AD AD7453BRT-R2 Pseudo differential, 555 ksps 12-bit adc in an 8-lead sot-23 Datasheet

Pseudo Differential, 555 kSPS
12-Bit ADC in an 8-Lead SOT-23
AD7453
FUNCTIONAL BLOCK DIAGRAM
FEATURES
Specified for VDD of 2.7 V to 5.25 V
Low power at max throughput rate:
3.3 mW max at 555 kSPS with VDD = 3 V
7.25 mW max at 555 kSPS with VDD = 5 V
Pseudo differential analog input
Wide input bandwidth:
70 dB SINAD at 100 kHz input frequency
Flexible power/serial clock speed management
No pipeline delays
High speed serial interface:
SPI®/QSPI™/MICROWIRE™/DSP compatible
Power-down mode: 1 µA max
8-lead SOT-23 package
VDD
VIN+
12-BIT
SUCCESSIVE
APPROXIMATION
ADC
T/H
VIN–
VREF
SCLK
SDATA
AD7453
CONTROL LOGIC
03155-A-001
CS
APPLICATIONS
Transducer interface
Battery-powered systems
Data acquisition systems
Portable instrumentation
GND
Figure 1.
PRODUCT HIGHLIGHTS
GENERAL DESCRIPTION
1
The AD7453 is a 12-bit, high speed, low power, successive
approximation (SAR) analog-to-digital converter that features a
pseudo differential analog input. This part operates from a
single 2.7 V to 5.25 V power supply and features throughput
rates up to 555 kSPS.
The part contains a low noise, wide bandwidth, differential
track-and-hold amplifier (T/H) that can handle input frequencies up to 3.5 MHz. The reference voltage for the AD7453 is
applied externally to the VREF pin and can range from 100 mV to
VDD, depending on the power supply and what suits the
application.
The conversion process and data acquisition are controlled
using CS and the serial clock, allowing the device to interface
with microprocessors or DSPs. The input signals are sampled on
the falling edge of CS; the conversion is also initiated at this
point.
The SAR architecture of this part ensures that there are no
pipeline delays. The AD7453 uses advanced design techniques
to achieve very low power dissipation.
1.
Operation with 2.7 V to 5.25 V Power Supplies.
2.
High Throughput with Low Power Consumption. With a
3 V supply, the AD7453 offers 3.3 mW max power
consumption for a 555 kSPS throughput rate.
3.
Pseudo Differential Analog Input.
4.
Flexible Power/Serial Clock Speed Management. The
conversion rate is determined by the serial clock, allowing
the power to be reduced as the conversion time is reduced
through the serial clock speed increase. This part also
features a shutdown mode to maximize power efficiency at
lower throughput rates.
5.
Variable Voltage Reference Input.
6.
No Pipeline Delay.
7.
Accurate control of the sampling instant via a CS input and
once-off conversion control.
8.
ENOB > 10 bits Typically with 500 mV Reference.
1
Protected by U.S. Patent Number 6,681,332.
Rev. B
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However, no responsibility is assumed by Analog Devices for its use, nor for any
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Specifications subject to change without notice. No license is granted by implication
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Fax: 781.326.8703
© 2004 Analog Devices, Inc. All rights reserved.
AD7453* PRODUCT PAGE QUICK LINKS
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AD7453
TABLE OF CONTENTS
Specifications..................................................................................... 3
Reference ..................................................................................... 13
Timing Specifications .................................................................. 5
Serial Interface ............................................................................ 13
Absolute Maximum Ratings............................................................ 6
Modes of Operation ....................................................................... 15
ESD Caution.................................................................................. 6
Normal Mode.............................................................................. 15
Pin Configuration and Function Descriptions............................. 7
Power-Down Mode.................................................................... 15
Terminology ...................................................................................... 8
Power-Up Time .......................................................................... 16
AD7453–Typical Performance Characteristics ............................ 9
Power vs. Throughput Rate....................................................... 17
Circuit Information ........................................................................ 11
Microprocessor and DSP Interfacing ...................................... 17
Converter Operation.................................................................. 11
Application Hints ....................................................................... 19
ADC Transfer Function............................................................. 11
Evaluating the AD7453’s Performance .................................... 19
Typical Connection Diagram ................................................... 12
Outline Dimensions ....................................................................... 20
The Analog Input........................................................................ 12
Ordering Guide .......................................................................... 20
Digital Inputs .............................................................................. 13
REVISION HISTORY
2/04—Data Sheet changed from Rev. A to Rev. B
Added Patent Note ....................................................................... 1
1/04—Data Sheet changed from Rev. 0 to Rev. A
Updated Format..............................................................Universal
Changes to General Description ................................................ 1
Changes to Specifications ............................................................ 3
Changes to Timing Specifications .............................................. 5
Changes to Table 4........................................................................ 7
Replaced Figures 11, 12, 13........................................................ 10
Changes to Typical Connection Diagram section ................. 12
Change to Figure 18 ................................................................... 12
Changes to Reference Section................................................... 13
Changes to Timing Example 1.................................................. 14
8/03—Rev. 0: Initial Version
Rev. B | Page 2 of 20
AD7453
SPECIFICATIONS
VDD = 2.7 V to 5.25 V, fSCLK = 10 MHz, fS = 555 kSPS, VREF = 2.5 V, FIN = 100 kHz, TA = TMIN to TMAX, unless otherwise noted
Table 1.
Parameter
DYNAMIC PERFORMANCE
Signal to Noise Ratio (SNR)2
Signal to (Noise + Distortion) (SINAD)2
Total Harmonic Distortion (THD)2
Peak Harmonic or Spurious Noise2
Intermodulation Distortion (IMD)2
Second-Order Terms
Third-Order Terms
Aperture Delay2
Aperture Jitter2
Full-Power Bandwidth2, 3
DC ACCURACY
Resolution
Integral Nonlinearity (INL)2
Differential Nonlinearity (DNL)2
Offset Error2
Gain Error2
ANALOG INPUT
Full-Scale Input Span
Absolute Input Voltage
VIN+
VIN–4
DC Leakage Current
Input Capacitance
REFERENCE INPUT
VREF Input Voltage
DC Leakage Current
VREF Input Capacitance
LOGIC INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IIN
Input Capacitance, CIN 6
LOGIC OUTPUTS
Output High Voltage, VOH
Output Low Voltage, VOL
Floating-State Leakage Current
Floating-State Output Capacitance6
Output Coding
A Version1
B Version1
Unit
70
69
70
–73
–75
–73
–75
70
69
70
–73
–75
–73
–75
dB min
dB min
dB min
dB max
dB max
dB max
dB max
–80
–80
5
50
20
2.5
–80
–80
5
50
20
2.5
dB typ
dB typ
ns typ
ps typ
MHz typ
MHz typ
Guaranteed no missed codes to 12 bits
12
±1.5
±0.95
±3.5
±3
12
±1
±0.95
±3.5
±3
Bits
LSB max
LSB max
LSB max
LSB max
VIN+ – VIN–
VREF
VREF
V
VREF
–0.1 to +0.4
–0.1 to +1.5
±1
30/10
VREF
–0.1 to +0.4
–0.1 to +1.5
±1
30/10
V
V
V
µA max
pF typ
2.5 5
±1
10/30
2.55
±1
10/30
V
µA max
pF typ
2.4
0.8
±1
10
2.4
0.8
±1
10
V min
V max
µA max
pF max
Test Conditions/Comments
fIN = 100 kHz
VDD = 2.7 V to 5.25 V
VDD = 2.7 V to 3.6 V
VDD = 4.75 V to 5.25 V
VDD = 2.7 V to 3.6 V; –78 dB typ
VDD = 4.75 V to 5.25 V; –80 dB typ
VDD = 2.7 V to 3.6 V; –80 dB typ
VDD = 4.75 V to 5.25 V; –82 dB typ
fa = 90 kHz; fb = 110 kHz
@ –3 dB
@ –0.1 dB
VDD = 2.7 V to 3.6 V
VDD = 4.75 V to 5.25 V
When in track/hold
± 1% tolerance for specified performance
When in track/hold
Typically 10 nA, VIN = 0 V or VDD
VDD = 4.75 V to 5.25 V, ISOURCE = 200 µA
VDD = 2.7 V to 3.6 V, ISOURCE = 200 µA
ISINK = 200 µA
Rev. B | Page 3 of 20
2.8
2.8
2.4
2.4
0.4
0.4
±1
±1
10
10
Straight (natural) binary
V min
V min
V max
µA max
pF max
AD7453
Parameter
CONVERSION RATE
Conversion Time
Track-and-Hold Acquisition Time2
Throughput Rate
POWER REQUIREMENTS
VDD
IDD7, 8
Normal Mode (Static)
Normal Mode (Operational)
Full Power-Down Mode
Power Dissipation
Normal Mode (Operational)
Full Power-Down Mode
Test Conditions/Comments
A Version1
B Version1
Unit
1.6 µs with a 10 MHz SCLK
Sine wave input
Full-scale step input
16
250
290
555
16
250
290
555
SCLK cycles
ns max
ns max
kSPS max
2.7/5.25
2.7/5.25
V min/max
SCLK on or off
VDD = 4.75 V to 5.25 V
VDD= 2.7 V to 3.6 V
SCLK on or off
0.5
1.5
1.2
1
0.5
1.5
1.2
1
mA typ
mA max
mA max
µA max
VDD = 5 V; 1.55 mW typ for 100 kSPS7
VDD = 3 V; 0.64 mW typ for 100 kSPS7
VDD = 5 V; SCLK on or off
VDD = 3 V; SCLK on or off
7.25
3.3
5
3
7.25
3.3
5
3
mW max
mW max
µW max
µW max
1
Temperature ranges as follows: A, B versions: –40°C to +85°C.
See Terminology section.
3
Analog inputs with slew rates exceeding 27 V/µs (full-scale input sine wave > 3.5 MHz) within the acquisition time may cause an incorrect result to be returned by the
converter.
4
A small dc input is applied to VIN– to provide a pseudo ground for VIN+.
5
The AD7453 is functional with a reference input in the range 100 mV to VDD.
6
Guaranteed by characterization.
7
See Power vs. Throughput Rate section.
8
Measured with a full-scale dc input.
2
Rev. B | Page 4 of 20
AD7453
TIMING SPECIFICATIONS
Guaranteed by characterization. All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage
level of 1.6 V.
See Figure 2 and the Serial Interface section.
VDD = 2.7 V to 5.25 V, fSCLK = 10 MHz, fS = 555 kSPS, VREF = 2.5 V, TA = TMIN to TMAX, unless otherwise noted.
Table 2.
Parameter
fSCLK1
tCONVERT
tQUIET
t1
t2
t32
t42
t5
t6
t7
t83
tPOWER-UP 4
Limit at TMIN, TMAX
10
10
16 × tSCLK
1.6
60
10
10
20
40
0.4 tSCLK
0.4 tSCLK
10
10
35
1
Unit
kHz min
MHz max
Description
tSCLK = 1/fSCLK
µs max
ns min
ns min
ns min
ns max
ns max
ns min
ns min
ns min
ns min
ns max
µs max
Minimum quiet time between the end of a serial read and the next falling edge of CS
Minimum CS pulse width
CS falling edge to SCLK falling edge setup time
Delay from CS falling edge until SDATA three-state disabled
Data access time after SCLK falling edge
SCLK high pulse width
SCLK low pulse width
SCLK edge to data valid hold time
SCLK falling edge to SDATA three-state enabled
SCLK falling edge to SDATA three-state enabled
Power-up time from full power-down
t1
CS
SCLK
2
3
t3
SDATA
tCONVERT
t5
1
4
5
0
0
4 LEADING ZEROS
0
14
DB11
DB10
15
t6
t7
t4
0
B
13
DB2
16
t8
DB1
DB0
tQUIET
THREE-STATE
03155-A-002
t2
Figure 2. AD7453 Serial Interface Timing Diagram
1
Mark/space ratio for the SCLK input is 40/60 to 60/40.
Measured with the load circuit of Figure 3 and defined as the time required for the output to cross 0.8 V or 2.4 V with VDD = 5 V, and the time required for an output to
cross 0.4 V or 2.0 V for VDD = 3 V.
3
t8 is derived from the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 3. The measured number is then extrapolated
back to remove the effects of charging or discharging the 25 pF capacitor. This means that the time, t8, quoted in the timing characteristics is the true bus relinquish
time of the part and is independent of the bus loading.
4
See Power-Up Time section.
2
Rev. B | Page 5 of 20
AD7453
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
1.6mA
IOL
Table 3.
Rating
–0.3 V to +7 V
–0.3 V to VDD + 0.3 V
–0.3 V to VDD + 0.3 V
–0.3 V to +7 V
–0.3 V to VDD + 0.3 V
–0.3 V to VDD + 0.3 V
±10 mA
TO OUTPUT
PIN
1.6V
CL
25pF
200µA
Figure 3. Load Circuit for Digital Output Timing Specifications
–40°C to +85°C
–65°C to +85°C
150°C
211.5°C/W (SOT-23)
91.99°C/W (SOT-23)
215°C
220°C
1 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
1
Transient currents of up to 100 mA will not cause SCR latch-up.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. B | Page 6 of 20
IOH
03155-A-003
Parameter
VDD to GND
VIN+ to GND
VIN– to GND
Digital Input Voltage to GND
Digital Output Voltage to GND
VREF to GND
Input Current to Any Pin Except Supplies1
Operating Temperature Range
Commercial (A, B Version)
Storage Temperature Range
Junction Temperature
θJA Thermal Impedance
θJC Thermal Impedance
Lead Temperature, Soldering
Vapor Phase (60 secs)
Infrared (15 secs)
ESD
AD7453
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
SDATA 3
CS 4
8
AD7453
VREF
VIN+
TOP VIEW
6 VIN–
(Not to Scale)
5 GND
7
03155-A-004
VDD 1
SCLK 2
Figure 4. Pin Function Descriptions
Table 4. Pin Function Descriptions
Mnemonic
VREF
VIN+
VIN–
GND
CS
SDATA
SCLK
VDD
Function
Reference Input for the AD7453. An external reference in the range 100 mV to VDD must be applied to this input. The specified
reference input is 2.5 V. This pin should be decoupled to GND with a capacitor of at least 0.1 µF.
Noninverting Analog Input.
Inverting Input. This pin sets the ground reference point for the VIN+ input. Connect to ground or to a dc offset to provide a
pseudo ground.
Analog Ground. Ground reference point for all circuitry on the AD7453. All analog input signals and any external reference
signal should be referred to this GND voltage.
Chip Select. Active low logic input. This input provides the dual function of initiating a conversion on the AD7453 and
framing the serial data transfer.
Serial Data. Logic output. The conversion result from the AD7453 is provided on this output as a serial data stream. The bits
are clocked out on the falling edge of the SCLK input. The data stream of the AD7453 consists of four leading zeros followed
by the 12 bits of conversion data that are provided MSB first. The output coding is straight (natural) binary.
Serial Clock. Logic input. SCLK provides the serial clock for accessing data from the part. This clock input is also used as the
clock source for the conversion process.
Power Supply Input. VDD is 2.7 V to 5.25 V. This supply should be decoupled to GND with a 0.1 µF capacitor and a 10 µF
tantalum capacitor.
Rev. B | Page 7 of 20
AD7453
TERMINOLOGY
Signal-to-(Noise + Distortion) Ratio
The measured ratio of signal to (noise + distortion) at the
output of the ADC. The signal is the rms amplitude of the fundamental. Noise is the sum of all nonfundamental signals up to
half the sampling frequency (fS/2), excluding dc. The ratio is
dependent on the number of quantization levels in the digitization process; the more levels, the smaller the quantization noise.
The theoretical signal-to-(noise + distortion) ratio for an ideal
N-bit converter with a sine wave input is given by
as per the THD specification where it is the ratio of the rms
sum of the individual distortion products to the rms amplitude
of the sum of the fundamentals expressed in dB.
Aperture Delay
The amount of time from the leading edge of the sampling
clock until the ADC actually takes the sample.
Aperture Jitter
The sample-to-sample variation in the effective point in time at
which the actual sample is taken.
Signal-to-(Noise + Distortion) = (6.02N + 1.76) dB
Thus, for a 12-bit converter, this is 74 dB.
Full Power Bandwidth
Total Harmonic Distortion (THD)
Total harmonic distortion is the ratio of the rms sum of
harmonics to the fundamental. For the AD7453, it is defined as
THD (dB) = 20 log
V2 2 + V3 2 + V4 2 + V5 2 + V6 2
V1
The full power bandwidth of an ADC is the input frequency at
which the amplitude of the reconstructed fundamental is
reduced by 0.1 dB or 3 dB for a full-scale input.
Integral Nonlinearity (INL)
where V1 is the rms amplitude of the fundamental and V2, V3,
V4, V5, and V6 are the rms amplitudes of the second to the sixth
harmonics.
The maximum deviation from a straight line passing through
the endpoints of the ADC transfer function.
Differential Nonlinearity (DNL)
The difference between the measured and the ideal 1 LSB
change between any two adjacent codes in the ADC.
Peak Harmonic or Spurious Noise
Peak harmonic or spurious noise is defined as the ratio of the
rms value of the next largest component in the ADC output
spectrum (up to fS/2 and excluding dc) to the rms value of the
fundamental. Normally, the value of this specification is determined by the largest harmonic in the spectrum, but for ADCs
where the harmonics are buried in the noise floor, it is a noise
peak.
Intermodulation Distortion
With inputs consisting of sine waves at two frequencies, fa and
fb, any active device with nonlinearities creates distortion
products at the sum and difference frequencies of mfa ± nfb
where m, n = 0, 1, 2, 3, and so on. Intermodulation distortion
terms are those for which neither m nor n are equal to zero. For
example, the second-order terms include (fa + fb) and (fa − fb),
while the third-order terms include (2fa + fb), (2fa − fb),
(fa + 2fb), and (fa − 2fb).
The AD7453 is tested using the CCIF standard where two input
frequencies near the top end of the input bandwidth are used.
In this case, the second-order terms are usually distanced in
frequency from the original sine waves while the third-order
terms are usually at a frequency close to the input frequencies.
As a result, the second- and third-order terms are specified
separately. The calculation of the intermodulation distortion is
Offset Error
The deviation of the first code transition (000...000 to 000...001)
from the ideal (i.e., AGND + 1 LSB)
Gain Error
This is the deviation of the last code transition (111...110 to
111...111) from the ideal (i.e., VREF – 1 LSB), after the offset
error has been adjusted out.
Track-and-Hold Acquisition Time
The minimum time required for the track and hold amplifier to
remain in track mode for its output to reach and settle to within
0.5 LSB of the applied input signal.
Power Supply Rejection Ratio (PSRR)
The ratio of the power in the ADC output at full-scale frequency, f, to the power of a 100 mV p-p sine wave applied to the
ADC VDD supply of frequency fS. The frequency of this input
varies from 1 kHz to 1 MHz.
PSRR(dB) = 10log(Pf/PfS)
Pf is the power at frequency f in the ADC output; Pfs is the
power at frequency fS in the ADC output.
Rev. B | Page 8 of 20
AD7453
AD7453–TYPICAL PERFORMANCE CHARACTERISTICS
Default Conditions: TA = 25°C, fS = 555 kSPS, fSCLK = 10 MHz, VDD = 2.7 V to 5.25 V, VREF = 2.5 V, unless otherwise noted.
1.0
75
VDD = 5.25V
0.8
0.6
70
DNL ERROR (LSB)
SINAD (dB)
VDD = 4.75V
VDD = 3.6V
VDD = 2.7V
65
0.4
0.2
0
–0.2
–0.4
60
55
10
100
03155-A-008
03155-A-005
–0.6
–0.8
–1.0
0
277
1024
2048
CODE
FREQUENCY (kHz)
3072
4096
Figure 8. Typical DNL for the AD7453 for VDD = 5 V
Figure 5. SINAD vs. Analog Input Frequency for Various Supply Voltages
0
1.0
100mV p-p SINE WAVE ON VDD
NO DECOUPLING ON VDD
–20
0.8
0.6
INL ERROR (LSB)
PSRR (dB)
–40
–60
VDD = 3V
–80
VDD= 5V
0.4
0.2
0
–0.2
–0.4
–100
–140
0
100
200 300 400 500 600 700 800
SUPPLY RIPPLE FREQUENCY (kHz)
03155-A-009
03155-A-006
–0.6
–120
–0.8
–1.0
0
900 1000
Figure 6. PSRR vs. Supply Ripple Frequency without Supply Decoupling
0
3072
4096
Figure 9. Typical INL for the AD7453 for VDD = 5 V
9949
CODES
9000
8000
7000
6000
–60
5000
–80
4000
3000
–100
–120
–140
0
100
200
FREQUENCY (kHz)
03155-A-010
2000
03155-A-007
SNR (dB)
–40
2048
CODE
10000
8192 POINT FFT
fSAMPLE = 555kSPS
fIN = 100kSPS
SINAD = 71.7dB
THD = –82dB
SFDR = –83dB
–20
1024
1000
27 CODES
0
2046
277
2047
24 CODES
2048
2049
2050
2051
CODES
Figure 10. Histogram of 10,000 Conversions of a DC Input
Figure 7. Dynamic Performance for VDD = 5 V
Rev. B | Page 9 of 20
AD7453
4.0
12
VDD = 3V
3.5
11
2.5
2.0
1.5
1.0
POSITIVE DNL
0.5
0
NEGATIVE DNL
–1.0
0
1
2
3
4
3
2
POSITIVE INL
0
NEGATIVE INL
03155-A-012
CHANGE IN INL (LSB)
2
3
4
Figure 13. ENOB vs. VREF for VDD = 3 V and 5 V
4
–1
–2
2
1
VREF (V)
5
1
VDD = 5V
0
Figure 11. Change in DNL vs. VREF for VDD = 5 V
0
8
6
5
VREF (V)
1
9
7
03155-A-011
–0.5
10
03155-A-013
EFFECTIVE NUMBER OF BITS
CHANGE IN DNL (LSB)
3.0
3
4
5
VREF (V)
Figure 12. Change in INL vs. VREF for VDD = 5 V
Rev. B | Page 10 of 20
5
AD7453
CIRCUIT INFORMATION
The AD7453 has an on-chip differential track-and-hold
amplifier, a successive approximation (SAR) ADC, and a serial
interface, housed in an 8-lead SOT-23 package. The serial clock
input accesses data from the part and provides the clock source
for the successive approximation ADC. The AD7453 features a
power-down option for reduced power consumption between
conversions. The power-down feature is implemented across the
standard serial interface, as described in the Modes of
Operation section.
When the ADC starts a conversion (Figure 15), SW3 opens and
SW1 and SW2 move to Position B, causing the comparator to
become unbalanced. Both inputs are disconnected once the
conversion begins. The control logic and charge redistribution
DACs are used to add and subtract fixed amounts of charge
from the sampling capacitor arrays to bring the comparator
back into a balanced condition. When the comparator is rebalanced, the conversion is complete. The control logic generates
the ADC’s output code. The output impedances of the sources
driving the VIN+ and VIN– pins must be matched; otherwise the
two inputs have different settling times, resulting in errors.
CAPACITIVE
DAC
CS
B
VIN+
A
SW1
A
SW2
CONTROL
LOGIC
SW3
CONVERTER OPERATION
VIN–
CAPACITIVE
DAC
ADC TRANSFER FUNCTION
The output coding for the AD7453 is straight (natural) binary.
The designed code transitions occur at successive LSB values
(i.e., 1 LSB, 2 LSB, and so on). The LSB size is VREF/4096. The
ideal transfer characteristic of the AD7453 is shown in
Figure 16.
1LSB = VREF/4096
VREF
111...11
111...10
CS
COMPARATOR
CAPACITIVE
DAC
Figure 14. ADC Acquisition Phase
111...00
011...11
000...10
000...01
000...00
0V 1LSB
VREF – 1LSB
ANALOG INPUT
Figure 16. Ideal Transfer Characteristic
Rev. B | Page 11 of 20
03155-A-016
SW2
CONTROL
LOGIC
ADC CODE
A
B
Figure 15. ADC Conversion Phase
SW1
SW3
VIN–
COMPARATOR
CAPACITIVE
DAC
03155-A-014
A
VREF
CS
B
VIN+
CS
B
The AD7453 is a successive approximation ADC based around
two capacitive DACs. Figure 14 and Figure 15 show simplified
schematics of the ADC in the acquisition and conversion phase,
respectively. The ADC is comprised of control logic, an SAR,
and two capacitive DACs. In Figure 14 (acquisition phase), SW3
is closed and SW1 and SW2 are in Position A, the comparator is
held in a balanced condition, and the sampling capacitor arrays
acquire the differential signal on the input.
03155-A-015
The AD7453 is a 12-bit, low power, single-supply, successive
approximation analog-to-digital converter (ADC) with a
pseudo differential analog input. It operates with a single 2.7 V
to 5.25 V power supply and is capable of throughput rates up to
555 kSPS when supplied with a 10 MHz SCLK. It requires an
external reference to be applied to the VREF pin.
AD7453
TYPICAL CONNECTION DIAGRAM
R
+2.7V TO +5.25V
SUPPLY
10µF
0.1µF
SERIAL
INTERFACE
VDD
AD7453
VREF
P-TO-P
VIN+
SCLK
SDATA
µC/µP
CS
VIN–
VREF
0.1µF
GND
2.5V
AD780
03155-A-017
DC INPUT
VOLTAGE
Figure 17. Typical Connection Diagram
THE ANALOG INPUT
The AD7453 has a pseudo differential analog input. The VIN+
input is coupled to the signal source and must have an amplitude of VREF p-p to make use of the full dynamic range of the
part. A dc input is applied to VIN–. The voltage applied to this
input provides an offset from ground or a pseudo ground for
the VIN+ input. The main benefit of pseudo differential inputs
is that they separate the analog input signal ground from the
ADC’s ground, allowing dc common-mode voltages to be
cancelled.
+1.25V
0V
–1.25V
R
VIN
VIN+
3R
AD7453
R
0.1µF
VREF
VIN–
03155-A-018
Figure 17 shows a typical connection diagram for the AD7453.
In this setup, the GND pin is connected to the analog ground
plane of the system. The VREF pin is connected to the AD780, a
2.5 V decoupled reference source. The signal source is connected to the VIN+ analog input via a unity gain buffer. A dc voltage
is connected to the VIN– pin to provide a pseudo ground for the
VIN+ input. The VDD pin should be decoupled to AGND with a
10 µF tantalum capacitor in parallel with a 0.1 µF ceramic
capacitor. The reference pin should be decoupled to AGND with
a capacitor of at least 0.1 µF. The conversion result is output in a
16-bit word with four leading zeros followed by the MSB of the
12-bit result.
2.5V
1.25V
0V
EXTERNAL
VREF (2.5V)
Figure 18. Op Amp Configuration to Level Shift a Bipolar Input Signal
Analog Input Structure
Figure 19 shows the equivalent circuit of the analog input structure of the AD7453. The four diodes provide ESD protection for
the analog inputs. Care must be taken to ensure that the analog
input signals never exceed the supply rails by more than
300 mV. This causes these diodes to become forward biased and
to start conducting into the substrate. These diodes can conduct
up to 10 mA without causing irreversible damage to the part.
The capacitors, C1 in Figure 19, are typically 4 pF and can be
attributed primarily to pin capacitance. The resistors are
lumped components made up of the on resistance of the
switches. The value of these resistors is typically about 100 Ω.
The capacitors C2 are the ADC’s sampling capacitors, and have
a typical capacitance of 16 pF.
For ac applications, removing high frequency components from
the analog input signal through the use of an RC low-pass filter
on the relevant analog input pins is recommended. In applications where harmonic distortion and signal-to-noise ratio are
critical, the analog input should be driven from a low impedance source. Large source impedances significantly affect the ac
performance of the ADC, which may necessitate the use of an
input buffer amplifier. The choice of the op amp is a function of
the particular application.
Because the ADC operates from a single supply, it is necessary
to level shift ground-based bipolar signals to comply with the
input requirements. An op amp (for example, the AD8021) can
be configured to rescale and level shift a ground-based (bipolar)
signal so that it is compatible with the input range of the
AD7453. See Figure 18.
VDD
D
VIN+
C1
R1
C2
R1
C2
D
VDD
When a conversion takes place, the pseudo ground corresponds
to 0 and the maximum analog input corresponds to 4096.
D
VIN–
D
03155-A-019
C1
Figure 19. Equivalent Analog Input Circuit.
Conversion Phase—Switches Open; Track Phase—Switches Closed
Rev. B | Page 12 of 20
AD7453
When no amplifier is used to drive the analog input, the source
impedance should be limited to low values. The maximum
source impedance depends on the amount of total harmonic
distortion (THD) that can be tolerated. The THD increases as
the source impedance increases and performance degrades.
Figure 20 shows a graph of the THD versus analog input signal
frequency for different source impedances.
0
–10
–20
An external source is required to supply the reference to the
AD7453. This reference input can range from 100 mV to VDD.
The specified reference is 2.5 V for the 2.7 V to 5.25 V power
supply range. The reference input chosen for an application
should never be greater than the power supply. Errors in the
reference source result in gain errors in the AD7453 transfer
function. A capacitor of at least 0.1 µF should be placed on the
VREF pin. Suitable reference sources for the AD7453 include the
AD780 and the ADR421. Figure 22 shows a typical connection
diagram for the VREF pin.
VDD
–40
–50
200Ω
NC
100Ω
–70
VDD
–90
10Ω
–100
10
62Ω
100
INPUT FREQUENCY (kHz)
03155-A-020
–80
0.1µF
TA = 25°C
–60
–65
VDD = 2.7V
7
3 TEMP VOUT
6
NC
2.5V
4 GND
TRIM 5
NC
0.1µF
Figure 22. Typical VREF Connection Diagram for VDD = 5 V
SERIAL INTERFACE
VDD = 3.6V
Once 13 SCLK falling edges have occurred, the track-and-hold
goes back into track mode on the next SCLK rising edge, as
shown at Point B in Figure 2. On the 16th SCLK falling edge, the
SDATA line goes back into three-state.
VDD = 5.25V
100
03155-A-021
VDD = 4.75V
–85
–90
10
2 VIN
VREF
Figure 2 shows a detailed timing diagram of the serial interface
of the AD7453. The serial clock provides the conversion clock
and controls the transfer of data from the device during
conversion. CS initiates the conversion process and frames the
data transfer. The falling edge of CS puts the track-and-hold
into hold mode and takes the bus out of three-state. The analog
input is sampled and the conversion is initiated at this point.
The conversion requires 16 SCLK cycles to complete.
–55
–80
NC
NC = NO CONNECT
–50
–75
0.1µF
OPSEL 8
1
*ADDITIONAL PINS OMITTED FOR CLARITY
Figure 21 shows a graph of THD versus analog input frequency
for various supply voltages while sampling at 555 kSPS with an
SCLK of 10 MHz. In this case, the source impedance is 10 Ω.
–70
10nF
277
Figure 20. THD vs. Analog Input Frequency for Various Source Impedances
THD (dBs)
AD7453*
AD780
–60
03155-A-022
THD (dB)
–30
REFERENCE
277
INPUT FREQUENCY (kHz)
Figure 21. THD vs. Analog Input Frequency for Various Supply Voltages
DIGITAL INPUTS
The digital inputs applied to the AD7453 are not limited by the
maximum ratings that limit the analog inputs. Instead, the
digital inputs applied, i.e., CS and SCLK, can go to 7 V and are
not restricted by the VDD + 0.3 V limits as on the analog input.
The main advantage of the inputs not being restricted to the
VDD + 0.3 V limit is that power supply sequencing issues are
avoided. If CS or SCLK are applied before VDD, there is no risk
of latch-up as there would be on the analog inputs if a signal
greater than 0.3 V were applied prior to VDD.
If the rising edge of CS occurs before 16 SCLKs have elapsed,
the conversion is terminated and the SDATA line goes back into
three-state.
The conversion result from the AD7453 is provided on the
SDATA output as a serial data stream. The bits are clocked out
on the falling edge of the SCLK input. The data stream of the
AD7453 consists of four leading zeros, followed by 12 bits of
conversion data, provided MSB first. The output coding is
straight (natural) binary.
Rev. B | Page 13 of 20
AD7453
Sixteen serial clock cycles are required to perform a conversion
and to access data from the AD7453. CS going low provides the
first leading zero to be read in by the microcontroller or DSP.
The remaining data is then clocked out on the subsequent
SCLK falling edges, beginning with the second leading zero.
Thus the first falling clock edge on the serial clock provides the
second leading zero. The final bit in the data transfer is valid on
the 16th falling edge, having been clocked out on the previous
(15th) falling edge. Once the conversion is complete and the data
has been accessed after the 16 clock cycles, it is important to
ensure that, before the next conversion is initiated, enough time
is left to meet the acquisition and quiet time specifications. See
Timing Example 1.
Timing Example 1
In applications with a slower SCLK, it may be possible to read in
data on each SCLK rising edge, i.e., the first rising edge of SCLK
after the CS falling edge would have the leading zero provided,
and the 15th SCLK edge would have DB0 provided.
This 540 ns satisfies the requirement of 290 ns for tACQ. From
Figure 23, tACQ comprises
Having FSCLK = 10 MHz and a throughput rate of 555 kSPS gives
a cycle time of
1/Throughput = 1/555,000 = 1.8 µs
A cycle consists of
t2 + 12.5(1/FSCLK) + tACQ = 1.8 µs
Therefore if t2 = 10 ns,
10 ns + 12.5(1/10 MHz) + tACQ = 1.8 µs
tACQ = 540 ns
2.5(1/FSCLK) + t8 + tQUIET
where t8 = 35 ns. This allows a value of 255 ns for tQUIET,
satisfying the minimum requirement of 60 ns.
CS
10ns
SCLK
tCONVERT
t5
1
2
3
4
5
13
14
t6
15
16
t8
tQUIET
tACQUISITION
12.5(1/FSCLK)
1/THROUGHPUT
Figure 23. Serial Interface Timing Example
Rev. B | Page 14 of 20
03155-A-023
t2
AD7453
MODES OF OPERATION
The mode of operation of the AD7453 is selected by controlling
the logic state of the CS signal during a conversion. There are
two possible modes of operation, normal mode and powerdown mode. The point at which CS is pulled high after the
conversion has been initiated determines whether the AD7453
enters power-down mode. Similarly, if already in power-down,
CS controls whether the device returns to normal operation or
remains in power-down. These modes of operation are designed
to provide flexible power management options. These options
can be chosen to optimize the power dissipation/ throughput
rate ratio for differing application requirements.
NORMAL MODE
POWER-DOWN MODE
This mode is intended for use in applications where slower
throughput rates are required—the ADC is powered down
between each conversion, or a series of conversions may be
performed at a high throughput rate and the ADC is then
powered down for a relatively long duration between these
bursts of several conversions. When the AD7453 is in powerdown mode, all analog circuitry is powered down. For the
AD7453 to enter power-down mode, the conversion process
must be interrupted by bringing CS high anywhere after the
second falling edge of SCLK and before the 10th falling edge of
SCLK, as shown in Figure 25.
This mode is intended for fastest throughput rate performance.
The user does not have to worry about any power-up times with
the AD7453 remaining fully powered up all the time. Figure 24
shows the general diagram of the operation of the AD7453 in
this mode. The conversion is initiated on the falling edge of CS,
as described in the Serial Interface section. To ensure that the
part remains fully powered up, CS must remain low until at
least 10 SCLK falling edges have elapsed after the falling edge
of CS.
Once CS has been brought high in this window of SCLKs, the
part enters power-down, the conversion that was initiated by
the falling edge of CS is terminated, and SDATA goes back into
three-state. The time from the rising edge of CS to SDATA
three-state enabled is never greater than t8 (see the Timing
Specifications). If CS is brought high before the second SCLK
falling edge, the part remains in normal mode and does not
power down. This avoids accidental power-down due to glitches
on the CS line.
If CS is brought high any time after the 10th SCLK falling edge
but before the 16th SCLK falling edge, the part remains powered
up but the conversion is terminated and SDATA goes back into
three-state. Sixteen serial clock cycles are required to complete
the conversion and access the complete conversion result. CS
may idle high until the next conversion, or may idle low until
some time prior to the next conversion. Once a data transfer is
complete, i.e., when SDATA has returned to three-state, another
conversion can be initiated after the quiet time, tQUIET, has
elapsed by again bringing CS low.
To exit this mode of operation and power up the AD7453 again,
a dummy conversion is performed. On the falling edge of CS,
the device begins to power up, and continues to power up as
long as CS is held low until after the falling edge of the 10th
SCLK. The device is fully powered up after 1 µs has elapsed and,
as shown in Figure 26, valid data results from the next
conversion.
CS
1
10
16
4 LEADING ZEROS + CONVERSION RESULT
CS
Figure 24. Normal Mode Operation
SCLK
SDATA
1 2
10
THREE-STATE
Figure 25. Entering Power-Down Mode
Rev. B | Page 15 of 20
03155-A-025
SDATA
03155-A-024
SCLK
If CS is brought high before the 10th falling edge of SCLK, the
AD7453 again goes back into power-down. This avoids
accidental power-up due to glitches on the CS line or an
inadvertent burst of eight SCLK cycles while CS is low. So
although the device may begin to power up on the falling edge
of CS, it again powers down on the rising edge of CS as long as
it occurs before the 10th SCLK falling edge.
AD7453
POWER-UP TIME
The power-up time of the AD7453 is typically 1 µs, which
means that with any frequency of SCLK up to 10 MHz, one
dummy cycle is always sufficient to allow the device to power
up. Once the dummy cycle is complete, the ADC is fully
powered up and the input signal is acquired properly. The quiet
time, tQUIET, must still be allowed—from the point at which the
bus goes back into three-state after the dummy conversion to
the next falling edge of CS.
When power supplies are first applied to the AD7453, the ADC
may either power up in the power-down mode or normal mode.
Because of this, it is best to allow a dummy cycle to elapse to
ensure that the part is fully powered up before attempting a
valid conversion. Likewise, if the user wants the part to power
up in power-down mode, the dummy cycle may be used to
ensure the device is in power-down mode by executing a cycle
such as that shown in Figure 25. Once supplies are applied to
the AD7453, the power-up time is the same as that when
powering up from power-down mode. It takes approximately
1 µs to power up fully if the part powers up in normal mode. It
is not necessary to wait 1 µs before executing a dummy cycle to
ensure the desired mode of operation. Instead, the dummy cycle
can occur directly after power is supplied to the ADC. If the
first valid conversion is then performed directly after the
dummy conversion, care must be taken to ensure that adequate
acquisition time has been allowed.
When running at the maximum throughput rate of 555 kSPS,
the AD7453 powers up and acquires a signal within ±0.5 LSB in
one dummy cycle. When powering up from power-down mode
with a dummy cycle, as in Figure 26, the track and-hold, which
was in hold mode while the part was powered down, returns to
track mode after the first SCLK edge the part receives after the
falling edge of CS. This is shown as Point A in Figure 26.
Although at any SCLK frequency one dummy cycle is sufficient
to power up the device and acquire VIN, it does not necessarily
mean that a full dummy cycle of 16 SCLKs must always elapse
to power up the device and acquire VIN fully; 1 µs is sufficient to
power up the device and acquire the input signal.
As mentioned earlier, when powering up from the power-down
mode, the part returns to track mode upon the first SCLK edge
applied after the falling edge of CS. However, when the ADC
powers up initially after supplies are applied, the track-and-hold
is already in track mode. This means (assuming one has the
facility to monitor the ADC supply current) that if the ADC
powers up in the desired mode of operation and thus a dummy
cycle is not required to change the mode, then a dummy cycle is
not required to place the track-and-hold into track.
For example, if a 5 MHz SCLK frequency is applied to the ADC,
the cycle time is 3.2 µs (i.e., 1/(5 MHz) × 16). In one dummy
cycle, 3.2 µs, the part is powered up and VIN is acquired fully.
However after 1 µs with a 5 MHz SCLK, only five SCLK cycles
have elapsed. At this stage, the ADC is fully powered up and the
signal acquired. So in this case, CS can be brought high after the
10th SCLK falling edge and brought low again after a time, tQUIET,
to initiate the conversion.
tPOWER-UP
PART BEGINS
TO POWER UP
CS
A
THIS PART IS FULLY POWERED
UP WITH VIN FULLY ACQUIRED
1
10
16
1
10
16
SDATA
INVALID DATA
VALID DATA
Figure 26. Exiting Power-Down Mode
Rev. B | Page 16 of 20
03155-A-026
SCLK
AD7453
POWER VS. THROUGHPUT RATE
By using the power-down mode on the AD7453 when not converting, the average power consumption of the ADC decreases
at lower throughput rates. Figure 27 shows how, as the throughput rate is reduced, the device remains in its power-down state
longer and the average power consumption reduces accordingly.
For example, if the AD7453 is operated in continuous sampling
mode with a throughput rate of 100 kSPS and a 10 MHz SCLK,
and the device is placed in the power-down mode between conversions, then the power consumption is calculated as follows:
Power dissipation during normal operation = 7.25 mW max (for
VDD = 5 V).
If the power-up time is one dummy cycle (1.06 µs if CS is
brought high after the 10th SCLK falling edge in the cycle and
then brought low after the quiet time) and the remaining
conversion time is another cycle (1.6 µs), then the AD7453 can
be said to dissipate 7.25 mW for 2.66 µs∗ during each
conversion cycle.
If the throughput rate = 100 kSPS, then the cycle time = 10 µs
and the average power dissipated during each cycle is
For throughput rates above 320 kSPS, the serial clock frequency
should be reduced for optimum power performance.
MICROPROCESSOR AND DSP INTERFACING
The serial interface on the AD7453 allows the part to be connected directly to a range of different microprocessors. This
section explains how to interface the AD7453 with some of the
more common microcontroller and DSP serial interface
protocols.
AD7453 to ADSP-21xx
The ADSP-21xx family of DSPs are interfaced directly to the
AD7453 without any glue logic required.
The SPORT control register should be set up as follows:
TFSW = RFSW = 1
INVRFS = INVTFS = 1
DTYPE = 00
SLEN = 1111
ISCLK = 1
TFSR = RFSR = 1
IRFS = 0
ITFS = 1
Alternate Framing
Active Low Frame Signal
Right Justify Data
16-Bit Data-Words
Internal Serial Clock
Frame Every Word
To implement power-down mode, SLEN should be set to 1001
to issue an 8-bit SCLK burst.
(2.66/10) × 7.25 mW = 1.92 mW
For the same scenario, if VDD = 3 V, the power dissipation during
normal operation is 3.3 mW max. The AD7453 can now be said
to dissipate 3.3 mW for 2.66 µs∗ during each conversion cycle.
The average power dissipated during each cycle with a
throughput rate of 100 kSPS is therefore
(2.66/10) × 3.3 mW = 0.88 mW
This is how the power numbers in Figure 27 are calculated.
100
The connection diagram is shown in Figure 28. The ADSP-21xx
has the TFS and RFS of the SPORT tied together, with TFS set
as an output and RFS set as an input. The DSP operates in
alternate framing mode and the SPORT control register is set
up as described. The frame synchronization signal generated on
the TFS is tied to CS, and, as with all signal processing applications, equidistant sampling is necessary. However, in this
example, the timer interrupt is used to control the sampling rate
of the ADC, and, under certain conditions, equidistant sampling
may not be achieved.
ADSP-21xx*
AD7453*
VDD = 5V
POWER (mW)
SCLK
SCLK
DR
SDATA
1
RFS
CS
VDD = 3V
TFS
0.1
03155-A-027
*ADDITIONAL PINS REMOVED FOR CLARITY
0.01
0
50
100
150
200
250
THROUGHPUT (kSPS)
300
Figure 28. Interfacing to the ADSP-21xx
350
Figure 27. Power vs. Throughput Rate for Power-Down Mode
∗
This figure assumes a very short time to enter power-down mode. This
increases as the burst of clocks used to enter power down mode is
increased.
Rev. B | Page 17 of 20
03155-A-028
10
AD7453
For example, the ADSP-2111 has a master clock frequency of
16 MHz. If the SCLKDIV register is loaded with the value 3, an
SCLK of 2 MHz is obtained and eight master clock periods
elapse for every SCLK period. If the timer registers are loaded
with the value 803, then 100.5 SCLKs occur between interrupts
and subsequently between transmit instructions. This situation
results in nonequidistant sampling as the transmit instruction is
occurring on an SCLK edge. If the number of SCLKs between
interrupts is a whole integer figure of N, equidistant sampling is
implemented by the DSP.
AD7453 to TMS320C5x/C54x
The serial interface on the TMS320C5x/C54x uses a continuous
serial clock and frame synchronization signals to synchronize
the data transfer operations with peripheral devices like the
AD7453. The CS input allows easy interfacing between the
TMS320C5x/C54x and the AD7453 without any glue logic
required. The serial port of the TMS320C5x/C54x is set up to
operate in burst mode with internal CLKx (Tx serial clock) and
FSx (Tx frame sync). The serial port control register (SPC) must
have the following setup: FO = 0, FSM = 1, MCM = 1 and TXM
= 1. The format bit, FO, may be set to 1 to set the word length to
eight bits in order to implement the power-down mode on the
AD7453. The connection diagram is shown in Figure 29. For
signal processing applications, it is imperative that the frame
synchronization signal from the TMS320C5x/C54x provide
equidistant sampling.
TMS320C5x/
C54x*
AD7453*
SCLK
CLKx
CLKR
DR
SDATA
CS
FSR
03155-A-029
FSx
*ADDITIONAL PINS REMOVED FOR CLARITY
Figure 29. Interfacing to the TMS320C5x/C54x
AD7453 to DSP56xxx
The connection diagram in Figure 30 shows how the AD7453
can be connected to the SSI (synchronous serial interface) of
the DSP56xxx family of DSPs from Motorola. The SSI is
operated in synchronous mode (SYN bit in CRB = 1) with
internally generated 1-bit clock period frame sync for both Tx
and Rx (Bit FSL1 = 1 and Bit FSL0 = 0 in CRB). Set the word
length to 16 by setting Bits WL1 = 1 and WL0 = 0 in CRA. To
implement the power-down mode on the AD7453, the word
length can be changed to eight bits by setting Bits WL1 = 0 and
WL0 = 0 in CRA. For signal processing applications, it is
imperative that the frame synchronization signal from the
DSP56xxx provide equidistant sampling.
DSP56xxx*
AD7453*
SCLK
SCLK
SDATA
SRD
CS
SR2
03155-A-030
The timer registers, for example, are loaded with a value that
provides an interrupt at the required sample interval. When an
interrupt is received, a value is transmitted with TFS/DT (ADC
control word). The TFS is used to control the RFS and thus the
reading of data. The frequency of the serial clock is set in the
SCLKDIV register. When the instruction to transmit with TFS
is given, (i.e., AX0 = TX0), the state of the SCLK is checked. The
DSP waits until the SCLK has gone high, low, and high again
before transmission starts. If the timer and SCLK values are
chosen such that the instruction to transmit occurs on or near
the rising edge of SCLK, then the data may be transmitted or it
may wait until the next clock edge.
*ADDITIONAL PINS REMOVED FOR CLARITY
Rev. B | Page 18 of 20
Figure 30. Interfacing to the DSP56xxx
AD7453
APPLICATION HINTS
Grounding and Layout
The printed circuit board that houses the AD7453 should be
designed so that the analog and digital sections are separated
and confined to certain areas of the board. This facilitates the
use of ground planes that can be easily separated. A minimum
etch technique is generally best for ground planes as it gives the
best shielding. Digital and analog ground planes should be
joined in only one place, and the connection should be a star
ground point established as close to the GND pin on the
AD7453 as possible.
Avoid running digital lines under the device as this couples
noise onto the die. The analog ground plane should be allowed
to run under the AD7453 to avoid noise coupling. The power
supply lines to the AD7453 should use as large a trace as
possible to provide low impedance paths and reduce the effects
of glitches on the power supply line.
Fast switching signals like clocks should be shielded with digital
ground to avoid radiating noise to other sections of the board,
and clock signals should never run near the analog inputs.
Avoid crossover of digital and analog signals. Traces on opposite
sides of the board should run at right angles to each other. This
reduces the effects of feedthrough through the board. A
microstrip technique is by far the best but is not always possible
with a double-sided board.
In this technique, the component side of the board is dedicated
to ground planes while signals are placed on the solder side.
Good decoupling is also important. All analog supplies should
be decoupled with 10 µF tantalum capacitors in parallel with
0.1 µF capacitors to GND. To achieve the best from these
decoupling components, they must be placed as close as
possible to the device.
EVALUATING THE AD7453’S PERFORMANCE
The evaluation board package includes a fully assembled and
tested evaluation board, documentation, and software for
controlling the board from a PC via the evaluation board
controller. The evaluation board controller can be used in
conjunction with the AD7453 evaluation board, as well as many
other Analog Devices evaluation boards ending with the CB
designator, to demonstrate/evaluate the ac and dc performance
of the AD7453.
The software allows the user to perform ac (Fast Fourier
Transform) and dc (histogram of codes) tests on the AD7453.
For more information, see the AD7453 application note that
accompanies the evaluation kit.
Rev. B | Page 19 of 20
AD7453
OUTLINE DIMENSIONS
2.90 BSC
8
7
6
5
1
2
3
4
1.60 BSC
2.80 BSC
PIN 1
0.65 BSC
1.95
BSC
1.30
1.15
0.90
1.45 MAX
0.38
0.22
0.15 MAX
0.22
0.08
SEATING
PLANE
8°
4°
0°
0.60
0.45
0.30
COMPLIANT TO JEDEC STANDARDS MO-178BA
Figure 31. 8-Lead Small Outline Transistor Package [SOT-23]
(RT-8)
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD7453ART-REEL7
AD7453BRT-R2
AD7453BRT-REEL7
EVAL-AD7453CB2
EVAL-CONTROL BRD23
1
2
3
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Linearity Error (LSB)1
±1.5
±1
±1
Package Description
8-Lead SOT-23
8-Lead SOT-23
8-Lead SOT-23
Evaluation Board
Controller Board
Package Option
RT-8
RT-8
RT-8
Branding
C0C
C09
C09
Linearity error here refers to integral nonlinearity error.
This can be used as a standalone evaluation board or in conjunction with the evaluation board controller for evaluation/demonstration purposes.
The evaluation board controller is a complete unit allowing a PC to control and communicate with all Analog Devices evaluation boards ending in the CB designator.
For a complete Evaluation Kit, you will need to order the ADC evaluation board, i.e., EVAL-AD7453CB, the EVAL-CONTROL BRD2, and a 12 V ac transformer. See the
AD7453 application note that accompanies the evaluation kit for more information.
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
C03155–0–2/04(B)
Rev. B | Page 20 of 20