Material Content Data Sheet Sales Product Name SAK-XC2797X-200F100L AB MA# MA001049238 Package PG-LQFP-176-12 Issued 29. August 2013 Weight* 2017.17 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 71.686 3.55 0.149 0.01 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 3.55 35538 35538 74 0.594 0.03 295 11.887 0.59 5893 482.643 23.93 24.56 239268 245530 4.995 0.25 0.25 2476 2476 7.063 0.35 3502 190.712 9.45 1214.905 60.22 70.02 602282 700328 15.144 0.75 0.75 7507 7507 2.988 0.15 0.15 1482 1482 3.600 0.18 10.800 0.54 94544 1785 0.72 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 5354 7139 1000000