KEMET Part Number: CBR06C308BAGAC (CBR06C308BAGACTU) Ceramic, High Q, Microwave (CBR), 0.3 pF, +/-0.1 pF, 250 V, 0603, C0G, SMD, Fixed, RF, Ultra High Q, Low ESR, Class I General Information Style: Series: Chip Size: Description: Features: SMD Chip Microwave (CBR) 0603 SMD, Fixed, RF, Ultra High Q, Low ESR, Class I Ultra High Q, Low ESR, Class I RoHS: Yes Termination: Tin Marking: No Miscellaneous: Notes: Minimum Q = 806 Solder Wave or Solder Reflow Dimensions L 1.6mm +/-0.1mm W 0.8mm +/-0.1mm T 0.8mm +/-0.07mm B 0.4mm +/-0.15mm Specifications Capacitance: Capacitance Tolerance: +/-0.1 pF Voltage DC: 250 VDC Temperature Range: Temperature Coefficient: Packaging Specifications Packaging: Packaging Quantity: Dissipation Factor: Aging Rate: T&R, 180mm, Plastic Tape 4000 0.3 pF Insulation Resistance: Dielectric Strength: Quality Factor: -55/+125C C0G 0.246% 0% Loss/Decade Hour 10 GOhms 500 V 806 Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute - and we specifically disclaim - any warranty concerning suitability for a specific customer application or use. This Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained. Generated - 89690dab-11c8-4cbe-9e34-6460c53e5f67 © 2006 - 2017 IntelliData.net