Material Content Data Sheet Sales Product Name BFP 760 H6327 MA# MA001369468 Package PG-SOT343-4-2 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip noble metal non noble metal inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal < 10% gold tin silicon silicon titanium chromium copper gold carbon black epoxy resin silicondioxide tin silver 7440-57-5 7440-31-5 7440-21-3 7440-21-3 7440-32-6 7440-47-3 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 leadframe wire encapsulation leadfinish plating *deviation 20. May 2015 Weight [mg] 6.93 mg Average Mass [%] Sum [%] Average Mass [ppm] 0.003 0.04 388 0.001 0.01 100 0.020 0.29 0.001 0.01 0.003 0.05 498 0.010 0.15 1492 3.433 49.53 49.74 495378 497468 0.010 0.15 0.15 1466 1466 0.030 0.44 0.34 2878 2. 3. 4374 0.652 9.40 2.349 33.90 43.74 338975 94038 437387 0.202 2.91 2.91 29107 29107 0.216 3.12 3.12 31206 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 3366 100 Important Remarks: 1. Sum [ppm] 31206 1000000