HDMI Switch ICs 1 for input 1 output buffer with Termination sense correspondence (Sync with HPD_SINK) BU16024KV No.09063EDT03 ●Description BU16024KV is 1 for input 1output HDMI/DVI buffer LSI. Each port supports 2.25Gbps. (HDMI 1.3a). This device control is simple. It requires only 3.3V and a few GPIO controls. Terminated resistors(50Ω) are integrated at each input port. When HPD_SINK is L, termination resistors are turned off. TMDS inputs are high impedance. This device is integrated equalization function and DDC buffer function, so It can adapt long cable. ●Features 1) Supports 2.25 Gbps signaling rate for 480i/p, 720i/p, and 1080i/p resolution to 12-bit color depth 2) Compatible with HDMI 1.3a 3) 5V tolerance to all DDC and HPD_SINK inputs 4) Integrated DDC buffer 5) Integrated switchable 50Ωreceiver termination 6) Integrated equalizer circuit to adapt long cable 7) Selectable output De-Emphasis Supports 8) High Impedance outputs when disabled 9) HBM ESD protection exceed 10kV 10) 3.3-V supply operation 11) 48-Pin VQFP package 12) ROHS compatible ●Applications Digital TV, DVD Player, Set-Top-Box, Audio Video Receiver, Digital Projector, DVI or HDMI Switch Box, PC ●Line up matrix Part No. Power Supply (V) ESD (KV) BU16020KV 3 to 3.6 10 BU16018KV 3 to 3.6 10 BU16027KV 3 to 3.6 10 BU16006KV 3 to 3.6 10 BU16024KV 3 to 3.6 10 Input (ch) HDMI 4ch HDMI 3ch HDMI 3ch HDMI 2ch HDMI 1ch Output (ch) Data rate (Gbps) Hot Plug Control Termination Sense Correspondence Switching Method DDC Buffer Equalizer De emphasis Package RoHS 2 Yes VQFP100 Yes Yes VQFP80 Yes VQFP64 Yes VQFP64 Yes VQFP48C Yes HDMI 1ch 2.7 Yes Yes GPIO/I C Yes Yes (adaptive) HDMI 1ch 2.25 Yes Yes GPIO Yes Yes HDMI 1ch 2.25 Yes Yes GPIO Yes Yes HDMI 1ch 2.25 Yes Yes GPIO Yes Yes HDMI 1ch 2.25 Yes Yes - Yes Yes www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 1/17 Yes (Always ON) Yes (Always ON) Yes 2009.05 - Rev.D Technical Note BU16024KV ●OUTSIDE DIMENSION CHART BU16024KV 1PIN MARK Lot No. Figure 1-1 Outside dimension chart www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 2/17 2009.05 - Rev.D Technical Note BU16024KV ●BLOCK DIAGRAM VSADJ OE PRE VCC RINT Y4 A4 B4 TMDS Rｘ TMDS Driver TMDS Rｘ TMDS Driver Z4 VCC RINT Y3 A3 B3 Z3 VCC RINT Y2 A2 TMDS Driver TMDS Rｘ B2 Z2 VCC RINT Y1 A1 TMDS Rｘ TMDS Driver Z1 B1 SCL SCL_SINK SDA SDA_SINK I2CEN SELREF HPD HPD_SINK(＊） (*) when HPD_SINK = “L”. Termination resistor is turned off. Figure 2-1 Block Diagram www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 3/17 2009.05 - Rev.D Technical Note BU16024KV ●PIN EXPLANATION 1). PIN ASSIGNMENT SDA Vcc GND SELREF Vcc SDA_SINK SCL_SINK GND TEST2 33 32 31 30 29 28 27 26 25 VSADJ SCL 35 34 TEST3 37 24 38 23 39 22 40 21 41 20 16024KV (48-pin VQFP) 42 43 44 19 18 17 12 11 HPD_SINK GND Z1 Y1 Vcc Z2 Y2 GND Z3 Y3 Vcc NC TEST1 Y4 Z4 10 7 OEB 9 6 8 5 Vcc I2CEN PRE 4 GND GND 3 13 2 14 48 A14 15 47 B14 16 46 1 45 TEST0 HPD GND B11 A11 Vcc B12 A12 GND B13 A13 Vcc NC 36 (TOP VIEW) Figure 3-1 Pin Location www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 4/17 2009.05 - Rev.D Technical Note BU16024KV 2). PIN LIST TERMINAL NAME No. B1, B2, B3, B4 39, 42, 45, 2 A1, A2, A3, A4 40, 43, 46, 3 Z1, Z2, Z3, Z4 22, 19, 16, 11 Y1, Y2, Y3, Y4 21, 18, 15, 10 HPD 37 HPD_SINK 24 SCL 34 SDA 33 SCL_SINK 27 SDA_SINK 28 I/O DESCRIPTION I I O O O I I/O I/O I/O I/O TMDS Negative inputs TMDS Positive inputs TMDS Negative outputs TMDS Positive outputs Hot plug detector output Hot plug detector input DDC Bus clock line to source DDC Bus data line to source DDC Bus clock line to sink DDC Bus data line to sink TMDS Compliant voltage swing control(via 4.64kΩ to GND) I2C Repeater enable Low : High-Z High : Active SCL_SINK/SDA_SINK Output voltage select Open or GND connect (recommend) Open or GND connect (recommend) TMDS Output enable Low : Active High : High-Z TMDS Output de-emphasis adjustment Low : OFF High : ON VSADJ 35 I I2CEN 6 I SELREF TEST0, 1, 2, 3 N.C 30 1, 12, 25, 36 13, 48 I I OEB 7 I PRE 8 I VCC GND 5, 14, 20, 29, 32, 41, 47 4, 9, 17, 23, 26, 31, 38, 44 www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. - Power supply - Ground 5/17 2009.05 - Rev.D Technical Note BU16024KV ● EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS TMDS Input Stage TMDS Output Stage VDD VDD 50Ω 50Ω A B Control Input Stage VDD VDD Y Z PRE OE 10mA R-Side I2C Input/Output Stage T-Side I2C Input/Output Stage VDD SCL_SINK SDA_SINK SCL SDA Control Input Stage VDD VDD Control Input Stage VDD HPD_SINK VDD VDD VDD SELREF HPD Output Stage VDD I2 CEN HPD Figure 4-1 I/O pin schematic diagram www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 6/17 2009.05 - Rev.D Technical Note BU16024KV ●ERECTRICAL SPECIFICATIONS 1.） ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted) ITEM MIN. TYP. MAX. Supply voltage （Vcc） -0.3 4.0 SCL, SCL_SINK, SDA, SDA_SINK, -0.3 6.0 HPD_SINK input voltage Differential input voltage 2.5 4 PRE, I2CEN, SELREF, OEB input voltage -0.3 4 Power dissipation 1200 ※1 Storage temperature range -55 125 ※70mm×70mm×1.6mm glass epoxy board mount.（Reverse Cu occupation rate：15mm×15mm） When it’s used by than Ta=25℃, it’s reduced by 12mW/℃. 2.） RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER VCC Supply voltage TA Operating free-air temperature TMDS DIFFERENTIAL PINS (A/B) VID Receiver peak-to-peak differential input voltage VIC Input common mode voltage RVSADJ Resistor for TMDS compliant voltage swing range AVCC TMDS output termination voltage, see Figure 5-1 RT Termination resistance, see Figure 5-1 Signaling rate STATUS(HPD_SINK) VIH LVTTL High-level input voltage VIL LVTTL Low-level input voltage DDC PINS (SCL_SINK, SDA_SINK,SDA,SCL) VI(DDC) Input voltage www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 7/17 UNIT V V V V mW ℃ MIN. 3.0 0 TYP. 3.3 - MAX. 3.6 70 UNIT V ℃ 150 VCC-0.6 4.6 3 45 0 4.64 3.3 50 - 1560 VCC+0.01 4.68 3.6 55 2.25 mVp-p V kΩ V Ω Gbps 2.4 GND - 5.5 0.8 V V GND - 5.5 V 2009.05 - Rev.D Technical Note BU16024KV 3.） ELECTRICAL CHARACTERISTICS Over recommended operating conditions (unless otherwise noted) LIMITS SYMBOL PARAMETER Icc Supply current PD Power dissipation TMDS DIFFERENTIAL PINS (A/B; Y/Z) Single-ended high-level output VOH voltage Single-ended low-level output VOL voltage Single-ended low-level swing VSWING voltage Overshoot of output differential VOD(O) voltage Undershoot of output VOD(U) differential voltage VOD(pp) RINT ⊿VOC（SS） Steady state output differential voltage with de-emphasis Input termination resistance Change in steady-state common-mode output voltage between logic states www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. TEST CONDITIONS VIH = Vcc,VIL = Vcc-0.4V,RVSADJ = 4.64kΩ RT = 50Ω,AVcc = 3.3V Am/Bm = 2.25 Gbps HDMI data pattern, m = 2,3,4 A1/B1 = 225 MHz clock VIH = Vcc,VIL = Vcc-0.4V,RVSADJ = 4.64kΩ RT = 50Ω,AVcc = 3.3V Am/Bm = 2.25Gbps HDMI data pattern, m = 2,3,4 A1/B1 = 225 MHz clock TYP.(1) MAX. - 140 170 mA - 480 700 mW AVcc 10 AVcc 600 AVcc = 3.3V, RT = 50Ω,PRE = 0V PRE = Vcc Am/Bm = 225 Mbps HDMI data pattern, m = 2,3,4 A1/B1 = 225 MHz clock VIN = 2.9V 8/17 UNIT MIN. - AVcc + 10 AVcc 400 mV mV 400 - 600 mV - 6% 15% 2xVswing - 12% 25% 2xVswing 600 - 920 mVp-p 45 50 55 Ω - 5 - mV 2009.05 - Rev.D Technical Note BU16024KV SYMBOL PARAMETER DDC Input and output Tx (SDA_SINK , SCL_SINK ) IlkR① Input leak current, MIN. LIMITS TYP.(1) MAX VI = 5.5V -10 - 10 uA TEST CONDITIONS UNIT IlkT② Input leak current, VI = Vcc -10 - 10 uA IOHT IILT High-level output current Low-level input current VO = 3.6V VIL = GND Low-level RL = 4.7kΩ 100 250 400 10 10 0.57 0.72 0.87 - uA uA VOLT -10 -10 0.43 0.58 0.73 - VI = 5.5V VI = Vcc VO = 3.6V VIL = GND IOUT = 4mA -10 -10 -10 -10 - - 10 10 10 10 0.2 uA uA uA uA V IOH = - 8mA IOL = 8mA 2.4 0 - Vcc 0.4 V V VIH = Vcc VIL = GND -10 -10 - 10 10 uA uA VIH = Vcc VIL = GND -45 -45 - 45 45 uA uA output voltage Low-level input voltage below output low-level voltage Rx (SDA, SCL) Il kR① Input leak current Il kR② Input leak current I OHR High-level output current I I LR Low-level input current VOLR Low-level output voltage STATUS PINS ( HPD ) VOH (TT L) TTL High–level output voltage VOL (TT L) TTL Low–level output voltage CONTROL PINS (PRE, OEB) IIH High–level digital input current IIL Low–level digital input current VOLT - VIL SELREF = NC SELREF= GND SELREF = Vcc SELREF = NC SELREF= GND SELREF = Vcc V mV CONTROL PINS (I2CEN, SELREF,) IIH IIL High–level digital input current Low–level digital input current STATUS PINS (HPD_SINK) II H High–level digital input current VIH = 5.5V VIH = Vcc 10 5 50 30 100 80 uA uA II L Low–level digital input current VIL = GND -10 - 10 uA www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 9/17 2009.05 - Rev.D Technical Note BU16024KV LIMITS SYMBOL PARAMETER TEST CONDITIONS TMDS DIFFERENTIAL PINS (Y/Z) Propagation delay time tPLH low-high-level output Propagation delay time tPHL high-low-level output Differential output signal rise tr See Figure5-2, AVCC = 3.3V, time (20%-80%) RT = 50Ω, PRE =”H” Differential output signal fall tf time (20%-80%) tsk(p) Pulse skew (|tPHL - tPLH |) Intra-pair differential skew, see tsk(D) Figure5-3 DDC I/O PINS (SCL, SCL_SINK, SDA, SDA_SINK) Propagation delay time, tpdLHTR low-to-high-level output Tx to (DDC) Rx RL = 4.7KΩ CL = 100pF Propagation delay time, tpdHLTR high-to-low-level output Tx to (DDC) Rx Propagation delay time, tpdLHRT low-to-high-level output Rx to (DDC) Tx RL = 1.67KΩ CL = 400pF Propagation delay time, tpdHLRT high-to-low-level output Rx to (DDC) Tx tr Tx(DDC) Tx output Rise time RL = 4.7KΩ CL = 100pF tf Tx(DDC) Tx output Fall time tr Rx(DDC) Rx output Rise time CL=10pF tf Rx(DDC) Rx output Fall time CIO Input/output capacitance STATUS PINS(HPD) Propagation delay time, tpdLH(HPD) low-to-high-level output from HPD_SINK to HPD Propagation delay time, tpdHL(HPD) high-to-low-level output from HPD_SINK to HPD Switch time from port select to tsx(HPD) the latest valid status of HPD UNIT MIN. TYP.(1) MAX. - 320 - ps - 335 - ps - 120 - ps - 120 - ps - 15 - ps - 25 - ps - 650 - ns - 200 - ns - 500 - ns - 350 - ns - 800 150 950 50 - ns ns ns ns VI=0V 15 pF CL=10pF - 5 - ns CL=10pF - 5 - ns CL=10pF - 8 - ns Note: All typical values are at 25℃ and with a 3.3V supply. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 10/17 2009.05 - Rev.D Technical Note BU16024KV ●MEASUREMENT SYMBOL AND CIRCUIT AVCC RT RT Zo = RT TMDS Receiver Zo = RT TMDS Driver Figure 5-1 Termination for TMDS Output Driver Vcc R INT R INT A V ID VA TMDS Driver CL 0.5pF Z TMDS Receiver B VB RT Y AV CC RT VY VZ V ID = V A - V B V swing = V Y - V Z DC Coupled AC Coupled VA Vcc V Vcc+0.2 V VB Vcc-0.4 V Vcc-0.2 V VID 0.4 V VIC VID(pp) 0V -0.4 V tPLH tPLH 80% Vswing VOD(O) VOD(pp) 20% tf 100% 0V Differential 0% tr VOD(U) VOC △VOC(SS) Figure 5-2 Timing Test Circuit and Definitions www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 11/17 2009.05 - Rev.D Technical Note BU16024KV VY VCH 50% VZ VOL tsk(D) Figure 5-3 Definition of Intra-Pair Differential Skew VDD 2 HPD_SINK VDD 2 HPD tpdHL(HPD) tpdLH(HPD) tpdHLRT(DDC) tpdLHRT(DDC) SDA_SINK 80% 20% tpdHLTR(DDC) tpdLHTR(DDC) 1.5V V IL SDA 80% 20% 1.5V tfTX(DDC) trTX(DDC) RX to TX tｆRX(DDC) trRX(DDC) TX to RX Figure 5-4 DDC and HPD Timing Definitions www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 12/17 2009.05 - Rev.D Technical Note BU16024KV 1). Y and Z terminal ESD Diode notice. Y and Z terminals are connected ESD diode. When VCC＋0.4 < AVCC. BU16024KV flow leak current from AVCC to VCC. In order to pass the compliance test. You must use mandatory application, refer Figure 6-1 for “Repeater” or “output Buffer” application. If you use “Repeater” or “output Buffer” power down controler 10kΩ AVCC VCC 10kΩ 10kΩ TEST0 TEST2 TEST1 Figure 6-1 Leak current control 2). HPD_SINK Pull down resistance. HPD_SINK is a 5V tolerant structure shown in Figure 6-2. It needs some drive current to pull down HPD_SINK "H" to "L"(max10uA@HPD_SINK=2V). So to pull down HPD_SINK, please use 10kΩ(or under 10kΩ) resistor. VCC BU16024KV HPD_SINK 10kΩ Figure 6-2 HPD_SINK I/O schematic www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 13/17 2009.05 - Rev.D Technical Note BU16024KV 3). About don’t use terminal. Unused TMDS input channel can be opened. BU16024KV Vcc R INT R INT RT A TMDS Receiver Y TMDS Driver B AVcc Z RT Ｆigure 6-3 TMDS Input Fail-Safe Recommendation Unused DDC Buffers of R side polled up to Vdd . VCC 4.7k T RSCL RSDA TSCL TSDA R Figure 6-4 DDC Buffers in BU16024KV Open unused HPDn. Figure 6-5 Open unused HPDn www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 14/17 2009.05 - Rev.D Technical Note BU16024KV 4）. About serial connect notice. When HDMI sw output connect to other HDMI sw input like following application. There is possibility that. 1080p(12bit) image isn’t displayed. It’s depend on receiver IC characteristic. When system is required 1080p (12bit), Rohm doesn’t recommend serial connect application. Vcc RINT Vcc RINT RINT RINT RT A TMDS Receiver TMDS Driver B Y A Z B TMDS Receiver TMDS Driver Y Z AVCC RT Figure 6-6 serial connect notice 5）. AC Coupling capable. Figure 6-7 AC Coupling capable 6). Offset voltage appearance. If differential input is opened, offset voltage appear at differential output OE is set to low to avoid it. Figure 6-8 Offset voltage avoid www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 15/17 2009.05 - Rev.D Technical Note BU16024KV 7）. Limitation of Master and slave direction. Figure 6-9 Limitation of Master and slave direction www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 16/17 2009.05 - Rev.D Technical Note BU16024KV Ordering part number B U 1 6 0 2 4 ROHM model name K V E 2 Package type VQFP48C Packaging and forming specification E2 =Reel-shaped emboss taping Package specification VQFP48C <Tape and Reel information> 9.0±0.2 7.0±0.1 36 25 Embossed carrier tape Quantity 1500pcs 0.5±0.15 0.75 48 13 1 1PIN MARK Direction of feed E2 direction is the 1pin of product is at the upper left when you hold ( The ) reel on the left hand and you pull out the tape on the right hand +0.05 0.145 -0.03 1.6MAX 0.75 12 1.0±0.2 24 7.0 ± 0.1 9.0 ± 0.2 37 Tape 0.1 ± 0.05 1.4 ± 0.05 4 +6 –4 0.5±0.1 0.08 S +0.05 0.22 -0.04 0.08 1pin M (Unit : mm) www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. Reel 17/17 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2009.05 - Rev.D Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. 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