Eudyna FMM5125X 15/60ghz frequency multiplier mmic Datasheet

FMM5125X
15/60GHz Frequency Multiplier MMIC
FEATURES
•Input/Output Frequency : 15 / 60 GHz
•Wide Frequency Band : 57 - 64 GHz
•Conversion Loss : Lc = 5dB (Typ.) @fout = 60 GHz, Pin = 10 dBm
•High Output Power : Po = 5dBm (Typ.) @fout = 60 GHz, Pin = 10 dBm
•Impedance Matched Zin/Zout = 50Ω
Device photo
DESCRIPTION
The FMM5125X is a by 4 frequency multiplier MMIC designed for
applications in the 57-64 GHz frequency range. This product is well
suited for wireless LAN and point-to-point radio.
Eudyna’s stringent Quality Assurance Program assures the highest
reliability and consistent performance.
o
ABSOLUTE MAXIMUM RATING (Case Temperature Tc=25 C)
Item
Symbol
Rating
Unit
DC Input Voltage
DC Input Voltage
Input Power
Storage Temperature
V
V
dBm
o
C
V DD
V GG
Pin
Tstg
+4
-3
15
-55 to +125
o
RECOMMENDED OPERATING CONDITION (Case Temperature Tc=25 C)
Item
Symbol
Condition
DC Input Voltage
Backside Temperature
V DD
Tb
3
Unit
V
C
o
-45 to + 85
o
ELECTRICAL CHARACTERISTICS (Case Temperature Tc=25 C)
Limit
Item
Symbol
Condition
Min. Typ. Max.
Output Power
Pout
V DD=3V
Unit
-5
5
-
dBm
-
100
8
12
-
mA
dB
dB
V GG=0V
Pin=10 dBm
Total Drain Current
Input Return Loss
Output Return Loss
IDDt
RLin
RLout
fin =14.25~16 GHz
f = 14.25~16 GHz
f = 57~64 GHz
These values are representative for CW on chip measurements that are made without bonding wires at the RF ports.
ESD
Class 0
Note : Based on EIAJ ED-4701 C-111A(C=100pF, R=1.5kΩ)
Edition 1.1
Dec. 2005
1
~ 199V
FMM5125X
15/60GHz Frequency Multiplier MMIC
Output Power vs. Frequency
Bias Condition: Vdd = 3V, Idd = 100 mA
Pin = 10 dBm
10
10
5
5
4x
0
0
Output Power [dBm ]
Output Power [dBm]
Output Power vs. Input Power
Bias Condition: Vdd = 3V, Idd = 100 mA
fin = 15 GHz
-5
-10
-15
3x
-5
-10
-15
-20
2x
-25
-30
5x
-35
-20
1x
-40
-25
-5
0
5
10
-45
15
13
Input Power [dBm]
14
15
16
Input Frequency [GHz]
Typical on chip measurements
2
17
FMM5125X
15/60GHz Frequency Multiplier MMIC
S-PARAMETERS
VDD = 3V, VGG = 0V, IDD = 100 mA
0
0
-2
-2
-4
-6
|S22| (dB)
|S11| (dB)
-4
-6
-8
-8
-10
-12
-14
-16
-10
-18
-12
-20
0
10
20
30
40
50
60
70
80
90
100
0
Frequency (GHz)
10
20
30
40
50
60
Frequency (GHz)
Typical on chip measurements
3
70
80
90
100
FMM5125X
15/60GHz Frequency Multiplier MMIC
S-PARAMETERS
Vdd = 3V, Vgg = 0V, Idd = 100 mA
Freq.
GHz
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
S11
MAG
0.874
0.689
0.558
0.477
0.425
0.389
0.364
0.347
0.335
0.327
0.324
0.323
0.325
0.342
0.365
0.383
0.403
0.424
0.446
0.465
0.484
0.501
0.515
0.525
0.534
0.547
0.555
0.561
0.564
0.571
0.572
0.575
0.583
0.581
0.585
0.588
0.583
0.590
0.586
0.582
0.579
0.580
0.578
0.573
0.572
0.572
0.566
0.562
0.544
0.531
ANG
-40.2
-68.7
-88.1
-101.9
-112.0
-119.8
-125.5
-129.5
-132.6
-134.5
-135.7
-136.4
-136.1
-135.0
-136.3
-137.9
-139.6
-141.9
-144.3
-147.0
-150.3
-153.4
-156.8
-159.7
-162.4
-165.8
-168.7
-172.0
-174.8
-177.7
179.9
176.5
174.1
171.6
168.3
165.8
163.1
159.7
157.4
154.3
151.3
148.5
145.6
142.7
139.3
136.4
132.7
129.2
125.2
122.6
S21
MAG
0.003
0.005
0.011
0.006
0.002
0.001
0.001
0.001
0.001
0.002
0.004
0.007
0.009
0.010
0.008
0.006
0.006
0.008
0.008
0.008
0.008
0.007
0.006
0.004
0.002
0.001
0.004
0.005
0.010
0.014
0.016
0.019
0.023
0.026
0.030
0.037
0.042
0.052
0.058
0.071
0.091
0.115
0.152
0.210
0.292
0.435
0.683
1.161
2.157
3.905
ANG
85.0
-71.0
55.7
-115.6
-164.9
-176.4
176.9
150.1
120.1
93.8
46.7
-18.1
-63.8
-127.1
-169.1
171.6
153.8
140.9
111.4
78.8
60.0
42.1
11.7
-0.5
-23.0
101.2
91.9
59.6
56.2
31.8
5.1
-12.3
-28.2
-43.4
-56.1
-69.6
-84.2
-100.7
-105.8
-121.8
-130.3
-142.9
-155.1
-167.3
179.9
166.3
149.6
129.5
100.7
52.8
S12
MAG
0.0003
0.0007
0.0008
0.0004
0.0003
0.0004
0.0003
0.0004
0.0006
0.0010
0.0015
0.0014
0.0013
0.0004
0.0001
0.0005
0.0007
0.0012
0.0013
0.0008
0.0005
0.0002
0.0004
0.0007
0.0019
0.0024
0.0019
0.0016
0.0017
0.0009
0.0005
0.0010
0.0013
0.0019
0.0010
0.0019
0.0017
0.0012
0.0020
0.0023
0.0023
0.0019
0.0018
0.0016
0.0010
0.0016
0.0021
0.0015
0.0027
0.0027
ANG
107.0
35.7
-62.7
-91.0
-100.2
-125.0
-147.4
-152.2
-157.7
170.6
124.2
60.1
-9.1
-59.7
-50.7
-81.6
-97.3
-143.2
165.8
142.1
132.6
115.1
-78.1
-112.1
-164.0
144.1
121.6
114.9
70.4
110.1
59.0
73.4
91.6
100.2
83.5
79.1
99.0
87.2
74.4
42.6
48.0
19.1
54.7
31.8
30.8
45.9
49.3
64.2
43.9
46.9
S22
MAG
0.995
0.982
0.899
0.882
0.896
0.890
0.873
0.853
0.833
0.810
0.779
0.741
0.720
0.699
0.676
0.654
0.629
0.603
0.576
0.545
0.512
0.476
0.438
0.395
0.337
0.195
0.142
0.110
0.085
0.073
0.080
0.094
0.113
0.141
0.174
0.205
0.235
0.258
0.277
0.295
0.314
0.336
0.350
0.359
0.363
0.370
0.368
0.357
0.319
0.206
ANG
-12.2
-24.5
-35.3
-43.0
-52.3
-62.5
-72.5
-82.0
-91.3
-100.5
-109.6
-117.3
-124.7
-132.5
-140.2
-148.0
-156.1
-164.4
-173.1
177.7
167.6
156.6
144.3
129.4
107.2
86.3
84.4
69.6
51.8
30.9
7.8
-9.4
-24.5
-33.2
-42.2
-52.7
-61.5
-69.3
-76.4
-83.0
-86.2
-94.2
-100.6
-106.0
-112.4
-118.9
-126.3
-135.4
-147.3
-155.1
Freq.
GHz
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
S11
MAG
0.528
0.530
0.529
0.511
0.496
0.487
0.465
0.457
0.433
0.423
0.407
0.390
0.365
0.356
0.340
0.310
0.293
0.307
0.327
0.330
0.332
0.341
0.342
0.334
0.332
0.348
0.348
0.338
0.350
0.356
0.350
0.358
0.366
0.376
0.379
0.385
0.403
0.405
0.415
0.430
0.430
0.435
0.419
0.428
0.415
0.409
0.426
0.432
0.449
0.466
ANG
120.6
117.0
112.8
108.2
104.3
100.2
96.5
92.4
89.0
84.4
81.3
77.1
73.1
72.3
66.9
64.5
66.1
67.7
63.1
58.4
53.1
48.2
42.4
37.0
30.8
23.8
19.1
13.2
5.7
-0.3
-6.2
-13.8
-21.0
-27.5
-35.4
-42.5
-51.5
-57.8
-68.2
-78.3
-88.3
-97.7
-108.5
-118.2
-131.3
-142.4
-155.2
-169.3
177.4
158.1
S21
MAG
4.543
4.181
4.203
4.486
4.754
5.109
5.270
5.457
5.609
5.793
5.935
6.042
5.809
5.888
6.089
6.186
4.622
2.634
1.520
0.956
0.634
0.454
0.348
0.277
0.217
0.184
0.149
0.133
0.106
0.094
0.080
0.064
0.062
0.054
0.041
0.027
0.020
0.015
0.012
0.014
0.005
0.005
0.008
0.006
0.008
0.012
0.002
0.007
0.007
0.010
ANG
-4.8
-45.6
-76.5
-109.2
-140.3
-172.8
154.7
122.9
91.7
59.5
25.8
-7.2
-42.6
-75.8
-112.6
-160.6
144.4
103.0
74.8
54.1
37.2
23.1
9.0
-5.3
-18.1
-31.1
-48.1
-63.5
-79.4
-91.7
-102.5
-124.4
-136.6
-149.5
-172.5
177.1
150.8
152.4
150.3
162.0
135.0
-110.8
141.6
173.6
147.2
-141.5
17.8
-50.6
-115.4
-150.4
S12
MAG
0.0009
0.0020
0.0020
0.0003
0.0011
0.0017
0.0019
0.0023
0.0027
0.0048
0.0044
0.0036
0.0035
0.0031
0.0018
0.0006
0.0027
0.0044
0.0046
0.0043
0.0064
0.0056
0.0050
0.0058
0.0031
0.0056
0.0046
0.0025
0.0025
0.0041
0.0061
0.0055
0.0057
0.0049
0.0064
0.0040
0.0062
0.0060
0.0063
0.0066
0.0064
0.0024
0.0061
0.0037
0.0027
0.0038
0.0036
0.0029
0.0006
0.0011
ANG
-17.5
-20.6
-25.7
-19.5
-140.8
85.7
34.9
66.4
42.3
33.0
23.8
-6.3
-31.3
-20.4
-32.9
-72.2
55.5
22.5
22.1
12.7
-5.4
-36.7
-16.5
0.9
-28.4
-52.0
-58.7
-18.6
-69.9
-66.0
-46.0
-55.7
-69.6
-74.6
-61.5
-79.0
-69.7
-95.9
-98.4
-120.6
-134.0
-152.3
-151.9
-137.3
-167.1
175.0
-177.8
150.4
-12.8
-177.0
S22
MAG
0.191
0.241
0.235
0.165
0.101
0.098
0.128
0.162
0.201
0.253
0.320
0.396
0.453
0.465
0.414
0.406
0.677
0.816
0.847
0.836
0.825
0.819
0.810
0.804
0.794
0.795
0.785
0.786
0.784
0.775
0.776
0.767
0.764
0.764
0.754
0.749
0.743
0.736
0.725
0.720
0.716
0.705
0.694
0.687
0.675
0.656
0.642
0.627
0.607
0.583
ANG
-123.7
-130.1
-143.6
-153.1
-133.9
-105.3
-85.1
-75.1
-71.7
-68.3
-68.6
-74.1
-83.2
-92.8
-95.5
-77.4
-76.4
-94.1
-106.4
-114.9
-121.4
-127.0
-132.1
-136.1
-139.9
-143.6
-146.7
-150.8
-153.1
-156.6
-159.6
-162.8
-166.4
-169.7
-172.8
-175.5
-179.0
178.1
174.5
171.4
168.1
163.7
160.4
156.3
152.1
147.5
141.8
137.7
132.1
126.9
Typical on chip measurements
4
FMM5125X
15/60GHz Frequency Multiplier MMIC
CHIP OUTLINE
VDD(MLT)
VDD(AMP)
VDD(AMP)
VDD(AMP)
RFin
RFout
VGG(MLT); Optional
VGG1 (AMP)
VGG2(AMP)
VGG3(AMP)
Bonding Pad Locations (Dimension in Micron Meters)
810
470
130
0
0
80
220
995
1490
Pad Dimensions
DC Pads; 100 x 100 µm
RF Pads; 80 x 60 µm
Unit; µm
Chip size; 2315 x 940 µm
Chip Thickness; 70 µm
5
2105 2235
FMM5125X
15/60GHz Frequency Multiplier MMIC
Assembly Diagrams
To DC Power Supply (VDD)
Recommendation assembly
Single Layer Capacitor ≥100 pF
RF In
*1
*1
Z0 = 50Ω
RF Out
Z0 = 50Ω
*2
*1; RF Wire Length = 150 µm
*2; DC Wire Length ≤ 1000 µm
DC Power Supply for a Custom Application
To DC Power Supply (VDD)
MIM Capacitor ≥100 pF
*2
RF In
RF Out
*1
*1
Z0 = 50Ω
Z0 = 50Ω
*2
To DC Power Supply for Custom
Application
VGG(MLT)
VGG1 (AMP)
VGG2(AMP)
6
VGG3(AMP)
FMM5125X
15/60GHz Frequency Multiplier MMIC
MTTF vs. Backside Temperature
1.E+12
1.E+11
Ea=1.02eV
MTTF (hrs)
1.E+10
1.E+09
1.E+08
1.E+07
1.E+06
1.E+05
20
40
60
80
100
120
140
BacksideTemperature (degC)
7
160
180
FMM5125X
15/60GHz Frequency Multiplier MMIC
DIE ATTACH
1) The die-attach station must have accurate temperature control, and an inert forming gas should
be used.
2)Chips should be kept at room temperature except during die-attach.
3) Place package or carrier on the heated stage.
4) Lightly grasp the chip edges by the longer side using tweezers.
Die attach conditions
Stage Temperature : 300 to 310 deg.C
Time : less than 15 seconds
AuSn Perform Volume : per next Figure
Volume of Au-Sn Perform (10 -3/mm 3)
500
400
300
FMM5125X
200
100
0
0
1
2
3
4
5
Area of Chip Back Surface (mm^2)
WIRE BONDING
The bonding equipment must be properly grounded. The following or equivalent equipment, tools,
materials, and conditions are recommended.
1) Bonding Equipment and Bonding Tool.
Bonding Equipment : West Bond Model 7400 (Manual Bonder)
Bonding Tool : CCOD-1/16-S-437-60-F-2010-MP (Deweyl)
2) Bonding Wire
Material : Hard or Half hard gold
Diameter : 0.7 to 1.0 mil
3) Bonding Conditions
Method : Thermal Compression Bonding with Ultrasonic Power
Tool Force : 0.196 N +/- 0.0196 N
Stage Temperature : 215 deg.C +/- 5 deg.C
Tool Heater : None
Ultrasonic Power Transmitter : West Bond Model 1400
Duration : 150 mS/Bond
8
FMM5125X
15/60GHz Frequency Multiplier MMIC
Eudyna Devices USA Inc.
2355 Zanker Rd.
San Jose, CA 95131-1138, U.S.A.
TEL: (408) 232-9500
FAX: (408) 428-9111
www.us.eudyna.com
CAUTION
Eudyna Devices Inc. products contain gallium arsenide
(GaAs) which can be hazardous to the human body and the
environment. For safety, observe the following procedures:
•Do not put these products into the mouth.
•Do not alter the form of this product into a gas, powder, or liquid
through burning, crushing, or chemical processing as these byproducts are dangerous to the human body if inhaled, ingested, or
swallowed.
Eudyna Devices Europe Ltd.
Network House
Norreys Drive
Maidenhead, Berkshire SL6 4FJ
United Kingdom
TEL: +44 (0) 1628 504800
FAX: +44 (0) 1628 504888
•Observe government laws and company regulations when
discarding this product. This product must be discarded in
accordance with methods specified by applicable hazardous waste
procedures.
Eudyna Devices Inc. reserves the right to change products and
specifications without notice.The information does not convey any
license under rights of Eudyna Devices Inc. or others.
Eudyna Devices Asia Pte. Ltd.
Hong Kong Branch
Suite 1906B, Tower 6, China Hong Kong City
33 Canton Road, Tsimshatsui, Kowloon
Hong Kong
TEL: +852-2377-0227
FAX: +852-2377-3921
© 2005 Eudyna Devices USA Inc.
Printed in U.S.A.
Eudyna Devices Inc.
Sales Division
1, Kanai-cho, Sakae-ku
Yokohama, 244-0845, Japan
TEL +81-45-853-8156
FAX +81-45-853-8170
9
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