ON AR0134CSSM00SPCA0-TRBR Inch 1.2 mp cmos digital image sensor with global shutter Datasheet

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AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Features
1/3-Inch 1.2 Mp CMOS Digital Image Sensor with
Global Shutter
AR0134 Datasheet, Rev. G
For the latest datasheet revision, please visit www.onsemi.com
Features
Table 1:
• ON Semiconductor's 3rd Generation Global Shutter
Technology
• Superior low-light performance
• HD video (720p60)
• Video/Single Frame mode
• Flexible row-skip modes
• On-chip AE and statistics engine
• Parallel and serial output
• Support for external LED or flash
• Auto black level calibration
• Context switching
Applications
• Scene processing
• Scanning and machine vision
• 720p60 video applications
General Description
ON Semiconductor's AR0134 is a 1/3-inch 1.2 Mp
CMOS digital image sensor with an active-pixel array
of 1280H x 960V. It is designed for low light performance and features a global shutter for accurate capture of moving scenes. It includes sophisticated
camera functions such as auto exposure control, windowing, scaling, row skip mode, and both video and
single frame modes. It is programmable through a simple two-wire serial interface. The AR0134 produces
extraordinarily clear, sharp digital pictures, and its
ability to capture both continuous video and single
frames makes it the perfect choice for a wide range of
applications, including scanning and industrial
inspection.
AR0134_DS Rev. G Pub. 6/15 EN
Key Parameters
Parameter
Typical Value
Optical format
Active pixels
Pixel size
Color filter array
Shutter type
Input clock range
Output pixel clock (maximum)
Serial
Output
Parallel
Full resolution
Frame rate
720p
Monochrome
Responsivity
Color
SNRMAX
Dynamic range
I/O
Digital
Supply
voltage
Analog
HiSPi
Power consumption
1/3-inch (6 mm)
1280H x 960V = 1.2 Mp
3.75 m
RGB Bayer or Monochrome
Global shutter
6 – 50 MHz
74.25 MHz
HiSPi
12-bit
54 fps
60 fps
6.1 V/lux-sec
5.3 V/lux-sec
38.6 dB
64 dB
1.8 or 2.8 V
1.8 V
2.8 V
0.4 V
<400 mW
–30°C to +70°C (ambient)
–30°C to +80°C ( junction)
9 x 9 mm 64-pin iBGA
10 x 10 mm 48-pin iLCC
Bare die
Operating temperature
Package options
1
©Semiconductor Components Industries, LLC 2015,
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Ordering Information
Ordering Information
Table 2:
Available Part Numbers
Part Number
Product Description
Orderable Product Attribute Description
AR0134CSSC00SPCA0-DPBR
Color, iLCC (Parallel)
Dry Pack with Protective Film, Double Side BBAR Glass
AR0134CSSC00SPCA0-DRBR
Color, iLCC (Parallel)
Dry Pack without Protective Film, Double Side BBAR Glass
AR0134CSSC00SPCA0-TPBR
Color, iLCC (Parallel)
Tape & Reel with Protective Film, Double Side BBAR Glass
AR0134CSSC00SPCA0-TRBR
Color, iLCC (Parallel)
Tape & Reel without Protective Film, Double Side BBAR Glass
AR0134CSSC00SPCAD-GEVK
Color, iLCC (Parallel), Demo Kit
AR0134CSSC00SPCAH-GEVB
Color, iLCC (Parallel), Head Board
AR0134CSSC00SUEA0-DPBR
Color, iBGA
Dry Pack with Protective Film, Double Side BBAR Glass
AR0134CSSC00SUEA0-DRBR
Color, iBGA
Dry Pack without Protective Film, Double Side BBAR Glass
AR0134CSSC00SUEA0-TPBR
Color, iBGA
Tape & Reel with Protective Film, Double Side BBAR Glass
AR0134CSSC00SUEA0-TRBR
Color, iBGA
Tape & Reel without Protective Film, Double Side BBAR Glass
AR0134CSSC00SUEAD3-GEVK
Color, iBGA Demo3 Kit
AR0134CSSC00SUEAD-GEVK
Color, iBGA Demo Kit
AR0134CSSC00SUEAH-GEVB
Color, iBGA Head Board
AR0134CSSC25SUEA0-DPBR
Color, iBGA, 25deg shift
Dry Pack with Protective Film, Double Side BBAR Glass
AR0134CSSC25SUEA0-DRBR
Color, iBGA, 25deg shift
Dry Pack without Protective Film, Double Side BBAR Glass
AR0134CSSC25SUEA0-TPBR
Color, iBGA, 25deg shift
Tape & Reel with Protective Film, Double Side BBAR Glass
AR0134CSSC25SUEA0-TRBR
Color, iBGA, 25deg shift
Tape & Reel without Protective Film, Double Side BBAR Glass
AR0134CSSM00SPCA0-DPBR
Mono,
Dry Pack with Protective Film, Double Side BBAR Glass
AR0134CSSM00SPCA0-DRBR
Mono, iLCC (Parallel)
Dry Pack without Protective Film, Double Side BBAR Glass
AR0134CSSM00SPCA0-TPBR
Mono, iLCC (Parallel)
Tape & Reel with Protective Film, Double Side BBAR Glass
AR0134CSSM00SPCA0-TRBR
Mono, iLCC (Parallel)
Tape & Reel without Protective Film, Double Side BBAR Glass
AR0134CSSM00SPCAD-GEVK
Mono, iLCC (Parallel) Demo Kit
AR0134CSSM00SPCAH-GEVB
Mono, iLCC (Parallel) Head Board
AR0134CSSM00SUEA0-DPBR
Mono, iBGA
Dry Pack with Protective Film, Double Side BBAR Glass
AR0134CSSM00SUEA0-DRBR
Mono, iBGA
Dry Pack without Protective Film, Double Side BBAR Glass
AR0134CSSM00SUEA0-TPBR
Mono, iBGA
Tape & Reel with Protective Film, Double Side BBAR Glass
AR0134CSSM00SUEA0-TRBR
Mono, iBGA
Tape & Reel without Protective Film, Double Side BBAR Glass
AR0134CSSM00SUEAD3-GEVK Mono, iBGA, Demo3 Kit
AR0134CSSM00SUEAD-GEVK
Mono, iBGA, Demo Kit
AR0134CSSM00SUEAH-GEVB
Mono, iBGA, Head Board
AR0134CSSM25SPCA0-DRBR
Mono, iLCC (Parallel), 25deg shift
AR0134CSSM25SPCA0-TPBR
Mono, iLCC (Parallel), 25deg shift
Tape & Reel with Protective Film, Double Side BBAR Glass
AR0134CSSM25SUEA0-DPBR
Mono, iBGA, Head Board
Dry Pack with Protective Film, Double Side BBAR Glass
AR0134CSSM25SUEA0-DRBR
Mono, iBGA, 25deg shift
Dry Pack without Protective Film, Double Side BBAR Glass
AR0134CSSM25SUEA0-TPBR
Mono, iBGA, 25deg shift
Tape & Reel with Protective Film, Double Side BBAR Glass
AR0134CSSM25SUEA0-TRBR
Mono, iBGA, 25deg shift
Tape & Reel without Protective Film, Double Side BBAR Glass
AR0134CSSM25SUEAD3-GEVK Mono, iBGA, 25deg shift
AR0134CSSM25SUEAD-GEVK
Mono, iBGA, 25deg shift Demo Kit
AR0134CSSM25SUEAH-GEVB
Mono, iBGA, 25deg shift Head Board
See the ON Semiconductor Device Nomenclature document (TND310/D) for a full description of the
naming convention used for image sensors. For reference documentation, including information on
evaluation kits, please visit our web site at www.onsemi.com.
AR0134_DS Rev. G Pub. 6/15 EN
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©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Table of Contents
Table of Contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Functional Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Features Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Pixel Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Configuration and Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Two-Wire Serial Register Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Power-On Reset and Standby Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
AR0134_DS Rev. G Pub. 6/15 EN
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©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
List of Figures
List of Figures
Figure 1:
Figure 2:
Figure 3:
Figure 4:
Figure 5:
Figure 6:
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Figure 8:
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Figure 10:
Figure 11:
Figure 12:
Figure 13:
Figure 14:
Figure 15:
Figure 16:
Figure 17:
Figure 18:
Figure 19:
Figure 20:
Figure 21:
Figure 22:
Figure 23:
Figure 24:
Figure 25:
Figure 26:
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Pixel Array Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Pixel Color Pattern Detail (Top Right Corner) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Typical Configuration: Serial Four-Lane HiSPi Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Typical Configuration: Parallel Pixel Data Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
9x9mm 63-Ball iBGA Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
48 iLCC Package, Parallel Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Single READ from Random Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Single READ from Current Location. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Sequential READ, Start from Random Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Sequential READ, Start from Current Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Single WRITE to Random Location. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Sequential WRITE, Start at Random Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Two-Wire Serial Bus Timing Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
I/O Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Differential Output Voltage for Clock or Data Pairs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Eye Diagram for Clock and Data Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
Skew Within the PHY and Output Channels. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
Power Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Power Down. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Enter Standby Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
Exit Standby Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
Quantum Efficiency – Monochrome Sensor (Typical) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Quantum Efficiency – Color Sensor (Typical) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
63-Ball iBGA Package Outline Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
48-pin iLCC Package Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
AR0134_DS Rev. G Pub. 6/15 EN
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©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
List of Tables
List of Tables
Table 1:
Table 2:
Table 3:
Table 4:
Table 5:
Table 6:
Table 7:
Table 8:
Table 9:
Table 10:
Table 11:
Table 12:
Table 13:
Table 14:
Table 15:
Table 16:
Table 17:
Table 18:
Table 19:
Table 20:
Key Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Available Part Numbers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Pin Descriptions - 63-Ball iBGA Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Pin Descriptions - 48 iLCC Package, Parallel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Two-Wire Serial Bus Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
I/O Timing Characteristics, Parallel Output (1.8V VDD_IO)1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
I/O Timing Characteristics, Parallel Output (2.8V VDD_IO)1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
I/O Rise Slew Rate (2.8V VDD_IO)1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
I/O Fall Slew Rate (2.8V VDD_IO)1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
I/O Rise Slew Rate (1.8V VDD_IO)1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
I/O Fall Slew Rate (1.8V VDD_IO)1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Operating Current Consumption for Parallel Output. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Standby Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
Input Voltage and Current (HiSPi Power Supply 0.4 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
Rise and Fall Times. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Power-Up Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Power-Down Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Chief Ray Angle - 25deg Mono . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
AR0134_DS Rev. G Pub. 6/15 EN
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©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
General Description
General Description
The ON Semiconductor AR0134 can be operated in its default mode or programmed for
frame size, exposure, gain, and other parameters. The default mode output is a full-resolution image at 54 frames per second (fps). It outputs 12-bit raw data, using either the
parallel or serial (HiSPi) output ports. The device may be operated in video (master)
mode or in frame trigger mode.
FRAME_VALID and LINE_VALID signals are output on dedicated pins, along with a
synchronized pixel clock. A dedicated FLASH pin can be programmed to control
external LED or flash exposure illumination.
The AR0134 includes additional features to allow application-specific tuning:
windowing, adjustable auto-exposure control, auto black level correction, on-board
temperature sensor, and row skip and digital binning modes.
The sensor is designed to operate in a wide temperature range (–30°C to +70°C).
Functional Overview
The AR0134 is a progressive-scan sensor that generates a stream of pixel data at a
constant frame rate. It uses an on-chip, phase-locked loop (PLL) that can be optionally
enabled to generate all internal clocks from a single master input clock running between
6 and 50 MHz. The maximum output pixel rate is 74.25 Mp/s, corresponding to a clock
rate of 74.25 MHz. Figure 1 shows a block diagram of the sensor.
Figure 1:
Block Diagram
Active Pixel Sensor
(APS)
Array
Power
Temperature
sensor
Timing and Control
(Sequencer)
Memory
PLL
External
Clock
Auto Exposure
and Stats Engine
Pixel Data Path
(Signal Processing)
Analog Processing and
A/D Conversion
Serial
Output
Parallel
Output
Flash
Trigger
Two-Wire
Serial
Interface
OTPM
Control Registers
User interaction with the sensor is through the two-wire serial bus, which communicates with the array control, analog signal chain, and digital signal chain. The core of the
sensor is a 1.2 Mp Active- Pixel Sensor array. The AR0134 features global shutter technology for accurate capture of moving images. The exposure of the entire array is
controlled by programming the integration time by register setting. All rows simultaneously integrate light prior to readout. Once a row has been read, the data from the
columns is sequenced through an analog signal chain (providing offset correction and
gain), and then through an analog-to- digital converter (ADC). The output from the ADC
is a 12-bit value for each pixel in the array. The ADC output passes through a digital
AR0134_DS Rev. G Pub. 6/15 EN
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©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Features Overview
processing signal chain (which provides further data path corrections and applies digital
gain). The pixel data are output at a rate of up to 74.25 Mp/s, in parallel to frame and line
synchronization signals.
Features Overview
The AR0134 Global Sensor shutter has a wide array of features to enhance functionality
and to increase versatility. A summary of features follows. Please refer to the AR0134
Developer Guide for detailed feature descriptions, register settings, and tuning guidelines and recommendations.
• Operating Modes
The AR0134 works in master (video), trigger (single frame), or Auto Trigger modes. In
master mode, the sensor generates the integration and readout timing. In trigger
mode, it accepts an external trigger to start exposure, then generates the exposure and
readout timing. The exposure time is programmed through the two-wire serial interface for both modes. Trigger mode is not compatible with the HiSPi interface.
• Window Control
Configurable window size and blanking times allow a wide range of resolutions and
frame rates. Digital binning and skipping modes are supported, as are vertical and
horizontal mirror operations.
• Context Switching
Context switching may be used to rapidly switch between two sets of register values.
Refer to the AR0134 Developer Guide for a complete set of context switchable registers.
• Gain
The AR0134 Global Shutter sensor can be configured for analog gain of up to 8x, and
digital gain of up to 8x.
• Automatic Exposure Control
The integrated automatic exposure control may be used to ensure optimal settings of
exposure and gain are computed and updated every other frame. Refer to the AR0134
Developer Guide for more details.
• HiSPi
The AR0134 Global Shutter image sensor supports two or three lanes of Streaming-SP
or Packetized-SP protocols of ON Semiconductor's High-Speed Serial Pixel Interface.
• PLL
An on chip PLL provides reference clock flexibility and supports spread spectrum
sources for improved EMI performance.
• Reset
The AR0134 may be reset by a register write, or by a dedicated input pin.
• Output Enable
The AR0134 output pins may be tri-stated using a dedicated output enable pin.
• Temperature Sensor
The temperature sensor is only guaranteed to be functional when the AR0134 is
initially powered-up or is reset at temperatures at or above 0°C.
• Black Level Correction
• Row Noise Correction
• Column Correction
• Test Patterns
Several test patterns may be enabled for debug purposes. These include a solid color,
color bar, fade to grey, and a walking 1s test pattern.
AR0134_DS Rev. G Pub. 6/15 EN
7
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Pixel Data Format
Pixel Data Format
Pixel Array Structure
The AR0134 pixel array is configured as 1412 columns by 1028 rows, (see Figure 2). The
dark pixels are optically black and are used internally to monitor black level. Of the right
108 columns, 64 are dark pixels used for row noise correction. Of the top 24 rows of
pixels, 12 of the dark rows are used for black level correction. There are 1296 columns by
976 rows of optically active pixels. While the sensor's format is 1280 x 960, the additional
active columns and active rows are included for use when horizontal or vertical mirrored
readout is enabled, to allow readout to start on the same pixel. The pixel adjustment is
always performed for monochrome or color versions. The active area is surrounded with
optically transparent dummy pixels to improve image uniformity within the active area.
Not all dummy pixels or barrier pixels can be read out.
Figure 2:
Pixel Array Description
1412
2 light dummy + 4 barrier + 24 dark + 4 barrier + 6 dark dummy
1296 x 976 (1288 x 968 active)
4.86 x 3.66 mm2 (4.83 x 3.63 mm2)
1028
2 light dummy + 4 barrier + 100 dark + 4 barrier
2 light dummy + 4 barrier
2 light dummy + 4 barrier + 6 dark dummy
Dark pixel
AR0134_DS Rev. G Pub. 6/15 EN
Light dummy
pixel
Barrier pixel
8
Active pixel
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Pixel Data Format
Figure 3:
Pixel Color Pattern Detail (Top Right Corner)
Column Readout Direction
Row Readout Direction
Active Pixel (0,0)
Array Pixel (110, 40)
R G
R
G R
G R
G
G B
G
B G
B G
B
R G
R
G R
G R
G
G B
G
B G
B G
B
R G
R
G R
G R
G
G B
G
B G
B G
B
Default Readout Order
By convention, the sensor core pixel array is shown with the first addressable (logical)
pixel (0,0) in the top right corner (see Figure 3). This reflects the actual layout of the array
on the die. Also, the physical location of the first pixel data read out of the sensor in
default condition is that of pixel (112, 44).
AR0134_DS Rev. G Pub. 6/15 EN
9
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Configuration and Pinout
Configuration and Pinout
The figures and tables below show a typical configuration for the AR0134 image sensor
and show the package pinouts.
Typical Configuration: Serial Four-Lane HiSPi Interface
VDD_IO
1.5kΩ2, 3
1.5kΩ2
Digital Digital
I/O
Core
power1 power1
Master clock
(6–50 MHz)
VDD
HiSPi
power1
VDD_SLVS
Figure 4:
EXTCLK
VDD_PLL
VAA
VAA_PIX
SLVS0_P
SLVS0_N
SLVS1_P
SLVS1_N
SLVS2_P
SLVS2_N
SDATA
SCLK
OE_BAR
STANDBY
RESET_BAR
From
controller
Analog Analog
PLL
power1 power1 power1
SLVS3_P7
SLVS3_N7
SLVSC_P
SLVSC_N
To
controller
TEST
FLASH
VDD_IO
VDD
Notes:
AR0134_DS Rev. G Pub. 6/15 EN
VDD_SLVS
VDD_PLL
VAA
DGND
AGND
Digital
ground
Analog
ground
VAA_PIX
1. All power supplies must be adequately decoupled.
2. ON Semiconductor recommends a resistor value of 1.5k, but it may be greater for slower two-wire
speed.
3. This pull-up resistor is not required if the controller drives a valid logic level on SCLK at all times.
4. The parallel interface output pads can be left unconnected if the serial output interface is used.
5. ON Semiconductor recommends that 0.1μF and 10μF decoupling capacitors for each power supply
are mounted as close as possible to the pad. Actual values and results may vary depending on layout and design considerations. Refer to the AR0134 demo headboard schematics for circuit recommendations.
6. ON Semiconductor recommends that analog power planes be placed in a manner such that coupling with the digital power planes is minimized.
7. Although 4 serial lanes are shown, the AR0134 supports only 2 or 3 lane HiSPi.
10
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Configuration and Pinout
Figure 5:
Typical Configuration: Parallel Pixel Data Interface
1.5kΩ2, 3
1.5kΩ2
Digital Digital
core
I/O
power1 power1
Master clock
(6–50 MHz)
VDD_IO
PLL Analog Analog
power1 power1 power1
VDD
VDD_PLL VAA
DOUT [11:0]
EXTCLK
PIXCLK
LINE_VALID
FRAME_VALID
SDATA
SCLK
TRIGGER
OE_BAR
STANDBY
RESET_BAR
From
Controller
VAA_PIX
To
controller
FLASH
TEST
DGND
VDD_IO
VDD
VDD_PLL
VAA
VAA_PIX
Digital
ground
Notes:
AR0134_DS Rev. G Pub. 6/15 EN
AGND
Analog
ground
1. All power supplies must be adequately decoupled.
2. ON Semiconductor recommends a resistor value of 1.5k, but it may be greater for slower two-wire
speed.
3. This pull-up resistor is not required if the controller drives a valid logic level on SCLK at all times.
4. The serial interface output pads can be left unconnected if the parallel output interface is used.
5. ON Semiconductor recommends that 0.1μF and 10μF decoupling capacitors for each power supply
are mounted as close as possible to the pad. Actual values and results may vary depending on layout and design considerations. Refer to the AR0134 demo headboard schematics for circuit recommendations.
6. ON Semiconductor recommends that analog power planes be placed in a manner such that coupling with the digital power planes is minimized.
11
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Configuration and Pinout
Figure 6:
9x9mm 63-Ball iBGA Package
1
A
2
3
4
5
SLVS0N
SLVS0P
SLVS1N
6
7
SLVS1P
VDD
VDD
STANDBY
SLVS2P
VDD
VAA
VAA
B
VDD_PLL
SLVSCN
SLVSCP
SLVS2N
C
EXTCLK
VDD_
SLVS
(SLVS3N)
(SLVS3P)
D
SADDR
SCLK
SDATA
DGND
DGND
E
LINE_
VALID
FRAME_
VALID
PIXCLK
FLASH
DGND
F
DOUT8
DOUT9
DOUT10
DOUT11
G
DOUT4
DOUT5
DOUT6
H
DOUT0
DOUT1
DOUT2
DGND
VDD
8
AGND
AGND
VAA_PIX
VAA_PIX
VDD_IO
RESERVED
RESERVED
DGND
VDD_IO
TEST
RESERVED
DOUT7
DGND
VDD_IO
TRIGGER
OE_BAR
DOUT3
DGND
VDD_IO
VDD_IO
RESET
_BAR
VDD
Top View
(Ball Down)
AR0134_DS Rev. G Pub. 6/15 EN
12
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Configuration and Pinout
Table 3:
Pin Descriptions - 63-Ball iBGA Package
Name
iBGA Pin
Type
Description
SLVS0_N
SLVS0_P
A2
Output
HiSPi serial data, lane 0, differential N.
A3
Output
HiSPi serial data, lane 0, differential P.
SLVS1_N
SLVS1_P
A4
Output
HiSPi serial data, lane 1, differential N.
A5
Output
HiSPi serial data, lane 1, differential P.
STANDBY
A8
Input
Standby-mode enable pin (active HIGH).
VDD_PLL
B1
Power
PLL power.
SLVSC_N
B2
Output
HiSPi serial DDR clock differential N.
SLVSC_P
B3
Output
HiSPi serial DDR clock differential P.
SLVS2_N
B4
Output
HiSPi serial data, lane 2, differential N.
SLVS2_P
B5
Output
HiSPi serial data, lane 2, differential P.
VAA
B7, B8
Power
Analog power.
External input clock.
EXTCLK
C1
Input
VDD_SLVS
C2
Power
HiSPi power. (May leave unconnected if parallel interface is used)
SLVS3_N
C3
Output
(Unsupported) HiSPi serial data, lane 3, differential N.
SLVS3_P
C4
Output
(Unsupported) HiSPi serial data, lane 3, differential P.
DGND
C5, D4, D5, E5, F5, G5, H5
Power
Digital GND.
VDD
A6, A7, B6, C6, D6
Power
Digital power.
AGND
C7, C8
Power
Analog GND.
SADDR
D1
Input
Two-Wire Serial address select.
SCLK
D2
Input
Two-Wire Serial clock input.
I/O
Two-Wire Serial data I/O.
SDATA
D3
VAA_PIX
D7, D8
Power
Pixel power.
LINE_VALID
E1
Output
Asserted when DOUT line data is valid.
FRAME_VALID
E2
Output
Asserted when DOUT frame data is valid.
PIXCLK
E3
Output
Pixel clock out. DOUT is valid on rising edge of this clock.
FLASH
E4
Output
Control signal to drive external light sources.
VDD_IO
E6, F6, G6, H6, H7
Power
I/O supply power.
DOUT8
F1
Output
Parallel pixel data output.
DOUT9
F2
Output
Parallel pixel data output.
DOUT10
F3
Output
Parallel pixel data output.
DOUT11
F4
Output
Parallel pixel data output (MSB)
TEST
F7
Input
Manufacturing test enable pin (connect to DGND).
DOUT4
G1
Output
Parallel pixel data output.
DOUT5
G2
Output
Parallel pixel data output.
DOUT6
G3
Output
Parallel pixel data output.
Output
Parallel pixel data output.
Input
Exposure synchronization input. (Connect to DGND if HiSPi interface is
used)
Input
Output enable (active LOW).
DOUT7
G4
TRIGGER
G7
OE_BAR
G8
DOUT0
H1
Output
Parallel pixel data output (LSB)
DOUT1
H2
Output
Parallel pixel data output.
DOUT2
H3
Output
Parallel pixel data output.
DOUT3
H4
Output
Parallel pixel data output.
AR0134_DS Rev. G Pub. 6/15 EN
13
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Configuration and Pinout
Table 3:
Pin Descriptions (continued)- 63-Ball iBGA Package
Name
iBGA Pin
RESET_BAR
H8
Reserved
E7, E8, F8
7
Description
Input
Asynchronous reset (active LOW). All settings are restored to factory
default.
n/a
Reserved (do not connect).
6
5
4
3
2
1
48
47
46
45
44
43
E X T C LK
V DD_P LL
DOUT6
DOUT5
DOUT4
DOUT3
DOUT2
DOUT1
DOUT0
DGND
NC
48 iLCC Package, Parallel Output
D GND
Figure 7:
Type
DOUT7
NC
42
8
DOUT8
NC
41
9
DOUT9
V AA
40
10
DOUT10
AGND
39
11
DOUT11
VAA_PIX
38
12
V DD_IO
VAA_PIX
37
13
PIXCLK
VAA
36
14
V DD
AGND
15
S CLK
VAA
34
16
S DATA
Reserved
33
17
RESET _BAR
Reserved
32
Reserved
31
AR0134_DS Rev. G Pub. 6/15 EN
FLASH
T R IG G E R
FRAME_VALID
LINE_VALID
22
23
24
25
26
27
28
29
14
D GND
TEST
21
S ADDR
20
OE_BAR
NC
19
STANDBY
NC
V DD_IO
V DD
18
35
30
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Configuration and Pinout
Table 4:
Pin Descriptions - 48 iLCC Package, Parallel
Pin Number
Name
Type
Description
1
DOUT4
Output
Parallel pixel data output.
2
DOUT5
Output
Parallel pixel data output.
3
DOUT6
Output
Parallel pixel data output.
4
VDD_PLL
Power
PLL power.
5
EXTCLK
Input
External input clock.
6
DGND
Power
Digital ground.
7
DOUT7
Output
Parallel pixel data output.
8
DOUT8
Output
Parallel pixel data output.
9
DOUT9
Output
Parallel pixel data output.
10
DOUT10
Output
Parallel pixel data output.
11
DOUT11
Output
Parallel pixel data output (MSB).
12
VDD_IO
Power
I/O supply power.
13
PIXCLK
Output
Pixel clock out. DOUT is valid on rising edge of this clock.
14
VDD
Power
Digital power.
15
SCLK
Input
Two-Wire Serial clock input.
16
SDATA
I/O
17
RESET_BAR
Input
Two-Wire Serial data I/O.
Asynchronous reset (active LOW). All settings are restored to factory default.
18
VDD_IO
Power
I/O supply power.
19
VDD
Power
Digital power.
20
NC
No connection.
21
NC
22
STANDBY
Input
No connection.
Standby-mode enable pin (active HIGH).
23
OE_BAR
Input
Output enable (active LOW).
24
SADDR
Input
Two-Wire Serial address select.
25
TEST
Input
26
FLASH
Output
Manufacturing test enable pin (connect to DGND).
Flash output control.
27
TRIGGER
Input
28
FRAME_VALID
Output
Exposure synchronization input.
Asserted when DOUT frame data is valid.
29
LINE_VALID
Output
Asserted when DOUT line data is valid.
Digital ground
30
DGND
Power
31
Reserved
n/a
Reserved (do not connect).
32
Reserved
n/a
Reserved (do not connect).
33
Reserved
n/a
Reserved (do not connect).
34
VAA
Power
Analog power.
35
AGND
Power
Analog ground.
36
VAA
Power
Analog power.
37
VAA_PIX
Power
Pixel power.
38
VAA_PIX
Power
Pixel power.
39
AGND
Power
Analog ground.
40
VAA
Power
Analog power.
41
NC
No connection.
42
NC
No connection.
43
NC
No connection.
AR0134_DS Rev. G Pub. 6/15 EN
15
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Configuration and Pinout
Table 4:
Pin Descriptions (continued)- 48 iLCC Package, Parallel
Pin Number
Name
Type
Description
44
DGND
Power
Digital ground.
45
DOUT0
Output
Parallel pixel data output (LSB)
46
DOUT1
Output
Parallel pixel data output.
47
DOUT2
Output
Parallel pixel data output.
48
DOUT3
Output
Parallel pixel data output.
AR0134_DS Rev. G Pub. 6/15 EN
16
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Two-Wire Serial Register Interface
Two-Wire Serial Register Interface
The two-wire serial interface bus enables read/write access to control and status registers within the AR0134.The interface protocol uses a master/slave model in which a
master controls one or more slave devices. The sensor acts as a slave device. The master
generates a clock (SCLK) that is an input to the sensor and is used to synchronize transfers. Data is transferred between the master and the slave on a bidirectional signal
(SDATA). SDATA is pulled up to VDD_IO off-chip by a 1.5k resistor. Either the slave or
master device can drive SDATA LOW—the interface protocol determines which device is
allowed to drive SDATA at any given time.
The protocols described in the two-wire serial interface specification allow the slave
device to drive SCLK LOW; the AR0134 uses SCLK as an input only and therefore never
drives it LOW.
Protocol
Data transfers on the two-wire serial interface bus are performed by a sequence of lowlevel protocol elements:
1. a (repeated) start condition
2. a slave address/data direction byte
3. an (a no) acknowledge bit
4. a message byte
5. a stop condition
The bus is idle when both SCLK and SDATA are HIGH. Control of the bus is initiated with a
start condition, and the bus is released with a stop condition. Only the master can
generate the start and stop conditions.
Start Condition
A start condition is defined as a HIGH-to-LOW transition on SDATA while ScLK is HIGH.
At the end of a transfer, the master can generate a start condition without previously
generating a stop condition; this is known as a “repeated start” or “restart” condition.
Stop Condition
A stop condition is defined as a LOW-to-HIGH transition on SDATA while ScLK is HIGH.
Data Transfer
Data is transferred serially, 8 bits at a time, with the MSB transmitted first. Each byte of
data is followed by an acknowledge bit or a no-acknowledge bit. This data transfer
mechanism is used for the slave address/data direction byte and for message bytes.
One data bit is transferred during each SCLK clock period. SDATA can change when ScLK is
LOW and must be stable while ScLK is HIGH.
Slave Address/Data Direction Byte
Bits [7:1] of this byte represent the device slave address and bit [0] indicates the data
transfer direction. A “0” in bit [0] indicates a WRITE, and a “1” indicates a READ. The
default slave addresses used by the AR0134 are 0x20 (write address) and 0x21 (read
address) in accordance with the specification. Alternate slave addresses of 0x30 (write
address) and 0x31 (read address) can be selected by enabling and asserting the SADDR
input.
AR0134_DS Rev. G Pub. 6/15 EN
17
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Two-Wire Serial Register Interface
An alternate slave address can also be programmed through R0x31FC.
Message Byte
Message bytes are used for sending register addresses and register write data to the slave
device and for retrieving register read data.
Acknowledge Bit
Each 8-bit data transfer is followed by an acknowledge bit or a no-acknowledge bit in the
ScLK clock period following the data transfer. The transmitter (which is the master when
writing, or the slave when reading) releases SDATA. The receiver indicates an acknowledge bit by driving SDATA LOW. As for data transfers, SDATA can change when ScLK is LOW
and must be stable while ScLK is HIGH.
No-Acknowledge Bit
The no-acknowledge bit is generated when the receiver does not drive SDATA LOW
during the ScLK clock period following a data transfer. A no-acknowledge bit is used to
terminate a read sequence.
Typical Sequence
A typical READ or WRITE sequence begins by the master generating a start condition on
the bus. After the start condition, the master sends the 8-bit slave address/data direction
byte. The last bit indicates whether the request is for a read or a write, where a “0” indicates a write and a “1” indicates a read. If the address matches the address of the slave
device, the slave device acknowledges receipt of the address by generating an acknowledge bit on the bus.
If the request was a WRITE, the master then transfers the 16-bit register address to which
the WRITE should take place. This transfer takes place as two 8-bit sequences and the
slave sends an acknowledge bit after each sequence to indicate that the byte has been
received. The master then transfers the data as an 8-bit sequence; the slave sends an
acknowledge bit at the end of the sequence. The master stops writing by generating a
(re)start or stop condition.
If the request was a READ, the master sends the 8-bit write slave address/data direction
byte and 16-bit register address, the same way as with a WRITE request. The master then
generates a (re)start condition and the 8-bit read slave address/data direction byte, and
clocks out the register data, eight bits at a time. The master generates an acknowledge
bit after each 8-bit transfer. The slave’s internal register address is automatically incremented after every 8 bits are transferred. The data transfer is stopped when the master
sends a no-acknowledge bit.
AR0134_DS Rev. G Pub. 6/15 EN
18
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Two-Wire Serial Register Interface
Single READ from Random Location
This sequence (Figure 8 on page 19) starts with a dummy WRITE to the 16-bit address
that is to be used for the READ. The master terminates the WRITE by generating a restart
condition. The master then sends the 8-bit read slave address/data direction byte and
clocks out one byte of register data. The master terminates the READ by generating a noacknowledge bit followed by a stop condition. Figure 8 shows how the internal register
address maintained by the AR0134 is loaded and incremented as the sequence proceeds.
Figure 8:
Single READ from Random Location
Previous Reg Address, N
S
Slave Address
0 A Reg Address[15:8]
S = start condition
P = stop condition
Sr = restart condition
A = acknowledge
A = no-acknowledge
A
Reg Address, M
Reg Address[7:0]
A Sr
Slave Address
1 A
M+1
Read Data
A P
slave to master
master to slave
Single READ from Current Location
This sequence (Figure 9) performs a read using the current value of the AR0134 internal
register address. The master terminates the READ by generating a no-acknowledge bit
followed by a stop condition. The figure shows two independent READ sequences.
Figure 9:
Single READ from Current Location
Previous Reg Address, N
S
Slave Address
AR0134_DS Rev. G Pub. 6/15 EN
1 A
Reg Address, N+1
Read Data
A P
S
19
Slave Address
1 A
N+2
Read Data
A P
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Two-Wire Serial Register Interface
Sequential READ, Start from Random Location
This sequence (Figure 10) starts in the same way as the single READ from random location (Figure 8). Instead of generating a no-acknowledge bit after the first byte of data has
been transferred, the master generates an acknowledge bit and continues to perform
byte READs until “L” bytes have been read.
Figure 10:
Sequential READ, Start from Random Location
Previous Reg Address, N
S
Slave Address
0 A Reg Address[15:8]
M+1
M+2
A
Reg Address, M
Reg Address[7:0] A Sr
Slave Address
M+L-2
M+3
1 A
M+L-1
M+1
Read Data
A
M+L
Sequential READ, Start from Current Location
This sequence (Figure 11) starts in the same way as the single READ from current location (Figure 9 on page 19). Instead of generating a no-acknowledge bit after the first byte
of data has been transferred, the master generates an acknowledge bit and continues to
perform byte READs until “L” bytes have been read.
Figure 11:
Sequential READ, Start from Current Location
Previous Reg Address, N
S
Slave Address
1 A
Read Data
N+1
A
N+2
Read Data
A
Read Data
N+L-1
A
Read Data
N+L
A P
Single WRITE to Random Location
This sequence (Figure 12) begins with the master generating a start condition. The slave
address/data direction byte signals a WRITE and is followed by the HIGH then LOW
bytes of the register address that is to be written. The master follows this with the byte of
write data. The WRITE is terminated by the master generating a stop condition.
Figure 12:
Single WRITE to Random Location
Previous Reg Address, N
S
AR0134_DS Rev. G Pub. 6/15 EN
Slave Address
0 A Reg Address[15:8]
20
A Reg Address[7:0]
Reg Address, M
A
Write Data
M+1
A P
A
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Two-Wire Serial Register Interface
Sequential WRITE, Start at Random Location
This sequence (Figure 13) starts in the same way as the single WRITE to random location
(Figure 12). Instead of generating a no-acknowledge bit after the first byte of data has
been transferred, the master generates an acknowledge bit and continues to perform
byte WRITEs until “L” bytes have been written. The WRITE is terminated by the master
generating a stop condition.
Figure 13:
Sequential WRITE, Start at Random Location
Previous Reg Address, N
S
Slave Address
0 A Reg Address[15:8]
M+1
Write Data
AR0134_DS Rev. G Pub. 6/15 EN
M+2
A
Write Data
A
Reg Address, M
Reg Address[7:0]
M+3
A
Write Data
M+L-2
Write Data
A
21
M+1
A
M+L-1
A
Write Data
M+L
A
P
A
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Electrical Specifications
Electrical Specifications
Unless otherwise stated, the following specifications apply to the following conditions:
VDD = 1.8V – 0.10/+0.15; VDD_IO = VDD_PLL = VAA = VAA_PIX = 2.8V ± 0.3V;
VDD_SLVS = 0.4V – 0.1/+0.2; TA = -30°C to +70°C; output load = 10pF;
PIXCLK frequency = 74.25 MHz; HiSPi off.
Two-Wire Serial Register Interface
The electrical characteristics of the two-wire serial register interface (SCLK, SDATA) are
shown in Figure 14 and Table 5.
Figure 14:
Two-Wire Serial Bus Timing Parameters
SDATA
tLOW
tf
tf
tSU;DAT
tr
tHD;STA
tr
tBUF
SCLK
S
tHD;STA
Note:
Table 5:
tHD;DAT
tHIGH
tSU;STA
tSU;STO
Sr
P
S
Read sequence: For an 8-bit READ, read waveforms start after WRITE command and register
address are issued.
Two-Wire Serial Bus Characteristics
f
EXTCLK = 27 MHz; VDD = 1.8V; VDD_IO = 2.8V; VAA = 2.8V; VAA_PIX = 2.8V;
VDD_PLL = 2.8V; VDD_DAC = 2.8V; TA = 25°C
Standard-Mode
Parameter
Fast-Mode
Symbol
Min
Max
Min
Max
Unit
fSCL
0
100
0
400
KHz
HD;STA
4.0
-
0.6
-
S
LOW period of the SCLK clock
tLOW
4.7
-
1.3
-
S
HIGH period of the SCLK clock
t
SCLK Clock Frequency
Hold time (repeated) START condition.
After this period, the first clock pulse is
generated
t
HIGH
4.0
-
0.6
-
S
Set-up time for a repeated START
condition
tSU;STA
4.7
-
0.6
-
S
Data hold time:
tHD;DAT
04
3.455
06
0.95
S
Data set-up time
tSU;DAT
250
-
1006
-
nS
Rise time of both SDATA and SCLK signals
tr
-
1000
20 + 0.1Cb7
300
nS
Fall time of both SDATA and SCLK signals
tf
300
20 + 0.1Cb7
300
nS
AR0134_DS Rev. G Pub. 6/15 EN
-
22
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Electrical Specifications
Table 5:
Two-Wire Serial Bus Characteristics
f
EXTCLK = 27 MHz; VDD = 1.8V; VDD_IO = 2.8V; VAA = 2.8V; VAA_PIX = 2.8V;
VDD_PLL = 2.8V; VDD_DAC = 2.8V; TA = 25°C
Standard-Mode
Parameter
Symbol
Min
Set-up time for STOP condition
t
Bus free time between a STOP and START
condition
Capacitive load for each bus line
Serial interface input pin capacitance
SDATA max load capacitance
SDATA pull-up resistor
Notes:
AR0134_DS Rev. G Pub. 6/15 EN
Max
Fast-Mode
Min
Max
Unit
4.0
-
0.6
-
S
BUF
4.7
-
1.3
-
S
Cb
-
400
-
400
pF
CIN_SI
-
3.3
-
3.3
pF
SU;STO
t
CLOAD_SD
-
30
-
30
pF
RSD
1.5
4.7
1.5
4.7
K
This table is based on I2C standard (v2.1 January 2000). Philips Semiconductor.
Two-wire control is I2C-compatible.
All values referred to VIHmin = 0.9 VDD and VILmax = 0.1VDD levels. Sensor EXCLK = 27 MHz.
A device must internally provide a hold time of at least 300 ns for the SDATA signal to bridge the
undefined region of the falling edge of SCLK.
5. The maximum tHD;DAT has only to be met if the device does not stretch the LOW period (tLOW) of
the SCLK signal.
6. A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement
tSU;DAT 250 ns must then be met. This will automatically be the case if the device does not stretch
the LOW period of the SCLK signal. If such a device does stretch the LOW period of the SCLK signal, it
must output the next data bit to the SDATA line tr max + tSU;DAT = 1000 + 250 = 1250 ns (according
to the Standard-mode I2C-bus specification) before the SCLK line is released.
7. Cb = total capacitance of one bus line in pF.
1.
2.
3.
4.
23
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Electrical Specifications
I/O Timing
By default, the AR0134 launches pixel data, FV and LV with the falling edge of PIXCLK.
The expectation is that the user captures DOUT[11:0], FV and LV using the rising edge of
PIXCLK. The launch edge of PIXCLK can be configured in register R0x3028. See Figure 15
and Table 6 for I/O timing (AC) characteristics.
Figure 15:
I/O Timing Diagram
tR
t RP
tF
t FP
90%
90%
10%
10%
t EXTCLK
EXTCLK
PIXCLK
t PD
Data[11:0]
Pxl _0
Pxl _1
Pxl _2
Pxl _n
t PLH
LINE_VALID/
FRAME_VALID
Table 6:
t PFL
t PFH
t PLL
FRAME_VALID trails
LINE_VALID by 6 PIXCLKs.
FRAME_VALID leads LINE_VALID by 6 PIXCLKs.
I/O Timing Characteristics, Parallel Output (1.8V VDD_IO)1
Symbol
Definition
fEXTCLK
Input clock frequency
tEXTCLK
Input clock period
Condition
Min
Typ
Max
Unit
6
50
MHz
20
166
ns
tR
Input clock rise time
PLL enabled
3
tF
Input clock fall time
PLL enabled
3
tjJITTER
Input clock jitter
5.7
ns
ns
600
ns
14.3
ns
tcp
EXTCLK to PIXCLK propagation
delay
Nominal voltages, PLL disabled,
PIXCLK slew rate = 4
tRP
PIXCLK rise time
PCLK slew rate = 6
1.3
4.0
ns
PCLK slew rate = 6
1.3
3.9
ns
60
%
tFP
PIXCLK fall time
40
PIXCLK duty cycle
50
PIXCLK frequency
PIXCLK slew rate = 6,
Data slew rate = 7
6
74.25
MHz
tPD
PIXCLK to data valid
PIXCLK slew rate = 6,
Data slew rate = 7
-2.5
2
ns
tPFH
PIXCLK to FV HIGH
PIXCLK slew rate = 6,
Data slew rate = 7
-2.5
2
ns
tPLH
PIXCLK to LV HIGH
PIXCLK slew rate = 6,
Data slew rate = 7
-3
1.5
ns
tPFL
PIXCLK to FV LOW
PIXCLK slew rate = 6,
Data slew rate = 7
-2.5
2
ns
tPLL
PIXCLK to LV LOW
PIXCLK slew rate = 6,
Data slew rate = 7
-3
1.5
ns
CIN
Input pin capacitance
fPIXCLK
AR0134_DS Rev. G Pub. 6/15 EN
2.5
24
pf
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Electrical Specifications
Notes:
1. Minimum and maximum values are taken at 70°C, 1.7V and -30°C, 1.95V. All values are taken at the
50% transition point. The loading used is 10 pF.
2. Jitter from PIXCLK is already taken into account in the data for all of the output parameters.
I/O Timing Characteristics, Parallel Output (2.8V VDD_IO)1
Table 7:
Symbol
Definition
Max
Unit
fEXTCLK
Input clock frequency
Condition
Min
6
50
MHz
tEXTCLK
Input clock period
20
166
ns
tR
Input clock rise time
PLL enabled
3
ns
tF
Input clock fall time
PLL enabled
3
ns
tjJITTER
600
ns
EXTCLK to PIXCLK
propagation delay
Nominal voltages, PLL
disabled, PIXCLK slew
rate = 4
5.3
13.4
ns
tRP
PIXCLK rise time
PCLK slew rate = 6
1.3
4.0
ns
tFP
PIXCLK fall time
PCLK slew rate = 6
1.3
3.9
ns
60
%
tcp
Input clock jitter
40
PIXCLK duty cycle
fPIXCLK
50
PIXCLK frequency
PIXCLK slew rate = 6,
Data slew rate = 7
6
74.25
MHz
tPD
PIXCLK to data valid
PIXCLK slew rate = 6,
Data slew rate = 7
-2.5
2
ns
tPFH
PIXCLK to FV HIGH
PIXCLK slew rate = 6,
Data slew rate = 7
-2.5
2
ns
tPLH
PIXCLK to LV HIGH
PIXCLK slew rate = 6,
Data slew rate = 7
-2.5
2
ns
tPFL
PIXCLK to FV LOW
PIXCLK slew rate = 6,
Data slew rate = 7
-2.5
2
ns
tPLL
PIXCLK to LV LOW
PIXCLK slew rate = 6,
Data slew rate = 7
-2.5
2
ns
CIN
Input pin capacitance
Notes:
AR0134_DS Rev. G Pub. 6/15 EN
Typ
2.5
pf
1. Minimum and maximum values are taken at 70°C, 1.7V and -30°C, 1.95V. All values are taken at the
50% transition point. The loading used is 10 pF.
2. Jitter from PIXCLK is already taken into account in the data for all of the output parameters.
25
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Electrical Specifications
I/O Rise Slew Rate (2.8V VDD_IO)1
Table 8:
Parallel Slew Rate
(R0x306E[15:13])
Conditions
Min
Typ
Max
Units
7
6
5
4
3
2
1
0
Default
Default
Default
Default
Default
Default
Default
Default
1.50
0.98
0.71
0.52
0.37
0.26
0.17
0.10
2.50
1.62
1.12
0.82
0.58
0.40
0.27
0.16
3.90
2.52
1.79
1.26
0.88
0.61
0.40
0.23
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
Note:
1. Minimum and maximum values are taken at 70°C, 2.5V and -30°C, 3.1V.
The loading used is 10 pF.
I/O Fall Slew Rate (2.8V VDD_IO)1
Table 9:
Parallel Slew Rate
(R0x306E[15:13])
Conditions
Min
Typ
Max
Units
7
6
5
4
3
2
1
0
Default
Default
Default
Default
Default
Default
Default
Default
1.40
0.97
0.73
0.54
0.39
0.27
0.18
0.11
2.30
1.61
1.21
0.88
0.63
0.43
0.29
0.17
3.50
2.48
1.86
1.36
0.88
0.66
0.44
0.25
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
Note:
AR0134_DS Rev. G Pub. 6/15 EN
1. Minimum and maximum values are taken at 70°C, 2.5V and -30°C, 3.1V.
The loading used is 10 pF.
26
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Electrical Specifications
I/O Rise Slew Rate (1.8V VDD_IO)1
Table 10:
Parallel Slew Rate
(R0x306E[15:13])
Conditions
Min
Typ
Max
Units
7
6
5
4
3
2
1
0
Default
Default
Default
Default
Default
Default
Default
Default
0.57
0.39
0.29
0.22
0.16
0.12
0.08
0.05
0.91
0.61
0.46
0.34
0.24
0.17
0.11
0.07
1.55
1.02
0.75
0.54
0.39
0.27
0.18
0.10
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
Note:
Table 11:
I/O Fall Slew Rate (1.8V VDD_IO)1
Parallel Slew Rate
(R0x306E[15:13])
Conditions
Min
Typ
Max
Units
7
6
5
4
3
2
1
0
Default
Default
Default
Default
Default
Default
Default
Default
0.57
0.40
0.31
0.24
0.18
0.13
0.09
0.05
0.92
0.64
0.50
0.38
0.27
0.19
0.13
0.08
1.55
1.08
0.82
0.61
0.44
0.31
0.20
0.12
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
Notes:
AR0134_DS Rev. G Pub. 6/15 EN
1. Minimum and maximum values are taken at 70°C, 1,7V and -30°C, 1.95V.
The loading used is 10 pF.
1. Minimum and maximum values are taken at 70°C, 1.7V and -30°C, 1.95V.
The loading used is 10 pF.
27
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Electrical Specifications
DC Electrical Characteristics
The DC electrical characteristics are shown in Table 12, Table 13, Table 14, and Table 15.
Table 12:
DC Electrical Characteristics
Symbol
Definition
Condition
Min
Typ
Max
Unit
VDD
Core digital voltage
1.7
1.8
1.95
V
VDD_IO
I/O digital voltage
1.7/2.5
1.8/2.8
1.9/3.1
V
VAA
Analog voltage
2.5
2.8
3.1
V
VAA_PIX
Pixel supply voltage
2.5
2.8
3.1
V
VDD_PLL
PLL supply voltage
2.5
2.8
3.1
V
VDD_SLVS
HiSPi supply voltage
0.3
0.4
0.6
V
VIH
Input HIGH voltage
VDD_IO * 0.7
–
–
V
–
–
V
20
–
VDD_IO *
0.3
–
A
VDD_IO – 0.3
–
–
V
VIL
Input LOW voltage
IIN
Input leakage current
VOH
Output HIGH voltage
VOL
Output LOW voltage
VDD_IO = 2.8V
–
–
0.4
V
IOH
Output HIGH current
At specified VOH
–22
–
–
mA
IOL
Output LOW current
At specified VOL
–
–
22
mA
Caution
Table 13:
No pull-up resistor; VIN = VDD_IO or
DGND
Stresses greater than those listed in Table 13 may cause permanent damage to the device.
This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Absolute Maximum Ratings
Symbol
Parameter
Minimum
Maximum
Unit
Symbol
VSUPPLY
Power supply voltage (all supplies)
–0.3
4.5
V
VSUPPLY
ISUPPLY
IGND
Total power supply current
–
200
mA
ISUPPLY
Total ground current
–
200
mA
IGND
VIN
VOUT
DC input voltage
–0.3
VDD_IO + 0.3
V
VIN
DC output voltage
–0.3
VDD_IO + 0.3
V
TSTG1
VOUT
Storage temperature
–40
+85
°C
TSTG1
Note:
Table 14:
1. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
Operating Current Consumption for Parallel Output
VAA = VAA_PIX = VDD_IO = VDD_PLL = 2.8V; VDD= 1.8V; PLL Enabled and PIXCLK = 74.25 MHz; TA = 25°C; CLOAD = 10pF
Condition
Typ
Max
Unit
Parallel, Streaming, Full resolution 54 fps
IDD1
46
60
mA
I/O digital operating current
Parallel, Streaming, Full resolution 54 fps
IDD_IO
52
–
mA
Analog operating current
Parallel, Streaming, Full resolution 54 fps
IAA
46
55
mA
Digital operating current
Symbol
Min
Pixel supply current
Parallel, Streaming, Full resolution 54 fps
IAA_PIX
7
9
mA
PLL supply current
Parallel, Streaming, Full resolution 54 fps
IDD_PLL
8
10
mA
AR0134_DS Rev. G Pub. 6/15 EN
28
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Electrical Specifications
Table 15:
Standby Current Consumption
Analog - VAA + VAA_PIX + VDD_PLL; Digital - VDD + VDD_IO; TA = 25°C
Definition
Hard standby (clock off, driven low)
Hard standby (clock on, EXTCLK = 20 MHz)
Soft standby (clock off, driven low)
Soft standby (clock on, EXTCLK = 20 MHz)
Condition
Min
Typ
Max
Unit
Analog, 2.8V
Digital, 1.8V
Analog, 2.8V
Digital, 1.8V
Analog, 2.8V
Digital, 1.8V
Analog, 2.8V
Digital, 1.8V
–
–
–
–
–
–
–
–
3
25
12
1.1
3
25
12
1.1
15
80
25
1.7
15
80
25
1.7
A
A
A
mA
A
A
A
mA
HiSPi Electrical Specifications
The ON Semiconductor AR0134 sensor supports SLVS mode only, and does not have a
DLL for timing adjustments. Refer to the High-Speed Serial Pixel (HiSPi) Interface Physical Layer Specification v2.00.00 for electrical definitions, specifications, and timing
information. The VDD_SLVS supply in this data sheet corresponds to VDD_TX in the
HiSPi Physical Layer Specification. Similarly, VDD is equivalent to VDD_HiSPi as referenced in the specification. The HiSPi transmitter electrical specifications are listed at
700 MHz.
Table 16:
Input Voltage and Current (HiSPi Power Supply 0.4 V)
Measurement Conditions: Max Freq 700 MHz
Parameter
Symbol
Min
Typ
Max
Unit
IDD_SLVS
–
10
15
mA
HiSPi common mode voltage
(driving 100 load)
VCMD
VDD_SLVS x 0.45
VDD_SLVS/2
VDD_SLVS x 0.55
V
HiSPi differential output voltage
(driving 100 load)
|VOD|
VDD_SLVS x 0.36
VDD_SLVS/2
VDD_SLVS x 0.64
V
Change in VCM between logic 1 and 0
VCM
25
mV
Change in |VOD| between logic 1 and
0
|VOD|
25
mV
Supply current (PWRHiSPi)
(driving 100 load)
Vod noise margin
30
%
Difference in VCM between any two
channels
|VCM|
50
mV
Difference in VOD between any two
channels
|VOD|
100
mV
Common-mode AC voltage (pk)
without VCM cap termination
VCM_ac
50
mV
Common-mode AC voltage (pk) with
VCM cap termination
VCM_ac
30
mV
Max overshoot peak |VOD|
VOD_ac
1.3 x |VOD|
V
Max overshoot Vdiff pk-pk
Vdiff_pkpk
2.6 x |VOD|
V
70

20
%
Eye Height
Single-ended output impedance
Output impedance mismatch
AR0134_DS Rev. G Pub. 6/15 EN
NM
–
Veye
1.4 x VOD
Ro
35
Ro
29
50
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Electrical Specifications
Figure 16:
Differential Output Voltage for Clock or Data Pairs
VDIFFmax
VDIFFmin
0V Diff)
Output Signal is 'Cp - Cn' or 'Dp - Dn'
Table 17:
Rise and Fall Times
Measurement Conditions: HiSPi Power Supply 0.4V, Max Freq 700 MHz
Parameter
Symbol
Min
Typ
Max
Unit
Data Rate
1/UI
280
–
700
Mb/s
Max setup time from transmitter
TxPRE
0.3
–
–
UI1
Max hold time from transmitter
TxPost
0.3
–
–
UI
Rise time (20% - 80%)
RISE
–
0.25UI
–
Fall time (20% - 80%)
FALL
150ps
0.25 UI
–
50
Clock duty
PLL_DUTY
45
Bitrate Period
tpw
1.43
Eye Width
teye
0.3
55
%
3.57
ns1
UI1, 2
ttotaljit
0.2
UI1, 2
Clock Period Jitter (RMS)
tckjit
50
ps2
Clock cycle to cycle jitter (RMS)
tcyjit
100
ps2
0.1
UI1, 2
2.1
UI1, 5
100
ps6
Data Total jitter (pk pk)@1e-9
Clock to Data Skew
tchskew
PHY-to-PHY Skew
t|PHYskew|
Mean differential skew
tDIFFSKEW
Notes:
AR0134_DS Rev. G Pub. 6/15 EN
-0.1
–100
1. One UI is defined as the normalized mean time between one edge and the following edge of the
clock.
2. Taken from 0V crossing point.
3. Also defined with a maximum loading capacitance of 10pF on any pin. The loading capacitance
may also need to be less for higher bitrates so the rise and fall times do not exceed the maximum
0.3UI.
4. The absolute mean skew between the Clock lane and any Data Lane in the same PHY between any
edges.
5. The absolute mean skew between any Clock in one PHY and any Data lane in any other PHY
between any edges.
6. Differential skew is defined as the skew between complementary outputs. It is measured as the
absolute time between the two complementary edges at mean VCM point.
30
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Electrical Specifications
Figure 17:
Eye Diagram for Clock and Data Signals
RISE
80%
D A T A M A SK
V d i ff
20%
T x Pr e
T x Po s t
FALL
UI/ 2
UI/ 2
V d i ff
M a x V d i ff
C L O C K M A SK
T r i g ge r/ R efe re nce
C L K JIT T ER
Figure 18:
Skew Within the PHY and Output Channels
V C MD
t C M PSK EW
AR0134_DS Rev. G Pub. 6/15 EN
t C HSKEW1 PHY
31
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Power-On Reset and Standby Timing
Power-On Reset and Standby Timing
Power-Up Sequence
The recommended power-up sequence for the AR0134 is shown in Figure 19. The available power supplies (VDD_IO, VDD, VDD_SLVS, VDD_PLL, VAA, VAA_PIX) must have the
separation specified below.
1. Turn on VDD_PLL power supply.
2. After 0–10s, turn on VAA and VAA_PIX power supply.
3. After 0–10s, turn on VDD_IO power supply.
4. After the last power supply is stable, enable EXTCLK.
5. If RESET_BAR is in a LOW state, hold RESET_BAR LOW for at least 1ms.
If RESET_BAR is in a HIGH state, assert RESET_BAR for at least 1ms.
6. Wait 160000 EXTCLKs (for internal initialization into software standby).
7. Configure PLL, output, and image settings to desired values.
8. Wait 1ms for the PLL to lock.
9. Set streaming mode (R0x301a[2] = 1).
Figure 19:
Power Up
VDD_PLL (2.8)
VAA_PIX
VAA (2.8)
VDD_IO (1.8/2.8)
t0
t1
t2
VDD (1.8)
t3
VDD_SLVS (0.4)
EXTCLK
t4
RESET_BAR
tx
t5
Internal
Initialization
Hard Reset
Table 18:
t6
Software
Standby
PLL Lock
Streaming
Power-Up Sequence
Definition
Symbol
Minimum
Typical
Maximum
Unit
VDD_PLL to VAA/VAA_PIX
t0
0
10
–
s
VAA/VAA_PIX to VDD_IO
t1
0
10
–
s
VDD_IO to VDD
t2
0
10
–
s
VDD to VDD_SLVS
t3
0
10
–
s
Xtal settle time
tx
–
301
–
ms
Hard Reset
t4
12
–
–
ms
Internal Initialization
t5
160000
–
–
EXTCLKs
PLL Lock Time
t6
1
–
–
ms
Notes:
AR0134_DS Rev. G Pub. 6/15 EN
1. Xtal settling time is component-dependent, usually taking about 10 – 100 ms.
2. Hard reset time is the minimum time required after power rails are settled. In a circuit where hard
reset is held down by RC circuit, then the RC time must include the all power rail settle time and
Xtal settle time.
32
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Power-On Reset and Standby Timing
3. It is critical that VDD_PLL is not powered up after the other power supplies. It must be powered
before or at least at the same time as the others. If the case happens that VDD_PLL is powered after
other supplies then the sensor may have functionality issues and will experience high current draw
on this supply.
Power-Down Sequence
The recommended power-down sequence for the AR0134 is shown in Figure 20. The
available power supplies (VDD_IO, VDD, VDD_SLVS, VDD_PLL, VAA, VAA_PIX) must have
the separation specified below.
1. Disable streaming if output is active by setting standby R0x301a[2] = 0
2. The soft standby state is reached after the current row or frame, depending on configuration, has ended.
3. Turn off VDD_SLVS.
4. Turn off VDD.
5. Turn off VDD_IO
6. Turn off VAA/VAA_PIX.
7. Turn off VDD_PLL.
Figure 20:
Power Down
VDD_SLVS (0.4)
t0
VDD (1.8)
t1
V DD_IO (1.8/2.8)
t2
VAA_PIX
VAA (2.8)
t3
VDD_PLL (2.8)
EXTCLK
t4
Power Down until next Power up cycle
Table 19:
Power-Down Sequence
Definition
Symbol
Minimum
Typical
Maximum
Unit
t0
0
–
–
S
VDD to VDD_IO
t1
0
–
–
S
VDD_IO to VAA/VAA_PIX
t2
0
–
–
S
VDD_SLVS to VDD
AR0134_DS Rev. G Pub. 6/15 EN
VAA/VAA_PIX to VDD_PLL
t3
0
–
–
S
PwrDn until Next PwrUp Time
t4
100
–
–
mS
33
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Power-On Reset and Standby Timing
Note:
t4 is required between power down and next power up time; all decoupling caps
from regulators must be completely discharged.
Standby Sequence
Figures 21 and 22 show timing diagrams for entering and exiting standby. Delays are
shown indicating the last valid register write prior to entering standby as well as the first
valid write upon exiting standby. Also shown is timing if the EXTCLK is to be disabled
during standby.
Figure 21:
Enter Standby Timing
FV
E XTC L K
50 E XTC L Ks
S DATA
R egister Writes Valid
R egister Writes Not Valid
750 E XTC L Ks
S TANDBY
Figure 22:
Exit Standby Timing
28 rows + C IT
FV
E XTC L K
S DATA
R egister Writes Not Valid
R egister Writes Valid
10 E XTC L Ks
S TANDBY
1ms
TR IGGE R
AR0134_DS Rev. G Pub. 6/15 EN
34
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Power-On Reset and Standby Timing
Figure 23:
Quantum Efficiency – Monochrome Sensor (Typical)
AR0134_DS Rev. G Pub. 6/15 EN
35
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Power-On Reset and Standby Timing
Figure 24:
Quantum Efficiency – Color Sensor (Typical)
AR0134_DS Rev. G Pub. 6/15 EN
36
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Power-On Reset and Standby Timing
Table 20:
Chief Ray Angle - 25deg Mono
Image Height
30
28
26
24
22
20
CRA (deg)
18
16
14
12
10
8
6
4
2
0
0
10
20
30
40
50
I
AR0134_DS Rev. G Pub. 6/15 EN
60
H i ht (%)
70
80
37
90
100
110
CRA
(%)
(mm)
(deg)
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
0
0.150
0.300
0.450
0.600
0.750
0.900
1.050
1.200
1.350
1.500
1.650
1.800
1.950
2.100
2.250
2.400
2.550
2.700
2.850
3000
0
1.35
2.70
4.04
5.39
6.73
8.06
9.39
10.71
12.02
13.33
14.62
15.90
17.16
18.41
19.64
20.85
22.05
23.22
24.38
25.51
©Semiconductor Components Industries, LLC,2015.
AR0134_DS Rev. G Pub. 6/15 EN
Package Dimensions
Figure 25:
63-Ball iBGA Package Outline Drawing
©Semiconductor Components Industries, LLC,2015
1. Dimensions in mm. Dimensions in () are for reference only.
2 Encapsulant: Epoxy.
3 Substrate material: Plastic laminate 0.25 thickness.
4 Lid material: Borosilicate glass 0.4 ± 0.04 thickness.
Refractive index at 20C = 1.5255 @ 546nm and 1.5231 @ 588nm.
Double side AR Coating: 530-570nm R< 1%; 420-700nm R < 2%.
5 Image sensor die: 0.2mm thickness.
6 Solder ball material: SAC305 (95% Sn, 3% Ag, 0.5% Cu).
Dimensions apply to solder balls post reflow.
Pre-flow ball is0.5 on a Ø0.4 SMD ball pad.
7 Maximum rotation of optical area relative to package edges: 1°.
Maximum tilt of optical area relative to substrate plane D : 25 m.
Maximum tilt of cover glass relative to optical area plane E : 50 m.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Package Dimensions
38
Notes:
AR0134_DS Rev. G Pub. 6/15 EN
Figure 26:
48-pin iLCC Package Drawing
©Semiconductor Components Industries, LLC,2015
1. Dimensions in mm. Dimensions in () are for reference only.
2 Encapsulant: Epoxy.
3 Substrate material: Plastic laminate 0.5 thickness.
4 Lid material: Borosilicate glass 0.4 ± 0.04 thickness.
Refractive index at 20C = 1.5255 @ 546nm and 1.5231 @ 588nm.
Double side AR Coating: 530-570nm R< 1%; 420-700nm R < 2%.
5 Lead finish: Gold plating, 0.5 microns minimum thickness.
6 Image sensor die: 0.2mm thickness.
7 Maximum rotation of optical area relative to package edges: 1°.
Maximum tilt of optical area relative to substrate plane D : 25 m.
Maximum tilt of cover glass relative to optical area plane E : 50 m.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Package Dimensions
39
Notes:
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Revision History
Revision History
Rev. G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6/9/15
• Updated “Ordering Information” on page 2
Rev. F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5/29/15
• Updated “Ordering Information” on page 2
• Removed Confidential marking
Rev. E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11/19/14
• Updated to ON Semiconductor template
Rev. D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6/13/14
• Updated Table 1, “Key Parameters,” on page 1
• Updated Figure 4: “Typical Configuration: Serial Four-Lane HiSPi Interface,” on
page 10
• Updated Figure 6: “9x9mm 63-Ball iBGA Package,” on page 12
• Updated Table 5, “Two-Wire Serial Bus Characteristics,” on page 22
• Updated Table 6, “I/O Timing Characteristics, Parallel Output (1.8V VDD_IO)1,” on
page 24
• Updated Table 7, “I/O Timing Characteristics, Parallel Output (2.8V VDD_IO)1,” on
page 25
• Updated “Two-Wire Serial Register Interface” on page 17
• Split Table 6 and updated values in Table 8, “I/O Rise Slew Rate (2.8V VDD_IO)1,” on
page 26 and Table 9, “I/O Fall Slew Rate (2.8V VDD_IO)1,” on page 26
• Updated “Power-Up Sequence” on page 32
• Updated Figure 19: “Power Up,” on page 32
• Updated Figure 25: “63-Ball iBGA Package Outline Drawing,” on page 38
• Updated Figure 26: “48-pin iLCC Package Drawing,” on page 39
Rev. C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6/13/13
• Updated to Production
• Applied updated Aptina template
• Updated “General Description” on page 1
• Updated Table 1, “Key Parameters,” on page 1
• Updated Table 3, “Available Part Numbers,” on page 3
• Updated “Features Overview” on page 7
• Added “Pixel Data Format” on page 8
• Updated Table 6, “I/O Timing Characteristics, Parallel Output (1.8V VDD_IO)1,” on
page 24
• Updated Table 7, “I/O Rise Slew Rate (2.8V Vdd_IO)1,” on page 23
• Updated Table 8, “I/O Fall Slew Rate (2.8V Vdd_IO)1,” on page 23
• Updated Table 9, “I/O Rise Slew Rate (1.8V Vdd_IO)1,” on page 23
• Added “Two-Wire Serial Register Interface” on page 17
• Added “Standby Sequence” on page 34
• Added Table 20, “Chief Ray Angle - 25deg Mono,” on page 37
Rev. B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1/23/13
• Updated to Preliminary
• Updated “Features” on page 1
AR0134_DS Rev. G Pub. 6/15 EN
40
©Semiconductor Components Industries, LLC,2015.
AR0134: 1/3-Inch 1.2 Mp CMOS Digital Image Sensor
Revision History
• Updated third paragraph of “General Description” on page 6
• Updated Figure 15: “I/O Timing Diagram,” on page 24
• Updated Table 6, “I/O Timing Characteristics, Parallel Output (1.8V VDD_IO)1,” on
page 24
• Added Figure 21: “Enter Standby Timing,” on page 34
• Added Figure 22: “Exit Standby Timing,” on page 34
• Added Table 7, “I/O Rise Slew Rate (2.8V Vdd_IO)1,” on page 23
• Added Table 8, “I/O Fall Slew Rate (2.8V Vdd_IO)1,” on page 23
• Added Table 9, “I/O Rise Slew Rate (1.8V Vdd_IO)1,” on page 23
• Added Table 10, “I/O Fall Slew Rate (1.8V Vdd_IO)1,” on page 24
• Updated “Power-Up Sequence” on page 32
• Updated Table 18, “Power-Up Sequence,” on page 32
• Added Figure 21: “Enter Standby Timing,” on page 34
• Added Figure 22: “Exit Standby Timing,” on page 34
• Added Figure 23: “Quantum Efficiency – Monochrome Sensor (Typical),” on page 35
Rev. A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9/19/12
• Initial release
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AR0134_DS Rev. G Pub. 6/15 EN
41
©Semiconductor Components Industries, LLC,2015 .