General register ER7 has the function of stack pointer (SP) in addition to its general-register
function, and is used implicitly in exception handling and subroutine calls. Figure 2.5 shows the
stack.
Free area
SP (ER7)
Stack area
Figure 2.5 Stack
2.4.3
Control Registers
The control registers are the 24-bit program counter (PC) and the 8-bit condition code register
(CCR).
Program Counter (PC)
This 24-bit counter indicates the address of the next instruction the CPU will execute. The length
of all CPU instructions is 2 bytes (one word) or a multiple of 2 bytes, so the least significant PC
bit is ignored. When an instruction is fetched, the least significant PC bit is regarded as 0.
Condition Code Register (CCR)
This 8-bit register contains internal CPU status information, including the interrupt mask bit (I)
and half-carry (H), negative (N), zero (Z), overflow (V), and carry (C) flags.
• Bit 7—Interrupt Mask Bit (I): Masks interrupts other than NMI when set to 1. NMI is
accepted regardless of the I bit setting. The I bit is set to 1 at the start of an exception-handling
sequence.
• Bit 6—User Bit or Interrupt Mask Bit (UI): Can be written and read by software using the
LDC, STC, ANDC, ORC, and XORC instructions. This bit can also be used as an interrupt
mask bit. For details see section 5, Interrupt Controller.
• Bit 5—Half-Carry Flag (H): When the ADD.B, ADDX.B, SUB.B, SUBX.B, CMP.B, or
NEG.B instruction is executed, this flag is set to 1 if there is a carry or borrow at bit 3, and
cleared to 0 otherwise. When the ADD.W, SUB.W, CMP.W, or NEG.W instruction is
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Section 2 CPU
executed, the H flag is set to 1 if there is a carry or borrow at bit 11, and cleared to 0 otherwise.
When the ADD.L, SUB.L, CMP.L, or NEG.L instruction is executed, the H flag is set to 1 if
there is a carry or borrow at bit 27, and cleared to 0 otherwise.
• Bit 4—User Bit (U): Can be written and read by software using the LDC, STC, ANDC, ORC,
and XORC instructions.
• Bit 3—Negative Flag (N): Indicates the most significant bit (sign bit) of data.
• Bit 2—Zero Flag (Z): Set to 1 to indicate zero data, and cleared to 0 to indicate non-zero data.
• Bit 1—Overflow Flag (V): Set to 1 when an arithmetic overflow occurs, and cleared to 0 at
other times.
• Bit 0—Carry Flag (C): Set to 1 when a carry occurs, and cleared to 0 otherwise. Used by:
 Add instructions, to indicate a carry
 Subtract instructions, to indicate a borrow
 Shift and rotate instructions, to store the value shifted out of the end bit
The carry flag is also used as a bit accumulator by bit manipulation instructions.
Some instructions leave flag bits unchanged. Operations can be performed on CCR by the LDC,
STC, ANDC, ORC, and XORC instructions. The N, Z, V, and C flags are used by conditional
branch (Bcc) instructions.
For the action of each instruction on the flag bits, see appendix A.1, Instruction List. For the I and
UI bits, see section 5, Interrupt Controller.
2.4.4
Initial CPU Register Values
In reset exception handling, PC is initialized to a value loaded from the vector table, and the I bit
in CCR is set to 1. The other CCR bits and the general registers are not initialized. In particular,
the stack pointer (ER7) is not initialized. The stack pointer must therefore be initialized by an
MOV.L instruction executed immediately after a reset.
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Section 2 CPU
2.5
Data Formats
The H8/300H CPU can process 1-bit, 4-bit (BCD), 8-bit (byte), 16-bit (word), and 32-bit
(longword) data. Bit-manipulation instructions operate on 1-bit data by accessing bit n (n = 0, 1,
2, …, 7) of byte operand data. The DAA and DAS decimal-adjust instructions treat byte data as
two digits of 4-bit BCD data.
2.5.1
General Register Data Formats
Figures 2.6 and 2.7 show the data formats in general registers.
Data Type
General
Register
1-bit data
RnH
7 6 5 4 3 2 1 0
1-bit data
RnL
Don’t care
4-bit BCD data
RnH
Upper digit Lower digit
4-bit BCD data
RnL
Don’t care
Byte data
RnH
Data Format
7
0
Don’t care
7
7
4 3
0
Don’t care
7
7
RnL
4 3
0
Upper digit Lower digit
0
Don’t care
MSB
Byte data
0
7 6 5 4 3 2 1 0
LSB
7
0
MSB
LSB
Don’t care
Figure 2.6 General Register Data Formats (1)
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Section 2 CPU
Data Type
General
Register
Word data
Rn
Word data
Data Format
15
0
MSB
LSB
15
0
MSB
LSB
En
31
16 15
0
Longword data ERn
MSB
Legend:
ERn: General register
En:
General register E
Rn:
General register R
RnH: General register RH
RnL: General register RL
MSB: Most significant bit
LSB: Least significant bit
Figure 2.7 General Register Data Formats (2)
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LSB
Section 2 CPU
2.5.2
Memory Data Formats
Figure 2.8 shows the data formats on memory. The H8/300H CPU can access word data and
longword data on memory, but word or longword data must begin at an even address. If an attempt
is made to access word or longword data at an odd address, no address error occurs but the least
significant bit of the address is regarded as 0, so the access starts at the preceding address. This
also applies to instruction fetches.
Data Type
Address
Data Format
7
1-bit data
Address L
7
Byte data
Address L
MSB
Word data
Address 2M
MSB
0
6
5
4
Address 2N
2
1
0
LSB
Address 2M + 1
Longword data
3
LSB
MSB
Address 2N + 1
Address 2N + 2
Address 2N + 3
LSB
Figure 2.8 Memory Data Formats
When ER7 (SP) is used as an address register to access the stack, the operand size should be word
size or longword size.
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Section 2 CPU
2.6
Instruction Set
2.6.1
Instruction Set Overview
The H8/300H CPU has 62 types of instructions, which are classified in table 2.1.
Table 2.1
Instruction Classification
Function
Instruction
Types
Data transfer
1
1
2
2
MOV, PUSH* , POP* , MOVTPE* , MOVFPE*
3
Arithmetic operations
ADD, SUB, ADDX, SUBX, INC, DEC, ADDS, SUBS, DAA,
DAS, MULXU, MULXS, DIVXU, DIVXS, CMP, NEG, EXTS,
EXTU
18
Logic operations
AND, OR, XOR, NOT
4
Shift operations
SHAL, SHAR, SHLL, SHLR, ROTL, ROTR, ROTXL, ROTXR
8
Bit manipulation
14
Branch
BSET, BCLR, BNOT, BTST, BAND, BIAND, BOR, BIOR,
BXOR, BIXOR, BLD, BILD, BST, BIST
3
Bcc* , JMP, BSR, JSR, RTS
System control
TRAPA, RTE, SLEEP, LDC, STC, ANDC, ORC, XORC, NOP
9
Block data transfer
EEPMOV
1
5
Total 62 types
Notes: 1. POP.W Rn is identical to MOV.W @SP+, Rn.
PUSH.W Rn is identical to MOV.W Rn, @–SP.
POP.L ERn is identical to MOV.L @SP+, Rn.
PUSH.L ERn is identical to MOV.L Rn, @–SP.
2. Not available in the H8/3048B Group.
3. Bcc is a generic branching instruction.
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Section 2 CPU
2.6.2
Instructions and Addressing Modes
Table 2.2 indicates the instructions available in the H8/300H CPU.
Table 2.2
Instructions and Addressing Modes
@(d:24,ERn)
@ERn+/@–ERn
@aa:8
@aa:16
@aa:24
BWL
BWL
BWL
B
BWL
BWL
—
—
—
—
—
—
—
—
—
—
—
—
—
—
WL
—
—
—
—
—
—
—
B
—
—
—
—
—
BWL
BWL
—
—
—
—
—
—
—
—
—
—
—
WL
BWL
—
—
—
—
—
—
—
—
—
—
—
ADDX, SUBX
B
B
—
—
—
—
—
—
—
—
—
—
—
ADDS, SUBS
—
L
—
—
—
—
—
—
—
—
—
—
—
INC, DEC
—
BWL
—
—
—
—
—
—
—
—
—
—
—
DAA, DAS
—
B
—
—
—
—
—
—
—
—
—
—
—
MULXU, MULXS,
DIVXU, DIVXS
—
BW
—
—
—
—
—
—
—
—
—
—
—
NEG
—
BWL
—
—
—
—
—
—
—
—
—
—
—
EXTU, EXTS
—
WL
—
—
—
—
—
—
—
—
—
—
—
BWL
BWL
—
—
—
—
—
—
—
—
—
—
—
—
BWL
—
—
—
—
—
—
—
—
—
—
—
Shift instructions
—
BWL
—
—
—
—
—
—
—
—
—
—
—
Bit manipulation
—
B
B
—
—
—
B
—
—
—
—
—
—
Branch
Bcc, BSR
—
—
—
—
—
—
—
—
—
—
—
JMP, JSR
—
—
—
—
—
—
—
RTS
—
—
—
—
—
—
—
—
TRAPA
—
—
—
—
—
—
—
RTE
—
—
—
—
—
—
—
SLEEP
—
—
—
—
—
—
LDC
B
B
W
W
W
STC
—
B
W
W
W
ANDC, ORC,
XORC
B
—
—
—
—
Arithmetic
operations
Logic
operations
System
control
POP, PUSH
MOVFPE*,
MOVTPE*
ADD, CMP
SUB
AND, OR, XOR
NOT
NOP
Block data transfer
Legend:
B: Byte
W: Word
L: Longword
—
@(d:16,ERn)
BWL
—
MOV
@@aa:8
@ERn
BWL
—
Data
transfer
Instruction
@(d:16,PC)
Rn
BWL
Function
@(d:8,PC)
#xx
Addressing Modes
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
W
—
W
W
—
—
—
W
—
W
W
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
BW
Note: * Not availabe in the H8/3048B Group.
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Section 2 CPU
2.6.3
Tables of Instructions Classified by Function
Tables 2.3 to 2.10 summarize the instructions in each functional category. The operation notation
used in these tables is defined next.
Operation Notation
Rs
General register (destination)*
General register (source)*
Rn
General register*
ERn
General register (32-bit register or address register)
(EAd)
Destination operand
(EAs)
Source operand
CCR
Condition code register
N
N (negative) flag of CCR
Z
Z (zero) flag of CCR
V
V (overflow) flag of CCR
C
C (carry) flag of CCR
PC
Program counter
SP
Stack pointer
#IMM
Immediate data
Rd
disp
Displacement
+
Addition
–
Subtraction
×
Multiplication
÷
Division
∧
AND logical
∨
OR logical
⊕
Exclusive OR logical
→
Move
¬
NOT (logical complement)
:3/:8/:16/:24
Note:
*
3-, 8-, 16-, or 24-bit length
General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0
to R7, E0 to E7), and 32-bit data or address registers (ER0 to ER7).
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Section 2 CPU
Table 2.3
Data Transfer Instructions
Instruction
Size*
Function
MOV
B/W/L
(EAs) → Rd, Rs → (EAd)
Moves data between two general registers or between a general
register and memory, or moves immediate data to a general register.
MOVFPE
B
(EAs) → Rd
Cannot be used in the H8/3048B Group.
MOVTPE
B
Rs → (EAs)
Cannot be used in the H8/3048B Group.
POP
W/L
@SP+ → Rn
Pops a general register from the stack. POP.W Rn is identical to
MOV.W @SP+, Rn. Similarly, POP.L ERn is identical to MOV.L
@SP+, ERn.
PUSH
W/L
Rn → @–SP
Pushes a general register onto the stack. PUSH.W Rn is identical to
MOV.W Rn, @–SP. Similarly, PUSH.L ERn is identical to MOV.L
ERn, @–SP.
Note:
*
Size refers to the operand size.
B: Byte
W: Word
L: Longword
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Section 2 CPU
Table 2.4
Arithmetic Operation Instructions
Instruction
Size*
Function
ADD, SUB
B/W/L
Rd ± Rs → Rd, Rd ± #IMM → Rd
Performs addition or subtraction on data in two general registers, or
on immediate data and data in a general register. (Immediate byte
data cannot be subtracted from data in a general register. Use the
SUBX or ADD instruction.)
ADDX, SUBX
B
Rd ± Rs ± C → Rd, Rd ± #IMM ± C → Rd
Performs addition or subtraction with carry or borrow on data in two
general registers, or on immediate data and data in a general
register.
INC, DEC
B/W/L
Rd ± 1 → Rd, Rd ± 2 → Rd
Increments or decrements a general register by 1 or 2. (Byte
operands can be incremented or decremented by 1 only.)
ADDS, SUBS
L
Rd ± 1 → Rd, Rd ± 2 → Rd, Rd ± 4 → Rd
Adds or subtracts the value 1, 2, or 4 to or from data in a 32-bit
register.
DAA, DAS
B
Rd decimal adjust → Rd
Decimal-adjusts an addition or subtraction result in a general register
by referring to CCR to produce 4-bit BCD data.
MULXU
B/W
Rd × Rs → Rd
Performs unsigned multiplication on data in two general registers:
either 8 bits × 8 bits → 16 bits or 16 bits × 16 bits → 32 bits.
MULXS
B/W
Rd × Rs → Rd
Performs signed multiplication on data in two general registers:
either 8 bits × 8 bits → 16 bits or 16 bits × 16 bits → 32 bits.
DIVXU
B/W
Rd ÷ Rs → Rd
Performs unsigned division on data in two general registers: either
16 bits ÷ 8 bits → 8-bit quotient and 8-bit remainder or 32 bits ÷ 16
bits → 16-bit quotient and 16-bit remainder.
DIVXS
B/W
Rd ÷ Rs → Rd
Performs signed division on data in two general registers: either 16
bits ÷ 8 bits → 8-bit quotient and 8-bit remainder, or 32 bits ÷ 16 bits
→ 16-bit quotient and 16-bit remainder.
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Section 2 CPU
Instruction
Size*
Function
CMP
B/W/L
Rd – Rs, Rd – #IMM
Compares data in a general register with data in another general
register or with immediate data, and sets CCR according to the
result.
NEG
B/W/L
0 – Rd → Rd
Takes the two’s complement (arithmetic complement) of data in a
general register.
EXTS
W/L
Rd (sign extension) → Rd
Extends byte data in the lower 8 bits of a 16-bit register to word data,
or extends word data in the lower 16 bits of a 32-bit register to
longword data, by extending the sign bit.
EXTU
W/L
Rd (zero extension) → Rd
Extends byte data in the lower 8 bits of a 16-bit register to word data,
or extends word data in the lower 16 bits of a 32-bit register to
longword data, by padding with zeros.
Note:
*
Size refers to the operand size.
B: Byte
W: Word
L: Longword
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Section 2 CPU
Table 2.5
Logic Operation Instructions
Instruction
Size*
Function
AND
B/W/L
Rd ∧ Rs → Rd, Rd ∧ #IMM → Rd
Performs a logical AND operation on a general register and another
general register or immediate data.
OR
B/W/L
Rd ∨ Rs → Rd, Rd ∨ #IMM → Rd
Performs a logical OR operation on a general register and another
general register or immediate data.
XOR
B/W/L
Rd ⊕ Rs → Rd, Rd ⊕ #IMM → Rd
Performs a logical exclusive OR operation on a general register and
another general register or immediate data.
NOT
B/W/L
¬ Rd → Rd
Takes the one’s complement of general register contents.
Note:
*
Size refers to the operand size.
B: Byte
W: Word
L: Longword
Table 2.6
Shift Instructions
Instruction
Size*
Function
SHAL,
SHAR
B/W/L
Rd (shift) → Rd
SHLL,
SHLR
B/W/L
ROTL,
ROTR
B/W/L
ROTXL,
ROTXR
B/W/L
Note:
Performs an arithmetic shift on general register contents.
Rd (shift) → Rd
Performs a logical shift on general register contents.
Rd (rotate) → Rd
Rotates general register contents.
*
Rd (rotate) → Rd
Rotates general register contents through the carry bit.
Size refers to the operand size.
B: Byte
W: Word
L: Longword
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Section 2 CPU
Table 2.7
Bit Manipulation Instructions
Instruction
Size*
Function
BSET
B
1 → (<bit-No.> of <EAd>)
Sets a specified bit in a general register or memory operand to 1.
The bit number is specified by 3-bit immediate data or the lower 3
bits of a general register.
BCLR
B
0 → (<bit-No.> of <EAd>)
Clears a specified bit in a general register or memory operand to 0.
The bit number is specified by 3-bit immediate data or the lower 3
bits of a general register.
BNOT
B
¬ (<bit-No.> of <EAd>) → (<bit-No.> of <EAd>)
Inverts a specified bit in a general register or memory operand. The
bit number is specified by 3-bit immediate data or the lower 3 bits of
a general register.
BTST
B
¬ (<bit-No.> of <EAd>) → Z
Tests a specified bit in a general register or memory operand and
sets or clears the Z flag accordingly. The bit number is specified by
3-bit immediate data or the lower 3 bits of a general register.
BAND
B
C ∧ (<bit-No.> of <EAd>) → C
ANDs the carry flag with a specified bit in a general register or
memory operand and stores the result in the carry flag.
BIAND
B
C ∧ [¬ (<bit-No.> of <EAd>)] → C
ANDs the carry flag with the inverse of a specified bit in a general
register or memory operand and stores the result in the carry flag.
The bit number is specified by 3-bit immediate data.
BOR
B
C ∨ (<bit-No.> of <EAd>) → C
ORs the carry flag with a specified bit in a general register or
memory operand and stores the result in the carry flag.
BIOR
B
C ∨ [¬ (<bit-No.> of <EAd>)] → C
ORs the carry flag with the inverse of a specified bit in a general
register or memory operand and stores the result in the carry flag.
The bit number is specified by 3-bit immediate data.
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Section 2 CPU
Instruction
Size*
Function
BXOR
B
C ⊕ (<bit-No.> of <EAd>) → C
Exclusive-ORs the carry flag with a specified bit in a general register
or memory operand and stores the result in the carry flag.
BIXOR
B
C ⊕ [¬ (<bit-No.> of <EAd>)] → C
Exclusive-ORs the carry flag with the inverse of a specified bit in a
general register or memory operand and stores the result in the carry
flag.
The bit number is specified by 3-bit immediate data.
BLD
B
(<bit-No.> of <EAd>) → C
Transfers a specified bit in a general register or memory operand to
the carry flag.
BILD
B
¬ (<bit-No.> of <EAd>) → C
Transfers the inverse of a specified bit in a general register or
memory operand to the carry flag.
The bit number is specified by 3-bit immediate data.
BST
B
C → (<bit-No.> of <EAd>)
Transfers the carry flag value to a specified bit in a general register
or memory operand.
BIST
B
C → ¬ (<bit-No.> of <EAd>)
Transfers the inverse of the carry flag value to a specified bit in a
general register or memory operand.
The bit number is specified by 3-bit immediate data.
Note:
*
Size refers to the operand size.
B: Byte
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Section 2 CPU
Table 2.8
Branching Instructions
Instruction
Size
Function
Bcc
—
Branches to a specified address if a specified condition is true. The
branching conditions are listed below.
Mnemonic
Description
Condition
BRA (BT)
Always (true)
Always
BRN (BF)
Never (false)
Never
BHI
High
C∨Z=0
BLS
Low or same
C∨Z=1
Bcc (BHS)
Carry clear (high or same)
C=0
BCS (BLO)
Carry set (low)
C=1
BNE
Not equal
Z=0
BEQ
Equal
Z=1
BVC
Overflow clear
V=0
BVS
Overflow set
V=1
BPL
Plus
N=0
BMI
Minus
N=1
BGE
Greater or equal
N⊕V=0
BLT
Less than
N⊕V=1
BGT
Greater than
Z ∨ (N ⊕ V) = 0
BLE
Less or equal
Z ∨ (N ⊕ V) = 1
JMP
—
Branches unconditionally to a specified address
BSR
—
Branches to a subroutine at a specified address
JSR
—
Branches to a subroutine at a specified address
RTS
—
Returns from a subroutine
Rev. 3.00 Sep 27, 2006 page 49 of 872
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Section 2 CPU
Table 2.9
System Control Instructions
Instruction
Size*
Function
TRAPA
—
Starts trap-instruction exception handling
RTE
—
Returns from an exception-handling routine
SLEEP
—
Causes a transition to the power-down state
LDC
B/W
(EAs) → CCR
Moves the source operand contents to the condition code register.
The condition code register size is one byte, but in transfer from
memory, data is read by word access.
STC
B/W
CCR → (EAd)
Transfers the CCR contents to a destination location. The condition
code register size is one byte, but in transfer to memory, data is
written by word access.
ANDC
B
ORC
B
CCR ∧ #IMM → CCR
Logically ANDs the condition code register with immediate data.
CCR ∨ #IMM → CCR
Logically ORs the condition code register with immediate data.
XORC
B
CCR ⊕ #IMM → CCR
Logically exclusive-ORs the condition code register with immediate
data.
NOP
—
PC + 2 → PC
Only increments the program counter.
Note:
*
Size refers to the operand size.
B: Byte
W: Word
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Section 2 CPU
Table 2.10 Block Transfer Instruction
Instruction
Size
Function
EEPMOV.B
—
if R4L ≠ 0 then
repeat
until
@ER5+ → @ER6+, R4L – 1 → R4L
R4L = 0
else next;
EEPMOV.W
—
if R4 ≠ 0 then
repeat
until
@ER5+ → @ER6+, R4 – 1 → R4
R4 = 0
else next;
Transfers a data block according to parameters set in general
registers R4L or R4, ER5, and ER6.
R4L or R4: Size of block (bytes)
ER5:
Starting source address
ER6:
Starting destination address
Execution of the next instruction begins as soon as the transfer is
completed.
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Section 2 CPU
2.6.4
Basic Instruction Formats
The H8/300H instructions consist of 2-byte (1-word) units. An instruction consists of an operation
field (OP field), a register field (r field), an effective address extension (EA field), and a condition
field (cc).
Operation Field: Indicates the function of the instruction, the addressing mode, and the operation
to be carried out on the operand. The operation field always includes the first 4 bits of the
instruction. Some instructions have two operation fields.
Register Field: Specifies a general register. Address registers are specified by 3 bits, data registers
by 3 bits or 4 bits. Some instructions have two register fields. Some have no register field.
Effective Address Extension: Eight, 16, or 32 bits specifying immediate data, an absolute
address, or a displacement. A 24-bit address or displacement is treated as 32-bit data in which the
first 8 bits are 0 (H'00).
Condition Field: Specifies the branching condition of Bcc instructions.
Figure 2.9 shows examples of instruction formats.
Operation field only
op
NOP, RTS, etc.
Operation field and register fields
op
rn
rm
ADD.B Rn, Rm, etc.
Operation field, register fields, and effective address extension
op
rn
rm
MOV.B @(d:16, Rn), Rm
EA (disp)
Operation field, effective address extension, and condition field
op
cc
EA (disp)
Figure 2.9 Instruction Formats
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2.6.5
Notes on Use of Bit Manipulation Instructions
The BSET, BCLR, BNOT, BST, and BIST instructions read a byte of data, modify a bit in the
byte, then write the byte back. Care is required when these instructions are used to access registers
with write-only bits, or to access ports.
The BCLR instruction can be used to clear flags in the internal I/O registers. In an interrupthandling routine, for example, if it is known that the flag is set to 1, it is not necessary to read the
flag ahead of time.
Step
Description
1
Read
Read data (byte unit) at the specified address
2
Bit manipulation
Modify the specified bit in the read data
3
Write
Write the modified data (byte unit) to the specified address
In the following example, a BCLR instruction is executed on the data direction register (DDR) of
port 4.
P47 and P46 are set as input pins, and are inputting low-level and high-level signals, respectively.
P45 to P40 are set as output pins, and are in the low-level output state.
In this example, the BCLR instruction is used to make P40 an input port.
Before Execution of BCLR Instruction
P47
P46
P45
P44
P43
P42
P41
P40
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
DDR
0
0
1
1
1
1
1
1
DR
1
0
0
0
0
0
0
0
Execution of BCLR Instruction
BCLR
#0, @P4DDR
; Execute BCLR instruction on DDR
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After Execution of BCLR Instruction
Input/output
P47
P46
P45
P44
P43
P42
P41
P40
Output
Output
Output
Output
Output
Output
Output
Input
DDR
1
1
1
1
1
1
1
0
DR
1
0
0
0
0
0
0
0
Explanation of BCLR Instruction
To execute the BCLR instruction, the CPU begins by reading P4DDR. Since P4DDR is a writeonly register, it is read as H'FF, even though its true value is H'3F.
Next the CPU clears bit 0 of the read data, changing the value to H'FE.
Finally, the CPU writes this value (H'FE) back to DDR to complete the BCLR instruction.
As a result, P40DDR is cleared to 0, making P40 an input pin. In addition, P47DDR and P46DDR
are set to 1, making P47 and P46 output pins.
The BCLR instruction can be used to clear flags in the internal I/O registers to 0. In an interrupthandling routine, for example, if it is known that the flag is set to 1, it is not necessary to read the
flag ahead of time.
2.7
Addressing Modes and Effective Address Calculation
2.7.1
Addressing Modes
The H8/300H CPU supports the eight addressing modes listed in table 2.11. Each instruction uses
a subset of these addressing modes. Arithmetic and logic instructions can use the register direct
and immediate modes. Data transfer instructions can use all addressing modes except programcounter relative and memory indirect. Bit manipulation instructions use register direct, register
indirect, or absolute (@aa:8) addressing mode to specify an operand, and register direct (BSET,
BCLR, BNOT, and BTST instructions) or immediate (3-bit) addressing mode to specify a bit
number in the operand.
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Table 2.11 Addressing Modes
No.
Addressing Mode
Symbol
1
Register direct
Rn
2
Register indirect
@ERn
3
Register indirect with displacement
@(d:16, ERn)/@(d:24, ERn)
4
Register indirect with post-increment
@ERn+
Register indirect with pre-decrement
@–ERn
5
Absolute address
@aa:8/@aa:16/@aa:24
6
Immediate
#xx:8/#xx:16/#xx:32
7
Program-counter relative
@(d:8, PC)/@(d:16, PC)
8
Memory indirect
@@aa:8
1. Register Direct—Rn
The register field of the instruction code specifies an 8-, 16-, or 32-bit register containing the
operand. R0H to R7H and R0L to R7L can be specified as 8-bit registers. R0 to R7 and E0 to E7
can be specified as 16-bit registers. ER0 to ER7 can be specified as 32-bit registers.
2. Register Indirect—@ERn
The register field of the instruction code specifies an address register (ERn), the lower 24 bits of
which contain the address of the operand.
3. Register Indirect with Displacement—@(d:16, ERn) or @(d:24, ERn)
A 16-bit or 24-bit displacement contained in the instruction code is added to the contents of an
address register (ERn) specified by the register field of the instruction, and the lower 24 bits of the
sum specify the address of a memory operand. A 16-bit displacement is sign-extended when
added.
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4. Register Indirect with Post-Increment or Pre-Decrement—@ERn+ or @–ERn
• Register indirect with post-increment—@ERn+
The register field of the instruction code specifies an address register (ERn) the lower 24 bits
of which contain the address of a memory operand. After the operand is accessed, 1, 2, or 4 is
added to the address register contents (32 bits) and the sum is stored in the address register.
The value added is 1 for byte access, 2 for word access, or 4 for longword access. For word or
longword access, the register value should be even.
• Register indirect with pre-decrement—@–ERn
The value 1, 2, or 4 is subtracted from an address register (ERn) specified by the register field
in the instruction code, and the lower 24 bits of the result become the address of a memory
operand. The result is also stored in the address register. The value subtracted is 1 for byte
access, 2 for word access, or 4 for longword access. For word or longword access, the resulting
register value should be even.
5. Absolute Address—@aa:8, @aa:16, or @aa:24
The instruction code contains the absolute address of a memory operand. The absolute address
may be 8 bits long (@aa:8), 16 bits long (@aa:16), or 24 bits long (@aa:24). For an 8-bit absolute
address, the upper 16 bits are all assumed to be 1 (H'FFFF). For a 16-bit absolute address the
upper 8 bits are a sign extension. A 24-bit absolute address can access the entire address space.
Table 2.12 indicates the accessible address ranges.
Table 2.12 Absolute Address Access Ranges
Absolute Address
1-Mbyte Modes
16-Mbyte Modes
8 bits (@aa:8)
H'FFF00 to H'FFFFF
(1048320 to 1048575)
H'FFFF00 to H'FFFFFF
(16776960 to 16777215)
16 bits (@aa:16)
H'00000 to H'07FFF,
H'F8000 to H'FFFFF
(0 to 32767, 1015808 to 1048575)
H'000000 to H'007FFF,
H'FF8000 to H'FFFFFF
(0 to 32767, 16744448 to 16777215)
24 bits (@aa:24)
H'00000 to H'FFFFF
(0 to 1048575)
H'000000 to H'FFFFFF
(0 to 16777215)
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6. Immediate—#xx:8, #xx:16, or #xx:32
The instruction code contains 8-bit (#xx:8), 16-bit (#xx:16), or 32-bit (#xx:32) immediate data as
an operand.
The instruction codes of the ADDS, SUBS, INC, and DEC instructions contain immediate data
implicitly. The instruction codes of some bit manipulation instructions contain 3-bit immediate
data specifying a bit number. The TRAPA instruction code contains 2-bit immediate data
specifying a vector address.
7. Program-Counter Relative—@(d:8, PC) or @(d:16, PC)
This mode is used in the Bcc and BSR instructions. An 8-bit or 16-bit displacement contained in
the instruction code is sign-extended to 24 bits and added to the 24-bit PC contents to generate a
24-bit branch address. The PC value to which the displacement is added is the address of the first
byte of the next instruction, so the possible branching range is –126 to +128 bytes (–63 to +64
words) or –32766 to +32768 bytes (–16383 to +16384 words) from the branch instruction. The
resulting value should be an even number.
8. Memory Indirect—@@aa:8
This mode can be used by the JMP and JSR instructions. The instruction code contains an 8-bit
absolute address specifying a memory operand. This memory operand contains a branch address.
The memory operand is accessed by longword access. The first byte of the memory operand is
ignored, generating a 24-bit branch address. See figure 2.10. The upper bits of the 8-bit absolute
address are assumed to be 0 (H'0000), so the address range is 0 to 255 (H'000000 to H'0000FF).
Note that the first part of this range is also the exception vector area. For further details see section
5, Interrupt Controller.
Specified by @aa:8
Reserved
Branch address
Figure 2.10 Memory-Indirect Branch Address Specification
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When a word-size or longword-size memory operand is specified, or when a branch address is
specified, if the specified memory address is odd, the least significant bit is regarded as 0. The
accessed data or instruction code therefore begins at the preceding address. See section 2.5.2,
Memory Data Formats.
2.7.2
Effective Address Calculation
Table 2.13 explains how an effective address is calculated in each addressing mode. In the
1-Mbyte operating modes the upper 4 bits of the calculated address are ignored in order to
generate a 20-bit effective address.
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Table 2.13 Effective Address Calculation
No.
Addressing Mode and
Instruction Format
1
Register direct (Rn)
op
2
Effective Address
Calculation
Effective Address
Operand is general
register contents
rm rn
Register indirect (@ERn)
31
0
23
0
General register contents
op
3
r
Register indirect with displacement
@(d:16, ERn)/@(d:24, ERn)
31
0
General register contents
op
r
0
23
0
23
0
disp
Sign extension
4.
23
disp
Register indirect with post-increment
or pre-decrement
•
Register indirect with post-increment @ERn+
31
0
General register contents
op
r
1, 2, or 4
•
Register indirect with pre-decrement @–ERn
31
0
General register contents
op
r
1, 2, or 4
1 for a byte operand, 2 for a word
operand, 4 for a longword operand
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No.
Addressing Mode and
Instruction Format
5
Absolute address
Effective Address
Calculation
Effective Address
@aa:8
op
23
87
0
H'FFFF
abs
@aa:16
op
abs
23 16 15
Sign
extension
0
23
0
@aa:24
op
abs
6
Immediate
#xx:8, #xx:16, or #xx:32
op
7
Operand is immediate
data
IMM
Program-counter relative
@(d:8, PC) or @(d:16, PC)
0
23
PC contents
Sign
extension
op
disp
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disp
23
0
Section 2 CPU
No.
Addressing Mode and
Instruction Format
8
Memory indirect @@aa:8
•
Effective Address
Calculation
Effective Address
Normal mode
op
abs
23
87
0
abs
H'0000
0
15
Memory
contents
•
23
16 15
0
H'00
Advanced mode
op
abs
23
87
0
abs
H'0000
0
31
23
0
Memory contents
Legend:
r, rm, rn: Register field
op:
Operation field
disp:
Displacement
IMM:
Immediate data
abs:
Absolute address
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2.8
Processing States
2.8.1
Overview
The H8/300H CPU has five processing states: the program execution state, exception-handling
state, power-down state, reset state, and bus-released state. The power-down state includes sleep
mode, software standby mode, and hardware standby mode. Figure 2.11 classifies the processing
states. Figure 2.13 indicates the state transitions.
Processing states
Program execution state
The CPU executes program instructions in sequence
Exception-handling state
A transient state in which the CPU executes a hardware sequence
(saving PC and CCR, fetching a vector, etc.) in response to a reset,
interrupt, or other exception
Bus-released state
The external bus has been released in response to a bus request
signal from a bus master other than the CPU
Reset state
The CPU and all on-chip supporting modules are initialized and halted
Sleep mode
Power-down state
The CPU is halted to conserve power
Software standby mode
Hardware standby mode
Figure 2.11 Processing States
2.8.2
Program Execution State
In this state the CPU executes program instructions in normal sequence.
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2.8.3
Exception-Handling State
The exception-handling state is a transient state that occurs when the CPU alters the normal
program flow due to a reset, interrupt, or trap instruction. The CPU fetches a starting address from
the exception vector table and branches to that address. In interrupt and trap exception handling
the CPU references the stack pointer (ER7) and saves the program counter and condition code
register.
Types of Exception Handling and Their Priority: Exception handling is performed for resets,
interrupts, and trap instructions. Table 2.14 indicates the types of exception handling and their
priority. Trap instruction exceptions are accepted at all times in the program execution state.
Table 2.14 Exception Handling Types and Priority
Priority
Type of
Exception
Detection Timing
Start of Exception Handling
High
Reset
Synchronized with clock
Exception handling starts immediately
when RES changes from low to high
Interrupt
End of instruction
execution or end of
exception handling*
When an interrupt is requested,
exception handling starts at the end of
the current instruction or current
exception-handling sequence
Trap instruction
When TRAPA instruction
is executed
Exception handling starts when a trap
(TRAPA) instruction is executed
Low
Note:
*
Interrupts are not detected at the end of the ANDC, ORC, XORC, and LDC instructions,
or immediately after reset exception handling.
Figure 2.12 classifies the exception sources. For further details about exception sources, vector
numbers, and vector addresses, see section 4, Exception Handling, and section 5, Interrupt
Controller.
Reset
External interrupts
Exception
sources
Interrupt
Internal interrupts (from on-chip supporting modules)
Trap instruction
Figure 2.12 Classification of Exception Sources
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End of bus release
Bus request
Program execution state
End of bus
release
Bus
request
Exception
SLEEP
instruction
with SSBY = 0
Bus-released state
End of
exception
handling
Exception-handling state
Sleep mode
Interrupt
NMI, IRQ 0 , IRQ 1,
or IRQ 2 interrupt
SLEEP instruction
with SSBY = 1
Software standby mode
RES = High
Reset state*1
STBY = High, RES = Low
Hardware standby mode*2
Power-down state
Notes: 1. From any state except hardware standby mode, a transition to the reset state occurs
whenever RES goes low.
2. From any state, a transition to hardware standby mode occurs when STBY goes low.
Figure 2.13 State Transitions
2.8.4
Exception-Handling Sequences
Reset Exception Handling: Reset exception handling has the highest priority. The reset state is
entered when the RES signal goes low. Reset exception handling starts after that, when RES
changes from low to high. When reset exception handling starts the CPU fetches a start address
from the exception vector table and starts program execution from that address. All interrupts,
including NMI, are disabled during the reset exception-handling sequence and immediately after it
ends.
Interrupt Exception Handling and Trap Instruction Exception Handling: When these
exception-handling sequences begin, the CPU references the stack pointer (ER7) and pushes the
program counter and condition code register on the stack. Next, if the UE bit in the system control
register (SYSCR) is set to 1, the CPU sets the I bit in the condition code register to 1. If the UE bit
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Section 2 CPU
is cleared to 0, the CPU sets both the I bit and the UI bit in the condition code register to 1. Then
the CPU fetches a start address from the exception vector table and execution branches to that
address.
Figure 2.14 shows the stack after the exception-handling sequence.
SP − 4
SP (ER7)
SP − 3
SP + 1
SP − 2
SP + 2
SP − 1
SP + 3
SP (ER7)
Stack area
Before exception
handling starts
CCR
PC
SP + 4
Even
address
Pushed on stack
After exception
handling ends
Legend:
CCR: Condition code register
SP:
Stack pointer
Notes: 1. PC is the address of the first instruction executed after the return from the
exception-handling routine.
2. Registers must be saved and restored by word access or longword access,
starting at an even address.
Figure 2.14 Stack Structure after Exception Handling
2.8.5
Bus-Released State
In this state the bus is released to a bus master other than the CPU, in response to a bus request.
The bus masters other than the CPU are the DMA controller, the refresh controller, and an external
bus master. While the bus is released, the CPU halts except for internal operations. Interrupt
requests are not accepted. For details see section 6.3.7, Bus Arbiter Operation.
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2.8.6
Reset State
When the RES input goes low all current processing stops and the CPU enters the reset state. The I
bit in the condition code register is set to 1 by a reset. All interrupts are masked in the reset state.
Reset exception handling starts when the RES signal changes from low to high.
The reset state can also be entered by a watchdog timer overflow. For details see section 12,
Watchdog Timer.
2.8.7
Power-Down State
In the power-down state the CPU stops operating to conserve power. There are three modes: sleep
mode, software standby mode, and hardware standby mode.
Sleep Mode: A transition to sleep mode is made if the SLEEP instruction is executed while the
SSBY bit is cleared to 0 in the system control register (SYSCR). CPU operations stop
immediately after execution of the SLEEP instruction, but the contents of CPU registers are
retained.
Software Standby Mode: A transition to software standby mode is made if the SLEEP
instruction is executed while the SSBY bit is set to 1 in SYSCR. The CPU and clock halt and all
on-chip supporting modules stop operating. The on-chip supporting modules are reset, but as long
as a specified voltage is supplied the contents of CPU registers and on-chip RAM are retained.
The I/O ports also remain in their existing states.
Hardware Standby Mode: A transition to hardware standby mode is made when the STBY input
goes low. As in software standby mode, the CPU and all clocks halt and the on-chip supporting
modules are reset, but as long as a specified voltage is supplied, on-chip RAM contents are
retained.
For further information see section 20, Power-Down State.
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2.9
Basic Operational Timing
2.9.1
Overview
The H8/300H CPU operates according to the system clock (φ). The interval from one rise of the
system clock to the next rise is referred to as a “state.” A memory cycle or bus cycle consists of
two or three states. The CPU uses different methods to access on-chip memory, the on-chip
supporting modules, and the external address space. Access to the external address space can be
controlled by the bus controller.
2.9.2
On-Chip Memory Access Timing
On-chip memory is accessed in two states. The data bus is 16 bits wide, permitting both byte and
word access. Figure 2.15 shows the on-chip memory access cycle. Figure 2.16 indicates the pin
states.
Bus cycle
T1 state
T2 state
φ
Internal address bus
Address
Internal read signal
Internal data bus
(read access)
Read data
Internal write signal
Internal data bus
(write access)
Write data
Figure 2.15 On-Chip Memory Access Cycle
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T1
T2
φ
Address bus
AS , RD, HWR , LWR
Address
High
High-impedance
D15 to D0
Figure 2.16 Pin States during On-Chip Memory Access
2.9.3
On-Chip Supporting Module Access Timing
The on-chip supporting modules are accessed in three states. The data bus is 8 or 16 bits wide,
depending on the register being accessed. Figure 2.17 shows the on-chip supporting module access
timing. Figure 2.18 indicates the pin states.
Bus cycle
T1 state
T2 state
T3 state
φ
Address bus
Read
access
Address
Internal read signal
Internal data bus
Read data
Internal write signal
Write
access
Internal data bus
Write data
Figure 2.17 Access Cycle for On-Chip Supporting Modules
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T1
T2
T3
φ
Address bus
AS , RD, HWR , LWR
Address
High
High-impedance
D15 to D0
Figure 2.18 Pin States during Access to On-Chip Supporting Modules
2.9.4
Access to External Address Space
The external address space is divided into eight areas (areas 0 to 7). Bus-controller settings
determine whether each area is accessed via an 8-bit or 16-bit bus, and whether it is accessed in
two or three states. For details see section 6, Bus Controller.
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Section 3 MCU Operating Modes
Section 3 MCU Operating Modes
3.1
Overview
3.1.1
Operating Mode Selection
The H8/3048B Group has seven operating modes (modes 1 to 7) that are selected by the mode
pins (MD2 to MD0) as indicated in table 3.1. The input at these pins determines the size of the
address space and the initial bus mode.
Table 3.1
Operating Mode Selection
Mode Pins
Description
Address Space
Initial Bus
1
Mode*
On-Chip
ROM
On-Chip
RAM
0
—
—
—
—
0
1
Expanded mode
8 bits
Disabled
Enabled*
0
1
0
Expanded mode
16 bits
Disabled
Enabled*
Mode 3
0
1
1
Expanded mode
8 bits
Disabled
Enabled*
Mode 4
1
0
0
Expanded mode
16 bits
Disabled
Enabled*
Mode 5
1
0
1
Expanded mode
8 bits
Enabled
Enabled*
Mode 6
1
1
0
Expanded mode
8 bits
Enabled
Enabled*
Mode 7
1
1
1
Single-chip advanced
mode
—
Enabled
Enabled
Operating
Mode
MD2
MD1
MD0
—
0
0
Mode 1
0
Mode 2
2
2
2
2
2
2
Notes: 1. In modes 1 to 6, an 8-bit or 16-bit data bus can be selected on a per-area basis by
settings made in the area bus width control register (ABWCR). For details see section
6, Bus Controller.
2. If the RAME bit in SYSCR is cleared to 0, these addresses become external addresses.
For the address space size there are two choices: 1 Mbyte or 16 Mbytes. The external data bus is
either 8 or 16 bits wide depending on ABWCR settings. If 8-bit access is selected for all areas, the
external data bus is 8 bits wide. For details see section 6, Bus Controller.
Modes 1 to 4 are externally expanded modes that enable access to external memory and peripheral
devices and disable access to the on-chip ROM. Modes 1 and 2 support a maximum address space
of 1 Mbyte. Modes 3 and 4 support a maximum address space of 16 Mbytes.
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Section 3 MCU Operating Modes
Modes 5 and 6 are externally expanded modes that enable access to external memory and
peripheral devices and also enable access to the on-chip ROM. Mode 5 supports a maximum
address space of 1 Mbyte. Mode 6 supports a maximum address space of 16 Mbytes.
Mode 7 is a single-chip mode that operates using the on-chip ROM, RAM, and internal I/O
registers, and makes all I/O ports available. Mode 7 supports a 1-Mbyte address space.
The H8/3048B Group can be used only in modes 1 to 7. The inputs at the mode pins must select
one of these seven modes. The inputs at the mode pins must not be changed during operation.
3.1.2
Register Configuration
The H8/3048B Group has a mode control register (MDCR) that indicates the inputs at the mode
pins (MD2 to MD0), and a system control register (SYSCR). Table 3.2 summarizes these registers.
Table 3.2
Registers
Address*
Name
Abbreviation
R/W
Initial Value
H'FFF1
Mode control register
MDCR
R
Undetermined
System control register
SYSCR
R/W
H'0B
H'FFF2
Note:
3.2
*
The lower 16 bits of the address are indicated.
Mode Control Register (MDCR)
MDCR is an 8-bit read-only register that indicates the current operating mode of the H8/3048B
Group.
Bit
7
6
5
4
3
2
1
0





MDS2
MDS1
MDS0
Initial value
1
1
0
0
0
*
*
*
Read/Write





R
R
R
Reserved bits
Note: * Determined by pins MD2 to MD0 .
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Reserved bits
Mode select 2 to 0
Bits indicating the current
operating mode
Section 3 MCU Operating Modes
Bits 7 and 6—Reserved: Read-only bits, always read as 1.
Bits 5 to 3—Reserved: Read-only bits, always read as 0.
Bits 2 to 0—Mode Select 2 to 0 (MDS2 to MDS0): These bits indicate the logic levels at pins
MD2 to MD0 (the current operating mode). MDS2 to MDS0 correspond to MD2 to MD0. MDS2 to
MDS0 are read-only bits. The mode pin (MD2 to MD0) levels are latched into these bits when
MDCR is read.
Note: For the flash memory version with single power supply (H8/3048F-ONE), flash memory
can be written to in the boot mode. In the boot mode, the inverted value of the MD2 signal
is set to bit MDS2.
3.3
System Control Register (SYSCR)
SYSCR is an 8-bit register that controls the operation of the H8/3048B Group.
Bit
7
6
5
4
3
2
1
0
SSBY
STS2
STS1
STS0
UE
NMIEG

RAME
Initial value
0
0
0
0
1
0
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W

R/W
RAM enable
Enables or
disables
on-chip RAM
Reserved bit
NMI edge select
Selects the valid edge
of the NMI input
User bit enable
Selects whether to use the UI bit in CCR
as a user bit or an interrupt mask bit
Standby timer select 2 to 0
These bits select the waiting time at
recovery from software standby mode
Software standby
Enables transition to software standby mode
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Section 3 MCU Operating Modes
Bit 7—Software Standby (SSBY): Enables transition to software standby mode. (For further
information about software standby mode see section 20, Power-Down State.)
When software standby mode is exited by an external interrupt, this bit remains set to 1. To clear
this bit, write 0.
Bit 7: SSBY
Description
0
SLEEP instruction causes transition to sleep mode
1
SLEEP instruction causes transition to software standby mode
(Initial value)
Bits 6 to 4—Standby Timer Select (STS2 to STS0): These bits select the length of time the CPU
and on-chip supporting modules wait for the internal clock oscillator to settle when software
standby mode is exited by an external interrupt. When using a crystal oscillator, set these bits so
that the waiting time will be at least 7 ms at the system clock rate. For further information about
waiting time selection, see section 20.4.3, Selection of Waiting Time for Exit from Software
Standby Mode.
Bit 6: STS2
Bit 5: STS1
Bit 4: STS0
Description
0
0
0
Waiting time = 8,192 states
1
Waiting time = 16,384 states
0
Waiting time = 32,768 states
1
Waiting time = 65,536 states
1
1
0
1
0
Waiting time = 131,072 states
1
Waiting time = 262,144 states
0
Waiting time = 1,024 states
1
Illegal setting
(Initial value)
Bit 3—User Bit Enable (UE): Selects whether to use the UI bit in the condition code register as a
user bit or an interrupt mask bit.
Bit 3: UE
Description
0
UI bit in CCR is used as an interrupt mask bit
1
UI bit in CCR is used as a user bit
Rev. 3.00 Sep 27, 2006 page 74 of 872
REJ09B0325-0300
(Initial value)
Section 3 MCU Operating Modes
Bit 2—NMI Edge Select (NMIEG): Selects the valid edge of the NMI input.
Bit 2: NMIEG
Description
0
An interrupt is requested at the falling edge of NMI
1
An interrupt is requested at the rising edge of NMI
(Initial value)
Bit 1—Reserved: Read-only bit, always read as 1.
Bit 0—RAM Enable (RAME): Enables or disables the on-chip RAM. The RAME bit is
initialized by the rising edge of the RES signal. It is not initialized in software standby mode.
Bit 0: RAME
Description
0
On-chip RAM is disabled
1
On-chip RAM is enabled
3.4
Operating Mode Descriptions
3.4.1
Mode 1
(Initial value)
Ports 1, 2, and 5 function as address pins A19 to A0, permitting access to a maximum 1-Mbyte
address space. The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. If at least
one area is designated for 16-bit access in ABWCR, the bus mode switches to 16 bits.
3.4.2
Mode 2
Ports 1, 2, and 5 function as address pins A19 to A0, permitting access to a maximum 1-Mbyte
address space. The initial bus mode after a reset is 16 bits, with 16-bit access to all areas. If all
areas are designated for 8-bit access in ABWCR, the bus mode switches to 8 bits.
3.4.3
Mode 3
Ports 1, 2, and 5 and part of port A function as address pins A23 to A0, permitting access to a
maximum 16-Mbyte address space. The initial bus mode after a reset is 8 bits, with 8-bit access to
all areas. If at least one area is designated for 16-bit access in ABWCR, the bus mode switches to
16 bits. A23 to A21 are valid when 0 is written in bits 7 to 5 of the bus release control register
(BRCR). (In this mode A20 is always used for address output.)
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Section 3 MCU Operating Modes
3.4.4
Mode 4
Ports 1, 2, and 5 and part of port A function as address pins A23 to A0, permitting access to a
maximum 16-Mbyte address space. The initial bus mode after a reset is 16 bits, with 16-bit access
to all areas. If all areas are designated for 8-bit access in ABWCR, the bus mode switches to 8 bits.
A23 to A21 are valid when 0 is written in bits 7 to 5 of BRCR. (In this mode A20 is always used for
address output.)
3.4.5
Mode 5
Ports 1, 2, and 5 can function as address pins A19 to A0, permitting access to a maximum 1-Mbyte
address space, but following a reset they are input ports. To use ports 1, 2, and 5 as an address bus,
the corresponding bits in their data direction registers (P1DDR, P2DDR, and P5DDR) must be set
to 1. The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. If at least one area is
designated for 16-bit access in ABWCR, the bus mode switches to 16 bits.
3.4.6
Mode 6
Ports 1, 2, and 5 and part of port A function as address pins A23 to A0, permitting access to a
maximum 16-Mbyte address space, but following a reset they are input ports. To use ports 1, 2,
and 5 as an address bus, the corresponding bits in their data direction registers (P1DDR, P2DDR,
and P5DDR) must be set to 1. For A23 to A21 output, clear bits 7 to 5 of BRCR to 0. (In this mode
A20 is always used for address output.)
The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. If at least one area is
designated for 16-bit access in ABWCR, the bus mode switches to 16 bits.
3.4.7
Mode 7
This mode operates using the on-chip ROM, RAM, and internal I/O registers. All I/O ports are
available. Mode 7 supports a 1-Mbyte address space.
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Section 3 MCU Operating Modes
3.5
Pin Functions in Each Operating Mode
The pin functions of ports 1 to 5 and port A vary depending on the operating mode. Table 3.3
indicates their functions in each operating mode.
Table 3.3
Pin Functions in Each Mode
Port
Mode 1
Mode 2
Mode 3
Mode 4
Mode 5
Mode 6
Mode 7
Port 1
A7 to A0
A7 to A0
A7 to A0
A7 to A0
P17 to P10*2
P17 to P10*2
P17 to P10
Port 2
A15 to A8
A15 to A8
A15 to A8
A15 to A8
P27 to P20*2
P27 to P20*2
P27 to P20
Port 3
D15 to D8
D15 to D8
D15 to D8
D15 to D8
D15 to D8
D15 to D8
P37 to P30
Port 4
P47 to P40*1
D7 to D0*1
P47 to P40*1
D7 to D0*1
P47 to P40*1
P47 to P40*1
P47 to P40
A19 to A16
P53 to P50*2
P53 to P50*2
P53 to P50
PA7 to PA5,
A *3
PA7 to PA4
Port 5
Port A
A19 to A16
PA7 to PA4
A19 to A16
A19 to A16
PA7 to PA4
PA7 to PA5*3, PA7 to PA5*3, PA7 to PA4
A20
A20
20
Notes: 1. Initial state. The bus mode can be switched by settings in ABWCR. These pins function
as P47 to P40 in 8-bit bus mode, and as D7 to D0 in 16-bit bus mode.
2. Initial state. These pins become address output pins when the corresponding bits in the
data direction registers (P1DDR, P2DDR, P5DDR) are set to 1.
3. Initial state. A20 is always an address output pin. PA7 to PA5 are switched over to A23 to
A21 output by writing 0 in bits 7 to 5 of BRCR.
3.6
Memory Map in Each Operating Mode
Figure 3.1 shows a memory map of the H8/3048B Group. The address space is divided into eight
areas.
The initial bus mode differs between modes 1 and 2, and also between modes 3 and 4.
The address locations of the on-chip RAM and internal I/O registers differ between the 1-Mbyte
modes (modes 1, 2, 5, and 7) and 16-Mbyte modes (modes 3, 4, and 6). The address range
specifiable by the CPU in the 8- and 16-bit absolute addressing modes (@aa:8 and @aa:16) also
differs.
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Section 3 MCU Operating Modes
H'07FFF
H'1FFFF
H'20000
H'3FFFF
H'40000
H'5FFFF
H'60000 External address
space
H'7FFFF
H'80000
H'9FFFF
H'A0000
H'BFFFF
H'C0000
H'DFFFF
H'E0000
H'000000
Vector area
H'0000FF
H'007FFF
16-bit absolute
addresses
H'000FF
Modes 3 and 4
(16-Mbyte expanded modes with
on-chip ROM disabled)
Memory-indirect
branch addresses
Vector area
16-bit absolute
addresses
H'00000
Memory-indirect
branch addresses
Modes 1 and 2
(1-Mbyte expanded modes with
on-chip ROM disabled)
Area 0
Area 0
H'1FFFFF
H'200000
Area 1
Area 1
Area 2
H'3FFFFF
H'400000
Area 3
Area 2
Area 4
H'5FFFFF
H'600000
Area 5
Area 6
H'7FFFFF
H'800000
Area 7
External
address
space
Area 3
Area 4
H'9FFFFF
H'A00000
H'FFFFF
Internal I/O
registers
Area 6
H'DFFFFF
H'E00000
Area 7
H'FF8000
H'FFEF0F
H'FFEF10
H'FFFF00
H'FFFF0F
H'FFFF10
H'FFFF1B
H'FFFF1C
H'FFFFFF
On-chip RAM*
External
address
space
Internal I/O
registers
16-bit absolute addresses
H'FFF1B
H'FFF1C
External
address
space
Area 5
H'BFFFFF
H'C00000
8-bit absolute addresses
H'FFF00
H'FFF0F
H'FFF10
On-chip RAM *
16-bit absolute addresses
H'FEF0F
H'FEF10
8-bit absolute addresses
H'F8000
Note: * External addresses can be accessed by disabling on-chip RAM.
Figure 3.1 H8/3048B Group Memory Map in Each Operating Mode
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Section 3 MCU Operating Modes
H'07FFF
H'0000FF
On-chip ROM
H'007FFF
H'00000
Vector area
H'000FF
On-chip ROM
H'07FFF
16-bit absolute
addresses
Vector area
Mode 7
(single-chip advanced mode)
Memory-indirect
branch addresses
On-chip ROM
H'000000
16-bit absolute
addresses
H'000FF
Mode 6
(16-Mbyte expanded mode with
on-chip ROM enabled)
Memory-indirect
branch addresses
Vector area
16-bit absolute
addresses
H'00000
Memory-indirect
branch addresses
Mode 5
(1-Mbyte expanded mode with
on-chip ROM enabled)
H'1FFFF
H'01FFFF
H'020000
H'1FFFFF
H'200000
Area 0
Area 1
Area 2
Area 4
H'7FFFFF
H'800000
H'FFFFF
Internal I/O
registers
16-bit absolute addresses
H'FFF1B
H'FFF1C
External
address
space
Area 3
H'9FFFFF
H'A00000
Area 4
H'BFFFFF
H'C00000
Area 5
H'FEF10
Area 6
H'FFF00
H'FFF0F
H'F8000
On-chip RAM
H'DFFFFF
H'E00000
Area 7
H'FFF1C
H'FF8000
H'FFFFF
H'FFEF0F
H'FFEF10
H'FFFF00
H'FFFF0F
H'FFFF10
H'FFFF1B
H'FFFF1C
H'FFFFFF
On-chip RAM *
External
address
space
Internal I/O
registers
Internal I/O
registers
16-bit absolute addresses
Area 7
16-bit absolute addresses
Area 6
Area 2
External
address
space
8-bit absolute addresses
H'5FFFFF
H'600000
Area 5
8-bit absolute addresses
H'FFF00
H'FFF0F
H'FFF10
On-chip RAM *
Area 1
H'3FFFFF
H'400000
Area 3
H'F8000
H'FEF0F
H'FEF10
Area 0
8-bit absolute addresses
H'1FFFF
H'20000
H'3FFFF
H'40000
H'5FFFF
H'60000 External address
space
H'7FFFF
H'80000
H'9FFFF
H'A0000
H'BFFFF
H'C0000
H'DFFFF
H'E0000
Note: * External addresses can be accessed by disabling on-chip RAM.
Figure 3.1 H8/3048B Group Memory Map in Each Operating Mode (cont)
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Section 3 MCU Operating Modes
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Section 4 Exception Handling
Section 4 Exception Handling
4.1
Overview
4.1.1
Exception Handling Types and Priority
As table 4.1 indicates, exception handling may be caused by a reset, trap instruction, or interrupt.
Exception handling is prioritized as shown in table 4.1. If two or more exceptions occur
simultaneously, they are accepted and processed in priority order. Trap instruction exceptions are
accepted at all times in the program execution state.
Table 4.1
Exception Types and Priority
Priority
Exception Type
Start of Exception Handling
High
Reset
Starts immediately after a low-to-high transition at the
RES pin
Interrupt
Interrupt requests are handled when execution of the
current instruction or handling of the current exception is
completed
Trap instruction (TRAPA)
Started by execution of a trap instruction (TRAPA)
Low
4.1.2
Exception Handling Operation
Exceptions originate from various sources. Trap instructions and interrupts are handled as follows.
1. The program counter (PC) and condition code register (CCR) are pushed onto the stack.
2. The CCR interrupt mask bit is set to 1.
3. A vector address corresponding to the exception source is generated, and program execution
starts from the address indicated in that address.
Note: For a reset exception, steps 2 and 3 above are carried out.
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Section 4 Exception Handling
4.1.3
Exception Vector Table
The exception sources are classified as shown in figure 4.1. Different vectors are assigned to
different exception sources. Table 4.2 lists the exception sources and their vector addresses.
• Reset
External interrupts: NMI, IRQ 0 to IRQ5
Exception
sources
• Interrupts
• Trap instruction
Internal interrupts: 30 interrupts from on-chip
supporting modules
Figure 4.1 Exception Sources
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Section 4 Exception Handling
Table 4.2
Exception Vector Table
Exception Source
Vector Number
Vector Address*
Reset
0
H'0000 to H'0003
Reserved for system use
1
H'0004 to H'0007
2
H'0008 to H'000B
3
H'000C to H'000F
4
H'0010 to H'0013
5
H'0014 to H'0017
6
H'0018 to H'001B
External interrupt (NMI)
7
H'001C to H'001F
Trap instruction (4 sources)
8
H'0020 to H'0023
9
H'0024 to H'0027
10
H'0028 to H'002B
11
H'002C to H'002F
External interrupt IRQ0
12
H'0030 to H'0033
External interrupt IRQ1
13
H'0034 to H'0037
External interrupt IRQ2
14
H'0038 to H'003B
External interrupt IRQ3
15
H'003C to H'003F
External interrupt IRQ4
16
H'0040 to H'0043
External interrupt IRQ5
17
H'0044 to H'0047
Reserved for system use
18
H'0048 to H'004B
19
H'004C to H'004F
20
to
60
H'0050 to H'0053
to
H'00F0 to H'00F3
Internal interrupts*
2
1
Notes: 1. Lower 16 bits of the address.
2. For the internal interrupt vectors, see section 5.3.3, Interrupt Vector Table.
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Section 4 Exception Handling
4.2
Reset
4.2.1
Overview
A reset is the highest-priority exception. When the RES pin goes low, all processing halts and the
chip enters the reset state. A reset initializes the internal state of the CPU and the registers of the
on-chip supporting modules. Reset exception handling begins when the RES pin changes from
low to high.
The chip can also be reset by overflow of the watchdog timer. For details see section 12,
Watchdog Timer.
4.2.2
Reset Sequence
The chip enters the reset state when the RES pin goes low.
To ensure that the chip is reset properly, hold the RES pin low for at least 20 ms at power-up. To
reset the chip during operation, hold the RES pin low for at least 20 system clock (φ) cycles. See
appendix D.2, Pin States at Reset, for the states of the pins in the reset state.
When the RES pin goes high after being held low for the necessary time, the chip starts reset
exception handling as follows.
• The internal state of the CPU and the registers of the on-chip supporting modules are
initialized, and the I bit is set to 1 in CCR.
• The contents of the reset vector address (H'0000 to H'0003) are read, and program execution
starts from the address indicated in the vector address.
Figure 4.2 shows the reset sequence in modes 1 and 3. Figure 4.3 shows the reset sequence in
modes 2 and 4. Figure 4.4 shows the reset sequence in modes 5, 6, and 7.
Rev. 3.00 Sep 27, 2006 page 84 of 872
REJ09B0325-0300
(2)
(4)
(3)
(6)
(5)
(8)
(7)
Internal
processing
Address of reset vector: (1) = H'00000, (3) = H'00001, (5) = H'00002, (7) = H'00003
Start address (contents of reset vector)
Start address
First instruction of program
High
(1)
Note: After a reset, the wait-state controller inserts three wait states in every bus cycle.
(1), (3), (5), (7)
(2), (4), (6), (8)
(9)
(10)
D15 to D8
HWR , LWR
RD
Address
bus
RES
φ
Vector fetch
(10)
(9)
Prefetch of
first program
instruction
Section 4 Exception Handling
Figure 4.2 Reset Sequence (Modes 1 and 3)
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Section 4 Exception Handling
Internal
processing
Vector fetch
Prefetch of first
program instruction
φ
RES
Address bus
(1)
(3)
(5)
RD
HWR , LWR
D15 to D0
(1), (3)
(2), (4)
(5)
(6)
High
(2)
(4)
(6)
Address of reset vector: (1) = H'000000, (3) = H'000002
Start address (contents of reset vector)
Start address
First instruction of program
Note: After a reset, the wait-state controller inserts three wait states in every bus cycle.
Figure 4.3 Reset Sequence (Modes 2 and 4)
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Section 4 Exception Handling
Internal
processing
Vector fetch
Prefetch of
first program
instruction
φ
RES
Internal
address bus
(1)
(3)
(5)
Internal
read signal
Internal
write signal
Internal
data bus
(16 bits wide)
(1), (3)
(2), (4)
(5)
(6)
(2)
(4)
(6)
Address of reset vector ((1) = H'000000, (2) = H'000002)
Start address (contents of reset vector)
Start address
First instruction of program
Figure 4.4 Reset Sequence (Modes 5, 6, and 7)
4.2.3
Interrupts after Reset
If an interrupt is accepted after a reset but before the stack pointer (SP) is initialized, PC and CCR
will not be saved correctly, leading to a program crash. To prevent this, all interrupt requests,
including NMI, are disabled immediately after a reset. The first instruction of the program is
always executed immediately after the reset state ends. This instruction should initialize the stack
pointer (example: MOV.L #xx:32, SP).
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Section 4 Exception Handling
4.3
Interrupts
Interrupt exception handling can be requested by seven external sources (NMI, IRQ0 to IRQ5) and
30 internal sources in the on-chip supporting modules. Figure 4.5 classifies the interrupt sources
and indicates the number of interrupts of each type.
The on-chip supporting modules that can request interrupts are the watchdog timer (WDT), refresh
controller, 16-bit integrated timer unit (ITU), DMA controller (DMAC), serial communication
interface (SCI), and A/D converter. Each interrupt source has a separate vector address.
NMI is the highest-priority interrupt and is always accepted*. Interrupts are controlled by the
interrupt controller. The interrupt controller can assign interrupts other than NMI to two priority
levels, and arbitrate between simultaneous interrupts. Interrupt priorities are assigned in interrupt
priority registers A and B (IPRA and IPRB) in the interrupt controller.
For details on interrupts see section 5, Interrupt Controller.
Note: * For the H8/3048F-ONE (single power supply with flash memory), the NMI input may
be prohibited. For details, refer to section 18.8.4, NMI Input Disable Conditions.
External interrupts
NMI (1)
IRQ 0 to IRQ 5 (6)
Internal interrupts
WDT*1 (1)
Refresh controller*2 (1)
ITU (15)
DMAC (4)
SCI (8)
A/D converter (1)
Interrupts
Notes: Numbers in parentheses are the number of interrupt sources.
1. When the watchdog timer is used as an interval timer, it generates an interrupt
request at every counter overflow.
2. When the refresh controller is used as an interval timer, it generates an interrupt
request at compare match.
Figure 4.5 Interrupt Sources and Number of Interrupts
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Section 4 Exception Handling
4.4
Trap Instruction
Trap instruction exception handling starts when a TRAPA instruction is executed. If the UE bit is
set to 1 in the system control register (SYSCR), the exception handling sequence sets the I bit to 1
in CCR. If the UE bit is 0, the I and UI bits are both set to 1. The TRAPA instruction fetches a
start address from a vector table entry corresponding to a vector number from 0 to 3, which is
specified in the instruction code.
4.5
Stack Status after Exception Handling
Figure 4.6 shows the stack after completion of trap instruction exception handling and interrupt
exception handling.
SP-4
SP-3
SP-2
SP-1
SP (ER7) →
Stack area
SP (ER7) →
SP+1
SP+2
SP+3
SP+4
Before exception handling
CCR
PC E
PC H
PC L
Even address
After exception handling
Pushed on stack
Legend:
PCE: Bits 23 to 16 of program counter (PC)
PCH: Bits 15 to 8 of program counter (PC)
PCL: Bits 7 to 0 of program counter (PC)
CCR: Condition code register
SP: Stack pointer
Notes: 1. PC indicates the address of the first instruction that will be executed after return.
2. Registers must be saved in word or longword size at even addresses.
Figure 4.6 Stack after Completion of Exception Handling
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Section 4 Exception Handling
4.6
Notes on Stack Usage
When accessing word data or longword data, the H8/3048B Group regards the lowest address bit
as 0. The stack should always be accessed by word access or longword access, and the value of the
stack pointer (SP:ER7) should always be kept even. Use the following instructions to save
registers:
PUSH.W Rn
PUSH.L ERn
(or MOV.W Rn, @–SP)
(or MOV.L ERn, @–SP)
Use the following instructions to restore registers:
POP.W Rn
POP.L ERn
(or MOV.W @SP+, Rn)
(or MOV.L @SP+, ERn)
Setting SP to an odd value may lead to a malfunction. Figure 4.7 shows an example of what
happens when the SP value is odd.
SP
CCR
R1L
SP
H'FFFEFA
H'FFFEFB
PC
PC
H'FFFEFC
H'FFFEFD
H'FFFEFF
SP
TRAPA instruction executed
SP set to H'FFFEFF
MOV. B R1L, @-ER7
Data saved above SP
CCR contents lost
Legend:
CCR: Condition code register
PC: Program counter
R1L: General register R1L
SP: Stack pointer
Note: The diagram illustrates modes 3 and 4.
Figure 4.7 Operation when SP Value Is Odd
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Section 5 Interrupt Controller
Section 5 Interrupt Controller
5.1
Overview
5.1.1
Features
The interrupt controller has the following features:
• Interrupt priority registers (IPRs) for setting interrupt priorities
Interrupts other than NMI can be assigned to two priority levels on a module-by-module basis
in interrupt priority registers A and B (IPRA and IPRB).
• Three-level masking by the I and UI bits in the CPU condition code register (CCR)
• Independent vector addresses
All interrupts are independently vectored; the interrupt service routine does not have to
identify the interrupt source.
• Seven external interrupt pins
NMI has the highest priority and is always accepted*; either the rising or falling edge can be
selected. For each of IRQ0 to IRQ5, sensing of the falling edge or level sensing can be selected
independently.
Note: * For the H8/3048F-ONE (single power supply with flash memory), the NMI input may
be prohibited. For details, refer to section 18.8.4, NMI Input Disable Conditions.
Rev. 3.00 Sep 27, 2006 page 91 of 872
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Section 5 Interrupt Controller
5.1.2
Block Diagram
Figure 5.1 shows a block diagram of the interrupt controller.
CPU
ISCR
IER
IPRA, IPRB
NMI
input
IRQ input
section ISR
IRQ input
OVF
TME
.
.
.
.
.
.
.
ADI
ADIE
Priority
decision logic
Interrupt
request
Vector
number
.
.
.
I
UI
Interrupt controller
UE
SYSCR
Legend:
ISCR:
IER:
ISR:
IPRA:
IPRB:
SYSCR:
IRQ sense control register
IRQ enable register
IRQ status register
Interrupt priority register A
Interrupt priority register B
System control register
Figure 5.1 Interrupt Controller Block Diagram
Rev. 3.00 Sep 27, 2006 page 92 of 872
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CCR
Section 5 Interrupt Controller
5.1.3
Pin Configuration
Table 5.1 lists the interrupt pins.
Table 5.1
Interrupt Pins
Name
Abbreviation
I/O
Function
Nonmaskable interrupt
NMI
Input
Nonmaskable interrupt*, rising edge
or falling edge selectable
External interrupt request
5 to 0
IRQ5 to IRQ0
Input
Maskable interrupts, falling edge or
level sensing selectable
Note:
For the H8/3048F-ONE (single power supply with flash memory), the NMI input may be
prohibited. For details, refer to section 18.8.4, NMI Input Disable Conditions.
*
5.1.4
Register Configuration
Table 5.2 lists the registers of the interrupt controller.
Table 5.2
Interrupt Controller Registers
Address*
Name
Abbreviation
R/W
Initial Value
H'FFF2
System control register
SYSCR
R/W
H'0B
H'FFF4
IRQ sense control register
ISCR
R/W
H'00
H'FFF5
IRQ enable register
IER
H'FFF6
IRQ status register
ISR
R/W
2
R/(W)*
H'00
H'FFF8
Interrupt priority register A
IPRA
R/W
H'00
H'FFF9
Interrupt priority register B
IPRB
R/W
H'00
1
H'00
Notes: 1. Lower 16 bits of the address.
2. Only 0 can be written, to clear flags.
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Section 5 Interrupt Controller
5.2
Register Descriptions
5.2.1
System Control Register (SYSCR)
SYSCR is an 8-bit readable/writable register that controls software standby mode, selects the
action of the UI bit in CCR, selects the NMI edge, and enables or disables the on-chip RAM.
Only bits 3 and 2 are described here. For the other bits, see section 3.3, System Control Register
(SYSCR).
SYSCR is initialized to H'0B by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bit
7
6
5
4
3
2
1
0
SSBY
STS2
STS1
STS0
UE
NMIEG

RAME
Initial value
0
0
0
0
1
0
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W

R/W
RAM enable
Reserved bit
Standby timer
select 2 to 0
Software standby
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NMI edge select
Selects the NMI input edge
User bit enable
Selects whether to use the UI bit in
CCR as a user bit or interrupt mask bit
Section 5 Interrupt Controller
Bit 3—User Bit Enable (UE): Selects whether to use the UI bit in CCR as a user bit or an
interrupt mask bit.
Bit 3: UE
Description
0
UI bit in CCR is used as interrupt mask bit
1
UI bit in CCR is used as user bit
(Initial value)
Bit 2—NMI Edge Select (NMIEG): Selects the NMI input edge.
Bit 2: NMIEG
Description
0
Interrupt is requested at falling edge of NMI input
1
Interrupt is requested at rising edge of NMI input
5.2.2
(Initial value)
Interrupt Priority Registers A and B (IPRA, IPRB)
IPRA and IPRB are 8-bit readable/writable registers that control interrupt priority.
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Section 5 Interrupt Controller
Interrupt Priority Register A (IPRA)
IPRA is an 8-bit readable/writable register in which interrupt priority levels can be set.
Bit
7
6
5
4
3
2
1
0
IPRA7
IPRA6
IPRA5
IPRA4
IPRA3
IPRA2
IPRA1
IPRA0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Priority
level A0
Selects the
priority level
of ITU
channel 2
interrupt
requests
Priority level A1
Selects the priority level
of ITU channel 1
interrupt requests
Priority level A2
Selects the priority level of
ITU channel 0 interrupt requests
Priority level A3
Selects the priority level of WDT and
refresh controller interrupt requests
Priority level A4
Selects the priority level of IRQ4 and IRQ 5
interrupt requests
Priority level A5
Selects the priority level of IRQ 2 and IRQ 3 interrupt requests
Priority level A6
Selects the priority level of IRQ1 interrupt requests
Priority level A7
Selects the priority level of IRQ 0 interrupt requests
IPRA is initialized to H'00 by a reset and in hardware standby mode.
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Section 5 Interrupt Controller
Bit 7—Priority Level A7 (IPRA7): Selects the priority level of IRQ0 interrupt requests.
Bit 7: IPRA7
Description
0
IRQ0 interrupt requests have priority level 0 (low priority)
1
IRQ0 interrupt requests have priority level 1 (high priority)
(Initial value)
Bit 6—Priority Level A6 (IPRA6): Selects the priority level of IRQ1 interrupt requests.
Bit 6: IPRA6
Description
0
IRQ1 interrupt requests have priority level 0 (low priority)
1
IRQ1 interrupt requests have priority level 1 (high priority)
(Initial value)
Bit 5—Priority Level A5 (IPRA5): Selects the priority level of IRQ2 and IRQ3 interrupt requests.
Bit 5: IPRA5
Description
0
IRQ2 and IRQ3 interrupt requests have priority level 0 (low priority)
(Initial value)
1
IRQ2 and IRQ3 interrupt requests have priority level 1 (high priority)
Bit 4—Priority Level A4 (IPRA4): Selects the priority level of IRQ4 and IRQ5 interrupt requests.
Bit 4: IPRA4
Description
0
IRQ4 and IRQ5 interrupt requests have priority level 0 (low priority)
(Initial value)
1
IRQ4 and IRQ5 interrupt requests have priority level 1 (high priority)
Bit 3—Priority Level A3 (IPRA3): Selects the priority level of WDT and refresh controller
interrupt requests.
Bit 3: IPRA3
Description
0
WDT and refresh controller interrupt requests have priority level 0 (low priority)
(Initial value)
1
WDT and refresh controller interrupt requests have priority level 1 (high
priority)
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Section 5 Interrupt Controller
Bit 2—Priority Level A2 (IPRA2): Selects the priority level of ITU channel 0 interrupt requests.
Bit 2: IPRA2
Description
0
ITU channel 0 interrupt requests have priority level 0 (low priority) (Initial value)
1
ITU channel 0 interrupt requests have priority level 1 (high priority)
Bit 1—Priority Level A1 (IPRA1): Selects the priority level of ITU channel 1 interrupt requests.
Bit 1: IPRA1
Description
0
ITU channel 1 interrupt requests have priority level 0 (low priority) (Initial value)
1
ITU channel 1 interrupt requests have priority level 1 (high priority)
Bit 0—Priority Level A0 (IPRA0): Selects the priority level of ITU channel 2 interrupt requests.
Bit 0: IPRA0
Description
0
ITU channel 2 interrupt requests have priority level 0 (low priority) (Initial value)
1
ITU channel 2 interrupt requests have priority level 1 (high priority)
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Section 5 Interrupt Controller
Interrupt Priority Register B (IPRB)
IPRB is an 8-bit readable/writable register in which interrupt priority levels can be set.
Bit
7
6
5
4
3
2
1
0
IPRB7
IPRB6
IPRB5

IPRB3
IPRB2
IPRB1

Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reserved bit
Priority level B1
Selects the priority level
of A/D converter
interrupt request
Priority level B2
Selects the priority level of
SCI channel 1 interrupt requests
Priority level B3
Selects the priority level of SCI
channel 0 interrupt requests
Reserved bit
Priority level B5
Selects the priority level of DMAC
interrupt requests (channels 0 and 1)
Priority level B6
Selects the priority level of ITU channel 4 interrupt requests
Priority level B7
Selects the priority level of ITU channel 3 interrupt requests
IPRB is initialized to H'00 by a reset and in hardware standby mode.
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Section 5 Interrupt Controller
Bit 7—Priority Level B7 (IPRB7): Selects the priority level of ITU channel 3 interrupt requests.
Bit 7: IPRB7
Description
0
ITU channel 3 interrupt requests have priority level 0 (low priority) (Initial value)
1
ITU channel 3 interrupt requests have priority level 1 (high priority)
Bit 6—Priority Level B6 (IPRB6): Selects the priority level of ITU channel 4 interrupt requests.
Bit 6: IPRB6
Description
0
ITU channel 4 interrupt requests have priority level 0 (low priority) (Initial value)
1
ITU channel 4 interrupt requests have priority level 1 (high priority)
Bit 5—Priority Level B5 (IPRB5): Selects the priority level of DMAC interrupt requests
(channels 0 and 1).
Bit 5: IPRB5
Description
0
DMAC interrupt requests (channels 0 and 1) have priority level 0 (low priority)
(Initial value)
1
DMAC interrupt requests (channels 0 and 1) have priority level 1 (high priority)
Bit 4—Reserved: This bit can be written and read, but it does not affect interrupt priority.
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Section 5 Interrupt Controller
Bit 3—Priority Level B3 (IPRB3): Selects the priority level of SCI channel 0 interrupt requests.
Bit 3: IPRB3
Description
0
SCI0 interrupt requests have priority level 0 (low priority)
1
SCI0 interrupt requests have priority level 1 (high priority)
(Initial value)
Bit 2—Priority Level B2 (IPRB2): Selects the priority level of SCI channel 1 interrupt requests.
Bit 2: IPRB2
Description
0
SCI1 interrupt requests have priority level 0 (low priority)
1
SCI1 interrupt requests have priority level 1 (high priority)
(Initial value)
Bit 1—Priority Level B1 (IPRB1): Selects the priority level of A/D converter interrupt requests.
Bit 1: IPRB1
Description
0
A/D converter interrupt requests have priority level 0 (low priority) (Initial value)
1
A/D converter interrupt requests have priority level 1 (high priority)
Bit 0—Reserved: This bit can be written and read, but it does not affect interrupt priority.
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Section 5 Interrupt Controller
5.2.3
IRQ Status Register (ISR)
ISR is an 8-bit readable/writable register that indicates the status of IRQ0 to IRQ5 interrupt
requests.
Bit
7
6
5
4
3
2
1
0


IRQ5F
IRQ4F
IRQ3F
IRQ2F
IRQ1F
IRQ0F
Initial value
0
0
0
0
0
0
0
0
Read/Write


R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
Reserved bits
IRQ 5 to IRQ0 flags
These bits indicate IRQ 5 to IRQ 0
interrupt request status
Note: * Only 0 can be written, to clear flags.
ISR is initialized to H'00 by a reset and in hardware standby mode.
Bits 7 and 6—Reserved: Read-only bits, always read as 0.
Bits 5 to 0—IRQ5 to IRQ0 Flags (IRQ5F to IRQ0F): These bits indicate the status of IRQ5 to
IRQ0 interrupt requests.
Bits 5 to 0:
IRQ5F to IRQ0F
Description
0
[Clearing conditions]
(Initial value)
0 is written in IRQnF after reading the IRQnF flag when IRQnF = 1.
IRQnSC = 0, IRQn input is high, and interrupt exception handling is carried out.
IRQnSC = 1 and IRQn interrupt exception handling is carried out.
1
[Setting conditions]
IRQnSC = 0 and IRQn input is low.
IRQnSC = 1 and IRQn input changes from high to low.
Note: n = 5 to 0
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Section 5 Interrupt Controller
5.2.4
IRQ Enable Register (IER)
IER is an 8-bit readable/writable register that enables or disables IRQ0 to IRQ5 interrupt requests.
Bit
7
6
5
4
3
2
1
0


IRQ5E
IRQ4E
IRQ3E
IRQ2E
IRQ1E
IRQ0E
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reserved bits
IRQ 5 to IRQ0 enable
These bits enable or disable IRQ 5 to IRQ 0 interrupts
IER is initialized to H'00 by a reset and in hardware standby mode.
Bits 7 and 6—Reserved: These bits can be written and read, but they do not enable or disable
interrupts.
Bits 5 to 0—IRQ5 to IRQ0 Enable (IRQ5E to IRQ0E): These bits enable or disable IRQ5 to
IRQ0 interrupts.
Bits 5 to 0:
IRQ5E to IRQ0E
Description
0
IRQ5 to IRQ0 interrupts are disabled
1
IRQ5 to IRQ0 interrupts are enabled
(Initial value)
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Section 5 Interrupt Controller
5.2.5
IRQ Sense Control Register (ISCR)
ISCR is an 8-bit readable/writable register that selects level sensing or falling-edge sensing of the
inputs at pins IRQ5 to IRQ0.
Bit
7
6


5
4
3
2
1
0
IRQ5SC IRQ4SC IRQ3SC IRQ2SC IRQ1SC IRQ0SC
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reserved bits
IRQ 5 to IRQ0 sense control
These bits select level sensing or falling-edge
sensing for IRQ 5 to IRQ 0 interrupts
ISCR is initialized to H'00 by a reset and in hardware standby mode.
Bits 7 and 6—Reserved: These bits can be written and read, but they do not select level or
falling-edge sensing.
Bits 5 to 0—IRQ5 to IRQ0 Sense Control (IRQ5SC to IRQ0SC): These bits select whether
interrupts IRQ5 to IRQ0 are requested by level sensing of pins IRQ5 to IRQ0, or by falling-edge
sensing.
Bits 5 to 0:
IRQ5SC to IRQ0SC
Description
0
Interrupts are requested when IRQ5 to IRQ0 inputs are low
1
Interrupts are requested by falling-edge input at IRQ5 to IRQ0
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(Initial value)
Section 5 Interrupt Controller
5.3
Interrupt Sources
The interrupt sources include external interrupts (NMI, IRQ0 to IRQ5) and 30 internal interrupts.
5.3.1
External Interrupts
There are seven external interrupts: NMI, and IRQ0 to IRQ5. Of these, NMI, IRQ0, IRQ1, and IRQ2
can be used to exit software standby mode.
NMI
NMI is the highest-priority interrupt and is always accepted, regardless of the states of the I and UI
bits in CCR. The NMIEG bit in SYSCR selects whether an interrupt is requested by the rising or
falling edge of the input at the NMI pin*. NMI interrupt exception handling has vector number 7.
Note: * For the H8/3048F-ONE (single power supply with flash memory), the NMI input may
be prohibited. For details, refer to section 18.8.4, NMI Input Disable Conditions.
IRQ0 to IRQ5 Interrupts
These interrupts are requested by input signals at pins IRQ0 to IRQ5. The IRQ0 to IRQ5 interrupts
have the following features.
• ISCR settings can select whether an interrupt is requested by the low level of the input at pins
IRQ0 to IRQ5, or by the falling edge.
• IER settings can enable or disable the IRQ0 to IRQ5 interrupts. Interrupt priority levels can be
assigned by four bits in IPRA (IPRA7 to IPRA4).
• The status of IRQ0 to IRQ5 interrupt requests is indicated in ISR. The ISR flags can be cleared
to 0 by software.
Figure 5.2 shows a block diagram of interrupts IRQ0 to IRQ5.
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Section 5 Interrupt Controller
IRQnSC
IRQnE
IRQnF
Edge/level
sense circuit
S
Q
IRQn interrupt
request
R
IRQn input
Clear signal
Note: n = 5 to 0
Figure 5.2 Block Diagram of Interrupts IRQ0 to IRQ5
Figure 5.3 shows the timing of the setting of the interrupt flags (IRQnF).
φ
IRQn
input pin
IRQnF
Note: n = 5 to 0
Figure 5.3 Timing of Setting of IRQnF
Interrupts IRQ0 to IRQ5 have vector numbers 12 to 17. These interrupts are detected regardless of
whether the corresponding pin is set for input or output. When using a pin for external interrupt
input, clear its DDR bit to 0 and do not use the pin for chip select output, refresh output, or SCI
input or output.
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Section 5 Interrupt Controller
5.3.2
Internal Interrupts
Thirty internal interrupts are requested from the on-chip supporting modules.
• Each on-chip supporting module has status flags for indicating interrupt status, and enable bits
for enabling or disabling interrupts.
• Interrupt priority levels can be assigned in IPRA and IPRB.
• ITU and SCI interrupt requests can activate the DMAC, in which case no interrupt request is
sent to the interrupt controller, and the I and UI bits are disregarded.
5.3.3
Interrupt Vector Table
Table 5.3 lists the interrupt sources, their vector addresses, and their default priority order. In the
default priority order, smaller vector numbers have higher priority. The priority of interrupts other
than NMI can be changed in IPRA and IPRB. The priority order after a reset is the default order
shown in table 5.3.
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Section 5 Interrupt Controller
Table 5.3
Interrupt Sources, Vector Addresses, and Priority
Interrupt Source
Origin
Vector
Number
Vector Address*
IPR
Priority
NMI
External pins
7
H'001C to H'001F
—
High
IRQ0
12
H'0030 to H'0033
IPRA7
IRQ1
13
H'0034 to H0037
IPRA6
IRQ2
14
H'0038 to H'003B
IPRA5
IRQ3
15
H'003C to H'003F
IRQ4
16
H'0040 to H'0043
IRQ5
17
H'0044 to H'0047
18
H'0048 to H'004B
19
H'004C to H'004F
Reserved
—
WOVI
(interval timer)
Watchdog
timer
20
H'0050 to H'0053
CMI
(compare match)
Refresh
controller
21
H'0054 to H'0057
Reserved
—
22
H'0058 to H'005B
23
H'005C to H'005F
24
H'0060 to H'0063
25
H'0064 to H'0067
IMIA0
(compare match/
input capture A0)
ITU channel 0
IMIB0
(compare match/
input capture B0)
OVI0 (overflow 0)
26
H'0068 to H'006B
Reserved
—
27
H'006C to H'006F
IMIA1
(compare match/
input capture A1)
ITU channel 1
28
H'0070 to H'0073
IMIB1
(compare match/
input capture B1)
29
H'0074 to H'0077
OVI1 (overflow 1)
30
H'0078 to H'007B
31
H'007C to H'007F
Reserved
—
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IPRA4
IPRA3
IPRA2
IPRA1
Low
Section 5 Interrupt Controller
Interrupt Source
Origin
Vector
Number
Vector Address*
IPR
Priority
IMIA2
(compare match/
input capture A2)
ITU channel 2
32
H'0080 to H'0083
IPRA0
High
IMIB2
(compare match/
input capture B2)
33
H'0084 to H'0087
OVI2 (overflow 2)
34
H'0088 to H'008B
Reserved
—
35
H'008C to H'008F
IMIA3
(compare match/
input capture A3)
ITU channel 3
36
H'0090 to H'0093
37
H'0094 to H'0097
IMIB3
(compare match/
input capture B3)
OVI3 (overflow 3)
38
H'0098 to H'009B
Reserved
—
39
H'009C to H'009F
IMIA4
(compare match/
input capture A4)
ITU channel 4
40
H'00A0 to H'00A3
IMIB4
(compare match/
input capture B4)
41
H'00A4 to H'00A7
OVI4 (overflow 4)
42
H'00A8 to H'00AB
Reserved
—
43
H'00AC to H'00AF
DEND0A
DMAC
44
H'00B0 to H'00B3
DEND0B
45
H'00B4 to H'00B7
DEND1A
46
H'00B8 to H'00BB
DEND1B
47
H'00BC to H'00BF
48
H'00C0 to H'00C3
49
H'00C4 to H'00C7
50
H'00C8 to H'00CB
51
H'00CC to H'00CF
Reserved
—
IPRB7
IPRB6
IPRB5
—
Low
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Section 5 Interrupt Controller
Interrupt Source
Origin
Vector
Number
Vector Address*
IPR
Priority
ERI0
(receive error 0)
SCI channel 0
52
H'00D0 to H'00D3
IPRB3
High
RXI0
(receive data full 0)
53
H'00D4 to H'00D7
TXI0 (transmit data
empty 0)
54
H'00D8 to H'00DB
TEI0
(transmit end 0)
55
H'00DC to H'00DF
56
H'00E0 to H'00E3
RXI1
(receive data full 1)
57
H'00E4 to H'00E7
TXI1 (transmit data
empty 1)
58
H'00E8 to H'00EB
TEI1
(transmit end 1)
59
H'00EC to H'00EF
60
H'00F0 to H'00F3
ERI1
(receive error 1)
ADI (A/D end)
Note:
*
SCI channel 1
A/D
Lower 16 bits of the address.
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IPRB2
IPRB1
Low
Section 5 Interrupt Controller
5.4
Interrupt Operation
5.4.1
Interrupt Handling Process
The H8/3048B Group handles interrupts differently depending on the setting of the UE bit. When
UE = 1, interrupts are controlled by the I bit. When UE = 0, interrupts are controlled by the I and
UI bits. Table 5.4 indicates how interrupts are handled for all setting combinations of the UE, I,
and UI bits.
NMI interrupts are always accepted except in the reset and hardware standby states*. IRQ
interrupts and interrupts from the on-chip supporting modules have their own enable bits. Interrupt
requests are ignored when the enable bits are cleared to 0.
Note: * For the H8/3048F-ONE (single power supply with flash memory), the NMI input may
be prohibited. For details, refer to section 18.8.4, NMI Input Disable Conditions.
Table 5.4
UE, I, and UI Bit Settings and Interrupt Handling
SYSCR
CCR
UE
I
UI
Description
1
0
—
All interrupts are accepted. Interrupts with priority level 1 have higher
priority.
1
—
No interrupts are accepted except NMI.
0
—
All interrupts are accepted. Interrupts with priority level 1 have higher
priority.
1
0
NMI and interrupts with priority level 1 are accepted.
1
No interrupts are accepted except NMI.
0
UE = 1
Interrupts IRQ0 to IRQ5 and interrupts from the on-chip supporting modules can all be masked by
the I bit in the CPU’s CCR. Interrupts are masked when the I bit is set to 1, and unmasked when
the I bit is cleared to 0. Interrupts with priority level 1 have higher priority. Figure 5.4 is a
flowchart showing how interrupts are accepted when UE = 1.
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Section 5 Interrupt Controller
Program execution state
No
Interrupt requested?
Yes
Yes
NMI
No
No
Pending
Priority level 1?
Yes
IRQ 0
No
Yes
IRQ 1
IRQ 0
No
Yes
No
IRQ 1
Yes
No
Yes
ADI
ADI
Yes
Yes
No
I=0
Yes
Save PC and CCR
I ←1
Read vector address
Branch to interrupt
service routine
Figure 5.4 Process Up to Interrupt Acceptance when UE = 1
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Section 5 Interrupt Controller
• If an interrupt condition occurs and the corresponding interrupt enable bit is set to 1, an
interrupt request is sent to the interrupt controller.
• When the interrupt controller receives one or more interrupt requests, it selects the highestpriority request, following the IPR interrupt priority settings, and holds other requests pending.
If two or more interrupts with the same IPR setting are requested simultaneously, the interrupt
controller follows the priority order shown in table 5.3.
• The interrupt controller checks the I bit. If the I bit is cleared to 0, the selected interrupt request
is accepted. If the I bit is set to 1, only NMI is accepted; other interrupt requests are held
pending.
• When an interrupt request is accepted, interrupt exception handling starts after execution of the
current instruction has been completed.
• In interrupt exception handling, PC and CCR are saved to the stack area. The PC value that is
saved indicates the address of the first instruction that will be executed after the return from the
interrupt service routine.
• Next the I bit is set to 1 in CCR, masking all interrupts except NMI.
• The vector address of the accepted interrupt is generated, and the interrupt service routine
starts executing from the address indicated by the contents of the vector address.
UE = 0
The I and UI bits in the CPU’s CCR and the IPR bits enable three-level masking of IRQ0 to IRQ5
interrupts and interrupts from the on-chip supporting modules.
• Interrupt requests with priority level 0 are masked when the I bit is set to 1, and are unmasked
when the I bit is cleared to 0.
• Interrupt requests with priority level 1 are masked when the I and UI bits are both set to 1, and
are unmasked when either the I bit or the UI bit is cleared to 0.
For example, if the interrupt enable bits of all interrupt requests are set to 1, IPRA is set to
H'20, and IPRB is set to H'00 (giving IRQ2 and IRQ3 interrupt requests priority over other
interrupts), interrupts are masked as follows:
a. If I = 0, all interrupts are unmasked (priority order: NMI > IRQ2 > IRQ3 >IRQ0 …).
b. If I = 1 and UI = 0, only NMI, IRQ2, and IRQ3 are unmasked.
c. If I = 1 and UI = 1, all interrupts are masked except NMI.
Figure 5.5 shows the transitions among the above states.
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Section 5 Interrupt Controller
I←0
a. All interrupts are
unmasked
I←0
b. Only NMI, IRQ 2 , and
IRQ 3 are unmasked
I ← 1, UI ← 0
Exception handling,
or I ← 1, UI ← 1
UI ← 0
Exception handling,
or UI ← 1
c. All interrupts are
masked except NMI
Figure 5.5 Interrupt Masking State Transitions (Example)
Figure 5.6 is a flowchart showing how interrupts are accepted when UE = 0.
• If an interrupt condition occurs and the corresponding interrupt enable bit is set to 1, an
interrupt request is sent to the interrupt controller.
• When the interrupt controller receives one or more interrupt requests, it selects the highestpriority request, following the IPR interrupt priority settings, and holds other requests pending.
If two or more interrupts with the same IPR setting are requested simultaneously, the interrupt
controller follows the priority order shown in table 5.3.
• The interrupt controller checks the I bit. If the I bit is cleared to 0, the selected interrupt request
is accepted regardless of its IPR setting, and regardless of the UI bit. If the I bit is set to 1 and
the UI bit is cleared to 0, only NMI and interrupts with priority level 1 are accepted; interrupt
requests with priority level 0 are held pending. If the I bit and UI bit are both set to 1, only
NMI is accepted; all other interrupt requests are held pending.
• When an interrupt request is accepted, interrupt exception handling starts after execution of the
current instruction has been completed.
• In interrupt exception handling, PC and CCR are saved to the stack area. The PC value that is
saved indicates the address of the first instruction that will be executed after the return from the
interrupt service routine.
• The I and UI bits are set to 1 in CCR, masking all interrupts except NMI.
• The vector address of the accepted interrupt is generated, and the interrupt service routine
starts executing from the address indicated by the contents of the vector address.
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Section 5 Interrupt Controller
Program execution state
No
Interrupt requested?
Yes
Yes
NMI
No
No
Pending
Priority level 1?
Yes
IRQ 0
No
IRQ 0
Yes
IRQ 1
No
Yes
No
IRQ 1
Yes
No
Yes
ADI
ADI
Yes
Yes
No
No
I=0
I=0
Yes
Yes
No
UI = 0
Yes
Save PC and CCR
I ← 1, UI ← 1
Read vector address
Branch to interrupt
service routine
Figure 5.6 Process Up to Interrupt Acceptance when UE = 0
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(2)
(1)
(4)
High
(3)
(8)
(7)
(10)
(9)
(12)
(11)
Vector fetch
(14)
(13)
(6), (8)
PC and CCR saved to stack
(9), (11) Vector address
(10), (12) Starting address of interrupt service routine (contents of
vector address)
(13)
Starting address of interrupt service routine; (13) = (10), (12)
(14)
First instruction of interrupt service routine
(6)
(5)
Stack
Note: Mode 2, with program code and stack in external memory area accessed in two states via 16-bit bus.
Instruction prefetch address (not executed;
return address, same as PC contents)
(2), (4) Instruction code (not executed)
(3)
Instruction prefetch address (not executed)
(5)
SP – 2
(7)
SP – 4
(1)
D15 to D0
HWR , LWR
RD
Address
bus
Interrupt
request
signal
φ
Instruction Internal
prefetch
processing
Prefetch of
interrupt
Internal
service routine
processing instruction
5.4.2
Interrupt level
decision and wait
for end of instruction
Interrupt accepted
Section 5 Interrupt Controller
Interrupt Sequence
Figure 5.7 shows the interrupt sequence in mode 2 when the program code and stack are in an
external memory area accessed in two states via a 16-bit bus.
Figure 5.7 Interrupt Sequence (Mode 2, Two-State Access, Stack in External Memory)
Section 5 Interrupt Controller
5.4.3
Interrupt Response Time
Table 5.5 indicates the interrupt response time from the occurrence of an interrupt request until the
first instruction of the interrupt service routine is executed.
Table 5.5
Interrupt Response Time
External Memory
No.
Item
8-Bit Bus
16-Bit Bus
On-Chip
Memory
2 States
3 States
2 States
3 States
2*
2*
2*
2*
1
Interrupt priority
decision
2*
2
Maximum number of
states until end of
current instruction
1 to 23*
3
Saving PC and CCR
to stack
4
8
12*
4
4
6*
4
Vector fetch
4
8
4
5
Instruction prefetch*
3
Internal processing*
4
8
12*
4
12*
4
6*
4
6*
4
4
4
4
4
19 to 41
31 to 57
43 to 83
19 to 41
25 to 49
6
Total
2
1
5
1
1
5 6
6
1 to 27* * 1 to 41*
4
1
1 to 23*
5
1
1 to 25*
5
4
4
Notes: 1. 1 state for internal interrupts.
2. Prefetch after the interrupt is accepted and prefetch of the first instruction in the
interrupt service routine.
3. Internal processing after the interrupt is accepted and internal processing after prefetch.
4. The number of states increases if wait states are inserted in external memory access.
5. Example for DIVXS.W Rs,ERd and MULXS.W Rs,ERd
6. Example for MOV.L @(d:24,ERs),ERd and MOV.L ERs,@(d:24,ERd)
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Section 5 Interrupt Controller
5.5
Usage Notes
5.5.1
Contention between Interrupt and Interrupt-Disabling Instruction
When an instruction clears an interrupt enable bit to 0 to disable the interrupt, the interrupt is not
disabled until after execution of the instruction is completed. If an interrupt occurs while a BCLR,
MOV, or other instruction is being executed to clear its interrupt enable bit to 0, at the instant
when execution of the instruction ends the interrupt is still enabled, so its interrupt exception
handling is carried out. If a higher-priority interrupt is also requested, however, interrupt exception
handling for the higher-priority interrupt is carried out, and the lower-priority interrupt is ignored.
This also applies to the clearing of an interrupt flag.
Figure 5.8 shows an example in which an IMIEA bit is cleared to 0 in TIER of the ITU.
TIER write cycle by CPU
IMIA exception handling
φ
Internal
address bus
TIER address
Internal
write signal
IMIEA
IMIA
IMFA interrupt
signal
Figure 5.8 Contention between Interrupt and Interrupt-Disabling Instruction
This type of contention will not occur if the interrupt is masked when the interrupt enable bit or
flag is cleared to 0.
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Section 5 Interrupt Controller
5.5.2
Instructions That Inhibit Interrupts
The LDC, ANDC, ORC, and XORC instructions inhibit interrupts. When an interrupt occurs, after
determining the interrupt priority, the interrupt controller requests a CPU interrupt. If the CPU is
currently executing one of these interrupt-inhibiting instructions, however, when the instruction is
completed the CPU always continues by executing the next instruction.
5.5.3
Interrupts during EEPMOV Instruction Execution
The EEPMOV.B and EEPMOV.W instructions differ in their reaction to interrupt requests.
When the EEPMOV.B instruction is executing a transfer, no interrupts are accepted until the
transfer is completed, not even NMI.
When the EEPMOV.W instruction is executing a transfer, interrupt requests other than NMI are
not accepted until the transfer is completed. If NMI is requested, NMI exception handling starts at
a transfer cycle boundary. The PC value saved on the stack is the address of the next instruction.
Programs should be coded as follows to allow for NMI interrupts during EEPMOV.W execution:
L1: EEPMOV.W
MOV.W R4,R4
BNE
5.5.4
L1
Usage Notes on External Interrupts
The IRQnF flag specification calls for the flag to be cleared by writing 0 to it after it has been read
while set to 1. However, it is possible for the IRQnF flag to be cleared by mistake simply by
writing 0 to it, irrespective of whether it has been read while set to 1, with the result that interrupt
exception handling is not executed. This occurs when the following conditions are fulfilled.
• Setting conditions
1. Multiple external interrupts (IRQa, IRQb) are being used.
2. Different clearing methods are being used: clearing by writing 0 for the IRQaF flag, and
clearing by hardware for the IRQbF flag.
3. A bit manipulation instruction is used on the IRQ status register to clear the IRQaF flag, or
else ISR is read as a byte unit, the IRQaF flag bit is cleared, and the values read in the other
bits are written as a byte unit.
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Section 5 Interrupt Controller
• Occurrence conditions
1. When IRQaF = 1, for the IRQaF flag to clear, ISR register read is executed. Thereafter
interrupt processing is carried out and IRQbF flag clears.
2. IRQaF flag clear and IRQbF flag generation compete (IRQaF flag setting).
(The ISR read needed for IRQaF flag clear was at IRQbF = 0 but in the time taken for ISR
write, IRQbF = 1 was reached.)
In all of the setting conditions 1 to 3 and occurrence conditions 1 and 2 are generated, IRQbF
clears in error during ISR write for occurrence condition 2 and interrupt processing is not carried
out. However, if IRQbF flag reaches 0 between occurrence conditions 1 and 2, IRQbF flag does
not clear in error.
IRQaF
Read Write
1
0
Read Write
1
0
Read Write IRQb
1
1
Execution
Read
0
IRQbF
Write
0
Clear in error
Occurrence condition 1
Occurrence condition 2
Figure 5.9 IRQnF Flag When Interrupt Processing Is Not Conducted
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Section 5 Interrupt Controller
In this situation, conduct one of the following countermeasures.
Countermeasure 1: When clears IRQaF flag, do not use the bit manipulation instruction, read the
ISR in bytes. Then write a value in bytes which sets IRQaF flag to 0 and other bits to 1.
For example, if a = 0
MOV.B @ISR,R0L
MOV.B #HFE,R0L
MOV.B R0L,@ISR
Countermeasure 2: During IRQb interrupt exception processing, carry out IRQbF flag clear
dummy processing.
For example, if b = 1
IRQB
MOV.B #HFD,R0L
MOV.B R0L,@ISR
·
·
·
5.5.5
Notes on Non-Maskable Interrupts (NMI)
NMI is an exception processing that can be executed by the interrupt controller and CPU when the
chip internal circuits are operating normally under a specified electrical characteristics. If an NMI
is executed when the circuits are not operating normally due to some factors such as software or
abnormal interrupt of input to the pins (runaway execution), the operation will not be guaranteed.
Incorrect NMI Operation Factors: Software
1. When an interrupt exception processing is executed in an H8/300H CPU, it is assumed that the
stack pointer (SP(ER7)) has already been set by software, and that the stack pointer (SP(ER7))
points to the stack area set in a system such as RAM. If the program is in a runaway execution,
the stack pointer may be overflowed and updated illegally. Therefore, normal operation will
not be guaranteed.
2. Requests for NMIs can be accepted on the rising or falling edge of a pin. Acceptance of the
rising or falling edge depends on the setting of the bit NMIEG in the system control register
(SYSCR). It is necessary for the customer to set the bit according to the designated system.
When the program is in a runaway execution, this bit may be rewritten illegally. Therefore, the
system may not operate as expected.
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Section 5 Interrupt Controller
3. This chip has a break function to implement on-board emulation for specific customers. To use
this break function, execute the BRK instruction (H'5770). Note that the BRK instruction is
usually undefined. Therefore, if the CPU accidentally executes the instruction, the chip will
perform exceptional processing and will enter the break mode. In the break mode, interrupts
including the NMI are inhibited and the count of the watch dog timer will be stopped. Then by
executing the RTB (H'56F0) instruction, the break mode will be cancelled, and usual program
execution will resume. When the execution is reset during break mode, the CPU enters the
reset state and the break mode is cancelled. Once the reset has been cancelled, normal program
execution will resume after the reset exception processing has been executed.
Incorrect NMI Operation Factors: Abnormal Interrupts Input to the Chip Pins
If an abnormal interrupt which was not specified in the electrical characteristics is input to a pin
during a chip operation, the chip may be destroyed. In this case, the operation of the chip will not
be guaranteed.
When an abnormal interrupt has been input to a pin, the chip may not be destroyed; however, the
internal circuits of the chip may partially or wholly malfunction, and the CPU may enter an
unimagined undefined state when the CPU was designed. If this occurs, it will be impossible to
control the operation of the chip by external pins other than the external reset and standby pins,
and the operation of the NMI will not be guaranteed. In this case, after some specified signals have
been input to the pins, input an external reset so that the chip can enter the normal program
execution state again.
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Section 6 Bus Controller
Section 6 Bus Controller
6.1
Overview
The H8/3048B Group has an on-chip bus controller that divides the address space into eight areas
and can assign different bus specifications to each. This enables different types of memory to be
connected easily.
A bus arbitration function of the bus controller controls the operation of the DMA controller
(DMAC) and refresh controller. The bus controller can also release the bus to an external device.
6.1.1
Features
Features of the bus controller are listed below.
• Independent settings for address areas 7 to 0
 128-kbyte areas in 1-Mbyte modes; 2-Mbyte areas in 16-Mbyte modes.
 Chip select signals (CS7 to CS0) can be output for areas 7 to 0.
 Areas can be designated for 8-bit or 16-bit access.
 Areas can be designated for two-state or three-state access.
• Four wait modes
 Programmable wait mode, pin auto-wait mode, and pin wait modes 0 and 1 can be selected.
 Zero to three wait states can be inserted automatically.
• Bus arbitration function
 A built-in bus arbiter arbitrates the bus right to the CPU, DMAC, refresh controller, or an
external bus master.
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Section 6 Bus Controller
6.1.2
Block Diagram
Figure 6.1 shows a block diagram of the bus controller.
CS7 to CS0
ABWCR
Internal
address bus
ASTCR
Area
decoder
WCER
Chip select
control signals
CSCR
Internal signals
Bus mode control signal
Bus control
circuit
Bus size control signal
Access state control signal
Internal data bus
Wait request signal
Wait-state
controller
WAIT
WCR
Internal signals
CPU bus request signal
DMAC bus request signal
Refresh controller bus request signal
CPU bus acknowledge signal
DMAC bus acknowledge signal
Refresh controller bus acknowledge signal
BRCR
Bus arbiter
BACK
Legend:
ABWCR:
ASTCR:
WCER:
WCR:
BRCR:
CSCR:
Bus width control register
Access state control register
Wait state controller enable register
Wait control register
Bus release control register
Chip select control register
BREQ
Figure 6.1 Block Diagram of Bus Controller
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Section 6 Bus Controller
6.1.3
Input/Output Pins
Table 6.1 summarizes the bus controller’s input/output pins.
Table 6.1
Bus Controller Pins
Name
Abbreviation
I/O
Function
Chip select 7 to 0
CS7 to CS0
Output
Strobe signals selecting areas 7 to 0
Address strobe
AS
Output
Strobe signal indicating valid address output
on the address bus
Read
RD
Output
Strobe signal indicating reading from the
external address space
High write
HWR
Output
Strobe signal indicating writing to the
external address space, with valid data on
the upper data bus (D15 to D8)
Low write
LWR
Output
Strobe signal indicating writing to the
external address space, with valid data on
the lower data bus (D7 to D0)
Wait
WAIT
Input
Wait request signal for access to external
three-state-access areas
Bus request
BREQ
Input
Request signal for releasing the bus to an
external device
Bus acknowledge
BACK
Output
Acknowledge signal indicating the bus is
released to an external device
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Section 6 Bus Controller
6.1.4
Register Configuration
Table 6.2 summarizes the bus controller’s registers.
Table 6.2
Bus Controller Registers
Initial Value
Address*
Name
Abbreviation
R/W
Modes
1, 3, 5, 6
Modes
2, 4, 7
H'FFEC
Bus width control register
ABWCR
R/W
H'FF
H'00
H'FFED
Access state control register
ASTCR
R/W
H'FF
H'FF
H'FFEE
Wait control register
WCR
R/W
H'F3
H'F3
H'FFEF
Wait state controller enable
register
WCER
R/W
H'FF
H'FF
H'FFF3
Bus release control register
BRCR
R/W
H'FE
H'FE
Chip select control register
CSCR
R/W
H'0F
H'0F
H'FF5F
Note:
*
Lower 16 bits of the address.
6.2
Register Descriptions
6.2.1
Bus Width Control Register (ABWCR)
ABWCR is an 8-bit readable/writable register that selects 8-bit or 16-bit access for each area.
Bit
Initial
value
7
6
5
4
3
2
1
0
ABW7
ABW6
ABW5
ABW4
ABW3
ABW2
ABW1
ABW0
Modes 1, 3, 5, 6
1
1
1
1
1
1
1
1
Modes 2, 4, 7
0
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Read/Write
Bits selecting bus width for each area
When ABWCR contains H'FF (selecting 8-bit access for all areas), the chip operates in 8-bit bus
mode: the upper data bus (D15 to D8) is valid, and port 4 is an input/output port. When at least one
bit is cleared to 0 in ABWCR, the chip operates in 16-bit bus mode with a 16-bit data bus (D15 to
D0). In modes 1, 3, 5, and 6 ABWCR is initialized to H'FF by a reset and in hardware standby
mode. In modes 2, 4, and 7 ABWCR is initialized to H'00 by a reset and in hardware standby
mode. ABWCR is not initialized in software standby mode.
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Section 6 Bus Controller
Bits 7 to 0—Areas 7 to 0 Bus Width Control (ABW7 to ABW0): These bits select 8-bit access
or 16-bit access to the corresponding address areas.
Bits 7 to 0:
ABW7 to ABW0
Description
0
Areas 7 to 0 are 16-bit access areas
1
Areas 7 to 0 are 8-bit access areas
ABWCR specifies the bus width of external memory areas. The bus width of on-chip memory and
internal I/O registers is fixed and does not depend on ABWCR settings. These settings are
therefore meaningless in single-chip mode (mode 7).
6.2.2
Access State Control Register (ASTCR)
ASTCR is an 8-bit readable/writable register that selects whether each area is accessed in two
states or three states.
Bit
7
6
5
4
3
2
1
0
AST7
AST6
AST5
AST4
AST3
AST2
AST1
AST0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bits selecting number of states for access to each area
ASTCR is initialized to H'FF by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bits 7 to 0—Areas 7 to 0 Access State Control (AST7 to AST0): These bits select whether the
corresponding area is accessed in two or three states.
Bits 7 to 0:
AST7 to AST0
Description
0
Areas 7 to 0 are accessed in two states
1
Areas 7 to 0 are accessed in three states
(Initial value)
ASTCR specifies the number of states in which external areas are accessed. On-chip memory and
internal I/O registers are accessed in a fixed number of states that does not depend on ASTCR
settings. These settings are therefore meaningless in single-chip mode (mode 7).
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Section 6 Bus Controller
6.2.3
Wait Control Register (WCR)
WCR is an 8-bit readable/writable register that selects the wait mode for the wait-state controller
(WSC) and specifies the number of wait states.
Bit
7
6
5
4
3
2
1
0




WMS1
WMS0
WC1
WC0
Initial value
1
1
1
1
0
0
1
1
Read/Write




R/W
R/W
R/W
R/W
Reserved bits
Wait count 1/0
These bits select the
number of wait states
inserted
Wait mode select 1/0
These bits select the wait mode
WCR is initialized to H'F3 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bits 7 to 4—Reserved: Read-only bits, always read as 1.
Bits 3 and 2—Wait Mode Select 1 and 0 (WMS1, WMS0): These bits select the wait mode.
Bit 3: WMS1
Bit 2: WMS0
Description
0
0
Programmable wait mode
1
No wait states inserted by wait-state controller
0
Pin wait mode 1
1
Pin auto-wait mode
1
(Initial value)
Bits 1 and 0—Wait Count 1 and 0 (WC1, WC0): These bits select the number of wait states
inserted in access to external three-state-access areas.
Bit 1: WC1
Bit 0: WC0
Description
0
0
No wait states inserted by wait-state controller
1
1 state inserted
0
2 states inserted
1
3 states inserted
1
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(Initial value)
Section 6 Bus Controller
6.2.4
Wait State Controller Enable Register (WCER)
WCER is an 8-bit readable/writable register that enables or disables wait-state control of external
three-state-access areas by the wait-state controller.
Bit
7
6
5
4
3
2
1
0
WCE7
WCE6
WCE5
WCE4
WCE3
WCE2
WCE1
WCE0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Wait-state controller enable 7 to 0
These bits enable or disable wait-state control
WCER is initialized to H'FF by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bits 7 to 0—Wait-State Controller Enable 7 to 0 (WCE7 to WCE0): These bits enable or
disable wait-state control of external three-state-access areas.
Bits 7 to 0:
WCE7 to WCE0
Description
0
Wait-state control disabled (pin wait mode 0)
1
Wait-state control enabled
(Initial value)
Since WCER enables or disables wait-state control of external three-state-access areas, these
settings are meaningless in single-chip mode (mode 7).
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Section 6 Bus Controller
6.2.5
Bus Release Control Register (BRCR)
BRCR is an 8-bit readable/writable register that enables address output on bus lines A23 to A21 and
enables or disables release of the bus to an external device.
Bit
7
6
5
4
3
2
1
0
A23E
A22E
A21E




BRLE
Initial value
1
1
1
1
1
1
1
0
Read/ Modes 1, 2, 5, 7







R/W
R/W
R/W
R/W




R/W
Write
Modes 3, 4, 6
Address 23 to 21 enable
These bits enable PA 6 to
PA 4 to be used for A 23 to
A 21 address output
Reserved bits
Bus release enable
Enables or disables
release of the bus to
an external device
BRCR is initialized to H'FE by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bit 7—Address 23 Enable (A23E): Enables PA4 to be used as the A23 address output pin. Writing
0 in this bit enables A23 address output from PA4. In modes other than 3, 4, and 6 this bit cannot be
modified and PA4 has its ordinary input/output functions.
Bit 7: A23E
Description
0
PA4 is the A23 address output pin
1
PA4 is the PA4/TP4/TIOCA1 input/output pin
(Initial value)
Bit 6—Address 22 Enable (A22E): Enables PA5 to be used as the A22 address output pin. Writing
0 in this bit enables A22 address output from PA5. In modes other than 3, 4, and 6 this bit cannot be
modified and PA5 has its ordinary input/output functions.
Bit 6: A22E
Description
0
PA5 is the A22 address output pin
1
PA5 is the PA5/TP5/TIOCB1 input/output pin
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(Initial value)
Section 6 Bus Controller
Bit 5—Address 21 Enable (A21E): Enables PA6 to be used as the A21 address output pin. Writing
0 in this bit enables A21 address output from PA6. In modes other than 3, 4, and 6 this bit cannot be
modified and PA6 has its ordinary input/output functions.
Bit 5: A21E
Description
0
PA6 is the A21 address output pin
1
PA6 is the PA6/TP6/TIOCA2 input/output pin
(Initial value)
Bits 4 to 1—Reserved: Read-only bits, always read as 1.
Bit 0—Bus Release Enable (BRLE): Enables or disables release of the bus to an external device.
Bit 0: BRLE
Description
0
The bus cannot be released to an external device; BREQ and BACK can be
used as input/output pins
(Initial value)
1
The bus can be released to an external device
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Section 6 Bus Controller
6.2.6
Chip Select Control Register (CSCR)
CSCR is an 8-bit readable/writable register that enables or disables output of chip select signals
(CS7 to CS4).
If a chip select signal (CS7 to CS4) output is selected in this register, the corresponding pin
functions as a chip select signal (CS7 to CS4) output, this function taking priority over other
functions. CSCR cannot be modified in single-chip mode.
Bit
7
6
5
4
3
2
1
0
CS7E
CS6E
CS5E
CS4E




Initial value
0
0
0
0
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W




Chip select 7 to 4 enable
These bits enable or disable
chip select signal output
Reserved bits
CSCR is initialized to H'0F by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bits 7 to 4—Chip Select 7 to 4 Enable (CS7E to CS4E): These bits enable or disable output of
the corresponding chip select signal.
Bit n: CSnE
Description
0
Output of chip select signal CSn is disabled
1
Output of chip select signal CSn is enabled
Note: n = 7 to 4
Bits 3 to 0—Reserved: Read-only bits, always read as 1.
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(Initial value)
Section 6 Bus Controller
6.3
Operation
6.3.1
Area Division
The external address space is divided into areas 0 to 7. Each area has a size of 128 kbytes in the
1-Mbyte modes, or 2 Mbytes in the 16-Mbyte modes. Figure 6.2 shows a general view of the
memory map.
H'000000
H'00000
H'1FFFF
H'20000
H'1FFFFF
H'200000
Area 5 (128 kbytes)
H'BFFFFF
H'C00000
H'DFFFFF
H'E00000
Area 7 (128 kbytes)
1 2
On-chip RAM* *
Area 6 (128 kbytes)
H'DFFFF
H'E0000
Area 7 (2 Mbytes)
1 2
On-chip RAM* *
3
*1
a. 1-Mbyte modes with
on-chip ROM disabled
(modes 1 and 2)
Internal I/O registers
Area 6 (2 Mbytes)
H'DFFFFF
H'E00000
Area 7 (128 kbytes)
3
*1
b. 16-Mbyte modes with
on-chip ROM disabled
(modes 3 and 4)
External address space*
H'FFFFF
Internal I/O registers
Area 7 (2 Mbytes)
1 2
On-chip RAM* *
1 2
On-chip RAM* *
External address space*
H'FFFFFF
Area 5 (2 Mbytes)
H'BFFFFF
H'C00000
H'BFFFF
H'C0000
Area 6 (2 Mbytes)
Area 6 (128 kbytes)
Area 4 (2 Mbytes)
H'9FFFFF
H'A00000
H'9FFFF
H'A0000
Area 5 (2 Mbytes)
Area 5 (128 kbytes)
Area 3 (2 Mbytes)
H'7FFFFF
H'800000
Area 4 (128 kbytes)
H'9FFFFF
H'A00000
H'BFFFF
H'C0000
Area 2 (2 Mbytes)
H'5FFFFF
H'600000
H'7FFFF
H'80000
Area 4 (2 Mbytes)
Area 4 (128 kbytes)
H'9FFFF
H'A0000
Area 0 (2 Mbytes)
Area 1 (2 Mbytes)
Area 3 (128 kbytes)
H'7FFFFF
H'800000
Internal I/O registers
1
On-chip ROM*
H'3FFFFF
H'400000
H'5FFFF
H'60000
Area 3 (2 Mbytes)
Area 3 (128 kbytes)
H'1FFFFF
H'200000
Area 2 (128 kbytes)
H'5FFFFF
H'600000
H'7FFFF
H'80000
Area 0 (128 kbytes)
H'3FFFF
H'40000
Area 2 (2 Mbytes)
Area 2 (128 kbytes)
External address space*
H'000000
1
On-chip ROM*
Area 1 (128 kbytes)
H'3FFFFF
H'400000
H'5FFFF
H'60000
H'FFFFF
H'1FFFF
H'20000
Area 1 (2 Mbytes)
Area 1 (128 kbytes)
H'3FFFF
H'40000
H'DFFFF
H'E0000
H'00000
Area 0 (2 Mbytes)
Area 0 (128 kbytes)
3
*1
External address space*3
H'FFFFFF
c. 1-Mbyte mode with
on-chip ROM enabled
(mode 5)
Internal I/O registers *1
d. 16-Mbyte mode with
on-chip ROM enabled
(mode 6)
Notes: 1. The on-chip ROM, on-chip RAM, and internal I/O registers have a fixed bus width and are accessed in a
fixed number of states.
2. When the RAME bit is cleared to 0 in SYSCR, this area conforms to the specifications of area 7.
3. This external address area conforms to the specifications of area 7.
Figure 6.2 Access Area Map for Modes 1 to 6
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Section 6 Bus Controller
Chip select signals (CS7 to CS0) can be output for areas 7 to 0. The bus specifications for each area
can be selected in ABWCR, ASTCR, WCER, and WCR as shown in table 6.3.
Table 6.3
Bus Specifications
ABWCR
ASTCR
WCER
WCR
ABWn
ASTn
WCEn
WMS1
WMS0
Bus
Width
Access
States Wait Mode
0
0
—
—
—
16
2
Disabled
1
0
—
—
16
3
Pin wait mode 0
1
0
0
16
3
Programmable wait mode
1
16
3
Disabled
0
16
3
Pin wait mode 1
1
16
3
Pin auto-wait mode
—
8
2
Disabled
1
1
0
1
—
—
Bus Specifications
0
—
—
8
3
Pin wait mode 0
1
0
0
8
3
Programmable wait mode
1
8
3
Disabled
0
8
3
Pin wait mode 1
1
8
3
Pin auto-wait mode
1
Note: n = 0 to 7
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Section 6 Bus Controller
6.3.2
Chip Select Signals
For each of areas 7 to 0, the H8/3048B Group can output a chip select signal (CS7 to CS0) that goes
low to indicate when the area is selected. Figure 6.3 shows the output timing of a CSn signal (n = 0
to 7).
Output of CS3 to CS0: Output of CS3 to CS0 is enabled or disabled in the data direction register
(DDR) of the corresponding port.
In the expanded modes with on-chip ROM disabled, a reset leaves pin CS0 in the output state and
pins CS3 to CS1 in the input state. To output chip select signals CS3 to CS1, the corresponding DDR
bits must be set to 1. In the expanded modes with on-chip ROM enabled, a reset leaves pins CS3 to
CS0 in the input state. To output chip select signals CS3 to CS0, the corresponding DDR bits must
be set to 1. For details see section 9, I/O Ports.
Output of CS7 to CS4: Output of CS7 to CS4 is enabled or disabled in the chip select control
register (CSCR). A reset leaves pins CS7 to CS4 in the input state. To output chip select signals CS7
to CS4, the corresponding CSCR bits must be set to 1. For details see section 9, I/O Ports.
φ
Address
bus
External address in area n
CSn
Figure 6.3 CSn Output Timing (n = 7 to 0)
When the on-chip ROM, on-chip RAM, and internal I/O registers are accessed, CS7 and CS0
remain high. The CSn signals are decoded from the address signals. They can be used as chip
select signals for SRAM and other devices.
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Section 6 Bus Controller
6.3.3
Data Bus
The H8/3048B Group allows either 8-bit access or 16-bit access to be designated for each of areas
7 to 0. An 8-bit-access area uses the upper data bus (D15 to D8). A 16-bit-access area uses both the
upper data bus (D15 to D8) and lower data bus (D7 to D0).
In read access the RD signal applies without distinction to both the upper and lower data bus. In
write access the HWR signal applies to the upper data bus, and the LWR signal applies to the
lower data bus.
Table 6.4 indicates how the two parts of the data bus are used under different access conditions.
Table 6.4
Access Conditions and Data Bus Usage
Access Read/
Size
Write
Valid
Address Strobe
8-bit-access
area
—
Read
—
RD
Write
—
HWR
16-bit-access
area
Byte
Read
Even
RD
Area
Odd
Write
Word
Upper Data Bus
(D15 to D8)
Lower Data Bus
(D7 to D0)
Valid
Invalid
Undetermined data
Valid
Invalid
Invalid
Valid
Undetermined data
Even
HWR
Valid
Odd
LWR
Undetermined data
Valid
Read
—
RD
Valid
Valid
Write
—
HWR,
LWR
Valid
Valid
Note: Undetermined data means that unpredictable data is output.
Invalid means that the bus is in the input state and the input is ignored.
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Section 6 Bus Controller
6.3.4
Bus Control Signal Timing
8-Bit, Three-State-Access Areas
Figure 6.4 shows the timing of bus control signals for an 8-bit, three-state-access area. The upper
address bus (D15 to D8) is used to access these areas. The LWR pin is always high. Wait states can
be inserted.
Bus cycle
T1
T2
T3
φ
Address bus
External address in area n
CS n
AS
RD
Read
access
D15 to D8
Valid
D 7 to D 0
Invalid
HWR
Write
access
LWR
High
D15 to D8
Valid
D 7 to D 0
Undetermined data
Note: n = 7 to 0
Figure 6.4 Bus Control Signal Timing for 8-Bit, Three-State-Access Area
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Section 6 Bus Controller
8-Bit, Two-State-Access Areas
Figure 6.5 shows the timing of bus control signals for an 8-bit, two-state-access area. The upper
address bus (D15 to D8) is used to access these areas. The LWR pin is always high. Wait states
cannot be inserted.
Bus cycle
T1
T2
φ
Address bus
External address in area n
CSn
AS
RD
Read
access
D15 to D8
Valid
D 7 to D 0
Invalid
HWR
Write
access
LWR
High
D15 to D8
Valid
D 7 to D 0
Undetermined data
Note: n = 7 to 0
Figure 6.5 Bus Control Signal Timing for 8-Bit, Two-State-Access Area
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Section 6 Bus Controller
16-Bit, Three-State-Access Areas
Figures 6.6 to 6.8 show the timing of bus control signals for a 16-bit, three-state-access area. In
these areas, the upper address bus (D15 to D8) is used to access even addresses and the lower
address bus (D7 to D0) is used to access odd addresses. Wait states can be inserted.
Bus cycle
T1
T2
T3
φ
Address bus
Even external address in area n
CS n
AS
RD
Read
access
D15 to D8
Valid
D 7 to D 0
Invalid
HWR
Write
access
LWR
High
D15 to D8
Valid
D 7 to D 0
Undetermined data
Note: n = 7 to 0
Figure 6.6 Bus Control Signal Timing for 16-Bit, Three-State-Access Area (1)
(Byte Access to Even Address)
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Section 6 Bus Controller
Bus cycle
T1
T2
T3
φ
Address bus
Odd external address in area n
CS n
AS
RD
Read
access
D15 to D8
Invalid
D 7 to D 0
Valid
HWR
Write
access
High
LWR
D15 to D8
Undetermined data
D 7 to D 0
Valid
Note: n = 7 to 0
Figure 6.7 Bus Control Signal Timing for 16-Bit, Three-State-Access Area (2)
(Byte Access to Odd Address)
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Section 6 Bus Controller
Bus cycle
T1
T2
T3
φ
Address bus
External address in area n
CS n
AS
RD
Read
access
D15 to D8
Valid
D 7 to D 0
Valid
HWR
LWR
Write
access
D15 to D8
Valid
D 7 to D 0
Valid
Note: n = 7 to 0
Figure 6.8 Bus Control Signal Timing for 16-Bit, Three-State-Access Area (3)
(Word Access)
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Section 6 Bus Controller
16-Bit, Two-State-Access Areas
Figures 6.9 to 6.11 show the timing of bus control signals for a 16-bit, two-state-access area. In
these areas, the upper address bus (D15 to D8) is used to access even addresses and the lower
address bus (D7 to D0) is used to access odd addresses. Wait states cannot be inserted.
Bus cycle
T1
T2
φ
Address bus
Even external address in area n
CS n
AS
RD
Read
access
D15 to D8
Valid
D 7 to D 0
Invalid
HWR
Write
access
LWR
High
D15 to D8
Valid
D 7 to D 0
Undetermined data
Note: n = 7 to 0
Figure 6.9 Bus Control Signal Timing for 16-Bit, Two-State-Access Area (1)
(Byte Access to Even Address)
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Section 6 Bus Controller
Bus cycle
T1
T2
φ
Address bus
Odd external address in area n
CSn
AS
RD
Read
access
D15 to D8
Invalid
D 7 to D 0
Valid
HWR
Write
access
High
LWR
D15 to D8
Undetermined data
D 7 to D 0
Valid
Note: n = 7 to 0
Figure 6.10 Bus Control Signal Timing for 16-Bit, Two-State-Access Area (2)
(Byte Access to Odd Address)
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Section 6 Bus Controller
Bus cycle
T1
T2
φ
Address bus
External address in area n
CSn
AS
RD
Read
access
D15 to D8
Valid
D 7 to D 0
Valid
HWR
Write
access
LWR
D15 to D8
Valid
D 7 to D 0
Valid
Note: n = 7 to 0
Figure 6.11 Bus Control Signal Timing for 16-Bit, Two-State-Access Area (3)
(Word Access)
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Section 6 Bus Controller
6.3.5
Wait Modes
Four wait modes can be selected as shown in table 6.5.
Table 6.5
Wait Mode Selection
ASTCR
WCER
WCR
ASTn Bit
WCEn Bit
WMS1 Bit WMS0 Bit WSC Control
Wait Mode
0
—
—
—
Disabled
No wait states
1
0
—
—
Disabled
Pin wait mode 0
1
0
0
Enabled
Programmable wait mode
1
Enabled
No wait states
0
Enabled
Pin wait mode 1
1
Enabled
Pin auto-wait mode
1
Note: n = 7 to 0
Wait Mode in Areas Where Wait-State Controller is Disabled
External three-state access areas in which the wait-state controller is disabled (ASTn = 1, WCEn =
0) operate in pin wait mode 0. The other wait modes are unavailable. The settings of bits WMS1
and WMS0 are ignored in these areas.
Pin Wait Mode 0: Wait states can only be inserted by WAIT pin control. During access to an
external three-state-access area, if the WAIT pin is low at the fall of the system clock (φ) in the T2
state, a wait state (TW) is inserted. If the WAIT pin remains low, wait states continue to be inserted
until the WAIT signal goes high. Figure 6.12 shows the timing.
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Section 6 Bus Controller
Inserted by WAIT signal
T1
T2
φ
TW
*
*
TW
T3
*
WAIT pin
Address bus
External address
AS
RD
Read
access
Read data
Data bus
HWR , LWR
Write
access
Data bus
Write data
Note: * Arrows indicate time of sampling of the WAIT pin.
Figure 6.12 Pin Wait Mode 0
Wait Modes in Areas Where Wait-State Controller is Enabled
External three-state access areas in which the wait-state controller is enabled (ASTn = 1, WCEn =
1) can operate in pin wait mode 1, pin auto-wait mode, or programmable wait mode, as selected by
bits WMS1 and WMS0. Bits WMS1 and WMS0 apply to all areas, so all areas in which the waitstate controller is enabled operate in the same wait mode.
Pin Wait Mode 1: In all accesses to external three-state-access areas, the number of wait states
(TW) selected by bits WC1 and WC0 are inserted. If the WAIT pin is low at the fall of the system
clock (φ) in the last of these wait states, an additional wait state is inserted. If the WAIT pin
remains low, wait states continue to be inserted until the WAIT signal goes high.
Pin wait mode 1 is useful for inserting four or more wait states, or for inserting different numbers
of wait states for different external devices.
If the wait count is 0, this mode operates in the same way as pin wait mode 0.
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Section 6 Bus Controller
Figure 6.13 shows the timing when the wait count is 1 (WC1 = 0, WC0 = 1) and one additional
wait state is inserted by WAIT input.
T1
Inserted by
wait count
Inserted by
WAIT signal
TW
TW
T2
φ
*
T3
*
WAIT pin
Address bus
External address
AS
Read
access
RD
Read data
Data bus
HWR, LWR
Write
access
Data bus
Write data
Note: * Arrows indicate time of sampling of the WAIT pin.
Figure 6.13 Pin Wait Mode 1
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Section 6 Bus Controller
Pin Auto-Wait Mode: If the WAIT pin is low, the number of wait states (TW) selected by bits
WC1 and WC0 are inserted.
In pin auto-wait mode, if the WAIT pin is low at the fall of the system clock (φ) in the T2 state, the
number of wait states (TW) selected by bits WC1 and WC0 are inserted. No additional wait states
are inserted even if the WAIT pin remains low. Pin auto-wait mode can be used for an easy
interface to low-speed memory, simply by routing the chip select signal to the WAIT pin.
Figure 6.14 shows the timing when the wait count is 1.
T1
φ
T2
T3
*
T1
T2
TW
T3
*
WAIT
Address bus
External address
External address
AS
RD
Read
access
Read data
Read data
Data bus
HWR , LWR
Write
access
Data bus
Write data
Note: * Arrows indicate time of sampling of the WAIT pin.
Figure 6.14 Pin Auto-Wait Mode
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Write data
Section 6 Bus Controller
Programmable Wait Mode: The number of wait states (TW) selected by bits WC1 and WC0 are
inserted in all accesses to external three-state-access areas. Figure 6.15 shows the timing when the
wait count is 1 (WC1 = 0, WC0 = 1).
T1
T2
TW
T3
φ
Address bus
External address
AS
RD
Read
access
Read data
Data bus
HWR, LWR
Write
access
Data bus
Write data
Figure 6.15 Programmable Wait Mode
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Section 6 Bus Controller
Example of Wait State Control Settings
A reset initializes ASTCR and WCER to H'FF and WCR to H'F3, selecting programmable wait
mode and three wait states for all areas. Software can select other wait modes for individual areas
by modifying the ASTCR, WCER, and WCR settings. Figure 6.16 shows an example of wait
mode settings.
Area 0
Area 1
3-state-access area,
programmable wait mode
(3 states inserted)
3-state-access area,
programmable wait mode
(3 states inserted)
Area 2
3-state-access area,
pin wait mode 0
Area 3
3-state-access area,
pin wait mode 0
Area 4
2-state-access area,
no wait states inserted
Area 5
2-state-access area,
no wait states inserted
Area 6
2-state-access area,
no wait states inserted
Area 7
2-state-access area,
no wait states inserted
Bit:
ASTCR H'0F:
7
0
6
0
5
0
4
0
3
1
2
1
1
1
0
1
WCER H'33:
0
0
1
1
0
0
1
1
WCR H'F3:




0
0
1
1
Note: Wait states cannot be inserted in areas designated for two-state access by ASTCR.
Figure 6.16 Wait Mode Settings (Example)
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Section 6 Bus Controller
6.3.6
Interconnections with Memory (Example)
For each area, the bus controller can select two- or three-state access and an 8- or 16-bit data bus
width. In three-state-access areas, wait states can be inserted in a variety of modes, simplifying the
connection of both high-speed and low-speed devices.
Figure 6.18 shows an example of interconnections between the H8/3048B Group and memory.
Figure 6.17 shows a memory map for this example.
A 256-kword × 16-bit EPROM is connected to area 0. This device is accessed in three states via a
16-bit bus.
Two 32-kword × 8-bit SRAM devices (SRAM1 and SRAM2) are connected to area 1. These
devices are accessed in two states via a 16-bit bus.
One 32-kword × 8-bit SRAM (SRAM3) is connected to area 2. This device is accessed via an 8-bit
bus, using three-state access with an additional wait state inserted in pin auto-wait mode.
H'000000
EPROM
H'07FFFF
Area 0
16-bit, three-state-access area
Not used
H'1FFFFF
H'200000
SRAM 1, 2
Area 1
16-bit, two-state-access area
H'20FFFF
H'210000
Not used
H'3FFFFF
H'400000
SRAM 3
H'407FFF
Area 2
8-bit, three-state-access area
(one auto-wait state)
Not used
H'5FFFFF
On-chip RAM
H'FFFFFF
Internal I/O registers
Figure 6.17 Memory Map (Example)
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Section 6 Bus Controller
EPROM
A19 to A 1
A 18 to A 0
I/O 15 to I/O8
H8/3048B Group
I/O 7 to I/O 0
CS 0
CE
OE
CS 1
CS 2
SRAM1 (even addresses)
A15 to A 1
A14 to A 0
I/O 7 to I/O 0
WAIT
CS
RD
OE
WE
HWR
LWR
SRAM2 (odd addresses)
A15 to A 1
A 14 to A 0
A 23 to A 0
I/O 7 to I/O 0
CS
OE
WE
D15 to D 8
D 7 to D 0
SRAM3
A14 to A 0
A 14 to A 0
I/O 7 to I/O 0
CS
OE
WE
Figure 6.18 Interconnections with Memory (Example)
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Section 6 Bus Controller
6.3.7
Bus Arbiter Operation
The bus controller has a built-in bus arbiter that arbitrates between different bus masters. There are
four bus masters: the CPU, DMA controller (DMAC), refresh controller, and an external bus
master. When a bus master has the bus right it can carry out read, write, or refresh access. Each
bus master uses a bus request signal to request the bus right. At fixed times the bus arbiter
determines priority and uses a bus acknowledge signal to grant the bus to a bus master, which can
then operate using the bus.
The bus arbiter checks whether the bus request signal from a bus master is active or inactive, and
returns an acknowledge signal to the bus master if the bus request signal is active. When two or
more bus masters request the bus, the highest-priority bus master receives an acknowledge signal.
The bus master that receives an acknowledge signal can continue to use the bus until the
acknowledge signal is deactivated.
The bus master priority order is:
(High)
External bus master > refresh controller > DMAC > CPU
(Low)
The bus arbiter samples the bus request signals and determines priority at all times, but it does not
always grant the bus immediately, even when it receives a bus request from a bus master with
higher priority than the current bus master. Each bus master has certain times at which it can
release the bus to a higher-priority bus master.
CPU
The CPU is the lowest-priority bus master. If the DMAC, refresh controller, or an external bus
master requests the bus while the CPU has the bus right, the bus arbiter transfers the bus right to
the bus master that requested it. The bus right is transferred at the following times:
• The bus right is transferred at the boundary of a bus cycle. If word data is accessed by two
consecutive byte accesses, however, the bus right is not transferred between the two byte
accesses.
• If another bus master requests the bus while the CPU is performing internal operations, such as
executing a multiply or divide instruction, the bus right is transferred immediately. The CPU
continues its internal operations.
• If another bus master requests the bus while the CPU is in sleep mode, the bus right is
transferred immediately.
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Section 6 Bus Controller
DMAC
When the DMAC receives an activation request, it requests the bus right from the bus arbiter. If
the DMAC is bus master and the refresh controller or an external bus master requests the bus, the
bus arbiter transfers the bus right from the DMAC to the bus master that requested the bus. The
bus right is transferred at the following times.
The bus right is transferred when the DMAC finishes transferring 1 byte or 1 word. A DMAC
transfer cycle consists of a read cycle and a write cycle. The bus right is not transferred between
the read cycle and the write cycle.
There is a priority order among the DMAC channels. For details see section 8.4.9, DMAC
Multiple-Channel Operation.
Refresh Controller
When a refresh cycle is requested, the refresh controller requests the bus right from the bus arbiter.
When the refresh cycle is completed, the refresh controller releases the bus. For details see section
7, Refresh Controller.
External Bus Master
When the BRLE bit is set to 1 in BRCR, the bus can be released to an external bus master. The
external bus master has highest priority, and requests the bus right from the bus arbiter by driving
the BREQ signal low. Once the external bus master gets the bus, it keeps the bus right until the
BREQ signal goes high. While the bus is released to an external bus master, the H8/3048B Group
holds the address bus and data bus control signals (AS, RD, HWR, and LWR) in the highimpedance state, holds the chip select signals high (CSn: n = 7 to 0), and holds the BACK pin in
the low output state.
The bus arbiter samples the BREQ pin at the rise of the system clock (φ). If BREQ is low, the bus
is released to the external bus master at the appropriate opportunity. The BREQ signal should be
held low until the BACK signal goes low.
When the BREQ pin is high in two consecutive samples, the BACK signal is driven high to end
the bus-release cycle.
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Section 6 Bus Controller
Figure 6.19 shows the timing when the bus right is requested by an external bus master during a
read cycle in a two-state-access area. There is a minimum interval of two states from when the
BREQ signal goes low until the bus is released.
CPU cycles
T1
External bus released
CPU cycles
T2
φ
High-impedance
Address
bus
Address
High level
CSn
High-impedance
Data bus
AS , RD
High-impedance
High
High-impedance
HWR , LWR
BREQ
BACK
Minimum 2 cycles
1
1
2
3
4, 5
6
2
3
4
5
6
Low BREQ signal is sampled at rise of T1 state.
BACK signal goes low at end of CPU read cycle, releasing bus right to external bus master.
BREQ pin continues to be sampled while bus is released to external bus master.
High BREQ signal is sampled twice consecutively.
BACK signal goes high, ending bus-release cycle.
Note: n = 7 to 0
Figure 6.19 External-Bus-Released State (Two-State-Access Area, During Read Cycle)
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Section 6 Bus Controller
6.4
Usage Notes
6.4.1
Connection to Dynamic RAM and Pseudo-Static RAM
A different bus control signal timing applies when dynamic RAM or pseudo-static RAM is
connected to area 3. For details see section 7, Refresh Controller.
6.4.2
Register Write Timing
ABWCR, ASTCR, and WCER Write Timing
Data written to ABWCR, ASTCR, or WCER takes effect starting from the next bus cycle. Figure
6.20 shows the timing when an instruction fetched from area 0 changes area 0 from three-state
access to two-state access.
T1
T2
T3
T1
T2
T3
T1
T2
φ
Address
bus
ASTCR address
3-state access to area 0
Figure 6.20 ASTCR Write Timing
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2-state access
to area 0
Section 6 Bus Controller
DDR Write Timing
Data written to a data direction register (DDR) to change a CSn pin from CSn output to generic
input, or vice versa, takes effect starting from the T3 state of the DDR write cycle. Figure 6.21
shows the timing when the CS1 pin is changed from generic input to CS1 output.
T1
T2
T3
φ
Address
bus
CS1
P8DDR address
High-impedance
Figure 6.21 DDR Write Timing
BRCR Write Timing
Data written to switch between A23, A22, or A21 output and generic input or output takes effect
starting from the T3 state of the BRCR write cycle. Figure 6.22 shows the timing when a pin is
changed from generic input to A23, A22, or A21 output.
T1
T2
T3
φ
Address
bus
A 23 to A 21
BRCR address
High-impedance
Figure 6.22 BRCR Write Timing
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Section 6 Bus Controller
BREQ Input Timing
6.4.3
After driving the BREQ pin low, hold it low until BACK goes low. If BREQ returns to the high
level before BACK goes low, the bus arbiter may operate incorrectly.
To terminate the external-bus-released state, hold the BREQ signal high for at least three states. If
BREQ is high for too short an interval, the bus arbiter may operate incorrectly.
6.4.4
Transition To Software Standby Mode
If contention occurs between a transition to software standby mode and a bus request from an
external bus master, the bus may be released for one state just before the transition to software
standby mode (see figure 6.23). When using software standby mode, clear the BRLE bit to 0 in
BRCR before executing the SLEEP instruction.
Bus-released state
Software standby mode
φ
BREQ
BACK
Address bus
Strobe
Figure 6.23 Contention between Bus-Released State and Software Standby Mode
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Section 7 Refresh Controller
Section 7 Refresh Controller
7.1
Overview
The H8/3048B Group has an on-chip refresh controller that enables direct connection of 16-bitwide DRAM or pseudo-static RAM (PSRAM).
DRAM or pseudo-static RAM can be directly connected to area 3 of the external address space.
A maximum 128 kbytes can be connected in modes 1, 2, and 5 (1-Mbyte modes). A maximum
2 Mbytes can be connected in modes 3, 4, and 6 (16-Mbyte modes).
Systems that do not need to refresh DRAM or pseudo-static RAM can use the refresh controller as
an 8-bit interval timer.
When the refresh controller is not used, it can be independently halted to conserve power. For
details see section 20.6, Module Standby Function.
7.1.1
Features
The refresh controller can be used for one of three functions: DRAM refresh control, pseudo-static
RAM refresh control, or 8-bit interval timing. Features of the refresh controller are listed below.
Features as a DRAM Refresh Controller:
• Enables direct connection of 16-bit-wide DRAM
• Selection of 2CAS or 2WE mode
• Selection of 8-bit or 9-bit column address multiplexing for DRAM address input
Examples:
 1-Mbit DRAM: 8-bit row address × 8-bit column address
 4-Mbit DRAM: 9-bit row address × 9-bit column address
 4-Mbit DRAM: 10-bit row address × 8-bit column address
• CAS-before-RAS refresh control
• Software-selectable refresh interval
• Software-selectable self-refresh mode
• Wait states can be inserted
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Section 7 Refresh Controller
Features as a Pseudo-Static RAM Refresh Controller:
• RFSH signal output for refresh control
• Software-selectable refresh interval
• Software-selectable self-refresh mode
• Wait states can be inserted
Features as an Interval Timer:
• Refresh timer counter (RTCNT) can be used as an 8-bit up-counter
• Selection of seven counter clock sources: φ/2, φ/8, φ/32, φ/128, φ/512, φ/2048, φ/4096
• Interrupts can be generated by compare match between RTCNT and the refresh time constant
register (RTCOR)
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Section 7 Refresh Controller
7.1.2
Block Diagram
Figure 7.1 shows a block diagram of the refresh controller.
φ/2, φ/8, φ/32,
φ/128, φ/512,
φ/2048, φ/4096
Refresh signal
Clock selector
Control logic
CMI interrupt
Internal data bus
Bus interface
RFSHCR
RTMCSR
RTCOR
RTCNT
Comparator
Module data bus
Legend:
RTCNT:
RTCOR:
RTMCSR:
RFSHCR:
Refresh timer counter
Refresh time constant register
Refresh timer control/status register
Refresh control register
Figure 7.1 Block Diagram of Refresh Controller
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Section 7 Refresh Controller
7.1.3
Input/Output Pins
Table 7.1 summarizes the refresh controller’s input/output pins.
Table 7.1
Refresh Controller Pins
Signal
Pin
Name
Abbr.
I/O
Function
RFSH
Refresh
RFSH
Output
Goes low during refresh cycles;
used to refresh DRAM and PSRAM
HWR
Upper write/upper column
address strobe
UW/UCAS
Output
Connects to the UW pin of 2WE
DRAM or UCAS pin of 2CAS DRAM
LWR
Lower write/lower column
address strobe
LW/LCAS
Output
Connects to the LW pin of 2WE
DRAM or LCAS pin of 2CAS DRAM
RD
Column address strobe/
write enable
CAS/WE
Output
Connects to the CAS pin of 2WE
DRAM or WE pin of 2CAS DRAM
CS3
Row address strobe
RAS
Output
Connects to the RAS pin of DRAM
7.1.4
Register Configuration
Table 7.2 summarizes the refresh controller’s registers.
Table 7.2
Refresh Controller Registers
Address*
Name
Abbreviation
R/W
Initial Value
H'FFAC
Refresh control register
RFSHCR
R/W
H'02
H'FFAD
Refresh timer control/status register
RTMCSR
R/W
H'07
H'FFAE
Refresh timer counter
RTCNT
R/W
H'00
H'FFAF
Refresh time constant register
RTCOR
R/W
H'FF
Note:
*
Lower 16 bits of the address.
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Section 7 Refresh Controller
7.2
Register Descriptions
7.2.1
Refresh Control Register (RFSHCR)
RFSHCR is an 8-bit readable/writable register that selects the operating mode of the refresh
controller.
Bit
7
6
5
4
3
2
1
0
RFSHE

RCYCE
Initial value
0
0
0
0
0
0
1
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W

R/W
SRFMD PSRAME DRAME CAS/WE M9/M8
Refresh cycle
enable
Enables or
disables
insertion of
refresh cycles
Reserved bit
Refresh pin enable
Enables refresh signal output
from the refresh pin
Address multiplex mode select
Selects the number of column address bits
Strobe mode select
Selects 2CAS or 2WE strobing of DRAM
PSRAM enable and DRAM enable
These bits enable or disable connection of pseudo-static RAM and DRAM
Self-refresh mode
Selects self-refresh mode
RFSHCR is initialized to H'02 by a reset and in hardware standby mode.
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Section 7 Refresh Controller
Bit 7—Self-Refresh Mode (SRFMD): Specifies DRAM or pseudo-static RAM self-refresh
during software standby mode. When PSRAME = 1 and DRAME = 0, after the SRFMD bit is set
to 1, pseudo-static RAM can be self-refreshed when the H8/3048B Group enters software standby
mode. When PSRAME = 0 and DRAME = 1, after the SRFMD bit is set to 1, DRAM can be selfrefreshed when the H8/3048B Group enters software standby mode. In either case, the normal
access state resumes on exit from software standby mode.
Bit 7: SRFMD
Description
0
DRAM or PSRAM self-refresh is disabled in software standby mode
(Initial value)
1
DRAM or PSRAM self-refresh is enabled in software standby mode
Bit 6—PSRAM Enable (PSRAME) and
Bit 5—DRAM Enable (DRAME): These bits enable or disable connection of pseudo-static RAM
and DRAM to area 3 of the external address space.
When DRAM or pseudo-static RAM is connected, the bus cycle and refresh cycle of area 3 consist
of three states, regardless of the setting in the access state control register (ASTCR). If AST3 = 0
in ASTCR, wait states cannot be inserted.
When the PSRAME or DRAME bit is set to 1, bits 0, 2, 3, and 4 in RFSHCR and registers
RTMCSR, RTCNT, and RTCOR are write-disabled, except that the CMF flag in RTMCSR can be
cleared by writing 0.
Bit 6: PSRAME
Bit 5: DRAME
Description
0
0
Can be used as an interval timer
(Initial value)
(DRAM and PSRAM cannot be directly connected)
1
1
DRAM can be directly connected
0
PSRAM can be directly connected
1
Illegal setting
Bit 4—Strobe Mode Select (CAS/WE
WE):
WE Selects 2CAS or 2WE mode. The setting of this bit is
valid when PSRAME = 0 and DRAME = 1. This bit is write-disabled when the PSRAME or
DRAME bit is set to 1.
Bit 4: CAS/WE
WE
Description
0
2WE mode
1
2CAS mode
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(Initial value)
Section 7 Refresh Controller
Bit 3—Address Multiplex Mode Select (M9/M8
M8):
M8 Selects 8-bit or 9-bit column addressing.
The setting of this bit is valid when PSRAME = 0 and DRAME = 1. This bit is write-disabled
when the PSRAME or DRAME bit is set to 1.
Bit 3: M9/M8
M8
Description
0
8-bit column address mode
1
9-bit column address mode
(Initial value)
Bit 2—Refresh Pin Enable (RFSHE): Enables or disables refresh signal output from the RFSH
pin. This bit is write-disabled when the PSRAME or DRAME bit is set to 1.
Bit 2: RFSHE
Description
0
Refresh signal output at the RFSH pin is disabled (the RFSH pin can be used
as a generic input/output port)
(Initial value)
1
Refresh signal output at the RFSH pin is enabled
Bit 1—Reserved: Read-only bit, always read as 1.
Bit 0—Refresh Cycle Enable (RCYCE): Enables or disables insertion of refresh cycles.
The setting of this bit is valid when PSRAME = 1 or DRAME = 1. When PSRAME = 0 and
DRAME = 0, refresh cycles are not inserted regardless of the setting of this bit.
Bit 0: RCYCE
Description
0
Refresh cycles are disabled
1
Refresh cycles are enabled for area 3
(Initial value)
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Section 7 Refresh Controller
7.2.2
Refresh Timer Control/Status Register (RTMCSR)
RTMCSR is an 8-bit readable/writable register that selects the clock source for RTCNT. It also
enables or disables interrupt requests when the refresh controller is used as an interval timer.
Bit
7
6
5
4
3
2
1
0
CMF
CMIE
CKS2
CKS1
CKS0



Initial value
0
0
0
0
0
1
1
1
Read/Write
R/(W)*
R/W
R/W
R/W
R/W



Clock select 2 to 0
These bits select an
internal clock source
for input to RTCNT
Reserved bits
Compare match interrupt enable
Enables or disables the CMI interrupt requested by CMF
Compare match flag
Status flag indicating that RTCNT has matched RTCOR
Note: * Only 0 can be written, to clear the flag.
Bits 7 and 6 are initialized by a reset and in standby mode. Bits 5 to 3 are initialized by a reset and
in hardware standby mode, but retain their previous values on transition to software standby mode.
Bit 7—Compare Match Flag (CMF): This status flag indicates that the RTCNT and RTCOR
values have matched.
Bit 7: CMF
Description
0
[Clearing condition]
Cleared by reading CMF when CMF = 1, then writing 0 in CMF
1
[Setting condition]
When RTCNT = RTCOR
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Section 7 Refresh Controller
Bit 6—Compare Match Interrupt Enable (CMIE): Enables or disables the CMI interrupt
requested when the CMF flag is set to 1 in RTMCSR. The CMIE bit is always cleared to 0 when
PSRAME = 1 or DRAME = 1.
Bit 6: CMIE
Description
0
The CMI interrupt requested by CMF is disabled
1
The CMI interrupt requested by CMF is enabled
(Initial value)
Bits 5 to 3—Clock Select 2 to 0 (CKS2 to CKS0): These bits select an internal clock source for
input to RTCNT. When used for refresh control, the refresh controller outputs a refresh request at
periodic intervals determined by compare match between RTCNT and RTCOR. When used as an
interval timer, the refresh controller generates CMI interrupts at periodic intervals determined by
compare match. These bits are write-disabled when the PSRAME bit or DRAME bit is set to 1.
Bit 5: CKS2
Bit 4: CKS1
Bit 3: CKS0
Description
0
0
0
Clock input is disabled
1
φ/2 clock source
0
φ/8 clock source
1
φ/32 clock source
1
1
0
1
0
φ/128 clock source
1
φ/512 clock source
0
φ/2048 clock source
1
φ/4096 clock source
(Initial value)
Bits 2 to 0—Reserved: Read-only bits, always read as 1.
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Section 7 Refresh Controller
7.2.3
Refresh Timer Counter (RTCNT)
RTCNT is an 8-bit readable/writable up-counter.
Bit
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
RTCNT is an up-counter that is incremented by an internal clock selected by bits CKS2 to CKS0
in RTMCSR. When RTCNT matches RTCOR (compare match), the CMF flag is set to 1 and
RTCNT is cleared to H'00.
RTCNT is write-disabled when the PSRAME bit or DRAME bit is set to 1. RTCNT is initialized
to H'00 by a reset and in standby mode.
7.2.4
Refresh Time Constant Register (RTCOR)
RTCOR is an 8-bit readable/writable register that determines the interval at which RTCNT is
compare matched.
Bit
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
RTCOR and RTCNT are constantly compared. When their values match, the CMF flag is set to 1
in RTMCSR, and RTCNT is simultaneously cleared to H'00.
RTCOR is write-disabled when the PSRAME bit or DRAME bit is set to 1. RTCOR is initialized
to H'FF by a reset and in hardware standby mode. In software standby mode it retains its previous
value.
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Section 7 Refresh Controller
7.3
Operation
7.3.1
Overview
One of three functions can be selected for the H8/3048B Group refresh controller: interfacing to
DRAM connected to area 3, interfacing to pseudo-static RAM connected to area 3, or interval
timing. Table 7.3 summarizes the register settings when these three functions are used.
Table 7.3
Refresh Controller Settings
Usage
Register Settings
DRAM Interface
PSRAM Interface
Interval Timer
RFSHCR
SRFMD
Selects self-refresh
mode
Selects self-refresh
mode
Cleared to 0
PSRAME
Cleared to 0
Set to 1
Cleared to 0
DRAME
Set to 1
Cleared to 0
Cleared to 0
CAS/WE
Selects 2CAS or
2WE mode
—
—
M9/M8
Selects column
addressing mode
—
—
RFSHE
Selects RFSH signal
output
Selects RFSH signal
output
Cleared to 0
RCYCE
Selects insertion of
refresh cycles
Selects insertion of
refresh cycles
—
Refresh interval
setting
Refresh interval
setting
Interrupt interval
setting
CMF
Set to 1 when
RTCNT = RTCOR
Set to 1 when
RTCNT = RTCOR
Set to 1 when
RTCNT = RTCOR
CMIE
Cleared to 0
Cleared to 0
Enables or disables
interrupt requests
P8DDR
P81DDR
Set to 1 (CS3 output)
Set to 1 (CS3 output)
Set to 0 or 1
ABWCR
ABW3
Cleared to 0
—
—
RTCOR
RTMCSR
CKS2 to
CKS0
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Section 7 Refresh Controller
DRAM Interface
To set up area 3 for connection to 16-bit-wide DRAM, initialize RTCOR, RTMCSR, and
RFSHCR in that order, clearing bit PSRAME to 0 and setting bit DRAME to 1. Set bit P81DDR to
1 in the port 8 data direction register (P8DDR) to enable CS3 output. In ABWCR, make area 3 a
16-bit-access area.
Pseudo-Static RAM Interface
To set up area 3 for connection to pseudo-static RAM, initialize RTCOR, RTMCSR, and
RFSHCR in that order, setting bit PSRAME to 1 and clearing bit DRAME to 0. Set bit P81DDR to
1 in P8DDR to enable CS3 output.
Interval Timer
When PSRAME = 0 and DRAME = 0, the refresh controller operates as an interval timer. After
setting RTCOR, select an input clock in RTMCSR and set the CMIE bit to 1. CMI interrupts will
be requested at compare match intervals determined by RTCOR and bits CKS2 to CKS0 in
RTMCSR.
When setting RTCOR, RTMCSR, and RFSHCR, make sure that PSRAME = 0 and DRAME = 0.
Writing is disabled when either of these bits is set to 1.
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Section 7 Refresh Controller
7.3.2
DRAM Refresh Control
Refresh Request Interval and Refresh Cycle Execution
The refresh request interval is determined by the settings of RTCOR and bits CKS2 to CKS0 in
RTMCSR. Figure 7.2 illustrates the refresh request interval.
RTCOR
RTCNT
H'00
Refresh request
Figure 7.2 Refresh Request Interval (RCYCE = 1)
Refresh requests are generated at regular intervals as shown in figure 7.2, but the refresh cycle is
not actually executed until the refresh controller gets the bus right.
Table 7.4 summarizes the relationship among area 3 settings, DRAM read/write cycles, and
refresh cycles.
Table 7.4
Area 3 Settings, DRAM Access Cycles, and Refresh Cycles
Read/Write Cycle by CPU
or DMAC
Refresh Cycle
2-state-access area
(AST3 = 0)
•
3 states
•
3 states
•
Wait states cannot be inserted
•
Wait states cannot be inserted
3-state-access area
(AST3 = 1)
•
3 states
•
3 states
•
Wait states can be inserted
•
Wait states can be inserted
Area 3 Settings
To insert refresh cycles, set the RCYCE bit to 1 in RFSHCR. Figure 7.3 shows the state transitions
for execution of refresh cycles.
When the first refresh request occurs after exit from the reset state or standby mode, the refresh
controller does not execute a refresh cycle, but goes into the refresh request pending state. Note
this point when using a DRAM that requires a refresh cycle for initialization.
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Section 7 Refresh Controller
When a refresh request occurs in the refresh request pending state, the refresh controller acquires
the bus right, then executes a refresh cycle. If another refresh request occurs during execution of
the refresh cycle, it is ignored.
Exit from reset or standby mode
Refresh request
Refresh request pending state
End of refresh
cycle*
Refresh request
Refresh
request*
Requesting bus right
Bus granted
Refresh
request*
Executing refresh cycle
Note: * A refresh request is ignored if it occurs while the refresh controller is requesting the
bus right or executing a refresh cycle.
Figure 7.3 State Transitions for Refresh Cycle Execution
Address Multiplexing
Address multiplexing depends on the setting of the M9/M8 bit in RFSHCR, as described in table
7.5. Figure 7.4 shows the address output timing. Address output is multiplexed only in area 3.
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Section 7 Refresh Controller
Table 7.5
Address Multiplexing
Address Pins
A23 to
A10
Address signals during row
address output
Address signals
during column
address output
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
A23 to
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
M9/M8 = 0
A23 to
A10
A9
A9
A16
A15
A14
A13
A12
A11
A10
A0
M9/M8 = 1
A23 to
A10
A18
A17
A16
A15
A14
A13
A12
A11
A10
A0
T1
T2
T3
φ
A 23 to A 9, A 0
A 23 to A 9 , A 0
Address
bus
A 8 to A 1
A 8 to A1
A 16 to A 9
Row address
Column address
a. M9/ M8 = 0
T1
T2
T3
φ
A 23 to A10 , A 0
A 23 to A10 , A 0
Address
bus
A 9 to A 1
A 9 to A1
A 18 to A 10
Row address
Column address
b. M9/ M8 = 1
Figure 7.4 Multiplexed Address Output (Example without Wait States)
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Section 7 Refresh Controller
2CAS
CAS and 2WE
WE Modes
The CAS/WE bit in RFSHCR can select two control modes for 16-bit-wide DRAM: one using
UCAS and LCAS; the other using UW and LW. These DRAM pins correspond to H8/3048B
Group pins as shown in table 7.6.
Table 7.6
DRAM Pins and H8/3048B Group Pins
DRAM Pin
H8/3048B Group Pin
CAS/WE
WE = 0 (2WE
WE Mode)
CAS/WE
WE = 1 (2CAS
CAS Mode)
HWR
UW
UCAS
LWR
LW
LCAS
RD
CAS
WE
CS3
RAS
RAS
Figure 7.5 (1) shows the interface timing for 2WE DRAM. Figure 7.5 (2) shows the interface
timing for 2CAS DRAM.
Read cycle
Write cycle*
Refresh cycle
φ
Address
bus
Row
Column
Row
Column
Area 3 top address
CS 3
(RAS)
RD
(CAS)
HWR
(UW)
LWR
(LW)
RFSH
AS
Note: * 16-bit access
Figure 7.5(1) DRAM Control Signal Output Timing (2WE
WE Mode)
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Section 7 Refresh Controller
Read cycle
Write cycle*
Refresh cycle
φ
Address
bus
Row
Column
Row
Column
Area 3 top address
CS 3
(RAS)
HWR
(UCAS)
LWR
(LCAS)
RD
(WE)
RFSH
AS
Note: * 16-bit access
Figure 7.5(2) DRAM Control Signal Output Timing (2CAS
CAS Mode)
Refresh Cycle Priority Order
When there are simultaneous bus requests, the priority order is:
(High)
External bus master > refresh controller > DMA controller > CPU
(Low)
For details see section 6.3.7, Bus Arbiter Operation.
Wait State Insertion
When bit AST3 is set to 1 in ASTCR, bus controller settings can cause wait states to be inserted
into bus cycles and refresh cycles. For details see section 6.3.5, Wait Modes.
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Section 7 Refresh Controller
Self-Refresh Mode
Some DRAM devices have a self-refresh function. After the SRFMD bit is set to 1 in RFSHCR,
when a transition to software standby mode occurs, the CAS and RAS outputs go low in that order
so that the DRAM self-refresh function can be used. On exit from software standby mode, the
CAS and RAS outputs both go high.
Table 7.7 shows the pin states in software standby mode. Figure 7.6 shows the signal output
timing.
Table 7.7
Pin States in Software Standby Mode (1) (PSRAME = 0, DRAME = 1)
Software Standby Mode
SRFMD = 0
SRFMD = 1 (self-refresh mode)
Signal
CAS/WE
WE = 0
CAS/WE
WE = 1
CAS/WE
WE = 0
CAS/WE
WE = 1
HWR
High-impedance
High-impedance
High
Low
LWR
High-impedance
High-impedance
High
Low
RD
High-impedance
High-impedance
Low
High
CS3
High
High
Low
Low
RFSH
High
High
Low
Low
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Section 7 Refresh Controller
Software
standby mode
Oscillator
settling time
φ
High-impedance
Address
bus
CS 3 (RAS)
RD (CAS)
HWR (UW)
High
LWR (LW)
High
RFSH
a. 2WE mode (SRFMD = 1)
Software
standby mode
Oscillator
settling time
φ
Address
bus
High-impedance
CS 3 (RAS)
HWR
(UCAS)
LWR
(LCAS)
RD (WE)
RFSH
b. 2CAS mode (SRFMD = 1)
Figure 7.6 Signal Output Timing in Self-Refresh Mode (PSRAME = 0, DRAME = 1)
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Section 7 Refresh Controller
Operation in Power-Down State
The refresh controller operates in sleep mode. It does not operate in hardware standby mode. In
software standby mode RTCNT is initialized, but RFSHCR, RTMCSR bits 5 to 3, and RTCOR
retain their settings prior to the transition to software standby mode.
Example 1: Connection to 2WE
WE 1-Mbit DRAM (1-Mbyte Mode)
Figure 7.7 shows typical interconnections to a 2WE 1-Mbit DRAM, and the corresponding
address map. Figure 7.8 shows a setup procedure to be followed by a program for this example.
After power-up the DRAM must be refreshed to initialize its internal state. Initialization takes a
certain length of time, which can be measured by using an interrupt from another timer module, or
by counting the number of times RTMCSR bit 7 (CMF) is set. Note that no refresh cycle is
executed for the first refresh request after exit from the reset state or standby mode (the first time
the CMF flag is set; see figure 7.3). When using this example, check the DRAM device
characteristics carefully and use a procedure that fits them.
2WE 1-Mbit DRAM with
× 16-bit organization
H8/3048B Group
A8
A7
A6
A5
A4
A3
A2
A1
A7
A6
A5
A4
A3
A2
A1
A0
CS 3
RD
HWR
LWR
RAS
CAS
UW
LW
OE
D15 to D 0
I/O 15 to I/O 0
a. Interconnections (example)
H'60000
DRAM area
Area 3 (1-Mbyte mode)
H'7FFFF
b. Address map
Figure 7.7 Interconnections and Address Map for 2WE
WE 1-Mbit DRAM (Example)
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Section 7 Refresh Controller
Set area 3 for 16-bit access
Set P81 DDR to 1 for CS3 output
Set RTCOR
Set bits CKS2 to CKS0 in RTMCSR
Write H'23 in RFSHCR
Wait for DRAM to be initialized
DRAM can be accessed
Figure 7.8 Setup Procedure for 2WE
WE 1-Mbit DRAM (1-Mbyte Mode)
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Section 7 Refresh Controller
Example 2: Connection to 2WE
WE 4-Mbit DRAM (16-Mbyte Mode)
Figure 7.9 shows typical interconnections to a single 2WE 4-Mbit DRAM, and the corresponding
address map. Figure 7.10 shows a setup procedure to be followed by a program for this example.
The DRAM in this example has 10-bit row addresses and 8-bit column addresses. Its address area
is H'600000 to H'67FFFF.
2WE 4-Mbit DRAM with 10-bit
row address, 8-bit column address,
and × 16-bit organization
H8/3048B Group
A18
A17
A9
A8
A8
A7
A6
A5
A4
A3
A2
A1
A7
A6
A5
A4
A3
A2
A1
A0
CS 3
RD
HWR
LWR
RAS
CAS
UW
LW
OE
D15 to D 0
I/O 15 to I/O 0
a. Interconnections (example)
H'600000
DRAM area
H'67FFFF
H'680000
Area 3 (16-Mbyte mode)
Not used
H'7FFFFF
b. Address map
Figure 7.9 Interconnections and Address Map for 2WE
WE 4-Mbit DRAM (Example)
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Section 7 Refresh Controller
Set area 3 for 16-bit access
Set P81 DDR to 1 for CS3 output
Set RTCOR
Set bits CKS2 to CKS0 in RTMCSR
Write H'23 in RFSHCR
Wait for DRAM to be initialized
DRAM can be accessed
Figure 7.10 Setup Procedure for 2WE
WE 4-Mbit DRAM with 10-Bit Row Address and 8-Bit
Column Address (16-Mbyte Mode)
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Section 7 Refresh Controller
Example 3: Connection to 2CAS
CAS 4-Mbit DRAM (16-Mbyte Mode)
Figure 7.11 shows typical interconnections to a single 2CAS 4-Mbit DRAM, and the
corresponding address map.
Figure 7.12 shows a setup procedure to be followed by a program for this example.
The DRAM in this example has 9-bit row addresses and 9-bit column addresses. Its address area is
H'600000 to H'67FFFF.
2CAS 4-Mbit DRAM with 9-bit
row address, 9-bit column address,
and × 16-bit organization
A9
A8
A7
A6
A5
A4
A3
A2
A1
H8/3048B Group
A8
A7
A6
A5
A4
A3
A2
A1
A0
CS 3
HWR
LWR
RD
RAS
UCAS
LCAS
WE
OE
D15 to D 0
I/O 15 to I/O 0
a. Interconnections (example)
H'600000
DRAM area
H'67FFFF
H'680000
Not used
Area 3 (16-Mbyte mode)
H'7FFFFF
b. Address map
Figure 7.11 Interconnections and Address Map for 2CAS
CAS 4-Mbit DRAM (Example)
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Section 7 Refresh Controller
Set area 3 for 16-bit access
Set P81 DDR to 1 for CS3 output
Set RTCOR
Set bits CKS2 to CKS0 in RTMCSR
Write H'3B in RFSHCR
Wait for DRAM to be initialized
DRAM can be accessed
Figure 7.12 Setup Procedure for 2CAS
CAS 4-Mbit DRAM with 9-Bit Row Address and 9-Bit
Column Address (16-Mbyte Mode)
Example 4: Connection to Multiple 4-Mbit DRAM Chips (16-Mbyte Mode)
Figure 7.13 shows an example of interconnections to two 2CAS 4-Mbit DRAM chips, and the
corresponding address map. Up to four DRAM chips can be connected to area 3 by decoding
upper address bits A19 and A20.
Figure 7.14 shows a setup procedure to be followed by a program for this example. The DRAM in
this example has 9-bit row addresses and 9-bit column addresses. Both chips must be refreshed
simultaneously, so the RFSH pin must be used.
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Section 7 Refresh Controller
2CAS 4-Mbit DRAM with 9-bit
row address, 9-bit column
address, and × 16-bit organization
A 8 to A 0
H8/3048B Group
RAS
A19
A 9 to A 1
UCAS
No. 1
LCAS
WE
OE
I/O15 to I/O 0
A 8 to A 0
CS 3
RAS
HWR
UCAS
LWR
RD
LCAS
WE
RFSH
No. 2
OE
D15 to D 0
I/O15 to I/O 0
a. Interconnections (example)
H'600000
H'67FFFF
H'680000
H'6FFFFF
H'700000
No. 1
DRAM area
No. 2
DRAM area
Area 3 (16-Mbyte mode)
Not used
H'7FFFFF
b. Address map
Figure 7.13 Interconnections and Address Map for Multiple 2CAS
CAS 4-Mbit DRAM Chips
(Example)
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Section 7 Refresh Controller
Set area 3 for 16-bit access
Set P81 DDR to 1 for CS 3 output
Set RTCOR
Set bits CKS2 to CKS0 in RTMCSR
Write H'3F in RFSHCR
Wait for DRAM to be initialized
DRAM can be accessed
Figure 7.14 Setup Procedure for Multiple 2CAS
CAS 4-Mbit DRAM Chips with 9-Bit Row
Address and 9-Bit Column Address (16-Mbyte Mode)
7.3.3
Pseudo-Static RAM Refresh Control
Refresh Request Interval and Refresh Cycle Execution
The refresh request interval is determined as in a DRAM interface, by the settings of RTCOR and
bits CKS2 to CKS0 in RTMCSR. The numbers of states required for pseudo-static RAM
read/write cycles and refresh cycles are the same as for DRAM (see table 7.4). The state
transitions are as shown in figure 7.3.
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Section 7 Refresh Controller
Pseudo-Static RAM Control Signals
Figure 7.15 shows the control signals for pseudo-static RAM read, write, and refresh cycles.
Read cycle
Write cycle *
Refresh cycle
φ
Address
bus
Area 3 top address
CS 3
RD
HWR
LWR
RFSH
AS
Note: * 16-bit access
Figure 7.15 Pseudo-Static RAM Control Signal Output Timing
Refresh Cycle Priority Order
When there are simultaneous bus requests, the priority order is:
(High)
External bus master > refresh controller > DMA controller > CPU
(Low)
For details see section 6.3.7, Bus Arbiter Operation.
Wait State Insertion
When bit AST3 is set to 1 in ASTCR, the wait state controller (WSC) can insert wait states into
bus cycles and refresh cycles. For details see section 6.3.5, Wait Modes.
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Section 7 Refresh Controller
Self-Refresh Mode
Some pseudo-static RAM devices have a self-refresh function. After the SRFMD bit is set to 1 in
RFSHCR, when a transition to software standby mode occurs, the H8/3048B Group’s CS3 output
goes high and its RFSH output goes low so that the pseudo-static RAM self-refresh function can
be used. On exit from software standby mode, the RFSH output goes high.
Table 7.8 shows the pin states in software standby mode. Figure 7.16 shows the signal output
timing.
Table 7.8
Pin States in Software Standby Mode (2) (PSRAME = 1, DRAME = 0)
Software Standby Mode
Signal
SRFMD = 0
SRFMD = 1 (Self-Refresh Mode)
CS3
High
High
RD
High-impedance
High-impedance
HWR
High-impedance
High-impedance
LWR
High-impedance
High-impedance
RFSH
High
Low
Software standby mode
Oscillator
settling time
φ
High-impedance
Address
bus
CS3
RD
HWR
LWR
High
High-impedance
High-impedance
High-impedance
RFSH
Figure 7.16 Signal Output Timing in Self-Refresh Mode (PSRAME = 1, DRAME = 0)
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Section 7 Refresh Controller
Operation in Power-Down State
The refresh controller operates in sleep mode. It does not operate in hardware standby mode. In
software standby mode RTCNT is initialized, but RFSHCR, RTMCSR bits 5 to 3, and RTCOR
retain their settings prior to the transition to software standby mode.
Example
Pseudo-static RAM may have separate OE and RFSH pins, or these may be combined into a single
OE/RFSH pin. Figure 7.17 shows an example of a circuit for generating an OE/RFSH signal.
Check the device characteristics carefully, and design a circuit that fits them. Figure 7.18 shows a
setup procedure to be followed by a program.
H8/3048B Group
PSRAM
RD
OE/RFSH
RFSH
Figure 7.17 Interconnection to Pseudo-Static RAM with OE/RFSH
OE RFSH Signal (Example)
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Section 7 Refresh Controller
Set P81 DDR to 1 for CS 3 output
Set RTCOR
Set bits CKS2 to CKS0 in RTMCSR
Write H'47 in RFSHCR
Wait for PSRAM to be initialized
PSRAM can be accessed
Figure 7.18 Setup Procedure for Pseudo-Static RAM
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Section 7 Refresh Controller
7.3.4
Interval Timer
To use the refresh controller as an interval timer, clear the PSRAME and DRAME both to 0. After
setting RTCOR, select a clock source with bits CKS2 to CKS0 in RTMCSR, and set the CMIE bit
to 1.
Timing of Setting of Compare Match Flag and Clearing by Compare Match
The CMF flag in RTCSR is set to 1 by a compare match signal output when the RTCOR and
RTCNT values match. The compare match signal is generated in the last state in which the values
match (when RTCNT is updated from the matching value to a new value). Accordingly, when
RTCNT and RTCOR match, the compare match signal is not generated until the next counter
clock pulse. Figure 7.19 shows the timing.
φ
RTCNT
N
RTCOR
H'00
N
Compare
match signal
CMF flag
Figure 7.19 Timing of Setting of CMF Flag
Operation in Power-Down State
The interval timer function operates in sleep mode. It does not operate in hardware standby mode.
In software standby mode RTCNT and RTMCSR bits 7 and 6 are initialized, but RTMCSR bits 5
to 3 and RTCOR retain their settings prior to the transition to software standby mode.
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Section 7 Refresh Controller
Contention between RTCNT Write and Counter Clear
If a counter clear signal occurs in the T3 state of an RTCNT write cycle, clearing of the counter
takes priority and the write is not performed. See figure 7.20.
RTCNT write cycle by CPU
T2
T1
T3
φ
Address bus
RTCNT address
Internal
write signal
Counter
clear signal
RTCNT
N
H'00
Figure 7.20 Contention between RTCNT Write and Clear
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Section 7 Refresh Controller
Contention between RTCNT Write and Increment
If an increment pulse occurs in the T3 state of an RTCNT write cycle, writing takes priority and
RTCNT is not incremented. See figure 7.21.
RTCNT write cycle by CPU
T1
T2
T3
φ
Address bus
RTCNT address
Internal
write signal
RTCNT
input clock
RTCNT
N
M
Counter write data
Figure 7.21 Contention between RTCNT Write and Increment
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Section 7 Refresh Controller
Contention between RTCOR Write and Compare Match
If a compare match occurs in the T3 state of an RTCOR write cycle, writing takes priority and the
compare match signal is inhibited. See figure 7.22.
RTCOR write cycle by CPU
T1
T2
T3
φ
Address bus
RTCNT address
Internal
write signal
RTCNT
N
N+1
RTCOR
N
M
RTCOR write data
Compare
match signal
Inhibited
Figure 7.22 Contention between RTCOR Write and Compare Match
RTCNT Operation at Internal Clock Source Switchover
Switching internal clock sources may cause RTCNT to increment, depending on the switchover
timing. Table 7.9 shows the relation between the time of the switchover (by writing to bits CKS2
to CKS0) and the operation of RTCNT.
The RTCNT input clock is generated from the internal clock source by detecting the falling edge
of the internal clock. If a switchover is made from a high clock source to a low clock source, as in
case No. 3 in table 7.9, the switchover will be regarded as a falling edge, an RTCNT clock pulse
will be generated, and RTCNT will be incremented.
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Section 7 Refresh Controller
Table 7.9
Internal Clock Switchover and RTCNT Operation
No.
CKS2 to CKS0
Write Timing
1
Low → low
RTCNT Operation
switchover*1
Old clock
source
New clock
source
RTCNT
clock
RTCNT
N
N+1
CKS bits rewritten
2
Low → high switchover*
2
Old clock
source
New clock
source
RTCNT
clock
RTCNT
N
N+1
N+2
CKS bits rewritten
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Section 7 Refresh Controller
No.
CKS2 to CKS0
Write Timing
3
High → low
RTCNT Operation
switchover*3
Old clock
source
New clock
source
*4
RTCNT
clock
RTCNT
N
N+1
N+2
CKS bits rewritten
4
High → high switchover*
4
Old clock
source
New clock
source
RTCNT
clock
RTCNT
N
N+1
N+2
CKS bits rewritten
Notes: 1. Including switchovers from a low clock source to the halted state, and from the halted
state to a low clock source.
2. Including switchover from the halted state to a high clock source.
3. Including switchover from a high clock source to the halted state.
4. The switchover is regarded as a falling edge, causing RTCNT to increment.
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Section 7 Refresh Controller
7.4
Interrupt Source
Compare match interrupts (CMI) can be generated when the refresh controller is used as an
interval timer. Compare match interrupt requests are masked/unmasked with the CMIE bit of
RTMCSR.
7.5
Usage Notes
When using the DRAM or pseudo-static RAM refresh function, note the following points:
• With the refresh controller, if directly connected DRAM or PSRAM is disconnected*, the
P80/RFSH/IRQ0 pin and the P81/CS3/IRQ1 pin may both become low-level outputs
simultaneously.
Note: * When the DRAM enable bit (DRAME) or PSRAM enable bit (PSRAME) in the
refresh control register (RFSHCR) is cleared to 0 after being set to 1.
Address bus
Area 3 start address
P80/RFSH/IRQ0
P81/CS3/IRQ1
Figure 7.23 Operation when DRAM/PSRAM Connection Is Switched
• Refresh cycles are not executed while the bus is released, during software standby mode, and
when a bus cycle is greatly prolonged by insertion of wait states. When these conditions occur,
other means of refreshing are required.
• If refresh requests occur while the bus is released, the first request is held and one refresh cycle
is executed after the bus-released state ends. Figure 7.24 shows the bus cycles in this case.
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Section 7 Refresh Controller
Bus-released state
Refresh cycle
CPU cycle
Refresh cycle
φ
RFSH
Refresh
request
BACK
Figure 7.24 Refresh Cycles when Bus Is Released
• If a bus cycle is prolonged by insertion of wait states, the first refresh request is held, as in the
bus-released state.
• If there is contention with a bus request from an external bus master when making a transition
to software standby mode, a one-state bus-released state may occur immediately before the
transition to software standby mode (see figure 7.25).
When using software standby mode, clear the BRLE bit to 0 in BRCR before executing the
SLEEP instruction.
When making a transition to self-refresh mode, the strobe waveform output may not be
guaranteed due to the same kind of contention. This, too, can be prevented by clearing the
BRLE bit to 0 in BRCR.
External bus
released state
Software standby mode
φ
BREQ
BACK
Address bus
Strobe
Figure 7.25 Contention between Bus-Released State and Software Standby Mode
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Section 7 Refresh Controller
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Section 8 DMA Controller
Section 8 DMA Controller
8.1
Overview
The H8/3048B Group has an on-chip DMA controller (DMAC) that can transfer data on up to four
channels.
When the DMA controller is not used, it can be independently halted to conserve power. For
details see section 20.6, Module Standby Function.
8.1.1
Features
DMAC features are listed below.
• Selection of short address mode or full address mode
Short address mode:
 8-bit source address and 24-bit destination address, or vice versa
 Maximum four channels available
 Selection of I/O mode, idle mode, or repeat mode
Full address mode:
 24-bit source and destination addresses
 Maximum two channels available
 Selection of normal mode or block transfer mode
• Directly addressable 16-Mbyte address space
• Selection of byte or word transfer
• Activation by internal interrupts, external requests, or auto-request (depending on transfer
mode)
 16-bit integrated timer unit (ITU) compare match/input capture interrupts (four)
 Serial communication interface (SCI channel 0) transmit-data-empty/receive-data-full
interrupts
 External requests
 Auto-request
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Section 8 DMA Controller
8.1.2
Block Diagram
Figure 8.1 shows a DMAC block diagram.
Internal address bus
Address buffer
IMIA0
IMIA1
IMIA2
IMIA3
TXI0
RXI0
DREQ0
DREQ1
TEND0
TEND1
Arithmetic-logic unit
MAR0A
Channel
0A
Control logic
ETCR0A
Channel
0
MAR0B
Channel
0B
DTCR0A
Interrupt DEND0A
signals
DEND0B
DEND1A
DEND1B
MAR1A
Channel
1A
DTCR1A
Channel
1
MAR1B
Internal data bus
Legend:
DTCR: Data transfer control register
MAR: Memory address register
IOAR: I/O address register
ETCR: Execute transfer count register
Figure 8.1 Block Diagram of DMAC
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IOAR1A
ETCR1A
Channel
1B
Data buffer
IOAR0B
ETCR0B
DTCR0B
DTCR1B
IOAR0A
IOAR1B
ETCR1B
Module data bus
Internal
interrupts
Section 8 DMA Controller
8.1.3
Functional Overview
Table 8.1 gives an overview of the DMAC functions.
Table 8.1
DMAC Functional Overview
Address
Reg. Length
Transfer Mode
Activation
Source
Destination
Short
address
mode
•
Compare match/
input capture A
interrupts from ITU
channels 0 to 3
24
8
•
Transmit-data-empty
interrupt from SCI
channel 0
•
Receive-data-full
interrupt from SCI
channel 0
8
24
•
External request
24
8
I/O mode
•
Transfers one byte or one word
per request
•
Increments or decrements the
memory address by 1 or 2
•
Executes 1 to 65,536 transfers
Idle mode
•
Transfers one byte or one word
per request
•
Holds the memory address fixed
•
Executes 1 to 65,536 transfers
Repeat mode
•
Transfers one byte or one word per
request
•
Increments or decrements the
memory address by 1 or 2
•
Executes a specified number (1 to
255) of transfers, then returns to
the initial state and continues
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Section 8 DMA Controller
Address
Reg. Length
Transfer Mode
Activation
Source
Destination
Full
address
mode
Normal mode
•
Auto-request
24
24
•
•
External request
•
Compare match/
input capture A
interrupts from ITU
channels 0 to 3
24
24
•
External request
Auto-request
 Retains the transfer request
internally
 Executes a specified number
(1 to 65,536) of transfers
continuously
 Selection of burst mode or
cycle-steal mode
•
External request
 Transfers one byte or one
word per request
 Executes 1 to 65,536 transfers
Block transfer
•
Transfers one block of a specified
size per request
•
Executes 1 to 65,536 transfers
•
Allows either the source or
destination to be a fixed block
area
•
Block size can be 1 to 255 bytes
or words
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Section 8 DMA Controller
8.1.4
Input/Output Pins
Table 8.2 lists the DMAC pins.
Table 8.2
DMAC Pins
Channel
Name
Abbreviation
Input/
Output
Function
0
DMA request 0
DREQ0
Input
External request for DMAC channel 0
Transfer end 0
TEND0
Output
Transfer end on DMAC channel 0
DMA request 1
DREQ1
Input
External request for DMAC channel 1
Transfer end 1
TEND1
Output
Transfer end on DMAC channel 1
1
Note: External requests cannot be made to channel A in short address mode.
8.1.5
Register Configuration
Table 8.3 lists the DMAC registers.
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Section 8 DMA Controller
Table 8.3
DMAC Registers
Channel
Address*
Name
0
H'FF20
Memory address register 0AR
MAR0AR
R/W
H'FF
H'FF21
Memory address register 0AE
MAR0AE
R/W
Undetermined
H'FF22
Memory address register 0AH
MAR0AH
R/W
Undetermined
H'FF23
Memory address register 0AL
MAR0AL
R/W
Undetermined
H'FF26
I/O address register 0A
IOAR0A
R/W
Undetermined
H'FF24
Execute transfer count register 0AH
ETCR0AH
R/W
Undetermined
H'FF25
Execute transfer count register 0AL
ETCR0AL
R/W
Undetermined
H'FF27
Data transfer control register 0A
DTCR0A
R/W
H'00
H'FF28
Memory address register 0BR
MAR0BR
R/W
H'FF
H'FF29
Memory address register 0BE
MAR0BE
R/W
Undetermined
H'FF2A
Memory address register 0BH
MAR0BH
R/W
Undetermined
H'FF2B
Memory address register 0BL
MAR0BL
R/W
Undetermined
H'FF2E
I/O address register 0B
IOAR0B
R/W
Undetermined
H'FF2C
Execute transfer count register 0BH
ETCR0BH
R/W
Undetermined
1
Note:
*
Abbreviation
R/W
Initial Value
H'FF2D
Execute transfer count register 0BL
ETCR0BL
R/W
Undetermined
H'FF2F
Data transfer control register 0B
DTCR0B
R/W
H'00
H'FF30
Memory address register 1AR
MAR1AR
R/W
H'FF
H'FF31
Memory address register 1AE
MAR1AE
R/W
Undetermined
H'FF32
Memory address register 1AH
MAR1AH
R/W
Undetermined
H'FF33
Memory address register 1AL
MAR1AL
R/W
Undetermined
H'FF36
I/O address register 1A
IOAR1A
R/W
Undetermined
H'FF34
Execute transfer count register 1AH
ETCR1AH
R/W
Undetermined
H'FF35
Execute transfer count register 1AL
ETCR1AL
R/W
Undetermined
H'FF37
Data transfer control register 1A
DTCR1A
R/W
H'00
H'FF38
Memory address register 1BR
MAR1BR
R/W
H'FF
H'FF39
Memory address register 1BE
MAR1BE
R/W
Undetermined
H'FF3A
Memory address register 1BH
MAR1BH
R/W
Undetermined
H'FF3B
Memory address register 1BL
MAR1BL
R/W
Undetermined
H'FF3E
I/O address register 1B
IOAR1B
R/W
Undetermined
H'FF3C
Execute transfer count register 1BH
ETCR1BH
R/W
Undetermined
H'FF3D
Execute transfer count register 1BL
ETCR1BL
R/W
Undetermined
H'FF3F
Data transfer control register 1B
DTCR1B
R/W
H'00
The lower 16 bits of the address are indicated.
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Section 8 DMA Controller
8.2
Register Descriptions (Short Address Mode)
In short address mode, transfers can be carried out independently on channels A and B. Short
address mode is selected by bits DTS2A and DTS1A in data transfer control register A (DTCRA)
as indicated in table 8.4.
Table 8.4
Selection of Short and Full Address Modes
Channel
Bit 2:
DTS2A
Bit 1:
DTS1A
0
1
1
1
Other than above
DMAC channels 0A and 0B operate as two independent
channels in short address mode
1
DMAC channel 1 operates as one channel in full address
mode
1
Other than above
8.2.1
Description
DMAC channel 0 operates as one channel in full address
mode
DMAC channels 1A and 1B operate as two independent
channels in short address mode
Memory Address Registers (MAR)
A memory address register (MAR) is a 32-bit readable/writable register that specifies a source or
destination address. The transfer direction is determined automatically from the activation source.
An MAR consists of four 8-bit registers designated MARR, MARE, MARH, and MARL. All bits
of MARR are reserved: they cannot be modified and are always read as 1.
Bit
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9
Initial value
1
Read/Write
        R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
1
1
1
1
MARR
1
1
1
8
7
6
5
4
3
2
1
0
Undetermined
MARE
MARH
MARL
Source or destination address
An MAR functions as a source or destination address register depending on how the DMAC is
activated: as a destination address register if activation is by a receive-data-full interrupt from the
serial communication interface (SCI) (channel 0), and as a source address register otherwise.
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Section 8 DMA Controller
The MAR value is incremented or decremented each time one byte or word is transferred,
automatically updating the source or destination memory address. For details, see section 8.2.4,
Data Transfer Control Registers (DTCR).
The MARs are not initialized by a reset or in standby mode.
8.2.2
I/O Address Registers (IOAR)
An I/O address register (IOAR) is an 8-bit readable/writable register that specifies a source or
destination address. The IOAR value is the lower 8 bits of the address. The upper 16 address bits
are all 1 (H'FFFF).
Bit
7
6
5
3
2
1
0
R/W
R/W
R/W
Undetermined
Initial value
Read/Write
4
R/W
R/W
R/W
R/W
R/W
Source or destination address
An IOAR functions as a source or destination address register depending on how the DMAC is
activated: as a source address register if activation is by a receive-data-full interrupt from the SCI
(channel 0), and as a destination address register otherwise.
The IOAR value is held fixed. It is not incremented or decremented when a transfer is executed.
The IOARs are not initialized by a reset or in standby mode.
8.2.3
Execute Transfer Count Registers (ETCR)
An execute transfer count register (ETCR) is a 16-bit readable/writable register that specifies the
number of transfers to be executed. These registers function in one way in I/O mode and idle
mode, and another way in repeat mode.
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Section 8 DMA Controller
I/O mode and idle mode
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
Undetermined
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Transfer counter
In I/O mode and idle mode, ETCR functions as a 16-bit counter. The count is decremented by
1 each time one transfer is executed. The transfer ends when the count reaches H'0000.
Repeat mode
Bit
7
6
5
R/W
R/W
R/W
Initial value
Read/Write
4
3
2
1
0
R/W
R/W
R/W
2
1
0
R/W
R/W
R/W
Undetermined
R/W
R/W
ETCRH
Transfer counter
Bit
7
6
5
Initial value
Read/Write
4
3
Undetermined
R/W
R/W
R/W
R/W
R/W
ETCRL
Initial count
In repeat mode, ETCRH functions as an 8-bit transfer counter and ETCRL holds the initial transfer
count. ETCRH is decremented by 1 each time one transfer is executed. When ETCRH reaches
H'00, the value in ETCRL is reloaded into ETCRH and the same operation is repeated.
The ETCRs are not initialized by a reset or in standby mode.
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Section 8 DMA Controller
8.2.4
Data Transfer Control Registers (DTCR)
A data transfer control register (DTCR) is an 8-bit readable/writable register that controls the
operation of one DMAC channel.
Bit
7
6
5
4
3
2
1
0
DTE
DTSZ
DTID
RPE
DTIE
DTS2
DTS1
DTS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Data transfer enable
Enables or disables
data transfer
Data transfer select
These bits select the data
transfer activation source
Data transfer size
Selects byte or
word size
Data transfer interrupt enable
Enables or disables the CPU interrupt
at the end of the transfer
Data transfer
increment/decrement
Selects whether to
increment or decrement
the memory address
register
Repeat enable
Selects repeat
mode
The DTCRs are initialized to H'00 by a reset and in standby mode.
Bit 7—Data Transfer Enable (DTE): Enables or disables data transfer on a channel. When the
DTE bit is set to 1, the channel waits for a transfer to be requested, and executes the transfer when
activated as specified by bits DTS2 to DTS0. When DTE is 0, the channel is disabled and does not
accept transfer requests. DTE is set to 1 by reading the register when DTE is 0, then writing 1.
Bit 7: DTE
Description
0
Data transfer is disabled. In I/O mode or idle mode, DTE is cleared to 0 when
the specified number of transfers have been completed.
(Initial value)
1
Data transfer is enabled
If DTIE is set to 1, a CPU interrupt is requested when DTE is cleared to 0.
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Section 8 DMA Controller
Bit 6—Data Transfer Size (DTSZ): Selects the data size of each transfer.
Bit 6: DTSZ
Description
0
Byte-size transfer
1
Word-size transfer
(Initial value)
Bit 5—Data Transfer Increment/Decrement (DTID): Selects whether to increment or
decrement the memory address register (MAR) after a data transfer in I/O mode or repeat mode.
Bit 5: DTID
Description
0
MAR is incremented after each data transfer
1
•
If DTSZ = 0, MAR is incremented by 1 after each transfer
•
If DTSZ = 1, MAR is incremented by 2 after each transfer
MAR is decremented after each data transfer
•
If DTSZ = 0, MAR is decremented by 1 after each transfer
•
If DTSZ = 1, MAR is decremented by 2 after each transfer
MAR is not incremented or decremented in idle mode.
Bit 4—Repeat Enable (RPE): Selects whether to transfer data in I/O mode, idle mode, or repeat
mode.
Bit 4: RPE
Bit 3: DTIE
Description
0
0
I/O mode
(Initial value)
1
1
0
Repeat mode
1
Idle mode
Operations in these modes are described in sections 8.4.2, I/O Mode, 8.4.3, Idle Mode, and 8.4.4,
Repeat Mode.
Bit 3—Data Transfer Interrupt Enable (DTIE): Enables or disables the CPU interrupt (DEND)
requested when the DTE bit is cleared to 0.
Bit 3: DTIE
Description
0
The DEND interrupt requested by DTE is disabled
1
The DEND interrupt requested by DTE is enabled
(Initial value)
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Section 8 DMA Controller
Bits 2 to 0—Data Transfer Select (DTS2, DTS1, DTS0): These bits select the data transfer
activation source. Some of the selectable sources differ between channels A and B.*
Note: * Refer to section 8.3.4, Data Transfer Control Registers (DTCR).
Bit 2: DTS2
Bit 1: DTS1
Bit 0: DTS0
Description
0
0
0
Compare match/input capture A interrupt from ITU
channel 0
(Initial value)
1
Compare match/input capture A interrupt from ITU
channel 1
0
Compare match/input capture A interrupt from ITU
channel 2
1
Compare match/input capture A interrupt from ITU
channel 3
0
Transmit-data-empty interrupt from SCI channel 0
1
Receive-data-full interrupt from SCI channel 0
0
Falling edge of DREQ input (channel B)
1
1
0
1
Transfer in full address mode (channel A)
1
Low level of DREQ input (channel B)
Transfer in full address mode (channel A)
The same internal interrupt can be selected as an activation source for two or more channels at
once. In that case the channels are activated in a priority order, highest-priority channel first. For
the priority order, see section 8.4.9, DMAC Multiple-Channel Operation.
When a channel is enabled (DTE = 1), its selected DMAC activation source cannot generate a
CPU interrupt.
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Section 8 DMA Controller
8.3
Register Descriptions (Full Address Mode)
In full address mode the A and B channels operate together. Full address mode is selected as
indicated in table 8.4.
8.3.1
Memory Address Registers (MAR)
A memory address register (MAR) is a 32-bit readable/writable register. MARA functions as the
source address register of the transfer, and MARB as the destination address register.
An MAR consists of four 8-bit registers designated MARR, MARE, MARH, and MARL. All bits
of MARR are reserved: they cannot be modified and are always read as 1.
Bit
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9
Initial value
1
Read/Write
        R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
1
1
1
1
MARR
1
1
1
8
7
6
5
4
3
2
1
0
Undetermined
MARE
MARH
MARL
Source or destination address
The MAR value is incremented or decremented each time one byte or word is transferred,
automatically updating the source or destination memory address. For details, see section 8.3.4,
Data Transfer Control Registers (DTCR).
The MARs are not initialized by a reset or in standby mode.
8.3.2
I/O Address Registers (IOAR)
The I/O address registers (IOARs) are not used in full address mode.
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Section 8 DMA Controller
8.3.3
Execute Transfer Count Registers (ETCR)
An execute transfer count register (ETCR) is a 16-bit readable/writable register that specifies the
number of transfers to be executed. The functions of these registers differ between normal mode
and block transfer mode.
Normal mode
ETCRA:
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
Undetermined
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Block transfer counter
ETCRB: Is not used in normal mode.
In normal mode ETCRA functions as a 16-bit transfer counter. The count is decremented by 1
each time one transfer is executed. The transfer ends when the count reaches H'0000. ETCRB is
not used.
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Section 8 DMA Controller
Block transfer mode
ETCRA:
Bit
7
6
5
4
R/W
R/W
R/W
Initial value
Read/Write
3
2
1
0
R/W
R/W
R/W
2
1
0
R/W
R/W
R/W
Undetermined
R/W
R/W
ETCRAH
Block size counter
Bit
7
6
5
4
Initial value
Read/Write
3
Undetermined
R/W
R/W
R/W
R/W
R/W
ETCRAL
Initial block size
ETCRB:
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
Undetermined
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Block transfer counter
In block transfer mode, ETCRAH functions as an 8-bit block size counter. ETCRAL holds the
initial block size. ETCRAH is decremented by 1 each time one byte or word is transferred. When
the count reaches H'00, ETCRAH is reloaded from ETCRAL. Blocks consisting of an arbitrary
number of bytes or words can be transferred repeatedly by setting the same initial block size value
in ETCRAH and ETCRAL.
In block transfer mode ETCRB functions as a 16-bit block transfer counter. ETCRB is
decremented by 1 each time one block is transferred. The transfer ends when the count reaches
H'0000.
The ETCRs are not initialized by a reset or in standby mode.
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Section 8 DMA Controller
8.3.4
Data Transfer Control Registers (DTCR)
The data transfer control registers (DTCRs) are 8-bit readable/writable registers that control the
operation of the DMAC channels. A channel operates in full address mode when bits DTS2A and
DTS1A are both set to 1 in DTCRA. DTCRA and DTCRB have different functions in full address
mode.
DTCRA
Bit
7
6
5
4
3
2
1
0
DTE
DTSZ
SAID
SAIDE
DTIE
DTS2A
DTS1A
DTS0A
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Data transfer enable
Enables or disables
data transfer
Data transfer size
Selects byte or
word size
Data transfer
interrupt enable
Enables or disables the
CPU interrupt at the end
of the transfer
Source address
increment/decrement
Source address increment/
decrement enable
These bits select whether
the source address register
(MARA) is incremented,
decremented, or held fixed
during the data transfer
Data transfer
select 0A
Selects block
transfer mode
Data transfer select
2A and 1A
These bits must both be
set to 1
DTCRA is initialized to H'00 by a reset and in standby mode.
Bit 7—Data Transfer Enable (DTE): Together with the DTME bit in DTCRB, this bit enables
or disables data transfer on the channel. When the DTME and DTE bits are both set to 1, the
channel is enabled. If auto-request is specified, data transfer begins immediately. Otherwise, the
channel waits for transfers to be requested. When the specified number of transfers have been
completed, the DTE bit is automatically cleared to 0. When DTE is 0, the channel is disabled and
does not accept transfer requests. DTE is set to 1 by reading the register when DTE is 0, then
writing 1.
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Section 8 DMA Controller
Bit 7: DTE
Description
0
Data transfer is disabled (DTE is cleared to 0 when the specified number of
transfers have been completed)
(Initial value)
1
Data transfer is enabled
If DTIE is set to 1, a CPU interrupt is requested when DTE is cleared to 0.
Bit 6—Data Transfer Size (DTSZ): Selects the data size of each transfer.
Bit 6: DTSZ
Description
0
Byte-size transfer
1
Word-size transfer
(Initial value)
Bit 5—Source Address Increment/Decrement (SAID) and
Bit 4—Source Address Increment/Decrement Enable (SAIDE): These bits select whether the
source address register (MARA) is incremented, decremented, or held fixed during the data
transfer.
Bit 5: SAID
Bit 4: SAIDE
Description
0
0
MARA is held fixed
1
MARA is incremented after each data transfer
1
(Initial value)
•
If DTSZ = 0, MARA is incremented by 1 after each
transfer
•
If DTSZ = 1, MARA is incremented by 2 after each
transfer
0
MARA is held fixed
1
MARA is decremented after each data transfer
•
If DTSZ = 0, MARA is decremented by 1 after each
transfer
•
If DTSZ = 1, MARA is decremented by 2 after each
transfer
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Section 8 DMA Controller
Bit 3—Data Transfer Interrupt Enable (DTIE): Enables or disables the CPU interrupt (DEND)
requested when the DTE bit is cleared to 0.
Bit 3: DTIE
Description
0
The DEND interrupt requested by DTE is disabled
1
The DEND interrupt requested by DTE is enabled
(Initial value)
Bits 2 and 1—Data Transfer Select 2A and 1A (DTS2A, DTS1A): A channel operates in full
address mode when DTS2A and DTS1A are both set to 1.
Bit 0—Data Transfer Select 0A (DTS0A): Selects normal mode or block transfer mode.
Bit 0: DTS0A
Description
0
Normal mode
1
Block transfer mode
(Initial value)
Operations in these modes are described in sections 8.4.5, Normal Mode, and 8.4.6, Block
Transfer Mode.
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Section 8 DMA Controller
DTCRB
Bit
7
6
5
4
3
2
1
0
DTME

DAID
DAIDE
TMS
DTS2B
DTS1B
DTS0B
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Data transfer master enable
Enables or disables data
transfer, together with
the DTE bit, and is cleared
to 0 by an interrupt
Reserved bit
Transfer mode select
Selects whether the
block area is the source
or destination in block
transfer mode
Destination address
increment/decrement
Destination address
increment/decrement enable
These bits select whether
the destination address
register (MARB) is incremented,
decremented, or held fixed
during the data transfer
Data transfer select
2B to 0B
These bits select the data
transfer activation source
DTCRB is initialized to H'00 by a reset and in standby mode.
Bit 7—Data Transfer Master Enable (DTME): Together with the DTE bit in DTCRA, this bit
enables or disables data transfer. When the DTME and DTE bits are both set to 1, the channel is
enabled. When an NMI interrupt occurs DTME is cleared to 0, suspending the transfer so that the
CPU can use the bus. The suspended transfer resumes when DTME is set to 1 again. For further
information on operation in block transfer mode, see section 8.6.6, NMI Interrupts and Block
Transfer Mode.
DTME is set to 1 by reading the register while DTME = 0, then writing 1.
Bit 7: DTME
Description
0
Data transfer is disabled (DTME is cleared to 0 when an NMI interrupt occurs)
(Initial value)
1
Data transfer is enabled
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Section 8 DMA Controller
Bit 6—Reserved: Although reserved, this bit can be written and read.
Bit 5—Destination Address Increment/Decrement (DAID) and
Bit 4—Destination Address Increment/Decrement Enable (DAIDE): These bits select whether
the destination address register (MARB) is incremented, decremented, or held fixed during the
data transfer.
Bit 5: DAID
Bit 4: DAIDE
Description
0
0
MARB is held fixed
1
MARB is incremented after each data transfer
1
(Initial value)
•
If DTSZ = 0, MARB is incremented by 1 after each
data transfer
•
If DTSZ = 1, MARB is incremented by 2 after each
data transfer
0
MARB is held fixed
1
MARB is decremented after each data transfer
•
If DTSZ = 0, MARB is decremented by 1 after each
data transfer
•
If DTSZ = 1, MARB is decremented by 2 after each
data transfer
Bit 3—Transfer Mode Select (TMS): Selects whether the source or destination is the block area
in block transfer mode.
Bit 3: TMS
Description
0
Destination is the block area in block transfer mode
1
Source is the block area in block transfer mode
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(Initial value)
Section 8 DMA Controller
Bits 2 to 0—Data Transfer Select 2B to 0B (DTS2B, DTS1B, DTS0B): These bits select the
data transfer activation source. The selectable activation sources differ between normal mode and
block transfer mode.
• Normal mode
Bit 2:
DTS2B
Bit 1:
DTS1B
Bit 0:
DTS0B
Description
0
0
0
Auto-request (burst mode)
1
Cannot be used
0
Auto-request (cycle-steal mode)
1
Cannot be used
0
Cannot be used
1
Cannot be used
1
1
0
1
0
Falling edge of DREQ
1
Low level input at DREQ
Description
(Initial value)
• Block transfer mode
Bit 2:
DTS2B
Bit 1:
DTS1B
Bit 0:
DTS0B
0
0
0
Compare match/input capture A interrupt from ITU
channel 0
(Initial value)
1
Compare match/input capture A interrupt from ITU
channel 1
0
Compare match/input capture A interrupt from ITU
channel 2
1
Compare match/input capture A interrupt from ITU
channel 3
0
Cannot be used
1
Cannot be used
0
Falling edge of DREQ
1
Cannot be used
1
1
0
1
The same internal interrupt can be selected to activate two or more channels. The channels are
activated in a priority order, highest priority first. For the priority order, see section 8.4.9, DMAC
Multiple-Channel Operation.
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Section 8 DMA Controller
8.4
Operation
8.4.1
Overview
Table 8.5 summarizes the DMAC modes.
Table 8.5
DMAC Modes
Transfer Mode
Short address
mode
I/O mode
Idle mode
Repeat mode
Activation
Notes
Compare match/input
capture A interrupt from
ITU channels 0 to 3
•
Up to four channels can
operate independently
•
Only the B channels
support external requests
•
A and B channels are
paired; up to two channels
are available
Transmit-data-empty and
receive-data-full interrupts
from SCI channel 0
External request
Full address
mode
Normal mode
Auto-request
External request
Block transfer
mode
Compare match/input
capture A interrupt from ITU •
channels 0 to 3
External request
Burst mode or cycle-steal
mode can be selected for
auto-requests
A summary of operations in these modes follows.
I/O Mode
One byte or word is transferred per request. A designated number of these transfers are executed.
A CPU interrupt can be requested at completion of the designated number of transfers. One 24-bit
address and one 8-bit address are specified. The transfer direction is determined automatically
from the activation source.
Idle Mode
One byte or word is transferred per request. A designated number of these transfers are executed.
A CPU interrupt can be requested at completion of the designated number of transfers. One 24-bit
address and one 8-bit address are specified. The addresses are held fixed. The transfer direction is
determined automatically from the activation source.
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Section 8 DMA Controller
Repeat Mode
One byte or word is transferred per request. A designated number of these transfers are executed.
When the designated number of transfers are completed, the initial address and counter value are
restored and operation continues. No CPU interrupt is requested. One 24-bit address and one 8-bit
address are specified. The transfer direction is determined automatically from the activation
source.
Normal Mode
Auto-request: The DMAC is activated by register setup alone, and continues executing transfers
until the designated number of transfers have been completed. A CPU interrupt can be requested at
completion of the transfers. Both addresses are 24-bit addresses.
• Cycle-steal mode
The bus is released to another bus master after each byte or word is transferred.
• Burst mode
Unless requested by a higher-priority bus master, the bus is not released until the designated
number of transfers have been completed.
External request: One byte or word is transferred per request. A designated number of these
transfers are executed. A CPU interrupt can be requested at completion of the designated number
of transfers. Both addresses are 24-bit addresses.
Block Transfer Mode
One block of a specified size is transferred per request. A designated number of block transfers are
executed. At the end of each block transfer, one address is restored to its initial value. When the
designated number of blocks have been transferred, a CPU interrupt can be requested. Both
addresses are 24-bit addresses.
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Section 8 DMA Controller
8.4.2
I/O Mode
I/O mode can be selected independently for each channel.
One byte or word is transferred at each transfer request in I/O mode. A designated number of these
transfers are executed. One address is specified in the memory address register (MAR), the other
in the I/O address register (IOAR). The direction of transfer is determined automatically from the
activation source. The transfer is from the address specified in IOAR to the address specified in
MAR if activated by an SCI channel 0 receive-data-full interrupt, and from the address specified
in MAR to the address specified in IOAR otherwise.
Table 8.6 indicates the register functions in I/O mode.
Table 8.6
Register Functions in I/O Mode
Function
Activated by
SCI0 ReceiveData-Full
Interrupt
Other
Activation
0
Destination
address
register
0
0
Register
23
MAR
23
7
All 1s
IOAR
15
ETCR
Initial Setting
Operation
Source
address
register
Destination or
source address
Incremented or
decremented
once per
transfer
Source
address
register
Destination
address
register
Source or
destination
address
Held fixed
Transfer
counter
Transfer
counter
Number of
transfers
Decremented
once per
transfer until
H'0000 is
reached and
transfer ends
Legend:
MAR: Memory address register
IOAR: I/O address register
ETCR: Execute transfer count register
MAR and IOAR specify the source and destination addresses. MAR specifies a 24-bit source or
destination address, which is incremented or decremented as each byte or word is transferred.
IOAR specifies the lower 8 bits of a fixed address. The upper 16 bits are all 1s. IOAR is not
incremented or decremented.
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Section 8 DMA Controller
Figure 8.2 illustrates how I/O mode operates.
Transfer
Address T
IOAR
1 byte or word is
transferred per request
Address B
Legend:
L = initial setting of MAR
N = initial setting of ETCR
Address T = L
Address B = L + (−1) DTID • (2 DTSZ • N − 1)
Figure 8.2 Operation in I/O Mode
The transfer count is specified as a 16-bit value in ETCR. The ETCR value is decremented by 1 at
each transfer. When the ETCR value reaches H'0000, the DTE bit is cleared and the transfer ends.
If the DTIE bit is set to 1, a CPU interrupt is requested at this time. The maximum transfer count
is 65,536, obtained by setting ETCR to H'0000.
Transfers can be requested (activated) by compare match/input capture A interrupts from ITU
channels 0 to 3, transmit-data-empty and receive-data-full interrupts from SCI channel 0, and
external request signals.
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Section 8 DMA Controller
For the detailed settings see section 8.2.4, Data Transfer Control Registers (DTCR).
Figure 8.3 shows a sample setup procedure for I/O mode.
I/O mode setup
Set source and
destination addresses
1
Set transfer count
2
Read DTCR
3
Set DTCR
4
1. Set the source and destination addresses
in MAR and IOAR. The transfer direction is
determined automatically from the activation
source.
2. Set the transfer count in ETCR.
3. Read DTCR while the DTE bit is cleared to 0.
4. Set the DTCR bits as follows.
• Select the DMAC activation source with bits
DTS2 to DTS0.
• Set or clear the DTIE bit to enable or disable
the CPU interrupt at the end of the transfer.
• Clear the RPE bit to 0 to select I/O mode.
• Select MAR increment or decrement with the
DTID bit.
• Select byte size or word size with the DTSZ bit.
• Set the DTE bit to 1 to enable the transfer.
I/O mode
Figure 8.3 I/O Mode Setup Procedure (Example)
8.4.3
Idle Mode
Idle mode can be selected independently for each channel.
One byte or word is transferred at each transfer request in idle mode. A designated number of
these transfers are executed. One address is specified in the memory address register (MAR), the
other in the I/O address register (IOAR). The direction of transfer is determined automatically
from the activation source. The transfer is from the address specified in IOAR to the address
specified in MAR if activated by an SCI channel 0 receive-data-full interrupt, and from the
address specified in MAR to the address specified in IOAR otherwise.
Table 8.7 indicates the register functions in idle mode.
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Section 8 DMA Controller
Table 8.7
Register Functions in Idle Mode
Function
Activated by
SCI0 ReceiveData-Full
Interrupt
Other
Activation
0
Destination
address
register
0
0
Register
23
MAR
23
7
All 1s
IOAR
15
ETCR
Initial Setting
Operation
Source
address
register
Destination or
source address
Held fixed
Source
address
register
Destination
address
register
Source or
destination
address
Held fixed
Transfer
counter
Transfer
counter
Number of
transfers
Decremented
once per
transfer until
H'0000 is
reached and
transfer ends
Legend:
MAR: Memory address register
IOAR: I/O address register
ETCR: Execute transfer count register
MAR and IOAR specify the source and destination addresses. MAR specifies a 24-bit source or
destination address. IOAR specifies the lower 8 bits of a fixed address. The upper 16 bits are all
1s. MAR and IOAR are not incremented or decremented.
Figure 8.4 illustrates how idle mode operates.
MAR
Transfer
IOAR
1 byte or word is
transferred per request
Figure 8.4 Operation in Idle Mode
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Section 8 DMA Controller
The transfer count is specified as a 16-bit value in ETCR. The ETCR value is decremented by 1 at
each transfer. When the ETCR value reaches H'0000, the DTE bit is cleared, the transfer ends, and
a CPU interrupt is requested. The maximum transfer count is 65,536, obtained by setting ETCR to
H'0000.
Transfers can be requested (activated) by compare match/input capture A interrupts from ITU
channels 0 to 3, transmit-data-empty and receive-data-full interrupts from SCI channel 0, and
external request signals.
For the detailed settings see section 8.2.4, Data Transfer Control Registers (DTCR).
Figure 8.5 shows a sample setup procedure for idle mode.
Idle mode setup
Set source and
destination addresses
1
Set transfer count
2
Read DTCR
3
Set DTCR
4
1. Set the source and destination addresses
in MAR and IOAR. The transfer direction is determined automatically from the activation source.
2. Set the transfer count in ETCR.
3. Read DTCR while the DTE bit is cleared to 0.
4. Set the DTCR bits as follows.
• Select the DMAC activation source with bits
DTS2 to DTS0.
• Set the DTIE and RPE bits to 1 to select idle mode.
• Select byte size or word size with the DTSZ bit.
• Set the DTE bit to 1 to enable the transfer.
Idle mode
Figure 8.5 Idle Mode Setup Procedure (Example)
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Section 8 DMA Controller
8.4.4
Repeat Mode
Repeat mode is useful for cyclically transferring a bit pattern from a table to the programmable
timing pattern controller (TPC) in synchronization, for example, with ITU compare match. Repeat
mode can be selected for each channel independently.
One byte or word is transferred per request in repeat mode, as in I/O mode. A designated number
of these transfers are executed. One address is specified in the memory address register (MAR),
the other in the I/O address register (IOAR). At the end of the designated number of transfers,
MAR and ETCR are restored to their original values and operation continues. The direction of
transfer is determined automatically from the activation source. The transfer is from the address
specified in IOAR to the address specified in MAR if activated by an SCI channel 0 receive-datafull interrupt, and from the address specified in MAR to the address specified in IOAR otherwise.
Table 8.8 indicates the register functions in repeat mode.
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Section 8 DMA Controller
Table 8.8
Register Functions in Repeat Mode
Function
Register
23
0
Activated by
SCI0 ReceiveData-Full
Interrupt
Other
Activation
Destination
address
register
Initial Setting
Operation
Source
address
register
Destination or
source address
Incremented or
decremented at
each transfer
until H'0000,
then restored to
initial value
Source
address
register
Destination
address
register
Source or
destination
address
Held fixed
Transfer
counter
Transfer
counter
Number of
transfers
Decremented
once per
transfer until
H'0000 is
reached, then
reloaded from
ETCRL
Initial transfer
count
Initial transfer Number of
count
transfers
MAR
7
23
All 1s
0
IOAR
7
0
ETCRH
7
0
ETCRL
Held fixed
Legend:
MAR: Memory address register
IOAR: I/O address register
ETCR: Execute transfer count register
In repeat mode ETCRH is used as the transfer counter while ETCRL holds the initial transfer
count. ETCRH is decremented by 1 at each transfer until it reaches H'00, then is reloaded from
ETCRL. MAR is also restored to its initial value, which is calculated from the DTSZ and DTID
bits in DTCR. Specifically, MAR is restored as follows:
MAR ← MAR – (–1)DTID · 2DTSZ · ETCRL
ETCRH and ETCRL should be initially set to the same value.
In repeat mode transfers continue until the CPU clears the DTE bit to 0. After DTE is cleared to 0,
if the CPU sets DTE to 1 again, transfers resume from the state at which DTE was cleared. No
CPU interrupt is requested.
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Section 8 DMA Controller
As in I/O mode, MAR and IOAR specify the source and destination addresses. MAR specifies a
24-bit source or destination address. IOAR specifies the lower 8 bits of a fixed address. The upper
16 bits are all 1s. IOAR is not incremented or decremented.
Figure 8.6 illustrates how repeat mode operates.
Address T
Transfer
IOAR
1 byte or word is
transferred per request
Address B
Legend:
L = initial setting of MAR
N = initial setting of ETCRH and ETCRL
Address T = L
Address B = L + (−1)DTID • (2DTSZ • N − 1)
Figure 8.6 Operation in Repeat Mode
The transfer count is specified as an 8-bit value in ETCRH and ETCRL. The maximum transfer
count is 255, obtained by setting both ETCRH and ETCRL to H'FF.
Transfers can be requested (activated) by compare match/input capture A interrupts from ITU
channels 0 to 3, transmit-data-empty and receive-data-full interrupts from SCI channel 0, and
external request signals.
For the detailed settings see section 8.2.4, Data Transfer Control Registers (DTCR).
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Section 8 DMA Controller
Figure 8.7 shows a sample setup procedure for repeat mode.
Repeat mode
Set source and
destination addresses
1
Set transfer count
2
Read DTCR
3
Set DTCR
4
1. Set the source and destination addresses in MAR
and IOAR. The transfer direction is determined
automatically from the activation source.
2. Set the transfer count in both ETCRH and ETCRL.
3. Read DTCR while the DTE bit is cleared to 0.
4. Set the DTCR bits as follows.
• Select the DMAC activation source with bits
DTS2 to DTS0.
• Clear the DTIE bit to 0 and set the RPE bit to 1
to select repeat mode.
• Select MAR increment or decrement with the
DTID bit.
• Select byte size or word size with the DTSZ bit.
• Set the DTE bit to 1 to enable the transfer.
Repeat mode
Figure 8.7 Repeat Mode Setup Procedure (Example)
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Section 8 DMA Controller
8.4.5
Normal Mode
In normal mode the A and B channels are combined. One byte or word is transferred per request.
A designated number of these transfers are executed. Addresses are specified in MARA and
MARB. Table 8.9 indicates the register functions in I/O mode.
Table 8.9
Register Functions in Normal Mode
Register
23
Function
Initial Setting
Operation
0
Source address
register
Source address
Incremented or
decremented once per
transfer, or held fixed
0
Destination
address register
Destination
address
Incremented or
decremented once per
transfer, or held fixed
0
Transfer counter
Number of
transfers
Decremented once per
transfer
MARA
23
MARB
15
ETCRA
Legend:
MARA: Memory address register A
MARB: Memory address register B
ETCRA: Execute transfer count register A
The source and destination addresses are both 24-bit addresses. MARA specifies the source
address. MARB specifies the destination address. MARA and MARB can be independently
incremented, decremented, or held fixed as data is transferred.
The transfer count is specified as a 16-bit value in ETCRA. The ETCRA value is decremented by
1 at each transfer. When the ETCRA value reaches H'0000, the DTE bit is cleared and the transfer
ends. If the DTIE bit is set, a CPU interrupt is requested at this time. The maximum transfer count
is 65,536, obtained by setting ETCRA to H'0000.
Figure 8.8 illustrates how normal mode operates.
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Section 8 DMA Controller
Transfer
Address TA
Address BA
Address T B
Address B B
Legend:
L A = initial setting of MARA
L B = initial setting of MARB
N = initial setting of ETCRA
TA = LA
BA = L A + SAIDE • (−1)SAID • (2DTSZ • N − 1)
TB = LB
BB = L B + DAIDE • (−1)DAID • (2DTSZ • N − 1)
Figure 8.8 Operation in Normal Mode
Transfers can be requested (activated) by an external request or auto-request. An auto-requested
transfer is activated by the register settings alone. The designated number of transfers are executed
automatically. Either cycle-steal or burst mode can be selected. In cycle-steal mode the DMAC
releases the bus temporarily after each transfer. In burst mode the DMAC keeps the bus until the
transfers are completed, unless there is a bus request from a higher-priority bus master.
For the detailed settings see section 8.3.4, Data Transfer Control Registers (DTCR).
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Section 8 DMA Controller
Figure 8.9 shows a sample setup procedure for normal mode.
Normal mode
Set initial source address
1
Set initial destination address
2
Set transfer count
3
Set DTCRB (1)
4
Set DTCRA (1)
5
1.
2.
3.
4.
5.
Read DTCRB
6
Set DTCRB (2)
7
Read DTCRA
8
Set DTCRA (2)
9
6.
7.
8.
9.
Set the initial source address in MARA.
Set the initial destination address in MARB.
Set the transfer count in ETCRA.
Set the DTCRB bits as follows.
• Clear the DTME bit to 0.
• Set the DAID and DAIDE bits to select whether
MARB is incremented, decremented, or held fixed.
• Select the DMAC activation source with bits
DTS2B to DTS0B.
Set the DTCRA bits as follows.
• Clear the DTE bit to 0.
• Select byte or word size with the DTSZ bit.
• Set the SAID and SAIDE bits to select whether
MARA is incremented, decremented, or held fixed.
• Set or clear the DTIE bit to enable or disable the
CPU interrupt at the end of the transfer.
• Clear the DTS0A bit to 0 and set the DTS2A
and DTS1A bits to 1 to select normal mode.
Read DTCRB with DTME cleared to 0.
Set the DTME bit to 1 in DTCRB.
Read DTCRA with DTE cleared to 0.
Set the DTE bit to 1 in DTCRA to enable the transfer.
Normal mode
Note: Carry out settings 1 to 9 with the DEND interrupt masked in the CPU.
If an NMI interrupt occurs during the setup procedure, it may clear the DTME bit to 0, in
which case the transfer will not start.
Figure 8.9 Normal Mode Setup Procedure (Example)
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Section 8 DMA Controller
8.4.6
Block Transfer Mode
In block transfer mode the A and B channels are combined. One block of a specified size is
transferred per request. A designated number of block transfers are executed. Addresses are
specified in MARA and MARB. The block area address can be either held fixed or cycled.
Table 8.10 indicates the register functions in block transfer mode.
Table 8.10 Register Functions in Block Transfer Mode
Register
23
Function
Initial Setting
Operation
0
Source address
register
Source address
Incremented or
decremented once per
transfer, or held fixed
0
Destination
address register
Destination
address
Incremented or
decremented once per
transfer, or held fixed
0
Block size
counter
Block size
Decremented once per
transfer until H'00 is
reached, then reloaded
from ETCRAL
Initial block size
Block size
Held fixed
Block transfer
counter
Number of block
transfers
Decremented once per
block transfer until H'0000
is reached and the
transfer ends
MARA
23
MARB
7
ETCRAH
7
0
ETCRAL
15
0
ETCRB
Legend:
MARA:
MARB:
ETCRA:
ETCRB:
Memory address register A
Memory address register B
Execute transfer count register A
Execute transfer count register B
The source and destination addresses are both 24-bit addresses. MARA specifies the source
address. MARB specifies the destination address. MARA and MARB can be independently
incremented, decremented, or held fixed as data is transferred. One of these registers operates as a
block area register: even if it is incremented or decremented, it is restored to its initial value at the
end of each block transfer. The TMS bit in DTCRB selects whether the block area is the source or
destination.
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Section 8 DMA Controller
If M (1 to 255) is the size of the block transferred at each request and N (1 to 65,536) is the
number of blocks to be transferred, then ETCRAH and ETCRAL should initially be set to M and
ETCRB should initially be set to N.
Figure 8.10 illustrates how block transfer mode operates. In this figure, bit TMS is cleared to 0,
meaning the block area is the destination.
TA
Address T B
Transfer
Block 1
Block area
BA
Address B B
Block 2
M bytes or words are
transferred per request
Block N
Legend:
L A = initial setting of MARA
L B = initial setting of MARB
M = initial setting of ETCRAH and ETCRAL
N = initial setting of ETCRB
T A = LA
B A = L A + SAIDE • (−1)SAID • (2DTSZ • M − 1)
T B = LB
B B = L B + DAIDE • (−1)DAID • (2DTSZ • M − 1)
Figure 8.10 Operation in Block Transfer Mode
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Section 8 DMA Controller
When activated by a transfer request, the DMAC executes a burst transfer. During the transfer
MARA and MARB are updated according to the DTCR settings, and ETCRAH is decremented.
When ETCRAH reaches H'00, it is reloaded from ETCRAL to restore the initial value. The
memory address register of the block area is also restored to its initial value, and ETCRB is
decremented. If ETCRB is not H'0000, the DMAC then waits for the next transfer request.
ETCRAH and ETCRAL should be initially set to the same value.
The above operation is repeated until ETCRB reaches H'0000, at which point the DTE bit is
cleared to 0 and the transfer ends. If the DTIE bit is set to 1, a CPU interrupt is requested at this
time.
Figure 8.11 shows examples of a block transfer with byte data size when the block area is the
destination. In (a) the block area address is cycled. In (b) the block area address is held fixed.
Transfers can be requested (activated) by compare match/input capture A interrupts from ITU
channels 0 to 3, and by external request signals.
For the detailed settings see section 8.3.4, Data Transfer Control Registers (DTCR).
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Section 8 DMA Controller
Start
(DTE = DTME = 1)
Transfer requested?
Start
(DTE = DTME = 1)
No
Transfer requested?
Yes
No
Yes
Get bus
Get bus
Read from MARA address
Read from MARA address
MARA = MARA + 1
MARA = MARA + 1
Write to MARB address
Write to MARB address
MARB = MARB + 1
ETCRAH = ETCRAH − 1
ETCRAH = ETCRAH − 1
No
ETCRAH = H'00
No
ETCRAH = H'00
Yes
Yes
Release bus
Release bus
ETCRAH = ETCRAL
MARB = MARB − ETCRAL
ETCRAH = ETCRAL
ETCRB = ETCRB − 1
ETCRB = ETCRB − 1
ETCRB = H'0000
No
ETCRB = H'0000
Yes
No
Yes
Clear DTE to 0 and end transfer
Clear DTE to 0 and end transfer
a. DTSZ = TMS = 0
SAID = DAID = 0
SAIDE = DAIDE = 1
b. DTSZ = TMS = 0
SAID = 0
SAIDE = 1
DAIDE = 0
Figure 8.11 Block Transfer Mode Flowcharts (Examples)
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Section 8 DMA Controller
Figure 8.12 shows a sample setup procedure for block transfer mode.
Block transfer mode
Set source address
1
Set destination address
2
Set block transfer count
3
Set block size
4
Set DTCRB (1)
5
Set DTCRA (1)
6
Read DTCRB
7
Set DTCRB (2)
8
Read DTCRA
9
Set DTCRA (2)
10
Set the source address in MARA.
Set the destination address in MARB.
Set the block transfer count in ETCRB.
Set the block size (number of bytes or words)
in both ETCRAH and ETCRAL.
5. Set the DTCRB bits as follows.
• Clear the DTME bit to 0.
• Set the DAID and DAIDE bits to select whether
MARB is incremented, decremented, or held fixed.
• Set or clear the TMS bit to make the block area
the source or destination.
• Select the DMAC activation source with bits
DTS2B to DTS0B.
6. Set the DTCRA bits as follows.
• Clear the DTE to 0.
• Select byte size or word size with the DTSZ bit.
• Set the SAID and SAIDE bits to select whether
MARA is incremented, decremented, or held fixed.
• Set or clear the DTIE bit to enable or disable the
CPU interrupt at the end of the transfer.
• Set bits DTS2A to DTS0A all to 1 to select
block transfer mode.
7. Read DTCRB with DTME cleared to 0.
8. Set the DTME bit to 1 in DTCRB.
9. Read DTCRA with DTE cleared to 0.
10. Set the DTE bit to 1 in DTCRA to enable
the transfer.
1.
2.
3.
4.
Block transfer mode
Note: Carry out settings 1 to 10 with the DEND interrupt masked in the CPU.
If an NMI interrupt occurs during the setup procedure, it may clear the DTME bit to 0, in
which case the transfer will not start.
Figure 8.12 Block Transfer Mode Setup Procedure (Example)
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Section 8 DMA Controller
8.4.7
DMAC Activation
The DMAC can be activated by an internal interrupt, external request, or auto-request. The
available activation sources differ depending on the transfer mode and channel as indicated in
table 8.11.
Table 8.11 DMAC Activation Sources
Short Address Mode
Channels
0A and 1A
Channels
0B and 1B
Normal
Block
IMIA0
Yes
Yes
No
Yes
IMIA1
Yes
Yes
No
Yes
IMIA2
Yes
Yes
No
Yes
IMIA3
Yes
Yes
No
Yes
TXI0
Yes
Yes
No
No
RXI0
Yes
Yes
No
No
Falling edge of
DREQ
No
Yes
Yes
Yes
Low input at
DREQ
No
Yes
Yes
No
No
No
Yes
No
Activation Source
Internal
interrupts
External
requests
Auto-request
Full Address Mode
Activation by Internal Interrupts
When an interrupt request is selected as a DMAC activation source and the DTE bit is set to 1, that
interrupt request is not sent to the CPU. It is not possible for an interrupt request to activate the
DMAC and simultaneously generate a CPU interrupt.
When the DMAC is activated by an interrupt request, the interrupt request flag is cleared
automatically. If the same interrupt is selected to activate two or more channels, the interrupt
request flag is cleared when the highest-priority channel is activated, but the transfer request is
held pending on the other channels in the DMAC, which are activated in their priority order.
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Section 8 DMA Controller
Activation by External Request
If an external request (DREQ pin) is selected as an activation source, the DREQ pin becomes an
input pin and the corresponding TEND pin becomes an output pin, regardless of the port data
direction register (DDR) settings. The DREQ input can be level-sensitive or edge-sensitive.
In short address mode and normal mode, an external request operates as follows. If edge sensing is
selected, one byte or word is transferred each time a high-to-low transition of the DREQ input is
detected. If the next edge is input before the transfer is completed, the next transfer may not be
executed. If level sensing is selected, the transfer continues while DREQ is low, until the transfer
is completed. The bus is released temporarily after each byte or word has been transferred,
however. If the DREQ input goes high during a transfer, the transfer is suspended after the current
byte or word has been transferred. When DREQ goes low, the request is held internally until one
byte or word has been transferred. The TEND signal goes low during the last write cycle.
In block transfer mode, an external request operates as follows. Only edge-sensitive transfer
requests are possible in block transfer mode. Each time a high-to-low transition of the DREQ
input is detected, a block of the specified size is transferred. The TEND signal goes low during the
last write cycle in each block.
Activation by Auto-Request
The transfer starts as soon as enabled by register setup, and continues until completed. Cycle-steal
mode or burst mode can be selected.
In cycle-steal mode the DMAC releases the bus temporarily after transferring each byte or word.
Normally, DMAC cycles alternate with CPU cycles.
In burst mode the DMAC keeps the bus until the transfer is completed, unless there is a higherpriority bus request. If there is a higher-priority bus request, the bus is released after the current
byte or word has been transferred.
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Section 8 DMA Controller
8.4.8
DMAC Bus Cycle
Figure 8.13 shows an example of the timing of the basic DMAC bus cycle. This example shows a
word-size transfer from a 16-bit two-state access area to an 8-bit three-state access area. When the
DMAC gets the bus from the CPU, after one dead cycle (Td), it reads from the source address and
writes to the destination address. During these read and write operations the bus is not released
even if there is another bus request. DMAC cycles comply with bus controller settings in the same
way as CPU cycles.
CPU cycle
T1
T2
T1
DMAC cycle (word transfer)
T2
Td
T1
T2
T1
T2
T3
T1
T2
CPU cycle
T3
T1
T2
T1
T2
φ
Source
address
Destination address
Address
bus
RD
HWR
LWR
Figure 8.13 DMA Transfer Bus Timing (Example)
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Section 8 DMA Controller
Figure 8.14 shows the timing when the DMAC is activated by low input at a DREQ pin. This
example shows a word-size transfer from a 16-bit two-state access area to another 16-bit two-state
access area. The DMAC continues the transfer while the DREQ pin is held low.
CPU cycle
T1
T2
T3
DMAC cycle
Td
T1
T2
T1
DMAC cycle
(last transfer cycle)
CPU cycle
T2
T1
T2
Td
T1
T2
T1
T2
CPU cycle
T1
φ
DREQ
Source Destination
address address
Source Destination
address address
Address
bus
RD
HWR , LWR
TEND
Figure 8.14 Bus Timing of DMA Transfer Requested by Low DREQ Input
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T2
Section 8 DMA Controller
Figure 8.15 shows an auto-requested burst-mode transfer. This example shows a transfer of three
words from a 16-bit two-state access area to another 16-bit two-state access area.
CPU cycle
T1
T2
DMAC cycle
Td
T1
T2
T1
T2
T1
T2
T1
CPU cycle
T2
T1
T2
T1
T2
T1
T2
φ
Source
address
Destination
address
Address
bus
RD
HWR ,
LWR
Figure 8.15 Bus Timing of Burst Mode DMA Transfer
When the DMAC is activated from a DREQ pin there is a minimum interval of four states from
when the transfer is requested until the DMAC starts operating. The DREQ pin is not sampled
during the time between the transfer request and the start of the transfer. In short address mode and
normal mode, the pin is next sampled at the end of the read cycle. In block transfer mode, the pin
is next sampled at the end of one block transfer.
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Section 8 DMA Controller
Figure 8.16 shows the timing when the DMAC is activated by the falling edge of DREQ in normal
mode.
CPU cycle
T2
T1
T2
T1
CPU
cycle
DMAC cycle
T2
Td
T1
T2
T1
T2
T1
T2
DMAC cycle
Td
T1
T2
φ
DREQ
Address
bus
RD
HWR, LWR
Minimum 4 states
Next sampling point
Figure 8.16 Timing of DMAC Activation by Falling Edge of DREQ in Normal Mode
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Section 8 DMA Controller
Figure 8.17 shows the timing when the DMAC is activated by level-sensitive low DREQ input in
normal mode.
CPU cycle
T2
T1
T2
T1
DMAC cycle
T2
Td
T1
T2
T1
CPU cycle
T2
T1
T2
T1
T2
T1
φ
DREQ
Address
bus
RD
HWR , LWR
Minimum 4 states
Next sampling point
Figure 8.17 Timing of DMAC Activation by Low DREQ Level in Normal Mode
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Section 8 DMA Controller
Figure 8.18 shows the timing when the DMAC is activated by the falling edge of DREQ in block
transfer mode.
End of 1 block transfer
DMAC cycle
T1
T2
T1
T2
T1
CPU cycle
T2
T1
T2
T1
T2
T1
T2
DMAC cycle
Td
T1
T2
φ
DREQ
Address
bus
RD
HWR , LWR
TEND
Next sampling
Minimum 4 states
Figure 8.18 Timing of DMAC Activation by Falling Edge of DREQ in Block Transfer Mode
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Section 8 DMA Controller
8.4.9
DMAC Multiple-Channel Operation
The DMAC channel priority order is: channel 0 > channel 1 and channel A > channel B.
Table 8.12 shows the complete priority order.
Table 8.12 Channel Priority Order
Short Address Mode
Full Address Mode
Priority
Channel 0A
Channel 0
High
Channel 0B
Channel 1A
Channel 1B
Channel 1
Low
If transfers are requested on two or more channels simultaneously, or if a transfer on one channel
is requested during a transfer on another channel, the DMAC operates as follows.
1. When a transfer is requested, the DMAC requests the bus right. When it gets the bus right, it
starts a transfer on the highest-priority channel at that time.
2. Once a transfer starts on one channel, requests to other channels are held pending until that
channel releases the bus.
3. After each transfer in short address mode, and each externally-requested or cycle-steal transfer
in normal mode, the DMAC releases the bus and returns to step 1. After releasing the bus, if
there is a transfer request for another channel, the DMAC requests the bus again.
4. After completion of a burst-mode transfer, or after transfer of one block in block transfer
mode, the DMAC releases the bus and returns to step 1. If there is a transfer request for a
higher-priority channel or a bus request from a higher-priority bus master, however, the
DMAC releases the bus after completing the transfer of the current byte or word. After
releasing the bus, if there is a transfer request for another channel, the DMAC requests the bus
again.
Figure 8.19 shows the timing when channel 0A is set up for I/O mode and channel 1 for burst
mode, and a transfer request for channel 0A is received while channel 1 is active.
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Section 8 DMA Controller
DMAC cycle
(channel 1)
T2
T1
CPU
cycle
T1
T2
DMAC cycle
(channel 0A)
Td
T1
T2
T1
CPU
cycle
T2
T1
T2
DMAC cycle
(channel 1)
Td
T1
T2
T1
T2
φ
Address
bus
RD
HWR ,
LWR
Figure 8.19 Timing of Multiple-Channel Operations
8.4.10
External Bus Requests, Refresh Controller, and DMAC
During a DMA transfer, if the bus right is requested by an external bus request signal (BREQ) or
by the refresh controller, the DMAC releases the bus after completing the transfer of the current
byte or word. If there is a transfer request at this point, the DMAC requests the bus right again.
Figure 8.20 shows an example of the timing of insertion of a refresh cycle during a burst transfer
on channel 0.
Refresh
cycle
DMAC cycle (channel 0)
T1
T2
T1
T2
T1
T2
T1
T2
T1
T2
DMAC cycle (channel 0)
Td
T1
T2
T1
φ
Address
bus
RD
HWR , LWR
Figure 8.20 Bus Timing of Refresh Controller and DMAC
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T2
T1
T2
Section 8 DMA Controller
8.4.11
NMI Interrupts and DMAC
NMI interrupts do not affect DMAC operations in short address mode.
If an NMI interrupt occurs during a transfer in full address mode, the DMAC suspends operations.
In full address mode, a channel is enabled when its DTE and DTME bits are both set to 1. NMI
input clears the DTME bit to 0. After transferring the current byte or word, the DMAC releases the
bus to the CPU. In normal mode, the suspended transfer resumes when the CPU sets the DTME
bit to 1 again. Check that the DTE bit is set to 1 and the DTME bit is cleared to 0 before setting
the DTME bit to 1.
Figure 8.21 shows the procedure for resuming a DMA transfer in normal mode on channel 0 after
the transfer was halted by NMI input.
Resuming DMA transfer
in normal mode
1. Check that DTE = 1 and DTME = 0.
2. Read DTCRB while DTME = 0,
then write 1 in the DTME bit.
1
DTE = 1
DTME = 0
No
Yes
Set DTME to 1
DMA transfer continues
2
End
Figure 8.21 Procedure for Resuming a DMA Transfer Halted by NMI (Example)
For information about NMI interrupts in block transfer mode, see section 8.6.6, NMI Interrupts
and Block Transfer Mode.
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Section 8 DMA Controller
8.4.12
Aborting a DMA Transfer
When the DTE bit in an active channel is cleared to 0, the DMAC halts after transferring the
current byte or word. The DMAC starts again when the DTE bit is set to 1. In full address mode,
the DTME bit can be used for the same purpose. Figure 8.22 shows the procedure for aborting a
DMA transfer by software.
DMA transfer abort
Set DTCR
1. Clear the DTE bit to 0 in DTCR.
To avoid generating an interrupt when
aborting a DMA transfer, clear the DTIE
bit to 0 simultaneously.
1
DMA transfer aborted
Figure 8.22 Procedure for Aborting a DMA Transfer
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Section 8 DMA Controller
8.4.13
Exiting Full Address Mode
Figure 8.23 shows the procedure for exiting full address mode and initializing the pair of channels.
To set the channels up in another mode after exiting full address mode, follow the setup procedure
for the relevant mode.
Exiting full address mode
Halt the channel
1
Initialize DTCRB
2
Initialize DTCRA
3
1. Clear the DTE bit to 0 in DTCRA, or wait
for the transfer to end and the DTE bit
to be cleared to 0.
2. Clear all DTCRB bits to 0.
3. Clear all DTCRA bits to 0.
Initialized and halted
Figure 8.23 Procedure for Exiting Full Address Mode (Example)
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Section 8 DMA Controller
8.4.14
DMAC States in Reset State, Standby Modes, and Sleep Mode
When the chip is reset or enters hardware or software standby mode, the DMAC is initialized and
halts. DMAC operations continue in sleep mode. Figure 8.24 shows the timing of a cycle-steal
transfer in sleep mode.
Sleep mode
CPU cycle
T2
DMAC cycle
Td
T1
T2
T1
DMAC cycle
T2
Td
T1
T2
T1
T2
φ
Address bus
RD
HWR , LWR
Figure 8.24 Timing of Cycle-Steal Transfer in Sleep Mode
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Td
Section 8 DMA Controller
8.5
Interrupts
The DMAC generates only DMA-end interrupts. Table 8.13 lists the interrupts and their priority.
Table 8.13 DMAC Interrupts
Description
Interrupt
Short Address Mode
Full Address Mode
Interrupt
Priority
DEND0A
End of transfer on channel 0A
End of transfer on channel 0
High
DEND0B
End of transfer on channel 0B
—
DEND1A
End of transfer on channel 1A
End of transfer on channel 1
DEND1B
End of transfer on channel 1B
—
Low
Each interrupt is enabled or disabled by the DTIE bit in the corresponding data transfer control
register (DTCR). Separate interrupt signals are sent to the interrupt controller.
The interrupt priority order among channels is channel 0 > channel 1 and channel A > channel B.
Figure 8.25 shows the DMA-end interrupt logic. An interrupt is requested whenever DTE = 0 and
DTIE = 1.
DTE
DMA-end interrupt
DTIE
Figure 8.25 DMA-End Interrupt Logic
The DMA-end interrupt for the B channels (DENDB) is unavailable in full address mode. The
DTME bit does not affect interrupt operations.
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Section 8 DMA Controller
8.6
Usage Notes
8.6.1
Note on Word Data Transfer
Word data cannot be accessed starting at an odd address. When word-size transfer is selected, set
even values in the memory and I/O address registers (MAR and IOAR).
8.6.2
DMAC Self-Access
The DMAC itself cannot be accessed during a DMAC cycle. DMAC registers cannot be specified
as source or destination addresses.
8.6.3
Longword Access to Memory Address Registers
A memory address register can be accessed as longword data at the MARR address.
Example:
MOV.L
#LBL, ER0
MOV.L
ER0, @MARR
Four byte accesses are performed. Note that the CPU may release the bus between the second byte
(MARE) and third byte (MARH).
Memory address registers should be written and read only when the DMAC is halted.
8.6.4
Note on Full Address Mode Setup
Full address mode is controlled by two registers: DTCRA and DTCRB. Care must be taken to
prevent the B channel from operating in short address mode during the register setup. The enable
bits (DTE and DTME) should not be set to 1 until the end of the setup procedure.
8.6.5
Note on Activating DMAC by Internal Interrupts
When using an internal interrupt to activate the DMAC, make sure that the interrupt selected as
the activating source does not occur during the interval after it has been selected but before the
DMAC has been enabled. The on-chip supporting module that will generate the interrupt should
not be activated until the DMAC has been enabled. If the DMAC must be enabled while the onchip supporting module is active, follow the procedure in figure 8.26.
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Section 8 DMA Controller
Enabling of DMAC
Yes
Interrupt handling by CPU
Selected interrupt
requested?
1
No
Clear selected interrupt’s
enable bit to 0
2
Enable DMAC
3
Set selected interrupt’s
enable bit to 1
4
1. While the DTE bit is cleared to 0,
interrupt requests are sent to the
CPU.
2. Clear the interrupt enable bit to 0
in the interrupt-generating on-chip
supporting module.
3. Enable the DMAC.
4. Enable the DMAC-activating
interrupt.
DMAC operates
Figure 8.26 Procedure for Enabling DMAC while On-Chip Supporting Module Is
Operating (Example)
If the DTE bit is set to 1 but the DTME bit is cleared to 0, the DMAC is halted and the selected
activating source cannot generate a CPU interrupt. If the DMAC is halted by an NMI interrupt, for
example, the selected activating source cannot generate CPU interrupts. To terminate DMAC
operations in this state, clear the DTE bit to 0 to allow CPU interrupts to be requested. To continue
DMAC operations, carry out steps 2 and 4 in figure 8.26 before and after setting the DTME bit to
1.
When an ITU interrupt activates the DMAC, make sure the next interrupt does not occur before
the DMA transfer ends. If one ITU interrupt activates two or more channels, make sure the next
interrupt does not occur before the DMA transfers end on all the activated channels. If the next
interrupt occurs before a transfer ends, the channel or channels for which that interrupt was
selected may fail to accept further activation requests.
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Section 8 DMA Controller
8.6.6
NMI Interrupts and Block Transfer Mode
If an NMI interrupt occurs in block transfer mode, the DMAC operates as follows.
1. When the NMI interrupt occurs, the DMAC finishes transferring the current byte or word, then
clears the DTME bit to 0 and halts. The halt may occur in the middle of a block.
It is possible to find whether a transfer was halted in the middle of a block by checking the
block size counter. If the block size counter does not have its initial value, the transfer was
halted in the middle of a block.
2. If the transfer is halted in the middle of a block, the activating interrupt flag is cleared to 0. The
activation request is not held pending.
3. While the DTE bit is set to 1 and the DTME bit is cleared to 0, the DMAC is halted and does
not accept activating interrupt requests. If an activating interrupt occurs in this state, the
DMAC does not operate and does not hold the transfer request pending internally. Neither is a
CPU interrupt requested.
For this reason, before setting the DTME bit to 1, first clear the enable bit of the activating
interrupt to 0. Then, after setting the DTME bit to 1, set the interrupt enable bit to 1 again. See
section 8.6.5, Note on Activating DMAC by Internal Interrupts.
4. When the DTME bit is set to 1, the DMAC waits for the next transfer request. If it was halted
in the middle of a block transfer, the rest of the block is transferred when the next transfer
request occurs. Otherwise, the next block is transferred when the next transfer request occurs.
8.6.7
Memory and I/O Address Register Values
Table 8.14 indicates the address ranges that can be specified in the memory and I/O address
registers (MAR and IOAR).
Table 8.14 Address Ranges Specifiable in MAR and IOAR
1-Mbyte Mode
16-Mbyte Mode
MAR
H'00000 to H'FFFFF
(0 to 1048575)
H'000000 to H'FFFFFF
(0 to 16777215)
IOAR
H'FFF00 to H'FFFFF
(1048320 to 1048575)
H'FFFF00 to H'FFFFFF
(16776960 to 16777215)
MAR bits 23 to 20 are ignored in 1-Mbyte mode.
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Section 8 DMA Controller
8.6.8
Bus Cycle when Transfer Is Aborted
When a transfer is aborted by clearing the DTE bit or suspended by an NMI that clears the DTME
bit, if this halts a channel for which the DMAC has a transfer request pending internally, a dead
cycle may occur. This dead cycle does not update the halted channel’s address register or counter
value. Figure 8.27 shows an example in which an auto-requested transfer in cycle-steal mode on
channel 0 is aborted by clearing the DTE bit in channel 0.
CPU cycle
T1
T2
DMAC cycle
Td
T1
T2
T1
DMAC
cycle
CPU cycle
T2
T1
T2
T3
Td
Td
CPU cycle
T1
T2
φ
Address bus
RD
HWR, LWR
DTE bit is
cleared
Figure 8.27 Bus Timing at Abort of DMA Transfer in Cycle-Steal Mode
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Section 8 DMA Controller
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Section 9 I/O Ports
Section 9 I/O Ports
9.1
Overview
The H8/3048B Group has 10 input/output ports (ports 1, 2, 3, 4, 5, 6, 8, 9, A, and B) and one input
port (port 7). Table 9.1 summarizes the port functions. The pins in each port are multiplexed as
shown in table 9.1.
Each port has a data direction register (DDR) for selecting input or output, and a data register
(DR) for storing output data. In addition to these registers, ports 2, 4, and 5 have an input pull-up
MOS control register (PCR) for switching input pull-up MOS transistors on and off.
Ports 1 to 6 and port 8 can drive one TTL load and a 90-pF capacitive load. Ports 9, A, and B can
drive one TTL load and a 30-pF capacitive load. Ports 1 to 6 and 8 to B can drive a darlington
pair. Ports 1, 2, 5, and B can drive LEDs (with 10-mA current sink). Pins P82 to P80, PA7 to PA0,
and PB3 to PB0 have Schmitt-trigger input circuits.
For block diagrams of the ports see appendix C, I/O Port Block Diagrams.
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Section 9 I/O Ports
Table 9.1
Port
Port Functions
Description
Pins
Port 1 • 8-bit I/O port P17 to P10/
A7 to A0
• Can drive
LEDs
Mode 1
Mode 2
Mode 3
Mode 4
Address output pins (A7 to A0)
Mode 5
Mode 6
Mode 7
Address output (A7 Generic
to A0) and generic input/
output
input
DDR = 0: generic
input
DDR = 1: address
output
Port 2 • 8-bit I/O port P27 to P20/
• Input pull-up A15 to A8
Address output pins (A15 to A8)
MOS
Address output (A15 Generic
to A8) and generic input/
input
output
DDR = 0: generic
input
• Can drive
LEDs
DDR = 1: address
output
Port 3 • 8-bit I/O port P37 to P30/
D15 to D8
Data input/output (D15 to D8)
Generic
input/
output
Port 4 • 8-bit I/O port P47 to P40/
• Input pull-up D7 to D0
Data input/output (D7 to D0) and 8-bit generic input/output
Generic
input/
output
MOS
8-bit bus mode: generic input/output
16-bit bus mode: data input/output
Port 5 • 4-bit I/O port P53 to P50/
• Input pull-up A19 to A16
Address output (A19 to A16)
MOS
Address output (A19 Generic
to A16) and 4-bit
input/
generic input
output
DDR = 0: generic
input
• Can drive
LEDs
DDR = 1: address
output
Port 6 • 7-bit I/O port P66/LWR,
P65/HWR,
P64/RD,
P63/AS
P62/BACK,
P61/BREQ,
P60/WAIT
Port 7 • 8-bit I/O port P77/AN7/DA1,
P76/AN6/DA0
P75 to P70/
AN5 to AN0
Bus control signal output (LWR, HWR, RD, AS)
Generic
input/
output
Bus control signal input/output (BACK, BREQ, WAIT) and 3bit generic input/output
Analog input (AN7, AN6) to A/D converter, analog output (DA1, DA0) from
D/A converter, and generic input
Analog input (AN5 to AN0) to A/D converter, and generic input
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Section 9 I/O Ports
Port
Description
Pins
Port 8 • 5-bit I/O port P84/CS0
• P82 to P80
have
Schmitt
inputs
Mode 1
Mode 2
Mode 3
Mode 4
Mode 5
Mode 6
DDR = 1 (after reset): CS0 output
P83/CS1/IRQ3,
P82/CS2/IRQ2,
P81/CS3/IRQ1
Mode 7
Generic
input/
output
DDR = 0: generic input
IRQ3 to IRQ1 input, CS1 to CS3 output, and generic input
DDR = 0 (after reset): generic input
DDR = 1: CS1 to CS3 output
P80/RFSH/IRQ0 IRQ0 input, RFSH output, and generic input/output
IRQ3 to
IRQ0
input and
generic
input/
output
Port 9 • 6-bit I/O port P95/SCK1/IRQ5, Input and output (SCK1, SCK0, RxD1, RxD0, TxD1, TxD0) for serial
P94/SCK0/IRQ4, communication interfaces 1 and 0 (SCI1/0), IRQ5 and IRQ4 input, and 6P93/RxD1,
bit generic input/output
P92/RxD0,
P91/TxD1,
P90/TxD0
Port A • 8-bit I/O port PA7/TP7/
TIOCB2/A20
• Schmitt
inputs
PA6/TP6/
TIOCA2/A21/
CS4
PA5/TP5/
TIOCB1/A22/
CS5
PA4/TP4/
TIOCA1/A23/
CS6
Output (TP7) from Address output
(A20)
programmable
timing pattern
controller (TPC),
input or output
(TIOCB2) for 16-bit
integrated timer unit
(ITU), and generic
input/output
TPC output (TP6 to
TP4), ITU input and
output (TIOCA2,
TIOCB1, TIOCA1),
CS4 to CS6 output,
and generic input/
output
TPC output (TP6 to
TP4), ITU input and
output (TIOCA2,
TIOCB1, TIOCA1),
address output (A23
to A21), CS4 to CS6
output, and generic
input/output
Address TPC
TPC
output
output
output
(A20)
(TP7),
(TP7),
ITU input
ITU input
or output
or output
(TIOCB2),
(TIOCB2),
and
and
generic
generic
input/
input/
output
output
TPC
output
(TP6 to
TP4), ITU
input and
output
(TIOCA2,
TIOCB1,
TIOCA1),
CS4 to
CS6
output,
and
generic
input/
output
TPC
output
(TP6 to
TP4), ITU
input and
output
(TIOCA2,
TIOCB1,
TIOCA1),
address
output
(A23 to
A21), CS4
to CS6
output,
and
generic
input/out
put
TPC
output
(TP6 to
TP4), ITU
input and
output
(TIOCA2,
TIOCB1,
TIOCA1),
and
generic
input/
output
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Section 9 I/O Ports
Port
Description
Pins
Mode 1
Mode 2
Mode 3
Mode 4
Mode 5
Mode 6
Mode 7
Port A • 8-bit I/O port PA3/TP3/
TPC output (TP3 to TP0), output (TEND1, TEND0) from DMA controller
TIOCB0/
(DMAC), ITU input and output (TCLKD, TCLKC, TCLKB, TCLKA,
• Schmitt
TIOCB0, TIOCA0), and generic input/output
TCLKD,
inputs
PA2/TP2/
TIOCA0/
TCLKC,
PA1/TP1/
TEND1/TCLKB,
PA0/TP0/
TEND0/TCLKA
Port B • 8-bit I/O port PB7/TP15/
TPC output (TP15), DMAC input (DREQ1), trigger input (ADTRG) to A/D
DREQ1/ADTRG converter, and generic input/output
• Can drive
LEDs
PB6/TP14/
TPC output (TP14), DMAC input (DREQ0), CS7 output, and
TPC
DREQ0,/CS7
generic input/output
output
• PB3 to PB0
(TP14),
have
DMAC
Schmitt
input
inputs
(DREQ0),
and
generic
input/
output
PB5/TP13/
TOCXB4,
PB4/TP12/
TOCXA4,
PB3/TP11/
TIOCB4,
PB2/TP10/
TIOCA4,
PB1/TP9/
TIOCB3,
PB0/TP8/
TIOCA3
TPC output (TP13 to TP8), ITU input and output (TOCXB4, TOCXA4,
TIOCB4, TIOCA4, TIOCB3, TIOCA3), and generic input/output
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Section 9 I/O Ports
9.2
Port 1
9.2.1
Overview
Port 1 is an 8-bit input/output port with the pin configuration shown in figure 9.1. The pin
functions differ between the expanded modes with on-chip ROM disabled, expanded modes with
on-chip ROM enabled, and single-chip mode. In modes 1 to 4 (expanded modes with on-chip
ROM disabled), they are address bus output pins (A7 to A0).
In modes 5 and 6 (expanded modes with on-chip ROM enabled), settings in the port 1 data
direction register (P1DDR) can designate pins for address bus output (A7 to A0) or generic input.
In mode 7 (single-chip mode), port 1 is a generic input/output port.
When DRAM is connected to area 3, A7 to A0 output row and column addresses in read and write
cycles. For details see section 7, Refresh Controller.
Pins in port 1 can drive one TTL load and a 90-pF capacitive load. They can also drive a
darlington transistor pair.
Port 1 pins
Port 1
Modes 1 to 4
Modes 5 and 6
Mode 7
P17 /A 7
A 7 (output)
P17 (input)/A 7 (output)
P17 (input/output)
P16 /A 6
A 6 (output)
P16 (input)/A 6 (output)
P16 (input/output)
P15 /A 5
A 5 (output)
P15 (input)/A 5 (output)
P15 (input/output)
P14 /A 4
A 4 (output)
P14 (input)/A 4 (output)
P14 (input/output)
P13 /A 3
A 3 (output)
P13 (input)/A 3 (output)
P13 (input/output)
P12 /A 2
A 2 (output)
P12 (input)/A 2 (output)
P12 (input/output)
P11 /A 1
A 1 (output)
P11 (input)/A 1 (output)
P11 (input/output)
P10 /A 0
A 0 (output)
P10 (input)/A 0 (output)
P10 (input/output)
Figure 9.1 Port 1 Pin Configuration
Rev. 3.00 Sep 27, 2006 page 263 of 872
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Section 9 I/O Ports
9.2.2
Register Descriptions
Table 9.2 summarizes the registers of port 1.
Table 9.2
Port 1 Registers
Initial Value
Address*
Name
Abbreviation
R/W
Modes 1 to 4
Modes 5 to 7
H'FFC0
Port 1 data direction
register
P1DDR
W
H'FF
H'00
Port 1 data register
P1DR
R/W
H'00
H'00
H'FFC2
Note:
*
Lower 16 bits of the address.
Port 1 Data Direction Register (P1DDR)
P1DDR is an 8-bit write-only register that can select input or output for each pin in port 1.
Bit
7
6
5
4
3
2
1
0
P1 7 DDR P1 6 DDR P1 5 DDR P1 4 DDR P1 3 DDR P1 2 DDR P1 1 DDR P1 0 DDR
Modes Initial value
1 to 4 Read/Write
Modes Initial value
5 to 7 Read/Write
1
1
1
1
1
1
1
1








0
0
0
0
0
0
0
0
W
W
W
W
W
W
W
W
Port 1 data direction 7 to 0
These bits select input or
output for port 1 pins
Modes 1 to 4 (Expanded Modes with On-Chip ROM Disabled): P1DDR values are fixed at 1
and cannot be modified. Port 1 functions as an address bus.
Modes 5 and 6 (Expanded Modes with On-Chip ROM Enabled): A pin in port 1 becomes an
address output pin if the corresponding P1DDR bit is set to 1, and a generic input pin if this bit is
cleared to 0.
Mode 7 (Single-Chip Mode): Port 1 functions as an input/output port. A pin in port 1 becomes an
output pin if the corresponding P1DDR bit is set to 1, and an input pin if this bit is cleared to 0.
In modes 5 to 7, P1DDR is a write-only register. Its value cannot be read. All bits return 1 when
read.
Rev. 3.00 Sep 27, 2006 page 264 of 872
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Section 9 I/O Ports
P1DDR is initialized to H'FF in modes 1 to 4 and H'00 in modes 5 to 7 by a reset and in hardware
standby mode. In software standby mode it retains its previous setting. If a P1DDR bit is set to 1,
the corresponding pin maintains its output state in software standby mode.
Port 1 Data Register (P1DR)
P1DR is an 8-bit readable/writable register that stores output data for pins P17 to P10. While port 1
acts as an output port, the value of this register is output. When a bit in P1DDR is set to 1, if port 1
is read the value of the corresponding P1DR bit is returned. When a bit in P1DDR is cleared to 0,
if port 1 is read the corresponding pin level is read.
Bit
7
6
5
4
3
2
1
0
P17
P16
P15
P14
P13
P12
P11
P10
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Port 1 data 7 to 0
These bits store data for port 1 pins
P1DR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it
retains its previous setting.
Rev. 3.00 Sep 27, 2006 page 265 of 872
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Section 9 I/O Ports
9.3
Port 2
9.3.1
Overview
Port 2 is an 8-bit input/output port with the pin configuration shown in figure 9.2. The pin
functions differ according to the operating mode.
In modes 1 to 4 (expanded modes with on-chip ROM disabled), port 2 consists of address bus
output pins (A15 to A8). In modes 5 and 6 (expanded modes with on-chip ROM enabled), settings
in the port 2 data direction register (P2DDR) can designate pins for address bus output (A15 to A8)
or generic input. In mode 7 (single-chip mode), port 2 is a generic input/output port.
When DRAM is connected to area 3, A9 and A8 output row and column addresses in read and write
cycles. For details see section 7, Refresh Controller.
Port 2 has software-programmable built-in pull-up MOS. Pins in port 2 can drive one TTL load
and a 90-pF capacitive load. They can also drive a darlington transistor pair.
Port 2
Port 2 pins
Modes 1 to 4
Modes 5 and 6
Mode 7
P27 /A 15
A15 (output)
P27 (input)/A15 (output)
P27 (input/output)
P26 /A 14
A14 (output)
P26 (input)/A14 (output)
P26 (input/output)
P25 /A 13
A13 (output)
P25 (input)/A13 (output)
P25 (input/output)
P24 /A 12
A12 (output)
P24 (input)/A12 (output)
P24 (input/output)
P23 /A 11
A11 (output)
P23 (input)/A11 (output)
P23 (input/output)
P22 /A 10
A10 (output)
P22 (input)/A10 (output)
P22 (input/output)
P21 /A 9
A9 (output)
P21 (input)/A9 (output)
P21 (input/output)
P20 /A 8
A8 (output)
P20 (input)/A8 (output)
P20 (input/output)
Figure 9.2 Port 2 Pin Configuration
Rev. 3.00 Sep 27, 2006 page 266 of 872
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Section 9 I/O Ports
9.3.2
Register Descriptions
Table 9.3 summarizes the registers of port 2.
Table 9.3
Port 2 Registers
Initial Value
Address*
Name
Abbreviation
R/W
Modes 1 to 4
Modes 5 to 7
H'FFC1
Port 2 data direction
register
P2DDR
W
H'FF
H'00
H'FFC3
Port 2 data register
P2DR
R/W
H'00
H'00
H'FFD8
Port 2 input pull-up MOS
control register
P2PCR
R/W
H'00
H'00
Note:
*
Lower 16 bits of the address.
Port 2 Data Direction Register (P2DDR)
P2DDR is an 8-bit write-only register that can select input or output for each pin in port 2.
Bit
7
6
5
4
3
2
1
0
P2 7 DDR P2 6 DDR P2 5 DDR P2 4 DDR P2 3 DDR P2 2 DDR P2 1 DDR P2 0 DDR
Modes Initial value
1 to 4 Read/Write
Modes Initial value
5 to 7 Read/Write
1
1
1
1
1
1
1
1








0
0
0
0
0
0
0
0
W
W
W
W
W
W
W
W
Port 2 data direction 7 to 0
These bits select input or
output for port 2 pins
Modes 1 to 4 (Expanded Modes with On-Chip ROM Disabled): P2DDR values are fixed at 1
and cannot be modified. Port 2 functions as an address bus.
Modes 5 and 6 (Expanded Modes with On-Chip ROM Enabled): Following a reset, port 2 is
an input port. A pin in port 2 becomes an address output pin if the corresponding P2DDR bit is set
to 1, and a generic input port if this bit is cleared to 0.
Mode 7 (Single-Chip Mode): Port 2 functions as an input/output port. A pin in port 2 becomes an
output port if the corresponding P2DDR bit is set to 1, and an input port if this bit is cleared to 0.
In modes 1 to 4, P2DDR always returns 1 when read. No value can be written to.
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Section 9 I/O Ports
In modes 5 to 7, P2DDR is a write-only register. Its value cannot be read. All bits return 1 when
read.
P2DDR is initialized to H'FF in modes 1 to 4 and H'00 in modes 5 to 7 by a reset and in hardware
standby mode. In software standby mode it retains its previous setting. If a P2DDR bit is set to 1,
the corresponding pin maintains its output state in software standby mode.
Port 2 Data Register (P2DR)
P2DR is an 8-bit readable/writable register that stores output data for pins P27 to P20. While port 2
acts as an output port, the value of this register is output. When a bit in P2DDR is set to 1, if port 2
is read the value of the corresponding P2DR bit is returned. When a bit in P2DDR is cleared to 0,
if port 2 is read the corresponding pin level is read.
Bit
7
6
5
4
3
2
1
0
P2 7
P2 6
P2 5
P2 4
P2 3
P2 2
P2 1
P2 0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Port 2 data 7 to 0
These bits store data for port 2 pins
P2DR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it
retains its previous setting.
Port 2 Input Pull-Up MOS Control Register (P2PCR)
P2PCR is an 8-bit readable/writable register that controls the MOS input pull-up transistors in port
2.
Bit
7
6
5
4
3
2
1
0
P2 7 PCR P2 6 PCR P2 5 PCR P2 4 PCR P2 3 PCR P2 2 PCR P2 1 PCR P2 0 PCR
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Port 2 input pull-up MOS control 7 to 0
These bits control input pull-up
transistors built into port 2
Rev. 3.00 Sep 27, 2006 page 268 of 872
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Section 9 I/O Ports
In modes 5 to 7, when a P2DDR bit is cleared to 0 (selecting generic input), if the corresponding
bit from P27PCR to P20PCR is set to 1, the input pull-up MOS is turned on.
P2PCR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it
retains its previous setting.
Table 9.4 summarizes the states of the input pull-up transistors.
Table 9.4
Input Pull-Up MOS States (Port 2)
Mode
Reset
Hardware
Standby Mode
Software
Standby Mode
Other Modes
1
Off
Off
Off
Off
Off
Off
On/off
On/off
2
3
4
5
6
7
Legend:
Off:
The input pull-up MOS is always off.
On/off: The input pull-up MOS is on if P2PCR = 1 and P2DDR = 0. Otherwise, it is off.
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Section 9 I/O Ports
9.4
Port 3
9.4.1
Overview
Port 3 is an 8-bit input/output port with the pin configuration shown in figure 9.3. Port 3 is a data
bus in modes 1 to 6 (expanded modes) and a generic input/output port in mode 7 (single-chip
mode).
Pins in port 3 can drive one TTL load and a 90-pF capacitive load. They can also drive a
darlington transistor pair.
Port 3
Port 3 pins
Modes 1 to 6
Mode 7
P37 /D15
D15 (input/output)
P37 (input/output)
P36 /D14
D14 (input/output)
P36 (input/output)
P35 /D13
D13 (input/output)
P35 (input/output)
P34 /D12
D12 (input/output)
P34 (input/output)
P33 /D11
D11 (input/output)
P33 (input/output)
P32 /D10
D10 (input/output)
P32 (input/output)
P31 /D9
D9 (input/output)
P31 (input/output)
P30 /D8
D8 (input/output)
P30 (input/output)
Figure 9.3 Port 3 Pin Configuration
9.4.2
Register Descriptions
Table 9.5 summarizes the registers of port 3.
Table 9.5
Port 3 Registers
Address*
Name
Abbreviation
R/W
Initial Value
H'FFC4
Port 3 data direction register
P3DDR
W
H'00
Port 3 data register
P3DR
R/W
H'00
H'FFC6
Note:
*
Lower 16 bits of the address.
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Section 9 I/O Ports
Port 3 Data Direction Register (P3DDR)
P3DDR is an 8-bit write-only register that can select input or output for each pin in port 3.
Bit
7
6
5
4
3
2
1
0
P3 7 DDR P3 6 DDR P3 5 DDR P3 4 DDR P3 3 DDR P3 2 DDR P3 1 DDR P3 0 DDR
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port 3 data direction 7 to 0
These bits select input or output for port 3 pins
Modes 1 to 6 (Expanded Modes): Port 3 functions as a data bus. P3DDR is ignored.
Mode 7 (Single-Chip Mode): Port 3 functions as an input/output port. A pin in port 3 becomes an
output port if the corresponding P3DDR bit is set to 1, and an input port if this bit is cleared to 0.
P3DDR is a write-only register. Its value cannot be read. All bits return 1 when read.
P3DDR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode
it retains its previous setting. If a P3DDR bit is set to 1, the corresponding pin maintains its output
state in software standby mode.
Port 3 Data Register (P3DR)
P3DR is an 8-bit readable/writable register that stores output data for pins P37 to P30. While port 3
acts as an output port, the value of this register is output. When a bit in P3DDR is set to 1, if port 3
is read the value of the corresponding P3DR bit is returned. When a bit in P3DDR is cleared to 0,
if port 3 is read the corresponding pin level is read.
Bit
7
6
5
4
3
2
1
0
P3 7
P3 6
P3 5
P3 4
P3 3
P3 2
P3 1
P3 0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Port 3 data 7 to 0
These bits store data for port 3 pins
P3DR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it
retains its previous setting.
Rev. 3.00 Sep 27, 2006 page 271 of 872
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Section 9 I/O Ports
9.5
Port 4
9.5.1
Overview
Port 4 is an 8-bit input/output port with the pin configuration shown in figure 9.4. The pin
functions differ according to the operating mode.
In modes 1 to 6 (expanded modes), when the bus width control register (ABWCR) designates
areas 0 to 7 all as 8-bit-access areas, the chip operates in 8-bit bus mode and port 4 is a generic
input/output port. When at least one of areas 0 to 7 is designated as a 16-bit-access area, the chip
operates in 16-bit bus mode and port 4 becomes part of the data bus. In mode 7 (single-chip
mode), port 4 is a generic input/output port.
Port 4 has software-programmable built-in pull-up MOS.
Pins in port 4 can drive one TTL load and a 90-pF capacitive load. They can also drive a
darlington transistor pair.
Port 4
Port 4 pins
Modes 1 to 6
Mode 7
P47 /D7
P47 (input/output)/D7 (input/output)
P47 (input/output)
P46 /D6
P46 (input/output)/D6 (input/output)
P46 (input/output)
P45 /D5
P45 (input/output)/D5 (input/output)
P45 (input/output)
P44 /D4
P44 (input/output)/D4 (input/output)
P44 (input/output)
P43 /D3
P43 (input/output)/D3 (input/output)
P43 (input/output)
P42 /D2
P42 (input/output)/D2 (input/output)
P42 (input/output)
P41 /D1
P41 (input/output)/D1 (input/output)
P41 (input/output)
P40 /D0
P40 (input/output)/D0 (input/output)
P40 (input/output)
Figure 9.4 Port 4 Pin Configuration
Rev. 3.00 Sep 27, 2006 page 272 of 872
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Section 9 I/O Ports
9.5.2
Register Descriptions
Table 9.6 summarizes the registers of port 4.
Table 9.6
Port 4 Registers
Address*
Name
Abbreviation
R/W
Initial Value
H'FFC5
Port 4 data direction register
P4DDR
W
H'00
H'FFC7
Port 4 data register
P4DR
R/W
H'00
H'FFDA
Port 4 input pull-up MOS control
register
P4PCR
R/W
H'00
Note:
*
Lower 16 bits of the address.
Port 4 Data Direction Register (P4DDR)
P4DDR is an 8-bit write-only register that can select input or output for each pin in port 4.
Bit
7
6
5
4
3
2
1
0
P4 7 DDR P4 6 DDR P4 5 DDR P4 4 DDR P4 3 DDR P4 2 DDR P4 1 DDR P4 0 DDR
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port 4 data direction 7 to 0
These bits select input or output for port 4 pins
Modes 1 to 6 (Expanded Modes): When all areas are designated as 8-bit-access areas using the
bus width control register (ABWCR) of the bus controller, selecting 8-bit bus mode, port 4
functions as a generic input/output port. A pin in port 4 becomes an output port if the
corresponding P4DDR bit is set to 1, and an input port if this bit is cleared to 0.
When at least one area is designated as a 16-bit-access area, selecting 16-bit bus mode, port 4
functions as part of the data bus regardless of the value in P4DDR.
Mode 7 (Single-Chip Mode): Port 4 functions as an input/output port. A pin in port 4 becomes an
output port if the corresponding P4DDR bit is set to 1, and an input port if this bit is cleared to 0.
P4DDR is a write-only register. Its value cannot be read. All bits return 1 when read.
P4DDR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode
it retains its previous setting.
Rev. 3.00 Sep 27, 2006 page 273 of 872
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Section 9 I/O Ports
ABWCR and P4DDR are not initialized in software standby mode. When port 4 functions as a
generic input/output port, if a P4DDR bit is set to 1, the corresponding pin maintains its output
state in software standby mode.
Port 4 Data Register (P4DR)
P4DR is an 8-bit readable/writable register that stores output data for pins P47 to P40. While port 4
acts as an output port, the value of this register is output. When a bit in P4DDR is set to 1, if port 4
is read the value of the corresponding P4DR bit is returned. When a bit in P4DDR is cleared to 0,
if port 4 is read the corresponding pin level is read.
Bit
7
6
5
4
3
2
1
0
P4 7
P4 6
P4 5
P4 4
P4 3
P4 2
P4 1
P4 0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Port 4 data 7 to 0
These bits store data for port 4 pins
P4DR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it
retains its previous setting.
Port 4 Input Pull-Up MOS Control Register (P4PCR)
P4PCR is an 8-bit readable/writable register that controls the MOS input pull-up transistors in port
4.
Bit
7
6
5
4
3
2
1
0
P4 7 PCR P4 6 PCR P4 5 PCR P4 4 PCR P4 3 PCR P4 2 PCR P4 1 PCR P4 0 PCR
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Port 4 input pull-up MOS control 7 to 0
These bits control input pull-up MOS transistors built into port 4
In mode 7 (single-chip mode), and in 8-bit bus mode in modes 1 to 6 (expanded modes), when a
P4DDR bit is cleared to 0 (selecting generic input), if the corresponding P4PCR bit is set to 1, the
input pull-up MOS transistor is turned on.
Rev. 3.00 Sep 27, 2006 page 274 of 872
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Section 9 I/O Ports
P4PCR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it
retains its previous setting.
Table 9.7 summarizes the states of the input pull-ups MOS in the 8-bit and 16-bit bus modes.
Table 9.7
Input Pull-Up MOS Transistor States (Port 4)
Mode
1 to 6
8-bit bus mode
16-bit bus mode
7
Reset
Hardware
Standby Mode
Software
Standby Mode
Other Modes
Off
Off
On/off
On/off
Off
Off
On/off
On/off
Legend:
Off:
The input pull-up MOS transistor is always off.
On/off: The input pull-up MOS transistor is on if P4PCR = 1 and P4DDR = 0. Otherwise, it is off.
Rev. 3.00 Sep 27, 2006 page 275 of 872
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Section 9 I/O Ports
9.6
Port 5
9.6.1
Overview
Port 5 is a 4-bit input/output port with the pin configuration shown in figure 9.5. The pin functions
differ depending on the operating mode.
In modes 1 to 4 (expanded modes with on-chip ROM disabled), port 5 consists of address output
pins (A19 to A16). In modes 5 and 6 (expanded modes with on-chip ROM enabled), settings in the
port 5 data direction register (P5DDR) designate pins for address bus output (A19 to A16) or generic
input. In mode 7 (single-chip mode), port 5 is a generic input/output port.
Port 5 has software-programmable built-in pull-up MOS transistors.
Pins in port 5 can drive one TTL load and a 90-pF capacitive load. They can also drive an LED or
a darlington transistor pair.
Port 5
Port 5
pins
Modes 1 to 4
Modes 5 and 6
Mode 7
P53 /A 19
A19 (output)
P5 3 (input)/A19 (output)
P5 3 (input/output)
P52 /A 18
A18 (output)
P5 2 (input)/A18 (output)
P5 2 (input/output)
P51 /A 17
A17 (output)
P5 1 (input)/A17 (output)
P5 1 (input/output)
P50 /A 16
A16 (output)
P5 0 (input)/A16 (output)
P5 0 (input/output)
Figure 9.5 Port 5 Pin Configuration
Rev. 3.00 Sep 27, 2006 page 276 of 872
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Section 9 I/O Ports
9.6.2
Register Descriptions
Table 9.8 summarizes the registers of port 5.
Table 9.8
Port 5 Registers
Initial Value
Address*
Name
Abbreviation
R/W
Modes 1 to 4
Modes 5 to 7
H'FFC8
Port 5 data direction
register
P5DDR
W
H'FF
H'F0
H'FFCA
Port 5 data register
P5DR
R/W
H'F0
H'F0
H'FFDB
Port 5 input pull-up MOS
control register
P5PCR
R/W
H'F0
H'F0
Note:
*
Lower 16 bits of the address.
Port 5 Data Direction Register (P5DDR)
P5DDR is an 8-bit write-only register that can select input or output for each pin in port 5.
Bits 7 to 4 are reserved. They cannot be modified and are always read as 1.
Bit
Modes Initial value
1 to 4 Read/Write
Modes Initial value
5 to 7 Read/Write
7
6
5
4




1
1
1
1
1
1
1
1








1
1
1
1
0
0
0
0




W
W
W
W
Reserved bits
3
2
1
0
P5 3 DDR P5 2 DDR P5 1 DDR P5 0 DDR
Port 5 data direction 3 to 0
These bits select input or
output for port 5 pins
Modes 1 to 4 (Expanded Modes with On-Chip ROM Disabled): P5DDR values are fixed at 1
and cannot be modified. Port 5 functions as an address bus.
Modes 5 and 6 (Expanded Modes with On-Chip ROM Enabled): Following a reset, port 5 is
an input port. A pin in port 5 becomes an address output pin if the corresponding P5DDR bit is set
to 1, and an input port if this bit is cleared to 0.
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Section 9 I/O Ports
Mode 7 (Single-Chip Mode): Port 5 functions as an input/output port. A pin in port 5 becomes an
output port if the corresponding P5DDR bit is set to 1, and an input port if this bit is cleared to 0.
In modes 1 to 4, P5DDR always returns 1 when read. No value can be written to.
In modes 5 to 7, P5DDR is a write-only register. Its value cannot be read. All bits return 1 when
read.
P5DDR is initialized to H'FF in modes 1 to 4 and H'F0 in modes 5 to 7 by a reset and in hardware
standby mode. In software standby mode it retains its previous setting, so if a P5DDR bit is set to
1 while port 5 acts as an I/O port, the corresponding pin maintains its output state in software
standby mode.
Port 5 Data Register (P5DR)
P5DR is an 8-bit readable/writable register that stores output data for pins P53 to P50. While port 5
acts as an output port, the value of this register is output. When a bit in P5DDR is set to 1, if port 5
is read the value of the corresponding P5DR bit is returned. When a bit in P5DDR is cleared to 0,
if port 5 is read the corresponding pin level is read.
Bits 7 to 4 are reserved. They cannot be modified and are always read as 1.
Bit
7
6
5
4
3
2
1
0




P5 3
P5 2
P5 1
P5 0
Initial value
1
1
1
1
0
0
0
0
Read/Write




R/W
R/W
R/W
R/W
Reserved bits
Port 5 data 3 to 0
These bits store data
for port 5 pins
P5DR is initialized to H'F0 by a reset and in hardware standby mode. In software standby mode it
retains its previous setting.
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Section 9 I/O Ports
Port 5 Input Pull-Up MOS Control Register (P5PCR)
P5PCR is an 8-bit readable/writable register that controls the MOS input pull-up MOS transistors
in port 5.
Bits 7 to 4 are reserved. They cannot be modified and are always read as 1.
Bit
7
6
5
4




Initial value
1
1
1
1
0
0
0
0
Read/Write




R/W
R/W
R/W
R/W
Reserved bits
2
3
1
0
P5 3 PCR P5 2 PCR P5 1 PCR P5 0 PCR
Port 5 input pull-up MOS control 3 to 0
These bits control input pull-up MOS
transistors built into port 5
In modes 5 to 7, when a P5DDR bit is cleared to 0 (selecting generic input), if the corresponding
bit from P53PCR to P50PCR is set to 1, the input pull-up MOS transistor is turned on.
P5PCR is initialized to H'F0 by a reset and in hardware standby mode. In software standby mode
it retains its previous setting.
Table 9.9 summarizes the states of the input pull-ups MOS in each mode.
Table 9.9
Input Pull-Up MOS Transistor States (Port 5)
Mode
Reset
Hardware
Standby Mode
Software
Standby Mode
Other Modes
1
Off
Off
Off
Off
Off
Off
On/off
On/off
2
3
4
5
6
7
Legend:
Off:
The input pull-up MOS transistor is always off.
On/off: The input pull-up MOS transistor is on if P5PCR = 1 and P5DDR = 0. Otherwise, it is off.
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Section 9 I/O Ports
9.7
Port 6
9.7.1
Overview
Port 6 is a 7-bit input/output port that is also used for input and output of bus control signals
(LWR, HWR, RD, AS, BACK, BREQ, and WAIT). When DRAM is connected to area 3, LWR,
HWR, and RD also function as LW, UW, and CAS, or LCAS, UCAS, and WE, respectively. For
details see section 7, Refresh Controller.
Figure 9.6 shows the pin configuration of port 6. In modes 1 to 6 (expanded modes) the pin
functions are LWR, HWR, RD, AS, P62/BACK, P61/BREQ, and P60/WAIT. See table 9.11 for the
method of selecting the pin states. In mode 7 (single-chip mode) port 6 is a generic input/output
port.
Pins in port 6 can drive one TTL load and a 30-pF capacitive load. They can also drive a
darlington transistor pair.
Port 6 pins
Port 6
Mode 7
(single-chip mode)
Modes 1 to 6
(expanded modes)
P6 6 / LWR
LWR (output)
P6 6 (input/output)
P6 5 / HWR
HWR (output)
P6 5 (input/output)
P6 4 / RD
RD
(output)
P6 4 (input/output)
P6 3 / AS
AS
(output)
P6 3 (input/output)
P6 2 / BACK
P6 2 (input/output)/ BACK (output)
P6 2 (input/output)
P6 1 / BREQ
P6 1 (input/output)/ BREQ (input)
P6 1 (input/output)
P6 0 / WAIT
P6 0 (input/output)/ WAIT (input)
P6 0 (input/output)
Figure 9.6 Port 6 Pin Configuration
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Section 9 I/O Ports
9.7.2
Register Descriptions
Table 9.10 summarizes the registers of port 6.
Table 9.10 Port 6 Registers
Initial Value
Address*
Name
Abbreviation
R/W
Modes 1 to 5
Modes 6, 7
H'FFC9
Port 6 data direction
register
P6DDR
W
H'F8
H'80
Port 6 data register
P6DR
R/W
H'80
H'80
H'FFCB
Note:
*
Lower 16 bits of the address.
Port 6 Data Direction Register (P6DDR)
P6DDR is an 8-bit write-only register that can select input or output for each pin in port 6. Bit 7 is
reserved. It cannot be modified and is always read as 1.
Bit
7

6
5
4
3
2
1
0
P6 6 DDR P6 5 DDR P6 4 DDR P6 3 DDR P6 2 DDR P6 1 DDR P6 0 DDR
Initial value
1
0
0
0
0
0
0
0
Read/Write

W
W
W
W
W
W
W
Reserved bit
Port 6 data direction 6 to 0
These bits select input or output for port 6 pins
Modes 1 to 6 (Expanded Modes): Ports P66 to P63 function as bus control output pins (LWR,
HWR, RD, AS), regardless of the settings of P66DDR to P63DDR. Ports P62 to P60 function as the
bus control pins (BACK, BREQ, WAIT) or I/O ports. For selecting the pin function, see table
9.11. When ports P62 to P60 function as I/O ports and if P6DDR is set to 1, the corresponding pin
of port 6 functions as an output port. If P6DDR is cleared to 0, the corresponding pin functions as
an input port.
Mode 7 (Single-Chip Mode): Port 6 is a generic input/output port. A pin in port 6 becomes an
output port if the corresponding P6DDR bit is set to 1, and an input port if this bit is cleared to 0.
P6DDR is a write-only register. Its value cannot be read. All bits return 1 when read.
P6DDR is initialized to H'80 by a reset and in hardware standby mode. In software standby mode
it retains its previous setting. If a P6DDR bit is set to 1 while port 6 acts as an I/O port, the
corresponding pin maintains its output state in software standby mode.
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Section 9 I/O Ports
Port 6 Data Register (P6DR)
P6DR is an 8-bit readable/writable register that stores output data for pins P66 to P60. When this
register is read, bits 6 to 0 each returns the logic level of the pin, when the corresponding bit of
P6DDR is 0. When the corresponding bit of P6DDR is 1, bits 6 to 0 return the P6DR value.
Bit
7
6
5
4
3
2
1
0

P6 6
P6 5
P6 4
P6 3
P6 2
P6 1
P6 0
Initial value
1
0
0
0
0
0
0
0
Read/Write

R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reserved bit
Port 6 data 6 to 0
These bits store data for port 6 pins
Bit 7 is reserved, cannot be modified, and always read as 1.
P6DR is initialized to H'80 by a reset and in hardware standby mode. In software standby mode it
retains its previous setting.
Table 9.11 Port 6 Pin Functions in Modes 1 to 6
Pin
Pin Functions and Selection Method
P66/LWR
Functions as follows regardless of P66DDR
P66DDR
0
P65/HWR
Functions as follows regardless of P65DDR
P65DDR
0
1
HWR output
Pin function
P64/RD
1
LWR output
Pin function
Functions as follows regardless of P64DDR
P64DDR
Pin function
Rev. 3.00 Sep 27, 2006 page 282 of 872
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0
1
RD output
Section 9 I/O Ports
Pin
Pin Functions and Selection Method
P63/AS
Functions as follows regardless of P63DDR
P63DDR
0
1
AS output
Pin function
P62/BACK
Bit BRLE in BRCR and bit P62DDR select the pin function as follows
BRLE
0
P62DDR
Pin function
P61/BREQ
0
1
—
P62 input
P62 output
BACK output
Bit BRLE in BRCR and bit P61DDR select the pin function as follows
BRLE
0
P61DDR
Pin function
P60/WAIT
1
1
0
1
—
P61 input
P61 output
BREQ input
Bits WCE7 to WCE0 in WCER, bit WMS1 in WCR, and bit P60DDR select the
pin function as follows
WCER
All 1s
WMS1
0
P60DDR
Pin function
Note:
*
0
1
P60 input
P60 output
Not all 1s
1
0*
—
0*
WAIT input
Do not set bit P60DDR to 1.
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Section 9 I/O Ports
9.8
Port 7
9.8.1
Overview
Port 7 is an 8-bit input port that is also used for analog input to the A/D converter and analog
output from the D/A converter. The pin functions are the same in all operating modes. Figure 9.7
shows the pin configuration of port 7.
For the analog input pins of the A/D converter, see section 15, A/D Converter.
For the analog input pins of the D/A converter, see section 16, D/A Converter.
Port 7 pins
P77 (input)/AN 7 (input)/DA 1 (output)
P76 (input)/AN 6 (input)/DA 0 (output)
P75 (input)/AN 5 (input)
Port 7
P74 (input)/AN 4 (input)
P73 (input)/AN 3 (input)
P72 (input)/AN 2 (input)
P71 (input)/AN 1 (input)
P70 (input)/AN 0 (input)
Figure 9.7 Port 7 Pin Configuration
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Section 9 I/O Ports
9.8.2
Register Description
Table 9.12 summarizes the port 7 register. Port 7 is an input-only port, so it has no data direction
register.
Table 9.12 Port 7 Data Register
Address*
Name
Abbreviation
R/W
Initial Value
H'FFCE
Port 7 data register
P7DR
R
Undetermined
Note:
*
Lower 16 bits of the address.
Port 7 Data Register (P7DR)
Bit
7
6
5
4
3
2
1
0
P77
P76
P75
P74
P73
P72
P71
P70
Initial value
*
*
*
*
*
*
*
*
Read/Write
R
R
R
R
R
R
R
R
Note: * Determined by pins P77 to P70.
When P7DR is read, the logic level of the pin is always read. No data can be written to.
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Section 9 I/O Ports
9.9
Port 8
9.9.1
Overview
Port 8 is a 5-bit input/output port that is also used for CS3 to CS0 output, RFSH output, and IRQ3 to
IRQ0 input. Figure 9.8 shows the pin configuration of port 8.
In modes 1 to 6 (expanded modes), port 8 can provide CS3 to CS0 output, RFSH output, and IRQ3
to IRQ0 input. See table 9.14 for the selection of pin functions in expanded modes.
In mode 7 (single-chip mode), port 8 can provide IRQ3 to IRQ0 input. See table 9.15 for the
selection of pin functions in single-chip mode.
The IRQ3 to IRQ0 functions are selected by IER settings, regardless of whether the pin is used for
input or output. For details see section 5, Interrupt Controller.
Pins in port 8 can drive one TTL load and a 90-pF capacitive load. They can also drive a
darlington transistor pair.
Pins P82 to P80 have Schmitt-trigger inputs.
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Section 9 I/O Ports
Port 8
Port 8 pins
Pin functions in modes 1 to 6
(expanded modes)
P84 / CS 0
P84 (input)/ CS 0 (output)
P83 / CS 1 / IRQ 3
P83 (input)/ CS 1 (output)/ IRQ 3 (input)
P82 / CS 2 / IRQ 2
P82 (input)/ CS 2 (output)/ IRQ 2 (input)
P81 / CS 3 / IRQ 1
P81 (input)/ CS 3 (output)/ IRQ 1 (input)
P80 / RFSH /IRQ 0
P80 (input/output)/ RFSH (output)/ IRQ 0 (input)
Pin functions in mode 7
(single-chip mode)
P84 /(input/output)
P83 /(input/output)/ IRQ 3 (input)
P82 /(input/output)/ IRQ 2 (input)
P81 /(input/output)/ IRQ 1 (input)
P80 /(input/output)/ IRQ 0 (input)
Figure 9.8 Port 8 Pin Configuration
9.9.2
Register Descriptions
Table 9.13 summarizes the registers of port 8.
Table 9.13 Port 8 Registers
Initial Value
Address*
Name
Abbreviation
R/W
Modes 1 to 4
Modes 5 to 7
H'FFCD
Port 8 data direction
register
P8DDR
W
H'F0
H'E0
Port 8 data register
P8DR
R/W
H'E0
H'E0
H'FFCF
Note:
*
Lower 16 bits of the address.
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Section 9 I/O Ports
Port 8 Data Direction Register (P8DDR)
P8DDR is an 8-bit write-only register that can select input or output for each pin in port 8.
Bits 7 to 5 are reserved. They cannot be modified and are always read as 1.
Bit
Modes Initial value
1 to 4 Read/Write
Modes Initial value
5 to 7 Read/Write
7
6
5



4
3
2
1
0
P8 4 DDR P8 3 DDR P8 2 DDR P8 1 DDR P8 0 DDR
1
1
1
1
0
0
0
0



W
W
W
W
W
1
1
1
0
0
0
0
0



W
W
W
W
W
Reserved bits
Port 8 data direction 4 to 0
These bits select input or
output for port 8 pins
Modes 1 to 6 (Expanded Modes): When bits in P8DDR bit are set to 1, P84 to P81 become CS0 to
CS3 output pins. When bits in P8DDR are cleared to 0, the corresponding pins become input ports.
In modes 1 to 4 (expanded modes with on-chip ROM disabled), following a reset only CS0 is
output. The other three pins are input ports. In modes 5 and 6 (expanded modes with on-chip
ROM enabled), following a reset all four pins are input ports.
When the refresh controller is enabled, P80 is used unconditionally for RFSH output. When the
refresh controller is disabled, P80 becomes a generic input/output port according to the P8DDR
setting. For details see table 9.15.
Mode 7 (Single-Chip Mode): Port 8 is a generic input/output port. A pin in port 8 becomes an
output port if the corresponding P8DDR bit is set to 1, and an input port if this bit is cleared to 0.
P8DDR is a write-only register. Its value cannot be read. All bits return 1 when read.
P8DDR is initialized to H'F0 in modes 1 to 4 and H'E0 in modes 5 to 7 by a reset and in hardware
standby mode. In software standby mode it retains its previous setting, so if a P8DDR bit is set to
1 while port 8 acts as an I/O port, the corresponding pin maintains its output state in software
standby mode.
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Section 9 I/O Ports
Port 8 Data Register (P8DR)
P8DR is an 8-bit readable/writable register that stores output data for pins P84 to P80. While port 8
acts as an output port, the value of this register is output. When a bit in P8DDR is set to 1, if port 8
is read the value of the corresponding P8DR bit is returned. When a bit in P8DDR is cleared to 0,
if port 8 is read the corresponding pin level is read.
Bits 7 to 5 are reserved. They cannot be modified and always are read as 1.
Bit
7
6
5
4
3
2
1
0



P8 4
P8 3
P8 2
P8 1
P8 0
Initial value
1
1
1
0
0
0
0
0
Read/Write



R/W
R/W
R/W
R/W
R/W
Reserved bits
Port 8 data 4 to 0
These bits store data
for port 8 pins
P8DR is initialized to H'E0 by a reset and in hardware standby mode. In software standby mode it
retains its previous setting.
Rev. 3.00 Sep 27, 2006 page 289 of 872
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Section 9 I/O Ports
Table 9.14 Port 8 Pin Functions in Modes 1 to 6
Pin
Pin Functions and Selection Method
P84/CS0
Bit P84DDR selects the pin function as follows
P84DDR
Pin function
P83/CS1/IRQ3
0
1
P84 input
CS0 output
Bit P83DDR selects the pin function as follows
P83DDR
Pin function
0
1
P83 input
CS1 output
IRQ3 input
P82/CS2/IRQ2
Bit P82DDR selects the pin function as follows
P82DDR
Pin function
0
1
P82 input
CS2 output
IRQ2 input
P81/CS3/IRQ1
Bit P81DDR selects the pin function as follows
P81DDR
Pin function
0
1
P81 input
CS3 output
IRQ1 input
P80/RFSH/IRQ0
Bit RFSHE in RFSHCR and bit P80DDR select the pin function as follows
RFSHE
P80DDR
Pin function
0
1
0
1
—
P80 input
P80 output
RFSH output
IRQ0 input
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Section 9 I/O Ports
Table 9.15 Port 8 Pin Functions in Mode 7
Pin
Pin Functions and Selection Method
P84
Bit P84DDR selects the pin function as follows
P84DDR
Pin function
P83/IRQ3
0
1
P84 input
P84 output
Bit P83DDR selects the pin function as follows
P83DDR
Pin function
0
1
P83 input
P83 output
IRQ3 input
P82/IRQ2
Bit P82DDR selects the pin function as follows
P82DDR
Pin function
0
1
P82 input
P82 output
IRQ2 input
P81/IRQ1
Bit P81DDR selects the pin function as follows
P81DDR
Pin function
0
1
P81 input
P81 output
IRQ1 input
P80/IRQ0
Bit P80DDR select the pin function as follows
P80DDR
Pin function
0
1
P80 input
P80 output
IRQ0 input
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Section 9 I/O Ports
9.10
Port 9
9.10.1
Overview
Port 9 is a 6-bit input/output port that is also used for input and output (TxD0, TxD1, RxD0, RxD1,
SCK0, SCK1) by serial communication interface channels 0 and 1 (SCI0 and SCI1), and for IRQ5
and IRQ4 input. See table 9.17 for the selection of pin functions.
The IRQ5 and IRQ4 functions are selected by IER settings, regardless of whether the pin is used for
input or output. For details see section 5, Interrupt Controller.
Port 9 has the same set of pin functions in all operating modes. Figure 9.9 shows the pin
configuration of port 9.
Pins in port 9 can drive one TTL load and a 30-pF capacitive load. They can also drive a
darlington transistor pair.
Port 9 pins
P95 (input/output)/SCK 1 (input/output)/IRQ 5 (input)
P94 (input/output)/SCK 0 (input/output)/IRQ 4 (input)
Port 9
P93 (input/output)/RxD1 (input)
P92 (input/output)/RxD0 (input)
P91 (input/output)/TxD1 (output)
P90 (input/output)/TxD0 (output)
Figure 9.9 Port 9 Pin Configuration
Rev. 3.00 Sep 27, 2006 page 292 of 872
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Section 9 I/O Ports
9.10.2
Register Descriptions
Table 9.16 summarizes the registers of port 9.
Table 9.16 Port 9 Registers
Address*
Name
Abbreviation
R/W
Initial Value
H'FFD0
Port 9 data direction register
P9DDR
W
H'C0
H'FFD2
Port 9 data register
P9DR
R/W
H'C0
Note:
*
Lower 16 bits of the address.
Port 9 Data Direction Register (P9DDR)
P9DDR is an 8-bit write-only register that can select input or output for each pin in port 9.
Bits 7 and 6 are reserved. They cannot be modified and are always read as 1.
Bit
7
6


5
4
3
2
1
0
P9 5 DDR P9 4 DDR P9 3 DDR P9 2 DDR P9 1 DDR P9 0 DDR
Initial value
1
1
0
0
0
0
0
0
Read/Write


W
W
W
W
W
W
Reserved bits
Port 9 data direction 5 to 0
These bits select input or
output for port 9 pins
While port 9 acts as an I/O port, a pin in port 9 becomes an output port if the corresponding
P9DDR bit is set to 1, and an input port if this bit is cleared to 0. For selecting the pin function, see
table 9.17.
P9DDR is a write-only register. Its value cannot be read. All bits return 1 when read.
P9DDR is initialized to H'C0 by a reset and in hardware standby mode. In software standby mode
it retains its previous setting. If a P9DDR bit is set to 1 while port 9 acts as an I/O port, the
corresponding pin maintains its output state in software standby mode.
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Section 9 I/O Ports
Port 9 Data Register (P9DR)
P9DR is an 8-bit readable/writable register that stores output data for pins P95 to P90. While port 9
acts as an output port, the value of this register is output. When a bit in P9DDR is set to 1, if port 9
is read the value of the corresponding P9DR bit is returned. When a bit in P9DDR is cleared to 0,
if port 9 is read the corresponding pin level is read.
Bit
7
6
5
4
3
2
1
0


P9 5
P9 4
P9 3
P9 2
P9 1
P9 0
Initial value
1
1
0
0
0
0
0
0
Read/Write


R/W
R/W
R/W
R/W
R/W
R/W
Reserved bits
Port 9 data 5 to 0
These bits store data
for port 9 pins
Bits 7 and 6 are reserved. They cannot be modified and are always read as 1.
P9DR is initialized to H'C0 by a reset and in hardware standby mode. In software standby mode it
retains its previous setting.
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Section 9 I/O Ports
Table 9.17 Port 9 Pin Functions
Pin
Pin Functions and Selection Method
P95/SCK1/IRQ5
Bit C/A in SMR of SCI1, bits CKE0 and CKE1 in SCR of SCI1, and bit P95DDR
select the pin function as follows
CKE1
0
C/A
0
CKE0
P95DDR
Pin function
1
0
1
—
1
—
—
0
1
—
—
—
P95
input
P95
output
SCK1
output
SCK1
output
SCK1
input
IRQ5 input
P94/SCK0/IRQ4
Bit C/A in SMR of SCI0, bits CKE0 and CKE1 in SCR of SCI0, and bit P94DDR
select the pin function as follows
CKE1
0
C/A
0
CKE0
P94DDR
Pin function
1
0
1
—
1
—
—
0
1
—
—
—
P94
input
P94
output
SCK0
output
SCK0
output
SCK0
input
IRQ4 input
P93/RxD1
Bit RE in SCR of SCI1 and bit P93DDR select the pin function as follows
RE
0
P93DDR
Pin function
P92/RxD0
1
0
1
—
P93 input
P93 output
RxD1 input
Bit RE in SCR of SCI0, bit SMIF in SCMR, and bit P92DDR select the pin
function as follows
SMIF
0
RE
P92DDR
Pin function
0
1
1
—
0
1
—
—
P92 input
P92 output
RxD0 input
RxD0 input
Rev. 3.00 Sep 27, 2006 page 295 of 872
REJ09B0325-0300
Section 9 I/O Ports
Pin
Pin Functions and Selection Method
P91/TxD1
Bit TE in SCR of SCI1 and bit P91DDR select the pin function as follows
TE
0
P91DDR
Pin function
P90/TxD0
1
0
1
—
P91 input
P91 output
TxD1 output
Bit TE in SCR of SCI0, bit SMIF in SCMR, and bit P90DDR select the pin
function as follows
SMIF
0
TE
0
P90DDR
Pin function
Note:
*
1
1
—
0
1
—
—
P90 input
P90 output
TxD0 output
TxD0 output*
Functions as the TxD0 output pin, but there are two states: one in
which the pin is driven, and another in which the pin is at highimpedance.
Rev. 3.00 Sep 27, 2006 page 296 of 872
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Section 9 I/O Ports
9.11
Port A
9.11.1
Overview
Port A is an 8-bit input/output port that is also used for output (TP7 to TP0) from the programmable
timing pattern controller (TPC), input and output (TIOCB2, TIOCA2, TIOCB1, TIOCA1, TIOCB0,
TIOCA0, TCLKD, TCLKC, TCLKB, TCLKA) by the 16-bit integrated timer unit (ITU), output
(TEND1, TEND0) from the DMA controller (DMAC), CS4 to CS6 output, and address output (A23
to A20). A reset or hardware standby leaves port A as an input port, except that in modes 3, 4, and
6, one pin is always used for A20 output. For selecting the pin function, see table 9.19. Usage of
pins for TPC, ITU, and DMAC input and output is described in the sections on those modules. For
output of address bits A23 to A21 in modes 3, 4, and 6, see section 6.2.5, Bus Release Control
Register (BRCR). For output of CS4 to CS6 in modes 1 to 6, see section 6.3.2, Chip Select Signals.
Pins not assigned to any of these functions are available for generic input/output. Figure 9.10
shows the pin configuration of port A.
Pins in port A can drive one TTL load and a 30-pF capacitive load. They can also drive a
darlington transistor pair. Port A has Schmitt-trigger inputs.
Rev. 3.00 Sep 27, 2006 page 297 of 872
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Section 9 I/O Ports
Port A pins
PA 7/TP7 /TIOCB2 /A 20
PA 6/TP6 /TIOCA2 /A21/CS4
PA 5/TP5 /TIOCB1 /A22/CS5
PA 4/TP4 /TIOCA1 /A23/CS6
Port A
PA 3/TP3 /TIOCB 0 /TCLKD
PA 2/TP2 /TIOCA 0 /TCLKC
PA 1/TP1 /TEND1 /TCLKB
PA 0/TP0 /TEND0 /TCLKA
Pin functions in modes 1, 2, and 5
PA 7 (input/output)/TP7 (output)/TIOCB 2 (input/output)
PA 6 (input/output)/TP6 (output)/TIOCA 2 (input/output)/CS4 (output)
PA 5 (input/output)/TP5 (output)/TIOCB 1 (input/output)/CS5(output)
PA 4 (input/output)/TP4 (output)/TIOCA 1 (input/output)/CS6(output)
PA 3 (input/output)/TP3 (output)/TIOCB 0 (input/output)/TCLKD (input)
PA 2 (input/output)/TP2 (output)/TIOCA 0 (input/output)/TCLKC (input)
PA 1 (input/output)/TP1 (output)/TEND 1 (output)/TCLKB (input)
PA 0 (input/output)/TP0 (output)/TEND 0 (output)/TCLKA (input)
Pin functions in modes 3, 4, and 6
A20 (output)
PA 6 (input/output)/TP6 (output)/TIOCA 2 (input/output)/A 21 (output)/CS4 (output)
PA 5 (input/output)/TP5 (output)/TIOCB 1 (input/output)/A 22 (output)/CS5 (output)
PA 4 (input/output)/TP4 (output)/TIOCA 1 (input/output)/A 23 (output)/CS6 (output)
PA 3 (input/output)/TP3 (output)/TIOCB 0 (input/output)/TCLKD (input)
PA 2 (input/output)/TP2 (output)/TIOCA 0 (input/output)/TCLKC (input)
PA 1 (input/output)/TP1 (output)/TEND 1 (output)/TCLKB (input)
PA 0 (input/output)/TP0 (output)/TEND 0 (output)/TCLKA (input)
Pin functions in mode 7
PA7 (input/output)/TP7 (output)/TIOCB2 (input/output)
PA6 (input/output)/TP6 (output)/TIOCA2 (input/output)
PA5 (input/output)/TP5 (output)/TIOCB1 (input/output)
PA4 (input/output)/TP4 (output)/TIOCA1 (input/output)
PA3 (input/output)/TP3 (output)/TIOCB0 (input/output)/TCLKD (input)
PA2 (input/output)/TP2 (output)/TIOCA0 (input/output)/TCLKC (input)
PA1 (input/output)/TP1 (output)/TEND1 (output)/TCLKB (input)
PA0 (input/output)/TP0 (output)/TEND0 (output)/TCLKA (input)
Figure 9.10 Port A Pin Configuration
Rev. 3.00 Sep 27, 2006 page 298 of 872
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Section 9 I/O Ports
9.11.2
Register Descriptions
Table 9.18 summarizes the registers of port A.
Table 9.18 Port A Registers
Initial Value
Address*
Name
Abbreviation
R/W
Modes
1, 2, 5, and 7
Modes
3, 4, and 6
H'FFD1
Port A data direction
register
PADDR
W
H'00
H'80
H'FFD3
Port A data register
PADR
R/W
H'00
H'00
Note:
*
Lower 16 bits of the address.
Port A Data Direction Register (PADDR)
PADDR is an 8-bit write-only register that can select input or output for each pin in port A. When
pins are used for TPC output, the corresponding PADDR bits must also be set.
Bit
7
6
5
4
3
2
1
0
PA7 DDR PA6 DDR PA5 DDR PA4 DDR PA3 DDR PA2 DDR PA1 DDR PA0 DDR
Modes
3, 4,
and 6
Modes
1, 2, 5,
and 7
Initial value
1
0
0
0
0
0
0
0
Read/Write 
W
W
W
W
W
W
W
Initial value
0
0
0
0
0
0
0
0
Read/Write W
W
W
W
W
W
W
W
Port A data direction 7 to 0
These bits select input or output for port A pins
While port A acts as an I/O port, a pin in port A becomes an output pin if the corresponding
PADDR bit is set to 1, and an input pin if this bit is cleared to 0. In modes 3, 4, and 6, PA7DDR is
fixed at 1 and PA7 functions as an address output pin.
PADDR is a write-only register. Its value cannot be read. All bits return 1 when read.
PADDR is initialized to H'00 by a reset and in hardware standby mode in modes 1, 2, 5, and 7.
It is initialized to H'80 by a reset and in hardware standby mode in modes 3, 4, and 6. In software
standby mode it retains its previous setting. If a PADDR bit is set to 1, the corresponding pin
maintains its output state in software standby mode.
Rev. 3.00 Sep 27, 2006 page 299 of 872
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Section 9 I/O Ports
Port A Data Register (PADR)
PADR is an 8-bit readable/writable register that stores output data for pins PA7 to PA0. While port
A acts as an output port, the value of this register is output. When a bit in PADDR is set to 1, if
port A is read the value of the corresponding PADR bit is returned. When a bit in PADDR is
cleared to 0, if port A is read the corresponding pin level is read.
Bit
7
6
5
4
3
2
1
0
PA 7
PA 6
PA 5
PA 4
PA 3
PA 2
PA 1
PA 0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Port A data 7 to 0
These bits store data for port A pins
PADR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it
retains its previous setting.
Rev. 3.00 Sep 27, 2006 page 300 of 872
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Section 9 I/O Ports
9.11.3
Pin Functions
Table 9.19 describes the selection of pin functions.
Table 9.19 Port A Pin Functions
Pin
Pin Functions and Selection Method
The mode setting, ITU channel 2 settings (bit PWM2 in TMDR and bits IOB2 to IOB0 in
PA7/TP7/
TIOCB2/A20 TIOR2), bit NDER7 in NDERA, and bit PA7DDR in PADDR select the pin function as
follows
Mode
1, 2, 5, 7
3, 4, 6
ITU
channel 2
settings
(1) in table
below
PA7DDR
—
0
1
1
—
NDER7
—
—
0
1
—
TIOCB2
output
PA7 input
PA7 output
TP7 output
A20 output
Pin function
Note:
*
ITU
channel 2
settings
(2) in table below
—
TIOCB2 input*
TIOCB2 input when IOB2 = 1 and PWM2 = 0.
(2)
IOB2
(1)
(2)
0
1
IOB1
0
0
1
—
IOB0
0
1
—
—
Rev. 3.00 Sep 27, 2006 page 301 of 872
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Section 9 I/O Ports
Pin
Pin Functions and Selection Method
PA6/TP6/
TIOCA2/
A21/CS4
The mode setting, bit A21E in BRCR, bit CS4E in CSCR, ITU channel 2 settings (bit
PWM2 in TMDR and bits IOA2 to IOA0 in TIOR2), bit NDER6 in NDERA, and bit
PA6DDR in PADDR select the pin function as follows
Mode
1, 2, 5
3, 4, 6
CS4E
0
1
A21E
—
—
—
7
0
1
(1) in
(2) in table
table
below
1
—
0
—
—
—
—
ITU
(1) in
(2) in table
channel 2
table
below
settings
below
PA6DDR
—
0
1
1
—
—
0
1
1
—
—
—
0
1
1
NDER6
—
—
0
1
—
—
—
0
1
—
—
—
—
0
1
below
(1) in
(2) in table
table
below
below
Pin
TIOCA2 PA6
PA6
TP6
CS4 TIOCA2 PA6
PA6
TP6
A21
CS4 TIOCA2 PA6
PA6
TP6
function
output input out-
out-
out-
output input out-
out-
out-
out-
output input out-
out-
put
put
put
put
put
put
put
put
put
TIOCA2 input*
TIOCA2 input*
TIOCA2 input*
Note: * TIOCA2 input when IOA2 = 1.
ITU
channel 2
(2)
(1)
(2)
(1)
settings
PWM2
0
IOA2
1
0
1
—
IOA1
0
0
1
—
—
IOA0
0
1
—
—
—
Rev. 3.00 Sep 27, 2006 page 302 of 872
REJ09B0325-0300
Section 9 I/O Ports
Pin
Pin Functions and Selection Method
PA5/TP5/
The mode setting, bit A22E in BRCR, bit CS5E in CSCR, ITU channel 1 settings (bit
PWM1 in TMDR and bits IOB2 to IOB0 in TIOR1), bit NDER5 in NDERA, and bit
PA5DDR in PADDR select the pin function as follows
TIOCB1/
A22/CS5
Mode
1, 2, 5
3, 4, 6
CS5E
0
1
A22E
—
—
—
7
0
1
(1) in
(2) in table
table
below
1
—
0
—
—
—
—
ITU
(1) in
(2) in table
channel 1
table
below
settings
below
PA5DDR
—
0
1
1
—
—
0
1
1
—
—
—
0
1
1
NDER5
—
—
0
1
—
—
—
0
1
—
—
—
—
0
1
below
(1) in
(2) in table
table
below
below
Pin
TIOCB1 PA5
PA5
TP5
CS5 TIOCB1 PA5
PA5
TP5
A22
CS5 TIOCB1 PA5
PA5
TP5
function
output input out-
out-
out-
output input out-
out-
out-
out-
output input out-
out-
put
put
put
put
put
put
put
put
put
TIOCB1 input*
TIOCB1 input*
TIOCB1 input*
Note: * TIOCB1 input when IOB2 = 1 and PWM1 = 0.
ITU
channel 1
(2)
(1)
(2)
settings
IOB2
0
1
IOB1
0
0
1
—
IOB0
0
1
—
—
Rev. 3.00 Sep 27, 2006 page 303 of 872
REJ09B0325-0300
Section 9 I/O Ports
Pin
Pin Functions and Selection Method
PA4/TP4/
TIOCA1/
A23/CS6
The mode setting, bit A23E in BRCR, bit CS6E in CSCR, ITU channel 1 settings (bit
PWM1 in TMDR and bits IOA2 to IOA0 in TIOR1), bit NDER4 in NDERA, and bit
PA4DDR in PADDR select the pin function as follows
Mode
1, 2, 5
3, 4, 6
CS6E
0
1
A23E
—
—
ITU
(1) in
(2) in table
channel 2
table
below
settings
below
—
7
0
1
(1) in
(2) in table
table
below
1
—
0
—
—
—
—
below
(1) in
(2) in table
table
below
below
PA4DDR
—
0
1
1
—
—
0
1
1
—
—
—
0
1
1
NDER4
—
—
0
1
—
—
—
0
1
—
—
—
—
0
1
Pin
TIOCA1 PA4
PA4
TP4
CS6 TIOCA1 PA4
PA4
TP4
A23
CS6 TIOCA1 PA4
PA4
TP4
function
output input out-
out-
out-
output input out-
out-
out-
out-
output input out-
out-
put
put
put
put
put
put
put
put
put
TIOCA1 input*
TIOCA1 input*
TIOCA1 input*
Note: * TIOCA1 input when IOA2 = 1.
ITU
channel 1
(2)
(1)
(2)
(1)
settings
PWM1
0
IOA2
1
0
1
—
IOA1
0
0
1
—
—
IOA0
0
1
—
—
—
Rev. 3.00 Sep 27, 2006 page 304 of 872
REJ09B0325-0300
Section 9 I/O Ports
Pin
Pin Functions and Selection Method
PA3/TP3/
TIOCB0/
TCLKD
ITU channel 0 settings (bit PWM0 in TMDR and bits IOB2 to IOB0 in TIOR0), bits
TPSC2 to TPSC0 in TCR4 to TCR0, bit NDER3 in NDERA, and bit PA3DDR in PADDR
select the pin function as follows
ITU channel 0
settings
PA3DDR
NDER3
Pin function
(1) in table
below
—
(2) in table
below
0
1
1
—
—
0
1
TIOCB0 output
PA3 input
PA3 output
TP3 output
TIOCB0 input*
2
TCLKD input*
1
Notes: 1. TIOCB0 input when IOB2 = 1 and PWM0 = 0.
2. TCLKD input when TPSC2 = TPSC1 = TPSC0 = 1 in any of TCR4 to TCR0.
ITU channel 0
settings
(2)
IOB2
(1)
(2)
0
1
IOB1
0
0
1
—
IOB0
0
1
—
—
Rev. 3.00 Sep 27, 2006 page 305 of 872
REJ09B0325-0300
Section 9 I/O Ports
Pin
Pin Functions and Selection Method
PA2/TP2/
TIOCA0/
TCLKC
ITU channel 0 settings (bit PWM0 in TMDR and bits IOA2 to IOA0 in TIOR0), bits
TPSC2 to TPSC0 in TCR4 to TCR0, bit NDER2 in NDERA, and bit PA2DDR in PADDR
select the pin function as follows
ITU channel 0
settings
(1) in table
below
PA2DDR
—
NDER2
Pin function
(2) in table
below
0
1
1
—
—
0
1
TIOCA0 output
PA2 input
PA2 output
TP2 output
TIOCA0 input*
2
TCLKC input*
1
Notes: 1. TIOCA0 input when IOA2 = 1.
2. TCLKC input when TPSC2 = TPSC1 = 1 and TPSC0 = 0 in any of TCR4 to
TCR0.
ITU channel 0
settings
(2)
(1)
PWM0
(2)
0
IOA2
(1)
1
1
—
IOA1
0
0
0
1
—
—
IOA0
0
1
—
—
—
Rev. 3.00 Sep 27, 2006 page 306 of 872
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Section 9 I/O Ports
Pin
Pin Functions and Selection Method
PA1/TP1/
TCLKB/
TEND1
DMAC channel 1 settings (bits DTS2A to DTS0A and DTS2B to DTS0B in DTCR1A and
DTCR1B), bit NDER1 in NDERA, and bit PA1DDR in PADDR select the pin function as
follows
DMAC
channel 1
settings
(1) in table
below
(2) in table
below
PA1DDR
—
0
1
1
NDER1
—
—
0
1
TEND1 output
PA1 input
Pin function
Note:
*
PA1 output
TCLKB input*
TP1 output
TCLKB input when MDF = 1 in TMDR, or when TPSC2 = 1, TPSC1 = 0, and
TPSC0 = 1 in any of TCR4 to TCR0.
DMAC
channel 1
settings
(2)
(1)
DTS2A,
DTS1A
Not both 1
DTS0A
—
(2)
(1)
(2)
(1)
Both 1
0
0
1
1
1
DTS2B
0
1
1
0
1
0
1
1
DTS1B
—
0
1
—
—
—
0
1
Rev. 3.00 Sep 27, 2006 page 307 of 872
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Section 9 I/O Ports
Pin
Pin Functions and Selection Method
PA0/TP0/
TCLKA/
TEND0
DMAC channel 0 settings (bits DTS2A to DTS0A and DTS2B to DTS0B in DTCR0A and
DTCR0B), bit NDER0 in NDERA, and bit PA0DDR in PADDR select the pin function as
follows
DMAC
channel 0
settings
(1) in table
below
(2) in table
below
PA0DDR
—
0
1
1
NDER0
—
—
0
1
TEND0 output
PA0 input
Pin function
Note:
*
PA0 output
TCLKA input*
TP0 output
TCLKA input when MDF = 1 in TMDR, or when TPSC2 = 1 and TPSC1 = 0
in any of TCR4 to TCR0.
DMAC
channel 0
settings
(2)
(1)
DTS2A,
DTS1A
Not both 1
DTS0A
—
(2)
(1)
(2)
(1)
Both 1
0
0
1
1
1
DTS2B
0
1
1
0
1
0
1
1
DTS1B
—
0
1
—
—
—
0
1
Rev. 3.00 Sep 27, 2006 page 308 of 872
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Section 9 I/O Ports
9.12
Port B
9.12.1
Overview
Port B is an 8-bit input/output port that is also used for output (TP15 to TP8) from the
programmable timing pattern controller (TPC), input/output (TIOCB4, TIOCB3, TIOCA4, TIOCA3)
and output (TOCXB4, TOCXA4) by the 16-bit integrated timer unit (ITU), input (DREQ1, DREQ0)
to the DMA controller (DMAC), ADTRG input to the A/D converter, and CS7 output. A reset or
hardware standby leaves port B as an input port. For selecting the pin function, see table 9.21.
Usage of pins for TPC, ITU, DMAC, and A/D converter input and output is described in the
sections on those modules. For output of CS7 in modes 1 to 6, see section 6.3.2, Chip Select
Signals. Pins not assigned to any of these functions are available for generic input/output. Figure
9.11 shows the pin configuration of port B.
Pins in port B can drive one TTL load and a 30-pF capacitive load. They can also drive an LED or
darlington transistor pair. Pins PB3 to PB0 have Schmitt-trigger inputs.
Rev. 3.00 Sep 27, 2006 page 309 of 872
REJ09B0325-0300
Section 9 I/O Ports
Port B pins
PB7/TP15/DREQ1/ADTRG
PB6/TP14/DREQ0/CS7
PB5/TP13/TOCXB4
PB4/TP12/TOCXA4
Port B
PB3/TP11/TIOCB4
PB2/TP10/TIOCA4
PB1/TP9/TIOCB3
PB0/TP8/TIOCA3
Pin functions in modes 1 to 6
PB7 (input/output)/TP15 (output)/DREQ1 (input)/ADTRG (input)
PB6 (input/output)/TP14 (output)/DREQ0 (input)/CS7 (output)
PB5 (input/output)/TP13 (output)/TOCXB4 (output)
PB4 (input/output)/TP12 (output)/TOCXA4 (output)
PB3 (input/output)/TP11 (output)/TIOCB4 (input/output)
PB2 (input/output)/TP10 (output)/TIOCA4 (input/output)
PB1 (input/output)/TP9 (output)/TIOCB3 (input/output)
PB0 (input/output)/TP8 (output)/TIOCA3 (input/output)
Pin functions in mode 7
PB7 (input/output)/TP15 (output)/DREQ1 (input)/ADTRG (input)
PB6 (input/output)/TP14 (output)/DREQ0 (input)
PB5 (input/output)/TP13 (output)/TOCXB4 (output)
PB4 (input/output)/TP12 (output)/TOCXA4 (output)
PB3 (input/output)/TP11 (output)/TIOCB4 (input/output)
PB2 (input/output)/TP10 (output)/TIOCA4 (input/output)
PB1 (input/output)/TP9 (output)/TIOCB3 (input/output)
PB0 (input/output)/TP8 (output)/TIOCA3 (input/output)
Figure 9.11 Port B Pin Configuration
Rev. 3.00 Sep 27, 2006 page 310 of 872
REJ09B0325-0300
Section 9 I/O Ports
9.12.2
Register Descriptions
Table 9.20 summarizes the registers of port B.
Table 9.20 Port B Registers
Address*
Name
Abbreviation
R/W
Initial Value
H'FFD4
Port B data direction register
PBDDR
W
H'00
H'FFD6
Port B data register
PBDR
R/W
H'00
Note:
*
Lower 16 bits of the address.
Port B Data Direction Register (PBDDR)
PBDDR is an 8-bit write-only register that can select input or output for each pin in port B. When
pins are used for TPC output, the corresponding PBDDR bits must also be set.
Bit
7
6
5
4
3
2
1
0
PB7 DDR PB6 DDR PB5 DDR PB4 DDR PB3 DDR PB2 DDR PB1 DDR PB0 DDR
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port B data direction 7 to 0
These bits select input or output for port B pins
While port B acts as an I/O port, a pin in port B becomes an output pin if the corresponding
PBDDR bit is set to 1, and an input pin if this bit is cleared to 0.
PBDDR is a write-only register. Its value cannot be read. All bits return 1 when read.
PBDDR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode
it retains its previous setting. If a PBDDR bit is set to 1 while port B acts as an I/O port, the
corresponding pin maintains its output state in software standby mode.
Rev. 3.00 Sep 27, 2006 page 311 of 872
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Section 9 I/O Ports
Port B Data Register (PBDR)
PBDR is an 8-bit readable/writable register that stores output data for pins PB7 to PB0. While port
B acts as an output port, the value of this register is output. When a bit in PBDDR is set to 1, if
port B is read the value of the corresponding PBDR bit is returned. When a bit in PBDDR is
cleared to 0, if port B is read the corresponding pin level is read.
Bit
7
6
5
4
3
2
1
0
PB 7
PB 6
PB 5
PB 4
PB 3
PB 2
PB 1
PB 0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Port B data 7 to 0
These bits store data for port B pins
PBDR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it
retains its previous setting.
Rev. 3.00 Sep 27, 2006 page 312 of 872
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Section 9 I/O Ports
9.12.3
Pin Functions
Table 9.21 describes the selection of pin functions.
Table 9.21 Port B Pin Functions
Pin
Pin Functions and Selection Method
PB7/TP15/
DREQ1/
ADTRG
DMAC channel 1 settings (bits DTS2A to DTS0A and DTS2B to DTS0B in DTCR1A
and DTCR1B), bit TRGE in ADCR, bit NDER15 in NDERB, and bit PB7DDR in PBDDR
select the pin function as follows
PB7DDR
0
1
1
NDER15
—
0
1
PB7 input
PB7 output
TP15 output
Pin function
1
DREQ1 input*
2
ADTRG input*
Notes: 1. DREQ1 input under DMAC channel 1 settings (1) in the table below.
2. ADTRG input when TRGE = 1.
DMAC
channel
1 settings
(2)
DTS2A, DTS1A
Not both 1
DTS0A
(1)
(2)
(1)
(2)
(1)
Both 1
—
0
0
1
1
1
DTS2B
0
1
1
0
1
0
1
1
DTS1B
—
0
1
—
—
—
0
1
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Section 9 I/O Ports
Pin
Pin Functions and Selection Method
PB6/TP14/
DREQ0/
CS7
Bit CS7E in CSCR, DMAC channel 0 settings (bits DTS2A to DTS0A and DTS2B to
DTS0B in DTCR0A and DTCR0B), bit NDER14 in NDERB, and bit PB6DDR in PBDDR
select the pin function as follows
PB6DDR
0
1
1
—
CS7E
0
0
0
1
NDER14
—
0
1
—
PB6 input
PB6 output
TP14 output
—
Pin function
DREQ0 input*
Note:
*
DMAC
channel 0
settings
(2)
DTS2A, DTS1A
Not both 1
DTS0A
PB5/TP13/
TOCXB4
(1)
(2)
(1)
(2)
(1)
Both 1
—
0
0
1
1
1
DTS2B
0
1
1
0
1
0
1
1
DTS1B
—
0
1
—
—
—
0
1
ITU channel 4 settings (bit CMD1 in TFCR and bit EXB4 in TOER), bit NDER13 in
NDERB, and bit PB5DDR in PBDDR select the pin function as follows
EXB4, CMD1
Not both 1
Both 1
PB5DDR
0
1
1
—
NDER13
—
0
1
—
PB5 input
PB5 output
TP13 output
TOCXB4 output
Pin function
PB4/TP12/
TOCXA4
CS7 output
DREQ0 input under DMAC channel 0 settings (1) in the table below.
ITU channel 4 settings (bit CMD1 in TFCR and bit EXA4 in TOER), bit NDER12 in
NDERB, and bit PB4DDR in PBDDR select the pin function as follows
EXA4, CMD1
Not both 1
Both 1
PB4DDR
0
1
1
—
NDER12
—
0
1
—
PB4 input
PB4 output
TP12 output
TOCXA4 output
Pin function
Rev. 3.00 Sep 27, 2006 page 314 of 872
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Section 9 I/O Ports
Pin
Pin Functions and Selection Method
PB3/TP11/
TIOCB4
ITU channel 4 settings (bit PWM4 in TMDR, bit CMD1 in TFCR, bit EB4 in TOER, and
bits IOB2 to IOB0 in TIOR4), bit NDER11 in NDERB, and bit PB3DDR in PBDDR select
the pin function as follows
ITU channel 4
settings
(1) in table
below
PB3DDR
(2) in table
below
—
NDER11
Pin function
0
1
1
—
—
0
1
TIOCB4 output
PB3 input
PB3 output
TP11 output
TIOCB4 input*
Note:
*
TIOCB4 input when CMD1 = PWM4 = 0 and IOB2 = 1.
ITU channel 4
settings
(2)
(2)
(1)
(2)
(1)
EB4
0
1
CMD1
—
IOB2
—
0
0
0
1
—
IOB1
—
0
0
1
—
—
IOB0
—
0
1
—
—
—
0
1
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REJ09B0325-0300
Section 9 I/O Ports
Pin
Pin Functions and Selection Method
PB2/TP10/
TIOCA4
ITU channel 4 settings (bit CMD1 in TFCR, bit EA4 in TOER, bit PWM4 in TMDR, and
bits IOA2 to IOA0 in TIOR4), bit NDER10 in NDERB, and bit PB2DDR in PBDDR select
the pin function as follows
ITU channel 4
settings
(1) in table
below
PB2DDR
(2) in table
below
—
NDER10
Pin function
0
1
1
—
—
0
1
TIOCA4 output
PB2 input
PB2 output
TP10 output
TIOCA4 input*
Note:
*
TIOCA4 input when CMD1 = PWM4 = 0 and IOA2 = 1.
ITU channel 4
settings
(2)
(2)
(1)
(2)
EA4
0
CMD1
—
PWM4
—
IOA2
—
0
0
0
IOA1
—
0
0
IOA0
—
0
1
Rev. 3.00 Sep 27, 2006 page 316 of 872
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(1)
1
0
1
0
1
—
1
—
—
1
—
—
—
—
—
—
—
Section 9 I/O Ports
Pin
Pin Functions and Selection Method
PB1/TP9/
TIOCB3
ITU channel 3 settings (bit PWM3 in TMDR, bit CMD1 in TFCR, bit EB3 in TOER, and
bits IOB2 to IOB0 in TIOR3), bit NDER9 in NDERB, and bit PB1DDR in PBDDR select
the pin function as follows
ITU channel 3
settings
(1) in table
below
PB1DDR
(2) in table
below
—
NDER9
Pin function
0
1
1
—
—
0
1
TIOCB3 output
PB1 input
PB1 output
TP9 output
TIOCB3 input*
Note:
*
TIOCB3 input when CMD1 = PWM3 = 0 and IOB2 = 1.
ITU channel 3
settings
(2)
(2)
(1)
(2)
(1)
EB3
0
1
CMD1
—
IOB2
—
0
0
0
1
—
IOB1
—
0
0
1
—
—
IOB0
—
0
1
—
—
—
0
1
Rev. 3.00 Sep 27, 2006 page 317 of 872
REJ09B0325-0300
Section 9 I/O Ports
Pin
Pin Functions and Selection Method
PB0/TP8/
TIOCA3
ITU channel 3 settings (bit CMD1 in TFCR, bit EA3 in TOER, bit PWM3 in TMDR, and
bits IOA2 to IOA0 in TIOR3), bit NDER8 in NDERB, and bit PB0DDR in PBDDR select
the pin function as follows
ITU channel 3
settings
(1) in table
below
PB0DDR
(2) in table
below
—
NDER8
Pin function
0
1
1
—
—
0
1
TIOCA3 output
PB0 input
PB0 output
TP8 output
TIOCA3 input*
Note:
*
TIOCA3 input when CMD1 = PWM3 = 0 and IOA2 = 1.
ITU channel 3
settings
(2)
(2)
(1)
(2)
EA3
0
CMD1
—
PWM3
—
IOA2
—
0
0
0
IOA1
—
0
0
IOA0
—
0
1
Rev. 3.00 Sep 27, 2006 page 318 of 872
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(1)
1
0
1
0
1
—
1
—
—
1
—
—
—
—
—
—
—
Section 10 16-Bit Integrated Timer Unit (ITU)
Section 10 16-Bit Integrated Timer Unit (ITU)
10.1
Overview
The H8/3048B Group has a built-in 16-bit integrated timer unit (ITU) with five 16-bit timer
channels.
When the ITU is not used, it can be independently halted to conserve power. For details see
section 20.6, Module Standby Function.
10.1.1
Features
ITU features are listed below.
• Capability to process up to 12 pulse outputs or 10 pulse inputs
• Ten general registers (GRs, two per channel) with independently-assignable output compare or
input capture functions
• Selection of eight counter clock sources for each channel:
Internal clocks: φ, φ/2, φ/4, φ/8
External clocks: TCLKA, TCLKB, TCLKC, TCLKD
• Five operating modes selectable in all channels:
 Waveform output by compare match
Selection of 0 output, 1 output, or toggle output (only 0 or 1 output in channel 2)
 Input capture function
Rising edge, falling edge, or both edges (selectable)
 Counter clearing function
Counters can be cleared by compare match or input capture
 Synchronization
Two or more timer counters (TCNTs) can be preset simultaneously, or cleared
simultaneously by compare match or input capture. Counter synchronization enables
synchronous register input and output.
 PWM mode
PWM output can be provided with an arbitrary duty cycle. With synchronization, up to
five-phase PWM output is possible
• Phase counting mode selectable in channel 2
Two-phase encoder output can be counted automatically.
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Section 10 16-Bit Integrated Timer Unit (ITU)
• Three additional modes selectable in channels 3 and 4
 Reset-synchronized PWM mode
If channels 3 and 4 are combined, three-phase PWM output is possible with three pairs of
complementary waveforms.
 Complementary PWM mode
If channels 3 and 4 are combined, three-phase PWM output is possible with three pairs of
non-overlapping complementary waveforms.
 Buffering
Input capture registers can be double-buffered. Output compare registers can be updated
automatically.
• High-speed access via internal 16-bit bus
The 16-bit timer counters, general registers, and buffer registers can be accessed at high speed
via a 16-bit bus.
• Fifteen interrupt sources
Each channel has two compare match/input capture interrupts and an overflow interrupt. All
interrupts can be requested independently.
• Activation of DMA controller (DMAC)
Four of the compare match/input capture interrupts from channels 0 to 3 can start the DMAC.
• Output triggering of programmable timing pattern controller (TPC)
Compare match/input capture signals from channels 0 to 3 can be used as TPC output triggers.
Rev. 3.00 Sep 27, 2006 page 320 of 872
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Section 10 16-Bit Integrated Timer Unit (ITU)
Table 10.1 summarizes the ITU functions.
Table 10.1 ITU Functions
Item
Channel 0
Clock sources
Internal clocks: φ, φ/2, φ/4, φ/8
Channel 1
Channel 2
Channel 3
Channel 4
External clocks: TCLKA, TCLKB, TCLKC, TCLKD, selectable independently
General registers
(output compare/input
capture registers)
GRA0, GRB0
GRA1, GRB1
GRA2, GRB2
GRA3, GRB3
GRA4, GRB4
Buffer registers
—
—
—
BRA3, BRB3
BRA4, BRB4
Input/output pins
TIOCA0,
TIOCB0
TIOCA1,
TIOCB1
TIOCA2,
TIOCB2
TIOCA3,
TIOCB3
TIOCA4,
TIOCB4
Output pins
—
—
—
—
TOCXA4,
TOCXB4
Counter clearing function
GRA0/GRB0
compare
match or
input capture
GRA1/GRB1
compare
match or
input capture
GRA2/GRB2
compare
match or
input capture
GRA3/GRB3
compare
match or
input capture
GRA4/GRB4
compare
match or
input capture
Compare match 0
output
1
O
O
O
O
O
O
O
O
O
O
O
O
—
O
O
Input capture function
O
O
O
O
O
Synchronization
O
O
O
O
O
PWM mode
O
O
O
O
O
Reset-synchronized
PWM mode
—
—
—
O
O
Complementary PWM
mode
—
—
—
O
O
Phase counting mode
—
—
O
—
—
Buffering
—
—
—
O
O
DMAC activation
GRA0 compare GRA1 compare GRA2 compare GRA3 compare —
match or input match or input match or input match or input
capture
capture
capture
capture
Interrupt sources
Three sources
Three sources
Three sources
Three sources
Three sources
• tch/input
capture A0
• Compare
match/input
capture A1
• Compare
match/input
capture A2
• Compare
match/input
capture A3
• Compare
match/input
capture A4
• Compare
match/input
capture B1
• Compare
match/input
capture B2
• Compare
match/input
capture B3
• Compare
match/input
capture B4
• Overflow
• Overflow
• Overflow
• Overflow
Toggle
• Compare
match/input
capture B0
• Overflow
Legend: O: Available
—: Not available
Rev. 3.00 Sep 27, 2006 page 321 of 872
REJ09B0325-0300
Section 10 16-Bit Integrated Timer Unit (ITU)
10.1.2
Block Diagrams
ITU Block Diagram (Overall)
Figure 10.1 is a block diagram of the ITU.
TCLKA to TCLKD
IMIA0 to IMIA4
IMIB0 to IMIB4
OVI0 to OVI4
Clock selector
φ, φ/2, φ/4, φ/8
Control logic
TOCXA4, TOCXB4
TIOCA0 to TIOCA4
TIOCB0 to TIOCB4
TSTR
TSNC
TMDR
TFCR
Module data bus
Legend:
TOER: Timer output master enable register (8 bits)
TOCR: Timer output control register (8 bits)
TSTR: Timer start register (8 bits)
TSNC: Timer synchro register (8 bits)
TMDR: Timer mode register (8 bits)
TFCR: Timer function control register (8 bits)
Figure 10.1 ITU Block Diagram (Overall)
Rev. 3.00 Sep 27, 2006 page 322 of 872
REJ09B0325-0300
Internal data bus
TOCR
Bus interface
16-bit timer channel 0
16-bit timer channel 1
16-bit timer channel 2
16-bit timer channel 3
16-bit timer channel 4
TOER
Section 10 16-Bit Integrated Timer Unit (ITU)
Block Diagram of Channels 0 and 1
ITU channels 0 and 1 are functionally identical. Both have the structure shown in figure 10.2.
TCLKA to TCLKD
φ, φ/2, φ/4, φ/8
TIOCA0
TIOCB0
Clock selector
Control logic
IMIA0
IMIB0
OVI0
TSR
TIER
TIOR
TCR
GRB
GRA
TCNT
Comparator
Module data bus
Legend:
TCNT:
GRA, GRB:
TCR:
TIOR:
TIER:
TSR:
Timer counter (16 bits)
General registers A and B (input capture/output compare registers) (16 bits × 2)
Timer control register (8 bits)
Timer I/O control register (8 bits)
Timer interrupt enable register (8 bits)
Timer status register (8 bits)
Figure 10.2 Block Diagram of Channels 0 and 1 (for Channel 0)
Rev. 3.00 Sep 27, 2006 page 323 of 872
REJ09B0325-0300
Section 10 16-Bit Integrated Timer Unit (ITU)
Block Diagram of Channel 2
Figure 10.3 is a block diagram of channel 2. This is the channel that provides only 0 output and 1
output.
TCLKA to TCLKD
TIOCA2
TIOCB2
Clock selector
φ, φ/2, φ/4, φ/8
Control logic
IMIA2
IMIB2
OVI2
TSR2
TIER2
TIOR2
TCR2
GRB2
GRA2
TCNT2
Comparator
Module data bus
Legend:
Timer counter 2 (16 bits)
TCNT2:
GRA2, GRB2: General registers A2 and B2 (input capture/output compare registers)
(16 bits × 2)
Timer control register 2 (8 bits)
TCR2:
Timer I/O control register 2 (8 bits)
TIOR2:
Timer interrupt enable register 2 (8 bits)
TIER2:
Timer status register 2 (8 bits)
TSR2:
Figure 10.3 Block Diagram of Channel 2
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Section 10 16-Bit Integrated Timer Unit (ITU)
Block Diagrams of Channels 3 and 4
Figure 10.4 is a block diagram of channel 3. Figure 10.5 is a block diagram of channel 4.
TCLKA to
TCLKD
φ, φ/2,
φ/4, φ/8
TIOCA3
TIOCB3
Clock selector
Control logic
IMIA3
IMIB3
OVI3
TSR3
TIER3
TIOR3
TCR3
GRB3
BRB3
GRA3
BRA3
TCNT3
Comparator
Module data bus
Legend:
Timer counter 3 (16 bits)
TCNT3:
GRA3, GRB3: General registers A3 and B3 (input capture/output compare registers)
(16 bits × 2)
BRA3, BRB3: Buffer registers A3 and B3 (input capture/output compare buffer registers)
(16 bits × 2)
Timer control register 3 (8 bits)
TCR3:
TIOR3:
Timer I/O control register 3 (8 bits)
TIER3:
Timer interrupt enable register 3 (8 bits)
TSR3:
Timer status register 3 (8 bits)
Figure 10.4 Block Diagram of Channel 3
Rev. 3.00 Sep 27, 2006 page 325 of 872
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Section 10 16-Bit Integrated Timer Unit (ITU)
TCLKA to
TCLKD
φ, φ/2,
φ/4, φ/8
TOCXA4
TOCXB4
TIOCA4
TIOCB4
IMIA4
IMIB4
OVI4
Clock selector
Control logic
TSR4
TIER4
TIOR4
TCR4
GRB4
BRB4
GRA4
BRA4
TCNT4
Comparator
Module data bus
Legend:
Timer counter 4 (16 bits)
TCNT4:
GRA4, GRB4: General registers A4 and B4 (input capture/output compare registers)
(16 bits × 2)
BRA4, BRB4: Buffer registers A4 and B4 (input capture/output compare buffer registers)
(16 bits × 2)
Timer control register 4 (8 bits)
TCR4:
TIOR4:
Timer I/O control register 4 (8 bits)
TIER4:
Timer interrupt enable register 4 (8 bits)
TSR4:
Timer status register 4 (8 bits)
Figure 10.5 Block Diagram of Channel 4
Rev. 3.00 Sep 27, 2006 page 326 of 872
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.1.3
Input/Output Pins
Table 10.2 summarizes the ITU pins.
Table 10.2 ITU Pins
Channel
Name
Abbreviation
Input/
Output
Common
Clock input A
TCLKA
Input
External clock A input pin
(phase-A input pin in phase counting mode)
Clock input B
TCLKB
Input
External clock B input pin
(phase-B input pin in phase counting mode)
Clock input C
TCLKC
Input
External clock C input pin
Clock input D
TCLKD
Input
External clock D input pin
Input capture/output
compare A0
TIOCA0
Input/
output
GRA0 output compare or input capture pin PWM
output pin in PWM mode
Input capture/output
compare B0
TIOCB0
Input/
output
GRB0 output compare or input capture pin
Input capture/output
compare A1
TIOCA1
Input/
output
GRA1 output compare or input capture pin PWM
output pin in PWM mode
Input capture/output
compare B1
TIOCB1
Input/
output
GRB1 output compare or input capture pin
Input capture/output
compare A2
TIOCA2
Input/
output
GRA2 output compare or input capture pin PWM
output pin in PWM mode
Input capture/output
compare B2
TIOCB2
Input/
output
GRB2 output compare or input capture pin
Input capture/output
compare A3
TIOCA3
Input/
output
GRA3 output compare or input capture pin PWM
output pin in PWM mode, complementary PWM
mode, or reset-synchronized PWM mode
Input capture/output
compare B3
TIOCB3
Input/
output
GRB3 output compare or input capture pin PWM
output pin in complementary PWM mode or
reset-synchronized PWM mode
Input capture/output
compare A4
TIOCA4
Input/
output
GRA4 output compare or input capture pin PWM
output pin in PWM mode, complementary PWM
mode, or reset-synchronized PWM mode
Input capture/output
compare B4
TIOCB4
Input/
output
GRB4 output compare or input capture pin PWM
output pin in complementary PWM mode or
reset-synchronized PWM mode
Output compare XA4
TOCXA4
Output
PWM output pin in complementary PWM mode
or reset-synchronized PWM mode
Output compare XB4
TOCXB4
Output
PWM output pin in complementary PWM mode
or reset-synchronized PWM mode
0
1
2
3
4
Function
Rev. 3.00 Sep 27, 2006 page 327 of 872
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.1.4
Register Configuration
Table 10.3 summarizes the ITU registers.
Table 10.3 ITU Registers
Channel
Address*
Name
Abbreviation
R/W
Initial
Value
Common
H'FF60
Timer start register
TSTR
R/W
H'E0
H'FF61
Timer synchro register
TSNC
R/W
H'E0
H'FF62
Timer mode register
TMDR
R/W
H'80
H'FF63
Timer function control register
TFCR
R/W
H'C0
H'FF90
Timer output master enable register
TOER
R/W
H'FF
H'FF91
Timer output control register
TOCR
R/W
H'FF
H'FF64
Timer control register 0
TCR0
R/W
H'80
H'FF65
Timer I/O control register 0
TIOR0
R/W
H'88
H'FF66
Timer interrupt enable register 0
TIER0
R/W
0
1
1
H'FF67
Timer status register 0
TSR0
R/(W)*
H'FF68
Timer counter 0 (high)
TCNT0H
R/W
H'F8
2
H'F8
H'00
H'FF69
Timer counter 0 (low)
TCNT0L
R/W
H'00
H'FF6A
General register A0 (high)
GRA0H
R/W
H'FF
H'FF6B
General register A0 (low)
GRA0L
R/W
H'FF
H'FF6C
General register B0 (high)
GRB0H
R/W
H'FF
H'FF6D
General register B0 (low)
GRB0L
R/W
H'FF
H'FF6E
Timer control register 1
TCR1
R/W
H'80
H'FF6F
Timer I/O control register 1
TIOR1
R/W
H'88
H'FF70
Timer interrupt enable register 1
TIER1
R/W
H'F8
H'FF71
Timer status register 1
TSR1
R/(W)*
H'FF72
Timer counter 1 (high)
TCNT1H
R/W
H'00
H'FF73
Timer counter 1 (low)
TCNT1L
R/W
H'00
H'FF74
General register A1 (high)
GRA1H
R/W
H'FF
H'FF75
General register A1 (low)
GRA1L
R/W
H'FF
H'FF76
General register B1 (high)
GRB1H
R/W
H'FF
H'FF77
General register B1 (low)
GRB1L
R/W
H'FF
Rev. 3.00 Sep 27, 2006 page 328 of 872
REJ09B0325-0300
2
H'F8
Section 10 16-Bit Integrated Timer Unit (ITU)
Channel
Address*
Name
Abbreviation
R/W
Initial
Value
2
H'FF78
Timer control register 2
TCR2
R/W
H'80
H'FF79
Timer I/O control register 2
TIOR2
R/W
H'88
H'FF7A
Timer interrupt enable register 2
TIER2
R/W
3
1
H'F8
H'FF7B
Timer status register 2
TSR2
R/(W)*
H'FF7C
Timer counter 2 (high)
TCNT2H
R/W
H'00
H'FF7D
Timer counter 2 (low)
TCNT2L
R/W
H'00
H'FF7E
General register A2 (high)
GRA2H
R/W
H'FF
H'FF7F
General register A2 (low)
GRA2L
R/W
H'FF
H'FF80
General register B2 (high)
GRB2H
R/W
H'FF
H'FF81
General register B2 (low)
GRB2L
R/W
H'FF
H'FF82
Timer control register 3
TCR3
R/W
H'80
H'FF83
Timer I/O control register 3
TIOR3
R/W
H'88
H'FF84
Timer interrupt enable register 3
TIER3
R/W
2
H'F8
H'F8
H'FF85
Timer status register 3
TSR3
R/(W)*
H'FF86
Timer counter 3 (high)
TCNT3H
R/W
H'00
H'FF87
Timer counter 3 (low)
TCNT3L
R/W
H'00
H'FF88
General register A3 (high)
GRA3H
R/W
H'FF
2
H'F8
H'FF89
General register A3 (low)
GRA3L
R/W
H'FF
H'FF8A
General register B3 (high)
GRB3H
R/W
H'FF
H'FF8B
General register B3 (low)
GRB3L
R/W
H'FF
H'FF8C
Buffer register A3 (high)
BRA3H
R/W
H'FF
H'FF8D
Buffer register A3 (low)
BRA3L
R/W
H'FF
H'FF8E
Buffer register B3 (high)
BRB3H
R/W
H'FF
H'FF8F
Buffer register B3 (low)
BRB3L
R/W
H'FF
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Section 10 16-Bit Integrated Timer Unit (ITU)
Channel
Address*
Name
Abbreviation
R/W
Initial
Value
4
H'FF92
Timer control register 4
TCR4
R/W
H'80
H'FF93
Timer I/O control register 4
TIOR4
R/W
H'88
H'FF94
Timer interrupt enable register 4
TIER4
R/W
1
H'F8
H'FF95
Timer status register 4
TSR4
R/(W)*
H'FF96
Timer counter 4 (high)
TCNT4H
R/W
H'00
H'FF97
Timer counter 4 (low)
TCNT4L
R/W
H'00
H'FF98
General register A4 (high)
GRA4H
R/W
H'FF
H'FF99
General register A4 (low)
GRA4L
R/W
H'FF
H'FF9A
General register B4 (high)
GRB4H
R/W
H'FF
H'FF9B
General register B4 (low)
GRB4L
R/W
H'FF
H'FF9C
Buffer register A4 (high)
BRA4H
R/W
H'FF
2
H'F8
H'FF9D
Buffer register A4 (low)
BRA4L
R/W
H'FF
H'FF9E
Buffer register B4 (high)
BRB4H
R/W
H'FF
H'FF9F
Buffer register B4 (low)
BRB4L
R/W
H'FF
Notes: 1. Lower 16 bits of the address.
2. Only 0 can be written, to clear flags.
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.2
Register Descriptions
10.2.1
Timer Start Register (TSTR)
TSTR is an 8-bit readable/writable register that starts and stops the timer counter (TCNT) in
channels 0 to 4.
Bit
7
6
5
4
3
2
1
0



STR4
STR3
STR2
STR1
STR0
Initial value
1
1
1
0
0
0
0
0
Read/Write



R/W
R/W
R/W
R/W
R/W
Reserved bits
Counter start 4 to 0
These bits start and
stop TCNT4 to TCNT0
TSTR is initialized to H'E0 by a reset and in standby mode.
Bits 7 to 5—Reserved: Read-only bits, always read as 1.
Bit 4—Counter Start 4 (STR4): Starts and stops timer counter 4 (TCNT4).
Bit 4: STR4
Description
0
TCNT4 is halted
1
TCNT4 is counting
(Initial value)
Bit 3—Counter Start 3 (STR3): Starts and stops timer counter 3 (TCNT3).
Bit 3: STR3
Description
0
TCNT3 is halted
1
TCNT3 is counting
(Initial value)
Bit 2—Counter Start 2 (STR2): Starts and stops timer counter 2 (TCNT2).
Bit 2: STR2
Description
0
TCNT2 is halted
1
TCNT2 is counting
(Initial value)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Bit 1—Counter Start 1 (STR1): Starts and stops timer counter 1 (TCNT1).
Bit 1: STR1
Description
0
TCNT1 is halted
1
TCNT1 is counting
(Initial value)
Bit 0—Counter Start 0 (STR0): Starts and stops timer counter 0 (TCNT0).
Bit 0: STR0
Description
0
TCNT0 is halted
1
TCNT0 is counting
10.2.2
(Initial value)
Timer Synchro Register (TSNC)
TSNC is an 8-bit readable/writable register that selects whether channels 0 to 4 operate
independently or synchronously. Channels are synchronized by setting the corresponding bits to 1.
Bit
7
6
5
4
3
2
1
0



SYNC4
SYNC3
SYNC2
SYNC1
SYNC0
Initial value
1
1
1
0
0
0
0
0
Read/Write



R/W
R/W
R/W
R/W
R/W
Reserved bits
Timer sync 4 to 0
These bits synchronize
channels 4 to 0
TSNC is initialized to H'E0 by a reset and in standby mode.
Bits 7 to 5—Reserved: Read-only bits, always read as 1.
Bit 4—Timer Sync 4 (SYNC4): Selects whether channel 4 operates independently or
synchronously.
Bit 4: SYNC4
Description
0
Channel 4’s timer counter (TCNT4) operates independently
TCNT4 is preset and cleared independently of other channels
1
Channel 4 operates synchronously
TCNT4 can be synchronously preset and cleared
Rev. 3.00 Sep 27, 2006 page 332 of 872
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(Initial value)
Section 10 16-Bit Integrated Timer Unit (ITU)
Bit 3—Timer Sync 3 (SYNC3): Selects whether channel 3 operates independently or
synchronously.
Bit 3: SYNC3
Description
0
Channel 3’s timer counter (TCNT3) operates independently
(Initial value)
TCNT3 is preset and cleared independently of other channels
1
Channel 3 operates synchronously
TCNT3 can be synchronously preset and cleared
Bit 2—Timer Sync 2 (SYNC2): Selects whether channel 2 operates independently or
synchronously.
Bit 2: SYNC2
Description
0
Channel 2’s timer counter (TCNT2) operates independently
(Initial value)
TCNT2 is preset and cleared independently of other channels
1
Channel 2 operates synchronously
TCNT2 can be synchronously preset and cleared
Bit 1—Timer Sync 1 (SYNC1): Selects whether channel 1 operates independently or
synchronously.
Bit 1: SYNC1
Description
0
Channel 1’s timer counter (TCNT1) operates independently
(Initial value)
TCNT1 is preset and cleared independently of other channels
1
Channel 1 operates synchronously
TCNT1 can be synchronously preset and cleared
Bit 0—Timer Sync 0 (SYNC0): Selects whether channel 0 operates independently or
synchronously.
Bit 0: Bit 0
Description
0
Channel 0’s timer counter (TCNT0) operates independently
(Initial value)
TCNT0 is preset and cleared independently of other channels
1
Channel 0 operates synchronously
TCNT0 can be synchronously preset and cleared
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.2.3
Timer Mode Register (TMDR)
TMDR is an 8-bit readable/writable register that selects PWM mode for channels 0 to 4. It also
selects phase counting mode and the overflow flag (OVF) setting conditions for channel 2.
Bit
7
6
5
4
3
2
1
0

MDF
FDIR
PWM4
PWM3
PWM2
PWM1
PWM0
Initial value
1
0
0
0
0
0
0
0
Read/Write

R/W
R/W
R/W
R/W
R/W
R/W
R/W
PWM mode 4 to 0
These bits select PWM
mode for channels 4 to 0
Flag direction
Selects the setting condition for the overflow
flag (OVF) in timer status register 2 (TSR2)
Phase counting mode flag
Selects phase counting mode for channel 2
Reserved bit
TMDR is initialized to H'80 by a reset and in standby mode.
Bit 7—Reserved: Read-only bit, always read as 1.
Bit 6—Phase Counting Mode Flag (MDF): Selects whether channel 2 operates normally or in
phase counting mode.
Bit 6: MDF
Description
0
Channel 2 operates normally
1
Channel 2 operates in phase counting mode
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REJ09B0325-0300
(Initial value)
Section 10 16-Bit Integrated Timer Unit (ITU)
When MDF is set to 1 to select phase counting mode, TCNT2 operates as an up/down-counter and
pins TCLKA and TCLKB become counter clock input pins. TCNT2 counts both rising and falling
edges of TCLKA and TCLKB, and counts up or down as follows.
Counting Direction
Down-Counting
TCLKA pin
↑
Low
TCLKB pin
High
↑
Up-Counting
↓
High
Low
↓
↑
High
Low
↑
↓
Low
High
↓
In phase counting mode channel 2 operates as above regardless of the external clock edges
selected by bits CKEG1 and CKEG0 and the clock source selected by bits TPSC2 to TPSC0 in
TCR2. Phase counting mode takes precedence over these settings.
The counter clearing condition selected by the CCLR1 and CCLR0 bits in TCR2 and the compare
match/input capture settings and interrupt functions of TIOR2, TIER2, and TSR2 remain effective
in phase counting mode.
Bit 5—Flag Direction (FDIR): Designates the setting condition for the OVF flag in TSR2. The
FDIR designation is valid in all modes in channel 2.
Bit 5: FDIR
Description
0
OVF is set to 1 in TSR2 when TCNT2 overflows or underflows
1
OVF is set to 1 in TSR2 when TCNT2 overflows
(Initial value)
Bit 4—PWM Mode 4 (PWM4): Selects whether channel 4 operates normally or in PWM mode.
Bit 4: PWM4
Description
0
Channel 4 operates normally
1
Channel 4 operates in PWM mode
(Initial value)
When bit PWM4 is set to 1 to select PWM mode, pin TIOCA4 becomes a PWM output pin. The
output goes to 1 at compare match with GRA4, and to 0 at compare match with GRB4.
If complementary PWM mode or reset-synchronized PWM mode is selected by bits CMD1 and
CMD0 in TFCR, the CMD1 and CMD0 setting takes precedence and the PWM4 setting is
ignored.
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Section 10 16-Bit Integrated Timer Unit (ITU)
Bit 3—PWM Mode 3 (PWM3): Selects whether channel 3 operates normally or in PWM mode.
Bit 3: PWM3
Description
0
Channel 3 operates normally
1
Channel 3 operates in PWM mode
(Initial value)
When bit PWM3 is set to 1 to select PWM mode, pin TIOCA3 becomes a PWM output pin. The
output goes to 1 at compare match with GRA3, and to 0 at compare match with GRB3.
If complementary PWM mode or reset-synchronized PWM mode is selected by bits CMD1 and
CMD0 in TFCR, the CMD1 and CMD0 setting takes precedence and the PWM3 setting is
ignored.
Bit 2—PWM Mode 2 (PWM2): Selects whether channel 2 operates normally or in PWM mode.
Bit 2: PWM2
Description
0
Channel 2 operates normally
1
Channel 2 operates in PWM mode
(Initial value)
When bit PWM2 is set to 1 to select PWM mode, pin TIOCA2 becomes a PWM output pin. The
output goes to 1 at compare match with GRA2, and to 0 at compare match with GRB2.
Bit 1—PWM Mode 1 (PWM1): Selects whether channel 1 operates normally or in PWM mode.
Bit 1: PWM1
Description
0
Channel 1 operates normally
1
Channel 1 operates in PWM mode
(Initial value)
When bit PWM1 is set to 1 to select PWM mode, pin TIOCA1 becomes a PWM output pin. The
output goes to 1 at compare match with GRA1, and to 0 at compare match with GRB1.
Bit 0—PWM Mode 0 (PWM0): Selects whether channel 0 operates normally or in PWM mode.
Bit 0: PWM0
Description
0
Channel 0 operates normally
1
Channel 0 operates in PWM mode
(Initial value)
When bit PWM0 is set to 1 to select PWM mode, pin TIOCA0 becomes a PWM output pin. The
output goes to 1 at compare match with GRA0, and to 0 at compare match with GRB0.
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.2.4
Timer Function Control Register (TFCR)
TFCR is an 8-bit readable/writable register that selects complementary PWM mode, resetsynchronized PWM mode, and buffering for channels 3 and 4.
Bit
7
6
5
4
3
2
1
0


CMD1
CMD0
BFB4
BFA4
BFB3
BFA3
Initial value
1
1
0
0
0
0
0
0
Read/Write


R/W
R/W
R/W
R/W
R/W
R/W
Reserved bits
Combination mode 1/0
These bits select complementary
PWM mode or reset-synchronized
PWM mode for channels 3 and 4
Buffer mode B4 and A4
These bits select buffering of
general registers (GRB4 and
GRA4) by buffer registers
(BRB4 and BRA4) in channel 4
Buffer mode B3 and A3
These bits select buffering
of general registers (GRB3
and GRA3) by buffer
registers (BRB3 and BRA3)
in channel 3
TFCR is initialized to H'C0 by a reset and in standby mode.
Bits 7 and 6—Reserved: Read-only bits, always read as 1.
Bits 5 and 4—Combination Mode 1 and 0 (CMD1, CMD0): These bits select whether channels
3 and 4 operate in normal mode, complementary PWM mode, or reset-synchronized PWM mode.
Bit 5: CMD1
Bit 4: CMD0
Description
0
0
Channels 3 and 4 operate normally
(Initial value)
1
1
0
Channels 3 and 4 operate together in complementary
PWM mode
1
Channels 3 and 4 operate together in reset-synchronized
PWM mode
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Section 10 16-Bit Integrated Timer Unit (ITU)
Before selecting reset-synchronized PWM mode or complementary PWM mode, halt the timer
counter or counters that will be used in these modes.
When these bits select complementary PWM mode or reset-synchronized PWM mode, they take
precedence over the setting of the PWM mode bits (PWM4 and PWM3) in TMDR. Settings of
complementary PWM mode or reset-synchronized PWM mode and settings of timer sync bits
SYNC4 and SYNC3 in TSNC are valid simultaneously, however, when complementary PWM
mode is selected, channels 3 and 4 must not be synchronized (do not set bits SYNC3 and SYNC4
both to 1 in TSNC).
Bit 3—Buffer Mode B4 (BFB4): Selects whether GRB4 operates normally in channel 4, or
whether GRB4 is buffered by BRB4.
Bit 3: BFB4
Description
0
GRB4 operates normally
1
GRB4 is buffered by BRB4
(Initial value)
Bit 2—Buffer Mode A4 (BFA4): Selects whether GRA4 operates normally in channel 4, or
whether GRA4 is buffered by BRA4.
Bit 2: BFA4
Description
0
GRA4 operates normally
1
GRA4 is buffered by BRA4
(Initial value)
Bit 1—Buffer Mode B3 (BFB3): Selects whether GRB3 operates normally in channel 3, or
whether GRB3 is buffered by BRB3.
Bit 1: BFB3
Description
0
GRB3 operates normally
1
GRB3 is buffered by BRB3
(Initial value)
Bit 0—Buffer Mode A3 (BFA3): Selects whether GRA3 operates normally in channel 3, or
whether GRA3 is buffered by BRA3.
Bit 0: BFA3
Description
0
GRA3 operates normally
1
GRA3 is buffered by BRA3
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REJ09B0325-0300
(Initial value)
Section 10 16-Bit Integrated Timer Unit (ITU)
10.2.5
Timer Output Master Enable Register (TOER)
TOER is an 8-bit readable/writable register that enables or disables output settings for channels 3
and 4.
Bit
7
6
5
4
3
2
1
0


EXB4
EXA4
EB3
EB4
EA4
EA3
Initial value
1
1
1
1
1
1
1
1
Read/Write


R/W
R/W
R/W
R/W
R/W
R/W
Reserved bits
Master enable TOCXA4, TOCXB4
These bits enable or disable output
settings for pins TOCXA4 and TOCXB4
Master enable TIOCA3, TIOCB3 , TIOCA4, TIOCB4
These bits enable or disable output settings for pins
TIOCA3, TIOCB3 , TIOCA4, and TIOCB4
TOER is initialized to H'FF by a reset and in standby mode.
Bits 7 and 6—Reserved: Read-only bits, always read as 1.
Bit 5—Master Enable TOCXB4 (EXB4): Enables or disables ITU output at pin TOCXB4.
Bit 5: EXB4
Description
0
TOCXB4 output is disabled regardless of TFCR settings (TOCXB4 operates as
a generic input/output pin).
If XTGD = 0, EXB4 is cleared to 0 when input capture A occurs in channel 1.
1
TOCXB4 is enabled for output according to TFCR settings
(Initial value)
Bit 4—Master Enable TOCXA4 (EXA4): Enables or disables ITU output at pin TOCXA4.
Bit 4: EXA4
Description
0
TOCXA4 output is disabled regardless of TFCR settings (TOCXA4 operates as
a generic input/output pin).
If XTGD = 0, EXA4 is cleared to 0 when input capture A occurs in channel 1.
1
TOCXA4 is enabled for output according to TFCR settings
(Initial value)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Bit 3—Master Enable TIOCB3 (EB3): Enables or disables ITU output at pin TIOCB3.
Bit 3: EB3
Description
0
TIOCB3 output is disabled regardless of TIOR3 and TFCR settings (TIOCB3
operates as a generic input/output pin).
If XTGD = 0, EB3 is cleared to 0 when input capture A occurs in channel 1.
1
TIOCB3 is enabled for output according to TIOR3 and TFCR settings
(Initial value)
Bit 2—Master Enable TIOCB4 (EB4): Enables or disables ITU output at pin TIOCB4.
Bit 2: EB4
Description
0
TIOCB4 output is disabled regardless of TIOR4 and TFCR settings (TIOCB4
operates as a generic input/output pin).
1
TIOCB4 is enabled for output according to TIOR4 and TFCR settings
(Initial value)
If XTGD = 0, EB4 is cleared to 0 when input capture A occurs in channel 1.
Bit 1—Master Enable TIOCA4 (EA4): Enables or disables ITU output at pin TIOCA4.
Bit 1: EA4
Description
0
TIOCA4 output is disabled regardless of TIOR4, TMDR, and TFCR settings
(TIOCA4 operates as a generic input/output pin).
If XTGD = 0, EA4 is cleared to 0 when input capture A occurs in channel 1.
1
TIOCA4 is enabled for output according to TIOR4, TMDR, and TFCR settings
(Initial value)
Bit 0—Master Enable TIOCA3 (EA3): Enables or disables ITU output at pin TIOCA3.
Bit 0: EA3
Description
0
TIOCA3 output is disabled regardless of TIOR3, TMDR, and TFCR settings
(TIOCA3 operates as a generic input/output pin).
If XTGD = 0, EA3 is cleared to 0 when input capture A occurs in channel 1.
1
TIOCA3 is enabled for output according to TIOR3, TMDR, and TFCR settings
(Initial value)
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.2.6
Timer Output Control Register (TOCR)
TOCR is an 8-bit readable/writable register that selects externally triggered disabling of output in
complementary PWM mode and reset-synchronized PWM mode, and inverts the output levels.
Bit
7
6
5
4
3
2
1
0



XTGD


OLS4
OLS3
Initial value
1
1
1
1
1
1
1
1
Read/Write



R/W


R/W
R/W
Reserved bits
Output level select 3, 4
These bits select output
levels in complementary
PWM mode and resetsynchronized PWM mode
Reserved bits
External trigger disable
Selects externally triggered disabling of output in
complementary PWM mode and reset-synchronized
PWM mode
The settings of the XTGD, OLS4, and OLS3 bits are valid only in complementary PWM mode
and reset-synchronized PWM mode. These settings do not affect other modes.
TOCR is initialized to H'FF by a reset and in standby mode.
Bits 7 to 5—Reserved: Read-only bits, always read as 1.
Bit 4—External Trigger Disable (XTGD): Selects externally triggered disabling of ITU output
in complementary PWM mode and reset-synchronized PWM mode.
Bit 4: XTGD
Description
0
Input capture A in channel 1 is used as an external trigger signal in
complementary PWM mode and reset-synchronized PWM mode.
When an external trigger occurs, bits 5 to 0 in TOER are cleared to 0, disabling
ITU output.
1
External triggering is disabled
(Initial value)
Bits 3 and 2—Reserved: Read-only bits, always read as 1.
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Section 10 16-Bit Integrated Timer Unit (ITU)
Bit 1—Output Level Select 4 (OLS4): Selects output levels in complementary PWM mode and
reset-synchronized PWM mode.
Bit 1: OLS4
Description
0
TIOCA3, TIOCA4, and TIOCB4 outputs are inverted
1
TIOCA3, TIOCA4, and TIOCB4 outputs are not inverted
(Initial value)
Bit 0—Output Level Select 3 (OLS3): Selects output levels in complementary PWM mode and
reset-synchronized PWM mode.
Bit 0: OLS3
Description
0
TIOCB3, TOCXA4, and TOCXB4 outputs are inverted
1
TIOCB3, TOCXA4, and TOCXB4 outputs are not inverted
10.2.7
(Initial value)
Timer Counters (TCNT)
TCNT is a 16-bit counter. The ITU has five TCNTs, one for each channel.
Channel
Abbreviation
Function
0
TCNT0
Up-counter
1
TCNT1
2
TCNT2
Phase counting mode: up/down-counter
Other modes: up-counter
3
TCNT3
Complementary PWM mode: up/down-counter
4
TCNT4
Other modes: up-counter
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Each TCNT is a 16-bit readable/writable register that counts pulse inputs from a clock source. The
clock source is selected by bits TPSC2 to TPSC0 in TCR.
TCNT0 and TCNT1 are up-counters. TCNT2 is an up/down-counter in phase counting mode and
an up-counter in other modes. TCNT3 and TCNT4 are up/down-counters in complementary PWM
mode and up-counters in other modes.
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Section 10 16-Bit Integrated Timer Unit (ITU)
TCNT can be cleared to H'0000 by compare match with GRA or GRB or by input capture to GRA
or GRB (counter clearing function) in the same channel.
When TCNT overflows (changes from H'FFFF to H'0000), the OVF flag is set to 1 in TSR of the
corresponding channel.
When TCNT underflows (changes from H'0000 to H'FFFF), the OVF flag is set to 1 in TSR of the
corresponding channel.
The TCNTs are linked to the CPU by an internal 16-bit bus and can be written or read by either
word access or byte access.
Each TCNT is initialized to H'0000 by a reset and in standby mode.
10.2.8
General Registers A, B (GRA, GRB)
The general registers are 16-bit registers. The ITU has 10 general registers, two in each channel.
Channel
Abbreviation
Function
0
GRA0, GRB0
Output compare/input capture register
1
GRA1, GRB1
2
GRA2, GRB2
3
GRA3, GRB3
4
GRA4, GRB4
Bit
Initial value
Read/Write
Output compare/input capture register; can be buffered by
buffer registers BRA and BRB
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
A general register is a 16-bit readable/writable register that can function as either an output
compare register or an input capture register. The function is selected by settings in TIOR.
When a general register is used as an output compare register, its value is constantly compared
with the TCNT value. When the two values match (compare match), the IMFA or IMFB flag is set
to 1 in TSR. Compare match output can be selected in TIOR.
When a general register is used as an input capture register, rising edges, falling edges, or both
edges of an external input capture signal are detected and the current TCNT value is stored in the
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Section 10 16-Bit Integrated Timer Unit (ITU)
general register. The corresponding IMFA or IMFB flag in TSR is set to 1 at the same time. The
valid edge or edges of the input capture signal are selected in TIOR.
TIOR settings are ignored in PWM mode, complementary PWM mode, and reset-synchronized
PWM mode.
General registers are linked to the CPU by an internal 16-bit bus and can be written or read by
either word access or byte access.
General registers are initialized to the output compare function (with no output signal) by a reset
and in standby mode. The initial value is H'FFFF.
10.2.9
Buffer Registers A, B (BRA, BRB)
The buffer registers are 16-bit registers. The ITU has four buffer registers, two each in channels 3
and 4.
Channel
Abbreviation
Function
3
BRA3, BRB3
Used for buffering
4
BRA4, BRB4
•
When the corresponding GRA or GRB functions as an
output compare register, BRA or BRB can function as an
output compare buffer register: the BRA or BRB value is
automatically transferred to GRA or GRB at compare match
•
When the corresponding GRA or GRB functions as an input
capture register, BRA or BRB can function as an input
capture buffer register: the GRA or GRB value is
automatically transferred to BRA or BRB at input capture
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
A buffer register is a 16-bit readable/writable register that is used when buffering is selected.
Buffering can be selected independently by bits BFB4, BFA4, BFB3, and BFA3 in TFCR.
The buffer register and general register operate as a pair. When the general register functions as an
output compare register, the buffer register functions as an output compare buffer register. When
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Section 10 16-Bit Integrated Timer Unit (ITU)
the general register functions as an input capture register, the buffer register functions as an input
capture buffer register.
The buffer registers are linked to the CPU by an internal 16-bit bus and can be written or read by
either word or byte access.
Buffer registers are initialized to H'FFFF by a reset and in standby mode.
10.2.10 Timer Control Registers (TCR)
TCR is an 8-bit register. The ITU has five TCRs, one in each channel.
Channel
Abbreviation
Function
0
TCR0
1
TCR1
2
TCR2
TCR controls the timer counter. The TCRs in all channels are
functionally identical. When phase counting mode is selected in
channel 2, the settings of bits CKEG1 and CKEG0 and TPSC2
to TPSC0 in TCR2 are ignored.
3
TCR3
4
TCR4
Bit
7
6
5

CCLR1
CCLR0
4
3
CKEG1 CKEG0
2
1
0
TPSC2
TPSC1
TPSC0
Initial value
1
0
0
0
0
0
0
0
Read/Write

R/W
R/W
R/W
R/W
R/W
R/W
R/W
Timer prescaler 2 to 0
These bits select the
counter clock
Clock edge 1, 0
These bits select external clock edges
Counter clear 1, 0
These bits select the counter clear source
Reserved bit
Each TCR is an 8-bit readable/writable register that selects the timer counter clock source, selects
the edge or edges of external clock sources, and selects how the counter is cleared.
TCR is initialized to H'80 by a reset and in standby mode.
Bit 7—Reserved: Read-only bit, always read as 1.
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Section 10 16-Bit Integrated Timer Unit (ITU)
Bits 6 and 5—Counter Clear 1 and 0 (CCLR1, CCLR0): These bits select how TCNT is
cleared.
Bit 6: CCLR1
Bit 5: CCLR0
Description
0
0
TCNT is not cleared
1
TCNT is cleared by GRA compare match or input
1
capture*
0
TCNT is cleared by GRB compare match or input
1
capture*
1
Synchronous clear: TCNT is cleared in synchronization
2
with other synchronized timers*
1
(Initial value)
Notes: 1. TCNT is cleared by compare match when the general register functions as an output
compare register, and by input capture when the general register functions as an input
capture register.
2. Selected in TSNC.
Bits 4 and 3—Clock Edge 1 and 0 (CKEG1, CKEG0): These bits select external clock input
edges when an external clock source is used.
Bit 4: CKEG1
Bit 3: CKEG0
Description
0
0
Count rising edges
1
Count falling edges
—
Count both edges
1
(Initial value)
When channel 2 is set to phase counting mode, bits CKEG1 and CKEG0 in TCR2 are ignored.
Phase counting takes precedence.
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Section 10 16-Bit Integrated Timer Unit (ITU)
Bits 2 to 0—Timer Prescaler 2 to 0 (TPSC2 to TPSC0): These bits select the counter clock
source.
Bit 2: TPSC2
Bit 1: TPSC1
Bit 0: TPSC0
Description
0
0
0
Internal clock: φ
1
Internal clock: φ/2
1
1
0
1
(Initial value)
0
Internal clock: φ/4
1
Internal clock: φ/8
0
External clock A: TCLKA input
1
External clock B: TCLKB input
0
External clock C: TCLKC input
1
External clock D: TCLKD input
When bit TPSC2 is cleared to 0 an internal clock source is selected, and the timer counts only
falling edges. When bit TPSC2 is set to 1 an external clock source is selected, and the timer counts
the edge or edges selected by bits CKEG1 and CKEG0.
When channel 2 is set to phase counting mode (MDF = 1 in TMDR), the settings of bits TPSC2 to
TPSC0 in TCR2 are ignored. Phase counting takes precedence.
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.2.11 Timer I/O Control Register (TIOR)
TIOR is an 8-bit register. The ITU has five TIORs, one in each channel.
Channel
Abbreviation
Function
0
TIOR0
1
TIOR1
2
TIOR2
TIOR controls the general registers. Some functions differ in
PWM mode. TIOR3 and TIOR4 settings are ignored when
complementary PWM mode or reset-synchronized PWM mode
is selected in channels 3 and 4.
3
TIOR3
4
TIOR4
Bit
7
6
5
4
3
2
1
0

IOB2
IOB1
IOB0

IOA2
IOA1
IOA0
Initial value
1
0
0
0
1
0
0
0
Read/Write

R/W
R/W
R/W

R/W
R/W
R/W
I/O control A2 to A0
These bits select GRA
functions
Reserved bit
I/O control B2 to B0
These bits select GRB functions
Reserved bit
Each TIOR is an 8-bit readable/writable register that selects the output compare or input capture
function for GRA and GRB, and specifies the functions of the TIOCA and TIOCB pins. If the
output compare function is selected, TIOR also selects the type of output. If input capture is
selected, TIOR also selects the edge or edges of the input capture signal.
TIOR is initialized to H'88 by a reset and in standby mode.
Bit 7—Reserved: Read-only bit, always read as 1.
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Section 10 16-Bit Integrated Timer Unit (ITU)
Bits 6 to 4—I/O Control B2 to B0 (IOB2 to IOB0): These bits select the GRB function.
Bit 6:
IOB2
Bit 5:
IOB1
Bit 4:
IOB0
0
0
0
1
1
1
0
No output at compare match (Initial value)
1
0 output at GRB compare match*
0
1 output at GRB compare match*
1
Output toggles at GRB compare match
1 2
(1 output in channel 2)* *
0
1
1
Description
GRB is an output
compare register
GRB is an input
capture register
0
1
GRB captures rising edge of input
GRB captures falling edge of input
GRB captures both edges of input
1
Notes: 1. After a reset, the output is 0 until the first compare match.
2. Channel 2 output cannot be toggled by compare match. This setting selects 1 output
instead.
Bit 3—Reserved: Read-only bit, always read as 1.
Bits 2 to 0—I/O Control A2 to A0 (IOA2 to IOA0): These bits select the GRA function.
Bit 2:
IOA2
Bit 1:
IOA1
Bit 0:
IOA0
0
0
0
1
1
1
0
GRA is an output
compare register
No output at compare match (Initial value)
1
0 output at GRA compare match*
0
1 output at GRA compare match*
1
Output toggles at GRA compare match
1 2
(1 output in channel 2)* *
0
1
1
Description
0
GRA is an input
capture register
1
GRA captures rising edge of input
GRA captures falling edge of input
GRA captures both edges of input
1
Notes: 1. After a reset, the output is 0 until the first compare match.
2. Channel 2 output cannot be toggled by compare match. This setting selects 1 output
instead.
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.2.12 Timer Status Register (TSR)
TSR is an 8-bit register. The ITU has five TSRs, one in each channel.
Channel
Abbreviation
Function
0
TSR0
Indicates input capture, compare match, and overflow status
1
TSR1
2
TSR2
3
TSR3
4
TSR4
Bit
7
6
5
4
3
2
1
0





OVF
IMFB
IMFA
Initial value
1
1
1
1
1
0
0
0
Read/Write





R/(W)*
R/(W)*
R/(W)*
Reserved bits
Overflow flag
Status flag indicating
overflow or underflow
Input capture/compare match flag B
Status flag indicating GRB compare
match or input capture
Input capture/compare match flag A
Status flag indicating GRA compare
match or input capture
Note: * Only 0 can be written, to clear the flag.
Each TSR is an 8-bit readable/writable register containing flags that indicate TCNT overflow or
underflow and GRA or GRB compare match or input capture. These flags are interrupt sources
and generate CPU interrupts if enabled by corresponding bits in TIER.
TSR is initialized to H'F8 by a reset and in standby mode.
Bits 7 to 3—Reserved: Read-only bits, always read as 1.
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Section 10 16-Bit Integrated Timer Unit (ITU)
Bit 2—Overflow Flag (OVF): This status flag indicates TCNT overflow or underflow.
Bit 2: OVF
Description
0
[Clearing condition]
(Initial value)
Read OVF when OVF = 1, then write 0 in OVF
1
[Setting condition]
TCNT overflowed from H'FFFF to H'0000, or underflowed from H'0000 to
H'FFFF*
Note:
*
TCNT underflow occurs when TCNT operates as an up/down-counter. Underflow
occurs only under the following conditions:
(1) Channel 2 operates in phase counting mode (MDF = 1 in TMDR)
(2) Channels 3 and 4 operate in complementary PWM mode (CMD1 = 1 and CMD0 = 0
in TFCR)
Bit 1—Input Capture/Compare Match Flag B (IMFB): This status flag indicates GRB
compare match or input capture events.
Bit 1: IMFB
0
Description
[Clearing condition]
(Initial value)
Read IMFB when IMFB = 1, then write 0 in IMFB
1
[Setting conditions]
TCNT = GRB when GRB functions as an output compare register.
TCNT value is transferred to GRB by an input capture signal, when GRB
functions as an input capture register.
Bit 0—Input Capture/Compare Match Flag A (IMFA): This status flag indicates GRA
compare match or input capture events.
Bit 0: IMFA
Description
0
[Clearing conditions]
(Initial value)
Read IMFA when IMFA = 1, then write 0 in IMFA.
DMAC activated by IMIA interrupt (channels 0 to 3 only).
1
[Setting conditions]
TCNT = GRA when GRA functions as an output compare register.
TCNT value is transferred to GRA by an input capture signal, when GRA
functions as an input capture register.
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.2.13 Timer Interrupt Enable Register (TIER)
TIER is an 8-bit register. The ITU has five TIERs, one in each channel.
Channel
Abbreviation
Function
0
TIER0
Enables or disables interrupt requests.
1
TIER1
2
TIER2
3
TIER3
4
TIER4
Bit
7
6
5
4
3
2
1
0





OVIE
IMIEB
IMIEA
Initial value
1
1
1
1
1
0
0
0
Read/Write





R/W
R/W
R/W
Reserved bits
Overflow interrupt enable
Enables or disables OVF
interrupts
Input capture/compare match
interrupt enable B
Enables or disables IMFB interrupts
Input capture/compare match
interrupt enable A
Enables or disables IMFA
interrupts
Each TIER is an 8-bit readable/writable register that enables and disables overflow interrupt
requests and general register compare match and input capture interrupt requests.
TIER is initialized to H'F8 by a reset and in standby mode.
Bits 7 to 3—Reserved: Read-only bits, always read as 1.
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Section 10 16-Bit Integrated Timer Unit (ITU)
Bit 2—Overflow Interrupt Enable (OVIE): Enables or disables the interrupt requested by the
OVF flag in TSR when OVF is set to 1.
Bit 2: OVIE
Description
0
OVI interrupt requested by OVF is disabled
1
OVI interrupt requested by OVF is enabled
(Initial value)
Bit 1—Input Capture/Compare Match Interrupt Enable B (IMIEB): Enables or disables the
interrupt requested by the IMFB flag in TSR when IMFB is set to 1.
Bit 1: IMIEB
Description
0
IMIB interrupt requested by IMFB is disabled
1
IMIB interrupt requested by IMFB is enabled
(Initial value)
Bit 0—Input Capture/Compare Match Interrupt Enable A (IMIEA): Enables or disables the
interrupt requested by the IMFA flag in TSR when IMFA is set to 1.
Bit 0: IMIEA
Description
0
IMIA interrupt requested by IMFA is disabled
1
IMIA interrupt requested by IMFA is enabled
10.3
CPU Interface
10.3.1
16-Bit Accessible Registers
(Initial value)
The timer counters (TCNTs), general registers A and B (GRAs and GRBs), and buffer registers A
and B (BRAs and BRBs) are 16-bit registers, and are linked to the CPU by an internal 16-bit data
bus. These registers can be written or read a word at a time, or a byte at a time.
Figures 10.6 and 10.7 show examples of word access to a timer counter (TCNT). Figures 10.8 to
10.11 show examples of byte access to TCNTH and TCNTL.
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Section 10 16-Bit Integrated Timer Unit (ITU)
On-chip data bus
H
CPU
H
L
Bus interface
L
TCNTH
Module
data bus
TCNTL
Figure 10.6 Access to Timer Counter (CPU Writes to TCNT, Word)
On-chip data bus
H
CPU
H
L
Bus interface
L
TCNTH
Module
data bus
TCNTL
Figure 10.7 Access to Timer Counter (CPU Reads TCNT, Word)
On-chip data bus
H
CPU
L
H
Bus interface
L
TCNTH
Module
data bus
TCNTL
Figure 10.8 Access to Timer Counter (CPU Writes to TCNT, Upper Byte)
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Section 10 16-Bit Integrated Timer Unit (ITU)
On-chip data bus
H
CPU
L
H
Bus interface
L
TCNTH
Module
data bus
TCNTL
Figure 10.9 Access to Timer Counter (CPU Writes to TCNT, Lower Byte)
On-chip data bus
H
CPU
L
H
Bus interface
L
TCNTH
Module
data bus
TCNTL
Figure 10.10 Access to Timer Counter (CPU Reads TCNT, Upper Byte)
On-chip data bus
H
CPU
L
H
Bus interface
L
TCNTH
Module
data bus
TCNTL
Figure 10.11 Access to Timer Counter (CPU Reads TCNT, Lower Byte)
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.3.2
8-Bit Accessible Registers
The registers other than the timer counters, general registers, and buffer registers are 8-bit
registers. These registers are linked to the CPU by an internal 8-bit data bus.
Figures 10.12 and 10.13 show examples of byte read and write access to a TCR.
If a word-size data transfer instruction is executed, two byte transfers are performed.
On-chip data bus
H
CPU
H
L
Bus interface
L
Module
data bus
TCR
Figure 10.12 Access to Timer Counter (CPU Writes to TCR)
On-chip data bus
H
CPU
L
H
Bus interface
L
TCR
Figure 10.13 Access to Timer Counter (CPU Reads TCR)
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Module
data bus
Section 10 16-Bit Integrated Timer Unit (ITU)
10.4
Operation
10.4.1
Overview
A summary of operations in the various modes is given below.
Normal Operation
Each channel has a timer counter and general registers. The timer counter counts up, and can
operate as a free-running counter, periodic counter, or external event counter. General registers A
and B can be used for input capture or output compare.
Synchronous Operation
The timer counters in designated channels are preset synchronously. Data written to the timer
counter in any one of these channels is simultaneously written to the timer counters in the other
channels as well. The timer counters can also be cleared synchronously if so designated by the
CCLR1 and CCLR0 bits in the TCRs.
PWM Mode
A PWM waveform is output from the TIOCA pin. The output goes to 1 at compare match A and
to 0 at compare match B. The duty cycle can be varied from 0% to 100% depending on the
settings of GRA and GRB. When a channel is set to PWM mode, its GRA and GRB automatically
become output compare registers.
Reset-Synchronized PWM Mode
Channels 3 and 4 are paired for three-phase PWM output with complementary waveforms. (The
three phases are related by having a common transition point.) When reset-synchronized PWM
mode is selected GRA3, GRB3, GRA4, and GRB4 automatically function as output compare
registers, TIOCA3, TIOCB3, TIOCA4, TOCXA4, TIOCB4, and TOCXB4 function as PWM output
pins, and TCNT3 operates as an up-counter. TCNT4 operates independently, and is not compared
with GRA4 or GRB4.
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Section 10 16-Bit Integrated Timer Unit (ITU)
Complementary PWM Mode
Channels 3 and 4 are paired for three-phase PWM output with non-overlapping complementary
waveforms. When complementary PWM mode is selected GRA3, GRB3, GRA4, and GRB4
automatically function as output compare registers, and TIOCA3, TIOCB3, TIOCA4, TOCXA4,
TIOCB4, and TOCXB4 function as PWM output pins. TCNT3 and TCNT4 operate as up/downcounters.
Phase Counting Mode
The phase relationship between two clock signals input at TCLKA and TCLKB is detected and
TCNT2 counts up or down accordingly. When phase counting mode is selected TCLKA and
TCLKB become clock input pins and TCNT2 operates as an up/down-counter.
Buffering
• If the general register is an output compare register
When compare match occurs the buffer register value is transferred to the general register.
• If the general register is an input capture register
When input capture occurs the TCNT value is transferred to the general register, and the
previous general register value is transferred to the buffer register.
• Complementary PWM mode
The buffer register value is transferred to the general register when TCNT3 and TCNT4
change counting direction.
• Reset-synchronized PWM mode
The buffer register value is transferred to the general register at GRA3 compare match.
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.4.2
Basic Functions
Counter Operation
When one of bits STR0 to STR4 is set to 1 in the timer start register (TSTR), the timer counter
(TCNT) in the corresponding channel starts counting. The counting can be free-running or
periodic.
Sample setup procedure for counter: Figure 10.14 shows a sample procedure for setting up a
counter.
Counter setup
Select counter clock
Type of counting?
1
No
Yes
Free-running counting
Periodic counting
Select counter clear source
2
Select output compare
register function
3
Set period
4
Start counter
5
Periodic counter
Start counter
5
Free-running counter
Figure 10.14 Counter Setup Procedure (Example)
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Section 10 16-Bit Integrated Timer Unit (ITU)
1. Set bits TPSC2 to TPSC0 in TCR to select the counter clock source. If an external clock source
is selected, set bits CKEG1 and CKEG0 in TCR to select the desired edge(s) of the external
clock signal.
2. For periodic counting, set CCLR1 and CCLR0 in TCR to have TCNT cleared at GRA compare
match or GRB compare match.
3. Set TIOR to select the output compare function of GRA or GRB, whichever was selected in
step 2.
4. Write the count period in GRA or GRB, whichever was selected in step 2.
5. Set the STR bit to 1 in TSTR to start the timer counter.
Free-running and periodic counter operation: A reset leaves the counters (TCNTs) in ITU
channels 0 to 4 all set as free-running counters. A free-running counter starts counting up when the
corresponding bit in TSTR is set to 1. When the count overflows from H'FFFF to H'0000, the
OVF flag is set to 1 in TSR. If the corresponding OVIE bit is set to 1 in TIER, a CPU interrupt is
requested. After the overflow, the counter continues counting up from H'0000. Figure 10.15
illustrates free-running counting.
TCNT value
H'FFFF
H'0000
Time
STR0 to
STR4 bit
OVF
Figure 10.15 Free-Running Counter Operation
When a channel is set to have its counter cleared by compare match, in that channel TCNT
operates as a periodic counter. Select the output compare function of GRA or GRB, set bit CCLR1
or CCLR0 in TCR to have the counter cleared by compare match, and set the count period in GRA
or GRB. After these settings, the counter starts counting up as a periodic counter when the
corresponding bit is set to 1 in TSTR. When the count matches GRA or GRB, the IMFA or IMFB
flag is set to 1 in TSR and the counter is cleared to H'0000. If the corresponding IMIEA or IMIEB
bit is set to 1 in TIER, a CPU interrupt is requested at this time. After the compare match, TCNT
continues counting up from H'0000. Figure 10.16 illustrates periodic counting.
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Section 10 16-Bit Integrated Timer Unit (ITU)
TCNT value
Counter cleared by general
register compare match
GR
Time
H'0000
STR bit
IMF
Figure 10.16 Periodic Counter Operation
TCNT count timing:
• Internal clock source
Bits TPSC2 to TPSC0 in TCR select the system clock (φ) or one of three internal clock sources
obtained by prescaling the system clock (φ/2, φ/4, φ/8).
Figure 10.17 shows the timing.
φ
Internal
clock
TCNT input
TCNT
N–1
N
N+1
Figure 10.17 Count Timing for Internal Clock Sources
• External clock source
Bits TPSC2 to TPSC0 in TCR select an external clock input pin (TCLKA to TCLKD), and its
valid edge or edges are selected by bits CKEG1 and CKEG0. The rising edge, falling edge, or
both edges can be selected.
The pulse width of the external clock signal must be at least 1.5 system clocks when a single
edge is selected, and at least 2.5 system clocks when both edges are selected. Shorter pulses
will not be counted correctly.
Figure 10.18 shows the timing when both edges are detected.
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Section 10 16-Bit Integrated Timer Unit (ITU)
φ
External
clock input
TCNT input
TCNT
N–1
N
N+1
Figure 10.18 Count Timing for External Clock Sources (when Both Edges Are Detected)
Waveform Output by Compare Match
In ITU channels 0, 1, 3, and 4, compare match A or B can cause the output at the TIOCA or
TIOCB pin to go to 0, go to 1, or toggle. In channel 2 the output can only go to 0 or go to 1.
Sample setup procedure for waveform output by compare match: Figure 10.19 shows a
sample procedure for setting up waveform output by compare match.
Output setup
1. Select the compare match output mode (0, 1, or
toggle) in TIOR. When a waveform output mode
is selected, the pin switches from its generic input/
output function to the output compare function
(TIOCA or TIOCB). An output compare pin outputs
0 until the first compare match occurs.
Select waveform
output mode
1
Set output timing
2
2. Set a value in GRA or GRB to designate the
compare match timing.
Start counter
3
3. Set the STR bit to 1 in TSTR to start the timer
counter.
Waveform output
Figure 10.19 Setup Procedure for Waveform Output by Compare Match (Example)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Examples of waveform output: Figure 10.20 shows examples of 0 and 1 output. TCNT operates
as a free-running counter, 0 output is selected for compare match A, and 1 output is selected for
compare match B. When the pin is already at the selected output level, the pin level does not
change.
TCNT value
H'FFFF
GRB
GRA
H'0000
TIOCB
TIOCA
Time
No change
No change
No change
No change
1 output
0 output
Figure 10.20 0 and 1 Output (Examples)
Figure 10.21 shows examples of toggle output. TCNT operates as a periodic counter, cleared by
compare match B. Toggle output is selected for both compare match A and B.
TCNT value
Counter cleared by compare match with GRB
GRB
GRA
H'0000
Time
TIOCB
Toggle
output
TIOCA
Toggle
output
Figure 10.21 Toggle Output (Example)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Output compare timing: The compare match signal is generated in the last state in which TCNT
and the general register match (when TCNT changes from the matching value to the next value).
When the compare match signal is generated, the output value selected in TIOR is output at the
output compare pin (TIOCA or TIOCB). When TCNT matches a general register, the compare
match signal is not generated until the next counter clock pulse.
Figure 10.22 shows the output compare timing.
φ
TCNT input
clock
TCNT
N
GR
N
N+1
Compare
match signal
TIOCA,
TIOCB
Figure 10.22 Output Compare Timing
Input Capture Function
The TCNT value can be captured into a general register when a transition occurs at an input
capture/output compare pin (TIOCA or TIOCB). Capture can take place on the rising edge, falling
edge, or both edges. The input capture function can be used to measure pulse width or period.
Sample setup procedure for input capture: Figure 10.23 shows a sample procedure for setting
up input capture.
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Section 10 16-Bit Integrated Timer Unit (ITU)
Input selection
Select input-capture input
1
Start counter
2
1. Set TIOR to select the input capture function of a
general register and the rising edge, falling edge,
or both edges of the input capture signal. Clear the
port data direction bit to 0 before making these
TIOR settings.
2. Set the STR bit to 1 in TSTR to start the timer
counter.
Input capture
Figure 10.23 Setup Procedure for Input Capture (Example)
Examples of input capture: Figure 10.24 illustrates input capture when the falling edge of
TIOCB and both edges of TIOCA are selected as capture edges. TCNT is cleared by input capture
into GRB.
TCNT value
Counter cleared by TIOCB
input (falling edge)
H'0180
H'0160
H'0005
H'0000
Time
TIOCB
TIOCA
GRA
GRB
H'0005
H'0160
H'0180
Figure 10.24 Input Capture (Example)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Input capture signal timing: Input capture on the rising edge, falling edge, or both edges can be
selected by settings in TIOR. Figure 10.25 shows the timing when the rising edge is selected. The
pulse width of the input capture signal must be at least 1.5 system clocks for single-edge capture,
and 2.5 system clocks for capture of both edges.
φ
Input-capture input
Internal input
capture signal
N
TCNT
N
GRA, GRB
Figure 10.25 Input Capture Signal Timing
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.4.3
Synchronization
The synchronization function enables two or more timer counters to be synchronized by writing
the same data to them simultaneously (synchronous preset). With appropriate TCR settings, two or
more timer counters can also be cleared simultaneously (synchronous clear). Synchronization
enables additional general registers to be associated with a single time base. Synchronization can
be selected for all channels (0 to 4).
Sample Setup Procedure for Synchronization
Figure 10.26 shows a sample procedure for setting up synchronization.
Setup for synchronization
Select synchronization
1
Synchronous preset
Write to TCNT
Synchronous clear
2
Clearing
synchronized to this
channel?
No
Yes
Synchronous preset
Select counter clear source
3
Select counter clear source
4
Start counter
5
Start counter
5
Counter clear
Synchronous clear
1. Set the SYNC bits to 1 in TSNC for the channels to be synchronized.
2. When a value is written in TCNT in one of the synchronized channels, the same value is
simultaneously written in TCNT in the other channels (synchronized preset).
3. Set the CCLR1 or CCLR0 bit in TCR to have the counter cleared by compare match or input capture.
4. Set the CCLR1 and CCLR0 bits in TCR to have the counter cleared synchronously.
5. Set the STR bits in TSTR to 1 to start the synchronized counters.
Figure 10.26 Setup Procedure for Synchronization (Example)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Example of Synchronization
Figure 10.27 shows an example of synchronization. Channels 0, 1, and 2 are synchronized, and are
set to operate in PWM mode. Channel 0 is set for counter clearing by compare match with GRB0.
Channels 1 and 2 are set for synchronous counter clearing. The timer counters in channels 0, 1,
and 2 are synchronously preset, and are synchronously cleared by compare match with GRB0. A
three-phase PWM waveform is output from pins TIOCA0, TIOCA1, and TIOCA2. For further
information on PWM mode, see section 10.4.4, PWM Mode.
Value of TCNT0 to TCNT2
Cleared by compare match with GRB0
GRB0
GRB1
GRA0
GRB2
GRA1
GRA2
Time
H'0000
TIOCA0
TIOCA1
TIOCA2
Figure 10.27 Synchronization (Example)
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.4.4
PWM Mode
In PWM mode GRA and GRB are paired and a PWM waveform is output from the TIOCA pin.
GRA specifies the time at which the PWM output changes to 1. GRB specifies the time at which
the PWM output changes to 0. If either GRA or GRB is selected as the counter clear source, a
PWM waveform with a duty cycle from 0% to 100% is output at the TIOCA pin. PWM mode can
be selected in all channels (0 to 4).
Table 10.4 summarizes the PWM output pins and corresponding registers. If the same value is set
in GRA and GRB, the output does not change when compare match occurs.
Table 10.4
PWM Output Pins and Registers
Channel
Output Pin
1 Output
0 Output
0
TIOCA0
GRA0
GRB0
1
TIOCA1
GRA1
GRB1
2
TIOCA2
GRA2
GRB2
3
TIOCA3
GRA3
GRB3
4
TIOCA4
GRA4
GRB4
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Section 10 16-Bit Integrated Timer Unit (ITU)
Sample Setup Procedure for PWM Mode
Figure 10.28 shows a sample procedure for setting up PWM mode.
PWM mode
Select counter clock
1
Select counter clear source
2
Set GRA
3
Set GRB
4
Select PWM mode
5
Start counter
6
PWM mode
1. Set bits TPSC2 to TPSC0 in TCR to
select the counter clock source. If an
external clock source is selected, set
bits CKEG1 and CKEG0 in TCR to
select the desired edge(s) of the
external clock signal.
2. Set bits CCLR1 and CCLR0 in TCR
to select the counter clear source.
3. Set the time at which the PWM
waveform should go to 1 in GRA.
4. Set the time at which the PWM
waveform should go to 0 in GRB.
5. Set the PWM bit in TMDR to select
PWM mode. When PWM mode is
selected, regardless of the TIOR
contents, GRA and GRB become
output compare registers specifying
the times at which the PWM output
goes to 1 and 0. The TIOCA pin
automatically becomes the PWM
output pin. The TIOCB pin conforms
to the settings of bits IOB1 and IOB0
in TIOR. If TIOCB output is not
desired, clear both IOB1 and IOB0 to 0.
6. Set the STR bit to 1 in TSTR to start
the timer counter.
Figure 10.28 Setup Procedure for PWM Mode (Example)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Examples of PWM Mode
Figure 10.29 shows examples of operation in PWM mode. In PWM mode TIOCA becomes an
output pin. The output goes to 1 at compare match with GRA, and to 0 at compare match with
GRB.
In the examples shown, TCNT is cleared by compare match with GRA or GRB. Synchronized
operation and free-running counting are also possible.
TCNT value
Counter cleared by compare match with GRA
GRA
GRB
H'0000
Time
TIOCA
a. Counter cleared by GRA
TCNT value
Counter cleared by compare match with GRB
GRB
GRA
Time
H'0000
TIOCA
b. Counter cleared by GRB
Figure 10.29 PWM Mode (Example 1)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Figure 10.30 shows examples of the output of PWM waveforms with duty cycles of 0% and
100%. If the counter is cleared by compare match with GRB, and GRA is set to a higher value
than GRB, the duty cycle is 0%. If the counter is cleared by compare match with GRA, and GRB
is set to a higher value than GRA, the duty cycle is 100%.
TCNT value
Counter cleared by compare match with GRB
GRB
GRA
H'0000
Time
TIOCA
Write to GRA
Write to GRA
a. 0% duty cycle
TCNT value
Counter cleared by compare match with GRA
GRA
GRB
H'0000
Time
TIOCA
Write to GRB
Write to GRB
b. 100% duty cycle
Figure 10.30 PWM Mode (Example 2)
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.4.5
Reset-Synchronized PWM Mode
In reset-synchronized PWM mode channels 3 and 4 are combined to produce three pairs of
complementary PWM waveforms, all having one waveform transition point in common.
When reset-synchronized PWM mode is selected TIOCA3, TIOCB3, TIOCA4, TOCXA4, TIOCB4,
and TOCXB4 automatically become PWM output pins, and TCNT3 functions as an up-counter.
Table 10.5 lists the PWM output pins. Table 10.6 summarizes the register settings.
Table 10.5
Output Pins in Reset-Synchronized PWM Mode
Channel
Output Pin
Description
3
TIOCA3
PWM output 1
TIOCB3
PWM output 1' (complementary waveform to PWM output 1)
TIOCA4
PWM output 2
TOCXA4
PWM output 2' (complementary waveform to PWM output 2)
TIOCB4
PWM output 3
TOCXB4
PWM output 3' (complementary waveform to PWM output 3)
4
Table 10.6
Register Settings in Reset-Synchronized PWM Mode
Register
Setting
TCNT3
Initially set to H'0000
TCNT4
Not used (operates independently)
GRA3
Specifies the count period of TCNT3
GRB3
Specifies a transition point of PWM waveforms output from TIOCA3 and TIOCB3
GRA4
Specifies a transition point of PWM waveforms output from TIOCA4 and TOCXA4
GRB4
Specifies a transition point of PWM waveforms output from TIOCB4 and TOCXB4
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Section 10 16-Bit Integrated Timer Unit (ITU)
Sample Setup Procedure for Reset-Synchronized PWM Mode
Figure 10.31 shows a sample procedure for setting up reset-synchronized PWM mode.
Reset-synchronized PWM mode
Stop counter
1
Select counter clock
2
Select counter clear source
3
Select reset-synchronized
PWM mode
4
Set TCNT
5
Set general registers
6
Start counter
7
Reset-synchronized PWM mode
1. Clear the STR3 bit in TSTR to 0 to
halt TCNT3. Reset-synchronized
PWM mode must be set up while
TCNT3 is halted.
2. Set bits TPSC2 to TPSC0 in TCR to
select the counter clock source for
channel 3. If an external clock source
is selected, select the external clock
edge(s) with bits CKEG1 and CKEG0
in TCR.
3. Set bits CCLR1 and CCLR0 in TCR3
to select GRA3 compare match as
the counter clear source.
4. Set bits CMD1 and CMD0 in TFCR to
select reset-synchronized PWM mode.
TIOCA3, TIOCB3, TIOCA4, TIOCB4,
TOCXA4, and TOCXB4 automatically
become PWM output pins.
5. Preset TCNT3 to H'0000. TCNT4
need not be preset.
6. GRA3 is the waveform period register.
Set the waveform period value in
GRA3. Set transition times of the
PWM output waveforms in GRB3,
GRA4, and GRB4. Set times within
the compare match range of TCNT3.
X ≤ GRA3 (X: setting value)
7. Set the STR3 bit in TSTR to 1 to start
TCNT3.
Figure 10.31 Setup Procedure for Reset-Synchronized PWM Mode (Example)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Example of Reset-Synchronized PWM Mode
Figure 10.32 shows an example of operation in reset-synchronized PWM mode. TCNT3 operates
as an up-counter in this mode. TCNT4 operates independently, detached from GRA4 and GRB4.
When TCNT3 matches GRA3, TCNT3 is cleared and resumes counting from H'0000. The PWM
outputs toggle at compare match of TCNT3 with GRB3, GRA4, and GRB4 respectively, and all
toggle when the counter is cleared.
TCNT3 value
Counter cleared at compare match with GRA3
GRA3
GRB3
GRA4
GRB4
H'0000
Time
TIOCA3
TIOCB3
TIOCA4
TOCXA4
TIOCB4
TOCXB4
Figure 10.32 Operation in Reset-Synchronized PWM Mode (Example)
(when OLS3 = OLS4 = 1)
For the settings and operation when reset-synchronized PWM mode and buffer mode are both
selected, see section 10.4.8, Buffering.
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.4.6
Complementary PWM Mode
In complementary PWM mode channels 3 and 4 are combined to output three pairs of
complementary, non-overlapping PWM waveforms.
When complementary PWM mode is selected TIOCA3, TIOCB3, TIOCA4, TOCXA4, TIOCB4, and
TOCXB4 automatically become PWM output pins, and TCNT3 and TCNT4 function as up/downcounters.
Table 10.7 lists the PWM output pins. Table 10.8 summarizes the register settings.
Table 10.7
Output Pins in Complementary PWM Mode
Channel
Output Pin
Description
3
TIOCA3
PWM output 1
TIOCB3
PWM output 1' (non-overlapping complementary waveform
to PWM output 1)
TIOCA4
PWM output 2
TOCXA4
PWM output 2' (non-overlapping complementary waveform
to PWM output 2)
TIOCB4
PWM output 3
TOCXB4
PWM output 3' (non-overlapping complementary waveform
to PWM output 3)
4
Table 10.8
Register Settings in Complementary PWM Mode
Register
Setting
TCNT3
Initially specifies the non-overlap margin (difference to TCNT4)
TCNT4
Initially set to H'0000
GRA3
Specifies the upper limit value of TCNT3 minus 1
GRB3
Specifies a transition point of PWM waveforms output from TIOCA3 and TIOCB3
GRA4
Specifies a transition point of PWM waveforms output from TIOCA4 and TOCXA4
GRB4
Specifies a transition point of PWM waveforms output from TIOCB4 and TOCXB4
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Section 10 16-Bit Integrated Timer Unit (ITU)
Setup Procedure for Complementary PWM Mode
Figure 10.33 shows a sample procedure for setting up complementary PWM mode.
Complementary PWM mode
Stop counting
1
Select counter clock
2
Select complementary
PWM mode
3
Set TCNTs
4
Set general registers
5
Start counters
6
Complementary PWM mode
1. Clear bits STR3 and STR4 to 0 in
TSTR to halt the timer counters.
Complementary PWM mode must be
set up while TCNT3 and TCNT4 are
halted.
2. Set bits TPSC2 to TPSC0 in TCR to
select the same counter clock source
for channels 3 and 4. If an external
clock source is selected, select the
external clock edge(s) with bits
CKEG1 and CKEG0 in TCR. Do not
select any counter clear source
with bits CCLR1 and CCLR0 in TCR.
3. Set bits CMD1 and CMD0 in TFCR
to select complementary PWM mode.
TIOCA3, TIOCB3, TIOCA4, TIOCB4,
TOCXA4, and TOCXB4 automatically
become PWM output pins.
4. Clear TCNT4 to H'0000. Set the
non-overlap margin in TCNT3. Do not
set TCNT3 and TCNT4 to the same
value.
5. GRA3 is the waveform period
register. Set the upper limit value of
TCNT3 minus 1 in GRA3. Set
transition times of the PWM output
waveforms in GRB3, GRA4, and
GRB4. Set times within the compare
match range of TCNT3 and TCNT4.
T ≤ X (X: initial setting of GRB3,
GRA4, or GRB4. T: initial setting of
TCNT3)
6. Set bits STR3 and STR4 in TSTR to
1 to start TCNT3 and TCNT4.
Note: After exiting complementary PWM mode, to resume operating in complementary
PWM mode, follow the entire setup procedure from step 1 again.
Figure 10.33 Setup Procedure for Complementary PWM Mode (Example)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Clearing Procedure for Complementary PWM Mode
Figure 10.34 shows the steps to clear complementary PWM mode.
Complementary PWM mode
1. Clear the CMD1 bit of TFCR to 0 to
set channels 3 and 4 to normal
operating mode.
Clear complementary PWM mode
1
Stop counter operation
2
2. After setting channels 3 and 4 to
normal operating mode, wait at least
one counter clock period, then clear
bits STR3 and STR4 of TSTR to 0 to
stop counter operation of TCNT3 and
TCNT4.
Normal operating mode
Figure 10.34 Clearing Procedure for Complementary PWM Mode
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Section 10 16-Bit Integrated Timer Unit (ITU)
Examples of Complementary PWM Mode
Figure 10.35 shows an example of operation in complementary PWM mode. TCNT3 and TCNT4
operate as up/down-counters, counting down from compare match between TCNT3 and GRA3
and counting up from the point at which TCNT4 underflows. During each up-and-down counting
cycle, PWM waveforms are generated by compare match with general registers GRB3, GRA4,
and GRB4. Since TCNT3 is initially set to a higher value than TCNT4, compare match events
occur in the sequence TCNT3, TCNT4, TCNT4, TCNT3.
TCNT3 and
TCNT4 values
Down-counting starts at compare
match between TCNT3 and GRA3
GRA3
TCNT3
GRB3
GRA4
GRB4
TCNT4
Time
H'0000
TIOCA3
Up-counting starts when
TCNT4 underflows
TIOCB3
TIOCA4
TOCXA4
TIOCB4
TOCXB4
Figure 10.35 Operation in Complementary PWM Mode (Example 1, OLS3 = OLS4 = 1)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Figure 10.36 shows examples of waveforms with 0% and 100% duty cycles (in one phase) in
complementary PWM mode. In this example the outputs change at compare match with GRB3, so
waveforms with duty cycles of 0% or 100% can be output by setting GRB3 to a value larger than
GRA3. The duty cycle can be changed easily during operation by use of the buffer registers. For
further information see section 10.4.8, Buffering.
TCNT3 and
TCNT4 values
GRA3
GRB3
H'0000
Time
TIOCA3
TIOCB3
0% duty cycle
a. 0% duty cycle
TCNT3 and
TCNT4 values
GRA3
GRB3
Time
H'0000
TIOCA3
TIOCB3
100% duty cycle
b. 100% duty cycle
Figure 10.36 Operation in Complementary PWM Mode (Example 2, OLS3 = OLS4 = 1)
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Section 10 16-Bit Integrated Timer Unit (ITU)
In complementary PWM mode, TCNT3 and TCNT4 overshoot and undershoot at the transitions
between up-counting and down-counting. The setting conditions for the IMFA bit in channel 3 and
the OVF bit in channel 4 differ from the usual conditions. In buffered operation the buffer transfer
conditions also differ. Timing diagrams are shown in figures 10.37 and 10.38.
TCNT3
GRA3
N−1
N
N+1
N
N−1
N
Flag not set
IMFA
Set to 1
Buffer transfer
signal (BR to GR)
GR
Buffer transfer
No buffer transfer
Figure 10.37 Overshoot Timing
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Section 10 16-Bit Integrated Timer Unit (ITU)
Underflow
TCNT4
H'0001
H'0000
Overflow
H'FFFF
H'0000
Flag not set
OVF
Set to 1
Buffer transfer
signal (BR to GR)
GR
Buffer transfer
No buffer transfer
Figure 10.38 Undershoot Timing
In channel 3, IMFA is set to 1 only during up-counting. In channel 4, OVF is set to 1 only when
an underflow occurs. When buffering is selected, buffer register contents are transferred to the
general register at compare match A3 during up-counting, and when TCNT4 underflows.
General Register Settings in Complementary PWM Mode
When setting up general registers for complementary PWM mode or changing their settings
during operation, note the following points.
• Initial settings
Do not set values from H'0000 to T – 1 (where T is the initial value of TCNT3). After the
counters start and the first compare match A3 event has occurred, however, settings in this
range also become possible.
• Changing settings
Use the buffer registers. Correct waveform output may not be obtained if a general register is
written to directly.
• Cautions on changes of general register settings
Figure 10.39 shows six correct examples and one incorrect example.
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Section 10 16-Bit Integrated Timer Unit (ITU)
GRA3
GR
H'0000
Not allowed
BR
GR
Figure 10.39 Changing a General Register Setting by Buffer Transfer (Example 1)
 Buffer transfer at transition from up-counting to down-counting
If the general register value is in the range from GRA3 – T + 1 to GRA3, do not transfer a
buffer register value outside this range. Conversely, if the general register value is outside
this range, do not transfer a value within this range. See figure 10.40.
GRA3 + 1
GRA3
Illegal changes
GRA3 − T + 1
GRA3 − T
TCNT3
TCNT4
Figure 10.40 Changing a General Register Setting by Buffer Transfer (Caution 1)
 Buffer transfer at transition from down-counting to up-counting
If the general register value is in the range from H'0000 to T – 1, do not transfer a buffer
register value outside this range. Conversely, when a general register value is outside this
range, do not transfer a value within this range. See figure 10.41.
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Section 10 16-Bit Integrated Timer Unit (ITU)
TCNT3
TCNT4
T
T−1
Illegal changes
H'0000
H'FFFF
Figure 10.41 Changing a General Register Setting by Buffer Transfer (Caution 2)
 General register settings outside the counting range (H'0000 to GRA3)
Waveforms with a duty cycle of 0% or 100% can be output by setting a general register to
a value outside the counting range. When a buffer register is set to a value outside the
counting range, then later restored to a value within the counting range, the counting
direction (up or down) must be the same both times. See figure 10.42.
GRA3
GR
H'0000
0% duty cycle
100% duty cycle
Output pin
Output pin
BR
GR
Write during down-counting
Write during up-counting
Figure 10.42 Changing a General Register Setting by Buffer Transfer (Example 2)
Settings can be made in this way by detecting GRA3 compare match or TCNT4 underflow
before writing to the buffer register. They can also be made by using GRA3 compare match
to activate the DMAC.
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.4.7
Phase Counting Mode
In phase counting mode the phase difference between two external clock inputs (at the TCLKA
and TCLKB pins) is detected, and TCNT2 counts up or down accordingly.
In phase counting mode, the TCLKA and TCLKB pins automatically function as external clock
input pins and TCNT2 becomes an up/down-counter, regardless of the settings of bits TPSC2 to
TPSC0, CKEG1, and CKEG0 in TCR2. Settings of bits CCLR1, CCLR0 in TCR2, and settings in
TIOR2, TIER2, TSR2, GRA2, and GRB2 are valid. The input capture and output compare
functions can be used, and interrupts can be generated.
Phase counting is available only in channel 2.
Sample Setup Procedure for Phase Counting Mode
Figure 10.43 shows a sample procedure for setting up phase counting mode.
Phase counting mode
Select phase counting mode
1
Select flag setting condition
2
Start counter
3
1. Set the MDF bit in TMDR to 1 to select
phase counting mode.
2. Select the flag setting condition with
the FDIR bit in TMDR.
3. Set the STR2 bit to 1 in TSTR to start
the timer counter.
Phase counting mode
Figure 10.43 Setup Procedure for Phase Counting Mode (Example)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Example of Phase Counting Mode
Figure 10.44 shows an example of operations in phase counting mode. Table 10.9 lists the upcounting and down-counting conditions for TCNT2.
In phase counting mode both the rising and falling edges of TCLKA and TCLKB are counted. The
phase difference between TCLKA and TCLKB must be at least 1.5 states, the phase overlap must
also be at least 1.5 states, and the pulse width must be at least 2.5 states. See figure 10.45.
TCNT2 value
Counting up
Counting down
Time
TCLKB
TCLKA
Figure 10.44 Operation in Phase Counting Mode (Example)
Table 10.9 Up/Down Counting Conditions
Counting Direction
Up-Counting
TCLKB
↑
Low
TCLKA
Phase
difference
High
↑
Down-Counting
↓
High
Phase
difference
Low
High
↓
↓
Pulse width
↓
Low
Low
↑
↑
High
Pulse width
TCLKA
TCLKB
Overlap
Overlap
Phase difference and overlap: at least 1.5 states
Pulse width:
at least 2.5 states
Figure 10.45 Phase Difference, Overlap, and Pulse Width in Phase Counting Mode
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.4.8
Buffering
Buffering operates differently depending on whether a general register is an output compare
register or an input capture register, with further differences in reset-synchronized PWM mode and
complementary PWM mode. Buffering is available only in channels 3 and 4. Buffering operations
under the conditions mentioned above are described next.
• General register used for output compare
The buffer register value is transferred to the general register at compare match.
See figure 10.46.
Compare match signal
BR
GR
Comparator
TCNT
Figure 10.46 Compare Match Buffering
• General register used for input capture
The TCNT value is transferred to the general register at input capture. The previous general
register value is transferred to the buffer register.
See figure 10.47.
Input capture signal
BR
GR
TCNT
Figure 10.47 Input Capture Buffering
• Complementary PWM mode
The buffer register value is transferred to the general register when TCNT3 and TCNT4
change counting direction. This occurs at the following two times:
 When TCNT3 compare matches GRA3
 When TCNT4 underflows
• Reset-synchronized PWM mode
The buffer register value is transferred to the general register at compare match A3.
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Section 10 16-Bit Integrated Timer Unit (ITU)
Sample Buffering Setup Procedure
Figure 10.48 shows a sample buffering setup procedure.
Buffering
Select general register functions
1
Set buffer bits
2
Start counters
3
1. Set TIOR to select the output compare or input
capture function of the general registers.
2. Set bits BFA3, BFA4, BFB3, and BFB4 in TFCR
to select buffering of the required general registers.
3. Set the STR bits to 1 in TSTR to start the timer
counters.
Buffered operation
Figure 10.48 Buffering Setup Procedure (Example)
Examples of Buffering
Figure 10.49 shows an example in which GRA is set to function as an output compare register
buffered by BRA, TCNT is set to operate as a periodic counter cleared by GRB compare match,
and TIOCA and TIOCB are set to toggle at compare match A and B. Because of the buffer setting,
when TIOCA toggles at compare match A, the BRA value is simultaneously transferred to GRA.
This operation is repeated each time compare match A occurs. Figure 10.50 shows the transfer
timing.
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Section 10 16-Bit Integrated Timer Unit (ITU)
TCNT value
Counter cleared by compare match B
GRB
H'0250
H'0200
H'0100
H'0000
Time
BRA
H'0200
GRA
H'0250
H'0100
H'0200
H'0200
H'0100
H'0200
TIOCB
Toggle
output
TIOCA
Toggle
output
Compare match A
Figure 10.49 Register Buffering (Example 1: Buffering of Output Compare Register)
φ
n
TCNT
n+1
Compare
match signal
Buffer transfer
signal
N
BR
GR
n
N
Figure 10.50 Compare Match and Buffer Transfer Timing (Example)
Figure 10.51 shows an example in which GRA is set to function as an input capture register
buffered by BRA, and TCNT is cleared by input capture B. The falling edge is selected as the
input capture edge at TIOCB. Both edges are selected as input capture edges at TIOCA. Because
Rev. 3.00 Sep 27, 2006 page 389 of 872
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Section 10 16-Bit Integrated Timer Unit (ITU)
of the buffer setting, when the TCNT value is captured into GRA at input capture A, the previous
GRA value is simultaneously transferred to BRA. Figure 10.52 shows the transfer timing.
TCNT value
Counter cleared by
input capture B
H'0180
H'0160
H'0005
H'0000
Time
TIOCB
TIOCA
GRA
H'0005
H'0160
H'0160
H'0005
BRA
GRB
H'0180
Input capture A
Figure 10.51 Register Buffering (Example 2: Buffering of Input Capture Register)
φ
TIOC pin
Input capture
signal
TCNT
n
n+1
N
N+1
GR
M
n
n
N
BR
m
M
M
n
Figure 10.52 Input Capture and Buffer Transfer Timing (Example)
Rev. 3.00 Sep 27, 2006 page 390 of 872
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Section 10 16-Bit Integrated Timer Unit (ITU)
Figure 10.53 shows an example in which GRB3 is buffered by BRB3 in complementary PWM
mode. Buffering is used to set GRB3 to a higher value than GRA3, generating a PWM waveform
with 0% duty cycle. The BRB3 value is transferred to GRB3 when TCNT3 matches GRA3, and
when TCNT4 underflows.
TCNT3 and
TCNT4 values
TCNT3
H'1FFF
GRA3
GRB3
TCNT4
H'0999
H'0000
BRB3
GRB3
Time
H'1FFF
H'0999
H'0999
H'0999
H'1FFF
H'0999
H'1FFF
H'0999
TIOCA3
TIOCB3
Figure 10.53 Register Buffering (Example 3: Buffering in Complementary PWM Mode)
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.4.9
ITU Output Timing
The ITU outputs from channels 3 and 4 can be disabled by bit settings in TOER or by an external
trigger, or inverted by bit settings in TOCR.
Timing of Enabling and Disabling of ITU Output by TOER
In this example an ITU output is disabled by clearing a master enable bit to 0 in TOER. An
arbitrary value can be output by appropriate settings of the data register (DR) and data direction
register (DDR) of the corresponding input/output port. Figure 10.54 illustrates the timing of the
enabling and disabling of ITU output by TOER.
T1
T2
T3
φ
Address bus
TOER address
TOER
ITU output pin
Timer output
ITU output
I/O port
Generic input/output
Figure 10.54 Timing of Disabling of ITU Output by Writing to TOER (Example)
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Section 10 16-Bit Integrated Timer Unit (ITU)
Timing of Disabling of ITU Output by External Trigger
If the XTGD bit is cleared to 0 in TOCR in reset-synchronized PWM mode or complementary
PWM mode, when an input capture A signal occurs in channel 1, the master enable bits are
cleared to 0 in TOER, disabling ITU output. Figure 10.55 shows the timing.
φ
TIOCA1 pin
Input capture
signal
N
TOER
ITU output
pins
ITU output
ITU output
H'C0
N
I/O port
Generic
input/output
ITU output
ITU output
H'C0
I/O port
Generic
input/output
N: Arbitrary setting (H'C1 to H'FF)
Figure 10.55 Timing of Disabling of ITU Output by External Trigger (Example)
Rev. 3.00 Sep 27, 2006 page 393 of 872
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Section 10 16-Bit Integrated Timer Unit (ITU)
Timing of Output Inversion by TOCR
The output levels in reset-synchronized PWM mode and complementary PWM mode can be
inverted by inverting the output level select bits (OLS4 and OLS3) in TOCR. Figure 10.56 shows
the timing.
T1
T2
T3
φ
Address bus
TOCR address
TOCR
ITU output pin
Inverted
Figure 10.56 Timing of Inverting of ITU Output Level by Writing to TOCR (Example)
Rev. 3.00 Sep 27, 2006 page 394 of 872
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.5
Interrupts
The ITU has two types of interrupts: input capture/compare match interrupts, and overflow
interrupts.
10.5.1
Setting of Status Flags
Timing of Setting of IMFA and IMFB at Compare Match
IMFA and IMFB are set to 1 by a compare match signal generated when TCNT matches a general
register (GR). The compare match signal is generated in the last state in which the values match
(when TCNT is updated from the matching count to the next count). Therefore, when TCNT
matches a general register, the compare match signal is not generated until the next timer clock
input. Figure 10.57 shows the timing of the setting of IMFA and IMFB.
φ
TCNT input
clock
TCNT
GR
N
N+1
N
Compare
match signal
IMF
IMI
Figure 10.57 Timing of Setting of IMFA and IMFB by Compare Match
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Section 10 16-Bit Integrated Timer Unit (ITU)
Timing of Setting of IMFA and IMFB by Input Capture
IMFA and IMFB are set to 1 by an input capture signal. The TCNT contents are simultaneously
transferred to the corresponding general register. Figure 10.58 shows the timing.
φ
Input capture
signal
IMF
N
TCNT
GR
N
IMI
Figure 10.58 Timing of Setting of IMFA and IMFB by Input Capture
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Section 10 16-Bit Integrated Timer Unit (ITU)
Timing of Setting of Overflow Flag (OVF)
OVF is set to 1 when TCNT overflows from H'FFFF to H'0000 or underflows from H'0000 to
H'FFFF. Figure 10.59 shows the timing.
φ
TCNT
H'FFFF
H'0000
Overflow
signal
OVF
OVI
Figure 10.59 Timing of Setting of OVF
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.5.2
Timing of Clearing of Status Flags
If the CPU reads a status flag while it is set to 1, then writes 0 in the status flag, the status flag is
cleared. Figure 10.60 shows the timing.
TSR write cycle
T1
T2
T3
φ
Address
TSR address
IMF, OVF
Figure 10.60 Timing of Clearing of Status Flags
10.5.3
Interrupt Sources and DMA Controller Activation
Each ITU channel can generate a compare match/input capture A interrupt, a compare match/input
capture B interrupt, and an overflow interrupt. In total there are 15 interrupt sources, all
independently vectored. An interrupt is requested when the interrupt request flag and interrupt
enable bit are both set to 1.
The priority order of the channels can be modified in interrupt priority registers A and B (IPRA
and IPRB). For details see section 5, Interrupt Controller.
Compare match/input capture A interrupts in channels 0 to 3 can activate the DMA controller
(DMAC). When the DMAC is activated a CPU interrupt is not requested.
Table 10.10 lists the interrupt sources.
Rev. 3.00 Sep 27, 2006 page 398 of 872
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Section 10 16-Bit Integrated Timer Unit (ITU)
Table 10.10 ITU Interrupt Sources
Channel
Interrupt
Source
Description
DMAC
Activatable
Priority*
0
IMIA0
Compare match/input capture A0
Yes
High
IMIB0
Compare match/input capture B0
No
OVI0
Overflow 0
No
IMIA1
Compare match/input capture A1
Yes
IMIB1
Compare match/input capture B1
No
OVI1
Overflow 1
No
IMIA2
Compare match/input capture A2
Yes
1
2
3
4
Note:
*
IMIB2
Compare match/input capture B2
No
OVI2
Overflow 2
No
IMIA3
Compare match/input capture A3
Yes
IMIB3
Compare match/input capture B3
No
OVI3
Overflow 3
No
IMIA4
Compare match/input capture A4
No
IMIB4
Compare match/input capture B4
No
OVI4
Overflow 4
No
Low
The priority immediately after a reset is indicated. Inter-channel priorities can be
changed by settings in IPRA and IPRB.
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Section 10 16-Bit Integrated Timer Unit (ITU)
10.6
Usage Notes
This section describes contention and other matters requiring special attention during ITU
operations.
Contention between TCNT Write and Clear
If a counter clear signal occurs in the T3 state of a TCNT write cycle, clearing of the counter takes
priority and the write is not performed. See figure 10.61.
TCNT write cycle
T2
T1
T3
φ
Address bus
TCNT address
Internal write signal
Counter clear signal
TCNT
N
H'0000
Figure 10.61 Contention between TCNT Write and Clear
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Section 10 16-Bit Integrated Timer Unit (ITU)
Contention between TCNT Word Write and Increment
If an increment pulse occurs in the T3 state of a TCNT word write cycle, writing takes priority and
TCNT is not incremented. See figure 10.62.
TCNT word write cycle
T2
T1
T3
φ
Address bus
TCNT address
Internal write signal
TCNT input clock
TCNT
N
M
TCNT write data
Figure 10.62 Contention between TCNT Word Write and Increment
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Section 10 16-Bit Integrated Timer Unit (ITU)
Contention between TCNT Byte Write and Increment
If an increment pulse occurs in the T2 or T3 state of a TCNT byte write cycle, writing takes priority
and TCNT is not incremented. The TCNT byte that was not written retains its previous value. See
figure 10.63, which shows an increment pulse occurring in the T2 state of a byte write to TCNTH.
TCNTH byte write cycle
T1
T2
T3
φ
TCNTH address
Address bus
Internal write signal
TCNT input clock
TCNTH
N
M
TCNT write data
TCNTL
X
X+1
X
Figure 10.63 Contention between TCNT Byte Write and Increment
Rev. 3.00 Sep 27, 2006 page 402 of 872
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Section 10 16-Bit Integrated Timer Unit (ITU)
Contention between General Register Write and Compare Match
If a compare match occurs in the T3 state of a general register write cycle, writing takes priority
and the compare match signal is inhibited. See figure 10.64.
General register write cycle
T1
T2
T3
φ
GR address
Address bus
Internal write signal
TCNT
N
GR
N
N+1
M
General register write data
Compare match signal
Inhibited
Figure 10.64 Contention between General Register Write and Compare Match
Rev. 3.00 Sep 27, 2006 page 403 of 872
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Section 10 16-Bit Integrated Timer Unit (ITU)
Contention between TCNT Write and Overflow or Underflow
If an overflow occurs in the T3 state of a TCNT write cycle, writing takes priority and the counter
is not incremented. OVF is set to 1. The same holds for underflow. See figure 10.65.
TCNT write cycle
T1
T2
T3
φ
Address bus
TCNT address
Internal write signal
TCNT input clock
Overflow signal
TCNT
H'FFFF
M
TCNT write data
OVF
Figure 10.65 Contention between TCNT Write and Overflow
Rev. 3.00 Sep 27, 2006 page 404 of 872
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Section 10 16-Bit Integrated Timer Unit (ITU)
Contention between General Register Read and Input Capture
If an input capture signal occurs during the T3 state of a general register read cycle, the value
before input capture is read. See figure 10.66.
General register read cycle
T1
T2
T3
φ
GR address
Address bus
Internal read signal
Input capture signal
GR
Internal data bus
X
M
X
Figure 10.66 Contention between General Register Read and Input Capture
Rev. 3.00 Sep 27, 2006 page 405 of 872
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Section 10 16-Bit Integrated Timer Unit (ITU)
Contention between Counter Clearing by Input Capture and Counter Increment
If an input capture signal and counter increment signal occur simultaneously, the counter is
cleared according to the input capture signal. The counter is not incremented by the increment
signal. The value before the counter is cleared is transferred to the general register. See figure
10.67.
φ
Input capture signal
Counter clear signal
TCNT input clock
TCNT
GR
N
H'0000
N
Figure 10.67 Contention between Counter Clearing by Input Capture and Counter
Increment
Rev. 3.00 Sep 27, 2006 page 406 of 872
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Section 10 16-Bit Integrated Timer Unit (ITU)
Contention between General Register Write and Input Capture
If an input capture signal occurs in the T3 state of a general register write cycle, input capture takes
priority and the write to the general register is not performed. See figure 10.68.
General register write cycle
T1
T2
T3
φ
Address bus
GR address
Internal write signal
Input capture signal
TCNT
GR
M
M
Figure 10.68 Contention between General Register Write and Input Capture
Note on Waveform Period Setting
When a counter is cleared by compare match, the counter is cleared in the last state at which the
TCNT value matches the general register value, at the time when this value would normally be
updated to the next count. The actual counter frequency is therefore given by the following
formula:
f=
φ
(N + 1)
(f: counter frequency. φ: system clock frequency. N: value set in general register.)
Rev. 3.00 Sep 27, 2006 page 407 of 872
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Section 10 16-Bit Integrated Timer Unit (ITU)
Contention between Buffer Register Write and Input Capture
If a buffer register is used for input capture buffering and an input capture signal occurs in the T3
state of a write cycle, input capture takes priority and the write to the buffer register is not
performed. See figure 10.69.
Buffer register write cycle
T2
T1
T3
φ
Address bus
BR address
Internal write signal
Input capture signal
GR
N
X
TCNT value
BR
M
N
Figure 10.69 Contention between Buffer Register Write and Input Capture
Rev. 3.00 Sep 27, 2006 page 408 of 872
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Section 10 16-Bit Integrated Timer Unit (ITU)
Note on Synchronous Preset
When channels are synchronized, if a TCNT value is modified by byte write access, all 16 bits of
all synchronized counters assume the same value as the counter that was addressed.
Example: When channels 2 and 3 are synchronized
• Byte write to channel 2 or byte write to channel 3
TCNT2
W
X
TCNT3
Y
Z
Upper byte Lower byte
Write A to upper byte
of channel 2
TCNT2
A
X
TCNT3
A
X
Upper byte Lower byte
Write A to lower byte
of channel 3
TCNT2
Y
A
TCNT3
Y
A
Upper byte Lower byte
• Word write to channel 2 or word write to channel 3
TCNT2
W
X
TCNT3
Y
Z
Upper byte Lower byte
Write AB word to
channel 2 or 3
TCNT2
A
B
TCNT3
A
B
Upper byte Lower byte
Note on Setup of Reset-Synchronized PWM Mode and Complementary PWM Mode
When setting bits CMD1 and CMD0 in TFCR, take the following precautions:
• Write to bits CMD1 and CMD0 only when TCNT3 and TCNT4 are stopped.
• Do not switch directly between reset-synchronized PWM mode and complementary PWM
mode. First switch to normal mode (by clearing bit CMD1 to 0), then select reset-synchronized
PWM mode or complementary PWM mode.
Rev. 3.00 Sep 27, 2006 page 409 of 872
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IOA2 = 0
Other bits
unrestricted















































PWM0 = 0
PWM0 = 0
PWM0 = 0














Output compare A
Output compare B
Input capture A
Input capture B
Counter By compare
clearing match/input
capture A
By compare
match/input
capture B
Synchronous
clear
Rev. 3.00 Sep 27, 2006 page 410 of 872
REJ09B0325-0300
: Setting available (valid).
: Setting does not affect this mode.
IOB2 = 1
Other bits
unrestricted
IOB2 = 0
Other bits
unrestricted
*
IOB
CCLR1 = 1
CCLR0 = 1
CCLR1 = 1
CCLR0 = 0
CCLR1 = 0
CCLR0 = 1
Clear
Select
TCR0
Clock
Select
Note: * The input capture function cannot be used in PWM mode. If compare match A and compare match B occur simultaneously, the compare match signal is inhibited.
Legend:
SYNC0 = 1
IOA2 = 1
Other bits
unrestricted







SYNC0 = 1

Synchronous preset
PWM0 = 1
IOA

Master
Enable
TIOR0

PWM
TOER

FDIR
MDF
TOCR
Register Settings
ResetOutput
CompleSynchro- BufferXTGD Level
mentary
nized
ing
Select
PWM
PWM
TFCR

Synchronization
TMDR
PWM mode
Operating Mode
TSNC
Section 10 16-Bit Integrated Timer Unit (ITU)
ITU Operating Modes
Table 10.11 (a) ITU Operating Modes (Channel 0)


Input capture B
: Setting available (valid).
: Setting does not affect this mode.
SYNC1 = 1
PWM1 = 0
PWM1 = 0
PWM1 = 0
PWM1 = 1
PWM
TOCR
Register Settings































*2













ResetOutput
CompleSynchro- BufferXTGD Level
mentary
nized
ing
Select
PWM
PWM
TFCR









Master
Enable
TOER
IOA2 = 1
Other bits
unrestricted
IOA2 = 0
Other bits
unrestricted

IOA
*1
IOB
IOB2 = 1
Other bits
unrestricted
IOB2 = 0
Other bits
unrestricted
TIOR1
CCLR1 = 1
CCLR0 = 1
CCLR1 = 1
CCLR0 = 0
CCLR1 = 0
CCLR0 = 1
Clear
Select
TCR1
Clock
Select
Notes: 1. The input capture function cannot be used in PWM mode. If compare match A and compare match B occur simultaneously, the compare match signal is inhibited.
2. Valid only when channels 3 and 4 are operating in complementary PWM mode or reset-synchronized PWM mode.
Legend:
Synchronous
clear
By compare
match/input
capture B
Counter By compare
clearing match/input
capture A



Input capture A



Output compare B



Output compare A



PWM mode
SYNC1 = 1

Synchronous preset

FDIR
MDF

Synchronization
TMDR

Operating Mode
TSNC
Section 10 16-Bit Integrated Timer Unit (ITU)
Table 10.11 (b) ITU Operating Modes (Channel 1)
Rev. 3.00 Sep 27, 2006 page 411 of 872
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Rev. 3.00 Sep 27, 2006 page 412 of 872
REJ09B0325-0300
















































PWM2 = 0
PWM2 = 0
PWM2 = 0














Output compare A
Output compare B
Input capture A
Input capture B
Counter By compare
clearing match/input
capture A
By compare
match/input
capture B
Synchronous
clear
: Setting available (valid).
: Setting does not affect this mode.
IOB2 = 1
Other bits
unrestricted
IOB2 = 0
Other bits
unrestricted
*
IOB
CCLR1 = 1
CCLR0 = 1
CCLR1 = 1
CCLR0 = 0
CCLR1 = 0
CCLR0 = 1
Clear
Select
TCR2

Clock
Select
Note: * The input capture function cannot be used in PWM mode. If compare match A and compare match B occur simultaneously, the compare match signal is inhibited.
Legend:
Phase counting
mode
SYNC2 = 1
MDF = 1
IOA2 = 0
Other bits
unrestricted





IOA2 = 1
Other bits
unrestricted
—






SYNC2 = 1

Synchronous preset
PWM2 = 1
IOA

Master
Enable
TIOR2

PWM
TOER

FDIR
MDF
TOCR
Register Settings
ResetOutput
CompleSynchro- BufferXTGD Level
mentary
nized
ing
Select
PWM
PWM
TFCR

Synchronization
TMDR
PWM mode
Operating Mode
TSNC
Section 10 16-Bit Integrated Timer Unit (ITU)
Table 10.11 (c) ITU Operating Modes (Channel 2)
















Output compare A
Output compare B
Input capture A
Input capture B
Counter By compare
clearing match/input
capture A
By compare
match/input
capture B
Synchronous
clear







Reset-synchronized
PWM mode
Buffering
(BRA)
Buffering
(BRB)
*3
Complementary
PWM


CMD1 = 1
CMD0 = 1
CMD1 = 1
CMD0 = 0
Illegal setting:
CMD1 = 1
CMD0 = 0
CMD1 = 0
Illegal setting:
CMD1 = 1
CMD0 = 0
PWM3 = 0 CMD1 = 0
PWM3 = 0 CMD1 = 0
CMD1 = 0
PWM3 = 0 CMD1 = 0
PWM3 = 1 CMD1 = 0
PWM
CMD1 = 1
CMD0 = 1
CMD1 = 1
CMD0 = 0
CMD1 = 0
*4
CMD1 = 0
CMD1 = 0
CMD1 = 0
CMD1 = 0
CMD1 = 0
ResetSynchronized
PWM
TFCR
BFA3 = 1
Other bits
unrestricted
BFA3 = 1
Other bits
unrestricted
Buffering


*6
*6




















Output
XTGD Level
Select
TOCR
Register Settings
IOA2 = 0
Other bits
unrestricted

IOA
*1
*1
*1
*1
EB3 ignored
Other bits
unrestricted
*1


*2
IOB


IOA2 = 1
Other bits
unrestricted
IOB2 = 0
Other bits
unrestricted
TIOR3
EA3 ignored IOA2 = 1
Other bits
Other bits
unrestricted unrestricted
*1
Master
Enable
TOER
CCLR1 = 0
CCLR0 = 1
CCLR1 = 0
CCLR0 = 0
CCLR1 = 1
CCLR0 = 1
CCLR1 = 1
CCLR0 = 0
CCLR1 = 0
CCLR0 = 1
Clear
Select
TCR3
*5
Clock
Select
Master enable bit settings are valid only during waveform output.
The input capture function cannot be used in PWM mode. If compare match A and compare match B occur simultaneously, the compare match signal is inhibited.
Do not set both channels 3 and 4 for synchronous operation when complementary PWM mode is selected.
The counter cannot be cleared by input capture A when reset-synchronized PWM mode is selected.
In complementary PWM mode, select the same clock source for channels 3 and 4.
Use the input capture A function in channel 1.
: Setting available (valid).
: Setting does not affect this mode.
Notes: 1.
2.
3.
4.
5.
6.
Legend:
Complementary
PWM mode

*3
SYNC3 = 1
SYNC3 = 1

Synchronous preset

Synchro- MDF FDIR
nization
TMDR
PWM mode
Operating Mode
TSNC
Section 10 16-Bit Integrated Timer Unit (ITU)
Table 10.11 (d) ITU Operating Modes (Channel 3)
Rev. 3.00 Sep 27, 2006 page 413 of 872
REJ09B0325-0300
























Output compare A
Output compare B
Input capture A
Input capture B
Counter By compare
clearing match/input
capture A
By compare
match/input
capture B
Synchronous
clear
Rev. 3.00 Sep 27, 2006 page 414 of 872
REJ09B0325-0300
Reset-synchronized
PWM mode
Buffering
(BRA)
Buffering
(BRB)
*3
*3


CMD1 = 1
CMD0 = 1
CMD1 = 1
CMD0 = 0
Illegal setting:
CMD1 = 1
CMD0 = 0
Illegal setting:
CMD1 = 1
CMD0 = 0
Illegal setting:
CMD1 = 1
CMD0 = 0
PWM4 = 0 CMD1 = 0
PWM4 = 0 CMD1 = 0
CMD1 = 0
PWM4 = 0 CMD1 = 0
PWM4 = 1 CMD1 = 0
PWM
Complementary
PWM
CMD1 = 1
CMD0 = 1
CMD1 = 1
CMD0 = 0
*4
*4
*4
CMD1 = 0
CMD1 = 0
CMD1 = 0
CMD1 = 0
CMD1 = 0
ResetSynchronized
PWM
TFCR
BFA4 = 1
Other bits
unrestricted
BFA4 = 1
Other bits
unrestricted
Buffering






















Output
XTGD Level
Select
TOCR
Register Settings
IOA2 = 0
Other bits
unrestricted
—
IOA
*1
*1
*1
*1
EB4 ignored
Other bits
unrestricted
*1


*2
IOB


IOA2 = 1
Other bits
unrestricted
IOB2 = 0
Other bits
unrestricted
TIOR4
EA4 ignored IOA2 = 1
Other bits
Other bits
unrestricted unrestricted
*1
Master
Enable
TOER
CCLR1 = 0
CCLR0 = 0
*6
CCLR1 = 1
CCLR0 = 1
CCLR1 = 1
CCLR0 = 0
CCLR1 = 0
CCLR0 = 1
Clear
Select
TCR4
*6
*5
Clock
Select
Master enable bit settings are valid only during waveform output.
The input capture function cannot be used in PWM mode. If compare match A and compare match B occur simultaneously, the compare match signal is inhibited.
Do not set both channels 3 and 4 for synchronous operation when complementary PWM mode is selected.
When reset-synchronized PWM mode is selected, TCNT4 operates independently and the counter clearing function is available. Waveform output is not affected.
In complementary PWM mode, select the same clock source for channels 3 and 4.
TCR4 settings are valid in reset-synchronized PWM mode, but TCNT4 operates independently, without affecting waveform output.
: Setting available (valid).
: Setting does not affect this mode.
Notes: 1.
2.
3.
4.
5.
6.
Legend:
Complementary
PWM mode
SYNC4 = 1
SYNC4 = 1

Synchronous preset

Synchro- MDF FDIR
nization
TMDR
PWM mode
Operating Mode
TSNC
Section 10 16-Bit Integrated Timer Unit (ITU)
Table 10.11 (e) ITU Operating Modes (Channel 4)
Section 11 Programmable Timing Pattern Controller
Section 11 Programmable Timing Pattern Controller
11.1
Overview
The H8/3048B Group has a built-in programmable timing pattern controller (TPC) that provides
pulse outputs by using the 16-bit integrated timer unit (ITU) as a time base. The TPC pulse
outputs are divided into 4-bit groups (group 3 to group 0) that can operate simultaneously and
independently.
11.1.1
Features
TPC features are listed below.
• 16-bit output data
Maximum 16-bit data can be output. TPC output can be enabled on a bit-by-bit basis.
• Four output groups
Output trigger signals can be selected in 4-bit groups to provide up to four different 4-bit
outputs.
• Selectable output trigger signals
Output trigger signals can be selected for each group from the compare-match signals of four
ITU channels.
• Non-overlap mode
A non-overlap margin can be provided between pulse outputs.
• Can operate together with the DMA controller (DMAC)
The compare-match signals selected as trigger signals can activate the DMAC for sequential
output of data without CPU intervention.
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Section 11 Programmable Timing Pattern Controller
11.1.2
Block Diagram
Figure 11.1 shows a block diagram of the TPC.
ITU compare match signals
Control logic
TP15
TP14
TP13
TP12
TP11
TP10
TP 9
TP 8
TP 7
TP 6
TP 5
TP 4
TP 3
TP 2
TP 1
TP 0
Legend:
TPMR:
TPCR:
NDERB:
NDERA:
PBDDR:
PADDR:
NDRB:
NDRA:
PBDR:
PADR:
PADDR
PBDDR
NDERA
NDERB
TPMR
TPCR
Internal
data bus
Pulse output
pins, group 3
PBDR
NDRB
PADR
NDRA
Pulse output
pins, group 2
Pulse output
pins, group 1
Pulse output
pins, group 0
TPC output mode register
TPC output control register
Next data enable register B
Next data enable register A
Port B data direction register
Port A data direction register
Next data register B
Next data register A
Port B data register
Port A data register
Figure 11.1 TPC Block Diagram
Rev. 3.00 Sep 27, 2006 page 416 of 872
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Section 11 Programmable Timing Pattern Controller
11.1.3
TPC Pins
Table 11.1 summarizes the TPC output pins.
Table 11.1 TPC Pins
Name
Symbol
I/O
Function
TPC output 0
TP0
Output
Group 0 pulse output
TPC output 1
TP1
Output
TPC output 2
TP2
Output
TPC output 3
TP3
Output
TPC output 4
TP4
Output
TPC output 5
TP5
Output
TPC output 6
TP6
Output
TPC output 7
TP7
Output
TPC output 8
TP8
Output
TPC output 9
TP9
Output
TPC output 10
TP10
Output
TPC output 11
TP11
Output
TPC output 12
TP12
Output
TPC output 13
TP13
Output
TPC output 14
TP14
Output
TPC output 15
TP15
Output
Group 1 pulse output
Group 2 pulse output
Group 3 pulse output
Rev. 3.00 Sep 27, 2006 page 417 of 872
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Section 11 Programmable Timing Pattern Controller
11.1.4
Registers
Table 11.2 summarizes the TPC registers.
Table 11.2 TPC Registers
Address*
Name
Abbreviation
R/W
H'FFD1
Port A data direction register
PADDR
W
1
Initial Value
H'00
H'FFD3
Port A data register
PADR
R/(W)*
H'FFD4
Port B data direction register
PBDDR
W
H'00
H'00
2
H'00
H'FFD6
Port B data register
PBDR
2
R/(W)*
H'FFA0
TPC output mode register
TPMR
R/W
H'F0
H'FFA1
TPC output control register
TPCR
R/W
H'FF
H'FFA2
Next data enable register B
NDERB
R/W
H'00
H'FFA3
Next data enable register A
NDERA
R/W
H'00
H'FFA5/
3
H'FFA7*
Next data register A
NDRA
R/W
H'00
H'FFA4
3
H'FFA6*
Next data register B
NDRB
R/W
H'00
Notes: 1. Lower 16 bits of the address.
2. Bits used for TPC output cannot be written.
3. The NDRA address is H'FFA5 when the same output trigger is selected for TPC output
groups 0 and 1 by settings in TPCR. When the output triggers are different, the NDRA
address is H'FFA7 for group 0 and H'FFA5 for group 1. Similarly, the address of NDRB
is H'FFA4 when the same output trigger is selected for TPC output groups 2 and 3 by
settings in TPCR. When the output triggers are different, the NDRB address is H'FFA6
for group 2 and H'FFA4 for group 3.
Rev. 3.00 Sep 27, 2006 page 418 of 872
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Section 11 Programmable Timing Pattern Controller
11.2
Register Descriptions
11.2.1
Port A Data Direction Register (PADDR)
PADDR is an 8-bit write-only register that selects input or output for each pin in port A.
Bit
7
6
5
4
3
2
1
0
PA7 DDR PA6 DDR PA5 DDR PA4 DDR PA3 DDR PA2 DDR PA1 DDR PA0 DDR
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port A data direction 7 to 0
These bits select input or
output for port A pins
Port A is multiplexed with pins TP7 to TP0. Bits corresponding to pins used for TPC output must
be set to 1. For further information about PADDR, see section 9.11, Port A.
11.2.2
Port A Data Register (PADR)
PADR is an 8-bit readable/writable register that stores TPC output data for groups 0 and 1, when
these TPC output groups are used.
Bit
7
6
5
4
3
2
1
0
PA 7
PA 6
PA 5
PA 4
PA 3
PA 2
PA 1
PA 0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
Port A data 7 to 0
These bits store output data
for TPC output groups 0 and 1
Note: * Bits selected for TPC output by NDERA settings become read-only bits.
For further information about PADR, see section 9.11, Port A.
Rev. 3.00 Sep 27, 2006 page 419 of 872
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Section 11 Programmable Timing Pattern Controller
11.2.3
Port B Data Direction Register (PBDDR)
PBDDR is an 8-bit write-only register that selects input or output for each pin in port B.
Bit
7
6
5
4
3
2
1
0
PB7 DDR PB6 DDR PB5 DDR PB4 DDR PB3 DDR PB2 DDR PB1 DDR PB0 DDR
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port B data direction 7 to 0
These bits select input or
output for port B pins
Port B is multiplexed with pins TP15 to TP8. Bits corresponding to pins used for TPC output must
be set to 1. For further information about PBDDR, see section 9.12, Port B.
11.2.4
Port B Data Register (PBDR)
PBDR is an 8-bit readable/writable register that stores TPC output data for groups 2 and 3, when
these TPC output groups are used.
Bit
7
6
5
4
3
2
1
0
PB 7
PB 6
PB 5
PB 4
PB 3
PB 2
PB 1
PB 0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
Port B data 7 to 0
These bits store output data
for TPC output groups 2 and 3
Note: * Bits selected for TPC output by NDERB settings become read-only bits.
For further information about PBDR, see section 9.12, Port B.
Rev. 3.00 Sep 27, 2006 page 420 of 872
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Section 11 Programmable Timing Pattern Controller
11.2.5
Next Data Register A (NDRA)
NDRA is an 8-bit readable/writable register that stores the next output data for TPC output groups
1 and 0 (pins TP7 to TP0). During TPC output, when an ITU compare match event specified in
TPCR occurs, NDRA contents are transferred to the corresponding bits in PADR. The address of
NDRA differs depending on whether TPC output groups 0 and 1 have the same output trigger or
different output triggers.
NDRA is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Same Trigger for TPC Output Groups 0 and 1
If TPC output groups 0 and 1 are triggered by the same compare match event, the NDRA address
is H'FFA5. The upper 4 bits belong to group 1 and the lower 4 bits to group 0. Address H'FFA7
consists entirely of reserved bits that cannot be modified and are always read as 1.
Address H'FFA5
Bit
7
6
5
4
3
2
1
0
NDR7
NDR6
NDR5
NDR4
NDR3
NDR2
NDR1
NDR0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Next data 7 to 4
These bits store the next output
data for TPC output group 1
Next data 3 to 0
These bits store the next output
data for TPC output group 0
Address H'FFA7
Bit
7
6
5
4
3
2
1
0








Initial value
1
1
1
1
1
1
1
1
Read/Write








Reserved bits
Rev. 3.00 Sep 27, 2006 page 421 of 872
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Section 11 Programmable Timing Pattern Controller
Different Triggers for TPC Output Groups 0 and 1
If TPC output groups 0 and 1 are triggered by different compare match events, the address of the
upper 4 bits of NDRA (group 1) is H'FFA5 and the address of the lower 4 bits (group 0) is
H'FFA7. Bits 3 to 0 of address H'FFA5 and bits 7 to 4 of address H'FFA7 are reserved bits that
cannot be modified and are always read as 1.
Address H'FFA5
Bit
7
6
5
4
3
2
1
0
NDR7
NDR6
NDR5
NDR4




Initial value
0
0
0
0
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W




Next data 7 to 4
These bits store the next output
data for TPC output group 1
Reserved bits
Address H'FFA7
Bit
7
6
5
4
3
2
1
0




NDR3
NDR2
NDR1
NDR0
Initial value
1
1
1
1
0
0
0
0
Read/Write




R/W
R/W
R/W
R/W
Reserved bits
Rev. 3.00 Sep 27, 2006 page 422 of 872
REJ09B0325-0300
Next data 3 to 0
These bits store the next output
data for TPC output group 0
Section 11 Programmable Timing Pattern Controller
11.2.6
Next Data Register B (NDRB)
NDRB is an 8-bit readable/writable register that stores the next output data for TPC output groups
3 and 2 (pins TP15 to TP8). During TPC output, when an ITU compare match event specified in
TPCR occurs, NDRB contents are transferred to the corresponding bits in PBDR. The address of
NDRB differs depending on whether TPC output groups 2 and 3 have the same output trigger or
different output triggers.
NDRB is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Same Trigger for TPC Output Groups 2 and 3
If TPC output groups 2 and 3 are triggered by the same compare match event, the NDRB address
is H'FFA4. The upper 4 bits belong to group 3 and the lower 4 bits to group 2. Address H'FFA6
consists entirely of reserved bits that cannot be modified and are always read as 1.
Address H'FFA4
Bit
7
6
5
4
3
2
1
0
NDR15
NDR14
NDR13
NDR12
NDR11
NDR10
NDR9
NDR8
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Next data 15 to 12
These bits store the next output
data for TPC output group 3
Next data 11 to 8
These bits store the next output
data for TPC output group 2
Address H'FFA6
Bit
7
6
5
4
3
2
1
0








Initial value
1
1
1
1
1
1
1
1
Read/Write








Reserved bits
Rev. 3.00 Sep 27, 2006 page 423 of 872
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Section 11 Programmable Timing Pattern Controller
Different Triggers for TPC Output Groups 2 and 3
If TPC output groups 2 and 3 are triggered by different compare match events, the address of the
upper 4 bits of NDRB (group 3) is H'FFA4 and the address of the lower 4 bits (group 2) is
H'FFA6. Bits 3 to 0 of address H'FFA4 and bits 7 to 4 of address H'FFA6 are reserved bits that
cannot be modified and are always read as 1.
Address H'FFA4
Bit
7
6
5
4
3
2
1
0
NDR15
NDR14
NDR13
NDR12




Initial value
0
0
0
0
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W




Next data 15 to 12
These bits store the next output
data for TPC output group 3
Reserved bits
7
6
5
4
3
2
1
0




NDR11
NDR10
NDR9
NDR8
Initial value
1
1
1
1
0
0
0
0
Read/Write




R/W
R/W
R/W
R/W
Address H'FFA6
Bit
Reserved bits
Rev. 3.00 Sep 27, 2006 page 424 of 872
REJ09B0325-0300
Next data 11 to 8
These bits store the next output
data for TPC output group 2
Section 11 Programmable Timing Pattern Controller
11.2.7
Next Data Enable Register A (NDERA)
NDERA is an 8-bit readable/writable register that enables or disables TPC output groups 1 and 0
(TP7 to TP0) on a bit-by-bit basis.
Bit
6
7
NDER7
5
NDER6 NDER5
4
2
3
NDER4 NDER3
NDER2
1
0
NDER1 NDER0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Next data enable 7 to 0
These bits enable or disable
TPC output groups 1 and 0
If a bit is enabled for TPC output by NDERA, then when the ITU compare match event selected in
the TPC output control register (TPCR) occurs, the NDRA value is automatically transferred to
the corresponding PADR bit, updating the output value. If TPC output is disabled, the bit value is
not transferred from NDRA to PADR and the output value does not change.
NDERA is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bits 7 to 0—Next Data Enable 7 to 0 (NDER7 to NDER0): These bits enable or disable TPC
output groups 1 and 0 (TP7 to TP0) on a bit-by-bit basis.
Bits 7 to 0:
NDER7 to NDER0
Description
0
TPC outputs TP7 to TP0 are disabled
(NDR7 to NDR0 are not transferred to PA7 to PA0)
1
TPC outputs TP7 to TP0 are enabled
(NDR7 to NDR0 are transferred to PA7 to PA0)
(Initial value)
Rev. 3.00 Sep 27, 2006 page 425 of 872
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Section 11 Programmable Timing Pattern Controller
11.2.8
Next Data Enable Register B (NDERB)
NDERB is an 8-bit readable/writable register that enables or disables TPC output groups 3 and 2
(TP15 to TP8) on a bit-by-bit basis.
Bit
7
6
4
5
3
2
1
0
NDER15 NDER14 NDER13 NDER12 NDER11 NDER10 NDER9 NDER8
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Next data enable 15 to 8
These bits enable or disable
TPC output groups 3 and 2
If a bit is enabled for TPC output by NDERB, then when the ITU compare match event selected in
the TPC output control register (TPCR) occurs, the NDRB value is automatically transferred to the
corresponding PBDR bit, updating the output value. If TPC output is disabled, the bit value is not
transferred from NDRB to PBDR and the output value does not change.
NDERB is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bits 7 to 0—Next Data Enable 15 to 8 (NDER15 to NDER8): These bits enable or disable TPC
output groups 3 and 2 (TP15 to TP8) on a bit-by-bit basis.
Bits 7 to 0:
NDER15 to NDER8
Description
0
TPC outputs TP15 to TP8 are disabled
(NDR15 to NDR8 are not transferred to PB7 to PB0)
1
TPC outputs TP15 to TP8 are enabled
(NDR15 to NDR8 are transferred to PB7 to PB0)
Rev. 3.00 Sep 27, 2006 page 426 of 872
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(Initial value)
Section 11 Programmable Timing Pattern Controller
11.2.9
TPC Output Control Register (TPCR)
TPCR is an 8-bit readable/writable register that selects output trigger signals for TPC outputs on a
group-by-group basis.
Bit
7
6
5
4
3
2
1
0
G3CMS1 G3CMS0 G2CMS1 G2CMS0 G1CMS1 G1CMS0 G0CMS1 G0CMS0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Group 3 compare
match select 1 and 0
These bits select
the compare match
Group 2 compare
event that triggers
TPC output group 3 match select 1 and 0
These bits select
(TP15 to TP12)
the compare match
Group 1 compare
event that triggers
TPC output group 2 match select 1 and 0
These bits select
(TP11 to TP 8 )
the compare match
Group 0 compare
event that triggers
TPC output group 1 match select 1 and 0
These bits select
(TP7 to TP4 )
the compare match
event that triggers
TPC output group 0
(TP3 to TP 0 )
TPCR is initialized to H'FF by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bits 7 and 6—Group 3 Compare Match Select 1 and 0 (G3CMS1, G3CMS0): These bits
select the compare match event that triggers TPC output group 3 (TP15 to TP12).
Bit 7: G3CMS1
Bit 6: G3CMS0
Description
0
0
TPC output group 3 (TP15 to TP12) is triggered by compare
match in ITU channel 0
1
TPC output group 3 (TP15 to TP12) is triggered by compare
match in ITU channel 1
0
TPC output group 3 (TP15 to TP12) is triggered by compare
match in ITU channel 2
1
TPC output group 3 (TP15 to TP12) is triggered by compare
match in ITU channel 3
(Initial value)
1
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Section 11 Programmable Timing Pattern Controller
Bits 5 and 4—Group 2 Compare Match Select 1 and 0 (G2CMS1, G2CMS0): These bits
select the compare match event that triggers TPC output group 2 (TP11 to TP8).
Bit 5: G2CMS1
Bit 4: G2CMS0
Description
0
0
TPC output group 2 (TP11 to TP8) is triggered by compare
match in ITU channel 0
1
TPC output group 2 (TP11 to TP8) is triggered by compare
match in ITU channel 1
0
TPC output group 2 (TP11 to TP8) is triggered by compare
match in ITU channel 2
1
TPC output group 2 (TP11 to TP8) is triggered by compare
match in ITU channel 3
(Initial value)
1
Bits 3 and 2—Group 1 Compare Match Select 1 and 0 (G1CMS1, G1CMS0): These bits
select the compare match event that triggers TPC output group 1 (TP7 to TP4).
Bit 3: G1CMS1
Bit 2: G1CMS0
Description
0
0
TPC output group 1 (TP7 to TP4) is triggered by compare
match in ITU channel 0
1
TPC output group 1 (TP7 to TP4) is triggered by compare
match in ITU channel 1
0
TPC output group 1 (TP7 to TP4) is triggered by compare
match in ITU channel 2
1
TPC output group 1 (TP7 to TP4) is triggered by compare
match in ITU channel 3
(Initial value)
1
Bits 1 and 0—Group 0 Compare Match Select 1 and 0 (G0CMS1, G0CMS0): These bits
select the compare match event that triggers TPC output group 0 (TP3 to TP0).
Bit 1: G0CMS1
Bit 0: G0CMS0
Description
0
0
TPC output group 0 (TP3 to TP0) is triggered by compare
match in ITU channel 0
1
TPC output group 0 (TP3 to TP0) is triggered by compare
match in ITU channel 1
0
TPC output group 0 (TP3 to TP0) is triggered by compare
match in ITU channel 2
1
TPC output group 0 (TP3 to TP0) is triggered by compare
match in ITU channel 3
(Initial value)
1
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Section 11 Programmable Timing Pattern Controller
11.2.10 TPC Output Mode Register (TPMR)
TPMR is an 8-bit readable/writable register that selects normal or non-overlapping TPC output for
each group.
Bit
7
6
5
4




3
2
G3NOV G2NOV
1
0
G1NOV G0NOV
Initial value
1
1
1
1
0
0
0
0
Read/Write




R/W
R/W
R/W
R/W
Reserved bits
Group 3 non-overlap
Selects non-overlapping TPC
output for group 3 (TP15 to TP12 )
Group 2 non-overlap
Selects non-overlapping TPC
output for group 2 (TP11 to TP8 )
Group 1 non-overlap
Selects non-overlapping TPC
output for group 1 (TP7 to TP4 )
Group 0 non-overlap
Selects non-overlapping TPC
output for group 0 (TP3 to TP0 )
The output trigger period of a non-overlapping TPC output waveform is set in general register B
(GRB) in the ITU channel selected for output triggering. The non-overlap margin is set in general
register A (GRA). The output values change at compare match A and B. For details see section
11.3.4, Non-Overlapping TPC Output.
TPMR is initialized to H'F0 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bits 7 to 4—Reserved: Read-only bits, always read as 1.
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Section 11 Programmable Timing Pattern Controller
Bit 3—Group 3 Non-Overlap (G3NOV): Selects normal or non-overlapping TPC output for
group 3 (TP15 to TP12).
Bit 3: G3NOV
Description
0
Normal TPC output in group 3 (output values change at compare match A in
the selected ITU channel)
(Initial value)
1
Non-overlapping TPC output in group 3 (independent 1 and 0 output at
compare match A and B in the selected ITU channel)
Bit 2—Group 2 Non-Overlap (G2NOV): Selects normal or non-overlapping TPC output for
group 2 (TP11 to TP8).
Bit 2: G2NOV
Description
0
Normal TPC output in group 2 (output values change at compare match A in
the selected ITU channel)
(Initial value)
1
Non-overlapping TPC output in group 2 (independent 1 and 0 output at
compare match A and B in the selected ITU channel)
Bit 1—Group 1 Non-Overlap (G1NOV): Selects normal or non-overlapping TPC output for
group 1 (TP7 to TP4).
Bit 1: G1NOV
Description
0
Normal TPC output in group 1 (output values change at compare match A in
the selected ITU channel)
(Initial value)
1
Non-overlapping TPC output in group 1 (independent 1 and 0 output at
compare match A and B in the selected ITU channel)
Bit 0—Group 0 Non-Overlap (G0NOV): Selects normal or non-overlapping TPC output for
group 0 (TP3 to TP0).
Bit 0: G0NOV
Description
0
Normal TPC output in group 0 (output values change at compare match A in
the selected ITU channel)
(Initial value)
1
Non-overlapping TPC output in group 0 (independent 1 and 0 output at
compare match A and B in the selected ITU channel)
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Section 11 Programmable Timing Pattern Controller
11.3
Operation
11.3.1
Overview
When corresponding bits in PADDR or PBDDR and NDERA or NDERB are set to 1, TPC output
is enabled. The TPC output initially consists of the corresponding PADR or PBDR contents.
When a compare-match event selected in TPCR occurs, the corresponding NDRA or NDRB bit
contents are transferred to PADR or PBDR to update the output values.
Figure 11.2 illustrates the TPC output operation. Table 11.3 summarizes the TPC operating
conditions.
DDR
NDER
Q
Q
Output trigger signal
C
Q
DR
D
Q NDR
D
Internal
data bus
TPC output pin
Figure 11.2 TPC Output Operation
Table 11.3 TPC Operating Conditions
NDER
DDR
Pin Function
0
0
Generic input port
1
Generic output port
0
Generic input port (but the DR bit is a read-only bit, and when compare
match occurs, the NDR bit value is transferred to the DR bit)
1
TPC pulse output
1
Sequential output of up to 16-bit patterns is possible by writing new output data to NDRA and
NDRB before the next compare match. For information on non-overlapping operation, see section
11.3.4, Non-Overlapping TPC Output.
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Section 11 Programmable Timing Pattern Controller
11.3.2
Output Timing
If TPC output is enabled, NDRA/NDRB contents are transferred to PADR/PBDR and output
when the selected compare match event occurs. Figure 11.3 shows the timing of these operations
for the case of normal output in groups 2 and 3, triggered by compare match A.
φ
TCNT
N
GRA
N+1
N
Compare
match A signal
NDRB
n
PBDR
m
n
TP8 to TP15
m
n
Figure 11.3 Timing of Transfer of Next Data Register Contents and Output (Example)
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Section 11 Programmable Timing Pattern Controller
11.3.3
Normal TPC Output
Sample Setup Procedure for Normal TPC Output
Figure 11.4 shows a sample procedure for setting up normal TPC output.
Normal TPC output
Select GR functions
1
Set GRA value
2
Select counting operation
3
Select interrupt request
4
Set initial output data
5
Select port output
6
Enable TPC output
7
Select TPC output trigger
8
Set next TPC output data
9
Start counter
10
ITU setup
Port and
TPC setup
ITU setup
Compare match?
1.
Set TIOR to make GRA an output compare
register (with output inhibited).
2. Set the TPC output trigger period.
3. Select the counter clock source with bits
TPSC2 to TPSC0 in TCR. Select the counter
clear source with bits CCLR1 and CCLR0.
4. Enable the IMFA interrupt in TIER.
The DMAC can also be set up to transfer
data to the next data register.
5. Set the initial output values in the DR bits
of the input/output port pins to be used for
TPC output.
6. Set the DDR bits of the input/output port
pins to be used for TPC output to 1.
7. Set the NDER bits of the pins to be used for
TPC output to 1.
8. Select the ITU compare match event to be
used as the TPC output trigger in TPCR.
9. Set the next TPC output values in the NDR bits.
10. Set the STR bit to 1 in TSTR to start the
timer counter.
11. At each IMFA interrupt, set the next output
values in the NDR bits.
No
Yes
Set next TPC output data
11
Figure 11.4 Setup Procedure for Normal TPC Output (Example)
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Section 11 Programmable Timing Pattern Controller
Example of Normal TPC Output (Example of Five-Phase Pulse Output)
Figure 11.5 shows an example in which the TPC is used for cyclic five-phase pulse output.
TCNT value
Compare match
TCNT
GRA
H'0000
Time
NDRB
80
PBDR
00
C0
80
40
C0
60
40
20
60
30
20
10
30
18
10
08
18
88
08
80
88
C0
80
40
C0
TP15
TP14
TP13
TP12
TP11
•
•
•
•
The ITU channel to be used as the output trigger channel is set up so that GRA is an output compare
register and the counter will be cleared by compare match A. The trigger period is set in GRA.
The IMIEA bit is set to 1 in TIER to enable the compare match A interrupt.
H'F8 is written in PBDDR and NDERB, and bits G3CMS1, G3CMS0, G2CMS1, and G2CMS0 are set in
TPCR to select compare match in the ITU channel set up in step 1 as the output trigger.
Output data H'80 is written in NDRB.
The timer counter in this ITU channel is started. When compare match A occurs, the NDRB contents
are transferred to PBDR and output. The compare match/input capture A (IMFA) interrupt service routine
writes the next output data (H'C0) in NDRB.
Five-phase overlapping pulse output (one or two phases active at a time) can be obtained by writing
H'40, H'60, H'20, H'30, H'10, H'18, H'08, H'88… at successive IMFA interrupts. If the DMAC is set for
activation by this interrupt, pulse output can be obtained without loading the CPU.
Figure 11.5 Normal TPC Output Example (Five-Phase Pulse Output)
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Section 11 Programmable Timing Pattern Controller
11.3.4
Non-Overlapping TPC Output
Sample Setup Procedure for Non-Overlapping TPC Output
Figure 11.6 shows a sample procedure for setting up non-overlapping TPC output.
Non-overlapping
TPC output
Select GR functions
1
Set GR values
2
Select counting operation
3
Select interrupt requests
4
Set initial output data
5
Set up TPC output
6
Enable TPC transfer
7
Select TPC transfer trigger
8
Select non-overlapping groups
9
Set next TPC output data
10
Start counter
11
ITU setup
Port and
TPC setup
ITU setup
Compare match A?
1. Set TIOR to make GRA and GRB output
compare registers (with output inhibited).
2. Set the TPC output trigger period in GRB
and the non-overlap margin in GRA.
3. Select the counter clock source with bits
TPSC2 to TPSC0 in TCR. Select the counter
clear source with bits CCLR1 and CCLR0.
4. Enable the IMFA interrupt in TIER.
The DMAC can also be set up to transfer
data to the next data register.
5. Set the initial output values in the DR bits
of the input/output port pins to be used for
TPC output.
6. Set the DDR bits of the input/output port pins
to be used for TPC output to 1.
7. Set the NDER bits of the pins to be used for
TPC output to 1.
8. In TPCR, select the ITU compare match
event to be used as the TPC output trigger.
9. In TPMR, select the groups that will operate
in non-overlap mode.
10. Set the next TPC output values in the NDR
bits.
11. Set the STR bit to 1 in TSTR to start the timer
counter.
12. At each IMFA interrupt, write the next output
value in the NDR bits.
No
Yes
Set next TPC output data
12
Figure 11.6 Setup Procedure for Non-Overlapping TPC Output (Example)
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Section 11 Programmable Timing Pattern Controller
Example of Non-Overlapping TPC Output
(Example of Four-Phase Complementary Non-Overlapping Output)
Figure 11.7 shows an example of the use of TPC output for four-phase complementary nonoverlapping pulse output.
TCNT value
GRB
TCNT
GRA
H'0000
Time
NDRB
95
PBDR
00
65
95
59
05
65
56
41
59
95
50
56
65
14
95
05
65
Non-overlap margin
TP15
TP14
TP13
TP12
TP11
TP10
TP9
TP8
• The output trigger ITU channel is set up so that GRA and GRB are output compare registers and the
counter will be cleared by compare match B. The TPC output trigger period is set in GRB. The nonoverlap margin is set in GRA. The IMIEA bit is set to 1 in TIER to enable IMFA interrupts.
• H'FF is written in PBDDR and NDERB, and bits G3CMS1, G3CMS0, G2CMS1, and G2CMS0 are set
in TPCR to select compare match in the ITU channel set up in step 1 as the output trigger.
Bits G3NOV and G2NOV are set to 1 in TPMR to select non-overlapping output. Output data H'95 is
written in NDRB.
• The timer counter in this ITU channel is started. When compare match B occurs, outputs change from
1 to 0. When compare match A occurs, outputs change from 0 to 1 (the change from 0 to 1 is delayed
by the value of GRA). The IMFA interrupt service routine writes the next output data (H'65) in NDRB.
• Four-phase complementary non-overlapping pulse output can be obtained by writing H'59, H'56, H'95…
at successive IMFA interrupts. If the DMAC is set for activation by this interrupt, pulse output can be
obtained without loading the CPU.
Figure 11.7 Non-Overlapping TPC Output Example
(Four-Phase Complementary Non-Overlapping Pulse Output)
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Section 11 Programmable Timing Pattern Controller
11.3.5
TPC Output Triggering by Input Capture
TPC output can be triggered by ITU input capture as well as by compare match. If GRA and GRB
functions as an input capture register in the ITU channel selected in TPCR, TPC output will be
triggered by the input capture signal. Figure 11.8 shows the timing.
φ
TIOC pin
Input capture
signal
N
NDR
DR
M
N
Figure 11.8 TPC Output Triggering by Input Capture (Example)
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Section 11 Programmable Timing Pattern Controller
11.4
Usage Notes
11.4.1
Operation of TPC Output Pins
TP0 to TP15 are multiplexed with ITU, DMAC, address bus, and other pin functions. When ITU,
DMAC, or address output is enabled, the corresponding pins cannot be used for TPC output. The
data transfer from NDR bits to DR bits takes place, however, regardless of the usage of the pin.
Pin functions should be changed only under conditions in which the output trigger event will not
occur.
11.4.2
Note on Non-Overlapping Output
During non-overlapping operation, the transfer of NDR bit values to DR bits takes place as
follows.
1. NDR bits are always transferred to DR bits at compare match A.
2. At compare match B, NDR bits are transferred only if their value is 0. Bits are not transferred
if their value is 1.
Figure 11.9 illustrates the non-overlapping TPC output operation.
DDR
NDER
Q
Q
Compare match A
Compare match B
C
Q
DR
D
Q NDR
TPC output pin
Figure 11.9 Non-Overlapping TPC Output
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D
Internal
data bus
Section 11 Programmable Timing Pattern Controller
Therefore, 0 data can be transferred ahead of 1 data by making compare match B occur before
compare match A. NDR contents should not be altered during the interval from compare match B
to compare match A (the non-overlap margin).
This can be accomplished by having the IMFA interrupt service routine write the next data in
NDR, or by having the IMFA interrupt activate the DMAC. The next data must be written before
the next compare match B occurs.
Figure 11.10 shows the timing relationships.
Compare
match A
Compare
match B
NDR write
NDR write
NDR
DR
0 output
0/1 output
0 output
0/1 output
Write to NDR
in this interval
Do not write
to NDR in this
interval
Write to NDR
in this interval
Do not write
to NDR in this
interval
Figure 11.10 Non-Overlapping Operation and NDR Write Timing
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Section 11 Programmable Timing Pattern Controller
Rev. 3.00 Sep 27, 2006 page 440 of 872
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Section 12 Watchdog Timer
Section 12 Watchdog Timer
12.1
Overview
The H8/3048B Group has an on-chip watchdog timer (WDT). The WDT has two selectable
functions: it can operate as a watchdog timer to supervise system operation, or it can operate as an
interval timer. As a watchdog timer, it generates a reset signal for the chip if a system crash allows
the timer counter (TCNT) to overflow before being rewritten. In interval timer operation, an
interval timer interrupt is requested at each TCNT overflow.
12.1.1
Features
WDT features are listed below.
• Selection of eight counter clock sources
φ/2, φ/32, φ/64, φ/128, φ/256, φ/512, φ/2048, or φ/4096
• Interval timer option
• Timer counter overflow generates a reset signal or interrupt.
The reset signal is generated in watchdog timer operation. An interval timer interrupt is
generated in interval timer operation.
• The entire chip can be reset internally by a reset signal output from the watchdog timer.
The reset signal generated by timer counter overflow during watchdog timer operation resets
the entire chip internally. In an H8/3048F-ONE (single power supply with flash memory), the
RESO pin acts as the FWE pin; no external reset signal can be output.
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Section 12 Watchdog Timer
12.1.2
Block Diagram
Figure 12.1 shows a block diagram of the WDT.
Overflow
TCNT
Interrupt signal
Interrupt
control
(interval timer)
TCSR
Internal
data bus
Internal clock sources
φ/2
RSTCSR
Reset
(internal, external)
Read/
write
control
φ/32
φ/64
Reset control
Clock
Clock
selector
φ/128
φ/256
φ/512
φ/2048
φ/4096
RESO*
Legend:
TCNT:
Timer counter
TCSR:
Timer control/status register
RSTCSR: Reset control/status register
Note: * Open-drain output pin
Figure 12.1 WDT Block Diagram
12.1.3
Pin Configuration
Output pins used by the WDT* are shown in table 12.11.
1
Table 12.1 WDT Pins
Pin Name
Abbreviation
I/O
Reset output
RESO
Output*
Function
2
External output of watchdog timer reset signal
Notes: 1. Not provided in on-chip flash memory versions.
2. Open-drain output pin
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Section 12 Watchdog Timer
12.1.4
Register Configuration
Table 12.2 summarizes the WDT registers.
Table 12.2 WDT Registers
Address*
1
Write*
2
H'FFA8
H'FFAA
Read
Name
Abbreviation
R/W
Initial
Value
H'FFA8
Timer control/status register
TCSR
3
R/(W)*
H'18
H'FFA9
Timer counter
TCNT
R/W
H'00
RSTCSR
3
R/(W)*
H'3F
H'FFAB
Reset control/status register
Notes: 1. Lower 16 bits of the address.
2. Write word data starting at this address.
3. Only 0 can be written in bit 7, to clear the flag.
12.2
Register Descriptions
12.2.1
Timer Counter (TCNT)
TCNT is an 8-bit readable and writable* up-counter.
Bit
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
When the TME bit is set to 1 in TCSR, TCNT starts counting pulses generated from an internal
clock source selected by bits CKS2 to CKS0 in TCSR. When the count overflows (changes from
H'FF to H'00), the OVF bit is set to 1 in TCSR. TCNT is initialized to H'00 by a reset and when
the TME bit is cleared to 0.
Note: * TCNT is write-protected by a password. For details see section 12.2.4, Notes on
Register Rewriting.
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Section 12 Watchdog Timer
12.2.2
Timer Control/Status Register (TCSR)
TCSR is an 8-bit readable and writable* register. Its functions include selecting the timer mode
and clock source.
Note: * TCSR differs from other registers in being more difficult to write. For details see
section 12.2.4, Notes on Register Rewriting.
Bit
7
6
5
4
3
2
1
0
OVF
WT/IT
TME


CKS2
CKS1
CKS0
Initial value
0
0
0
1
1
0
0
0
Read/Write
R/(W)*
R/W
R/W


R/W
R/W
R/W
Clock select
These bits select the
TCNT clock source
Reserved bits
Timer enable
Selects whether TCNT runs or halts
Timer mode select
Selects the mode
Overflow flag
Status flag indicating overflow
Note: * Only 0 can be written, to clear the flag.
Bits 7 to 5 are initialized to 0 by a reset and in standby mode. Bits 2 to 0 are initialized to 0 by a
reset. In software standby mode bits 2 to 0 are not initialized, but retain their previous values.
Bit 7—Overflow Flag (OVF): This status flag indicates that the timer counter has overflowed
from H'FF to H'00.
Bit 7: OVF
Description
0
[Clearing condition]
Cleared by reading OVF when OVF = 1, then writing 0 in OVF
1
[Setting condition]
Set when TCNT changes from H'FF to H'00
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(Initial value)
Section 12 Watchdog Timer
Bit 6—Timer Mode Select (WT/IT
IT):
IT Selects whether to use the WDT as a watchdog timer or
interval timer. If used as an interval timer, the WDT generates an interval timer interrupt request
when TCNT overflows. If used as a watchdog timer, the WDT generates a reset signal when
TCNT overflows.
Bit 6: WT/IT
IT
Description
0
Interval timer: requests interval timer interrupts
1
Watchdog timer: generates a reset signal
(Initial value)
Bit 5—Timer Enable (TME): Selects whether TCNT runs or is halted.
When WT/IT = 1, clear the SYSCR software standby bit (SSBY) to 0, then set the TME to 1.
When SSBY is set to 1, clear TME to 0.
Bit 5: TME
Description
0
TCNT is initialized to H'00 and halted
1
TCNT is counting and CPU interrupt requests are enabled
(Initial value)
Bits 4 and 3—Reserved: Read-only bits, always read as 1.
Bits 2 to 0—Clock Select 2 to 0 (CKS2 to CKS0): These bits select one of eight internal clock
sources, obtained by prescaling the system clock (φ), for input to TCNT.
Bit 2: CKS2
Bit 1: CKS1
Bit 0: CKS0
Description
0
0
0
φ/2
1
φ/32
0
φ/64
1
φ/128
0
φ/256
1
φ/512
0
φ/2048
1
φ/4096
1
1
0
1
(Initial value)
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Section 12 Watchdog Timer
12.2.3
Reset Control/Status Register (RSTCSR)
RSTCSR is an 8-bit readable and writable register that indicates when a reset signal has been
generated by watchdog timer overflow, and controls external output of the reset signal.
Bit
Initial value
Read/Write
7
6
5
4
3
2
1
0
WRST
RSTOE






0
R/(W)*
0
1
1
1
1
1
1
R/W






Reserved bits
Reset output enable
Enables or disables external output of the reset signal
Watchdog timer reset
Indicates that a reset signal has been generated
Notes: The method for writing to RSTCSR is different from that for general registers to prevent
inadvertent overwriting. For details see section 12.2.4, Notes on Register Rewriting.
* Only 0 can be written in bit 7, to clear the flag.
Bits 7 and 6 are initialized by input of a reset signal at the RES pin. They are not initialized by
reset signals generated by watchdog timer overflow.
Bit 7—Watchdog Timer Reset (WRST): During watchdog timer operation, this bit indicates that
TCNT has overflowed and generated a reset signal. This reset signal resets the entire chip
internally. If bit RSTOE is set to 1, this reset signal is also output (low) at the RESO pin to
initialize external system devices. Note that there is no RESO pin in the versions with on-chip
flash memory.
Bit 7
WRST
Description
0
[Clearing conditions]
1
•
Reset signal at RES pin.
•
Read WRST when WRST = 1, then write 0 in WRST.
(Initial value)
[Setting condition]
Set when TCNT overflow generates a reset signal during watchdog timer operation
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Section 12 Watchdog Timer
Bit 6—Reset Output Enable (RSTOE): Enables or disables external output at the RESO pin of
the reset signal generated if TCNT overflows during watchdog timer operation. Note that there is
no RESO pin in the versions with on-chip flash memory.
Bit 6
RSTOE
Description
0
Reset signal is not output externally
1
Reset signal is output externally
(Initial value)
Bits 5 to 0—Reserved: These bits cannot be modified and are always read as 1.
12.2.4
Notes on Register Rewriting
The watchdog timer’s TCNT, TCSR, and RSTCSR registers differ from other registers in being
more difficult to write. The procedures for writing and reading these registers are given below.
Writing to TCNT and TCSR
These registers must be written by a word transfer instruction. They cannot be written by byte
instructions. Figure 12.2 shows the format of data written to TCNT and TCSR. TCNT and TCSR
both have the same write address. The write data must be contained in the lower byte of the
written word. The upper byte must contain H'5A (password for TCNT) or H'A5 (password for
TCSR). This transfers the write data from the lower byte to TCNT or TCSR.
15
TCNT write
Address
H'FFA8 *
H'5A
15
TCSR write
Address
8 7
H'FFA8 *
0
Write data
8 7
H'A5
0
Write data
Note: * Lower 16 bits of the address.
Figure 12.2 Format of Data Written to TCNT and TCSR
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Section 12 Watchdog Timer
Writing to RSTCSR
RSTCSR must be written by a word transfer instruction. It cannot be written by byte transfer
instructions. Figure 12.3 shows the format of data written to RSTCSR. To write 0 in the WRST
bit, the write data must have H'A5 in the upper byte and H'00 in the lower byte. The H'00 in the
lower byte clears the WRST bit in RSTCSR to 0. To write to the RSTOE bit, the upper byte must
contain H'5A and the lower byte must contain the write data. Writing this word transfers a write
data value into the RSTOE bit.
Writing 0 in WRST bit
Address
H'FFAA*
Writing to RSTOE bit
Address
15
8 7
H'A5
15
H'FFAA*
0
H'00
8 7
H'5A
0
Write data
Note: * Lower 16 bits of the address.
Figure 12.3 Format of Data Written to RSTCSR
Reading TCNT, TCSR, and RSTCSR
These registers are read like other registers. Byte access instructions can be used. The read
addresses are H'FFA8 for TCSR, H'FFA9 for TCNT, and H'FFAB for RSTCSR, as listed in table
12.3.
Table 12.3 Read Addresses of TCNT, TCSR, and RSTCSR
Address*
Register
H'FFA8
TCSR
H'FFA9
TCNT
H'FFAB
RSTCSR
Note:
*
Lower 16 bits of the address.
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Section 12 Watchdog Timer
12.3
Operation
Operations when the WDT is used as a watchdog timer and as an interval timer are described
below.
12.3.1
Watchdog Timer Operation
Figure 12.4 illustrates watchdog timer operation. To use the WDT as a watchdog timer, set the
WT/IT and TME bits to 1 in TCSR. Software must prevent TCNT overflow by rewriting the
TCNT value (normally by writing H'00) before overflow occurs. If TCNT fails to be rewritten and
overflows due to a system crash etc., the chip is internally reset for a duration of 518 states.
The watchdog reset signal can be externally output from the RESO pin to reset external system
devices. The reset signal is output externally for 132 states. External output can be enabled or
disabled by the RSTOE bit in RSTCSR. Note that there is no RESO pin in the versions with onchip flash memory.
A watchdog reset has the same vector as a reset generated by input at the RES pin. Software can
distinguish a RES reset from a watchdog reset by checking the WRST bit in RSTCSR.
If a RES reset and a watchdog reset occur simultaneously, the RES reset takes priority.
WDT overflow
H'FF
TME set to 1
TCNT count
value
H'00
OVF = 1
Start
Internal
reset signal
H'00 written
in TCNT
Reset
H'00 written
in TCNT
518 states
RESO
132 states
Figure 12.4 Watchdog Timer Operation
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Section 12 Watchdog Timer
12.3.2
Interval Timer Operation
Figure 12.5 illustrates interval timer operation. To use the WDT as an interval timer, clear bit
WT/IT to 0 and set bit TME to 1 in TCSR. An interval timer interrupt request is generated at each
TCNT overflow. This function can be used to generate interval timer interrupts at regular
intervals.
H'FF
TCNT
count value
Time t
H'00
WT/ IT = 0
TME = 1
Interval
timer
interrupt
Interval
timer
interrupt
Interval
timer
interrupt
Interval
timer
interrupt
Figure 12.5 Interval Timer Operation
12.3.3
Timing of Setting of Overflow Flag (OVF)
Figure 12.6 shows the timing of setting of the OVF flag in TCSR. The OVF flag is set to 1 when
TCNT overflows. At the same time, a reset signal is generated in watchdog timer operation, or an
interval timer interrupt is generated in interval timer operation.
φ
TCNT
H'FF
H'00
Overflow signal
OVF
Figure 12.6 Timing of Setting of OVF
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Section 12 Watchdog Timer
12.3.4
Timing of Setting of Watchdog Timer Reset Bit (WRST)
The WRST bit in RSTCSR is valid when bits WT/IT and TME are both set to 1 in TCSR.
Figure 12.7 shows the timing of setting of WRST and the internal reset timing. The WRST bit is
set to 1 when TCNT overflows and OVF is set to 1. At the same time an internal reset signal is
generated for the entire chip. This internal reset signal clears OVF to 0, but the WRST bit remains
set to 1. The reset routine must therefore clear the WRST bit.
φ
H'FF
TCNT
H'00
Overflow signal
OVF
WDT internal
reset
WRST
Figure 12.7 Timing of Setting of WRST Bit and Internal Reset
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Section 12 Watchdog Timer
12.4
Interrupts
During interval timer operation, an overflow generates an interval timer interrupt (WOVI). The
interval timer interrupt is requested whenever the OVF bit is set to 1 in TCSR.
12.5
Usage Notes
Contention between TCNT Write and Increment
If a timer counter clock pulse is generated during the T3 state of a write cycle to TCNT, the write
takes priority and the timer count is not incremented. See figure 12.8.
Write cycle: CPU writes to TCNT
T1
T2
T3
φ
TCNT
Internal write
signal
TCNT input
clock
TCNT
N
M
Counter write data
Figure 12.8 Contention between TCNT Write and Increment
Changing CKS2 to CKS0 Values
Halt TCNT by clearing the TME bit to 0 in TCSR before changing the values of bits CKS2 to
CKS0.
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Section 12 Watchdog Timer
12.6
Notes
This chip incorporates an WDT. The timer counter value of the on-chip WDT is not rewritten,
even if a system crash occurs. If an overflow occurs, a reset signal is generated and the chip is
reset.
However, if the following three events occur due to a CPU overrun, for example, the above
operations cannot be guaranteed since the WDT and the CPU are incorporated in the same chip.
• When the internal I/O registers related to the on-chip WDT are rewritten.
• When software standby mode is incorrectly entered.
• When the break mode is incorrectly entered.
In addition, as stated in the NMI above, if an abnormal level is input into the power supply pins or
the system control pins, correct operations cannot be guaranteed.
Except the above cases, the on-chip WDT functions as a device that supports recovery from a
system crash. Accordingly, when a fail-safe function is required in your system, an additional
circuit may be required as necessary.
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Section 12 Watchdog Timer
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Section 13 Serial Communication Interface
Section 13 Serial Communication Interface
13.1
Overview
The H8/3048B Group has a serial communication interface (SCI) with two independent channels.
The two channels are functionally identical. The SCI can communicate in asynchronous or
synchronous mode. It also has a multiprocessor communication function for serial communication
among two or more processors.
When the SCI is not used, it can be halted to conserve power. Each SCI channel can be halted
independently. For details see section 20.6, Module Standby Function.
Channel 0 (SCI0) also has a smart card interface function conforming to the ISO/IEC7816-3
(Identification Card) standard. This function supports serial communication with a smart card. For
details, see section 14, Smart Card Interface.
13.1.1
Features
SCI features are listed below.
• Selection of asynchronous or synchronous mode for serial communication
 Asynchronous mode
Serial data communication is synchronized one character at a time. The SCI can
communicate with a universal asynchronous receiver/transmitter (UART), asynchronous
communication interface adapter (ACIA), or other chip that employs standard
asynchronous serial communication. It can also communicate with two or more other
processors using the multiprocessor communication function. There are twelve selectable
serial data communication formats.
• Data length: 7 or 8 bits
• Stop bit length: 1 or 2 bits
• Parity bit: even, odd, or none
• Multiprocessor bit: 1 or 0
• Receive error detection: parity, overrun, and framing errors
• Break detection: by reading the RxD level directly when a framing error occurs
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Section 13 Serial Communication Interface
 Synchronous mode
Serial data communication is synchronized with a clock signal. The SCI can communicate
with other chips having a synchronous communication function. There is one serial data
communication format.
• Data length: 8 bits
• Receive error detection: overrun errors
• Full duplex communication
The transmitting and receiving sections are independent, so the SCI can transmit and receive
simultaneously. The transmitting and receiving sections are both double-buffered, so serial
data can be transmitted and received continuously.
• Built-in baud rate generator with selectable bit rates
• Selectable transmit/receive clock sources: internal clock from baud rate generator, or external
clock from the SCK pin.
• Four types of interrupts
Transmit-data-empty, transmit-end, receive-data-full, and receive-error interrupts are requested
independently. The transmit-data-empty and receive-data-full interrupts from SCI0 can
activate the DMA controller (DMAC) to transfer data.
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Section 13 Serial Communication Interface
13.1.2
Block Diagram
Bus interface
Figure 13.1 shows a block diagram of the SCI.
Module data bus
RxD
RDR
TDR
RSR
TSR
BRR
SSR
SCR
SMR
Transmit/
receive control
TxD
SCK
Parity generate
Parity check
Internal
data bus
Baud rate
generator
φ
φ/4
φ/16
φ/64
Clock
External clock
TEI
TXI
RXI
ERI
Legend:
RSR: Receive shift register
RDR: Receive data register
TSR: Transmit shift register
TDR: Transmit data register
SMR: Serial mode register
SCR: Serial control register
SSR: Serial status register
BRR: Bit rate register
Figure 13.1 SCI Block Diagram
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Section 13 Serial Communication Interface
13.1.3
Input/Output Pins
The SCI has serial pins for each channel as listed in table 13.1.
Table 13.1 SCI Pins
Channel
Name
Abbreviation
I/O
Function
0
Serial clock pin
SCK0
Input/output
SCI0 clock input/output
Receive data pin
RxD0
Input
SCI0 receive data input
Transmit data pin
TxD0
Output
SCI0 transmit data output
1
13.1.4
Serial clock pin
SCK1
Input/output
SCI1 clock input/output
Receive data pin
RxD1
Input
SCI1 receive data input
Transmit data pin
TxD1
Output
SCI1 transmit data output
Register Configuration
The SCI has internal registers as listed in table 13.2. These registers select asynchronous or
synchronous mode, specify the data format and bit rate, and control the transmitter and receiver
sections.
Table 13.2 Registers
Channel
Address*
Name
Abbreviation
R/W
Initial Value
0
H'FFB0
Serial mode register
SMR
R/W
H'00
H'FFB1
Bit rate register
BRR
R/W
H'FF
H'FFB2
Serial control register
SCR
R/W
H'00
1
1
H'FFB3
Transmit data register
TDR
R/W
H'FF
H'FFB4
Serial status register
SSR
2
R/(W)*
H'84
H'FFB5
Receive data register
RDR
R
H'00
H'FFB8
Serial mode register
SMR
R/W
H'00
H'FFB9
Bit rate register
BRR
R/W
H'FF
H'FFBA
Serial control register
SCR
R/W
H'00
H'FFBB
Transmit data register
TDR
R/W
H'FF
H'FFBC
Serial status register
SSR
2
R/(W)*
H'84
H'FFBD
Receive data register
RDR
R
H'00
Notes: 1. Lower 16 bits of the address.
2. Only 0 can be written, to clear flags.
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Section 13 Serial Communication Interface
13.2
Register Descriptions
13.2.1
Receive Shift Register (RSR)
RSR is the register that receives serial data.
Bit
7
6
5
4
3
2
1
0
Read/Write








The SCI loads serial data input at the RxD pin into RSR in the order received, LSB (bit 0) first,
thereby converting the data to parallel data. When 1 byte has been received, it is automatically
transferred to RDR. The CPU cannot read or write RSR directly.
13.2.2
Receive Data Register (RDR)
RDR is the register that stores received serial data.
Bit
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
When the SCI finishes receiving 1 byte of serial data, it transfers the received data from RSR into
RDR for storage. RSR is then ready to receive the next data. This double buffering allows data to
be received continuously.
RDR is a read-only register. Its contents cannot be modified by the CPU. RDR is initialized to
H'00 by a reset and in standby mode.
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Section 13 Serial Communication Interface
13.2.3
Transmit Shift Register (TSR)
TSR is the register that transmits serial data.
Bit
7
6
5
4
3
2
1
0
Read/Write








The SCI loads transmit data from TDR into TSR, then transmits the data serially from the TxD
pin, LSB (bit 0) first. After transmitting one data byte, the SCI automatically loads the next
transmit data from TDR into TSR and starts transmitting it. If the TDRE flag is set to 1 in SSR,
however, the SCI does not load the TDR contents into TSR. The CPU cannot read or write TSR
directly.
13.2.4
Transmit Data Register (TDR)
TDR is an 8-bit register that stores data for serial transmission.
Bit
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
When the SCI detects that TSR is empty, it moves transmit data written in TDR from TDR into
TSR and starts serial transmission. Continuous serial transmission is possible by writing the next
transmit data in TDR during serial transmission from TSR.
The CPU can always read and write TDR. TDR is initialized to H'FF by a reset and in standby
mode.
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Section 13 Serial Communication Interface
13.2.5
Serial Mode Register (SMR)
SMR is an 8-bit register that specifies the SCI serial communication format and selects the clock
source for the baud rate generator.
Bit
7
6
5
4
3
2
1
0
C/A
CHR
PE
O/E
STOP
MP
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Clock select 1/0
These bits select the
baud rate generator’s
clock source
Multiprocessor mode
Selects the multiprocessor
function
Stop bit length
Selects the stop bit length
Parity mode
Selects even or odd parity
Parity enable
Selects whether a parity bit is added
Character length
Selects character length in asynchronous mode
Communication mode
Selects asynchronous or synchronous mode
The CPU can always read and write SMR. SMR is initialized to H'00 by a reset and in standby
mode.
Bit 7—Communication Mode (C/A
A): Selects whether the SCI operates in asynchronous or
synchronous mode.
Bit 7: C/A
A
Description
0
Asynchronous mode
1
Synchronous mode
(Initial value)
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Section 13 Serial Communication Interface
Bit 6—Character Length (CHR): Selects 7-bit or 8-bit data length in asynchronous mode. In
synchronous mode the data length is 8 bits regardless of the CHR setting.
Bit 6: CHR
Description
0
8-bit data
7-bit data*
1
Note:
*
(Initial value)
When 7-bit data is selected, the MSB (bit 7) in TDR is not transmitted.
Bit 5—Parity Enable (PE): In asynchronous mode, this bit enables or disables the addition of a
parity bit to transmit data, and the checking of the parity bit in receive data. In synchronous mode
the parity bit is neither added nor checked, regardless of the PE setting.
Bit 5: PE
Description
0
Parity bit not added or checked
Parity bit added and checked*
1
Note:
*
(Initial value)
When PE is set to 1, an even or odd parity bit is added to transmit data according to the
even or odd parity mode selected by the O/E bit, and the parity bit in receive data is
checked to see that it matches the even or odd mode selected by the O/E bit.
Bit 4—Parity Mode (O/E
E): Selects even or odd parity. The O/E bit setting is valid in
asynchronous mode when the PE bit is set to 1 to enable the adding and checking of a parity bit.
The O/E setting is ignored in synchronous mode, or when parity adding and checking is disabled
in asynchronous mode.
Bit 4: O/E
E
Description
0
Even parity*
2
Odd parity*
1
1
(Initial value)
Notes: 1. When even parity is selected, the parity bit added to transmit data makes an even
number of 1s in the transmitted character and parity bit combined. Receive data must
have an even number of 1s in the received character and parity bit combined.
2. When odd parity is selected, the parity bit added to transmit data makes an odd number
of 1s in the transmitted character and parity bit combined. Receive data must have an
odd number of 1s in the received character and parity bit combined.
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Section 13 Serial Communication Interface
Bit 3—Stop Bit Length (STOP): Selects one or two stop bits in asynchronous mode. This setting
is used only in asynchronous mode. In synchronous mode no stop bit is added, so the STOP bit
setting is ignored.
Bit 3: STOP
Description
0
One stop bit*
2
Two stop bits*
1
1
(Initial value)
Notes: 1. One stop bit (with value 1) is added at the end of each transmitted character.
2. Two stop bits (with value 1) are added at the end of each transmitted character.
In receiving, only the first stop bit is checked, regardless of the STOP bit setting. If the second
stop bit is 1 it is treated as a stop bit. If the second stop bit is 0 it is treated as the start bit of the
next incoming character.
Bit 2—Multiprocessor Mode (MP): Selects a multiprocessor format. When a multiprocessor
format is selected, parity settings made by the PE and O/E bits are ignored. The MP bit setting is
valid only in asynchronous mode. It is ignored in synchronous mode.
For further information on the multiprocessor communication function, see section 13.3.3,
Multiprocessor Communication.
Bit 2: MP
Description
0
Multiprocessor function disabled
1
Multiprocessor format selected
(Initial value)
Bits 1 and 0—Clock Select 1 and 0 (CKS1, CKS0): These bits select the clock source of the onchip baud rate generator. Four clock sources are available: φ, φ/4, φ/16, and φ/64.
For the relationship between the clock source, bit rate register setting, and baud rate, see section
13.2.8, Bit Rate Register (BRR).
Bit 1: CKS1
Bit 0: CKS0
Description
0
0
φ
1
φ/4
0
φ/16
1
φ/64
1
(Initial value)
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Section 13 Serial Communication Interface
13.2.6
Serial Control Register (SCR)
SCR enables the SCI transmitter and receiver, enables or disables serial clock output in
asynchronous mode, enables or disables interrupts, and selects the transmit/receive clock source.
Bit
7
6
5
4
3
2
1
0
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Clock enable 1/0
These bits select the
SCI clock source
Transmit-end interrupt enable
Enables or disables transmitend interrupts (TEI)
Multiprocessor interrupt enable
Enables or disables multiprocessor
interrupts
Receive enable
Enables or disables the receiver
Transmit enable
Enables or disables the transmitter
Receive interrupt enable
Enables or disables receive-data-full interrupts (RXI) and
receive-error interrupts (ERI)
Transmit interrupt enable
Enables or disables transmit-data-empty interrupts (TXI)
The CPU can always read and write SCR. SCR is initialized to H'00 by a reset and in standby
mode.
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Section 13 Serial Communication Interface
Bit 7—Transmit Interrupt Enable (TIE): Enables or disables the transmit-data-empty interrupt
(TXI) requested when the TDRE flag in SSR is set to 1 due to transfer of serial transmit data from
TDR to TSR.
Bit 7: TIE
Description
0
Transmit-data-empty interrupt request (TXI) is disabled*
1
Transmit-data-empty interrupt request (TXI) is enabled
Note:
*
(Initial value)
TXI interrupt requests can be cleared by reading the value 1 from the TDRE flag, then
clearing it to 0; or by clearing the TIE bit to 0.
Bit 6—Receive Interrupt Enable (RIE): Enables or disables the receive-data-full interrupt (RXI)
requested when the RDRF flag is set to 1 in SSR due to transfer of serial receive data from RSR to
RDR; also enables or disables the receive-error interrupt (ERI).
Bit 6: RIE
Description
0
Receive-data-full (RXI) and receive-error (ERI) interrupt requests are disabled*
(Initial value)
1
Receive-data-full (RXI) and receive-error (ERI) interrupt requests are enabled
Note:
*
RXI and ERI interrupt requests can be cleared by reading the value 1 from the RDRF,
FER, PER, or ORER flag, then clearing it to 0; or by clearing the RIE bit to 0.
Bit 5—Transmit Enable (TE): Enables or disables the start of SCI serial transmitting operations.
Bit 5: TE
Description
0
1
Transmitting disabled*
2
Transmitting enabled*
1
(Initial value)
Notes: 1. The TDRE bit is locked at 1 in SSR.
2. In the enabled state, serial transmitting starts when the TDRE bit in SSR is cleared to 0
after writing of transmit data into TDR. Select the transmit format in SMR before setting
the TE bit to 1.
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Section 13 Serial Communication Interface
Bit 4—Receive Enable (RE): Enables or disables the start of SCI serial receiving operations.
Bit 4: RE
Description
0
Receiving disabled*
2
Receiving enabled*
1
1
(Initial value)
Notes: 1. Clearing the RE bit to 0 does not affect the RDRF, FER, PER, and ORER flags. These
flags retain their previous values.
2. In the enabled state, serial receiving starts when a start bit is detected in asynchronous
mode, or serial clock input is detected in synchronous mode. Select the receive format
in SMR before setting the RE bit to 1.
Bit 3—Multiprocessor Interrupt Enable (MPIE): Enables or disables multiprocessor interrupts.
The MPIE setting is valid only in asynchronous mode, and only if the MP bit is set to 1 in SMR.
The MPIE setting is ignored in synchronous mode or when the MP bit is cleared to 0.
Bit 3: MPIE
Description
0
Multiprocessor interrupts are disabled (normal receive operation) (Initial value)
[Clearing conditions]
•
The MPIE bit is cleared to 0.
•
MPB = 1 in received data.
Multiprocessor interrupts are enabled*
1
Receive-data-full interrupts (RXI), receive-error interrupts (ERI), and setting of
the RDRF, FER, and ORER status flags in SSR are disabled until data with the
multiprocessor bit set to 1 is received.
Note:
*
The SCI does not transfer receive data from RSR to RDR, does not detect receive
errors, and does not set the RDRF, FER, and ORER flags in SSR. When it receives
data in which MPB = 1, the SCI sets the MPB bit to 1 in SSR, automatically clears the
MPIE bit to 0, enables RXI and ERI interrupts (if the RIE bit is set to 1 in SCR), and
allows the FER and ORER flags to be set.
Bit 2—Transmit-End Interrupt Enable (TEIE): Enables or disables the transmit-end interrupt
(TEI) requested if TDR does not contain new transmit data when the MSB is transmitted.
Bit 2: TEIE
Description
0
Transmit-end interrupt requests (TEI) are disabled*
Transmit-end interrupt requests (TEI) are enabled*
1
Note:
*
(Initial value)
TEI interrupt requests can be cleared by reading the value 1 from the TDRE flag in
SSR, then clearing the TDRE flag to 0, thereby also clearing the TEND flag to 0; or by
clearing the TEIE bit to 0.
Rev. 3.00 Sep 27, 2006 page 466 of 872
REJ09B0325-0300
Section 13 Serial Communication Interface
Bits 1 and 0—Clock Enable 1 and 0 (CKE1, CKE0): These bits select the SCI clock source and
enable or disable clock output from the SCK pin. Depending on the settings of CKE1 and CKE0,
the SCK pin can be used for generic input/output, serial clock output, or serial clock input.
The CKE0 setting is valid only in asynchronous mode, and only when the SCI is internally
clocked (CKE1 = 0). The CKE0 setting is ignored in synchronous mode, or when an external
clock source is selected (CKE1 = 1). Select the SCI operating mode in SMR before setting the
CKE1 and CKE0 bits. For further details on selection of the SCI clock source, see table 13.9 in
section 13.3, Operation.
Bit 1:
CKE1
Bit 0:
CKE0
Description
0
0
Asynchronous mode
Internal clock, SCK pin available for generic
1
input/output*
Synchronous mode
Internal clock, SCK pin used for serial clock output*
2
Internal clock, SCK pin used for clock output*
1
Asynchronous mode
Synchronous mode
1
1
Internal clock, SCK pin used for serial clock output
3
External clock, SCK pin used for clock input*
0
Asynchronous mode
Synchronous mode
External clock, SCK pin used for serial clock input
1
Asynchronous mode
External clock, SCK pin used for clock input*
Synchronous mode
External clock, SCK pin used for serial clock input
3
Notes: 1. Initial value
2. The output clock frequency is the same as the bit rate.
3. The input clock frequency is 16 times the bit rate.
Rev. 3.00 Sep 27, 2006 page 467 of 872
REJ09B0325-0300
Section 13 Serial Communication Interface
13.2.7
Serial Status Register (SSR)
SSR is an 8-bit register containing multiprocessor bit values, and status flags that indicate SCI
operating status.
Bit
7
6
5
4
3
2
1
0
TDRE
RDRF
ORER
FER
PER
TEND
MPB
MPBT
Initial value
1
0
0
0
0
1
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R
R
R/W
Multiprocessor
bit transfer
Value of multiprocessor bit to
be transmitted
Multiprocessor bit
Stores the received
multiprocessor bit value
Transmit end
Status flag indicating end of
transmission
Parity error
Status flag indicating detection of
a receive parity error
Framing error
Status flag indicating detection of a receive
framing error
Overrun error
Status flag indicating detection of a receive overrun error
Receive data register full
Status flag indicating that data has been received and stored in RDR
Transmit data register empty
Status flag indicating that transmit data has been transferred from TDR into
TSR and new data can be written in TDR
Note: * Only 0 can be written, to clear the flag.
The CPU can always read and write SSR, but cannot write 1 in the TDRE, RDRF, ORER, PER,
and FER flags. These flags can be cleared to 0 only if they have first been read while set to 1. The
TEND and MPB flags are read-only bits that cannot be written.
SSR is initialized to H'84 by a reset and in standby mode.
Rev. 3.00 Sep 27, 2006 page 468 of 872
REJ09B0325-0300
Section 13 Serial Communication Interface
Bit 7—Transmit Data Register Empty (TDRE): Indicates that the SCI has loaded transmit data
from TDR into TSR and the next serial transmit data can be written in TDR.
Bit 7: TDRE
Description
0
TDR contains valid transmit data
[Clearing conditions]
1
•
Software reads TDRE while it is set to 1, then writes 0.
•
The DMAC writes data in TDR.
TDR does not contain valid transmit data
(Initial value)
[Setting conditions]
•
The chip is reset or enters standby mode.
•
The TE bit in SCR is cleared to 0.
•
TDR contents are loaded into TSR, so new data can be written in TDR.
Bit 6—Receive Data Register Full (RDRF): Indicates that RDR contains new receive data.
Bit 6: RDRF
Description
0
RDR does not contain new receive data
(Initial value)
[Clearing conditions]
1
•
The chip is reset or enters standby mode.
•
Software reads RDRF while it is set to 1, then writes 0.
•
The DMAC reads data from RDR.
RDR contains new receive data
[Setting condition]
When serial data is received normally and transferred from RSR to RDR.
Note: The RDR contents and RDRF flag are not affected by detection of receive errors or by
clearing of the RE bit to 0 in SCR. They retain their previous values. If the RDRF flag is still
set to 1 when reception of the next data ends, an overrun error occurs and receive data is
lost.
Rev. 3.00 Sep 27, 2006 page 469 of 872
REJ09B0325-0300
Section 13 Serial Communication Interface
Bit 5—Overrun Error (ORER): Indicates that data reception ended abnormally due to an
overrun error.
Bit 5: ORER
Description
0
Receiving is in progress or has ended normally
(Initial value)*
1
[Clearing conditions]
•
The chip is reset or enters standby mode.
•
1
Software reads ORER while it is set to 1, then writes 0.
2
A receive overrun error occurred*
[Setting condition]
Reception of the next serial data ends when RDRF = 1.
Notes: 1. Clearing the RE bit to 0 in SCR does not affect the ORER flag, which retains its
previous value.
2. RDR continues to hold the receive data before the overrun error, so subsequent receive
data is lost. Serial receiving cannot continue while the ORER flag is set to 1. In
synchronous mode, serial transmitting is also disabled.
Bit 4—Framing Error (FER): Indicates that data reception ended abnormally due to a framing
error in asynchronous mode.
Bit 4: FER
Description
0
Receiving is in progress or has ended normally
(Initial value)*
1
[Clearing conditions]
•
The chip is reset or enters standby mode.
•
1
Software reads FER while it is set to 1, then writes 0.
2
A receive framing error occurred*
[Setting condition]
The stop bit at the end of receive data is checked and found to be 0.
Notes: 1. Clearing the RE bit to 0 in SCR does not affect the FER flag, which retains its previous
value.
2. When the stop bit length is 2 bits, only the first bit is checked. The second stop bit is not
checked. When a framing error occurs the SCI transfers the receive data into RDR but
does not set the RDRF flag. Serial receiving cannot continue while the FER flag is set
to 1. In synchronous mode, serial transmitting is also disabled.
Rev. 3.00 Sep 27, 2006 page 470 of 872
REJ09B0325-0300
Section 13 Serial Communication Interface
Bit 3—Parity Error (PER): Indicates that data reception ended abnormally due to a parity error
in asynchronous mode.
Bit 3: PER
Description
0
Receiving is in progress or has ended normally*
1
(Initial value)
[Clearing conditions]
•
The chip is reset or enters standby mode.
•
1
Software reads PER while it is set to 1, then writes 0.
2
A receive parity error occurred*
[Setting condition]
The number of 1s in receive data, including the parity bit, does not match the
even or odd parity setting of O/E in SMR.
Notes: 1. Clearing the RE bit to 0 in SCR does not affect the PER flag, which retains its previous
value.
2. When a parity error occurs the SCI transfers the receive data into RDR but does not set
the RDRF flag. Serial receiving cannot continue while the PER flag is set to 1. In
synchronous mode, serial transmitting is also disabled.
Bit 2—Transmit End (TEND): Indicates that when the last bit of a serial character was
transmitted TDR did not contain new transmit data, so transmission has ended. The TEND flag is
a read-only bit and cannot be written.
Bit 2: TEND
Description
0
Transmission is in progress
[Clearing conditions]
1
•
Software reads TDRE while it is set to 1, then writes 0 in the TDRE flag.
•
The DMAC writes data in TDR.
End of transmission
(Initial value)
[Setting conditions]
•
The chip is reset or enters standby mode.
•
The TE bit is cleared to 0 in SCR.
•
TDRE is 1 when the last bit of a serial character is transmitted.
Rev. 3.00 Sep 27, 2006 page 471 of 872
REJ09B0325-0300
Section 13 Serial Communication Interface
Bit 1—Multiprocessor Bit (MPB): Stores the value of the multiprocessor bit in receive data
when a multiprocessor format is used in asynchronous mode. MPB is a read-only bit and cannot
be written.
Bit 1: MPB
Description
0
Multiprocessor bit value in receive data is 0*
1
Multiprocessor bit value in receive data is 1
Note:
*
(Initial value)
If the RE bit is cleared to 0 when a multiprocessor format is selected, MPB retains its
previous value.
Bit 0—Multiprocessor Bit Transfer (MPBT): Stores the value of the multiprocessor bit added to
transmit data when a multiprocessor format is selected for transmitting in asynchronous mode.
The MPBT setting is ignored in synchronous mode, when a multiprocessor format is not selected,
or when the SCI is not transmitting.
Bit 0: MPBT
Description
0
Multiprocessor bit value in transmit data is 0
1
Multiprocessor bit value in transmit data is 1
13.2.8
(Initial value)
Bit Rate Register (BRR)
BRR is an 8-bit register that, together with the CKS1 and CKS0 bits in SMR that select the baud
rate generator clock source, determines the serial communication bit rate.
Bit
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
The CPU can always read and write BRR. BRR is initialized to H'FF by a reset and in standby
mode. The two SCI channels have independent baud rate generator control, so different values can
be set in the two channels.
Table 13.3 shows examples of BRR settings in asynchronous mode. Table 13.4 shows examples of
BRR settings in synchronous mode.
Rev. 3.00 Sep 27, 2006 page 472 of 872
REJ09B0325-0300
Section 13 Serial Communication Interface
Table 13.3 Examples of Bit Rates and BRR Settings in Asynchronous Mode
φ (MHz)
2
2.097152
2.4576
3
Bit Rate
(bits/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
1
141
0.03
1
148
–0.04
1
174
–0.26
1
212
0.03
150
1
103
0.16
1
108
0.21
1
127
0.00
1
155
0.16
300
0
207
0.16
0
217
0.21
0
255
0.00
1
77
0.16
600
0
103
0.16
0
108
0.21
0
127
0.00
0
155
0.16
1200
0
51
0.16
0
54
–0.70
0
63
0.00
0
77
0.16
2400
0
25
0.16
0
26
1.14
0
31
0.00
0
38
0.16
4800
0
12
0.16
0
13
–2.48
0
15
0.00
0
19
–2.34
9600
0
6
–6.99
0
6
–2.48
0
7
0.00
0
9
–2.34
19200
0
2
8.51
0
2
13.78
0
3
0.00
0
4
–2.34
31250
0
1
0.00
0
1
4.86
0
1
22.88
0
2
0.00
38400
0
1
–18.62
0
1
–14.67
0
1
0.00
0
1
22.07
φ (MHz)
3.6864
4
4.9152
5
Bit Rate
(bits/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
2
64
0.70
2
70
0.03
2
86
0.31
2
88
–0.25
150
1
191
0.00
1
207
0.16
1
255
0.00
2
64
0.16
300
1
95
0.00
1
103
0.16
1
127
0.00
1
129
0.16
600
0
191
0.00
0
207
0.16
0
255
0.00
1
64
0.16
1200
0
95
0.00
0
103
0.16
0
127
0.00
0
129
0.16
2400
0
47
0.00
0
51
0.16
0
63
0.00
0
64
0.16
4800
0
23
0.00
0
25
0.16
0
31
0.00
0
32
–1.36
9600
0
11
0.00
0
12
0.16
0
15
0.00
0
15
1.73
19200
0
5
0.00
0
6
–6.99
0
7
0.00
0
7
1.73
31250
0
3
–7.84
0
3
0.00
0
4
–1.70
0
4
0.00
38400
0
2
0.00
0
2
8.51
0
3
0.00
0
3
1.73
Rev. 3.00 Sep 27, 2006 page 473 of 872
REJ09B0325-0300
Section 13 Serial Communication Interface
φ (MHz)
6
Bit Rate
(bits/s)
n
N
6.144
Error
(%)
n
7.3728
Error
(%)
N
n
8
N
Error
(%)
n
N
Error
(%)
110
2
106
–0.44
2
108
0.08
2
130
–0.07
2
141
0.03
150
2
77
0.16
2
79
0.00
2
95
0.00
2
103
0.16
300
1
155
0.16
1
159
0.00
1
191
0.00
1
207
0.16
600
1
77
0.16
1
79
0.00
1
95
0.00
1
103
0.16
1200
0
155
0.16
0
159
0.00
0
191
0.00
0
207
0.16
2400
0
77
0.16
0
79
0.00
0
95
0.00
0
103
0.16
4800
0
38
0.16
0
39
0.00
0
47
0.00
0
51
0.16
9600
0
19
–2.34
0
19
0.00
0
23
0.00
0
25
0.16
19200
0
9
–2.34
0
9
0.00
0
11
0.00
0
12
0.16
31250
0
5
0.00
0
5
2.40
0
6
5.33
0
7
0.00
38400
0
4
–2.34
0
4
0.00
0
5
0.00
0
6
–6.99
φ (MHz)
9.8304
10
12
12.288
Bit Rate
(bits/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
2
174
–0.26
2
177
–0.25
2
212
0.03
2
217
0.08
150
2
127
0.00
2
129
0.16
2
155
0.16
2
159
0.00
300
1
255
0.00
2
64
0.16
2
77
0.16
2
79
0.00
600
1
127
0.00
1
129
0.16
1
155
0.16
1
159
0.00
1200
0
255
0.00
1
64
0.16
1
77
0.16
1
79
0.00
2400
0
127
0.00
0
129
0.16
0
155
0.16
0
159
0.00
4800
0
63
0.00
0
64
0.16
0
77
0.16
0
79
0.00
9600
0
31
0.00
0
32
–1.36
0
38
0.16
0
39
0.00
19200
0
15
0.00
0
15
1.73
0
19
–2.34
0
19
0.00
31250
0
9
–1.70
0
9
0.00
0
11
0.00
0
11
2.40
38400
0
7
0.00
0
7
1.73
0
9
–2.34
0
9
0.00
Rev. 3.00 Sep 27, 2006 page 474 of 872
REJ09B0325-0300
Section 13 Serial Communication Interface
φ (MHz)
13
Bit Rate
(bits/s)
n
14
Error
(%)
N
n
14.7456
Error
(%)
N
n
Error
(%)
N
16
n
N
Error
(%)
110
2
230
–0.08
2
248
–0.17
3
64
0.70
3
70
0.03
150
2
168
0.16
2
181
0.16
2
191
0.00
2
207
0.16
300
2
84
–0.43
2
90
0.16
2
95
0.00
2
103
0.16
600
1
168
0.16
1
181
0.16
1
191
0.00
1
207
0.16
1200
1
84
–0.43
1
90
0.16
1
95
0.00
1
103
0.16
2400
0
168
0.16
0
181
0.16
0
191
0.00
0
207
0.16
4800
0
84
–0.43
0
90
0.16
0
95
0.00
0
103
0.16
9600
0
41
0.76
0
45
–0.93
0
47
0.00
0
51
0.16
19200
0
20
0.76
0
22
–0.93
0
23
0.00
0
25
0.16
31250
0
12
0.00
0
13
0.00
0
14
–1.70
0
15
0.00
38400
0
10
–3.82
0
10
3.57
0
11
0.00
0
12
0.16
φ (MHz)
18
20
25
Bit Rate
(bits/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
3
79
–0.12
3
88
–0.25
3
110
–0.02
150
2
233
0.16
3
64
0.16
3
80
0.47
300
2
116
0.16
2
129
0.16
2
162
–0.15
600
1
233
0.16
2
64
0.16
2
80
0.47
1200
1
116
0.16
1
129
0.16
1
162
–0.15
2400
0
233
0.16
1
64
0.16
1
80
0.47
4800
0
116
0.16
0
129
0.16
0
162
–0.15
9600
0
58
–0.69
0
64
0.16
0
80
0.47
19200
0
28
1.02
0
32
–1.36
0
40
–0.76
31250
0
17
0.00
0
19
0.00
0
24
0.00
38400
0
14
–2.34
0
15
1.73
0
19
1.73
Rev. 3.00 Sep 27, 2006 page 475 of 872
REJ09B0325-0300
Section 13 Serial Communication Interface
Table 13.4 Examples of Bit Rates and BRR Settings in Synchronous Mode
φ (MHz)
Bit Rate
(bits/s) n
2
4
N
n
N
8
n
N
10
n
N
13
n
N
16
n
N
18
n
N
20
n
N
25
n
N
110
3
70
— —
— —
— —
— —
— —
— —
— —
— —
250
2
124
2
249
3
124
— —
3
202
3
249
— —
— —
— —
500
1
249
2
124
2
249
— —
3
101
3
124
3
140
3
155
— —
1k
1
124
1
249
2
124
— —
2
202
2
249
3
69
3
77
3
97
2.5 k
0
199
1
99
1
199
1
249
2
80
2
99
2
112
2
124
2
155
5k
0
99
0
199
1
99
1
124
1
162
1
199
1
224
1
249
2
77
10 k
0
49
0
99
0
199
0
249
1
80
1
99
1
112
1
124
1
155
25 k
0
19
0
39
0
79
0
99
0
129
0
159
0
179
0
199
0
249
50 k
0
9
0
19
0
39
0
49
0
64
0
79
0
89
0
99
0
124
100 k
0
4
0
9
0
19
0
24
— —
0
39
0
44
0
49
0
62
250 k
0
1
0
3
0
7
0
9
0
12
0
15
0
17
0
19
0
24
0
0*
0
1
0
3
0
4
— —
0
7
0
8
0
9
— —
0
0*
0
1
— —
— —
0
3
0
4
0
4
— —
2M
0
0*
0
1
— —
— —
— —
— —
— —
0 0*
— —
2.5 M
— —
— —
0 0*
— —
— —
— —
— —
— —
— —
500 k
1M
4M
Legend:
Blank: No setting available
—:
Setting possible, but error occurs
*:
Continuous transmit/receive not possible
Note: Settings with an error of 1% or less are recommended.
Rev. 3.00 Sep 27, 2006 page 476 of 872
REJ09B0325-0300
Section 13 Serial Communication Interface
The BRR setting is calculated as follows:
Asynchronous mode:
N=
φ
64 ×
22n−1
×B
× 106 − 1
Synchronous mode:
N=
B:
N:
φ:
n:
φ
8 × 22n−1 × B
× 106 − 1
Bit rate (bits/s)
BRR setting for baud rate generator (0 ≤ N ≤ 255)
System clock frequency (MHz)
Baud rate generator clock source (n = 0, 1, 2, 3)
(For the clock sources and values of n, see the following table.)
SMR Settings
n
Clock Source
CKS1
CKS0
0
φ
0
0
1
φ/4
0
1
2
φ/16
1
0
3
φ/64
1
1
The bit rate error in asynchronous mode is calculated as follows.
Error (%) =
φ × 106
(N + 1) × B × 64 × 22n−1
− 1 × 100
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Section 13 Serial Communication Interface
Table 13.5 indicates the maximum bit rates in asynchronous mode for various system clock
frequencies. Tables 13.6 and 13.7 indicate the maximum bit rates with external clock input.
Table 13.5 Maximum Bit Rates for Various Frequencies (Asynchronous Mode)
Settings
φ (MHz)
Maximum Bit Rate (bits/s)
n
N
2
62500
0
0
2.097152
65536
0
0
2.4576
76800
0
0
3
93750
0
0
3.6864
115200
0
0
4
125000
0
0
4.9152
153600
0
0
5
156250
0
0
6
187500
0
0
6.144
192000
0
0
7.3728
230400
0
0
8
250000
0
0
9.8304
307200
0
0
10
312500
0
0
12
375000
0
0
12.288
384000
0
0
14
437500
0
0
14.7456
460800
0
0
16
500000
0
0
17.2032
537600
0
0
18
562500
0
0
20
625000
0
0
25
781250
0
0
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Section 13 Serial Communication Interface
Table 13.6 Maximum Bit Rates with External Clock Input (Asynchronous Mode)
φ (MHz)
External Input Clock (MHz)
Maximum Bit Rate (bits/s)
2
0.5000
31250
2.097152
0.5243
32768
2.4576
0.6144
38400
3
0.7500
46875
3.6864
0.9216
57600
4
1.0000
62500
4.9152
1.2288
76800
5
1.2500
78125
6
1.5000
93750
6.144
1.5360
96000
7.3728
1.8432
115200
8
2.0000
125000
9.8304
2.4576
153600
10
2.5000
156250
12
3.0000
187500
12.288
3.0720
192000
14
3.5000
218750
14.7456
3.6864
230400
16
4.0000
250000
17.2032
4.3008
268800
18
4.5000
281250
20
5.0000
312500
25
6.2500
390625
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Section 13 Serial Communication Interface
Table 13.7 Maximum Bit Rates with External Clock Input (Synchronous Mode)
φ (MHz)
External Input Clock (MHz)
Maximum Bit Rate (bits/s)
2
0.3333
333333.3
4
0.6667
666666.7
6
1.0000
1000000.0
8
1.3333
1333333.3
10
1.6667
1666666.7
12
2.0000
2000000.0
14
2.3333
2333333.3
16
2.6667
2666666.7
18
3.0000
3000000.0
20
3.3333
3333333.3
25
4.1667
4166666.7
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Section 13 Serial Communication Interface
13.3
Operation
13.3.1
Overview
The SCI has an asynchronous mode in which characters are synchronized individually, and a
synchronous mode in which communication is synchronized with clock pulses. Serial
communication is possible in either mode. Asynchronous or synchronous mode and the
communication format are selected in SMR, as shown in table 13.8. The SCI clock source is
selected by the C/A bit in SMR and the CKE1 and CKE0 bits in SCR, as shown in table 13.9.
Asynchronous Mode:
• Data length is selectable: 7 or 8 bits.
• Parity and multiprocessor bits are selectable. So is the stop bit length (1 or 2 bits). These
selections determine the communication format and character length.
• In receiving, it is possible to detect framing errors, parity errors, overrun errors, and the break
state.
• An internal or external clock can be selected as the SCI clock source.
 When an internal clock is selected, the SCI operates using the on-chip baud rate generator,
and can output a serial clock signal with a frequency matching the bit rate.
 When an external clock is selected, the external clock input must have a frequency 16 times
the bit rate. (The on-chip baud rate generator is not used.)
Synchronous Mode:
• The communication format has a fixed 8-bit data length.
• In receiving, it is possible to detect overrun errors.
• An internal or external clock can be selected as the SCI clock source.
 When an internal clock is selected, the SCI operates using the on-chip baud rate generator,
and outputs a serial clock signal to external devices.
 When an external clock is selected, the SCI operates on the input serial clock. The on-chip
baud rate generator is not used.
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Section 13 Serial Communication Interface
Table 13.8 SMR Settings and Serial Communication Formats
SMR Settings
SCI Communication Format
Bit 7: Bit 6: Bit 2: Bit 5: Bit 3:
C/A
A
CHR MP
PE
STOP Mode
0
0
0
0
Asynchronous
mode
0
1
1
Data
Length
Multiprocessor Parity
Bit
Bit
8-bit data
Absent
Absent
0
0
Present
0
7-bit data
Absent
1
—
0
Present
0
0
Asynchronous
mode (multiprocessor
format)
8-bit data
Synchronous
mode
8-bit data
Present
Absent
—
—
—
1 bit
2 bits
7-bit data
1 bit
1
1
1 bit
2 bits
1
1
1 bit
2 bits
1
0
1 bit
2 bits
1
1
1 bit
2 bits
1
1
Stop
Bit
Length
2 bits
—
Absent
None
Table 13.9 SMR and SCR Settings and SCI Clock Source Selection
SMR
SCR Settings
Bit 7:
C/A
A
Bit 1:
CKE1
Bit 0:
CKE0
0
0
0
1
1
SCI Transmit/Receive Clock
Mode
Asynchronous
mode
0
Clock
Source
SCK Pin Function
Internal
SCI does not use the SCK pin
Outputs a clock with frequency
matching the bit rate
External
Inputs a clock with frequency 16
times the bit rate
Internal
Outputs the serial clock
External
Inputs the serial clock
1
1
0
0
1
1
Synchronous
mode
0
1
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Section 13 Serial Communication Interface
13.3.2
Operation in Asynchronous Mode
In asynchronous mode each transmitted or received character begins with a start bit and ends with
a stop bit. Serial communication is synchronized one character at a time.
The transmitting and receiving sections of the SCI are independent, so full duplex communication
is possible. The transmitter and receiver are both double buffered, so data can be written and read
while transmitting and receiving are in progress, enabling continuous transmitting and receiving.
Figure 13.2 shows the general format of asynchronous serial communication. In asynchronous
serial communication the communication line is normally held in the mark (high) state. The SCI
monitors the line and starts serial communication when the line goes to the space (low) state,
indicating a start bit. One serial character consists of a start bit (low), data (LSB first), parity bit
(high or low), and stop bit (high), in that order.
When receiving in asynchronous mode, the SCI synchronizes at the falling edge of the start bit.
The SCI samples each data bit on the eighth pulse of a clock with a frequency 16 times the bit rate.
Receive data is latched at the center of each bit.
1
Serial data
(LSB)
0
D0
Idle (mark) state
1
(MSB)
D1
D2
D3
D4
D5
Start
bit
Transmit or receive data
1 bit
7 bits or 8 bits
D6
D7
0/1
Parity
bit
1
1
Stop
bit
1 bit or 1 bit or
no bit 2 bits
One unit of data (character or frame)
Figure 13.2 Data Format in Asynchronous Communication
(Example: 8-Bit Data with Parity and 2 Stop Bits)
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Section 13 Serial Communication Interface
Communication Formats
Table 13.10 shows the 12 communication formats that can be selected in asynchronous mode. The
format is selected by settings in SMR.
Table 13.10 Serial Communication Formats (Asynchronous Mode)
SMR Settings
Serial Communication Format and Frame Length
CHR
PE
MP
STOP
1
2
3
0
0
0
0
S
8-bit data
STOP
0
0
0
1
S
8-bit data
STOP STOP
0
1
0
0
S
8-bit data
P
STOP
0
1
0
1
S
8-bit data
P
STOP STOP
1
0
0
0
S
7-bit data
STOP
1
0
0
1
S
7-bit data
STOP STOP
1
1
0
0
S
7-bit data
P
STOP
1
1
0
1
S
7-bit data
P
STOP STOP
0
—
1
0
S
8-bit data
MPB STOP
0
—
1
1
S
8-bit data
MPB STOP STOP
1
—
1
0
S
7-bit data
MPB STOP
1
—
1
1
S
7-bit data
MPB STOP STOP
Legend:
S:
Start bit
STOP: Stop bit
P:
Parity bit
MPB: Multiprocessor bit
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4
5
6
7
8
9
10
11
12
Section 13 Serial Communication Interface
Clock
An internal clock generated by the on-chip baud rate generator or an external clock input from the
SCK pin can be selected as the SCI transmit/receive clock. The clock source is selected by the C/A
bit in SMR and bits CKE1 and CKE0 in SCR. See table 13.9.
When an external clock is input at the SCK pin, it must have a frequency equal to 16 times the
desired bit rate.
When the SCI operates on an internal clock, it can output a clock signal at the SCK pin. The
frequency of this output clock is equal to the bit rate. The phase is aligned as in figure 13.3 so that
the rising edge of the clock occurs at the center of each transmit data bit.
0
D0
D1
D2
D3
D4
D5
D6
D7
0/1
1
1
1 frame
Figure 13.3 Phase Relationship between Output Clock and Serial Data
(Asynchronous Mode)
Transmitting and Receiving Data
SCI Initialization (Asynchronous Mode): Before transmitting or receiving, clear the TE and RE
bits to 0 in SCR, then initialize the SCI as follows.
When changing the communication mode or format, always clear the TE and RE bits to 0 before
following the procedure given below. Clearing TE to 0 sets the TDRE flag to 1 and initializes
TSR. Clearing RE to 0, however, does not initialize the RDRF, PER, FER, and ORER flags and
RDR, which retain their previous contents.
When an external clock is used, the clock should not be stopped during initialization or subsequent
operation. SCI operation becomes unreliable if the clock is stopped.
Figure 13.4 is a sample flowchart for initializing the SCI.
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Section 13 Serial Communication Interface
Start of initialization
Clear TE and RE bits
to 0 in SCR
Set CKE1 and CKE0 bits
in SCR (leaving TE and
RE bits cleared to 0)
1
Select communication
format in SMR
2
Set value in BRR
3
1. Select the clock source in SCR. Clear the RIE, TIE, TEIE,
MPIE, TE, and RE bits to 0. If clock output is selected in
asynchronous mode, clock output starts immediately after
the setting is made in SCR.
2. Select the communication format in SMR.
3. Write the value corresponding to the bit rate in BRR.
This step is not necessary when an external clock is used.
4. Wait for at least the interval required to transmit or receive
1 bit, then set the TE or RE bit to 1 in SCR. Set the RIE,
TIE, TEIE, and MPIE bits as necessary. Setting the TE
or RE bit enables the SCI to use the TxD or RxD pin.
Wait
1 bit interval
elapsed?
No
Yes
Set TE or RE bit to 1 in SCR
Set RIE, TIE, TEIE, and
MPIE bits as necessary
4
Transmitting or receiving
Figure 13.4 Sample Flowchart for SCI Initialization
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Section 13 Serial Communication Interface
Transmitting Serial Data (Asynchronous Mode): Figure 13.5 shows a sample flowchart for
transmitting serial data and indicates the procedure to follow.
1
Initialize
Start transmitting
2
Read TDRE flag in SSR
No
TDRE = 1?
Yes
Write transmit data
in TDR and clear TDRE
flag to 0 in SSR
All data
transmitted?
No
1. SCI initialization: the transmit data output function
of the TxD pin is selected automatically.
2. SCI status check and transmit data write: read SSR,
check that the TDRE flag is 1, then write transmit data
in TDR and clear the TDRE flag to 0.
3. To continue transmitting serial data: after checking
that the TDRE flag is 1, indicating that data can be
written, write data in TDR, then clear the TDRE
flag to 0. When the DMAC is activated by a transmitdata-empty interrupt request (TXI) to write data in TDR,
the TDRE flag is checked and cleared automatically.
4. To output a break signal at the end of serial transmission:
set the DDR bit to 1 and clear the DR bit to 0
(DDR and DR are I/O port registers), then clear the
TE bit to 0 in SCR.
3
Yes
Read TEND flag in SSR
TEND = 1?
No
Yes
Output break
signal?
No
4
Yes
Clear DR bit to 0,
set DDR bit to 1
Clear TE bit to 0 in SCR
End
Figure 13.5 Sample Flowchart for Transmitting Serial Data
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Section 13 Serial Communication Interface
In transmitting serial data, the SCI operates as follows.
1. The SCI monitors the TDRE flag in SSR. When the TDRE flag is cleared to 0 the SCI
recognizes that TDR contains new data, and loads this data from TDR into TSR.
2. After loading the data from TDR into TSR, the SCI sets the TDRE flag to 1 and starts
transmitting. If the TIE bit is set to 1 in SCR, the SCI requests a transmit-data-empty interrupt
(TXI) at this time.
Serial transmit data is transmitted in the following order from the TxD pin:
a. Start bit: One 0 bit is output.
b. Transmit data: 7 or 8 bits are output, LSB first.
c. Parity bit or multiprocessor bit: One parity bit (even or odd parity) or one multiprocessor
bit is output. Formats in which neither a parity bit nor a multiprocessor bit is output can
also be selected.
d. Stop bit: One or two 1 bits (stop bits) are output.
e. Mark state: Output of 1 bits continues until the start bit of the next transmit data.
3. The SCI checks the TDRE flag when it outputs the stop bit. If the TDRE flag is 0, the SCI
loads new data from TDR into TSR, outputs the stop bit, then begins serial transmission of the
next frame. If the TDRE flag is 1, the SCI sets the TEND flag to 1 in SSR, outputs the stop bit,
then continues output of 1 bits in the mark state. If the TEIE bit is set to 1 in SCR, a transmitend interrupt (TEI) is requested at this time.
Figure 13.6 shows an example of SCI transmit operation in asynchronous mode.
1
Start
bit
0
Parity Stop Start
bit
bit
bit
Data
D0
D1
D7
0/1
1
0
Parity Stop
bit
bit
Data
D0
D1
D7
0/1
1
1
Idle (mark)
state
TDRE
TEND
TXI
interrupt
request
TXI interrupt handler
writes data in TDR and
clears TDRE flag to 0
TXI
interrupt
request
TEI interrupt request
1 frame
Figure 13.6 Example of SCI Transmit Operation in Asynchronous Mode
(8-Bit Data with Parity and 1 Stop Bit)
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Section 13 Serial Communication Interface
Receiving Serial Data (Asynchronous Mode): Figure 13.7 shows a sample flowchart for
receiving serial data and indicates the procedure to follow.
1
Initialize
Start receiving
Read ORER, PER,
and FER flags in SSR
PER ∨ FER ∨
ORER = 1?
2
Yes
3
No
Error handling
(continued on next page)
4
Read RDRF flag in SSR
No
RDRF = 1?
1. SCI initialization: the receive data function of
the RxD pin is selected automatically.
2, 3. Receive error handling and break
detection: if a receive error occurs, read the
ORER, PER, and FER flags in SSR to identify
the error. After executing the necessary error
handling, clear the ORER, PER, and FER
flags all to 0. Receiving cannot resume if any
of the ORER, PER, and FER flags remains
set to 1. When a framing error occurs, the
RxD pin can be read to detect the break state.
4. SCI status check and receive data read: read
SSR, check that RDRF is set to 1, then read
receive data from RDR and clear the RDRF
flag to 0. Notification that the RDRF flag has
changed from 0 to 1 can also be given by the
RXI interrupt.
5. To continue receiving serial data: check the
RDRF flag, read RDR, and clear the RDRF
flag to 0 before the stop bit of the current
frame is received. If the DMAC is activated
by an RXI interrupt to read the RDR value,
the RDRF flag is cleared automatically.
Yes
Read receive data
from RDR, and clear
RDRF flag to 0 in SSR
No
Finished
receiving?
5
Yes
Clear RE bit to 0 in SCR
End
Figure 13.7 Sample Flowchart for Receiving Serial Data (1)
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Section 13 Serial Communication Interface
3
Error handling
No
ORER = 1?
Yes
Overrun error handling
No
FER = 1?
Yes
Break?
Yes
No
Framing error handling
Clear RE bit to 0 in SCR
No
PER = 1?
Yes
Parity error handling
Clear ORER, PER, and
FER flags to 0 in SSR
End
Figure 13.7 Sample Flowchart for Receiving Serial Data (2)
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Section 13 Serial Communication Interface
In receiving, the SCI operates as follows.
1. The SCI monitors the receive data line. When it detects a start bit, the SCI synchronizes
internally and starts receiving.
2. Receive data is stored in RSR in order from LSB to MSB.
3. The parity bit and stop bit are received.
After receiving, the SCI makes the following checks:
a. Parity check: The number of 1s in the receive data must match the even or odd parity
setting of the O/E bit in SMR.
b. Stop bit check: The stop bit value must be 1. If there are two stop bits, only the first stop bit
is checked.
c. Status check: The RDRF flag must be 0 so that receive data can be transferred from RSR
into RDR.
If these checks all pass, the RDRF flag is set to 1 and the received data is stored in RDR. If one
of the checks fails (receive error)*, the SCI operates as indicated in table 13.11.
Note: * When a receive error occurs, further receiving is disabled. In receiving, the RDRF flag
is not set to 1. Be sure to clear the error flags to 0.
4. When the RDRF flag is set to 1, if the RIE bit is set to 1 in SCR, a receive-data-full interrupt
(RXI) is requested. If the ORER, PER, or FER flag is set to 1 and the RIE bit in SCR is also
set to 1, a receive-error interrupt (ERI) is requested.
Table 13.11 Receive Error Conditions
Receive Error
Abbreviation
Condition
Data Transfer
Overrun error
ORER
Receiving of next data ends
while RDRF flag is still set
to 1 in SSR
Receive data not transferred
from RSR to RDR
Framing error
FER
Stop bit is 0
Receive data transferred from
RSR to RDR
Parity error
PER
Parity of receive data differs
from even/odd parity setting
in SMR
Receive data transferred from
RSR to RDR
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Section 13 Serial Communication Interface
Figure 13.8 shows an example of SCI receive operation in asynchronous mode.
1
Start
bit
0
Parity Stop Start
bit
bit
bit
Data
D0
D1
D7
0/1
1
0
Parity Stop
bit
bit
Data
D0
D1
D7
0/1
1
1
Idle (mark)
state
RDRF
FER
RXI
request
1 frame
RXI interrupt handler
reads data in RDR and
clears RDRF flag to 0
Framing error,
ERI request
Figure 13.8 Example of SCI Receive Operation (8-Bit Data with Parity and One Stop Bit)
13.3.3
Multiprocessor Communication
The multiprocessor communication function enables several processors to share a single serial
communication line. The processors communicate in asynchronous mode using a format with an
additional multiprocessor bit (multiprocessor format).
In multiprocessor communication, each receiving processor is addressed by an ID. A serial
communication cycle consists of an ID-sending cycle that identifies the receiving processor, and a
data-sending cycle. The multiprocessor bit distinguishes ID-sending cycles from data-sending
cycles.
The transmitting processor starts by sending the ID of the receiving processor with which it wants
to communicate as data with the multiprocessor bit set to 1. Next the transmitting processor sends
transmit data with the multiprocessor bit cleared to 0.
Receiving processors skip incoming data until they receive data with the multiprocessor bit set
to 1. When they receive data with the multiprocessor bit set to 1, receiving processors compare the
data with their IDs. The receiving processor with a matching ID continues to receive further
incoming data. Processors with IDs not matching the received data skip further incoming data
until they again receive data with the multiprocessor bit set to 1. Multiple processors can send and
receive data in this way.
Figure 13.9 shows an example of communication among different processors using a
multiprocessor format.
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Section 13 Serial Communication Interface
Communication Formats
Four formats are available. Parity-bit settings are ignored when a multiprocessor format is
selected. For details see table 13.10.
Clock
See the description of asynchronous mode.
Transmitting
processor
Serial communication line
Receiving
processor A
Receiving
processor B
Receiving
processor C
Receiving
processor D
(ID = 01)
(ID = 02)
(ID = 03)
(ID = 04)
H'01
Serial data
(MPB = 1)
ID-sending cycle: receiving
processor address
H'AA
(MPB = 0)
Data-sending cycle:
data sent to receiving
processor specified by ID
Legend:
MPB: Multiprocessor bit
Figure 13.9 Example of Communication among Processors Using Multiprocessor Format
(Sending Data H'AA to Receiving Processor A)
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Section 13 Serial Communication Interface
Transmitting and Receiving Data
Transmitting Multiprocessor Serial Data: Figure 13.10 shows a sample flowchart for
transmitting multiprocessor serial data and indicates the procedure to follow.
1
Initialize
Start transmitting
2
Read TDRE flag in SSR
TDRE = 1?
No
Yes
Write transmit data in
TDR and set MPBT bit in SSR
Clear TDRE flag to 0
All data transmitted?
No
3
Yes
1. SCI initialization: the transmit data
output function of the TxD pin is
selected automatically.
2. SCI status check and transmit data
write: read SSR, check that the TDRE
flag is 1, then write transmit
data in TDR. Also set the MPBT flag to
0 or 1 in SSR. Finally, clear the TDRE
flag to 0.
3. To continue transmitting serial data:
after checking that the TDRE flag is 1,
indicating that data can be
written, write data in TDR, then clear
the TDRE flag to 0. When the DMAC
is activated by a transmit-data-empty
interrupt request (TXI) to write data in
TDR, the TDRE flag is checked and
cleared automatically.
4. To output a break signal at the end of
serial transmission: set the DDR bit to
1 and clear the DR bit to 0 (DDR and
DR are I/O port registers), then clear
the TE bit to 0 in SCR.
Read TEND flag in SSR
TEND = 1?
No
Yes
Output break signal?
No
4
Yes
Clear DR bit to 0, set DDR bit to 1
Clear TE bit to 0 in SCR
End
Figure 13.10 Sample Flowchart for Transmitting Multiprocessor Serial Data
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Section 13 Serial Communication Interface
In transmitting serial data, the SCI operates as follows.
1. The SCI monitors the TDRE flag in SSR. When the TDRE flag is cleared to 0 the SCI
recognizes that TDR contains new data, and loads this data from TDR into TSR.
2. After loading the data from TDR into TSR, the SCI sets the TDRE flag to 1 and starts
transmitting. If the TIE bit in SCR is set to 1, the SCI requests a transmit-data-empty interrupt
(TXI) at this time.
Serial transmit data is transmitted in the following order from the TxD pin:
a. Start bit: One 0 bit is output.
b. Transmit data: 7 or 8 bits are output, LSB first.
c. Multiprocessor bit: One multiprocessor bit (MPBT value) is output.
d. Stop bit: One or two 1 bits (stop bits) are output.
e. Mark state: Output of 1 bits continues until the start bit of the next transmit data.
3. The SCI checks the TDRE flag when it outputs the stop bit. If the TDRE flag is 0, the SCI
loads data from TDR into TSR, outputs the stop bit, then begins serial transmission of the next
frame. If the TDRE flag is 1, the SCI sets the TEND flag in SSR to 1, outputs the stop bit, then
continues output of 1 bits in the mark state. If the TEIE bit is set to 1 in SCR, a transmit-end
interrupt (TEI) is requested at this time.
Figure 13.11 shows an example of SCI transmit operation using a multiprocessor format.
Multiprocessor
bit
1
Start
bit
0
Stop Start
bit
bit
Data
D0
D1
Multiprocessor
bit
D7
0/1
1
0
Stop
bit
Data
D0
D1
D7
0/1
1
1
Idle (mark)
state
TDRE
TEND
TXI
request
TXI interrupt handler
writes data in TDR and
clears TDRE flag to 0
TXI
request
TEI request
1 frame
Figure 13.11 Example of SCI Transmit Operation
(8-Bit Data with Multiprocessor Bit and One Stop Bit)
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Section 13 Serial Communication Interface
Receiving Multiprocessor Serial Data: Figure 13.12 shows a sample flowchart for receiving
multiprocessor serial data and indicates the procedure to follow.
Initialize
1
1. SCI initialization: the receive data function
of the RxD pin is selected automatically.
2. ID receive cycle: set the MPIE bit to 1 in SCR.
3. SCI status check and ID check: read SSR,
check that the RDRF flag is set to 1, then read
data from RDR and compare with the
processor’s own ID. If the ID does not match,
set the MPIE bit to 1 again and clear the
RDRF flag to 0. If the ID matches, clear the
RDRF flag to 0.
4. SCI status check and data receiving: read
SSR, check that the RDRF flag is set to 1,
then read data from RDR.
5. Receive error handling and break detection:
if a receive error occurs, read the
ORER and FER flags in SSR to identify the error.
After executing the necessary error handling,
clear the ORER and FER flags both to 0.
Receiving cannot resume while either the ORER
or FER flag remains set to 1. When a framing
error occurs, the RxD pin can be read to detect
the break state.
Start receiving
Set MPIE bit to 1 in SCR
2
Read ORER and FER flags in SSR
FER ∨ ORER = 1
Yes
No
Read RDRF flag in SSR
3
No
RDRF = 1?
Yes
Read receive data from RDR
No
Own ID?
Yes
Read ORER and FER flags in SSR
FER ∨ ORER = 1
Yes
No
Read RDRF flag in SSR
4
No
RDRF = 1?
Yes
Read receive data from RDR
No
5
Finished receiving?
Yes
Error handling
(continued on next page)
Clear RE bit to 0 in SCR
End
Figure 13.12 Sample Flowchart for Receiving Multiprocessor Serial Data (1)
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Section 13 Serial Communication Interface
5
Error handling
No
ORER = 1?
Yes
Overrun error handling
No
FER = 1?
Yes
Break?
Yes
No
Framing error handling
Clear RE bit to 0 in SCR
Clear ORER, PER, and FER
flags to 0 in SSR
End
Figure 13.12 Sample Flowchart for Receiving Multiprocessor Serial Data (2)
Figure 13.13 shows an example of SCI receive operation using a multiprocessor format.
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Section 13 Serial Communication Interface
1
Start
bit
0
MPB
Data (ID1)
D0
D1
D7
1
Stop Start
Data (data1)
bit
bit
1
0
D0
D1
MPB
D7
0
Stop
bit
1
1
Idle (mark)
state
MPIE
RDRF
RDR value
ID1
RXI request
(multiprocessor
interrupt)
MPB detection
MPIE= 0
RXI handler reads
RDR data and clears
RDRF flag to 0
Not own ID, so
MPIE bit is set
to 1 again
No RXI request,
RDR not updated
a. Own ID does not match data
1
Start
bit
0
MPB
Data (ID2)
D0
D1
D7
1
Stop Start
Data (data2)
bit
bit
1
0
D0
D1
MPB
D7
0
Stop
bit
1
1
Idle (mark)
state
MPIE
RDRF
RDR value
ID2
MPB detection
MPIE= 0
RXI request
(multiprocessor
interrupt)
RXI interrupt handler Own ID, so receiving MPIE bit is set
reads RDR data and continues, with data to 1 again
clears RDRF flag to 0 received by RXI
interrupt handler
b. Own ID matches data
Figure 13.13 Example of SCI Receive Operation
(8-Bit Data with Multiprocessor Bit and One Stop Bit)
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Data 2
Section 13 Serial Communication Interface
13.3.4
Synchronous Operation
In synchronous mode, the SCI transmits and receives data in synchronization with clock pulses.
This mode is suitable for high-speed serial communication.
The SCI transmitter and receiver share the same clock but are otherwise independent, so full
duplex communication is possible. The transmitter and receiver are also double buffered, so
continuous transmitting or receiving is possible by reading or writing data while transmitting or
receiving is in progress.
Figure 13.14 shows the general format in synchronous serial communication.
One unit (character or frame) of serial data
*
*
Serial clock
LSB
Serial data
Bit 0
MSB
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Don’t care
Don’t care
Note: * High except in continuous transmitting or receiving
Figure 13.14 Data Format in Synchronous Communication
In synchronous serial communication, each data bit is placed on the communication line from one
falling edge of the serial clock to the next. Data is guaranteed valid at the rise of the serial clock.
In each character, the serial data bits are transmitted in order from LSB (first) to MSB (last). After
output of the MSB, the communication line remains in the state of the MSB. In synchronous mode
the SCI receives data by synchronizing with the rise of the serial clock.
Communication Format
The data length is fixed at 8 bits. No parity bit or multiprocessor bit can be added.
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Section 13 Serial Communication Interface
Clock
An internal clock generated by the on-chip baud rate generator or an external clock input from the
SCK pin can be selected by setting the C/A bit in SMR and the CKE1 and CKE0 bits in SCR. See
table 13.9. When the SCI operates on an internal clock, it outputs the clock signal at the SCK pin.
Eight clock pulses are output per transmitted or received character.
When the SCI operates on an internal clock, the serial clock outputs the clock signal at the SCK
pin. Eight clock pulses are output per transmitted or received character. When the SCI is not
transmitting or receiving, the clock signal remains in the high state. However, when receiving
only, overrun error may occur or the serial clock continues output until the RE bit clears at 0.
When transmitting or receiving in single characters, select the external clock.
Transmitting and Receiving Data
SCI Initialization (Synchronous Mode): Before transmitting or receiving, clear the TE and
RE bits to 0 in SCR, then initialize the SCI as follows.
When changing the communication mode or format, always clear the TE and RE bits to 0 before
following the procedure given below. Clearing the TE bit to 0 sets the TDRE flag to 1 and
initializes TSR. Clearing the RE bit to 0, however, does not initialize the RDRF, PER, FER, and
ORE flags and RDR, which retain their previous contents.
Figure 13.15 is a sample flowchart for initializing the SCI.
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Section 13 Serial Communication Interface
Start of initialization
Clear TE and RE
bits to 0 in SCR
Set RIE, TIE, TEIE, MPIE,
CKE1, and CKE0 bits in SCR
(leaving TE and RE bits
cleared to 0)
1
1. Select the clock source in SCR. Clear the RIE, TIE, TEIE,
MPIE, TE, and RE bits to 0.
2. Select the communication format in SMR.
3. Write the value corresponding to the bit rate in BRR.
This step is not necessary when an external clock is used.
4. Wait for at least the interval required to transmit or receive
one bit, then set the TE or RE bit to 1 in SCR. Also set
the RIE, TIE, TEIE, and MPIE bits as necessary.
Setting the TE or RE bit enables the SCI to use the
TxD or RxD pin.
2
Select communication
format in SMR
3
Set value in BRR
Wait
1 bit interval
elapsed?
No
Yes
Set TE or RE to 1 in SCR
Set RIE, TIE, TEIE, and
MPIE bits as necessary
Start transmitting or receiving
4
Note: In simultaneous transmitting and receiving, the TE and
RE bits should be cleared to 0 or set to 1 simultaneously.
Figure 13.15 Sample Flowchart for SCI Initialization
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Section 13 Serial Communication Interface
Transmitting Serial Data (Synchronous Mode): Figure 13.16 shows a sample flowchart for
transmitting serial data and indicates the procedure to follow.
Initialize
1
Start transmitting
Read TDRE flag in SSR
2
No
TDRE = 1?
1. SCI initialization: the transmit data output function
of the TxD pin is selected automatically.
2. SCI status check and transmit data write: read SSR,
check that the TDRE flag is 1, then write transmit
data in TDR and clear the TDRE flag to 0.
3. To continue transmitting serial data: after checking
that the TDRE flag is 1, indicating that data can be
written, write data in TDR, then clear the TDRE flag
to 0. When the DMAC is activated by a transmitdata-empty interrupt request (TXI) to write data in
TDR, the TDRE flag is checked and cleared
automatically.
Yes
Write transmit data in
TDR and clear TDRE flag
to 0 in SSR
All data
transmitted?
No
3
Yes
Read TEND flag in SSR
TEND = 1?
No
Yes
Clear TE bit to 0 in SCR
End
Figure 13.16 Sample Flowchart for Serial Transmitting
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Section 13 Serial Communication Interface
In transmitting serial data, the SCI operates as follows.
1. The SCI monitors the TDRE flag in SSR. When the TDRE flag is cleared to 0 the SCI
recognizes that TDR contains new data, and loads this data from TDR into TSR.
2. After loading the data from TDR into TSR, the SCI sets the TDRE flag to 1 and starts
transmitting. If the TIE bit is set to 1 in SCR, the SCI requests a transmit-data-empty interrupt
(TXI) at this time.
If clock output is selected, the SCI outputs eight serial clock pulses. If an external clock source
is selected, the SCI outputs data in synchronization with the input clock. Data is output from
the TxD pin in order from LSB (bit 0) to MSB (bit 7).
3. The SCI checks the TDRE flag when it outputs the MSB (bit 7). If the TDRE flag is 0, the SCI
loads data from TDR into TSR and begins serial transmission of the next frame. If the TDRE
flag is 1, the SCI sets the TEND flag to 1 in SSR, and after transmitting the MSB, holds the
TxD pin in the MSB state. If the TEIE bit in SCR is set to 1, a transmit-end interrupt (TEI) is
requested at this time.
4. After the end of serial transmission, the SCK pin is held in a constant state.
Figure 13.17 shows an example of SCI transmit operation.
Transmit
direction
Serial clock
Serial data
Bit 0
Bit 1
Bit 7
Bit 0
Bit 1
Bit 6
Bit 7
TDRE
TEND
TXI
request
TXI interrupt handler
writes data in TDR
and clears TDRE
flag to 0
TXI
request
TEI
request
1 frame
Figure 13.17 Example of SCI Transmit Operation
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Section 13 Serial Communication Interface
Receiving Serial Data: Figure 13.18 shows a sample flowchart for receiving serial data and
indicates the procedure to follow. When switching from asynchronous mode to synchronous
mode, make sure that the ORER, PER, and FER flags are cleared to 0. If the FER or PER flag is
set to 1 the RDRF flag will not be set and both transmitting and receiving will be disabled.
Initialize
1
Read receive data
from RDR, and clear
RDRF flag to 0 in SSR
5
SCI initialization: the receive data function of
the RxD pin is selected automatically.
2, 3. Receive error handling: if a receive error
Start receiving
occurs, read the ORER flag in SSR, then after
executing the necessary error handling, clear
the ORER flag to 0. Neither transmitting nor
receiving can resume while the ORER flag
Read ORER flag in SSR
2
remains set to 1.
4. SCI status check and receive data read: read
SSR, check that the RDRF flag is set to 1,
Yes
ORER = 1?
then read receive data from RDR and clear
3
the RDRF flag to 0. Notification that the RDRF
Error handling
No
flag has changed from 0 to 1 can also be
given by the RXI interrupt.
continued on next page
5. To continue receiving serial data: check the
4
Read RDRF flag in SSR
RDRF flag, read RDR, and clear the RDRF
flag to 0 before the MSB (bit 7) of the current
frame is received. If the DMAC is activated
No
by a receive-data-full interrupt request (RXI)
RDRF = 1?
to read RDR, the RDRF flag is cleared
automatically.
Yes
No
1.
Finished
receiving?
Yes
Clear RE bit to 0 in SCR
End
Figure 13.18 Sample Flowchart for Serial Receiving (1)
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Section 13 Serial Communication Interface
3
Error handling
Overrun error handling
Clear ORER flag to 0 in SSR
End
Figure 13.18 Sample Flowchart for Serial Receiving (2)
In receiving, the SCI operates as follows.
1. The SCI synchronizes with serial clock input or output and initializes internally.
2. Receive data is stored in RSR in order from LSB to MSB.
After receiving the data, the SCI checks that the RDRF flag is 0 so that receive data can be
transferred from RSR to RDR. If this check passes, the RDRF flag is set to 1 and the received
data is stored in RDR. If the check does not pass (receive error), the SCI operates as indicated
in table 13.11.
3. After setting the RDRF flag to 1, if the RIE bit is set to 1 in SCR, the SCI requests a receivedata-full interrupt (RXI). If the ORER flag is set to 1 and the RIE bit in SCR is also set to 1,
the SCI requests a receive-error interrupt (ERI).
Figure 13.19 shows an example of SCI receive operation.
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Section 13 Serial Communication Interface
Receive direction
Serial clock
Serial data
Bit 7
Bit 7
Bit 0
Bit 0
Bit 1
Bit 6
Bit 7
RDRF
ORER
RXI
request
RXI interrupt
handler reads
data in RDR
and clears
RDRF flag to 0
RXI
request
Overrun error,
ERI request
1 frame
Figure 13.19 Example of SCI Receive Operation
Transmitting and Receiving Serial Data Simultaneously (Synchronous Mode): Figure 13.20
shows a sample flowchart for transmitting and receiving serial data simultaneously and indicates
the procedure to follow.
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Section 13 Serial Communication Interface
Initialize
1
Start transmitting and receiving
Read TDRE flag in SSR
2
No
TDRE = 1?
Yes
Write transmit data in TDR and
clear TDRE flag to 0 in SSR
Read ORER flag in SSR
ORER = 1?
Yes
3
No
Read RDRF flag in SSR
Error handling
4
No
RDRF = 1?
Yes
Read receive data from RDR
and clear RDRF flag to 0 in SSR
No
End of transmitting and
receiving?
5
Yes
Clear TE and RE bits to 0 in SCR
1. SCI initialization: the transmit data
output function of the TxD pin and
receive data input function of the
RxD pin are selected, enabling
simultaneous transmitting and
receiving.
2. SCI status check and transmit
data write: read SSR, check that
the TDRE flag is 1, then write
transmit data in TDR and clear
the TDRE flag to 0.
Notification that the TDRE flag has
changed from 0 to 1 can also be
given by the TXI interrupt.
3. Receive error handling: if a receive
error occurs, read the ORER flag in
SSR, then after executing the necessary error handling, clear the ORER
flag to 0.
Neither transmitting nor receiving
can resume while the ORER flag
remains set to 1.
4. SCI status check and receive
data read: read SSR, check that
the RDRF flag is 1, then read
receive data from RDR and clear
the RDRF flag to 0. Notification
that the RDRF flag has changed
from 0 to 1 can also be given
by the RXI interrupt.
5. To continue transmitting and
receiving serial data: check the
RDRF flag, read RDR, and clear
the RDRF flag to 0 before the
MSB (bit 7) of the current frame
is received. Also check that
the TDRE flag is set to 1, indicating that data can be written, write
data in TDR, then clear the TDRE
flag to 0 before the MSB (bit 7) of
the current frame is transmitted.
When the DMAC is activated by
a transmit-data-empty interrupt
request (TXI) to write data in TDR,
the TDRE flag is checked and
cleared automatically. When the
DMAC is activated by a receivedata-full interrupt request (RXI) to
read RDR, the RDRF flag is
cleared automatically.
End
Note: When switching from transmitting or receiving to simultaneous
transmitting and receiving, clear both the TE bit and the RE bit
to 0, then set both bits to 1.
Figure 13.20 Sample Flowchart for Serial Transmitting
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Section 13 Serial Communication Interface
13.4
SCI Interrupts
The SCI has four interrupt request sources: TEI (transmit-end interrupt), ERI (receive-error
interrupt), RXI (receive-data-full interrupt), and TXI (transmit-data-empty interrupt). Table 13.12
lists the interrupt sources and indicates their priority. These interrupts can be enabled and disabled
by the TIE, TEIE, and RIE bits in SCR. Each interrupt request is sent separately to the interrupt
controller.
The TXI interrupt is requested when the TDRE flag is set to 1 in SSR. The TEI interrupt is
requested when the TEND flag is set to 1 in SSR. The TXI interrupt request can activate the
DMAC to transfer data. Data transfer by the DMAC automatically clears the TDRE flag to 0. The
TEI interrupt request cannot activate the DMAC.
The RXI interrupt is requested when the RDRF flag is set to 1 in SSR. The ERI interrupt is
requested when the ORER, PER, or FER flag is set to 1 in SSR. The RXI interrupt request can
activate the DMAC to transfer data. Data transfer by the DMAC automatically clears the RDRF
flag to 0. The ERI interrupt request cannot activate the DMAC.
The DMAC can be activated by interrupts from SCI channel 0.
Table 13.12 SCI Interrupt Sources
Interrupt
Description
Priority
ERI
Receive error (ORER, FER, or PER)
High
RXI
Receive data register full (RDRF)
TXI
Transmit data register empty (TDRE)
TEI
Transmit end (TEND)
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Low
Section 13 Serial Communication Interface
13.5
Usage Notes
Note the following points when using the SCI.
TDR Write and TDRE Flag
The TDRE flag in SSR is a status flag indicating the loading of transmit data from TDR into TSR.
The SCI sets the TDRE flag to 1 when it transfers data from TDR to TSR.
Data can be written into TDR regardless of the state of the TDRE flag. If new data is written in
TDR when the TDRE flag is 0, the old data stored in TDR will be lost because this data has not
yet been transferred to TSR. Before writing transmit data in TDR, be sure to check that the TDRE
flag is set to 1.
Simultaneous Multiple Receive Errors
Table 13.13 indicates the state of SSR status flags when multiple receive errors occur
simultaneously. When an overrun error occurs the RSR contents are not transferred to RDR, so
receive data is lost.
Table 13.13 SSR Status Flags and Transfer of Receive Data
RDRF
ORER
FER
PER
Receive Data
Transfer
RSR → RDR
1
1
0
0
×
Overrun error
0
0
1
0
O
Framing error
0
0
0
1
O
Parity error
1
1
1
0
×
Overrun error + framing error
1
1
0
1
×
Overrun error + parity error
0
0
1
1
O
Framing error + parity error
1
1
1
1
×
Overrun error + framing error + parity error
SSR Status Flags
Receive Errors
Legend:
O: Receive data is transferred from RSR to RDR.
×: Receive data is not transferred from RSR to RDR.
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Section 13 Serial Communication Interface
Break Detection and Processing
Break signals can be detected by reading the RxD pin directly when a framing error (FER) is
detected. In the break state the input from the RxD pin consists of all 0s, so the FER flag is set and
the parity error flag (PER) may also be set. In the break state the SCI receiver continues to operate,
so if the FER flag is cleared to 0 it will be set to 1 again.
Sending a Break Signal
When the TE bit is cleared to 0 the TxD pin becomes an I/O port, the level and direction (input or
output) of which are determined by DR and DDR bits. This feature can be used to send a break
signal.
After the serial transmitter is initialized, the DR value substitutes for the mark state until the TE
bit is set to 1 (the TxD pin function is not selected until the TE bit is set to 1). The DDR and DR
bits should therefore both be set to 1 beforehand.
To send a break signal during serial transmission, clear the DR bit to 0, then clear the TE bit to 0.
When the TE bit is cleared to 0 the transmitter is initialized, regardless of its current state, so the
TxD pin becomes an output port outputting the value 0.
Receive Error Flags and Transmitter Operation (Synchronous Mode Only)
When a receive error flag (ORER, PER, or FER) is set to 1 the SCI will not start transmitting,
even if the TDRE flag is cleared to 0. Be sure to clear the receive error flags to 0 when starting to
transmit. Note that clearing the RE bit to 0 does not clear the receive error flags to 0.
Receive Data Sampling Timing in Asynchronous Mode and Receive Margin
In asynchronous mode the SCI operates on a base clock with 16 times the bit rate frequency. In
receiving, the SCI synchronizes internally with the fall of the start bit, which it samples on the
base clock. Receive data is latched at the rising edge of the eighth base clock pulse. See figure
13.21.
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Section 13 Serial Communication Interface
16 clocks
8 clocks
0
15 0
7
7
15 0
Internal
base clock
Receive data
(RxD)
D0
Start bit
D1
Synchronization
sampling timing
Data sampling
timing
Figure 13.21 Receive Data Sampling Timing in Asynchronous Mode
The receive margin in asynchronous mode can therefore be expressed as in equation (1).
M = (0.5 −
M:
N:
D:
L:
F:
1
) − (L − 0.5) F −
2N
D − 0.5
N
(1 + F) × 100% ................... (1)
Receive margin (%)
Ratio of clock frequency to bit rate (N = 16)
Clock duty cycle (D = 0 to 1.0)
Frame length (L = 9 to 12)
Absolute deviation of clock frequency
From equation (1), if F = 0 and D = 0.5 the receive margin is 46.875%, as given by equation (2).
D = 0.5, F = 0
M = {0.5 – 1/(2 × 16)} × 100%
= 46.875% ............................................................................................. (2)
This is a theoretical value. A reasonable margin to allow in system designs is 20% to 30%.
Restrictions on Usage of DMAC
To have the DMAC read RDR, be sure to select the SCI receive-data-full interrupt (RXI) as the
activation source with bits DTS2 to DTS0 in DTCR.
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Section 13 Serial Communication Interface
Restrictions on Usage of the Serial Clock
When transmitting data using an external clock as the serial clock, an interval of at least 5 states is
necessary between clearing the TDRE bit in SSR and the start (falling edge) of the first transmit
clock pulse corresponding to each frame (see figure 13.22). This condition is also needed for
continuous transmission. If it is not fulfilled, operational error will occur.
SCK
t*
t*
TDRE
TXD
X0
X1
X2
X3
X4
X5
X6
X7
Y0
Y1
Y2
Y3
Continuous transmission
Note: * Ensure that t ≥ 5 states.
Figure 13.22 Serial Clock Transmission (Example)
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Section 13 Serial Communication Interface
Switching SCK Pin to Port Output Pin in Synchronous Mode
When the SCK pin is used as the serial clock output in synchronous mode, and is then switched to
its output port function at the end of transmission, a low level may be output for one half-cycle.
Half-cycle low-level output occurs when SCK is switched to its port function with the following
settings when DDR = 1, DR = 1, C/A = 1, CKE1 = 0, CKE0 = 0, and TE = 1.
1. End of serial data transmission
2. TE bit = 0
3. C/A bit = 0 ... switchover to port output
4. Occurrence of low-level output (see figure 13.23)
Half-cycle low-level output
SCK/port
1. End of transmission
Data
TE
C/A
Bit 6
4. Low-level output
Bit 7
2. TE = 0
3. C/A = 0
CKE1
CKE0
Figure 13.23 Operation when Switching from SCK Pin to Port Pin
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Section 13 Serial Communication Interface
Sample Procedure for Preventing Low-Level Output
As this sample procedure temporarily places the SCK pin in the input state, the SCK/port pin
should be pulled up beforehand with an external circuit.
With DDR = 1, DR = 1, C/A = 1, CKE1 = 0, CKE0 = 0, and TE = 1, make the following settings
in the order shown.
1. End of serial data transmission
2. TE bit = 0
3. CKE1 bit = 1
4. C/A bit = 0 ... switchover to port output
5. CKE1 bit = 0
High-level output
SCK/port
1. End of transmission
Data
TE
Bit 6
Bit 7
2. TE = 0
4. C/A = 0
C/A
3. CKE1 = 1
CKE1
5. CKE1 = 0
CKE0
Figure 13.24 Operation when Switching from SCK Pin Function to Port Pin Function
(Example of Preventing Low-Level Output)
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Section 14 Smart Card Interface
Section 14 Smart Card Interface
14.1
Overview
As an extension of its serial communication interface functions, SCI0 supports a smart card (IC
card) interface conforming to the ISO/IEC7816-3 (Identification Card) standard. Switchover
between normal serial communication and the smart card interface is controlled by a register
setting.
14.1.1
Features
Features of the smart-card interface supported by the H8/3048B Group are listed below.
• Asynchronous communication
 Data length: 8 bits
 Parity bits generated and checked
 Error signal output in receive mode (parity error)
 Error signal detect and automatic data retransmit in transmit mode
 Supports both direct convention and inverse convention
• Built-in baud rate generator with selectable bit rates
• Three types of interrupts
Transmit-data-empty, receive-data-full, and receive-error interrupts are requested
independently. The transmit-data-empty and receive-data-full interrupts can activate the DMA
controller (DMAC) to transfer data.
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Section 14 Smart Card Interface
14.1.2
Block Diagram
Bus interface
Figure 14.1 shows a block diagram of the smart card interface.
Module data bus
RDR
RxD0
TDR
RSR
TSR
Transmit/receive
control
TxD0
BRR
SCMR
SSR
SCR
SMR
Parity generate
φ
φ/4
Baud rate
generator
φ/16
φ/64
Clock
Parity check
SCK0
TXI
RXI
ERI
Legend:
SCMR: Smart card mode register
RSR: Receive shift register
RDR: Receive data register
Transmit shift register
TSR:
TDR: Transmit data register
SMR: Serial mode register
SCR: Serial control register
SSR: Serial status register
BRR: Bit rate register
Figure 14.1 Smart Card Interface Block Diagram
Rev. 3.00 Sep 27, 2006 page 516 of 872
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Internal
data
bus
Section 14 Smart Card Interface
14.1.3
Input/Output Pins
Table 14.1 lists the smart card interface pins.
Table 14.1 Smart Card Interface Pins
Name
Abbreviation
I/O
Function
Serial clock pin
SCK0
Output
Clock output
Receive data pin
RxD0
Input
Receive data input
Transmit data pin
TxD0
Output
Transmit data output
14.1.4
Register Configuration
The smart card interface has the internal registers listed in table 14.2. BRR, TDR, and RDR have
their normal serial communication interface functions, as described in section 13, Serial
Communication Interface.
Table 14.2 Registers
Address*
Name
Abbreviation
R/W
Initial Value
H'FFB0
Serial mode register
SMR
R/W
H'00
H'FFB1
Bit rate register
BRR
R/W
H'FF
H'FFB2
Serial control register
SCR
R/W
H'00
H'FFB3
Transmit data register
TDR
R/W
H'FF
F'84
1
H'FFB4
Serial status register
SSR
2
R/(W)*
H'FFB5
Receive data register
RDR
R
H'00
H'FFB6
Smart card mode register
SCMR
R/W
H'F2
Notes: 1. Lower 16 bits of the address.
2. Only 0 can be written, to clear flags.
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Section 14 Smart Card Interface
14.2
Register Descriptions
This section describes the new or modified registers and bit functions in the smart card interface.
14.2.1
Smart Card Mode Register (SCMR)
SCMR is an 8-bit readable/writable register that selects smart card interface functions.
Bit
7
6
5
4
3
2
1
0




SDIR
SINV

SMIF
Initial value
1
1
1
1
0
0
1
0
Read/Write




R/W
R/W

R/W
Reserved bits
Reserved bits
Smart card interface
mode select
Enables or disables
the smart card
interface function
Smart card data invert
Inverts data logic levels
Smart card data transfer direction
Selects the serial/parallel conversion format
SCMR is initialized to H'F2 by a reset and in standby mode.
Bits 7 to 4—Reserved: Read-only bits, always read as 1.
Bit 3—Smart Card Data Transfer Direction (SDIR): Selects the serial/parallel conversion
format.
Bit 3: SDIR
Description
0
TDR contents are transmitted LSB-first
Received data is stored LSB-first in RDR
1
TDR contents are transmitted MSB-first
Received data is stored MSB-first in RDR
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(Initial value)
Section 14 Smart Card Interface
Bit 2—Smart Card Data Inverter (SINV): Inverts data logic levels. This function is used in
combination with bit 3 to communicate with inverse-convention cards. SINV does not affect the
logic level of the parity bit. For parity settings, see section 14.3.4, Register Settings.
Bit 2: SINV
Description
0
Unmodified TDR contents are transmitted
(Initial value)
Received data is stored unmodified in RDR
1
Inverted TDR contents are transmitted
Received data is inverted before storage in RDR
Bit 1—Reserved: Read-only bit, always read as 1.
Bit 0—Smart Card Interface Mode Select (SMIF): Enables the smart card interface function.
Bit 0: SMIF
Description
0
Smart card interface function is disabled
1
Smart card interface function is enabled
14.2.2
(Initial value)
Serial Status Register (SSR)
The function of SSR bit 4 is modified in the smart card interface. This change also causes a
modification to the setting conditions for bit 2 (TEND).
Bit
7
6
5
4
3
2
1
0
TDRE
RDRF
ORER
ERS
PER
TEND
MPB
MPBT
Initial value
1
0
0
0
0
1
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R
R
R/W
Transmit end
Status flag indicating
end of transmission
Error signal status (ERS)
Status flag indicating that an
error signal has been received
Note: * Only 0 can be written, to clear the flag.
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Section 14 Smart Card Interface
Bits 7 to 5: These bits operate as in normal serial communication. For details see section 13,
Serial Communication Interface.
Bit 4—Error Signal Status (ERS): In smart card interface mode, this flag indicates the status of
the error signal sent from the receiving device to the transmitting device. The smart card interface
does not detect framing errors.
Bit 4: ERS
Description
0
Indicates normal data transmission, with no error signal returned (Initial value)
[Clearing conditions]
The chip is reset or enters standby mode.
Software reads ERS while it is set to 1, then writes 0.
1
Indicates that the receiving device sent an error signal reporting a parity error
[Setting condition]
A low error signal was sampled.
Note: Clearing the TE bit to 0 in SCR does not affect the ERS flag, which retains its previous
value.
Bits 3 to 0: These bits operate as in normal serial communication. For details see section 13,
Serial Communication Interface. The setting conditions for transmit end (TEND, bit 2), however,
are modified as follows.
Bit 2: TEND
Description
0
Transmission is in progress
[Clearing conditions]
Software reads TDRE while it is set to 1, then writes 0 in the TDRE flag.
The DMAC writes data in TDR.
1
End of transmission
(Initial value)
[Setting conditions]
The chip is reset or enters standby mode.
The TE bit and FER/ERS bit are both cleared to 0 in SCR.
TDRE is 1 and FER/ERS is 0 at a time 2.5 etu after the last bit of a 1-byte
serial character is transmitted (normal transmission)
Note: An etu (elementary time unit) is the time needed to transmit one bit.
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Section 14 Smart Card Interface
14.2.3
Serial Mode Register (SMR)
Bit 7 of SMR has a different function in smart card interface mode. The related serial control
register (SCR) changes from bit 1 to bit 0. However, this function does not exist in the flash
memory version.
Bit
7
6
5
4
3
2
1
0
GM
CHR
PE
O/E
STOP
MP
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit 7—GSM Mode (GM): Set at 0 when using the regular smart card interface. In GSM mode,
set to 1. When transmission is complete, initially the TEND flag set timing appears followed by
clock output restriction mode. Clock output restriction mode comprises serial control register bit 1
and bit 0.
Bit 7: GM
Description
0
Using the regular smart card interface mode
1
•
The TEND flag is set 12.5 etu after the beginning of the start bit
•
Clock output on/off control only
(Initial value)
Using the GSM mode smart card interface mode
•
The TEND flag is set 11.0 etu after the beginning of the start bit
•
Clock output on/off and fixed-high/fixed-low control
(set by SCR)
Bits 6 to 0—Operate in the same way as for the normal SCI.
For details, see section 13.2.5, Serial Mode Register (SMR).
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Section 14 Smart Card Interface
14.2.4
Serial Control Register (SCR)
Bits 1 and 0 have different functions in smart card interface mode. However, this function does not
exist in the flash memory version.
Bit
7
6
5
4
3
2
1
0
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
0
0
0
0
R/W
R/W
R/W
R/W
Initial value
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
Bits 7 to 2—Operate in the same way as for the normal SCI.
For details, see section 13.2.6, Serial Control Register (SCR).
Bits 1 and 0—Clock Enable (CKE1, CKE0): Setting enable or disable for the SCI clock
selection and clock output from the SCK pin. In smart card interface mode, it is possible to switch
between enabling and disabling of the normal clock output, and specify a fixed high level or fixed
low level for the clock output.
SMR
SCR
Bit 7:
GM
Bit 1:
CKE1
Bit 0:
CKE0
Description
0
0
0
The internal clock/SCK0 pin functions as an I/O port
0
0
1
The internal clock/SCK0 pin functions as the clock output
1
0
0
The internal clock/SCK0 pin is fixed at low-level output
1
0
1
The internal clock/SCK0 pin functions as the clock output
1
1
0
The internal clock/SCK0 pin is fixed at high-level output
1
1
1
The internal clock/SCK0 pin functions as the clock output
Rev. 3.00 Sep 27, 2006 page 522 of 872
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(Initial value)
Section 14 Smart Card Interface
14.3
Operation
14.3.1
Overview
The main features of the smart-card interface are as follows.
• One frame consists of eight data bits and a parity bit.
• In transmitting, a guard time of at least two elementary time units (2 etu) is provided between
the end of the parity bit and the start of the next frame. (An elementary time unit is the time
required to transmit one bit.)
• In receiving, if a parity error is detected, a low error signal is output for 1 etu, beginning 10.5
etu after the start bit.
• In transmitting, if an error signal is received, after at least 2 etu, the same data is automatically
transmitted again.
• Only asynchronous communication is supported. There is no synchronous communication
function.
14.3.2
Pin Connections
Figure 14.2 shows a pin connection diagram for the smart card interface.
In communication with a smart card, data is transmitted and received over the same signal line.
The TxD0 and RxD0 pins should both be connected to this line. The data transmission line should
be pulled up to VCC through a resistor.
If the smart card uses the clock generated by the smart card interface, connect the SCK0 output pin
to the card’s CLK input. If the card uses its own internal clock, this connection is unnecessary.
The reset signal should be output from one of the H8/3048B Group’s generic ports.
In addition to these pin connections, power and ground connections will normally also be
necessary.
Rev. 3.00 Sep 27, 2006 page 523 of 872
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Section 14 Smart Card Interface
VCC
TxD0
RxD0
Data line
SCK0
Clock line
Px (port)
H8/3048B Group
Reset line
I/O
CLK
RST
Smart card
Card-processing device
Figure 14.2 Smart Card Interface Connection Diagram
Note: A loop-back test can be performed by setting both RE and TE to 1 without connecting a
smart card.
14.3.3
Data Format
Figure 14.3 shows the data format of the smart card interface. In receive mode, parity is checked
once per frame. If a parity error is detected, an error signal is returned to the transmitting device to
request retransmission. In transmit mode, the error signal is sampled and the same data is
retransmitted if the error signal is low.
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Section 14 Smart Card Interface
No parity error
Ds
D0
D1
D2
D3
D4
D5
D6
D7
Dp
D6
D7
Dp
Output from transmitting device
Parity error
Ds
D0
D1
D2
D3
D4
D5
DE
Output from transmitting device
Legend:
Ds:
D0 to D7:
Dp:
DE:
Output from
receiving device
Start bit
Data bits
Parity bit
Error signal
Figure 14.3 Smart Card Interface Data Format
The operating sequence is as follows.
1. When not in use, the data line is in the high-impedance state, and is pulled up to the high level
through a resistor.
2. To start transmitting a frame of data, the transmitting device transmits a low start bit (Ds),
followed by eight data bits (D0 to D7) and a parity bit (Dp).
3. Next, in the smart card interface, the transmitting device returns the data line to the highimpedance state. The data line is pulled up to the high level through a resistor.
4. The receiving device performs a parity check. If there is no parity error, the receiving device
waits to receive the next data. If a parity error is present, the receiving device outputs a low
error signal (DE) to request retransmission of the data. After outputting the error signal for a
designated interval, the receiving device returns the signal line to the high-impedance state.
The signal line is pulled back up to the high level through the pull-up resistor.
5. If the transmitting device does not receive an error signal, it proceeds to transmit the next data.
If it receives an error signal, it returns to step 2 and transmits the same data again.
Rev. 3.00 Sep 27, 2006 page 525 of 872
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Section 14 Smart Card Interface
14.3.4
Register Settings
Table 14.3 shows a bit map of the registers used in the smart card interface. Bits indicated as 0 or
1 should always be set to the indicated value. The settings of the other bits will be described in this
section.
Table 14.3 Register Settings in Smart Card Interface
Register
Address*
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SMR
H'FFB0
GM
0
1
O/E
1
0
CKS1
CKS0
BRR
H'FFB1
BRR7
BRR6
BRR5
BRR4
BRR3
BRR2
SCR
H'FFB2
TIE
RIE
TE
RE
0
0
BRR1 BRR0
2
CKE1* CKE0
TDR
H'FFB3
TDR7
TDR6
TDR5
TDR4
TDR3
TDR2
TDR1
TDR0
SSR
H'FFB4
TDRE
RDRF
ORER
ERS
PER
TEND
0
0
RDR
H'FFB5
RDR7
RDR6
RDR5
RDR4
RDR3
RDR2
RDR1
RDR0
SCMR
H'FFB6
—
—
—
—
SDIR
SINV
—
SMIF
1
Legend: —: Unused bit.
Notes: 1. Lower 16 bits of the address.
2. When the GM of the SMR is set at 0, be sure the CKE1 bit is 0.
Serial Mode Register (SMR) Settings: In regular smart card interface mode, set the GM bit at 0.
In regular smart card mode, clear the GM bit to 0. In GSM mode, set the GM bit to 1. Clear the
O/E bit to 0 if the smart card uses the direct convention. Set the O/E bit to 1 if the smart card uses
the inverse convention. Bits CKS1 and CKS0 select the clock source of the built-in baud rate
generator. See section 14.3.5, Clock.
Bit Rate Register (BRR) Settings: This register sets the bit rate. Equations for calculating the
setting are given in section 14.3.5, Clock.
Serial Control Register (SCR): The TIE, RIE, TE, and RE bits have their normal serial
communication functions. For details, see section 13, Serial Communication Interface. The CKE1
and CKE0 bits select clock output. When the GM bit of the SMR is cleared to 0, to disable clock
output, clear this bit to 00. To enable clock output, set this bit to 01. When the GM bit of the SMR
is set to 1, clock output is enabled. Clock output is fixed at high or low.
Smart Card Mode Register (SCMR): If the smart card follows the direct convention, clear the
SDIR and SINV bits to 0. If the smart card follows the indirect convention, set the SDIR and
SINV bits to 1. To use the smart card interface, set the SMIF bit to 1.
Rev. 3.00 Sep 27, 2006 page 526 of 872
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Section 14 Smart Card Interface
The register settings and examples of starting character waveforms are shown below for two smart
cards, one following the direct convention and one the inverse convention.
• Direct convention (SDIR = SINV = O/E = 0)
(Z)
A
Z
Z
A
Z
Z
Z
A
A
Z
Ds
D0
D1
D2
D3
D4
D5
D6
D7
Dp
(Z)
State
In the direct convention, state Z corresponds to logic level 1, and state A to logic level 0.
Characters are transmitted and received LSB-first. In the example above the first character data
is H'3B. The parity bit is 1, following the even parity rule designated for smart cards.
• Inverse convention (SDIR = SINV = O/E = 1)
(Z)
A
Z
Z
A
A
A
A
A
A
Z
Ds
D7
D6
D5
D4
D3
D2
D1
D0
Dp
(Z)
State
In the inverse convention, state A corresponds to the logic level 1, and state Z to the logic level
0. Characters are transmitted and received MSB-first. In the example above the first character
data is H'3F. Following the even parity rule designated for smart cards, the parity bit logic
level is 0, corresponding to state Z.
In the H8/3048B Group, the SINV bit inverts only the data bits D7 to D0. The parity bit is not
inverted, so the O/E bit in SMR must be set to odd parity mode. This applies in both transmitting
and receiving.
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Section 14 Smart Card Interface
14.3.5
Clock
As its serial communication clock, the smart card interface can use only the internal clock
generated by the on-chip baud rate generator. The bit rate can be selected by setting the bit rate
register (BRR) and bits CKS1 and CKS0 in the serial mode register (SMR). The bit rate can be
calculated from the equation given below. Table 14.5 lists some examples of bit rate settings.
If bit CKE0 is set to 1, a clock signal with a frequency equal to 372 times the bit rate is output
from the SCK0 pin.
B=
where, N:
B:
φ:
n:
φ
1488 ×
22n−1
× (N + 1)
× 106
BRR setting (0 ≤ N ≤ 255)
Bit rate (bits/s)
System clock frequency (MHz)*
See table 14.4
Table 14.4 n-Values of CKS1 and CKS0 Settings
n
CKS1
CKS0
0
0
0
1
0
1
2
1
0
3
1
1
Note: * If the gear function is used to divide the system clock frequency, use the divided
frequency to calculate the bit rate. The equation above applies directly to 1/1 frequency
division.
Table 14.5 Bit Rates (bits/s) for Different BRR Settings (when n = 0)
φ (MHz)
N
7.1424
10.00
10.7136 13.00
14.2848 16.00
0
9600.0
13440.9 14400.0 17473.1 19200.0 21505.4 24193.5 26881.7 33602.2
1
4800.0
6720.4
7200.0
8736.6
9600.0
10752.7 12096.8 13440.9 16801.1
2
3200.0
4480.3
4800.0
5824.4
6400.0
7168.5
Note: Bit rates are rounded off to one decimal place.
Rev. 3.00 Sep 27, 2006 page 528 of 872
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18.00
8064.5
20.00
8960.6
25.00
11200.7
Section 14 Smart Card Interface
The following equation calculates the bit rate register (BRR) setting from the system clock
frequency and bit rate. N is an integer from 0 to 255, specifying the value with the smaller error.
N=
φ
1488 × 22n−1 × B
× 106 − 1
Table 14.6 BRR Settings for Typical Bit Rate (bits/s) (when n = 0)
φ (MHz)
7.1424
10.00
10.7136
13.00
14.2848
16.00
18.00
20.00
25.00
Bit/s
N Error
N Error
N Error
N Error
N Error
N Error
N Error
N Error
N Error
9600
0
1
1
1
1
1
2
2
3
0.00
30.00
25.00
8.99
0.00
12.01
15.99
6.66
12.49
Table 14.7 Maximum Bit Rates for Various Frequencies (Smart Card Interface)
φ (MHz)
Maximum Bit Rate (bits/s)
N
n
7.1424
9600
0
0
10.00
13441
0
0
10.7136
14400
0
0
13.00
17473
0
0
14.2848
19200
0
0
16.00
21505
0
0
18.00
24194
0
0
20.00
26882
0
0
25.00
33602
0
0
The bit rate error is calculated from the following equation.
Error (%) =
φ
1488 ×
22n−1
× B × (N + 1)
× 106 − 1 × 100
Rev. 3.00 Sep 27, 2006 page 529 of 872
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Section 14 Smart Card Interface
14.3.6
Transmitting and Receiving Data
Initialization
Before transmitting or receiving data, initialize the smart card interface by the procedure below.
Initialization is also necessary when switching from transmit mode to receive mode or from
receive mode to transmit mode.
1. Clear the TE and RE bits to 0 in the serial control register (SCR).
2. Clear the ERS, PER, and ORER error flags to 0 in the serial status register (SSR).
3. Set the parity mode bit (O/E) and baud rate generator clock source select bits (CKS1 and
CKS0) as required in the serial mode register (SMR). At the same time, clear the C/A, CHR,
and MP bits to 0, and set the STOP and PE bits to 1.
4. Set the SMIF, SDIR, and SINV bits as required in the smart card mode register (SCMR).
When the SMIF bit is set to 1, the TxD0 and RxD0 pins switch from their I/O port functions to
their serial communication interface functions, and are placed in the high-impedance state.
5. Set a value corresponding to the desired bit rate in the bit rate register (BRR).
6. Set clock enable bit 0 (CKE0) as required in the serial control register (SCR). Write 0 in the
TIE, RIE, TE, RE, MPIE, TEIE, and CKE1 bits. If bit CKE0 is set to 1, a serial clock will be
output from the SCK0 pin.
7. Wait for at least the interval required to transmit or receive one bit, then set the TIE, RIE, TE,
and RE bits as necessary in SCR. Do not set TE and RE both to 1, except when performing a
loop-back test.
Rev. 3.00 Sep 27, 2006 page 530 of 872
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Section 14 Smart Card Interface
Transmitting Serial Data
The transmitting procedure in smart card mode is different from the normal SCI procedure,
because of the need to sample the error signal and retransmit. Figure 14.4 shows a flowchart for
transmitting, and figure 14.5 shows the relation between a transmit operation and the internal
registers.
1. Initialize the smart card interface by the procedure given above in Initialization.
2. Check that the ERS error flag is cleared to 0 in SSR.
3. Check that the TEND flag is set to 1 in SSR. Repeat steps 2 and 3 until this check passes.
4. Write transmit data in TDR and clear the TDRE flag to 0. The data will be transmitted and the
TEND flag will be cleared to 0.
5. To continue transmitting data, return to step 2.
6. To terminate transmission, clear the TE bit to 0.
This procedure may include interrupt handling and DMA transfer.
If the TIE bit is set to 1 to enable interrupt requests, when transmission is completed and the
TEND flag is set to 1, a transmit-data-empty interrupt (TXI) is requested. If the RIE bit is set to 1
to enable interrupt requests, when a transmit error occurs and the ERS flag is set to 1, a
transmit/receive-error interrupt (ERI) is requested.
The timing of TEND flag setting depends on the GM bit in SMR. The timing is shown in figure
14.6.
If the TXI interrupt activates the DMAC, the number of bytes designated in the DMAC can be
transmitted automatically, including automatic retransmit.
For details, see Interrupt Operations and Data Transfer by DMAC in this section.
Rev. 3.00 Sep 27, 2006 page 531 of 872
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Section 14 Smart Card Interface
Start
Initialize
Start transmitting
FER/ERS = 0 ?
No
Yes
Error handling
No
TEND = 1 ?
Yes
Write data in TDR and clear
TDRE flag to 0 in SSR
No
All data
transmitted ?
Yes
FER/ERS = 0 ?
No
Yes
Error handling
No
TEND = 1 ?
Yes
Clear TE bit to 0
End
Figure 14.4 Transmit Flowchart (Example)
Rev. 3.00 Sep 27, 2006 page 532 of 872
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Section 14 Smart Card Interface
TDR
TSR
(shift register)
(1) Data write
Data 1
(2) Transfer from
TDR to TSR
Data 1
(3) Serial data output
Data 1
Data 1
; Data remains in TDR
Data 1
I/O signal line output
In case of normal transmission: TEND flag is set
In case of transmit error:
ERS flag is set
Steps (2) and (3) above are repeated until the TEND flag is set
Note: When the ERS flag is set, it should be cleared until transfer of the last bit (D7 in LSB-first
transmission, D0 in MSB-first transmission) of the next transfer data to be transmitted has
been completed.
Figure 14.5 Relation Between Transmit Operation and Internal Registers
I/O data
Ds
Da
Db
Dc
Dd
De
Df
Dg
Dh
Dp
DE
Guard
time
TXI
(TEND interrupt)
12.5 etu
When GM = 0
11.0 etu
When GM = 1
Figure 14.6 TEND Flag Occurrence Timing
Rev. 3.00 Sep 27, 2006 page 533 of 872
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Section 14 Smart Card Interface
Receiving Serial Data
The receiving procedure in smart card mode is the same as the normal SCI procedure. Figure 14.7
shows a flowchart for receiving.
1. Initialize the smart card interface by the procedure given in Initialization at the beginning of
this section.
2. Check that the ORER and PER error flags are cleared to 0 in SSR. If either flag is set, carry out
the necessary error handling, then clear both the ORER and PER flags to 0.
3. Check that the RDRF flag is set to 1. Repeat steps 2 and 3 until this check passes.
4. Read receive data from RDR.
5. To continue receiving data, clear the RDRF flag to 0 and return to step 2.
6. To terminate receiving, clear the RE bit to 0.
Start
Initialize
Start receiving
ORER = 0 and
PER = 0 ?
No
Yes
Error handling
No
RDRF = 1 ?
Yes
Read RDR and clear RDRF
flag to 0 in SSR
No
All data received ?
Yes
Clear RE bit to 0
Figure 14.7 Receive Flowchart (Example)
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Section 14 Smart Card Interface
This procedure may include interrupt handling and DMA transfer.
If the RIE bit is set to 1 to enable interrupt requests, when receiving is completed and the RDRF
flag is set to 1, a receive-data-full interrupt (RXI) is requested. If a receive error occurs, either the
ORER or PER flag is set to 1 and a transmit/receive-error interrupt (ERI) is requested.
If the RXI interrupt activates the DMAC, the number of bytes designated in the DMAC will be
transferred, skipping receive data in which an error occurred.
For details, see Interrupt Operations and Data Transfer by DMAC below.
When a parity error occurs and PER is set to 1, the receive data is transferred to RDR, so the
erroneous data can be read.
Switching Modes
To switch from receive mode to transmit mode, check that receiving operations have completed,
then initialize the smart card interface, clearing RE to 0 and setting TE to 1. Completion of receive
operations is indicated by the RDRF, PER, or ORER flag.
To switch from transmit mode to receive mode, check that transmitting operations have
completed, then initialize the smart card interface, clearing TE to 0 and setting RE to 1.
Completion of transmit operations can be verified from the TEND flag.
Fixing Clock Output
When the GM bit of the SMR is set to 1, clock output is fixed by CKE1 and CKE0 of SCR. In this
case, the clock pulse can be set at minimum value.
Figure 14.8 shows clock output fixed timing: CKE0 is restricted with GM = 1 and CKE1 = 1.
Specified pulse width
Specified pulse width
CKE1 value
SCK
SCR write
(CKE0 = 0)
SCR write
(CKE0 = 1)
Figure 14.8 Clock Output Fixed Timing
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Section 14 Smart Card Interface
Interrupt Operations
The smart card interface has three interrupt sources: transmit-data-empty (TXI), transmit/receiveerror (ERI), and receive-data-full (RXI). The transmit-end interrupt request (TEI) is not available
in smart card mode.
A TXI interrupt is requested when the TEND flag is set to 1 in SSR. An RXI interrupt is requested
when the RDRF flag is set to 1 in SSR. An ERI interrupt is requested when the ORER, PER, or
ERS flag is set to 1 in SSR. These relationships are shown in table 14.8.
Table 14.8 Smart Card Mode Operating States and Interrupt Sources
Flag
Mask Bit
Interrupt
Source
DMAC
Activation
Normal operation
TEND
TIE
TXI
Available
Error
ERS
RIE
ERI
Not available
Normal operation
RDRF
RIE
RXI
Available
Error
PER, ORER
RIE
ERI
Not available
Operating State
Transmit mode
Receive mode
Data Transfer by DMAC
The DMAC can be used to transmit and receive in smart card mode, as in normal SCI operations.
In transmit mode, when the TEND flag is set to 1 in SSR, the TDRE flag is set simultaneously,
generating a TXI interrupt. If TXI is designated in advance as a DMAC activation source, the
DMAC will be activated by the TXI request and will transfer the next transmit data. This data
transfer by the DMAC automatically clears the TDRE and TEND flags to 0. When an error occurs,
the SCI automatically retransmits the same data, keeping TEND cleared to 0 so that the DMAC is
not activated. The SCI and DMAC will therefore automatically transmit the designated number of
bytes, including retransmission when an error occurs. When an error occurs the ERS flag is not
cleared automatically, so the RIE bit should be set to 1 to enable the error to generate an ERI
request, and the ERI interrupt handler should clear ERS.
When using the DMAC to transmit or receive, first set up and enable the DMAC, then make SCI
settings. DMAC settings are described in section 8, DMA Controller.
In receive operations, when the RDRF flag is set to 1 in SSR, an RXI interrupt is requested. If RXI
is designated in advance as a DMAC activation source, the DMAC will be activated by the RXI
request and will transfer the received data. This data transfer by the DMAC automatically clears
the RDRF flag to 0. When an error occurs, the RDRF flag is not set and an error flag is set instead.
The DMAC is not activated. The ERI interrupt request is directed to the CPU. The ERI interrupt
handler should clear the error flags.
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Section 14 Smart Card Interface
Examples of Operation in GSM Mode
When switching between smart card interface mode and software standby mode, use the following
procedures to maintain the clock duty cycle.
• Switching from smart card interface mode to software standby mode
1. Set the P94 data register (DR) and data direction register (DDR) to the values for the fixed
output state in software standby mode.
2. Write 0 to the TE and RE bits in the serial control register (SCR) to stop transmit/receive
operations. At the same time, set the CKE1 bit to the value for the fixed output state in
software standby mode.
3. Write 0 to the CKE0 bit in SCR to stop the clock.
4. Wait for one serial clock cycle. During this period, the duty cycle is preserved and clock
output is fixed at the specified level.
5. Write H'00 to the serial mode register (SMR) and smart card mode register (SCMR).
6. Make the transition to the software standby state.
• Returning from software standby mode to smart card interface mode
1. Clear the software standby state.
2. Set the CKE1 bit in SCR to the value for the fixed output state at the start of software
standby (the current P94 pin state).
3. Set smart card interface mode and output the clock. Clock signal generation is started with
the normal duty cycle.
Normal operation
(1)(2)(3)
Software standby
mode
(4) (5)(6)
Normal operation
(1) (2)(3)
Figure 14.9 Procedure for Stopping and Restarting the Clock
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Section 14 Smart Card Interface
Use the following procedure to secure the clock duty cycle after powering on.
1. The initial state is port input and high impedance. Use pull-up or pull-down resistors to fix the
potential.
2. Fix at the output specified by the CKE1 bit in SCR.
3. Set SMR and SCMR, and switch to smart card interface mode operation.
4. Set the CKE0 bit in SCR to 1 to start clock output.
14.4
Usage Notes
When using the SCI as a smart card interface, note the following points.
Receive Data Sampling Timing in Smart Card Mode and Receive Margin
In smart card mode the SCI operates on a base clock with 372 times the bit rate frequency. In
receiving, the SCI synchronizes internally with the fall of the start bit, which it samples on the
base clock. Receive data is latched at the rising edge of the 186th base clock pulse. See figure
14.10.
372 clocks
186 clocks
0
185
371 0
185
371
0
Internal
base clock
Receive data
(RxD)
Start
bit
D0
Synchronization
sampling timing
Data sampling
timing
Figure 14.10 Receive Data Sampling Timing in Smart Card Mode
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D1
Section 14 Smart Card Interface
The receive margin can therefore be expressed as follows.
Receive margin in smart card mode:
M=
0.5 −
1
− (L − 0.5) F −
2N
D − 0.5
(1 + F) × 100%
N
M: Receive margin (%)
N: Ratio of clock frequency to bit rate (N = 372)
D: Clock duty cycle (D = 0 to 1.0)
L: Frame length (L = 10)
F: Absolute deviation of clock frequency
From this equation, if F = 0 and D = 0.5 the receive margin is as follows.
D = 0.5, F = 0
M = {0.5 – 1/(2 × 372)} × 100%
= 49.866%
Retransmission
Retransmission is described below for the separate cases of transmit mode and receive mode.
• Retransmission when SCI is in Receive Mode (see figure 14.11)
(1) The SCI checks the received parity bit. If it detects an error, it automatically sets the PER
flag to 1. If the RIE bit in SCR is set to the enable state, an ERI interrupt is requested. The
PER flag should be cleared to 0 in SSR before the next parity bit sampling timing.
(2) The RDRF bit in SSR is not set to 1 for the error frame.
(3) If an error is not detected when the parity bit is checked, the PER flag is not set in SSR.
(4) If an error is not detected when the parity bit is checked, receiving operations are assumed
to have ended normally, and the RDRF bit is automatically set to 1 in SSR. If the RIE bit in
SCR is set to the enable state, an RXI interrupt is requested. If RXI is enabled as a DMA
transfer activation source, the RDR contents can be read automatically. When the DMAC
reads the RDR data, it automatically clears RDRF to 0.
(5) When a normal frame is received, at the error signal transmit timing, the data pin is held in
the high-impedance state.
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Section 14 Smart Card Interface
Retransmitted frame
Frame n
Frame n + 1
(DE)
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
DE
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
Ds D0 D1 D2 D3 D4
RDRF
(2)
(4)
(1)
(3)
PER
Figure 14.11 Retransmission in SCI Receive Mode
• Retransmission when SCI is in Transmit Mode (see figure 14.12)
(6) After transmitting one frame, if the receiving device returns an error signal, the SCI sets the
ERS flag to 1 in SSR. If the RIE bit in SCR is set to the enable state, an ERI interrupt is
requested. The ERS flag should be cleared to 0 in SSR before the next parity bit sampling
timing.
(7) The TEND bit in SSR is not set for the frame in which the error signal was received,
indicating an error.
(8) If no error signal is returned from the receiving device, the ERS flag is not set in SSR.
(9) If no error signal is returned from the receiving device, transmission of the frame, including
retransmission, is assumed to be complete, and the TEND bit is set to 1 in SSR. If the TIE
bit in SCR is set to the enable state, a TXI interrupt is requested. If TXI is enabled as a
DMA transfer activation source, the next data can be written in TDR automatically. When
the DMAC writes data in TDR, it automatically clears the TDRE bit to 0.
Frame n
Retransmitted frame
Frame n + 1
(DE)
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
DE
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
Ds D0 D1 D2 D3 D4
TDRE
Transfer from TDR to TSR
Transfer from
TDR to TSR
Transfer from TDR to TSR
TEND
(7)
(9)
ERS
(6)
(8)
Figure 14.12 Retransmission in SCI Transmit Mode
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Section 15 A/D Converter
Section 15 A/D Converter
15.1
Overview
The H8/3048B Group includes a 10-bit successive-approximations A/D converter with a selection
of up to eight analog input channels.
When the A/D converter is not used, it can be halted independently to conserve power. For details
see section 20.6, Module Standby Function.
15.1.1
Features
A/D converter features are listed below.
• 10-bit resolution
• Eight input channels
• Selectable analog conversion voltage range
The analog voltage conversion range can be programmed by input of an analog reference
voltage at the VREF pin.
• High-speed conversion
Conversion time: Minimum 5.36 µs per channel (with 25-MHz system clock)
• Two conversion modes
Single mode: A/D conversion of one channel
Scan mode: continuous conversion on one to four channels
• Four 16-bit data registers
A/D conversion results are transferred for storage into data registers corresponding to the
channels.
• Sample-and-hold function
• A/D conversion can be externally triggered
• A/D interrupt requested at end of conversion
At the end of A/D conversion, an A/D end interrupt (ADI) can be requested.
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Section 15 A/D Converter
15.1.2
Block Diagram
Figure 15.1 shows a block diagram of the A/D converter.
Internal
data bus
AV SS
AN 0
AN 5
ADCR
ADCSR
ADDRD
−
AN 2
AN 4
ADDRC
+
AN 1
AN 3
ADDRB
10-bit D/A
ADDRA
V REF
Successiveapproximations register
AVCC
Bus interface
Module data bus
Analog
multiplexer
φ/8
Comparator
Control circuit
Sample-andhold circuit
φ/16
AN 6
AN 7
ADI
ADTRG
Legend:
ADCR:
ADCSR:
ADDRA:
ADDRB:
ADDRC:
ADDRD:
A/D control register
A/D control/status register
A/D data register A
A/D data register B
A/D data register C
A/D data register D
Figure 15.1 A/D Converter Block Diagram
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Section 15 A/D Converter
15.1.3
Input Pins
Table 15.1 summarizes the A/D converter’s input pins. The eight analog input pins are divided
into two groups: group 0 (AN0 to AN3), and group 1 (AN4 to AN7). AVCC and AVSS are the power
supply for the analog circuits in the A/D converter. VREF is the A/D conversion reference voltage.
Table 15.1 A/D Converter Pins
Pin Name
Abbreviation
I/O
Function
Analog power supply pin
AVCC
Input
Analog power supply
Analog ground pin
AVSS
Input
Analog ground and reference voltage
Reference voltage pin
VREF
Input
Analog reference voltage
Analog input pin 0
AN0
Input
Group 0 analog inputs
Analog input pin 1
AN1
Input
Analog input pin 2
AN2
Input
Analog input pin 3
AN3
Input
Analog input pin 4
AN4
Input
Analog input pin 5
AN5
Input
Analog input pin 6
AN6
Input
Analog input pin 7
AN7
Input
A/D external trigger input pin
ADTRG
Input
Group 1 analog inputs
External trigger input for starting A/D
conversion
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Section 15 A/D Converter
15.1.4
Register Configuration
Table 15.2 summarizes the A/D converter’s registers.
Table 15.2 A/D Converter Registers
Address*
Name
Abbreviation
R/W
Initial Value
H'FFE0
A/D data register A (high)
ADDRAH
R
H'00
H'FFE1
A/D data register A (low)
ADDRAL
R
H'00
H'FFE2
A/D data register B (high)
ADDRBH
R
H'00
1
H'FFE3
A/D data register B (low)
ADDRBL
R
H'00
H'FFE4
A/D data register C (high)
ADDRCH
R
H'00
H'FFE5
A/D data register C (low)
ADDRCL
R
H'00
H'FFE6
A/D data register D (high)
ADDRDH
R
H'00
H'FFE7
A/D data register D (low)
ADDRDL
R
H'00
H'00
3
H'7E*
H'FFE8
A/D control/status register
ADCSR
2
R/(W)*
H'FFE9
A/D control register
ADCR
R/W
Notes: 1. Lower 16 bits of the address
2. Only 0 can be written in bit 7, to clear the flag.
3. Initial value is H'7F in mask ROM versions, PROM versions, and dual power supply
flash memory versions.
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Section 15 A/D Converter
15.2
Register Descriptions
15.2.1
A/D Data Registers A to D (ADDRA to ADDRD)
14
12
10
8
6
5
4
3
2
1
0
AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 
15
Bit
13
11
9
7





Initial value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Read/Write
(n = A to D)
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
ADDRn
A/D conversion data
10-bit data giving an
A/D conversion result
Reserved bits
The four A/D data registers (ADDRA to ADDRD) are 16-bit read-only registers that store the
results of A/D conversion.
An A/D conversion produces 10-bit data, which is transferred for storage into the A/D data
register corresponding to the selected channel. The upper 8 bits of the result are stored in the upper
byte of the A/D data register. The lower 2 bits are stored in the lower byte. Bits 5 to 0 of an A/D
data register are reserved bits that are always read as 0. Table 15.3 indicates the pairings of analog
input channels and A/D data registers.
The CPU can always read and write the A/D data registers. The upper byte can be read directly,
but the lower byte is read through a temporary register (TEMP). For details see section 15.3, CPU
Interface.
The A/D data registers are initialized to H'0000 by a reset and in standby mode.
Table 15.3 Analog Input Channels and A/D Data Registers
Analog Input Channel
Group 0
Group 1
A/D Data Register
AN0
AN4
ADDRA
AN1
AN5
ADDRB
AN2
AN6
ADDRC
AN3
AN7
ADDRD
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Section 15 A/D Converter
15.2.2
A/D Control/Status Register (ADCSR)
Bit
7
6
5
4
3
2
1
0
ADF
ADIE
ADST
SCAN
CKS
CH2
CH1
CH0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Channel select 2 to 0
These bits select analog
input channels
Clock select
Selects the A/D conversion time
Scan mode
Selects single mode or scan mode
A/D start
Starts or stops A/D conversion
A/D interrupt enable
Enables and disables A/D end interrupts
A/D end flag
Indicates end of A/D conversion
Note: * Only 0 can be written, to clear the flag.
ADCSR is an 8-bit readable/writable register that selects the mode and controls the A/D converter.
ADCSR is initialized to H'00 by a reset and in standby mode.
Bit 7—A/D End Flag (ADF): Indicates the end of A/D conversion.
Bit 7: ADF
Description
0
[Clearing condition]
Cleared by reading ADF while ADF = 1, then writing 0 in ADF
1
[Setting conditions]
Single mode: A/D conversion ends
Scan mode: A/D conversion ends in all selected channels
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(Initial value)
Section 15 A/D Converter
Bit 6—A/D Interrupt Enable (ADIE): Enables or disables the interrupt (ADI) requested at the
end of A/D conversion.
Bit 6: ADIE
Description
0
A/D end interrupt request (ADI) is disabled
1
A/D end interrupt request (ADI) is enabled
(Initial value)
Bit 5—A/D Start (ADST): Starts or stops A/D conversion. The ADST bit remains set to 1 during
A/D conversion. It can also be set to 1 by external trigger input at the ADTRG pin.
Bit 5: ADST
Description
0
A/D conversion is stopped
1
Single mode: A/D conversion starts; ADST is automatically cleared to 0 when
conversion ends.
(Initial value)
Scan mode: A/D conversion starts and continues, cycling among the selected
channels, until ADST is cleared to 0 by software, by a reset, or by a transition
to standby mode.
Bit 4—Scan Mode (SCAN): Selects single mode or scan mode. For further information on
operation in these modes, see section 15.4, Operation. Clear the ADST bit to 0 before switching
the conversion mode.
Bit 4: SCAN
Description
0
Single mode
1
Scan mode
(Initial value)
Bit 3—Clock Select (CKS): Selects the A/D conversion time. Clear the ADST bit to 0 before
switching the conversion time.
Bit 3: CKS
Description
0
Conversion time = 266 states (maximum)
1
Conversion time = 134 states (maximum)
(Initial value)
Bits 2 to 0—Channel Select 2 to 0 (CH2 to CH0): These bits and the SCAN bit select the analog
input channels. Clear the ADST bit to 0 before changing the channel selection.
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Section 15 A/D Converter
Group
Selection
Channel Selection
CH2
CH1
0
0
CH0
1
1
0
1
15.2.3
Description
Single Mode
Scan Mode
0
AN0 (Initial value)
AN0
1
AN1
AN0, AN1
0
AN2
AN0 to AN2
1
AN3
AN0 to AN3
0
AN4
AN4
1
AN5
AN4, AN5
0
AN6
AN4 to AN6
1
AN7
AN4 to AN7
A/D Control Register (ADCR)
Bit
7
6
5
4
3
2
1
0
TRGE







Initial value
0
1
1
1
1
1
1
0
Read/Write
R/W







Reserved bits
Trigger enable
Enables or disables external triggering of A/D conversion
Reserved bit
Must not be set to 1
ADCR is an 8-bit readable/writable register that enables or disables external triggering of A/D
conversion. ADCR is initialized to H'7E by a reset and in standby mode.
Bit 7—Trigger Enable (TRGE): Enables or disables external triggering of A/D conversion.
Bit 7: TRGE
Description
0
A/D conversion cannot be externally triggered
1
A/D conversion starts at the falling edge of the external trigger signal (ADTRG)
Bits 6 to 1—Reserved: Read-only bits, always read as 1.
Bit 0—Reserved: Do not set to 1.
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(Initial value)
Section 15 A/D Converter
15.3
CPU Interface
ADDRA to ADDRD are 16-bit registers, but they are connected to the CPU by an 8-bit data bus.
Therefore, although the upper byte can be be accessed directly by the CPU, the lower byte is read
through an 8-bit temporary register (TEMP).
An A/D data register is read as follows. When the upper byte is read, the upper-byte value is
transferred directly to the CPU and the lower-byte value is transferred into TEMP. Next, when the
lower byte is read, the TEMP contents are transferred to the CPU.
When reading an A/D data register, always read the upper byte before the lower byte. It is possible
to read only the upper byte, but if only the lower byte is read, incorrect data may be obtained.
Figure 15.2 shows the data flow for access to an A/D data register.
Upper-byte read
CPU
(H'AA)
Module data bus
Bus interface
TEMP
(H'40)
ADDRnH
(H'AA)
ADDRnL
(H'40)
(n = A to D)
Lower-byte read
CPU
(H'40)
Module data bus
Bus interface
TEMP
(H'40)
ADDRnH
(H'AA)
ADDRnL
(H'40)
(n = A to D)
Figure 15.2 A/D Data Register Access Operation (Reading H'AA40)
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Section 15 A/D Converter
15.4
Operation
The A/D converter operates by successive approximations with 10-bit resolution. It has two
operating modes: single mode and scan mode.
15.4.1
Single Mode (SCAN = 0)
Single mode should be selected when only one A/D conversion on one channel is required. A/D
conversion starts when the ADST bit is set to 1 by software, or by external trigger input. The
ADST bit remains set to 1 during A/D conversion and is automatically cleared to 0 when
conversion ends.
When conversion ends the ADF bit is set to 1. If the ADIE bit is also set to 1, an ADI interrupt is
requested at this time. To clear the ADF flag to 0, first read ADCSR, then write 0 in ADF.
When the mode or analog input channel must be switched during analog conversion, to prevent
incorrect operation, first clear the ADST bit to 0 in ADCSR to halt A/D conversion. After making
the necessary changes, set the ADST bit to 1 to start A/D conversion again. The ADST bit can be
set at the same time as the mode or channel is changed.
Typical operations when channel 1 (AN1) is selected in single mode are described next.
Figure 15.3 shows a timing diagram for this example.
1. Single mode is selected (SCAN = 0), input channel AN1 is selected (CH2 = CH1 = 0,
CH0 = 1), the A/D interrupt is enabled (ADIE = 1), and A/D conversion is started (ADST = 1).
2. When A/D conversion is completed, the result is transferred into ADDRB. At the same time
the ADF flag is set to 1, the ADST bit is cleared to 0, and the A/D converter becomes idle.
3. Since ADF = 1 and ADIE = 1, an ADI interrupt is requested.
4. The A/D interrupt handling routine starts.
5. The routine reads ADCSR, then writes 0 in the ADF flag.
6. The routine reads and processes the conversion result (ADDRB).
7. Execution of the A/D interrupt handling routine ends. After that, if the ADST bit is set to 1,
A/D conversion starts again and steps 2 to 7 are repeated.
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Note: * Vertical arrows ( ) indicate instructions executed by software.
ADDRD
ADDRC
ADDRB
Read conversion result
A/D conversion result (2)
Idle
Clear *
A/D conversion result (1)
A/D conversion (2)
Set *
Read conversion result
Idle
State of channel 3
(AN 3)
ADDRA
Idle
State of channel 2
(AN 2)
Idle
Clear *
State of channel 1
(AN 1)
A/D conversion (1)
Set *
Idle
Idle
A/D conversion
starts
State of channel 0
(AN 0)
ADF
ADST
ADIE
Set *
Section 15 A/D Converter
Figure 15.3 Example of A/D Converter Operation (Single Mode, Channel 1 Selected)
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Section 15 A/D Converter
15.4.2
Scan Mode (SCAN = 1)
Scan mode is useful for monitoring analog inputs in a group of one or more channels. When the
ADST bit is set to 1 by software or external trigger input, A/D conversion starts on the first
channel in the group (AN0 when CH2 = 0, AN4 when CH2 = 1). When two or more channels are
selected, after conversion of the first channel ends, conversion of the second channel (AN1 or AN5)
starts immediately. A/D conversion continues cyclically on the selected channels until the ADST
bit is cleared to 0. The conversion results are transferred for storage into the A/D data registers
corresponding to the channels.
When the mode or analog input channel selection must be changed during analog conversion, to
prevent incorrect operation, first clear the ADST bit to 0 in ADCSR to halt A/D conversion. After
making the necessary changes, set the ADST bit to 1. A/D conversion will start again from the
first channel in the group. The ADST bit can be set at the same time as the mode or channel
selection is changed.
Typical operations when three channels in group 0 (AN0 to AN2) are selected in scan mode are
described next. Figure 15.4 shows a timing diagram for this example.
1. Scan mode is selected (SCAN = 1), scan group 0 is selected (CH2 = 0), analog input channels
AN0 to AN2 are selected (CH1 = 1, CH0 = 0), and A/D conversion is started (ADST = 1).
2. When A/D conversion of the first channel (AN0) is completed, the result is transferred into
ADDRA. Next, conversion of the second channel (AN1) starts automatically.
3. Conversion proceeds in the same way through the third channel (AN2).
4. When conversion of all selected channels (AN0 to AN2) is completed, the ADF flag is set to 1
and conversion of the first channel (AN0) starts again. If the ADIE bit is set to 1, an ADI
interrupt is requested at this time.
5. Steps 2 to 4 are repeated as long as the ADST bit remains set to 1. When the ADST bit is
cleared to 0, A/D conversion stops. After that, if the ADST bit is set to 1, A/D conversion
starts again from the first channel (AN0).
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Idle
Idle
Idle
A/D conversion (1)
Transfer
Idle
A/D conversion (3)
Idle
Idle
Clear*1
Idle
A/D conversion result (4)
Idle
A/D conversion (5)*2
A/D conversion result (3)
A/D conversion result (2)
A/D conversion (4)
A/D conversion result (1)
A/D conversion (2)
Idle
A/D conversion time
Continuous A/D conversion
Notes: 1. Vertical arrows ( ) indicate instructions executed by software.
2. Data currently being converted is ignored.
ADDRD
ADDRC
ADDRB
ADDRA
State of channel 3
(AN 3)
State of channel 2
(AN 2)
State of channel 1
(AN 1)
State of channel 0
(AN 0)
ADF
ADST
Set*1
Clear*1
Section 15 A/D Converter
Figure 15.4 Example of A/D Converter Operation
(Scan Mode, Channels AN0 to AN2 Selected)
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Section 15 A/D Converter
15.4.3
Input Sampling and A/D Conversion Time
The A/D converter has a built-in sample-and-hold circuit. The A/D converter samples the analog
input at a time tD after the ADST bit is set to 1, then starts conversion. Figure 15.5 shows the A/D
conversion timing. Table 15.4 indicates the A/D conversion time.
As indicated in figure 15.5, the A/D conversion time includes tD and the input sampling time. The
length of tD varies depending on the timing of the write access to ADCSR. The total conversion
time therefore varies within the ranges indicated in table 15.4.
In scan mode, the values given in table 15.4 apply to the first conversion. In the second and
subsequent conversions the conversion time is fixed at 256 states when CKS = 0 or 128 states
when CKS = 1.
(1)
φ
Address bus
(2)
Write signal
Input sampling
timing
ADF
tD
t SPL
t CONV
Legend:
(1):
ADCSR write cycle
(2):
ADCSR address
tD :
Synchronization delay
t SPL : Input sampling time
t CONV: A/D conversion time
Figure 15.5 A/D Conversion Timing
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Section 15 A/D Converter
Table 15.4 A/D Conversion Time (Single Mode)
CKS = 0
CKS = 1
Symbol
Min
Typ
Max
Min
Typ
Max
Synchronization delay
tD
10
—
17
6
—
9
Input sampling time
tSPL
—
63
—
—
31
—
A/D conversion time
tCONV
259
—
266
131
—
134
Note: Values in the table are numbers of states.
15.4.4
External Trigger Input Timing
A/D conversion can be externally triggered. When the TRGE bit is set to 1 in ADCR, external
trigger input is enabled at the ADTRG pin. A high-to-low transition at the ADTRG pin sets the
ADST bit to 1 in ADCSR, starting A/D conversion. Other operations, in both single and scan
modes, are the same as if the ADST bit had been set to 1 by software. Figure 15.6 shows the
timing.
φ
ADTRG
Internal trigger
signal
ADST
A/D conversion
Figure 15.6 External Trigger Input Timing
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Section 15 A/D Converter
15.5
Interrupts
The A/D converter generates an interrupt (ADI) at the end of A/D conversion. The ADI interrupt
request can be enabled or disabled by the ADIE bit in ADCSR.
15.6
Usage Notes
When using the A/D converter, note the following points:
1. Analog Input Voltage Range: During A/D conversion, the voltages input to the analog input
pins should be in the range AVSS ≤ ANn ≤ VREF.
2. Relationships of AVCC and AVSS to VCC and VSS: AVCC, AVSS, VCC, and VSS should be related as
follows: AVSS = VSS. AVCC and AVSS must not be left open, even if the A/D converter is not
used.
3. VREF Programming Range: The reference voltage input at the VREF pin should be in the range
VREF ≤ AVCC.
Failure to observe points 1, 2, and 3 above may degrade chip reliability.
4. Note on Board Design: In board layout, separate the digital circuits from the analog circuits as
much as possible. Particularly avoid layouts in which the signal lines of digital circuits cross or
closely approach the signal lines of analog circuits. Induction and other effects may cause the
analog circuits to operate incorrectly, or may adversely affect the accuracy of A/D conversion.
The analog input signals (AN0 to AN7), analog reference voltage (VREF), and analog supply
voltage (AVCC) must be separated from digital circuits by the analog ground (AVSS). The
analog ground (AVSS) should be connected to a stable digital ground (VSS) at one point on the
board.
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Section 15 A/D Converter
5. Note on Noise: To prevent damage from surges and other abnormal voltages at the analog
input pins (AN0 to AN7) and analog reference voltage pin (VREF), connect a protection circuit
like the one in figure 15.7 between AVCC and AVSS. The bypass capacitors connected to AVCC
and VREF and the filter capacitors connected to AN0 to AN7 must be connected to AVSS. If filter
capacitors like the ones in figure 15.7 are connected, the voltage values input to the analog
input pins (AN0 to AN7) will be smoothed, which may give rise to error. Error can also occur if
A/D conversion is frequently performed in scan mode so that the current that charges and
discharges the capacitor in the sample-and-hold circuit of the A/D converter becomes greater
than that input to the analog input pins via input impedance Rin. The circuit constants should
therefore be selected carefully.
AVCC
VREF
Rin*2
*1
100 Ω
AN0 to AN7
*1
0.1 µF
AVSS
Notes: 1. Numeric values are approximate.
10 µF
0.01 µF
2. Rin: input impedance
Figure 15.7 Example of Analog Input Protection Circuit
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Section 15 A/D Converter
10 kΩ
AN0 to AN7
To A/D converter
20 pF
Note: Numeric values are approximate.
Figure 15.8 Analog Input Pin Equivalent Circuit
Table 15.5 Analog Input Pin Ratings
Item
Min
Max
Unit
Analog input capacitance
—
20
pF
φ ≤ 13 MHz
—
10
kΩ
φ > 13 MHz
—
5
kΩ
Allowable signal-source impedance
6. A/D Conversion Accuracy Definitions: A/D conversion accuracy in the H8/3048B Group is
defined as follows:
•
Resolution
Digital output code length of A/D converter
•
Offset error
Deviation from ideal A/D conversion characteristic of analog input voltage required to
raise digital output from minimum voltage value B'0000000000 to B'0000000001 (figure
15.10)
•
Full-scale error
Deviation from ideal A/D conversion characteristic of analog input voltage required to
raise digital output from B'1111111110 to B'1111111111 (figure 15.10)
•
Quantization error
Intrinsic error of the A/D converter; 1/2 LSB (figure 15.9)
•
Nonlinearity error
Deviation from ideal A/D conversion characteristic in range from zero volts to full scale,
exclusive of offset error, full-scale error, and quantization error.
•
Absolute accuracy
Deviation of digital value from analog input value, including offset error, full-scale error,
quantization error, and nonlinearity error.
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Section 15 A/D Converter
Digital
output
111
Ideal A/D conversion
characteristic
110
101
100
011
010
Quantization error
001
000
1/8 2/8 3/8 4/8 5/8 6/8 7/8 FS
Analog input
voltage
Figure 15.9 A/D Converter Accuracy Definitions (1)
Full-scale
error
Digital
output
Ideal A/D
conversion
characteristic
Nonlinearity
error
Actual A/D conversion
characteristic
FS
Offset error
Analog input
voltage
Figure 15.10 A/D Converter Accuracy Definitions (2)
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Section 15 A/D Converter
7. Allowable Signal-Source Impedance: The analog inputs of the H8/3048B Group are designed
to assure accurate conversion of input signals with a signal-source impedance not exceeding
10 kΩ (φ ≤ 13 MHz) or not exceeding 5 kΩ (φ > 13 MHz) (table 15.5). The reason for this
rating is that it enables the input capacitor in the sample-and-hold circuit in the A/D converter
to charge within the sampling time. If the sensor output impedance exceeds 10 kΩ, charging
may be inadequate and the accuracy of A/D conversion cannot be guaranteed.
If a large external capacitor is provided in scan mode, then the internal 10-kΩ input resistance
becomes the only significant load on the input. In this case the impedance of the signal source
is not a problem.
A large external capacitor, however, acts as a low-pass filter. This may make it impossible to
track analog signals with high dv/dt (e.g. a variation of 5 mV/µs) (figure 15.11). To convert
high-speed analog signals or to use scan mode, insert a low-impedance buffer.
8. Effect on Absolute Accuracy: Attaching an external capacitor creates a coupling with ground,
so if there is noise on the ground line, it may degrade absolute accuracy. The capacitor must be
connected to an electrically stable ground, such as AVSS.
If a filter circuit is used, be careful of interference with digital signals on the same board, and
make sure the circuit does not act as an antenna.
H8/3048B Group
Sensor output impedance
Sensor
input
Up to 10 kΩ (φ ≤ 13 MHz)
Up to 5 kΩ (φ > 13 MHz)
Equivalent circuit of
A/D converter
10 kΩ
Cin =
15 pF
Low-pass
filter
Up to 0.1 µF
Figure 15.11 Analog Input Circuit (Example)
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20 pF
Section 16 D/A Converter
Section 16 D/A Converter
16.1 Overview
The H8/3048B Group includes a D/A converter with two channels.
16.1.1 Features
D/A converter features are listed below.
• Eight-bit resolution
• Two output channels
• Conversion time: maximum 10 µs (with 20-pF capacitive load)
• Output voltage: 0 V to 255/256 × VREF
• D/A outputs can be sustained in software standby mode
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Section 16 D/A Converter
16.1.2
Block Diagram
Bus interface
Figure 16.1 shows a block diagram of the D/A converter.
Module data bus
DACR
8-bit D/A
DADR1
DA 0
DADR0
AVCC
DASTCR
VREF
DA 1
AVSS
Legend:
DACR: D/A control register
DADR0: D/A data register 0
DADR1: D/A data register 1
DASTCR: D/A standby control register
Control circuit
Figure 16.1 D/A Converter Block Diagram
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Internal
data bus
Section 16 D/A Converter
16.1.3
Input/Output Pins
Table 16.1 summarizes the D/A converter’s input and output pins.
Table 16.1 D/A Converter Pins
Pin Name
Abbreviation
I/O
Function
Analog power supply pin
AVCC
Input
Analog power supply
Analog ground pin
AVSS
Input
Analog ground and reference voltage
Analog output pin 0
DA0
Output
Analog output, channel 0
Analog output pin 1
DA1
Output
Analog output, channel 1
Reference voltage input pin
VREF
Input
Analog reference voltage
16.1.4
Register Configuration
Table 16.2 summarizes the D/A converter’s registers.
Table 16.2 D/A Converter Registers
Address*
Name
Abbreviation
R/W
Initial Value
H'FFDC
D/A data register 0
DADR0
R/W
H'00
H'FFDD
D/A data register 1
DADR1
R/W
H'00
H'FFDE
D/A control register
DACR
R/W
H'1F
H'FF5C
D/A standby control register
DASTCR
R/W
H'FE
Note:
*
Lower 16 bits of the address
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Section 16 D/A Converter
16.2
Register Descriptions
16.2.1
D/A Data Registers 0 and 1 (DADR0, DADR1)
Bit
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
The D/A data registers (DADR0 and DADR1) are 8-bit readable/writable registers that store the
data to be converted. When analog output is enabled, the D/A data register values are constantly
converted and output at the analog output pins.
The D/A data registers are initialized to H'00 by a reset and in standby mode.
16.2.2
D/A Control Register (DACR)
Bit
7
6
5
4
3
2
1
0
DAOE1
DAOE0
DAE





Initial value
0
0
0
1
1
1
1
1
Read/Write
R/W
R/W
R/W





D/A enable
Controls D/A conversion
D/A output enable 0
Controls D/A conversion and analog output
D/A output enable 1
Controls D/A conversion and analog output
DACR is an 8-bit readable/writable register that controls the operation of the D/A converter.
DACR is initialized to H'1F by a reset and in standby mode.
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Section 16 D/A Converter
Bit 7—D/A Output Enable 1 (DAOE1): Controls D/A conversion and analog output.
Bit 7: DAOE1
Description
0
DA1 analog output is disabled
1
Channel-1 D/A conversion and DA1 analog output are enabled
(Initial value)
Bit 6—D/A Output Enable 0 (DAOE0): Controls D/A conversion and analog output.
Bit 6: DAOE0
Description
0
DA0 analog output is disabled
1
Channel-0 D/A conversion and DA0 analog output are enabled
(Initial value)
Bit 5—D/A Enable (DAE): Controls D/A conversion, together with bits DAOE0 and DAOE1.
When the DAE bit is cleared to 0, analog conversion is controlled independently in channels 0 and
1. When the DAE bit is set to 1, analog conversion is controlled together in channels 0 and 1.
Output of the conversion results is always controlled independently by DAOE0 and DAOE1.
Bit 7:
DAOE1
0
Bit 6:
DAOE0
Bit 5:
DAE
Description
0
—
D/A conversion is disabled in channels 0 and 1
1
0
D/A conversion is enabled in channel 0
D/A conversion is disabled in channel 1
1
0
1
D/A conversion is enabled in channels 0 and 1
0
D/A conversion is disabled in channel 0
D/A conversion is enabled in channel 1
1
1
D/A conversion is enabled in channels 0 and 1
—
D/A conversion is enabled in channels 0 and 1
When the DAE bit is set to 1, even if bits DAOE0 and DAOE1 in DACR and the ADST bit in
ADCSR are cleared to 0, the same current is drawn from the analog power supply as during A/D
and D/A conversion.
Bits 4 to 0—Reserved: Read-only bits, always read as 1.
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Section 16 D/A Converter
16.2.3
D/A Standby Control Register (DASTCR)
DASTCR is an 8-bit readable/writable register that enables or disables D/A output in software
standby mode.
Bit
7
6
5
4
3
2
1
0







DASTE
Initial value
1
1
1
1
1
1
1
0
Read/Write







R/W
Reserved bits
D/A standby enable
Enables or disables D/A output
in software standby mode
DASTCR is initialized to H'FE by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bits 7 to 1—Reserved: Read-only bits, always read as 1.
Bit 0—D/A Standby Enable (DASTE): Enables or disables D/A output in software standby
mode.
Bit 0: DASTE
Description
0
D/A output is disabled in software standby mode
1
D/A output is enabled in software standby mode
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(Initial value)
Section 16 D/A Converter
16.3
Operation
The D/A converter has two built-in D/A conversion circuits that can perform conversion
independently.
D/A conversion is performed constantly while enabled in DACR. If the DADR0 or DADR1 value
is modified, conversion of the new data begins immediately. The conversion results are output
when bits DAOE0 and DAOE1 are set to 1.
An example of D/A conversion on channel 0 is given next. Timing is indicated in figure 16.2.
1. Data to be converted is written in DADR0.
2. Bit DAOE0 is set to 1 in DACR. D/A conversion starts and DA0 becomes an output pin. The
converted result is output after the conversion time. The output value is (DADR0 contents/256)
× VREF. Output of this conversion result continues until the value in DADR0 is modified or the
DAOE0 bit is cleared to 0.
3. If the DADR0 value is modified, conversion starts immediately, and the result is output after
the conversion time.
4. When the DAOE0 bit is cleared to 0, DA0 becomes an input pin.
DADR0
write cycle
DACR
write cycle
DADR0
write cycle
DACR
write cycle
φ
Address
bus
Conversion data 1
DADR0
Conversion data 2
DAOE0
DA 0
Conversion
result 2
Conversion
result 1
High-impedance state
t DCONV
t DCONV
Legend:
t DCONV : D/A conversion time
Figure 16.2 Example of D/A Converter Operation
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Section 16 D/A Converter
16.4
D/A Output Control
In the H8/3048B Group, D/A converter output can be enabled or disabled in software standby
mode.
When the DASTE bit is set to 1 in DASTCR, D/A converter output is enabled in software standby
mode. The D/A converter registers retain the values they held prior to the transition to software
standby mode.
When D/A output is enabled in software standby mode, the reference supply current is the same as
during normal operation.
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Section 17 RAM
Section 17 RAM
17.1
Overview
The H8/3048B Group has 4 kbytes of high-speed static RAM on-chip. The RAM is connected to
the CPU by a 16-bit data bus. The CPU accesses both byte data and word data in two states,
making the RAM useful for rapid data transfer.
The on-chip RAM of the H8/3048B Group is assigned to addresses H'FEF10 to H'FFF0F in modes
1, 2, 5, and 7, and to addresses H'FFEF10 to H'FFFF0F in modes 3, 4, and 6. The RAM enable bit
(RAME) in the system control register (SYSCR) can enable or disable the on-chip RAM.
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Section 17 RAM
17.1.1
Block Diagram
Figure 17.1 shows a block diagram of the on-chip RAM.
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
Bus interface
SYSCR
H'FEF10*
H'FEF11*
H'FEF12*
H'FEF13*
On-chip RAM
H'FFF0E*
Even addresses
Legend:
SYSCR: System control register
H'FFF0F*
Odd addresses
Note: * This example is of the operating in mode 7. The lower 20 bits of the address are shown.
Figure 17.1 RAM Block Diagram
17.1.2
Register Configuration
The on-chip RAM is controlled by SYSCR. Table 17.1 gives the address and initial value of
SYSCR.
Table 17.1 System Control Register
Address*
H'FFF2
Note:
*
Name
Abbreviation
R/W
Initial Value
System control register
SYSCR
R/W
H'0B
Lower 16 bits of the address.
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Section 17 RAM
17.2
System Control Register (SYSCR)
Bit
7
6
5
4
3
2
1
0
SSBY
STS2
STS1
STS0
UE
NMIEG

RAME
Initial value
0
0
0
0
1
0
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W

R/W
RAM enable
Enables or
disables
on-chip RAM
Reserved bit
NMI edge select
User bit enable
Standby timer select 2 to 0
Software standby
One function of SYSCR is to enable or disable access to the on-chip RAM. The on-chip RAM is
enabled or disabled by the RAME bit in SYSCR. For details about the other bits, see section 3.3,
System Control Register (SYSCR).
Bit 0—RAM Enable (RAME): Enables or disables the on-chip RAM. The RAME bit is
initialized at the rising edge of the input at the RES pin. It is not initialized in software standby
mode.
Bit 0: RAME
Description
0
On-chip RAM is disabled
1
On-chip RAM is enabled
(Initial value)
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Section 17 RAM
17.3
Operation
When the RAME bit is set to 1, the on-chip RAM is enabled. Accesses to addresses H'FEF10 to
H'FFF0F in the H8/3048B Group in modes 1, 2, 5, and 7, addresses H'FFEF10 to H'FFFF0F in the
H8/3048B Group in modes 3, 4, and 6 are directed to the on-chip RAM. In modes 1 to 6
(expanded modes), when the RAME bit is cleared to 0, the off-chip address space is accessed. In
mode 7 (single-chip mode), when the RAME bit is cleared to 0, the on-chip RAM is not accessed:
read access always results in H'FF data, and write access is ignored.
Since the on-chip RAM is connected to the CPU by an internal 16-bit data bus, it can be written
and read by word access. It can also be written and read by byte access. Byte data is accessed in
two states using the upper 8 bits of the data bus. Word data starting at an even address is accessed
in two states using all 16 bits of the data bus.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Section 18 ROM
(H8/3048F-ONE: Single Power Supply,
H8/3048B Mask ROM Version)
18.1
Flash Memory Overview
18.1.1
Notes on H8/3048F-ONE (Single Power Supply)
There are two models of the H8/3048F-ZTAT with on-chip flash memory: a dual power supply
model (H8/3048F) and single power supply model (H8/3048F-ONE). Points to be noted when
using the H8/3048F-ONE single power supply is given below.
For the differences between the dual power supply model and single power supply model
(H8/3048F-ONE), see section 1.4.3, Differences between H8/3048F and H8/3048F-ONE.
(1) Voltage Application
12 V must not be applied to the H8/3048F-ONE (single power supply), as this will
permanently damage the device.
The flash memory programming power supply for the H8/3048F-ONE (single power supply) is
VCC.
The programming power supply for the dual power supply model is the VPP pin (12 V), but there is
no VPP pin in the single power supply model. In the H8/3048F-ONE (single power supply) model
the FWE pin is provided at the same pin position as the VPP pin in the dual power source model,
but FWE is not a power supply pin—it is used to control flash memory write enabling.
Also, in boot mode, 12 V must be applied to the MD2 pin in the dual power supply model, but this
is not necessary in the H8/3048F-ONE (single power supply).
The maximum rating of the FWE and MD2 pins in the H8/3048F-ONE (single power supply)
is VCC +0.3 V. Applying a voltage in excess of the maximum rating will permanently damage
the device.
Do not select the HN28F101 programmer setting for the H8/3048F-ONE (single power
supply). If this setting is made by mistake, 12.0 V will be applied to the FWE pin,
permanently damaging the device.
When using a PROM programmer to program the on-chip flash memory in the H8/3048FONE (single power supply), use a PROM programmer that supports Renesas Technology
microcomputer device types with 128-kbyte on-chip flash memory.
Rev. 3.00 Sep 27, 2006 page 573 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.1.2
Mode Pin Settings
The H8/3048F-ONE has 128 kbytes of on-chip flash memory. The flash memory is connected to
the CPU by a 16-bit data bus. The CPU accesses both byte data and word data in two states,
enabling rapid data transfer.
The mode pins (MD2 to MD0), FWE pin, and RXD1 pin can be set to enable or disable the on-chip
ROM as indicated in table 18.1.
Table 18.1 Operating Mode and ROM
Pin Name
Mode
MD2
MD1
MD0
FWE
RXD1
On-Chip ROM
Mode 1
(1-Mbyte expanded mode
with on-chip ROM disabled)
0
0
1
0
0/1
Disabled (external
address area)
Mode 2
(1-Mbyte expanded mode
with on-chip ROM disabled)
0
1
0
0
0/1
Mode 3
(16-Mbyte expanded mode
with on-chip ROM disabled)
0
1
1
0
0/1
Mode 4
(16-Mbyte expanded mode
with on-chip ROM disabled)
1
0
0
0
0/1
Mode 5
(1-Mbyte expanded mode
with on-chip ROM enabled)
1
0
1
0
0/1
Mode 6
(16-Mbyte expanded mode
with on-chip ROM enabled)
1
1
0
0
0/1
Mode 7 (single-chip mode)
1
1
1
0
0/1
Enabled
The H8/3048F-ONE can be set to PROM mode and programmed with a general-purpose PROM
programmer.
Rev. 3.00 Sep 27, 2006 page 574 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.2
Flash Memory Features
The H8/3048F-ONE has 128 kbytes of on-chip flash memory. The features of the flash memory
are summarized below.
• Four flash memory operating modes
 Program mode
 Erase mode
 Program-verify mode
 Erase-verify mode
• Programming/erase methods
The flash memory is programmed 128 bytes at a time. Block erase (in single-block units) can
be performed. To erase the entire flash memory, each block must be erased in turn. Block
erasing can be performed as required on 1 kbyte, 28 kbytes, and 32 kbytes blocks.
• Programming/erase times
The flash memory programming time is 10 ms (typ.) for simultaneous 128-byte programming,
equivalent approximately to 80 µs (typ.) per byte, and the erase time is 100 ms (typ.).
• Reprogramming capability
The flash memory can be reprogrammed up to 100 times.
• On-board programming modes
There are two modes in which flash memory can be programmed/erased/verified on-board:
 Boot mode
 User program mode
In the boot mode, the transferred program from the host can be recognized.
• Automatic bit rate adjustment
With data transfer in boot mode, the LSI’s bit rate can be automatically adjusted to match the
transfer bit rate of the host.
• Flash memory emulation in RAM
Flash memory programming can be emulated in real time by overlapping a part of RAM onto
flash memory.
• Protect modes
There are three protect modes, hardware, software, and error which allow protected status to be
designated for flash memory program/erase/verify operations.
• PROM mode
Flash memory can be programmed/erased in PROM mode, using a PROM programmer, as
well as in on-board programming mode.
Rev. 3.00 Sep 27, 2006 page 575 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.2.1
Block Diagram
Internal address bus
Module bus
Internal data bus (16 bits)
FLMCR1
FLMCR2
EBR
Bus interface/controller
Operating
mode
FWE pin
Mode pin
RAMCR
Flash memory
(128 kbytes)
Legend:
FLMCR1:
FLMCR2:
EBR:
RAMCR:
Flash memory control register 1
Flash memory control register 2
Erase block register
RAM control register
Note: Never apply 12 V to the H8/3048F-ONE (single power supply).
Otherwise, the LSI will be permanently damaged.
Figure 18.1 Block Diagram of Flash Memory
18.2.2
Mode Transitions
When the mode pins and the FWE pin are set in the reset state and a reset-start is executed, the
microcomputer enters an operating mode as shown in figure 18.2. In user mode, flash memory can
be read but not programmed or erased.
The boot, user program and PROM modes are provided as modes to write and erase the flash
memory.
Rev. 3.00 Sep 27, 2006 page 576 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Reset state
*1, *3
RES = 0
User mode
RES = 0
*3
FWE = 1
*2
RES = 0
*3
FWE = 0
RES = 0
PROM mode
*1
User
program mode
Boot mode
On-board programming mode
Notes: Only make a transition between user mode and user program mode when the CPU is not accessing
the flash memory.
1.
2.
3.
4.
RAM emulation possible
The H8/3048F-ONE is placed in PROM mode by means of a dedicated PROM writer.
Mode settings are shown in the following table.
For pins RXD1 and TXD1, use on-board pull-up in boot mode.
Pins
Mode
FWE
MD2
MD1
MD0
RXD1
Mode 1
Mode 2
Mode 3
Mode 4
Mode 5
Mode 6
Mode 7
0
0
0
0
1
1
1
1
0
1
1
0
0
1
1
1
0
1
0
1
0
1
0, 1
0, 1
0, 1
0, 1
0, 1
0, 1
0, 1
Boot mode 5
Boot mode 6
Boot mode 7
1
0
0
0
0
1
1
1
0
1
Setting prohibited
1
0
0
1
User program mode 5
User program mode 6
User program mode 7
1
1
1
0
1
1
1
0
1
0, 1
0, 1
0, 1
1*4
1*4
1*4
Figure 18.2 Flash Memory State Transitions
Rev. 3.00 Sep 27, 2006 page 577 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
State transitions between the normal user mode and on-board programming mode are performed
by changing the FWE pin level from high to low or from low to high. To prevent misoperation
(erroneous programming or erasing) in these cases, the bits in the flash memory control registers
(FLMCR1 and FLMCR2) should be cleared to 0 before making such a transition. After the bits are
cleared, a wait time is necessary. Normal operation is not guaranteed if this wait time is
insufficient.
Rev. 3.00 Sep 27, 2006 page 578 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.2.3
On-Board Programming Modes
Boot Mode
1. Initial state
The old program version or data remains written
in the flash memory. The user should prepare the
programming control program and new
application program beforehand in the host.
2. Programming control program transfer
When boot mode is entered, the boot program in
the H8/3048F-ONE (originally incorporated in the
chip) is started and the programming control
program in the host is transferred to RAM via SCI
communication. The boot program required for
flash memory erasing is automatically transferred
to the RAM boot program area.
Host
Host
Programming control
program
New application
program
New application
program
H8/3048F-ONE
H8/3048F-ONE
SCI
Boot program
Flash memory
SCI
Boot program
Flash memory
RAM
RAM
Boot program area
Application program
(old version)
Application program
(old version)
3. Flash memory initialization
The erase program in the boot program area (in
RAM) is executed, and the flash memory is
initialized (to H'FF). In boot mode, total flash
memory erasure is performed, without regard to
blocks.
Programming control
program
4. Writing new application program
The programming control program is recognized
if it corresponds to the H8/3048F-ONE.
The programming control program is then
transferred from the host to RAM is executed,
and the new application program in the host is
written into the flash memory.
Host
Host
New application
program
H8/3048F-ONE
H8/3048F-ONE
SCI
Boot program
Flash memory
RAM
Flash memory
Boot program area
Flash memory
preprogramming
erase
Programming control
program
SCI
Boot program
RAM
Boot program area
New application
program
Programming control
program
Program execution state
Note: Never apply 12 V to the H8/3048F-ONE (single power supply).
Otherwise, the LSI will be permanently damaged.
Rev. 3.00 Sep 27, 2006 page 579 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
User Program Mode
1. Initial state
The FWE assessment program that confirms that
user program mode has been entered, and the
program that will transfer the programming/erase
control program from flash memory to on-chip
RAM should be written into the flash memory by
the user beforehand. The programming/erase
control program should be prepared in the host or
in the flash memory.
2. Programming/erase control program transfer
When user program mode is entered, user
software confirms this fact, executes transfer
program in the flash memory, and transfers the
programming/erase control program to RAM.
Host
Host
Programming/
erase control program
New application
program
New application
program
H8/3048F-ONE
H8/3048F-ONE
SCI
Boot program
Flash memory
SCI
Boot program
RAM
RAM
Flash memory
FWE assessment
program
FWE assessment
program
Transfer program
Transfer program
Programming/
erase control program
Application program
(old version)
Application program
(old version)
3. Flash memory initialization
The programming/erase program in RAM is
executed, and the flash memory is initialized (to
H'FF). Erasing can be performed in block units,
but not in byte units.
4. Writing new application program
Next, the new application program in the host is
written into the erased flash memory blocks. Do
not write to unerased blocks.
Host
Host
New application
program
H8/3048F-ONE
H8/3048F-ONE
SCI
Boot program
Flash memory
RAM
FWE assessment
program
SCI
Boot program
Flash memory
RAM
FWE assessment
program
Transfer program
Transfer program
Programming/
erase control program
Flash memory
erase
Programming/
erase control program
New application
program
Program execution state
Note: Never apply 12 V to the H8/3048F-ONE (single power supply).
Otherwise, the LSI will be permanently damaged.
Rev. 3.00 Sep 27, 2006 page 580 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.2.4
Flash Memory Emulation in RAM
In the H8/3048F-ONE, flash memory programming can be emulated in real time by overlapping
the flash memory with part of RAM (“overlap RAM”). When the emulation block set in RAMCR
is accessed while the emulation function is being executed, data written in the overlap RAM is
read. Emulation should be performed in user mode or user program mode.
SCI
Flash memory
RAM
Emulation block
Overlap RAM
(emulation is performed
on data written in RAM)
Application program
Execution state
Figure 18.3 Reading Overlap RAM Data in User Mode or User Program Mode
When overlap RAM data is confirmed, clear the RAMS bit to release RAM overlap, and actually
perform writes to the flash memory.
When the programming control program is transferred to RAM in on-board programming mode,
ensure that the transfer destination and the overlap RAM do not overlap, as this will cause data in
the overlap RAM to be rewritten.
Rev. 3.00 Sep 27, 2006 page 581 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
SCI
RAM
Flash memory
Programming data
Overlap RAM
(programming data)
Application program
Programming control
program execution state
Figure 18.4 Writing Overlap RAM Data in User Program Mode
18.2.5
Differences between Boot Mode and User Program Mode
Item
Boot Mode
User Program Mode
Total erase
Yes
No
Block erase
No
Yes
Programming control program*
Boot program is initiated,
and programming control
program is transferred from
host to on-chip RAM, and
executed there.
Program that controls
programming program in flash
memory is executed. Program
should be written beforehand in
PROM mode and boot mode.
Note:
*
To be provided by the user, in accordance with the recommended algorithm.
Rev. 3.00 Sep 27, 2006 page 582 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.2.6
Block Configuration
The flash memory in the H8/3048F-ONE is divided into three 32-kbyte blocks, one 28-kbyte
block, and four 1-kbyte blocks and can be erased in these block units.
Address H'00000
1 kbyte × 4
28 kbytes
128 kbytes
32 kbytes
32 kbytes
32 kbytes
Address H'1FFFF
Figure 18.5 Erase Area Block Divisions
18.3
Flash Memory Pin Configuration
The flash memory is controlled by means of the pins shown in table 18.2.
Table 18.2 Pin Configuration
Pin Name
Abbreviation
I/O
Function
Reset
RES
Input
Reset
Flash write enable
Input
Flash program/erase protection by hardware
Mode 2
FWE*
1
MD2*
Input
Sets LSI operating mode
Mode 1
MD1
Input
Sets LSI operating mode
Mode 0
MD0
Input
Sets LSI operating mode
Transmit data
2
TxD1*
Output
Serial transmit data output
Receive data
RxD1*
Input
Serial receive data input
1
2
Notes: 1. Never apply 12 V to the H8/3048F-ONE (single power supply).
Otherwise, the LSI will be permanently damaged.
2. In boot mode, use on-board pull-up.
Rev. 3.00 Sep 27, 2006 page 583 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.4
Flash Memory Register Configuration
The registers* used to control the on-chip flash memory when enabled are shown in table 18.3.
Note: * Access is prohibited to lower 16 address bits H'FF43 to H'FF46 and H'FF48 to H'FF4F.
These bits are designed for the on-chip flash memory version and do not exist in the
on-chip mask ROM version.
In the on-chip mask ROM version, these bits always read 1, and writing is disabled.
Table 18.3 Register Configuration
Register Name
Abbreviation
R/W
Flash memory control register 1
Flash memory control register 2
FLMCR1*
5
FLMCR2*
R/W*
2 6
R/W* *
Erase block register
5
EBR*
R/W*
RAM control register
5
RAMCR*
R/W
5
2
2
Initial Value
Address*
H'00*
H'FF40
1
3
H'00
4
H'00*
H'FF42
H'FF41
H'F0
H'FF47
Notes: 1. Lower 16 bits of the address.
2. If the chip is in a mode in which the on-chip flash memory is disabled, a read will return
H'00 and writes are invalid. Writes are also invalid when the FWE bit in FLMCR1 is not
set to 1.
3. When a high level is input to the FWE pin, the initial value is H'80.
4. When a low level is input to the FWE pin, or if a high level is input and the SWE bit in
FLMCR1 is 0, these registers are initialized to H'00.
5. FLMCR1, FLMCR2, EBR, and RAMCR are 8-bit registers.
Byte access must be used on these registers (do not use word or longword access).
6. Bits 6 to 0 are reserved bits but are readable/writable.
18.5
Flash Memory Register Descriptions
18.5.1
Flash Memory Control Register 1 (FLMCR1)
Bit
7
6
5
4
3
2
1
0
SWE
ESU
PSU
EV
PV
E
P
Initial value
FWE
—*
0
0
0
0
0
0
0
Read/Write
R
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note:
*
Determined by the state of the FWE pin.
Rev. 3.00 Sep 27, 2006 page 584 of 872
REJ09B0325-0300
Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
FLMCR1 is an 8-bit register used for flash memory operating mode control. Program-verify mode
or erase-verify mode for addresses H'00000 to H'1FFFF is entered by setting SWE bit to 1 when
FWE = 1, then setting the PV or EV bit. Program mode for addresses H'00000 to H'1FFFF is
entered by setting SWE bit to 1 when FWE = 1, then setting the PSU bit, and finally setting the P
bit. Erase mode for addresses H'00000 to H'1FFFF is entered by setting SWE bit to 1 when FWE
= 1, then setting the ESU bit, and finally setting the E bit. FLMCR1 is initialized by a reset, and in
hardware standby mode and software standby mode. Its initial value is H'80 when a high level is
input to the FWE pin, and H'00 when a low level is input. When on-chip flash memory is disabled,
a read will return H'00, and writes are invalid. Set 1 to bits 6 to 0 by each bit in this register.
Writes are enabled only in the following cases: Writes to bit SWE of FLMCR1 enabled when
FWE = 1, to bits ESU, PSU, EV, and PV when FWE = 1 and SWE = 1, to bit E when FWE = 1,
SWE = 1 and ESU = 1, and to bit P when FWE = 1, SWE = 1, and PSU = 1.
Notes: 1. The programming and erase flowcharts must be followed when setting the bits in this
register to prevent erroneous programming or erasing.
2. Transitions are made to program mode, erase mode, program-verify mode, and eraseverify mode according to the settings in this register. When reading flash memory as
normal on-chip ROM, bits 6 to 0 in this register must be cleared.
Bit 7—Flash Write Enable Bit (FWE): Sets hardware protection against flash memory
programming/erasing.
Bit 7: FWE
Description
0
When a low level is input to the FWE pin (hardware-protected state)
1
When a high level is input to the FWE pin
Bit 6—Software Write Enable Bit (SWE): Enables or disables flash memory programming and
erasing (applicable addresses: H'00000 to H'1FFFF). Set this bit when setting bits 5 to 0, bits 7 to
0 of EBR.
Bit 6: SWE
Description
0
Writes disabled
Writes enabled*
1
(Initial value)
[Setting condition]
When FWE = 1
Note:
*
Do not execute a SLEEP instruction while the SWE bit is set to 1.
Rev. 3.00 Sep 27, 2006 page 585 of 872
REJ09B0325-0300
Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Bit 5—Erase Setup Bit (ESU): Prepares for a transition to erase mode (applicable addresses:
H'00000 to H'1FFFF). Do not set the SWE, PSU, EV, PV, E, or P bit at the same time. Set this bit
to 1 before setting bit E to 1 in FLMCR1.
Bit 5: ESU
Description
0
Erase setup cleared
1
Erase setup
(Initial value)
[Setting condition]
When FWE = 1 and SWE = 1
Bit 4—Program Setup Bit (PSU): Prepares for a transition to program mode (applicable
addresses: H'00000 to H'1FFFF). Do not set the SWE, ESU, EV, PV, E, or P bit at the same time.
Set this bit to 1 before setting bit P to 1 in FLMCR1.
Bit 4: PSU
Description
0
Program setup cleared
1
Program setup
(Initial value)
[Setting condition]
When FWE = 1 and SWE = 1
Bit 3—Erase-Verify Bit (EV): Selects erase-verify mode transition or clearing (applicable
addresses: H'00000 to H'1FFFF). Do not set the SWE, ESU, PSU, PV, E, or P bit at the same time.
Bit 3: EV
Description
0
Erase-verify mode cleared
1
Transition to erase-verify mode
[Setting condition]
When FWE = 1 and SWE = 1
Rev. 3.00 Sep 27, 2006 page 586 of 872
REJ09B0325-0300
(Initial value)
Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Bit 2—Program-Verify Bit (PV): Selects program-verify mode transition or clearing (applicable
addresses: H'00000 to H'1FFFF). Do not set the SWE, ESU, PSU, EV, E, or P bit at the same time.
Bit 2: PV
Description
0
Program-verify mode cleared
1
Transition to program-verify mode
(Initial value)
[Setting condition]
When FWE = 1 and SWE = 1
Bit 1—Erase Bit (E): Selects erase mode transition or clearing (applicable addresses: H'00000 to
H'1FFFF). Do not set the SWE, ESU, PSU, EV, PV, or P bit at the same time.
Bit 1: E
Description
0
Erase mode cleared
1
Transition to erase mode*
(Initial value)
[Setting condition]
When FWE = 1, SWE = 1, and ESU = 1
Note:
*
Do not access flash memory while the E bit is set to 1.
Bit 0—Program Bit (P): Selects program mode transition or clearing (applicable addresses:
H'00000 to H'1FFFF). Do not set the SWE, PSU, ESU, EV, PV, or E bit at the same time.
Bit 0: P
Description
0
Program mode cleared
1
Transition to program mode*
(Initial value)
[Setting condition]
When FWE = 1, SWE = 1, and PSU = 1
Note:
*
Do not access flash memory while the P bit is set.
Rev. 3.00 Sep 27, 2006 page 587 of 872
REJ09B0325-0300
Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.5.2
Flash Memory Control Register 2 (FLMCR2)
Bit
7
6
5
4
3
2
1
0
FLER
—
—
—
—
—
—
—
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R/W
R/W
R/W
R/W
R/W
R/W
R/W
FLMCR2 is an 8-bit register used for flash memory operating mode control. FLMCR2 is
initialized to H'00 by a reset, and in hardware standby mode and software standby mode. When
the on-chip flash memory is disabled, a read will return H'00.
Note: Bits 6 to 0 are reserved bits but are readable/writable.
Bit 7—Flash Memory Error (FLER): Indicates that an error has occurred during an operation on
flash memory (programming or erasing). When FLER is set to 1, flash memory goes to the errorprotection state.
Bit 7:
FLER
Description
0
Flash memory is operating normally
Flash memory program/erase protection (error protection) is disabled
[Clearing condition]
Reset (RES pin or WDT reset) or hardware standby mode
1
(Initial value)
An error occurred during flash memory programming/erasing
Flash memory program/erase protection (error protection) is enabled
[Setting conditions]
•
When flash memory is read during programming/erasing (including a vector read
or instruction fetch, but excluding a read of the RAM area overlapping flash
memory space)
•
Immediately after the start of exception handling during programming/erasing
(excluding reset, illegal instruction, trap instruction, and division-by-zero exception
handling)
•
When a SLEEP instruction (including software standby) is executed during
programming/erasing
•
When the bus is released during programming/erasing
Bits 6 to 0—Reserved: These bits are readable/writable.
Rev. 3.00 Sep 27, 2006 page 588 of 872
REJ09B0325-0300
Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.5.3
Erase Block Register (EBR)
EBR is an 8-bit register that designates the flash memory block for erasure. EBR is initialized to
H'00 by a reset, in hardware standby mode or software standby mode, when a high level is not
input to the FWE pin, or when the SWE bit in FLMCR1 is 0 when a high level is applied to the
FWE pin. When a bit is set in EBR, the corresponding block can be erased. Other blocks are eraseprotected. The blocks are erased block by block. Therefore, set only one bit in EBR; do not set bits
in EBR to erase two or more blocks at the same time.
Each bit in EBR cannot be set until the SWE bit in FLMCR1 is set. The flash memory block
configuration is shown in table 18.4. To erase all the blocks, erase each block sequentially.
Bit
7
6
5
4
3
2
1
0
EB7
EB6
EB5
EB4
EB3
EB2
EB1
EB0
Modes
1 to 4
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
Modes
5 to 7
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bits 7 to 0—Block 7 to Block 0 (EB7 to EB0): Setting one of these bits specifies the
corresponding block (EB7 to EB0) for erasure.
Bits 7–0:
EB7–EB0
Description
0
Corresponding block (EB7 to EB0) not selected
1
Corresponding block (EB7 to EB0) selected
(Initial value)
Note: When not performing an erase, clear EBR to H'00.
Rev. 3.00 Sep 27, 2006 page 589 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Table 18.4 Flash Memory Erase Blocks
Block (Size)
Address
EB0 (1 kbyte)
H'000000–H'0003FF
EB1 (1 kbyte)
H'000400–H'0007FF
EB2 (1 kbyte)
H'000800–H'000BFF
EB3 (1 kbyte)
H'000C00–H'000FFF
EB4 (28 kbytes)
H'001000–H'007FFF
EB5 (32 kbytes)
H'008000–H'00FFFF
EB6 (32 kbytes)
H'010000–H'017FFF
EB7 (32 kbytes)
H'018000–H'01FFFF
18.5.4
RAM Control Register (RAMCR)
Bit
7
6
5
4
3
2
1
0




RAMS
RAM2
RAM1

Modes
1 to 4
Initial value
1
1
1
1
0
0
0
0
Read/Write




R
R
R

Modes
5 to 7
Initial value
1
1
1
1
0
0
0
0
Read/Write




R/W
R/W
R/W
R/W
Reserved bits
Reserved bit
RAM2, RAM1
Used together with bit 3 to select
a flash memory area
RAM select
Used together with bits 2 and 1 to select
a flash memory area
RAMCR selects the RAM area to be used when emulating real-time flash memory programming.
RAMCR initialized to H'F0 by a reset and in hardware standby mode. It is not initialized in
software standby mode. RAMCR settings should be made in user mode or user program mode.*
Note: * When performing flash memory emulation by RAM, the RAME bit in SYSCR must be
set to 1.
RAM area settings are shown in table 18.5. To ensure correct operation of the emulation function,
the ROM for which RAM emulation is performed should not be accessed immediately after this
Rev. 3.00 Sep 27, 2006 page 590 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
register has been modified. Normal execution of an access immediately after register modification
is not guaranteed.
Bits 7 to 4—Reserved: These bits always read 1. Writing is disabled.
Bit 3—RAM Select (RAMS): Specifies selection or non-selection of flash memory emulation in
RAM. When RAMS = 1, all flash memory block are program/erase-protected.
Bit 3: RAMS
Description
0
Emulation not selected
(Initial value)
Program/erase-protection of all flash memory blocks is disabled
1
Emulation selected
Program/erase-protection of all flash memory blocks is enabled
Bits 2 and 1—RAM2 and RAM1: These bits are used with bit 3 to reassign an area to RAM (see
table 18.5).
Bit 0—Reserved: This bit is readable/writable.
Table 18.5 RAM Area Setting
RAM Area
Bit 3
Bit 2
Bit 1
RAMS
RAM2
RAM1
RAM Emulation Status
H'FFF000–H'FFF3FF
0
0/1
0/1
No emulation
H'000000–H'0003FF
1
0
0
Mapping RAM
H'000400–H'0007FF
1
0
1
H'000800–H'000BFF
1
1
0
H'000C00–H'000FFF
1
1
1
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
ROM area
RAM area
H'000000
H'FFEF10
EB0
ROM blocks
EB0–EB3
(H'000000–
H'000FFF)
H'0003FF
H'000400
H'FFEFFF
H'FFF000
ROM selection
area
EB1
H'0007FF
H'000800
H'000BFF
H'000C00
H'000FFF
Mapping RAM
EB2
Actual RAM
RAM selection
area
H'FFF3FF
H'FFF400
RAM
overlap area
(H'FFF000–
H'FFF3FF)
H'FFFF0F
EB3
Figure 18.6 Example of ROM Area/RAM Area Overlap
18.6
Flash Memory On-Board Programming Modes
When pins are set to on-board programming mode and a reset-start is executed, a transition is
made to the on-board programming state in which program/erase/verify operations can be
performed on the on-chip flash memory. There are two on-board programming modes: boot mode
and user program mode. The pin settings for transition to each of these modes are shown in table
18.6. For a diagram of the transitions to the various flash memory modes, see figure 18.2.
Table 18.6 Setting On-Board Programming Modes
Mode
Boot mode
Mode 5
2
FWE*
MD2*
1*
0*
1
0*
1
Mode 6
MD1
MD0
RxD1
Notes
0
1
0: VIL
1
0
1*
3
1*
3
1
1
1*
Mode 5
0*
1
1*
0
1
0/1
Mode 6
1
1*
1
0
0/1
Mode 7
1
1*
1
1
0/1
Mode 7
User program mode
1
2
1
1: VIH
3
Notes: 1. (1) For the high-level application timing, see Notes on Use of Boot Mode.
(2) In boot mode, the inverse of the MD2 setting should be input.
(3) In boot mode, the mode control register (MDCR) can be used to monitor the status
of modes 5, 6, and 7, in the same way as in normal mode.
2. Never apply 12 V to the H8/3048F-ONE (single power supply). If do so, the LSI will be
permanently damaged.
3. For pins RXD1 and TXD1, use on-board pull-up.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.6.1
Boot Mode
When boot mode is used, the flash memory programming control program must be prepared in the
host beforehand. The SCI channel to be used is set to asynchronous mode.
When a reset-start is executed after H8/3048F-ONE’s pins have been set to boot mode, the boot
program built into the LSI is started and the programming control program prepared in the host is
serially transmitted to the LSI via the SCI. In the LSI, the programming control program received
via the SCI is written into the programming control program area in on-chip RAM. After the
transfer is completed, the programming control program is recognized (the ID code is checked) if
it corresponds to the H8/3048F-ONE. When the ID code is matched, control branches to the start
address of the programming control program area and the programming control program execution
state is entered (flash memory programming is performed).
The transferred programming control program must therefore include coding that follows the
programming algorithm given later.
The system configuration in boot mode is shown in figure 18.7, and the boot mode execution
procedure in figure 18.8.
H8/3048F-ONE
Flash memory
Host
Write data reception
Verify data transmission
RxD1*
SCI1
TxD1*
On-chip RAM
Note: * For pins RxD1 and TxD1, use on-board pull-up.
Figure 18.7 System Configuration in Boot Mode
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Start
Set pins to boot program mode and execute reset-start
Host transfers data (H'00) continuously at prescribed
bit rate
H8/3048F-ONE measures low period of H'00 data
transmitted by host
H8/3048F-ONE calculates bit rate and sets value in bit
rate register
After bit rate adjustment, H8/3048F-ONE transmits one
H'00 data byte to host to indicate end of adjustment
Host confirms normal reception of bit rate adjustment
end indication (H'00), and transmits one H'55 data byte
After receiving H'55, H8/3048F-ONE transmits one
H'AA byte to host
Host transmits number of programming control program
bytes (N), upper byte followed by lower byte
H8/3048F-ONE transmits received number of bytes to
host as verify data (echo-back)
n=1
Host transmits programming control program
sequentially in byte units
H8/3048F-ONE transmits received programming
control program to host as verify data (echo-back)
n+1→n
Transfer received programming control program to
on-chip RAM
n = N?
No
Yes
End of transmission
Check flash memory data, and if data has already been
written, erase all blocks
Confirm that all flash memory data has been erased*
Check ID code at beginning of user program transfer
area
(Mismatch)
(Match)
Transmit one H'AA byte to host
Transmit H'FF as
error notification
Execute programming control program transferred to
on-chip RAM
Note: * If a memory cell does not operate normally and cannot be erased, one H'FF byte is transmitted as an erase error
indication, and the erase operation and subsequent operations are halted.
Figure 18.8 Boot Mode Execution Procedure
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Automatic SCI Bit Rate Adjustment
Start
bit
D0
D1
D2
D3
D4
D5
D6
Low period (9 bits) measured (H'00 data)
D7
Stop
bit
High period
(1 or more bits)
When boot mode is initiated, H8/3048F-ONE measures the low period of the asynchronous SCI
communication data (H'00) transmitted continuously from the host. The SCI transmit/receive
format should be set as follows: 8-bit data, 1 stop bit, no parity. H8/3048F-ONE calculates the bit
rate of the transmission from the host from the measured low period, and transmits one H'00 byte
to the host to indicate the end of bit rate adjustment. The host should confirm that this adjustment
end indication (H'00) has been received normally, and transmit one H'55 byte to H8/3048F-ONE.
If reception cannot be performed normally, initiate boot mode again (reset), and repeat the above
operations. Depending on the host’s transmission bit rate and H8/3048F-ONE’s system clock
frequency, there will be a discrepancy between the bit rates of the host and H8/3048F-ONE. Set
the host transfer bit rate at 4,800, 9,600 or 19,200 bps* to operate the SCI properly.
Table 18.7 shows host transfer bit rates and system clock frequencies for which automatic
adjustment of H8/3048F-ONE bit rate is possible. The boot program should be executed within
this system clock range.
Table 18.7 System Clock Frequencies for which Automatic Adjustment of H8/3048F-ONE
Bit Rate is Possible
Host Bit Rate
System Clock Frequency for Which Automatic Adjustment
of LSI Bit Rate is Possible (MHz)
4800 bps
4 to 25
9,600 bps
8 to 25
19,200 bps
16 to 25
Note: * Use a host bit rate setting of 4800, 9600, or 19200 bps only. No other setting should be
used.
Although the H8/3048F-ONE may also perform automatic bit rate adjustment with bit
rate and system clock combinations other than those shown in table 18.7, a degree of
error will arise between the bit rates of the host and the H8/3048F-ONE, and
subsequent transfer will not be performed normally. Therefore, only combinations of
bit rate and system clock within the ranges shown in table 18.7 can be used for boot
mode execution.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
On-Chip RAM Area Divisions in Boot Mode
In boot mode, the RAM area is divided into an area used by the boot program and an area to which
the programming control program is transferred via the SCI, as shown in figure 18.9. The boot
program area cannot be used until the execution state in boot mode switches to the programming
control program transferred from the host.
H'FFEF10
Boot program area
H'FFF50F
H'FFF510
Programming
control
program area
ID code area
(8 bytes)
H'FFFF0F
Figure 18.9 RAM Areas in Boot Mode
Note: The boot program area cannot be used until a transition is made to the execution state for
the programming control program transferred to RAM. Note also that the boot program
remains in this area of the on-chip RAM even after control branches to the programming
control program.
In boot mode in the H8/3048F-ONE, the contents of the 8-byte ID code area shown below are
checked to determine whether the program is a programming control program compatible with the
H8/3048F-ONE.
H'FFF510
40
FE
62
66
33
30
34
38
(Product ID code)
H'FFF518 onward
Programming control program instruction codes
If an original programming control program is used in boot mode, the 8-byte ID code shown
above should be added at the beginning of the program.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Notes on Using the Boot Mode
1. When this LSI comes out of reset in boot mode, it measures the low period the input at the
SCI’s RXD1 pin. The reset should end with RXD1 high. After the reset ends, it takes about 100
states for this LSI to get ready to measure the low period of the RXD1 input.
2. In boot mode, if any data has been written to the flash memory (if all data is not H'FF), all
flash memory blocks are erased. Therefore, this mode should be used for initial on-board
programming, or for forced recovery if the program to be activated in user program mode is
accidentally erased and user program mode cannot be executed, for example.
3. Interrupts cannot be used during programming or erasing of flash memory.
The RXD1 and TXD1 pins should be pulled up on the board.
4.
5. This LSI terminates transmit and receive operations by the on-chip SCI(channel 1) (by clearing
the RE and TE bits in serial control register (SCR)) before branching to the transmit data
output pin. However, the adjusted bit rate is held in the bit rate register (BRR). At this time, the
TXD1 is in the high level output state (P9DDR P91DDR=1, P9DR P91DR=1).
Before branching to the programming control program the value of the general registers in the
CPU are also undefined. Therefore, the general registers must be initialized immediately after
control branches to the programming control program. Since the stack pointer (SP) is
implicitly used during subroutine call, etc., a stack area must be specified for use by the
programming control program.
There are no other internal I/O registers in which the initial value is changed.
6. Transition to the boot mode executes a reset-start of this LSI after setting the MD0 to MD2,
FWE, and RXD1 pins according to the mode setting conditions shown in table 18.6.
At this time, this LSI latches the status of the mode pin inside the microcomputer to maintain
1
the boot mode status at the reset clear (startup from Low level to High level) timing* .
To clear boot mode, it is necessary to drive the FWE pin low during the reset, and then execute
1
reset release* . The following points must be noted:
•
Before making a transition from the boot mode to the regular mode, the microcomputer
1
boot mode must be reset by reset input via the RES pin* . At this time, the RES pin must be
2
hold at low level for at least 20 system clock* .
•
Do not change the input levels at the mode pins (MD2 to MD0) or the FWE pin while in
boot mode. When making a mode transition, first enter the reset state by inputting a low
level to the RES pin. When a watchdog timer reset was generated in the boot mode, the
microcomputer mode is not reset and the on-chip boot program is restarted regardless of
the state of the mode pin.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
•
Do not input low level to the FWE pin while the boot program is executing and when
3
programming/erasing flash memory* .
7. If the mode pins (MD2 to MD0), FWE pin, and RXD1 pin input levels are changed (e.g., from
low level to high level) during a reset (while a low level is being input to the RES pin), since
the microcomputer’s operating mode will change and the state of the address dual port and bus
control output signals (CSn, RD, HWR, LWR) changes, use of these pins as output signals
during reset must be disabled outside the microcomputer.
H8/3048F-ONE
CSn
External
memory,
etc.
MD2
MD1
MD0
FWE
RES
System
control
unit
Figure 18.10 Recommended System Block Diagram
Notes: 1. The mode pin, FWE pin, and RXD1 pin input must satisfy the mode programming
setup time (tMDS) relative to the reset clear timing.
2. See section 4.2.2, Reset Sequence and 18.11, Notes on Flash Memory
Programming/Erasing. The H8/3048F-ONE requires a minimum of 20 system clocks.
3. For notes on FWE pin High/Low, see section 18.11, Notes on Flash Memory
Programming/Erasing.
18.6.2
User Program Mode
When set to the user program mode, user’s programming/erasing control program can erase and
program the flash memory. Therefore, on-chip flash memory on-board programming can be
performed by providing a means of controlling FWE and supplying the write data on the board
and providing a programming/erasing program in a part of the program area.
To select this mode, activate H8/3048F-ONE to on-chip flash memory enable modes 5, 6, and 7
and apply a high level to the FWE pin. In this state, the peripheral functions, other than flash
memory, are performed the same as in modes 5, 6, and 7.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Since the flash memory cannot be read while it is being programmed/erased, place a programming
program on external memory, or transfer the programming program to RAM area, and execute it
in the RAM.
Figure 18.11 shows the procedure for executing when transferred to on-chip RAM. During reset
start, starting from the user program mode is possible.
Procedure
1
MD2–MD0 = 101, 110, 111
2
Reset start
3
Transfer programming/erasing
program to RAM
The user writes a program that executes steps
3 to 8 in advance as shown below.
1. Sets the mode pin to an on-chip ROM
enable mode (mode 5, 6, or 7).
2. Starts the CPU via reset.
(The CPU can also be started from the user
program mode by setting the FWE pin to
High level during reset; that is, during the
period the RES pin is a low level.)
3. Transfers the programming/erasing program
to RAM.
4
Branch to programming/erasing
program in RAM area
4. Branches to the program in RAM area.
5. Sets the FWE pin to a high level.*
(Switches to user program mode.)
5
FWE = high
(user program mode)
6. After confirming that the FWE pin is a high
level, executes the programming/erasing
program in RAM. This reprograms the user
application program in flash memory.
6
Execute programming/erasing
program in RAM
(flash memory reprogramming)
7. At the end of reprograming, clears the SWE
bit, and exits the user program mode by
switching the FWE pin from a high level to a
low level.*
7
8
Input low level to FWE
after SWE bit clear
(user program mode exit)
Execute user application
program in flash memory
8. Branches to, and executes, the user
application program reprogrammed in flash
memory.
Note: * For notes on FWE pin High/Low, see
section 18.11, Notes on Flash Memory
Programming/Erasing.
Figure 18.11 User Program Mode Execution Procedure (Example)
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Notes: 1. Normally do not apply a high level to the FWE pin. Apply a high level to the FWE pin
only when programming/erasing flash memory (including flash memory emulation by
RAM).
Also, while a high level is input to the FWE pin, the watchdog timer should be
activated to prevent overprogramming or overerasing due to program runaway, etc.
2. When the flash memory is read normally in the user program mode, the programming/
erasing program must not be executed. Bits 6 to 0 in FLMCR1 must be cleared to 0.
18.7
Programming/Erasing Flash Memory
A software method, using the CPU, is employed to program and erase flash memory in the onboard programming modes. There are four flash memory operating modes: program mode, erase
mode, program-verify mode, and erase-verify mode. Transitions to these modes are made by
setting the PSU, ESU, P, E, PV, and EV bits in FLMCR1 for addresses H'000000 to H'01FFFF.
The flash memory cannot be read while it is being written or erased. Install the program to control
flash memory programming and erasing (programming control program) in the on-chip RAM or in
external memory, and execute the program from there.
See section 18.11, Notes on Flash Memory Programming/Erasing, for points to be noted when
programming or erasing the flash memory. In the following operation descriptions, wait times
after setting or clearing individual bits in FLMCR1 are given as parameters; for details of the wait
times, see section 21.1.6, Flash Memory Characteristics.
Notes: 1. Operation is not guaranteed if bits SWE, ESU, PSU, EV, PV, E, and P of FLMCR1 are
set/reset by a program in flash memory in the corresponding address areas.
2. When programming or erasing, set FWE to 1 (programming/erasing will not be
executed if FWE = 0).
3. Programming should be performed in the erased state. Do not perform additional
programming on previously programmed addresses.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
*3
E=1
Erase setup
state
Erase mode
=
0
ES
U
*1
ES
U
Normal mode
=
1
E=0
FWE = 1
FWE = 0
*2
On-board
programming mode
Software programming
disable state
SWE = 1
SWE = 0
=
EV
=
EV
Software
programming
enable
state
PS
Erase-verify
mode
1
U=
PS
U=
0
0
1
*4
Program
setup state
P=1
Program mode
P=0
PV
=
1
PV
=
0
Program-verify
mode
Notes: In order to perform a normal read of flash memory, SWE must be cleared to 0.
Also note that verify-reads can be performed during the programming/erasing process.
1.
: Normal mode
: On-board programming mode
2. Do not make a state transition by setting or clearing multiple bits simultaneously.
3. After a transition from erase mode to the erase setup state, do not enter erase mode without passing
through the software programming enable state.
4. After a transition from program mode to the program setup state, do not enter program mode without
passing through the software programming enable state.
Figure 18.12 State Transitions Caused by FLMCR1 Bit Settings
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.7.1
Program Mode
To write data or programs to flash memory, the program/program-verify flowchart shown in figure
18.13 should be followed. Performing program operations according to this flowchart will enable
data or programs to be written to flash memory without subjecting the device to voltage stress or
sacrificing program data reliability. Programming should be carried out 128 bytes at a time.
The wait times after bits are set or cleared in the flash memory control register 1 (FLMCR1) and
the maximum number of programming operations (N) are shown in table 21.11 in section 21.1.6,
Flash Memory Characteristics.
Following the elapse of (tsswe) µs or more after the SWE bit is set to 1 in FLMCR1, 128-byte data is
written consecutively to the write addresses. The lower 8 bits of the first address written to must
be H'00 and H'80, 128 consecutive byte data transfers are performed. The program address and
program data are latched in the flash memory. A 128-byte data transfer must be performed even if
writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses.
Next, the watchdog timer (WDT) is set to prevent overprogramming due to program runaway, etc.
Set a value greater than (tspsu + tsp + tcp + tcpsu) µs as the WDT overflow period. Preparation for
entering program mode (program setup) is performed next by setting the PSU bit in FLMCR1.
The operating mode is then switched to program mode by setting the P bit in FLMCR1 after the
elapse of at least (tspsu) µs. The time during which the P bit is set is the flash memory programming
time. Make a program setting so that the time for one programming operation is within the range
of (tsp) µs.
The wait time after P bit setting must be changed according to the number of reprogramming
loops. For details, see Notes on Program/Program-Verify Procedure.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.7.2
Program-Verify Mode
In program-verify mode, the data written in program mode is read to check whether it has been
correctly written in the flash memory.
After the elapse of the given programming time, clear the P bit in FLMCR1, then wait for at least
(tcp) µs before clearing the PSU bit to exit program mode. After exiting program mode, the
watchdog timer setting is also cleared. The operating mode is then switched to program-verify
mode by setting the PV bit in FLMCR1. Before reading in program-verify mode, a dummy write
of H'FF data should be made to the addresses to be read. The dummy write should be executed
after the elapse of (tspv) µs or more. When the flash memory is read in this state (verify data is read
in 16-bit units), the data at the latched address is read. Wait at least (tspvr) µs after the dummy write
before performing this read operation. Next, the originally written data is compared with the verify
data, and reprogram data is computed (see figure 18.13) and transferred to RAM. After
verification of 128 bytes of data has been completed, exit program-verify mode, wait for at least
(tcpv) µs, then determine whether 128-byte programming has finished. If reprogramming is
necessary, set program mode again, and repeat the program/program-verify sequence as before.
The maximum value for repetition of the program/program-verify sequence is indicated by the
maximum programming count (N). Leave a wait time of at least (tcswe) µs after clearing SWE.
Notes on Program/Program-Verify Procedure
1. The program/program-verify procedure for the H8/3048F-ONE is a 128-byte-unit
programming algorithm.
In order to perform 128-byte-unit programming, the lower 8 bits of the write start address must
be H'00 or H'80.
2. When performing continuous writing of 128-byte data to flash memory, byte-unit transfer
should be used.
128-byte data transfer is necessary even when writing fewer than 128 bytes of data. H'FF data
must be written to the extra addresses.
3. Verify data is read in word units.
4. The write pulse is applied and a flash memory write executed while the P bit in FLMCR1 is
set. In the H8/3048F-ONE, write pulses should be applied as follows in the program/programverify procedure to prevent voltage stress on the device and loss of write data reliability.
a. After write pulse application, perform a verify-read in program-verify mode and apply a
write pulse again for any bits read as 1 (reprogramming processing). When all the 0-write
bits in the 128-byte write data are read as 0 in the verify-read operation, the
program/program-verify procedure is completed. In the H8/3048F-ONE, the number of
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
loops in reprogramming processing is guaranteed not to exceed the maximum value of the
maximum programming count (N).
b. After write pulse application, a verify-read is performed in program-verify mode, and
programming is judged to have been completed for bits read as 0. The following processing
is necessary for programmed bits.
When programming is completed at an early stage in the program/program-verify
procedure:
If programming is completed in the 1st to 6th reprogramming processing loop,
additional programming should be performed on the relevant bits. Additional
programming should only be performed on bits which first return 0 in a verify-read
in certain reprogramming processing.
When programming is completed at a late stage in the program/program-verify procedure:
If programming is completed in the 7th or later reprogramming processing loop, additional
programming is not necessary for the relevant bits.
c. If programming of other bits is incomplete in the 128 bytes, reprogramming process should
be executed. If a bit for which programming has been judged to be completed is read as 1
in a subsequent verify-read, a write pulse should again be applied to that bit.
5. The period for which the P bit in FLMCR1 is set (the write pulse width) should be
changed according to the degree of progress through the program/program-verify
procedure. For detailed wait time specifications, see section 21.1.6, Flash Memory
Characteristics.
Table 18.8 Wait Time after P Bit Setting
Item
Symbol
Conditions
Symbol
Wait time after P
bit setting
tsp
When reprogramming loop count (n) is 1 to 6
tsp30
When reprogramming loop count (n) is 7 or more
In case of additional programming processing*
tsp200
Note:
*
tsp10
Additional programming processing is necessary only when the reprogramming loop
count (n) is 1 to 6.
6. The program/program-verify flowchart for the H8/3048F-ONE is shown in figure 18.13.
To cover the points noted above, bits on which reprogramming processing is to be executed,
and bits on which additional programming is to be executed, must be determined as shown
below.
Since reprogram data and additional-programming data vary according to the progress of the
programming procedure, it is recommended that the following data storage areas (128 bytes
each) be provided in RAM.
Rev. 3.00 Sep 27, 2006 page 604 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Table 18.9 Reprogram Data Computation Table
(D)
Result of Verify-Read
after Write Pulse
(X)
Application (V)
Result of Operation
0
0
1
Programming completed: reprogramming
processing not to be executed
0
1
0
Programming incomplete: reprogramming
processing to be executed
1
0
1

1
1
1
Still in erased state: no action
Comments
Legend:
Source data of bits on which programming is executed: (D)
Data of bits on which reprogramming is executed: (X)
Table 18.10 Additional-Programming Data Computation Table
X
Result of Verify-Read
after Write Pulse
(Y)
Application (V)
Result of Operation
0
0
0
Programming by write pulse application
judged to be completed: additional
programming processing to be executed
0
1
1
Programming by write pulse application
incomplete: additional programming
processing not to be executed
1
0
1
Programming already completed: additional
programming processing not to be executed
1
1
1
Still in erased state: no action
Comments
Legend:
Data of bits on which additional programming is executed: (Y)
Data of bits on which reprogramming is executed in a certain reprogramming loop: (X')
7. It is necessary to execute additional programming processing during the course of the
H8/3048F-ONE program/program-verify procedure. However, once 128-byte-unit
programming is finished, additional programming should not be carried out on the same
address area. When executing reprogramming, an erase must be executed first. Note that
normal operation of reads, etc., is not guaranteed if additional programming is performed on
addresses for which a program/program-verify operation has finished.
Rev. 3.00 Sep 27, 2006 page 605 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Write pulse application subroutine
Start of programming
Sub-Routine Write Pulse
START
WDT enable
Set SWE bit in FLMCR1
Wait (tsswe) µs
*7
Store 128-byte program data in program
data area and reprogram data area
*4
Set PSU in FLMCR1
Wait (tspsu) µs
*7
n= 1
Start of programming
Set P bit in FLMCR1
Wait (tsp) µs
m= 0
*5 *7
Clear P bit in FLMCR1
Wait (tcp) µs
Write 128-byte data in RAM reprogram
data area consecutively to flash memory
Programming halted
*1
Sub-Routine-Call
Write pulse
*7
See Note 6 for pulse width
Set PV bit in FLMCR1
Clear PSU bit in FLMCR1
Wait (tcpsu) µs
Perform programming in the erased state.
Do not perform additional programming
on previously programmed addresses.
Wait (tspv) µs
*7
*7
H'FF dummy write to verify address
Disable WDT
n←n+1
Wait (tspvr) µs
*7
End Sub
Read verify data
Note: 6. Write Pulse Width
Number of Writes n Write Time (tsp) µsec
1
30
2
30
3
30
4
30
5
30
6
30
7
200
8
200
9
200
10
200
11
200
12
200
13
200
Increment
address
Write data = verify data?
m=1
OK
NG
6≥n?
OK
Additional-programming data computation
Transfer additional-programming data to
additional-programming data area
*4
Reprogram data computation
*3
Transfer reprogram data to reprogram data area
*4
128-byte data
verification completed?
NG
998
999
1000
*2
NG
200
200
200
OK
Clear PV bit in FLMCR1
Reprogram
Wait (tcpv) µs
Note: Use a 10 µs write pulse for additional programming.
*7
NG
6 ≥ n?
OK
Successively write 128-byte data from additionalprogramming data area in RAM to flash memory *1
RAM
Program data storage
area (128 bytes)
Sub-Routine-Call
Write Pulse (Additional programming)
Reprogram data storage
area (128 bytes)
m=0?
OK
Clear SWE bit in FLMCR1
Additional-programming
data storage area
(128 bytes)
*7
NG
n ≥ N?
OK
Clear SWE bit in FLMCR1
NG
Wait (tcswe) µs
Wait (tcswe) µs
End of programming
Programming failure
*7
Notes: 1. Data transfer is performed by byte transfer. The lower 8 bits of the first address written to must be H'00 or H'80.
A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses.
2. Verify data is read in 16-bit (word) units.
3. Reprogram data is determined by the operation shown in the table below (comparison between the data stored in the program data area and the verify data).
Bits for which the reprogram data is 0 are programmed in the next reprogramming loop. Therefore, even bits for which programming has been completed will be
subjected to programming once again if the result of the subsequent verify operation is NG.
4. A 128-byte area for storing program data, a 128-byte area for storing reprogram data, and a 128-byte area for storing additional data must be provided in RAM.
The contents of the reprogram data area and additional data area are modified as programming proceeds.
5. A write pulse of 30 µs or 200 µs is applied according to the progress of the programming operation. See Note 6 for details of the pulse widths. When writing of
additional-programming data is executed, a 10 µs write pulse should be applied. Reprogram data X' means reprogram data when the write pulse is applied.
7. The wait times and value of N are shown in section 21.1.6, Flash Memory Characteristics.
Reprogram Data Computation Table
Original Data
Verify Data Reprogram Data
(D)
(V)
(X)
Comments
Additional-Programming Data Computation Table
Reprogram Data Verify Data
Additional(X')
(V)
Programming Data (Y)
0
0
1
Programming completed
0
0
0
0
1
0
Programming incomplete;
reprogram
0
1
1
1
0
1
1
0
1
1
1
1
1
1
1
Still in erased state;
no action
Comments
Additional programming
to be executed
Additional programming
not to be executed
Additional programming
not to be executed
Additional programming
not to be executed
Figure 18.13 Program/Program-Verify Flowchart (128-Byte Programming)
Rev. 3.00 Sep 27, 2006 page 606 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.7.3
Erase Mode
To erase an individual flash memory block, follow the flowchart for erasing one block (singleblock erase) shown in figure 18.14.
The wait times after bits are set or cleared in the flash memory control register 1 (FLMCR1) and
the maximum number of erase operations (N) are shown in table 21.11 in section 21.1.6, Flash
Memory Characteristics.
To erase flash memory contents, make a 1-bit setting for the flash memory area to be erased in
erase block register (EBR1) at least (tsswe) µs after setting the SWE bit to 1 in FLMCR1. Next, the
watchdog timer (WDT) is set to prevent overerasing due to program runaway, etc. Set a value
greater than (tse) ms + (tsesu + tce + tcesu) µs as the WDT overflow period. Preparation for entering
erase mode (erase setup) is performed next by setting the ESU bit in FLMCR1. The operating
mode is then switched to erase mode by setting the E bit in FLMCR1 after the elapse of at least
(tsesu) µs. The time during which the E bit is set is the flash memory erase time. Ensure that the
erase time does not exceed (tse) ms.
Note: With flash memory erasing, preprogramming (setting all memory data in the memory to
be erased to all 0) is not necessary before starting the erase procedure.
18.7.4
Erase-Verify Mode
In erase-verify mode, data is read after memory has been erased to check whether it has been
correctly erased.
After the elapse of the fixed erase time, clear the E bit in FLMCR1, then wait for at least (tce) µs
before clearing the ESU bit to exit erase mode. After exiting erase mode, the watchdog timer
setting is also cleared. The operating mode is then switched to erase-verify mode by setting the EV
bit in FLMCR1. Before reading in erase-verify mode, a dummy write of H'FF data should be made
to the addresses to be read. The dummy write should be executed after the elapse of (tsev) µs or
more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at
the latched address is read. Wait at least (tsevr) µs after the dummy write before performing this read
operation. If the read data has been erased (all 1), a dummy write is performed to the next address,
and erase-verify is performed. If the read data is unerased, set erase mode again, and repeat the
erase/erase-verify sequence as before. The maximum value for repetition of the erase/erase-verify
sequence is indicated by the maximum erase count (N). When verification is completed, exit
erase-verify mode, and wait for at least (tcev) µs. If erasure has been completed on all the erase
blocks, clear bit SWE1 in FLMCR1, and leave a wait time of at least (tcswe) µs.
Rev. 3.00 Sep 27, 2006 page 607 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
If erasing multiple blocks, set a single bit in EBR for the next block to be erased, and repeat the
erase/erase-verify sequence as before.
Start
*1
Perform erasing in block units.
Set SWE bit in FLMCR1
Wait (tsswe) µs
*5
n=1
Set EBR
*3, *4
Enable WDT
Set ESU bit in FLMCR1
Wait (tsesu) µs
*5
Start of erase
Set E bit in FLMCR1
Wait (tse) ms
*5
Clear E bit in FLMCR1
Erase halted
Wait (tce) µs
*5
Clear ESU bit in FLMCR1
Wait (tcesu) µs
*5
Disable WDT
Set EV bit in FLMCR1
Wait (tsev) µs
n←n+1
*5
Set block start address as verify address
H'FF dummy write to verify address
Increment
address
Wait (tsevr) µs
*5
Read verify data
*2
Verify data = all 1s?
No
Yes
No
Last address of block?
Yes
Clear EV bit in FLMCR1
*5
Wait (tcev) µs
Clear EV bit in FLMCR1
*5
n ≥ N?
Clear SWE bit in FLMCR1
Notes: 1.
2.
3.
4.
5.
*5
Wait (tcev) µs
*5
No
Yes
Clear SWE bit in FLMCR1
Wait (tcswe) µs
Wait (tcswe) µs
End of erasing
Erase failure
*5
Prewriting (setting erase block data to all 0s) is not necessary.
Verify data is read in 16-bit (word) units.
Make only a single-bit specification in the erase block register (EBR). Two or more bits must not be set simultaneously.
Erasing is performed in block units. To erase multiple blocks, each block must be erased in turn.
The wait times and the value of N are shown in section 21.1.6, Flash Memory Characteristics.
Figure 18.14 Erase/Erase-Verify Flowchart (Single-Block Erasing)
Rev. 3.00 Sep 27, 2006 page 608 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.8
Flash Memory Protection
There are three kinds of flash memory program/erase protection: hardware protection, software
protection, and error protection.
18.8.1
Hardware Protection
Hardware protection refers to a state in which programming/erasing of flash memory is forcibly
disabled or aborted. Hardware protection is reset by settings in flash memory control register 1
(FLMCR1), and erase block register (EBR). In the error-protected state, the FLMCR1, FLMCR2,
and EBR settings are retained; the P and E bits can be set, but a transition is not made to program
mode or erase mode. (See table 18.11.)
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Table 18.11 Hardware Protection
Functions
Item
Description
Program Erase
Verify
FWE pin
protection
•
When a low level is input to the FWE pin,
FLMCR1, and EBR are initialized, and the
program/erase-protected state is entered.
No*
No*
3
No
Reset/
standby
protection
•
In a reset (including a WDT overflow reset) and
in standby mode, FLMCR1, FLMCR2, and EBR
are initialized, and the program/erase-protected
state is entered.
No
No*
3
No
•
In a reset via the RES pin, the reset state is not
entered unless the RES pin is held low until
oscillation stabilizes after powering on. In the
case of a reset during operation, hold the RES
pin low for the RES pulse width specified in the
4
AC Characteristics section* .
•
When a microcomputer operation error (error
generation (FLER = 1)) was detected while flash
memory was being programmed/erased, error
protection is enabled. At this time, the FLMCR1
and EBR settings are held, but programming/
erasing is aborted at the time the error was
generated. Error protection is released only by a
reset via the RES pin or a WDT reset, or in the
hardware standby mode.
No
No*
3
Yes*
Error
protection
1
Notes: 1. Excluding a RAM area overlapping flash memory.
2. It is possible to perform a program-verify operation on the 128 bytes being
programmed, or an erase-verify operation on the block being erased.
3. All blocks are unerasable and block-by-block specification is not possible.
4. See section 4.2.2, Reset Sequence, and section 18.11, Notes on Flash Memory
Programming/Erasing. The H8/3048F-ONE requires at least 20 system clocks for a
reset period during operation.
Rev. 3.00 Sep 27, 2006 page 610 of 872
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2
Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.8.2
Software Protection
Software protection can be implemented by setting, erase block register (EBR) and the RAMS bit
in the RAM control register (RAMCR). When software protection is in effect, setting the P or E
bit in flash memory control register 1 (FLMCR1) does not cause a transition to program mode or
erase mode. (See table 18.12.)
Table 18.12 Software Protection
Functions
Item
Description
Program Erase
Verify
Block
specification
protection
•
Erase protection can be set for individual
blocks by settings in erase block register
2
(EBR)* .
However, programming protection is disabled.
—
Yes
•
Setting EBR to H'00 places all blocks in the
erase-protected state.
•
Setting the RAMS bit to 1 in the RAM
control register (RAMCR) places all blocks
in the program/erase-protected state.
Emulation
protection
No*
No
1
No*
3
Yes
Notes: 1. A RAM area overlapping flash memory can be written to.
2. When not erasing, clear all EBR bits to 0.
3. All blocks are unerasable and block-by-block specification is not possible.
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.8.3
Error Protection
In error protection, an error is detected when H8/3048F-ONE runaway occurs during flash
1
memory programming/erasing* , or operation is not performed in accordance with the
program/erase algorithm, and the program/erase operation is aborted. Aborting the program/erase
operation prevents damage to the flash memory due to overprogramming or overerasing.
If the H8/3048F-ONE malfunctions during flash memory programming/erasing, the FLER bit is
set to 1 in FLMCR2 and the error protection state is entered. The FLMCR1, FLMCR2, EBR
3
settings* are retained, but program mode or erase mode is aborted at the point at which the error
occurred. Program mode or erase mode cannot be re-entered by re-setting the P, E bit. However,
2
PV, EV bit setting is enabled, and a transition can be made to verify mode* .
FLER bit setting conditions are as follows:
1. When the flash memory of the relevant address area is read during programming/erasing
(including vector read and instruction fetch)
2. Immediately after exception handling (excluding an illegal reset or trap instruction and
exception handling at zero division) during programming/erasing
3. When a SLEEP instruction (including software standby) is executed during
programming/erasing
4. When the CPU releases the bus to the DMAC, refresh controller, and external bus master
during programming/erasing
Error protection is released only by a reset (RES pin or WDT reset) and in hardware standby
mode.
Notes: 1. State in which the P bit or E bit in FLMCR1 is set to 1. Note that NMI input is disabled
in this state.
2. It is possible to perform a program-verify operation on the 128 bytes being
programmed, or an erase-verify on the block being erased.
3. FLMCR1 and EBR can be written to. However, the registers are initialized if a
transition is made to software standby mode while in the error-protected state.
Rev. 3.00 Sep 27, 2006 page 612 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Program mode
Erase mode
Reset or standby
(hardware protection)
WDT reset, RES = 0 or STBY = 0
RD VF PR ER INIT FLER = 0
RD VF PR ER FLER = 0
Error occurrence
(software standby)
Error
occurrence
WDT reset,
RES = 0 or
STBY = 0
WDT reset,
RES = 0 or
STBY = 0
Software
standby mode
Error protection mode
RD VF PR ER FLER = 1
Software standby
mode release
FLMCR1, FLMCR2,
EBR initialization
state
Error protection mode
(software standby)
RD VF PR ER INIT FLER = 1
FLMCR1, EBR
initialization state
Legend:
RD: Memory read possible
VF: Verify-read possible
PR: Programming possible
ER: Erasing possible
RD:
VF:
PR:
ER:
INIT:
Memory read not possible
Verify-read not possible
Programming not possible
Erasing not possible
Register initialization state
Figure 18.15 Flash Memory State Transitions
(When High Level Is Applied to FWE Pin in Mode 5, 6, and 7 (On-Chip ROM Enabled))
The error protection function is invalid for abnormal operations other than the FLER bit setting
conditions. Also, if a certain time has elapsed before this protection state is entered, damage may
already have been caused to the flash memory. Consequently, this function cannot provide
complete protection against damage to flash memory.
To prevent such abnormal operations, therefore, it is necessary to ensure correct operation in
accordance with the program/erase algorithm, with the flash write enable (FWE) voltage applied,
and to conduct constant monitoring for MCU errors, internally and externally, using the watchdog
timer or other means. There may also be cases where the flash memory is in an erroneous
programming or erroneous erasing state at the point of transition to this protection mode, or where
programming or erasing is not properly carried out because of an abort. In cases such as these, a
forced recovery (program rewrite) must be executed using boot mode. However, it may also
happen that boot mode cannot be normally initiated because of overprogramming or overerasing.
Rev. 3.00 Sep 27, 2006 page 613 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.8.4
NMI Input Disable Conditions
While flash memory is being programmed/erased (P bit or E bit in FLMCR1 is set) and the boot
1
program is executing in the boot mode* , all interrupts including NMI input must be disabled
because the programming/erasing have priority.
This is done to avoid the following operation states:
1. Generation of an interrupt during programming/erasing violates the program/erase algorithms
and normal operation can not longer be assured.
2
2. Vector-read cannot be carried out normally* during interrupt exception handling during
programming/erasing and the microcomputer runs away as a result.
3. If an interrupt is generated during boot program execution, the normal boot mode sequence
cannot be executed.
With above reasons, there are conditions that exceptionally disable NMI inputs only in the onboard programming mode. However, this does not assure normal programming/erasing and
microcomputer operation.
Thus, when the flash memory is programmed/erased, all interrupt requests (exception handling
and bus release), including NMI, inside and outside the microcomputer, must be disabled. NMI
interrupt is also disabled in the error-protected state and when the P bit or E bit in FLMCR1 is
retained during flash memory emulation by RAM.
Notes: 1. Indicates the period up to branching to the on-chip RAM boot program area
(H'FFEF10). (This branch occurs immediately after programming control program
transfer was completed.)
Therefore, after branching to RAM area, NMI input is enabled in states other than the
program/erase state. Thus, interrupt requests inside and outside the microcomputer
must be disabled until initial writing by programming control program (writing of
vector table and NMI processing program, etc.) is completed.
2. In this case, vector read is not performed normally for the following two reasons:
•
The correct value cannot be read even by reading the flash memory during
programming/erasing (P bit or E bit in FLMCR1 is set). (Value is undefined.)
•
If a value has not yet been written to the interrupt vector table, interrupt exception
handling will not be performed correctly.
Rev. 3.00 Sep 27, 2006 page 614 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.9
Flash Memory Emulation in RAM
As flash memory programming and erasing takes time, it may be difficult to carry out tuning by
writing parameters and other data in real time. In this case, real-time programming of flash
memory can be emulated by overlapping part of RAM (H'FFF000–H'FFF3FF) onto a small block
area in flash memory. This RAM area change is executed by means of bits 3 to 1 in the RAM
control register (RAMCR). After the RAM area change, access is possible both from the area
overlapped onto flash memory and from the original area (H'FFF000–H'FFF3FF). For details of
RAMCR and the RAM area setting method, see section 18.5.4, RAM Control Register (RAMCR).
Example of Emulation of Real-Time Flash Memory Programming
In the following example, RAM area H'FFF000–H'FFF3FF is overlapped onto flash memory area
EB2 (H'000800–H'000BFF).
Procedure:
H'000000
1. Part of RAM (H'FFF000−
H'FFF3FF) is overlapped onto the
area (EB2) requiring real-time
programming.
Flash memory
space
Block area
(RAMCR bits 3−1 are set to 1, 1, 0,
and the flash memory area to be
overlapped (EB2) is selected.)
Overlapping RAM
EB2 H'000800
area H'000BFF
H'000FFF
*
(Mapping RAM
area)
Real-time programming is
performed using the overlapping
RAM.
3. The programmed data is checked,
then RAM overlapping is cleared.
(RAMS bit is cleared.)
H'FFEF10
On-chip RAM
area
H'FFEFFF
H'FFF000
H'FFF3FF
H'FFF400
2.
4. The data written in RAM area
H'FFF000−H'FFF3FF is written to
flash memory space.
(Actual RAM
area)
H'FFFF0F
Note: * When part of RAM (H'FFF000−H'FFF3FF) is overlapped onto a flash memory small block area, the flash
memory in the overlapped area cannot be accessed. It can be accessed when the overlapping is
cleared.
Figure 18.16 Example of RAM Overlap Operation
Rev. 3.00 Sep 27, 2006 page 615 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Notes on Using the Emulation Function by RAM
1. When the RAMS bit is set to 1, program/erase protection is enabled for all blocks regardless of
the value of RAM2 and RAM1 (emulation protection). In this state, setting the P or E bit in
flash memory control register 1 (FLMCR1), will not cause a transition to program mode or
erase mode. When actually programming or erasing a flash memory area, the RAMS bit should
be cleared to 0.
2. A RAM area cannot be erased by execution of software in accordance with the erase algorithm
while flash memory emulation in RAM is being used.
3. Block area EB0 includes the vector table. When performing RAM emulation, the vector table
is needed by the overlap RAM.
4. Flash write enable (FWE) application and releasing
As in on-board programming mode, care is required when applying and releasing FWE to
prevent erroneous programming or erasing. To prevent erroneous programming and erasing
due to program runaway during FWE application, in particular, the watchdog timer should be
set when the PSU, P, ESU, or E bit in FLMCR1 is set to 1, even while the emulation function
is being used. For details, see section 18.11, Notes on Flash Memory Programming/Erasing.
5. Prohibited conditions of NMI input
When the emulation function is used, NMI input is prohibited when the P bit or E bit in
FLMCR1 is set to 1, in the same way as with normal programming and erasing. The P and E
bits are cleared by a reset (including a watchdog timer reset), in standby mode, when a high
level is not being input to the FWE pin, or when the SWE bit in FLMCR1 is 0, while a high
level is being input to the FWE pin.
18.10
Flash Memory PROM Mode
The H8/3048F-ONE has a PROM mode as well as the on-board programming modes for
programming and erasing flash memory. In PROM mode, the on-chip ROM can be freely
programmed using a general-purpose PROM writer that supports the Renesas Technology
microcomputer device type with 128-kbyte on-chip flash memory.
Rev. 3.00 Sep 27, 2006 page 616 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.10.1 Socket Adapters and Memory Map
In PROM mode using a PROM writer, memory reading (verification) and writing and flash
memory initialization (total erasure) can be performed. For these operations, a special socket
adapter is mounted in the PROM writer. The socket adapter product codes are given in table
18.13*. In the H8/3048F-ONE PROM mode, only the socket adapters shown in this table should
be used.
Table 18.13 H8/3048F-ONE Socket Adapter Product Codes
Product Code
Package
Socket Adapter Product Code*
Manufacturer
HD64F3048BF
100-pin QFP
(FP-100B)
ME3064ESHF1H
Minato Electronics
100-pin TQFP
(TFP-100B)
ME3064ESNF1H
100-pin QFP
(FP-100B)
HF306BQ100D4001
HD64F3048BVF
HD64F3048BTE
HD64F3048BVTE
HD64F3048BF
HD64F3048BVF
HD64F3048BTE
HD64F3048BVTE
Note:
*
100-pin TQFP
(TFP-100B)
ME3024ESHF1H
ME3024ESNF1H
Data IO Japan
HF302BQ100D4001
HF306BT100D4001
HF302BT100D4001
Use of the wrong socket adapter may destroy the chip.
Figure 18.17 shows the memory map in PROM mode.
MCU mode
H'000000
H8/3048F-ONE
PROM mode
H'00000
On-chip ROM
H'01FFFF
H'1FFFF
Figure 18.17 Memory Map in PROM Mode
Rev. 3.00 Sep 27, 2006 page 617 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.10.2 Notes on Use of PROM Mode
1. A write to a 128-byte programming unit in PROM mode should be performed once only.
Erasing must be carried out before reprogramming an address that has already been
programmed.
2. When using a PROM writer to reprogram a device on which on-board programming/erasing
has been performed, it is recommended that erasing be carried out before executing
programming.
3. The memory is initially in the erased state when the device is shipped by Renesas. For samples
for which the erasure history is unknown, it is recommended that erasing be executed to check
and correct the initialization (erase) level.
4. The H8/3048F-ONE does not support a product identification mode as used with generalpurpose EPROMs, and therefore the device name cannot be set automatically in the PROM
writer.
5. Refer to the instruction manual provided with the socket adapter, or other relevant
documentation, for information on PROM writers and associated program versions that are
compatible with the PROM mode of the H8/3048F-ONE.
6. Select a Renesas Technology 128 kbytes flash memory on-board microcomputer device type.
If HN28F101 is selected, the LSI may be permanently damaged.
Rev. 3.00 Sep 27, 2006 page 618 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.11
Notes on Flash Memory Programming/Erasing
The following describes notes when using the on-board programming mode, RAM emulation
function, and PROM mode.
1. Program/erase with the specified voltage and timing.
Applied voltages in excess of the rating can permanently damage the device.
Note that the pins FWE, VPP, and MD2 have different absolute maximum ratings between the
H8/3048F-ONE (single power supply) and H8/3048F (dual power supply) models.
Use a PROM writer that supports the Renesas Technology 128 kbytes flash memory on-board
microcomputer device type.
Do not select the HN28F101 as the PROM writer. Otherwise, 12 V will be applied to the FWE
pin and this will permanently damage H8/3048F-ONE.
2. Notes on powering on/powering off (see figures 18.18 to 18.20)
Input a high level to the FWE pin after verifying Vcc. Before turning off Vcc, set the FWE pin
to a low level.
When powering on and powering off the Vcc power supply, fix the FWE pin low and set the
flash memory to the hardware protection mode.
Be sure that the powering on and powering off timing is satisfied even when the power is
turned off and back on in the event of a power interruption, etc. If this timing is not satisfied,
microcomputer runaway, etc., may cause overprogramming or overerasing and the memory
cells may not operate normally.
3. Notes on FWE pin High/Low switching (see figures 18.18 to 18.20)
Input FWE in the state microcomputer operation is verified. If the microcomputer does not
satisfy the operation confirmation state, fix the FWE pin low to set the protection mode.
To prevent erroneous programming/erasing of flash memory, note the following in FWE pin
High/Low switching:
a. Apply an input to the FWE pin after the Vcc voltage has stabilized within the rated voltage.
If an input is applied to the FWE pin when the microcomputer Vcc voltage does not satisfy
the rated voltage, flash memory may be erroneously programmed or erased because the
microcomputer is in the unconfirmed state.
b. Apply an input to the FWE pin when the oscillation has stabilized (after the oscillation
stabilization time).
When turning on the Vcc power, apply an input to the FWE pin after holding the RES pin
at a low level during the oscillation stabilization time. Do not apply an input to the FWE
pin when oscillation is stopped or unstable.
Rev. 3.00 Sep 27, 2006 page 619 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
c. In the boot mode, perform FWE pin High/Low switching during reset.
In transition to the boot mode, input FWE = high level and set MD2 to MD0 and RXD1 pins
while the RES input is low. At this time, the FWE, MD2 to MD0, and RXD1 inputs must
satisfy the mode programming setup time (tMDS) relative to the reset clear timing. The mode
programming setup time is necessary for RES reset timing even in transition from the boot
mode to another mode.
In reset during operation, the RES pin must be held at a low level for at least 20 system
clocks.
d. In the user program mode, FWE = High/Low switching is possible regardless of the RES
input.
FWE input switching is also possible during program execution on flash memory.
e. Apply an input to FWE when the program is not running away.
When applying an input to the FWE pin, the program execution state must be supervised
using a watchdog timer, etc.
f. Release FWE pin input only when the SWE, ESU, PSU, EV, PV, E, and P bits in FLMCR1
are cleared.
Do not erroneously set any of bits SWE, ESU, PSU, EV, PV, E, or P when applying or
releasing FWE.
4. Do not input a constant high level to the FWE pin.
To prevent erroneous programming/erasing in the event of program runaway, etc., input a high
level to the FWE pin only when programming/erasing flash memory (including flash memory
emulation by RAM). Avoid system configurations that constantly input a high level to the
FWE pin. Handle program runaway, etc. by starting the watchdog timer so that flash memory
is not overprogrammed/overerased even while a high level is input to the FWE pin.
5. Program/erase the flash memory in accordance with the recommended algorithms.
The recommended algorithms can program/erase the flash memory without applying voltage
stress to the device or sacrificing the reliability of the program data.
When setting the P and E bits in FLMCR1, set the watchdog timer for program runaway, etc.
Accesses to flash memory by means of an MOV instruction, etc., are prohibited while bit
P or bit E is set.
6. Do not set/clear the SWE bit while a program is executing on flash memory.
Before performing flash memory program execution or data read, clear the SWE bit.
If the SWE bit is set, the flash data can be reprogrammed, but flash memory cannot be
accessed for purposes other than verify (verify during programming/erase).
Rev. 3.00 Sep 27, 2006 page 620 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Similarly perform flash memory program execution and data read after clearing the SWE bit
even when using the RAM emulation function with a high level input to the FWE pin.
However, RAM area that overlaps flash memory space can be read/programmed whether the
SWE bit is set or cleared.
After the SWE bit is cleared, waiting time is required. For details, refer to table 21.11 in
section 21.1.6, Flash Memory Characteristics.
7. Do not use an interrupt during flash memory programming or erasing.
Since programming/erase operations (including emulation by RAM) have priority when a high
level is input to the FWE pin, disable all interrupt requests, including NMI. The bus release
should also be disabled.
8. Do not perform additional programming. Reprogram flash memory after erasing.
With on-board programming, program to 128-byte programming unit blocks one time only.
Erase all the programming unit blocks before reprogramming.
9. Before programming, check that the chip is correctly mounted in the PROM
programmer.
Overcurrent damage to the device can result if the index marks on the PROM programmer
socket, socket adapter, and chip are not correctly aligned.
10. Do not touch the socket adapter or chip during programming.
Touching either of these can cause contact faults and write errors.
11. A wait time of 100 µs or more is necessary when performing a read after a transition to
normal mode from program, erase, or verify mode.
12. Use byte access on the registers that control the flash memory (FLMCR1, FLMCR2,
EBR, and RAMCR).
Rev. 3.00 Sep 27, 2006 page 621 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Programming
and erase
possible
Wait time: x
Wait time: y
φ
Min 0 µs
tOSC1
VCC
tMDS
FWE
MD2 to MD0*1,
RXD1*3
Min 0 µs
tMDS
RES
SWE set
SWE clear
SWE bit
Flash memory access disabled period
(x: Wait time after SWE setting, y: wait time after SWE clearing)*2
Flash memory reprogrammable period
(Flash memory program execution and data read, other than verify, are disabled.)
Notes: 1. Always fix the level by pulling down or pulling up the mode pins (MD2 to MD0)
until powering off, except for mode switching.
2. See section 21.1.6, Flash Memory Characteristics.
3. For pins RXD1 and TXD1, use on-board pull-up.
Figure 18.18 Powering On/Off Timing (Boot Mode)
Rev. 3.00 Sep 27, 2006 page 622 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Programming
and erase
possible
Wait time: x
Wait time: y
φ
Min 0 µs
tOSC1
VCC
FWE
MD2 to MD0*1
tMDS
RES
SWE set
SWE bit
SWE clear
Flash memory access disabled period
(x: Wait time after SWE setting, y: wait time after SWE clearing)*2
Flash memory reprogrammable period
(Flash memory program execution and data read, other than verify, are disabled.)
Notes: 1. Always fix the level by pulling down or pulling up the mode pins (MD2 to MD0)
up to powering off, except for mode switching.
2. See section 21.1.6, Flash Memory Characteristics.
Figure 18.19 Powering On/Off Timing (User Program Mode)
Rev. 3.00 Sep 27, 2006 page 623 of 872
REJ09B0325-0300
Programming and
erase possible
Wait time: x
Wait time: x
Programming and
erase possible
Wait time: y
Wait time: x
Programming and
erase possible
Wait time: y
Wait time: y
Programming and
erase possible
Wait time: x
Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
φ
tOSC1
VCC
Min 0 µs
FWE
tMDS
MD2 to MD0,
RXD1*4
*2
tMDS
tMDS
tRESW
RES
SWE set
SWE clear
SWE bit
Mode switching*1
Boot mode
Mode
User
switching*1 mode
User program mode
User
mode
User
program
mode
Flash memory access disabled time
(x: Wait time after SWE setting, y: wait time after SWE clearing)*3
Flash memory reprogammable period
(Flash memory program execution and data read, other than verify, are disabled.)
Notes: 1. In transition to the boot mode and transition from the boot mode to another mode, mode switching via RES
input is necessary.
During this switching period (period during which a low level is input to the RES pin),the state of the address
dual port and bus control output signals (CSn, AS, RD, WR) changes.
Therefore, do not use these pins as output signals during this switching period.
2. When making a transition from the boot mode to another mode, the mode programming setup time tMDS relative
to the RES clear timing is necessary.
3. See section 21.1.6, Flash Memory Characteristics.
4. For pin RXD1, use on-board pull-up.
Figure 18.20 Mode Transition Timing
(Example: Boot mode → User mode ↔ User program mode)
Rev. 3.00 Sep 27, 2006 page 624 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.12
Mask ROM (H8/3048B Mask ROM Version) Overviews
18.12.1 Block Diagram
Figure 18.21 shows a block diagram of the ROM.
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'00000
H'00001
H'00002
H'00003
On-chip ROM
H'1FFFE
H'1FFFF
Even addresses
Odd addresses
Figure 18.21 ROM Block Diagram (H8/3048B Mask ROM Version)
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.13
Notes on Ordering Mask ROM Version Chips
When ordering H8/3048B with mask ROM, note the following.
1. When ordering by means of an EPROM, use a 128-kbyte one.
2. Fill all unused addresses with H'FF and order the same ROM data size as for the 128-kbyte
version. This applies to ordering by means of an EPROM and by means of data transmission.
HD6433048B
(ROM: 128 kbytes)
Addresses: H'00000−1FFFF
H'00000
Unused area*
H'1FFFF
Note: * Write H'FF data in all addresses in this area.
Figure 18.22 Mask ROM Addresses and Data
3. The flash memory control registers (FLMCR, EBR, RAMCR, FLMSR, FLMCR1, FLMCR2,
EBR1, and EBR2)used by the versions with on-chip flash memory are not provided in the
mask ROM versions. Reading the corresponding addresses in a mask ROM version will
always return 1s, and writes to these addresses are disabled. This must be borne in mind when
switching from a flash memory version to a mask ROM version.
Rev. 3.00 Sep 27, 2006 page 626 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
18.14
Notes when Converting the F-ZTAT (Single Power Supply)
Application Software to the Mask-ROM Versions
Please note the following when converting the F-ZTAT (single power supply) application software
to the mask-ROM versions.
The values read from the internal registers (refer to appendix B, Internal I/O Register, Table B.1)
for the F-ZTAT (single power supply) version differ as follows.
Status
Register
Bit
FLMCR1
FWE
F-ZTAT (Single Power Supply)
Version
Mask-ROM Version
0: Application software running
1: Programming
0: Is not read out
1: Application software running
Note: This difference applies to all the F-ZTAT (single power supply) versions and all the maskROM versions that have different ROM size.
Rev. 3.00 Sep 27, 2006 page 627 of 872
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Section 18 ROM (H8/3048F-ONE: Single Power Supply, H8/3048B Mask ROM Version)
Rev. 3.00 Sep 27, 2006 page 628 of 872
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Section 19 Clock Pulse Generator
Section 19 Clock Pulse Generator
19.1
Overview
The H8/3048B Group has a built-in clock pulse generator (CPG) that generates the system clock
(φ) and other internal clock signals (φ/2 to φ/4096). After duty adjustment, a frequency divider
divides the clock frequency to generate the system clock (φ). The system clock is output at the φ
1
pin* and furnished as a master clock to prescalers that supply clock signals to the on-chip
supporting modules. Frequency division ratios of 1/1, 1/2, 1/4, and 1/8 can be selected for the
frequency divider by settings in a division control register (DIVCR). Power consumption in the
2
chip is reduced in almost direct proportion to the frequency division ratio* .
Notes: 1. Usage of the φ pin differs depending on the chip operating mode and the PSTOP bit
setting in the module standby control register (MSTCR). For details, see section 20.7,
System Clock Output Disabling Function.
2. The division ratio of the frequency divider can be changed dynamically during
operation. The clock output at the φ pin also changes when the division ratio is
changed. The frequency output at the φ pin is shown below.
φ = EXTAL × n
where,
EXTAL: Frequency of crystal resonator or external clock signal
n:
Frequency division ratio (n = 1/1, 1/2, 1/4, or 1/8)
Rev. 3.00 Sep 27, 2006 page 629 of 872
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Section 19 Clock Pulse Generator
19.1.1
Block Diagram
Figure 19.1 shows a block diagram of the clock pulse generator.
CPG
XTAL
Oscillator
EXTAL
Duty
adjustment
circuit
Frequency
divider
Prescalers
Division
control
register
Data bus
φ
φ/2 to φ/4096
Figure 19.1 Block Diagram of Clock Pulse Generator
19.2
Oscillator Circuit
Clock pulses can be supplied by connecting a crystal resonator, or by input of an external clock
signal.
19.2.1
Connecting a Crystal Resonator
Circuit Configuration
A crystal resonator can be connected as in the example in figure 19.2. The damping resistance Rd
should be selected according to table 19.1, and external capacitance CL1 or CL2 to table 19.2. An
AT-cut parallel-resonance crystal should be used.
Rev. 3.00 Sep 27, 2006 page 630 of 872
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Section 19 Clock Pulse Generator
C L1
EXTAL
XTAL
Rd
C L2
Figure 19.2 Connection of Crystal Resonator (Example)
If a crystal resonator with a frequency higher than 20 MHz in the case of the 5 V version, or 13
MHz in the case of the 3 V version, is connected, the external load capacitance values in table 19.2
should not exceed 10 [pF]. Also, in order to improve the accuracy of the oscillation frequency, a
thorough study of oscillation matching evaluation, etc., should be carried out when deciding the
circuit constants.
Table 19.1 Damping Resistance Value
Damping Resistance
Value
Rd (Ω
Ω) H8/3048B
Group
Frequency f (MHz)
2
2 < f ≤ 4 4 < f ≤ 8 8 < f ≤ 10 10 < f ≤ 13 13 < f ≤ 16 16 < f ≤ 18 18 < f ≤ 25
1k
500
200
0
0
0
0
0
Note: A crystal resonator between 2 MHz and 25 MHz can be used. If the chip is to be operated
at less than 2 MHz, the on-chip frequency divider should be used. (A crystal resonator of
less than 2 MHz cannot be used.)
Table 19.2 External Capacitance Values
External Capacitance Value
Frequency f (MHz)
CL1 = CL2 (pF)
5 V Version
3 V Version
20 < f ≤ 25
2 ≤ f ≤ 20
2 ≤ f ≤ 13
13 < f ≤ 25
10
10 to 22
10 to 22
10
Rev. 3.00 Sep 27, 2006 page 631 of 872
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Section 19 Clock Pulse Generator
Crystal Resonator
Figure 19.3 shows an equivalent circuit of the crystal resonator. The crystal resonator should have
the characteristics listed in table 19.3.
CL
L
Rs
XTAL
EXTAL
AT-cut parallel-resonance type
C0
Figure 19.3 Crystal Resonator Equivalent Circuit
Table 19.3 Crystal Resonator Parameters
Frequency (MHz)
Rs max (Ω
Ω)
2
4
8
10
12
16
18
20
25
500
120
80
70
60
50
40
40
40
C0 max (pF)
7
Use a crystal resonator with a frequency equal to the system clock frequency (φ).
Notes on Board Design
When a crystal resonator is connected, the following points should be noted:
Other signal lines should be routed away from the oscillator circuit to prevent induction from
interfering with correct oscillation. See figure 19.4.
When the board is designed, the crystal resonator and its load capacitors should be placed as close
as possible to the XTAL and EXTAL pins.
Rev. 3.00 Sep 27, 2006 page 632 of 872
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Section 19 Clock Pulse Generator
Avoid
Signal A
Signal B
H8/3048B Group
C L2
XTAL
EXTAL
C L1
Figure 19.4 Example of Incorrect Board Design
19.2.2
External Clock Input
Circuit Configuration
An external clock signal can be input as shown in the examples in figure 19.5. The external clock
is input from the EXTAL pin. If the XTAL pin is left open, the stray capacitance should not
exceed 10 pF. If the stray capacitance at the XTAL pin exceeds 10 pF in configuration a, use
configuration b instead and hold the clock high in standby mode.
EXTAL
External clock input
XTAL
Open
a. XTAL pin left open
EXTAL
External clock input
74HC04
XTAL
b. Complementary clock input at XTAL pin
Figure 19.5 External Clock Input (Examples)
Rev. 3.00 Sep 27, 2006 page 633 of 872
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Section 19 Clock Pulse Generator
External Clock
The external clock frequency should be equal to the system clock frequency (φ) when not divided
by the on-chip frequency divider. Table 19.4, figures 19.6 and 19.7 indicate the clock timing.
When the appropriate external clock is input via the EXTAL pin, its waveform is corrected by the
on-chip oscillator and duty adjustment circuit. The resulting stable clock is output to external
devices after the external clock settling time (tDEXT) has passed after the clock input. The system
must remain reset with the reset signal low during tDEXT, while the clock output is unstable.
Table 19.4(1) Clock Timing for H8/3048B Group (8 MHz ≤ f ≤ 25 MHz)
VCC =
3.0 V to 3.6 V
VCC =
5.0 V ±10%
Item
Symbol Min
Max
Min
Max
Unit
Test
Conditions
External clock input low
pulse width
tEXL
tcyc/2–5
—
tcyc/2–5
—
ns
Figure 19.6
External clock input high
pulse width
tEXH
tcyc/2–5
—
tcyc/2–5
—
ns
External clock rise time
tEXr
—
5
—
5
ns
External clock fall time
tEXf
—
5
—
5
ns
Clock low pulse width
tCL
0.4
0.6
0.4
0.6
tcyc
Clock high pulse width
tCH
0.4
0.6
0.4
0.6
tcyc
500
—
500
—
µs
External clock output
settling delay time
Note:
*
*
tDEXT
tDEXT includes a RES pulse width (tRESW). tRESW = 20 tcyc
Rev. 3.00 Sep 27, 2006 page 634 of 872
REJ09B0325-0300
Figure 21.7
Figure 19.7
Section 19 Clock Pulse Generator
Table 19.4(2) Clock Timing for H8/3048B Group (2 MHz ≤ f < 8 MHz)
VCC =
3.0 V to 3.6 V
VCC =
5.0 V ±10%
Item
Symbol
Min
Max
Min
Max
Unit
Test Conditions
External clock
input low pulse
width
tEXL
57
—
57
—
ns
Figure 19.6
External clock
input high pulse
width
tEXH
57
—
57
—
ns
External clock
rise time
tEXr
—
5
—
5
ns
External clock
fall time
tEXf
—
5
—
5
ns
Clock low pulse
width
tCL
0.4
0.6
0.4
0.6
tcyc
φ ≥ 5 MHz
80
—
80
—
ns
φ < 5 MHz
Clock high pulse
width
tCH
0.4
0.6
0.4
0.6
tcyc
φ ≥ 5 MHz
80
—
80
—
ns
φ < 5 MHz
500
—
500
—
µs
Figure 19.7
External clock
output settling
delay time
Note:
*
*
tDEXT
Figure
21.7
tDEXT includes a RES pulse width (tRESW). tRESW = 20 tcyc
tEXH
tEXL
VCC × 0.7
EXTAL
VCC × 0.5
0.3 V
tEXr
tEXf
Figure 19.6 External Clock Input Timing
Rev. 3.00 Sep 27, 2006 page 635 of 872
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Section 19 Clock Pulse Generator
VCC
STBY
VIH
EXTAL
φ (internal or
external)
RES
tDEXT
Figure 19.7 External Clock Output Settling Delay Timing
19.3
Duty Adjustment Circuit
When the oscillator frequency is 5 MHz or higher, the duty adjustment circuit adjusts the duty
cycle of the clock signal from the oscillator to generate the signal that becomes the system clock.
19.4
Prescalers
The prescalers divide the system clock (φ) to generate internal clocks (φ/2 to φ/4096).
19.5
Frequency Divider
The frequency divider divides the duty-adjusted clock signal to generate the system clock (φ). The
frequency division ratio can be changed dynamically by modifying the value in DIVCR, as
described below. Power consumption in the chip is reduced in almost direct proportion to the
frequency division ratio. The system clock generated by the frequency divider can be output at the
φ pin.
Rev. 3.00 Sep 27, 2006 page 636 of 872
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Section 19 Clock Pulse Generator
19.5.1
Register Configuration
Table 19.5 summarizes the frequency division register.
Table 19.5
Frequency Division Register
Address*
H'FF5D
Note:
19.5.2
Name
Abbreviation
R/W
Initial Value
Division control register
DIVCR
R/W
H'FC
The lower 16 bits of the address are shown.
*
Division Control Register (DIVCR)
DIVCR is an 8-bit readable/writable register that selects the division ratio of the frequency
divider.
Bit
7
6
5
4
3
2
1
0






DIV1
DIV0
Initial value
1
1
1
1
1
1
0
0
Read/Write






R/W
R/W
Reserved bits
Divide bits 1 and 0
These bits select the
frequency division ratio
DIVCR is initialized to H'FC by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bits 7 to 2—Reserved: Read-only bits, always read as 1.
Bits 1 and 0—Divide (DIV1 and DIV0): These bits select the frequency division ratio, as
follows.
Bit 1: DIV1
Bit 0: DIV0
Frequency Division Ratio
0
0
1/1
1
1/2
0
1/4
1
1/8
1
(Initial value)
Rev. 3.00 Sep 27, 2006 page 637 of 872
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Section 19 Clock Pulse Generator
19.5.3
Usage Notes
The DIVCR setting changes the φ frequency, so note the following points.
• Select a frequency division ratio that stays within the assured operation range specified for the
clock cycle time tcyc in the AC electrical characteristics. Note that φMIN must be in the lower
limit of the clock frequency range. Avoid settings that give system clock frequencies less than
the lower limit.
Table 19.6 shows the comparison with the clock frequency range for each version.
Table 19.6 Comparison with the Clock Frequency Ranges in the H8/3048 Group and
H8/3048B Group
F-ZTAT
ROM type
ZTAT
H8/3048
Mask
H8/3048
H8/3048F H8/3048
ROM
F-ONE
Version
Product type
Guaranteed 4.5–5.5 V
clock
frequency 3.15–5.5 V
range
2–25
MHz
1–16
MHz
—
Mask ROM
H8/3047 H8/3045 H8/3044 H8/3048B
Mask
Mask
Mask
Mask
ROM
ROM
ROM
ROM
Version Version Version Version
1–18
MHz
1–18 MHz
2–25
MHz
1–13
MHz
1–13 MHz
—
2.7–5.5 V
—
1–8
MHz
1–8
MHz
1–8 MHz
—
3.0–3.6 V
2–25
MHz
—
—
—
2–25
MHz
2–25
MHz
2–16
MHz
2–18
MHz
2–18 MHz
2–25
MHz
Crystal oscillation
range
• All on-chip module operations are based on φ. Note that the timing of timer operations, serial
communication, and other time-dependent processing differs before and after any change in
the division ratio. The waiting time for exit from software standby mode also changes when
the division ratio is changed. For details, see section 20.4.3, Selection of Waiting Time for Exit
from Software Standby Mode.
Rev. 3.00 Sep 27, 2006 page 638 of 872
REJ09B0325-0300
Section 20 Power-Down State
Section 20 Power-Down State
20.1
Overview
The H8/3048B Group has a power-down state that greatly reduces power consumption by halting
the CPU, and a module standby function that reduces power consumption by selectively halting
on-chip modules.
The power-down state includes the following three modes:
• Sleep mode
• Software standby mode
• Hardware standby mode
The module standby function can halt on-chip supporting modules independently of the powerdown state. The modules that can be halted are the ITU, SCI0, SCI1, DMAC, refresh controller,
and A/D converter.
Table 20.1 indicates the methods of entering and exiting the power-down modes and module
standby mode, and gives the status of the CPU and on-chip supporting modules in each mode.
Rev. 3.00 Sep 27, 2006 page 639 of 872
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Rev. 3.00 Sep 27, 2006 page 640 of 872
REJ09B0325-0300
Corresponding Active
bit set to 1 in
MSTCR
Active
Notes: 1.
2.
3.
4.
Halted*2 Halted*2
and
and
reset
held*1

Halted
and
reset
Halted
and
held*1
Active
Halted
and
reset
Halted
and
reset
Active
Halted
and
reset
Halted
and
reset
Active
SCI1
Halted
and
reset
Halted
and
reset
Active
A/D
Halted
and
reset
Halted
and
reset
Active

• NMI
• IRQ0 to IRQ2
• RES
• STBY
• Interrupt
• RES
• STBY
Exiting
Conditions
High

impedance*2
• STBY
• RES
• Clear MSTCR
bit to 0*4
High
• STBY
impedance • RES
Held
Held
φ output
High
output
I/O Ports
φ Clock
Output
Held*3 High
impedance
Held
Held
Other
Modules RAM
Halted*2 Halted*2 Halted*2 Halted*2 Active
and
and
and
and
reset
reset
reset
reset
Halted
and
reset
Halted
and
reset
Halted
and
reset
Halted
and
reset
Active
SCI0
Active
Refresh
Controller ITU
Undetermined
Held
Held
CPU
Registers DMAC
RTCNT and bits 7 and 6 of RTMCSR are initialized. Other bits and registers hold their previous states.
State in which the corresponding MSTCR bit was set to 1. For details see section 20.2.2, Module Standby Control Register (MSTCR).
The RAME bit must be cleared to 0 in SYSCR before the transition from the program execution state to hardware standby mode.
When a MSTCR bit is set to 1, the registers of the corresponding on-chip supporting module are initialized. To restart the module, first clear the MSTCR bit to 0, then set
up the module registers again.
Legend:
SYSCR: System control register
SSBY: Software standby bit
MSTCR: Module standby control register
Module
standby
Halted Halted
Halted
CPU
Hardware Low input at
standby STBY pin
mode
Active
Clock
Halted Halted
SLEEP
instruction
executed
while
SSBY = 0
in SYSCR
Entering
Conditions
Software SLEEP
standby instruction
mode
executed
while
SSBY = 1
in SYSCR
Sleep
mode
Mode
State
Section 20 Power-Down State
Table 20.1 Power-Down State and Module Standby Function
Section 20 Power-Down State
20.2
Register Configuration
The H8/3048B Group has a system control register (SYSCR) that controls the power-down state,
and a module standby control register (MSTCR) that controls the module standby function. Table
20.2 summarizes these registers.
Table 20.2 Control Register
Address*
Name
Abbreviation
R/W
Initial Value
H'FFF2
System control register
SYSCR
R/W
H'0B
Module standby control register
MSTCR
R/W
H'40
H'FF5E
Note:
20.2.1
*
Lower 16 bits of the address.
System Control Register (SYSCR)
Bit
7
6
5
4
3
2
1
0
SSBY
STS2
STS1
STS0
UE
NMIEG

RAME
Initial value
0
0
0
0
1
0
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W

R/W
RAM enable
Reserved bit
NMI edge select
User bit enable
Standby timer select 2 to 0
These bits select the
waiting time at exit from
software standby mode
Software standby
Enables transition to
software standby mode
SYSCR is an 8-bit readable/writable register. Bit 7 (SSBY) and bits 6 to 4 (STS2 to STS0) control
the power-down state. For information on the other SYSCR bits, see section 3.3, System Control
Register (SYSCR).
Rev. 3.00 Sep 27, 2006 page 641 of 872
REJ09B0325-0300
Section 20 Power-Down State
Bit 7—Software Standby (SSBY): Enables transition to software standby mode. When software
standby mode is exited by an external interrupt, this bit remains set to 1 after the return to normal
operation. To clear this bit, write 0.
Bit 7: SSBY
Description
0
SLEEP instruction causes transition to sleep mode
1
SLEEP instruction causes transition to software standby mode
(Initial value)
Bits 6 to 4—Standby Timer Select (STS2 to STS0): These bits select the length of time the CPU
and on-chip supporting modules wait for the clock to settle when software standby mode is exited
by an external interrupt. If the clock is generated by a crystal resonator, set these bits according to
the clock frequency so that the waiting time will be at least 7 ms. See table 20.3.
If an external clock is used, select the setting so that the waiting time is 100 µs or more according
to the clock frequency.
Bit 6: STS2
Bit 5: STS1
Bit 4: STS0
Description
0
0
0
Waiting time = 8,192 states
1
Waiting time = 16,384 states
0
Waiting time = 32,768 states
1
Waiting time = 65,536 states
0
Waiting time = 131,072 states
1
Waiting time = 262,144 states
0
Waiting time = 1,024 states
1
Illegal setting
1
1
0
1
Rev. 3.00 Sep 27, 2006 page 642 of 872
REJ09B0325-0300
(Initial value)
Section 20 Power-Down State
20.2.2
Module Standby Control Register (MSTCR)
MSTCR is an 8-bit readable/writable register that controls output of the system clock (φ). It also
controls the module standby function, which places individual on-chip supporting modules in the
standby state. Module standby can be designated for the ITU, SCI0, SCI1, DMAC, refresh
controller, and A/D converter modules.
Bit
7
6
PSTOP

Initial value
0
1
0
0
0
0
0
0
Read/Write
R/W

R/W
R/W
R/W
R/W
R/W
R/W
4
5
3
2
1
0
MSTOP5 MSTOP4 MSTOP3 MSTOP2 MSTOP1 MSTOP0
Reserved bit
Module standby 5 to 0
These bits select modules
to be placed in standby
φ clock stop
Enables or disables
output of the system clock
MSTCR is initialized to H'40 by a reset and in hardware standby mode. It is not initialized in
software standby mode.
Bit 7—φ
φ Clock Stop (PSTOP): Enables or disables output of the system clock (φ).
Bit 1: PSTOP
Description
0
System clock output is enabled
1
System clock output is disabled
(Initial value)
Bit 6—Reserved: Read-only bit, always read as 1.
Bit 5—Module Standby 5 (MSTOP5): Selects whether to place the ITU in standby.
Bit 5: MSTOP5
Description
0
ITU operates normally
1
ITU is in standby state
(Initial value)
Rev. 3.00 Sep 27, 2006 page 643 of 872
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Section 20 Power-Down State
Bit 4—Module Standby 4 (MSTOP4): Selects whether to place SCI0 in standby.
Bit 4: MSTOP4
Description
0
SCI0 operates normally
1
SCI0 is in standby state
(Initial value)
Bit 3—Module Standby 3 (MSTOP3): Selects whether to place SCI1 in standby.
Bit 3: MSTOP3
Description
0
SCI1 operates normally
1
SCI1 is in standby state
(Initial value)
Bit 2—Module Standby 2 (MSTOP2): Selects whether to place the DMAC in standby.
Bit 2: MSTOP2
Description
0
DMAC operates normally
1
DMAC is in standby state
(Initial value)
Bit 1—Module Standby 1 (MSTOP1): Selects whether to place the refresh controller in standby.
Bit 1: MSTOP1
Description
0
Refresh controller operates normally
1
Refresh controller is in standby state
(Initial value)
Bit 0—Module Standby 0 (MSTOP0): Selects whether to place the A/D converter in standby.
Bit 0: MSTOP0
Description
0
A/D converter operates normally
1
A/D converter is in standby state
Rev. 3.00 Sep 27, 2006 page 644 of 872
REJ09B0325-0300
(Initial value)
Section 20 Power-Down State
20.3
Sleep Mode
20.3.1
Transition to Sleep Mode
When the SSBY bit is cleared to 0 in SYSCR, execution of the SLEEP instruction causes a
transition from the program execution state to sleep mode. Immediately after executing the SLEEP
instruction the CPU halts, but the contents of its internal registers are retained. The DMA
controller (DMAC), refresh controller, and on-chip supporting modules do not halt in sleep mode.
Modules which have been placed in standby by the module standby function, however, remain
halted.
20.3.2
Exit from Sleep Mode
Sleep mode is exited by an interrupt, or by input at the RES or STBY pin.
Exit by Interrupt: An interrupt terminates sleep mode and causes a transition to the interrupt
exception handling state. Sleep mode is not exited by an interrupt source in an on-chip supporting
module if the interrupt is disabled in the on-chip supporting module. Sleep mode is not exited by
an interrupt other than NMI if the interrupt is masked by the I and UI bits in CCR and IPR.
Exit by RES Input: Low input at the RES pin exits from sleep mode to the reset state.
Exit by STBY Input: Low input at the STBY pin exits from sleep mode to hardware standby
mode.
20.4
Software Standby Mode
20.4.1
Transition to Software Standby Mode
To enter software standby mode, execute the SLEEP instruction while the SSBY bit is set to 1 in
SYSCR.
In software standby mode, current dissipation is reduced to an extremely low level because the
CPU, clock, and on-chip supporting modules all halt. The DMAC and on-chip supporting modules
are reset. As long as the specified voltage is supplied, however, CPU register contents and on-chip
RAM data are retained. The settings of the I/O ports and refresh controller* are also held.
Note: * RTCNT and bits 7 and 6 of RTMCSR are initialized. Other bits and registers hold their
previous states.
Rev. 3.00 Sep 27, 2006 page 645 of 872
REJ09B0325-0300
Section 20 Power-Down State
When the WDT is used as a watchdog timer (WT/IT = 1), the TME bit must be cleared to 0 before
setting SSBY. Also, when setting TME to 1, SSBY should be cleared to 0.
Clear the BRLE bit in BRCR (inhibiting bus release) before making a transition to software
standby mode.
20.4.2
Exit from Software Standby Mode
Software standby mode can be exited by input of an external interrupt at the NMI, IRQ0, IRQ1, or
IRQ2 pin, or by input at the RES or STBY pin.
Exit by Interrupt: When an NMI, IRQ0, IRQ1, or IRQ2 interrupt request signal is received, the
clock oscillator begins operating. After the oscillator settling time selected by bits STS2 to STS0
in SYSCR, stable clock signals are supplied to the entire chip, software standby mode ends, and
interrupt exception handling begins. Software standby mode is not exited if the interrupt enable
bits of interrupts IRQ0, IRQ1, and IRQ2 are cleared to 0, or if these interrupts are masked in the
CPU.
Exit by RES Input: When the RES input goes low, the clock oscillator starts and clock pulses are
supplied immediately to the entire chip. The RES signal must be held low long enough for the
clock oscillator to stabilize. When RES goes high, the CPU starts reset exception handling.
Exit by STBY Input: Low input at the STBY pin causes a transition to hardware standby mode.
20.4.3
Selection of Waiting Time for Exit from Software Standby Mode
Bits STS2 to STS0 in SYSCR and bits DIV1 and DIV0 in DIVCR should be set as follows.
Crystal Resonator: Set STS2 to STS0, DIV1, and DIV0 so that the waiting time (for the clock to
stabilize) is at least 7 ms. Table 20.3 indicates the waiting times that are selected by STS2 to
STS0, DIV1, and DIV0 settings at various system clock frequencies. Refer to the clock frequency
and the waiting time in which it takes for the clock to settle, as shown in table 20.3.
External Clock: Set bits STS2 to STS0, Bits DIV0, and DIV1 so that the waiting time is 100 µs
or more.
Rev. 3.00 Sep 27, 2006 page 646 of 872
REJ09B0325-0300
Section 20 Power-Down State
Table 20.3 Clock Frequency and Waiting Time for Clock to Settle
DIV1 DIV0 STS2 STS1 STS0 Waiting Time 25 MHz 20 MHz 18 MHz 16 MHz 12 MHz 10 MHz 8 MHz 6 MHz 4 MHz 2 MHz Unit
0
0
1
1
0
1
0
1
0
0
0
8192 states
0.3
0.4
0.46
0.51
0.65
0.8
1.0
1.3
2.0
4.1
0
0
1
16384 states
0.7
0.8
0.91
1.0
1.3
1.6
2.0
2.7
4.1
8.2*
0
1
0
32768 states
1.3
1.6
1.8
2.0
2.7
3.3
4.1
5.5
8.2*
16.4
0
1
1
65536 states
2.6
3.3
3.6
4.1
5.5
6.6
8.2*
10.9* 16.4
32.8
1
0
0
131072 states 5.2
6.6
7.3*
8.2*
10.9*
13.1*
16.4
21.8
32.8
65.5
1
0
1
262144 states 10.5*
13.1*
14.6
16.4
21.8
26.2
32.8
43.7
65.5
131.1
1
1
0
1024 states
0.05
0.057
0.064
0.085
0.10
0.13
0.17
0.26
0.51
1
1
1
0.04
Illegal setting
0
0
0
8192 states
0.7
0.8
0.91
1.02
1.4
1.6
2.0
2.7
4.1
8.2*
0
0
1
16384 states
1.3
1.6
1.8
2.0
2.7
3.3
4.1
5.5
8.2*
16.4
0
1
0
32768 states
2.6
3.3
3.6
4.1
5.5
6.6
8.2*
10.9* 16.4
32.8
0
1
1
65536 states
5.2
6.6
7.3*
8.2*
10.9*
13.1*
16.4
21.8
32.8
65.5
1
0
0
131072 states 10.5*
13.1*
14.6
16.4
21.8
26.2
32.8
43.7
65.5
131.1
1
0
1
262144 states 21.0
26.2
29.1
32.8
43.7
52.4
65.5
87.4
131.1 262.1
1024 states
0.10
0.11
0.13
0.17
0.20
0.26
0.34
0.51
1.0
8.2*
16.4*
1
1
0
1
1
1
0.08
0
0
0
8192 states
1.3
1.6
1.8
2.0
2.7
3.3
4.1
5.5
0
1
16384 states
2.6
3.3
3.6
4.1
5.5
6.6
8.2*
10.9* 16.4
32.8
0
1
0
32768 states
5.2
6.6
7.3*
8.2*
10.9*
13.1*
16.4
21.8
32.8
65.5
0
1
1
65536 states
10.5*
13.1*
14.6
16.4
21.8
26.2
32.8
43.7
65.5
131.1
1
0
0
131072 states 21.0
26.2
29.1
32.8
43.7
52.4
65.5
87.4
131.1 262.1
1
0
1
262144 states 41.9
52.4
58.3
65.5
87.4
104.9
131.1 174.8 262.1 524.3
1
1
0
1024 states
0.20
0.23
0.26
0.34
0.41
0.51
0.68
1
1
1
0.16
1.02
2.0
0
0
0
8192 states
2.6
3.3
3.6
4.1
5.5
6.6
8.2*
10.9* 16.4* 32.8*
0
1
16384 states
5.2
6.6
7.3*
8.2*
10.9*
13.1*
16.4
21.8
32.8
65.5
0
1
0
32768 states
10.5
13.1*
14.6
16.4
21.8
26.2
32.8
43.7
65.5
131.1
0
1
1
65536 states
21.0*
26.2
29.1
32.8
43.7
52.4
65.5
87.4
131.1 262.1
1
0
0
131072 states 41.9
52.4
58.3
65.5
87.4
104.9
131.1 174.8 262.1 524.3
1
0
1
262144 states 83.9
104.9
116.5
131.1
174.8
209.7
262.1 349.5 524.3 1048.6
1024 states
0.41
0.46
0.51
0.68
0.82
1.0
1
0
1
1
ms
Illegal setting
0
1
ms
Illegal setting
0
1
ms
0.33
1.4
2.0
ms
4.1
Illegal setting
Note: * Recommended setting
Rev. 3.00 Sep 27, 2006 page 647 of 872
REJ09B0325-0300
Section 20 Power-Down State
20.4.4
Sample Application of Software Standby Mode
Figure 20.1 shows an example in which software standby mode is entered at the fall of NMI and
exited at the rise of NMI.
With the NMI edge select bit (NMIEG) cleared to 0 in SYSCR (selecting the falling edge), an
NMI interrupt occurs. Next the NMIEG bit is set to 1 (selecting the rising edge) and the SSBY bit
is set to 1; then the SLEEP instruction is executed to enter software standby mode.
Software standby mode is exited at the next rising edge of the NMI signal.
Clock
oscillator
φ
NMI
NMIEG
SSBY
NMI interrupt
handler
NMIEG = 1
SSBY = 1
Software standby
mode (powerdown state)
Oscillator
settling time
(tosc2)
NMI exception
handling
SLEEP
instruction
Figure 20.1 NMI Timing for Software Standby Mode (Example)
20.4.5
Note
The I/O ports retain their existing states in software standby mode. If a port is in the high output
state, its output current is not reduced.
Rev. 3.00 Sep 27, 2006 page 648 of 872
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Section 20 Power-Down State
20.5
Hardware Standby Mode
20.5.1
Transition to Hardware Standby Mode
Regardless of its current state, the chip enters hardware standby mode whenever the STBY pin
goes low. Hardware standby mode reduces power consumption drastically by halting all functions
of the CPU, DMAC, refresh controller, and on-chip supporting modules. All modules are reset
except the on-chip RAM. As long as the specified voltage is supplied, on-chip RAM data is
retained. I/O ports are placed in the high-impedance state.
Clear the RAME bit to 0 in SYSCR before STBY goes low to retain on-chip RAM data.
The inputs at the mode pins (MD2 to MD0) should not be changed during hardware standby mode.
20.5.2
Exit from Hardware Standby Mode
Hardware standby mode is exited by inputs at the STBY and RES pins. While RES is low, when
STBY goes high, the clock oscillator starts running. RES should be held low long enough for the
clock oscillator to settle. When RES goes high, reset exception handling begins, followed by a
transition to the program execution state.
20.5.3
Timing for Hardware Standby Mode
Figure 20.2 shows the timing relationships for hardware standby mode. To enter hardware standby
mode, first drive RES low, then drive STBY low. To exit hardware standby mode, first drive
STBY high, wait for the clock to settle, then bring RES from low to high.
Rev. 3.00 Sep 27, 2006 page 649 of 872
REJ09B0325-0300
Section 20 Power-Down State
Clock
oscillator
RES
STBY
Oscillator
settling time
Reset
exception
handling
Figure 20.2 Hardware Standby Mode Timing
20.6
Module Standby Function
20.6.1
Module Standby Timing
The module standby function can halt several of the on-chip supporting modules (the ITU, SCI0,
SCI1, DMAC, refresh controller, and A/D converter) independently of the power-down state. This
standby function is controlled by bits MSTOP5 to MSTOP0 in MSTCR. When one of these bits is
set to 1, the corresponding on-chip supporting module is placed in standby and halts at the
beginning of the next bus cycle after the MSTCR write cycle.
20.6.2
Read/Write in Module Standby
When an on-chip supporting module is in module standby, read/write access to its registers is
disabled. Read access always results in H'FF data. Write access is ignored.
Rev. 3.00 Sep 27, 2006 page 650 of 872
REJ09B0325-0300
Section 20 Power-Down State
20.6.3
Usage Notes
When using the module standby function, note the following points.
DMAC and Refresh Controller: When setting bit MSTOP2 or MSTOP1 to 1 to place the
DMAC or refresh controller in module standby, make sure that the DMAC or refresh controller is
not currently requesting the bus right. If bit MSTOP2 or MSTOP1 is set to 1 when a bus request is
present, operation of the bus arbiter becomes ambiguous and a malfunction may occur.
Internal Peripheral Module Interrupt: When MSTCR is set to 1, prevent module interrupt in
advance. When an on-chip supporting module is placed in standby by the module standby
function, its registers, including the interrupt flag, are initialized.
Pin States: Pins used by an on-chip supporting module lose their module functions when the
module is placed in module standby. What happens after that depends on the particular pin. For
details, see section 9, I/O Ports. Pins that change from the input to the output state require special
care. For example, if SCI1 is placed in module standby, the receive data pin loses its receive data
function and becomes a generic I/O pin. If its data direction bit is set to 1, the pin becomes a data
output pin, and its output may collide with external serial data. Data collisions should be prevented
by clearing the data direction bit to 0 or taking other appropriate action.
Register Resetting: When an on-chip supporting module is halted by the module standby
function, all its registers are initialized. To restart the module, after its MSTCR bit is cleared to 0,
its registers must be set up again. It is not possible to write to the registers while the MSTCR bit is
set to 1.
MSTCR Access from DMAC Disabled: To prevent malfunctions, MSTCR can only be accessed
from the CPU. It can be read by the DMAC, but it cannot be written by the DMAC.
Rev. 3.00 Sep 27, 2006 page 651 of 872
REJ09B0325-0300
Section 20 Power-Down State
20.7
System Clock Output Disabling Function
Output of the system clock (φ) can be controlled by the PSTOP bit in MSTCR. When the PSTOP
bit is set to 1, output of the system clock halts and the φ pin is placed in the high-impedance state.
Figure 20.3 shows the timing of the stopping and starting of system clock output. When the
PSTOP bit is cleared to 0, output of the system clock is enabled. Table 20.4 indicates the state of
the φ pin in various operating states.
MSTCR write cycle
MSTCR write cycle
(PSTOP = 1)
(PSTOP = 0)
T1
T2
T3
T1
T2
T3
φ pin
High-impedance
Figure 20.3 Starting and Stopping of System Clock Output
Table 20.4
φ Pin State in Various Operating States
Operating State
PSTOP = 0
PSTOP = 1
Hardware standby
High-impedance
High-impedance
Software standby
Always high
High-impedance
Sleep mode
System clock output
High-impedance
Normal operation
System clock output
High-impedance
Rev. 3.00 Sep 27, 2006 page 652 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
Section 21 Electrical Characteristics
Table 21.1 shows the electrical characteristics of the various products in the H8/3048 Group and
H8/3048B Group.
Table 21.1
Electrical Characteristics of H8/3048 Group and H8/3048B Group Products
H8/3048 Group
H8/3048
F-ONE H8/3048B
Mask
(Single
ROM
Power
Supply)
H8/3048
H8/3047
H8/3045
H8/3044
H8/3048
ZTAT
1 to 16
1 to 18
1 to 18
2 to 25
(5 V
operation
model)
2 to 25
(5 V
operation
model)
VCC = 3.15 to 5.5 V
—
1 to 13
1 to 13
—
—
VCC = 2.7 to 5.5 V
1 to 8
1 to 8
1 to 8
—
—
VCC = 3.0 to 3.6 V
—
—
—
2 to 25
(3 V
operation
model)
2 to 25
(3 V
operation
model)
–20 to +75 –20 to +75 –20 to +75
–20 to
+75*1
–20 to
+75*1
–40 to +85 –40 to +85 –40 to +85
–40 to
+85*1
–40 to
+85*1
—
—
Item
Operating
range
H8/3048B Group
H8/3048
F-ZTAT
(Dual
Power
Supply)
Symbol
VCC = 4.5 to 5.5 V
MHz
Operating
Regular
temperature specifications
range
Wide-range
specifications
Topr
Absolute
maximum
ratings
Vin
VPP pin rating
Unit
°C
Yes
—
Yes
FWE pin rating
—
—
—
Yes
—
VCL pin
—
—
—
Cannot be
connected
to power
supply*2
(5 V
operation
model
only)
Cannot be
connected
to power
supply*2
(5 V
operation
model
only)
Rev. 3.00 Sep 27, 2006 page 653 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
H8/3048 Group
Item
Absolute
maximum
ratings
DC characteristics
Power supply
voltage
Symbol
Vin
Unit
V
H8/3048
H8/3047
H8/3045
H8/3044
H8/3048
ZTAT
–0.3 to
+7.0
–0.3 to
+7.0
–0.3 to
+7.0
H8/3048
F-ONE H8/3048B
Mask
(Single
Power
ROM
Supply)
–0.3 to
+7.0
(5 V
operation
model)
–0.3 to
+7.0
(5 V
operation
model)
–0.3 to
+4.6
(3 V
operation
model)
–0.3 to
+4.6
(3 V
operation
model)
Yes
Yes
Yes
—
Yes
FWE pin
specification
—
—
—
Yes
—
Yes
—
—
—
—
Max 5
Max 5
Max 5
Max 10
Max 10
Max 20
Max 20
Max 20
Max 80
Max 80
Standby current
(Ta ≤ 50°C)
ICC*3
µA
Standby current
(50°C < Ta)
Clock cycle time
tcyc
ns
Max 1000
Max 1000
Max 1000
Max 500
Max 500
RES pulse width
tRESW
tcyc
Min 10
Min 10
Min 10
Min 20
Min 20
RESO output
delay time
tRESD
ns
Max 100
Max 100
Max 100
—
—
RESO output
pulse width
tRESOW
tcyc
Min 132
Min 132
Min 132
—
—
—
—
See table
21.11
—
Flash
memory
characteristics*4
Notes: 1.
2.
3.
4.
H8/3048
F-ZTAT
(Dual
Power
Supply)
RESO pin
specification
Determination
level for applying
high voltage (12 V)
AC characteristics
H8/3048B Group
Refer to
the
H8/3048
Group
Hardware
Manual
(revision
7.0) for
details.
The operating temperature range for flash memory programming/erasing is 0°C to +75°.
Connect an external capacitor between the VCL pin and GND.
See the DC Characteristics table for current dissipation during operation.
Refer to the program/erase algorithms for details of flash memory characteristics.
Rev. 3.00 Sep 27, 2006 page 654 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
21.1
Electrical Characteristics of H8/3048F-ONE (Single-Power Supply)
21.1.1
Absolute Maximum Ratings
Table 21.2 lists the absolute maximum ratings.
Table 21.2 Absolute Maximum Ratings
Item
Symbol
Value
Unit
Power supply voltage
1
VCC*
5 V operation model: –0.3 to +7.0
V
3 V operation model: –0.3 to +4.6
2
Input voltage (FWE)*
Vin
–0.3 to VCC +0.3
V
Vin
–0.3 to VCC +0.3
V
Input voltage (port 7)
Vin
–0.3 to AVCC +0.3
V
Reference voltage
VREF
–0.3 to AVCC +0.3
V
Analog power supply voltage
AVCC
5 V operation model: –0.3 to +7.0
V
Analog input voltage
VAN
–0.3 to AVCC +0.3
Topr
Regular specifications: –20 to +75*
Input voltage (except for port 7)*
2
3 V operation model: –0.3 to +4.6
Operating temperature
V
3
Wide-range specifications: –40 to +85*
Storage temperature
Tstg
–55 to +125
°C
3
°C
Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded.
Notes: 1. Do not apply the power supply voltage to the VCL pin in 5 V operation models. Connect
an external capacitor between this pin and GND.
2. 12 V must not be applied to any pin, as this may cause permanent damage to the
device.
3. The operating temperature range for flash memory programming/erasing is 0°C to
+75°C.
Rev. 3.00 Sep 27, 2006 page 655 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
21.1.2
DC Characteristics
Table 21.3 lists the DC characteristics. Table 21.4 lists the permissible output currents.
Table 21.3 DC Characteristics (1)
Conditions: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, VREF = 4.5 V to AVCC,
1
VSS = AVSS = 0 V* , Ta = –20°C to +75°C (regular specifications), Ta = –40°C to
+85°C (wide-range specifications), (Ta = 0°C to +75°C during program/erase)
Item
Schmitt
trigger input
voltages
Input high
voltage
Symbol
Min
Typ
Max
Unit Test Conditions
Port A,
P82 to P80,
PB3 to PB0
VT–
1.0
—
—
V
VT+
—
—
VCC × 0.7
V
VT+ – VT–
0.4
—
—
V
RES, STBY,
FWE, NMI,
MD2 to MD0
VIH
VCC –0.7
—
VCC +0.3
V
VCC × 0.7
—
VCC +0.3
V
EXTAL
Input low
voltage
Port 7
2.0
—
AVCC +0.3 V
Ports 1 to 6, 9,
P84, P83, PB7 to
PB4
2.0
—
VCC +0.3
V
–0.3
—
0.5
V
–0.3
—
0.8
V
VCC –0.5
—
—
V
IOH = –200 µA
3.5
—
—
V
IOH = –1 mA
RES, STBY,
MD2 to MD0,
FWE
VIL
NMI, EXTAL,
ports 1 to 7, 9,
P84, P83, PB7 to
PB4
Output high
voltage
Output low
voltage
Input
leakage
current
All output pins
All output pins
VOH
VOL
Ports 1, 2, 5,
and B
STBY, NMI,
RES, FWE,
MD2 to MD0
|Iin|
Port 7
Rev. 3.00 Sep 27, 2006 page 656 of 872
REJ09B0325-0300
—
—
0.4
V
IOL = 1.6 mA
—
—
1.0
V
IOL = 10 mA
—
—
1.0
µA
Vin = 0.5 to
VCC –0.5 V
—
—
1.0
µA
Vin = 0.5 to
AVCC –0.5 V
Section 21 Electrical Characteristics
Item
Symbol
Min
Typ
Max
Unit Test Conditions
|ITSI|
—
—
1.0
µA
Vin = 0.5 to
VCC –0.5 V
Input pull-up Ports 2, 4,
MOS current and 5
–IP
50
—
300
µA
Vin = 0 V
Input
FWE
capacitance NMI
Cin
VIN = 0 V,
f = fmin,
Ta = 25°C
Three-state
leakage
current
(off state)
Ports 1 to 6,
8 to B
—
—
60
pF
—
—
50
pF
—
—
15
pF
—
45
60
mA
Sleep mode
—
35
50
mA
Module standby
4
mode*
3
Standby mode*
—
20
25
mA
—
1
10
µA
Ta ≤ 50°C
—
—
80
µA
50°C < Ta
—
0.5
1.5
mA
AVCC = 5.0 V
During A/D and
D/A conversion
—
0.5
1.5
mA
Idle
—
0.01
5.0
µA
DASTE = 0
—
0.4
0.8
mA
VREF = 5.0 V
During A/D and
D/A conversion
—
1.5
3.0
mA
Idle
—
0.01
5.0
µA
2.0
—
—
V
All input pins
except NMI,
FWE
Current
Normal
2
5
dissipation* operation*
Analog
power
supply
current
Reference
current
During A/D
conversion
During A/D
conversion
RAM standby voltage
6
ICC*
AICC
AICC
VRAM
f = 25 MHz
DASTE = 0
Notes: 1. If the A/D and D/A converters are not used, do not leave the AVCC, AVSS, and VREF pins
open. Connect AVCC and VREF to VCC, and connect AVSS to VSS.
2. Current dissipation values are for VIH min = VCC –0.5 V and VIL max = 0.5 V with all
output pins unloaded and the on-chip pull-up transistors in the off state.
3. The values are for VRAM ≤ VCC < 4.5 V, VIH min = VCC × 0.9, and VIL max = 0.3 V.
4. Module standby current values apply in sleep mode with all modules halted.
5. The current dissipation value for flash memory program/erase operations (Ta = 0°C to
+75°C) is 10 mA (max.) greater than the current dissipation value for normal operation.
Rev. 3.00 Sep 27, 2006 page 657 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
6. ICC depends on VCC and f, according to the following expressions.
ICC max. (normal operation) = 10.0 [mA] + 0.36 [mA/(MHz × V)] × VCC × f
ICC max. (sleep mode) = 10.0 [mA] + 0.29 [mA/(MHz × V)] × VCC × f
ICC max. (sleep mode and module standby mode) = 10.0 [mA] + 0.11 [mA/(MHz × V)] ×
VCC × f
The typical values of current dissipation are reference values.
Rev. 3.00 Sep 27, 2006 page 658 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
Table 21.3 DC Characteristics (2)
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC,
1
VSS = AVSS = 0 V* , Ta = –20°C to +75°C (regular specifications), Ta = –40°C to
+85°C (wide-range specifications), (Ta = 0°C to +75°C during program/erase)
Item
Schmitt
trigger input
voltages
Input high
voltage
Input low
voltage
Symbol
Min
Typ
Max
Unit Test Conditions
Port A,
P82 to P80,
PB3 to PB0
VT–
VCC × 0.2
—
—
V
VT+
—
—
VCC × 0.7
V
VT+ – VT–
VCC × 0.05 —
—
V
RES, STBY,
FWE, NMI,
MD2 to MD0
VIH
VCC × 0.9
—
VCC +0.3
V
EXTAL
VCC × 0.7
—
VCC +0.3
V
Port 7
VCC × 0.7
—
AVCC +0.3 V
Ports 1 to 6, 9,
P84, P83, PB7 to
PB4
VCC × 0.7
—
VCC +0.3
V
–0.3
—
VCC × 0.1
V
–0.3
—
VCC × 0.2
V
VCC –0.5
—
—
V
IOH = –200 µA
VCC –1.0
—
—
V
IOH = –1 mA
—
—
0.4
V
IOL = 1.6 mA
—
—
1.0
V
IOL = 5 mA
—
—
1.0
µA
Vin = 0.5 to
VCC –0.5 V
—
—
1.0
µA
Vin = 0.5 to
AVCC –0.5 V
—
—
1.0
µA
Vin = 0.5 to
VCC –0.5 V
RES, STBY,
MD2 to MD0,
FWE
VIL
NMI, EXTAL,
ports 1 to 7, 9,
P84, P83, PB7 to
PB4
Output high
voltage
All output pins
Output low
voltage
All output pins
Input
leakage
current
VOH
VOL
Ports 1, 2, 5,
and B
STBY, NMI,
RES, FWE,
MD2 to MD0
|Iin|
Port 7
Three-state
leakage
current
(off state)
Ports 1 to 6,
8 to B
|ITSI|
Rev. 3.00 Sep 27, 2006 page 659 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
Item
Symbol
Min
Typ
Max
Unit Test Conditions
Input pull-up Ports 2, 4,
MOS current and 5
–IP
10
—
300
µA
Vin = 0 V
Input
FWE
capacitance NMI
Cin
Vin = 0 V,
f = fmin,
Ta = 25°C
—
—
60
pF
—
—
50
pF
—
—
15
pF
—
40
60
mA
Sleep mode
—
30
50
mA
Module standby
4
mode*
3
Standby mode*
—
20
25
mA
—
1
10
µA
Ta ≤ 50°C
—
—
80
µA
50°C < Ta
—
0.5
1.5
mA
AVCC = 3.3 V
During A/D and
D/A conversion
—
0.5
1.5
mA
Idle
—
0.01
5
µA
DASTE = 0
—
0.4
0.8
mA
VREF = 3.3 V
During A/D and
D/A conversion
—
1.5
3
mA
Idle
—
0.01
5
µA
2.0
—
—
V
All input pins
except NMI,
FWE
Current
Normal
2
5
dissipation* operation*
Analog
power
supply
current
Reference
current
During A/D
conversion
During A/D
conversion
RAM standby voltage
6
ICC*
AICC
AICC
VRAM
f = 25 MHz
DASTE = 0
Notes: 1. If the A/D and D/A converters are not used, do not leave the AVCC, AVSS, and VREF pins
open. Connect AVCC and VREF to VCC, and connect AVSS to VSS.
2. Current dissipation values are for VIH min = VCC –0.5 V and VIL max = 0.5 V with all
output pins unloaded and the on-chip pull-up transistors in the off state.
3. The values are for VRAM ≤ VCC < 3.0 V, VIH min = VCC × 0.9, and VIL max = 0.3 V.
4. Module standby current values apply in sleep mode with all modules halted.
5. The current dissipation value for flash memory program/erase operations (Ta = 0°C to
+75°C) is 10 mA (max.) greater than the current dissipation value for normal operation.
6. ICC depends on VCC and f, according to the following expressions.
ICC max. (normal operation) = 6.0 [mA] + 0.60 [mA/(MHz × V)] × VCC × f
ICC max. (sleep mode) = 6.0 [mA] + 0.49 [mA/(MHz × V)] × VCC × f
ICC max. (sleep mode and module standby mode) = 6.0 [mA] + 0.21 [mA/(MHz × V)] ×
VCC × f
The typical values of current dissipation are reference values.
Rev. 3.00 Sep 27, 2006 page 660 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
Table 21.4 Permissible Output Currents
Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC,
VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to
+85°C (wide-range specifications)
Condition B: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, VREF = 4.5 V to AVCC,
VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to
+85°C (wide-range specifications)
Conditions A, B
Item
Symbol
Permissible output
low current (per pin)
Ports 1, 2, 5, and B
Permissible output
low current (total)
Total of 28 pins in
ports 1, 2, 5, and B
IOL
Other output pins
ΣIOL
Total of all output pins,
including the above
Min
Typ
Max
Unit
—
—
10
mA
—
—
2.0
mA
—
—
80
mA
—
—
120
mA
Permissible output
high current (per pin)
All output pins
IOH
—
—
2.0
mA
Permissible output
high current (total)
Total of all output pins
ΣIOH
—
—
40
mA
Notes: 1. To protect chip reliability, do not exceed the output current values in table 21.4.
2. When driving a darlington pair or LED, always insert a current-limiting resistor in the
output line, as shown in figures 21.1 and 21.2.
Rev. 3.00 Sep 27, 2006 page 661 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
H8/3048F-ONE
2 kΩ
Port
Darlington pair
Figure 21.1 Darlington Pair Drive Circuit (Example)
H8/3048F-ONE
Ports 1, 2, 5,
and B
600 Ω
LED
Figure 21.2 LED Drive Circuit (Example)
Rev. 3.00 Sep 27, 2006 page 662 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
21.1.3
AC Characteristics
Bus timing parameters are listed in table 21.5. Refresh controller bus timing parameters are listed
in table 21.6. Control signal timing parameters are listed in table 21.7. Timing parameters of the
on-chip supporting modules are listed in table 21.8.
Table 21.5 Bus Timing
Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC,
VSS = AVSS = 0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition B: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, VREF = 4.5 V to AVCC,
VSS = AVSS = 0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition A
Condition B
25 MHz
25 MHz
Item
Symbol
Min
Max
Min
Max
Unit
Test
Conditions
Clock cycle time
tcyc
40
500
40
500
ns
Figure 21.7
Clock pulse low width
tCL
10
—
10
—
Clock pulse high width
tCH
10
—
10
—
Clock rise time
tCR
—
10
—
10
Clock fall time
tCF
—
10
—
10
Address delay time
tAD
—
28
—
25
Address hold time
tAH
0.5tcyc –20
—
0.5tcyc –20
—
Address strobe delay time tASD
—
25
—
25
Write strobe delay time
tWSD
—
25
—
25
Strobe delay time
tSD
—
25
—
25
Write data strobe pulse
width 1
tWSW1
1.0tcyc –25
—
1.0tcyc –25
—
Write data strobe pulse
width 2
tWSW2
1.5tcyc –25
—
1.5tcyc –25
—
Address setup time 1
tAS1
0.5tcyc –20
—
0.5tcyc –20
—
Address setup time 2
tAS2
1.0tcyc –20
—
1.0tcyc –20
—
Read data setup time
tRDS
15
—
15
—
Read data hold time
tRDH
0
—
0
—
Figure 21.8
Rev. 3.00 Sep 27, 2006 page 663 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
Condition A
Condition B
25 MHz
25 MHz
Item
Symbol
Min
Max
Min
Max
Unit
Test
Conditions
Write data delay time
tWDD
—
35
—
35
ns
Figure 21.7
Write data setup time 1
tWDS1
1.0tcyc –30
—
1.0tcyc –30
—
Write data setup time 2
tWDS2
0.5tcyc –30
—
0.5tcyc –30
—
Write data hold time
tWDH
0.5tcyc –15
—
0.5tcyc –15
—
Read data access time 1
tACC1
—
1.5tcyc –40
—
1.5tcyc –40
Read data access time 2
tACC2
—
2.5tcyc –40
—
2.5tcyc –40
Read data access time 3
tACC3
—
1.0tcyc –28
—
1.0tcyc –28
Read data access time 4
tACC4
—
2.0tcyc –32
—
2.0tcyc –32
Precharge time
tPCH
1.0tcyc –20
—
1.0tcyc –20
—
Wait setup time
tWTS
25
—
25
—
Wait hold time
tWTH
5
—
5
—
Bus request setup time
tBRQS
25
—
25
—
Bus acknowledge delay
time 1
tBACD1
—
30
—
30
Bus acknowledge delay
time 2
tBACD2
—
30
—
30
Bus-floating time
tBZD
—
40
—
40
Rev. 3.00 Sep 27, 2006 page 664 of 872
REJ09B0325-0300
Figure 21.8
ns
Figure 21.9
ns
Figure 21.21
Section 21 Electrical Characteristics
Table 21.6 Refresh Controller Bus Timing
Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC,
VSS = AVSS = 0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition B: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, VREF = 4.5 V to AVCC,
VSS = AVSS = 0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition A
Condition B
25 MHz
25 MHz
Test
Conditions
Item
Symbol
Min
Max
Min
Max
Unit
RAS delay time 1*1
tRAD1
—
20
—
18
ns
RAS delay time 2*1
tRAD2
—
20
—
18
RAS delay time 3*1
Figure 21.10
to
Figure 21.16
tRAD3
—
20
—
18
Row address hold time
tRAH
0.5tcyc –5
—
0.5tcyc –5
—
RAS precharge time*1
tRP
1.0tcyc –15
—
1.0tcyc –15
—
CAS to RAS precharge
time*1 *2
tCRP
1.0tcyc –15
—
1.0tcyc –15
—
CAS pulse width*2
tCAS
1.0tcyc –18
—
1.0tcyc –18
—
RAS access time*1
tRAC
—
2.0tcyc –35
—
2.0tcyc –35
Address access time
tAA
—
1.5tcyc –40
—
1.5tcyc –40
CAS access time*2
tCAC
—
1.0tcyc –30
—
1.0tcyc –30
Write data setup time 3
tWDS3
1.0tcyc –25
—
1.0tcyc –25
—
CAS setup time*2
tCSR
0.5tcyc –15
—
0.5tcyc –15
—
Read strobe delay time
tRSD
—
25
—
25
Signal rise time (all input
pins except EXTAL)
tSR
—
100
—
100
ns
Figure 21.18
Signal fall time (all input
pins except EXTAL)
tSF
—
100
—
100
Notes: 1. The RAS pin is assigned to the CS3 pin.
2. The CAS pin is assigned to the RD pin.
Rev. 3.00 Sep 27, 2006 page 665 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
Table 21.7 Control Signal Timing
Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC,
VSS = AVSS = 0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition B: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, VREF = 4.5 V to AVCC,
VSS = AVSS = 0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition A
Condition B
25 MHz
25 MHz
Item
Symbol
Min
Max
Min
Max
Unit
Test
Conditions
RES setup time
tRESS
200
—
200
—
ns
Figure 21.18
RES pulse width
tRESW
20
—
20
—
tcyc
Mode programming setup time
tMDS
200
—
200
—
ns
NMI setup time
(NMI, IRQ5 to IRQ0)
tNMIS
150
—
150
—
ns
Figure 21.20
NMI hold time
(NMI, IRQ5 to IRQ0)
tNMIH
10
—
10
—
Interrupt pulse width
(NMI, IRQ2 to IRQ0
when exiting software
standby mode)
tNMIW
200
—
200
—
Clock oscillator settling
time at reset (crystal)
tOSC1
20
—
20
—
ms
Figure 21.22
Clock oscillator settling
time in software standby
(crystal)
tOSC2
7
—
7
—
ms
Figure 20.1
Rev. 3.00 Sep 27, 2006 page 666 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
Table 21.8 Timing of On-Chip Supporting Modules
Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC,
VSS = AVSS = 0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition B: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, VREF = 4.5 V to AVCC,
VSS = AVSS = 0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Item
DMAC DREQ setup time
ITU
SCI
Ports
and
TPC
Condition A
Condition B
25 MHz
25 MHz
Symbol
Min
Max
Min
Max
Unit
Test
Conditions
ns
Figure 21.30
tDRQS
20
—
20
—
DREQ hold time
tDRQH
10
—
10
—
TEND delay time 1
tTED1
—
50
—
50
TEND delay time 2
tTED2
—
50
—
50
Timer output delay time
tTOCD
—
50
—
50
Timer input setup time
tTICS
40
—
40
—
Timer clock input setup time
tTCKS
40
—
40
—
Timer clock
pulse width
Single edge
tTCKWH
1.5
—
1.5
—
Both edges
tTCKWL
2.5
—
2.5
—
Input clock
cycle
Asynchronous
tSCYC
4
—
4
—
Synchronous
tSCYC
6
—
6
—
Input clock rise time
tSCKr
—
1.5
—
1.5
Input clock fall time
tSCKf
—
1.5
—
1.5
Input clock pulse width
tSCKW
0.4
0.6
0.4
0.6
tSCYC
Transmit data delay time
tTXD
—
100
—
100
ns
Figure 21.27
Receive data setup time
(synchronous)
tRXS
100
—
100
—
Receive
data hold
time (synchronous)
Clock input
tRXH
100
—
100
—
Clock output
tRXH
0
—
0
—
tPWD
—
50
—
50
ns
Figure 21.23
Input data setup time
tPRS
50
—
50
—
Input data hold time
tPRH
50
—
50
—
Output data delay time
Figures 21.28
and 21.29
ns
Figure 21.24
Figure 21.25
tCYC
tCYC
Figure 21.26
Rev. 3.00 Sep 27, 2006 page 667 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
RL
H8/3048F-ONE
output pin
C = 90 pF: ports 4, 5, 6, 8, A (19 to 0),
D (15 to 8), φ
C = 30 pF: ports 9, A, B
R L = 2.4 k Ω
R H = 12 k Ω
C
RH
Input/output timing measurement levels
• Low: 0.8 V
• High: 2.0 V
Figure 21.3 Output Load Circuit
Rev. 3.00 Sep 27, 2006 page 668 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
21.1.4
A/D Conversion Characteristics
Table 21.9 lists the A/D conversion characteristics.
Table 21.9 A/D Converter Characteristics
Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC,
VSS = AVSS = 0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition B: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, VREF = 4.5 V to AVCC,
VSS = AVSS = 0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition A
Condition B
25 MHz
25 MHz
Item
Min
Typ
Max
Min
Typ
Max
Unit
Resolution
10
10
10
10
10
10
bits
Conversion time (single mode)
5.36
—
—
5.36
—
—
µs
Analog input capacitance
—
—
20
—
—
20
pF
φ ≤ 13 MHz
—
—
10
—
—
10
kΩ
φ > 13 MHz
—
—
5
—
—
5
Nonlinearity error
—
—
±3.5
—
—
±3.5
LSB
Offset error
—
—
±3.5
—
—
±3.5
LSB
Full-scale error
—
—
±3.5
—
—
±3.5
LSB
Quantization error
—
—
±0.5
—
—
±0.5
LSB
Absolute accuracy
—
—
±4.0
—
—
±4.0
LSB
Permissible
signal-source
impedance
Rev. 3.00 Sep 27, 2006 page 669 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
21.1.5
D/A Conversion Characteristics
Table 21.10 lists the D/A conversion characteristics.
Table 21.10 D/A Converter Characteristics
Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC,
VSS = AVSS = 0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition B: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, VREF = 4.5 V to AVCC,
VSS = AVSS = 0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition A
Condition B
25 MHz
25 MHz
Item
Min
Typ
Max
Min
Typ
Max
Resolution
8
8
8
8
8
8
bits
Conversion time
(centering time)
—
—
10
—
—
10
µs
20-pF capacitive
load
Absolute accuracy
—
±2.0
±3.0
—
±1.5
±2.0
LSB
2-MΩ resistive
load
—
—
±2.0
—
—
±1.5
LSB
4-MΩ resistive
load
Rev. 3.00 Sep 27, 2006 page 670 of 872
REJ09B0325-0300
Unit
Test Conditions
Section 21 Electrical Characteristics
21.1.6
Flash Memory Characteristics
Table 21.11 lists the flash memory characteristics.
Table 21.11 Flash Memory Characteristics (1)
Conditions:
VCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, VREF = 4.5 V to AVCC, VSS = AVSS = 0 V,
Ta = 0°C to +75°C (program/erase operating temperature range)
Item
Symbol
Min
Typ
Max
Unit
Programming time*1 *2 *4
tP
—
10
200
ms/
128 bytes
Erase time*1 *3 *5
tE
—
100
1200 ms/block
Reprogramming count
Programming
NWEC
—
—
100
Times
Wait time after SWE bit setting*1
Wait time after PSU bit setting*1
tsswe
1
1
—
µs
tspsu
50
50
—
µs
Wait time after P bit setting*1 *4
tsp30
28
30
32
µs
Programming
time wait
tsp200
198
200
202
µs
Programming
time wait
tsp10
8
10
12
µs
Additional
programming
time wait
Wait time after P bit clear*1
tcp
5
5
—
µs
Wait time after PSU bit clear*1
Wait time after PV bit setting*1
tcpsu
5
5
—
µs
tspv
4
4
—
µs
Wait time after H'FF dummy write*1 tspvr
Wait time after PV bit clear*1
tcpv
Wait time after SWE bit clear*1
t
2
2
—
µs
2
2
—
µs
100
100

µs
Maximum programming count*1 *4
Wait time after SWE bit setting*1
N
—
—
1000 Times
tsswe
1
1
—
Wait time after ESU bit setting*1
Wait time after E bit setting*1 *5
tsesu
100
100
—
µs
tse
10
10
100
ms
Wait time after E bit clear*1
tce
10
10
—
µs
Wait time after ESU bit clear*1
Wait time after EV bit setting*1
tcesu
10
10
—
µs
tsev
20
20
—
µs
Wait time after H'FF dummy write*1 tsevr
Wait time after EV bit clear*1
tcev
Wait time after SWE bit clear*1
t
2
2
—
µs
4
4
—
µs
100
100

µs
Maximum erase count*1 *5
12
—
120
Times
cswe
Erase
Notes
cswe
N
µs
Erase time wait
Rev. 3.00 Sep 27, 2006 page 671 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
Notes: 1. Set the times according to the program/erase algorithms.
2. Programming time per 128 bytes. (Shows the total time the P bit in the flash memory
control register (FLMCR1) is set. It does not include the programming verification time.)
3. Block erase time. (Shows the total time the E bit in FLMCR1 is set. It does not include
the erase verification time.)
4. To specify the maximum programming time value (tP(max)) in the 128-byte
programming algorithm, set the max. value (1000) for the maximum programming count
(N).
The wait time after P bit setting should be changed as follows according to the value of
the programming counter (n).
Programming counter (n) = 1 to 6:
tsp30 = 30 µs
Programming counter (n) = 7 to 1000:
tsp200 = 200 µs
Programming counter (n) [in additional programming] = 1 to 6: tsp10 = 10 µs
5. For the maximum erase time (tE(max)), the following relationship applies between the
wait time after E bit setting (tse) and the maximum erase count (N):
tE(max) = Wait time after E bit setting (tse) x maximum erase count (N)
To set the maximum erase time, the values of tse and N should be set so as to satisfy
the above formula.
Examples:
When tse = 100 [ms], N = 12
When tse = 10 [ms], N = 120
Rev. 3.00 Sep 27, 2006 page 672 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
Table 21.11 Flash Memory Characteristics (2)
Conditions: VCC = 3.0 to 3.6 V, AVCC = 3.0 to 3.6 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V,
Ta = 0°C to +75°C (operating temperature range for programming/erasing)
Item
Symbol
Min
Typ
Max
Unit
Programming time*1 *2 *4
tP
—
10
200
ms/
128 bytes
Erase time*1 *3 *5
tE
—
100
1200
ms/block
Reprogramming count
NWEC
—
—
100
Times
Programming Wait time after SWE bit setting*1
tsswe
1
1
—
µs
Wait time after PSU bit setting*1
tspsu
50
50
—
µs
Wait time after P bit setting*1 *4
tsp30
28
30
32
µs
Programming
time wait
tsp200
198
200
202
µs
Programming
time wait
tsp10
8
10
12
µs
Additionalprogramming
time wait
tcp
5
5
—
µs
Wait time after P bit clear*1
Wait time after PSU bit clear*
1
tcpsu
5
5
—
µs
Wait time after PV bit setting*1
tspv
4
4
—
µs
Wait time after H'FF dummy
write*1
tspvr
2
2
—
µs
tcpv
2
2
—
µs
tcswe
100
100
—
µs
Maximum programming
count*1 *4
N
—
—
1000
Times
Wait time after SWE bit setting*1
tsswe
1
1
—
µs
Wait time after ESU bit setting*1
tsesu
100
100
—
µs
Wait time after E bit setting*1 *5
tse
10
10
100
ms
Wait time after E bit clear*1
tce
10
10
—
µs
Wait time after ESU bit clear*1
tcesu
10
10
—
µs
Wait time after EV bit setting*1
tsev
20
20
—
µs
Wait time after H'FF dummy
write*1
tsevr
2
2
—
µs
Wait time after EV bit clear*1
tcev
4
4
—
µs
Wait time after SWE bit clear*1
tcswe
100
100
—
µs
Maximum erase count*1 *5
N
12
—
120
Times
Wait time after PV bit clear*1
Wait time after SWE bit clear*
Erase
1
Notes
Erase time wait
Rev. 3.00 Sep 27, 2006 page 673 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
Notes: 1. Make each time setting in accordance with the program/program-verify flowchart or
erase/erase-verify flowchart.
2. Programming time per 128 bytes (Shows the total period for which the P bit in the flash
memory control register 1 (FLMCR1) is set. It does not include the programming
verification time.)
3. Block erase time (Shows the total period for which the E bit in FLMCR1 is set. It does
not include the erase verification time.)
4. To specify the maximum programming time (tP(max)) in the 128-byte programming
flowchart, set the maximum value (1000) for the maximum programming count (N).
The wait time after P bit setting should be changed as follows according to the value of
the programming counter (n).
Programming counter (n) = 1 to 6:
tsp30 = 30 µs
Programming counter (n) = 7 to 1000:
tsp200 = 200 µs
Programming counter (n) [in additional programming] = 1 to 6: tsp10 = 10 µs
5. For the maximum erase time (tE(max)), the following relationship applies between the
wait time after E bit setting (tse) and the maximum erase count (N):
tE(max) = Wait time after E bit setting (tse) × maximum erase count (N)
To set the maximum erase time, the values of tse and N should be set so as to satisfy
the above formula.
Examples: When tse = 100 [ms], N = 12 times
When tse = 10 [ms], N = 120 times
Rev. 3.00 Sep 27, 2006 page 674 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
21.2
Electrical Characteristics of H8/3048B (Mask ROM)
21.2.1
Absolute Maximum Ratings
Table 21.12 lists the absolute maximum ratings.
Table 21.12 Absolute Maximum Ratings
Item
Symbol
Value
Unit
Power supply voltage
1
VCC*
5 V operation model: –0.3 to +7.0
V
3 V operation model: –0.3 to +4.6
2
Input voltage (FWE)*
Vin
–0.3 to VCC +0.3
V
Vin
–0.3 to VCC +0.3
V
Input voltage (port 7)
Vin
–0.3 to AVCC +0.3
V
Reference voltage
VREF
–0.3 to AVCC +0.3
V
Analog power supply voltage
AVCC
5 V operation model: –0.3 to +7.0
V
Analog input voltage
VAN
–0.3 to AVCC +0.3
Topr
Regular specifications: –20 to +75*
Input voltage (except for port 7)*
2
3 V operation model: –0.3 to +4.6
Operating temperature
V
3
Wide-range specifications: –40 to +85*
Storage temperature
Tstg
–55 to +125
°C
3
°C
Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded.
Notes: 1. Do not apply the power supply voltage to the VCL pin in 5 V operation models. Connect
an external capacitor between this pin and GND.
2. 12 V must not be applied to any pin, as this may cause permanent damage to the
device.
3. The operating temperature range for flash memory programming/erasing is 0°C to
+75°C.
Rev. 3.00 Sep 27, 2006 page 675 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
21.2.2
DC Characteristics
Table 21.13 lists the DC characteristics. Table 21.14 lists the permissible output currents.
Table 21.13 DC Characteristics (1)
Conditions: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, VREF = 4.5 V to AVCC,
1
VSS = AVSS = 0 V* , Ta = –20°C to +75°C (regular specifications), Ta = –40°C to
+85°C (wide-range specifications)
Item
Schmitt
trigger input
voltages
Input high
voltage
Symbol
Min
Typ
Max
Unit Test Conditions
Port A,
P82 to P80,
PB3 to PB0
VT–
1.0
—
—
V
VT+
—
—
VCC × 0.7
V
VT+ – VT–
0.4
—
—
V
RES, STBY,
NMI, MD2 to
MD0
VIH
VCC –0.7
—
VCC +0.3
V
VCC × 0.7
—
VCC +0.3
V
EXTAL
Port 7
2.0
—
AVCC +0.3 V
Ports 1 to 6, 9,
P84, P83, PB7 to
PB4
2.0
—
VCC +0.3
V
–0.3
—
0.5
V
NMI, EXTAL,
ports 1 to 7, 9,
P84, P83, PB7 to
PB4
–0.3
—
0.8
V
Output high
voltage
All output pins VOH
(Except RESO)
VCC –0.5
—
—
V
IOH = –200 µA
3.5
—
—
V
IOH = –1 mA
Output low
voltage
All output pins VOL
(Except RESO)
—
—
0.4
V
IOL = 1.6 mA
Ports 1, 2, 5,
and B
—
—
1.0
V
IOL = 10 mA
RESO
—
—
0.4
—
—
1.0
µA
Vin = 0.5 to
VCC –0.5 V
—
—
1.0
µA
Vin = 0.5 to
AVCC –0.5 V
Input low
voltage
Input
leakage
current
RES, STBY,
MD2 to MD0
STBY, NMI,
RES, MD2 to
MD0
VIL
|Iin|
Port 7
Rev. 3.00 Sep 27, 2006 page 676 of 872
REJ09B0325-0300
IOL = 1.6 mA
Section 21 Electrical Characteristics
Item
Symbol
Min
Typ
Max
Unit Test Conditions
|ITSI|
—
—
1.0
µA
Vin = 0.5 to
VCC –0.5 V
Input pull-up Ports 2, 4,
MOS current and 5
–IP
50
—
300
µA
Vin = 0 V
Input
NMI
capacitance All input pins
except NMI
Cin
Current
Normal
2
dissipation* operation
5
ICC*
Three-state
leakage
current
(off state)
Analog
power
supply
current
Reference
current
Ports 1 to 6,
8 to B
—
—
50
pF
—
—
15
pF
VIN = 0 V,
f = fmin,
Ta = 25°C
—
45
60
mA
f = 25 MHz
Sleep mode
—
35
50
mA
Module standby
4
mode*
—
20
25
mA
3
Standby mode*
—
1
10
µA
Ta ≤ 50°C
—
—
80
µA
50°C < Ta
—
0.5
1.5
mA
AVCC = 5.0 V
During A/D and
D/A conversion
—
0.5
1.5
mA
Idle
—
0.01
5.0
µA
DASTE = 0
—
0.4
0.8
mA
VREF = 5.0 V
During A/D and
D/A conversion
—
1.5
3.0
mA
Idle
—
0.01
5.0
µA
2.0
—
—
V
During A/D
conversion
During A/D
conversion
RAM standby voltage
AICC
AICC
VRAM
DASTE = 0
Notes: 1. If the A/D and D/A converters are not used, do not leave the AVCC, AVSS, and VREF pins
open. Connect AVCC and VREF to VCC, and connect AVSS to VSS.
2. Current dissipation values are for VIH min = VCC –0.5 V and VIL max = 0.5 V with all
output pins unloaded and the on-chip pull-up transistors in the off state.
3. The values are for VRAM ≤ VCC < 4.5 V, VIH min = VCC × 0.9, and VIL max = 0.3 V.
4. Module standby current values apply in sleep mode with all modules halted.
5. ICC depends on VCC and f, according to the following expressions.
[Applicable operating frequency: 2 to 25 MHz]
ICC max. (normal operation) = 5.0 [mA] + 0.32 [mA/(MHz × V)] × VCC × (f –2)
ICC max. (sleep mode) = 7.0 [mA] + 0.26 [mA/(MHz × V)] × VCC × (f –2)
ICC max. (sleep mode and module standby mode) = 6.0 [mA] + 0.11 [mA/(MHz × V)] ×
VCC × (f –2)
The typical values of current dissipation are reference values.
Rev. 3.00 Sep 27, 2006 page 677 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
Table 21.13 DC Characteristics (2)
Conditions: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC,
1
VSS = AVSS = 0 V* , Ta = –20°C to +75°C (regular specifications), Ta = –40°C to
+85°C (wide-range specifications)
Item
Symbol
Min
Typ
Max
Unit Test Conditions
Port A,
P82 to P80,
PB3 to PB0
VT–
VCC × 0.2
—
—
V
VT+
—
—
VCC × 0.7
V
VT+ – VT–
VCC × 0.05 —
—
V
RES, STBY,
NMI, MD2 to
MD0
VIH
VCC × 0.9
—
VCC +0.3
V
EXTAL
VCC × 0.7
—
VCC +0.3
V
Port 7
VCC × 0.7
—
AVCC +0.3 V
Ports 1 to 6, 9,
P84, P83, PB7 to
PB4
VCC × 0.7
—
VCC +0.3
V
–0.3
—
VCC × 0.1
V
NMI, EXTAL,
ports 1 to 7, 9,
P84, P83, PB7 to
PB4
–0.3
—
VCC × 0.2
V
Output high
voltage
All output pins VOH
(Except RESO)
VCC –0.5
—
—
V
IOH = –200 µA
VCC –1.0
—
—
V
IOH = –1 mA
Output low
voltage
All output pins VOL
(Except RESO)
—
—
0.4
V
IOL = 1.6 mA
Ports 1, 2, 5,
and B
—
—
1.0
V
IOL = 5 mA
—
—
0.4
—
—
1.0
µA
Vin = 0.5 to
VCC –0.5 V
—
—
1.0
µA
Vin = 0.5 to
AVCC –0.5 V
Schmitt
trigger input
voltages
Input high
voltage
Input low
voltage
RES, STBY,
MD2 to MD0
VIL
RESO
Input
leakage
current
STBY, NMI,
RES, MD2 to
MD0
|Iin|
Port 7
Rev. 3.00 Sep 27, 2006 page 678 of 872
REJ09B0325-0300
IOL = 1.6 mA
Section 21 Electrical Characteristics
Item
Symbol
Min
Typ
Max
Unit Test Conditions
|ITSI|
—
—
1.0
µA
Vin = 0.5 to
VCC –0.5 V
Input pull-up Ports 2, 4,
MOS current and 5
–IP
10
—
300
µA
Vin = 0 V
Input
NMI
capacitance All input pins
except NMI
Cin
Current
Normal
2
dissipation* operation
5
ICC*
Three-state
leakage
current
(off state)
Analog
power
supply
current
Reference
current
Ports 1 to 6,
8 to B
—
—
50
pF
—
—
15
pF
VIN = 0 V,
f = fmin,
Ta = 25°C
—
40
50
mA
f = 25 MHz
Sleep mode
—
25
40
mA
Module standby
4
mode*
—
15
20
mA
3
Standby mode*
—
1
10
µA
Ta ≤ 50°C
—
—
80
µA
50°C < Ta
—
0.5
1.5
mA
AVCC = 3.3 V
During A/D and
D/A conversion
—
0.5
1.5
mA
Idle
—
0.01
5
µA
DASTE = 0
—
0.4
0.8
mA
VREF = 3.3 V
During A/D and
D/A conversion
—
1.5
3
mA
Idle
—
0.01
5
µA
2.0
—
—
V
During A/D
conversion
During A/D
conversion
RAM standby voltage
AICC
AICC
VRAM
DASTE = 0
Notes: 1. If the A/D and D/A converters are not used, do not leave the AVCC, AVSS, and VREF pins
open. Connect AVCC and VREF to VCC, and connect AVSS to VSS.
2. Current dissipation values are for VIH min = VCC –0.5 V and VIL max = 0.5 V with all
output pins unloaded and the on-chip pull-up transistors in the off state.
3. The values are for VRAM ≤ VCC < 3.0 V, VIH min = VCC × 0.9, and VIL max = 0.3 V.
4. Module standby current values apply in sleep mode with all modules halted.
5. ICC depends on VCC and f, according to the following expressions.
[Applicable operating frequency: 2 to 25 MHz]
ICC max. (normal operation) = 6.0 [mA] + 0.53 [mA/(MHz × V)] × VCC × (f –2)
ICC max. (sleep mode) = 4.0 [mA] + 0.43 [mA/(MHz × V)] × VCC × (f –2)
ICC max. (sleep mode and module standby mode) = 3.0 [mA] + 0.20 [mA/(MHz × V)] ×
VCC × (f –2)
The typical values of current dissipation are reference values.
Rev. 3.00 Sep 27, 2006 page 679 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
Table 21.14 Permissible Output Currents
Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC,
VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to
+85°C (wide-range specifications)
Condition B: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, VREF = 4.5 V to AVCC,
VSS = AVSS = 0 V, Ta = –20°C to +75°C (regular specifications), Ta = –40°C to
+85°C (wide-range specifications)
Conditions A, B
Item
Symbol
Permissible output
low current (per pin)
Ports 1, 2, 5, and B
Permissible output
low current (total)
Total of 28 pins in
ports 1, 2, 5, and B
IOL
Other output pins
ΣIOL
Total of all output pins,
including the above
Min
Typ
Max
Unit
—
—
10
mA
—
—
2.0
mA
—
—
80
mA
—
—
120
mA
Permissible output
high current (per pin)
All output pins
IOH
—
—
2.0
mA
Permissible output
high current (total)
Total of all output pins
ΣIOH
—
—
40
mA
Notes: 1. To protect chip reliability, do not exceed the output current values in table 21.14.
2. When driving a darlington pair or LED, always insert a current-limiting resistor in the
output line, as shown in figures 21.4 and 21.5.
Rev. 3.00 Sep 27, 2006 page 680 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
H8/3048B Group
2 kΩ
Port
Darlington pair
Figure 21.4 Darlington Pair Drive Circuit (Example)
H8/3048B Group
Ports 1, 2, 5,
and B
600 Ω
LED
Figure 21.5 LED Drive Circuit (Example)
Rev. 3.00 Sep 27, 2006 page 681 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
21.2.3
AC Characteristics
Bus timing parameters are listed in table 21.15. Refresh controller bus timing parameters are listed
in table 21.16. Control signal timing parameters are listed in table 21.17. Timing parameters of the
on-chip supporting modules are listed in table 21.18.
Table 21.15 Bus Timing
Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC,
VSS = AVSS = 0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition B: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, VREF = 4.5 V to AVCC,
VSS = AVSS = 0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition A
Condition B
25 MHz
25 MHz
Item
Symbol
Min
Max
Min
Max
Unit
Test
Conditions
Clock cycle time
tcyc
40
500
40
500
ns
Figure 21.7
Clock pulse low width
tCL
10
—
10
—
Clock pulse high width
tCH
10
—
10
—
Clock rise time
tCR
—
10
—
10
Clock fall time
tCF
—
10
—
10
Address delay time
tAD
—
28
—
25
Address hold time
tAH
0.5tcyc –20
—
0.5tcyc –20
—
Address strobe delay time tASD
—
25
—
25
Write strobe delay time
tWSD
—
25
—
25
Strobe delay time
tSD
—
25
—
25
Write data strobe pulse
width 1
tWSW1
1.0tcyc –25
—
1.0tcyc –25
—
Write data strobe pulse
width 2
tWSW2
1.5tcyc –25
—
1.5tcyc –25
—
Address setup time 1
tAS1
0.5tcyc –20
—
0.5tcyc –20
—
Address setup time 2
tAS2
1.0tcyc –20
—
1.0tcyc –20
—
Read data setup time
tRDS
15
—
15
—
Read data hold time
tRDH
0
—
0
—
Rev. 3.00 Sep 27, 2006 page 682 of 872
REJ09B0325-0300
Figure 21.8
Section 21 Electrical Characteristics
Condition A
Condition B
25 MHz
25 MHz
Item
Symbol
Min
Max
Min
Max
Unit
Test
Conditions
Write data delay time
tWDD
—
35
—
35
ns
Figure 21.7
Write data setup time 1
tWDS1
1.0tcyc –30
—
1.0tcyc –30
—
Write data setup time 2
tWDS2
0.5tcyc –30
—
0.5tcyc –30
—
Write data hold time
tWDH
0.5tcyc –15
—
0.5tcyc –15
—
Read data access time 1
tACC1
—
1.5tcyc –40
—
1.5tcyc –40
Read data access time 2
tACC2
—
2.5tcyc –40
—
2.5tcyc –40
Read data access time 3
tACC3
—
1.0tcyc –28
—
1.0tcyc –28
Read data access time 4
tACC4
—
2.0tcyc –32
—
2.0tcyc –32
Precharge time
tPCH
1.0tcyc –20
—
1.0tcyc –20
—
Wait setup time
tWTS
25
—
25
—
Wait hold time
tWTH
5
—
5
—
Bus request setup time
tBRQS
25
—
25
—
Bus acknowledge delay
time 1
tBACD1
—
30
—
30
Bus acknowledge delay
time 2
tBACD2
—
30
—
30
Bus-floating time
tBZD
—
40
—
40
Figure 21.8
ns
Figure 21.9
ns
Figure 21.21
Rev. 3.00 Sep 27, 2006 page 683 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
Table 21.16 Refresh Controller Bus Timing
Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC,
VSS = AVSS = 0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition B: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, VREF = 4.5 V to AVCC,
VSS = AVSS = 0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition A
Condition B
25 MHz
25 MHz
Test
Conditions
Item
Symbol
Min
Max
Min
Max
Unit
RAS delay time 1*1
tRAD1
—
20
—
18
ns
RAS delay time 2*1
tRAD2
—
20
—
18
RAS delay time 3*1
Figure 21.10
to
Figure 21.16
tRAD3
—
20
—
18
Row address hold time
tRAH
0.5tcyc –5
—
0.5tcyc –5
—
RAS precharge time*1
tRP
1.0tcyc –15
—
1.0tcyc –15
—
CAS to RAS precharge
time*1 *2
tCRP
1.0tcyc –15
—
1.0tcyc –15
—
CAS pulse width*2
tCAS
1.0tcyc –18
—
1.0tcyc –18
—
RAS access time*1
tRAC
—
2.0tcyc –35
—
2.0tcyc –35
Address access time
tAA
—
1.5tcyc –40
—
1.5tcyc –40
CAS access time*2
tCAC
—
1.0tcyc –30
—
1.0tcyc –30
Write data setup time 3
tWDS3
1.0tcyc –25
—
1.0tcyc –25
—
CAS setup time*2
tCSR
0.5tcyc –15
—
0.5tcyc –15
—
Read strobe delay time
tRSD
—
25
—
25
Signal rise time (all input
pins except EXTAL)
tSR
—
100
—
100
ns
Figure 21.18
Signal fall time (all input
pins except EXTAL)
tSF
—
100
—
100
Notes: 1. The RAS pin is assigned to the CS3 pin.
2. The CAS pin is assigned to the RD pin.
Rev. 3.00 Sep 27, 2006 page 684 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
Table 21.17 Control Signal Timing
Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC,
VSS = AVSS = 0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition B: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, VREF = 4.5 V to AVCC,
VSS = AVSS = 0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition A
Condition B
25 MHz
25 MHz
Item
Symbol
Min
Max
Min
Max
Unit
Test
Conditions
RES setup time
tRESS
200
—
200
—
ns
Figure 21.18
RES pulse width
tRESW
20
—
20
—
tcyc
Mode programming setup time
tMDS
200
—
200
—
ns
RESO output delay time
tRESD
—
50
—
50
ns
RESO output pulse width
tRESOW
132
—
132
—
tcyc
NMI setup time
(NMI, IRQ5 to IRQ0)
tNMIS
150
—
150
—
ns
Figure 21.20
NMI hold time
(NMI, IRQ5 to IRQ0)
tNMIH
10
—
10
—
Interrupt pulse width
(NMI, IRQ2 to IRQ0
when exiting software
standby mode)
tNMIW
200
—
200
—
Clock oscillator settling
time at reset (crystal)
tOSC1
20
—
20
—
ms
Figure 21.22
Clock oscillator settling
time in software standby
(crystal)
tOSC2
7
—
7
—
ms
Figure 20.1
Figure 21.19
Rev. 3.00 Sep 27, 2006 page 685 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
Table 21.18 Timing of On-Chip Supporting Modules
Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC,
VSS = AVSS = 0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition B: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, VREF = 4.5 V to AVCC,
VSS = AVSS = 0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Item
DMAC DREQ setup time
ITU
SCI
Ports
and
TPC
Condition A
Condition B
25 MHz
25 MHz
Symbol
Min
Max
Min
Max
Unit
Test
Conditions
ns
Figure 21.30
tDRQS
20
—
20
—
DREQ hold time
tDRQH
10
—
10
—
TEND delay time 1
tTED1
—
50
—
50
TEND delay time 2
tTED2
—
50
—
50
Timer output delay time
tTOCD
—
50
—
50
Timer input setup time
tTICS
40
—
40
—
Timer clock input setup time
tTCKS
40
—
40
—
Timer clock
pulse width
Single edge
tTCKWH
1.5
—
1.5
—
Both edges
tTCKWL
2.5
—
2.5
—
Input clock
cycle
Asynchronous
tSCYC
4
—
4
—
Synchronous
tSCYC
6
—
6
—
Input clock rise time
tSCKr
—
1.5
—
1.5
Input clock fall time
tSCKf
—
1.5
—
1.5
Input clock pulse width
tSCKW
0.4
0.6
0.4
0.6
tSCYC
Transmit data delay time
tTXD
—
100
—
100
ns
Figure 21.27
Receive data setup time
(synchronous)
tRXS
100
—
100
—
Receive
data hold
time (synchronous)
Clock input
tRXH
100
—
100
—
Clock output
tRXH
0
—
0
—
tPWD
—
50
—
50
ns
Figure 21.23
Input data setup time
tPRS
50
—
50
—
Input data hold time
tPRH
50
—
50
—
Output data delay time
Rev. 3.00 Sep 27, 2006 page 686 of 872
REJ09B0325-0300
Figures 21.28
and 21.29
ns
Figure 21.24
Figure 21.25
tCYC
tCYC
Figure 21.26
Section 21 Electrical Characteristics
RL
C = 90 pF: ports 4, 5, 6, 8, A (19 to 0),
D (15 to 8), φ
C = 30 pF: ports 9, A, B, RESO
H8/3048B Group
output pin
R L = 2.4 k Ω
R H = 12 k Ω
C
RH
Input/output timing measurement levels
• Low: 0.8 V
• High: 2.0 V
Figure 21.6 Output Load Circuit
Rev. 3.00 Sep 27, 2006 page 687 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
21.2.4
A/D Conversion Characteristics
Table 21.19 lists the A/D conversion characteristics.
Table 21.19 A/D Converter Characteristics
Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC,
VSS = AVSS = 0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition B: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, VREF = 4.5 V to AVCC,
VSS = AVSS = 0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition A
Condition B
25 MHz
25 MHz
Item
Min
Resolution
10
10
10
10
10
10
bits
Conversion time (single mode)
5.36
—
—
5.36
—
—
µs
Analog input capacitance
Typ
Max
Min
Typ
Max
Unit
—
—
20
—
—
20
pF
φ ≤ 13 MHz
—
—
10
—
—
10
kΩ
φ > 13 MHz
—
—
5
—
—
5
Nonlinearity error
—
—
±3.5
—
—
±3.5
LSB
Offset error
—
—
±3.5
—
—
±3.5
LSB
Full-scale error
—
—
±3.5
—
—
±3.5
LSB
Quantization error
—
—
±0.5
—
—
±0.5
LSB
Absolute accuracy
—
—
±4.0
—
—
±4.0
LSB
Permissible
signal-source
impedance
Rev. 3.00 Sep 27, 2006 page 688 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
21.2.5
D/A Conversion Characteristics
Table 21.20 lists the D/A conversion characteristics.
Table 21.20 D/A Converter Characteristics
Condition A: VCC = 3.0 V to 3.6 V, AVCC = 3.0 V to 3.6 V, VREF = 3.0 V to AVCC,
VSS = AVSS = 0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition B: VCC = 5.0 V ±10%, AVCC = 5.0 V ±10%, VREF = 4.5 V to AVCC,
VSS = AVSS = 0 V, φ = 2 MHz to 25 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition A
Condition B
25 MHz
25 MHz
Item
Min
Typ
Max
Min
Typ
Max
Unit
Test Conditions
Resolution
8
8
8
8
8
8
bits
Conversion time
(centering time)
—
—
10
—
—
10
µs
20-pF capacitive
load
Absolute accuracy
—
±2.0
±3.0
—
±1.5
±2.0
LSB
2-MΩ resistive
load
—
—
±2.0
—
—
±1.5
LSB
4-MΩ resistive
load
Rev. 3.00 Sep 27, 2006 page 689 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
21.3
Operational Timing
This section shows timing diagrams.
21.3.1
Bus Timing
Bus timing is shown as follows:
• Basic bus cycle: two-state access
Figure 21.7 shows the timing of the external two-state access cycle.
• Basic bus cycle: three-state access
Figure 21.8 shows the timing of the external three-state access cycle.
• Basic bus cycle: three-state access with one wait state
Figure 21.9 shows the timing of the external three-state access cycle with one wait state
inserted.
Rev. 3.00 Sep 27, 2006 page 690 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
T1
T2
tcyc
tCH
tCL
φ
tCF
tcyc
tAD
tCR
A23 to A0,
CS 7 to CS 0
AS
tPCH
tASD
tACC3
tSD
tAH
tASD
tACC3
tSD
tAH
tAS1
tPCH
RD
(read)
tAS1
tACC1
tRDS
tRDH
D15 to D0
(read)
tPCH
tASD
HWR, LWR
(write)
tSD
tAH
tAS1
tWSW1
tWDD
tWDS1
tWDH
D15 to D0
(write)
Figure 21.7 Basic Bus Cycle: Two-State Access
Rev. 3.00 Sep 27, 2006 page 691 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
T1
T2
T3
φ
A23 to A0
tACC4
AS
tACC4
RD (read)
tRDS
tACC2
D15 to D0
(read)
tWSD
HWR, LWR
(write)
tWSW2
tAS2
tWDS2
D15 to D0
(write)
Figure 21.8 Basic Bus Cycle: Three-State Access
Rev. 3.00 Sep 27, 2006 page 692 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
T1
T2
TW
T3
φ
A23 to A0
AS
RD (read)
D15 to D0
(read)
HWR, LWR
(write)
D15 to D0
(write)
tWTS
tWTH
tWTS
tWTH
WAIT
Figure 21.9 Basic Bus Cycle: Three-State Access with One Wait State
Rev. 3.00 Sep 27, 2006 page 693 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
21.3.2
Refresh Controller Bus Timing
Refresh controller bus timing is shown as follows:
• DRAM bus timing
Figures 21.10 to 21.15 show the DRAM bus timing in each operating mode.
• PSRAM bus timing
Figures 21.16 and 21.17 show the pseudo-static RAM bus timing in each operating mode.
T2
T1
φ
tAD
T3
tAD
A9 to A1
AS
tRAD1
CS 3 (RAS)
tRAD3
tRAH
tAS1
tRP
tASD
RD (CAS)
tAS1
HWR (UW),
LWR (LW )
(read)
HWR (UW),
LWR (LW )
(write)
tCAS
tRAC
tASD
tSD
tCRP
tSD
tAA
tCAC
RFSH
tWDH
tRDS
D15 to D0
(read)
tRDH
tWDS3
D15 to D0
(write)
Figure 21.10 DRAM Bus Timing (Read/Write): Three-State Access
— 2WE
WE Mode —
Rev. 3.00 Sep 27, 2006 page 694 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
T2
T1
T3
φ
A9 to A1
tASD
tSD
AS
tCSR
tRAD3
CS3 (RAS)
tASD
tRAD2
tSD
tRAD2
tRAD3
RD (CAS)
HWR (UW),
LWR (LW)
RFSH
tCSR
Figure 21.11 DRAM Bus Timing (Refresh Cycle): Three-State Access
— 2WE
WE Mode —
φ
CS3 (RAS)
RD (CAS)
tCSR
tCSR
RFSH
Figure 21.12 DRAM Bus Timing (Self-Refresh Mode)
— 2WE
WE Mode —
Rev. 3.00 Sep 27, 2006 page 695 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
T1
φ
T2
tAD
T3
tAD
A9 to A1
AS
tAS1
CS 3 (RAS)
tRAD3
tRAD1
tRAH
tRP
tASD
HWR (UCAS),
LWR (LCAS)
tCAS
tAS1
RD (WE)
(read)
tRAC
tCAC
RD (WE)
(write)
RFSH
tCRP
tSD
tAA
tASD
tSD
tWDH
tRDS
tRDH
D15 to D0
(read)
tWDS3
D15 to D0
(write)
Figure 21.13 DRAM Bus Timing (Read/Write): Three-State Access
— 2CAS
CAS Mode —
Rev. 3.00 Sep 27, 2006 page 696 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
T1
T2
T3
φ
A9 to A1
tASD
tSD
AS
tCSR
tRAD3
CS 3 (RAS)
tASD
tRAD2
tSD
tRAD2
tRAD3
HWR (UCAS),
LWR (LCAS)
RD (WE)
RFSH
tCSR
Figure 21.14 DRAM Bus Timing (Refresh Cycle): Three-State Access
— 2CAS
CAS Mode —
φ
CS 3 (RAS)
tCSR
HWR (UCAS),
LWR (LCAS)
tCSR
RFSH
Figure 21.15 DRAM Bus Timing (Self-Refresh Mode)
— 2CAS
CAS Mode —
Rev. 3.00 Sep 27, 2006 page 697 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
T1
φ
T2
T3
tAD
A23 to A0
AS
tRAD1
tRAD3
tRP
CS3
tAS1
RD (read)
tSD
tRSD
tRDS
D15 to D0
(read)
tRDH
tWSD
tSD
HWR, LWR
(write)
tWDS2
D15 to D0
(write)
RFSH
Figure 21.16 PSRAM Bus Timing (Read/Write): Three-State Access
T1
T2
T3
φ
A23 to A0
AS
CS3 HWR,
LWR, RD
tRAD2
tRAD3
RFSH
Figure 21.17 PSRAM Bus Timing (Refresh Cycle): Three-State Access
Rev. 3.00 Sep 27, 2006 page 698 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
21.3.3
Control Signal Timing
Control signal timing is shown as follows:
• Reset input timing
Figure 21.18 shows the reset input timing.
• Reset output timing
Figure 21.19 shows the reset output timing.
• Interrupt input timing
Figure 21.20 shows the input timing for NMI and IRQ5 to IRQ0.
• Bus-release mode timing
Figure 21.21 shows the bus-release mode timing.
φ
tRESS
tRESS
RES
tSR
tSF
tMDS
tRESW
MD2 to MD0
Figure 21.18 Reset Input Timing
φ
tRESD
tRESD
RESO
tRESOW
Figure 21.19 Reset Output Timing*
Note: * This is a function for models with on-chip mask ROM (H8/3048B, H8/3048, H8/3047,
H8/3045, and H8/3044), PROM (H8/3048ZTAT), and on-chip flash memory with a
dual power supply (H8/3048F). The function does not exist in the product with on-chip
flash memory with a single power supply (H8/3048F-ONE).
Rev. 3.00 Sep 27, 2006 page 699 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
φ
tNMIS
tNMIH
tNMIS
tNMIH
NMI
IRQ E
tNMIS
IRQ L
IRQ E : Edge-sensitive IRQ i
IRQ L : Level-sensitive IRQ i (i = 0 to 5)
tNMIW
NMI
IRQ j
(j = 0 to 2)
Figure 21.20 Interrupt Input Timing
φ
tBRQS
tBRQS
BREQ
tBACD2
tBACD1
BACK
tBZD
A23 to A0,
AS, RD,
HWR, LWR
Figure 21.21 Bus-Release Mode Timing
Rev. 3.00 Sep 27, 2006 page 700 of 872
REJ09B0325-0300
tBZD
Section 21 Electrical Characteristics
21.3.4
Clock Timing
Clock timing is shown as follows:
• Oscillator settling timing
Figure 21.22 shows the oscillator settling timing.
φ
VCC
STBY
tOSC1
tOSC1
RES
Figure 21.22 Oscillator Settling Timing
21.3.5
TPC and I/O Port Timing
Figure 21.23 shows the TPC and I/O port timing.
T1
T2
T3
φ
tPRS
tPRH
Port 1 to B
(read)
tPWD
Port 1 to 6,
8 to B
(write)
Figure 21.23 TPC and I/O Port Input/Output Timing
Rev. 3.00 Sep 27, 2006 page 701 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
21.3.6
ITU Timing
ITU timing is shown as follows:
• ITU input/output timing
Figure 21.24 shows the ITU input/output timing.
• ITU external clock input timing
Figure 21.25 shows the ITU external clock input timing.
φ
tTOCD
Output
compare*1
tTICS
Input
capture*2
Notes: 1. TIOCA0 to TIOCA4, TIOCB0 to TIOCB4, TOCXA4, TOCXB4
2. TIOCA0 to TIOCA4, TIOCB0 to TIOCB4
Figure 21.24 ITU Input/Output Timing
tTCKS
φ
tTCKS
TCLKA to
TCLKD
tTCKWL
tTCKWH
Figure 21.25 ITU External Clock Input Timing
Rev. 3.00 Sep 27, 2006 page 702 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
21.3.7
SCI Input/Output Timing
SCI timing is shown as follows:
• SCI input clock timing
Figure 21.26 shows the SCK input clock timing.
• SCI input/output timing (synchronous mode)
Figure 21.27 shows the SCI input/output timing in synchronous mode.
tSCKW
tSCKr
tSCKf
SCK0, SCK1
tScyc
Figure 21.26 SCK Input Clock Timing
tScyc
SCK0, SCK1
tTXD
TxD0, TxD1
(transmit
data)
tRXS
tRXH
RxD0, RxD1
(receive
data)
Figure 21.27 SCI Input/Output Timing in Synchronous Mode
Rev. 3.00 Sep 27, 2006 page 703 of 872
REJ09B0325-0300
Section 21 Electrical Characteristics
21.3.8
DMAC Timing
DMAC timing is shown as follows.
• DMAC TEND output timing for 2 state access
Figure 21.28 shows the DMAC TEND output timing for 2 state access.
• DMAC TEND output timing for 3 state access
Figure 21.29 shows the DMAC TEND output timing for 3 state access.
• DMAC DREQ input timing
Figure 21.30 shows DMAC DREQ input timing.
T1
T2
φ
tTED1
tTED2
TEND
Figure 21.28 DMAC TEND Output Timing for 2 State Access
T1
T2
T3
φ
tTED2
tTED1
TEND
Figure 21.29 DMAC TEND Output Timing for 3 State Access
φ
tDRQS
tDRQH
DREQ
Figure 21.30 DMAC DREQ Input Timing
Rev. 3.00 Sep 27, 2006 page 704 of 872
REJ09B0325-0300
Appendix A Instruction Set
Appendix A Instruction Set
A.1
Instruction List
Operand Notation
Symbol
Description
Rd
General destination register
Rs
General source register
Rn
General register
ERd
General destination register (address register or 32-bit register)
ERs
General source register (address register or 32-bit register)
ERn
General register (32-bit register)
(EAd)
Destination operand
(EAs)
Source operand
PC
Program counter
SP
Stack pointer
CCR
Condition code register
N
N (negative) flag in CCR
Z
Z (zero) flag in CCR
V
V (overflow) flag in CCR
C
C (carry) flag in CCR
disp
Displacement
→
Transfer from the operand on the left to the operand on the right, or transition from
the state on the left to the state on the right
+
Addition of the operands on both sides
–
Subtraction of the operand on the right from the operand on the left
×
Multiplication of the operands on both sides
÷
Division of the operand on the left by the operand on the right
∧
Logical AND of the operands on both sides
∨
Logical OR of the operands on both sides
⊕
Exclusive logical OR of the operands on both sides
¬
NOT (logical complement)
( ), < >
Contents of operand
Note: General registers include 8-bit registers (R0H to R7H and R0L to R7L) and 16-bit registers
(R0 to R7 and E0 to E7).
Rev. 3.00 Sep 27, 2006 page 705 of 872
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Appendix A Instruction Set
Symbol
Description
↔
Condition Code Notation
Changed according to execution result
*
Undetermined (no guaranteed value)
0
Cleared to 0
1
Set to 1
—
Not affected by execution of the instruction
∆
Varies depending on conditions, described in notes
Rev. 3.00 Sep 27, 2006 page 706 of 872
REJ09B0325-0300
Appendix A Instruction Set
Table A.1
Instruction Set
1. Data transfer instructions
No. of
States*1
MOV.B @(d:16, ERs), Rd
B @(d:16, ERs) → Rd8
4
 
MOV.B @(d:24, ERs), Rd
B @(d:24, ERs) → Rd8
8
 
MOV.B @ERs+, Rd
B @ERs → Rd8,
ERs32+1 → ERs32
MOV.B @aa:8, Rd
B @aa:8 → Rd8
2
 
MOV.B @aa:16, Rd
B @aa:16 → Rd8
4
 
MOV.B @aa:24, Rd
B @aa:24 → Rd8
6
 
MOV.B Rs, @ERd
B Rs8 → @ERd
MOV.B Rs, @(d:16, ERd)
B Rs8 → @(d:16, ERd)
4
 
MOV.B Rs, @(d:24, ERd)
B Rs8 → @(d:24, ERd)
8
 
MOV.B Rs, @−ERd
B ERd32−1 → ERd32,
Rs8 → @ERd
MOV.B Rs, @aa:8
B Rs8 → @aa:8
2
 
MOV.B Rs, @aa:16
B Rs8 → @aa:16
4
 
MOV.B Rs, @aa:24
B Rs8 → @aa:24
6
 
MOV.W #xx:16, Rd
W #xx:16 → Rd16
MOV.W Rs, Rd
W Rs16 → Rd16
MOV.W @ERs, Rd
W @ERs → Rd16
 
2
 
2
 
2
 
2
 
4
 
2
 
2
MOV.W @(d:16, ERs), Rd W @(d:16, ERs) → Rd16
4
 
MOV.W @(d:24, ERs), Rd W @(d:24, ERs) → Rd16
8
 
 
MOV.W @ERs+, Rd
W @ERs → Rd16,
ERs32+2 → @ERd32
MOV.W @aa:16, Rd
W @aa:16 → Rd16
4
 
MOV.W @aa:24, Rd
W @aa:24 → Rd16
6
 
MOV.W Rs, @ERd
W Rs16 → @ERd
2
 
2
MOV.W Rs, @(d:16, ERd) W Rs16 → @(d:16, ERd)
4
 
MOV.W Rs, @(d:24, ERd) W Rs16 → @(d:24, ERd)
8
 
Advanced
Normal
C
↔ ↔ ↔ ↔ ↔ ↔
B @ERs → Rd8
 
2
↔ ↔ ↔ ↔ ↔ ↔
MOV.B @ERs, Rd
2
V
0 
↔ ↔ ↔ ↔ ↔ ↔ ↔
B Rs8 → Rd8
↔ ↔ ↔ ↔ ↔ ↔ ↔
B #xx:8 → Rd8
MOV.B Rs, Rd
Z
0 
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
 
MOV.B #xx:8, Rd
N
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
H
0 
0 
6
0 
10
0 
6
↔ ↔ ↔ ↔ ↔
I
↔ ↔ ↔ ↔ ↔

@@aa
@(d, PC)
Condition Code
@aa
@−ERn/@ERn+
@(d, ERn)
@ERn
Rn
Operation
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
0 
6
0 
8
0 
4
2
0 
2
0 
4
0 
6
0 
10
0 
6
4
0 
6
0 
8
0 
4
0 
6
0 
10
0 
6
4
0 
6
0 
8
0 
4
0 
2
0 
4
0 
6
0 
10
Rev. 3.00 Sep 27, 2006 page 707 of 872
REJ09B0325-0300
Appendix A Instruction Set
No. of
States*1
0 
0 
8
0 
10
0 
14
0 
10
0 
10
0 
12
0 
6
0 
10
0 
6
0 
10
MOV.W Rs, @aa:16
W Rs16 → @aa:16
4
 
MOV.W Rs, @aa:24
W Rs16 → @aa:24
6
 
MOV.L #xx:32, Rd
L #xx:32 → Rd32
MOV.L ERs, ERd
L ERs32 → ERd32
MOV.L @ERs, ERd
L @ERs → ERd32
MOV.L @(d:16, ERs), ERd
L @(d:16, ERs) → ERd32
6
MOV.L @(d:24, ERs), ERd
L @(d:24, ERs) → ERd32
10
MOV.L @ERs+, ERd
L @ERs → ERd32,
ERs32+4 → ERs32
MOV.L @aa:16, ERd
L @aa:16 → ERd32
6
 
MOV.L @aa:24, ERd
L @aa:24 → ERd32
8
 
MOV.L ERs, @ERd
L ERs32 → @ERd
MOV.L ERs, @(d:16, ERd)
L ERs32 → @(d:16, ERd)
6
MOV.L ERs, @(d:24, ERd)
L ERs32 → @(d:24, ERd)
10
MOV.L ERs, @−ERd
L ERd32–4 → ERd32,
ERs32 → @ERd
MOV.L ERs, @aa:16
L ERs32 → @aa:16
6
 
MOV.L ERs, @aa:24
L ERs32 → @aa:24
8
 
POP.W Rn
W @SP → Rn16,
SP+2 → SP
2  
POP.L ERn
L @SP → ERn32,
SP+4 → SP
4  
PUSH.W Rn
W SP−2 → SP,
Rn16 → @SP
2  
PUSH.L ERn
L SP−4 → SP,
ERn32 → @SP
4  
MOVFPE @aa:16, Rd
B Cannot be used in
the H8/3048B Group
4
Cannot be used in
the H8/3048B Group
B Cannot be used in
the H8/3048B Group
4
Cannot be used in
the H8/3048B Group
MOVTPE Rs, @aa:16
Rev. 3.00 Sep 27, 2006 page 708 of 872
REJ09B0325-0300
 
4
 
 
 
4
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
 
↔ ↔ ↔ ↔ ↔ ↔
 
4
↔ ↔ ↔
 
↔
 
4
↔
 
2
↔
 
↔
W ERd32−2 → ERd32,
Rs16 → @ERd
6
Advanced
0 
MOV.W Rs, @−ERd
2
Normal
↔
C
0 
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
V
↔ ↔ ↔ ↔ ↔ ↔
Z
↔ ↔ ↔
N
↔
H
↔
I
 
↔

@@aa
@(d, PC)
Condition Code
@aa
@−ERn/@ERn+
@(d, ERn)
@ERn
Rn
Operation
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
6
6
0 
8
0 
6
0 
2
0 
8
0 
10
0 
14
0 
10
10
0 
12
Appendix A Instruction Set
2. Arithmetic instructions
No. of
States*1
↔ ↔ ↔ ↔ ↔
↔

(3)
↔ ↔
Advanced
↔ ↔ ↔ ↔ ↔
 (2)
Normal
↔ ↔
 (2)
B Rd8+#xx:8 → Rd8
2
ADD.B Rs, Rd
B Rd8+Rs8 → Rd8
ADD.W #xx:16, Rd
W Rd16+#xx:16 → Rd16
ADD.W Rs, Rd
W Rd16+Rs16 → Rd16
ADD.L #xx:32, ERd
L ERd32+#xx:32 →
ERd32
ADD.L ERs, ERd
L ERd32+ERs32 →
ERd32
2
ADDX.B #xx:8, Rd
B Rd8+#xx:8 +C → Rd8
2
ADDX.B Rs, Rd
B Rd8+Rs8 +C → Rd8
2

ADDS.L #1, ERd
L ERd32+1 → ERd32
2
     
2
ADDS.L #2, ERd
L ERd32+2 → ERd32
2
     
2
ADDS.L #4, ERd
L ERd32+4 → ERd32
2
     
2
INC.B Rd
B Rd8+1 → Rd8
2
 

2
INC.W #1, Rd
W Rd16+1 → Rd16
2
 

2
INC.W #2, Rd
W Rd16+2 → Rd16
2
 

2
INC.L #1, ERd
L ERd32+1 → ERd32
2
 

2
INC.L #2, ERd
L ERd32+2 → ERd32
2
 

2
DAA Rd
B Rd8 decimal adjust
→ Rd8
2
 *
* 
2
2

6
2
(3)
2
4
2
6
2
SUB.W Rs, Rd
W Rd16−Rs16 → Rd16
SUB.L #xx:32, ERd
L ERd32−#xx:32 → ERd32
SUB.L ERs, ERd
L ERd32−ERs32 → ERd32
SUBX.B #xx:8, Rd
B Rd8−#xx:8−C → Rd8
SUBX.B Rs, Rd
B Rd8−Rs8−C → Rd8
2

SUBS.L #1, ERd
L ERd32−1 → ERd32
2
     
2
SUBS.L #2, ERd
L ERd32−2 → ERd32
2
     
2
SUBS.L #4, ERd
L ERd32−4 → ERd32
2
     
2
DEC.B Rd
B Rd8−1 → Rd8
2
 

2
DEC.W #1, Rd
W Rd16−1 → Rd16
2
 

2
DEC.W #2, Rd
W Rd16−2 → Rd16
2
 

2
 (1)
 (2)
2
 (2)

2
↔ ↔
6
(3)
(3)
↔ ↔ ↔
2
↔ ↔ ↔
 (1)
4
↔ ↔ ↔
2
W Rd16−#xx:16 → Rd16
↔
B Rd8−Rs8 → Rd8
SUB.W #xx:16, Rd
↔ ↔ ↔ ↔ ↔ ↔ ↔
SUB.B Rs, Rd
↔ ↔ ↔ ↔ ↔ ↔ ↔
2
 (1)
↔ ↔
2
↔ ↔ ↔ ↔ ↔
 (1)
4
↔ ↔ ↔ ↔ ↔ ↔

↔ ↔ ↔ ↔ ↔
2
↔ ↔ ↔ ↔ ↔ ↔ ↔

2
↔ ↔ ↔ ↔ ↔ ↔
ADD.B #xx:8, Rd
↔ ↔ ↔ ↔ ↔
C
↔ ↔ ↔ ↔ ↔
V
↔
Z
↔ ↔
N
↔
I
↔
H
↔ ↔

@@aa
@(d, PC)
Condition Code
@aa
@−ERn/@ERn+
@(d, ERn)
@ERn
Rn
Operation
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
4
2
6
2
2
2
Rev. 3.00 Sep 27, 2006 page 709 of 872
REJ09B0325-0300
Appendix A Instruction Set
No. of
States*1
Advanced
2
     
14
W Rd16 × Rs16 → ERd32
(unsigned multiplication)
2
     
22
MULXS. B Rs, Rd
B Rd8 × Rs8 → Rd16
(signed multiplication)
4
 
↔
Normal
↔ ↔
2
 
16
MULXS. W Rs, ERd
W Rd16 × Rs16 → ERd32
(signed multiplication)
4
 
 
24
DIVXU. B Rs, Rd
B Rd16 ÷ Rs8 → Rd16
(RdH: remainder,
RdL: quotient)
(unsigned division)
2
  (6) (7)  
14
DIVXU. W Rs, ERd
W ERd32 ÷ Rs16 → ERd32
(Ed: remainder,
Rd: quotient)
(unsigned division)
2
  (6) (7)  
22
DIVXS. B Rs, Rd
B Rd16 ÷ Rs8 → Rd16
(RdH: remainder,
RdL: quotient)
(signed division)
4
  (8) (7)  
16
DIVXS. W Rs, ERd
W ERd32 ÷ Rs16 → ERd32
(Ed: remainder,
Rd: quotient)
(signed division)
4
  (8) (7)  
24
CMP.B #xx:8, Rd
B Rd8−#xx:8

2
CMP.B Rs, Rd
B Rd8−Rs8
CMP.W #xx:16, Rd
W Rd16−#xx:16
CMP.W Rs, Rd
W Rd16−Rs16
CMP.L #xx:32, ERd
L ERd32−#xx:32
CMP.L ERs, ERd
L ERd32−ERs32
DAS.Rd
B Rd8 decimal adjust
→ Rd8
2
 *
MULXU. B Rs, Rd
B Rd8 × Rs8 → Rd16
(unsigned multiplication)
MULXU. W Rs, ERd
Rev. 3.00 Sep 27, 2006 page 710 of 872
REJ09B0325-0300
2
2

 (1)
4
2
 (1)
 (2)
6
2
 (2)
↔
 
↔
2
↔ ↔
L ERd32−2 → ERd32
Z
↔ ↔ ↔ ↔ ↔ ↔
2
* 
DEC.L #2, ERd
N
↔ ↔ ↔
2

 
↔ ↔ ↔ ↔ ↔ ↔
C

2
↔ ↔ ↔ ↔ ↔ ↔
H
L ERd32−1 → ERd32
↔ ↔ ↔ ↔ ↔ ↔
I
DEC.L #1, ERd
↔ ↔ ↔
V
↔

@@aa
@(d, PC)
Condition Code
@aa
@−ERn/@ERn+
@(d, ERn)
@ERn
Rn
Operation
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
2
4
2
4
2
Appendix A Instruction Set
No. of
States*1
C
↔ ↔ ↔
↔ ↔ ↔ ↔
↔ ↔ ↔
NEG.W Rd
W 0–Rd16 → Rd16
2

NEG.L ERd
L 0–ERd32 → ERd32
2

EXTU.W Rd
W 0 → (<bits 15 to 8>
of Rd16)
2
  0
EXTU.L ERd
L 0 → (<bits 31 to 16>
of ERd32)
2
  0
EXTS.W Rd
W (<bit 7> of Rd16) →
(<bits 15 to 8> of Rd16)
2
 
EXTS.L ERd
L (<bit 15> of ERd32) →
(<bits 31 to 16> of
ERd32)
2
 
↔
Advanced
V
Normal
Z
↔ ↔ ↔
N
2
0 
2
↔

0 
2
↔
2
0 
2
↔
H
B 0–Rd8 → Rd8
↔
I
NEG.B Rd
↔ ↔ ↔

@@aa
@(d, PC)
Condition Code
@aa
@−ERn/@ERn+
@(d, ERn)
@ERn
Rn
Operation
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
0 
2
2
2
Rev. 3.00 Sep 27, 2006 page 711 of 872
REJ09B0325-0300
Appendix A Instruction Set
3. Logic instructions
No. of
States*1
 
AND.B #xx:8, Rd
B Rd8∧#xx:8 → Rd8
AND.B Rs, Rd
B Rd8∧Rs8 → Rd8
AND.W #xx:16, Rd
W Rd16∧#xx:16 → Rd16
AND.W Rs, Rd
W Rd16∧Rs16 → Rd16
AND.L #xx:32, ERd
L ERd32∧#xx:32 → ERd32
AND.L ERs, ERd
L ERd32∧ERs32 → ERd32
OR.B #xx:8, Rd
B Rd8∨#xx:8 → Rd8
OR.B Rs, Rd
B Rd8∨Rs8 → Rd8
OR.W #xx:16, Rd
W Rd16∨#xx:16 → Rd16
OR.W Rs, Rd
W Rd16∨Rs16 → Rd16
OR.L #xx:32, ERd
L ERd32∨#xx:32 → ERd32
OR.L ERs, ERd
L ERd32∨ERs32 → ERd32
XOR.B #xx:8, Rd
B Rd8⊕#xx:8 → Rd8
XOR.B Rs, Rd
B Rd8⊕Rs8 → Rd8
XOR.W #xx:16, Rd
W Rd16⊕#xx:16 → Rd16
XOR.W Rs, Rd
W Rd16⊕Rs16 → Rd16
XOR.L #xx:32, ERd
L ERd32⊕#xx:32 → ERd32 6
XOR.L ERs, ERd
L ERd32⊕ERs32 → ERd32
4
 
NOT.B Rd
B ¬ Rd8 → Rd8
2
 
NOT.W Rd
W ¬ Rd16 → Rd16
2
 
NOT.L ERd
L ¬ Rd32 → Rd32
2
 
Rev. 3.00 Sep 27, 2006 page 712 of 872
REJ09B0325-0300
2
2
 
 
4
2
 
 
6
4
 
 
2
2
 
 
4
2
 
 
6
4
 
 
2
2
 
 
4
2
 
 
Z
V
C
Advanced
N
Normal
H
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
I
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔

@@aa
@(d, PC)
Condition Code
@aa
@−ERn/@ERn+
@(d, ERn)
@ERn
Rn
Operation
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
0 
2
0 
2
0 
4
0 
2
0 
6
0 
4
0 
2
0 
2
0 
4
0 
2
0 
6
0 
4
0 
2
0 
2
0 
4
0 
2
0 
6
0 
4
0 
2
0 
2
0 
2
Appendix A Instruction Set
4. Shift instructions
L
SHAR.B Rd
B
SHAR.W Rd
W
SHAR.L ERd
L
SHLL.B Rd
B
SHLL.W Rd
W
SHLL.L ERd
L
SHLR.B Rd
B
SHLR.W Rd
W
SHLR.L ERd
L
ROTXL.B Rd
B
ROTXL.W Rd
W
ROTXL.L ERd
L
ROTXR.B Rd
B
ROTXR.W Rd
W
ROTXR.L ERd
L
ROTL.B Rd
B
ROTL.W Rd
W
ROTL.L ERd
L
ROTR.B Rd
B
ROTR.W Rd
W
ROTR.L ERd
L
0
MSB
LSB
C
MSB
LSB
C
0
MSB
LSB
0
C
MSB
LSB
C
MSB
LSB
C
MSB
LSB
C
MSB
LSB
C
MSB
LSB
Z
2
 
2
 
2
 
2
 
2
 
2
 
2
 
2
 
2
 
2
 
2
 
2
 
2
 
2
 
2
 
2
 
2
 
2
 
2
 
2
 
2
 
2
 
2
 
2
 
V
C
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Advanced
N
Normal

@@aa
@(d, PC)
@aa
@−ERn/@ERn+
@(d, ERn)
@ERn
Rn
H
↔ ↔ ↔
SHAL.L ERd
C
I
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
W
Condition Code
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
B
SHAL.W Rd
No. of
States*1
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
SHAL.B Rd
Operation
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Rev. 3.00 Sep 27, 2006 page 713 of 872
REJ09B0325-0300
Appendix A Instruction Set
5. Bit manipulation instructions
B (#xx:3 of @ERd) ← 1
BSET #xx:3, @aa:8
B (#xx:3 of @aa:8) ← 1
BSET Rn, Rd
B (Rn8 of Rd8) ← 1
BSET Rn, @ERd
B (Rn8 of @ERd) ← 1
BSET Rn, @aa:8
B (Rn8 of @aa:8) ← 1
BCLR #xx:3, Rd
B (#xx:3 of Rd8) ← 0
BCLR #xx:3, @ERd
B (#xx:3 of @ERd) ← 0
BCLR #xx:3, @aa:8
B (#xx:3 of @aa:8) ← 0
BCLR Rn, Rd
B (Rn8 of Rd8) ← 0
BCLR Rn, @ERd
B (Rn8 of @ERd) ← 0
BCLR Rn, @aa:8
B (Rn8 of @aa:8) ← 0
BNOT #xx:3, Rd
B (#xx:3 of Rd8) ←
¬ (#xx:3 of Rd8)
BNOT #xx:3, @ERd
B (#xx:3 of @ERd) ←
¬ (#xx:3 of @ERd)
BNOT #xx:3, @aa:8
B (#xx:3 of @aa:8) ←
¬ (#xx:3 of @aa:8)
BNOT Rn, Rd
B (Rn8 of Rd8) ←
¬ (Rn8 of Rd8)
BNOT Rn, @ERd
B (Rn8 of @ERd) ←
¬ (Rn8 of @ERd)
BNOT Rn, @aa:8
B (Rn8 of @aa:8) ←
¬ (Rn8 of @aa:8)
BTST #xx:3, Rd
B ¬ (#xx:3 of Rd8) → Z
BTST #xx:3, @ERd
B ¬ (#xx:3 of @ERd) → Z
BTST #xx:3, @aa:8
B ¬ (#xx:3 of @aa:8) → Z
BTST Rn, Rd
B ¬ (Rn8 of @Rd8) → Z
BTST Rn, @ERd
B ¬ (Rn8 of @ERd) → Z
BTST Rn, @aa:8
B ¬ (Rn8 of @aa:8) → Z
BLD #xx:3, Rd
B (#xx:3 of Rd8) → C
Rev. 3.00 Sep 27, 2006 page 714 of 872
REJ09B0325-0300
2
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
N
4
4
C
2
     
8
     
8
     
2
     
8
     
8
     
2
     
8
     
8
     
2
     
8
     
8
     
2
     
8
     
8
     
2
     
8
     
8
  
 
2
 
6
 
6
 
2
 
6
 
6
  
  
4
V
     
  
2
Z
Advanced
H
Normal

@@aa
I
  
4
2
@(d, PC)
@aa
@−ERn/@ERn+
@(d, ERn)
@ERn
Condition Code
  
    
↔
B (#xx:3 of Rd8) ← 1
BSET #xx:3, @ERd
No. of
States*1
↔ ↔ ↔ ↔ ↔ ↔
BSET #xx:3, Rd
Rn
Operation
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
2
Appendix A Instruction Set
BLD #xx:3, @aa:8
B (#xx:3 of @aa:8) → C
BILD #xx:3, Rd
B ¬ (#xx:3 of Rd8) → C
BILD #xx:3, @ERd
B ¬ (#xx:3 of @ERd) → C
BILD #xx:3, @aa:8
B ¬ (#xx:3 of @aa:8) → C
BST #xx:3, Rd
B C → (#xx:3 of Rd8)
BST #xx:3, @ERd
B C → (#xx:3 of @ERd24)
BST #xx:3, @aa:8
B C → (#xx:3 of @aa:8)
BIST #xx:3, Rd
B ¬ C → (#xx:3 of Rd8)
BIST #xx:3, @ERd
B ¬ C → (#xx:3 of @ERd24)
BIST #xx:3, @aa:8
B ¬ C → (#xx:3 of @aa:8)
BAND #xx:3, Rd
B C∧(#xx:3 of Rd8) → C
BAND #xx:3, @ERd
B C∧(#xx:3 of @ERd24) → C
BAND #xx:3, @aa:8
B C∧(#xx:3 of @aa:8) → C
BIAND #xx:3, Rd
B C∧ ¬ (#xx:3 of Rd8) → C
BIAND #xx:3, @ERd
B C∧ ¬ (#xx:3 of @ERd24) → C
BIAND #xx:3, @aa:8
B C∧ ¬ (#xx:3 of @aa:8) → C
BOR #xx:3, Rd
B C∨(#xx:3 of Rd8) → C
BOR #xx:3, @ERd
B C∨(#xx:3 of @ERd24) → C
BOR #xx:3, @aa:8
B C∨(#xx:3 of @aa:8) → C
BIOR #xx:3, Rd
B C∨ ¬ (#xx:3 of Rd8) → C
BIOR #xx:3, @ERd
B C∨ ¬ (#xx:3 of @ERd24) → C
BIOR #xx:3, @aa:8
B C∨ ¬ (#xx:3 of @aa:8) → C
BXOR #xx:3, Rd
B C⊕(#xx:3 of Rd8) → C
BXOR #xx:3, @ERd
B C⊕(#xx:3 of @ERd24) → C
BXOR #xx:3, @aa:8
B C⊕(#xx:3 of @aa:8) → C
BIXOR #xx:3, Rd
B C⊕ ¬ (#xx:3 of Rd8) → C
BIXOR #xx:3, @ERd
B C⊕ ¬ (#xx:3 of @ERd24) → C
BIXOR #xx:3, @aa:8
B C⊕ ¬ (#xx:3 of @aa:8) → C
4
4
I
H
N
Z
C
6
     
2
     
8
     
8
     
2
     
8
     
8
    
2
    
    
2
    
4
4
2
4
4
2
4
4
2
    
    
4
4
    
    
2
    
4
4
    
    
2
    
4
4
    
    
2
    
4
4
    
    
2
    
4
4
    
    
2
    
4
4
Advanced
V
    
Normal

@@aa
@(d, PC)
@aa
@−ERn/@ERn+
@(d, ERn)
@ERn
Condition Code
↔ ↔ ↔ ↔ ↔
B (#xx:3 of @ERd) → C
No. of
States*1
    
↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔ ↔
BLD #xx:3, @ERd
Rn
Operation
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
6
2
6
6
6
6
2
6
6
2
6
6
2
6
6
2
6
6
2
6
6
Rev. 3.00 Sep 27, 2006 page 715 of 872
REJ09B0325-0300
Appendix A Instruction Set
6. Branching instructions
BRA d:8 (BT d:8)
BRN d:16 (BF d:16)
— If condition Always
— is true then
PC ← PC+d
Never
—
else next;
—
BHI d:8
—
BHI d:16
—
BLS d:8
—
BLS d:16
—
BCC d:8 (BHS d:8)
—
BCC d:16 (BHS d:16)
—
BCS d:8 (BLO d:8)
—
BCS d:16 (BLO d:16)
—
BNE d:8
—
BNE d:16
—
BEQ d:8
—
BEQ d:16
—
BVC d:8
—
BVC d:16
—
BVS d:8
—
BVS d:16
—
BPL d:8
—
BPL d:16
—
BMI d:8
—
BMI d:16
—
BGE d:8
—
BGE d:16
—
BLT d:8
—
BLT d:16
—
BGT d:8
—
BGT d:16
—
BLE d:8
—
BLE d:16
—
BRA d:16 (BT d:16)
BRN d:8 (BF d:8)
C∨Z=0
C∨Z=1
C=0
C=1
Z=0
Z=1
V=0
V=1
N=0
N=1
N⊕V = 0
N⊕V = 1
Z ∨ (N⊕V) = 0
Z ∨ (N⊕V) = 1
Rev. 3.00 Sep 27, 2006 page 716 of 872
REJ09B0325-0300
No. of
States*1
H
N
Z
V
C
Advanced
I
Normal

@@aa
@(d, PC)
Condition Code
@aa
@−ERn/@ERn+
@(d, ERn)
@ERn
Branch
Condition
Rn
Operation
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
2
     
4
4
     
6
2
     
4
4
     
6
2
     
4
4
     
6
2
     
4
4
     
6
2
     
4
4
     
6
2
     
4
4
     
6
2
     
4
4
     
6
2
     
4
4
     
6
2
     
4
4
     
6
2
     
4
4
     
6
2
     
4
4
     
6
2
     
4
4
     
6
2
     
4
4
     
6
2
     
4
4
     
6
2
     
4
4
     
6
2
     
4
4
     
6
Appendix A Instruction Set
JMP @ERn
— PC ← ERn
JMP @aa:24
— PC ← aa:24
JMP @@aa:8
— PC ← @aa:8
BSR d:8
— PC → @−SP
PC ← PC+d:8
BSR d:16
— PC → @−SP
PC ← PC+d:16
JSR @ERn
— PC → @−SP
PC ← @ERn
JSR @aa:24
— PC → @−SP
PC ← @aa:24
JSR @@aa:8
— PC → @−SP
PC ← @aa:8
RTS
— PC ← @SP+
No. of
States*1
H
N
Z
V
C
     
2
4
     
4
Advanced
I
Normal

@@aa
@(d, PC)
Condition Code
@aa
@−ERn/@ERn+
@(d, ERn)
@ERn
Rn
Operation
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
6
     
8
10
2
     
6
8
4
     
8
10
     
6
8
     
8
10
     
8
12
2      
8
10
2
2
4
2
Rev. 3.00 Sep 27, 2006 page 717 of 872
REJ09B0325-0300
Appendix A Instruction Set
7. System control instructions
No. of
States*1
B #xx:8 → CCR
LDC Rs, CCR
B Rs8 → CCR
LDC @ERs, CCR
W @ERs → CCR
LDC @(d:16, ERs), CCR
W @(d:16, ERs) → CCR
6
LDC @(d:24, ERs), CCR
W @(d:24, ERs) → CCR
10
LDC @ERs+, CCR
W @ERs → CCR,
ERs32+2 → ERs32
LDC @aa:16, CCR
W @aa:16 → CCR
6
LDC @aa:24, CCR
W @aa:24 → CCR
8

@@aa
Advanced
LDC #xx:8, CCR
Normal
 Transition to powerdown state
↔ ↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔ ↔
↔ ↔ ↔ ↔ ↔ ↔
↔ ↔
↔ ↔
↔ ↔
↔ ↔
4
2
↔ ↔
↔
4
     
↔ ↔ ↔ ↔ ↔ ↔
2
C
10
↔ ↔
2
V
↔
SLEEP
16
Z
↔
 CCR ← @SP+,
PC ← @SP+
1      14
N
↔
RTE
2
H
↔
 PC → @−SP,
CCR → @−SP,
<vector> → PC
I
↔
TRAPA #x:2
@(d, PC)
Condition Code
@aa
@−ERn/@ERn+
@(d, ERn)
@ERn
Rn
Operation
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
10
     
2
2
2
6
8
12
8
8
STC CCR, Rd
B CCR → Rd8
STC CCR, @ERd
W CCR → @ERd
STC CCR, @(d:16, ERd)
W CCR → @(d:16, ERd)
6
     
8
STC CCR, @(d:24, ERd)
W CCR → @(d:24, ERd)
10
     
12
STC CCR, @–ERd
W ERd32−2 → ERd32,
CCR → @ERd
     
8
STC CCR, @aa:16
W CCR → @aa:16
6
     
8
STC CCR, @aa:24
W CCR → @aa:24
8
     
10
ANDC #xx:8, CCR
B CCR∧#xx:8 → CCR
2
ORC #xx:8, CCR
B CCR∨#xx:8 → CCR
2
XORC #xx:8, CCR
B CCR⊕#xx:8 → CCR
2
NOP
 PC ← PC+2
Rev. 3.00 Sep 27, 2006 page 718 of 872
REJ09B0325-0300
↔ ↔ ↔
↔ ↔ ↔
↔ ↔ ↔
6
↔ ↔ ↔
4
     
↔ ↔ ↔
4
↔ ↔ ↔
2
2
2      
2
2
2
Appendix A Instruction Set
8. Block transfer instructions
No. of
States*1
H
N
Z
V
C
EEPMOV. B
 if R4L ≠ 0 then
repeat @R5 → @R6
R5+1 → R5
R6+1 → R6
R4L−1 → R4L
until
R4L=0
else next
4       8+
4n*2
EEPMOV. W
 if R4 ≠ 0 then
repeat @R5 → @R6
R5+1 → R5
R6+1 → R6
R4−1 → R4
until
R4=0
else next
4       8+
4n*2
Advanced
I
Normal

@@aa
@(d, PC)
Condition Code
@aa
@−ERn/@ERn+
@(d, ERn)
@ERn
Rn
Operation
#xx
Mnemonic
Operand Size
Addressing Mode and
Instruction Length (bytes)
Notes: 1. The number of states is the number of states required for execution when the
instruction and its operands are located in on-chip memory. For other cases see
section A.3, Number of States Required for Execution.
2. n is the value set in register R4L or R4.
(1) Set to 1 when a carry or borrow occurs at bit 11; otherwise cleared to 0.
(2) Set to 1 when a carry or borrow occurs at bit 27; otherwise cleared to 0.
(3) Retains its previous value when the result is zero; otherwise cleared to 0.
(4) Set to 1 when the adjustment produces a carry; otherwise retains its previous value.
(5) The number of states required for execution of an instruction that transfers data in
synchronization with the E clock is variable.
(6) Set to 1 when the divisor is negative; otherwise cleared to 0.
(7) Set to 1 when the divisor is zero; otherwise cleared to 0.
(8) Set to 1 when the quotient is negative; otherwise cleared to 0.
Rev. 3.00 Sep 27, 2006 page 719 of 872
REJ09B0325-0300
Rev. 3.00 Sep 27, 2006 page 720 of 872
REJ09B0325-0300
MULXU
5
STC
LDC
3
SUBX
OR
XOR
AND
MOV
C
D
E
F
BILD
BIST
BLD
BST
TRAPA
BEQ
B
BIAND
BAND
AND
RTE
BNE
CMP
BIXOR
BXOR
XOR
BSR
BCS
A
BIOR
BOR
OR
RTS
BCC
MOV.B
Table A.2
(2)
LDC
7
ADDX
BTST
DIVXU
BLS
AND.B
ANDC
6
9
BCLR
MULXU
BHI
XOR.B
XORC
5
ADD
BNOT
DIVXU
BRN
OR.B
ORC
4
8
7
BSET
BRA
6
2
1
Table A.2
(2)
Table A.2 Table A.2 Table A.2 Table A.2
(2)
(2)
(2)
(2)
NOP
4
3
2
1
0
0
MOV
BVS
9
A
B
JMP
BPL
BMI
MOV
Table A.2 Table A.2
(2)
(2)
Table A.2 Table A.2
(2)
(2)
Table A.2 Table A.2
EEPMOV
(2)
(2)
SUB
ADD
Table A.2
(2)
BVC
8
BSR
BGE
C
CMP
MOV
Instruction when most significant bit of BH is 1.
Instruction when most significant bit of BH is 0.
E
JSR
BGT
SUBX
ADDX
Table A.2
(3)
BLT
D
F
BLE
Table A.2
(2)
Table A.2
(2)
Table A.2
AL
1st byte 2nd byte
AH AL BH BL
A.2
AH
Instruction code:
Appendix A Instruction Set
Operation Code Map
Operation Code Map
SUBS
DAS
BRA
MOV
MOV
1B
1F
58
79
7A
CMP
CMP
ADD
ADD
2
BHI
1
SUB
SUB
BLS
OR
OR
XOR
XOR
BCS
AND
AND
BEQ
BVC
SUBS
9
BVS
NEG
NOT
DEC
ROTR
ROTXR
DEC
ROTL
ADDS
SLEEP
8
ROTXL
EXTU
INC
7
SHAR
BNE
6
SHLR
EXTU
INC
5
SHAL
BCC
LDC/STC
4
SHLL
3
1st byte 2nd byte
AH AL BH BL
BRN
NOT
17
DEC
ROTXR
13
1A
ROTXL
12
DAA
0F
SHLR
ADDS
0B
11
INC
0A
SHLL
MOV
01
10
0
BH
AH AL
Instruction code:
BPL
A
MOV
BMI
NEG
CMP
SUB
ROTR
ROTL
SHAR
C
D
BGE
BLT
DEC
EXTS
INC
Table A.2 Table A.2
(3)
(3)
ADD
SHAL
B
BGT
E
BLE
DEC
EXTS
INC
Table A.2
(3)
F
Appendix A Instruction Set
Rev. 3.00 Sep 27, 2006 page 721 of 872
REJ09B0325-0300
CL
Rev. 3.00 Sep 27, 2006 page 722 of 872
REJ09B0325-0300
DIVXS
3
BSET
7Faa7 *2
BNOT
BNOT
BCLR
BCLR
Notes: 1. r is the register designation field.
2. aa is the absolute address field.
BSET
7Faa6 *2
BTST
BCLR
7Eaa7 *2
BNOT
BTST
BSET
7Dr07 *1
7Eaa6 *2
BSET
7Dr06 *1
BTST
BCLR
MULXS
2
7Cr07 *1
BNOT
DIVXS
1
BTST
MULXS
0
BIOR
BOR
BIOR
BOR
OR
4
BIXOR
BXOR
BIXOR
BXOR
XOR
5
BIAND
BAND
BIAND
BAND
AND
6
7
BIST
BILD
BST
BLD
BIST
BILD
BST
BLD
1st byte 2nd byte 3rd byte 4th byte
AH AL BH BL CH CL DH DL
7Cr06 *1
01F06
01D05
01C05
01406
AH
ALBH
BLCH
Instruction code:
8
LDC
STC
9
A
LDC
STC
B
C
LDC
STC
D
E
LDC
STC
F
Instruction when most significant bit of DH is 1.
Instruction when most significant bit of DH is 0.
Appendix A Instruction Set
Appendix A Instruction Set
A.3
Number of States Required for Execution
The tables in this section can be used to calculate the number of states required for instruction
execution by the H8/300H CPU. Table A.4 indicates the number of instruction fetch, data
read/write, and other cycles occurring in each instruction. Table A.3 indicates the number of states
required per cycle according to the bus size. The number of states required for execution of an
instruction can be calculated from these two tables as follows:
Number of states = I × SI + J × SJ + K × SK + L × SL + M × SM + N × SN
Examples of Calculation of Number of States Required for Execution
Examples: Advanced mode, stack located in external address space, on-chip supporting modules
accessed with 8-bit bus width, external devices accessed in three states with one wait state and
16-bit bus width.
BSET #0, @FFFFC7:8
From table A.4,
I = L = 2 and J = K = M = N = 0
From table A.3,
SI = 4 and SL = 3
Number of states = 2 × 4 + 2 × 3 = 14
JSR @@30
From table A.4,
I = J = K = 2 and L = M = N = 0
From table A.3,
SI = SJ = SK = 4
Number of states = 2 × 4 + 2 × 4 + 2 × 4 = 24
Rev. 3.00 Sep 27, 2006 page 723 of 872
REJ09B0325-0300
Appendix A Instruction Set
Table A.3
Number of States per Cycle
Access Conditions
On-Chip
Supporting
Module
Cycle
Instruction fetch
SI
Branch address read
SJ
Stack operation
SK
Byte data access
SL
Word data access
SM
Internal operation
SN
External Device
8-Bit Bus
16-Bit Bus
On-Chip
Memory
8-Bit
Bus
16-Bit
Bus
2-State
Access
3-State
Access
2-State
Access
3-State
Access
2
6
3
4
6 + 2m
2
3+m
2
3+m
1
1
3
6
1
1
1
4
6 + 2m
1
1
Legend:
m: Number of wait states inserted into external device access
Rev. 3.00 Sep 27, 2006 page 724 of 872
REJ09B0325-0300
Appendix A Instruction Set
Table A.4
Number of Cycles per Instruction
Instruction Mnemonic
Instruction Branch
Stack
Byte Data Word Data Internal
Fetch
Addr. Read Operation Access
Access
Operation
I
J
K
L
M
N
ADD
ADD.B #xx:8, Rd
1
ADD.B Rs, Rd
1
ADD.W #xx:16, Rd
2
ADD.W Rs, Rd
1
ADD.L #xx:32, ERd
3
ADD.L ERs, ERd
1
ADDS
ADDS #1/2/4, ERd
1
ADDX
ADDX #xx:8, Rd
1
AND
ADDX Rs, Rd
1
AND.B #xx:8, Rd
1
AND.B Rs, Rd
1
AND.W #xx:16, Rd
2
AND.W Rs, Rd
1
AND.L #xx:32, ERd
3
AND.L ERs, ERd
2
ANDC
ANDC #xx:8, CCR
1
BAND
BAND #xx:3, Rd
1
Bcc
BAND #xx:3, @ERd
2
1
BAND #xx:3, @aa:8
2
1
BRA d:8 (BT d:8)
2
BRN d:8 (BF d:8)
2
BHI d:8
2
BLS d:8
2
BCC d:8 (BHS d:8)
2
BCS d:8 (BLO d:8)
2
BNE d:8
2
BEQ d:8
2
BVC d:8
2
BVS d:8
2
BPL d:8
2
BMI d:8
2
Rev. 3.00 Sep 27, 2006 page 725 of 872
REJ09B0325-0300
Appendix A Instruction Set
Instruction Mnemonic
Instruction Branch
Stack
Byte Data Word Data Internal
Fetch
Addr. Read Operation Access
Access
Operation
I
J
K
L
M
N
Bcc
BCLR
BIAND
BILD
BGE d:8
2
BLT d:8
2
BGT d:8
2
BLE d:8
2
BRA d:16 (BT d:16)
2
2
BRN d:16 (BF d:16)
2
2
BHI d:16
2
2
BLS d:16
2
2
BCC d:16 (BHS d:16)
2
2
BCS d:16 (BLO d:16)
2
2
BNE d:16
2
2
BEQ d:16
2
2
BVC d:16
2
2
BVS d:16
2
2
BPL d:16
2
2
BMI d:16
2
2
BGE d:16
2
2
BLT d:16
2
2
BGT d:16
2
2
BLE d:16
2
2
BCLR #xx:3, Rd
1
BCLR #xx:3, @ERd
2
2
BCLR #xx:3, @aa:8
2
2
BCLR Rn, Rd
1
BCLR Rn, @ERd
2
2
BCLR Rn, @aa:8
2
2
BIAND #xx:3, Rd
1
BIAND #xx:3, @ERd
2
1
1
BIAND #xx:3, @aa:8
2
BILD #xx:3, Rd
1
BILD #xx:3, @ERd
2
1
BILD #xx:3, @aa:8
2
1
Rev. 3.00 Sep 27, 2006 page 726 of 872
REJ09B0325-0300
Appendix A Instruction Set
Instruction Branch
Stack
Byte Data Word Data Internal
Fetch
Addr. Read Operation Access
Access
Operation
I
J
K
L
M
N
Instruction Mnemonic
BIOR
BIST
BIXOR
BLD
BNOT
BOR
BSET
BIOR #xx:8, Rd
1
BIOR #xx:8, @ERd
2
1
1
BIOR #xx:8, @aa:8
2
BIST #xx:3, Rd
1
BIST #xx:3, @ERd
2
2
BIST #xx:3, @aa:8
2
2
BIXOR #xx:3, Rd
1
BIXOR #xx:3, @ERd
2
1
BIXOR #xx:3, @aa:8
2
1
BLD #xx:3, Rd
1
BLD #xx:3, @ERd
2
1
BLD #xx:3, @aa:8
2
1
BNOT #xx:3, Rd
1
BNOT #xx:3, @ERd
2
2
BNOT #xx:3, @aa:8
2
2
BNOT Rn, Rd
1
BNOT Rn, @ERd
2
2
BNOT Rn, @aa:8
2
2
BOR #xx:3, Rd
1
BOR #xx:3, @ERd
2
1
BOR #xx:3, @aa:8
2
1
BSET #xx:3, Rd
1
BSET #xx:3, @ERd
2
2
BSET #xx:3, @aa:8
2
2
BSET Rn, Rd
1
BSET Rn, @ERd
2
BSET Rn, @aa:8
BSR
BSR d:8
BSR d:16
2
2
2
1
Normal*
2
1
Advanced
2
2
1
Normal*
2
1
2
Advanced
2
2
2
Rev. 3.00 Sep 27, 2006 page 727 of 872
REJ09B0325-0300
Appendix A Instruction Set
Instruction Mnemonic
BST
BTST
BXOR
CMP
Instruction Branch
Stack
Byte Data Word Data Internal
Fetch
Addr. Read Operation Access
Access
Operation
I
J
K
L
M
N
BST #xx:3, Rd
1
BST #xx:3, @ERd
2
2
2
BST #xx:3, @aa:8
2
BTST #xx:3, Rd
1
BTST #xx:3, @ERd
2
1
BTST #xx:3, @aa:8
2
1
BTST Rn, Rd
1
BTST Rn, @ERd
2
1
BTST Rn, @aa:8
2
1
BXOR #xx:3, Rd
1
BXOR #xx:3, @ERd
2
1
BXOR #xx:3, @aa:8
2
1
CMP.B #xx:8, Rd
1
CMP.B Rs, Rd
1
CMP.W #xx:16, Rd
2
CMP.W Rs, Rd
1
CMP.L #xx:32, ERd
3
CMP.L ERs, ERd
1
DAA
DAA Rd
1
DAS
DAS Rd
1
DEC
DIVXS
DIVXU
EEPMOV
EXTS
EXTU
DEC.B Rd
1
DEC.W #1/2, Rd
1
DEC.L #1/2, ERd
1
DIVXS.B Rs, Rd
2
12
DIVXS.W Rs, ERd
2
20
DIVXU.B Rs, Rd
1
12
DIVXU.W Rs, ERd
1
20
EEPMOV.B
2
2
2n + 2*
EEPMOV.W
2
2n + 2*
EXTS.W Rd
1
EXTS.L ERd
1
EXTU.W Rd
1
EXTU.L ERd
1
Rev. 3.00 Sep 27, 2006 page 728 of 872
REJ09B0325-0300
2
Appendix A Instruction Set
Instruction Branch
Stack
Byte Data Word Data Internal
Fetch
Addr. Read Operation Access
Access
Operation
I
J
K
L
M
N
Instruction Mnemonic
INC
JMP
INC.B Rd
1
INC.W #1/2, Rd
1
INC.L #1/2, ERd
1
JMP @ERn
2
JMP @aa:24
2
JMP @@aa:8 Normal*
JSR
1
2
2
Advanced
2
Normal*
2
Advanced
2
2
JSR @aa:24
Normal*
2
1
2
2
2
2
1
1
1
JSR @@aa:8 Normal*
Advanced
MOV
1
JSR @ERn
Advanced
LDC
2
2
2
1
2
1
1
2
2
2
LDC #xx:8, CCR
1
LDC Rs, CCR
1
LDC @ERs, CCR
2
1
LDC @(d:16, ERs), CCR
3
1
LDC @(d:24, ERs), CCR
5
1
LDC @ERs+, CCR
2
1
LDC @aa:16, CCR
3
1
LDC @aa:24, CCR
4
1
MOV.B #xx:8, Rd
1
MOV.B Rs, Rd
1
MOV.B @ERs, Rd
1
1
MOV.B @(d:16, ERs), Rd
2
1
MOV.B @(d:24, ERs), Rd
4
1
MOV.B @ERs+, Rd
1
1
MOV.B @aa:8, Rd
1
1
MOV.B @aa:16, Rd
2
1
MOV.B @aa:24, Rd
3
1
MOV.B Rs, @ERd
1
1
MOV.B Rs, @(d:16, ERd)
2
1
2
2
Rev. 3.00 Sep 27, 2006 page 729 of 872
REJ09B0325-0300
Appendix A Instruction Set
Instruction Mnemonic
MOV
Instruction Branch
Stack
Byte Data Word Data Internal
Fetch
Addr. Read Operation Access
Access
Operation
I
J
K
L
M
N
MOV.B Rs, @(d:24, ERd)
4
1
MOV.B Rs, @–ERd
1
1
2
MOV.B Rs, @aa:8
1
1
MOV.B Rs, @aa:16
2
1
MOV.B Rs, @aa:24
3
1
MOV.W #xx:16, Rd
2
MOV.W Rs, Rd
1
MOV.W @ERs, Rd
1
1
MOV.W @(d:16, ERs), Rd 2
1
MOV.W @(d:24, ERs), Rd 4
1
MOV.W @ERs+, Rd
1
1
MOV.W @aa:16, Rd
2
1
MOV.W @aa:24, Rd
3
1
MOV.W Rs, @ERd
1
1
MOV.W Rs, @(d:16, ERd) 2
1
MOV.W Rs, @(d:24, ERd) 4
1
MOV.W Rs, @–ERd
1
1
MOV.W Rs, @aa:16
2
1
MOV.W Rs, @aa:24
3
1
MOV.L #xx:32, ERd
3
MOV.L ERs, ERd
1
MOV.L @ERs, ERd
2
2
MOV.L @(d:16, ERs), ERd 3
2
MOV.L @(d:24, ERs), ERd 5
2
MOV.L @ERs+, ERd
2
2
MOV.L @aa:16, ERd
3
2
MOV.L @aa:24, ERd
4
2
MOV.L ERs, @ERd
2
2
MOV.L ERs, @(d:16, ERd) 3
2
MOV.L ERs, @(d:24, ERd) 5
2
MOV.L ERs, @–ERd
2
2
MOV.L ERs, @aa:16
3
2
MOV.L ERs, @aa:24
4
2
Rev. 3.00 Sep 27, 2006 page 730 of 872
REJ09B0325-0300
2
2
2
2
Appendix A Instruction Set
Instruction Branch
Stack
Byte Data Word Data Internal
Fetch
Addr. Read Operation Access
Access
Operation
I
J
K
L
M
N
Instruction Mnemonic
MOVFPE
1
MOVFPE @aa:16, Rd*
2
1
MOVTPE
MOVTPE Rs, @aa:16*
2
1
MULXS
MULXU
NEG
NOP
NOT
OR
1
MULXS.B Rs, Rd
2
12
MULXS.W Rs, ERd
2
20
MULXU.B Rs, Rd
1
12
MULXU.W Rs, ERd
1
20
NEG.B Rd
1
NEG.W Rd
1
NEG.L ERd
1
NOP
1
NOT.B Rd
1
NOT.W Rd
1
NOT.L ERd
1
OR.B #xx:8, Rd
1
OR.B Rs, Rd
1
OR.W #xx:16, Rd
2
OR.W Rs, Rd
1
OR.L #xx:32, ERd
3
OR.L ERs, ERd
2
ORC
ORC #xx:8, CCR
1
POP
POP.W Rn
1
1
2
POP.L ERn
2
2
2
PUSH.W Rn
1
1
2
PUSH.L ERn
2
2
2
ROTL.B Rd
1
ROTL.W Rd
1
ROTL.L ERd
1
PUSH
ROTL
ROTR
ROTXL
ROTR.B Rd
1
ROTR.W Rd
1
ROTR.L ERd
1
ROTXL.B Rd
1
ROTXL.W Rd
1
ROTXL.L ERd
1
Rev. 3.00 Sep 27, 2006 page 731 of 872
REJ09B0325-0300
Appendix A Instruction Set
Instruction Branch
Stack
Byte Data Word Data Internal
Fetch
Addr. Read Operation Access
Access
Operation
I
J
K
L
M
N
Instruction Mnemonic
ROTXR
RTE
RTS
SHAL
SHAR
SHLL
SHLR
SLEEP
STC
SUB
SUBS
ROTXR.B Rd
1
ROTXR.W Rd
1
ROTXR.L ERd
1
RTE
RTS
2
2
2
1
Normal*
2
1
2
Advanced
2
2
2
SHAL.B Rd
1
SHAL.W Rd
1
SHAL.L ERd
1
SHAR.B Rd
1
SHAR.W Rd
1
SHAR.L ERd
1
SHLL.B Rd
1
SHLL.W Rd
1
SHLL.L ERd
1
SHLR.B Rd
1
SHLR.W Rd
1
SHLR.L ERd
1
SLEEP
1
STC CCR, Rd
1
STC CCR, @ERd
2
1
STC CCR, @(d:16, ERd)
3
1
STC CCR, @(d:24, ERd)
5
1
STC CCR, @–ERd
2
1
STC CCR, @aa:16
3
1
STC CCR, @aa:24
4
1
SUB.B Rs, Rd
1
SUB.W #xx:16, Rd
2
SUB.W Rs, Rd
1
SUB.L #xx:32, ERd
3
SUB.L ERs, ERd
1
SUBS #1/2/4, ERd
1
Rev. 3.00 Sep 27, 2006 page 732 of 872
REJ09B0325-0300
2
Appendix A Instruction Set
Instruction Branch
Stack
Byte Data Word Data Internal
Fetch
Addr. Read Operation Access
Access
Operation
I
J
K
L
M
N
Instruction Mnemonic
SUBX
TRAPA
SUBX #xx:8, Rd
1
SUBX Rs, Rd
1
1
TRAPA #x:2 Normal*
Advanced
XOR
XORC
2
1
2
4
2
2
2
4
XOR.B #xx:8, Rd
1
XOR.B Rs, Rd
1
XOR.W #xx:16, Rd
2
XOR.W Rs, Rd
1
XOR.L #xx:32, ERd
3
XOR.L ERs, ERd
2
XORC #xx:8, CCR
1
Notes: 1. Not available in the H8/3048B Group.
2. n is the value set in register R4L or R4. The source and destination are accessed n + 1
times each.
Rev. 3.00 Sep 27, 2006 page 733 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
Appendix B Internal I/O Register
Table B.1
Comparison of H8/3048 Group and H8/3048B Group Internal I/O Register
Specifications
Address H8/3048
(Low)
ZTAT
H8/3048 Mask ROM Version,
H8/3047 Mask ROM Version,
H8/3048F
H8/3045 Mask ROM Version,
H8/3044 Mask ROM Version
H8/3048
F-ONE
H8/3048B
Mask
ROM
Version
H'FF40
—
—
FLMCR
FLMCR1
—
H'FF41
—
—
—
FLMCR2
—
H'FF42
—
—
EBR1
EBR
—
H'FF43
—
—
EBR2
—
—
H'FF47
—
—
—
RAMCR
—
H'FF48
—
—
RAMCR
—
—
Module
Flash
memory
Note: A dash (“—”) indicates that access is prohibited. Normal operation is not guaranteed if
these addresses are accessed.
Rev. 3.00 Sep 27, 2006 page 734 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
B.1
Addresses (For H8/3048F-ONE, H8/3048B Mask ROM Version)
Address Register
(low)
Name
H'1C
Data
Bus
Width Bit 7
Bit Names
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
Reserved area (access prohibited)
H'1D
H'1E
H'1F
H'20
MAR0AR
8
H'21
MAR0AE
8
H'22
MAR0AH
8
H'23
MAR0AL
8
H'24
ETCR0AH
8
H'25
ETCR0AL
8
H'26
IOAR0A
8
H'27
DTCR0A
8
H'28
MAR0BR
8
H'29
MAR0BE
8
H'2A
MAR0BH
8
H'2B
MAR0BL
8
H'2C
ETCR0BH
8
H'2D
ETCR0BL
8
H'2E
IOAR0B
8
H'2F
DTCR0B
8
DMAC
channel 0A
DTE
DTSZ
DTID
RPE
DTIE
DTS2
DTS1
DTS0
Short
address
mode
DTE
DTSZ
SAID
SAIDE
DTIE
DTS2A
DTS1A
DTS0A
Full
address
mode
DMAC
channel 0B
DTE
DTSZ
DTID
RPE
DTIE
DTS2
DTS1
DTS0
Short
address
mode
DTME
—
DAID
DAIDE
TMS
DTS2B
DTS1B
DTS0B
Full
address
mode
Rev. 3.00 Sep 27, 2006 page 735 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
Address Register
(low)
Name
Data
Bus
Width Bit 7
H'30
MAR1AR
8
H'31
MAR1AE
8
H'32
MAR1AH
8
H'33
MAR1AL
8
H'34
ETCR1AH
8
H'35
ETCR1AL
8
H'36
IOAR1A
8
H'37
DTCR1A
8
H'38
MAR1BR
8
H'39
MAR1BE
8
H'3A
MAR1BH
8
H'3B
MAR1BL
8
H'3C
ETCR1BH
8
H'3D
ETCR1BL
8
H'3E
IOAR1B
8
H'3F
DTCR1B
8
Bit Names
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
DMAC
channel 1A
DTE
DTSZ
DTID
RPE
DTIE
DTS2
DTS1
DTS0
Short
address
mode
DTE
DTSZ
SAID
SAIDE
DTIE
DTS2A
DTS1A
DTS0A
Full
address
mode
DMAC
channel 1B
DTE
DTSZ
DTID
RPE
DTIE
DTS2
DTS1
DTS0
Short
address
mode
DTME
—
DAID
DAIDE
TMS
DTS2B
DTS1B
DTS0B
Full
address
mode
Flash
memory
H'40
FLMCR1*4 8
FWE
SWE
ESU
PSU
EV
PV
E
P
H'41
FLMCR2*4 8
FLER
—*3
—*3
—*3
—*3
—*3
—*3
—*3
H'42
EBR*4
EB7
EB6
EB5
EB4
EB3
EB2
EB1
EB0
H'43
Reserved area (access prohibited)
—
—
RAMS
RAM2
RAM1
—
8
H'44
H'45
H'46
H'47
RAMCR*4
H'48
Reserved area (access prohibited)
8
Module
Name
—
—
H'49
H'4A
H'4B
H'4C
H'4D
H'4E
H'4F
Rev. 3.00 Sep 27, 2006 page 736 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
Address Register
(low)
Name
H'50
Data
Bus
Width Bit 7
Bit Names
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
D/A converter
Reserved area (access prohibited)
H'51
H'52
H'53
H'54
H'55
H'56
H'57
H'58
H'59
H'5A
H'5B
H'5C
DASTCR
8
—
—
—
—
—
—
—
DASTE
H'5D
DIVCR
8
—
—
—
—
—
—
DIV1
DIV0
H'5E
MSTCR
8
PSTOP
—
System
MSTOP5 MSTOP4 MSTOP3 MSTOP2 MSTOP1 MSTOP0 control
H'5F
CSCR
8
CS7E
CS6E
CS5E
CS4E
—
—
—
—
Bus controller
H'60
TSTR
8
—
—
—
STR4
STR3
STR2
STR1
STR0
H'61
TSNC
8
—
—
—
SYNC4
SYNC3
SYNC2
SYNC1
SYNC0
ITU
(all channels)
H'62
TMDR
8
—
MDF
FDIR
PWM4
PWM3
PWM2
PWM1
PWM0
H'63
TFCR
8
—
—
CMD1
CMD0
BFB4
BFA4
BFB3
BFA3
H'64
TCR0
8
—
CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
H'65
TIOR0
8
—
IOB2
IOB1
IOB0
—
IOA2
IOA1
IOA0
H'66
TIER0
8
—
—
—
—
—
OVIE
IMIEB
IMIEA
H'67
TSR0
8
—
—
—
—
—
OVF
IMFB
IMFA
H'68
TCNT0H
16
H'69
TCNT0L
H'6A
GRA0H
H'6B
GRA0L
H'6C
GRB0H
H'6D
GRB0L
ITU
channel 0
16
16
H'6E
TCR1
8
—
CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
H'6F
TIOR1
8
—
IOB2
IOB1
IOB0
—
IOA2
IOA1
IOA0
ITU
channel 1
Rev. 3.00 Sep 27, 2006 page 737 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
Address Register
(low)
Name
Data
Bus
Width Bit 7
Bit Names
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
ITU channel 1
H'70
TIER1
8
—
—
—
—
—
OVIE
IMIEB
IMIEA
H'71
TSR1
8
—
—
—
—
—
OVF
IMFB
IMFA
H'72
TCNT1H
16
H'73
TCNT1L
H'74
GRA1H
H'75
GRA1L
H'76
GRB1H
H'77
GRB1L
16
16
H'78
TCR2
8
—
CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
H'79
TIOR2
8
—
IOB2
IOB1
IOB0
—
IOA2
IOA1
IOA0
H'7A
TIER2
8
—
—
—
—
—
OVIE
IMIEB
IMIEA
H'7B
TSR2
8
—
—
—
—
—
OVF
IMFB
IMFA
H'7C
TCNT2H
16
H'7D
TCNT2L
H'7E
GRA2H
H'7F
GRA2L
H'80
GRB2H
H'81
GRB2L
ITU channel 2
16
16
H'82
TCR3
8
—
CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
H'83
TIOR3
8
—
IOB2
IOB1
IOB0
—
IOA2
IOA1
IOA0
H'84
TIER3
8
—
—
—
—
—
OVIE
IMIEB
IMIEA
H'85
TSR3
8
—
—
—
—
—
OVF
IMFB
IMFA
H'86
TCNT3H
16
H'87
TCNT3L
H'88
GRA3H
H'89
GRA3L
H'8A
GRB3H
H'8B
GRB3L
H'8C
BRA3H
H'8D
BRA3L
H'8E
BRB3H
H'8F
BRB3L
16
16
16
16
Rev. 3.00 Sep 27, 2006 page 738 of 872
REJ09B0325-0300
ITU channel 3
Appendix B Internal I/O Register
Address Register
(low)
Name
Data
Bus
Width Bit 7
Bit Names
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
H'90
TOER
8
—
—
EXB4
EXA4
EB3
EB4
EA4
EA3
H'91
TOCR
8
—
—
—
XTGD
—
—
OLS4
OLS3
ITU (all
channels)
ITU channel 4
H'92
TCR4
8
—
CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
H'93
TIOR4
8
—
IOB2
IOB1
IOB0
—
IOA2
IOA1
IOA0
H'94
TIER4
8
—
—
—
—
—
OVIE
IMIEB
IMIEA
H'95
TSR4
8
—
—
—
—
—
OVF
IMFB
IMFA
H'96
TCNT4H
16
H'97
TCNT4L
H'98
GRA4H
H'99
GRA4L
H'9A
GRB4H
H'9B
GRB4L
H'9C
BRA4H
H'9D
BRA4L
H'9E
BRB4H
H'9F
BRB4L
H'A0
TPMR
8
—
—
—
—
G3NOV
G2NOV
G1NOV
G0NOV
H'A1
TPCR
8
G3CMS1 G3CMS0 G2CMS1 G2CMS0 G1CMS1 G1CMS0 G0CMS1 G0CMS0
H'A2
NDERB
8
NDER15 NDER14 NDER13 NDER12 NDER11 NDER10 NDER9
NDER8
H'A3
NDERA
8
NDER7
NDER6
NDER5
NDER4
NDER3
NDER2
NDER1
NDER0
H'A4
NDRB*1
8
NDR15
NDR14
NDR13
NDR12
NDR11
NDR10
NDR9
NDR8
8
NDR15
NDR14
NDR13
NDR12
—
—
—
—
8
NDR7
NDR6
NDR5
NDR4
NDR3
NDR2
NDR1
NDR0
8
NDR7
NDR6
NDR5
NDR4
—
—
—
—
8
—
—
—
—
—
—
—
—
8
—
—
—
—
NDR11
NDR10
NDR9
NDR8
8
—
—
—
—
—
—
—
—
8
—
—
—
—
NDR3
NDR2
NDR1
NDR0
OVF
WT/IT
TME
—
—
CKS2
CKS1
CKS0
H'A5
NDRA*1
H'A6
NDRB*1
H'A7
NDRA*1
16
16
16
16
H'A8
TCSR*2
8
H'A9
TCNT*2
8
H'AA
—
—
—
—
—
—
—
—
—
H'AB
RSTCSR*2 8
WRST
—
—
—
—
—
—
—
H'AC
RFSHCR
8
SRFMD
PSRAME DRAME CAS/WE M9/M8
RFSHE
—
RCYCE
H'AD
RTMCSR
8
CMF
CMIE
—
—
—
H'AE
RTCNT
8
H'AF
RTCOR
8
CKS2
CKS1
CKS0
TPC
WDT
Refresh
controller
Rev. 3.00 Sep 27, 2006 page 739 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
Address Register
(low)
Name
Data
Bus
Width Bit 7
H'B0
SMR
8
H'B1
BRR
8
H'B2
SCR
8
H'B3
TDR
8
H'B4
SSR
8
Bit Names
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
C/A GM CHR
PE
O/E
STOP
MP
CKS1
CKS0
SCI channel 0
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
TDRE
RDRF
ORER
FER/
ERS
PER
TEND
MPB
MPBT
—
—
—
—
SDIR
SINV
—
SMIF
Bit 6
/
H'B5
RDR
8
H'B6
SCMR
8
H'B7
Reserved area (access prohibited)
H'B8
SMR
8
H'B9
BRR
8
H'BA
SCR
8
H'BB
TDR
8
H'BC
SSR
8
H'BD
RDR
8
H'BE
Reserved area (access prohibited)
C/A
CHR
PE
O/E
STOP
MP
CKS1
CKS0
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
TDRE
RDRF
ORER
FER
PER
TEND
MPB
MPBT
SCI channel 1
H'BF
H'C0
P1DDR
8
H'C1
P2DDR
8
P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR P11DDR P10DDR Port 1
P27DDR P26DDR P25DDR P24DDR P23DDR P22DDR P21DDR P20DDR Port 2
H'C2
P1DR
8
P17
P16
P15
P14
P13
P12
P11
P10
Port 1
H'C3
P2DR
8
P27
P26
P25
P24
P23
P22
P21
P20
Port 2
H'C4
P3DDR
8
P37DDR P36DDR P35DDR P34DDR P33DDR P32DDR P31DDR P30DDR Port 3
H'C5
P4DDR
8
P47DDR P46DDR P45DDR P44DDR P43DDR P42DDR P41DDR P40DDR Port 4
H'C6
P3DR
8
P37
P36
P35
P34
P33
P32
P31
P30
Port 3
H'C7
P4DR
8
P47
P46
P45
P44
P43
P42
P41
P40
Port 4
H'C8
P5DDR
8
—
—
—
—
P53DDR P52DDR P51DDR P50DDR Port 5
H'C9
P6DDR
8
—
P66DDR P65DDR P64DDR P63DDR P62DDR P61DDR P60DDR Port 6
H'CA
P5DR
8
—
—
—
—
P53
P52
P51
P50
Port 5
H'CB
P6DR
8
—
P66
P65
P64
P63
P62
P61
P60
Port 6
H'CC
—
—
—
—
—
—
—
—
—
H'CD
P8DDR
8
—
—
—
P84DDR P83DDR P82DDR P81DDR P80DDR Port 8
H'CE
P7DR
8
P77
P76
P75
P74
P73
P72
P71
P70
Port 7
H'CF
P8DR
8
—
—
—
P84
P83
P82
P81
P80
Port 8
Rev. 3.00 Sep 27, 2006 page 740 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
Address Register
(low)
Name
Data
Bus
Width Bit 7
Bit Names
Bit 6
Bit 5
—
P95DDR P94DDR P93DDR P92DDR P91DDR P90DDR Port 9
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
H'D0
P9DDR
8
—
H'D1
PADDR
8
PA7DDR PA6DDR PA5DDR PA4DDR PA3DDR PA2DDR PA1DDR PA0DDR Port A
H'D2
P9DR
8
—
—
P95
P94
P93
P92
P91
P90
Port 9
H'D3
PADR
8
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
Port A
H'D4
PBDDR
8
PB7DDR PB6DDR PB5DDR PB4DDR PB3DDR PB2DDR PB1DDR PB0DDR Port B
H'D5
—
—
—
—
—
—
—
—
—
—
—
H'D6
PBDR
8
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
Port B
H'D7
—
—
—
—
—
—
—
—
—
—
—
H'D8
P2PCR
8
P27PCR P26PCR P25PCR P24PCR P23PCR P22PCR P21PCR P20PCR Port 2
H'D9
—
H'DA
P4PCR
H'DB
H'DC
H'DD
—
—
—
—
—
—
—
—
8
P47PCR P46PCR P45PCR P44PCR P43PCR P42PCR P41PCR P40PCR Port 4
P5PCR
8
—
DADR0
8
DADR1
8
H'DE
DACR
8
H'DF
Reserved area (access prohibited)
H'E0
ADDRAH
8
AD9
H'E1
ADDRAL
8
AD1
H'E2
ADDRBH
8
H'E3
ADDRBL
8
H'E4
ADDRCH
H'E5
H'E6
H'E7
ADDRDL
8
H'E8
ADCSR
8
H'E9
ADCR
8
TRGE
H'EA
Reserved area (access prohibited)
—
—
—
P53PCR P52PCR P51PCR P50PCR Port 5
D/A converter
DAOE1
DAOE0
DAE
—
—
—
—
—
AD8
AD7
AD6
AD5
AD4
AD3
AD2
AD0
—
—
—
—
—
—
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
AD1
AD0
—
—
—
—
—
—
8
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
ADDRCL
8
AD1
AD0
—
—
—
—
—
—
ADDRDH
8
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
AD1
AD0
—
—
—
—
—
—
ADF
ADIE
ADST
SCAN
CKS
CH2
CH1
CH0
—
—
—
—
—
—
—
A/D converter
H'EB
H'EC
ABWCR
8
ABW7
ABW6
ABW5
ABW4
ABW3
ABW2
ABW1
ABW0
H'ED
ASTCR
8
AST7
AST6
AST5
AST4
AST3
AST2
AST1
AST0
H'EE
WCR
8
—
—
—
—
WMS1
WMS0
WC1
WC0
H'EF
WCER
8
WCE7
WCE6
WCE5
WCE4
WCE3
WCE2
WCE1
WCE0
Bus controller
Rev. 3.00 Sep 27, 2006 page 741 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
Address Register
(low)
Name
Data
Bus
Width Bit 7
Bit Names
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
H'F0
Reserved area (access prohibited)
H'F1
MDCR
8
—
—
—
—
—
MDS2
MDS1
MDS0
H'F2
SYSCR
8
SSBY
STS2
STS1
STS0
UE
NMIEG
—
RAME
System
control
H'F3
BRCR
8
A23E
A22E
A21E
—
—
—
—
BRLE
Bus controller
H'F4
ISCR
8
—
—
H'F5
IER
8
—
—
IRQ5E
IRQ5SC IRQ4SC IRQ3SC IRQ2SC IRQ1SC IRQ0SC Interrupt
controller
IRQ4E
IRQ3E
IRQ2E
IRQ1E
IRQ0E
H'F6
ISR
8
—
—
IRQ5F
IRQ4F
H'F7
Reserved area (access prohibited)
H'F8
IPRA
8
IPRA7
IPRA6
IPRA5
IPRA4
IPRA3
IPRA2
IPRA1
IPRA0
H'F9
IPRB
8
IPRB7
IPRB6
IPRB5
—
IPRB3
IPRB2
IPRB1
—
H'FA
Reserved area (access prohibited)
IRQ3F
IRQ2F
IRQ1F
IRQ0F
H'FB
H'FC
H'FD
H'FE
H'FF
Legend:
DMAC: DMA controller
ITU:
16-bit integrated timer unit
TPC: Programmable timing pattern controller
WDT: Watchdog timer
SCI:
Serial communication interface
Notes: 1. The address depends on the output trigger setting.
2. For write access to TCSR TCNT, and RSTCR see section 12.2.4, Notes on Register
Rewriting.
3. Bits 6 to 0 in FLMCR2 are reserved bits but are readable/writable.
4. Byte data must be used to access FLMCR1, FLMCR2, EBR, and RAMCR.
Registers FLMCR1, FLMCR2, EBR, and RAMCR are implemented in the flash memory
version only. The mask ROM version does not have these registers.
Rev. 3.00 Sep 27, 2006 page 742 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
B.2
Addresses (For H8/3048F, H8/3048ZTAT, H8/3048 Mask-ROM,
H8/3047 Mask-ROM, H8/3045 Mask-ROM, and H8/3044 MaskROM Versions)
Address Register
(low)
Name
Data
Bus
Width Bit 7
Bit Names
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
H'1C
H'1D
H'1E
H'1F
H'20
MAR0AR
8
H'21
MAR0AE
8
H'22
MAR0AH
8
H'23
MAR0AL
8
H'24
ETCR0AH
8
H'25
ETCR0AL
8
H'26
IOAR0A
8
H'27
DTCR0A
8
H'28
MAR0BR
8
H'29
MAR0BE
8
H'2A
MAR0BH
8
H'2B
MAR0BL
8
H'2C
ETCR0BH
8
H'2D
ETCR0BL
8
H'2E
IOAR0B
8
H'2F
DTCR0B
8
DMAC
channel 0A
DTE
DTSZ
DTID
RPE
DTIE
DTS2
DTS1
DTS0
Short
address
mode
DTE
DTSZ
SAID
SAIDE
DTIE
DTS2A
DTS1A
DTS0A
Full
address
mode
DMAC
channel 0B
DTE
DTSZ
DTID
RPE
DTIE
DTS2
DTS1
DTS0
Short
address
mode
DTME
—
DAID
DAIDE
TMS
DTS2B
DTS1B
DTS0B
Full
address
mode
Rev. 3.00 Sep 27, 2006 page 743 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
Address Register
(low)
Name
Data
Bus
Width Bit 7
H'30
MAR1AR
8
H'31
MAR1AE
8
H'32
MAR1AH
8
H'33
MAR1AL
8
H'34
ETCR1AH
8
H'35
ETCR1AL
8
H'36
IOAR1A
8
H'37
DTCR1A
8
H'38
MAR1BR
8
H'39
MAR1BE
8
H'3A
MAR1BH
8
H'3B
MAR1BL
8
H'3C
ETCR1BH
8
H'3D
ETCR1BL
8
H'3E
IOAR1B
8
H'3F
DTCR1B
8
H'40
FLMCR
H'41
—
H'42
EBR1
H'43
EBR2
H'44
8
Bit Names
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
DMAC
channel 1A
DTE
DTSZ
DTID
RPE
DTIE
DTS2
DTS1
DTS0
Short
address
mode
DTE
DTSZ
SAID
SAIDE
DTIE
DTS2A
DTS1A
DTS0A
Full
address
mode
DMAC
channel 1B
DTE
DTSZ
DTID
RPE
DTIE
DTS2
DTS1
DTS0
Short
address
mode
DTME
—
DAID
DAIDE
TMS
DTS2B
DTS1B
DTS0B
Full
address
mode
Flash
memory
VPP
VPPE
—
—
EV
PV
E
P
—
—
—
—
—
—
—
—
8
LB7
LB6
LB5
LB4
LB3
LB2
LB1
LB0
8
SB7
SB6
SB5
SB4
SB3
SB2
SB1
SB0
—
—
—
—
—
—
—
—
—
H'45
—
—
—
—
—
—
—
—
—
H'46
—
—
—
—
—
—
—
—
—
H'47
—
—
—
—
—
—
—
—
—
H'48
RAMCR
FLER
—
—
—
RAMS
RAM2
RAM1
RAM0
H'49
—
—
—
—
—
—
—
—
—
H'4A
—
—
—
—
—
—
—
—
—
H'4B
—
—
—
—
—
—
—
—
—
H'4C
—
—
—
—
—
—
—
—
—
H'4D
—
—
—
—
—
—
—
—
—
H'4E
—
—
—
—
—
—
—
—
—
H'4F
—
—
—
—
—
—
—
—
—
8
Module
Name
Rev. 3.00 Sep 27, 2006 page 744 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
Address Register
(low)
Name
Data
Bus
Width Bit 7
Bit Names
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
H'50
—
—
—
—
—
—
—
—
—
H'51
—
—
—
—
—
—
—
—
—
H'52
—
—
—
—
—
—
—
—
—
H'53
—
—
—
—
—
—
—
—
—
H'54
—
—
—
—
—
—
—
—
—
H'55
—
—
—
—
—
—
—
—
—
H'56
—
—
—
—
—
—
—
—
—
H'57
—
—
—
—
—
—
—
—
—
H'58
—
—
—
—
—
—
—
—
—
H'59
—
—
—
—
—
—
—
—
—
H'5A
—
—
—
—
—
—
—
—
—
H'5B
—
—
—
—
—
—
—
—
—
H'5C
DASTCR
8
—
—
—
—
—
—
—
DASTE
H'5D
DIVCR
8
—
—
—
—
—
—
DIV1
DIV0
H'5E
MSTCR
8
PSTOP
—
System
MSTOP5 MSTOP4 MSTOP3 MSTOP2 MSTOP1 MSTOP0 control
H'5F
CSCR
8
CS7E
CS6E
CS5E
CS4E
—
—
—
—
Bus controller
H'60
TSTR
8
—
—
—
STR4
STR3
STR2
STR1
STR0
H'61
TSNC
8
—
—
—
SYNC4
SYNC3
SYNC2
SYNC1
SYNC0
ITU
(all channels)
H'62
TMDR
8
—
MDF
FDIR
PWM4
PWM3
PWM2
PWM1
PWM0
H'63
TFCR
8
—
—
CMD1
CMD0
BFB4
BFA4
BFB3
BFA3
H'64
TCR0
8
—
CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
H'65
TIOR0
8
—
IOB2
IOB1
IOB0
—
IOA2
IOA1
IOA0
H'66
TIER0
8
—
—
—
—
—
OVIE
IMIEB
IMIEA
H'67
TSR0
8
—
—
—
—
—
OVF
IMFB
IMFA
H'68
TCNT0H
16
H'69
TCNT0L
H'6A
GRA0H
H'6B
GRA0L
H'6C
GRB0H
H'6D
GRB0L
D/A converter
ITU
channel 0
16
16
H'6E
TCR1
8
—
CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
H'6F
TIOR1
8
—
IOB2
IOB1
IOB0
—
IOA2
IOA1
IOA0
ITU
channel 1
Rev. 3.00 Sep 27, 2006 page 745 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
Address Register
(low)
Name
Data
Bus
Width Bit 7
Bit Names
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
ITU channel 1
H'70
TIER1
8
—
—
—
—
—
OVIE
IMIEB
IMIEA
H'71
TSR1
8
—
—
—
—
—
OVF
IMFB
IMFA
H'72
TCNT1H
16
H'73
TCNT1L
H'74
GRA1H
H'75
GRA1L
H'76
GRB1H
H'77
GRB1L
16
16
H'78
TCR2
8
—
CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
H'79
TIOR2
8
—
IOB2
IOB1
IOB0
—
IOA2
IOA1
IOA0
H'7A
TIER2
8
—
—
—
—
—
OVIE
IMIEB
IMIEA
H'7B
TSR2
8
—
—
—
—
—
OVF
IMFB
IMFA
H'7C
TCNT2H
16
H'7D
TCNT2L
H'7E
GRA2H
H'7F
GRA2L
H'80
GRB2H
H'81
GRB2L
ITU channel 2
16
16
H'82
TCR3
8
—
CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
H'83
TIOR3
8
—
IOB2
IOB1
IOB0
—
IOA2
IOA1
IOA0
H'84
TIER3
8
—
—
—
—
—
OVIE
IMIEB
IMIEA
H'85
TSR3
8
—
—
—
—
—
OVF
IMFB
IMFA
H'86
TCNT3H
16
H'87
TCNT3L
H'88
GRA3H
H'89
GRA3L
H'8A
GRB3H
H'8B
GRB3L
H'8C
BRA3H
H'8D
BRA3L
H'8E
BRB3H
H'8F
BRB3L
16
16
16
16
Rev. 3.00 Sep 27, 2006 page 746 of 872
REJ09B0325-0300
ITU channel 3
Appendix B Internal I/O Register
Address Register
(low)
Name
Data
Bus
Width Bit 7
Bit Names
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
H'90
TOER
8
—
—
EXB4
EXA4
EB3
EB4
EA4
EA3
H'91
TOCR
8
—
—
—
XTGD
—
—
OLS4
OLS3
ITU (all
channels)
ITU channel 4
H'92
TCR4
8
—
CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
H'93
TIOR4
8
—
IOB2
IOB1
IOB0
—
IOA2
IOA1
IOA0
H'94
TIER4
8
—
—
—
—
—
OVIE
IMIEB
IMIEA
H'95
TSR4
8
—
—
—
—
—
OVF
IMFB
IMFA
H'96
TCNT4H
16
H'97
TCNT4L
H'98
GRA4H
H'99
GRA4L
H'9A
GRB4H
H'9B
GRB4L
H'9C
BRA4H
H'9D
BRA4L
H'9E
BRB4H
H'9F
BRB4L
H'A0
TPMR
8
—
—
—
—
G3NOV
G2NOV
G1NOV
G0NOV
H'A1
TPCR
8
G3CMS1 G3CMS0 G2CMS1 G2CMS0 G1CMS1 G1CMS0 G0CMS1 G0CMS0
H'A2
NDERB
8
NDER15 NDER14 NDER13 NDER12 NDER11 NDER10 NDER9
NDER8
H'A3
NDERA
8
NDER7
NDER6
NDER5
NDER4
NDER3
NDER2
NDER1
NDER0
H'A4
NDRB*1
8
NDR15
NDR14
NDR13
NDR12
NDR11
NDR10
NDR9
NDR8
8
NDR15
NDR14
NDR13
NDR12
—
—
—
—
8
NDR7
NDR6
NDR5
NDR4
NDR3
NDR2
NDR1
NDR0
8
NDR7
NDR6
NDR5
NDR4
—
—
—
—
8
—
—
—
—
—
—
—
—
8
—
—
—
—
NDR11
NDR10
NDR9
NDR8
8
—
—
—
—
—
—
—
—
8
—
—
—
—
NDR3
NDR2
NDR1
NDR0
OVF
WT/IT
TME
—
—
CKS2
CKS1
CKS0
H'A5
NDRA*1
H'A6
NDRB*1
H'A7
NDRA*1
16
16
16
16
H'A8
TCSR*2
8
H'A9
TCNT*2
8
H'AA
—
—
—
—
—
—
—
—
—
H'AB
RSTCSR*2 8
WRST
RSTOE
—
—
—
—
—
—
H'AC
RFSHCR
8
SRFMD
PSRAME DRAME CAS/WE M9/M8
RFSHE
—
RCYCE
H'AD
RTMCSR
8
CMF
CMIE
—
—
—
H'AE
RTCNT
8
H'AF
RTCOR
8
CKS2
CKS1
CKS0
TPC
WDT
Refresh
controller
Rev. 3.00 Sep 27, 2006 page 747 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
Address Register
(low)
Name
Data
Bus
Width Bit 7
H'B0
SMR
8
H'B1
BRR
8
H'B2
SCR
8
H'B3
TDR
8
H'B4
SSR
8
Bit Names
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
C/A GM CHR
PE
O/E
STOP
MP
CKS1
CKS0
SCI channel 0
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
TDRE
RDRF
ORER
FER/
ERS
PER
TEND
MPB
MPBT
Bit 6
/
H'B5
RDR
8
H'B6
SCMR
8
—
—
—
—
SDIR
SINV
—
SMIF
H'B8
SMR
8
C/A
CHR
PE
O/E
STOP
MP
CKS1
CKS0
H'B9
BRR
8
H'BA
SCR
8
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
H'BB
TDR
8
H'BC
SSR
8
TDRE
RDRF
ORER
FER
PER
TEND
MPB
MPBT
H'BD
RDR
8
H'BE
—
—
—
—
—
—
—
—
—
H'B7
SCI channel 1
H'BF
H'C0
P1DDR
8
H'C1
P2DDR
8
P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR P11DDR P10DDR Port 1
P27DDR P26DDR P25DDR P24DDR P23DDR P22DDR P21DDR P20DDR Port 2
H'C2
P1DR
8
P17
P16
P15
P14
P13
P12
P11
P10
Port 1
H'C3
P2DR
8
P27
P26
P25
P24
P23
P22
P21
P20
Port 2
H'C4
P3DDR
8
P37DDR P36DDR P35DDR P34DDR P33DDR P32DDR P31DDR P30DDR Port 3
H'C5
P4DDR
8
P47DDR P46DDR P45DDR P44DDR P43DDR P42DDR P41DDR P40DDR Port 4
H'C6
P3DR
8
P37
P36
P35
P34
P33
P32
P31
P30
Port 3
H'C7
P4DR
8
P47
P46
P45
P44
P43
P42
P41
P40
Port 4
H'C8
P5DDR
8
—
—
—
—
P53DDR P52DDR P51DDR P50DDR Port 5
H'C9
P6DDR
8
—
P66DDR P65DDR P64DDR P63DDR P62DDR P61DDR P60DDR Port 6
H'CA
P5DR
8
—
—
—
—
P53
P52
P51
P50
Port 5
H'CB
P6DR
8
—
P66
P65
P64
P63
P62
P61
P60
Port 6
H'CC
—
—
—
—
—
—
—
—
—
H'CD
P8DDR
8
—
—
—
P84DDR P83DDR P82DDR P81DDR P80DDR Port 8
H'CE
P7DR
8
P77
P76
P75
P74
P73
P72
P71
P70
Port 7
H'CF
P8DR
8
—
—
—
P84
P83
P82
P81
P80
Port 8
Rev. 3.00 Sep 27, 2006 page 748 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
Address Register
(low)
Name
Data
Bus
Width Bit 7
Bit Names
Bit 6
Bit 5
—
P95DDR P94DDR P93DDR P92DDR P91DDR P90DDR Port 9
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
H'D0
P9DDR
8
—
H'D1
PADDR
8
PA7DDR PA6DDR PA5DDR PA4DDR PA3DDR PA2DDR PA1DDR PA0DDR Port A
H'D2
P9DR
8
—
—
P95
P94
P93
P92
P91
P90
Port 9
H'D3
PADR
8
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
Port A
H'D4
PBDDR
8
PB7DDR PB6DDR PB5DDR PB4DDR PB3DDR PB2DDR PB1DDR PB0DDR Port B
H'D5
—
—
—
—
—
—
—
—
—
H'D6
PBDR
8
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
H'D7
—
—
—
—
—
—
—
—
—
H'D8
P2PCR
H'D9
—
H'DA
P4PCR
H'DB
H'DC
H'DD
8
Port B
P27PCR P26PCR P25PCR P24PCR P23PCR P22PCR P21PCR P20PCR Port 2
—
—
—
—
—
—
—
—
8
P47PCR P46PCR P45PCR P44PCR P43PCR P42PCR P41PCR P40PCR Port 4
P5PCR
8
—
DADR0
8
DADR1
8
H'DE
DACR
8
H'DF
—
H'E0
ADDRAH
H'E1
ADDRAL
H'E2
H'E3
—
—
—
P53PCR P52PCR P51PCR P50PCR Port 5
D/A converter
DAOE1
DAOE0
DAE
—
—
—
—
—
—
—
—
—
—
—
—
—
8
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
8
AD1
AD0
—
—
—
—
—
—
ADDRBH
8
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
ADDRBL
8
AD1
AD0
—
—
—
—
—
—
H'E4
ADDRCH
8
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
H'E5
ADDRCL
8
AD1
AD0
—
—
—
—
—
—
H'E6
ADDRDH
8
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
H'E7
ADDRDL
8
AD1
AD0
—
—
—
—
—
—
H'E8
ADCSR
8
ADF
ADIE
ADST
SCAN
CKS
CH2
CH1
CH0
H'E9
ADCR
8
TRGE
—
—
—
—
—
—
—
H'EA
—
—
—
—
—
—
—
—
—
H'EB
—
—
—
—
—
—
—
—
—
H'EC
ABWCR
8
ABW7
ABW6
ABW5
ABW4
ABW3
ABW2
ABW1
ABW0
H'ED
ASTCR
8
AST7
AST6
AST5
AST4
AST3
AST2
AST1
AST0
H'EE
WCR
8
—
—
—
—
WMS1
WMS0
WC1
WC0
H'EF
WCER
8
WCE7
WCE6
WCE5
WCE4
WCE3
WCE2
WCE1
WCE0
A/D converter
Bus controller
Rev. 3.00 Sep 27, 2006 page 749 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
Address Register
(low)
Name
Data
Bus
Width Bit 7
Bit Names
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
H'F0
—
—
—
—
—
—
—
—
—
H'F1
MDCR
8
—
—
—
—
—
MDS2
MDS1
MDS0
H'F2
SYSCR
8
SSBY
STS2
STS1
STS0
UE
NMIEG
—
RAME
System
control
H'F3
BRCR
8
A23E
A22E
A21E
—
—
—
—
BRLE
Bus controller
H'F4
ISCR
8
—
—
H'F5
IER
8
—
—
IRQ5E
IRQ5SC IRQ4SC IRQ3SC IRQ2SC IRQ1SC IRQ0SC Interrupt
controller
IRQ4E
IRQ3E
IRQ2E
IRQ1E
IRQ0E
H'F6
ISR
8
—
—
IRQ5F
IRQ4F
IRQ3F
IRQ2F
IRQ1F
IRQ0F
H'F7
—
—
—
—
—
—
—
—
—
H'F8
IPRA
8
IPRA7
IPRA6
IPRA5
IPRA4
IPRA3
IPRA2
IPRA1
IPRA0
H'F9
IPRB
8
IPRB7
IPRB6
IPRB5
—
IPRB3
IPRB2
IPRB1
—
H'FA
—
—
—
—
—
—
—
—
—
H'FB
—
—
—
—
—
—
—
—
—
H'FD
—
—
—
—
—
—
—
—
—
H'FE
—
—
—
—
—
—
—
—
—
H'FF
—
—
—
—
—
—
—
—
—
H'FC
Legend:
DMAC: DMA controller
ITU:
16-bit integrated timer unit
TPC: Programmable timing pattern controller
SCI:
Serial communication interface
WDT: Watchdog timer
Notes: 1. The address depends on the output trigger setting.
2. For write access to TCSR, TCNT, and RSTCSR, see section 12.2.4, Notes on Register
Rewriting.
Rev. 3.00 Sep 27, 2006 page 750 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
B.3
Function
Register
acronym
Register
name
TSTR Timer Start Register
Address to which
the register is mapped
H'60
Name of on-chip
supporting
module
ITU (all channels)
Bit
numbers
Bit
Initial bit
values
7
6
5
4
3
2
1
0



STR4
STR3
STR2
STR1
STR0
Initial value
1
1
1
0
0
0
0
0
Read/Write



R/W
R/W
R/W
R/W
R/W
Names of the
bits. Dashes
(—) indicate
reserved bits.
Possible types of access
R
Read only
W
Write only
R/W Read and write
Counter start 0
0 TCNT0 is halted
1 TCNT0 is counting
Counter start 1
0 TCNT1 is halted
1 TCNT1 is counting
Full name
of bit
Counter start 2
0 TCNT2 is halted
1 TCNT2 is counting
Counter start 3
0 TCNT3 is halted
1 TCNT3 is counting
Descriptions
of bit settings
Counter start 4
0 TCNT4 is halted
1 TCNT4 is counting
Rev. 3.00 Sep 27, 2006 page 751 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
MAR0A R/E/H/L—Memory Address Register 0A R/E/H/L
23
H'20, H'21,
H'22, H'23
22
21
Bit
31
30
29
28
27
26
25
24
Initial value
1
1
1
1
1
1
1
1
Read/Write







 R/W R/W R/W R/W R/W R/W R/W R/W
Initial value
Read/Write
15
14
13
12
11
19
18
17
16
Undetermined
MAR0AR
Bit
20
DMAC0
MAR0AE
10
Undetermined
9
8
7
6
5
4
3
2
1
0
Undetermined
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MAR0AH
MAR0AL
Source or destination address
Rev. 3.00 Sep 27, 2006 page 752 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
ETCR0A H/L—Execute Transfer Count Register 0A H/L
H'24, H'25
DMAC0
• Short address mode
 I/O mode and idle mode
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
Undetermined
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Transfer counter
 Repeat mode
Bit
7
6
5
R/W
R/W
R/W
Initial value
Read/Write
4
3
2
1
0
R/W
R/W
R/W
2
1
0
R/W
R/W
R/W
Undetermined
R/W
R/W
ETCR0AH
Transfer counter
Bit
7
6
5
Initial value
Read/Write
4
3
Undetermined
R/W
R/W
R/W
R/W
R/W
ETCR0AL
Initial count
Rev. 3.00 Sep 27, 2006 page 753 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
ETCR0A H/L—Execute Transfer Count Register 0A H/L
(cont)
H'24, H'25
DMAC0
• Full address mode
 Normal mode
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
Undetermined
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Transfer counter
 Block transfer mode
Bit
7
6
5
R/W
R/W
R/W
Initial value
Read/Write
4
3
2
1
0
R/W
R/W
R/W
2
1
0
R/W
R/W
R/W
Undetermined
R/W
R/W
ETCR0AH
Block size counter
Bit
7
6
5
R/W
R/W
R/W
Initial value
Read/Write
4
3
Undetermined
R/W
R/W
ETCR0AL
Initial block size
Rev. 3.00 Sep 27, 2006 page 754 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
IOAR0A—I/O Address Register 0A
Bit
7
6
H'26
5
Initial value
Read/Write
4
3
DMAC0
2
1
0
R/W
R/W
R/W
Undetermined
R/W
R/W
R/W
R/W
R/W
Short address mode: source or destination address
Full address mode: not used
Rev. 3.00 Sep 27, 2006 page 755 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
DTCR0A—Data Transfer Control Register 0A
H'27
DMAC0
• Short address mode
Bit
7
6
5
4
3
2
1
0
DTE
DTSZ
DTID
RPE
DTIE
DTS2
DTS1
DTS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Data transfer select
Bit 2 Bit 1 Bit 0
DTS2 DTS1 DTS0
0
0
0
1
1
0
1
1
0
0
1
1
0
1
Data Transfer Activation Source
Compare match/input capture A interrupt from ITU channel 0
Compare match/input capture A interrupt from ITU channel 1
Compare match/input capture A interrupt from ITU channel 2
Compare match/input capture A interrupt from ITU channel 3
SCI0 transmit-data-empty interrupt
SCI0 receive-data-full interrupt
Transfer in full address mode (channel A)
Transfer in full address mode (channel A)
Data transfer interrupt enable
0 Interrupt requested by DTE bit is disabled
1 Interrupt requested by DTE bit is enabled
Repeat enable
RPE
0
1
DTIE
0
1
0
1
Description
I/O mode
Repeat mode
Idle mode
Data transfer increment/decrement
0 Incremented: If DTSZ = 0, MAR is incremented by 1 after each transfer
If DTSZ = 1, MAR is incremented by 2 after each transfer
1 Decremented: If DTSZ = 0, MAR is decremented by 1 after each transfer
If DTSZ = 1, MAR is decremented by 2 after each transfer
Data transfer size
0 Byte-size transfer
1 Word-size transfer
Data transfer enable
0 Data transfer is disabled
1 Data transfer is enabled
Rev. 3.00 Sep 27, 2006 page 756 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
DTCR0A—Data Transfer Control Register 0A (cont)
H'27
DMAC0
• Full address mode
Bit
7
6
5
4
3
2
1
0
DTE
DTSZ
SAID
SAIDE
DTIE
DTS2A
DTS1A
DTS0A
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Data transfer select 0A
0 Normal mode
1 Block transfer mode
Data transfer select 2A and 1A
Set both bits to 1
Data transfer interrupt enable
0 Interrupt request by DTE bit is disabled
1 Interrupt request by DTE bit is enabled
Source address increment/decrement (bit 5)
Source address increment/decrement enable (bit 4)
Bit 5 Bit 4
SAID SAIDE Increment/Decrement Enable
0
0
MARA is held fixed
Incremented: If DTSZ = 0, MARA is incremented by 1 after each transfer
1
If DTSZ = 1, MARA is incremented by 2 after each transfer
1
MARA is held fixed
0
Decremented: If DTSZ = 0, MARA is decremented by 1 after each transfer
1
If DTSZ = 1, MARA is decremented by 2 after each transfer
Data transfer size
0 Byte-size transfer
1 Word-size transfer
Data transfer enable
0 Data transfer is disabled
1 Data transfer is enabled
Rev. 3.00 Sep 27, 2006 page 757 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
MAR0B R/E/H/L—Memory Address Register 0B R/E/H/L
Bit
31
30
29
28
27
26
25
24
23
H'28, H'29,
H'2A, H'2B
22
21
20
19
DMAC0
18
17
16
Initial value
1
1
1
1
1
1
1
1
Undetermined
Read/Write








R/W R/W R/W R/W R/W R/W R/W R/W
MAR0BR
Bit
Initial value
Read/Write
15
14
13
12
11
MAR0BE
10
Undetermined
9
8
7
6
5
4
3
2
1
0
Undetermined
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MAR0BH
MAR0BL
Source or destination address
Rev. 3.00 Sep 27, 2006 page 758 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
ETCR0B H/L—Execute Transfer Count Register 0B H/L
H'2C, H'2D
DMAC0
• Short address mode
 I/O mode and idle mode
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
Undetermined
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Transfer counter
 Repeat mode
Bit
7
6
5
R/W
R/W
R/W
Initial value
Read/Write
4
3
2
1
0
R/W
R/W
R/W
2
1
0
R/W
R/W
R/W
Undetermined
R/W
R/W
ETCR0BH
Transfer counter
Bit
7
6
5
Initial value
Read/Write
4
3
Undetermined
R/W
R/W
R/W
R/W
R/W
ETCR0BL
Initial count
Rev. 3.00 Sep 27, 2006 page 759 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
ETCR0B H/L—Execute Transfer Count Register 0B H/L
(cont)
H'2C, H'2D
DMAC0
• Full address mode
 Normal mode
Bit
15
14
13
12
11
10
9
8
7
5
6
4
3
2
1
0
Initial value
Undetermined
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Not used
 Block transfer mode
Bit
15
14
13
12
11
10
9
8
7
5
6
4
3
2
1
0
Initial value
Undetermined
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Block transfer counter
IOAR0B—I/O Address Register 0B
Bit
7
6
H'2E
5
Initial value
Read/Write
4
3
DMAC0
2
1
0
R/W
R/W
R/W
Undetermined
R/W
R/W
R/W
R/W
R/W
Short address mode: source or destination address
Full address mode: not used
Rev. 3.00 Sep 27, 2006 page 760 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
DTCR0B—Data Transfer Control Register 0B
H'2F
DMAC0
• Short address mode
Bit
7
6
5
4
3
2
1
0
DTE
DTSZ
DTID
RPE
DTIE
DTS2
DTS1
DTS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Data transfer select
Bit 2 Bit 1 Bit 0
DTS2 DTS1 DTS0
0
0
0
1
1
0
1
0
1
0
1
0
1
1
Data Transfer Activation Source
Compare match/input capture A interrupt from ITU channel 0
Compare match/input capture A interrupt from ITU channel 1
Compare match/input capture A interrupt from ITU channel 2
Compare match/input capture A interrupt from ITU channel 3
SCI0 transmit-data-empty interrupt
SCI0 receive-data-full interrupt
Falling edge of DREQ input
Low level of DREQ input
Data transfer interrupt enable
0 Interrupt requested by DTE bit is disabled
1 Interrupt requested by DTE bit is enabled
An interrupt request is issued to the CPU when the DTE bit = 0
Repeat enable
RPE DTIE Description
0
0
I/O mode
1
0
1
Repeat mode
1
Idle mode
Data transfer increment/decrement
0 Incremented: If DTSZ = 0, MAR is incremented by 1 after each transfer
If DTSZ = 1, MAR is incremented by 2 after each transfer
1 Decremented: If DTSZ = 0, MAR is decremented by 1 after each transfer
If DTSZ = 1, MAR is decremented by 2 after each transfer
Data transfer size
0 Byte-size transfer
1 Word-size transfer
Data transfer enable
0 Data transfer is disabled
1 Data transfer is enabled
Rev. 3.00 Sep 27, 2006 page 761 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
DTCR0B—Data Transfer Control Register 0B (cont)
H'2F
DMAC0
• Full address mode
Bit
7
6
5
4
3
2
1
0
DTME

DAID
DAIDE
TMS
DTS2B
DTS1B
DTS0B
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Data transfer select 2B to 0B
Bit 2 Bit 1 Bit 0
Data Transfer Activation Source
DTS2B DTS1B DTS0B Normal Mode
Block Transfer Mode
0
0
0
Auto-request
Compare match/input capture
(burst mode)
A from ITU channel 0
1
Not available
Compare match/input capture
A from ITU channel 1
0
Compare match/input capture
Auto-request
1
A from ITU channel 2
(cycle-steal mode)
1
Compare match/input capture
Not available
A from ITU channel 3
0
Not available
Not available
0
1
1
Not available
Not available
Falling edge of DREQ
0
Falling edge of DREQ
1
1
Low level input at DREQ Not available
Transfer mode select
0 Destination is the block area in block transfer mode
1 Source is the block area in block transfer mode
Destination address increment/decrement (bit 5)
Destination address increment/decrement enable (bit 4)
Bit 5 Bit 4
DAID DAIDE Increment/Decrement Enable
0
0
MARB is held fixed
1
Incremented: If DTSZ = 0, MARB is incremented by 1 after each transfer
If DTSZ = 1, MARB is incremented by 2 after each transfer
1
0
MARB is held fixed
1
Decremented: If DTSZ = 0, MARB is decremented by 1 after each transfer
If DTSZ = 1, MARB is decremented by 2 after each transfer
Data transfer master enable
0 Data transfer is disabled
1 Data transfer is enabled
Rev. 3.00 Sep 27, 2006 page 762 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
MAR1A R/E/H/L—Memory Address Register 1A R/E/H/L
Bit
31
30
29
28
27
26
25
24
23
H'30, H'31,
H'32, H'33
22
21
20
19
DMAC1
18
17
16
Initial value
1
1
1
1
1
1
1
1
Undetermined
Read/Write








R/W R/W R/W R/W R/W R/W R/W R/W
MAR1AR
Bit
Initial value
Read/Write
15
14
13
12
11
MAR1AE
10
9
Undetermined
8
7
6
5
4
3
2
1
0
Undetermined
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MAR1AH
MAR1AL
Note: Bit functions are the same as for DMAC0.
Rev. 3.00 Sep 27, 2006 page 763 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
ETCR1A H/L—Execute Transfer Count Register 1A H/L
Bit
15
14
13
12
11
10
9
8
7
H'34, H'35
6
5
4
DMAC1
3
2
1
0
Initial value
Undetermined
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Bit
7
6
5
Initial value
Read/Write
4
3
2
1
0
R/W
R/W
R/W
2
1
0
R/W
R/W
R/W
Undetermined
R/W
R/W
R/W
R/W
R/W
ETCR1AH
Bit
7
6
5
Initial value
Read/Write
4
3
Undetermined
R/W
R/W
R/W
R/W
R/W
ETCR1AL
Note: Bit functions are the same as for DMAC0.
IOAR1A—I/O Address Register 1A
Bit
H'36
7
6
5
R/W
R/W
R/W
Initial value
Read/Write
4
3
DMAC1
2
1
0
R/W
R/W
R/W
Undetermined
R/W
Note: Bit functions are the same as for DMAC0.
Rev. 3.00 Sep 27, 2006 page 764 of 872
REJ09B0325-0300
R/W
Appendix B Internal I/O Register
DTCR1A—Data Transfer Control Register 1A
H'37
DMAC1
• Short address mode
Bit
7
6
5
4
3
2
1
0
DTE
DTSZ
DTID
RPE
DTIE
DTS2
DTS1
DTS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
DTE
DTSZ
SAID
SAIDE
DTIE
DTS2A
DTS1A
DTS0A
• Full address mode
Bit
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: Bit functions are the same as for DMAC0.
MAR1B R/E/H/L—Memory Address Register 1B R/E/H/L
Bit
31
30
29
28
27
26
25
24
23
H'38, H'39,
H'3A, H'3B
22
21
20
19
DMAC1
18
17
16
Initial value
1
1
1
1
1
1
1
1
Undetermined
Read/Write








R/W R/W R/W R/W R/W R/W R/W R/W
MAR1BR
Bit
Initial value
Read/Write
15
14
13
12
11
MAR1BE
10
9
Undetermined
8
7
6
5
4
3
2
1
0
Undetermined
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
MAR1BH
MAR1BL
Note: Bit functions are the same as for DMAC0.
Rev. 3.00 Sep 27, 2006 page 765 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
ETCR1B H/L—Execute Transfer Count Register 1B H/L
Bit
15
14
13
12
11
10
9
8
7
H'3C, H'3D
6
5
4
DMAC1
3
2
1
0
Initial value
Undetermined
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Bit
7
6
5
R/W
R/W
R/W
Initial value
Read/Write
4
3
2
1
0
R/W
R/W
R/W
2
1
0
R/W
R/W
R/W
Undetermined
R/W
R/W
ETCR1BH
Bit
7
6
5
Initial value
Read/Write
4
3
Undetermined
R/W
R/W
R/W
R/W
R/W
ETCR1BL
Note: Bit functions are the same as for DMAC0.
IOAR1B—I/O Address Register 1B
Bit
7
6
H'3E
5
Initial value
Read/Write
4
3
DMAC1
2
1
0
R/W
R/W
R/W
Undetermined
R/W
R/W
R/W
R/W
Note: Bit functions are the same as for DMAC0.
Rev. 3.00 Sep 27, 2006 page 766 of 872
REJ09B0325-0300
R/W
Appendix B Internal I/O Register
DTCR1B—Data Transfer Control Register 1B
H'3F
DMAC1
• Short address mode
Bit
7
6
5
4
3
2
1
0
DTE
DTSZ
DTID
RPE
DTIE
DTS2
DTS1
DTS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
7
6
5
4
3
2
1
0
DTME

DAID
DAIDE
TMS
DTS2B
DTS1B
DTS0B
• Full address mode
Bit
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: Bit functions are the same as for DMAC0.
Rev. 3.00 Sep 27, 2006 page 767 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
FLMCR—Flash Memory Control Register
Bit
H'40
Flash memory
7
6
5
4
3
2
1
VPP
VPP E


0
EV
PV
E
P
Initial value*
0
0
0
0
0
0
0
0
Read/Write
R
R/W


R/W*
R/W*
R/W *
R/W *
Program mode
0 Exit from program mode
(Initial value)
1 Transition to program mode
Erase mode
0 Exit from erase mode
1 Transition to erase mode
(Initial value)
Program-verify mode
0 Exit from program-verify mode
1 Transition to program-verify mode
(Initial value)
Erase-verify mode
0 Exit from erase-verify mode
1 Transition to erase-verify mode
(Initial value)
VPP enable
0 VPP pin 12 V power supply is disabled
1 VPP pin 12 V power supply is enabled
Programming power
0 Cleared when 12 V is not applied to VPP
1 Set when 12 V is applied to VPP
(Initial value)
(Initial value)
Note: * The initial value is H'00 in modes 5, 6, and 7 (on-chip flash memory enabled). In modes
1, 2, 3, and 4 (on-chip flash memory disabled), this register cannot be modified and is
always read as H'FF.
H8/3048F
Include this register
H8/3048B mask ROM version Not include this register
H8/3048F-ONE
H8/3048ZTAT
H8/3048 mask ROM version
H8/3047 mask ROM version
H8/3045 mask ROM version
H8/3044 mask ROM version
Rev. 3.00 Sep 27, 2006 page 768 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
FLMCR1—Flash Memory Control Register 1
Bit
H'40
Flash memory
7
6
5
4
3
2
1
0
FWE
SWE
ESU
PSU
EV
PV
E
P
Initial value*
1
0
0
0
0
0
0
0
Read/Write
R
R/W*
R/W*
R/W*
R/W*
R/W*
R/W*
R/W*
Program mode
0
Program mode cleared
(Initial value)
1
Transition to program mode
Erase mode
0
Erase mode cleared
1
Transition to erase mode
(Initial value)
Program-verify mode
0
Program-verify mode cleared
1
Transition to program-verify mode
(Initial value)
Erase-verify mode
0
Erase-verify mode cleared
1
Transition to erase-verify mode
(Initial value)
Program setup bit
0
Program setup cleared
1
Program setup
(Initial value)
Erase setup bit
0
Erase setup cleared
1
Erase setup
(Initial value)
Software write enable bit
0
Write disabled
1
Write enabled
(Initial value)
Flash write enable bit
0
When a low level is input to the FWE pin (hardware protection state)
1
When a high level is input to the FWE pin
Note: * The initial value is H'00 in modes 5, 6, and 7 (on-chip flash memory enabled). In modes 1, 2,
3, and 4 (on-chip flash memory disabled), this register cannot be modified and is always read
as H'FF.
H8/3048F-ONE
Include this register
H8/3048B mask ROM version Not include this register
H8/3048F
H8/3048ZTAT
H8/3048 mask ROM version
H8/3047 mask ROM version
H8/3045 mask ROM version
H8/3044 mask ROM version
Rev. 3.00 Sep 27, 2006 page 769 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
FLMCR2—Flash Memory Control Register 2
Bit
H'41
Flash memory
7
6
5
4
3
2
1
0
FLER







Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reserved bits
Flash memory error
0 Flash memory is operating normally. Flash memory program/erase
protection (error protection) is disabled.
(Initial value)
1 This indicates that an error has occurred during flash memory
programming/erasing. Flash memory program/erase protection
(error protection) is enabled.
Note: Bits 6 to 0 are reserved bits but are readable/writable.
H8/3048F-ONE
Include this register
H8/3048B mask ROM version Not include this register
H8/3048F
H8/3048ZTAT
H8/3048 mask ROM version
H8/3047 mask ROM version
H8/3045 mask ROM version
H8/3044 mask ROM version
Rev. 3.00 Sep 27, 2006 page 770 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
EBR1—Erase Block Register 1
Bit
Initial value*
Read/Write
H'42
Flash memory
7
6
5
4
3
2
1
0
LB7
LB6
LB5
LB4
LB3
LB2
LB1
LB0
0
0
0
0
0
0
0
0
R/W*
R/W*
R/W*
R/W*
R/W*
R/W*
R/W*
R/W*
Large block 7 to 0
0 Block LB7 to LB0 is not selected
1 Block LB7 to LB0 is selected
(Initial value)
Note: * The initial value is H'00 in modes 5, 6, and 7 (on-chip flash memory enabled). In modes
1, 2, 3, and 4 (on-chip flash memory disabled), this register cannot be modified and is
always read as H'FF.
H8/3048F
H8/3048B mask ROM version
H8/3048F-ONE
H8/3048ZTAT
H8/3048 mask ROM version
H8/3047 mask ROM version
H8/3045 mask ROM version
H8/3044 mask ROM version
Include this register
Not include this register
Rev. 3.00 Sep 27, 2006 page 771 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
EBR—Erase Block Register
Bit
Initial value*
Read/Write
H'42
Flash memory
7
6
5
4
3
2
1
0
EB7
EB6
EB5
EB4
EB3
EB2
EB1
EB0
0
0
0
0
0
0
0
0
R/W*
R/W*
R/W*
R/W*
R/W*
R/W*
R/W*
R/W*
Erase block specification bits (1)
0 Erase protection state
1 Erasable state
Note: * The initial value is H'00 in modes 5, 6, and 7 (on-chip ROM enabled). In modes
1, 2, 3, and 4 (on-chip ROM disabled), this register cannot be modified and is
always read as H'00.
H8/3048F-ONE
Include this register
H8/3048B mask ROM version Not include this register
H8/3048F
H8/3048ZTAT
H8/3048 mask ROM version
H8/3047 mask ROM version
H8/3045 mask ROM version
H8/3044 mask ROM version
Rev. 3.00 Sep 27, 2006 page 772 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
EBR2—Erase Block Register 2
Bit
Initial value*
Read/Write
H'43
Flash memory
7
6
5
4
3
2
1
0
SB7
SB6
SB5
SB4
SB3
SB2
SB1
SB0
0
0
0
0
0
0
0
0
R/W*
R/W*
R/W*
R/W*
R/W*
R/W*
R/W*
R/W*
Small block 7 to 0
0 Block SB7 to SB0 is not selected
1 Block SB7 to SB0 is selected
(Initial value)
Note: * The initial value is H'00 in modes 5, 6, and 7 (on-chip flash memory enabled). In modes
1, 2, 3, and 4 (on-chip flash memory disabled), this register cannot be modified and is
always read as H'FF.
H8/3048F
H8/3048B mask ROM version
H8/3048F-ONE
H8/3048ZTAT
H8/3048 mask ROM version
H8/3047 mask ROM version
H8/3045 mask ROM version
H8/3044 mask ROM version
Include this register
Not include this register
Rev. 3.00 Sep 27, 2006 page 773 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
RAMCR—RAM Control Register
Bit
H'47
Flash memory
7
6
5
4
3
2
1
0




RAMS
RAM2
RAM1

Modes
1 to 4
Initial value
1
1
1
1
0
0
0
0
Read/Write




R
R
R

Modes
5 to 7
Initial value
1
1
1
1
0
0
0
0
Read/Write




R/W
R/W
R/W
R/W
Reserved bits
RAM select, RAM2, RAM1
Bit 2
Bit 1
Bit 3
RAM Area
RAM Emulation Status
RAMS RAM2 RAM1
0
0/1
0/1
H'FFF000 to H'FFF3FF No emulation
H'000000 to H'0003FF Mapping RAM
1
0
0
H'000400 to H'0007FF
1
H'000800 to H'000BFF
1
0
H'000C00 to H'000FFF
1
Note: Bits 7 to 4 are reserved and cannot be modified.
If data is written to these bits, normal operation is not guaranteed.
Bit 0 is a reserved bit but is readable/writable.
H8/3048F-ONE
Include this register
H8/3048B mask ROM version Not include this register
H8/3048F
H8/3048ZTAT
H8/3048 mask ROM version
H8/3047 mask ROM version
H8/3045 mask ROM version
H8/3044 mask ROM version
Rev. 3.00 Sep 27, 2006 page 774 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
RAMCR—RAM Control Register
Bit
Initial value
Read/Write
H'48
Flash memory
7
6
5
4
3
2
1
0
FLER



RAMS
RAM2
RAM1
RAM0
0
1
1
1
0
0
0
0
R/W



R/W
R/W
R/W
R/W
RAM select, RAM 2 to RAM 0
Bit 3
Bit 1
Bit 0
Bit 2
RAMS RAM 2 RAM 1 RAM 0
1/0
0
1/0
1/0
1
0
0
0
1
1
0
1
1
0
0
1
1
0
1
Flash memory error
0 Flash memory is not write/erase-protected
(is not in error protect mode)
1 Flash memory is write/erase-protected
(is in error protect mode)
RAM Area
H'FFF000 to H'FFF1FF
H'01F000 to H'01F1FF
H'01F200 to H'01F3FF
H'01F400 to H'01F5FF
H'01F600 to H'01F7FF
H'01F800 to H'01F9FF
H'01FA00 to H'01FBFF
H'01FC00 to H'01FDFF
H'01FE00 to H'01FFFF
(Initial value)
H8/3048F
Include this register
H8/3048B mask ROM version Not include this register
H8/3048F-ONE
H8/3048ZTAT
H8/3048 mask ROM version
H8/3047 mask ROM version
H8/3045 mask ROM version
H8/3044 mask ROM version
Rev. 3.00 Sep 27, 2006 page 775 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
DASTCR—D/A Standby Control Register
Bit
H'5C
System control
7
6
5
4
3
2
1
0







DASTE
Initial value
1
1
1
1
1
1
1
0
Read/Write







R/W
D/A standby enable
0 D/A output is disabled in software standby mode (Initial value)
1 D/A output is enabled in software standby mode
DIVCR—Division Control Register
H'5D
System control
7
6
5
7
3
2
1
0






DIV1
DIV0
Initial value
1
1
1
1
1
1
0
0
Read/Write






R/W
R/W
Bit
Divide 1 and 0
Bit 1 Bit 0
DIV1 DIV0
0
0
1
0
1
1
Rev. 3.00 Sep 27, 2006 page 776 of 872
REJ09B0325-0300
Frequency
Division Ratio
1/1 (Initial value)
1/2
1/4
1/8
Appendix B Internal I/O Register
MSTCR—Module Standby Control Register
Bit
7
6
H'5E
4
5
3
2
System control
1
0
PSTOP

Initial value
0
1
0
0
0
0
0
0
Read/Write
R/W

R/W
R/W
R/W
R/W
R/W
R/W
MSTOP5 MSTOP4 MSTOP3 MSTOP2 MSTOP1 MSTOP0
Module standby 0
0 A/D converter operates normally
(Initial value)
1 A/D converter is in standby state
Module standby 1
0 Refresh controller operates normally
1 Refresh controller is in standby state
Module standby 2
0 DMAC operates normally
1 DMAC is in standby state
Module standby 3
0 SCI1 operates normally
1 SCI1 is in standby state
Module standby 4
0 SCI0 operates normally
1 SCI0 is in standby state
(Initial value)
(Initial value)
(Initial value)
(Initial value)
Module standby 5
0 ITU operates normally
1 ITU is in standby state
(Initial value)
φ clock stop
0 φ clock output is enabled (Initial value)
1 φ clock output is disabled
Rev. 3.00 Sep 27, 2006 page 777 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
CSCR—Chip Select Control Register
Bit
H'5F
System control
7
6
5
4
3
2
1
0
CS7E
CS6E
CS5E
CS4E




Initial value
0
0
0
0
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W




Chip select 7 to 4 enable
Bit n
CSnE Description
0
Output of chip select signal CSn is disabled
1
Output of chip select signal CSn is enabled
(Initial value)
(n = 7 to 4)
TSTR—Timer Start Register
Bit
H'60
7
6
5



ITU (all channels)
4
3
2
1
0
STR4
STR3
STR2
STR1
STR0
Initial value
1
1
1
0
0
0
0
0
Read/Write



R/W
R/W
R/W
R/W
R/W
Counter start 0
0 TCNT0 is halted
1 TCNT0 is counting
Counter start 1
0 TCNT1 is halted
1 TCNT1 is counting
Counter start 2
0 TCNT2 is halted
1 TCNT2 is counting
Counter start 3
0 TCNT3 is halted
1 TCNT3 is counting
Counter start 4
0 TCNT4 is halted
1 TCNT4 is counting
Rev. 3.00 Sep 27, 2006 page 778 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
TSNC—Timer Synchro Register
Bit
H'61
ITU (all channels)
7
6
5
4
3
2
1
0



SYNC4
SYNC3
SYNC2
SYNC1
SYNC0
Initial value
1
1
1
0
0
0
0
0
Read/Write



R/W
R/W
R/W
R/W
R/W
Timer sync 0
0 TCNT0 operates independently
1 TCNT0 is synchronized
Timer sync 1
0 TCNT1 operates independently
1 TCNT1 is synchronized
Timer sync 2
0 TCNT2 operates independently
1 TCNT2 is synchronized
Timer sync 3
0 TCNT3 operates independently
1 TCNT3 is synchronized
Timer sync 4
0 TCNT4 operates independently
1 TCNT4 is synchronized
Rev. 3.00 Sep 27, 2006 page 779 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
TMDR—Timer Mode Register
Bit
H'62
ITU (all channels)
7
6
5
4
3
2
1
0

MDF
FDIR
PWM4
PWM3
PWM2
PWM1
PWM0
Initial value
1
0
0
0
0
0
0
0
Read/Write

R/W
R/W
R/W
R/W
R/W
R/W
R/W
PWM mode 0
0 Channel 0 operates normally
1 Channel 0 operates in PWM mode
PWM mode 1
0 Channel 1 operates normally
1 Channel 1 operates in PWM mode
PWM mode 2
0 Channel 2 operates normally
1 Channel 2 operates in PWM mode
PWM mode 3
0 Channel 3 operates normally
1 Channel 3 operates in PWM mode
PWM mode 4
0 Channel 4 operates normally
1 Channel 4 operates in PWM mode
Flag direction
0 OVF is set to 1 in TSR2 when TCNT2 overflows or underflows
1 OVF is set to 1 in TSR2 when TCNT2 overflows
Phase counting mode flag
0 Channel 2 operates normally
1 Channel 2 operates in phase counting mode
Rev. 3.00 Sep 27, 2006 page 780 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
TFCR—Timer Function Control Register
Bit
H'63
ITU (all channels)
7
6
5
4
3
2
1
0


CMD1
CMD0
BFB4
BFA4
BFB3
BFA3
Initial value
1
1
0
0
0
0
0
0
Read/Write


R/W
R/W
R/W
R/W
R/W
R/W
Buffer mode A3
0 GRA3 operates normally
1 GRA3 is buffered by BRA3
Buffer mode B3
0 GRB3 operates normally
1 GRB3 is buffered by BRB3
Buffer mode A4
0 GRA4 operates normally
1 GRA4 is buffered by BRA4
Buffer mode B4
0 GRB4 operates normally
1 GRB4 is buffered by BRB4
Combination mode 1 and 0
Bit 5 Bit 4
CMD1 CMD0 Operating Mode of Channels 3 and 4
0
0
Channels 3 and 4 operate normally
1
0
1
Channels 3 and 4 operate together in complementary PWM mode
1
Channels 3 and 4 operate together in reset-synchronized PWM mode
Rev. 3.00 Sep 27, 2006 page 781 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
TCR0—Timer Control Register 0
Bit
H'64
7
6
5
4
3
ITU0
2
1
0

CCLR1
CCLR0
TPSC2
TPSC1
TPSC0
Initial value
1
0
0
0
0
0
0
0
Read/Write

R/W
R/W
R/W
R/W
R/W
R/W
R/W
CKEG1 CKEG0
Timer prescaler 2 to 0
Bit 2
Bit 1
Bit 0
TPSC2 TPSC1 TPSC0
0
0
0
1
1
0
1
0
1
0
1
1
0
1
TCNT Clock Source
Internal clock: φ
Internal clock: φ/2
Internal clock: φ/4
Internal clock: φ/8
External clock A: TCLKA input
External clock B: TCLKB input
External clock C: TCLKC input
External clock D: TCLKD input
Clock edge 1 and 0
Bit 4 Bit 3
CKEG1 CKEG0
0
0
1
1
—
Counted Edges of External Clock
Rising edges counted
Falling edges counted
Both edges counted
Counter clear 1 and 0
Bit 6
Bit 5
CCLR1 CCLR0 TCNT Clear Source
0
0
TCNT is not cleared
1
TCNT is cleared by GRA compare match or input capture
1
0
TCNT is cleared by GRB compare match or input capture
1
Synchronous clear: TCNT is cleared in synchronization
with other synchronized timers
Rev. 3.00 Sep 27, 2006 page 782 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
TIOR0—Timer I/O Control Register 0
Bit
H'65
ITU0
7
6
5
4
3
2
1
0

IOB2
IOB1
IOB0

IOA2
IOA1
IOA0
Initial value
1
0
0
0
1
0
0
0
Read/Write

R/W
R/W
R/W

R/W
R/W
R/W
I/O control A2 to A0
Bit 2 Bit 1 Bit 0
IOA2 IOA1 IOA0
0
0
0
1
0
1
1
0
1
0
1
0
1
1
I/O control B2 to B0
Bit 6 Bit 5 Bit 4
IOB2 IOB1 IOB0
0
0
0
1
0
1
1
0
1
0
1
0
1
1
GRA Function
GRA is an output
compare register
GRA is an input
capture register
GRB Function
GRB is an output
compare register
GRB is an input
capture register
No output at compare match
0 output at GRA compare match
1 output at GRA compare match
Output toggles at GRA compare match
GRA captures rising edge of input
GRA captures falling edge of input
GRA captures both edges of input
No output at compare match
0 output at GRB compare match
1 output at GRB compare match
Output toggles at GRB compare match
GRB captures rising edge of input
GRB captures falling edge of input
GRB captures both edges of input
Rev. 3.00 Sep 27, 2006 page 783 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
TIER0—Timer Interrupt Enable Register 0
Bit
H'66
ITU0
7
6
5
4
3
2
1
0





OVIE
IMIEB
IMIEA
Initial value
1
1
1
1
1
0
0
0
Read/Write





R/W
R/W
R/W
Input capture/compare match interrupt enable A
0 IMIA interrupt requested by IMFA flag is disabled
1 IMIA interrupt requested by IMFA flag is enabled
Input capture/compare match interrupt enable B
0 IMIB interrupt requested by IMFB flag is disabled
1 IMIB interrupt requested by IMFB flag is enabled
Overflow interrupt enable
0 OVI interrupt requested by OVF flag is disabled
1 OVI interrupt requested by OVF flag is enabled
Rev. 3.00 Sep 27, 2006 page 784 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
TSR0—Timer Status Register 0
Bit
H'67
ITU0
7
6
5
4
3
2
1
0





OVF
IMFB
IMFA
Initial value
1
1
1
1
1
0
0
0
Read/Write





R/(W)*
R/(W)*
R/(W)*
Input capture/compare match flag A
0 [Clearing condition]
Read IMFA when IMFA = 1, then write 0 in IMFA
1 [Setting conditions]
TCNT = GRA when GRA functions as an output compare
register.
TCNT value is transferred to GRA by an input capture
signal, when GRA functions as an input capture register.
Input capture/compare match flag B
0 [Clearing condition]
Read IMFB when IMFB = 1, then write 0 in IMFB
1 [Setting conditions]
TCNT = GRB when GRB functions as an output compare
register.
TCNT value is transferred to GRB by an input capture
signal, when GRB functions as an input capture register.
Overflow flag
0 [Clearing condition]
Read OVF when OVF = 1, then write 0 in OVF
1 [Setting condition]
TCNT overflowed from H'FFFF to H'0000 or
underflowed from H'0000 to H'FFFF
Note: * Only 0 can be written, to clear the flag.
Rev. 3.00 Sep 27, 2006 page 785 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
TCNT0 H/L—Timer Counter 0 H/L
H'68, H'69
ITU0
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Up-counter
GRA0 H/L—General Register A0 H/L
H'6A, H'6B
ITU0
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Output compare or input capture register
GRB0 H/L—General Register B0 H/L
Bit
Initial value
Read/Write
H'6C, H'6D
ITU0
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Output compare or input capture register
TCR1—Timer Control Register 1
Bit
H'6E
ITU1
7
6
5
4
3
2
1
0

CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
Initial value
1
0
0
0
0
0
0
0
Read/Write

R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: Bit functions are the same as for ITU0.
Rev. 3.00 Sep 27, 2006 page 786 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
TIOR1—Timer I/O Control Register 1
Bit
H'6F
ITU1
7
6
5
4
3
2
1
0

IOB2
IOB1
IOB0

IOA2
IOA1
IOA0
Initial value
1
0
0
0
1
0
0
0
Read/Write

R/W
R/W
R/W

R/W
R/W
R/W
Note: Bit functions are the same as for ITU0.
TIER1—Timer Interrupt Enable Register 1
Bit
H'70
ITU1
7
6
5
4
3
2
1
0





OVIE
IMIEB
IMIEA
Initial value
1
1
1
1
1
0
0
0
Read/Write





R/W
R/W
R/W
Note: Bit functions are the same as for ITU0.
TSR1—Timer Status Register 1
Bit
H'71
ITU1
7
6
5
4
3
2
1
0





OVF
IMFB
IMFA
Initial value
1
1
1
1
1
0
0
0
Read/Write





R/(W)*
R/(W)*
R/(W)*
Notes: Bit functions are the same as for ITU0.
* Only 0 can be written, to clear the flag.
TCNT1 H/L—Timer Counter 1 H/L
H'72, H'73
ITU1
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Note: Bit functions are the same as for ITU0.
Rev. 3.00 Sep 27, 2006 page 787 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
GRA1 H/L—General Register A1 H/L
H'74, H'75
ITU1
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Note: Bit functions are the same as for ITU0.
GRB1 H/L—General Register B1 H/L
H'76, H'77
ITU1
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Note: Bit functions are the same as for ITU0.
TCR2—Timer Control Register 2
Bit
H'78
ITU2
7
6
5
4
3
2
1
0

CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
Initial value
1
0
0
0
0
0
0
0
Read/Write

R/W
R/W
R/W
R/W
R/W
R/W
R/W
Notes: 1. Bit functions are the same as for ITU0.
2. When channel 2 is used in phase counting mode, the counter clock source selection by
bits TPSC2 to TPSC0 is ignored.
Rev. 3.00 Sep 27, 2006 page 788 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
TIOR2—Timer I/O Control Register 2
Bit
H'79
ITU2
7
6
5
4
3
2
1
0

IOB2
IOB1
IOB0

IOA2
IOA1
IOA0
Initial value
1
0
0
0
1
0
0
0
Read/Write

R/W
R/W
R/W

R/W
R/W
R/W
Note: Bit functions are the same as for ITU0.
TIER2—Timer Interrupt Enable Register 2
Bit
H'7A
ITU2
7
6
5
4
3
2
1
0





OVIE
IMIEB
IMIEA
Initial value
1
1
1
1
1
0
0
0
Read/Write





R/W
R/W
R/W
Note: Bit functions are the same as for ITU0.
TSR2—Timer Status Register 2
Bit
H'7B
ITU2
7
6
5
4
3
2
1
0





OVF
IMFB
IMFA
Initial value
1
1
1
1
1
0
0
0
Read/Write





R/(W)*
R/(W)*
R/(W)*
The function is the same as ITU0.
Overflow flag
0
[Clearing condition]
Read OVF when OVF = 1, then write 0 in OVF.
[Setting condition]
1
The TCNT value overflows (from H'FFFF to H'0000)
or underflows (from H'0000 to H'FFFF)
Notes: Bit functions are the same as for ITU0.
* Only 0 can be written, to clear the flag.
Rev. 3.00 Sep 27, 2006 page 789 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
TCNT2 H/L—Timer Counter 2 H/L
H'7C, H'7D
ITU2
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Phase counting mode: up/down counter
Other modes:
up-counter
GRA2 H/L—General Register A2 H/L
H'7E, H'7F
ITU2
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Note: Bit functions are the same as for ITU0.
GRB2 H/L—General Register B2 H/L
H'80, H'81
ITU2
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Note: Bit functions are the same as for ITU0.
Rev. 3.00 Sep 27, 2006 page 790 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
TCR3—Timer Control Register 3
Bit
H'82
ITU3
7
6
5
4
3
2
1
0

CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
Initial value
1
0
0
0
0
0
0
0
Read/Write

R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: Bit functions are the same as for ITU0.
TIOR3—Timer I/O Control Register 3
Bit
H'83
ITU3
7
6
5
4
3
2
1
0

IOB2
IOB1
IOB0

IOA2
IOA1
IOA0
Initial value
1
0
0
0
1
0
0
0
Read/Write

R/W
R/W
R/W

R/W
R/W
R/W
Note: Bit functions are the same as for ITU0.
TIER3—Timer Interrupt Enable Register 3
Bit
H'84
ITU3
7
6
5
4
3
2
1
0





OVIE
IMIEB
IMIEA
Initial value
1
1
1
1
1
0
0
0
Read/Write





R/W
R/W
R/W
Note: Bit functions are the same as for ITU0.
Rev. 3.00 Sep 27, 2006 page 791 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
TSR3—Timer Status Register 3
Bit
H'85
ITU3
7
6
5
4
3
2
1
0





OVF
IMFB
IMFA
Initial value
1
1
1
1
1
0
0
0
Read/Write





R/(W)*
R/(W)*
R/(W)*
Bit functions are the
same as for ITU0
Overflow flag
0 [Clearing condition]
Read OVF when OVF = 1, then write 1 in OVF
1 [Setting condition]
TCNT overflowed from H'FFFF to H'0000 or underflowed from
H'0000 to H'FFFF
Note: * Only 0 can be written, to clear the flag.
TCNT3 H/L—Timer Counter 3 H/L
Bit
Initial value
Read/Write
H'86, H'87
ITU3
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Complementary PWM mode: up/down counter
Other modes:
up-counter
GRA3 H/L—General Register A3 H/L
H'88, H'89
ITU3
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Output compare or input capture register (can be buffered)
Rev. 3.00 Sep 27, 2006 page 792 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
GRB3 H/L—General Register B3 H/L
H'8A, H'8B
ITU3
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Output compare or input capture register (can be buffered)
BRA3 H/L—Buffer Register A3 H/L
H'8C, H'8D
ITU3
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Used to buffer GRA
BRB3 H/L—Buffer Register B3 H/L
Bit
Initial value
Read/Write
H'8E, H'8F
ITU3
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Used to buffer GRB
Rev. 3.00 Sep 27, 2006 page 793 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
TOER—Timer Output Enable Register
Bit
H'90
ITU (all channels)
7
6
5
4
3
2
1
0


EXB4
EXA4
EB3
EB4
EA4
EA3
Initial value
1
1
1
1
1
1
1
1
Read/Write


R/W
R/W
R/W
R/W
R/W
R/W
Master enable TIOCA3
0 TIOCA 3 output is disabled regardless of TIOR3, TMDR, and TFCR settings
1 TIOCA 3 is enabled for output according to TIOR3, TMDR, and TFCR settings
Master enable TIOCA4
0 TIOCA 4 output is disabled regardless of TIOR4, TMDR, and TFCR settings
1 TIOCA 4 is enabled for output according to TIOR4, TMDR, and TFCR settings
Master enable TIOCB4
0 TIOCB4 output is disabled regardless of TIOR4 and TFCR settings
1 TIOCB4 is enabled for output according to TIOR4 and TFCR settings
Master enable TIOCB3
0 TIOCB 3 output is disabled regardless of TIOR3 and TFCR settings
1 TIOCB 3 is enabled for output according to TIOR3 and TFCR settings
Master enable TOCXA4
0 TOCXA 4 output is disabled regardless of TFCR settings
1 TOCXA 4 is enabled for output according to TFCR settings
Master enable TOCXB4
0 TOCXB4 output is disabled regardless of TFCR settings
1 TOCXB4 is enabled for output according to TFCR settings
Rev. 3.00 Sep 27, 2006 page 794 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
TOCR—Timer Output Control Register
Bit
H'91
ITU (all channels)
7
6
5
4
3
2
1
0



XTGD


OLS4
OLS3
Initial value
1
1
1
1
1
1
1
1
Read/Write



R/W


R/W
R/W
Output level select 3
0 TIOCB 3 , TOCXA 4 , and TOCXB 4 outputs are inverted
1 TIOCB 3 , TOCXA 4 , and TOCXB 4 outputs are not inverted
Output level select 4
0 TIOCA 3 , TIOCA 4, and TIOCB4 outputs are inverted
1 TIOCA 3 , TIOCA 4, and TIOCB4 outputs are not inverted
External trigger disable
0 Input capture A in channel 1 is used as an external trigger signal in
reset-synchronized PWM mode and complementary PWM mode *
1 External triggering is disabled
Note: * When an external trigger occurs, bits 5 to 0 in TOER are cleared to 0, disabling ITU
output.
Rev. 3.00 Sep 27, 2006 page 795 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
TCR4—Timer Control Register 4
Bit
H'92
ITU4
7
6
5
4
3
2
1
0

CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
Initial value
1
0
0
0
0
0
0
0
Read/Write

R/W
R/W
R/W
R/W
R/W
R/W
R/W
Note: Bit functions are the same as for ITU0.
TIOR4—Timer I/O Control Register 4
Bit
H'93
ITU4
7
6
5
4
3
2
1
0

IOB2
IOB1
IOB0

IOA2
IOA1
IOA0
Initial value
1
0
0
0
1
0
0
0
Read/Write

R/W
R/W
R/W

R/W
R/W
R/W
Note: Bit functions are the same as for ITU0.
TIER4—Timer Interrupt Enable Register 4
Bit
H'94
ITU4
7
6
5
4
3
2
1
0





OVIE
IMIEB
IMIEA
Initial value
1
1
1
1
1
0
0
0
Read/Write





R/W
R/W
R/W
Note: Bit functions are the same as for ITU0.
TSR4—Timer Status Register 4
Bit
H'95
ITU4
7
6
5
4
3
2
1
0





OVF
IMFB
IMFA
Initial value
1
1
1
1
1
0
0
0
Read/Write





R/(W)*
R/(W)*
R/(W)*
Notes: Bit functions are the same as for ITU0.
* Only 0 can be written, to clear the flag.
Rev. 3.00 Sep 27, 2006 page 796 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
TCNT4 H/L—Timer Counter 4 H/L
H'96, H'97
ITU4
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Note: Bit functions are the same as for ITU3.
GRA4 H/L—General Register A4 H/L
H'98, H'99
ITU4
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Note: Bit functions are the same as for ITU3.
GRB4 H/L—General Register B4 H/L
Bit
Initial value
Read/Write
H'9A, H'9B
ITU4
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Note: Bit functions are the same as for ITU3.
BRA4 H/L—Buffer Register A4 H/L
H'9C, H'9D
ITU4
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Note: Bit functions are the same as for ITU3.
Rev. 3.00 Sep 27, 2006 page 797 of 872
REJ09B0325-0300
Appendix B Internal I/O Register
BRB4 H/L—Buffer Register B4 H/L
H'9E, H'9F
ITU4
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
Note: Bit functions are the same as for ITU3.
TPMR—TPC Output Mode Register
Bit
H'A0
TPC
7
6
5
4




Initial value
1
1
1
1
0
0
0
0
Read/Write




R/W
R/W
R/W
R/W
3
2
G3NOV G2NOV
0
1
G1NOV G0NOV
Group 0 non-overlap
0 Normal TPC output in group 0
Output values change at compare match A in the selected ITU channel
1 Non-overlapping TPC output in group 0, controlled by compare match
A and B in the selected ITU channel
Group 1 non-overlap
0 Normal TPC output in group 1
Output values change at compare match A in the selected ITU channel
1 Non-overlapping TPC output in group 1, controlled by compare match
A and B in the selected ITU channel
Group 2 non-overlap
0 Normal TPC output in g