DS3695A, DS3695AT, DS3696A www.ti.com SNLS353C – FEBRUARY 1996 – REVISED APRIL 2013 DS3695A/DS3695AT/DS3696A Multipoint RS485/RS422 Transceivers Check for Samples: DS3695A, DS3695AT, DS3696A FEATURES DESCRIPTION • The DS3695A and DS3696A are high speed differential TRI-STATE bus/line transceivers designed to meet the requirements of EIA standard RS485 with extended common mode range (+12V to −7V), for multipoint data transmission. In addition they are compatible with requirements of RS-422. 1 2 • • • • • • • • Meets EIA Standard RS485 for Multipoint Bus Transmission and is Compatible with RS-422 10 Ns Driver Propagation Delays (Typical) Single +5V Supply −7V to +12V Bus Common Mode Range Permits ±7V Ground Difference between Devices on the Bus Thermal Shutdown Protection High Impedance to Bus with Driver in TRISTATE or with Power Off, over the Entire Common Mode Range Allows the Unused Devices on the Bus to be Powered Down Combined Impedance of a Driver Output and Receiver Input is less than One RS485 Unit Load, Allowing up to 32 Transceivers on the Bus 70 mV Typical Receiver Hysteresis Available in SOIC Packaging The driver and receiver outputs feature TRI-STATE capability. The driver outputs remain in over the entire common mode range of +12V to −7V. Bus faults that cause excessive power dissipation within the device trigger a thermal shutdown circuit, which forces the driver outputs into the high impedance state. The DS3696A provides an output pin (TS) which reports the thermal shutdown of the device. TS is an “open collector” pin with an internal 10 kΩ pullup resistor. This allows the TS outputs of several devices to be wire OR-ed. Both AC and DC specifications are guaranteed over the 0°C to 70°C temperature and 4.75V to 5.25V supply voltage range. Connection and Logic Diagrams Figure 1. Molded Package, Small Outline (D0008A) Top View Figure 2. Top View (See Package Number D0008A) TS was LF (Line Fault) on previous datasheets, TS goes low upon thermal shutdown. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1996–2013, Texas Instruments Incorporated DS3695A, DS3695AT, DS3696A SNLS353C – FEBRUARY 1996 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Supply Voltage, VCC 7V Control Input Voltages 7V Driver Input Voltage 7V Driver Output Voltages +15V/−10V Receiver Input Voltages +15V/−10V Receiver Output Voltage 5.5V Continuous Power Dissipation @ 25°C D0008A Package 630 mW −65°C to +150°C Storage Temp. Range Lead Temp. (Soldering 4 seconds) (1) (3) 260°C “Absolute maximum ratings” are those beyond which the safety of the device cannot be verified. They are not meant to imply that the device should be operated at these limits. The tables of “Electrical Characteristics” provide conditions for actual device operation. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. Derate linearly at 6.5 mW/°C to 337 mW at 70°C. (2) (3) Recommended Operating Conditions Supply Voltage, VCC Bus Voltage Min Max Units 4.75 5.25 V −7 +12 V Operating Free Air Temperature (TA) Commercial (DS3695AM) Industrial (DS3695ATM) Commercial (DS3696AM) Electrical Characteristics 0 +70 °C −40 +85 °C 0 +70 °C Typ Max Units 5 V (1) (2) 0°C ≤ TA ≤ 70°C, 4.75V < VCC < 5.25V unless otherwise specified Parameter VOD1 VOD2 Test Conditions Differential Driver Output Voltage (Unloaded) Differential Driver Output Voltage (with Load) Min IO = 0 R = 50Ω; (RS-422) (3) 2 R = 27Ω; (RS-485) V 1.5 V ΔVOD Complementary Output States Differential Output Voltage For Change in Magnitude of Driver VOC Driver Common Mode Output Voltage 3.0 V Δ|VOC| Change in Magnitude of Driver Common Mode Output Voltage For Complementary Output States 0.2 V VIH Input High Voltage VIL Input Low Voltage VCL Input Clamp Voltage IIN = −18 mA −1.5 V IIL Input Low Current VIL = 0.4V −200 μA IIH Input High Current VIH = 2.4V 20 μA (1) (2) (3) 2 R = 27Ω 0.2 DI, DE, RE , RE/DE 2 V V 0.8 V All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. All typicals are given for VCC = 5V and TA = 25°C. All limits for which this note is applied must be derated by 10% for DS3695AT. Other parameters remain the same for this extended temperature range device (−40°C ≤ TA ≤ +85°C). Submit Documentation Feedback Copyright © 1996–2013, Texas Instruments Incorporated Product Folder Links: DS3695A DS3695AT DS3696A DS3695A, DS3695AT, DS3696A www.ti.com SNLS353C – FEBRUARY 1996 – REVISED APRIL 2013 Electrical Characteristics (1) (2) (continued) 0°C ≤ TA ≤ 70°C, 4.75V < VCC < 5.25V unless otherwise specified Parameter IIN Test Conditions Input Current RI, RI, DO/RI, DO/RI VCC = 0V or 5.25V, DE or RE /DE = 0V VTH Differential Input Threshold Voltage for Receiver −7V ≤ VCM ≤ +12V ΔVTH Receiver Input Hysteresis VCM = 0V VOH Receiver Output High Voltage VOL Output Low Voltage Max Units VIN = 12V +1.0 mA VIN = −7V −0.8 mA IOH = −400 μA IOL = 16 mA TS V 0.5 V IOL = 8 mA 0.45 V ±20 μA 0.4V ≤ VO ≤ 2.4V, VCC = Max, RIN Receiver Input Resistance −7V ≤ VCM ≤ +12V ICC Supply Current No Load (3) Output Current Receiver Short-Circuit V mV 2.4 (3) Output Current at Receiver OFF-State (High Impedance) IOSR +0.2 70 RO Output Current Driver Short-Circuit Typ −0.2 IOZR IOSD Min VO = −7V 12 kΩ Driver Outputs Enabled 42 60 mA Driver Outputs Disabled 27 40 mA −250 mA +250 mA (3) VO = +12V (3) −15 VO = 0V −85 mA Receiver Switching Characteristics 0°C ≤ TA ≤ 70°C, 4.75V < VCC < 5.25V unless otherwise specified Symbol (4) Min Typ Max Units tPLH CL = 15 pF 15 28 42 ns tPHL S1 and S2 15 28 42 ns |tPLH–tPHL| Closed 0 3 tPLZ CL = 15 pF, S2 Open 5 29 35 ns tPHZ CL = 15 pF, S1 Open 5 12 16 ns tPZL CL = 15 pF, S2 Open 7 15 28 ns tPZH CL = 15 pF, S1 Open 7 15 20 ns Min Typ Max Units (4) Test Conditions ns All typicals are given for VCC = 5V and TA = 25°C. Driver Switching Characteristics 0°C ≤ TA ≤ 70°C, 4.75V < VCC < 5.25V unless otherwise specified Symbol (1) Test Conditions SINGLE ENDED CHARACTERISTICS (Figure 7, Figure 8, and Figure 10) tPLH RLDIFF = 60Ω 9 15 22 ns tPHL CL1 = CL2 = 100 pF 9 15 22 ns 0 2 8 ns 7 15 30 ns tSKEW|tPLH–tPHL| tPLZ CL = 15 pF, S2 Open tPHZ CL = 15 pF, S1 Open 7 15 30 ns tPZL CL = 100 pF, S2 Open 30 35 50 ns tPZH CL = 100 pF, S1 Open 30 35 50 ns 6 10 18 ns DIFFERENTIAL SWITCHING CHARACTERISTICS (Figure 10) tr, tf (1) RLDIFF = 60Ω CL1 = CL2 = 100 pF All typicals are given for VCC = 5V and TA = 25°C. Copyright © 1996–2013, Texas Instruments Incorporated Product Folder Links: DS3695A DS3695AT DS3696A Submit Documentation Feedback 3 DS3695A, DS3695AT, DS3696A SNLS353C – FEBRUARY 1996 – REVISED APRIL 2013 www.ti.com AC TEST CIRCUITS AND SWITCHING WAVEFORMS Figure 3. Receiver Propagation Delay Test Circuit Differential input voltage may be realized by grounding RI and pulsing RI between +2.5V and −2.5V Figure 4. Receiver Input-to-Output Propagation Delay Timing Figure 5. Receiver Enable/Disable Propagation Delay Timing Figure 6. Unless Otherwise Specified the Switches are Closed 4 Submit Documentation Feedback Copyright © 1996–2013, Texas Instruments Incorporated Product Folder Links: DS3695A DS3695AT DS3696A DS3695A, DS3695AT, DS3696A www.ti.com SNLS353C – FEBRUARY 1996 – REVISED APRIL 2013 Figure 7. Driver Propagation Delay Test Circuits tPLH and tPHL are measured to the respective 50% points. tSKEW is the difference between propagation delays of the complementary outputs. Figure 8. Driver Input-to-Output Propagation Delay Timing (Single-Ended) Figure 9. Driver Enable/Disable Propagation Delay Timing Figure 10. Driver Differential Transition Timing Copyright © 1996–2013, Texas Instruments Incorporated Product Folder Links: DS3695A DS3695AT DS3696A Submit Documentation Feedback 5 DS3695A, DS3695AT, DS3696A SNLS353C – FEBRUARY 1996 – REVISED APRIL 2013 www.ti.com Table 1. Function Tables DS3695A/DS3696A Transmitting (1) Inputs Line Outputs RE DE DI Condition DO DO TS * (DS3696A Only) X 1 1 No Fault 0 1 H X 1 0 No Fault 1 0 H X 0 X X Z Z H X 1 X Fault Z Z L Table 2. Function Tables DS3695A/DS3696A Receiving (1) Inputs (1) (1) Outputs RE DE RI–RI RO TS * (DS3696A Only) 0 0 ≥+0.2V 1 H 0 0 ≤−0.2V 0 H 0 0 Inputs Open** 1 H 1 0 X Z H X — Don't care condition Z — High impedance state Fault — Improper line conditions causing excessive power dissipation in the driver, such as shorts or bus contention situations * TS is an “open collector” output with an on-chip 10 kΩ pull-up resistor. ** This is a fail safe condition X — Don't care condition Z — High impedance state Fault — Improper line conditions causing excessive power dissipation in the driver, such as shorts or bus contention situations * TS is an “open collector” output with an on-chip 10 kΩ pull-up resistor. ** This is a fail safe condition Typical Application Repeater control logic not shown. Figure 11. 6 Submit Documentation Feedback Copyright © 1996–2013, Texas Instruments Incorporated Product Folder Links: DS3695A DS3695AT DS3696A DS3695A, DS3695AT, DS3696A www.ti.com SNLS353C – FEBRUARY 1996 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision B (April 2013) to Revision C • Page Changed layout of National Data Sheet to TI format ............................................................................................................ 6 Copyright © 1996–2013, Texas Instruments Incorporated Product Folder Links: DS3695A DS3695AT DS3696A Submit Documentation Feedback 7 PACKAGE OPTION ADDENDUM www.ti.com 12-Jul-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DS3695AM NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 DS36 95AM DS3695AM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS36 95AM DS3695AMX NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 70 DS36 95AM DS3695AMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS36 95AM DS3695ATM NRND SOIC D 8 95 TBD Call TI Call TI -40 to 85 DS369 5ATM DS3695ATM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS369 5ATM DS3695ATMX NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 85 DS369 5ATM DS3695ATMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS369 5ATM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com (4) 12-Jul-2014 There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DS3695AMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 DS3695AMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 DS3695ATMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 DS3695ATMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS3695AMX SOIC D 8 2500 367.0 367.0 35.0 DS3695AMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 DS3695ATMX SOIC D 8 2500 367.0 367.0 35.0 DS3695ATMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2014, Texas Instruments Incorporated