W www.ti.com SLLS642 − JANUARY 2005 Description The MAX4597 is a single-pole single-throw (SPST) analog switch that is designed to operate from 2 V to 5.5 V. This device can handle both digital and analog signals, and signals up to V+ can be transmitted in either direction. Applications D Sample-and-Hold Circuits Features D Low ON-State Resistance (10 W) D ON-State Resistance Flatness (1.5 W) D Control Inputs Are 5.5-V Tolerant D Low Charge Injection (5 pC Max) D 300-MHz −3-dB Bandwidth at 255C D Low Total Harmonic Distortion (THD) (0.05%) D 2-V to 5.5-V Single-Supply Operation D Specified at 5-V and 3.3-V Nodes D −83-dB OFF Isolation at 1 MHz D Latch-Up Performance Exceeds 100 mA Per D D D Battery-Powered Equipment (Cellular Phones, PDAs) D Audio and Video Signal Routing JESD 78, Class II 0.5-nA Max OFF Leakage ESD Performance Tested Per JESD 22 − 2000-V Human-Body Model (A114-B, Class II) − 1000-V Charged-Device Model (C101) TTL/CMOS-Logic Compatible D Communication Circuits D D PCMCIA Cards Summary of Characteristics V+ = 5 V, TA = 25°C Single Pole Single Throw (SPST) Configuration SOT-23 OR SC-70 PACKAGE (TOP VIEW) Number of channels IN 1 5 V+ COM 2 4 GND 3 1 ON-state resistance (ron) 10 Ω ON-state resistance flatness (ron(flat)) 1.5 Ω Turn-on/turn-off time (tON/tOFF) NC 35 ns/40 ns Charge injection (QC) 5 pC Bandwidth (BW) 300 MHz OFF isolation (OISO) FUNCTION TABLE −83 dB at 1 MHz Total harmonic distortion (THD) IN NC TO COM, COM TO NC L ON Power-supply current (I+) H OFF Package option 0.05% ±0.05 nA Leakage current(ICOM(OFF)/INC(OFF)) 1 µA 5-pin SOT-23 or SC-70 ORDERING INFORMATION TA −40°C to 85°C PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) SOT (SOT-23) − DBV Tape and reel MAX4597DBVR 6SD_ SOT (SC−70) − DCK Tape and reel MAX4597DCKR SD_ (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. !" # $%&" !# '%()$!" *!"&+ *%$"# $ " #'&$$!"# '& ",& "&# &-!# #"%&"# #"!*!* .!!"/+ *%$" '$&##0 *&# " &$&##!)/ $)%*& "&#"0 !)) '!!&"&#+ Copyright 2005, Texas Instruments Incorporated W www.ti.com SLLS642 − JANUARY 2005 Pin Configurations Available in Other Pin Configurations IN 1 5 V+ 4 NC COM 1 NO 2 GND 3 5 V+ 4 IN COM 2 GND 3 MAX4597 MAX4594 COM 1 NC 2 GND 3 5 V+ IN 1 5 V+ 4 NO COM 2 4 IN MAX4595 GND 3 MAX4596 Absolute Minimum and Maximum Ratings(1)(2) over operating free-air temperature range (unless otherwise noted) V+ VNC VCOM IK INC ICOM VI MIN MAX Supply voltage range(3) −0.3 6 UNIT V Analog voltage range(3)(4) −0.3 V+ + 0.3 V Analog port diode current VNC, VCOM < 0 −50 On-state switch current VNC, VCOM = 0 to V+ −20 20 mA −0.3 6 V Digital input voltage range(3)(4) IIK I+ Digital input clamp current IGND Continuous current through GND θJA Package thermal impedance(5) VI < 0 mA −50 Continuous current through V+ mA 100 −100 mA mA DBV package 206 DCK package 252 °C/W Tstg Storage temperature range −65 150 °C (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum (3) All voltages are with respect to ground, unless otherwise specified. (4) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. (5) The package thermal impedance is calculated in accordance with JESD 51-7. 2 W www.ti.com SLLS642 − JANUARY 2005 Electrical Characteristics for 5-V Supply(1) V+ = 4.5 V to 5.5 V, TA = −40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS SYMBOL TA V+ MIN TYP MAX UNIT Analog Switch Analog signal range VCOM, VNC 0 VNC = 3.5 V, ICOM = 10 mA, Switch ON, See Figure 13 25°C VNC = 1.5 V, 2.5 V, 3.5 V, ICOM = 10 mA, Switch ON, See Figure 13 25°C ron(flat) NC OFF leakage current VNC = 1 V, VCOM = 4.5 V, or VNC = 4.5 V, VCOM = 1 V, Switch OFF, See Figure 14 25°C INC(OFF) COM OFF leakage current VCOM = 1 V, VNC = 4.5 V, or VCOM = 4.5 V, VNC = 1 V, Switch OFF, See Figure 14 25°C ICOM(OFF) INC(ON) VNC = 1 V, VCOM = 1 V, or VNC = 4.5 V, VCOM = 4.5 V, or VNC = 1 V, 4.5 V, VCOM = Open, Switch ON, See Figure 15 VCOM = 1 V, VNC = 1 V, or VCOM = 4.5 V, VNC = 4.5 V, or VCOM = 1 V, 4.5 V, VNC = Open, Switch ON, See Figure 15 ON-state resistance ron ON-state resistance flatness NC ON leakage current COM ON leakage current ICOM(ON) Full V+ 6.5 4.5 V 10 12 0.5 2 −0.5 0.01 nA −5 −0.5 5 0.01 0.5 5.5 V Full nA −5 25°C Ω 0.5 5.5 V Full Ω 1.5 4.5 V Full V −1 5 0.01 1 5.5 V nA Full −10 25°C −1 10 0.01 1 5.5 V nA Full −10 10 Full 2.4 5.5 V Full 0 0.8 V 25°C −1 Digital Control Input (IN) Input logic high Input logic low Input leakage current VIH VIL IIH, IIL VI = 5.5 V or 0 Full 5.5 V −1 0.03 1 1 µA A (1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum 3 W www.ti.com SLLS642 − JANUARY 2005 Electrical Characteristics for 5-V Supply(1) (continued) V+ = 4.5 V to 5.5 V, TA = −40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS SYMBOL TA V+ MIN TYP MAX 20 35 UNIT Dynamic Turn-on time VNC = 3 V, RL = 300 Ω, CL = 35 pF, See Figure 17 25°C 5V tON Full 4.5 V to 5.5 V Turn-off time VNC = 3 V, RL = 300 Ω, CL = 35 pF, See Figure 17 25°C 5V tOFF Full 4.5 V to 5.5 V CL = 1 nF, See Figure 20 25°C 5V 2 Switch OFF, See Figure 16 25°C 5V 8 pF 45 25 ns 40 50 ns Charge injection QC NC OFF capacitance CNC(OFF) VGEN = 0, RGEN = 0, VNC = 0, f = 1 MHz, COM OFF capacitance CCOM(OFF) VCOM = 0, f = 1 MHz, Switch OFF, See Figure 16 25°C 5V 8 pF NC ON capacitance CNC(ON)) VNC = 0, f = 1 MHz, Switch ON, See Figure 16 25°C 5V 20 pF COM ON capacitance CCOM(ON) VCOM = 0, f = 1 MHz, Switch ON, See Figure 16 25°C 5V 20 pF CI VI = V+ or GND, See Figure 16 25°C 5V 3 pF BW RL = 50 Ω, Signal = 0 dBm, Switch ON, See Figure 18 25°C 5V 300 MHz Digital input capacitance Bandwidth 5 pC OFF isolation OISO RL = 50 Ω, f = 10 MHz, VNC = 1 VRMS, Switch OFF, See Figure 19 25°C 5V −83 dB Total harmonic distortion THD RL = 600 Ω, CL = 50 pF, VSOURCE = 5 Vp-p, f = 20 Hz to 20 kHz, See Figure 21 25°C 5V 0.05 % Supply Positive supply I+ VI = V+ or GND, Switch ON or OFF Full 5.5 V current (1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum 4 1 µA W www.ti.com SLLS642 − JANUARY 2005 Electrical Characteristics for 3-V Supply(1) V+ = 2.7 V to 3.6 V, TA = −40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS SYMBOL TA V+ MIN TYP MAX UNIT Analog Switch Analog signal range ON-state resistance VCOM, VNC ron 0 VNC = 1.5 V, ICOM = 10 mA, Switch ON, See Figure 13 25°C Full V+ 10 2.7 V 20 25 V Ω Digital Control Input (IN) Input logic high Input logic low VIH VIL Full 2 5.5 V Full 0 0.8 V Input leakage current IIH, IIL VI = V+ or 0 Turn-on time VCOM = 2 V, RL = 300 Ω, CL = 35 pF, See Figure 17 25°C 3V tON Full 2.7 V to 3.6 V Turn-off time VCOM = 2 V, RL = 300 Ω, CL = 35 pF, See Figure 17 25°C 3V tOFF Full 2.7 V to 3.6 V VNC = 0, CL = 1 nF, See Figure 20 25°C 3V 25°C Full −1 3.6 V 0.03 −1 1 1 µA A Dynamic Charge injection QC 25 45 55 30 50 60 2 ns ns 4 pC 1 µA Supply Positive supply I+ VI = V+ or GND, Switch ON or OFF Full 3.6 V current (1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum 5 W www.ti.com SLLS642 − JANUARY 2005 TYPICAL PERFORMANCE 10 8 TA = 25_C 8 6 855C 255C 6 ron (W) ron (Ω) V+ = 3 V 4 4 –405C V+ = 5 V 2 2 0 0 0 1 2 3 4 5 0 1 2 VCOM (V) 1.0 –405C ICOM(ON)/INO(ON) 0.8 Leakage Current (nA) 8 ron (W) 5 Figure 2. ron vs VCOM (V+ = 5 V) 10 6 4 255C 855C 2 0.6 INO(OFF)/ICOM(OFF) 0.4 0.2 0.0 0 0 1 2 3 VCOM (V) −40°C 25°C TA (°C) 85°C Figure 4. Leakage Current vs Temperature (V+ = 5 V) Figure 3. ron vs VCOM (V+ = 3 V) 20 2 18 1 tON tOFF 16 0 tON/tOFF (ns) Charge Injection (pC) 4 VCOM (V) Figure 1. ron vs VCOM V+ = 3 V −1 V+ = 5 V −2 −3 14 12 10 8 6 −4 0 1 2 3 4 Bias Voltage (V) Figure 5. Charge-Injection (QC) vs VCOM 6 3 5 0 1 2 3 4 5 6 V+ (V) Figure 6. tON and tOFF vs Supply Voltage W www.ti.com SLLS642 − JANUARY 2005 TYPICAL PERFORMANCE 12 Logic Level Threshold (nA) 3 tON/tOFF (ns) 11 10 9 tON 8 7 tOFF 6 −40°C 25°C VIH 2 1 VIL 0 0 85°C 1 2 TA (5C) Figure 7. tON and tOFF vs Temperature (V+ = 5 V) 3 V+ (V) 4 5 6 Figure 8. Logic-Level Threshold vs V+ 0.0 0 −0.5 −20 Attenuation (dB) Gain (dB) −1.0 −1.5 −2.0 −2.5 −3.0 −40 −60 −80 −100 −3.5 −4.0 0.1 1 10 Frequency (MHz) 100 −120 0.1 1000 Figure 9. Bandwidth (Gain vs Frequency) (V+ = 5 V) 1 10 Frequency (MHz) 100 1000 Figure 10. Off Isolation vs Frequency 10 0.20 V+ = 5 V 9 8 0.15 7 5 V+ = 3 V 4 3 2 THD (%) I+ (µA) 6 0.10 V+ = 3 V 0.05 V+ = 5 V 1 0 −40°C 25°C 85°C TA (5C) Figure 11. Power-Supply Current vs Temperature 0.00 0.1 1 10 100 1000 Frequency (MHz) Figure 12. Total Harmonic Distortion vs Frequency 7 W www.ti.com SLLS642 − JANUARY 2005 PIN DESCRIPTION PIN NUMBER NAME DESCRIPTION 1 IN 2 COM Digital control pin to connect COM to NC Common 3 GND Digital ground 4 NC Normally closed 5 V+ Power supply PARAMETER DESCRIPTION SYMBOL 8 DESCRIPTION VCOM Voltage at COM VNC Voltage at NC ron Resistance between COM and NC ports when the channel is ON ron(flat) Difference between the maximum and minimum value of ron in a channel over the specified range of conditions INC(OFF) Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the OFF state INC(ON) Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the ON state and the output (COM) open ICOM(OFF) Leakage current measured at the COM port, with the corresponding channel (COM to NC) in the OFF state ICOM(ON) Leakage current measured at the COM port, with the corresponding channel (COM to NC) in the ON state and the output (NC) open VIH Minimum input voltage for logic high for the control input (IN) VIL Maximum input voltage for logic low for the control input (IN) VI Voltage at the control input (IN) IIH, IIL Leakage current measured at the control input (IN) tON Turn-on time for the switch. This parameter is measured under the specified range of conditions and by the propagation delay between the digital control (IN) signal and analog output (COM or NC) signal when the switch is turning ON. tOFF Turn-off time for the switch. This parameter is measured under the specified range of conditions and by the propagation delay between the digital control (IN) signal and analog output (COM or NC) signal when the switch is turning OFF. QC Charge injection is a measurement of unwanted signal coupling from the control (IN) input to the analog (NC or COM) output. This is measured in coulomb (C) and measured by the total charge induced due to switching of the control input. Charge injection, QC = CL × ∆VCOM, CL is the load capacitance, and ∆VCOM is the change in analog output voltage. CNC(OFF) CNC(ON) Capacitance at the NC port when the corresponding channel (NC to COM) is OFF CCOM(OFF) CCOM(ON) Capacitance at the COM port when the corresponding channel (COM to NC) is OFF CI Capacitance of control input (IN) OISO OFF isolation of the switch is a measurement of OFF-state switch impedance. This is measured in dB in a specific frequency, with the corresponding channel (NC to COM) in the OFF state. BW Bandwidth of the switch. This is the frequency in which the gain of an ON channel is −3 dB below the DC gain. THD Total harmonic distortion describes the signal distortion caused by the analog switch. This is defined as the ratio of root mean square (RMS) value of the second, third, and higher harmonic to the absolute magnitude of the fundamental harmonic. I+ Static power-supply current with the control (IN) pin at V+ or GND Capacitance at the NC port when the corresponding channel (NC to COM) is ON Capacitance at the COM port when the corresponding channel (COM to NC) is ON W www.ti.com SLLS642 − JANUARY 2005 PARAMETER MEASUREMENT INFORMATION V+ VNC NC COM + VCOM Channel ON r on + VI ICOM IN VCOM * VNC W ICOM VI = VIH or VIL + GND Figure 13. ON-State Resistance (ron) V+ VNC NC COM + VI VCOM + OFF-State Leakage Current Channel OFF VI = VIH or VIL IN + GND Figure 14. OFF-State Leakage Current (ICOM(OFF), INC(OFF)) V+ VNC NC COM + VI VCOM ON-State Leakage Current Channel ON VI = VIH or VIL IN + GND Figure 15. ON-State Leakage Current (ICOM(ON), INC(ON)) 9 W www.ti.com SLLS642 − JANUARY 2005 V+ VNC NC Capacitance Meter VBIAS = V+ or GND VI = VIH or VIL VCOM COM VBIAS Capacitance is measured at NC, COM, and IN inputs during ON and OFF conditions. IN VI GND Figure 16. Capacitance (CI, CCOM(OFF), CCOM(ON), CNC(OFF), CNC(ON)) V+ NC VCOM(3) VI VNC TEST RL CL tON 300 Ω 35 pF tOFF 300 Ω 35 pF COM CL(2) RL IN Logic Input(1) V+ Logic Input (VI) GND 50% 50% 0 tON tOFF Switch Output (VNC) 90% 90% (1) All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns. (2) CL includes probe and jig capacitance. (3) See Electrical Characteristics for VCOM. Figure 17. Turn-On (tON) and Turn-Off Time (tOFF) V+ Network Analyzer 50 W VNC NC Channel ON: NC to COM COM VCOM Source Signal VI = V+ or GND Network Analyzer Setup 50 W VI + IN Source Power = 0 dBm (632-mV P-P at 50-W load) GND Figure 18. Bandwidth (BW) 10 DC Bias = 350 mV W www.ti.com SLLS642 − JANUARY 2005 V+ Network Analyzer Channel OFF: NC to COM 50 W VNC NC VI = V+ or GND VCOM COM Source Signal 50 W Network Analyzer Setup VI 50 W Source Voltage = 1 VRMS IN + DC Bias = 350 mV GND Figure 19. OFF Isolation (OISO) V+ RGEN VGEN Logic Input (VI) VIH OFF ON OFF V IL NC COM + VCOM ∆VCOM VCOM CL(1) VI VGEN = 0 to V+ RGEN = 0 CL = 1 nF QC = CL × ∆VCOM VI = VIH or VIL IN Logic Input(2) GND (1) CL includes probe and jig capacitance. (2) All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns. Figure 20. Charge Injection (QC) VI = V+/2 or −V+/2 RL = 600 Ω fSOURCE = 20 Hz to 20 kHz CL = 50 pF Channel ON: COM to NO VSOURCE = V+ P-P V+/2 Audio Analyzer NO Source Signal COM CL(1) 600 W VI 600 W IN GND −V+/2 (1) CL includes probe and jig capacitance. Figure 21. Total Harmonic Distortion (THD) 11 PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) MAX4597DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 6SDR MAX4597DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 SDR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 5-Jun-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) MAX4597DBVR SOT-23 DBV 5 3000 180.0 8.4 MAX4597DCKR SC70 DCK 5 3000 180.0 8.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.23 3.17 1.37 4.0 8.0 Q3 2.47 2.3 1.25 4.0 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 5-Jun-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MAX4597DBVR MAX4597DCKR SOT-23 DBV 5 3000 202.0 201.0 28.0 SC70 DCK 5 3000 202.0 201.0 28.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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