ASMC-QxB2-Txxxx Envisium 0.5W Power PLCC-4 Surface Mount LED Indicator Data Sheet Envisium Features Envisium is the premier class of mid-Power LEDs from Avago and Philips Lumileds utilizing the very best solidstate lighting technologies from these two industry leaders. Envisium LEDs offer unparalleled performance, engineering and design flexibility. • Industry Standard PLCC 4 platform (3.2 x 2.8 x 1.9mm) • High reliability LED package • Mid-Power intensity brightness with optimum flux performance using Philips Lumileds TS AllnGaP chip technologies • Available in Red Orange and Amber colors • High optical efficiency • Available in 8mm carrier tape and 7 inch reel • Low Thermal Resistance Description The Envisium 0.5W Power PLCC-4 SMT LED is an extension of Envisium Power PLCC-4 SMT LEDs. The package can be driven at high current due to its superior package design. The product is able to dissipate the heat more efficiently compared to the Envisium Power PLCC-4 SMT LEDs. These LEDs produce higher light output with better flux performance compared to the Envisium Power PLCC-4 SMT LED. The Envisium 0.5W Power PLCC-4 SMT LEDs are designed for higher reliability, better performance, and operate under a wide range of environmental conditions. The performance characteristics of these new mid-power LEDs make them uniquely suitable for use in harsh conditions such as in automotive applications, and in electronics signs and signals. To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel is shipped in single intensity and color bin (except for red), to provide close uniformity. These LEDs are compatible with the IR solder reflow process. Due to the high reliability feature of these products, they also can be mounted using through-the-wave soldering process. Envisium 0.5W Power PLCC-4 SMT LED is available in red orange & amber colors. • Super wide viewing angle at 120° • Longer life time with minimum degradation due to enhanced silicone resin material • JEDEC MSL 2a Applications 1. Exterior automotive - Turn signals - Side repeaters - CHSML - Rear combination lamp - Side markers - Truck clearance lamp 2. Electronic signs and signals - Channel lettering - Contour lighting - Indoor variable message sign 3. Office automation, home appliances, industrial equipment - Front panel backlighting - Push button backlighting - Display backlighting Component Dimensions 2.2±0.2 1.9±0.2 0.8±0.1 A 0.15 (TYP.) Ø 2.40 1.15±0.05 0.8±0.3 C C 0.7±0.1 CATHODE MARKING 0.56 (TYP.) 3.2±0.2 3.6±0.2 A 0.41 (TYP.) 2.8±0.2 2.30±0.05 Note: 1. All Dimensions in millimeters. 2. Lead Polarity as shown in Figure 12. Figure 1. Package Drawing Table 1. Device Selection Guide Luminous Flux, fV [1] (lm) Color Part Number Min. Flux (lm) Typ. Flux (lm) Max. Flux (lm) Test Current (mA) Dice Technology Amber ASMC-QAB2-TAC0E 4.30 6.60 9.00 150 AlInGaP Red Orange ASMC-QHB2-TCD0E 7.00 9.30 11.50 150 AlInGaP Notes: 1. fV is the total luminous flux output as measured with an integrating sphere at mono pulse conditions. 2. Tolerance = ±12% Part Numbering System A S M C - Q X1 B 2 - T X2 X3 X4 X5 Packaging Option Color Bin Selection Max. Flux Bin Min. Flux Bin LED Chip Color Table 2. Absolute Maximum Ratings (TA = 25 °C) Parameters ASMC-QxB2-Txxxx DC Forward Current [1] 150 mA Peak Forward Current [2] 300 mA Power Dissipation 470 mW Reverse Voltage 5V Junction Temperature 125 °C Operating Temperature -40 °C to +100 °C Storage Temperature -40 °C to +100 °C Notes: 1. Derate Linearly as shown in Figure 6. 2. Duty Factor = 10%, Frequency = 1kHz Table 3. Optical Characteristics (TA = 25 °C) Dominant Wavelength lD [1] (nm) Viewing Angle 2q½ [2] (Degrees) Luminous Efficacy hV [3] (lm/W) Luminous Efficiency he (lm/W) Luminous Intensity / Total Flux [4, 5] IV (cd) / fV (lm) Typ. Typ. Typ. Typ. Typ. Color Part Number Dice Technology Amber ASMC-QAB2-Txxxx AlInGaP 593.5 120 470 17 0.15 Red Orange ASMC-QHB2-Txxxx AlInGaP 619.3 120 240 24 0.20 Notes: 1. The dominant wavelength, lD, is derived from the CIE Chromaticity diagram and represents the color of the device. 2. q½ is the off-axis angle where the luminous intensity is ½ the peak intensity. 3. Radiant intensity, Ie in watts / steradian, may be calculated from the equation Ie = IV / hV, where IV is the luminous intensity in candelas and hV is the luminous efficacy in lumens / watt. 4. fV is the total luminous flux output as measured with an integrating sphere after the device has stabilized. 5. Flux tested at mono pulse conditions. Table 4. Electrical Characteristics (TA = 25 °C) Forward Voltage VF (Volts) @ IF = 150 mA Reverse Voltage VR @ 100mA Part Number Typ. Max. Min. Thermal Resistance RqJ-P (°C/W) ASMC-QxB2-Txxxx 2.64 3.10 5 60 1.0 0.9 AlInGaP Red Orange RELATIVE INTENSITY 0.8 AlInGaP Amber 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 430 480 530 580 630 680 730 780 WAVELENGTH - nm Figure 2. Relative Intensity Vs. Wavelength 1.2 350 250 RELATIVE LUMINOUS INTENSITY (NORMALIZATION AT 150 mA) FORWARD CURRENT - mA 300 AlInGaP Red Orange 200 150 100 AlInGaP Amber 0.6 0.4 0 0 1 2 3 4 5 FORWARD VOLTAGE - V Figure 3. Forward Current Vs. Forward Voltage RELATIVE LUMINOUS INTENSITY (NORMALIZATION AT 25°C) 1.4 1.2 1 0.8 0.6 0.4 0.2 -50 -25 0 0 25 50 75 JUNCTION TEMPERATURE - °C Figure 5. Relative Intensity Vs. Temperature 0 20 40 60 80 100 100 125 120 DC FORWARD CURRENT - mA Figure 4. Relative Intensity Vs. Forward Current 1.6 0.8 0.2 50 0 1.0 140 160 160 160 Rθ JA = 100°C/W 140 Rθ�JA = 110°C/W 120 MAXIMUM FORWARD CURRENT - mA MAXIMUM FORWARD CURRENT - mA 140 Rθ JA = 130°C/W 100 80 60 40 100 80 60 40 20 0 Rθ JP = 60°C/W 120 20 0 20 40 60 80 AMBIENT TEMPERATURE (°C) 100 0 120 0 20 40 60 80 SOLDER POINT TEMPERATURE (°C) 100 120 Figure 6b. Maximum Forward Current Vs. Solder Point Temperature. Derated Based on TJMAX = 125°C, RqJP = 60°C/W Figure 6a. Maximum Forward Current Vs. Ambient Temperature. Derated Based on TJMAX = 125°C, RqJ-A=130 °C/W, 110°C/W and 100°C/W 630 RED ORANGE DOMINANT WAVELENGTH - nm 620 610 600 AMBER 590 580 570 1 2 5 10 20 CURRENT - mA 50 100 150 Figure 7. Dominant Wavelength Vs. Forward Current - AlInGaP Devices 1 0.9 0.1 0.8 0.05 0 -50 -25 0 25 50 -0.05 -0.1 -0.15 T J - JUNCTION TEMPERATURE - ˚C Figure 8. Forward Voltage Shift Vs. Temperature 75 100 NORMALIZED INTENSITY FORWARD VOLTAGE SHIFT - V 0.15 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREES Figure 9. Radiation Pattern 60 90 D Note: Diameter "D" should be smaller than 2.2mm Figure 10. Recommended Pick and Place Nozzle Size Figure 11. Recommended Pb-free Reflow Soldering Profile Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components ² Figure 12. Recommended Soldering Pad Pattern Figure 13. Tape Leader and Trailer Dimensions Figure 14. Tape Dimensions Figure 15. Reeling Orientation Device Color (X1) Color Bin Select (X4) A Amber H Red Orange Individual reel will contain parts from one full bin only. X4 Flux Bin Select (X2X3) 0 Full Distribution A 1 and 2 only Individual reel will contain parts from one bin only B 2 and 3 only Min Flux Bin C 3 and 4 only Max Flux Bin D 4 and 5 only E 5 and 6 only G 1, 2 and 3 only H 2, 3 and 4 only J 3, 4 and 5 only K 4, 5 and 6 only M 1, 2, 3 and 4 only N 2, 3, 4 and 5 only P 3, 4, 5 and 6 only R 1, 2, 3, 4 and 5 only S 2, 3, 4, 5 and 6 only Z Special Color Bin X2 X3 Flux Bin Limits Bin ID Min. (lm) Max. (lm) A 4.30 5.50 B 5.50 7.00 C 7.00 9.00 D 9.00 11.50 E 11.50 15.00 F 15.00 19.50 G 19.50 25.50 H 25.50 33.00 I 33.00 43.00 J 43.00 56.00 K 56.00 73.00 Tolerance of each bin limit = ± 12% Color Bin Limits Amber/Yellow Min. (nm) Max. (nm) 2 583.0 586.0 3 586.0 589.0 4 589.0 592.0 5 592.0 595.0 6 595.0 598.0 Red Orange Min. (nm) Max. (nm) 1 611.0 616.0 2 616.0 620.0 3 620.0 625.0 Tolerance of each bin limit = ±1nm Packaging Option (X5) Moisture Sensitivity Option Test Current Package Type Reel Size E 150mA Top Mount 7 Inch VF Binning This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. Bin Min. Max. A. Storage before use 2D 2.35 2.50 2E 2.50 2.65 2F 2.65 2.80 2G 2.80 2.95 2H 2.95 3.10 2J 3.10 3.25 - Unopen moisture barrier bag (MBB) can be stored at <40°C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is not recommended to open the MBB prior to assembly (e.g. for IQC). Tolerance of each bin = ±0.1V Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly of handling, the unit should b e held on the body only. Please refer to Avago Application Note AN 5288 for detail information. B. Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30°C / 60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours. C. Control for unfinished reel - For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembled boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if: - “10%” or “15%” HIC indicator turns pink. - The LEDs are exposed to condition of >30°C / 60% RH at any time. - The LEDs floor life exceeded 672 hours. Recommended baking condition: 60±5°C for 20 hours. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited, in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies, Limited. All rights reserved. AV02-0397EN - July 3, 2007