TI CD74HCT112E Dual j-k flip-flop with set and reset negative-edge trigger Datasheet

[ /Title
(CD74
HC112
,
CD74
HCT11
2)
/Subject
(Dual
J-K
FlipFlop
with
Set and
Reset
Nega-
CD54HC112, CD74HC112,
CD54HCT112, CD74HCT112
Data sheet acquired from Harris Semiconductor
SCHS141H
Dual J-K Flip-Flop with Set and Reset
Negative-Edge Trigger
March 1998 - Revised October 2003
Features
Description
• Hysteresis on Clock Inputs for Improved Noise
Immunity and Increased Input Rise and Fall Times
The ’HC112 and ’HCT112 utilize silicon-gate CMOS
technology to achieve operating speeds equivalent to LSTTL
parts. They exhibit the low power consumption of standard
CMOS integrated circuits, together with the ability to drive 10
LSTTL loads.
• Asynchronous Set and Reset
• Complementary Outputs
These flip-flops have independent J, K, Set, Reset, and
Clock inputs and Q and Q outputs. They change state on the
negative-going transition of the clock pulse. Set and Reset
are accomplished asynchronously by low-level inputs.
• Buffered Inputs
• Typical fMAX = 60MHz at VCC = 5V, CL = 15pF,
TA = 25oC
• Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
The HCT logic family is functionally as well as pincompatible with the standard LS logic family.
.
• Wide Operating Temperature Range . . . -55oC to 125oC
Ordering Information
• Balanced Propagation Delay and Transition Times
PART NUMBER
• Significant Power Reduction Compared to LSTTL
Logic ICs
TEMP. RANGE
(oC)
PACKAGE
CD54HC112F3A
-55 to 125
16 Ld CERDIP
• HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC
at VCC = 5V
CD54HCT112F3A
-55 to 125
16 Ld CERDIP
CD74HC112E
-55 to 125
16 Ld PDIP
CD74HC112MT
-55 to 125
16 Ld SOIC
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH
CD74HC112M96
-55 to 125
16 Ld SOIC
CD74HC112NSR
-55 to 125
16 Ld SOP
CD74HC112PW
-55 to 125
16 Ld TSSOP
CD74HC112PWR
-55 to 125
16 Ld TSSOP
CD74HC112PWT
-55 to 125
16 Ld TSSOP
CD74HCT112E
-55 to 125
16 Ld PDIP
Pinout
NOTE: When ordering, use the entire part number. The suffixes 96
and R denote tape and reel. The suffix T denotes a small-quantity
reel of 250.
CD54HC112, CD54HCT112 (CERDIP)
CD74HC112 (PDIP, SOIC, SOP, TSSOP)
CD74HCT112 (PDIP)
TOP VIEW
1CP 1
16 VCC
1K 2
15 1R
1J 3
14 2R
1S 4
13 2CP
1Q 5
12 2K
1Q 6
11 2J
2Q 7
10 2S
GND 8
9 2Q
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
© 2003, Texas Instruments Incorporated
1
CD54HC112, CD74HC112, CD54HCT112, CD74HCT112
Functional Diagram
1S
1J
1K
1CP
1R
2S
2J
2K
2CP
2R
4
3
5
1Q
2
F/F 1
6
1Q
1
15
10
11
9
2Q
12
F/F 2
7
2Q
13
GND = 8
VCC = 16
14
TRUTH TABLE
INPUTS
OUTPUTS
S
R
CP
J
K
Q
Q
L
H
X
X
X
H
L
H
L
X
X
X
L
H
L
L
X
X
X
H (Note 1)
H (Note 1)
H
H
↓
L
L
H
H
↓
H
L
H
L
H
H
↓
L
H
L
H
H
H
↓
H
H
Toggle
H
H
H
X
X
No Change
No Change
H= High Level (Steady State)
L= Low Level (Steady State)
X= Don’t Care
↓= High-to-Low Transition
NOTE:
1. Output states unpredictable if both S and R go High simultaneously after both being low at the same time.
2
CD54HC112, CD74HC112, CD54HCT112, CD74HCT112
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Drain Current, per Output, IO
For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA
Package Thermal Impedance, θJA (see Note 2):
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67oC/W
NS (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64oC/W
D (SOIC) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73oC/W
PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . 108oC/W
Maximum Junction Temperature (Hermetic Package or Die) . 175oC
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time, tr, tf
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0ms (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0ms (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0ms (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
2. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
TEST
CONDITIONS
PARAMETER
SYMBOL
VI (V)
VIH
-
25oC
IO (mA) VCC (V)
-40oC TO 85oC
-55oC TO 125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
2
1.5
-
-
1.5
-
1.5
-
V
4.5
3.15
-
-
3.15
-
3.15
-
V
6
4.2
-
-
4.2
-
4.2
-
V
2
-
-
0.5
-
0.5
-
0.5
V
4.5
-
-
1.35
-
1.35
-
1.35
V
6
-
-
1.8
-
1.8
-
1.8
V
HC TYPES
High Level Input
Voltage
Low Level Input
Voltage
High Level Output
Voltage
CMOS Loads
VIL
VOH
-
VIH or
VIL
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
VOL
VIH or
VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
II
VCC or
GND
-
-
-0.02
2
1.9
-
-
1.9
-
1.9
-
V
4.5
4.4
-
-
4.4
-
4.4
-
V
6
5.9
-
-
5.9
-
5.9
-
V
-
-
-
-
-
-
-
-
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
-5.2
6
5.48
-
-
5.34
-
5.2
-
V
0.02
2
-
-
0.1
-
0.1
-
0.1
V
4.5
-
-
0.1
-
0.1
-
0.1
V
6
-
-
0.1
-
0.1
-
0.1
V
-
-
-
-
-
-
-
-
-
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
5.2
6
-
-
0.26
-
0.33
-
0.4
V
-
6
-
-
±0.1
-
±1
-
±1
µA
3
CD54HC112, CD74HC112, CD54HCT112, CD74HCT112
DC Electrical Specifications
(Continued)
TEST
CONDITIONS
SYMBOL
VI (V)
ICC
VCC or
GND
0
High Level Input
Voltage
VIH
-
Low Level Input
Voltage
VIL
High Level Output
Voltage
CMOS Loads
VOH
PARAMETER
Quiescent Device
Current
25oC
IO (mA) VCC (V)
-40oC TO 85oC
-55oC TO 125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
6
-
-
4
-
40
-
80
µA
-
4.5 to
5.5
2
-
-
2
-
2
-
V
-
-
4.5 to
5.5
-
-
0.8
-
0.8
-
0.8
V
VIH or
VIL
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
±0.1
-
±1
-
±1
µA
HCT TYPES
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage CMOS Loads
VOL
VIH or
VIL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
Quiescent Device
Current
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
II
VCC
and
GND
-
5.5
-
ICC
VCC or
GND
0
5.5
-
-
4
-
40
-
80
µA
∆ICC
(Note 3)
VCC
- 2.1
-
4.5 to
5.5
-
100
360
-
450
-
490
µA
NOTE:
3. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
HCT Input Loading Table
INPUT
UNIT LOADS
1S, 2S
0.5
1K, 2K
0.6
1R, 2R
0.65
1J, 2J, 1CP, 2CP
1
NOTE: Unit Load is ∆ICC limit specified in DC Electrical Specifications table, e.g., 360µA max at 25oC.
Prerequisite For Switching Specifications
PARAMETER
25oC
-40oC TO 85oC -55oC TO 125oC
SYMBOL
TEST
CONDITIONS
VCC
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
tW
-
2
80
-
-
100
-
120
-
ns
4.5
16
-
-
20
-
24
-
ns
6
14
-
-
17
-
20
-
ns
HC TYPES
Pulse Width CP
4
CD54HC112, CD74HC112, CD54HCT112, CD74HCT112
Prerequisite For Switching Specifications
PARAMETER
Pulse Width R, S
Setup Time J, K, to CP
Hold Time J, K, to CP
Removal Time R to CP, S to CP
CP Frequency
(Continued)
25oC
-40oC TO 85oC -55oC TO 125oC
SYMBOL
TEST
CONDITIONS
VCC
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
tW
-
2
80
-
-
100
-
120
-
ns
4.5
16
-
-
20
-
24
-
ns
6
14
-
-
17
-
20
-
ns
2
80
-
-
100
-
120
-
ns
4.5
16
-
-
20
-
24
-
ns
6
14
-
-
17
-
20
-
ns
2
0
-
-
0
-
0
-
ns
4.5
0
-
-
0
-
0
-
ns
6
0
-
-
0
-
0
-
ns
2
80
-
-
100
-
120
-
ns
4.5
16
-
-
20
-
24
-
ns
6
14
-
-
17
-
20
-
ns
2
6
-
-
5
-
4
-
MHz
tSU
-
tH
-
tREM
-
fMAX
-
4.5
30
-
-
25
-
20
-
MHz
6
35
-
-
29
-
23
-
MHz
HCT TYPES
Pulse Width CP
tSU
-
4.5
16
-
-
20
-
24
-
ns
Pulse Width R, S
tW
-
4.5
18
-
-
23
-
27
-
ns
Setup Time J, K, to CP
tH
-
4.5
16
-
-
20
-
24
-
ns
Hold Time J, K, to CP
tREM
-
4.5
3
-
-
3
-
3
-
ns
tW
-
4.5
20
-
-
25
-
30
-
ns
fMAX
-
4.5
30
-
-
25
-
20
-
MHz
SYMBOL
TEST
CONDITIONS
VCC
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
tPLH, tPHL
CL = 50pF
2
-
-
175
-
220
-
265
ns
CL = 50pF
4.5
-
-
35
-
44
-
53
ns
CL = 15pF
5
-
14
-
-
-
-
-
ns
CL = 50pF
6
-
-
30
-
37
-
45
ns
Removal Time R to CP, S to CP
CP Frequency
Switching Specifications Input tr, tf = 6ns
PARAMETER
25oC
-40oC TO 85oC -55oC TO 125oC
HC TYPES
Propagation Delay,
CP to Q, Q
Propagation Delay,
S to Q, Q
Propagation Delay,
R to Q, Q
tPLH, tPHL
tPLH, tPHL
CL = 50pF
2
-
-
155
-
195
-
235
ns
CL = 50pF
4.5
-
-
31
-
39
-
47
ns
CL = 15pF
5
-
13
-
-
-
-
-
ns
CL = 50pF
6
-
-
26
-
33
-
40
ns
CL = 50pF
2
-
-
180
-
225
-
270
ns
CL = 50pF
4.5
-
-
36
-
45
-
54
ns
CL = 15pF
5
-
15
-
-
-
-
-
ns
CL = 50pF
6
-
-
31
-
38
-
46
ns
5
CD54HC112, CD74HC112, CD54HCT112, CD74HCT112
Switching Specifications Input tr, tf = 6ns
(Continued)
25oC
-40oC TO 85oC -55oC TO 125oC
PARAMETER
SYMBOL
TEST
CONDITIONS
Output Transition Time
tTLH, tTHL
CL = 50pF
2
-
-
75
-
95
-
110
ns
CL = 50pF
4.5
-
-
15
-
19
-
22
ns
CL = 50pF
6
-
-
13
-
16
-
19
ns
-
-
-
10
-
10
-
10
pF
5
-
60
-
-
-
-
-
MHz
5
-
12
-
-
-
-
-
pF
CL = 50pF
4.5
-
-
35
-
44
-
53
ns
CL = 15pF
5
-
14
-
-
-
-
-
ns
CL = 50pF
4.5
-
-
32
-
40
-
48
ns
CL = 15pF
5
-
13
-
-
-
-
-
ns
CL = 50pF
4.5
-
-
37
-
46
-
56
ns
CL = 15pF
5
-
14
-
-
-
-
-
ns
CL = 50pF
4.5
-
-
15
-
19
-
22
ns
Input Capacitance
CI
VCC
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
-
CP Frequency
fMAX
Power Dissipation Capacitance
(Notes 4, 5)
CPD
CL = 15pF
-
HCT TYPES
Propagation Delay,
CP to Q, Q
tPLH, tPHL
Propagation Delay,
S to Q, Q
tPLH, tPHL
Propagation Delay,
R to Q, Q
tPLH, tPHL
Output Transition Time
tTLH, tTHL
Input Capacitance
CI
-
-
-
-
10
-
10
-
10
pF
CP Frequency
fMAX
CL = 15pF
5
-
60
-
-
-
-
-
MHz
Power Dissipation Capacitance
(Notes 4, 5)
CPD
-
5
-
20
-
-
-
-
-
pF
NOTES:
4. CPD is used to determine the dynamic power consumption, per flip-flop.
5. PD = CPD VCC2 fi + Σ CL fo where fi = input frequency, fo = output frequency, CL = output load capacitance, VCC = supply voltage.
Test Circuits and Waveforms
tfCL
trCL
CLOCK
90%
10%
tWL + tWH =
I
tWL
50%
tfCL = 6ns
fCL
I
fCL
3V
VCC
50%
10%
tWL + tWH =
trCL = 6ns
CLOCK
50%
2.7V
0.3V
GND
1.3V
0.3V
tWL
tWH
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table. For fMAX, input duty cycle = 50%.
1.3V
1.3V
GND
tWH
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table. For fMAX, input duty cycle = 50%.
FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
6
CD54HC112, CD74HC112, CD54HCT112, CD74HCT112
Test Circuits and Waveforms
tr = 6ns
(Continued)
tf = 6ns
90%
50%
10%
INPUT
GND
tTLH
90%
INVERTING
OUTPUT
tPHL
FIGURE 3. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC
trCL
VCC
90%
GND
tH(H)
3V
2.7V
1.3V
0.3V
GND
tH(H)
tH(L)
VCC
DATA
INPUT
DATA
INPUT
50%
tH(L)
3V
1.3V
1.3V
1.3V
GND
tSU(H)
tSU(H)
tSU(L)
tTLH
90%
OUTPUT
tTHL
90%
50%
10%
tTLH
90%
1.3V
OUTPUT
tREM
3V
SET, RESET
OR PRESET
GND
tTHL
1.3V
10%
FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE
TRIGGERED SEQUENTIAL LOGIC CIRCUITS
tPHL
1.3V
GND
IC
CL
50pF
GND
90%
tPLH
50%
IC
tSU(L)
tPHL
tPLH
tREM
VCC
SET, RESET
OR PRESET
tfCL
CLOCK
INPUT
50%
10%
tPLH
FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
tfCL
trCL
tTLH
1.3V
10%
tPLH
tPHL
GND
tTHL
90%
50%
10%
INVERTING
OUTPUT
3V
2.7V
1.3V
0.3V
INPUT
tTHL
CLOCK
INPUT
tf = 6ns
tr = 6ns
VCC
CL
50pF
FIGURE 6. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE
TRIGGERED SEQUENTIAL LOGIC CIRCUITS
7
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
(1)
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
5962-8970201EA
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
CD54HC112F3A
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
CD54HCT112F3A
ACTIVE
CDIP
J
16
1
TBD
A42 SNPB
N / A for Pkg Type
CD74HC112E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC112EE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HC112M96
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC112M96E4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC112M96G4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC112MT
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC112MTE4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC112MTG4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC112NSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC112NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC112NSRG4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC112PW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC112PWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC112PWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC112PWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC112PWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC112PWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC112PWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC112PWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC112PWTG4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HCT112E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74HCT112EE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
The marketing status values are defined as follows:
Addendum-Page 1
Lead/Ball Finish
MSL Peak Temp (3)
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
CD74HC112M96
Package Package Pins
Type Drawing
SOIC
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
CD74HC112NSR
SO
NS
16
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
CD74HC112PWR
TSSOP
PW
16
2000
330.0
12.4
7.0
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CD74HC112M96
SOIC
D
16
2500
333.2
345.9
28.6
CD74HC112NSR
SO
NS
16
2000
346.0
346.0
33.0
CD74HC112PWR
TSSOP
PW
16
2000
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
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