TI1 LMV761 Lmv761/lmv762/lmv762q low voltage, precision comparator with push-pull output Datasheet

LMV761, LMV762
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SNOS998H – FEBRUARY 2002 – REVISED MARCH 2013
LMV761/LMV762/LMV762Q Low Voltage, Precision Comparator with Push-Pull Output
Check for Samples: LMV761, LMV762
FEATURES
APPLICATIONS
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(VS = 5V, TA = 25°C, typical values unless
specified)
Input Offset Voltage 0.2mV
Input Offset Voltage (Max Over Temp) 1mV
Input Bias Current 0.2pA
Propagation Delay (OD = 50mV) 120 nsec
Low Supply Current 300μA
CMRR 100dB
PSRR 110dB
Extended Temperature Range −40°C to 125°C
Push-Pull Output
Ideal for 2.7V and 5V Single Supply
Applications
Available in Space-Saving Packages:
–
6-Pin SOT-23 (Single w/Shutdown)
–
8-Pin SOIC (single w/Shutdown)
–
8-Pin SOIC/VSSOP (Dual without
Shutdown)
LMV762Q is an Automotive Grade Product that
is AEC-Q100 Grade 1 Qualified and is
Manufactured on an Automotive Grade Flow
Portable and Battery-Powered Systems
Scanners
Set Top Boxes
High Speed Differential Line Receiver
Window Comparators
Zero-Crossing Detectors
High Speed Sampling Circuits
Automotive
DESCRIPTION
The LMV761/LMV762/LMV762Q are precision
comparators intended for applications requiring low
noise and low input offset voltage. The LMV761
single has a shutdown pin that can be used to disable
the device and reduce the supply current. The
LMV761 is available in a space saving 6-Pin SOT-23
or 8-Pin SOIC package. The LMV762 dual is
available in 8-Pin SOIC or VSSOP package and
LMV762Q in VSSOP and SOIC package.
They feature a CMOS input and Push-Pull output
stage. The Push-Pull output stage eliminates the
need for an external pull-up resistor.
The LMV761/LMV762/LMV762Q are designed to
meet the demands of small size, low power and high
performance required by portable and battery
operated electronics.
The input offset voltage has a typical value of 200μV
at room temp and a 1mV limit over temp.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2013, Texas Instruments Incorporated
LMV761, LMV762
SNOS998H – FEBRUARY 2002 – REVISED MARCH 2013
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Typical Circuit
VIN
0.2
VCC
125°
C
0.18
0.16
R1
C1 =
0.1µF
SD
VOS (mV)
VOUT
R2
25°C
0.14
+
85°C
0.12
0.1
0.08
-40°C
0.06
0.04
0.02
VREF
0
2.5
3
3.5
4
4.5
5
VCC (V)
Figure 1. Threshold Detector
2
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Figure 2. VOS vs. VCC
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2)
Human Body Model
ESD Tolerance (3)
2000V
Machine Model
200V
Supply Voltage (V+ – V−)
5.5V
Differential Input Voltage
Supply Voltage
Voltage between any two pins
Output Short Circuit Duration (4)
Supply Voltage
Current at Input Pin
±5 mA
Infrared or Convection (20 sec.)
Soldering Information
Wave Soldering (10 sec.)
235°C
260°C (Lead Temp)
Junction Temperature
150°C
−65°C to 150°C
Storage Temperature Range
(1)
(2)
(3)
(4)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test condition,
see the Electrical Characteristics.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
Unless otherwise specified human body model is 1.5kΩ in series with 100pF. Machine model 200pF.
Applies to both single supply and split supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output current in excess of ±25 mA over long term may adversely
affect reliability.
Operating Ratings
Supply Voltage (V+ – V−)
2.7V to 5.25V
−40°C to +125°C
Temperature Range
Package Thermal Resistance
(1)
(1)
6-Pin SOT-23
265°C/W
8-Pin SOIC
190°C/W
8-Pin VSSOP
235°C/W
The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX)-TA)θJA. All numbers apply for packages soldered directly into a PC board.
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2.7V Electrical Characteristics
Unless otherwise specified, all limited ensured for TJ = 25°C, VCM = V+/2, V+ = 2.7V, V− = 0V−. Boldface limits apply at the
temperature extremes. (1)
Symbol
VOS
Parameter
Condition
Min (2)
Input Offset Voltage
(4)
Typ (3)
Max (2)
Units
0.2
1.0
mV
0.2
50
pA
.001
5
pA
IB
Input Bias Current
IOS
Input Offset Current (4)
CMRR
Common Mode Rejection Ratio
0V < VCM < VCC - 1.3V
80
100
dB
PSRR
Power Supply Rejection Ratio
V+ = 2.7V to 5V
80
110
dB
CMVR
Input Common Mode Voltage
Range
CMRR > 50dB
Output Swing High
IL = 2mA, VID = 200mV
Output Swing Low
IL = −2mA, VID = −200mV
VO
Output Short Circuit Current (5)
ISC
IS
IOUT
tPD
90
Sourcing, VO = 1.35V, VID = 200mV
6.0
20
Sinking, VO = 1.35V, VID = −200mV
6.0
15
V
250
mV
mA
700
μA
LMV762/LMV762Q (Both
Comparators)
550
1400
μA
Output Leakage I @ Shutdown
SD = GND, VO = 2.7V
0.20
Supply Leakage I @ Shutdown
SD = GND, VCC = 2.7V
0.20
Propagation Delay
RL = 5.1kΩ
CL = 50pF
Overdrive = 5mV
270
Overdrive = 10mV
205
Overdrive = 50mV
120
Propagation Delay Skew
tr
Output Rise Time
tf
Output Fall Time
ton
Turn On Time from Shutdown
4
V+ – 0.1
275
tSKEW
(1)
(2)
(3)
(4)
(5)
V+ – 0.35
V
Supply Current LMV761 (Single
Comparator)
LEAKAGE
IS LEAKAGE
−0.3
1.5
μA
2
μA
ns
5
ns
10% to 90%
1.7
ns
90% to 10%
1.8
ns
6
μs
Maximum temperature ensured range is −40°C to 125°C.
All limits are specified by testing or statistical analysis.
Typical values represent the most likely parametric norm.
Specified by design.
Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that TJ = TA. No ensured specification of parametric performance is indicated in the electrical
tables under conditions of internal self-heating where TJ > TA. See Application Information for information on temperature de-rating of
this device. Absolute Maximum Rating indicate junction temperature limits beyond which the device may be permanently degraded,
either mechanically or electrically.
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5.0V Electrical Characteristics
Unless otherwise specified, all limited ensured for TJ = 25°C, VCM = V+/2, V+ = 5.0V, V− = 0V−. Boldface limits apply at the
temperature extremes.
Symbol
Parameter
VOS
Min (1)
Condition
Input Offset Voltage
(3)
Typ (2)
Max (1)
Units
0.2
1.0
mV
0.2
50
pA
0.01
5
pA
IB
Input Bias Current
IOS
Input Offset Current (3)
CMRR
Common Mode Rejection Ratio
0V < VCM < VCC - 1.3V
80
100
dB
PSRR
Power Supply Rejection Ratio
V+ = 2.7V to 5V
80
110
dB
CMVR
Input Common Mode Voltage
Range
CMRR > 50dB
Output Swing High
IL = 4mA, VID = 200mV
Output Swing Low
IL = −4mA, VID = −200mV
VO
Output Short Circuit Current (4)
ISC
IS
IOUT
tPD
V+ – 0.1
120
Sourcing, VO = 2.5V, VID = 200mV
6.0
60
Sinking, VO = 2.5V, VID = −200mV
6.0
40
V
250
mV
mA
225
700
μA
LMV762/LMV762Q (Both
Comparators)
450
1400
μA
Output Leakage I @ Shutdown
SD = GND, VO = 5.0V
0.20
Supply Leakage I @ Shutdown
SD = GND, VCC = 5.0V
0.20
Propagation Delay
RL = 5.1kΩ
CL = 50pF
Overdrive = 5mV
225
Overdrive = 10mV
190
Overdrive = 50mV
120
tSKEW
Propagation Delay Skew
tr
Output Rise Time
tf
Output Fall Time
ton
Turn On Time from Shutdown
(1)
(2)
(3)
(4)
V+ – 0.35
V
Supply Current LMV761 (Single
Comparator)
LEAKAGE
IS LEAKAGE
−0.3
3.8
μA
μA
2
ns
5
ns
10% to 90%
1.7
ns
90% to 10%
1.5
ns
4
μs
All limits are specified by testing or statistical analysis.
Typical values represent the most likely parametric norm.
Specified by design.
Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that TJ = TA. No ensured specification of parametric performance is indicated in the electrical
tables under conditions of internal self-heating where TJ > TA. See Application Information for information on temperature de-rating of
this device. Absolute Maximum Rating indicate junction temperature limits beyond which the device may be permanently degraded,
either mechanically or electrically.
Connection Diagrams
1
6
V
+IN
-
V
2
+
N/C
-IN
5
SD
+IN
3
-IN
1
8
2
7
3
6
N/C
+
1
8
2
7
3
6
OUT A
V
-IN A
OUT
+IN A
+
V
OUT B
-IN B
4
OUT
V
Figure 3. LMV761 (Single) 6-Pin
SOT-23 Top View
-
4
5
SD
Figure 4. LMV761 (Single) 8-Pin
SOIC Top View
V
-
4
5
Figure 5. LMV762/LMV762Q
(Dual) 8-Pin SOIC and VSSOP
Top View
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PSI vs. VCC (VO = High)
0.5
0.4
5
0.4
125°C
85°C
0.35
0.3
0.25
25°C
0.2
0.15
-40°C
0.1
0.05
0
1.5
2
2.5
3
3.5
4.5
4
PSI vs. VCC (VO = Low)
0.5
SUPPLY CURRENT PER CH (mA)
SUPPLY CURRENT PER CH (mA)
Typical Performance Characteristics
5
5.5
6
125°C
0.45
0.4
85°C
0.35
0.3
0.2
5
0.2
0.1
5
0.1
0.0
5
0
1.5
25°C
-40°C
2
2.5
VOS vs. VCC
VS = +2.7V
80
INPUT BIAS CURRENT (fA)
VOS (mV)
6
Input Bias vs. Common Mode @ 25°C
25°C
0.14
85°C
0.12
0.1
0.08
-40°C
0.06
0.04
60
40
20
0
-20
-40
-60
-80
0.02
0
-100
2.5
3
3.5
4
4.5
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7
0
5
COMMON MODE VOLTAGE (V)
VCC (V)
Figure 8.
Figure 9.
Input Bias vs. Common Mode @ 25°C
Output Voltage vs. Supply Voltage
0.4
100
IL =
4mA
0.35
+
OUTPUT VOLTAGE, REF TO V (V)
VS = +5V
80
INPUT BIAS CURRENT (fA)
5.5
100
0.16
60
40
2
0
0
-20
-40
-60
-80
0.3
125°C
0.25
85°C
0.2
25°C
0.15
0.1
-40°C
0.5
0
-100
0
4
3
1
2
COMMON MODE VOLTAGE (V)
5
2
Figure 10.
6
5
Figure 7.
125°
C
0.18
4.5
4
VCC (V)
Figure 6.
0.2
3.5
3
VCC (V)
2.5
3
3.5
4
4.5
5
5.5
6
VCC (V)
Figure 11.
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Typical Performance Characteristics (continued)
Output Voltage vs. Supply Voltage
Output Voltage vs. Supply Voltage
0.4
OUTPUT VOLTAGE REF TO V (V)
IL = 2mA
0.14
+
125°C
IL = 4mA
0.35
125°C
-
OUTPUT VOLTAGE, REF TO V (V)
0.16
0.12
85°C
0.1
25°C
0.08
0.06
0.04
-40°C
0.02
0.3
85°C
0.25
25°C
0.2
0.15
0.1
-40°C
0.05
0
0
2
2.5
3
3.5
4
4.5
5.5
5
2
6
2.5
3
3.5
VCC (V)
Figure 12.
Output Voltage vs. Supply Voltage
ISOURCE vs. VOUT
VCC = 5V
-40°C
70
125°C
-
0.16
25°C
60
0.14
85°C
85°C
ISINK (mA)
OUTPUT VOLTAGE, TO REF V (V)
6
80
IL = 2mA
0.12
25°C
0.1
0.08
50
40
125°C
30
0.06
20
0.04
-40°C
10
0.02
0
0
2
2.5
3
3.5
4
4.5
5.5
5
6
0
VCC (V)
1.5
VOUT (V)
Figure 14.
Figure 15.
ISINK vs. VOUT
60
-40°C
50
1
40°C
ISOURCE (mA)
30
125°C
2.5
VCC = 2.7V
25°
C
20
85°C
2
ISOURCE vs. VOUT
25
25°C
20
0.5
VCC = 5V
40
ISINK (mA)
5.5
Figure 13.
0.2
0.18
5
4.5
4
VCC (V)
85°C
15
125°
C
1
0
5
10
0
0
0
0.5
1
1.5
2
2.5
0
0.2
0.4
0.6
0.8
VOUT (V)
VOUT (V)
Figure 16.
Figure 17.
1
1.2
1.4
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Typical Performance Characteristics (continued)
ISINK vs. VOUT
20
18
1
6
14
500
12
85°C
8
125°
C
6
CL = 50pF
400
25°C
10
RL = 5.1k:
450
PROP DELAY (ns)
ISINK (mA)
Prop Delay vs. Overdrive
40°C
350
300
2.7V
250
200
5V
150
4
100
VCC = 2.7V
2
50
0
0
0
0.2
0.6
0.4
1
0.8
1.2
1
1.4
10
Figure 18.
Figure 19.
2
10mV
5mV
1
OVERDRIVE =
50mV
0
|
|
OVERDRIVE
0
-150
OUTPUT VOLTAGE
(V)
VCC = 2.7V
TEMP = 25°C
LOAD = 5.1k:
50pF
Response Time vs.
Input Overdrives Positive Transition
INPUT VOLTAGE
(mV)
INPUT VOLTAGE
(mV)
OUTPUT VOLTAGE
(V)
Response Time vs.
Input Overdrives Positive Transition
3
6
VCC = 5V
TEMP = 25°C
LOAD = 5.1k:
50pF
5
4
3
50
100
150
200
250
OVERDRIVE =
50mV
1
0
|
|
OVERDRIVE
0
300
0
50
100
150
200
250
TIME (ns)
Figure 20.
Figure 21.
Response Time vs.
Input Overdrives Negative Transition
Response Time vs.
Input Overdrives Negative Transition
2
1
0
VCC = 2.7V
TEMP = 25°C
LOAD = 5.1k:
50pF
10mV
OUTPUT VOLTAGE
(V)
3
5mV
OVERDRIVE =
50mV
|
|
150
0
OVERDRIVE
0
50
100
150
200
TIME (ns)
250
INPUT VOLTAGE
(mV)
OUTPUT VOLTAGE
(V)
5mV
2
TIME (ns)
INPUT VOLTAGE
(mV)
10mV
-150
0
6
5
10mV
VCC = 5V
TEMP = 25°C
LOAD = 5.1k:
50pF
4
3
2
1
5mV
OVERDRIVE =
50mV
0
|
|
150
0
300
OVERDRIVE
0
50
100
150
200
250
TIME (ns)
Figure 22.
8
100
OVERDRIVE (mV)
VOUT (V)
Figure 23.
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APPLICATION INFORMATION
BASIC COMPARATOR
A basic comparator circuit is used to convert analog input signals to digital output signals. The comparator
compares an input voltage (VIN) at the non-inverting input to the reference voltage (VREF) at the inverting pin. If
VIN is less than VREF the output (VO) is low (VOL). However, if VIN is greater than VREF, the output voltage (VO) is
high (VOH).
V
VREF
-
VIN
+
+
VO
V
-
Figure 24. Basic Comparator
HYSTERESIS
The basic comparator configuration may oscillate or produce a noisy output if the applied differential input is near
the comparator's input offset voltage. This tends to occur when the voltage on one input is equal or very close to
the other input voltage. Adding hysteresis can prevent this problem. Hysteresis creates two switching thresholds
(one for the rising input voltage and the other for the falling input voltage). Hysteresis is the voltage difference
between the two switching thresholds. When both inputs are nearly equal, hysteresis causes one input to
effectively move quickly past the other. Thus, moving the input out of the region in which oscillation may occur.
Hysteresis can easily be added to a comparator in a non-inverting configuration with two resistors and positive
feedback Figure 25. The output will switch from low to high when VIN rises up to VIN1, where VIN1 is calculated by
VIN1 = [VREF(R1+R2)] / R2
(1)
The output will switch from high to low when VIN falls to VIN2, where VIN2 is calculated by
VIN2 = [VREF(R1+R2) – (VCC R1)] / R2
(2)
The Hysteresis is the difference between VIN1 and VIN2.
ΔVIN = VIN1 - VIN2 = [VREF(R1+R2) / R2] - [VREF(R1+R2)] - [(VCC R1) / R2] = VCC R1 / R2
(3)
VCC
VREF
VO
VIN
+
R1
R2
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VO
VIN2
0
VIN1
VIN
Figure 25. Non-Inverting Comparator Configuration
INPUT
The LMV761/LMV762 have near zero input bias current. This allows very high resistance circuits to be used
without any concern for matching input resistances. This also allows the use of very small capacitors in R-C type
timing circuits. This reduces the cost of the capacitors and amount of board space used.
SHUTDOWN MODE
The LMV761 features a low-power shutdown pin that is activated by driving SD low. In shutdown mode, the
output is in a high impedance state, supply current is reduced to 20nA and the comparator is disabled. Driving
SD high will turn the comparator on. The SD pin should not be left unconnected due to the fact that it is a high
impedance input. When left unconnected, the output will be at an unknown voltage. Also do not three-state the
SD pin.
The maximum input voltage for SD is 5.5V, referred to ground and is not limited by VCC. This allows the use of
5V logic to drive SD while VCC operates at a lower voltage, such as 3V. The logic threshold limits for SD are
proportional to VCC.
BOARD LAYOUT AND BYPASSING
The LMV761/LMV762 is designed to be stable and oscillation free, but it is still important to include the proper
bypass capacitors and ground pickups. Ceramic 0.1μF capacitors should be placed at both supplies to provide
clean switching. Minimize the length of signal traces to reduce stray capacitance.
10
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REVISION HISTORY
Changes from Revision G (March 2013) to Revision H
•
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 10
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PACKAGE OPTION ADDENDUM
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11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LMV761MA
ACTIVE
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 125
LMV76
1MA
LMV761MA/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LMV76
1MA
LMV761MAX
ACTIVE
SOIC
D
8
2500
TBD
Call TI
Call TI
-40 to 125
LMV76
1MA
LMV761MAX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LMV76
1MA
LMV761MF
ACTIVE
SOT-23
DBV
6
1000
TBD
Call TI
Call TI
-40 to 125
C22A
LMV761MF/NOPB
ACTIVE
SOT-23
DBV
6
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
C22A
LMV761MFX
ACTIVE
SOT-23
DBV
6
3000
TBD
Call TI
Call TI
-40 to 125
C22A
LMV761MFX/NOPB
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
C22A
LMV762MA
ACTIVE
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 125
LMV7
62MA
LMV762MA/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LMV7
62MA
LMV762MAX
ACTIVE
SOIC
D
8
2500
TBD
Call TI
Call TI
-40 to 125
LMV7
62MA
LMV762MAX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LMV7
62MA
LMV762MM
ACTIVE
VSSOP
DGK
8
1000
TBD
Call TI
Call TI
-40 to 125
C23A
LMV762MM/NOPB
ACTIVE
VSSOP
DGK
8
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
C23A
LMV762MMX
ACTIVE
VSSOP
DGK
8
3500
TBD
Call TI
Call TI
-40 to 125
C23A
LMV762MMX/NOPB
ACTIVE
VSSOP
DGK
8
3500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
C23A
LMV762QMA/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LMV76
2QMA
LMV762QMAX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LMV76
2QMA
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
11-Apr-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LMV762QMM/NOPB
ACTIVE
VSSOP
DGK
8
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
C32A
LMV762QMMX/NOPB
ACTIVE
VSSOP
DGK
8
3500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
C32A
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
LMV761MAX
Package Package Pins
Type Drawing
SOIC
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LMV761MAX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LMV761MF
SOT-23
DBV
6
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LMV761MF/NOPB
SOT-23
DBV
6
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LMV761MFX
SOT-23
DBV
6
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LMV761MFX/NOPB
SOT-23
DBV
6
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LMV762MAX
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LMV762MAX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LMV762MM
VSSOP
DGK
8
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LMV762MM/NOPB
VSSOP
DGK
8
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LMV762MMX
VSSOP
DGK
8
3500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LMV762MMX/NOPB
VSSOP
DGK
8
3500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LMV762QMAX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LMV762QMM/NOPB
VSSOP
DGK
8
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LMV762QMMX/NOPB
VSSOP
DGK
8
3500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LMV761MAX
SOIC
D
8
2500
367.0
367.0
35.0
LMV761MAX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LMV761MF
SOT-23
DBV
6
1000
210.0
185.0
35.0
LMV761MF/NOPB
SOT-23
DBV
6
1000
210.0
185.0
35.0
LMV761MFX
SOT-23
DBV
6
3000
210.0
185.0
35.0
LMV761MFX/NOPB
SOT-23
DBV
6
3000
210.0
185.0
35.0
LMV762MAX
SOIC
D
8
2500
367.0
367.0
35.0
LMV762MAX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LMV762MM
VSSOP
DGK
8
1000
210.0
185.0
35.0
LMV762MM/NOPB
VSSOP
DGK
8
1000
210.0
185.0
35.0
LMV762MMX
VSSOP
DGK
8
3500
367.0
367.0
35.0
LMV762MMX/NOPB
VSSOP
DGK
8
3500
367.0
367.0
35.0
LMV762QMAX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LMV762QMM/NOPB
VSSOP
DGK
8
1000
210.0
185.0
35.0
LMV762QMMX/NOPB
VSSOP
DGK
8
3500
367.0
367.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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Click to View Pricing, Inventory, Delivery & Lifecycle Information:
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LMV762QMAX/NOPB LMV762QMA/NOPB