Sample & Buy Product Folder Technical Documents Support & Community Tools & Software Reference Design LM341, LM78M05 SNVS090F – MAY 2004 – REVISED DECEMBER 2016 LM341 and LM78M05 Series 3-Terminal 500-mA Positive Voltage Regulators 1 Features 3 Description • • • • • • The LM341 and LM78M05 three-pin positive voltage regulators employ built-in current limiting, thermal shutdown, and safe-operating area protection, which makes them virtually immune to damage from output overloads. 1 • Output Current in Excess of 0.5 A No External Components Internal Thermal Overload Protection Internal Short Circuit Current-Limiting Output Transistor Safe-Area Compensation Available in 3-Pin TO-220, TO-252, and TO packages Output Voltages of 5 V and 15 V With adequate heat sinking, they can deliver in excess of 0.5-A output current. Typical applications would include local (on-card) regulators which can eliminate the noise and degraded performance associated with single-point regulation. 2 Applications • • • • • Device Information(1) Electronic Point-of-Sale Medical and Health Fitness Applications Printers Appliances and White Goods TVs and Set-Top Boxes PART NUMBER LM341 LM78M05 PACKAGE BODY SIZE (NOM) TO-220 (3) 10.16 mm × 14.986 mm TO-220 (3) 10.16 mm × 14.986 mm TO-252 (3) 6.10 mm × 6.58 mm TO (3) 9.14 mm × 9.14 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Available Pinouts Pin 1. Input 2. Ground 3. Output Tab/Case is Ground Typical Application 1 2 3 TO TO-220 1 2 3 TO-252 1 2 3 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM341, LM78M05 SNVS090F – MAY 2004 – REVISED DECEMBER 2016 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 6.1 6.2 6.3 6.4 3 3 4 Absolute Maximum Ratings ...................................... Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics: LM341 (5 V) and LM78M05 ................................................................... 6.5 Electrical Characteristics: LM341 (12 V)................... 6.6 Electrical Characteristics: LM341 (15 V)................... 6.7 Typical Characteristics .............................................. 7 4 4 5 6 Detailed Description .............................................. 8 7.1 7.2 7.3 7.4 Overview ................................................................... 8 Functional Block Diagram ......................................... 9 Feature Description................................................. 10 Device Functional Modes........................................ 10 8 Application and Implementation ........................ 11 8.1 Application Information............................................ 11 8.2 Typical Application .................................................. 11 9 Power Supply Recommendations...................... 12 10 Layout................................................................... 13 10.1 Layout Guidelines ................................................. 13 10.2 Layout Example .................................................... 13 10.3 Thermal Considerations ........................................ 13 11 Device and Documentation Support ................. 16 11.1 11.2 11.3 11.4 11.5 11.6 11.7 Documentation Support ........................................ Related Links ........................................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 16 16 16 16 16 16 16 12 Mechanical, Packaging, and Orderable Information ........................................................... 16 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision E (August 2005) to Revision F Page • Added Applications section, Device Information table, Pin Configuration and Functions section, ESD Ratings table, Recommended Operating Conditions table, Thermal Information table, Detailed Description section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1 • Deleted parts marked as obsolete: LM78M12 and LM78M15................................................................................................ 1 • Changed package type names throughout............................................................................................................................. 1 • Deleted 12-V output voltage option from Features................................................................................................................. 1 • Changed RθJA values in Thermal Information table From: 60°C/W To: 22.6°C/W (NDE), From: 92°C/W To: 38°C/W (NDP), and From: 120°C/W To: 162.4°C/W (NDT) ................................................................................................................ 4 • Changed RθJC(top) values in Thermal Information table From: 5°C/W To: 17.8°C/W (NDE), From: 10°C/W To: 48.4°C/W (NDP), and From: 18°C/W To: 23.9°C/W (NDT).................................................................................................... 4 • Updated Thermal Considerations section ............................................................................................................................ 13 2 Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated Product Folder Links: LM341 LM78M05 LM341, LM78M05 www.ti.com SNVS090F – MAY 2004 – REVISED DECEMBER 2016 5 Pin Configuration and Functions NDE Package 3-Pin TO-220 Top View NDP Package 3-Pin TO-252 Top View NDT Package 3-Pin TO Top View Pin Functions PIN NAME NO. I/O DESCRIPTION TO-220 TO-252 TO 2/TAB 2/TAB 3 INPUT 1 1 1 I Input OUTPUT 2 2 2 O Output GND — Tab is GND 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN Input voltage VO = 5 V to 15 V Power dissipation Lead temperature (Soldering, 10 s) MAX UNIT 35 V Internally limited TO package (NDT) 300 TO-220 package (NDE) 260 °C Operating junction temperature –40 125 °C Storage temperature, Tstg –65 150 °C (1) (2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. 6.2 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) Input voltage Output current MIN MAX VOUT + 1.8 35 UNIT V 0.5 A Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated Product Folder Links: LM341 LM78M05 3 LM341, LM78M05 SNVS090F – MAY 2004 – REVISED DECEMBER 2016 www.ti.com 6.3 Thermal Information LM341 THERMAL METRIC (1) RθJA Junction-to-ambient thermal resistance RθJC(top) Junction-to-case (top) thermal resistance RθJB Junction-to-board thermal resistance ψJT Junction-to-top characterization parameter ψJB Junction-to-board characterization parameter RθJC(bot) Junction-to-case (bottom) thermal resistance (1) LM78M05 NDE (TO-220) NDP (TO-252) NDT (TO) 3 PINS 3 PINS 3 PINS UNIT 22.6 38 162.4 °C/W 17.8 48.4 23.9 °C/W 6 17.7 — °C/W 3.3 6.7 — °C/W 6 17.9 — °C/W 1.3 4.4 — °C/W For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Electrical Characteristics: LM341 (5 V) and LM78M05 VIN = 10 V, CIN = 0.33 µF, CO = 0.1 µF, TJ = 25°C (unless otherwise noted). Limits are specified by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. PARAMETER TEST CONDITIONS IL = 500 mA VO Output voltage IL = 5 mA to 500 mA, PD ≤ 7.5 W, VIN = 7.5 V to 20 V, TJ = –40°C to 125°C VRLINE Line regulation VIN = 7.2 V to 25 V VRLOAD Load regulation IL = 5 mA to 500 mA IQ Quiescent current IL = 500 mA MIN TYP MAX 4.8 5 5.2 4.75 5 5.25 IL = 100 mA 50 IL = 500 mA 100 4 IL = 5 mA to 500 mA UNIT V mV 100 mV 10 mA 0.5 ΔIQ Quiescent current change Vn Output noise voltage f = 10 Hz to 100 kHz 40 µV ΔVIN Ripple rejection f = 120 Hz, IL = 500 mA 78 dB VIN Input voltage required to maintain IL = 500 mA line regulation ΔVO Long-term stability VIN = 7.5 V to 25 V, IL = 500 mA 1 mA 7.2 V IL = 500 mA, TJ = –40°C to 125°C 20 mV/khrs 6.5 Electrical Characteristics: LM341 (12 V) VIN = 19 V, CIN = 0.33 µF, CO = 0.1 µF, TJ = 25°C (unless otherwise noted). Limits are specified by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT IL = 500 mA 11.5 12 12.5 VO Output voltage IL = 5 mA to 500 mA, PD ≤ 7.5 W, VIN = 14.8 V to 27 V, TJ = –40°C to 125°C 11.4 12 12.6 VRLINE Line regulation VIN = 14.5 V to 30 V VRLOAD Load regulation IL = 5 mA to 500 mA IQ Quiescent current IL = 500 mA ΔIQ Quiescent current change Vn Output noise voltage f = 10 Hz to 100 kHz 75 µV ΔVIN Ripple rejection f = 120 Hz, IL = 500 mA 71 dB VIN Input voltage required to maintain IL = 500 mA line regulation ΔVO Long-term stability 4 IL = 100 mA 120 IL = 500 mA 240 4 IL = 5 mA to 500 mA IL = 500 mA, TJ = –40°C to 125°C Submit Documentation Feedback mV 240 mV 10 mA 0.5 VIN = 14.8 V to 30 V, IL = 500 mA V 1 14.5 mA V 48 mV/khrs Copyright © 2004–2016, Texas Instruments Incorporated Product Folder Links: LM341 LM78M05 LM341, LM78M05 www.ti.com SNVS090F – MAY 2004 – REVISED DECEMBER 2016 6.6 Electrical Characteristics: LM341 (15 V) VIN = 23 V, CIN = 0.33 µF, CO = 0.1 µF, TJ = 25°C (unless otherwise noted). Limits are specified by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. PARAMETER TEST CONDITIONS IL = 500 mA VO Output voltage IL = 5 mA to 500 mA, PD ≤ 7.5 W, VIN = 18 V to 30 V, TJ = –40°C to 125°C VRLINE Line regulation VIN = 17.6 V to 30 V VRLOAD Load regulation IL = 5 mA to 500 mA IQ Quiescent current IL = 500 mA MIN TYP MAX 14.4 15 15.6 14.25 15 15.75 IL = 100 mA 150 IL = 500 mA 300 4 IL = 5 mA to 500 mA UNIT V mV 300 mV 10 mA 0.5 ΔIQ Quiescent current change Vn Output noise voltage f = 10 Hz to 100 kHz 90 µV ΔVIN Ripple rejection f = 120 Hz, IL = 500 mA 69 dB VIN Input voltage required to maintain IL = 500 mA line regulation ΔVO Long-term stability VIN = 18 V to 30 V, IL = 500 mA IL = 500 mA, TJ = –40°C to 125°C mA 1 17.6 V 60 mV/khrs Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated Product Folder Links: LM341 LM78M05 5 LM341, LM78M05 SNVS090F – MAY 2004 – REVISED DECEMBER 2016 www.ti.com 6.7 Typical Characteristics Figure 1. Peak Output Current Figure 2. Ripple Rejection Figure 3. Ripple Rejection Figure 4. Dropout Voltage Normalized to 1 V TJ = 25°C Figure 5. Output Voltage 6 Submit Documentation Feedback Figure 6. Quiescent Current Copyright © 2004–2016, Texas Instruments Incorporated Product Folder Links: LM341 LM78M05 LM341, LM78M05 www.ti.com SNVS090F – MAY 2004 – REVISED DECEMBER 2016 Typical Characteristics (continued) Figure 7. Quiescent Current Figure 8. Output Impedance Figure 9. Line Transient Response Figure 10. Load Transient Response Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated Product Folder Links: LM341 LM78M05 7 LM341, LM78M05 SNVS090F – MAY 2004 – REVISED DECEMBER 2016 www.ti.com 7 Detailed Description 7.1 Overview The LM341 and LM78M05 devices are a family of fixed positive voltage regulators. They can accept up to 35 V at the input and regulate it down to outputs of 5 V, 12 V, or 15 V. The devices are capable of supplying up to 500 mA of output current, although it is important to ensure there is adequate heat sinking to avoid exceeding thermal limits. However, in the case of accidental overload the device has built in current limiting, thermal shutdown and safe-operating area protection to prevent damage from occurring. 8 Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated Product Folder Links: LM341 LM78M05 LM341, LM78M05 www.ti.com SNVS090F – MAY 2004 – REVISED DECEMBER 2016 7.2 Functional Block Diagram Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated Product Folder Links: LM341 LM78M05 9 LM341, LM78M05 SNVS090F – MAY 2004 – REVISED DECEMBER 2016 www.ti.com 7.3 Feature Description The LM341 and LM78M05 fixed voltage regulators have built-in thermal overload protection which prevents the device from being damaged due to excessive junction temperature. The regulators also contain internal short-circuit protection which limits the maximum output current, and safearea protection for the pass transistor which reduces the short-circuit current as the voltage across the pass transistor is increased. Although the internal power dissipation is automatically limited, the maximum junction temperature of the device must be kept below 125°C to meet data sheet specifications. An adequate heat sink must be provided to assure this limit is not exceeded under worst-case operating conditions (maximum input voltage and load current) if reliable performance is to be obtained. 7.4 Device Functional Modes 7.4.1 Normal Operation The device OUTPUT pin sources current necessary to make the voltage at the OUTPUT pin equal to the fixed voltage level of the device. 7.4.2 Operation With Low Input Voltage The device requires up to 2-V headroom (VI – VO) to operate in regulation. With less headroom, the device may drop out of regulation in which the OUTPUT voltage would equal INPUT voltage minus dropout voltage. 7.4.3 Operation in Self Protection When an overload occurs, the device shuts down Darlington NPN output stage or reduce the output current to prevent device damage. The device automatically resets from the overload. The output may be reduced or alternate between on and off until the overload is removed. 10 Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated Product Folder Links: LM341 LM78M05 LM341, LM78M05 www.ti.com SNVS090F – MAY 2004 – REVISED DECEMBER 2016 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The LM341 and LM78Mxx devices are fixed voltage regulators meaning no external feedback resistors are required to set the output voltage. Input and output capacitors are also not required for the device to be stable. However input capacitance helps filter noise from the supply and output capacitance improves the transient response. 8.2 Typical Application *Required if regulator input is more than 4 inches from input filter capacitor (or if no input filter capacitor is used). **Optional for improved transient response. Figure 11. Typical Application 8.2.1 Design Requirements For this design example, use the parameters listed in Table 1 as the input parameters. Table 1. Design Parameters PARAMETER VALUE CIN 0.33 µF COUT 0.1 µF 8.2.2 Detailed Design Procedure 8.2.2.1 Input Voltage Regardless of the output voltage option being used (5 V, 12 V, 15 V), the input voltage must be at least 2 V greater to ensure proper regulation (7 V, 14 V, 17 V). Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated Product Folder Links: LM341 LM78M05 11 LM341, LM78M05 SNVS090F – MAY 2004 – REVISED DECEMBER 2016 www.ti.com 8.2.2.2 Output Current Depending on the input-output voltage differential, the output current must be limited to ensure maximum power dissipation is not exceeded. The graph in Figure 1 shows the appropriate current limit for a variety of conditions. 8.2.2.3 Input Capacitor If no power supply filter capacitor is used or if the device is placed more than four inches away from the capacitor of the power supply, an additional capacitor placed at the input pin of the device helps bypass noise. 8.2.2.4 Output Capacitor These devices are designed to be stable with no output capacitance and can be omitted from the design if needed. However if large changes in load are expected, an output capacitor is recommended to improve the transient response. 8.2.3 Application Curves Figure 12. RθJA vs 2-oz Copper Area for PFM Figure 13. Maximum Allowable Power Dissipation vs Ambient Temperature for PFM Figure 14. Maximum Allowable Power Dissipation vs 2-oz Copper Area for PFM 9 Power Supply Recommendations The LM341 and LM78M05 devices are designed to operate from an input voltage supply range between VOUT + 2 V to 35 V. If the device is more than four inches from the power supply filter capacitors, an input bypass capacitor 0.1-µF or greater of any type is recommended. 12 Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated Product Folder Links: LM341 LM78M05 LM341, LM78M05 www.ti.com SNVS090F – MAY 2004 – REVISED DECEMBER 2016 10 Layout 10.1 Layout Guidelines Some layout guidelines must be followed to ensure proper regulation of the output voltage with minimum noise. TI recommends that the input terminal be bypassed to ground with a bypass capacitor. The optimum placement is closest to the input terminal of the device and the system GND. Take care to minimize the loop area formed by the bypass-capacitor connection, the input terminal, and the system GND. Traces carrying the load current must be wide to reduce the amount of parasitic trace inductance. In cases when VIN shorts to ground, an external diode must be placed from VOUT to VIN to divert the surge current from the output capacitor and protect the IC. This diode must be placed close to the corresponding IC pins to increase their effectiveness. 10.2 Layout Example Figure 15. Layout Recommendation 10.3 Thermal Considerations When an integrated circuit operates with appreciable current, its junction temperature is elevated. It is important to quantify its thermal limits to achieve acceptable performance and reliability. This limit is determined by summing the individual parts consisting of a series of temperature rises from the semiconductor junction to the operating environment. A one-dimension steady-state model of conduction heat transfer is demonstrated in Figure 16. The heat generated at the device junction flows through the die to the die attach pad, through the lead frame to the surrounding case material, to the printed-circuit board, and eventually to the ambient environment. There are several variables that may affect the thermal resistance and in turn the need for a heat sink, which includes the following. Component variables (RθJC) • Leadframe size and material • Number of conduction pins • Die size • Die attach material • Molding compound size and material Application variables (RθCA) • Mounting pad size, material, and location • Placement of mounting pad • PCB size and material • Traces length and width • Adjacent heat sources • Volume of air • Ambient temperature • Shape of mounting pad Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated Product Folder Links: LM341 LM78M05 13 LM341, LM78M05 SNVS090F – MAY 2004 – REVISED DECEMBER 2016 www.ti.com Thermal Considerations (continued) The case temperature is measured at the point where the leads contact the mounting pad surface Figure 16. Cross-Sectional View of Integrated Circuit Mounted on a Printed-Circuit Board The LM341 and LM78M05 regulators have internal thermal shutdown to protect the device from overheating. Under all possible operating conditions, the junction temperature of the LM341 and LM78M05 must be within the range of 0°C to 125°C. A heat sink may be required depending on the maximum power dissipation and maximum ambient temperature of the application. To determine if a heat sink is needed, the power dissipated by the regulator (PD) is calculated using Equation 1. IIN = IL + IG PD = (VIN – VOUT) × IL + (VIN × IG) (1) (2) Figure 17 shows the voltages and currents which are present in the circuit. Figure 17. Power Dissipation Diagram The next parameter which must be calculated is the maximum allowable temperature rise, TR(MAX). TR(MAX) = TJ(MAX) – TA(MAX) where • • TJ(MAX) is the maximum allowable junction temperature (125°C) TA(MAX) is the maximum ambient temperature encountered in the application Using the calculated values for TR(MAX) and PD, the maximum allowable value for the junction-to-ambient thermal resistance (RθJA) can be calculated with Equation 3. RθJA = TR(MAX) / PD (3) As a design aid, Table 2 shows the value of the RθJA of TO-252 for different heat sink area. The copper patterns that we used to measure these RθJA are shown at the end of AN–1028 Maximum Power Enhancement Techniques for Power Packages (SNVA036). Figure 12 reflects the same test results as what are in the Table 2. Figure 13 shows the maximum allowable power dissipation versus ambient temperature for the PFM device. Figure 14 shows the maximum allowable power dissipation versus copper area (in2) for the TO-252 device. For power enhancement techniques to be used with TO-252 package, see AN–1028 Maximum Power Enhancement Techniques for Power Packages (SNVA036). 14 Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated Product Folder Links: LM341 LM78M05 LM341, LM78M05 www.ti.com SNVS090F – MAY 2004 – REVISED DECEMBER 2016 Thermal Considerations (continued) Table 2. RθJA Different Heat Sink Area (1) THERMAL RESISTANCE: RθJA (°C/W) COPPER AREA (in2) LAYOUT TOP SIDE (1) BOTTOM SIDE TO-252 1 0.0123 0 103 2 0.066 0 87 3 0.3 0 60 4 0.53 0 54 5 0.76 0 52 6 1 0 47 7 0 0.2 84 8 0 0.4 70 9 0 0.6 63 10 0 0.8 57 11 0 1 57 12 0.066 0.066 89 13 0.175 0.175 72 14 0.284 0.284 61 15 0.392 0.392 55 16 0.5 0.5 53 Tab of device is attached to topside copper. Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated Product Folder Links: LM341 LM78M05 15 LM341, LM78M05 SNVS090F – MAY 2004 – REVISED DECEMBER 2016 www.ti.com 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 Related Documentation For related documentation see the following: AN–1028 Maximum Power Enhancement Techniques for Power Packages (SNVA036) 11.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 3. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LM341 Click here Click here Click here Click here Click here LM78M05 Click here Click here Click here Click here Click here 11.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.5 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.6 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.7 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 16 Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated Product Folder Links: LM341 LM78M05 PACKAGE OPTION ADDENDUM www.ti.com 2-May-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM341T-5.0 NRND TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM341T-5.0 LM78M05CT LM341T-5.0/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM341T-5.0 LM78M05CT LM78M05CDT NRND TO-252 NDP 3 75 TBD Call TI Call TI -40 to 125 LM78M05 CDT LM78M05CDT/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM78M05 CDT LM78M05CDTX NRND TO-252 NDP 3 2500 TBD Call TI Call TI -40 to 125 LM78M05 CDT LM78M05CDTX/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM78M05 CDT LM78M05CH ACTIVE TO NDT 3 500 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 125 ( LM78M05CH ~ LM78M05CH) LM78M05CH/NOPB ACTIVE TO NDT 3 500 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -40 to 125 ( LM78M05CH ~ LM78M05CH) LM78M05CT NRND TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM341T-5.0 LM78M05CT LM78M05CT/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM341T-5.0 LM78M05CT (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. 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NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements. Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S. TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. 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