LM135, LM135A, LM235, LM235A, LM335, LM335A www.ti.com SNIS160D – MAY 1999 – REVISED MARCH 2013 LM135/LM235/LM335, LM135A/LM235A/LM335A Precision Temperature Sensors Check for Samples: LM135, LM135A, LM235, LM235A, LM335, LM335A FEATURES 1 • • • • 2 Directly Calibrated in °Kelvin 1°C Initial Accuracy Available Operates from 400 μA to 5 mA Less than 1Ω Dynamic Impedance • • • • Easily Calibrated Wide Operating Temperature Range 200°C Overrange Low Cost DESCRIPTION The LM135 series are precision, easily-calibrated, integrated circuit temperature sensors. Operating as a 2terminal zener, the LM135 has a breakdown voltage directly proportional to absolute temperature at +10 mV/°K. With less than 1Ω dynamic impedance the device operates over a current range of 400 μA to 5 mA with virtually no change in performance. When calibrated at 25°C the LM135 has typically less than 1°C error over a 100°C temperature range. Unlike other sensors the LM135 has a linear output. Applications for the LM135 include almost any type of temperature sensing over a −55°C to 150°C temperature range. The low impedance and linear output make interfacing to readout or control circuitry especially easy. The LM135 operates over a −55°C to 150°C temperature range while the LM235 operates over a −40°C to 125°C temperature range. The LM335 operates from −40°C to 100°C. The LM135/LM235/LM335 are available packaged in hermetic TO transistor packages while the LM335 is also available in plastic TO-92 packages. Schematic Diagram These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2013, Texas Instruments Incorporated LM135, LM135A, LM235, LM235A, LM335, LM335A SNIS160D – MAY 1999 – REVISED MARCH 2013 www.ti.com Absolute Maximum Ratings (1) (2) Reverse Current 15 mA Forward Current 10 mA Storage Temperature 8-Pin SOIC Package −65°C to 150°C TO-92 Package −60°C to 150°C TO Package −60°C to 180°C Specified Operating Temp. Range Continuous Intermittent (3) LM135, LM135A −55°C to 150°C 150°C to 200°C LM235, LM235A −40°C to 125°C 125°C to 150°C LM335, LM335A −40°C to 100°C 100°C to 125°C Lead Temp. (Soldering, 10 seconds) 8-Pin SOIC Package: (1) (2) (3) 300°C Vapor Phase (60 seconds): 215°C Infrared (15 seconds): 220°C TO-92 Package: 260°C TO Package: 300°C Refer to RETS135H for military specifications. If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. Continuous operation at these temperatures for 10,000 hours for NDV package and 5,000 hours for LP package may decrease life expectancy of the device. Temperature Accuracy (1) LM135/LM235, LM135A/LM235A Parameter Conditions LM135A/LM235A LM135/LM235 Units Min Typ Max Min Typ Max 2.97 2.95 2.98 3.01 V 1 3 °C Operating Output Voltage TC = 25°C, IR = 1 mA 2.98 2.99 Uncalibrated Temperature Error TC = 25°C, IR = 1 mA 0.5 1 Uncalibrated Temperature Error TMIN ≤ TC ≤ TMAX, IR = 1 mA 1.3 2.7 2 5 °C Temperature Error with 25°C TMIN ≤ TC ≤ TMAX, IR = 1 mA 0.3 1 0.5 1.5 °C Calibration Calibrated Error at Extended TC = TMAX (Intermittent) 2 2 °C Temperatures Non-Linearity (1) IR = 1 mA 0.3 0.5 0.3 1 °C Accuracy measurements are made in a well-stirred oil bath. For other conditions, self heating must be considered. Temperature Accuracy (1) LM335, LM335A Parameter Conditions LM335A LM335 Units Min Typ Max Min Typ Max 2.95 2.98 3.01 2.92 2.98 3.04 V 1 3 2 6 °C Operating Output Voltage TC = 25°C, IR = 1 mA Uncalibrated Temperature Error TC = 25°C, IR = 1 mA Uncalibrated Temperature Error TMIN ≤ TC ≤ TMAX, IR = 1 mA 2 5 4 9 °C Temperature Error with 25°C TMIN ≤ TC ≤ TMAX, IR = 1 mA 0.5 1 1 2 °C Calibration Calibrated Error at Extended TC = TMAX (Intermittent) 2 2 °C Temperatures Non-Linearity (1) 2 IR = 1 mA 0.3 1.5 0.3 1.5 °C Accuracy measurements are made in a well-stirred oil bath. For other conditions, self heating must be considered. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A LM135, LM135A, LM235, LM235A, LM335, LM335A www.ti.com SNIS160D – MAY 1999 – REVISED MARCH 2013 Electrical Characteristics (1) Parameter Conditions LM135/LM235 LM335 LM135A/LM235A LM335A Min Operating Output Voltage 400 μA ≤ IR ≤ 5 mA Change with Current At Constant Temperature Dynamic Impedance IR = 1 mA Typ Max 2.5 10 Min Units Typ Max 3 14 mV 0.5 0.6 Ω +10 +10 mV/°C Still Air 80 80 sec 100 ft/Min Air 10 10 sec Output Voltage Temperature Coefficient Time Constant Stirred Oil Time Stability (1) TC = 125°C 1 1 sec 0.2 0.2 °C/khr Accuracy measurements are made in a well-stirred oil bath. For other conditions, self heating must be considered. Thermal Resistance 8-Pin SOIC TO-92 TO θJA (Junction to Ambient) 165°C/W 202°C/W 400°C/W θJC (Junction to Case) N/A 170°C/W N/A CONNECTION DIAGRAMS Figure 1. 8-Pin SOIC Surface Mount Package Top View Package Number M08A (1) Figure 2. TO-92 Plastic Package Bottom View Package Z03A Figure 3. TO Metal Can Package (1) Bottom View Package Number H03H Case is connected to negative pin. Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A 3 LM135, LM135A, LM235, LM235A, LM335, LM335A SNIS160D – MAY 1999 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics 4 Reverse Voltage Change Calibrated Error Figure 4. Figure 5. Reverse Characteristics Response Time Figure 6. Figure 7. Dynamic Impedance Noise Voltage Figure 8. Figure 9. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A LM135, LM135A, LM235, LM235A, LM335, LM335A www.ti.com SNIS160D – MAY 1999 – REVISED MARCH 2013 Typical Performance Characteristics (continued) Thermal Resistance Junction to Air Thermal Time Constant Figure 10. Figure 11. Thermal Response in Still Air Thermal Response in Stirred Oil Bath Figure 12. Figure 13. Forward Characteristics Figure 14. Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A 5 LM135, LM135A, LM235, LM235A, LM335, LM335A SNIS160D – MAY 1999 – REVISED MARCH 2013 www.ti.com APPLICATION INFORMATION CALIBRATING THE LM135 Included on the LM135 chip is an easy method of calibrating the device for higher accuracies. A pot connected across the LM135 with the arm tied to the adjustment terminal allows a 1-point calibration of the sensor that corrects for inaccuracy over the full temperature range. This single point calibration works because the output of the LM135 is proportional to absolute temperature with the extrapolated output of sensor going to 0V output at 0°K (−273.15°C). Errors in output voltage versus temperature are only slope (or scale factor) errors so a slope calibration at one temperature corrects at all temperatures. The output of the device (calibrated or uncalibrated) can be expressed as: (1) where T is the unknown temperature and To is a reference temperature, both expressed in degrees Kelvin. By calibrating the output to read correctly at one temperature the output at all temperatures is correct. Nominally the output is calibrated at 10 mV/°K. To insure good sensing accuracy several precautions must be taken. Like any temperature sensing device, self heating can reduce accuracy. The LM135 should be operated at the lowest current suitable for the application. Sufficient current, of course, must be available to drive both the sensor and the calibration pot at the maximum operating temperature as well as any external loads. If the sensor is used in an ambient where the thermal resistance is constant, self heating errors can be calibrated out. This is possible if the device is run with a temperature stable current. Heating will then be proportional to zener voltage and therefore temperature. This makes the self heating error proportional to absolute temperature the same as scale factor errors. WATERPROOFING SENSORS Meltable inner core heat shrinkable tubing such as manufactured by Raychem can be used to make low-cost waterproof sensors. The LM335 is inserted into the tubing about ½″ from the end and the tubing heated above the melting point of the core. The unfilled ½″ end melts and provides a seal over the device. Typical Applications Figure 15. Basic Temperature Sensor Figure 17. Wide Operating Supply Figure 16. Calibrated Sensor *Calibrate for 2.982V at 25°C 6 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A LM135, LM135A, LM235, LM235A, LM335, LM335A www.ti.com SNIS160D – MAY 1999 – REVISED MARCH 2013 Figure 18. Minimum Temperature Sensing Figure 20. Remote Temperature Sensing Wire length for 1°C error due to wire drop Figure 19. Average Temperature Sensing (1) IR = 1 mA IR = 0.5 mA (1) AWG FEET FEET 14 4000 8000 16 2500 5000 18 1600 3200 20 1000 2000 22 625 1250 24 400 800 For IR = 0.5 mA, the trim pot must be deleted. Figure 21. Isolated Temperature Sensor Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A 7 LM135, LM135A, LM235, LM235A, LM335, LM335A SNIS160D – MAY 1999 – REVISED MARCH 2013 www.ti.com Figure 22. Simple Temperature Controller Figure 23. Simple Temperature Control Figure 24. Ground Referred Fahrenheit Thermometer *Adjust R2 for 2.554V across LM336. Adjust R1 for correct output. Figure 25. Centigrade Thermometer *Adjust for 2.7315V at output of LM308 8 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A LM135, LM135A, LM235, LM235A, LM335, LM335A www.ti.com SNIS160D – MAY 1999 – REVISED MARCH 2013 Figure 26. Fahrenheit Thermometer *To calibrate adjust R2 for 2.554V across LM336. Adjust R1 for correct output. Figure 27. THERMOCOUPLE COLD JUNCTION COMPENSATION Compensation for Grounded Thermocouple *Select R3 for proper thermocouple type THERMO-COUPLE R3 (±1%) SEEBECK COEFFICIENT J 377Ω 52.3 μV/°C T 308Ω 42.8 μV/°C K 293Ω 40.8 μV/°C S 45.8Ω 6.4 μV/°C Adjustments: Compensates for both sensor and resistor tolerances 1. Short LM329B 2. Adjust R1 for Seebeck Coefficient times ambient temperature (in degrees K) across R3. 3. Short LM335 and adjust R2 for voltage across R3 corresponding to thermocouple type. J 14.32 mV K 11.17 mV T 11.79 mV S 1.768 mV Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A 9 LM135, LM135A, LM235, LM235A, LM335, LM335A SNIS160D – MAY 1999 – REVISED MARCH 2013 www.ti.com Figure 28. Single Power Supply Cold Junction Compensation *Select R3 and R4 for thermocouple type THERMO-COUPLE R3 R4 SEEBECK COEFFICIENT J 1.05K 385Ω 52.3 μV/°C T 856Ω 315Ω 42.8 μV/°C K 816Ω 300Ω 40.8 μV/°C S 128Ω 46.3Ω 6.4 μV/°C Adjustments: 1. Adjust R1 for the voltage across R3 equal to the Seebeck Coefficient times ambient temperature in degrees Kelvin. 2. Adjust R2 for voltage across R4 corresponding to thermocouple. 10 J 14.32 mV T 11.79 mV K 11.17 mV S 1.768 mV Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A LM135, LM135A, LM235, LM235A, LM335, LM335A www.ti.com SNIS160D – MAY 1999 – REVISED MARCH 2013 Figure 29. Centigrade Calibrated Thermocouple Thermometer Terminate thermocouple reference junction in close proximity to LM335. Adjustments: 1. Apply signal in place of thermocouple and adjust R3 for a gain of 245.7. 2. Short non-inverting input of LM308A and output of LM329B to ground. 3. Adjust R1 so that VOUT = 2.982V @ 25°C. 4. Remove short across LM329B and adjust R2 so that VOUT = 246 mV @ 25°C. 5. Remove short across thermocouple. Figure 30. Fast Charger for Nickel-Cadmium Batteries †Adjust D1 to 50 mV greater VZ than D2. Charge terminates on 5°C temperature rise. Couple D2 to battery. Figure 31. Differential Temperature Sensor Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A 11 LM135, LM135A, LM235, LM235A, LM335, LM335A SNIS160D – MAY 1999 – REVISED MARCH 2013 www.ti.com Figure 32. Differential Temperature Sensor Figure 33. Variable Offset Thermometer‡ †Adjust for zero with sensor at 0°C and 10T pot set at 0°C *Adjust for zero output with 10T pot set at 100°C and sensor at 100°C ‡Output reads difference between temperature and dial setting of 10T pot 12 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A LM135, LM135A, LM235, LM235A, LM335, LM335A www.ti.com SNIS160D – MAY 1999 – REVISED MARCH 2013 Figure 34. Ground Referred Centigrade Thermometer Figure 35. Air Flow Detector* *Self heating is used to detect air flow DEFINITION OF TERMS Operating Output Voltage: The voltage appearing across the positive and negative terminals of the device at specified conditions of operating temperature and current. Uncalibrated Temperature Error: The error between the operating output voltage at 10 mV/°K and case temperature at specified conditions of current and case temperature. Calibrated Temperature Error: The error between operating output voltage and case temperature at 10 mV/°K over a temperature range at a specified operating current with the 25°C error adjusted to zero. Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A 13 LM135, LM135A, LM235, LM235A, LM335, LM335A SNIS160D – MAY 1999 – REVISED MARCH 2013 www.ti.com REVISION HISTORY Changes from Revision C (March 2013) to Revision D • 14 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 13 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM135 LM135A LM235 LM235A LM335 LM335A PACKAGE OPTION ADDENDUM www.ti.com 9-Jun-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) LM135AH ACTIVE TO NDV 3 1000 TBD Call TI Call TI -55 to 150 LM135AH LM135AH/NOPB ACTIVE TO NDV 3 1000 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 150 LM135AH LM135H ACTIVE TO NDV 3 1000 TBD Call TI Call TI -55 to 150 LM135H LM135H/NOPB ACTIVE TO NDV 3 1000 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 150 LM135H LM235AH ACTIVE TO NDV 3 1000 TBD Call TI Call TI -40 to 125 LM235AH LM235AH/NOPB ACTIVE TO NDV 3 1000 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -40 to 125 LM235AH LM235H ACTIVE TO NDV 3 1000 TBD Call TI Call TI -40 to 125 LM235H LM235H/NOPB ACTIVE TO NDV 3 1000 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -40 to 125 LM235H LM335A MWC ACTIVE WAFERSALE YS 0 1 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM LM335AH ACTIVE TO NDV 3 1000 TBD Call TI Call TI -40 to 100 LM335AH LM335AH/NOPB ACTIVE TO NDV 3 1000 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -40 to 100 LM335AH LM335AM ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 100 LM335 AM LM335AM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 100 LM335 AM LM335AMX ACTIVE SOIC D 8 2500 TBD Call TI Call TI -40 to 100 LM335 AM LM335AMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 100 LM335 AM LM335AZ/LFT1 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SN Level-1-NA-UNLIM LM335AZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM -40 to 100 LM335 AZ LM335H ACTIVE TO NDV 3 1000 TBD Call TI Call TI -40 to 100 LM335H Addendum-Page 1 LM335 AZ Samples PACKAGE OPTION ADDENDUM www.ti.com 9-Jun-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) LM335H/NOPB ACTIVE TO NDV 3 1000 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -40 to 100 LM335H LM335M ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 100 LM335 M LM335M/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 100 LM335 M LM335MX ACTIVE SOIC D 8 2500 TBD Call TI Call TI -40 to 100 LM335 M LM335MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 100 LM335 M LM335Z/LFT7 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM LM335Z/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM LM335 Z -40 to 100 LM335 Z (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 9-Jun-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 21-Mar-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM335AMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM335AMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM335MX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM335MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 21-Mar-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM335AMX SOIC D 8 2500 367.0 367.0 35.0 LM335AMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM335MX SOIC D 8 2500 367.0 367.0 35.0 LM335MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA NDV0003H H03H (Rev F) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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