14-Bit, 85 MSPS Dual ADC, 8-Channel Wideband Receiver SLWS168 - OCTOBER 2005 Product Preview AFE8406 FEATURES • • • • • • • • • • • • • 14-bit 85 MSPS high performance dual ADC The dual ADC can be configured into single ADC At Fin=140MHz, SNR>=68dB, SFDR>=70dBc At Fin = 70MHz, SNR>=70dB, SFDR>=82dBc Independent clocks for ADC and DDC with build-in FIFO Programmable closed loop VGA control with 6-bit outputs for each ADC Provide Received Total Wide band Power (RTWP) measurement for the composite power across carriers with programmable time window for measurement 8 UMTS Digital Down Converter (DDC) channels or 16 CDMA/TD-SCDMA DDC channels with programmable 18 bit filter coefficients Each DDC channel includes o Real or complex DDC inputs o UMTS mode Rx Filtering: 6 stage CIC (m=1 or 2), up to 40 tap CFIR, up to 64 tap PFIR o CDMA mode Rx Filtering: 6 stage CIC (m=1 or 2), up to 64 tap CFIR, up to 64 tap PFIR o Each DDC channel provides individual channel specific power measurements o Each DDC channel has a dedicated final AGC Test Bus to monitor data at different stages of the DDC signal path 3.3V analog supplies, 1.5V digital core supply, 3.3V digital I/O supply 484 ball plastic BGA (23mm x 23mm) with 1.0 mm pitch Power dissipation: ~2.1W APPLICATIONS • • • • • • • • • • Wireless base station receiver Multi-carrier digital receiver UMTS (4 carriers-1 sector with diversity) CDMA (8 carriers-1 sector with diversity) TD-SCDMA (16 carriers-1 sector without diversity, 8 carriers-1-sector with diversity) Digital radio receivers Wide band receivers Software radios Wireless local loop Intelligent antenna systems PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Functional Block Diagram General Description The AFE8406 is a multi-channel communications signal processor that provides analog to digital conversion and digital downconversion optimized for cellular base transceiver systems. The device supports UMTS, CDMA-1X and TD-SCDMA air interface cellular standards. The AFE8406 provides up to 8 UMTS digital downconverter channels (DDC), 16 CDMA DDCs or 16 TDSCDMA DDCs. The DDC channels are independent and operate simultaneously. At the AFE8406 inputs, there are four input ports; two are hardwired to internal 14-bit analog-to-digital converters and two are 16-bit digital inputs. Each DDC channel can be programmed to accept data from any one of the four input ports. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 2 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Table of Contents 1 2 Analog to Digital Converters ................................................................................................................... 4 Receive Digital Signal Processing........................................................................................................... 5 2.1 Receive Input Interface.................................................................................................................... 6 2.1.1 Receive FIFO ........................................................................................................................... 7 2.1.2 Receive Input Power Meters ...................................................................................................... 9 2.1.3 Receive Input AGC (RAGC) .................................................................................................... 11 2.1.4 Test and Noise Signal Generator ............................................................................................. 16 2.1.5 Sample Delay Lines ................................................................................................................ 19 2.1.6 Test Bus ................................................................................................................................ 20 2.2 DDC Organization ......................................................................................................................... 22 2.2.1 Downconverter Function Blocks............................................................................................... 24 2.2.2 DDC Mixer ............................................................................................................................. 25 2.2.3 DDC Number Controlled Oscillator (NCO) ................................................................................ 26 2.2.4 DDC Filtering and Decimation.................................................................................................. 30 2.2.5 DDC Channel Delay Adjust and Zero Insertion ......................................................................... 31 2.2.6 DDC CIC Filter ....................................................................................................................... 32 2.2.7 DDC Compensating FIR Filter ................................................................................................. 33 2.2.8 DDC Programmable FIR Filter................................................................................................. 38 2.2.9 DDC RMS Power Meter .......................................................................................................... 45 2.2.10 DDC AGC .............................................................................................................................. 47 2.2.11 DDC Output Interface.............................................................................................................. 51 2.2.11.1 Serial Output Interface ..................................................................................................... 51 2.2.11.2 Parallel Output Interface .................................................................................................. 53 2.2.12 DDC Checksum Generator ...................................................................................................... 54 3 AFE8406 General Control .................................................................................................................... 55 3.1 Microprocessor Interface Control Data, Address, and Strobes .......................................................... 55 3.2 MPU Timing diagrams: .................................................................................................................. 56 3.3 Synchronization Signals ................................................................................................................ 59 3.4 Interrupt Handling ......................................................................................................................... 60 3.5 AFE8406 Programming ................................................................................................................. 60 3.5.1 Control Register Index ............................................................................................................ 64 3.5.2 Global Control Variables ......................................................................................................... 67 3.5.3 Receive Input Interface Controls .............................................................................................. 73 3.5.4 Receive AGC Controls ............................................................................................................ 86 3.5.5 DDC Channel Controls.......................................................................................................... 104 4 AFE8406 Pins ................................................................................................................................... 120 4.1 Analog Section Signals................................................................................................................ 120 4.2 Digital Receive Section Signals.................................................................................................... 121 4.3 Microprocessor Signals ............................................................................................................... 126 4.4 JTAG Signals ............................................................................................................................. 127 4.5 Factory Test and No Connect Signals .......................................................................................... 127 4.6 Power and Ground Signals .......................................................................................................... 128 4.7 Digital Supply Monitoring............................................................................................................. 128 4.8 JTAG ......................................................................................................................................... 129 5 Specifications .................................................................................................................................... 129 5.1 Absolute Maximum Ratings ......................................................................................................... 129 5.2 Recommended Operating Conditions ........................................................................................... 130 5.3 Thermal Characteristics............................................................................................................... 130 5.4 Power Consumption .................................................................................................................... 130 5.5 Analog Electrical Characteristics.................................................................................................. 131 5.6 Digital Chip DC Characteristics .................................................................................................... 134 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 3 WWW.TI.COM AFE8406 PRODUCT PREVIEW 6 1 SLWS168 - OCTOBER 2005 5.7 Digital Chip AC Timing Characteristics ......................................................................................... 135 Package/Ordering Information ............................................................................................................ 137 Analog to Digital Converters The AFE8406 includes a high performance dual channel 14bit 85MSPS Analog-to-Digital Converter. To provide a complete solution, each channel includes a high bandwidth linear sample-and-hold stage (S&H) and internal reference. An internal reference is provided, simplifying system design requirements, yet external reference can be used optionally to suit the accuracy and low drift requirements of the application. REFPA REFMA Internal Reference INPA S&H INMA Dual 14 bit 85Msps ADC 14bit Pipelined ADC Core Digital Error Correction Output Control CLKPA CLKMB CLKOUTB Timing circuitry CLKPB INMB S&H INPB REFMB REFPB OVFA CLKOUTA Timing circuitry CLKMA DA13:DA0 14bit Pipelined ADC Core Digital Error Correction Output Control DB13:DB0 OVFB Internal Reference The ADC digital output data and output clocks are connected directly to the rxin_a and rxin_b ports of the AFE8406 digital section. The OVFA and OVFB outputs connect directly to the AFE8406 digital section and also to package balls. The ADC outputs can be accessed through the test bus in a decimate by 32x only. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 4 WWW.TI.COM AFE8406 PRODUCT PREVIEW 2 SLWS168 - OCTOBER 2005 Receive Digital Signal Processi ng The down conversion section of the AFE8406 consists of the receive input interface, the rx_distribution bus, and 8 digital downconverter blocks. The purpose of the receive input interface is to accept signal data from four input ports (2 from the integrated 14 bit analog-to-digital converters, and 2 from the 16 bit input ports), measure the input signal power, provide control signals for external Digital Variable Gain Amplifiers (DVGAs) for controlling signal amplitude at each ADC input and to distribute the data to the DDC blocks. The input interface also has a user-controlled test generator and noise source. The rx_distribution bus distributes the four channels of signal data to each of the 8 DDC blocks. Each DDC block selects one of the four channels (or 2 for complex input data) from the rx_distribution bus and then performs downconversion tuning, programmable delay, channel filtering with decimation, power measurement, fixed gain adjust, and automatic gain control. Each DDC block can support 1 UMTS channel, 2 CDMA channels, or 2 TD-SCDMA channels. An optional mode permits stacking two DDC blocks in UMTS mode to provide double-length final pulse shaping filtering. Tuned, filtered, and decimated signal data is output in bit serial or parallel format. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 5 WWW.TI.COM AFE8406 PRODUCT PREVIEW 2.1 SLWS168 - OCTOBER 2005 Receive Input Interface dvga _a 6 18 hard wired to internal ADCA rxin_a 16 test & noise signal generator 16 FIFO 16 dual real or single complex Power Meter to testbus dual real or single complex AGC 1 to 64 sample delay line delay_a hard wired to internal ADCB rxin_b 16 FIFO 16 dvga_b 6 1 to 64 sample delay line dvga _c 6 delay_b 16 test & noise signal generator 18 rx_distribution bus to DDC channels 18 rxin_c 16 test & noise signal generator 16 test bus select and decimation FIFO 16 dual real or single complex Power Meter testbus sources dual real or single complex AGC 1 to 64 sample delay line delay_c rxin_d 16 test & noise signal generator 16 FIFO 16 dvga_d 6 18 1 to 64 sample delay line delay_d The AFE8406’s receive input data interface accepts data from several sources: • Signal data from the two integrated 14-bit ADCs. • Signal data presented at the two 16-bit digital data input ports. • A LFSR test signal generator allows the AFE8406 to be tested using a known repetitive data sequence. For the rxin_c and rxin_d input ports, signal data can be provided in binary or 2’s complement form. The location of the ADC’s MSB can be programmed to allow for additional AGC headroom if desired. For example, a 14-bit ADC may be connect with the MSBs aligned, or shifted down to allow the AGC additional gain range before clipping the signal. Signal data can be accepted at rates up to rxclk in UMTS mode for either 8 normal channels or 4 double length final pulse shaping filter channels. In CDMA mode the maximum input rate is rxclk for real inputs, or rxclk/2 for complex inputs. For maximum filter performance, higher clock rates generally allow longer filters. Complex signal data is input with I data driving one input port and Q data driving another. This means that there are only two signal data ports available when using complex input mode. The mapping of I and Q data onto the four input ports is programmable. Signal input data is clocked into 8-stage FIFOs using a matching external clock signal adcclk_a/b/c/d. Signal data is clocked out of the FIFO from a gated rxclk (the AFE8406 receive section clock). The FIFO PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 6 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 allows arbitrary phase relationship between adcclk_a/b/c/d and rxclk. The frequency relationship is mandated by the programmed configuration. The test and noise generator can supply test sequences or add noise to the input signal data. The test sequences, when combined with the checksum generators, are useful for initial board debug or power-on self-test. For applications that require receiver desensitization, the noise generator can add noise to user selected bits to input data stream to reduce receiver sensitivity. The two ADC input ports, rxin_a and rxin_b, can be passed to the testbus control block, decimated by 32x, and routed directly to the AFE8406 testbus output pins. The key requirement of this function is to be able to verify the performance of the ADC by reconstructing the samples, while limiting the output sample rate to less than 5MHz using a 85MHz ADC sample rate. Many other internal chip signals can be routed to the testbus for evaluation and debug purposes. When the testbus is enabled, the rxin_c and rxin_d ports are driven as digital outputs. Each of the four outputs to the DDC channels includes a 1 to 64 sample delay lines. Programming Variable ssel_ddc(2:0) offset_bin_X msb_pos_X(2:0) 2.1.1 Description Selects the sync source for the DDC data input mux and mixer. This sets the sync source for DDC input clock generation and synchronization for all DDC channels. Selects offset binary input when set, 2’s complement input when cleared. X={a,b,c,d} Note that the internal ADCs use 2’s complement format, so offset_bin_A and offset_bin_B must be set. Identifies the connection location of the ADC’s MSB. Programmed values of {0..7} corresponds to msb at {rxin_x_15.. rxin_x_8}. X={a,b,c,d} Receive FIFO The receive FIFO consists of an 8 stage memory and 2 counters generating the input write pointer and output read pointer. When the FIFO receives a sync signal, the input and output pointers are initialized with a write to read pointer offset of four samples. Input samples from rxin_X (writes) are clocked with the adcclk_X input clock rising edges, and the input pointer advances on each clock rising edge. Output samples (reads) and the output pointer are clocked with the rxclk input signal rising edges, divided by the programmed sample rate loaded into the rate_sel(1:0) control register. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 7 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Programming Variable adc_fifo_bypass ssel_adc_fifo(2:0) rate_sel(1:0) adc_fifo_strap_ab adc_fifo_strap_cd Description When set, bypasses the input FIFOs and input data is latched directly using the rxclk. When cleared, input data is latched using the adcclk_a/b/c/d inputs. Selects the sync source for the FIFO state machines. This sync signal initializes the FIFO input and output pointers. This selects the FIFO input and output rate; {rxclk, rxclk/2, rxclk/4 or rxclk/8 }. For example, with rxclk at 153.6MHz, set rate_sel to 0, 1, 2 or 3 respectively for adcclk_a/b/c/d 153.6, 76.8, 38.4 or 19.2MHz. MUST BE SET THE SAME AS REGISTER ch_rate_sel(1:0). When set, the rxin_a and rxin_b FIFO input and output pointers are synchronized to support complex input signals. When set, the rxin_c and rxin_d FIFO input and output pointers are synchronized to support complex input signals. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 8 WWW.TI.COM AFE8406 PRODUCT PREVIEW 2.1.2 SLWS168 - OCTOBER 2005 Receive Input Power Meters from rxin_a FIFO output I power meter 0 power meter 0 results power meter 1 power meter 1 results power meter 2 power meter 2 results power meter 3 power meter 3 results pmeter_iq0 Q from rxin_b FIFO output pmeter_iq1 from rxin_c FIFO output I Q I pmeter_iq2 Q from rxin_d FIFO output pmeter_iq3 I Q Four Receive Input RMS power meters are provided. For real inputs, the four power meters can be used to measure the RMS power of the combined carriers in each of the four input signals (the Q input is held at zero). For complex inputs, two power meters can be use to measure the combined complex power and two can be disabled. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 9 WWW.TI.COM AFE8406 PRODUCT PREVIEW 16 I 32 33 16 Q SLWS168 - OCTOBER 2005 58-bit Integrator RMS power 58-bit Register 32 clear 9-bit sync delay counter sync 21-bit interval counter 9 21-bit integration counter 21 delay (in 8 sample increments) transfer interrupt 21 interval (in 8 sample increments) integration (in 8 sample increments) interrupt interrupt interrupt sync delay integration time integration time interval time sync event integration start integration time interval time integration start integration start Power is calculated by squaring each 16 bit I (I and Q for complex inputs) sample, summing, and then integrating the summed-squared results into a 58 bit accumulator over a programmable integration period. The integration period is programmed into the 21 bit counter, in 8 sample increments. The power read is: 2 power = [ (I )x (Nx8 + 1) ] 2 2 power = [ (I + Q )x (Nx8 + 1) ] for real inputs where N is the integration count. for complex inputs where N is the integration count. A programmable 21 bit interval counter sets the power measurement interval (how often power will be measured) in 8 sample increments. A measurement integration period is started at the beginning of each interval period. The process begins with a sync event starting the 9 bit delay counter. After (8*sync_delay + 2) samples, the integration interval is started. Integration continues until the integration count is met, at which point the 58 bit integrator results are transferred to the read only register and an interrupt is generated. A new measurement period will start at the end of the interval period. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 10 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Note: Each of the four composite RMS power meter blocks has its own delay sync, interval, and integration period counters, as well as separate sync source registers. The 21-bit counters in 8 sample increments allow up to 104.8mS interval times at 160MHz clock. Programming Variable Description recv_pmeterX (57:0) 58 bit power measurement result. X= {0,1,2,3}. recv_pmeterX_sqr_sum(20:0) 21 bit integration (square and sum) period. X= {0,1,2,3}. recv_pmeterX_sync_delay(8:0) Power meter delay sync period. X= {0,1,2,3}. recv_pmeterX_strt_intrvl(20:0) 21 bit measurement interval. X= {0,1,2,3}. The strt_intrvl value must be greater than the sqr_sum value. 2.1.3 ssel_recv_pmeter_X(2:0) Sync source. X= {0,1,2,3}. pmeterX_iq selects complex power measurement input mode when set. X= {0,1,2,3}. recv_pmeterX_ena enables power meter when set. X= {0,1,2,3}. Receive Input AGC (RAGC) Input signals from the ADCs can be used to create a front end composite AGC loop when combined with a digitally controlled variable gain amplifier (DVGA) connected before the ADCs. The AGC system operates by integrating the square of the ADC samples over a programmable interval and applying a table driven error signal to a loop integrator based on the squared integration output. The error table maps the signal power to a user programmed error value. The loop integrator output is used to drive map tables to control the DVGA output pins and a gain adjustment multiplier. Fast updates can be enabled if desired, to cause the loop integrator to quickly adjust to interfering signals. The ADC input signals can also be passed through a high pass filter to remove DC offset before squaring the input. The programmable error table, integrator mapping tables, and clip thresholds, when combined with the user programmable interval timers provide a highly flexible AGC function. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 11 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 integrate and dump signal power measurement enable Samples from ADC FIFO corner 55 16 31 X2 Highpass Filter acc_offset 6 - acc_shift 6 shift & limit 0 1 7 128w x 8b ram 7 limit + Error Map Table {127..0} 8 update err_shift 5 sd_thresh signal detect mode controls Signal Level Detect error shift 64w x 22b ram loop accumulator no_signal 6 MSBs DVGA Map Table freeze control register bit freeze from sync source Gain Map Table clear control register bit clear sync source clip_error Mag 16 to DVGA pins 6 16 32 Clip Detect 16 delay adjust 16 clip_hi_thresh 16 clip_low_thresh clip detect controls 5 to DDC channels Delay sync update sync delay update interval The AGC measurement interval timer is a 24-bit timer initialized by a sync after a programmable 8-bit delay. During the integration interval, the squared input signal is shifted by the programmed value and accumulated. At the end of the interval time, an update pulse is generated, and the selected 7 bits of the 55-bit accumulated power is upper limit checked and transferred to the power holding register. A programmable offset is applied, and the following limit check produces a 7 bit address value for the error map table RAM. The user programmable error map table and following gain shift setting are used to determine the loop error signal to be added to the 32-bit AGC loop accumulator. The error value is only added to the loop accumulator once per update. The loop accumulator upper 6 MSBs are used as the address for the programmable DVGA map table and gain map table. The gain map table address can be delayed from 0 to 31 clock cycles to align DVGA changes to signal level changes at the output of the AGC. The AGC includes four sources for freezing the loop and holding the loop accumulator constant. A general sync source can be used to directly control the freeze; when the selected sync source is high, the AGC will be held, and when low, the AGC will operate. A control register bit freezes the AGC in the same fashion; when the bit is set, the AGC is held, and when cleared, the AGC will operate. A signal level detector is provided that can be used to automatically freeze the AGC loop in the event of input signal loss. A programmable signal detection threshold value, number of samples below the signal detection threshold, and window timer are used to determine when no signal is present. Finally, a programmable number of PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 12 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 AGC updates after sync can be programmed, and the AGC will he held until the next sync event. Freeze holds the loop accumulator constant, the integrate and dump accumulator constant and the interval timer constant. When freeze is released, the interval timer will resume counting. A sync event will always reinitialize the integrate and dump interval timer, and terminate the pending update to the loop accumulator from the current integrate and dump measurement interval. For example, if a sync event occurs during an integrate and dump interval, that interval will be terminated without updating the loop, and the integrate and dump accumulator will be cleared. After the programmed sync delay, a new interval will start. The AGC includes a dual threshold clip detect function, using two programmable 16-bit thresholds and programmable counters. The clip detector will cause immediate loop accumulator updates while the clip event is active. The 16-bit clip error value is aligned at the MSBs of the loop accumulator. Clip events are qualified when a programmed number of samples are above the high clip threshold during the programmable clip window time. For example, a clip event can be defined as 8 samples above the clip high threshold in a 256 sample window; the clip high threshold, the number of samples above the high clip threshold and the sample window time are programmable. Once the clip event has occurred, the clip duration is controlled by the clip low threshold value, clip low samples value and clip low timer. The clip event is cleared when the number of samples below the low clip threshold exceeds the programmed value within the clip low timer window. The clip low threshold, number of clip low samples and the clip low window timer are programmable. The AGC blocks can be paired together, rxin_a with rxin_b, and rxin_c with rxin_d, to produce a complex input AGC mode. The clip detector output from the rxin_b/d AGCs is logically OR’ed with the rxin_a/c clip detect outputs. The squared input function before the integrate and dump and signal level detector is 2 2 replaced with a I + Q power calculation. The accumulator MSBs from the rxin_a/c AGCs are connected to the rxin_c/d DVGA map table and gain map table inputs. This arrangement allows the AGCs to operate 2 2 in a direct conversion receiver system by controlling the I + Q complex signal level. The highpass filter is a 32 bit accumulator followed by an adjustable shift to control the corner frequency, a subtractor to remove the accumulated offset and a final limiter to produce a 16 bit result. The highpass filter function is enabled by setting hp_ena; clearing hp_ena holds the accumulator reset. 32 Samples from ADC FIFO - 16 hp_corner 3 17 shift & limit + hp_ena 16 17 16 limit Samples to X 2 block PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 13 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Programming Variable Description ragc_bypass_X Bypasses the entire receive AGC circuit when set. X = {0,1,2,3} hp_ena_X enables high pass filter when set hp_corner_X(2:0) adjusts the corner frequency of the high pass filter integ_interval_X(23:0) integrate and dump signal power measurement interval in samples. acc_shift_X(4:0) Shift down amount following the integrate and dump accumulator. acc_offset_X(5:0) offset value applied to the shifted integrate and dump output. ragc_sync_delay_X(7:0) AGC sync delay interval, from 1 to 256 samples. ssel_ragc_interval_X(2:0) Sync source selection for the interval timer. ssel_ragc_freeze_X(2:0) Sync source selection for AGC freeze ssel_ragc_clear_X(2:0) Sync source selection for the AGC loop accumulator clear ragc_freeze_X Register bit to freeze the AGC when set ragc_clear_X Register bit to clear the AGC accumulator when set ragc_update_X(7:0) Sets the number of updates per sync event, after which no further updates will occur until the next sync event. Program to 0x00 to continually update. sd_ena_X enables freezing the AGC with the signal detector when set sd_thresh_X(15:0) signal detection threshold for AGC channel X. This 16 bit word is lined up with bits 23 down to 8 of the square output. The smallest signal level is that can be programmed is therefor 16 LSBs on the ADC input, and the largest is 4095 LSBs at the ADC input. sd_samples_X(15:0) the number of samples below the signal detect threshold within the signal detect sample timer window required to freeze on the AGC. sd _timer_X(15:0) window timer to qualify signal detection. clip_hi_thresh_X(15:0) clip detector high threshold clip_lo_thresh_X(15:0) clip detector low threshold clip_hi_samples_X(7:0) a clip event is detected when this number of samples above the clip high threshold within the clip high sample timer window exceeds this value. clip_lo_samples_X(7:0) a clip event ends when this number of samples below the clip low threshold within the clip low sample timer window exceeds this value. clip_hi_timer_X(15:0) window timer to qualify clip events. clip_lo_timer_X(15:0) window timer to determine when the clip event ends. clip_error_X(15:0) error signal applied to the AGC accumulator when a clip event is active. This data is MSB aligned, and therefor can cause immediate changes to the accumulator. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 14 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Programming (continued) Variable Description ragc_error_map_X 128w x 8b memory holding the log to error look up table. dvga_map_X 64w x 6b memory holding the accumulator to DVGA look up table gain_map_X 64w x 16b memory holding the accumulator to GAIN look up table (256 decimal is unity gain) delay_adj_X(4:0) Delay between DVGA output updates and gain map updates to compensate for ADC pipeline delays, etc. err_s hift_X(4:0) error map table output shift up before adding to loop accumulator complex_01 enables complex AGC mode on inputs rxin_a and rxin_b when set complex_23 enables complex AGC mode on inputs rxin_c and rxin_d when set ragc_accum_X(31:0) 32-bit read only register holding the current contents of the loop accumulator. tristate(10:7) Tristate controls for the dvga_d/c/b/a output pins; pins are in tristate when the tristate bits are set. ragc_mpu_ram_read What set, the receive AGC map rams are readable via the MPU control interface. The AFE8406 signal path is not operational when this bit is set, it is intended for debug purposes only. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 15 WWW.TI.COM AFE8406 PRODUCT PREVIEW 2.1.4 SLWS168 - OCTOBER 2005 Test and Noise Signal Generator The test and noise generator can generate test signals replacing the rxin_a/b/c/d inputs as a tool for debug, evaluation and self test. Checksum generators included in the individual DDC channels at the outputs can be used in conjunction with the noise generator and the internal sync timer block to create the built in self test function. The test and noise signal source included in this block is a 23-bit linear feedback shift register (LFSR) with a fixed polynomial and fixed initialization state. A sync input is required to initialize the LFSR, and the sync source is connected to the ddc_counter output signal. sync adcclk_X LFSR lfsr(22:0) initialized on sync event - each of the four generators has a different seed 22 Receive Input Port rxin_a rxin_b rxin_c rxin_d 5 0 LFSR seed value, msb to lsb 100 0000 0000 0000 0001 0000 (0x400010) 010 0110 1110 0110 1100 1110 (0x26E6CE) 110 1110 1010 0010 1001 1000 (0x6EA298) 000 1011 0001 1110 1011 0111 (0x0B1EB7) PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 16 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 The 23-bit LFSR output signal if used to create a 16-bit “dout(15:0)” test signal using XOR combinations of the LFSR bits. lfsr(22) lfsr(20) lfsr(22) lfsr(16) lfsr(22) lfsr(15) lfsr(22) lfsr(14) lfsr(22) lfsr(13) lfsr(22) lfsr(12) lfsr(22) lfsr(11) lfsr(19) dout(15) lfsr(18) dout(14) lfsr(17) dout(13) lfsr(16) dout(12) lfsr(15) dout(11) lfsr(14) dout(10) lfsr(13) lfsr(12) lfsr(11) lfsr(10) dout(9) dout(8) dout(7) dout(6) dout(5) dout(4) dout(3) dout(2) dout(1) dout(0) To enable the test signal generator, the slf_tst_ena control bit should be set. The rxin_a/b/c/d signals will be then replaced by the four generator output streams. To use this test signal generator as a signal source for self test, the user must also set the adc_fifo_bypass control bit. Setting the adc_fifo_bypass control bit causes the adcclk_a/b/c/d input clocks to be internally replaced with rxclk/N, where N is as programmed with the rate_sel(1:0) control bits to {1,2,4 or 8}. The test signal generators can also output a programmable constant value. All four test signal generators output the same programmable constant value. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 17 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 16 rxin_a 16 data to FIFO for rxin_a 16 sync Test and Noise Generator 16 rxin_b 16 data to FIFO for rxin_b 16 Test and Noise Generator 16 rxin_c 16 data to FIFO for rxin_c 16 Test and Noise Generator 16 rxin_d 16 data to FIFO for rxin_d 16 Test and Noise Generator rduz_sens_ena slf_tst_ena The LFSR circuits can also be used to add noise to the rxin_a/b/c/d input signals by setting the rduz_sens_ena control register bit. The magnitude of the noise added can be adjusted by programming the nz_pwr_mask(15:0) control register. In the figure below, X = {a,b,c or d}. 16 rxin_X(15:0) lfsr(15:0) nz_pwr_mask(15:0) 16 to FIFO for rxin_X 16 16 16 16 XORs 16 ANDs lfsr(17) lfsr(16) rduz_sens_ena PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 18 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Programming Variable slf_tst_ena rduz_sens_ena nz_pwr_mask(15:0) adc_fifo_bypass ddc_counter(31:0) ddc_counter_width(7:0) ssel_ddc_counter(2:0) self_test_constant(17:0) self_test_const_ena 2.1.5 Description When set, the test signal generators replace the rxin_a/b/c/d input signals with internally generated psuedo random sequences. The fifo_bypass bit must be set when this bit is set. Enables the LFSR, adding noise to the ADC input data when set. Selects the power of the noise added to the ADC input data. When set, the FIFO is essentially bypassed, and the adcclk_a/b/c/d clock input ports are ignored. 32 bit general purpose counter interval 8 bit general purpose counter timeout width pulse Sync source selection for the general purpose counter 18-bit self test constant value applied to all 4 rxin_a/b/c/d inputs when self_test_const_ena is set. Enables the self test constant value for rxin_a/b/c/d Sample Delay Lines The four sample delay line blocks each consist of a 64 register memory and a state machine. The state machine uses a counter to control the write (input) pointer, and the programmed read offset register data to create the read (output) pointer. Programming larger read offset register values increases the effective delay at a resolution equal to the sample rate. The read offset registers, delay_line_X, are double buffered. Writes to these registers may occur anytime, but the actual values used by the circuit will not be updated until a delay line sync event occurs. Programming Variable delay_line_X(5:0) ssel_delay_line_X(2:0) Description Read offset into the 64 element memory for each delay line. X= {0,1,2,3}. Selects the sync source used to update the double buffered delay line register. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 19 WWW.TI.COM AFE8406 PRODUCT PREVIEW 2.1.6 SLWS168 - OCTOBER 2005 Test Bus When the test bus is enabled, the rxin_c(15:0) and rxin_d(15:0) ports become outputs, and the dvga_c and dvga_d pins are combined with these pins to allow 36 bit wide signals from the DDC channels and the receive input interface to be multiplexed to this test output port. Many of these sources are decimated to reduce the output sample rates. DDC0 MUX ddc_tst_sel(5:0) zeros pfir output cfir output tadj channel A tadj channel B nco sin nco cos cic output mixer i*cos & i*sin mixer q*cos & q*sin ddc mux channel A ddc mux channel B MUX DECIMATE tst_select(3:0) tst_decim17 tst_decim_delay (35:20) (19:18) (17:2) (1:0) tst_clk tst_aflag tst_sync rxin_d(15:0) dvga_c(3:2) rxin_c(15:0) dvga_c(5:4) dvga_c(1) dvga_d(5) dvga_c(0) DDC1 sync DDC2 DDC3 DDC4 DDC5 DDC6 DDC7 Receive Interface rxin_a & rxin_b FIFO outputs Programming Variable ssel_tst_decim(2:0) tst_decim_delay(3:0) tst_decim17 tst_on Description Selects the sync source for the testbus decimator Sets the testbus decimator delay from sync Not functional. Decimation is 32x regardless of setting. enables the test bus; rxin_c(15:0) and rxin_d(15:0) are changed from inputs to outputs, dvga_c(5:0) and dvga_d(5) are used as part of the test bus. tst_select(3:0) selects the source block for the testbus output; DDC0-7 or Receive Interface. ddc_tst_sel(5:0) selects the signal to be output from the DDC block tst_rate_sel(4:0) Sets the testbus output clock tst_clk period to (tst_rate_sel + 1) rxclk cycles. When the test bus source is set to the ADC FIFO, tst_rate_sel(4:0) must be set to 0 for an output. tst_clk_pol Selects the polarity of the test clock output at dvga_c(1) when the test bus is enabled; 0 for rising edge in the center of valid data, 1 for falling edge in the center PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 20 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 of valid data. No effect when tst_rate_sel is “00000”. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 21 WWW.TI.COM AFE8406 PRODUCT PREVIEW 2.2 SLWS168 - OCTOBER 2005 DDC Organization 18 18 18 18 4 to 2 (complex) or 4 to 1 (real) switch CDMA DDC A Output Interface or 1 UMTS DDC 4 to 2 (complex) or CDMA DDC B 4 to 1 (real) switch DDC0 DDC1 DDC2 DDC3 DDC4 DDC5 DDC6 DDC7 The AFE8406 provides downconversion for up to 8 UMTS receive channels, 16 CDMA2000 receive channels or 16 TD-SCDMA receive channels. Downconversion channels are organized into 8 DDC blocks. Each individual DDC block provides 2 CDMA2000 or 2 TD -SCDMA DDC channels, A and B, or 1 UMTS channel. Both CDMA DDC channels in a DDC block can be independently tuned, though they would likely be used as diversity pairs and tuned to the same frequency. Filter coefficients are shared between the two CDMA DDC channels within a block. Two adjacent DDC blocks (for example, DDC0 and DDC1) can be strapped together to form a single UMTS DDC channel with double-length final pulse shaping filtering. The AFE8406 can therefore provide 4 UMTS DDC channels with double-length final PFIR filtering as shown in the following diagram. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 22 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 4 UMTS DDCs with up to 128 tap PFIR 18 18 18 18 4 to 2 (complex) or 4 to 1 (real) switch CDMA DDC A Output Interface 4 to 2 (complex) or CDMA DDC B 4 to 1 (real) switch DDC0 DDC1 4 to 2 (complex) or 4 to 1 (real) switch CDMA DDC A or 1 UMTS DDC 4 to 2 (complex) or Output Interface CDMA DDC B 4 to 1 (real) switch DDC0 plus DDC1 DDC2 plus DDC3 DDC4 plus DDC5 DDC6 plus DDC7 Programming Variable ddc_ena cdma_mode gbl_ddc_write Description When set, turns on the DDC. When set, puts the DDC block in dual channel CDMA mode. When set, all subsequent programming (writes only) for DDC0 and DDC1 is also written to DDC2/4/6 and DDC3/5/7. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 23 WWW.TI.COM AFE8406 PRODUCT PREVIEW 2.2.1 SLWS168 - OCTOBER 2005 Downconverter Function Blocks from rx_distribution bus 18 18 18 18 4 to 2 Select Delay Adjust Frequency 32 Phase 16 NCO Zero Pad CFIR Filter Dec by 2 Six Stage CIC Filter Dec 4 to 32 PFIR Filter Dec by 1 Checksum Generator AGC RMS Power Measure Serial Interface serial I, Q up to 18-bits (25-bits with AGC disabled) parallel I, Q Each AFE8406 downconversion block can process two CDMA carriers or a single UMTS carrier. Signal data is selected from one of four ports for real inputs, or two of four ports for complex inputs. Data from the selected port(s) is multiplied with a complex, programmable numerically controlled oscillator (NCO) which tunes the signal of interest to baseband. The delay adjust and zero pad blocks permits adjustment of the delay in the end-to-end channel. Zero padding interpolates the signal to the rxclk rate. Filtering consists of a six stage CIC filter which decimates the tuned data by a factor from 4 to 32, a compensating FIR filter (CFIR) which decimates by a factor of two, followed by a programmable FIR filter (PFIR) which does not decimate. The output interface block can be programmed to decimate by 2 if desired. The RMS power meter measures the power within the channel’s bandwidth. The AGC automatically drives the gain and keeps the magnitude of the signal at a user-specified level. This allows fewer bits to represent the signal. The serial output interface formats and rounds the output data. Each of the above blocks is described in greater detail in the following sections. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 24 WWW.TI.COM AFE8406 PRODUCT PREVIEW 2.2.2 SLWS168 - OCTOBER 2005 DDC Mixer from rx_distribution bus 18 18 18 18 4 to 2 Select Demux and Round 18 18 18 18 18 18 IA QA IB QB to channel delay 20 20 cos sin mixer_gain from NCO The receive mixer translates the input (from one of the input signal sources) to baseband where subsequent filtering is performed to isolate the signal of interest. The mixer is a complex multiplier that accepts 18 bit I and 18 bit Q signal data from the receive input interface and 20 bit Sine and Cosine sequences from the NCO. The NCO generates a mixing frequency (sometimes referred to as a local oscillator, or LO) specified by the user so that the desired signal of interest is tuned to 0 Hertz. A DDC channel can support one UMTS signal directly, or two CDMA channels at half the input rate. When in CDMA mode each channel may set independently; the path selection and the mixer tuning and phase. The mixer output produces two complex streams; one representing the signal path for the A -side DDC, the other the B-side. Each of these streams drives a channel delay and zero pad block. The maximum input rate for UMTS is rxclk for either real or complex input data. The maximum input rate in CDMA mode with real inputs is rxclk (remix_only is set, see below). The maximum input rate in CDMA mode with complex inputs is rxclk/2 due to sharing of multiplier resources. Programming Variable ddcmux_sel_a(3:0) ddcmux_sel_b(3:0) remix_only zero_qsample ch_rate_sel(1:0) mixer_gain Description Programs the I and Q complex input data routing onto two of the four input ports for stream A of CDMA DDC Programs the I and Q complex input data routing onto two of the four input ports for stream B of CDMA DDC For CDMA mode only, set this bit for real input data at the rxclk rate. For complex inputs in CDMA mode, the maximum input data rate is rxclk/2, and this bit must be cleared. For CDMA mode with real inputs at the rxclk/2 rate or lower, this bit must be cleared When set, the Q samples used by the mixer are always zero. This bit should be set for real only inputs in UMTS mode, or real only inputs in CDMA mode when the input sample rate is rxclk/2 or lower. Specifies the input channel data rate (rxclk, rxclk/2, rxclk/4, or rxclk/8 MSPS). MUST BE SET THE SAME AS REGISTER rate_sel(1:0). When asserted, adds 6dB of gain in the mixer. This gain is highly recommended. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 25 WWW.TI.COM AFE8406 PRODUCT PREVIEW 2.2.3 SLWS168 - OCTOBER 2005 DDC Number Controlled Oscillator (NCO) Frequency Sync Frequency Word 32 Reg 32 Reg 32 23 23 Clear Aligned to top 32 bits Zero Phase Sync Phase Offset Sync 5 sin/cos table 20 cos 20 sin Aligned to bottom 5 bits Dither Generator Phase Offset 16 Reg 16 Dither Sync The NCO is a digital complex oscillator that is used to translate (or downconvert) an input signal of interest to baseband. The block produces programmable complex digital sinusoids by accumulating a frequency word which is programmed by the user. The output of the accumulator is a phase argument that indexes into a sin/cos ROM table which produces the complex sinusoid. A phase offset can be added prior to indexing if desired for channel calibration purposes. This will change the sin/cos phase with respect to other channels’ NCOs. A 5-bit dither generator is provided and generates a small level of digital pseudo-noise that is added to the phase argument below the bottom bits and is useful for reducing NCO spurious outputs. This dither generation is enabled by setting the dither_ena bit; the magnitude of the dither can be reduced by setting one or both of the dither_mask bits. Dither Programming Variable Description dither_ena dither_mask(1:0) When set turns dither on. Clearing turns dither off. Masks the MSB and MSB-1 dither bits, respectively, when set. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 26 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 The NCO spurious levels are better than –115 dBc. Added phase dither randomizes the periodic nature of the phase accumulation process and reduces low-level spurious energy. For some frequencies (K*Fs /24) dither is ineffective – in these cases an initial phase of 4 reduces NCO spurs. The figures below show the spur level performance of the NCO without dither, with dither, and with a phase offset value. a) Worst case spectrum without dither Figure 1. b) Spectrum with dither (tuned to same Frequency) Example NCO spurs with and without dithering a) Plot without dither or phase initialization Figure 2. b) Plot with dither and phase initialization NCO Peak Spur Plot The tuning frequency is specified as a 32 bit Frequency Word and is programmed as two sequential 16 bit 32 words over the control port. The NCO frequency resolution is simply the Fclk/ 2 , where Fclk is the ADCCLK frequency. As an example, at an input clock rate of 61.44 MHz, the frequency step size would be approximately 14 milli-Hertz. The Frequency Word is determined by the formula: 32 Frequency Word (in decimal)= 2 x Tuning Frequency / Fclk PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 27 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Note that frequency tuning words can be positive or negative valued. Specifying a positive frequency value translates negative frequencies upwards towards 0 Hertz. Specifying a negative tuning frequency translates positive frequencies downwards towards 0 Hertz. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 28 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Programming Variable phase_add_a(31:0) Description 32 bit tuning frequency word for the A-side DDC when in CDMA mode. Also for UMTS mode. 32 bit tuning frequency word for the B-side DDC when in CDMA mode. Not used in UMTS mode. phase_add_b(31:0) Each of the 12 CDMA DDC channels can be loaded with unique frequency words. The phase of the NCO’s Sin/Cos output can be adjusted relative to the phase of other channel NCOs by specifying a Phase Offset. The Phase Offset is programmed as a 16 bit word, yielding a step size of about 5.5 milliDegrees. The Phase Offset Word is determined by the formula: 16 x Offset_in_Degrees / 360 16 x Offset_in_Radians / 2p Phase Offset Word= 2 or, Phase Offset Word= 2 Programming Variable phase_offset_a(15:0) phase_offset_b(15:0) Description 16 bit phase offset word for the A-side DDC when in CDMA mode. Also for UMTS mode. 16 bit phase offset word for the B-side DDC when in CDMA mode. Not used in UMTS mode. Each of the 16 CDMA DDC blocks can be loaded with unique phase offset words. Various synchronization signals are available which are used to synchronize the NCOs of all channels with respect to each other. Frequency Sync and Phase Offset Sync determine when frequency and phase offset changes occur. For example, generating a Frequency Sync after programming the two frequency words will cause the NCO (or multiple NCOs) to change frequency at that time, rather than after each of the three frequency words is programmed over the control bus. The Zero Phase Sync signal is used to force the sine and cosine oscillators to their zero phase state. Dither Sync can be used to synchronize the dither generators of multiple NCOs. The NCOs used in the transmit section are identical to what is described for the receive section. Note that there is one set of sync’s provided for each DDC. When one DDC is used to process two CDMA signal the sync’s are shared between them. Sync Programming Variable ssel_nco(2:0) ssel_dither(2:0) ssel_freq(2:0) Description Sync source for NCO accumulator reset Sync source for NCO dither reset Sync source for NCO frequency register loading PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 29 WWW.TI.COM AFE8406 PRODUCT PREVIEW ssel_phase(2:0) 2.2.4 SLWS168 - OCTOBER 2005 Sync source for NCO phase register loading DDC Filtering and Decimation The purpose of the receive filter chain is to isolate the signal of interest (and reject all other others) that has been previously translated to baseband via the mixer and NCO. The overall decimation through the chain needs to be considered. The goal, generally, is to output the isolated signal at a rate that is twice (2X) the signal’s chip rate. For UMTS this would be 7.68 MSPS and for CDMA the output rate should be 2.4576 MSPS. TD-SCDMA systems require the output rate be the chip rate of 1.28 MSPS. The output interface is programmed to decimate by 2 for the TD-SCDMA case. Receive filtering and decimation is performed in several stages: - Zero padding to interpolate the input sample rate (if needed) up to the rxclk rate - High rate decimation (4 to 32) using a six stage cascade-integrate-comb filter (CIC) - Decimate by two compensation filtering using the programmable compensating FIR filter (CFIR) - Pulse-shape filtering via the programmable FIR filter (PFIR) with no decimation - Output interface, serial or parallel format, with no decimation or decimate by 2 From Mixer Delay Adjust Zero Pad Interp by {1,2,4,8} Six Stage CIC Filter Dec by {4 - 32} CFIR Filter Dec by 2 PFIR Filter no decimation Output Interface Dec by {1,2} The table below contains some examples of decimation and sample rates at the output of each block for UMTS, CDMA and TD -SCDMA standards at various supported input samples. For each example, the differential ADC clocks are provided to the AFE8406 at the input sample rate and the rxclk is provided at the zero pad output rate. Input Sample Rate (MSPS) rxclk(MHz) and Zero CIC Pad Output Zeros Rate DeciAdded (MSPS) mation CIC Output Rate (MSPS) CFIR Decimation CFIR Output Rate (MSPS) PFIR Decimation PFIR Output Rate (MSPS) Output Decimation UMTS UMTS 76.80 61.44 1 1 153.6 122.88 10 8 15.36 15.36 2 2 7.68 7.68 1 1 7.68 7.68 1 1 CDMA CDMA CDMA 78.6432 78.6432 61.44 0 1 1 78.6432 157.2864 122.88 16 32 25 4.9152 4.9152 4.9152 2 2 2 2.4576 2.4576 2.4576 1 1 1 2.4576 2.4576 2.4576 1 1 1 81.92 76.80 76.80 61.44 0 0 1 1 81.92 76.80 153.6 122.88 16 15 30 24 5.12 5.12 5.12 5.12 2 2 2 2 2.56 2.56 2.56 2.56 1 1 1 1 2.56 2.56 2.56 2.56 2 2 2 2 TD-SCDMA TD-SCDMA TD-SCDMA TD-SCDMA Note: The DDC output interfaces, both serial and parallel formats, can be programmed to decimate by 2. For the TD-SCDMA examples listed above, the DDC output rate is 1.28Msps (1x chip rate). PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 30 WWW.TI.COM AFE8406 PRODUCT PREVIEW 2.2.5 SLWS168 - OCTOBER 2005 DDC Channel Delay Adjust and Zero Insertion interpolation (number of zeros stuffed between samples) I input rate samples from Q Mixer read offset 18 Delay Memory I:8 slots x 18-bits Q:8 slots x 18-bits 18 3 18 18 Zero Pad 18 I 18 Q full rxclk rate samples to CIC Filter 3 sync (offset registers) sync (zero stuff moment) insert offset 3 The Receive Channel Delay Adjust function is used to add programmable delays in the channel downconvert path. Adjusting channel delay can be used to compensate for analog elements external to the AFE8406 digital downconversion such as cables, splitters, analog downconverters, filters, etc. The Delay Memory block consists of an 8 register memory and a state machine. The state machine uses a counter to control the write (input) pointer, and the programmed read offset register data to create a read (output) pointer. Programming larger read offset register values increases the effective delay at a resolution equal to the input sample rate. The Zero Pad block is used in conjunction with the Delay Memory for delay adjustments. For example, with input rates of rxclk/8, the Zero Pad block interpolates the input data to rxclk by inserting 7 zeros. The Zero Pad’s sync insert offset 3-bit control specifies when the zeros are inserted relative to the Sync signal. This permits a fine adjustment at the rxclk resolution. The read offset register, tadf_offset_course_a/b, and the insert offset register, tadj_offset_fine_a/b, are double buffered. Writes to these registers may occur anytime, but the actual values used by the circuit will not be updated until a register sync . PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 31 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Programming Variable tadj_offset_coarse_a(2:0) tadj_offset_coarse_b(2:0) tadj_offset_fine_a(2:0) tadj_offset_fine_b(2:0) tadj_interp(2:0) ssel_tadj_fine(2:0) ssel_tadj_reg(2:0) 2.2.6 Description Read offset into the 8 element memory for the UMTS or CDMA mode A channel DDC. Read offset into the 8 element memory for the CDMA mode B channel DDC when in CDMA mode. Controls the zero pad (or stuff) insert offset (fine adjust) for the UMTS or CDMA mode A channel of the DDC. Controls the zero pad (or stuff) insert offset (fine adjust) for the CDMA mode B channel of the DDC when in CDMA mode. The interpolation value (1, 2, 4, or 8). Same used for both the A and B channels when in CDMA mode. Selects the number of zeros to be inserted. Selects the sync source for the fine time adjust zero stuff moment. Same for A and B channels when in CDMA mode. Selects the sync source used to update the double buffer course and fine delay selection registers. Same for A and B channels when in CDMA mode. DDC CIC Filter Shift 18 Z -1 N Z -1 Z - m1 Z Z -m 2 -1 Z Z -1 -m 3 Z Z -m 4 -1 Z Z -m 5 Z -1 54 24 -m 6 24 Decimate by 4-32 Sh ift 0-3 1 Round & L imit 18 m1, m2, m3 , m 4, m5, m6 = 1 or 2 The CIC filter provides the first stage of filtering and large-value decimation. The filter consists of six stages and decimates over a range from 4 to 32. I data and Q data are handled separately with two CIC filters. In addition, when in CDMA mode (two CDMA channels processed within a single DDC), another pair of CIC filters handles the B-side channel. The filter response is 6*(Sin(x)/x) in character where the key attribute is that the resulting response nulls reject signal aliases from decimation. A consequence of this desirable behavior is that only a small portion of the passband can be used, less than 25% generally. This means that the CIC decimation value should be chosen so that the signal exiting the CIC filter is oversampled by at least a factor of four. The filter is equivalent to 6 stages of a FIR filter with uniform coefficients (6 combined boxcar filter stages). Each filter would be of length N if m=1, or 2N if m=2. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 32 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 The filter is made up of six banks of 54 bit accumulator sections followed by six banks of 24 bit subtractor sections. Each of the subtractor sections can be independently programmed with a differential delay of either one or two. A shift block follows the last integration stage and can shift the 54 bit accumulated data down by 36-rcic_shift (a programmable factor from 0 to 31 bits). The CIC filter exhibits a droop across its frequency response. The following CFIR filter compensates for the CIC droop with a gradually rising frequency response. It is also possible to compensate for CIC droop in the PFIR filter. The gain of the receive CIC filter is: 6 (number of stages where M=2) Ncic * 2 (-36+RCIC_SHIFT) *2 where RCIC_SHIFT is 0 to 31. There is no rollover protection internal to the CIC or at the final round so the user must guarantee no sample exceeds full scale prior to rounding. For practical purposes this means the CIC gain can only compensate for peak gain less than one or must be less than or equal to one. A fixed gain of +12 dB at the output of the CIC can also be programmed. Programming Variable cic_decim(4:0) cic_scale_a(4:0) cic_scale_b(4:0) cic_gain_ddc cic_m2_ena_a(5:0) cic_m2_ena_b (5:0) cic_bypass ssel_cic(2:0) 2.2.7 Description The CIC decimation ratio (4 to 32). The ratio is cic_decim + 1. This ratio applies to both A and B channels of the DDC block in CDMA mode. The shift value for the A channel. A value of 0 is no shift, each increment in value increases the amplitude of the shifter output by a factor of 2. The shift value for the B channel. A value of 0 is no shift, each increment in value increases the amplitude of the s hifter output by a factor of 2. When asserted, adds a gain of 12 dB at the CIC output. Sets the differential delay value M for each of the CIC subtractor stages for the UMTS or CDMA mode A channel. Sets the differential delay value M for each of the CIC subtractor stages for the CDMA mode B channel. Bypasses the CIC filter when set, for factory use only. Sets syncing (1 of 8 sources) for the CIC decimation moment. DDC Compensating FIR Filter The receive compensating FIR filter (CFIR) decimates the output of the CIC filter by a fixed factor of two. Filter coefficient size, input data size, and output data size are 18 bits. The CFIR length can be programmed. This permits “turning off” taps and saving power if shorter filters are appropriate (the CFIR power dissipation is proportional to its length). The filter is organized in two partial filter blocks, each containing a data RAM, a coefficient RAM and a dual multiplier, a common state machine and output accumulator. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 33 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 MPU control interface read data write data write pointer COEF RAM 32x18 mpu ram_read COEF RAM 32x18 MUX reg complex output samples read pointer complex input samples DATA RAM 64x36 DATA RAM 64x36 write pointer read pointer crastarttap State Machine output sample valid The maximum CFIR filter length is a function of AFE8406 rxclk clock rate, output sample rate and the number of coefficient memory registers. The maximum number of taps is 64 and the minimum number is 14. Lengths between these limits can be specified in increments of 2. Subject to the above minimum and maximum values, in the general case, the number of taps available is: UMTS Mode: 2 * (rxclk ÷ output sample rate) CDMA Mode if cic_decim is even (decimating by an odd number): 2 * (cic_decim) CDMA Mode if cic_decim is odd (decimating by an even number): 2 * (cic_decim + 1) PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 34 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Example CFIR filter lengths available based on mode and rxclk frequency: Mode UMTS UMTS CDMA CDMA CDMA CDMA CDMA CDMA rxclk (MHz) 153.60 122.88 157.2864 122.88 78.6432 153.60 81.92 76.80 CIC decimation 10 8 32 25 16 30 16 15 CFIR max length 40 32 64 48 32 60 32 28 CFIR min length 14 14 14 14 14 14 14 14 comments UMTS UMTS CDMA2000 CDMA2000 CDMA2000 low power configuration TD-SCDMA TD-SCDMA TD-SCDMA low power configuration A single set of programmed tap values are used for both the A-side and B-side DDC channels (two CDMA channels) within a single DDC block when in CDMA mode. After the CFIR filter performs the convolution, gain is applied at full precision, the signal is rounded, and then hard limited. A shifter at the output of the filter then scales the data by either 2e-19 or 2e-18. The gain through the filter is therefore: Sum(CFIR coefficients) * 2 -(18 or 19) Coefficients are organized in two groups of 32 words, each 18 bits wide. For fully utilized filters, the 64 coefficients are loaded 0 through 31 into the first RAM, and 32 through 63 into the second RAM. The 16 bit MSBs and 2 bit LSBs are written into the RAMs using different page register values. Shorter filters require the coefficients be loaded into the 2 rams equally, starting from address 0. For example, a CFIR coefficient set for a symmetric 58 tap TD -SCDMA CFIR is taps 0 = 57 1 = 56 2 = 55 3 = 54 4 = 53 5 = 52 6 = 51 7 = 50 8 = 49 9 = 48 10 = 47 11 = 46 12 = 45 13 = 44 14 = 43 Coefficient -13 -20 14 101 184 133 -147 -562 -768 -364 719 1905 2126 567 -2416 taps 15 = 42 16 = 41 17 = 40 18 = 39 19 = 38 20 = 37 21 = 36 22 = 35 23 = 34 24 = 33 25 = 32 26 = 31 27 = 30 28 = 29 Coefficient -4975 -4649 -232 6581 11266 8917 -1957 -16736 -25469 -17599 11560 56455 102215 131071 The first 29 coefficients are loaded into addresses 0 through 28 in the first coefficient RAM, and the remaining 29 are loaded into addresses 0 through 28 in the second coefficient RAM. Loading the 18 bit coefficients requires 2 writes per coefficient, one for the upper 16 bits and another for the lower 2 bits. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 35 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 To program this coefficient set for the DDC2 CFIR, the following control microprocessor interface sequence would be used. Step 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 Address a[5:0] 0x21 0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1A 0x1B 0x1C 0x1D 0x1E 0x1F 0x21 0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F Data d[15:0] 0x0480 0x0003 0x0000 0x0002 0x0001 0x0000 0x0001 0x0001 0x0002 0x0000 0x0000 0x0003 0x0001 0x0002 0x0003 0x0000 0x0001 0x0003 0x0000 0x0001 0x0002 0x0001 0x0003 0x0000 0x0003 0x0001 0x0000 0x0003 0x0003 0x0003 0x0000 0x0000 0x0000 0x04A0 0x0003 0x0003 0x0003 0x0000 0x0001 0x0003 0x0000 0x0003 0x0001 0x0002 0x0001 0x0000 0x0003 0x0001 0x0000 0x0003 Description Page register for DDC2 CFIR Coefficient RAM 0-31, LSBs. 2 lower bits of coefficient 0 2 lower bits of coefficient 1 2 lower bits of coefficient 2 2 lower bits of coefficient 3 2 lower bits of coefficient 4 2 lower bits of coefficient 5 2 lower bits of coefficient 6 2 lower bits of coefficient 7 2 lower bits of coefficient 8 2 lower bits of coefficient 9 2 lower bits of coefficient 10 2 lower bits of coefficient 11 2 lower bits of coefficient 12 2 lower bits of coefficient 13 2 lower bits of coefficient 14 2 lower bits of coefficient 15 2 lower bits of coefficient 16 2 lower bits of coefficient 17 2 lower bits of coefficient 18 2 lower bits of coefficient 19 2 lower bits of coefficient 20 2 lower bits of coefficient 21 2 lower bits of coefficient 22 2 lower bits of coefficient 23 2 lower bits of coefficient 24 2 lower bits of coefficient 25 2 lower bits of coefficient 26 2 lower bits of coefficient 27 2 lower bits of coefficient 28 2 lower bits of unused coefficient RAM location 2 lower bits of unused coefficient RAM location 2 lower bits of unused coefficient RAM location Page register for DDC2 CFIR Coefficient RAM 32-63, LSBs. 2 lower bits of coefficient 29 2 lower bits of coefficient 30 2 lower bits of coefficient 31 2 lower bits of coefficient 32 2 lower bits of coefficient 33 2 lower bits of coefficient 34 2 lower bits of coefficient 35 2 lower bits of coefficient 36 2 lower bits of coefficient 37 2 lower bits of coefficient 38 2 lower bits of coefficient 39 2 lower bits of coefficient 40 2 lower bits of coefficient 41 2 lower bits of coefficient 42 2 lower bits of coefficient 43 2 lower bits of coefficient 44 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 36 WWW.TI.COM AFE8406 PRODUCT PREVIEW 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1A 0x1B 0x1C 0x1D 0x1E 0x1F 0x21 0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1A 0x1B 0x1C 0x1D 0x1E 0x1F 0x21 0x00 0x01 0x02 0x03 0x04 0x0002 0x0001 0x0003 0x0000 0x0000 0x0002 0x0001 0x0001 0x0000 0x0001 0x0002 0x0000 0x0003 0x0000 0x0000 0x0000 0x04C0 0xFFFC 0xFFFB 0x0003 0x0019 0x002E 0x0021 0xFFDB 0xFF73 0xFF40 0xFFA5 0x00B3 0x01DC 0x0213 0x008D 0xFDA4 0xFB24 0xFB75 0xFFC6 0x066D 0x0B00 0x08B5 0xFE16 0xEFA8 0xE720 0xEED0 0x0B4A 0x3721 0x63D1 0x7FFF 0x0000 0x0000 0x0000 0x04E0 0x7FFF 0x63D1 0x3721 0x0B4A 0xEED0 SLWS168 - OCTOBER 2005 2 lower bits of coefficient 45 2 lower bits of coefficient 46 2 lower bits of coefficient 47 2 lower bits of coefficient 48 2 lower bits of coefficient 49 2 lower bits of coefficient 50 2 lower bits of coefficient 51 2 lower bits of coefficient 52 2 lower bits of coefficient 53 2 lower bits of coefficient 54 2 lower bits of coefficient 55 2 lower bits of coefficient 56 2 lower bits of coefficient 57 2 lower bits of unused coefficient RAM location 2 lower bits of unused coefficient RAM location 2 lower bits of unused coefficient RAM location Page register for DDC2 CFIR Coefficient RAM 0-31, MSBs. Upper 16 bits of coefficient 0 Upper 16 bits of coefficient 1 Upper 16 bits of coefficient 2 Upper 16 bits of coefficient 3 Upper 16 bits of coefficient 4 Upper 16 bits of coefficient 5 Upper 16 bits of coefficient 6 Upper 16 bits of coefficient 7 Upper 16 bits of coefficient 8 Upper 16 bits of coefficient 9 Upper 16 bits of coefficient 10 Upper 16 bits of coefficient 11 Upper 16 bits of coefficient 12 Upper 16 bits of coefficient 13 Upper 16 bits of coefficient 14 Upper 16 bits of coefficient 15 Upper 16 bits of coefficient 16 Upper 16 bits of coefficient 17 Upper 16 bits of coefficient 18 Upper 16 bits of coefficient 19 Upper 16 bits of coefficient 20 Upper 16 bits of coefficient 21 Upper 16 bits of coefficient 22 Upper 16 bits of coefficient 23 Upper 16 bits of coefficient 24 Upper 16 bits of coefficient 25 Upper 16 bits of coefficient 26 Upper 16 bits of coefficient 27 Upper 16 bits of coefficient 28 Upper 16 bits of unused coefficient RAM location Upper 16 bits of unused coefficient RAM location Upper 16 bits of unused coefficient RAM location Page register for DDC2 CFIR Coefficient RAM 32-63, MSBs. Upper 16 bits of coefficient 29 Upper 16 bits of coefficient 30 Upper 16 bits of coefficient 31 Upper 16 bits of coefficient 32 Upper 16 bits of coefficient 33 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 37 WWW.TI.COM AFE8406 PRODUCT PREVIEW 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1A 0x1B 0x1C 0x1D 0x1E 0x1F 0x21 0x00 0x01 0xE720 0xEFA8 0xFE16 0x08B5 0x0B00 0x066D 0xFFC6 0xFB75 0xFB24 0xFDA4 0x008D 0x0213 0x01DC 0x00B3 0xFFA5 0xFF40 0xFF73 0xFFDB 0x0021 0x002E 0x0019 0x0003 0xFFFB 0xFFFC 0x0000 0x0000 0x0000 0x0500 0x8EE0 0x2000 SLWS168 - OCTOBER 2005 Upper 16 bits of coefficient 34 Upper 16 bits of coefficient 35 Upper 16 bits of coefficient 36 Upper 16 bits of coefficient 37 Upper 16 bits of coefficient 38 Upper 16 bits of coefficient 39 Upper 16 bits of coefficient 40 Upper 16 bits of coefficient 41 Upper 16 bits of coefficient 42 Upper 16 bits of coefficient 43 Upper 16 bits of coefficient 44 Upper 16 bits of coefficient 45 Upper 16 bits of coefficient 46 Upper 16 bits of coefficient 47 Upper 16 bits of coefficient 48 Upper 16 bits of coefficient 49 Upper 16 bits of coefficient 50 Upper 16 bits of coefficient 51 Upper 16 bits of coefficient 52 Upper 16 bits of coefficient 53 Upper 16 bits of coefficient 54 Upper 16 bits of coefficient 55 Upper 16 bits of coefficient 56 Upper 16 bits of coefficient 57 Upper 16 bits of unused coefficient RAM location Upper 16 bits of unused coefficient RAM location Upper 16 bits of unused coefficient RAM location Page register for DDC2 control registers 0-31 DDC2 FIR_MODE register; cdma_mode enabled, 60 tap PFIR, 58 tap CFIR DDC2 PFIR gain = sum(taps)*2^-18 and CFIR gain = sum(taps)*2^-19 Programming Variable crastarttap_cfir(4:0) Description Number of DDC CFIR filter taps is 2*(crastarttap + 1) mpu_ram_read What set, the PFIR and CFIR coefficient rams are readable via the MPU control interface. The AFE8406 signal path is not operational when this bit is set, it is intended for debug purposes only. 0= 2e-19, 1= 2e-18 cfir_gain The CFIR filter’s 18 bit coefficients are loaded in two 32 word memories. Note: CFIR filter coefficients are shared between A and B channels of a DDC block in CDMA mode. 2.2.8 DDC Programmable FIR Filter The receive programmable FIR filter (PFIR) provides final pulse shaping of the baseband signal data. It does not perform any decimation. Filter coefficient size, input, and output data size is 18 bits. A special strapped mode can be employed for UMTS where two adjacent DDCs (2k & 2k+1, k=0 to 3) can be PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 38 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 combined to yield a filter with twice the number of coefficients. This means the AFE8406 can support 4 UMTS DDC channels with double-length filter coefficients (up to 128 taps). The filter is organized in four partial filter blocks, each containing a data RAM, a coefficient RAM and a dual multiplier, a common state machine and output accumulator. MPU control interface read data write data write pointer Filter cell 1 cell 2 cell 3 cell 4 COEF RAM 16x18 mpu ram_read MUX reg read pointer from adjacent DDC (if double_tap=“10”) complex input samples from cfir (or adjacent DDC if double_tap=“01”) to adjacent DDC (if double_tap =“10”) DATA RAM 32x36 read pointer write pointer crastarttap complex output samples State Machine output sample valid The PFIR length is programmable. This permits turning off taps and saving power if short filters are appropriate. The filter’s output data can be shifted over a range of 0 to 7 bits where it is then rounded and hard limited to 18 bits. The shift range results in a gain that ranges from 2e-19 to 2e-12. -shift The gain of the PFIR block is: sum(coefficients) * 2 , where shift ranges from 12 to 19. The maximum PFIR filter length is a function of AFE8406 clock rate and output sample rate and is limited by the number of coefficient memory registers. The maximum number of taps is 64 and the minimum number is 32 (for both CDMA and UMTS). Lengths between these limits can be specified in increments of 4. For strapped UMTS with double length filters, the range of taps available is 64 to 128 in increments of 8 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 39 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Subject to the above minimum and maximum values, the number of maximum taps available is: UMTS Mode: 4 * (rxclk ÷ output sample rate) Strapped UMTS Mode: 8 * (rxclk ÷ output sample rate) CDMA Mode: 2 * (rxclk ÷ output sample rate) PFIR coefficients and gain shift values are shared between both A and B CDMA channels in a DDC block. Example PFIR filter lengths available based on mode and rxclk frequency: Mode UMTS UMTS UMTS rxclk (MHz) 153.60 122.88 153.60 CIC decimation 10 8 10 PFIR max length 64 64 128 PFIR min length 32 32 64 UMTS 122.88 8 128 64 CDMA CDMA CDMA CDMA CDMA CDMA 157.2864 122.88 78.6432 153.60 81.92 76.80 32 25 16 30 16 15 64 64 64 64 64 60 32 32 32 32 32 32 comments UMTS, 1 to 8 DDC channels UMTS, 1 to 8 DDC channels Strapped UMTS double length PFIR configuration; 1 to 4 DDC channels. Strapped UMTS double length PFIR configuration; 1 to 4 DDC channels. CDMA2000 CDMA2000 CDMA2000 low power configuration TD-SCDMA TD-SCDMA TD-SCDMA low power configuration Coefficients are organized in four groups of 16 words, each 18 bits wide. For fully utilized filters, the 64 coefficients are loaded 0 through 31 into the first and second RAMs, and 32 through 63 into the third and fourth RAMs. The 16 bit MSBs and 2 bit LSBs are written into the RAMs using different page register values. Shorter filters require the coefficients be loaded into the 4 rams equally, starting from address 0 and address 16. For example, a PFIR coefficient set for a symmetric 60 tap TD -SCDMA PFIR is taps 0 = 59 1 = 58 2 = 57 3 = 56 4 = 55 5 = 54 6 = 53 7 = 52 8 = 51 9 = 50 10 = 49 11 = 48 12 = 47 13 = 46 14 = 45 Coefficient -2 1 4 -8 -2 21 -13 -28 46 1 -85 96 82 -266 38 taps 15 = 44 16 = 43 17 = 42 18 = 41 19 = 40 20 = 39 21 = 38 22 = 37 23 = 36 24 = 35 25 = 34 26 = 33 27 = 32 28 = 31 29 = 30 Coefficient 420 -331 -319 744 -440 -1005 2389 514 -6182 1845 12959 -8691 -27246 34166 131071 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 40 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 The first 15 coefficients are loaded into addresses 0 through 14 in the first coefficient RAM, the second group of 15 are loaded into addresses 16 through 30 corresponding to the second coefficient RAM, the third group of 15 are loaded into the third coefficient ram at addresses 0 through 14, and the fourth group of 15 are loaded into addresses 16 through 30 in the fourth coefficient RAM. Loading the 18 bit coefficients requires 2 writes per coefficient, one for the upper 16 bits and another for the lower 2 bits. To program this coefficient set for the DDC2 PFIR, the following control microprocessor interface sequence would be used. Step 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 Address a[5:0] 0x21 0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1A 0x1B 0x1C 0x1D 0x1E 0x1F 0x21 0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 Data d[15:0] 0x0400 0x0002 0x0001 0x0000 0x0000 0x0002 0x0001 0x0003 0x0000 0x0002 0x0001 0x0003 0x0000 0x0002 0x0002 0x0002 0x0000 0x0000 0x0001 0x0001 0x0000 0x0000 0x0003 0x0001 0x0002 0x0002 0x0001 0x0003 0x0001 0x0002 0x0002 0x0003 0x0000 0x0420 0x0003 0x0002 0x0002 0x0001 0x0003 0x0001 0x0002 0x0002 0x0001 Description Page register for DDC2 PFIR Coefficient RAMs 0-15 and 16-31, LSBs. 2 lower bits of coefficient 0 2 lower bits of coefficient 1 2 lower bits of coefficient 2 2 lower bits of coefficient 3 2 lower bits of coefficient 4 2 lower bits of coefficient 5 2 lower bits of coefficient 6 2 lower bits of coefficient 7 2 lower bits of coefficient 8 2 lower bits of coefficient 9 2 lower bits of coefficient 10 2 lower bits of coefficient 11 2 lower bits of coefficient 12 2 lower bits of coefficient 13 2 lower bits of coefficient 14 2 lower bits of unused coefficient RAM location 2 lower bits of coefficient 15 2 lower bits of coefficient 16 2 lower bits of coefficient 17 2 lower bits of coefficient 18 2 lower bits of coefficient 19 2 lower bits of coefficient 20 2 lower bits of coefficient 21 2 lower bits of coefficient 22 2 lower bits of coefficient 23 2 lower bits of coefficient 24 2 lower bits of coefficient 25 2 lower bits of coefficient 26 2 lower bits of coefficient 27 2 lower bits of coefficient 28 2 lower bits of coefficient 29 2 lower bits of unused coefficient RAM location Page register for DDC2 PFIR Coefficient RAMs 32-47 and 48-63, LSBs. 2 lower bits of coefficient 30 2 lower bits of coefficient 31 2 lower bits of coefficient 32 2 lower bits of coefficient 33 2 lower bits of coefficient 34 2 lower bits of coefficient 35 2 lower bits of coefficient 36 2 lower bits of coefficient 37 2 lower bits of coefficient 38 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 41 WWW.TI.COM AFE8406 PRODUCT PREVIEW 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1A 0x1B 0x1C 0x1D 0x1E 0x1F 0x21 0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1A 0x1B 0x1C 0x1D 0x1E 0x0003 0x0000 0x0000 0x0001 0x0001 0x0000 0x0000 0x0002 0x0002 0x0002 0x0000 0x0003 0x0001 0x0002 0x0000 0x0003 0x0001 0x0002 0x0000 0x0000 0x0001 0x0002 0x0000 0x0440 0xFFFF 0x0000 0x0001 0xFFFE 0xFFFF 0x0005 0xFFFC 0xFFF9 0x000B 0x0000 0xFFEA 0x0018 0x0014 0xFFBD 0x0009 0x0000 0x0069 0xFFAD 0xFFB0 0x00BA 0xFF92 0xFF04 0x0255 0x0080 0xF9F6 0x01CD 0x0CA7 0xF783 0xE564 0x215D 0x7FFF SLWS168 - OCTOBER 2005 2 lower bits of coefficient 39 2 lower bits of coefficient 40 2 lower bits of coefficient 41 2 lower bits of coefficient 42 2 lower bits of coefficient 43 2 lower bits of coefficient 44 2 lower bits of unused coefficient RAM location 2 lower bits of coefficient 45 2 lower bits of coefficient 46 2 lower bits of coefficient 47 2 lower bits of coefficient 48 2 lower bits of coefficient 49 2 lower bits of coefficient 50 2 lower bits of coefficient 51 2 lower bits of coefficient 52 2 lower bits of coefficient 53 2 lower bits of coefficient 54 2 lower bits of coefficient 55 2 lower bits of coefficient 56 2 lower bits of coefficient 57 2 lower bits of coefficient 58 2 lower bits of coefficient 59 2 lower bits of unused coefficient RAM location Page register for DDC2 PFIR Coefficient RAMs 0-15 and 16-31, MSBs. Upper 16 bits of coefficient 0 Upper 16 bits of coefficient 1 Upper 16 bits of coefficient 2 Upper 16 bits of coefficient 3 Upper 16 bits of coefficient 4 Upper 16 bits of coefficient 5 Upper 16 bits of coefficient 6 Upper 16 bits of coefficient 7 Upper 16 bits of coefficient 8 Upper 16 bits of coefficient 9 Upper 16 bits of coefficient 10 Upper 16 bits of coefficient 11 Upper 16 bits of coefficient 12 Upper 16 bits of coefficient 13 Upper 16 bits of coefficient 14 Upper 16 bits of unused coefficient RAM location Upper 16 bits of coefficient 15 Upper 16 bits of coefficient 16 Upper 16 bits of coefficient 17 Upper 16 bits of coefficient 18 Upper 16 bits of coefficient 19 Upper 16 bits of coefficient 20 Upper 16 bits of coefficient 21 Upper 16 bits of coefficient 22 Upper 16 bits of coefficient 23 Upper 16 bits of coefficient 24 Upper 16 bits of coefficient 25 Upper 16 bits of coefficient 26 Upper 16 bits of coefficient 27 Upper 16 bits of coefficient 28 Upper 16 bits of coefficient 29 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 42 WWW.TI.COM AFE8406 PRODUCT PREVIEW 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 0x1F 0x21 0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1A 0x1B 0x1C 0x1D 0x1E 0x1F 0x21 0x00 0x01 0x0000 0x0460 0x7FFF 0x215D 0xE564 0xF783 0x0CA7 0x01CD 0xF9F6 0x0080 0x0255 0xFF04 0xFF92 0x00BA 0xFFB0 0xFFAD 0x0069 0x008D 0x0009 0xFFBD 0x0014 0x0018 0xFFEA 0x0000 0x000B 0xFFF9 0xFFFC 0x0005 0xFFFF 0xFFFE 0x0001 0x0000 0xFFFF 0x0000 0x0500 0x8EE0 0x2000 SLWS168 - OCTOBER 2005 Upper 16 bits of unused coefficient RAM location Page register for DDC2 PFIR Coefficient RAMs 32-47 and 48-63, MSBs. Upper 16 bits of coefficient 30 Upper 16 bits of coefficient 31 Upper 16 bits of coefficient 32 Upper 16 bits of coefficient 33 Upper 16 bits of coefficient 34 Upper 16 bits of coefficient 35 Upper 16 bits of coefficient 36 Upper 16 bits of coefficient 37 Upper 16 bits of coefficient 38 Upper 16 bits of coefficient 39 Upper 16 bits of coefficient 40 Upper 16 bits of coefficient 41 Upper 16 bits of coefficient 42 Upper 16 bits of coefficient 43 Upper 16 bits of coefficient 44 Upper 16 bits of unused coefficient RAM location Upper 16 bits of coefficient 45 Upper 16 bits of coefficient 46 Upper 16 bits of coefficient 47 Upper 16 bits of coefficient 48 Upper 16 bits of coefficient 49 Upper 16 bits of coefficient 50 Upper 16 bits of coefficient 51 Upper 16 bits of coefficient 52 Upper 16 bits of coefficient 53 Upper 16 bits of coefficient 54 Upper 16 bits of coefficient 55 Upper 16 bits of coefficient 56 Upper 16 bits of coefficient 57 Upper 16 bits of coefficient 58 Upper 16 bits of coefficient 59 Upper 16 bits of unused coefficient RAM location Page register for DDC2 control registers 0-31 DDC2 FIR_MODE register; cdma_mode enabled, 60 tap PFIR, 58 tap CFIR DDC2 PFIR gain = sum(taps)*2^-18 and CFIR gain = sum(taps)*2^-19 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 43 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Programming Variable crastarttap_pfir(4:0) cdma_mode mpu_ram_read pfir_gain(2:0) double_tap(1:0) Description Number of DDC PFIR filter taps is 4*(crastartap+1) For double length PFIR the number of taps is 8*(crastartap+1) When set, puts the CFIR & PFIR blocks in CDMA mode. What set, the PFIR and CFIR coefficient rams are readable via the MPU control interface. The AFE8406 signal path is not operational when this bit is set, it is intended for debug purposes only. Sets the gain of the PFIR filter. The range is from 2e-19 to 2e-12; “000”= 2e-19 and “111”= 2e -12 When set, puts two adjacent DDC (2k & 2k+1, k=0 to 3) in double length (from 64 to128 tap) UMTS mode. Set to “00” for normal mode. In double tap mode, data out of the last PFIR ram in the main DDC (DDC0, DDC2, DDC4 or DDC6) is sent to the adjacent secondary DDC (DDC1, DDC3, DDC5 or DDC7) PFIR as input thus forming a 128-tap delay line. Data received from the adjacent PFIR summers is added into the Main DDC’s PFIR sum to form the final output. When using double tap mode, set double_tap to “10” for the main DDC, and to “01” for the secondary DDC. When in double tap mode, the first half of the coefficients should be loaded into the main DDC (DDC0, DDC2, DDC4 or DDC6), the remaining coefficients are loaded into the secondary DDC (DDC1, DDC3, DDC5 or DDC7). In double tap mode, the main DDC must be turned on (ddc_ena=1), and the secondary DDC must be turned off (ddc_ena=0). The PFIR filter’s 18 bit coefficients are loaded in four 16 word memories. Note: PFIR filter coefficients are shared between A and B channels of a DDC block when in CDMA mode. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 44 WWW.TI.COM AFE8406 PRODUCT PREVIEW 2.2.9 SLWS168 - OCTOBER 2005 DDC RMS Power Meter 18 I 36 37 18 Q 55-bit Integrator RMS power 55-bit Register 36 clear 8-bit sync delay counter sync 18-bit interval counter 8 18-bit integration counter 8 delay (in samples) transfer interrupt 16 interval (in 1024 sample increments) interrupt integration (in 4 sample increments) interrupt interrupt sync delay integration time integration time interval time sync event integration start integration time interval time integration start integration start Each DDC channel includes an RMS power meter which is used to measure the total power within the channel pass band. The power meter samples the I and Q data stream after the PFIR filter. Both 18 bit I and Q data are squared, summed, and then integrated over a period determined by a programmable counter. The integration time is a 16 bit word which is programmed into the 18 bit counter. There is a programmable 18 bit interval timer which sets the interval over which power measurements are made. The timer counts in increments of 1024 samples. This allows the user to select intervals from 1 x 1024 samples up to 256 x 1024 samples. For UMTS systems with sample rate rate at 7.68MHz, the power meter interval range is from 133uS to 34.1mS. For a CDMA system with the sample rate at 2.4576MHz, the power meter interval range is 417uS to 107mS. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 45 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 The power measurement process starts with a sync event. The integration will start at sync event + 3 chips + sync_delay. The 8 bit delay register permits delays from 1 to 256 samples after sync. The integration will continue until the integration count is met. At that point, the result in the 55 bit accumulator is transferred to the read holding register and an interrupt is generated indicating the power value is ready to read. The interval counter continues until the programmed interval count is reached. When reached, the integration counter and the interval counter start over again. Each time the integration count is reached, the 55 result bits are again transferred to the read register overwriting the previous value and an interrupt is generated signifying the data is ready to be read. Failure to read the data timely will result in overwriting the previous interval measurement. Sync starts the process. Whenever a sync is received, all the counters are reset to zero no matter what the status. For UMTS, I and Q are calculated and the integrated power is read. When in CDMA mode the power is calculated for both the A ( Signal ) path and the B ( Diversity) signal. As a result, there are two 55-bit words representing the Signal and Diversity when in CDMA mode. The power read is: 2 2 power = [ (I + Q )* (X*4 + 1) ] where X is the integration count. Programming Variable pmeter_result_a(54:0) pmeter_result_b(54:0) pmeter_sqr_sum_ddc(15:0) pmeter_sync_delay_ddc(7:0) pmeter_interval_ddc(7:0) ssel_pmeter(2:0) pmeter_sync_disable Description 55 bit UMTS or CDMA mode A channel power measurement result. 55 bit CDMA mode B channel power measurement result. Integration (square and sum) count in increments of four samples. Sync delay count in samples. The measurement interval in increments of 2048 samples. This value must be greater than SQR_SUM. Sync source selection. Turns off the sync to the channel power meter. This can be used to individually turn off syncs to a channels power meter while still having syncs to other power meters on the chip. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 46 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 2.2.10 DDC AGC I, Q limit & round 18 18 I, Q outputs (up to 25-bits in AGC bypass mode) threshold zero mask 12 integer & 12 fractional 8 24 magnitude 8 4 compare shift 29 accumulate ocnt 8 2 clear Freeze (from register bit Freeze (from sync source) ucnt 4 29 amin 16 limit dzro dsat 4 4 2 under/over detect amax 16 dblw dabv 4 4 shift select S=+/-1, D=4-bit shift 24 min limit max limit Gain gain adjust 24 The AFE8406 automatic gain control circuit is shown above. The basic operation of the circuit is to multiply the 18 bit input data from the PFIR by a 24-bit gain word that represents a gain or attenuation in the range of 0 to 4096. The gain format is mixed integer and fraction. The 12-bit integer allows the gain to be boosted by up to factor of 4096 (72 dB). The 12-bit fractional part allows the gain to be adjusted up or down in steps of one part in 4096, or approximately 0.002 dB. If the integer portion is zero, then the circuit attenuates the signal. The gain adjusted output data is saturated to full scale and then rounded to between 4 and 18 bits in steps of one bit. The AGC portion of the circuit is used to automatically adjust the gain so that the “median” magnitude of the output data matches a target value, which is performed by comparing the magnitude of the output data with a target threshold. If the magnitude is greater than the threshold, then the gain is decreased, otherwise it is increased. The gain is adjusted as: G(t) = G + A(t), where G is the default, user supplied -D gain value, and A(t) is the time varying adjustment. A(t) is updated as A(t) = A(t) + G(t)*S*2 , where S=1 if the magnitude is less than the threshold and is -1 if the magnitude exceeds the threshold, and where D sets the adjustment step size. Note that the adjustment is a fraction of the current gain. This is designed to set the AGC noise level to a known and acceptable level while keeping the AGC convergence and tracking -D rate constant, independent of the gain level. The AGC noise will be equal to +- 2 and the AGC attack and decay rate will be exponential, with a time constant equal to 2-D. Hence, the AGC will increase or decrease D by 0.63 times G(t) in 2 updates. If one assumes the data is random with a Gaussian distribution, which is valid for UMTS if more than 12 users with different codes have been overlaid, then the relationship between the RMS level and the median is MEDIAN = 0.6745*RMS, hence the threshold should be set to 0.6745 times the desired RMS level. The gain step size can be set using four different values of “D”, each of which is a 4 bit integer. D can range from 3 to 18. The user can specify values of D for different situations, ie, when the signal magnitude PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 47 WWW.TI.COM 5 AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 is below the user-specified threshold (Dblw), is above the threshold (Dabv), is consistently equal to zero (Dzro) or is consistently equal to maximum (Dsat). It is important to note that D represents a gain step size. Smaller values of D represent larger gain steps. The definition of “equal to zero” is any number when masked by zero_mask is considered to be zero. This permits consistently very small amplitude signals to have their gain increased rapidly. Separate programmable D values allow the user to set different attack and decay time constants, and to set shorter time constants for when the signal falls too low (equal to zero), or is too high (saturates). The magnitude is considered to be consistently equal to zero by using a 4-bit counter that counts up every time the 8-bit magnitude value is zero, and counts down otherwise. If the counter’s value exceeds a user specified threshold, then “Dabv” is used. Similarly the magnitude is considered too high by using a counter that counts up when the magnitude is maximum, and counts down otherwise. If this counter exceeds another user specified threshold, then “Dsat” is used. As an example, if the AGC’s current gain at a particular moment in time is 5.123, and the magnitude of the signal is greater than zero, but less than the user-programmed threshold. Step size Dblw will be used to modify the gain for the next sample. This represents the AGC attack profile. If Dblw is set to a value of 5, -5 then the gain for the next sample will be 5.123 + 5.123 x 2 = 5.123 + 0.160 = 5.283. If the signal’s magnitude is still less than the user-programmed threshold, then the gain for the next sample will be 5.283 -5 + 5.283 x 2 = 5.283 + 0.165 = 5.448. This continues until the signal’s magnitude exceeds the userprogrammed threshold. When the magnitude exceeds threshold (but is not saturated), then step size Dabv is automatically employed as a size rather than Dblw. The AGC converges linearly in dB with a step size of 40log(1+2^-D) when the error is greater than 12 dB (I.E. the gain is off by 12 dB or more). Within 6dB the behavior is approximately a exponential decay with a time constant of 2^(D-0.5) samples. The suggested value of D is 5 or 6 when the error is greater than 12dB (i.e., in the fast range detected by consistently zero or saturated data). This gives a step size of 0.5 or 0.25 dB per sample. The suggested value when the gain is off by less than 12dB is D=10, giving a exponential time constant for delay of around 724 samples (63% decay every 724 samples). PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 48 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 AGC GAIN ERROR 7 D=3 D=4 6 D=5 5 D=6 D=7 D=8 D=9 4 D=10 3 D=11 D=12 2 D=13 D=14 D=15 D=3 1 D=18 D=16 D=17 D=18 0 1 10 100 1000 10000 100000 1000000 SAMPLES The AGC noise once the AGC has converged is a random error of amplitude +/-2^-D relative to the RMS signal level. This means that the error level is -6*D dB below the signal RMS level. At D=10 (-60dB) the error is negligible. The plot above shows the AGC response for vales of D ranging from 3 to 18. “Error dB” represents the distance the signal level is from the desired target threshold. The AGC is also subject to user specified upper and lower adjustment limits. The AGC stops incrementing the gain if the adjustment exceeds Amax. It stops decrementing the gain if the adjustment is less than Amin. The input data is received with a valid flag that is high when a valid sample is received. For complex data the I and Q samples are on the same data input line and are not treated independently. An adjustment is made for the magnitude of the I sample, and then another adjustment is made for the Q sample. The AGC operates on UMTS and CDMA data. When in UMTS mode the I and Q data are each used to produce the AGC level. There is no separate I path gain and Q path gain. When in CDMA mode there are separate gain levels for the Signal and Diversity I and Q data. The I and Q for A (or the Signal ) pair is calculated and then the I' and Q' for the B (or Diversity) pair is calculated. There is a freeze mode for holding the accumulator at its current level. This will put the AGC in a hold mode using the user-programmed gain along with the current gain_adjust value. To only use the user programmed gain value as the gain, set the freeze bit and then clear the accumulator. When using the freeze bit the full 25 bit output is sent out of the AGC block to support transferring up to 25 bits when the AGC is disabled. For TDD applications, freeze mode can be controlled using a sync source. This allows rxsync_a/b/c/d to be assigned as a AGC hold signal to keep the AGC from responding during the transmit interval and run during the receive interval. The freeze register bit is logically Ored with the freeze sync source. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 49 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 The current AGC gain and state can also be optionally output with the DDCs I and Q output data by setting the gain_mon variable. When in this mode, the top 14 bits of the current AGC gain word are appended to the 8 bit AGC-modified I and Q output data. Output I Q Bits(17:10) I output data Q output data Bits(9:4) Bits(3:2) Gain(23:16) Gain(15:10) AGC State(1:0) Bits(1:0) “00” “00” Programming Variable agc_dblw(3:0) agc_dabv(3:0) agc_dzro(3:0) agc_dsat (3:0) agc_zero_msk(3:0) agc_md(3:0) agc_thresh(7:0) agc_rnd_disable agc_freeze agc_clear agc_gaina(23:0) agc_gainb(23:0) agc_zero_cnt(3:0) agc_max_cnt(3:0) agc_amax(15:0) agc_amin(15:0) gain_mon Description Below threshold gain. Sets the value of gain step size Dblw (data * current gain below threshold). Ranges from 3 to 18, and maps to a 4 bit field. For example: 3 = “0000”, 4= “0001”, … 18= “1111” Above threshold gain. Sets the value of gain step size Dabv (data * current gain above threshold). Ranges from 3 to 18, and maps to a 4 bit field. For example: 3 = “0000”, 4= “0001”, … 18= “1111” Zero signal gain. Sets the value of gain step size Dzro (data * current gain consistently zero). Ranges from 3 to 18, and maps to a 4 bit field. For example: 3 = “0000”, 4= “0001”, … 18= “1111” Saturated signal gain. Sets the value of gain step size Dsat (data * current gain consistently saturated). Ranges from 3 to 18, and maps to a 4 bit field. For example: 3 = “0000”, 4= “0001”, … 18= “1111” Masks the lower 4 bits of signal data so as to be considered zeros. AGC rounding. 0000= 18 bits out, 1111= 3 bits out. AGC threshold. Compared with magnitude of 8 bits of input * gain. AGC rounding is disabled when this bit is set. The AGC gain adjustment updates are disable when set. The AGC gain adjustment accumulator is cleared when set 24 bit gain word for DDC A 24 bit gain word for DDC B (in CDMA mode) When the AGC output (input * gain) is zero value this number of times, the shoft value is changed to agc_dzero. When the AGC output (input * gain) is zero value this number of times, the shift value is changed to agc_dsat. The maximum value that gain can be adjus ted up to. Top 12 bits are integer, bottom 4 bits are fractional. The minimum value that gain can be adjusted down to. Top 12 bits are integer, bottom 4 bits are fractional. When set, combines current AGC gain with I and Q data. The 18 bit output format thus becomes: I Portion: 8 bits of AGC’d I data - Gain(23:16) - 00 Q Portion: 8 bits of AGC’d Q data - Gain(15:10) - Status(1:0) - 00. ssel_agc_freeze(2:0) ssel_gain(2:0) ssel_ddc_agc(2:0) Note: Bit 0 of Status, when set, indicates the data is saturated. Bit 1 of Status, when set, indicates the data is zero. Sync selection for freeze mode, 1 of 8 sources. This source is ORed with the freeze register bit Sync selection for the double buffered agc_gaina and agc_gainb register. Sync selection used to initialize the AGC, primarily for test purposes. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 50 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 2.2.11 DDC Output Interface The baseband I/Q sample interface can be configured as serial or parallel formatted data. The serial interface closely matches the GC5316 style interface. The parallel interface is provided to interface directly to the TMS320TCI110 when delayed antenna streams used to implement channel estimation buffering and/or transport format combination indicator (TFCI) buffering are not required. The DDC output data is 2’s complement format. 2.2.11.1 Serial Output Interface Serial Outputs UMTS rxout_X_a I ch A I msb DDC Block rxout_X_b I ch B I msb-1 I msb-1 1 UMTS mode channel or 2 CDMA mode channels rxout_X_c Q ch A Q msb I msb-2 rxout_X_d Q ch B Q msb-1 I msb-3 sync clkdiv frame strobe delay 4 2 double length PFIR UMTS I msb CDMA rx_sync_out_X Q msb four outputs from adjacent DDC block Q msb-1 Q msb-2 Q msb-3 Each DDC block can be assigned four serial output data pins. These pins are used to transfer downconverted I/Q baseband data out of the AFE8406 for subsequent processing. The usage of these pins changes depending on how the DDC block is configured. When the block is configured for two CDMA channels, a pair of serial data pins provides separate I and Q data output for the two DDC channels. Word size is selectable from 4 to 25 bits with the most significant bit first. When the DDC block is configured for a single UMTS channel, even and odd I and Q data drive the four serial pins separately, most significant bit first. Four serial pins each for I and Q data can be optionally employed (instead of two for I and two for Q) at half the output rate. This would most likely be used when two DDC channels (2k & 2k + 1, k= 0 to 3) are combined to support double-length PFIR filtering (a channel is sacrificed). Formatting for I data is then: Imsb, Imsb-1, Imsb-2, Imsb-3. Q data formatting is: Qmsb, Qmsb-1, Qmsb-2, Qmsb-3. The frame strobe signal provided on the rx_sync_out_X pins can be programmed to arrive from 0 to 3 bit clocks early via a 2 bit control parameter. The frame interval can be programmed from 1 to 63 bits. A PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 51 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 programmable 4-bit clock divider circuit is used to specify the serial bit rate. The clock divider circuit is synchronized using a sync block discussed later in this document. Programming the serial port clock divider requires some thought and depends upon the channel’s overall decimation ratio, frame sync interval, number of output bits, and CDMA-UMTS mode. In general: the serial clock divide ratio * the frame sync interval = the total receive decimation The relationship between the number of serial bits output, clock divide ratio, and overall decimation ratio is: CDMA: [overall decimation * (pser_recv_8pin + 1) ] / (pser_recv_clkdiv + 1) > pser_recv_bits + 1 UMTS: 2 * [overall decimation * (pser_recv_8pin + 1) ] / (pser_recv_clkdiv + 1) > pser_recv_bits + 1 where overall decimation = CIC decimation * CFIR decimation Decimation by 2 in the output interface can be achieved by setting the frame strobe interval and clock divider to 1/2 the PFIR output rate. The serial interface samples the PFIR output each time the transfer interval defined by these two settings has completed. The decimation moment can be controlled using the rxsync_X input signal selected as the sync source for the serial interface. The timing diagram below shows the DDC serial output timing. tsetup tpd thold rxclk rxsync_X rxsync_X can be a pulse or level - interface will generate periodic frame strobes using programmed frame sync interval rxsync_out_X 3 rxclk + 1 Programmed bit time rxout_X_Y Programmed bit time (2 rxclk cycles for this example) MSB Programming Variable Description pser_recv_fsinvl(6:0) pser_recv_bits(4:0) pser_recv_clkdiv(3:0) Frame sync interval in bits Number of data output bits - 1. ie: 10001= 18 bits Receive serial interface clock divider rate - 1. 0= rxclk, 15= rxclk/16 pser_recv_8pin When set, configures the serial out pins for 4I and 4Q in UMTS mode. When clear, the mode is 2I and 2Q. Used in conjunction with pser_recv_alt. pser_recv_alt When set, outputs Q data from adjacent DDC channel. pser_recv_fsdel(1:0) Number of bit clocks the frame sync is output early with respect to serial data. ssel_serial(2:0) Sync source selection, 1 of 8. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 52 WWW.TI.COM AFE8406 PRODUCT PREVIEW tristate(6:3) SLWS168 - OCTOBER 2005 Tristate controls for the rx_sync_out_X and rxout_X_X pins. Pins are in tristate when the tristate register bits are set. 2.2.11.2 Parallel Output Interface DDC5 DDC4 rx_sync_out_6 par_sync_out rxclk_out rxclk_out rxout_7_d rxout_7_c rxout_7_b I(15) I(14) I(13) rxout_4_b rxout_4_a I(1) I(0) rxout_3_d rxout_3_c rxout_3_b Q(15) Q(14) Q(13) rxout_0_b rxout_0_a Q(1) Q(0) Output format DDC3 DDC2 DDC1 Parallel I/Q DDC0 When a parallel I/Q interface is required, a 32 bit time division multiplexed output mode can be selected using the rxout_X_X pins. This interface is provided for direct connection to the TMS320TCI110 Receive Chip Rate ASSP when delayed antenna streams are not required. The output sample rate, rxclk_out clock polarity, par_sync_out position and number of channels to be output are all programmable. rxclk_out par_sync_out Parallel I/Q IQ DDC0 IQ DDC1 IQ DDC2 IQ DDC3 IQ DDC4 IQ DDC5 The DDC channel serial interface synchronization source selections should all be programmed to the same value when using this parallel output interface (each DDC channel ssel_serial(2:0) in the SYNC_0 register should be programmed to the same rxsync_A/B/C/D value). Decimation by 2 in the output interface can be achieved by setting the frame strobe interval and clock divider to 1/2 the PFIR output rate. The parallel interface samples the PFIR outputs each time the transfer interval defined by these two settings has completed. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 53 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Programming Variable Description par_recv_fsinvl(6:0) par_recv_clkdiv(6:0) par_recv_chan(3:0) par_recv_sync_del(6:0) rx_sync_out (frame strobe) sync interval. 0 is 1 rxclk cycle and 127 is 128 rxclk cycles. rxclk_out cycles per IQ channel sample; 1 is full rate, 2 is rxclk/2, etc. Number channels to be output. 0 is 1 channel, and 15 is 16 channels. delays the DDC0 pser sync source to establish the timing of IQ DDC0. Increasing the value delays the par_sync_out location. delays the rx_sync_out position with respect to IQ DDC0. Setting to 0 moves the rx_sync_out pulse one rxclk_out cycle before the IQ DDC0 word, setting to 1 places it as shown above, lined up with IQ DDC0, etc. rxclk_out polarity. Outputs data on falling edges when cleared, rising edges when set. parallel interface par_sync_out polarity. 0 is active low, 1 for active high Parallel TCI110 style interface enabled when set, serial interface enabled when cleared. DDC channel serial interface sync source selection. All DDCs should be programmed to the same sync source when using this parallel output interface. When set, the parallel output data includes 8b I at I(15:8), 8b Q at Q(15:8), 14b AGC gain at I(7:0) & Q(7:2) and 2b AGC state at Q(1:0). Tristate controls for the rx_sync_out_X and rxout_X_X pins. Pins are in tristate when the tristate register bits are set. par_recv_syncout_del(3:0) par_recv_rxclk_pol par_recv_sync_pol par_recv_ena ssel_serial(2:0) gain_mon tristate(6:3) 2.2.12 DDC Checksum Generator The checksum generator is used in conjunction with the input test signal generator to implement a self test capability. sync rxclk rxout_X_a rxout _X_b rxout_X_c rxout _X_d checksum generator 16 checksum read-only results updated on each sync event results register initialized on sync event to “0000 0000 0000 0010” 15 14 1312 11 10 9 3 2 1 0 rxout_X_a rxout_X_b rxout_X_c rxout_X_d The sync for the checksum generator is internally connected to the ddc_counter output. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 54 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Programming 3 Variable Description ddc_chk_sum(15:0) Read only DDC channel checksum results AFE8406 General Control The AFE8406 is configured over a bi-directional 16 bit parallel data microprocessor control port. The control port permits access to the control registers which configure the chip. The control registers are organized using a paged-access scheme using 6 address lines. Half of the 64 addresses (Address 32 through Address 63) represent global registers. The other 32 (Address 0 through Address 31) are paged resisters. This arrangement permits accessing a large number of control registers using relatively few address lines. Global registers (Address 32 through Address 63) are used to read/write AFE8406 parameters that are global in nature and can benefit from single read/write operations. Examples include chip status, reset, sync options, checksum ramp parameters, interrupt sources, interrupt masks, tri-state controls and the page register. Global Address 33 is the page register. Writing a 16 bit value to this register sets the page to which future write or read operations performed. These paged-registers contain the actual parameters that configure the chip and are accessed by writing/reading address 0 through address 31. The global tristate register can be used to tristate the output drivers on the AFE8406, and also includes the capability of disabling the chip’s internal rxclk. Programming Variable Description rxclk_ena Enables the internal rxclk when set. When cleared, the AFE8406 will ignore the rxclk input signal and hold the internal clock low. Various output pins are forced into tristate mode when these bits are asserted. See the GBL_TRISTATE register description for pin groups to bit assignments. When asserted, the internal datapath is held reset. The control register programming is not affected. tristate(10:0) arst_func 3.1 Microprocessor Interface Control Data, Address, and Strobes The microprocessor control bus consists of 16 bi-directional control data lines d[15:0], 6 address lines a[5:0], a read enable line rd_n, a write enable line wr_n, and a chip enable line ce_n. These lines usually interface to a microprocessor or DSP chip and is intended to look like a block of memory. The interface can be operated in a 3 pin control mode (using rd_n, wr_n and ce_n) or 2 pin control mode (using wr_n and ce_n with rd_n always low). PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 55 WWW.TI.COM AFE8406 PRODUCT PREVIEW 3.2 SLWS168 - OCTOBER 2005 MPU Timing diagrams: tREC ce_n wr_n rd_n tCSU tHIZ a[5:0] t CDLY d[15:0] tCOH valid data Read Operation – 3 pin control mode tREC ce_n wr_n t CSU tHIZ a[5:0] tCDLY d[15:0] t COH valid data Read Operation – 2 pin control mode (rd_n tied low) PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 56 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 tREC ce_n tCSPW wr_n tCSU rd_n a[5:0] tCHD d[15:0] valid data tEWCSU Write Operation – 3 pin control mode t REC ce_n tCSPW wr_n tCSU a[5:0] tCHD d[15:0] valid data t EWCSU Write Operation – 2 pin control mode (rd_n tied low) PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 57 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 58 WWW.TI.COM AFE8406 PRODUCT PREVIEW 3.3 SLWS168 - OCTOBER 2005 Synchronization Signals Various function blocks within the AFE8406 need to be synchronized in order to realize predictable results. The AFE8406 provides a flexible system where each function block that requires synchronization can be independently synchronized from either device pins or from a software “one-shot”. The one-shot option is setup and triggered through control registers. The four sync input pins, rxsync_a, rxsync_b, rxsync_c and rxsync_d are qualified on the rxclk rising clock edge. The table below shows the different sync modes available: Sync Select Code 000 001 010 011 100 101 110 111 Receive Sync Source rxsync_a rxsync_b rxsync_c rxsync_d ddc sync counter terminal count ddc sync triggered by s/w oneshot (register bit) 0 (always off) 1 (always on) The tables below summarizes the blocks which have functions that can be synchronized using the above eight sync source options: Receive Common Syncs Sync Name sync_ddc_counter sync_ddc sync_rxsync_out sync_adc_fifo sync_tst_decim sync_recv_pmeterX sync_ragc_interval_X sync_ragc_freeze_X sync_ragc_clear_X Purpose Initializes the receive sync counter Initializes the receive ADC interface & clock generation circuits selects sync signal to be output on the rx_sync_out pin. Initializes the input and output pointers in the ADC fifo circuits. Initializes the testbus decimation counter. Initializes the rxin power meters. {X = 0,1,2 or 3} Initializes the rxin receive AGC timers. {X = 0,1,2 or 3} rxin receive AGC freeze mode control. {X = 0,1,2 or 3} Initializes the receive AGC error accumulator. {X = 0,1,2 or 3} DDC Channel Syncs Sync Name sync_ddc_tadj sync_ddc_tadj_reg sync_ddc_nco sync_ddc_freq sync_ddc_phase sync_ddc_dither sync_ddc_cic sync_ddc_pmeter sync_ddc_gain sync_ddc_agc sync_ddc_agc_freeze sync_ddc_serial Purpose Selects zero stuff moment in the tadj fine adjustment section. Updates the tadj output pointer register delay in the tadj coarse adjustment section. Resets the NCO accumulator. Updates the NCO freq registers. Updates the NCO phase register. Initializes the NCO dither circuits. Selects the CIC decimation moment. Initializes the receive channel power meters. Updates the DDC channel AGC gain registers Initializes the AGC accumulator. AGC freeze mode control. Initializes the receive serial interface. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 59 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 A 32-bit general purpose timer is included in the synchronization function. The timer loads the user programmed terminal count on a sync event, and counts down to zero using rxclk. The width of the terminal count pulse can also be programmed up to rxclk cycles. The timers output can be used as a sync source for any other circuits requiring a sync if desired, and can also be routed to the rx_sync_out pin. Programming 3.4 Variable Description ddc_counter(31:0) ddc_counter_width(7:0) ssel_ddc_counter(2:0) ssel_rxsync_out(2:0) tristate(0) rx_oneshot 32-bit programmable terminal count 8-bit programmable terminal count pulse width Sync source selection for the ddc counter Sync source selection for the rx_sync_out pin When set, the interrupt and rx_sync_out pins are tristated. Register bit used to generate the S/W oneshot signal for sync. This bit must be programmed from cleared to set in order to generate a rising edge sync signal. Interrupt Handling When a AFE8406 block sets an interrupt, the interrupt pin will go active masked. The microprocessor should then read the interrupt register to interrupt. The microprocessor will then have to write the interrupt register to interrupt source. The interrupt register and interrupt mask are located in the control registers. if the interrupt source is not determine the source of the clear the interrupt pin and the global registers section of the The AFE8406 has 16 interrupt sources; power meters in each of the eight DDC blocks, power meters in the four receive input interface, and four rxin_X_ovr (adc overflow) input pins where X={a,b,c,d}. Programming Variable Description pmeterX_im (7:0) recv_pmeterX_im(3:0) rxin_X_ovr_im pmeterX(7:0) recv_pmeterX(3:0) rxin_X_ovr intr_clr Channel pmeter interrupt mask bits. Interrupt source is masked when set. Receive input power meter interrupt masks. ADC overflow input pin interrupt masks. Channel pmeter interrupt status. Receive input power meter interrupt status. ADC overflow input pin interrupt status. When asserted, holds all interrupt status bits cleared. The interrupt pin will be inactive (always low) when this bit is set. Intended for lab/debug use only When set, the interrupt and rx_sync_out pins are tristated. tristate(0) 3.5 AFE8406 Programming The AFE8406 includes over 2000 internal configuration registers and therefore implements a paged addressing scheme. The register map includes a “global control variables” register address space that is accessed directly when the a5 signal is high. This “global control variables” address space includes the page register. All other registers are addressed using a combination of an address comprised of the internal page register contents and the 6-bit external address; a5, a4, a3, a2, a1 and a0. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 60 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 The page register is accessed when the 6-bit address a5:a0 is 0x21 (or binary “100001”). Page Register Contents in Hex don’t care Address pin a5 1 Registers Addressed with 5 bit address space, pins (a4:a0) 0x0000 0x0020 0x0040 0x0060 0x0080 0x00A0 0x00C0 0x00E0 0x0100 0x0120 0 0 0 0 0 0 0 0 0 0 DDC0 PFIR taps 0 through 31 coefficient lsbs (1:0) DDC0 PFIR taps 32 through 63 coefficient lsbs (1:0) DDC0 PFIR taps 0 through 31 coefficient msbs (17:2) DDC0 PFIR taps 32 through 63 coefficient msbs (17:2) DDC0 CFIR taps 0 through 31 coefficient lsbs (1:0) DDC0 CFIR taps 32 through 63 coefficient lsbs (1:0) DDC0 CFIR taps 0 through 31 coefficient msbs (17:2) DDC0 CFIR taps 32 through 63 coefficient msbs (17:2) DDC0 Control Registers 0x00 through 0x1F DDC0 Control Registers 0x20 through 0x3F 0x0200 0x0220 0x0240 0x0260 0x0280 0x02A0 0x02C0 0x02E0 0x0300 0x0320 0 0 0 0 0 0 0 0 0 0 DDC1 PFIR taps 0 through 31 coefficient lsbs (1:0) DDC1 PFIR taps 32 through 63 coefficient lsbs (1:0) DDC1 PFIR taps 0 through 31 coefficient msbs (17:2) DDC1 PFIR taps 32 through 63 coefficient msbs (17:2) DDC1 CFIR taps 0 through 31 coefficient lsbs (1:0) DDC1 CFIR taps 32 through 63 coefficient lsbs (1:0) DDC1 CFIR taps 0 through 31 coefficient msbs (17:2) DDC1 CFIR taps 32 through 63 coefficient msbs (17:2) DDC1 Control Registers 0x00 through 0x1F DDC1 Control Registers 0x20 through 0x3F 0x0400 0x0420 0x0440 0x0460 0x0480 0x04A0 0x04C0 0x04E0 0x0500 0x0520 0 0 0 0 0 0 0 0 0 0 DDC2 PFIR taps 0 through 31 coefficient lsbs (1:0) DDC2 PFIR taps 32 through 63 coefficient lsbs (1:0) DDC2 PFIR taps 0 through 31 coefficient msbs (17:2) DDC2 PFIR taps 32 through 63 coefficient msbs (17:2) DDC2 CFIR taps 0 through 31 coefficient lsbs (1:0) DDC2 CFIR taps 32 through 63 coefficient lsbs (1:0) DDC2 CFIR taps 0 through 31 coefficient msbs (17:2) DDC2 CFIR taps 32 through 63 coefficient msbs (17:2) DDC2 Control Registers 0x00 through 0x1F DDC2 Control Registers 0x20 through 0x3F 0x0600 0x0620 0x0640 0x0660 0x0680 0x06A0 0x06C0 0x06E0 0x0700 0x0720 0 0 0 0 0 0 0 0 0 0 DDC3 PFIR taps 0 through 31 coefficient lsbs (1:0) DDC3 PFIR taps 32 through 63 coefficient lsbs (1:0) DDC3 PFIR taps 0 through 31 coefficient msbs (17:2) DDC3 PFIR taps 32 through 63 coefficient msbs (17:2) DDC3 CFIR taps 0 through 31 coefficient lsbs (1:0) DDC3 CFIR taps 32 through 63 coefficient lsbs (1:0) DDC3 CFIR taps 0 through 31 coefficient msbs (17:2) DDC3 CFIR taps 32 through 63 coefficient msbs (17:2) DDC3 Control Registers 0x00 through 0x1F DDC3 Control Registers 0x20 through 0x3F Global Control Variables 0x00 through 0x1F PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 61 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Page Register Contents in Hex 0x0800 0x0820 0x0840 0x0860 0x0880 0x08A0 0x08C0 0x08E0 0x0900 0x0920 Address pin a5 0 0 0 0 0 0 0 0 0 0 Registers Addressed with 5 bit address space, pins (a4:a0) 0x0A00 0x0A20 0x0A40 0x0A60 0x0A80 0x0AA0 0x0AC0 0x0AE0 0x0B00 0x0B20 0 0 0 0 0 0 0 0 0 0 DDC5 PFIR taps 0 through 31 coefficient lsbs (1:0) DDC5 PFIR taps 32 through 63 coefficient lsbs (1:0) DDC5 PFIR taps 0 through 31 coefficient msbs (17:2) DDC5 PFIR taps 32 through 63 coefficient msbs (17:2) DDC5 CFIR taps 0 through 31 coefficient lsbs (1:0) DDC5 CFIR taps 32 through 63 coefficient lsbs (1:0) DDC5 CFIR taps 0 through 31 coefficient msbs (17:2) DDC5 CFIR taps 32 through 63 coefficient msbs (17:2) DDC5 Control Registers 0x00 through 0x1F DDC5 Control Registers 0x20 through 0x3F 0x0C00 0x0C20 0x0C40 0x0C60 0x0C80 0x0CA0 0x0CC0 0x0CE0 0x0D00 0x0D20 0 0 0 0 0 0 0 0 0 0 DDC6 PFIR taps 0 through 31 coefficient lsbs (1:0) DDC6 PFIR taps 32 through 63 coefficient ls bs (1:0) DDC6 PFIR taps 0 through 31 coefficient msbs (17:2) DDC6 PFIR taps 32 through 63 coefficient msbs (17:2) DDC6 CFIR taps 0 through 31 coefficient lsbs (1:0) DDC6 CFIR taps 32 through 63 coefficient lsbs (1:0) DDC6 CFIR taps 0 through 31 coefficient msbs (17:2) DDC6 CFIR taps 32 through 63 coefficient msbs (17:2) DDC6 Control Registers 0x00 through 0x1F DDC6 Control Registers 0x20 through 0x3F 0x0E00 0x0E20 0x0E40 0x0E60 0x0E80 0x0EA0 0x0EC0 0x0EE0 0x0F00 0x0F20 0 0 0 0 0 0 0 0 0 0 DDC7 PFIR taps 0 through 31 coefficient lsbs (1:0) DDC7 PFIR taps 32 through 63 coefficient lsbs (1:0) DDC7 PFIR taps 0 through 31 coefficient msbs (17:2) DDC7 PFIR taps 32 through 63 coefficient msbs (17:2) DDC7 CFIR taps 0 through 31 coefficient lsbs (1:0) DDC7 CFIR taps 32 through 63 coefficient lsbs (1:0) DDC7 CFIR taps 0 through 31 coefficient msbs (17:2) DDC7 CFIR taps 32 through 63 coefficient msbs (17:2) DDC7 Control Registers 0x00 through 0x1F DDC7 Control Registers 0x20 through 0x3F 0x1000 0x1020 0x1040 0x1080 0x10A0 0 0 0 0 0 Receive Input AGC0 Error RAM addresses 0 through 31 Receive Input AGC0 Error RAM addresses 32 through 63 Receive Input AGC0 DVGA RAM addresses 0 through 31 Receive Input AGC0 Gain RAM addresses 0 through 31 Receive Input AGC0 Gain RAM addresses 32 through 63 0x1100 0x1120 0x1140 0 0 0 Receive Input AGC1 Error RAM addresses 0 through 31 Receive Input AGC1 Error RAM addresses 32 through 63 Receive Input AGC1 DVGA RAM addresses 0 through 31 DDC4 PFIR taps 0 through 31 coefficient lsbs (1:0) DDC4 PFIR taps 32 through 63 coefficient lsbs (1:0) DDC4 PFIR taps 0 through 31 coefficient msbs (17:2) DDC4 PFIR taps 32 through 63 coefficient msbs (17:2) DDC4 CFIR taps 0 through 31 coefficient lsbs (1:0) DDC4 CFIR taps 32 through 63 coefficient lsbs (1:0) DDC4 CFIR taps 0 through 31 coefficient msbs (17:2) DDC4 CFIR taps 32 through 63 coefficient msbs (17:2) DDC4 Control Registers 0x00 through 0x1F DDC4 Control Registers 0x20 through 0x3F PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 62 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 0x1180 0x11A0 0 0 Receive Input AGC1 Gain RAM addresses 0 through 31 Receive Input AGC1 Gain RAM addresses 32 through 63 0x1400 0x1420 0x1440 0x1480 0x14A0 0 0 0 0 0 Receive Input AGC2 Error RAM addresses 0 through 31 Receive Input AGC2 Error RAM addresses 32 through 63 Receive Input AGC2 DVGA RAM addresses 0 through 31 Receive Input AGC2 Gain RAM addresses 0 through 31 Receive Input AGC2 Gain RAM addresses 32 through 63 0x1500 0x1520 0x1540 0x1580 0x15A0 0 0 0 0 0 Receive Input AGC3 Error RAM addresses 0 through 31 Receive Input AGC3 Error RAM addresses 32 through 63 Receive Input AGC3 DVGA RAM addresses 0 through 31 Receive Input AGC3 Gain RAM addresses 0 through 31 Receive Input AGC3 Gain RAM addresses 32 through 63 0x1800 0x1820 0 0 Receive Input Control Registers 0x00 through 0x1F Receive Input Control Registers 0x20 through 0x3F 0x1840 0x1860 0 0 Receive Input AGC Control Registers 0x00 through 0x1F Receive Input AGC Control Registers 0x20 through 0x3F PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 63 WWW.TI.COM AFE8406 PRODUCT PREVIEW 3.5.1 SLWS168 - OCTOBER 2005 Control Register Index Register name: VER................................................................................................................................... 67 Register name: PAGE ................................................................................................................................ 67 Register name: CONFIG............................................................................................................................. 69 Register name: GBL_PAR_CONFIG0.......................................................................................................... 70 Register name: GBL_PAR_CONFIG1.......................................................................................................... 71 Register name: GBL_TRISTATE ................................................................................................................. 71 Register name: GBL_ONESHOT................................................................................................................. 71 Register name: GBL_IMASK0..................................................................................................................... 72 Register name: GBL_INTERRUPT0 ............................................................................................................ 72 Register name: SYNC_DDC_CNTR_LSB .................................................................................................... 73 Register name: SYNC_DDC_CNTR_MSB ................................................................................................... 73 Register name: SSEL_DDC_CNTR ............................................................................................................. 73 Register name: SSEL_RX_0....................................................................................................................... 74 Register name: RECV_CONFIG0................................................................................................................ 74 Register name: RECV_CONFIG1................................................................................................................ 75 Register name: NZ_PWR_MASK ................................................................................................................ 76 Register name: RECV_PMETER_SYNC ..................................................................................................... 76 Register name: RECV_PMETER0_SQR_SUM_LSB .................................................................................... 77 Register name: RECV_PMETER0_STRT_INTVL_LSB................................................................................. 77 Register name: RECV_PMETER0_SYNC_DLY ........................................................................................... 77 Register name: RECV_PMETER0_CONFIG ................................................................................................ 77 Register name: RECV_PMETER1_SQR_SUM_LSB .................................................................................... 78 Register name: RECV_PMETER1_STRT_INTVL_LSB................................................................................. 78 Register name: RECV_PMETER1_SYNC_DLY ........................................................................................... 78 Register name: RECV_PMETER1_CONFIG ................................................................................................ 79 Register name: RECV_PMETER2_SQR_SUM_LSB .................................................................................... 79 Register name: RECV_PMETER2_STRT_INTVL_LSB................................................................................. 79 Register name: RECV_PMETER2_SYNC_DLY ........................................................................................... 79 Register name: RECV_PMETER2_CONFIG ................................................................................................ 80 Register name: RECV_PMETER3_SQR_SUM_LSB .................................................................................... 80 Register name: RECV_PMETER3_STRT_INTVL_LSB................................................................................. 80 Register name: RECV_PMETER3_SYNC_DLY ........................................................................................... 80 Register name: RECV_PMETER3_CONFIG ................................................................................................ 81 Register name: RECV_SLF_TST_VALUE ................................................................................................... 81 Register name: RECV_PMETER0_LSB....................................................................................................... 81 Register name: RECV_PMETER0_MID....................................................................................................... 82 Register name: RECV_PMETER0_LMSB.................................................................................................... 82 Register name: RECV_PMETER0_UMSB ................................................................................................... 82 Register name: RECV_PMETER1_LSB....................................................................................................... 82 Register name: RECV_PMETER1_MID....................................................................................................... 83 Register name: RECV_PMETER1_LMSB.................................................................................................... 83 Register name: RECV_PMETER1_UMSB ................................................................................................... 83 Register name: RECV_PMETER2_LSB....................................................................................................... 83 Register name: RECV_PMETER2_MID....................................................................................................... 84 Register name: RECV_PMETER2_LMSB.................................................................................................... 84 Register name: RECV_PMETER2_UMSB ................................................................................................... 84 Register name: RECV_PMETER3_LSB....................................................................................................... 84 Register name: RECV_PMETER3_MID....................................................................................................... 85 Register name: RECV_PMETER3_LMSB.................................................................................................... 85 Register name: RECV_PMETER3_UMSB ................................................................................................... 85 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 64 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Register name: RAGC_CONFIG0 ............................................................................................................... 86 Register name: RAGC_CONFIG1 ............................................................................................................... 86 Register name: RAGC_CONFIG2 ............................................................................................................... 86 Register name: RAGC_CONFIG3 ............................................................................................................... 87 Register name: RAGC0_INTEGINVL_LSB .................................................................................................. 87 Register name: RAGC0_INTEGINVL_MSB.................................................................................................. 87 Register name: RAGC0_CONFIG0 ............................................................................................................. 88 Register name: RAGC0_CONFIG1 ............................................................................................................. 88 Register name: RAGC0_SD_THRESH ........................................................................................................ 88 Register name: RAGC0_SD_TIMER ........................................................................................................... 89 Register name: RAGC0_SD_SAMPLES ...................................................................................................... 89 Register name: RAGC0_CLIP_HITHRESH.................................................................................................. 89 Register name: RAGC0_CLIP_LOTHRESH................................................................................................. 89 Register name: RAGC0_CLIP_HITIMER ..................................................................................................... 90 Register name: RAGC0_CLIP_LOTIMER.................................................................................................... 90 Register name: RAGC0_CLIP_SAMPLES ................................................................................................... 90 Register name: RAGC0_CLIP_ERROR....................................................................................................... 90 Register name: RAGC1_INTEGINVL_LSB .................................................................................................. 91 Register name: RAGC1_INTEGINVL_MSB.................................................................................................. 91 Register name: RAGC1_CONFIG0 ............................................................................................................. 91 Register name: RAGC1_CONFIG1 ............................................................................................................. 92 Register name: RAGC1_SD_THRESH ........................................................................................................ 92 Register name: RAGC1_SD_TIMER ........................................................................................................... 92 Register name: RAGC1_SD_SAMPLES ...................................................................................................... 92 Register name: RAGC1_CLIP_HITHRESH.................................................................................................. 93 Register name: RAGC1_CLIP_LOTHRESH................................................................................................. 93 Register name: RAGC1_CLIP_HITIMER ..................................................................................................... 93 Register name: RAGC1_CLIP_LOTIMER.................................................................................................... 93 Register name: RAGC1_CLIP_SAMPLES ................................................................................................... 94 Register name: RAGC1_CLIP_ERROR....................................................................................................... 94 Register name: RAGC2_INTEGINVL_LSB .................................................................................................. 94 Register name: RAGC2_INTEGINVL_MSB.................................................................................................. 94 Register name: RAGC2_CONFIG0 ............................................................................................................. 95 Register name: RAGC2_CONFIG1 ............................................................................................................. 95 Register name: RAGC2_SD_THRESH ........................................................................................................ 95 Register name: RAGC2_SD_TIMER ........................................................................................................... 96 Register name: RAGC2_SD_SAMPLES ...................................................................................................... 96 Register name: RAGC2_CLIP_HITHRESH.................................................................................................. 96 Register name: RAGC2_CLIP_LOTHRESH................................................................................................. 96 Register name: RAGC2_CLIP_HITIMER ..................................................................................................... 97 Register name: RAGC2_CLIP_LOTIMER.................................................................................................... 97 Register name: RAGC2_CLIP_SAMPLES ................................................................................................... 97 Register name: RAGC2_CLIP_ERROR....................................................................................................... 97 Register name: RAGC3_INTEGINVL_LSB .................................................................................................. 98 Register name: RAGC3_INTEGINVL_MSB.................................................................................................. 98 Register name: RAGC3_CONFIG0 ............................................................................................................. 98 Register name: RAGC3_CONFIG1 ............................................................................................................. 99 Register name: RAGC3_SD_THRESH ........................................................................................................ 99 Register name: RAGC3_SD_TIMER ........................................................................................................... 99 Register name: RAGC3_SD_SAMPLES ...................................................................................................... 99 Register name: RAGC3_CLIP_HITHRESH................................................................................................ 100 Register name: RAGC3_CLIP_LOTHRESH............................................................................................... 100 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 65 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Register name: RAGC3_CLIP_HITIMER ................................................................................................... 100 Register name: RAGC3_CLIP_LOTIMER.................................................................................................. 100 Register name: RAGC3_CLIP_SAMPLES ................................................................................................. 101 Register name: RAGC3_CLIP_ERROR..................................................................................................... 101 Register name: RAGC0_ACCUM_LSB ...................................................................................................... 101 Register name: RAGC0_ACCUM_MSB ..................................................................................................... 101 Register name: RAGC1_ACCUM_LSB ...................................................................................................... 102 Register name: RAGC1_ACCUM_MSB ..................................................................................................... 102 Register name: RAGC2_ACCUM_LSB ...................................................................................................... 102 Register name: RAGC2_ACCUM_MSB ..................................................................................................... 102 Register name: RAGC3_ACCUM_LSB ...................................................................................................... 103 Register name: RAGC3_ACCUM_MSB ..................................................................................................... 103 Register name: FIR_MODE ...................................................................................................................... 104 Register name: FIR_GAIN ........................................................................................................................ 104 Register name: SQR_SUM ....................................................................................................................... 104 Register name: STRT_INTRVL ................................................................................................................. 105 Register name: CIC_MODE1 .................................................................................................................... 105 Register name: CIC_MODE2 .................................................................................................................... 105 Register name: TADJC ............................................................................................................................. 106 Register name: TADJF ............................................................................................................................. 106 Register name: PHASEADD0A ................................................................................................................. 107 Register name: PHASEADD1A ................................................................................................................. 107 Register name: PHASEADD0B ................................................................................................................. 107 Register name: PHASEADD1B ................................................................................................................. 108 Register name: PHASE_OFFSETA ........................................................................................................... 108 Register name: PHASE_OFFSETB ........................................................................................................... 108 Register name: CONFIG1 ......................................................................................................................... 109 Register name: CONFIG2 ......................................................................................................................... 110 Register name: AGC_CONFIG1................................................................................................................ 110 Register name: AGC_CONFIG2................................................................................................................ 111 Register name: AGC_CONFIG3................................................................................................................ 111 Register name: AGC_GAINMSB ............................................................................................................... 111 Register name: AGC_GAINA .................................................................................................................... 112 Register name: AGC_GAINB .................................................................................................................... 112 Register name: AGC_AMAX..................................................................................................................... 112 Register name: AGC_AMIN ...................................................................................................................... 113 Register name: PSER_CONFIG1 .............................................................................................................. 113 Register name: PSER_CONFIG2 .............................................................................................................. 113 Register name: DDCCONFIG1.................................................................................................................. 114 Register name: SYNC_0........................................................................................................................... 115 Register name: SYNC_1........................................................................................................................... 116 Register name: SYNC_2........................................................................................................................... 116 Register name: DDC_CHK_SUM .............................................................................................................. 116 Register name: PMETER_RESULT_A_LSB .............................................................................................. 116 Register name: PMETER_RESULT_A_MID............................................................................................... 117 Register name: PMETER_RESULT_A_MSB.............................................................................................. 117 Register name: PMETER_RESULT_B_LSB .............................................................................................. 117 Register name: PMETER_RESULT_B_MID............................................................................................... 118 Register name: PMETER_RESULT_B_MSB.............................................................................................. 118 Register name: PMETER_RESULT_AB_UMSB ......................................................................................... 118 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 66 WWW.TI.COM AFE8406 PRODUCT PREVIEW 3.5.2 SLWS168 - OCTOBER 2005 Global Control Variables These registers are accessed directly without page address extension; when pin a5 is high during a read or write access, this block of 32 registers are accessed. Register name: VER Address: 0x0 READ_ONLY BIT15 unused 0 BIT7 unused 0 Unused 0 unused 0 unused 0 unused 0 unused 0 unused 0 Unused 0 unused 0 unused 0 VER3 0 VER2 0 VER1 0 BIT8 unused 0 BIT0 VER0 1 VER(3:0) : A hardwired read only register that returns the version of the chip. Register name: PAGE Address: 0x1 BIT15 unused 0 BIT7 Y(1) 0 W(2:0) X Unused 0 unused 0 Y(0) 0 Zp 0 0 W(2:0) 0 0 X 0 unused 0 unused 0 unused 0 unused 0 BIT8 Y(2) 0 BIT0 unused 0 : Selects which dual DDC block to address. : The DDC modules are configured as dual DDCs; an even numbered DDC and odd numbered DDC are contained in each dual DDC module, the X bit selects which DDC gets address. (DDC0/2/4/6=0, DDC1/3/5/7=1) W(2:0) X bit Selected Block 000 0 DDC0 000 1 DDC1 001 0 DDC2 001 1 DDC3 010 0 DDC4 010 1 DDC5 011 0 DDC6 011 1 DDC7 100 0 Receive AGC0/1 RAMs 101 0 Receive AGC2/3 RAMs 110 0 Receive Input Interface PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 67 WWW.TI.COM AFE8406 PRODUCT PREVIEW Y(2:0) : Within each major block, there are up to 8 different Zones that can be addressed using the Y bits. Y(2:0) 000 001 010 011 100 101 110 111 Zp SLWS168 - OCTOBER 2005 : DDC Zone PFIR coeffient lower 2 bits PFIR coeffient upper 16 bits CFIR coeffient lower 2 bits CFIR coeffient upper 16 bits Control registers Not assigned Not assigned Not assigned Receive Input Interface Zone CHIPS control registers RAGC control registers Not assigned Not assigned Not assigned Not assigned Not assigned Not assigned Receive AGC RAMs Zone RAGC0/2 ERRMAP RAGC0/2 DVGAMAP RAGC0/2 GAINMAP Not assigned RAGC1/3 ERRMAP RAGC1/3 DVGAMAP RAGC1/3 GAINMAP Not assigned The Zp bit is the MSB of the address word sent to the registers and rams. This bit can be thought of as an upper/lower selector of the 64 word addressing. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 68 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Register name: CONFIG Address: 0x2 BIT15 slf_ tst_ena 0 BIT7 par_recv_ ena 0 BIT8 rduz_sens _ena 0 arst_ func 0 gbl_ ddc_write 0 intr_ clr 0 slf_tst_ena rduz_sens_ena arst_func tst_rate_sel(4:0) par_recv_ena gbl_ddc_write intr_clr tst_select(3:0) 0 0 0 0 tst_select(3:0) 1 1 1 0 0 BIT0 tst_ on 0 : Turns on the checksum LFSR for the receivers. They are located ni the RECEIVE INPUT INTERFACE and DDC blocks. : When enabled, adds noise to the LSB’s of the ADC inputs. : When asserted, resets the functional portion of the circuits. The MPU registers do not get reset and retain their programmed value. : Sets the rate of the output test data and clock. The length of the clock cycle is the value in tst_rate_sel+1 multiplied by the RXCLK period. When the test bus source is set to 1000 (rxin_a and rxin_b FIFO outputs), tst_rate_sel(4:0) must be set to 0 for output. Therefore, will not output a clock at the decimated test bus rate. : When asserted, the rxout_*_* serial pins join to form a 32 bit parallel output using 32 pins as a data bus, one pin as a output clock and one pin as a sync. This is used to connect to the TCI110 Chip rate processor from TI. : Factory use only. When asserted, the mpu writes are global. This means that DDC0/2/4/6 or DDC1/3/5/7 can be programmed simultaneously with the same values. This is an effort to reduce the amount of time spent programming the device. A common setup can be used to program the DDC0/2/4/6, then all the DDC1/3/5/7. Afterwards, just individual writes to the registers which differ between DDCs can be done. To use this feature, this bit must be asserted and the DDC0/1 must be addressed. Any other DDC address will not work. : When asserted, this bit forces all interrupts to be cleared. To allow the interrupts to be set again, this bit must be programmed to zero. This does not stop blocks from generating interrupts, but rather just keeps the interrupts from being reported. : This selects which block the test output comes from: tst_select(3:0) 0000 0001 0010 0011 0100 0101 0110 0111 1000 others tst_on tst_rate_sel(4:0) Test data sent to test bus rxin_d(15:0), dvga_c(3:2), rxin_c(15:0), dvga_c(5:4) DDC 0 DDC 1 DDC 2 DDC 3 DDC 4 DDC 5 DDC 6 DDC 7 rxin_a(15:0), “00”, rxin_b(15:0), “00” from the fifo outputs none selected : When asserted, the testbus is active. The ADC input ports rxin_c(15:0), rxin_d(15:0), dvga_c(5:0) and dvga_d(5:0) become the testbus output ports. When this bit is set, the rxin_c(15:0) and rxin_d(15:0) ports become chip outputs. The dvga_c(5:0) and dvga_d(5:0) ports are enabled separately using the GBL_TRISTATE register PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 69 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Register name: GBL_PAR_CONFIG0 Address: 0x3 BIT15 0 0 par_recv_sync_del(6:0) 0 0 0 0 0 0 0 BIT7 par_recv_clkdiv(6:0) 0 0 0 0 0 BIT8 tst_clk_pol 0 BIT0 par_recv_ rxclk_pol 0 par_recv_sync_del(6:0) : Delays the sync source from the DDC0 AGC output by (par_recv_sync_del+1) rxclk cycles. tst_clk_pol : Selects the polarity of the test clock output at dvga_c(1) when the test bus is enabled; 0 for rising edge in the center of valid data, 1 for falling edge in the center of valid data. No effect when tst_rate_sel is “00000”. par_recv_clkdiv(6:0) : Selects the parallel interface output clock rate. par_recv_rxclk_pol : Selects the polarity of the rxclk_out clock output; 0 for rising edge in the center of valid data, 1 for falling edge in the center of valid data. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 70 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Register name: GBL_PAR_CONFIG1 Address: 0x4 BIT15 0 BIT8 par_recv_syncout_del(3:0) 0 0 0 0 par_recv_chan(3:0) 0 0 BIT7 par_recv_fsinvl(6:0) 0 0 0 0 0 0 0 0 BIT0 par_recv_ sync_pol 0 par_recv_syncout_del(3:0) : Changes the rx_sync_out position with respect to IQ DDC0. Setting to 0 causes rx_sync_out to lead IQ DDC0 by 1 output sample, setting to 1 causes rx_sync_out to line up with IQ DDC0, setting to 2 causes rx_sync_out to trail IQ DDC0 by 1 output sample, etc. par_recv_chan(3:0) : Selects the number of channels to be output over the parallel interface, from 1 to 16 channels. par_recv_fsinvl(6:0) : Selects the number of rxclk cycles per parallel interface frame, from 1 to 128 cycles. par_recv_sync_pol : Selects the polarity of the parallel interface sync pulse; 0 for active low, 1 for active high. Register name: GBL_TRISTATE Address: 0x5 BIT15 rxclk_ena 1 BIT7 tristate(7) 1 Unused 0 unused 0 unused 0 unused 0 tristate(10) 1 tristate(9) 1 tristate(6) 1 tristate(5) 1 tristate(4) 1 tristate(3) 1 tristate(2) 1 tristate(1) 1 BIT8 tristate(8) 1 BIT0 tristate(0) 1 rxclk_ena : Master rxclk enable. When set, the chip’s rxclk is enabled, when cleared, rxclk is disabled. All tristates are ACTIVE LOW; ‘0’ enables the output and ‘1’ tristates it. tristate(10) : When cleared, enables the dvga_d outputs. tristate(9) : When cleared, enables the dvga_c outputs. tristate(8) : When cleared, enables the dvga_b outputs. tristate(7) : When cleared, enables the dvga_a outputs. tristate(6) : When cleared, enables the rx_sync_out_6/7, and the rxout_6/7_a/b/c/d outputs (for parallel interface use only). tristate(5) : When cleared, enables the rx_sync_out_4/5, and the rxout_4/5_a/b/c/d outputs. tristate(4) : When cleared, enables the rx_sync_out_2/3, and the rxout_2/3_a/b/c/d outputs. tristate(3) : When cleared, enables the rx_sync_out_0/1, and the rxout_0/1_a/b/c/d outputs. tristate(2) : TBD tristate(1) : When cleared, enables the rxclk_out output. tristate(0) : When cleared, enables interrupt and rx_sync_out outputs. Register name: GBL_ONESHOT Address: 0x6 BIT15 unused 0 BIT7 rx_oneshot 0 rx_oneshot Unused 0 unused 0 unused 0 unused 0 unused 0 unused 0 Unused 0 unused 0 unused 0 unused 0 unused 0 unused 0 BIT8 unused 0 BIT0 unused 0 : When set, a one shot pulse is sent to the receive blocks for syncing. This only works if the blocks are programmed to use the oneshot as the sync source. To use the oneshot again, it must be programmed back to a ‘0’ and then back to a ‘1’. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 71 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Register name: GBL_IMASK0 Address: 0x7 BIT15 unused Unused 0 0 BIT7 recv_ recv_ pmeter0_im pmeter1_im 0 0 pmeterX_im recv_pmeterX_im rxin_X_ovr_im pmeter5_im pmeter4_im 0 0 recv_ pmeter2_im 0 recv_ pmeter3_im 0 pmeter3_im 0 rxin_a_ ovr_im 0 pmeter2_im pmeter1_im 0 0 rxin_b_ ovr_im 0 rxin_c_ ovr_im 0 BIT8 pmeter0_im 0 BIT0 rxin_d_ ovr_im 0 : When asserted, masks the interrupt for the particular DDC pmeter, X= {0,1,2,3,4,5,6,7}. : When asserted, masks the interrupt for the particular receive input pmeter, X= {0,1,2,3 }. : When asserted, masks the interrupt for the particular rxin overflow, X={a,b,c,d}. Register name: GBL_INTERRUPT0 Address: 0x9 BIT15 unused 0 BIT7 recv_ pmeter0 0 pmeterX recv_pmeterX rxin_X_ovr Unused 0 pmeter5 0 pmeter4 0 pmeter3 0 pmeter2 0 pmeter1 0 recv_ pmeter1 0 recv_ pmeter2 0 recv_ pmeter3 0 rxin_a_ovr rxin_b_ovr rcin_c_ovr BIT8 pmeter0 0 BIT0 rxin_d_ovr 0 0 0 0 : Asserted when an interrupt has been generated by this DDC pmeterX block, X={1,2,3,4,5,6,7}. : Asserted when an interrupt has been generated by this receive input pmeter, X= {0,1,2,3 }. : Asserted when a logic high input from the rxin_X_ovr pin occurs, X={a,b,c,d}. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 72 WWW.TI.COM AFE8406 PRODUCT PREVIEW 3.5.3 SLWS168 - OCTOBER 2005 Receive Input Interface Controls (Pages: 0x1800 and 0x1820) Register name: SYNC_DDC_CNTR_LSB Page: 0x1800 Address: 0x0 BIT15 BIT8 0 0 0 ddc_counter(15:8) 0 0 0 0 0 ddc_counter(7:0) 0 0 0 0 0 0 BIT7 0 BIT0 0 Register name: SYNC_DDC_CNTR_MSB Page: 0x1800 Address: 0x1 BIT15 BIT8 0 0 0 ddc_counter(31:24) 0 0 0 0 0 ddc_counter(23:16) 0 0 0 0 0 0 BIT7 ddc_counter(32:0) 0 BIT0 0 : 32 bit interval timer common to all DDC sync inputs. This timer may be programmed to any interval count, and each DDC synchronization input can select this counter as a source. The value programmed into the counter is: (desired number –1). The counter increments on each RX clock rising edge. Register name: SSEL_DDC_CNTR Page: 0x1800 Address: 0x2 BIT15 rxinab_mux rxincd_mux 0 0 BIT7 0 0 unused 0 0 unused 0 unused 0 ddc_counter_width(7:0) 0 0 BIT8 ssel_ddc_counter(2:0) 0 0 0 BIT0 0 0 0 rxinab_mux : When asserted, the rxin_a and rxin_b inputs are internally driven by the rxin_c and rxin_d ports, respectively (Factory test use only). rxincd_mux : When asserted, the rxin_c and rxin_d inputs are internally driven by the rxin_a and rxin_b ports, respectively (Factory test use only). ssel_ddc_counter(2:0) : Selects the sync source for the DDC sync counter. ddc_counter_width(7:0) : Sets the width of the counter generated sync pulse in RX clock cycles, from 1 to 256. Sync sources are contained in this and many of the following registers. For all sync source selections: ssel_ddc_XXXXX(2:0) 000 001 010 011 100 101 Selected sync source rxsyncA rxsyncB rxsyncC rxsyncD DDC sync counter one shot (register write triggered) PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 73 WWW.TI.COM AFE8406 PRODUCT PREVIEW 110 111 SLWS168 - OCTOBER 2005 always 0 always 1 Register name: SSEL_RX_0 Page: 0x1800 Address: 0x3 BIT15 unused 0 BIT7 unused 0 BIT8 0 ssel_adc_fifo(2:0) 0 0 ssel_rxsync_out(2:0) 0 ssel_adc_fifo(2:0) ssel_tst_decim(2:0) ssel_rxsync_out(2:0) ssel_ddc(2:0) 0 unused 0 0 ssel_tst_decim(2:0) 0 0 unused 0 0 ssel_ddc(2:0) 0 0 BIT0 0 : Selects the sync source for the adc FIFO blocks. Sync reinitializes the read and write pointers of the FIFO. : Selects the sync source for the test bus decimator block. : Selects the sync source for the RXSYNC_OUT pin. : Selects the sync source for the DDC data input mux and mixer. Controls clock generation in each DDC block (before the CIC input) which must match because the FIFO output clock is common for all DDC blocks. Register name: RECV_CONFIG0 Page: 0x1800 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 74 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Address: 0x4 BIT15 rate_sel(1:0) 0 0 adc_ adc_ self_test_ fifo_strap_ab fifo_strap_cd const_ena 0 0 0 adc_ fifo_bypass 0 ragc_mpu _ram_read 0 pmeter2_iq 0 pmeter1_iq 0 BIT7 0 tst_decim_delay(3:0) 0 0 rate_sel(1:0) adc_fifo_strap_cd self_test_const_ena adc_fifo_bypass ragc_mpu_ram_read tst_decim17 tst_decim_delay(3:0) pmeter3_iq pmeter2_iq pmeter1_iq pmeter0_iq pmeter3_iq 0 : Tells the RECV_CDRV the input rate. This is the rxin_a/b/c/d input rate and the rate that the RECEIVE INPUT INTERFACE block sends data to the DDCs. rate_sel 00 01 10 11 adc_fifo_strap_ab 0 BIT8 tst_ decim17 0 BIT0 pmeter0_iq 0 Input clock rate rxclk rxclk/2 rxclk/4 rxclk/8 : When asserted, the input pointers of the rxin_a FIFO and rxin_b FIFO are hooked together in lock step configuration. This is used for maintaining FIFO delay consistency when complex inputs are driven on rxin_a(I) and rxin_b(Q). rxin_a is the Master. : When asserted, the input pointers of the rxin_c FIFO and rxin_d FIFO are hooked together in lock step configuration. This is used for maintaining FIFO delay consistency when complex inputs are driven on rxin_c(I) and rxin_d(Q). rxin_c is the Master. : When asserted, (with slf_tst_ena also asserted), a constant value is output by the test and noise generator instead of the pseudo random sequence. The constant value is programmable. : When asserted, the ADC FIFO circuits are bypassed. Input data is then clocked in directly using the rxclk input. The ssel_ddc selection value will control the location of the internally generated sample clock when this bit is asserted where rate_sel is rxclk/2, rxclk/4 or rxclk/8. : When asserted, the RAMs in the RAGC blocks can be read. This bit should only be set when reading the RAGC map rams via the mpu interface and must be cleared for proper RAGC operation. : Factory use only. Will have no effect for user on production part. : These bits set the delay from the sync occurring until the decimator samples. In other words, the moment of the decimator is set by this delay value. : When asserted, the pmeter3 block takes input from both rxin_c and rxin_d as a complex sample pair. When de-asserted, only input from rxin_d is used for the power measurement. : When asserted, the pmeter2 block takes input from both rxin_c and rxin_d as a complex sample pair. When de-asserted, only input from rxin_c is used for the power measurement. : When asserted, the pmeter1 block takes input from both rxin_a and rxin_b as a complex sample pair. When de-asserted, only input from rxin_b is used for the power measurement. : When asserted, the pmeter0 block takes input from both rxin_a and rxin_b as a complex sample pair. When de-asserted, only input from rxin_a is used for the power measurement. Register name: RECV_CONFIG1 Page: 0x1800 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 75 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Address: 0x5 BIT15 0 msb_pos_d(2:0) 0 0 msb_pos_b(2:0) 0 0 offset_bin_d 0 0 offset_bin_b 0 0 msb_pos_c(2:0) 0 0 0 msb_pos_a(2:0) 0 0 BIT7 msb_pos_X(2:0) BIT8 offset_bin_c 0 BIT0 offset_bin_a 0 : Places the MSB of the input word from the ADC. The value programmed into the 3 bits is the number of bit positions to the left of bit16 in the input word, that the MSB is located. For example, if a 14bit input word is driving rxin_a input and is aligned with rxin_a_0, then msb_pos_a is programmed to “010” meaning 2 bits shifted down from bit 16 is the MSB. X={a,b,c,d} : rxin_X input data is in offset binary and not 2’s complement. If set, the input value will be converted to 2s complement using the MSB from the corresponding msb_pos_X value. X={a,b,c,d} Note that the internal ADCs use 2’s complement format, so offset_bin_A and offset_bin_B must be set. offset_bin_X Register name: NZ_PWR_MASK Page: 0x1800 Address: 0x6 BIT15 BIT8 0 0 0 nz_pwr_mask (15:8) 0 0 0 0 0 nz_pwr_mask (7:0) 0 0 0 0 0 0 BIT7 nz_pwr_mask(15:0) 0 BIT0 0 : Used with the rduz_sens_ena and selects the noise bits to be added to the ADC input sample when asserted. Register name: RECV_PMETER_SYNC Page: 0x1800 Address: 0x7 BIT15 recv_pmet er0_ena 0 BIT7 recv_pmet er2_ena 0 ssel_recv_pmeter0(2:0) 0 0 0 0 0 recv_pmet er3_ena 0 0 ssel_ recv_pmeter2(2:0) 0 recv_pmeter0_ena : recv_pmeter1_ena : recv_pmeter2_ena : recv_pmeter3_ena : ssel_ recv_pmeter0(2:0) : ssel_ recv_pmeter1(2:0) : ssel_ recv_pmeter2(2:0) : ssel_ recv_pmeter3(2:0) : 0 BIT8 ssel_ recv_pmeter1(2:0) recv_pmet er1_ena 0 0 0 BIT0 ssel_ recv_pmeter3(2:0) 0 0 Enables the Receive Input Interface pmeter0 block when set Enables the Receive Input Interface pmeter1 block when set Enables the Receive Input Interface pmeter2 block when set Enables the Receive Input Interface pmeter3 block when set Selects the sync source for the Receive Input Interface pmeter0 block Selects the sync source for the Receive Input Interface pmeter1 block Selects the sync source for the Receive Input Interface pmeter2 block Selects the sync source for the Receive Input Interface pmeter3 block PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 76 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Register name: RECV_PMETER0_SQR_SUM_LSB Page: 0x1800 Address: 0x8 BIT15 BIT8 0 0 0 recv_pmeter0_sqr_sum (15:8) 0 0 0 0 0 recv_pmeter0_sqr_sum (7:0) 0 0 0 0 0 0 BIT7 0 BIT0 0 recv_pmeter0_sqr_sum(15:0) : The sqr_sum register controls the number of samples to accumulate for a power measurement. Ia is (or Ia & Qa if complex mode is selected are) squared and accumulated. Eight Ia samples (or eight sample pairs of Ia and Qa samples) equal to one sqr_sum count. The accumulation interval is initiated when the sync is asserted and the programmed (8*sync_delay+2) samples has expired or when the interval start time is reached. When the (8*sqr_sum+1) sample time is reached, the accumulated powers are made available for MPU access and an interrupt is generated. Register name: RECV_PMETER0_STRT_INTVL_LSB Page: 0x1800 Address: 0x9 BIT15 BIT8 0 0 0 recv_pmeter0_strt_intrvl (15:8) 0 0 0 0 0 recv_pmeter0_strt_intrvl (7:0) 0 0 0 0 0 0 BIT7 0 BIT0 0 recv_pmeter0_strt_intrvl(15:0) : The start interval timer is the interval over which the sqr_sum is restarted. The timer value is (8*strt_intrvl + 1) samples and must be larger than (8*sqr_sum+1) samples. The interval start counter and RMS power accumulation is started at the sync pulse after the programmed delay and every time the STRT_INTRVL counter reaches its limit. Register name: RECV_PMETER0_SYNC_DLY Page: 0x1800 Address: 0xA BIT15 delay_line_0(5:0) 0 0 0 0 0 0 0 unused 0 0 0 0 0 BIT7 delay_line_0(5:0) : recv_pmeter0_sync_delay(8:0) : recv_pmeter0_sync_delay (7:0) 0 0 BIT8 recv_pmete r0_sync_del ay(8) 0 BIT0 0 Pointer offset for the rxin_a path variable delay line. Larger values result in larger pointer offsets and therefore more path delay. Programmable start delay from sync, in eight sample units. The actual value is (8*sync_delay + 2) samples. Register name: RECV_PMETER0_CONFIG Page: 0x1800 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 77 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Address: 0xB BIT15 recv_pmeter0_sqr_sum(20:16) 0 0 0 0 unused unused unused 0 0 0 0 BIT7 recv_pmeter0_strt_ intrvl(17:16) 0 0 BIT8 recv_pmeter0_strt_intrvl(20:18) 0 0 0 BIT0 ssel_delay_line_0(2:0) 0 0 0 recv_pmeter0_sqr_sum(20:16) : MSBs of sqr_sum value, in 8 sample units. recv_pmeter0_strt_intrvl(20:16): MSBs of start interval value, in 8 sample units. ssel_delay_line_0(2:0) : Sync source selection for the 64 sample delay line pointer value update Register name: RECV_PMETER1_SQR_SUM_LSB Page: 0x1800 Address: 0xC BIT15 BIT8 0 0 0 recv_pmeter1_sqr_sum (15:8) 0 0 0 0 0 recv_pmeter1_sqr_sum (7:0) 0 0 0 0 0 0 BIT7 0 BIT0 0 recv_pmeter1_sqr_sum(15:0) : Lower 16bits of the sqr_sum interval timer, in 8 sample units. Register name: RECV_PMETER1_STRT_INTVL_LSB Page: 0x1800 Address: 0xD BIT15 BIT8 0 0 0 recv_pmeter1_strt_intrvl (15:8) 0 0 0 0 0 recv_pmeter1_strt_intrvl (7:0) 0 0 0 0 0 0 BIT7 0 BIT0 0 recv_pmeter1_strt_intrvl(15:0) : Lower 16bits of the interval timer, in 8 sample units. Register name: RECV_PMETER1_SYNC_DLY Page: 0x1800 Address: 0xE BIT15 delay_line_1(5:0) 0 0 0 0 0 0 0 unused 0 0 0 0 0 BIT7 delay_line_1(5:0) : recv_pmeter1_sync_delay(8:0) : recv_pmeter1_sync_delay (7:0) 0 0 BIT8 recv_pmet er1_sync_ delay(8) 0 BIT0 0 Pointer offset for the rxin_b path variable delay line. Larger values result in larger pointer offsets and therefore more path delay. Programmable start delay from sync, in 8 sample units. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 78 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Register name: RECV_PMETER1_CONFIG Page: 0x1800 Address: 0xF BIT15 recv_pmeter1_sqr_sum(20:16) 0 0 0 0 unused unused unused 0 0 0 0 BIT7 recv_pmeter1_strt_ intrvl(17:16) 0 0 BIT8 recv_pmeter1_strt_intrvl(20:18) 0 0 0 BIT0 ssel_delay_line_1(2:0) 0 0 0 recv_pmeter1_sqr_sum(20:16) : MSBs of sqr_sum value, in 8 sample units. recv_pmeter1_strt_intrvl(20:16): MSBs of start interval value, in 8 sample units. ssel_delay_line_1(2:0) : Sync source selection for the 64 sample delay line pointer value update Register name: RECV_PMETER2_SQR_SUM_LSB Page: 0x1800 Address: 0x10 BIT15 BIT8 0 0 0 recv_pmeter2_sqr_sum (15:8) 0 0 0 0 0 recv_pmeter2_sqr_sum (7:0) 0 0 0 0 0 0 BIT7 0 BIT0 0 recv_pmeter2_sqr_sum(15:0) : Lower 16bits of the sqr_sum interval timer, in 8 sample units. Register name: RECV_PMETER2_STRT_INTVL_LSB Page: 0x1800 Address: 0x11 BIT15 BIT8 0 0 0 recv_pmeter2_strt_intrvl (15:8) 0 0 0 0 0 recv_pmeter2_strt_intrvl (7:0) 0 0 0 0 0 0 BIT7 0 BIT0 0 recv_pmeter2_strt_intrvl(15:0) : Lower 16bits of the interval timer, in 8 sample units. Register name: RECV_PMETER2_SYNC_DLY Page: 0x1800 Address: 0x12 BIT15 delay_line_2(5:0) 0 0 0 0 0 0 0 unused 0 0 0 0 0 BIT7 delay_line_2(5:0) : recv_pmeter2_sync_delay (7:0) 0 0 BIT8 recv_pmet er2_sync_ delay(8) 0 BIT0 0 Pointer offset for the rxin_c path variable delay line. Larger values result in larger pointer offsets and therefore more path delay. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 79 WWW.TI.COM AFE8406 PRODUCT PREVIEW recv_pmeter2_sync_delay (8:0) : SLWS168 - OCTOBER 2005 Programmable start delay from sync, in 8 sample units. Register name: RECV_PMETER2_CONFIG Page: 0x1800 Address: 0x13 BIT15 recv_pmeter2_sqr_sum(20:16) 0 0 0 0 unused unused unused 0 0 0 0 BIT7 recv_pmeter2_strt_ intrvl(17:16) 0 0 BIT8 recv_pmeter2_strt_intrvl(20:18) 0 0 0 BIT0 ssel_delay_line_2(2:0) 0 0 0 recv_pmeter2_sqr_sum(20:16) : MSBs of sqr_sum value, in 8 sample units. recv_pmeter2_strt_intrvl(20:16): MSBs of start interval value, in 8 sample units. ssel_delay_line_2(2:0) : Sync source selection for the 64 sample delay line pointer value update Register name: RECV_PMETER3_SQR_SUM_LSB Page: 0x1800 Address: 0x14 BIT15 BIT8 0 0 0 recv_pmeter3_sqr_sum (15:8) 0 0 0 0 0 recv_pmeter3_sqr_sum (7:0) 0 0 0 0 0 0 BIT7 0 BIT0 0 recv_pmeter3_sqr_sum(15:0) : Lower 16bits of the sqr_sum interval timer, in 8 sample units. Register name: RECV_PMETER3_STRT_INTVL_LSB Page: 0x1800 Address: 0x15 BIT15 BIT8 0 0 0 recv_pmeter3_strt_intrvl (15:8) 0 0 0 0 0 recv_pmeter3_strt_intrvl (7:0) 0 0 0 0 0 0 BIT7 0 BIT0 0 recv_pmeter3_strt_intrvl(15:0) : Lower 16bits of the interval timer, in 8 sample units. Register name: RECV_PMETER3_SYNC_DLY Page: 0x1800 Address: 0x16 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 80 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 BIT15 delay_line_3(5:0) 0 0 0 0 0 0 0 unused 0 0 0 0 0 BIT7 delay_line_3(5:0) : recv_pmeter3_sync_delay(8:0) : recv_pmeter3_sync_delay (7:0) 0 0 BIT8 recv_pme ter3_sync_ delay(8) 0 BIT0 0 Pointer offset for the rxin_d path variable delay line. Larger values result in larger pointer offsets and therefore more path delay. Programmable start delay from sync, in 8 sample units. Register name: RECV_PMETER3_CONFIG Page: 0x1800 Address: 0x17 BIT15 recv_pmeter3_sqr_sum(20:16) 0 0 0 0 unused unused unused 0 0 0 0 BIT7 recv_pmeter3_strt_ intrvl(17:16) 0 0 BIT8 recv_pmeter3_strt_intrvl(20:18) 0 0 0 BIT0 ssel_delay_line_3(2:0) 0 0 0 recv_pmeter3_sqr_sum(20:16) : MSBs of sqr_sum value, in 8 sample units recv_pmeter3_strt_intrvl(20:16): MSBs of start interval value, in 8 sample units ssel_delay_line_3(2:0) : Sync source selection for the 64 sample delay line pointer value update Register name: RECV_SLF_TST_VALUE Page: 0x1800 Address: 0x18 BIT15 BIT8 0 0 0 self_test_constant(15:8) 0 0 0 0 0 self_test_constant(7:0) 0 0 0 0 0 0 BIT7 0 BIT0 0 self_test_constant(15:0) : 16 bit constant presented at the test and noise generator output when enabled. Used for test and debug purposes. Register name: RECV _PMETER0_LSB Page: 0x1820 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 81 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Address: 0x20 READ ONLY BIT15 BIT8 0 0 0 recv_pmeter0(15:8) 0 0 0 0 0 recv_pmeter0(7:0) 0 0 0 0 0 0 BIT7 recv_pmeter0(15:0) 0 BIT0 0 : Lower bits of the power meter 0 measurement Register name: RECV_PMETER0_MID Page: 0x1820 Address: 0x21 READ ONLY BIT15 BIT8 0 0 0 recv_pmeter0(31:24) 0 0 0 0 0 recv_pmeter0(23:16) 0 0 0 0 0 0 BIT7 recv_pmeter0(31:16) 0 BIT0 0 : Mid bits of the power meter 0 measurement Register name: RECV_PMETER0_LMSB Page: 0x1820 Address: 0x22 READ ONLY BIT15 BIT8 0 0 0 recv_pmeter0(47:40) 0 0 0 0 0 recv_pmeter0(39:32) 0 0 0 0 0 0 BIT7 recv_pmeter0(47:32) 0 BIT0 0 : Lower MSB bits of the power meter 0 measurement Register name: RECV_PMETER0_UMSB Page: 0x1820 Address: 0x23 READ ONLY BIT15 unused 0 BIT7 0 unused 0 unused 0 0 0 recv_pmeter0(57:48) unused 0 unused 0 recv_pmeter0(55:48) 0 0 unused 0 0 BIT8 recv_pmeter0(57:56) 0 0 BIT0 0 0 : Upper MSB bits of the power meter 0 measurement Register name: RECV_PMETER1_LSB Page: 0x1820 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 82 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Address: 0x24 READ ONLY BIT15 BIT8 0 0 0 recv_pmeter1(15:8) 0 0 0 0 0 recv_pmeter1(7:0) 0 0 0 0 0 0 BIT7 recv_pmeter1(15:0) 0 BIT0 0 : Lower bits of the power meter 1 measurement Register name: RECV_PMETER1_MID Page: 0x1820 Address: 0x25 READ ONLY BIT15 BIT8 0 0 0 recv_pmeter1(31:24) 0 0 0 0 0 recv_pmeter1(23:16) 0 0 0 0 0 0 BIT7 recv_pmeter1(31:16) 0 BIT0 0 : Mid bits of the power meter 1 measurement Register name: RECV_PMETER1_LMSB Page: 0x1820 Address: 0x26 READ ONLY BIT15 BIT8 0 0 0 recv_pmeter1(47:40) 0 0 0 0 0 recv_pmeter1(39:32) 0 0 0 0 0 0 BIT7 recv_pmeter1(47:32) 0 BIT0 0 : Lower MSB bits of the power meter 1 measurement Register name: RECV_PMETER1_UMSB Page: 0x1820 Address: 0x27 READ ONLY BIT15 unused 0 BIT7 0 unused 0 unused 0 0 0 recv_pmeter1(57:48) unused 0 unused 0 recv_pmeter1(55:48) 0 0 unused 0 0 BIT8 recv_pmeter1(57:56) 0 0 BIT0 0 0 : Upper MSB bits of the power meter 1 measurement Register name: RECV_PMETER2_LSB Page: 0x1820 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 83 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Address: 0x28 READ ONLY BIT15 BIT8 0 0 0 recv_pmeter2(15:8) 0 0 0 0 0 recv_pmeter2(7:0) 0 0 0 0 0 0 BIT7 recv_pmeter2(15:0) 0 BIT0 0 : Lower bits of the power meter 2 measurement Register name: RECV_PMETER2_MID Page: 0x1820 Address: 0x29 READ ONLY BIT15 BIT8 0 0 0 recv_pmeter2(31:24) 0 0 0 0 0 recv_pmeter2(23:16) 0 0 0 0 0 0 BIT7 recv_pmeter2(31:16) 0 BIT0 0 : Mid bits of the power meter 2 measurement Register name: RECV_PMETER2_LMSB Page: 0x1820 Address: 0x2A READ ONLY BIT15 BIT8 0 0 0 recv_pmeter2(47:40) 0 0 0 0 0 recv_pmeter2(39:32) 0 0 0 0 0 0 BIT7 recv_pmeter2(47:32) 0 BIT0 0 : Lower MSB bits of the power meter 2 measurement Register name: RECV_PMETER2_UMSB Page: 0x1820 Address: 0x2B READ ONLY BIT15 unused 0 BIT7 0 unused 0 unused 0 0 0 recv_pmeter2(57:48) unused 0 unused 0 recv_pmeter2(55:48) 0 0 unused 0 0 BIT8 recv_pmeter2(57:56) 0 0 BIT0 0 0 : Upper MSB bits of the power meter 2 measurement Register name: RECV_PMETER3_LSB Page: 0x1820 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 84 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Address: 0x2C READ ONLY BIT15 BIT8 0 0 0 recv_pmeter3(15:8) 0 0 0 0 0 recv_pmeter3(7:0) 0 0 0 0 0 0 BIT7 recv_pmeter3(15:0) 0 BIT0 0 : Lower bits of the power meter 3 measurement Register name: RECV_PMETER3_MID Page: 0x1820 Address: 0x2D READ ONLY BIT15 BIT8 0 0 0 recv_pmeter3(31:24) 0 0 0 0 0 recv_pmeter3(23:16) 0 0 0 0 0 0 BIT7 recv_pmeter3(31:16) 0 BIT0 0 : Mid bits of the power meter 3 measurement Register name: RECV_PMETER3_LMSB Page: 0x1820 Address: 0x2E READ_ONLY BIT15 BIT8 0 0 0 recv_pmeter3(47:40) 0 0 0 0 0 recv_pmeter3(39:32) 0 0 0 0 0 0 BIT7 recv_pmeter3(47:32) 0 BIT0 0 : Lower MSB bits of the power meter 3 measurement Register name: RECV_PMETER3_UMSB Page: 0x1820 Address: 0x2F READ_ONLY BIT15 unused 0 BIT7 0 unused 0 unused 0 0 0 recv_pmeter3(57:48) unused 0 unused 0 recv_pmeter3(55:48) 0 0 unused 0 0 BIT8 recv_pmeter3(57:56) 0 0 BIT0 0 0 : Upper MSB bits of the power meter 3 measurement PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 85 WWW.TI.COM AFE8406 PRODUCT PREVIEW 3.5.4 SLWS168 - OCTOBER 2005 Receive AGC Controls (Pages 0x1840 and 0x1860) Register name: RAGC_CONFIG0 Page: 0x1840 Address: 0x0 BIT15 hp_ena_0 0 BIT7 ragc_ bypass_0 1 Hp_ena_1 0 hp_ena_2 0 hp_ena_3 0 sd_ena_0 0 sd_ena_1 0 sd_ena_2 0 ragc_ bypass_1 1 ragc_ bypass_2 1 ragc_ bypass_3 1 unused unused unused BIT8 sd_ena_3 0 BIT0 unused 0 0 0 0 hp_ena_X sd_ena_X ragc_bypass_X : Enables the high pass filter in receive AGC X when set. : Enables the Signal Detect block in receive AGC X when set. : Bypasses the receive AGC X block when set. Register name: RAGC_CONFIG1 Page: 0x1840 Address: 0x1 BIT15 ragc_ freeze_0 0 BIT7 complex01 0 ragc_ freeze_1 0 ragc_ freeze_2 0 complex23 0 0 ragc_ freeze_3 0 ragc_ clear_0 0 ssel_ragc_interval_0(2:0) 0 0 BIT8 ragc_ clear_3 0 BIT0 ssel_ragc_interval_1(2:0) 0 0 0 ragc_ clear_1 0 ragc_ clear_2 0 ragc_freeze_X ragc_clear_X complex01 : Freezes the receive AGC block when set. : Clears the loop error accumulator when set. : When set, receive AGC 0 uses complex input with the second sample stream coming from receive AGC 1. The clip detect, high pass, and squarer from receive AGC 1 are used to generate inputs for receive AGC 0. complex23 : When set, receive AGC 2 uses complex input with the second sample stream coming from receive AGC 3. The clip detect, high pass, and squarer from receive AGC 3 are used to generate inputs for receive AGC 2. ssel_ragc_interval_0(2:0) : Selects the sync source for receive AGC 0. After a programmed delay from sync, the interval update timer is started. ssel_ragc_interval_1(2:0) : Selects the sync source for receive AGC 1. After a programmed delay from sync, the interval update timer is started. Register name: RAGC_CONFIG2 Page: 0x1840 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 86 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Address: 0x2 BIT15 ssel_ragc_freeze_0(2:0) 0 BIT7 ssel_ragc_fr eeze_2(0) 0 0 ssel_ragc_freeze_1(2:0) 0 0 ssel_ragc_freeze_3(2:0) 0 0 0 unused 0 0 BIT8 ssel_ragc_ freeze_2(2:1) 0 0 0 BIT0 ssel_ragc_interval_2(2:0) 0 0 0 ssel_ragc_freeze_X(2:0) : Selects the sync source that will freeze the receive AGC loop when asserted. ssel_ragc_interval_2(2:0) : Selects the sync source for receive AGC 2. After a programmed delay from sync, the interval update timer is started. Register name: RAGC_CONFIG3 Page: 0x1840 Address: 0x3 BIT15 ssel_ragc_clear_0(2:0) 0 BIT7 ssel_ragc_ clear_2(0) 0 0 ssel_ragc_clear_1(2:0) 0 0 ssel_ragc_clear_3(2:0) 0 0 0 unused 0 0 BIT8 ssel_ragc_ clear_2(2:1) 0 0 0 BIT0 ssel_ragc_interval_3(2:0) 0 0 0 ssel_agc_clear_X(2:0) : Controls the selection of the sync that will clear the receive AGC error accumulator. ssel_agc_interval_3(2:0): Selects the sync source for receive AGC 3. After a programmed delay from sync, the interval update timer is started. Register name: RAGC0_INTEGINVL_LSB Page: 0x1840 Address: 0x4 BIT15 BIT8 0 0 0 integ_interval_0(15:8) 0 0 0 0 0 integ_interval_0(7:0) 0 0 0 0 0 0 BIT7 integ_interval_0(15:0) 0 BIT0 0 : The 16 LSBs of the integration time for receive AGC 0 Register name: RAGC0_INTEGINVL_MSB Page: 0x1840 Address: 0x5 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 87 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 BIT15 BIT8 0 0 0 ragc_update_0(7:0) 0 0 0 0 0 integ_interval_0(23:16) 0 0 0 0 0 0 BIT7 0 BIT0 0 ragc_update_0(7:0) : Sets the number of receive AGC updates per sync event (0x00 is infinite). integ_interval_0(23:16) : The eight MSBs of the integration time for receive AGC 0 Register name: RAGC0_CONFIG0 Page: 0x1840 Address: 0x6 BIT15 BIT8 0 0 0 0 hp_corner_0(2:0) 0 0 ragc_sync_delay_0(7:0) 0 0 0 0 acc_shift_0(4:0) 0 0 BIT7 0 0 0 BIT0 0 ragc_sync_delay_0(7:0) : The input sync to the receive AGC block is delayed by this number of samples. hp_corner_0(2:0) : Sets the corner frequency of the high pass filter. Larger values result in higher corner frequencies acc_shift_0(4:0) : Selects the integrated power measurements result bits to be used as the error lookup table address. A larger number means fewer samples will have to be integrated to achieve the same result. Register name: RAGC0_CONFIG1 Page: 0x1840 Address: 0x7 BIT15 acc_offset_0(5:0) 0 0 0 0 0 err_shift_0(2:0) 0 0 0 0 delay_adj_0(4:0) 0 BIT7 acc_offset_0(5:0) err_shift_0(4:0) delay_adj_0(4:0) 0 0 BIT8 err_shift_0(4:3) 0 0 BIT0 0 0 : Constant subtracted from the integrated power measurement result before the error lookup table. : Adjusts the loop gain by controlling the amount of shifting applied to the error lookup table output. Larger values result in higher gain. : Sets the delay difference, in samples, between the DVGA outputs and the value applied to the sample multiplier. Register name: RAGC0_SD_THRESH Page: 0x1840 Address: 0x8 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 88 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 BIT15 BIT8 0 0 0 sd_thresh_0(15:8) 0 0 0 0 0 sd_thresh_0(7:0) 0 0 0 0 0 0 BIT7 sd_thresh_0(15:0) 0 BIT0 0 : This is the threshold used by the Signal Detect block to determine if there is signal on the inputs. The comparison is done to the output of the squarer block, which is a 32 bit word. Because of this, these bits are aligned with bits 24 down to 8 of the 32 bit squared value. Register name: RAGC0_SD_TIMER Page: 0x1840 Address: 0x9 BIT15 BIT8 0 0 0 sd _timer_0(15:8) 0 0 0 0 0 sd _timer_0(7:0) 0 0 0 0 0 0 BIT7 sd_timer_0(15:0) 0 BIT0 0 : Qualification window timer for loss of input signal. Register name: RAGC0_SD_SAMPLES Page: 0x1840 Address: 0xA BIT15 BIT8 0 0 0 sd_samples_0(15:8) 0 0 0 0 0 sd_samples_0(7:0) 0 0 0 0 0 0 BIT7 sd_samples_0(15:0) 0 BIT0 0 : Number of samples that must be below the sd_thresh_X within the sd_timer_X timer value for the loss of signal condition to occur. Register name: RAGC0_CLIP_HITHRESH Page: 0x1840 Address: 0xB BIT15 BIT8 0 0 0 clip_hi_thresh_0(15:8) 0 0 0 0 0 clip_hi_thresh_0(7:0) 0 0 0 0 0 0 BIT7 clip_hi_thresh_0(15:0) 0 BIT0 0 : The high threshold value for clip detection. Register name: RAGC0_CLIP_LOTHRESH Page: 0x1840 Address: 0xC PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 89 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 BIT15 BIT8 0 0 0 clip_lo_thresh_0(15:8) 0 0 0 0 0 clip_lo_thresh_0(7:0) 0 0 0 0 0 0 BIT7 clip_lo_thresh_0(15:0) 0 BIT0 0 : The low threshold value for clip detection. Register name: RAGC0_CLIP_HITIMER Page: 0x1840 Address: 0xD BIT15 BIT8 0 0 0 clip_hi_timer_0(15:8) 0 0 0 0 0 clip_hi_timer_0(7:0) 0 0 0 0 0 0 BIT7 clip_hi_timer_0(15:0) 0 BIT0 0 : The high timer value in Samples Register name: RAGC0_CLIP_LOTIMER Page: 0x1840 Address: 0xE BIT15 BIT8 0 0 0 clip_lo_timer_0(15:8) 0 0 0 0 0 clip_lo_timer_0(7:0) 0 0 0 0 0 0 BIT7 clip_lo_timer_0(15:0) 0 BIT0 0 : The low timer value in Samples. Register name: RAGC0_CLIP_SAMPLES Page: 0x1840 Address: 0xF BIT15 BIT8 0 0 0 clip_hi_samples_0(7:0) 0 0 0 0 0 clip_lo_samples_0(7:0) 0 0 0 0 0 0 BIT7 0 BIT0 0 clip_hi_samples_0(7:0) : Number of samples above the high threshold within the clip high time to enable the clip event. clip_lo_samples_0(7:0) : Number of samples below the low threshold within the clip low time to disable the clip event. Register name: RAGC0_CLIP_ERROR Page: 0x1840 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 90 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Address: 0x10 BIT15 BIT8 0 0 0 clip_error_0(15:8) 0 0 0 0 0 clip_error_0(7:0) 0 0 0 0 0 0 BIT7 clip_error_0(15:0) 0 BIT0 0 : This is the error value that is added into the loop accumulator when a clip is detected. Register name: RAGC1_INTEGINVL_LSB Page: 0x1840 Address: 0x11 BIT15 BIT8 0 0 0 integ_interval_1(15:8) 0 0 0 0 0 integ_interval_1(7:0) 0 0 0 0 0 0 BIT7 integ_interval_1(15:0) 0 BIT0 0 : The LSBs of the integration time for receive AGC 1 Register name: RAGC1_INTEGINVL_MSB Page: 0x1840 Address: 0x12 BIT15 BIT8 0 0 0 ragc_update_1(7:0) 0 0 0 0 0 integ_interval_1(23:16) 0 0 0 0 0 0 BIT7 0 BIT0 0 ragc_update_1(7:0) : Sets the number of receive AGC updates per sync event (0x00 is infinite). integ_interval_1(23:16) : The MSBs of the integration time for receive AGC 1 Register name: RAGC1_CONFIG0 Page: 0x1840 Address: 0x13 BIT15 BIT8 0 0 0 0 hp_corner_1(2:0) 0 0 ragc_sync_delay_1(7:0) 0 0 0 0 acc_shift_1(4:0) 0 0 BIT7 0 0 0 BIT0 0 ragc_sync_delay_1(7:0) : The input sync to the receive AGC block is delayed by this value of samples. hp_corner_1(2:0) : This sets the corner frequency of the High Pass filter. Larger values result in higher corner frequencies. acc_shift_1(4:0) : Selects the integrated power measurements result bits to be used as the error lookup table address. A larger number means fewer samples will have to be integrated to achieve the same result. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 91 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Register name: RAGC1_CONFIG1 Page: 0x1840 Address: 0x14 BIT15 acc_offset_1(5:0) 0 0 0 0 0 err_shift_1(2:0) 0 0 0 0 delay_adj_1(4:0) 0 BIT7 acc_offset_1(5:0) err_shift_1(4:0) delay_adj_1(4:0) 0 0 BIT8 err_shift_1(4:3) 0 0 BIT0 0 0 : Constant subtracted from the integrated power measurement result before the error lookup table. : Controls the loop gain by left shifting the error output. Larger values result in higher gain. : Sets the delay difference, in samples, between the DVGA outputs and the value applied to the sample multiplier. Register name: RAGC1_SD_THRESH Page: 0x1840 Address: 0x15 BIT15 BIT8 0 0 0 sd_thresh_1(15:8) 0 0 0 0 0 sd_thresh_1(7:0) 0 0 0 0 0 0 BIT7 sd_thresh_1(15:0) 0 BIT0 0 : This is the threshold used by the Signal Detect block to determine if there is signal on the inputs. The comparison is done to the output of the squarer block, which is a 32 bit word. Because of this, these bits are aligned with bits 24 down to 8 of the 32 bit squared value. Register name: RAGC1_SD_TIMER Page: 0x1840 Address: 0x16 BIT15 BIT8 0 0 0 sd_timer_1(15:8) 0 0 0 0 0 sd_timer_1(7:0) 0 0 0 0 0 0 BIT7 sd_timer_1(15:0) 0 BIT0 0 : After the first no signal sample occurs, this is the amount of samples that control the length of time to determine the loss of signal condition. Register name: RAGC1_SD_SAMPLES Page: 0x1840 Address: 0x17 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 92 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 BIT15 BIT8 0 0 0 sd_samples_1(15:8) 0 0 0 0 0 sd_samples_1(7:0) 0 0 0 0 0 0 BIT7 sd_samples_1(15:0) 0 BIT0 0 : Number of samples that must be below the sd_thresh_X threshold within the sd_timer_X timer value for the loss of signal condition to occur. Register name: RAGC1_CLIP_HITHRESH Page: 0x1840 Address: 0x18 BIT15 BIT8 0 0 0 clip_hi_thresh_1(15:8) 0 0 0 0 0 clip_hi_thresh_1(7:0) 0 0 0 0 0 0 BIT7 clip_hi_thresh_1(15:0) 0 BIT0 0 : The high threshold value for clip detection. Register name: RAGC1_CLIP_LOTHRESH Page: 0x1840 Address: 0x19 BIT15 BIT8 0 0 0 clip_lo_thresh_1(15:8) 0 0 0 0 0 clip_lo_thresh_1(7:0) 0 0 0 0 0 0 BIT7 clip_lo_thresh_1(15:0) 0 BIT0 0 : The low threshold value for clip detection. Register name: RAGC1_CLIP_HITIMER Page: 0x1840 Address: 0x1A BIT15 BIT8 0 0 0 clip_hi_timer_1(15:8) 0 0 0 0 0 clip_hi_timer_1(7:0) 0 0 0 0 0 0 BIT7 clip_hi_timer_1(15:0) 0 BIT0 0 : The high timer value in samples. Register name: RAGC1_CLIP_LOTIMER Page: 0x1840 Address: 0x1B PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 93 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 BIT15 BIT8 0 0 0 clip_lo_timer_1(15:8) 0 0 0 0 0 clip_lo_timer_1(7:0) 0 0 0 0 0 0 BIT7 clip_lo_timer_1(15:0) 0 BIT0 0 : The low timer value in samples. Register name: RAGC1_CLIP_SAMPLES Page: 0x1840 Address: 0x1C BIT15 BIT8 0 0 0 clip_hi_samples_1(7:0) 0 0 0 0 0 clip_lo_samples_1(7:0) 0 0 0 0 0 0 BIT7 0 BIT0 0 clip_hi_samples_1(7:0) : Number of samples above the high threshold within the clip high time to enable the clip event. clip_lo_samples_1(7:0) : Number of samples below the low threshold within the clip low time to disable the clip event. Register name: RAGC1_CLIP_ERROR Page: 0x1840 Address: 0x1D BIT15 BIT8 0 0 0 clip_error_1(15:8) 0 0 0 0 0 clip_error_1(7:0) 0 0 0 0 0 0 BIT7 clip_error_1(15:0) 0 BIT0 0 : This is the error value that is added into the loop accumulator when a clip is detected. Register name: RAGC2_INTEGINVL_LSB Page: 0x1840 Address: 0x1E BIT15 BIT8 0 0 0 integ_interval_2(15:8) 0 0 0 0 0 integ_interval_2(7:0) 0 0 0 0 0 0 BIT7 integ_interval_2(15:0) 0 BIT0 0 : The LSBs of the integration time for receive AGC 2 Register name: RAGC2_INTEGINVL_MSB Page: 0x1840 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 94 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Address: 0x1F BIT15 BIT8 0 0 0 ragc_update_2(7:0) 0 0 0 0 0 integ_interval_2(23:16) 0 0 0 0 0 0 BIT7 0 BIT0 0 ragc_update_2(7:0) : Sets the number of receive AGC updates per sync event (0x00 is infinite). integ_interval_2(23:16) : The MSBs of the integration time for receive AGC 2 Register name: RAGC2_CONFIG0 Page: 0x1860 Address: 0x20 BIT15 BIT8 0 0 0 0 hp_corner_2(2:0) 0 0 ragc_sync_delay_2(7:0) 0 0 0 0 acc_shift_2(4:0) 0 0 BIT7 0 0 0 BIT0 0 ragc_sync_delay_2(7:0) : The input sync to the receive AGC block is delayed by this value of samples. hp_corner_2(2:0) : This sets the corner frequency of the High Pass filter. Larger values result in higher corner frequencies. acc_shift_2(4:0) : Selects the integrated power measurements result bits to be used as the error lookup table address. A larger number means fewer samples will have to be integrated to achieve the same result. Register name: RAGC2_CONFIG1 Page: 0x1860 Address: 0x21 BIT15 acc_offset_2(5:0) 0 0 0 0 0 err_shift_2(2:0) 0 0 0 0 delay_adj_2(4:0) 0 BIT7 acc_offset_2(5:0) err_shift_2(4:0) delay_adj_2(4:0) 0 0 BIT8 err_shift_2(4:3) 0 0 BIT0 0 0 : Constant subtracted from the integrated power measurement result before the error lookup table. : Controls the loop gain by left shifting the error output. Larger values result in higher gain.. : Sets the delay difference, in samples, between the DVGA outputs and the value applied to the sample multiplier. Register name: RAGC2_SD_THRESH Page: 0x1860 Address: 0x22 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 95 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 BIT15 BIT8 0 0 0 sd_thresh_2(15:8) 0 0 0 0 0 sd_thresh_2(7:0) 0 0 0 0 0 0 BIT7 sd_thresh_2(15:0) 0 BIT0 0 : This is the threshold used by the Signal Detect block to determine if there is signal on the inputs. The comparison is done to the output of the squarer block, which is a 32 bit word. Because of this, these bits are aligned with bits 24 down to 8 of the 32 bit squared value. Register name: RAGC2_SD_TIMER Page: 0x1860 Address: 0x23 BIT15 BIT8 0 0 0 sd_timer_2(15:8) 0 0 0 0 0 sd_timer_2(7:0) 0 0 0 0 0 0 BIT7 sd_timer_2(15:0) 0 BIT0 0 : After the first no signal sample occurs, this is the amount of samples that control the length of time to determine the loss of signal condition. Register name: RAGC2_SD_SAMPLES Page: 0x1860 Address: 0x24 BIT15 BIT8 0 0 0 sd_samples_2(15:8) 0 0 0 0 0 sd_samples_2(7:0) 0 0 0 0 0 0 BIT7 sd_samples_2(15:0) 0 BIT0 0 : Number of samples that must be below the sd_thresh_X threshold within the sd_timer_X timer value for the loss of signal condition to occur. Register name: RAGC2_CLIP_HITHRESH Page: 0x1860 Address: 0x25 BIT15 BIT8 0 0 0 clip_hi_thresh_2(15:8) 0 0 0 0 0 clip_hi_thresh_2(7:0) 0 0 0 0 0 0 BIT7 clip_hi_thresh_2(15:0) 0 BIT0 0 : The high threshold value for clip detection. Register name: RAGC2_CLIP_LOTHRESH Page: 0x1860 Address: 0x26 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 96 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 BIT15 BIT8 0 0 0 clip_lo_thresh_2(15:8) 0 0 0 0 0 clip_lo_thresh_2(7:0) 0 0 0 0 0 0 BIT7 clip_lo_thresh_2(15:0) 0 BIT0 0 : The low threshold value for clip detection. Register name: RAGC2_CLIP_HITIMER Page: 0x1860 Address: 0x27 BIT15 BIT8 0 0 0 clip_hi_timer_2(15:8) 0 0 0 0 0 clip_hi_timer_2(7:0) 0 0 0 0 0 0 BIT7 clip_hi_timer_2(15:0) 0 BIT0 0 : The high timer value in samples Register name: RAGC2_CLIP_LOTIMER Page: 0x1860 Address: 0x28 BIT15 BIT8 0 0 0 clip_lo_timer_2(15:8) 0 0 0 0 0 clip_lo_timer_2(7:0) 0 0 0 0 0 0 BIT7 clip_lo_timer_2(15:0) 0 BIT0 0 : The low timer value in samples. Register name: RAGC2_CLIP_SAMPLES Page: 0x1860 Address: 0x29 BIT15 BIT8 0 0 0 clip_hi_samples_2(7:0) 0 0 0 0 0 clip_lo_samples_2(7:0) 0 0 0 0 0 0 BIT7 0 BIT0 0 clip_hi_samples_2(7:0) : Number of samples above the high threshold within the clip high time to enable the clip event. clip_lo_samples_2(7:0) : Number of samples below the low threshold within the clip low time to disable the clip event. Register name: RAGC2_CLIP_ERROR Page: 0x1860 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 97 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Address: 0x2A BIT15 BIT8 0 0 0 clip_error_2(15:8) 0 0 0 0 0 clip_error_2(7:0) 0 0 0 0 0 0 BIT7 clip_error_2(15:0) 0 BIT0 0 : This is the error value that is added into the loop accumulator when a clip is detected. Register name: RAGC3_INTEGINVL_LSB Page: 0x1860 Address: 0x2B BIT15 BIT8 0 0 0 integ_interval_3(15:8) 0 0 0 0 0 integ_interval_3(7:0) 0 0 0 0 0 0 BIT7 integ_interval_3(15:0) 0 BIT0 0 : The LSBs of the integration time for receive AGC 3 Register name: RAGC3_INTEGINVL_MSB Page: 0x1860 Address: 0x2C BIT15 BIT8 0 0 0 ragc_update_3(7:0) 0 0 0 0 0 integ_interval_3(23:16) 0 0 0 0 0 0 BIT7 0 BIT0 0 ragc_update_3(7:0) : Sets the number of receive AGC updates per sync event (0x00 is infinite). integ_interval_3(23:16) : The MSBs of the integration time for receive AGC 3 Register name: RAGC3_CONFIG0 Page: 0x1860 Address: 0x2D BIT15 BIT8 0 0 0 0 hp_corner_3(2:0) 0 0 ragc_sync_delay_3(7:0) 0 0 0 0 acc_shift_3(4:0) 0 0 BIT7 0 0 0 BIT0 0 ragc_sync_delay_3(7:0) : The input sync to the receive AGC block is delayed by this value of samples. hp_corner_3(2:0) : This sets the corner frequency of the High Pass filter. Larger values result in higher corner frequencies. acc_shift_3(4:0) : Selects the integrated power measurements result bits to be used as the error lookup table address. A larger number means fewer samples will have to be integrated to achieve the same result. . PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 98 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Register name: RAGC3_CONFIG1 Page: 0x1860 Address: 0x2E BIT15 acc_offset_3(5:0) 0 0 0 0 0 err_shift_3(2:0) 0 0 0 0 delay_adj_3(4:0) 0 BIT7 acc_offset_3(5:0) err_shift_3(4:0) delay_adj_3(4:0) 0 0 BIT8 err_shift_3(4:3) 0 0 BIT0 0 0 : Constant subtracted from the integrated power measurement result before the error lookup table. : Controls the loop gain by left shifting the error output. Larger values result in higher gain. : Sets the delay difference, in samples, between the DVGA outputs and the value applied to the sample multiplier. Register name: RAGC3_SD_THRESH Page: 0x1860 Address: 0x2F BIT15 BIT8 0 0 0 sd_thresh_3(15:8) 0 0 0 0 0 sd_thresh_3(7:0) 0 0 0 0 0 0 BIT7 sd_thresh_3(15:0) 0 BIT0 0 : This is the threshold used by the Signal Detect block to determine if there is signal on the inputs. The comparis on is done to the output of the squarer block, which is a 32 bit word. Because of this, these bits are aligned with bits 24 down to 8 of the 32 bit squared value. Register name: RAGC3_SD_TIMER Page: 0x1860 Address: 0x30 BIT15 BIT8 0 0 0 sd_timer_3(15:8) 0 0 0 0 0 sd_timer_3(7:0) 0 0 0 0 0 0 BIT7 sd_timer_3(15:0) 0 BIT0 0 : After the first no signal sample occurs, this is the amount of samples that control the length of time to determine the loss of signal condition. Register name: RAGC3_SD_SAMPLES Page: 0x1860 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 99 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Address: 0x31 BIT15 BIT8 0 0 0 sd_samples_3(15:8) 0 0 0 0 0 sd_samples_3(7:0) 0 0 0 0 0 0 BIT7 sd_samples_3(15:0) 0 BIT0 0 : Number of samples that must be below the sd_thresh_X threshold within the sd_timer_X timer value for the loss of signal condition to occur. Register name: RAGC3_CLIP_HITHRESH Page: 0x1860 Address: 0x32 BIT15 BIT8 0 0 0 clip_hi_thresh_3(15:8) 0 0 0 0 0 clip_hi_thresh_3(7:0) 0 0 0 0 0 0 BIT7 clip_hi_thresh_3(15:0) 0 BIT0 0 : The high threshold value for clip detection. Register name: RAGC3_CLIP_LOTHRESH Page: 0x1860 Address: 0x33 BIT15 BIT8 0 0 0 clip_lo_thresh_3(15:8) 0 0 0 0 0 clip_lo_thresh_3(7:0) 0 0 0 0 0 0 BIT7 clip_lo_thresh_3(15:0) 0 BIT0 0 : The low threshold value for clip detection. Register name: RAGC3_CLIP_HITIMER Page: 0x1860 Address: 0x34 BIT15 BIT8 0 0 0 clip_hi_timer_3(15:8) 0 0 0 0 0 clip_hi_timer_3(7:0) 0 0 0 0 0 0 BIT7 clip_hi_timer_3(15:0) 0 BIT0 0 : The clip high timer value in samples Register name: RAGC3_CLIP_LOTIMER Page: 0x1860 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 100 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Address: 0x35 BIT15 BIT8 0 0 0 clip_lo_timer_3(15:8) 0 0 0 0 0 clip_lo_timer_3(7:0) 0 0 0 0 0 0 BIT7 clip_lo_timer_3(15:0) 0 BIT0 0 : The clip low timer value in samples. Register name: RAGC3_CLIP_SAMPLES Page: 0x1860 Address: 0x36 BIT15 BIT8 0 0 0 clip_hi_samples_3(7:0) 0 0 0 0 0 clip_lo_samples_3(7:0) 0 0 0 0 0 0 BIT7 0 BIT0 0 clip_hi_samples_3(7:0) : Number of samples above the high threshold within the clip high time to enable a clip event. clip_lo_samples_3(7:0) : Number of samples below the low threshold within the clip low time to disable a clip event. Register name: RAGC3_CLIP_ERROR Page: 0x1860 Address: 0x37 BIT15 BIT8 0 0 0 clip_error_3(15:8) 0 0 0 0 0 clip_error_3(7:0) 0 0 0 0 0 0 BIT7 clip_error_3(15:0) 0 BIT0 0 : Error value that is added into the loop accumulator when a clip is detected. Register name: RAGC0_ACCUM_LSB Page: 0x1860 Address: 0x38 READ ONLY BIT15 BIT8 0 0 0 ragc0_accum(15:8) 0 0 0 0 0 ragc0_accum (7:0) 0 0 0 0 0 0 BIT7 ragc0_accum(15:0) 0 BIT0 0 : lower 16 bits of the ragc0 error accumulator. Register name: RAGC0_ACCUM_MSB Page: 0x1860 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 101 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Address: 0x39 READ ONLY BIT15 BIT8 0 0 0 ragc0_accum(31:24) 0 0 0 0 0 ragc0_accum (23:16) 0 0 0 0 0 0 BIT7 ragc0_accum(31:16) 0 BIT0 0 : upper 16 bits of the ragc0 error accumulator. Register name: RAGC1_ACCUM_LSB Page: 0x1860 Address: 0x3A READ ONLY BIT15 BIT8 0 0 0 ragc1_accum(15:8) 0 0 0 0 0 ragc1_accum (7:0) 0 0 0 0 0 0 BIT7 ragc1_accum(15:0) 0 BIT0 0 : lower 16 bits of the ragc1 error accumulator. Register name: RAGC1_ACCUM_MSB Page: 0x1860 Addre ss: 0x3B READ ONLY BIT15 BIT8 0 0 0 ragc1_accum(31:24) 0 0 0 0 0 ragc1_accum (23:16) 0 0 0 0 0 0 BIT7 ragc1_accum(31:16) 0 BIT0 0 : upper 16 bits of the ragc1 error accumulator. Register name: RAGC2_ACCUM_LSB Page: 0x1860 Address: 0x3C READ ONLY BIT15 BIT8 0 0 0 ragc2_accum(15:8) 0 0 0 0 0 ragc2_accum (7:0) 0 0 0 0 0 0 BIT7 ragc2_accum(15:0) 0 BIT0 0 : lower 16 bits of the ragc2 error accumulator. Register name: RAGC2_ACCUM_MSB Page: 0x1860 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 102 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Address: 0x3D READ ONLY BIT15 BIT8 0 0 0 ragc2_accum(31:24) 0 0 0 0 0 ragc2_accum (23:16) 0 0 0 0 0 0 BIT7 ragc2_accum(31:16) 0 BIT0 0 : upper 16 bits of the ragc2 error accumulator. Register name: RAGC3_ACCUM_LSB Page: 0x1860 Address: 0x3E READ ONLY BIT15 BIT8 0 0 0 ragc3_accum(15:8) 0 0 0 0 0 ragc3_accum (7:0) 0 0 0 0 0 0 BIT7 ragc3_accum(15:0) 0 BIT0 0 : lower 16 bits of the ragc3 error accumulator. Register name: RAGC3_ACCUM_MSB Page: 0x1860 Address: 0x3F READ ONLY BIT15 BIT8 0 0 0 ragc3_accum(31:24) 0 0 0 0 0 ragc3_accum (23:16) 0 0 0 0 0 0 BIT7 ragc3_accum(31:16) 0 BIT0 0 : upper 16 bits of the ragc3 error accumulator. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 103 WWW.TI.COM AFE8406 PRODUCT PREVIEW 3.5.5 SLWS168 - OCTOBER 2005 DDC Channel Controls (Pages 0x0%00 and 0x0%20, where % = 1 to F is the 2*(DDC channel #)+1) Register name: FIR_MODE Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0x0 BIT15 cdma_mode 0 BIT7 unused 0 unused 0 BIT8 0 0 0 crastarttap_cfir(4:0) 0 0 cdma_mode crastarttap_pfir crastarttap_cfir 0 crastarttap_pfir(4:0) 0 0 0 unused 0 unused 0 0 BIT0 unused 0 : When asserted the DDC block is in CDMA mode (2 streams per DDC block). : These bits define the number of taps that PFIR will use for the filtering. : These bits define the number of taps that CFIR will use for the filtering. Formulas for the number of taps, in the different FIR’s, using the crastarttap word. DDC PFIR: 4*(crastarttap_pfir+1) DDC PFIR long mode: 8*(crastarttap_pfir+1) DDC CFIR: 2*(crastarttap_cfir+1) Register name: FIR_GAIN Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0x1 BIT15 0 BIT7 unused 0 pfir_gain(2:0) 0 unused 0 pfir_gain(2:0) cfir_gain 0 unused 0 unused 0 unused 0 unused 0 cfir_gain 0 unused 0 unused 0 unused 0 unused 0 BIT8 unused 0 BIT0 unused 0 : PFIR gain, from 2e-19 to 2e-12 for the receive PFIR. (“000” = 2e-19 and “111” = 2e-12) : When ‘0’ then the gain of the CFIR is 2e-19, otherwise when set to ‘1’ the gain is 2e-18. Register name: SQR_SUM Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0x2 BIT15 BIT8 0 0 0 pmeter_sqr_sum_ddc(15:8) 0 0 0 0 0 pmeter_sqr_sum_ddc(7:0) 0 0 0 0 0 0 BIT7 0 BIT0 0 pmeter_sqr_sum _ddc(15:0): The sqr_sum register is the number of 4 sample sets to accumulate for a power measurement. In CDMA mode, one sample set is the I & Q of the signal and diversity. Ia & Qa (signal) are each squared and accumulated and Ib & Qb (diversity) are squared and accumulated. In UMTS mode, each I and Q pair are squared and accumulated. 4 samples is equal to one SQR_SUM count. The count is initiated when the sync is asserted or when the interval start time is reached. When the SQR_NUM number is reached, the accumulated powers are made available for MPU access and an interrupt is generated. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 104 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Register name: STRT_INTRVL Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0x3 BIT15 BIT8 0 0 0 pmeter_sync_delay_ddc(7:0) 0 0 0 0 0 pmeter_interval_ddc(7:0) 0 0 0 0 0 0 BIT7 0 BIT0 0 pmeter_sync_delay_ddc(7:0): The delay from selected sync source to when the power calculation starts. The actual value is sync_delay + 1. pmeter_interval_ddc(7:0) : The start interval timer is the interval over which the SQR_SUM is restarted and must be greater than the SQR_SUM. The actual interval is interval + 1, and must be greater than the sqr_sum interval. The interval start counter and RMS power accumulation is started at the sync pulse after the programmed delay and every time the interval counter reaches its limit. This value is in 1024 sample units. Register name: CIC_MODE1 Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0x4 BIT15 BIT8 0 0 BIT7 cic_scale_b(1:0) 0 0 cic_scale_a(4:0) cic_scale_a(4:0) 0 cic_gain_ ddc 0 0 0 0 cic_scale_b(4:2) 0 0 BIT0 cic_decim(4:0) 0 0 0 0 0 : This sets the gain shift at the output of the A channel CIC. 0x00 is no shift, each increment by 1 increases the signal amplitude by 2X. : This sets the gain shift at the output of the B channel CIC. 0x00 is no shift, each increment by 1 increases the signal amplitude by 2X. : Adds a fixed gain of 12dB at the CIC output when asserted. : Sets the CIC decimation rate, where decimation is cic_decim + 1. cic_scale_b(4:0) cic_gain_ddc cic_decim(4:0) Register name: CIC_MODE2 Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0x5 BIT15 0 0 cic_m2_ena_a(5:0) 0 0 0 0 unused 0 unused 0 BIT7 0 cic_m2_ena_b(3:0) 0 0 cic_m2_ena_a(5:0) cic_m2_ena_b(5:0) 0 : Programs the A channel CIC fir sections M cic_m2_ena_a(0) controls the M value for the first the M value for the last comb section. : Programs the B channel CIC fir sections M cic_m2_ena_b(0) controls the M value for the first the M value for the last comb section. BIT8 cic_m2_ena_b(5:4) 0 0 BIT0 unused unused 0 0 value to 2 when set, 1 when cleared. comb section and cic_m2_ena_a(5) controls value to 2 when set, 1 when cleared. comb section and cic_m2_ena_b(5) controls PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 105 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Register name: TADJC Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0x6 DOUBLE BUFFERED, REQUIRES SYNC FOR LOADING BIT15 unused 0 BIT7 unused 0 unused 0 0 unused 0 tadj_offset_coarse_a(2:0) 0 0 0 tadj_offset_coarse_b(2:0) 0 0 unused 0 unused 0 unused 0 unused 0 BIT8 unused 0 BIT0 unused 0 tadj_offset_coarse_a(2:0) : This is the coarse time adjustment offset and acts as an offset from the write address in the delay ram. This value affects the A data in the path if CDMA mode is being used. Each LSB is one more offset between input to the course delay block and the output of the course block. tadj_offset_coarse_b(2:0) : Effects the B channel in CDMA, just as the above effects the A channel. Register name: TADJF Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0x7 DOUBLE BUFFERED, REQUIRES SYNC FOR LOADING BIT15 tadj_offset_fine_a(2:0) 0 0 0 BIT7 tadj_interp (0) 0 tadj_offset_fine_b(2:0) 0 0 0 unused unused unused unused unused 0 0 0 0 0 tadj_offset_fine_a(2:0) tadj_offset_fine_b(2:0) tadj_interp(2:0) BIT8 tadj_interp(2:1) 0 0 BIT0 unused unused 0 0 : This is the fine adjust (zero stuff offset) value. It adjusts the time delay at the rxclk rate. This value affects the A channel data in the path if CDMA mode is being used. : Same as above except this value affects the B channel data in CDMA mode. : This is the interpolation (zero stuff) value for the fine time adjust block. Interpolation can be from 1 to 8 (tadj_interp + 1). This value affects the A and B data in the path if CDMA mode is being used. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 106 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Register name: PHASEADD0A Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0x8 DOUBLE BUFFERED, REQUIRES SYNC FOR LOADING BIT15 BIT8 0 0 0 phase_add_a(15:8) 0 0 0 0 0 phase_add_a(7:0) 0 0 0 0 0 0 BIT7 phase_add_a(15:0) 0 BIT0 0 : This 32 bit word is used to control the frequency of the NCO. This value is added to the frequency accumulator every clock cycle (UMTS mode and Main channel in CDMA mode). Register name: PHASEADD1A Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0x9 DOUBLE BUFFERED, REQUIRES SYNC FOR LOADING BIT15 BIT8 0 0 0 phase_add_a(31:24) 0 0 0 0 0 phase_add_a(23:16) 0 0 0 0 0 0 BIT7 phase_add_a(31:16) 0 BIT0 0 : This 32 bit word is used to control the frequency of the NCO. This value is added to the frequency accumulator every clock cycle (UMTS mode and A channel in CDMA mode). Register name: PHASEADD0B Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0xA DOUBLE BUFFERED, REQUIRES SYNC FOR LOADING BIT15 BIT8 0 0 0 phase_add_b(15:8) 0 0 0 0 0 phase_add_b(7:0) 0 0 0 0 0 0 BIT7 phase_add_b(15:0) : 0 BIT0 0 This 32 bit word is used to control the frequency of the NCO. This value is added to the frequency accumulator every clock cycle (B channel in CDMA mode). PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 107 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Register name: PHASEADD1B Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0xB DOUBLE BUFFERED, REQ UIRES SYNC FOR LOADING BIT15 BIT8 0 0 0 phase_add_b(31:24) 0 0 0 0 0 phase_add_b(23:16) 0 0 0 0 0 0 BIT7 phase_add_b(31:16) 0 BIT0 0 : This 32 bit word is used to control the frequency of the NCO. This value is added to the frequency accumulator every clock cycle (B channel in CDMA mode). Register name: PHASE_OFFSETA Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0xC DOUBLE BUFFERED, REQUIRES SYNC FOR LOADING BIT15 BIT8 0 0 0 phase_offset_a(15:8) 0 0 0 0 0 phase_offset_a(7:0) 0 0 0 0 0 0 BIT7 phase_offset_a(15:0) 0 BIT0 0 : This is the fixed phase offset added to the output of the frequency accumulator for sinusoid generation in the NCO. (UMTS mode and A channel in CDMA mode) Register name: PHASE_OFFSETB Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0xD DOUBLE BUFFERED, REQUIRES SYNC FOR LOADING BIT15 BIT8 0 0 0 phase_offset_b(15:8) 0 0 0 0 0 phase_offset_b(7:0) 0 0 0 0 0 0 BIT7 phase_offset_b(15:0) 0 BIT0 0 : This is the fixed phase offset added to the output of the frequency accumulator for sinusoid generation in the NCO. (B channel in CDMA mode) PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 108 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Register name: CONFIG1 Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0xE BIT15 dither_ena 0 BIT7 unused 0 dither_mask(1:0) 0 0 pmeter_ sync_ disable 0 unused unused unused unused 0 0 0 0 dither_ena dither_mask(1) dither_mask(0) pmeter_sync_disable : : : : ddc_ena : muxed_data : mixer_gain mpu_ram_read : : zero_qsample : mux_pos : mux_factor : ddc_ena BIT8 mpu_ram_ read muxed _data mixer_gain 0 0 1 zero_ qsample 0 mux_pos 0 BIT0 mux_factor 0 0 This bit controls whether dither is turned on(1) or off(0). This bit controls the MASKing of the dither word’s MSB. (1= MASKed, 0=used in dither word) This bit controls the MASKing of the dither word’s MSB-1. (1= MASKed, 0=used in dither word) Turns off the sync to the channel power meter. This can be used to individually turn off syncs to a channels power meter while still having syncs to other power meters available. When set this turns on the DDC. When cleared, the clocks to this block are turned off. For the DDC blocks used as the second half in the long PFIR configuration, this bit should be cleared. When asserted the DDC mux block assumes that multiple channels are muxed together on one input data stream. For factory use only. For a 2X muxed stream it would look like: Sa0, Sb0, Sa1, Sb1, Sa2, Sb2 …. etc... Adds a fixed 6 dB of gain to the mixer output(before round and limiting) when asserted. (TESTING PURPOSES) Allows the coefficient RAMs in the PFIR/CFIR to be read out the mpu data bus. Unfortunately, this cannot be done during normal operation and must be done when the state of the output data is not important. THIS BIT MUST ONLY BE SET DURING THE MPU READ OPERATION AND MUST BE CLEARED FOR NORMAL DDC OPERATION. When asserted, the Q sample into the mixer is held to zero. For UMTS mode at any input rate, and CDMA mode with input rates of rxclk/2 or lower, this bit must be set for real only input data mode (also for muxed input data stream modes). For real only inputs at the full rxclk rate in CDMA mode, the remix_only bit must be set in the DDCCONFIG1 register. These bits set the position for selection in the muxed data stream. This value must be less than or equal to the mux_factor bits. These two bits set the number of channels in the data stream. 0=1 stream, 1=2 streams. The ch_rate_sel bits for the DDC should be programmed to rxclk/2 for the 2 streams mode. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 109 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Register name: CONFIG2 Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0xF BIT15 unused 0 BIT7 unused 0 unused 0 unused 0 unused 0 unused 0 0 0 ddc_tst_sel(5:0) unused 0 unused 0 ddc_tst_sel(5:0) 0 0 unused 0 BIT8 unused 0 BIT0 0 0 : This is the selection of which signal comes out the test bus. When a constant ‘0’ is selected this also reduces power by preventing the data at the input of the tst_blk from changing. It does not stop the clock however. The 36bits for the testbus are routed to the rxin_c, rxin_d, dvga_c and dvga_d pins on the chip. SYNC on dvga_c(0) AFLAG on dvga_d(5) N Y Y N N N N Y Y ddc_tst_sel(5:0) N N N N 001001 001010 001011 001100 Data selected for output (36 bits total) rxin_d(15:0), dvga_c(3:2), rxin_c(15:0), dvga_c(5:4) cons tant 0 pfir output - (35:18) I and (17:0) Q cfir output – (35:18) I and (17:0) Q tadj A output - (35:18) I and (17:0) Q tadj B output - (35:18) I and (17:0) Q nco SINE output – (35:20) zeroed (19:0) SINE nco COSINE output – (35:20) zeroed (19:0) COSINE cic output - (35:18) I and (17:0) Q agc output – (35:11) I and (10:0) Q {full 25b I result and upper 11b Q result} mix A output - (35:18) i*cos-q*sin and (17:0) i*sin+q*cos mix B output - (35:18) i*cos -q*sin and (17:0) i*sin+q*cos DDC MUX A output (35:18) I and (17:0) Q DDC MUX B output (35:18) I and (17:0) Q 000000 000001 000010 000011 000100 000101 000110 000111 001000 Register name: AGC_CONFIG1 Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0x10 BIT15 BIT8 0 agc_dblw(3:0) 0 0 0 0 agc_dabv(3:0) 0 0 0 agc_dzro(3:0) 0 0 0 0 agc_dsat(3:0) 0 0 BIT7 0 BIT0 0 agc_dblw(3:0) : The value to shift the gain that is then added to the accumulator when the value of the incoming data * current gain value is below the Threshold. agc_dabv(3:0) : The value to shift the gain that is then subtracted from the accumulator when the value of the incoming data * the current gain value is above the Threshold. agc_dzro(3:0) : The value to shift the gain that is then added to the accumulator when the value of the incoming data * current gain values consistently equal to zero. (Usually a smaller number than agc_dblw). agc_dsat(3:0) : The value to shift the gain that is then subtracted form the accumulator when the value of the incoming data * the current gain value is consistently equal to maximum (saturation). Note: The larger the number in the above words, the smaller the step size. The above values control the AGC gain shifting (range is from 3 to 18). PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 110 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Register name: AGC_CONFIG2 Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0x11 BIT15 BIT8 0 zero_msk(3:0) 0 0 0 0 0 agc_thresh(7:0) 0 0 0 agc_rnd(3:0) 0 0 BIT7 zero_msk(3:0) agc_rnd(3:0) 0 0 0 0 BIT0 0 : Masks the lower 4 bits of the magnitude of the input signal so that they are counted as zeros. : Determines where to round the output of the AGC; the number of bits output is (18 – agc_rnd). For example, 0000 is 18 bits. : Threshold for (input * gain) comparison. This value is compared to the magnitude of the upper eight bits of the agc output. agc_thresh(7:0) Register name: AGC_CONFIG3 Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0x12 BIT15 unused 0 BIT7 unused BIT8 unused unused 0 0 unused unused 0 0 0 agc_freeze agc_ freeze 0 agc_ clear 0 agc_max_cnt(3:0) 0 0 0 0 BIT0 agc_zero_cnt(3:0) 0 0 0 0 : Freezes the agc when set. This should be asserted when the AGC algorithm is bypassed or held constant. : When the agc_output (input * gain) is at full scale for this number of samples, then the gain shift value is changed to agc_dsat. : Clears the AGC accumulator when set. Assert this when the AGC is in bypass mode. : when the agc_output (input * gain) is zero value for this number of samples, then the gain shift value is changed to agc_dzro. agc_max_cnt(3:0) agc_clear agc_zero_cnt(3:0) Register name: AGC_GAINMSB Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0x13 DOUBLE BUFFERED, REQUIRES SYNC FOR LOADING BIT15 BIT8 0 0 0 agc_gaina(23:16) 0 0 0 0 0 agc_gainb(23:16) 0 0 0 0 0 0 BIT7 agc_gaina(23:16) agc_gainb(23:16) 0 BIT0 0 : MSBs of the agc_gaina word. : MSBs of the agc_gainb word. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 111 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Register name: AGC_GAINA Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0x14 DOUBLE BUFFERED, REQUIRES SYNC FOR LOADING BIT15 BIT8 0 0 0 agc_gaina(15:8) 0 0 0 0 0 agc_gaina(7:0) 0 0 0 0 0 0 BIT7 agc_gaina(15:0) 0 BIT0 0 : This is the lower 16 bits of the total 24 bits of programmable gain. The gain value is always positive with the upper 12 bits being the integer value and the lower 12 bits being the fractional. This gain value is used for all UMTS operations and for A channel data when in CDMA mode. A 24-bit value of 00000000001.000000000000 is unity gain. Register name: AGC_GAINB Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0x15 DOUBLE BUFFERED, REQUIRES SYNC FOR LOADING BIT15 BIT8 0 0 0 agc_gainb(15:8) 0 0 0 0 0 agc_gainb(7:0) 0 0 0 0 0 0 BIT7 agc_gainb(15:0) 0 BIT0 0 : This is the lower 16 of the total of 24 bit of programmable gain. The gain value is always positive with the upper 12 bits being the integer value and the lower 12 bits being the fractional. This gain value is used for B channel data when in CDMA. A 24-bit value of 00000000001.000000000000 is unity gain. Register name: AGC_AMAX Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0x16 BIT15 BIT8 0 0 0 agc_amax(15:8) 0 0 0 0 0 agc_amax(7:0) 0 0 0 0 0 0 BIT7 agc_amax(15:0) 0 BIT0 0 : This is the maximum gaina or gainb can be adjusted up. The value programmed is a positive value that is used to generate the most positive AGC gain adjust. For example, if 512 is programmed, the maximum gain will be the programmed gain (AGC_GAINA/B) + 512. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 112 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Register name: AGC_AMIN Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0x17 BIT15 BIT8 0 0 0 agc_amin(15:8) 0 0 0 0 0 agc_amin(7:0) 0 0 0 0 0 0 BIT7 agc_amin(15:0) 0 BIT0 0 : This is the minimum gaina or gainb can be adjusted down. The value programmed is a positive value that is inverted internally to generate the most negative AGC gain adjust. For example, if 512 is programmed, the minimum gain will be the programmed gain (AGC_GAINA/B) – 512. Register name: PSER_CONFIG1 Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0x18 BIT15 unused 0 BIT8 0 0 BIT7 unused 0 unused 0 unused 0 0 pser_recv_fsinvl(6:0) 0 0 0 0 BIT0 pser_recv_fsinvl(6:0) pser_recv_bits(4:0) 0 0 pser_recv_bits(4:0) 0 0 0 : Receive serial interface frame sync interval in bit clocks. : Number of output bits per sample-1; for 18 bits, this is set to {10001}. Register name: PSER_CONFIG2 Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0x19 BIT15 0 BIT7 pser_recv _8pin 0 pser_recv_clkdiv(3:0) 0 0 pser_recv _alt 0 pser_recv_clkdiv(3:0) pser_recv_8pin pser_recv_alt pser_recv_fsdel(1:0) 0 unused 0 unused 0 unused unused unused unused 0 0 0 0 BIT8 unused 0 BIT0 pser_recv_fsdel(1:0) unused 0 0 0 : Receive serial interface clock divider rate-1; 0 is full rate and 15 divides the clock by 16. For example, to run the receive serial interface at 1/4 the AFE8406 clock, set pser_recv_clkdiv(3:0) = 0011. : When set, 4 pins are used for I and 4 pins for Q in UMTS mode. When cleared, 2 pins are used for I and 2 pins for Q. This is used in combination with the pser_recv_alt bit. When this bit is set, it would be set in 2 adjacent DDC channels; one would also set the pser_recv_alt bit in the adjacent DDC. This will cause the I channel to be serialized on 4 pins and the Q channel to be serialized on the adjacent channels 4 pins. : When set, this channel's receive serial interface will output the Q data from the adjacent DDC channel. : Delay between the receive frame sync output and the MSB of serial data {3,2,1,0}. This number is in serial output bit times, not rxclk periods. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 113 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Register name: DDCCONFIG1 Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0x1A BIT15 ddcmux_sel_a (3:0) 0 0 0 0 agc_rnd_ disable 0 gain_mon remix_only cic_ bypass 0 0 BIT7 ddcmux_sel_b(3:0) 0 0 ddcmux_sel_X(3:0) 0 0 0 BIT8 ch_rate_sel(1:0) 0 0 BIT0 double_tap(1:0) 0 0 : Controls which samples go to the mixer for I/Q. Since in CDMA mode there are two streams, an A and B stream, two mux select values are used. Select Value 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 I data from X input RXINA RXINB RXINC RXIND RXINA RXINA RXIN A RXINB RXINB RXINB RXINC RXINC RXINC RXIND RXIND RXIND Q data from X input RXINA RXINB RXINC RXIND RXINB RXINC RXIND RXINA RXINC RXIND RXINA RXINB RXIND RXINA RXINB RXINC RXINA = internal A-side ADC, RXINB = internal B-side ADC, RXINC = external input C, RXIND = external input D agc_rnd_disable gain_mon OUTPUT I Q ch_rate_sel(1:0) : When set, the agc_rnd bits have no effect. The whole 29 bits are used in the rounding and the round bit is bit4. : Combines the gain with the I/Q output signals when asserted. Bits(17:10) Gained I value Gained Q value Bits(9:4) Bits(3:2) Gain(18:11) Gain(10:5) Shift status(1:0) Bits(1:0) “00” “00” : Sets the DDC channel input data rate. The value set here should match the value in the Receive Input Interface rate select bits (rate_sel). MUST BE SET THE SAME AS REGISTER rate_sel(1:0). ch_rate_sel 00 01 10 11 Input data rate rxclk rxclk/2 rxclk/4 rxclk/8 When muxed_data is set (Factory Use Only) rate_sel should be set to rxclk “00” and ch_rate_sel should be set to rxclk/2 “01”. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 114 WWW.TI.COM AFE8406 PRODUCT PREVIEW remix_only SLWS168 - OCTOBER 2005 : Assert this when real only, full rxclk rate input data is used in CDMA mode. The signal on the Q bus selected by the ddcmux_sel_X(3:0) bits above is ignored (functions as if the Q data is 0). : Factory Use Only. If asserted then the data from the rxin_a(15:0) and rxin_b(15:0) are fed directly into the cfir input as I and Q respectively. rxin_a(0) also functions as the “sync_cfir” signal and should rise at the beginning of input data. cic_bypass ONLY DDC0, DDC2 and DDC4 can be the UMTS double tap (64 to 128 tap) PFIR Mode. DDC1, DDC3 and DDC5 PFIRs are used to lengthen the DDC0, DDC2 and DDC4 PFIRs. double_tap(1) : When set, the DDC is in double length PFIR mode which sends the data out of the last PFIR sample ram in this DDC (DDC0, DDC2, DDC4) to the adjacent secondary DDC (DDC1, DDC3, DDC5) PFIR forming a 128-tap delay line. Output data received from the adjacent secondary DDC PFIR summer is added into the Main DDC’s PFIR sum to form the final output. double_tap(0) : When set, the PFIR input comes from the adjacent(Main) PFIR. When cleared, PFIR input is from the CFIR connected directly to this PFIR. Only valid in DDC1, DDC3 and DDC5. The ddc_ena bit in the CONFIG1 register should be cleared for the DDC1, DDC3 and DDC5 when double_tap(0) is set. Note: to put 2 DDCs in to 128 tap mode: Program DDC0/DDC2/DDC4 double_tap(1:0) to “10” and ddc_ena to “1”. Program DDC1/DDC3/DDC5 double_tap(1:0) to “01” and ddc_ena to “0”. Register name: SYNC_0 Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0x1B BIT15 unused 0 BIT7 unused 0 BIT8 0 ssel_cic(2:0) 0 1 ssel_agc_freeze(2:0) 1 ssel_cic(2:0) ssel_pmeter(2:0) ssel_agc_freeze(2:0) ssel_serial(2:0) 0 unused 0 0 ssel_pmeter(2:0) 0 0 unused 0 0 ssel_serial(2:0) 0 0 BIT0 0 : Selects the sync source for the DDC CIC filter, thus setting the decimation moment. : Selects the sync source for the channel power meter. : Selects the sync that is used to hold the AGC in freeze mode. With this functionality the user can program the AGC freeze control to look at the state of an input sync, or the one shots. It defaults to being off or not looking at any syncs and not driving the freeze control. This way, upon startup, the chip looks at the MPU register bit for AGC freezing and not the syncs. : Selects the sync source for the DDC serial interface state machines. Sync sources are contained in this and many of the following registers. For all sync source selections: ssel_XXXX(2:0) 000 001 010 011 100 101 110 111 Selected sync source for DDC rxsyncA rxsyncB rxsyncC rxsyncD DDC sync counter one shot (register write triggered) always 0 always 1 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 115 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Register name: SYNC_1 Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0x1C BIT15 unused 0 BIT7 unused 0 BIT8 0 ssel_tadj_fine(2:0) 0 0 ssel_gain(2:0) 0 ssel_tadj_fine(2:0) ssel_tadj_reg(2:0) ssel_gain(2:0) ssel_ddc_agc(2:0) : : : : 0 unused 0 0 ssel_tadj_reg(2:0) 0 0 unused 0 0 ssel_ddc_agc(2:0) 0 0 BIT0 0 Selects the sync source for the fine time adjust zero stuff moment. Selects the sync source for the fine and coarse time adjust register updates. Selects the sync source for the DDC AGC gain register. Selects the sync source to initialize the AGC, primarily for test purposes. Register name: SYNC_2 Page: 0x0%00, where % = 2*(DDC channel #)+1 Address: 0x1D BIT15 unused 0 BIT7 unused 0 BIT8 0 ssel_nco(2:0) 0 0 ssel_freq(2:0) 0 ssel_nco ssel_dither ssel_freq ssel_phase : : : : 0 unused 0 0 ssel_dither(2:0) 0 0 unused 0 0 ssel_phase (2:0) 0 0 BIT0 0 Selects the sync source for the NCO accumulator reset. Selects the sync source for the NCO phase dither generator reset. Selects the sync source for the NCO frequency register. Selects the sync source for the NCO phase offset register. Register name: DDC_CHK_SUM Page: 0x0%20, where % = 2*(DDC channel #)+1 Address: 0x00 READ ONLY BIT15 BIT8 0 0 0 ddc_chk_sum(15:0) 0 0 0 0 0 ddc_chk_sum(7:0) 0 0 0 0 0 0 BIT7 ddc_chk_sum 0 BIT0 0 : The DDC self test checksum value Register name: PMETER_RESULT_A_LSB Page: 0x0%20, where % = 2*(DDC channel #)+1 Address: 0x01 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 116 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 READ ONLY BIT15 0 BIT8 0 0 pmeter_result_a(15:8) 0 0 0 pmeter_result_a(7:0) 0 0 0 0 BIT7 0 BIT0 0 0 pmeter_result_a(15:0) 0 0 0 : Lower 16 bits of the UMTS mode or CDMA mode A channel power measurement. Register name: PMETER_RESULT_A_MID Page: 0x0%20, where % = 2*(DDC channel #)+1 Address: 0x02 READ ONLY BIT15 0 BIT8 0 0 pmeter_result_a(31:24) 0 0 0 pmeter_result_a(23:16) 0 0 0 0 BIT7 0 BIT0 0 0 0 0 0 pmeter_result_a(31:16) : Mid 16 bits of the UMTS mode or CDMA mode A channel power measurement. Register name: PMETER_RESULT_A_MSB Page: 0x0%20, where % = 2*(DDC channel #)+1 Address: 0x03 READ ONLY BIT15 0 BIT8 0 0 pmeter_result_a(47:40) 0 0 0 pmeter_result_a(39:32) 0 0 0 0 BIT7 0 BIT0 0 0 0 0 0 pmeter_result_a(47:32) : Upper mid 16 bits of the UMTS mode or CDMA mode A channel power measurement. Register name: PMETER_RESULT_B_LSB Page: 0x0%20, where % = 2*(DDC channel #)+1 Address: 0x04 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 117 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 READ ONLY BIT15 0 BIT8 0 0 pmeter_result_b(15:8) 0 0 0 pmeter_result_b(7:0) 0 0 0 0 BIT7 0 BIT0 0 0 pmeter_result_b(15:0) 0 0 0 : Lower 16 bits of the CDMA mode B channel power measurement. Register name: PMETER_RESULT_B_MID Page: 0x0%20, where % = 2*(DDC channel #)+1 Address: 0x05 READ ONLY BIT15 0 BIT8 0 0 pmeter_result_b(31:24) 0 0 0 pmeter_result_b(23:16) 0 0 0 0 BIT7 0 BIT0 0 0 0 0 0 pmeter_result_b(31:16) : Mid 16 bits of the CDMA mode B channel power measurement. Register name: PMETER_RESULT_B_MSB Page: 0x0%20, where % = 2*(DDC channel #)+1 Address: 0x06 READ ONLY BIT15 0 BIT8 0 0 pmeter_result_b(47:40) 0 0 0 pmeter_result_b(39:32) 0 0 0 0 BIT7 0 BIT0 0 0 0 0 0 pmeter_result_b(47:32) : Upper mid 16 bits of the CDMA mode B channel power measurement. Register name: PMETER_RESULT_AB_UMSB Page: 0x0%20, where % = 2*(DDC channel #)+1 Address: 0x07 READ ONLY BIT15 0 0 pmeter_result_a(54:48) 0 0 0 0 pmeter_result_b(54:48) 0 0 0 0 0 BIT8 unused 0 0 BIT0 unused 0 BIT7 0 0 pmeter_result_a(54:48) : Most Significant 7 bits of the 55-bit UMTS or CDMA mode A channel power measurement. pmeter_result_b(54:48) : Most Significant 7 bits of the 55-bit CDMA mode B channel power measurement. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 118 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 119 WWW.TI.COM AFE8406 PRODUCT PREVIEW 4 SLWS168 - OCTOBER 2005 AFE8406 Pins 4.1 Analog Section Signals Signal Name inpa inma inpb inmb Ball F3 F4 V4 V3 Type input input input input Description ADCA analog positive input ADCA analog negative input ADCB analog positive input ADCB analog negative input clkpa clkma clkpb clkmb H1 J1 R1 T1 input input input input ADCA clock positive input ADCA clock negative input ADCB clock positive input ADCB clock negative input refpa refma refpb refmb L3 K3 P3 N3 input input input input ADCA positive reference input. connect 0.1uF to AVSS. ADCA negative reference input; connect 0.1uF to AVSS. ADCB positive reference input; connect 0.1uF to AVSS. ADCB negative reference input; connect 0.1uF to AVSS. cma cmb H3 T3 output output iref M3 input Current set; connect 56KΩ to AVSS. oea L9 input oeb N9 input ovra ovrb da(13:0) db(13:0) clkouta clkoutb fuse_sel G6 N8 N/A N/A N/A N/A H5 output output output output output output input connect to AVDD ADCA output enable; AVDD=enable, AVSS=disabled connect to AVDD ADCB output enable; AVDD=enable, AVSS=disabled ADCA over range indicator bit ADCB over range indicator bit ADCA output data; internally connected to rxin_a_15:2 ADCB output data; internally connected to rxin_b_15:2 ADCA output clock; internally connected to adcclka ADCB output clock; internally connected to adcclkb connect to AVSS; fuse trim enable - factory use only pin_configure T5 input ADCA common mode output reference ADCB common mode output reference connect to AVDD Set mode of the following 3 pins when pin_configure = AVSS (factory use only, customers should always tie to AVDD) sdata N10 input serial interface data - factory use only sclk M9 input serial interface clock - factory use only sen M10 input serial interface enable - factory use only when pin_configure = AVDD (normal operating mode) dll_disable N10 input connect to AVDD AVDD=disables DLL, AVSS=enables DLL pwdn M9 Input connect to AVSS AVDD=powered down, AVSS=powered up ext_ref M10 input connect to AVSS AVDD=External reference, AVSS=internal reference. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 120 WWW.TI.COM AFE8406 PRODUCT PREVIEW 4.2 SLWS168 - OCTOBER 2005 Digital Receive Section Signals Signal Name rxclk Ball R22 Type input Description receive digital section clock input adcclk_a adcclk_b adcclk_c adcclk_d N/A N/A AA11 AB11 input input input input rxin_a_x input clock; connected to ADCA output clock rxin_b_x input clock; connected to ADCB output clock rxin_c_x input clock rxin_d_x input clock rxin_a_ovr rxin_b_ovr rxin_c_ovr rxin_d_ovr G6 N8 AB6 V12 input/output input/output input input adc overflow/overrange bit for rxin_a; driven by ADC A adc overflow/overrange bit for rxin_b; driven by ADC B adc overflow/overrange bit for rxin_c adc overflow/overrange bit for rxin_d dvga_a_5 dvga_a_4 dvga_a_3 dvga_a_2 dvga_a_1 dvga_a_0 D7 D8 C7 B7 A7 C8 output output output output output output Digital VGA control output for ADC0 MSB Digital VGA control output for ADC0 Digital VGA control output for ADC0 Digital VGA control output for ADC0 Digital VGA control output for ADC0 Digital VGA control output for ADC0 LSB dvga_b_5 dvga_b_4 dvga_b_3 dvga_b_2 dvga_b_1 dvga_b_0 B8 A8 D9 D10 C9 B9 output output output output output output Digital VGA control output for ADC1 MSB Digital VGA control output for ADC1 Digital VGA control output for ADC1 Digital VGA control output for ADC1 Digital VGA control output for ADC1 Digital VGA control output for ADC1 LSB dvga_c_5 dvga_c_4 dvga_c_3 dvga_c_2 dvga_c_1 dvga_c_0 AA15 AB15 V16 W16 Y16 AA16 output output output output output output Digital VGA control output for rxin_c MSB, test bus bit 1 Digital VGA control output for rxin_c, test bus bit 0 Digital VGA control output for rxin_c, test bus bit 19 Digital VGA control output for rxin_c, test bus bit 18 Digital VGA control output for rxin_c, test bus CLK Digital VGA control output for rxin_c LSB, test bus SYNC dvga_d_5 dvga_d_4 dvga_d_3 dvga_d_2 dvga_d_1 dvga_d_0 AB16 V17 W17 AA17 AB17 V18 output output output output output output Digital VGA control output for rxin_d MSB, test bus AFLAG Digital VGA control output for rxin_d Digital VGA control output for rxin_d Digital VGA control output for rxin_d Digital VGA control output for rxin_d Digital VGA control output for rxin_d LSB PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 121 WWW.TI.COM AFE8406 PRODUCT PREVIEW rxin_a_15 N/A input rxin_a_14 rxin_a_13 rxin_a_12 rxin_a_11 rxin_a_10 rxin_a_9 rxin_a_8 rxin_a_7 rxin_a_6 rxin_a_5 rxin_a_4 rxin_a_3 rxin_a_2 rxin_a_1 rxin_a_0 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A input input input input input input input input input input input input input input input rxin_b_15 N/A input rxin_b_14 rxin_b_13 rxin_b_12 rxin_b_11 rxin_b_10 rxin_b_9 rxin_b_8 rxin_b_7 rxin_b_6 rxin_b_5 rxin_b_4 rxin_b_3 rxin_b_2 rxin_b_1 rxin_b_0 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A input input input input input input input input input input input input input input input SLWS168 - OCTOBER 2005 receive input data bus a bit 15 (MSB); connected to ADC A d(13) receive input data bus a receive input data bus a receive input data bus a receive input data bus a receive input data bus a receive input data bus a receive input data bus a receive input data bus a receive input data bus a receive input data bus a receive input data bus a receive input data bus a receive input data bus a; connected to ADC A d(0) receive input data bus a receive input data bus a bit 0 (LSB) receive input data bus b bit 15 (MSB); connected to ADC B d(13) receive input data bus b receive input data bus b receive input data bus b receive input data bus b receive input data bus b receive input data bus b receive input data bus b receive input data bus b receive input data bus b receive input data bus b receive input data bus b receive input data bus b receive input data bus b; connected to ADC B d(0) receive input data bus b receive input data bus b bit 0 (LSB) rxin_c_15 Y7 input/output receive input data bus c bit 15 (MSB), test bus bit 17 rxin_c_14 AA7 input/output receive input data bus c bit 14, test bus bit 16 rxin_c_13 AB7 input/output receive input data bus c bit 13, test bus bit 15 rxin_c_12 Y8 input/output receive input data bus c bit 12, test bus bit 14 rxin_c_11 V10 input/output receive input data bus c bit 11, test bus bit 13 rxin_c_10 AA8 input/output receive input data bus c bit 10, test bus bit 12 rxin_c_9 AB8 input/output receive input data bus c bit 9, test bus bit 11 rxin_c_8 W9 input/output receive input data bus c bit 8, test bus bit 10 rxin_c_7 Y9 input/output receive input data bus c bit 7, test bus bit 9 rxin_c_6 AA9 input/output receive input data bus c bit 6, test bus bit 8 rxin_c_5 AB9 input/output receive input data bus c bit 5, test bus bit 7 rxin_c_4 W10 input/output receive input data bus c bit 4, test bus bit 6 rxin_c_3 Y10 input/output receive input data bus c bit 3, test bus bit 5 rxin_c_2 AA10 input/output receive input data bus c bit 2, test bus bit 4 rxin_c_1 AB10 input/output receive input data bus c bit 1, test bus bit 3 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 122 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 rxin_c_0 W11 input/output receive input data bus c bit 0 (LSB), test bus bit 2 rxin_d_15 rxin_d_14 rxin_d_13 rxin_d_12 rxin_d_11 rxin_d_10 rxin_d_9 rxin_d_8 rxin_d_7 rxin_d_6 rxin_d_5 rxin_d_4 rxin_d_3 rxin_d_2 rxin_d_1 rxin_d_0 W12 Y12 AA12 AB12 V13 W13 Y13 AA13 AB13 V14 W14 AA14 AB14 V15 W15 Y15 input/output input/output input/output input/output input/output input/output input/output input/output input/output input/output input/output input/output input/output input/output input/output input/output receive input data bus d bit 15 (MSB), test bus bit 35 receive input data bus d bit 14, test bus bit 34 receive input data bus d bit 13, test bus bit 33 receive input data bus d bit 12, test bus bit 32 receive input data bus d bit 11, test bus bit 31 receive input data bus d bit 10, test bus bit 30 receive input data bus d bit 9, test bus bit 29 receive input data bus d bit 8, test bus bit 28 receive input data bus d bit 7, test bus bit 27 receive input data bus d bit 6, test bus bit 26 receive input data bus d bit 5, test bus bit 25 receive input data bus d bit 4, test bus bit 24 receive input data bus d bit 3, test bus bit 23 receive input data bus d bit 2, test bus bit 22 receive input data bus d bit 1, test bus bit 21 receive input data bus d bit 0 (LSB), test bus bit 20 rx_synca rx_syncb rx_syncc rx_syncd P21 P22 N20 N21 input input input input rx_sync_out rxclk_out E22 E21 output output receive general purpose output sync receive clock output rx_sync_out_7 A20 output rx_sync_out_6 C19 output rx_sync_out_5 rx_sync_out_4 rx_sync_out_3 rx_sync_out_2 rx_sync_out_1 rx_sync_out_0 C17 C16 D15 B13 C12 A10 output output output output output output receive serial interface frame strobe for rxout_7_x, output clock (rxout_clk) for parallel interface. receive serial interface frame strobe for rxout_6_x, frame strobe (rx_sync_out) for parallel interface. receive serial interface frame strobe for rxout_5_x receive serial interface frame strobe for rxout_4_x receive serial interface frame strobe for rxout_3_x receive serial interface frame strobe for rxout_2_x receive serial interface frame strobe for rxout_1_x receive serial interface frame strobe for rxout_0_x receive sync input receive sync input receive sync input receive sync input PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 123 WWW.TI.COM AFE8406 PRODUCT PREVIEW rxout_7_a D20 output rxout_7_b C21 output rxout_7_c B20 output rxout_7_d C20 output rxout_6_a A19 output rxout_6_b B19 output rxout_6_c A18 output rxout_6_d B18 output rxout_5_a D18 output rxout_5_b B17 output rxout_5_c D17 output rxout_5_d A17 output rxout_4_a A16 output rxout_4_b B16 output rxout_4_c D16 output rxout_4_d A15 output rxout_3_a B15 output rxout_3_b C15 output rxout_3_c A14 output rxout_3_d B14 output rxout_2_a D14 output rxout_2_b A13 output rxout_2_c C13 output rxout_2_d D13 output DDC 7 serial out data. DDC Parallel Interface DDC 7 serial out data. DDC Parallel Interface DDC 7 serial out data. DDC Parallel Interface DDC 7 serial out data. DDC Parallel Interface SLWS168 - OCTOBER 2005 CDMA A: I(12) CDMA B: I(13) CDMA A: I(14) CDMA B: I(15) I data UMTS: I msb I data UMTS: I msb – 1 DDC 6 serial out data. CDMA A: DDC Parallel Interface I(8) DDC 6 serial out data. CDMA B: DDC Parallel Interface I(9) DDC 6 serial out data. CDMA A: DDC Parallel Interface I(10) DDC 6 serial out data. CDMA B: DDC Parallel Interface I(11) I data UMTS: I msb I data UMTS: I msb – 1 Q data UMTS: Qmsb Q data UMTS: Qmsb –1 Q data UMTS: Qmsb Q data UMTS: Qmsb –1 DDC 5 serial out data. Parallel Interface I(4) DDC 5 serial out data. Parallel Interface I(5) DDC 5 serial out data. Parallel Interface I(6) DDC 5 serial out data. Parallel Interface I(7) CDMA A: I data UMTS: I msb CDMA B: I data UMTS: I msb – 1 DDC 4 serial out data. Parallel Interface I(0) DDC 4 serial out data. Parallel Interface I(1) DDC 4 serial out data. Parallel Interface I(2) DDC 4 serial out data. Parallel Interface I(3) CDMA A: I data UMTS: I msb CDMA B: I data UMTS: I msb – 1 CDMA A: Q data UMTS: Qmsb CDMA B: Q data UMTS: Qmsb –1 CDMA A: Q data UMTS: Qmsb CDMA B: Q data UMTS: Qmsb –1 DDC 3 serial out data. CDMA A: Parallel Interface Q(12) DDC 3 serial out data. CDMA B: Parallel Interface Q(13) DDC 3 serial out data. CDMA A: Parallel Interface Q(14) DDC 3 serial out data. CDMA B: Parallel Interface Q(15) DDC 2 serial out data. CDMA A: Parallel Interface Q(8) DDC 2 serial out data. CDMA B: Parallel Interface Q(9) DDC 2 serial out data. CDMA A: Parallel Interface Q(10) DDC 2 serial out data. CDMA B: Parallel Interface Q(11) I data UMTS: I msb I data UMTS: I msb – 1 Q data UMTS: Qmsb Q data UMTS: Qmsb –1 I data UMTS: I msb I data UMTS: I msb – 1 Q data UMTS: Qmsb Q data UMTS: Qmsb –1 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 124 WWW.TI.COM AFE8406 PRODUCT PREVIEW rxout_1_a A12 output rxout_1_b B12 output rxout_1_c D12 output rxout_1_d A11 output rxout_0_a B11 output rxout_0_b C11 output rxout_0_c B10 output rxout_0_d A9 output SLWS168 - OCTOBER 2005 DDC 1 serial out data. Parallel Interface Q(4) DDC 1 serial out data. Parallel Interface Q(5) DDC 1 serial out data. Parallel Interface Q(6) DDC 1 serial out data. Parallel Interface Q(7) CDMA A: I data UMTS: I msb CDMA B: I data UMTS: I msb – 1 DDC 0 serial out data. Parallel Interface Q(0) DDC 0 serial out data. Parallel Interface Q(1) DDC 0 serial out data. Parallel Interface Q(2) DDC 0 serial out data. Parallel Interface Q(3) CDMA A: I data UMTS: I msb CDMA B: I data UMTS: I msb – 1 CDMA A: Q data UMTS: Qmsb CDMA B: Q data UMTS: Qmsb –1 CDMA A: Q data UMTS: Qmsb CDMA B: Q data UMTS: Qmsb –1 PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 125 WWW.TI.COM AFE8406 PRODUCT PREVIEW 4.3 SLWS168 - OCTOBER 2005 Microprocessor Signals Signal Name d0 d1 d2 d3 d4 d5 d6 d7 d8 d9 d10 d11 d12 d13 d14 d15 Ball Y22 Y21 AB20 AA20 Y20 W20 V20 AB19 AA19 Y19 W19 V19 AB18 AA18 Y18 W18 Type input/output input/output input/output input/output input/output input/output input/output input/output input/output input/output input/output input/output input/output input/output input/output input/output Description MPU register interface data bus bit 0 (LSB) MPU register interface data bus MPU register interface data bus MPU register interface data bus MPU register interface data bus MPU register interface data bus MPU register interface data bus MPU register interface data bus MPU register interface data bus MPU register interface data bus MPU register interface data bus MPU register interface data bus MPU register interface data bus MPU register interface data bus MPU register interface data bus MPU register interface data bus bit 15 (MSB) a0 a1 a2 a3 a4 a5 T20 U22 U21 W22 V21 W21 input input input input input input MPU register interface address bus bit 0 (LSB) MPU register interface address bus MPU register interface address bus MPU register interface address bus MPU register interface address bus MPU register interface address bus bit 5 (MSB) rd_n wr_n ce_n T22 R20 T21 input input input MPU register interface read – active low MPU register interface write – active low MPU register interface chip enable – active low reset_n interrupt R21 M21 input output chip reset – active low chip interrupt PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 126 WWW.TI.COM AFE8406 PRODUCT PREVIEW 4.4 JTAG Signals Signal Name tdi tms trst_n Ball K22 K21 J22 Type input input input tck tdo L20 L21 input output 4.5 SLWS168 - OCTOBER 2005 Description JTAG test data in JTAG test mode select JTAG test reset (same as trst; the “_n” is for consistency - being active low) Note: the trst_n pin should be asserted low after power up to insure the JTAG logic is properly initialized. JTAG test clock JTAG test data out Factory Test and No Connect Signals Signal Name testmode0 testmode1 scanen fa002_scan fa002_clk fa002_out zero fuse_out fuse_ena fuse_bias Ball G21 G22 H21 J20 H22 J21 H20 F20 D21 F21 Type input input input input input output input output input input Note Do not connect; internal pull down Do not connect; internal pull down Do not connect; internal pull down Do not connect; internal pull down Do not connect; internal pull down Do not connect Do not connect; internal pull down Do not connect Do not connect; internal pull down Do not connect; internal pull down PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 127 WWW.TI.COM AFE8406 PRODUCT PREVIEW 4.6 Power and Ground Signals Signal Name AVDD DRVDD FUSE_AVDD AVSS DRVSS VDDS VDDS_VFUSE DVDD DVSS 4.7 SLWS168 - OCTOBER 2005 Ball H4, J3, L1, L2, M2, N1, N2, R3, T4 H6, H7, J8, K8, L8, P8, R8, T6, T7 M1 A1, A2, A3, A4, A5, B1, B2, B3, B4, B5, C1, C2, C3, C4, C5, D1, D2, D3, D4, D5, E1, E2, E3, E4, E5, F1, F2, F5, F6, F7, F8, F9, G1, G2, G3, G4, G5, G7, G8, G9, H2, J2, J4, J5, J6, K1, K2, K4, K5, K6, L4, L5, L6, L7, M4, M5, M6, M7, N4, N5, N6, N7, P1, P2, P4, P5, P6, R2, R4, R5, R6, T2, U1, U2, U3, U4, U5, U6, U7, U8, U9, V1, V2, V5, V6, V7, V8 W1, W2, W3, W4, W5, Y1, Y2, Y3, Y4, AA1, AA2, AA3, AA4, AB1, AB2, AB3, AB4 H8, H9, J7, J9, K7, K9, M8, P7, P9, R7, R9, T8, T9 B6, B21, D6, D11, D19, E10, E11, E12, E13, E14, E15, E16, E17, E18, E19, K20, M20, P20, U11, U12, U13, U14, U15, U16, U17, U18, U19, V11, W7, AA6, AA21 D22 F22, G10, G19, H10, H19, J10, J19, K10, K19, L10, L19, M19, N19, P10, P19, R10, R19, V22 A6, A21, A22, B22, C6, C10, C14, C18, C22, E6, E7, E8, E9, E20, F10, F11, F12, F13, F14, F15, F16, F17, F18, F19, G11, G12, G13, G14, G15, G16, G17, G18, G20, H11, H12, H13, H14, H15, H16, H17, H18, J11, J12, J13, J14, J15, J16, J17, J18, K11, K12, K13, K14, K15, K16, K17, K18, L11, L12, L13, L14, L15, L16, L17, L18, M11, M12, M13, M14, M15, M16, M17, M18, N11, N12, N13, N14, N15, N16, N17, N18, N22, P11, P12, P13, P14, P15, P16, P17, P18, R11, R12, R13, R14, R15, R16, R17, R18, T10, T11, T12, T13, T14, T15, T16, T17, T18, T19, U10, U20, V9, W6, W8, Y5, Y6, Y11, Y14, Y17, AA5, AA22, AB5, AB21, AB22 Description Analog Power (3.3V) Analog I/O Power (3.3V) Analog Power (3.3V) Analog Ground Analog I/O Ground Digital I/O Power (3.3V) Also called Vpad Digital I/O Power (3.3V) Digital Core Power (1.5V) Also called Vcore Digital Ground Digital Supply Monitoring Signal Name dvddmon Ball L22 dvssmon M22 Description It is recommended that this pin be brought to a probe point for monitoring and debugging purposes. It is recommended that this pin be brought to a probe point for monitoring and debugging purposes. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 128 WWW.TI.COM AFE8406 PRODUCT PREVIEW 4.8 SLWS168 - OCTOBER 2005 JTAG The JTAG standard for boundary scan testing will be implemented for board testing purposes. Internal scan test will not be supported. Five device pins are dedicated for JTAG support: tdi, tdo, tms, tck, and trst_n. The JTAG bsdl configuration file will be available from TI at a later time. Note: the trst_n pin should be asserted LOW after power up to insure the JTAG logic is properly initialized. 5 Specifications NOTE: These numbers are engineering estimates prior to first silicon. They will change after we have characterized the parts. 5.1 Absolute Maximum Ratings Table 1. Absolute Maximum Ratings PARAMETER Analog Chip, Analog Supply Voltage Analog Chip, I/O Ring Supply Voltage Analog Chip, Ground Difference DRVSS to AVSS Digital Chip, Pad Ring Supply Voltage Digital Chip, Core Supply Voltage Analog Chip, Analog Input Voltage Analog Chip, Digital Input Voltage Digital Chip, Digital Input Voltage Clamp current for an input or output Storage Temperature SYMBOL AVDD DRVDD Junction Temperature TJ Theta Junction to Ambient (0 LFPM) ΘJA VDDS DVDD TSTG MIN -0.3 -0.3 -0.1 -0.3 -0.3 -0.15 -0.3 -0.3 -20 -65 MAX 3.7 3.7 0.1 3.7 1.8 2.5 DRVDD+0.3 VDDS+0.3 +20 140 105 Theta Junction to Ambient (100 LFPM) Theta Junction to Ambient (250 LFPM) Theta Junction to Ambient (500 LFPM) Theta Junction to Case Lead Soldering Temperature (10 seconds) 300 UNITS V V V V V V V V mA NOTES °C °C °C °C °C °C °C °C ESD Classification Class 2 Moisture Sensitivity Class 2 CAUTION: Exceeding the absolute maximum ratings (min or max) may cause permanent damage to the part. These are stress only ratings and are not intended for operation. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 129 WWW.TI.COM AFE8406 PRODUCT PREVIEW 5.2 SLWS168 - OCTOBER 2005 Recommended Operating Conditions Table 2. Recommended Operating Conditions PARAMETER Analog Chip, Analog Supply Voltage Analog Chip, I/O Ring Supply Voltage Analog Chip, Differential Input Range Analog Chip, Input Common Mode Analog Chip, Differential Clock Inputs Analog Chip, Clock Input Duty Cycle Digital Chip, I/O Ring Supply Voltage Digital Chip, Core Supply Voltage Digital Chip, Supply Voltage Difference, VDDS – DVDD Temperature Ambient, no air flow SYMBOL AVDD DRVDD MIN 3.0 3.0 VCM 1.5 Junction Temperature TJ NOM 3.3 3.3 2.3 MAX 3.6 3.6 1.6 3 50 VDDS DVDD TA 3 1.425 3.6 1.575 2.0 +85 -40 105 UNITS V V V V Vpp % V V V °C °C NOTES 1 2 1. Chips specifications in Tables 6.4 and 6.5 are production tested to100C case temperature. QA tests are performed at 85C. 2. Thermal management will be required for full rate operation, See table below and Section 5.4. The circuit is designed for junction temperatures up to 125C. Sustained operation at elevated temperatures will reduce long -term reliability. Lifetime calculations based on maximum junction temperature of 105C. Thermal management mechanisms such as air flow, heat sinks or lower ambient temperature may need to be employed to maintain a maximum junction temperature of 105C. 5.3 Thermal Characteristics THERMAL CONDUCTIVITY SYMBOL TYP UNITS Theta Junction to Ambient (0 LFPM) θJA 14 ° C/W ° C/W ° C/W ° C/W ° C/W Theta Junction to Ambient (100 LFPM) 13 Theta Junction to Ambient (250 LFPM) 12.2 Theta Junction to Ambient (500 LFPM) 11.6 θJC Theta Junction to Case 2.8 Note: Air flow will reduce θja and is highly recommended. 5.4 Power Consumption The maximum power consumption is largely a function of the operating mode of the chip. The Dual ADC chip power dissipation is fairly constant over clock rate due to the constant biasing in the analog circuits. The following equation estimates the typical power supply current for the digital chip The AC Characteristics table provides maximum current in a maximum configuration used in production test. IDVDD = proportional to filter lengths, supply, frequency, and number of channels active; separate equations for CDMA and UMTS modes to be included after characterization. Current consumption on the pad supply is primarily due to the external loads and follows C*V*F. Internal loads are estimated at 2pF per pin. Data outputs have a transition density of going from a zero to a one once per four clocks, while clock outputs transition every cycle. The rx_sync_out_X frame strobes consume negligible power due to the low transition frequency. In general, IVDDS = Σ DataPad/4*C*F*V + Σ ClockPad*C*F*V PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 130 WWW.TI.COM AFE8406 PRODUCT PREVIEW 5.5 SLWS168 - OCTOBER 2005 Analog Electrical Characteristics Typ, min, and max values at TA = +25°C, full temperature range is TMIN = -40°C to TMAX = +85°C, sampling rate = 80MSPS, 50% clock duty cycle, AVDD = DRVDD = 3.3V, DLL OFF, -1dBFS differential input, internal reference, and 3VPP differential clock, unless otherwise noted. PARAMETER Resolution Analog Inputs Differential input range Differential input impedance Differential input capacitance Total analog input common-mode current Analog input bandwidth Conversion Characteristics CONDITIONS MIN ADC clock rate, fadc (fclkpa=fclkma=fclkpb=fclkmb= fadc ) frxclk = 1xf adc ch_rate_sel = rate_sel = 00 85 frxclk = 2xf adc ch_rate_sel = rate_sel = 01 80 frxclk = 4xf adc ch_rate_sel = rate_sel = 10 40 frxclk = 8xf adc ch_rate_sel = rate_sel = 11 20 2mA per input, 4mA total Source impedance = 50? Data Latency – ADC input to FIFO input Internal Reference Voltages Lower Reference Voltages, REFMA & REFMB Upper Reference Voltages, REFPA & REFPB Reference Error Common Mode Voltage Outputs, CMA & CMB Dynamic DC Characteristics and Accuracy No missing codes Differential Linearity Error, DNL Integral Linearity Error, INL Offset Error Offset Temperature Coefficient Gain Error Gain Temperature Coefficient Dynamic AC Characteristics Signal to Noise Ratio, SNR RMS Output Noise TYP 14 tested MAX UNITS Bits 2.3 Vpp k? 4 750 mA MHz MSPS 16.5 Clock Cycles 0.97 2.11 V V % V 1.55 +/0.05 tested Fin = 10MHz Fin = 10MHz Fin = 10MHz, 25 oC Fin = 10MHz, -40 to 85 oC Fin = 30MHz Fin = 55MHz Fin = 70MHz, 25 oC Fin = 70MHz, -40 to 85 oC Fin = 110MHz Fin = 150MHz Fin = 225MHz INPA & INMA tied to C MA INPB & INMB tied to CMB LSBs LSBs mV %/oC %FS ∆%/oC TBD TBD TBD 73.5 TBD TBD TBD TBD TBD 1.1 dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS LSBs PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 131 WWW.TI.COM AFE8406 PRODUCT PREVIEW Spurious free dynamic range, SFDR Fin = 10MHz, 25 oC Fin = 10MHz, -40 to 85 oC Fin = 30MHz Fin = 55MHz Fin = 70MHz, 25 oC Fin = 70MHz, -40 to 85 oC Fin = 110MHz Fin = 150MHz Fin = 225MHz SLWS168 - OCTOBER 2005 TBD TBD TBD 84 TBD TBD TBD TBD TBD dBc dBc dBc dBc dBc dBc dBc dBc dBc PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 132 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 Analog Electrical Characteristics (Continued) Typ, min, and max values at TA = +25°C, full temperature range is TMIN = -40°C to TMAX = +85°C, sampling rate = 65MSPS, 50% clock duty cycle, AVDD = DRVDD = 3.3V, DLL OFF, -1dBFS differential input, internal reference, and 3VPP differential clock, unless otherwise noted. PARAMETER Second Harmonic, HD2 Third Harmonic, HD3 Worst harmonic/spur other than HD2 or HD3 Signal to Noise plus Distortion Total Harmonic Distortion, THD Channel to channel crosstalk CONDITIONS Fin = 10MHz, 25 oC Fin = 10MHz, -40 to 85 oC Fin = 30MHz Fin = 55MHz Fin = 70MHz, 25 oC Fin = 70MHz, -40 to 85 oC Fin = 110MHz Fin = 150MHz Fin = 225MHz Fin = 10MHz, 25 oC Fin = 10MHz, -40 to 85 oC Fin = 30MHz Fin = 55MHz Fin = 70MHz, 25 oC Fin = 70MHz, -40 to 85 oC Fin = 110MHz Fin = 150MHz Fin = 225MHz Fin = 10MHz, 25 oC Fin = 70MHz, 25 oC Fin = 10MHz, 25 oC Fin = 10MHz, -40 to 85 oC Fin = 30MHz Fin = 55MHz Fin = 70MHz, 25 oC Fin = 70MHz, -40 to 85 oC Fin = 110MHz Fin = 150MHz Fin = 225MHz Fin = 10MHz, 25 oC Fin = 10MHz, -40 to 85 oC Fin = 30MHz Fin = 55MHz Fin = 70MHz, 25 oC Fin = 70MHz, -40 to 85 oC Fin = 110MHz Fin = 150MHz Fin = 225MHz Fin = 225MHz MIN TBD TBD TYP TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD 90 MAX UNITS dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 133 WWW.TI.COM AFE8406 PRODUCT PREVIEW 5.6 SLWS168 - OCTOBER 2005 Digital Chip DC Characteristics Table 3. PARAMETER DC Operating Conditions (-40 to 85°C case unless noted) SYMBOL VDDS=3 to 3.6V MIN MAX 0.8 2.0 0.5 2.4 VDDS 5 35 UNITS NOTES Voltage input low VIL V 1 Voltage input high VIH V 1 Voltage output low (IOL = 2mA) VOL V 1 Voltage output high (IOH = -2mA) VOH V 1 Pullup current (VIN = 0V) (tdi, tms, trst_n, ce_n, wr_n, | IPU | uA 1 rd_n, reset_n ) (nominal 20uA) Pulldown current (VIN = VDDS) (all other inputs and | IPD | 5 35 uA 1 bidirs) (nominal 20uA) Leakage current (VIN = 0V or VDDS) | IIN | 20 uA 1 Outputs in tristate condition Quiescent supply current, IDVDD or IVDDS ICCQ 8 mA 1 (Vin = 0 for pads with pulldowns, Vin=VDDS for inputs with pullups) Capacitance for inputs CIN Typical 5 pF 2 Capacitance for bidirectionals CBI Typical 5 pF 2 Notes: General: Voltages are measured at low speed. Output voltages are measured with the indicated current load. General: Currents are measured at nominal voltages, high tem perature (TBDoC for production test, 85oC for QA). 1. Each part is tested at TBDoC case temperature for the given specification. Lots are sample tested at -40oC. 2. Controlled by design and process and not directly tested. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 134 WWW.TI.COM AFE8406 PRODUCT PREVIEW 5.7 SLWS168 - OCTOBER 2005 Digital Chip AC Timing Characteristics Table 4. AC Characteristics (-40 TO +85 C Case, Supplies across recommended range unless noted) o PARAMETER Clock Frequency (adcclk_c/d, rxclk) Clock low period (Below VIL) (adcclk_c/d, rxclk) Clock high period (Above VIH) (adcclk_c/d, rxclk) Clock rise and fall times (VIL to VIH) (adcclk_c/d, rxclk) SYMBOL FCK tCKL tCKH tRF MIN Input setup (rxsync_a/b/c/d) before rxclk rises Input setup (rxin_c/d_[0-15] ) before rxclk rises (adc fifo blocks bypassed) Input setup (rxin_c/d_[0-15] ) before adcclk_c/d rises (adc fifo blocks enabled) Input hold (rxsync_a/b/c/d) after rxclk rises Input hold (rxin_c/d_[0-15] ) after rxclk rises (adc fifo blocks bypassed) Input hold (rxin_c/d_[0-15] ) after adcclk_c/d rises (adc fifo blocks enabled) tSU tSU Data output delay (rx_sync_out_[0-7], rxout_[0-7]_a/b/c/d, rxclk_out, rx_sync_out, dvga_[a-d]_[5-0]) after rxclk rises. Data output hold (rx_sync_out_[0-7], rxout_[0-7]_a/b/c/d, rxclk_out, rx_sync_out, dvga_[a-d]_[5-0]) after rxclk rises. tDLY tOHD 0.5 JTAG Clock Frequency (tck) JTAG Clock low period (Below VIL) (tck) JTAG Clock high period (Above VIH) (tck) JTAG Input (tdi or tms) setup before tck goes high JTAG Input (tdi or tms) hold time after tck goes high JTAG output (tdo) delay from falling edge of tck. FJCK tJCKL tJCKH tJSU tJHD tJDLY 10 10 1 10 MAX 160 UNITS MHz ns ns ns NOTES 1 1 1 3 2 2 ns ns 1 1 tSU 2 ns 1 tHD tHD 1 2 ns ns 1 1 tHD 1 ns 1 ns 1 ns 1 MHz ns ns ns ns ns 1 1 1 1 1 1 2 2 2 6.5 40 10 Control setup during reads or writes tCSU 6 ns 1 3 pin mode: a[5:0] valid before rd_n, wr_n or ce_n falling edge 2 pin mode: a[5:0] and wr_n valid before ce_n falling edge Control setup during writes tEWCSU 10 ns 1 3 pin mode: d[15:0] valid before wr_n and ce_n rising edge 2 pin mode: d[15:0] valid before ce_n rising edge Control hold during writes. tCHD 6 ns 1 3 pin mode: a[5:0] and d[15:0] valid after wr_n and ce_n rise 2 pin mode: a[5:0], d[15:0] and wr_n valid after ce_n rise Control strobe (ce_n and wr_n low) pulse width during write. tCSPW 15 ns 1 Control output delay ce_n and rd_n low and a[5:0] stable to tCDLY 25 ns 1 d[15:0] during read. Control recovery time between reads or writes. tREC 6 ns 1 Control end of read to Hi-Z. tHIZ 10 ns 1 rd_n and ce_n rise to d[15:0] tristate Control read d[15:0] output hold time tCOH 3 ns 1 Core dynamic supply current ,nominal voltages, 160 MHz, ICDYN TBD TBD mA 1 (specific conditions, typical app with chip busy within capability of the tester, high temperature.) Notes: General: Timing is measured from the respective clock at VDDS/2 to input or output at VDDS/2. Output loading is a 50 Ohm transmission line whose delay is calibrated out. 1. Each part is tested at TBDoC case temperature for the given specification. Lots are sample tested at -40oC. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 135 WWW.TI.COM AFE8406 PRODUCT PREVIEW SLWS168 - OCTOBER 2005 2. Controlled by design and process and not directly tested. Verified on initial part evaluation. 3. Recommended practice. 4. reset_n and interrupt have no timing specifications since they are asynchronous signals PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 136 WWW.TI.COM AFE8406 PRODUCT PREVIEW 6 SLWS168 - OCTOBER 2005 Package/Ordering Information PRODUCT AFE8406 PACKAGE-LEAD Plastic BGA – 484 PACKAGE DESIGNATOR GDQ SPECIFIED TEMPERATURE RANGE -40°C to +85°C PACKAGE MARKING TBD ORDERING NUMBER TBD TRANSPORT MEDIA, QUANTITY Tray, TBD PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 137 WWW.TI.COM IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. 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