FMM5125X 15/60GHz Frequency Multiplier MMIC FEATURES •Input/Output Frequency : 15 / 60 GHz •Wide Frequency Band : 57 - 64 GHz •Conversion Loss : Lc = 5dB (Typ.) @fout = 60 GHz, Pin = 10 dBm •High Output Power : Po = 5dBm (Typ.) @fout = 60 GHz, Pin = 10 dBm •Impedance Matched Zin/Zout = 50Ω Device photo DESCRIPTION The FMM5125X is a by 4 frequency multiplier MMIC designed for applications in the 57-64 GHz frequency range. This product is well suited for wireless LAN and point-to-point radio. Eudyna’s stringent Quality Assurance Program assures the highest reliability and consistent performance. o ABSOLUTE MAXIMUM RATING (Case Temperature Tc=25 C) Item Symbol Rating Unit DC Input Voltage DC Input Voltage Input Power Storage Temperature V V dBm o C V DD V GG Pin Tstg +4 -3 15 -55 to +125 o RECOMMENDED OPERATING CONDITION (Case Temperature Tc=25 C) Item Symbol Condition DC Input Voltage Backside Temperature V DD Tb 3 Unit V C o -45 to + 85 o ELECTRICAL CHARACTERISTICS (Case Temperature Tc=25 C) Limit Item Symbol Condition Min. Typ. Max. Output Power Pout V DD=3V Unit -5 5 - dBm - 100 8 12 - mA dB dB V GG=0V Pin=10 dBm Total Drain Current Input Return Loss Output Return Loss IDDt RLin RLout fin =14.25~16 GHz f = 14.25~16 GHz f = 57~64 GHz These values are representative for CW on chip measurements that are made without bonding wires at the RF ports. ESD Class 0 Note : Based on EIAJ ED-4701 C-111A(C=100pF, R=1.5kΩ) Edition 1.1 Dec. 2005 1 ~ 199V FMM5125X 15/60GHz Frequency Multiplier MMIC Output Power vs. Frequency Bias Condition: Vdd = 3V, Idd = 100 mA Pin = 10 dBm 10 10 5 5 4x 0 0 Output Power [dBm ] Output Power [dBm] Output Power vs. Input Power Bias Condition: Vdd = 3V, Idd = 100 mA fin = 15 GHz -5 -10 -15 3x -5 -10 -15 -20 2x -25 -30 5x -35 -20 1x -40 -25 -5 0 5 10 -45 15 13 Input Power [dBm] 14 15 16 Input Frequency [GHz] Typical on chip measurements 2 17 FMM5125X 15/60GHz Frequency Multiplier MMIC S-PARAMETERS VDD = 3V, VGG = 0V, IDD = 100 mA 0 0 -2 -2 -4 -6 |S22| (dB) |S11| (dB) -4 -6 -8 -8 -10 -12 -14 -16 -10 -18 -12 -20 0 10 20 30 40 50 60 70 80 90 100 0 Frequency (GHz) 10 20 30 40 50 60 Frequency (GHz) Typical on chip measurements 3 70 80 90 100 FMM5125X 15/60GHz Frequency Multiplier MMIC S-PARAMETERS Vdd = 3V, Vgg = 0V, Idd = 100 mA Freq. GHz 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 S11 MAG 0.874 0.689 0.558 0.477 0.425 0.389 0.364 0.347 0.335 0.327 0.324 0.323 0.325 0.342 0.365 0.383 0.403 0.424 0.446 0.465 0.484 0.501 0.515 0.525 0.534 0.547 0.555 0.561 0.564 0.571 0.572 0.575 0.583 0.581 0.585 0.588 0.583 0.590 0.586 0.582 0.579 0.580 0.578 0.573 0.572 0.572 0.566 0.562 0.544 0.531 ANG -40.2 -68.7 -88.1 -101.9 -112.0 -119.8 -125.5 -129.5 -132.6 -134.5 -135.7 -136.4 -136.1 -135.0 -136.3 -137.9 -139.6 -141.9 -144.3 -147.0 -150.3 -153.4 -156.8 -159.7 -162.4 -165.8 -168.7 -172.0 -174.8 -177.7 179.9 176.5 174.1 171.6 168.3 165.8 163.1 159.7 157.4 154.3 151.3 148.5 145.6 142.7 139.3 136.4 132.7 129.2 125.2 122.6 S21 MAG 0.003 0.005 0.011 0.006 0.002 0.001 0.001 0.001 0.001 0.002 0.004 0.007 0.009 0.010 0.008 0.006 0.006 0.008 0.008 0.008 0.008 0.007 0.006 0.004 0.002 0.001 0.004 0.005 0.010 0.014 0.016 0.019 0.023 0.026 0.030 0.037 0.042 0.052 0.058 0.071 0.091 0.115 0.152 0.210 0.292 0.435 0.683 1.161 2.157 3.905 ANG 85.0 -71.0 55.7 -115.6 -164.9 -176.4 176.9 150.1 120.1 93.8 46.7 -18.1 -63.8 -127.1 -169.1 171.6 153.8 140.9 111.4 78.8 60.0 42.1 11.7 -0.5 -23.0 101.2 91.9 59.6 56.2 31.8 5.1 -12.3 -28.2 -43.4 -56.1 -69.6 -84.2 -100.7 -105.8 -121.8 -130.3 -142.9 -155.1 -167.3 179.9 166.3 149.6 129.5 100.7 52.8 S12 MAG 0.0003 0.0007 0.0008 0.0004 0.0003 0.0004 0.0003 0.0004 0.0006 0.0010 0.0015 0.0014 0.0013 0.0004 0.0001 0.0005 0.0007 0.0012 0.0013 0.0008 0.0005 0.0002 0.0004 0.0007 0.0019 0.0024 0.0019 0.0016 0.0017 0.0009 0.0005 0.0010 0.0013 0.0019 0.0010 0.0019 0.0017 0.0012 0.0020 0.0023 0.0023 0.0019 0.0018 0.0016 0.0010 0.0016 0.0021 0.0015 0.0027 0.0027 ANG 107.0 35.7 -62.7 -91.0 -100.2 -125.0 -147.4 -152.2 -157.7 170.6 124.2 60.1 -9.1 -59.7 -50.7 -81.6 -97.3 -143.2 165.8 142.1 132.6 115.1 -78.1 -112.1 -164.0 144.1 121.6 114.9 70.4 110.1 59.0 73.4 91.6 100.2 83.5 79.1 99.0 87.2 74.4 42.6 48.0 19.1 54.7 31.8 30.8 45.9 49.3 64.2 43.9 46.9 S22 MAG 0.995 0.982 0.899 0.882 0.896 0.890 0.873 0.853 0.833 0.810 0.779 0.741 0.720 0.699 0.676 0.654 0.629 0.603 0.576 0.545 0.512 0.476 0.438 0.395 0.337 0.195 0.142 0.110 0.085 0.073 0.080 0.094 0.113 0.141 0.174 0.205 0.235 0.258 0.277 0.295 0.314 0.336 0.350 0.359 0.363 0.370 0.368 0.357 0.319 0.206 ANG -12.2 -24.5 -35.3 -43.0 -52.3 -62.5 -72.5 -82.0 -91.3 -100.5 -109.6 -117.3 -124.7 -132.5 -140.2 -148.0 -156.1 -164.4 -173.1 177.7 167.6 156.6 144.3 129.4 107.2 86.3 84.4 69.6 51.8 30.9 7.8 -9.4 -24.5 -33.2 -42.2 -52.7 -61.5 -69.3 -76.4 -83.0 -86.2 -94.2 -100.6 -106.0 -112.4 -118.9 -126.3 -135.4 -147.3 -155.1 Freq. GHz 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 S11 MAG 0.528 0.530 0.529 0.511 0.496 0.487 0.465 0.457 0.433 0.423 0.407 0.390 0.365 0.356 0.340 0.310 0.293 0.307 0.327 0.330 0.332 0.341 0.342 0.334 0.332 0.348 0.348 0.338 0.350 0.356 0.350 0.358 0.366 0.376 0.379 0.385 0.403 0.405 0.415 0.430 0.430 0.435 0.419 0.428 0.415 0.409 0.426 0.432 0.449 0.466 ANG 120.6 117.0 112.8 108.2 104.3 100.2 96.5 92.4 89.0 84.4 81.3 77.1 73.1 72.3 66.9 64.5 66.1 67.7 63.1 58.4 53.1 48.2 42.4 37.0 30.8 23.8 19.1 13.2 5.7 -0.3 -6.2 -13.8 -21.0 -27.5 -35.4 -42.5 -51.5 -57.8 -68.2 -78.3 -88.3 -97.7 -108.5 -118.2 -131.3 -142.4 -155.2 -169.3 177.4 158.1 S21 MAG 4.543 4.181 4.203 4.486 4.754 5.109 5.270 5.457 5.609 5.793 5.935 6.042 5.809 5.888 6.089 6.186 4.622 2.634 1.520 0.956 0.634 0.454 0.348 0.277 0.217 0.184 0.149 0.133 0.106 0.094 0.080 0.064 0.062 0.054 0.041 0.027 0.020 0.015 0.012 0.014 0.005 0.005 0.008 0.006 0.008 0.012 0.002 0.007 0.007 0.010 ANG -4.8 -45.6 -76.5 -109.2 -140.3 -172.8 154.7 122.9 91.7 59.5 25.8 -7.2 -42.6 -75.8 -112.6 -160.6 144.4 103.0 74.8 54.1 37.2 23.1 9.0 -5.3 -18.1 -31.1 -48.1 -63.5 -79.4 -91.7 -102.5 -124.4 -136.6 -149.5 -172.5 177.1 150.8 152.4 150.3 162.0 135.0 -110.8 141.6 173.6 147.2 -141.5 17.8 -50.6 -115.4 -150.4 S12 MAG 0.0009 0.0020 0.0020 0.0003 0.0011 0.0017 0.0019 0.0023 0.0027 0.0048 0.0044 0.0036 0.0035 0.0031 0.0018 0.0006 0.0027 0.0044 0.0046 0.0043 0.0064 0.0056 0.0050 0.0058 0.0031 0.0056 0.0046 0.0025 0.0025 0.0041 0.0061 0.0055 0.0057 0.0049 0.0064 0.0040 0.0062 0.0060 0.0063 0.0066 0.0064 0.0024 0.0061 0.0037 0.0027 0.0038 0.0036 0.0029 0.0006 0.0011 ANG -17.5 -20.6 -25.7 -19.5 -140.8 85.7 34.9 66.4 42.3 33.0 23.8 -6.3 -31.3 -20.4 -32.9 -72.2 55.5 22.5 22.1 12.7 -5.4 -36.7 -16.5 0.9 -28.4 -52.0 -58.7 -18.6 -69.9 -66.0 -46.0 -55.7 -69.6 -74.6 -61.5 -79.0 -69.7 -95.9 -98.4 -120.6 -134.0 -152.3 -151.9 -137.3 -167.1 175.0 -177.8 150.4 -12.8 -177.0 S22 MAG 0.191 0.241 0.235 0.165 0.101 0.098 0.128 0.162 0.201 0.253 0.320 0.396 0.453 0.465 0.414 0.406 0.677 0.816 0.847 0.836 0.825 0.819 0.810 0.804 0.794 0.795 0.785 0.786 0.784 0.775 0.776 0.767 0.764 0.764 0.754 0.749 0.743 0.736 0.725 0.720 0.716 0.705 0.694 0.687 0.675 0.656 0.642 0.627 0.607 0.583 ANG -123.7 -130.1 -143.6 -153.1 -133.9 -105.3 -85.1 -75.1 -71.7 -68.3 -68.6 -74.1 -83.2 -92.8 -95.5 -77.4 -76.4 -94.1 -106.4 -114.9 -121.4 -127.0 -132.1 -136.1 -139.9 -143.6 -146.7 -150.8 -153.1 -156.6 -159.6 -162.8 -166.4 -169.7 -172.8 -175.5 -179.0 178.1 174.5 171.4 168.1 163.7 160.4 156.3 152.1 147.5 141.8 137.7 132.1 126.9 Typical on chip measurements 4 FMM5125X 15/60GHz Frequency Multiplier MMIC CHIP OUTLINE VDD(MLT) VDD(AMP) VDD(AMP) VDD(AMP) RFin RFout VGG(MLT); Optional VGG1 (AMP) VGG2(AMP) VGG3(AMP) Bonding Pad Locations (Dimension in Micron Meters) 810 470 130 0 0 80 220 995 1490 Pad Dimensions DC Pads; 100 x 100 µm RF Pads; 80 x 60 µm Unit; µm Chip size; 2315 x 940 µm Chip Thickness; 70 µm 5 2105 2235 FMM5125X 15/60GHz Frequency Multiplier MMIC Assembly Diagrams To DC Power Supply (VDD) Recommendation assembly Single Layer Capacitor ≥100 pF RF In *1 *1 Z0 = 50Ω RF Out Z0 = 50Ω *2 *1; RF Wire Length = 150 µm *2; DC Wire Length ≤ 1000 µm DC Power Supply for a Custom Application To DC Power Supply (VDD) MIM Capacitor ≥100 pF *2 RF In RF Out *1 *1 Z0 = 50Ω Z0 = 50Ω *2 To DC Power Supply for Custom Application VGG(MLT) VGG1 (AMP) VGG2(AMP) 6 VGG3(AMP) FMM5125X 15/60GHz Frequency Multiplier MMIC MTTF vs. Backside Temperature 1.E+12 1.E+11 Ea=1.02eV MTTF (hrs) 1.E+10 1.E+09 1.E+08 1.E+07 1.E+06 1.E+05 20 40 60 80 100 120 140 BacksideTemperature (degC) 7 160 180 FMM5125X 15/60GHz Frequency Multiplier MMIC DIE ATTACH 1) The die-attach station must have accurate temperature control, and an inert forming gas should be used. 2)Chips should be kept at room temperature except during die-attach. 3) Place package or carrier on the heated stage. 4) Lightly grasp the chip edges by the longer side using tweezers. Die attach conditions Stage Temperature : 300 to 310 deg.C Time : less than 15 seconds AuSn Perform Volume : per next Figure Volume of Au-Sn Perform (10 -3/mm 3) 500 400 300 FMM5125X 200 100 0 0 1 2 3 4 5 Area of Chip Back Surface (mm^2) WIRE BONDING The bonding equipment must be properly grounded. The following or equivalent equipment, tools, materials, and conditions are recommended. 1) Bonding Equipment and Bonding Tool. Bonding Equipment : West Bond Model 7400 (Manual Bonder) Bonding Tool : CCOD-1/16-S-437-60-F-2010-MP (Deweyl) 2) Bonding Wire Material : Hard or Half hard gold Diameter : 0.7 to 1.0 mil 3) Bonding Conditions Method : Thermal Compression Bonding with Ultrasonic Power Tool Force : 0.196 N +/- 0.0196 N Stage Temperature : 215 deg.C +/- 5 deg.C Tool Heater : None Ultrasonic Power Transmitter : West Bond Model 1400 Duration : 150 mS/Bond 8 FMM5125X 15/60GHz Frequency Multiplier MMIC Eudyna Devices USA Inc. 2355 Zanker Rd. San Jose, CA 95131-1138, U.S.A. TEL: (408) 232-9500 FAX: (408) 428-9111 www.us.eudyna.com CAUTION Eudyna Devices Inc. products contain gallium arsenide (GaAs) which can be hazardous to the human body and the environment. For safety, observe the following procedures: •Do not put these products into the mouth. •Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these byproducts are dangerous to the human body if inhaled, ingested, or swallowed. Eudyna Devices Europe Ltd. Network House Norreys Drive Maidenhead, Berkshire SL6 4FJ United Kingdom TEL: +44 (0) 1628 504800 FAX: +44 (0) 1628 504888 •Observe government laws and company regulations when discarding this product. This product must be discarded in accordance with methods specified by applicable hazardous waste procedures. Eudyna Devices Inc. reserves the right to change products and specifications without notice.The information does not convey any license under rights of Eudyna Devices Inc. or others. Eudyna Devices Asia Pte. Ltd. Hong Kong Branch Suite 1906B, Tower 6, China Hong Kong City 33 Canton Road, Tsimshatsui, Kowloon Hong Kong TEL: +852-2377-0227 FAX: +852-2377-3921 © 2005 Eudyna Devices USA Inc. Printed in U.S.A. Eudyna Devices Inc. Sales Division 1, Kanai-cho, Sakae-ku Yokohama, 244-0845, Japan TEL +81-45-853-8156 FAX +81-45-853-8170 9