Fox NC26LF Thru-hole tuning fork Datasheet

Thru-Hole Tuning Fork
RoHS Compliant / pB Free
Model: NC15LF/NC26LF/NC38LF
Rev. 1/13/2012
http://www.foxonline.com/need_a_sample.htm
FEATURES
•
•
•
•
•
Miniature Packages
Low Cost
Cold Weld Design
Long Term Stability
Tight Tolerance
NC15LF
Click to view mounting precautions
1.5 Max
• PART NUMBER SELECTION Learn More - Internet Required
Part Number
298LF-Frequency-xxxxx
299LF-Frequency-xxxxx
300LF-Frequency-xxxxx
Model
Number
Frequency
Stability
Operating
Temperature
Frequency
NC15LF
NC26LF
NC38LF
-0.04 PPM / (ƼC)2
-0.04 PPM / (ƼC)2
-0.04 PPM / (ƼC)2
-20 ºC~ +60 ºC
-20 ºC~ +60 ºC
-20 ºC~ +60 ºC
32.768 kHz
32.768 kHz
32.768 kHz
5.0 Max
0.22 ±0.05
4.5 Min
• STANDARD SPECIFICATIONS
PARAMETERS
Frequency
Frequency Tolerance @ 25ºC
Frequency Stability
Temperature Coefficient
Temperature Range
Turnover (TO)
Operating (TOPR)
Storage
(TSTG)
Equivalent Series Resistance (RS)
NC15 / NC26
NC38
Load Capacitance (Cl)
Insulation Resistance @ 100VDC
Drive Level
Aging per year
MAX (unless otherwise noted)
32.768 kHz
± 20 PPM
0.45
NC26LF
-0.04 PPM / (ƼC)2
2.0 Max
+20ºC ~ +30ºC
-20ºC ~ +60ºC
-30ºC ~ +70ºC
50 kΩ
35 kΩ
12.5 pF (Standard)
6 pF (Optional)
500 MΩ Min
1.0 µW
±3 PPM
6.0 Max
0.2 ±0.07
4.0 Min
0.7 ±0.15
All specifications subject to change without notice.
Note: Can should not be soldered to the circuit board or grounded. If securing the can to the board
is desired, a rubber adhesive is recommended.
NC38LF
3.2 Max
8.3 Max
0.38±0.05
9.0 Min
0.8 ±0.1
All dimensions are in millimeters.
FOXElectronics
5570 Enterprise Parkway Fort Myers, Florida 33905 USA +1.239.693.0099 FAX +1.239.693.1554 www.foxonline.com
EMEA Tel: +44 .1283.568153 | Canada +1.888.438.2369 | Asia Hong Kong Tel: +852.2854.4285 | Japan Tel: +81.3.3374.2079
© 2012 FOX ELECTRONICS | ISO9001:2008 Certified
1. Mounting Precautions
1.1 Lead Type Crystal Units
1.1.1. Structure
Tubular crystal units are hermetically sealed using glass (see Figures 1 and 2).
Case
Case
Hermetic
Glass
Hermetic
Glass
Lead
Lead
Figure 1
Figure 2
1.1.2 Unbending the lead
(1) DO NOT pull the lead excessively if unbending a lead or removing a crystal unit. The excessive force may
crack the glass and reduce the degree of vacuum. This may eventually result in deterioration of the
characteristics and may also break the crystal chip see Figure 3).
(2) Unbend the lead by pressing on the bent part from both the upper and lower sides with fixing the bottom of
lead tightly. (see Figure 4).
Tweezers or
needle-nose pliers
Breakage
Pull out
Case
Lead
Figure 3
Figure 4
Page 1 of 2
7/7/2011
1.1.3 Bending the lead
(1) Bend the lead so that the lead will remain straight for more than 0.5mm from the case when soldering a
crystal unit after bending. If not, the glass may be cracked (see Figures 5 and 6).
(2) Always leave a length greater than the case diameter when bending a lead after soldering (see Figure 7).
D
0.5mm
0.5mm
L>D
Solder
Printed circuit
board
Solder
L
Solder
Figure 5
Figure 6
Soldering directly to the case will reduce the degree of vacuum and may result in
deterioration of the characteristics and may break the crystal chip.
Figure 7
Make the length from the
case to the printed circuit
board (L) longer than the
case diameter (D) so that
the lead wire will not be
pulled in case the crystal
unit falls over.
1.1.4 Soldering
When mounting or removing a quartz crystal unit, heat the lead part at 300°C or lower for 5 seconds or less (in the case of a
lead-type conventional product). A long period of time of heating may result in deterioration of the characteristics and may
break the crystal unit. Be sure to keep the case at or below 150°C.
Page 2 of 2
7/7/2011
Similar pages