Panasonic EZJPZV6R8DANIL Multilayer varistor Datasheet

Multilayer Varistors
Multilayer Varistor for ESD pulse
[DC voltage lines/High speed signal lines]
Series
EZJP, 0201size
■ Features
■ Handling Precautions
see pages 8 to 13
● Excellent ESD suppression due to advanced material
■ Packaging Specifications
see pages 7
technology
● Meets IEC61000-4-2, Level 4 standard
● Can replace 2 Zener Diodes and 1 Capacitor
● Low capacitance versions for DC voltage lines of high
speed busses
● Ultra low capacitance for signal lines of high speed busses
● RoHS compliant
■ Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
E
Z
J
P
Z
V
6
R
8
G
A
Product Code
P
Series Code
EZJP series
Size Code
Z
0201
12
(Example)
Design Code
Packaging Style Code
V Paper Taping
Capacitance
Code
R
D
G
J
Nominal Varistor Voltage
The first and second digits denote
the first 2 numbers of the varistor
voltage and the third digit indicates
the number of zeros following.
Decimal point The decimal point
describes it into "R"
Design Code
Nil Cap. Tolerance :max.
20 pF
27 pF
100 pF
220 pF
■ Construction
No.
①
②
③
④
⑤
Name
Semiconductive Ceramics
Internal electrode
Substrate electrode
Terminal
Intermediate electrode
electrode
External electrode
■Dimensions in mm (not to scale)
(Unit:mm)
Size
Code
Z
Size
L
W
T
L1 , L2
0201
0.60±0.03
0.30±0.03
0.30±0.03
0.15±0.05
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
-1-
Multilayer Varistors
Multilayer Varistor, Low Voltage Type (Standard Type）
[DC voltage lines/Low speed signal lines]
Maximum allowable voltage
DC [V]
■Features
Multilayer monolithic ceramic construction
for use protecting DC voltage lines or signal lines
・Circuit voltage
- 1 -■ Recommended Applications
16
6.7
3.7
3
Mobile phone
SW, LCD, LED, Audio terminal,
Battery pack, Memory card, External IF
DSC, DVC
SW, LCD, LED, USB
PC, PDA
SW, LCD, LED, USB
TV, DVD
Audio, Video terminal
Audio
Audio terminal, Microphone, Receiver
Game console
Controller, External IF
5
12
Circuit voltage
DC [V]
・Varistor voltage : 6.8 to 27V [at 1mA]
・Capacitance : 15 to 150pFtyp. [at 1MHz]
■ Ratings and Characteristics
Maximum
allowable
voltage
at DC (V)
Nominal
varistor
voltage
at 1mA (V)
at 1MHz
at 1kHz
Maximum
peak current
at 8/20µs, 2times
(A)
EZJPZV6R8JA
3.7
6.8
220max
175typ.
5
EZJPZV6R8GA
3.7
6.8
100max
100typ.
5
EZJPZV120GA
6.7
12
100max
100typ.
5
EZJPZV120DA
6.7
12
27max
33typ.
1
EZJPZV270RA
16
27
20max.
16.5typ.
1
ize
0201
Part No.
Capacitance (pF)
Maximum ESD
at IEC61000-4-2
Contact discharge
8kV
●Operating Temperature Range : -40 to 85°C
＊Recommend soldering method : Reflow soldering
Maximum Allowable Voltage
Maximum DC Voltage that can be applied continuously within the operating temperature range
Varistor Voltage
Varistor starting voltage between terminals at DC 1mA, also known as Breakdown voltage
Maximum Peak Current
Varistor’s maximum current under the standard pulse 8/20µs, 2 times based on IEC60
Maximum ESD
Varistor’s maximum voltage under ESD based on IEC61000-4-2, 10 times
(5 times of each positive-negative polarity)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
-2-
Multilayer Varistors
■ Voltage vs. Current
Max. Leakage Current
Max. Clamping Voltage
100
Voltage (V)
EZJPZV270RA
EZJPZV120□A
EZJPZV6R8□A
10
EZJPZV270RA
EZJPZV120□A
EZJPZV6R8□A
1 -6
-5
-4
-3
-2
-1
0
10
10
10
100.001 10 0.01 10 0.110
1E-06
0.00001
0.0001
110
1
2
10
10
Current (A)
■Frequency vs. Capacitance
■Frequency vs. Attenuation
10
1000
220pFmax.
20pFmax.
0
27pFmax.
100
27pFmax.
20pFmax.
10
Attenuation [dB]
Capacitance [pF]
100pFmax.
-10
-20
220pFmax.
100pFmax.
-30
-40
-50
-60
1
0.1
1
10
100
Frequency [MHz]
1000
10000
0.1
1
10
100
1000
10000
Frequency [MHz]
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
-3-
Multilayer Varistors
■Varistor Characteristics and Equivalent Circuit
A Multilayer Varistor does not have an electrical polarity like zener diodes and is equivalent to total 3 pcs. of 2 zener
diodes and 1 capacitor.
［Equivalent Circuit］
Current (A)
Zener diode
Zener diode
monopolar 2pcs.
Voltage (V)
Capacitor 1 pc.
Multilayer Varistor
■ESD Suppressive Effects
Typical effects of ESD suppression
Test conditions: IEC61000-4-2* Level 4 Contact discharge, 8kV
［ESD suppressed waveform］
1200
1000
Attenuator : 60ｄB
330Ω
電圧 (V)(V)
Voltage
Electrostatic discharger
Oscillo-sc
ope
50Ω
Without Varistor
800
EZJPZV6R8GA
[V1mA : 6.8V,C1MHz:100pFmax.]
600
400
200
150pF
0
-200
-20
MLCV
0
20
40
60
80 100 120
時間 (nSecs)
140
160
180
200
Time (ns)
* IEC61000-4-2 … International Standard of the ESD testing method (HBM) setting 4 levels of severity
Severity
Level 1
Level 2
Level 3
Level 4
Contact discharge
2kV
4kV
6kV
8kV
Air discharge
2kV
4kV
8kV
15kV
■Replacement of Zener diode
Using a Multilayer Varistor to replace a “Zener diode & Capacitor” saves both the amount of space and number of
components used.
1.7
0.3
0.3
2.6
Mounting area
Approx.93%space saving
Zener diode
S-79
0.9
MLCC
Size 0402
MLCV
Size 0201
Dimensions in mm
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
-4-
Multilayer Varistors
■Recommended Applications
Applications
Series
DC 1k
Mobile phones, DSC, PC, PDA,
Series
EZJZ,P
HDD TV (PDP, LC etc.), DVD,
DVC, Game consoles,
1M
Circuit
1G (Hz)
DC to GHｚ
Ultra low capacitance
Antenna, RF circuit, LVDS
(Cap.:3pF or less)
USB, IEEE1394, HDMIetc.
Audio
equipment
Low capacitance
DC to millions of Hz
(Cap.:20 to 680pF)
PWR, SW, Audio terminals
LCD, RS232C, etc.
PWR, Photoelectronic sensors,
Series
SSR, Motors, Pressure sensors,
EZJS
High capacitance
DC to thousands of Hz
PWR, SW, Audio terminals etc.
(Cap.:1800 to 22000pF)
Proximity switches
■Applications
●Mobile Phone
- LCD/Camera lines
- Audio lines
AMP
LCD/
Camera
2mode noise filter
LCD/
Camera
F
P
C
controller
- LED
IC
- I/O data lines
- SW/ Keyboard
I/O
controller
Connector
IC
●USB1.1/2.0 lines
USB
controller
. .
.
●IEEE1394 lines
VDD
D＋
DGND
IEEE1394
controller
Power
IC
VDD
GND
..
..
TPA+
TPATPB+
TPB-
●HDMI lines
HDMI
IC
TMDS
Ch:0
Ch:1
Ch:2
Clock
Connector
1 1 1 1 1 1
11
2
2
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
-5-
Multilayer Varistors
■Performance and Testing Methods
Characteristics
Specifications
Standard test
conditions
Varistor voltage
Maximum allowable
voltage
Capacitance
To meet
the specified value
To meet
the specified value
To meet
the specified ｖalue
Maximum peak current
To meet
the specified value
Maximum ESD
To meet
the specified value
Solderability
Resistance to
soldering heat
Temperature cycle
Damp heat load
High temperature load
To meet
the specified value
ΔVc / Vc
: within ±10%
ΔVc / Vc
: within ±10%
ΔVc / Vc
: within ±10%
ΔVc / Vc
: within ±10%
Testing Method
Electrical characteristics shall be measured under the following
conditions.
Temp. : 5 to 35°C, Relative humidity : 85% or less
The voltage between both end terminals of a varistor when the
specified measuring current (CmA) is applied to the Varistor (Vc, or
VcmA.) The measurement shall be made as quickly as possible to
avoid heating effects.
The maximum DC voltage that can be applied continuously to a
varistor
Capacitance shall be measured at the specified frequency, bias
voltage 0V, measuring voltage 0.2 to 2 Vrms.
The maximum current measured (while the varistor voltage is within
±10% of its nominal value) when a standard impulse current of
8/20μseconds is applied twice within an interval of 5 minutes.
The maximum ESD measured (while the varistor voltage is within
±30% of its nominal value) when exposed to ESD 10 times (five
times for each positive-negative polarity) based on IEC61000-4-2.
The part shall be immersed into a soldering bath under the
conditions below.
Solder: H63A
Soldering flux: Ethanol solution of rosin (Concentration approx.25wt%）
Soldering temp.: 230±5°C
Period: 4±1 sec.
Soldering position: So that both terminal electrodes are completely
immersed in the soldering bath
The part shall be immersed into a soldering bath under the
conditions below (before being subjected to standard conditions) for
24±2 hours to evaluate its characteristics.
Soldering conditions:270°C, 3s / 260°C, 10s
Soldering position: So that both terminal electrodes are completely
immersed in the soldering bath
Repeat the following cycle on the part for the specified number of
times (before being subjected to standard conditions) for 24±2
hours to evaluate its characteristics.
Cycle : 5 cycles
Step
Temperature
Period
1
Max. Operating Temp.
30 min.
2
Ordinary temp.
3 min.
3
Min. Operating Temp.
30 min.
4
Ordinary temp.
3 min.
The part shall be tested under the conditions below (before being
subjected to standard conditions) for 24±2 hours to evaluate its
characteristics.
Temp.: 40±2°C
Humidity: 90~95%RH
Applied voltage: Maximum allowable voltage (Individually specified)
Period: 500＋24 / 0 h
The part shall be tested under the conditions below (before being
subjected to standard conditions) for 24±2 hours to evaluate its
characteristics.
Temp.: Maximum operating temperature ±3°C (Individually specified)
Applied voltage: Maximum allowable voltage (Individually specified)
Period : 500＋24 / 0h
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
-6-
Multilayer Varistors
■Packaging Specifications
●Standard Packing Quantities
Series
Size Code
Thickness
（mm）
Pitch (mm)
EZJP
Z (0201)
0.3
2
Paper Taping
Q’ty （pcs./reel）
15,000
●Paper Taping
● Reel for Taping
● Leader Part and Taped End
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
-7-
Multilayer Varistors
Multilayer Varistors ,Chip Type
Series : EZJZ
,EZJP(For DC voltage lines, high speed signal lines)
Series : EZJS (For DC voltage lines)
Handling Precautions
！
Safety Precautions
Multilayer Varistors (hereafter refereed to as “Varistors”) should be used for general purpose applications as
countermeasures against ESD and noise found in consumer electronics (audio/visual, home, office, information &
communication) equipment. When subjected to severe electrical, environmental, and/or mechanical stress beyond the
specifications, as noted in the Ratings and Specified Conditions section, the Varistors may fail in a short circuit mode
or in an open-circuit mode. This case results in a burn-out, smoke or flaming.
For products which require high safety levels, please carefully consider how a single malfunction can affect your
product. In order to ensure the safety in the case of a single malfunction, please design products with fail-safe, such as
setting up protecting circuits, etc.
● For the following applications and conditions, please contact us for additional specifications not found in this
document.
・When your application may have difficulty complying with the safety or handling precautions specified below.
・ For any applications where a malfunction with this product may directly or indirectly cause hazardous conditions
which could result in death or injury;
Aircraft and Aerospace Equipment (artificial satellite, rocket, etc.)
Submarine Equipment (submarine repeating equipment, etc.)
Transport Equipment (motor vehicles, airplanes, trains, ship, traffic signal controllers, etc.)
Power Generation Control Equipment (atomic power, hydroelectric power, thermal power plant control system,
etc.)
Medical Equipment (life-support equipment, pacemakers, dialysis controllers, etc.)
Information Processing Equipment (large scale computer system, etc.)
Electric Heating Appliances, Combustion devices (gas fan heaters, oil fan heaters, etc.)
Rotary Motion Equipment
Security Systems
And any similar types of equipment
！
Strict Observance
1. Confirmation of Rated Performance
The Varistors shall be operated within the specified rating/performance.
Application exceeding the specifications may cause deteriorated performance and/or breakdown, resulting in
degradation and/or smoking or ignition of products. The following are strictly observed.
(1) The Varistors shall not be operated beyond the specified operating temperature range.
(2) The Varistors shall not be operated in excess of the specified maximum allowable voltage.
(3) The Varistors shall not be operated in the circuits to which surge current and ESD are applied exceeding the
specified maximum peak current and maximum ESD.
(4) Never use for AC power supply circuits.
2. The Varistors shall not be mounted near inflammables.
■Operating Conditions and Circuit Design
1. Circuit Design
1.1 Operating Temperature and Storage Temperature
The specified “Operating Temperature Range” found
in the Specification is the absolute maximum and
minimum temperature rating. Every Varistor shall be
operated
within
the
specified
“Operating
Temperature Range”.
The Varistors mounted on PCB shall be stored
without operating within the specified “Storage
Temperature Range” in the Specifications.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
-8-
Multilayer Varistors
1.2 Operating Voltage
The Varistors shall not be operated in excess of the
“Maximum allowable voltage”. If the Varistors are
operated beyond the specified Maximum allowable
voltage, it may cause short and/or damage due to
thermal run away. When high frequency and steep
pulse voltages are continuously used, even when
less than the Maximum allowable voltage, in a
circuit, please examine the reliability of the Varistor
while also checking the safety and reliability of your
circuit. Check safety and reliability in your circuit.
1.3 Self-heating
The surface temperature of the Varistors shall be
under the specified Maximum Operating
Temperature in the Specifications including the
temperature rise cause by self-heating. Check
temperature rise of the Varistor in your circuit.
1.4 Environmental Restrictions
The Varistors shall not be operated and/or stored
under the following conditions.
(1) Environmental conditions
(a) Under direct exposure to water or salt water
(b) Under conditions where water can condense
and/or dew can form
(c) Under conditions containing corrosive gases
such as hydrogen sulfide, sulfurous acid,
chlorine and ammonia
(2) Mechanical conditions
Under severe conditions of vibration or impact
beyond the specified conditions found in the
Specifications.
2. Design of Printed Circuit Board
2.1 Selection of Printed Circuit Boards
When the Varistors are mounted and soldered on an
“Alumina Substrate”, the substrate influences the
Varistors’ reliability against “Temperature Cycles”
and “Heat shock” due to the difference in the
thermal expansion coefficient between them.
Confirm that the actual board used does not
deteriorate the characteristics of the Varistors.
2.2 Design of Land Pattern
(1) Recommended land dimensions are shown
below. Use the proper amount of solder in order to
prevent cracking. Using too much solder places
excessive stress on the Varistors.
Recommended Land Dimensions
SMD
Land
Size Code
Z(0201)
0(0402)
1(0603)
2(0805)
a
Component dimensions
Solder resist
a
b
c
0.3
0.2 to 0.3
0.2 to 0.3
0.2 to 0.3
1.0
0.5
0.5
0.4 to 0.5
0.4 to 0.5
0.4 to 0.5
1.6
0.8
0.8
0.8 to 1.0
0.6 to 0.8
0.6 to 0.8
2.0
1.25 0.8 to 1.25 0.8 to 1.2
0.8 to 1.0
0.8 to 1.0
W
0.6
a
Land
P
Component
dimensions
Size Code
L
W
a
T
S
1.37 1.0
(0504 2Array)
0.6
b
C
P
0.3～ 0.45～ 0.3～ 0.54～
0.4
0.55
0.4
0.74
(2) The size of lands shall be designed to have equal
spacing between the right and left sides. If the
amount of solder on the right land is different from
that on the left land, the component may be
cracked by stress since the side with a larger
amount of solder solidifies later during cooling.
Recommended Amount of Solder
(a) Excessive amount (b) Proper amount
(c) Insufficient amount
2.3 Utilization of Solder Resist
(1) Solder resist shall be utilized to equalize the
amounts of solder on both sides.
(2) Solder resist shall be used to divide the pattern for
the following cases;
･Components are arranged closely.
･The Varistor is mounted near a component with
lead wires.
･The Varistor is placed near a chassis.
See the table below.
Prohibited Applications and Recommended Applications
Prohibited
applications
Item
Mixed mounting
with a component
with lead wires
Arrangement
near chassis
Retro-fitting of
component with
lead wires
T
0.3
L
SMD
b
The lead wire of a
component with lead wires
Chassis
Solder
(Ground solder)
Improved applications
by pattern division
Solder resist
Solder resist
Electrode pattern
c
b
c
Lateral
arrangement
Soldering
iron
A lead wire of
Retro-fitted
component
Portion to be expressively
soldered
Solder resist
Solder resist
Land
2.4 Component Layout
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
-9-
Multilayer Varistors
The Varistors/components shall be placed on the PC
board such that both electrodes are subjected to uniform
stresses, or to position the component electrodes at right
angles to the grid glove or bending line. This should be
done to avoid cracking the Varistors from bending the
PC board after or during placing/mounting on the PC
board.
(1) To minimize mechanical stress caused by the
warp or bending of a PC board, please follow the
recommended Varistors’ layout below.
Prohibited
Recommendded layout
Layout the Varistor sideways
against the stressing direction.
(2) The following layout is for your reference since
mechanical stress near the dividing/breaking
position of a PC board varies depending on the
mounting position of the Varistors.
2. Adhesives for Mounting
(1) The amount and viscosity of an adhesive for
mounting shall be such that the adhesive shall
not flow off on the land during its curing.
(2) If the amount of adhesive is insufficient for
mounting, the Varistors may fall off after or during
soldering.
(3) If the adhesive is too low in its viscosity, the
Varistors may be out of alignment after or during
soldering.
(4) Adhesives for mounting can be cured by
ultraviolet or infrared radiation. In order to prevent
the terminal electrodes of the Varistors from
oxidizing, the curing shall be done under the
following conditions:
160°C max., for 2 minutes max.
(5) Insufficient curing may cause the Varistors to fall
off after or during soldering. In addition, insulation
resistance between terminal electrodes may
deteriorate due to moisture absorption. In order to
prevent these problems, please observe proper
curing conditions.
3. Chip Mounting Consideration
E
D
Perforation
C
A
Slit
B
Magnitude of stress A>B=C>D>E
(3) The magnitude of mechanical stress applied to the
Varistors when the circuit board is divided is in the
order of push back < slit < V-groove < perforation.
Also take into account the layout of the Varistors
and the dividing/breaking method.
2.5 Mounting Density and Spaces
If components are arranged in too narrow a space,
the components can be affected by solder bridges
and solder balls. The space between components
should be carefully determined.
■ Precautions for Assembly
1. Storage
(1) The Varistors shall be stored between 5 – 40°C
and 20 - 70%RH, not under severe conditions of
high temperature and humidity.
(2) If stored in a place that is humid, dusty, or contains
corrosive gasses (hydrogen sulfide, sulfurous acid,
hydrogen chloride and ammonia etc.), the solderability
of terminal electrodes may deteriorate.
In addition, storage in a place subjected to heating
and/or exposure to direct sunlight will causes
deformed tapes and reels, and component sticking
to tapes, both of which can result in mounting
problems.
(3) Do not store components longer than 6 months.
Check the solderability of products that have been
stored for more than 6 months before use.
(1) When mounting the Varistors/components on a PC
board, the Varistor bodies shall be free from
excessive impact loads such as mechanical impact
or stress due to the positioning, pushing force and
displacement of vacuum nozzles during mounting.
(2) Maintenance and inspection of the Chip Mounter
must be performed regularly.
(3) If the bottom dead center of the vacuum nozzle is
too low, the Varistor will crack from excessive force
during mounting.
The following precautions and recommendations
are for your reference in use.
(a) Set and adjust the bottom dead center of the
vacuum nozzles to the upper surface of the PC
board after correcting the warp of the PC board.
(b) Set the pushing force of the vacuum nozzle
during mounting to 1 to 3 N in static load.
(c) For double surface mounting, apply a supporting
pin on the rear surface of the PC board to
suppress the bending of the PC board in order to
minimize the impact of the vacuum nozzles.
Typical examples are shown in the table below.
Item
Prohibited mounting
Crack
Single surface
mouting
Recommended mounting
The supporting pin does not
necessarily
have
to
be
positioned beneath the Varistor.
Supporting
pin
Double surface
mounting
Separation
of Solder
Crack
Supporting
i
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
- 10 -
Multilayer Varistors
Recommended profile for Flow soldering [Ex.]
(d) Adjust the vacuum nozzles so that their bottom
dead center during mounting is not too low.
(4) The closing dimensions of the positioning chucks
shall be controlled. Maintenance and replacement
of positioning chucks shall be performed regularly
to prevent chipping or cracking of the Varistors
caused by mechanical impact during positioning
due to worn positioning chucks.
(5) Maximum stroke of the nozzle shall be adjusted so
that the maximum bending of PC board does not
exceed 0.5mm at 90 mm span. The PC board shall
be supported by an adequate number of supporting
pins.
Soldering
260
240
(1) Application of Soldering flux:
The soldering flux shall be applied to the mounted Varistors
thinly and uniformly by foaming method.
(2) Preheating:
The mounted Varistors/Components shall be pre-heated
sufficiently so that the “Temperature Gradient” between the
Varistors/Components and the melted solder shall be
150 °C max. (100 to 130°C)
(3) Immersion into Soldering bath:
The Varistors shall be immersed into a soldering bath of
240 to 260 °C for 3 to 5 seconds.
(4) Gradual Cooling:
The Varistors shall be cooled gradually to room ambient
temperature with the cooling temperature rates of 8 °C /s
max. from 250°C to 170 °C and 4 °C/s max. from 170 °C to
130°C.
(5) Flux Cleaning:
When the Varistors are immersed into a cleaning solvent,
be sure that the surface temperatures of devices do not
exceed 100 °C.
(6) Performing flow soldering once under the conditions shown
in the figure below [Recommended profile of Flow soldering
(Ex)] will not cause any problems. However, pay attention
to the possible warp and bending of the PC board.
Temperature (℃)
⊿T
Time
3 to 5
sec
5.2 Reflow Soldering
The reflow soldering temperature conditions are each
temperature curves of Preheating, Temp. rise, Heating,
Peak and Gradual cooling.
Large temperature difference caused by rapid heat
application to the Varistors may lead to excessive
thermal stresses, contributing to the thermal cracks.
The Preheating temperature requires controlling with
great care so that tombstone phenomenon may be
prevented.
Item
Preheating
Temp. rise
Heating
Peak
Gradual cooling
Temperature
140 to 180°C
Preheating temp
to Peak temp.
220°C min.
260°C max.
Peak temp.
to 140°C
Period or Speed
60 to 120 sec
2 to 5°C /sec
60 sec max.
10 sec max.
1 to 4°C /sec
Recommended profile of Reflow soldering (EX)
④Peak
260
220
②Temp.rise
⊿T
5.1 Flow Soldering
For flow soldering, abnormal and large thermal and
mechanical stress, caused by the ” Temperature
Gradient” between the mounted Varistors and melted
solder in a soldering bath may be applied directly to
the Varistors, resulting in failure and damage of the
Varistors. Therefore it is essential that soldering
process follow these recommended conditions.
3~5 秒
<Allowable temperature difference>
Size
Temp. Tol.
0603
∆T 150°C
For
products
specified
in
individual
specifications, avoid flow soldering.
Temperature (℃)
5. Soldering
(at ordinary temperature)
60 to 120sec
4. Selection of Soldering Flux
Soldering flux may seriously affect the performance of
the Varistors. The following shall be confirmed before
use.
(1) The soldering flux should have a halogen based
content of 0.1 wt% (converted to chlorine) or below.
Do not use soldering flux with strong acid.
(2) When applying water-soluble soldering flux, wash
the Varistors sufficiently because the soldering flux
residue on the surface of PC boards may
deteriorate the insulation resistance on the
Varistors’ surface.
Gradual cooling
⑤Gradual
cooling
180
140
①Preheating
③Heating
Time
60 to 120 sec
60 sec max.
∆T : Allowable temperature difference ∆T 150°C
The rapid cooling (forced cooling) during Gradual
cooling part should be avoided, because this may
cause defects such as the thermal cracks, etc.
When the Varistors are immersed into a cleaning
solvent, make sure that the surface temperatures of the
devices do not exceed 100 .
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
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Multilayer Varistors
Performing reflow soldering twice under the conditions
shown in the figure above [Recommended profile of
Reflow soldering (EX)] will not cause any problems.
However, pay attention to the possible warp and
bending of the PC board.
5.3 Hand Soldering
Hand soldering typically causes significant temperature
change, which may induce excessive thermal stresses
inside the Varistors, resulting in the thermal cracks, etc.
In order to prevent any defects, the following should be
observed;
･ The temperature of the soldering tips should be
controlled with special care.
･The direct contact of soldering tips with the Varistors
and/or terminal electrodes should be avoided.
･Dismounted Varistors shall not be reused.
(1) Condition 1 (with preheating)
(a) Soldering:
Φ1.0mm Thread eutectic solder with soldering
flux* in the core.
*Rosin-based and non-activated flux is Recommended.
(b) Preheating:
The Varistors shall be preheated so that the
“Temperature Gradient” between the devices
and the tip of soldering iron is 150°C or below.
(c) Temperature of Iron tip: 300°C max.
(The required amount of solder shall be melted
in advance on the soldering tip.)
(d) Gradual cooling:
After soldering, the Varistors shall be cooled
gradually at room temperature.
Recommended profile of Hand soldering (EX)
⊿T
Gradual cooling
Conditions of Hand soldering without preheating
Condition
Temperature of Iron tip
270 °C max.
Wattage
20 W max.
Shape of Iron tip
φ3 mm max.
Soldering time
3 sec max.
with a soldering iron
6. Post Soldering Cleaning
6.1 Cleaning solvent
Soldering flux residue may remain on the PC board
if cleaned with an inappropriate solvent. This may
deteriorate the electrical characteristics and
reliability of the Varistors.
6.2 Cleaning conditions
Inappropriate cleaning conditions such as
insufficient cleaning or excessive cleaning may
impair the electrical characteristics and reliability of
the Varistors.
(1) Insufficient cleaning can lead to:
(a) The halogen substance found in the residue of
the soldering flux may cause the metal of
terminal electrodes to corrode.
(b) The halogen substance found in the residue of
the soldering flux on the surface of the Varistors
may change resistance values.
(c) Water-soluble soldering flux may have more
remarkable tendencies of (a) and (b) above
compared to those of rosin soldering flux.
(2) Excessive cleaning can lead to:
(a) Overuse of ultrasonic cleaning may deteriorate
the strength of the terminal electrodes or cause
cracking in the solder and/or ceramic bodies of
the Varistors due to vibration of the PC boards.
Please follow these conditions for Ultrasonic
cleaning:
Ultrasonic wave output: 20 W/L max.
Ultrasonic wave frequency: 40 kHz max.
Ultrasonic wave cleaning time: 5 min. max.
Preheating
60 to 120 sec
3 sec max.
∆T : Allowable temperature difference ∆T 150°C
(2) Condition 2 (without preheating)
Hand soldering can be performed without preheating,
by following the conditions below:
(a) Soldering iron tip shall never directly touch the
ceramic and terminal electrodes of the Varistors.
(b) The lands are sufficiently preheated with a
soldering iron tip before sliding the soldering iron tip
to the terminal electrodes of the Varistors for
soldering.
6.3 Contamination of Cleaning solvent
Cleaning with contaminated cleaning solvent may
cause the same results as insufficient cleaning
due to the high density of liberated halogen.
7. Inspection Process
When mounted PC boards are inspected with
measuring terminal pins, abnormal and excess
mechanical stress shall not be applied to the PC broad
or mounted components, to prevent failure or damage
to the devices.
(1) Mounted PC boards shall be supported by an
adequate number of supporting pins with bend
settings of 90 mm span 0.5 mm max.
(2) Confirm that the measuring pins have the right tip
shape, are equal in height and are set in the
correct positions.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
- 12 -
Multilayer Varistors
The following figures are for your reference to
avoid bending the PC board.
Prohibited setting
Recommended setting
Check pin
Check pin
Bending of
PC board
Supporting pin
Separated, Crack
8. Protective Coating
When the surface of a PC board on which the Varistors
have been mounted is coated with resin to protect
against moisture and dust, it shall be confirmed that the
protective coating which is corrosive or chemically active
is not used, in order that the reliability of the Varistors in
the actual equipment may not be influenced. Coating
materials that expand or shrink also may lead to damage
to the Varistor during the curing process.
9. Dividing/Breaking of PC Boards
(1) Abnormal and excessive mechanical stress such as
bending or torsion shown below can cause cracking
in the Varistors.
Prohibited dividing
Recommended dividing
Loading direction
Loading direction
Loading
point
V-groove
PC
board
PC
board
Chip
component
Chip component
Loading
point
V-groove
9. Mechanical Impact
(1) The Varistors shall be free from any excessive
mechanical impact. The Varistor body is made of
ceramics and may be damaged or cracked if
dropped.
Never use a Varistor which has been dropped; their
quality may be impaired and failure rate increased.
(2) When handling PC boards with Varistors mounted
on them, do not allow the Varistors to collide with
another PC board.
When mounted PC boards are handled or stored in
a stacked state, impact between the corner of a PC
board and the Varistor may cause damage or
cracking and can deteriorate the withstand voltage
and insulation resistance of the Varistor.
Torsion
Bending
(2) Dividing/Breaking of the PC boards shall be done
carefully at moderate speed by using a jig or
apparatus to prevent the Varistors on the boards
from mechanical damage.
(3) Examples of PCB dividing/breaking jigs:
The outline of PC board breaking jig is shown
below.
When PC board are broken or divided, loading
points should be close to the jig to minimize the
extent of the bending.
Also, planes with no parts mounted on should be
used as plane of loading, which generates a
compressive stress on the mounted plane, in order
to prevent tensile stress induced by the bending,
which may cause cracks of the Varistors or other
parts mounted on the PC boards.
■Other
The various precautions described above are typical.
For special mounting conditions, please contact us.
Outline of Jig
PC board
V-groove
PC board
splitting jig
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
- 13 -