CERAMIC CHIP INDUCTORS C1 SERIES 1. PART NO. EXPRESSION : C 1 - 1 N 0 S - □□ (a) (b) (c) (d) (a) Series code (c) Inductance Tolerence : S=± 0.3nH , J=± 5% , K=± 10% (b) Inductance code : 1N0 = 1.0nH (d) 10: Standard 11 ~ 99 : Internal control number 2. C0NFIGURATION & DIMENSIONS : A B D L H C G Recommended PC Board Pattern Unit:m/m B A C G H L 0.45~0.55 0.45~0.55 1.50 D 1.00± 0.05 0.50± 0.05 0.50± 0.05 0.25± 0.10 3. SCHEMATIC : 4. MATERIALS : b a Ag(100%) Ni(100%)-1.5um(min.) Sn(100%)-3.0um(min.) (a) Body : ceramic ( Pb Free ) (b) Termination : ( Pb Free ) 5. GENERAL SPECIFICATION : a) Operating temp. : -40° C to +105° C ( including self-temperature. rise ) b) Storage condition (component in its packaging) i) Temperature : -10 to 40° C ii) Humidity : 60% NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 CERAMIC CHIP INDUCTORS C1 SERIES 6. ELECTRICAL CHARACTERISTICS : Part Number Inductance Test Frequency Q (nH) ( MHz ) Min Q(Typ.) Frequency(MHz) 100 300 500 800 1000 Rated Current DC Resistance (Ω) SRF ( MHz ) (mA) Max Max. Typ. Min 0.04 10000 >13000 Typ. C1-1N0S-10 1.0 100 8 11 25 34 43 52 300 0.08 C1-1N2S-10 1.2 100 8 11 25 35 44 52 300 0.09 0.04 10000 >13000 C1-1N5S-10 1.5 100 8 11 24 33 44 48 300 0.10 0.05 6000 >13000 C1-1N8S-10 1.8 100 8 11 23 30 36 42 300 0.12 0.06 6000 11000 C1-2N0S-10 2.0 100 8 11 21 27 34 39 300 0.12 0.06 6000 10500 C1-2N2S-10 2.2 100 8 10 18 25 31 36 300 0.13 0.07 6000 10000 C1-2N4S-10 2.4 100 8 10 18 24 31 35 300 0.13 0.07 6000 9500 9000 C1-2N7S-10 2.7 100 8 10 18 24 31 34 300 0.13 0.08 6000 C1-3N0S-10 3.0 100 8 10 18 24 31 35 300 0.16 0.09 6000 8500 C1-3N3S-10 3.3 100 8 10 18 24 31 35 300 0.16 0.10 6000 8000 C1-3N6S-10 3.6 100 8 10 18 24 31 35 300 0.20 0.11 5000 7500 C1-3N9S-10 3.9 100 8 10 18 24 31 35 300 0.21 0.12 4000 7000 C1-4N3S-10 4.3 100 8 10 18 24 31 35 300 0.20 0.12 4000 6500 C1-4N7S-10 4.7 100 8 10 18 24 31 34 300 0.21 0.12 4000 6000 C1-5N1S-10 5.1 100 8 10 18 24 31 34 300 0.21 0.13 4000 5800 10 18 24 30 35 300 0.23 0.15 4000 5700 C1-5N6S-10 5.6 100 8 C1-6N2S-10 6.2 100 8 10 18 24 30 34 300 0.25 0.16 3900 5600 C1-6N8□-10 6.8 100 8 10 18 23 29 32 300 0.25 0.17 3900 5500 C1-7N5□-10 7.5 100 8 10 18 23 29 32 300 0.25 0.18 3700 5200 C1-8N2□-10 8.2 100 8 10 18 23 29 31 300 0.28 0.21 3600 4900 0.22 3400 4500 4300 C1-9N1□-10 9.1 100 8 10 18 23 29 31 300 10 18 23 29 31 300 0.31 0.23 3200 0.30 C1-10N□-10 10 100 8 C1-12N□-10 12 100 8 11 18 23 29 31 300 0.40 0.28 2700 3900 C1-15N□-10 15 100 8 11 18 23 28 30 300 0.46 0.31 2300 3500 C1-18N□-10 18 100 8 11 18 23 28 30 300 0.55 0.35 2100 3100 C1-22N□-10 22 100 8 11 17 22 26 27 300 0.60 0.42 1900 2800 C1-27N□-10 27 100 8 11 17 21 25 26 300 0.70 0.47 1600 2300 C1-33N□-10 33 100 8 11 16 20 23 22 200 0.80 0.50 1300 1900 C1-39N□-10 39 100 8 11 16 20 23 21 200 0.90 0.52 1200 1700 16 19 21 18 200 1.00 0.58 1000 1500 C1-47N□-10 47 100 8 11 C1-56N□-10 56 100 8 11 16 18 18 16 200 1.00 0.61 750 1300 C1-68N□-10 68 100 8 11 15 17 18 11 180 1.20 0.70 750 1200 C1-82N□-10 82 100 8 10 14 16 15 6 150 1.30 0.81 600 1100 C1-R10□-10 100 100 8 10 14 14 12 - 150 1.50 0.94 600 1000 NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 CERAMIC CHIP INDUCTORS Part Number C1 SERIES Inductance Test Frequency Q (nH) ( MHz ) Min 10 12 10 - Q(Typ.) Frequency(MHz) 100 300 Rated Current DC Resistance (Ω) SRF ( MHz ) (mA) Max Max. Typ. Min - 150 1.60 1.10 600 800 500 800 1000 Typ. C1-R12□-10 120 100 8 C1-R15□-10 150 100 8 12 17 17 - - 140 3.20 2.57 550 920 C1-R18□-10 180 100 8 12 16 - - - 130 3.70 2.97 500 810 C1-R22□-10 220 100 8 12 16 - - - 120 4.20 3.29 450 700 C1-R27□-10 270 100 8 12 14 - - - 110 4.80 3.92 400 600 Inductance Tolerence : □ J=± 5% K=± 10% NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 CERAMIC CHIP INDUCTORS C1 SERIES 7. CHARACTERISTICS CURVES : Impedance v.s. Frequency Characteristics HCI100 5F Z 10000 VS Freq. IMPEDANCE(Ohm) 1000 100n 100 47n 10 22n 1 10n 6.8n 0. 1 1 10 100 1 000 10000 FREQUENCY(MHz) Inductance v.s. Frequency Characteristics HCI1005F L VS Fr eq. INDUCTANCE( nH) 1000 100n 100 47n 22n 10n 10 6.8n 1 1 10 100 1000 1 0000 FREQUENCY(MHz) Q v.s. Frequency Characteristics HCI1005F Q VS Freq. 100 6.8n Q 10n 22n 10 47n 100n 1 1 10 100 1000 10000 FREQUENCY(MHz) NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 CERAMIC CHIP INDUCTORS C1 SERIES 8. SOLDERING AND MOUNTING : 8-1. Recommended PC Board Pattern Unit:m/m L H G L G H 1.50 0.45~0.55 0.45~0.55 PC board should be designed so that products can prevent damage from mechanical stress when warping the board. 8-2. Soldering Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Note. If wave soldering is used ,there will be some risk. Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk 8-2.1 Lead Free Solder Re-flow : Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C) 8-2.2 Soldering Iron : Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2. Note : d) 1.0mm tip diameter (max) a) Preheat circuit and products to 150° C. e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 350° C tip temperature for Ferrite chip bead (max) f) Limit soldering time to 4-5 secs. c) Never contact the ceramic with the iron tip Soldering Natural cooling 20~40s TP(26 0° C/40 s max.) 217 200 150 60~150s 60~180s 25 4 80s max. Preheating TEMPERATURE ° C TEMPERATURE ° C Preheating Time(sec.) Figure 1. Re-flow Soldering:3 times max Soldering Natural cooling 350 150 G rad ual Cooling O ve r 60s. Within4 ~5s Figure 2. Wave Soldering:1 times max NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 CERAMIC CHIP INDUCTORS C1 SERIES 8-3. Solder Volume Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 3. Minimum fillet height = soldering thickness + 25% product height Upper limit t ReC0mmendable Figure 3 NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 CERAMIC CHIP INDUCTORS C1 SERIES 9. PACKAGING INFORMATION : 9-1. Reel Dimension A 2± 0.5 13.5± 0.5 R10.5 R0.5 C D B R1.9 120° 7" x 8mm Type A(mm) B(mm) 7" x 8mm 9.0± 0.5 60± 2 C(mm) D(mm) 13.5± 0.5 178.0± 2.0 9-2 Tape Dimension / 8mm Material : Paper Bo Ao P W:8.0± 0.1 t F:3.5± 0.1 E:1.75± 0.1 D:1.56+0.1-0.05 Po:4± 0.1 P2:2± 0.10 Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) C1 1.15± 0.10 0.65± 0.10 0.80 max 2.0± 0.05 0.80 max Ko 9-3. Packaging Quantity Chip Size C1 Chip / Reel 10000 Inner Box 50000 Middle Box 250000 Carton 500000 NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 CERAMIC CHIP INDUCTORS C1 SERIES 9-4. Tearing Off Force The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. F 165° C to 180° C Top cover tape Room Temp. (° C) Room Humidity (%) Room atm (hPa) Tearing Speed (mm/min) 5~35 45~85 860~1060 300 Base tape Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Recommended products should be used within 12 months from the time of delivery. b) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.01.2015 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8