Micrel MIC94090YC6 High side load switches for consumer application Datasheet

MIC94090/1/2/3/4/5
High Side Load Switches for
Consumer Applications
General Description
Features
The MIC94090/1/2/3/4/5 is a family of high-side load switches
designed for operation from 1.7V to 5.5V input voltage. The
load switch pass element is an internal 130mΩ RDS(ON) Pchannel MOSFET which enables the device to support up to
1.2A continuous current. Additionally, the load switch
supports 1.5V logic level control and shutdown features.
The MIC94090 and MIC94091 feature rapid turn on. The
MIC94092 and MIC94093 provide a slew rate controlled softstart turn-on of 790µs, while the MIC94094 and MIC94095
provide a slew rate controlled soft-start turn-on of 120µs. The
soft-start feature option prevents an in-rush current event
from pulling down the input supply voltage.
The MIC94091, MIC94093, and MIC94095 include a 250Ω
auto discharge load circuit that is switched on when the load
switch is disabled.
An active pull-down on the enable input keeps the
MIC94090/1/2/3/4/5 in a default OFF state until the enable pin
is pulled above 1.25V. Internal level shift circuitry allows low
voltage logic signals to switch higher supply voltages. The
enable voltage can be as high as 5.5V and is not limited by
the input voltage.
The MIC94090/1/2/3/4/5 operating voltage range makes
them ideal for Lithium ion and NiMH/NiCad/Alkaline battery
powered systems, as well as non-battery powered
applications. The devices provide low quiescent current and
low shutdown current to maximize battery life.
Datasheets and support documentation can be found on
Micrel’s web site at: www.micrel.com.
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•
•
•
•
•
•
1.7V to 5.5V input voltage range
1.2A continuous operating current
130mΩ RDS(ON)
Internal level shift for CMOS/TTL control logic
Ultra low quiescent current
Micro-power shutdown current
Rapid turn-on: MIC94090/1
Soft-Start: MIC94092/3 (790µs), MIC94094/5 (120µs)
Load discharge circuit: MIC94091/3/5
Space saving and thermally capable 1.2mm x 1.2mm
Thin MLF® package
• Industry standard SC-70-6 package
Applications
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Cellular phones
Portable Navigation Devices (PND)
GPS modules
Personal Media Players (PMP)
Ultra Mobile PCs
Other Portable applications
PDAs
Portable instrumentation
Industrial and DataComm equipment
_________________________________________________________________________________________________________
Typical Application
MIC94090 (ultra fast turn on)
MIC94092 (790µs soft-start)
MIC94094 (120µs soft-start)
MIC94091 (ultra fast turn on with auto-discharge)
MIC94093 (790µs soft-start with auto-discharge)
MIC94095 (120µs soft-start with auto-discharge)
MLF and MicroLeadFrame are registered trademarks of Amkor Technology, Inc.
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
March 2009
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Micrel, Inc.
MIC94090/1/2/3/4/5
Ordering Information
Part Number
Pb-Free
Part Marking
(1)
Pb-Free
Fast
Turn On
SoftStart
MIC94090YMT
D1
●
MIC94091YMT
D2
●
MIC94092YMT
D5
790µs
MIC94093YMT
D7
790µs
MIC94094YMT
0D
120µs
MIC94095YMT
1D
120µs
MIC94090YC6
D1D
●
MIC94091YC6
D2D
●
MIC94092YC6
D5D
790µs
MIC94093YC6
D7D
790µs
MIC94094YC6
0DD
120µs
MIC94095YC6
1DD
120µs
Load
Discharge
Package(2)
(3)
4-Pin 1.2mm x 1.2mm Thin MLF®
●
4-Pin 1.2mm x 1.2mm Thin MLF®
4-Pin 1.2mm x 1.2mm Thin MLF®
●
4-Pin 1.2mm x 1.2mm Thin MLF®
4-Pin 1.2mm x 1.2mm Thin MLF®
●
4-Pin 1.2mm x 1.2mm Thin MLF®
●
SC-70-6
SC-70-6
SC-70-6
●
SC-70-6
SC-70-6
●
SC-70-6
Notes:
1. Under bar symbol ( _ ) may not be to scale.
®
2. Thin MLF ▲ = Pin 1 identifier.
®
3. Thin MLF is a GREEN RoHS-compliant package. Lead finish is NiPdAu. Mold compound is Halogen Free.
Pin Configuration
PIN 1 TRIANGLE
BY MARKING
VOUT
1
4
GND
EN
2
3
VIN
4-Pin (1.2mm x 1.2mm) Thin MLF® (MT)
Top View
6-Pin SC-70-6 (C6)
Top View
Pin Description
Pin Number
Pin Name
Pin Function
TMLF-4
SC-70-6
1
1
VOUT
Drain of P-Channel MOSFET.
4
2, 5
GND
Ground: Connect to electrical ground.
3
4
VIN
Source of P-Channel MOSFET.
2
6
EN
Enable (Input): Active-high CMOS-compatible control input for switch. Internal 2MΩ
pull down resistor to GND, output will be off if this pin is left floating.
--
3
NC
No Internal Connection. A signal or voltage applied to this pin will have no effect on
device operation.
March 2009
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Micrel, Inc.
MIC94090/1/2/3/4/5
Absolute Maximum Ratings(1)
Operating Ratings(2)
Input Voltage (VIN) ...................................................... +6V
Enable Voltage (VEN) ................................................. +6V
Continuous Drain Current (ID)(3)
TA = 25°C (MLF®).............................................. ±1.2A
TA = 25°C (SC-70) ............................................ ±1.2A
Pulsed Drain Current (IDP)(4) .................................... ±6.0A
Continuous Diode Current (IS)(5) ............................ –50mA
Storage Temperature (Ts) ..................... –55°C to +150°C
ESD Rating – HBM(6)...................................................3kV
Input Voltage (VIN)....................................... +1.7 to +5.5V
Junction Temperature (TJ) .....................–40°C to +125°C
Package Thermal Resistance
Thin MLF® (θJC)(3) ............................................60°C/W
Thin MLF® (θJA)(3) ..........................................140°C/W
SC-70-6 (θJC) ................................................100°C/W
SC-70-6 (θJA) ................................................240°C/W
Electrical Characteristics
TA = 25°C, bold values indicate –40°C< TA < +85°C, unless noted.
Symbol
Parameter
Condition
Min
0.4
VEN_TH
Enable Threshold Voltage
VIN = 1.7V to 4.5V, ID = –250μA
IQ
Quiescent Current Measured on
the VIN Pin
VIN = VEN = 5.5V, ID = OPEN
Measured on VIN MIC94090/1
VIN = VEN = 5.5V, ID = OPEN
Measured on VIN MIC94092/3/4/5
Typ
Max
Units
1.25
V
0.1
1
µA
8
15
µA
IEN
Enable Input Current
VIN = VEN = 5.5V, ID = OPEN
2.5
4
µA
ISD
Shutdown Current
VIN = +5.5V, VEN = 0V, ID = OPEN
Measured on the VIN pin(7)
0.01
1
µA
ISHUT-SWITCH
OFF State Leakage Current
VIN = +5.5V, VEN = 0V, ID = SHORT
Measured on VOUT(7)
0.01
1
µA
RDS(ON)
P-Channel Drain to Source ON
Resistance
VIN = +5.0V, ID = –100mA, VEN = 1.5V
130
225
mΩ
VIN = +4.5V, ID = –100mA, VEN = 1.5V
135
235
mΩ
VIN = +3.6V, ID = –100mA, VEN = 1.5V
140
255
mΩ
VIN = +2.5V, ID = –100mA, VEN = 1.5V
170
315
mΩ
VIN = +1.8V, ID = –100mA, VEN = 1.5V
235
355
mΩ
VIN = +1.7V, ID = –100mA, VEN = 1.5V
260
375
mΩ
VIN = +3.6V, ITEST = 1mA, VEN = 0V
MIC94091/3/5
250
400
Ω
RSHUTDOWN
March 2009
Turn-Off Resistance
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Micrel, Inc.
MIC94090/1/2/3/4/5
Electrical Characteristics (Dynamic)
TA = 25°C, bold values indicate –40°C< TA < +85°C, unless noted.
Symbol
Parameter
Condition
tON_DLY
Turn-On Delay Time
VIN = +3.6V, ID = –100mA, VEN = 1.5V
Min
Typ
Max
Units
0.4
1.5
µs
200
740
1500
µs
65
110
165
µs
0.4
1.5
µs
400
790
1500
µs
65
120
175
µs
MIC94090/1
VIN = +3.6V, ID = –100mA, VEN = 1.5V
MIC94092/3
VIN = +3.6V, ID = –100mA, VEN = 1.5V
MIC94094/5
tON_RISE
Turn-On Rise Time
VIN = +3.6V, ID = –100mA, VEN = 1.5V
MIC94090/1
VIN = +3.6V, ID = –100mA, VEN = 1.5V
MIC94092/3
VIN = +3.6V, ID = –100mA, VEN = 1.5V
MIC94094/5
tOFF_DLY
Turn-Off Delay Time
VIN = +3.6V, ID = –100mA, VEN = 1.5V
60
200
ns
tOFF_FALL
Turn-Off Fall Time
VIN = +3.6V, ID = –100mA, VEN = 1.5V
10
100
ns
Notes:
1. Exceeding the absolute maximum rating may damage the device.
2. The device is not guaranteed to function outside its operating rating.
3. With backside thermal contact to PCB. See thermal considerations section.
4. Pulse width <300μs with < 2% duty cycle.
5. Continuous body diode current conduction (reverse conduction, i.e. VOUT to VIN) is not recommended.
6. Devices are ESD sensitive. Handling precautions recommended. HBM (Human body model), 1.5kΩ in series with 100pF.
7. Measured on the MIC94090YMT.
March 2009
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Micrel, Inc.
MIC94090/1/2/3/4/5
Typical Characteristics
March 2009
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Micrel, Inc.
MIC94090/1/2/3/4/5
Typical Characteristics
March 2009
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Micrel, Inc.
MIC94090/1/2/3/4/5
Functional Characteristics
MIC94090
March 2009
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Micrel, Inc.
MIC94090/1/2/3/4/5
MIC94091
March 2009
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Micrel, Inc.
MIC94090/1/2/3/4/5
MIC94092
March 2009
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Micrel, Inc.
MIC94090/1/2/3/4/5
MIC94093
March 2009
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Micrel, Inc.
MIC94090/1/2/3/4/5
MIC94094
March 2009
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Micrel, Inc.
MIC94090/1/2/3/4/5
MIC94095
March 2009
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Micrel, Inc.
MIC94090/1/2/3/4/5
Application Information
A switch is intended to drive a 500mA load and is placed
on a printed circuit board which has a ground plane area
of at least 25mm square. The Voltage source is a Li-ion
battery with a lower operating threshold of 3V and the
ambient temperature of the assembly can be up to 50oC.
Summary of variables:
ISW = 0.5A
VIN = 3V to 4.2V
Tamb = 50oC
Power Dissipation Considerations
As with all power switches, the ultimate current rating of
the switch is limited by the thermal properties of the
package and the PCB it is mounted on. There is a
simple, ohms law type relationship between thermal
resistance, power dissipation and temperature which are
analogous to an electrical circuit:
RθJC = 60oC/W from Datasheet (P. 3)
RθCA = 53oC/W Read from Graph in Fig. 3
Figure 1. Electrical Circuit
From this simple circuit we can calculate Vx if we know
Isource, Vz and the resistor values, Rxy and Ryz using
the equation:
Vx = Isource ⋅ (Rxy + Ryz) + Vz
Thermal circuits can be considered using these same
rules and can be drawn similarly replacing current
sources with Power dissipation (in Watts), Resistance
with Thermal Resistance (in oC/W) and Voltage sources
with temperature (in oC).
Figure 3. Excerpt from the LDO Book (1)
PDISS = ISW2 x RSWmax
The worst case switch resistance (RSWmax) at the lowest
VIN of 3V is not available in the datasheet, so the next
lower value of VIN is used.
Figure 2. Thermal Equivalent Circuit
RSWmax @ 2.5v = 315mΩ
If this were a figure for worst case RSWmax for 25oC, an
additional consideration is to allow for the maximum
junction temperature of 125oC, the actual worst case
resistance in this case will be 30% higher (See RDS(on)
variance vs. temperature graph).
Now replacing the variables in the equation for Vx, we
can find the junction temperature (Tj) from power
dissipation, ambient temperature and the known thermal
resistance of the PCB (RθCA) and the package (RθJA).
TJ = PDISS ⋅ (Rθ JC + Rθ CA ) + TAMB
(1)
It is this equation that is used to determine the graphs on
page 7. PDISS is calculated as (ISWITCH2 x RSWmax). RθJC is
found in the operating ratings section of the datasheet
and RθCA (the PCB thermal resistance) values for
various PCB copper areas can be taken from ‘Designing
with Low Dropout Voltage Regulators’(1) available from
the Micrel website (LDO Application Hints).
Example:
March 2009
RSWmax @ 2.5v (@ 125’C) = 315 x 1.3 = 410mΩ
Therefore junction temperature (TJ):
TJ = 0.52 x 0.41 x (60+53) + 50
TJ = 62oC
from (Eqn. 1)
This is well below the maximum 125oC.
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Micrel, Inc.
MIC94090/1/2/3/4/5
Package Information
6-Pin SC-70 (C6)
March 2009
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Micrel, Inc.
MIC94090/1/2/3/4/5
4-Pin Thin MLF® (MT)
March 2009
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Micrel, Inc.
MIC94090/1/2/3/4/5
Landing Pattern
Optional for maximum thermal performance. Heatsink should be connected to GND plane of PCB for maximum thermal performance.
Suggested Land Pattern 4-Pin Thin MLF® (MT)
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its
use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product
can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant
into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A
Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully
indemnify Micrel for any damages resulting from such use or sale.
© 2009 Micrel, Incorporated.
March 2009
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