DATASHEET ISL9001 FN9231 Rev 2.00 March 28, 2008 LDO with Low ISUPPLY, High PSRR ISL9001 is a high performance Low Dropout linear regulator capable of sourcing 300mA current. It has a low standby current and high-PSRR and is stable with an output capacitance of 1µF to 10µF with an ESR of up to 200m. Features The ISL9001 has a very high PSRR of 90dB and outputs noise less than 30µVRMS. A reference bypass pin allows connection of a noise-filtering capacitor for low-noise and high-PSRR applications. When coupled with a no load quiescent current of 25µA (typical), and 0.1µA shutdown current, the ISL9001 is an ideal choice for portable wireless equipment. • Excellent load regulation: <0.1% voltage change across full range of load current • 300mA high performance LDO • Excellent transient response to large current steps • High PSRR: 90dB @ 1kHz • Wide input voltage capability: 2.3V to 6.5V • Extremely low quiescent current: 25µA • Low dropout voltage: typically 200mV @ 300mA The ISL9001 provides a power-good signal with delay time programmable with an external capacitor. • Low output noise: typically 30µVRMS @ 100µA (1.5V) Several different fixed voltage outputs are standard. Output voltage options for each LDO range are from 1.5V to 3.3V. Other output voltage options may be available upon request. • Soft-start to limit input current surge during enable • Stable with 1µF to 10µF ceramic capacitors • Current limit and overheat protection • Delayed POR, programmable with external capacitor Pinout • ±1.8% accuracy over all operating conditions ISL9001 (8 LD 2x3 DFN) TOP VIEW • Tiny 2mmx3mm 8 Ld DFN package • -40°C to +85°C operating temperature range VIN 1 8 VO EN 2 7 POR CBYP 3 6 NC Applications CPOR 4 5 GND • PDAs, cell phones and smart phones • Pb-free (RoHS compliant) • Portable instruments, MP3 players • Handheld devices, including medical handhelds FN9231 Rev 2.00 March 28, 2008 Page 1 of 11 ISL9001 Ordering Information PART NUMBER (Notes 1, 2) PART MARKING VO VOLTAGE (V) (Note 3) TEMP RANGE (°C) PACKAGE (Pb-Free) PKG. DWG. # ISL9001IRNZ-T EAA 3.3 -40 to +85 8 Ld 2x3 DFN L8.2x3 ISL9001IRMZ-T EBA 3.0 -40 to +85 8 Ld 2x3 DFN L8.2x3 ISL9001IRLZ-T ECA 2.9 -40 to +85 8 Ld 2x3 DFN L8.2x3 ISL9001IRKZ-T EDA 2.85 -40 to +85 8 Ld 2x3 DFN L8.2x3 ISL9001IRJZ-T EEA 2.8 -40 to +85 8 Ld 2x3 DFN L8.2x3 ISL9001IRRZ-T EFA 2.6 -40 to +85 8 Ld 2x3 DFN L8.2x3 ISL9001IRFZ-T EGA 2.5 -40 to +85 8 Ld 2x3 DFN L8.2x3 ISL9001IRCZ-T EHA 1.8 -40 to +85 8 Ld 2x3 DFN L8.2x3 ISL9001IRBZ-T EJA 1.5 -40 to +85 8 Ld 2x3 DFN L8.2x3 NOTES: 1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 2. Please refer to TB347 for details on reel specifications. 3. For other output voltages, contact Intersil Marketing. FN9231 Rev 2.00 March 28, 2008 Page 2 of 11 ISL9001 Absolute Maximum Ratings Thermal Information Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.1V VO Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +3.6V All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to (VIN+0.3)V ESD Rating Human Body Model (Per MIL-STD-883 Method 3015.7) . . .2500V Machine Model (Per EIAJ ED-4701 Method C-111) . . . . . . . .200V Thermal Resistance (Notes 4, 5) Recommended Operating Conditions JA (°C/W) JC (°C/W) 8 Ld 2x3 DFN Package . . . . . . . . . . . . 69 10 Junction Temperature Range . . . . . . . . . . . . . . . . .-40°C to +125°C Operating Temperature Range . . . . . . . . . . . . . . . . .-40°C to +85°C Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Ambient Temperature Range (TA) . . . . . . . . . . . . . . .-40°C to +85°C Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3V to 6.5V CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 4. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 5. For JC, the “case temp” location is the center of the exposed metal pad on the package underside. Electrical Specifications PARAMETER Unless otherwise noted, all parameters are guaranteed over the operational supply voltage and temperature range of the device as follows: TA = -40°C to +85°C; VIN = (VO + 0.5V) to 5.5V with a minimum VIN of 2.3V; CIN = 1µF; CO = 1µF. SYMBOL TEST CONDITIONS MIN (Note 8) TYP MAX (Note 8) UNITS 6.5 V DC CHARACTERISTICS Supply Voltage 2.3 VIN Ground Current Quiescent condition: IO = 0µA IDD LDO active 25 32 µA LDO disabled @ +25°C 0.1 1.0 µA Shutdown Current IDDS UVLO Threshold VUV+ 1.9 2.1 2.3 V VUV- 1.6 1.8 2.0 V Regulation Voltage Accuracy Maximum Output Current IMAX Internal Current Limit ILIM Dropout Voltage (Note 7) Thermal Shutdown Temperature Initial accuracy at VIN = VO + 0.5V, IO = 10mA, TJ = +25°C -0.7 +0.7 % VIN = VO + 0.5V to 5.5V, IO = 10µA to 300mA, TJ = +25°C -0.8 +0.8 % VIN = VO + 0.5V to 5.5V, IO = 10µA to 300mA, TJ = -40°C to +125°C -1.8 +1.8 % Continuous 300 350 mA 475 600 mA VDO1 IO = 300mA; VO 2.5V 300 500 mV VDO2 IO = 300mA; 2.5V VO 2.8V 250 400 mV VDO3 IO = 300mA; VO > 2.8V 200 325 mV TSD+ 145 °C TSD- 110 °C @ 1kHz 90 dB @ 10kHz 70 dB @ 100kHz 50 dB IO = 100µA, VO = 1.5V, TA = +25°C, CBYP = 0.1µF BW = 10Hz to 100kHz 30 µVRMS AC CHARACTERISTICS Ripple Rejection (Note 6) Output Noise Voltage (Note 6) FN9231 Rev 2.00 March 28, 2008 IO = 10mA, VIN = 2.8V (min), VO = 1.8V, CBYP = 0.1µF Page 3 of 11 ISL9001 Electrical Specifications PARAMETER Unless otherwise noted, all parameters are guaranteed over the operational supply voltage and temperature range of the device as follows: TA = -40°C to +85°C; VIN = (VO + 0.5V) to 5.5V with a minimum VIN of 2.3V; CIN = 1µF; CO = 1µF. (Continued) TYP MAX (Note 8) UNITS Time from assertion of the ENx pin to when the output voltage reaches 95% of the VO (nom) 250 500 µs Slope of linear portion of LDO output voltage ramp during start-up 30 60 µs/V SYMBOL MIN (Note 8) TEST CONDITIONS DEVICE START-UP CHARACTERISTICS Device Enable Time tEN LDO Soft-start Ramp Rate tSSR EN PIN CHARACTERISTICS Input Low Voltage VIL -0.3 0.5 V Input High Voltage VIH 1.4 VIN + 0.3 V 0.1 µA Input Leakage Current IIL, IIH Pin Capacitance CPIN Informative 5 pF POR PIN CHARACTERISTICS POR Thresholds VPOR+ As a percentage of nominal output voltage VPORPOR Delay tPLH CPOR = 0.01µF 91 94 97 % 87 90 93 % 100 200 300 ms tPHL POR Pin Output Low Voltage POR Pin Internal Pull-up Resistance VOL 25 @ IOL = 1.0mA RPOR 78 100 µs 0.2 V 180 k NOTES: 6. Limits established by characterization and are not production tested. 7. VOx = 0.98*VOx(NOM); Valid for VOx greater than 1.85V. 8. Parts are 100% tested at +25°C. Temperature limits established by characterization and are not production tested. EN tEN VPOR+ VPOR- VPOR+ VPOR- <tPHL VO tPLH tPHL POR FIGURE 1. TIMING PARAMETER DEFINITION FN9231 Rev 2.00 March 28, 2008 Page 4 of 11 ISL9001 Typical Performance Curves 0.8 0.10 VO = 3.3V ILOAD = 0mA 0.4 0.2 -40°C 0.0 +25°C -0.2 +85°C -0.4 0.06 0.04 -40°C 0.02 0.00 +25°C -0.02 +85°C -0.04 -0.06 -0.6 -0.08 -0.8 3.4 3.8 4.2 4.6 5.0 5.4 INPUT VOLTAGE (V) 5.8 6.2 -0.10 0 6.6 FIGURE 2. OUTPUT VOLTAGE vs INPUT VOLTAGE (3.3V OUTPUT) 50 150 250 100 200 300 LOAD CURRENT - IO (mA) 350 400 FIGURE 3. OUTPUT VOLTAGE CHANGE vs LOAD CURRENT 0.10 3.4 VIN = 3.8V VO = 3.3V ILOAD = 0mA 0.08 0.06 0.04 0.02 0.00 -0.02 -0.04 -0.06 VO = 3.3V IO = 0mA 3.3 OUTPUT VOLTAGE, VO (V) OUTPUT VOLTAGE CHANGE (%) VIN = 3.8V VO = 3.3V 0.08 OUTPUT VOLTAGE CHANGE (%) OUTPUT VOLTAGE, VO (%) 0.6 3.2 IO = 150mA 3.1 IO = 300mA 3.0 2.9 -0.08 -0.10 -40 2.8 -25 5 -10 20 35 50 65 TEMPERATURE (°C) 80 95 110 125 DROPOUT VOLTAGE, VDO (mV) OUTPUT VOLTAGE, VO (V) 2.7 IO = 150mA 2.6 IO = 300mA 2.5 2.4 3.6 4.1 4.6 5.1 5.6 6.1 INPUT VOLTAGE (V) FIGURE 6. OUTPUT VOLTAGE vs INPUT VOLTAGE (2.8V OUTPUT) FN9231 Rev 2.00 March 28, 2008 4.6 5.1 5.6 6.1 6.5 350 VO = 2.8V 2.8 3.1 4.1 FIGURE 5. OUTPUT VOLTAGE vs INPUT VOLTAGE (3.3V OUTPUT) 2.9 2.3 2.6 3.6 INPUT VOLTAGE (V) FIGURE 4. OUTPUT VOLTAGE CHANGE vs TEMPERATURE IO = 0mA 3.1 6.5 300 250 VO = 2.8V 200 VO = 3.3V 150 100 50 0 0 50 100 150 200 250 300 350 OUTPUT LOAD (mA) FIGURE 7. DROPOUT VOLTAGE vs LOAD CURRENT Page 5 of 11 400 ISL9001 Typical Performance Curves (Continued) 40 350 VO = 3.3V 35 GROUND CURRENT (µA) DROPOUT VOLTAGE, VDO (mV) 300 250 +85°C +25°C -40°C 200 150 100 30 +25°C 25 -40°C 20 VO = 3.3V 15 50 0 +125°C 0 50 100 150 200 250 300 350 10 400 3.0 3.5 4.0 OUTPUT LOAD (mA) 4.58 5.0 5.5 6.5 6.0 INPUT VOLTAGE (V) FIGURE 8. DROPOUT VOLTAGE vs LOAD CURRENT FIGURE 9. GROUND CURRENT vs INPUT VOLTAGE 40 200 180 35 140 GROUND CURRENT (µA) GROUND CURRENT (µA) 160 +25°C +85°C 120 -40°C 100 80 60 40 25 20 VIN = 3.8V VO = 3.3V 20 0 30 0 50 100 150 200 250 300 350 VIN = 3.8V VO = 3.3V ILOAD = 0µA 15 10 -40 -25 400 -10 5 LOAD CURRENT (mA) FIGURE 10. GROUND CURRENT vs LOAD 20 35 50 65 TEMPERATURE (°C) 80 VIN = 5.0V VO = 2.85V IL = 150mA 5 CL = 1µF CBYP = 0.01µF 3 4 2 VO (V) VOLTAGE (V) 110 125 FIGURE 11. GROUND CURRENT vs TEMPERATURE VO = 2.85V IL = 150mA VIN 3 VO 2 POR VEN (V) 0 0.5 1 0 1 0 95 1.0 1.5 2.0 2.5 TIME (s) 3.0 3.5 4.0 FIGURE 12. POWER-UP/POWER-DOWN FN9231 Rev 2.00 March 28, 2008 4.5 5.0 5 0 0 0.2 0.4 0.6 0.8 1.0 1.2 TIME (ms) 1.4 1.6 1.8 2.0 FIGURE 13. TURN ON/TURN OFF RESPONSE Page 6 of 11 ISL9001 Typical Performance Curves (Continued) VO = 3.3V ILOAD = 300mA VO = 2.8V ILOAD = 300mA CLOAD = 1µF CBYP = 0.01µF CLOAD = 1µF CBYP = 0.01µF 4.3V 4.2V 3.6V 3.5V 10mV/DIV 10mV/DIV 400µs/DIV 400µs/DIV FIGURE 14. LINE TRANSIENT RESPONSE, 3.3V OUTPUT FIGURE 15. LINE TRANSIENT RESPONSE, 2.8V OUTPUT VO (25mV/DIV) VO = 1.8V VIN = 2.8V 300mA ILOAD SPECTRAL NOISE DENSITY (nV/Hz) 1000 100 10 VIN = 3.6V VO = 1.8V ILOAD = 10mA CBYP = 0.1µF 1 CIN = 1µF CLOAD = 1µF 100µA 0.1 10 100 1k 10k FREQUENCY (Hz) 100µs/DIV FIGURE 16. LOAD TRANSIENT RESPONSE VIN = 3.6V VO = 1.8V IO = 10mA 90 80 CBYP = 0.1µF CLOAD = 1µF 70 60 50 40 30 20 10 0 100 1k 10k FREQUENCY (Hz) 100k 1M FIGURE 18. PSRR vs FREQUENCY FN9231 Rev 2.00 March 28, 2008 1M FIGURE 17. SPECTRAL NOISE DENSITY vs FREQUENCY 100 PSRR (dB) 100k Page 7 of 11 ISL9001 Pin Description PIN NUMBER PIN NAME 1 VIN Supply Voltage/LDO Input: Connect a 1µF capacitor to GND. 2 EN LDO Enable. 3 CBYP Reference Bypass Capacitor Pin: Optionally connect capacitor of value 0.01µF to 0.1µF between this pin and GND to achieve lowest noise and highest PSRR. 4 CPOR POR Delay Setting Capacitor Pin: Connect a capacitor between this pin and GND to delay the POR output release after the output reaches 94% of its specified voltage level. (200ms delay per 0.01µF). 5 GND 6 NC 7 POR 8 VO DESCRIPTION GND is the connection to system ground. Connect to PCB Ground plane. Do not connect. Open-drain POR Output (active-low): Internally connected to VO through 100k resistor. LDO Output: Connect capacitor of value 1µF to 10µF to GND (1µF recommended). Typical Application ISL9001 VIN (2.3V TO 5V) 1 ON 2 ENABLE OFF 3 C1 C2 C4 4 VIN EN VO POR VOUT OK 7 VOUT TOO LOW CBYP CPOR 8 GND 5 VOUT RESET (200ms DELAY, C4 = 0.01µF) C3 C1, C3: 1µF X5R CERAMIC CAPACITOR C2: 0.1µF X7R CERAMIC CAPACITOR C4: 0.01µF X7R CERAMIC CAPACITOR FN9231 Rev 2.00 March 28, 2008 Page 8 of 11 ISL9001 Block Diagram VIN VO UVLO CONTROL LOGIC SHORT CIRCUIT, THERMAL PROTECTION, SOFT-START + EN + - VO 100k 1.0V GND BANDGAP AND TEMPERATURE SENSOR VOLTAGE AND REFERENCE GENERATOR CBYP Functional Description The ISL9001 contains all circuitry required to implement a high performance LDO. High performance is achieved through a circuit that delivers fast transient response to varying load conditions. In a quiescent condition, the ISL9001 adjusts its biasing to achieve the lowest standby current consumption. The device also integrates current limit protection, smart thermal shutdown protection, and soft-start. Smart Thermal shutdown protects the device against overheating. Power Control The ISL9001 has an enable pin (EN) to control power to the LDO output. When EN is low, the device is in shutdown mode. During this condition, all on-chip circuits are off, and the device draws minimum current, typically less than 0.1µA. When the enable pin is asserted, the device first polls the output of the UVLO detector to ensure that VIN voltage is at least about 2.1V. Once verified, the device initiates a start-up sequence. During the start-up sequence, trim settings are first read and latched. Then, sequentially, the bandgap, reference voltage and current generation circuitry power-up. Once the references are stable, a fast-start circuit quickly charges the external reference bypass capacitor (connected to the CBYP pin) to the proper operating voltage. Once the bypass capacitor has been charged, the LDO powers up. FN9231 Rev 2.00 March 28, 2008 POR POR DELAY 1.0V 0.94V 0.9V CPOR GND During operation, whenever the VIN voltage drops below about 1.84V, the ISL9001 immediately disables the LDO output. When VIN rises back above 2.1V, the device re-initiates its start-up sequence and LDO operation will resume automatically. Reference Generation The reference generation circuitry includes a trimmed bandgap, a trimmed voltage reference divider, a trimmed current reference generator, and an RC noise filter. The filter includes the external capacitor connected to the CBYP pin. A 0.01µF capacitor connected to CBYP implements a 100Hz lowpass filter, and is recommended for most high performance applications. For the lowest noise application, a 0.1µF CBYP capacitor should be used. This filters the reference noise to below the 10Hz to 1kHz frequency band, which is crucial in many noise-sensitive applications. The bandgap generates a zero temperature coefficient (TC) voltage for the reference divider. The reference divider provides the regulation reference, POR detection thresholds, and other voltage references required for current generation and over-temperature detection. The current generator outputs references required for adaptive biasing as well as references for LDO output current limit and thermal shutdown determination. Page 9 of 11 ISL9001 LDO Regulation and Programmable Output Divider The LDO Regulator is implemented with a high-gain operational amplifier driving a PMOS pass transistor. The design of the ISL9001 provides a regulator that has low quiescent current, fast transient response, and overall stability across all operating and load current conditions. LDO stability is guaranteed for a 1µF to 10µF output capacitor that has a tolerance better than 20% and ESR less than 200m. The design is performance-optimized for a 1µF capacitor. Unless limited by the application, use of an output capacitor value above 4.7µF is not recommended as LDO performance improvement is minimal. Soft-start circuitry integrated into each LDO limits the initial ramp-up rate to about 30µs/V to minimize current surge. The ISL9001 provides short-circuit protection by limiting the output current to about 425mA. The LDO uses an independently trimmed 1V reference as its input. An internal resistor divider drops the LDO output voltage down to 1V. This is compared to the 1V reference for regulation. The resistor division ratio is programmed in the factory. Power-On Reset Generation The power-good state is exited when the LDO output falls below 90% of the expected output voltage for a period longer than the PGOOD exit delay time. While power-good is false, the ISL9001 pulls the POR pin low. The PGOOD entry and exit delays are determined by the value of an external capacitor connected to the CPOR pin. For a 0.01µF capacitor, the entry and exit delays are 200ms and 25µs respectively. Larger or smaller capacitor values will yield proportionately longer or shorter delay times. The POR exit delay should never be allowed to be less than 10µs to ensure sufficient immunity against transient induced false POR triggering. Overheat Detection The bandgap outputs a proportional-to-temperature current that is indicative of the temperature of the silicon. This current is compared with references to determine if the device is in danger of damage due to overheating. When the die temperature reaches about +140°C, if the LDO is sourcing more than 50mA it shuts down until the die cools sufficiently. Once the die temperature falls back below about +110°C, the disabled LDO is re-enabled and soft-start automatically takes place. The ISL9001 has a Power-on Reset signal generation circuit, which indicates that output power is good. The POR signal is generated as follows. A POR comparator continuously monitors the output of the LDO. The LDO enters a power-good state when the output voltage is above 94% of the expected output voltage for a period exceeding the LDO PGOOD entry delay time (see the following). In the power-good state, the open-drain POR output is in a high-impedance state. An internal 100k pull-up resistor pulls the pin up to the LDO output voltage. An external resistor can be added between the POR output and the LDO output for a faster rise time, however, the POR output should not connect through an external resistor to a supply greater than the LDO voltage. © Copyright Intersil Americas LLC 2005-2008. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN9231 Rev 2.00 March 28, 2008 Page 10 of 11 ISL9001 Dual Flat No-Lead Plastic Package (DFN) L8.2x3 2X 8 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE 0.15 C A A D 2X 0.15 C B E MILLIMETERS SYMBOL MIN A 0.80 A1 - 6 A3 INDEX AREA b TOP VIEW D2 // 0.10 A SIDE VIEW C SEATING PLANE D2 (DATUM B) C 0.08 C 0.20 A3 7 8 0.90 1.00 - - 0.05 - 0.25 0.32 1 5,8 1.50 1.65 1.75 7,8 3.00 BSC 1.65 e 1.80 1.90 7,8 0.50 BSC - k 0.20 - - - L 0.30 0.40 0.50 8 N 8 Nd 4 2 3 D2/2 6 INDEX AREA NOTES 2.00 BSC E E2 MAX 0.20 REF D B NOMINAL Rev. 0 6/04 2 NX k NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2. N is the number of terminals. 3. Nd refers to the number of terminals on D. (DATUM A) E2 4. All dimensions are in millimeters. Angles are in degrees. E2/2 5. Dimension b applies to the metallized terminal and is measured between 0.25mm and 0.30mm from the terminal tip. NX L N N-1 NX b e 8 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 5 0.10 (Nd-1)Xe REF. M C A B 7. Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance. 8. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389. BOTTOM VIEW CL (A1) NX (b) L 5 SECTION "C-C" C C e TERMINAL TIP FOR EVEN TERMINAL/SIDE FN9231 Rev 2.00 March 28, 2008 Page 11 of 11