HDSEMI B5817WS Sod323 plastic-encapsulate diode Datasheet

B5817 WS
HD SD0.63
SOD323 Plastic-Encapsulate Diodes
Schottky Rectifier
Features
● VR 20V
● IFAV 1A
SOD3 23
Applications
● High frequency inverters
● Free wheeling
● Polarity protection applications
Marking
● SJ
Parameter
Symbol
Value
Unit
DC reverse voltage
VR
20
V
Mean rectifying current
IO
1
A
Non-repetitive Peak Forward Surge Current @ t=8.3ms
IFSM
15
A
Power Dissipation
PD
0.25
W
RθJA
400
℃/W
Junction Temperature
TJ
125
℃
Storage Temperature
TSTG
-55 ~ +150
℃
Thermal Resistance from Junction to Ambient
Electrical Characteristics (Ta=25℃ Unless otherwise specified)
Parameter
Reverse voltage
Forward voltage
Symbol
VBR
VF
Test Condition
Min
Type
Max
Unit
IR =250µA
20
V
IF =0.5A
0
0.37
0.40
V
IF =1.0A
0
0.42
0.45
V
IF =3.0A
0
0.62
0.75
V
50
µA
Reverse current
IR
VR =20V
5
Diode capacitance
CD
VR=4V, f=1MHz
60
High Diode Semiconductor
pF
1
Typical Characteristics
Forward Characteristics
Reverse
Characteristics
10
3
REVERSE CURRENT IR (mA)
10
0℃
T=
a 2
5℃
a
T=
FORWARD CURRENT IF (A)
1
0.1
1
Ta=100℃
0.1
0.01
Ta=25℃
0.01
0.0
1E-3
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0
0.8
5
FORWARD VOLTAGE VF (V)
Capacitance Characteristics
15
20
25
Power Derating Curve
300
200
CAPACITANCE BETWEEN TERMINALS
CT (pF)
10
REVERSE VOLTAGE VR (V)
Ta=25℃
f=1MHz
250
POWER DISSIPATION PD (mW)
160
120
80
200
150
100
50
40
0
0
0
0
5
10
15
20
25
50
75
AMBIENT TEMPERATURE Ta (℃)
100
125
REVERSE VOLTAGE VR (V)
High Diode Semiconductor
2
SOD323 Package Outline Dimensions
SOD323 Suggested Pad Layout
JSHD
JSHD
High Diode Semiconductor
3
Reel Taping Specifications For Surface Mount Devices-SOD323
1.46
2.9
1.25
High Diode Semiconductor
4
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