TI LM4880 Dual 250 mw audio power amplifier with shutdown mode Datasheet

LM4880
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LM4880
Dual 250 mW Audio Power Amplifier with
Shutdown Mode
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FEATURES
DESCRIPTION
•
The LM4880 is a dual audio power amplifier capable
of delivering typically 250mW per channel of
continuous average power to an 8Ω load with 0.1%
THD+N using a 5V power supply.
1
2
•
•
•
No Bootstrap Capacitors or Snubber Circuits
are Necessary
Small Outline (SOIC) and PDIP Packaging
Unity-Gain Stable
External Gain Configuration Capability
APPLICATIONS
Boomer audio power amplifiers were designed
specifically to provide high quality output power with a
minimal amount of external components using
surface mount packaging.
•
•
•
Headphone Amplifier
Personal Computers
CD-ROM Players
Since the LM4880 does not require bootstrap
capacitors or snubber networks, it is optimally suited
for low-power portable systems.
KEY SPECIFICATIONS
The LM4880 features an externally controlled, lowpower consumption shutdown mode, as well as an
internal thermal shutdown protection mechanism.
•
•
•
•
•
THD+N at 1kHz at 200mW Continuous Average
Output Power into 8Ω: 0.1% (max)
THD+N at 1kHz at 85mW Continuous Average
Output Power into 32Ω: 0.1% (typ)
Output Power at 10% THD+N at 1kHz into 8Ω
325 mW (typ)
Shutdown Current 0.7 µA (typ)
2.7V to 5.5V Supply Voltage Range
The unity-gain stable LM4880 can be configured by
external gain-setting resistors.
Connection Diagram
Figure 1. Small Outline and PDIP Packages- Top View
See Package Number D0008A for SOIC
or Package Number P0008E for PDIP
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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Typical Application
*Refer to Application Information for information concerning proper selection of the input and output coupling
capacitors.
Figure 2. Typical Audio Amplifier Application Circuit
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1) (2)
Supply Voltage
6.0V
−65°C to +150°C
Storage Temperature
−0.3V to VDD + 0.3V
Input Voltage
Power Dissipation
(3)
Internally limited
ESD Susceptibility
(4)
2000V
ESD Susceptibility
(5)
200V
Junction Temperature
Soldering Information
150°C
Small Outline Package
Vapor Phase (60 sec.)
Infrared (15 sec.)
Thermal Resistance
(1)
(2)
(3)
(4)
(5)
2
215°C
220°C
θJC (PDIP)
37°C/W
θJA (PDIP)
107°C/W
θJC (SOIC)
35°C/W
θJA (SOIC)
170°C/W
Absolute Maximum Ratings indicate limits beyond which damage may occur. Operating Ratings indicate conditions for which the device
is functional, but do not specify specific performance limits. Electrical Characteristics state DC and AC electrical specifications under
particular test conditions which ensure specific performance limits. This assumes that the device is within the Operating Ratings.
Specifications are not specified for parameters where no limit is given, however, the typical value is a good indication of device
performance.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature
TA. The maximum allowable power dissipation is PDMAX = (TJMAX − TA)/θJA or the number given in the Absolute Maximum Ratings,
whichever is lower. For the LM4880, TJMAX = 150°C, and the typical junction-to-ambient thermal resistance is 170°C/W for package
D0008A and 107°C/W for package P0008E.
Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Machine model, 220 pF–240 pF discharged through all pins.
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Operating Ratings
TMIN≤TA≤TMAX
Temperature Range
−40°C≤TA≤+85°C
2.7V≤VDD≤5.5V
Supply Voltage
Electrical Characteristics
(1) (2)
The following specifications apply for VDD = 5V unless otherwise specified. Limits apply for TA = 25°C.
Symbol
Parameter
Conditions
LM4880
Typical
(3)
Limit
Units
(Limits)
(4)
VDD
Supply Voltage
2.7
V (min)
5.5
V (max)
IDD
Quiescent Power Supply Current
VIN=0V, IO=0A
3.6
6.0
mA (max)
ISD
Shutdown Current
VPIN5=VDD
0.7
5
μA (max)
VOS
Output Offset Voltage
VIN=0V
5
50
mV (max)
PO
Output Power
THD=0.1% (max); f=1 kHz;
RL=8Ω
250
200
mW (min)
RL=32Ω
85
mW
RL=8Ω
325
mW
RL=32Ω
110
mW
RL=8Ω, PO=200 mW;
0.03
%
RL=32Ω, PO=75 mW;
0.02
%
50
dB
THD+N=10%; f=1 kHz
THD+N
Total Harmonic Distortion+Noise
f=1 kHz
PSRR
(1)
(2)
(3)
(4)
CB = 1.0 μF,
VRIPPLE=200 mVrms, f = 100 Hz
Power Supply Rejection Ratio
All voltages are measured with respect to the ground pin, unless otherwise specified.
Absolute Maximum Ratings indicate limits beyond which damage may occur. Operating Ratings indicate conditions for which the device
is functional, but do not specify specific performance limits. Electrical Characteristics state DC and AC electrical specifications under
particular test conditions which ensure specific performance limits. This assumes that the device is within the Operating Ratings.
Specifications are not specified for parameters where no limit is given, however, the typical value is a good indication of device
performance.
Typicals are measured at 25°C and represent the parametric norm.
Limits are ensured to TI's AOQL (Average Outgoing Quality Level).
Automatic Shutdown Circuit
Figure 3. Automatic Shutdown Circuit
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Automatic Switching Circuit
Figure 4. Automatic Switching Circuit
External Components Description
(Figure 2)
Components
Functional Description
1.
Ri
Inverting input resistance which sets the closed-loop gain in conjunction with RF. This resistor also forms a high
pass filter with Ci at fc = 1/(2πRiCi).
2.
Ci
Input coupling capacitor which blocks the DC voltage at the amplifier's input terminals. Also creates a high pass
filter with Ri at fc = 1/(2πRiCi). Refer to PROPER SELECTION OF EXTERNAL COMPONENTS for an explanation
of how to determine the value of Ci.
3.
RF
Feedback resistance which sets closed-loop gain in conjunction with Ri.
4.
CS
Supply bypass capacitor which provides power supply filtering. Refer to Application Information for proper
placement and selection of the supply bypass capacitor.
5.
CB
Bypass pin capacitor which provides half-supply filtering. Refer to PROPER SELECTION OF EXTERNAL
COMPONENTS for information concerning proper placement and selection of CB.
6.
Co
Output coupling capacitor which blocks the DC voltage at the amplifier's output. Forms a high pass filter with RL at
fo = 1/(2πRLCo).
4
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Typical Performance Characteristics
THD + N
vs
Output Power
THD + N
vs
Output Power
Figure 5.
Figure 6.
THD + N
vs
Output Power
THD + N
vs
Output Power
Figure 7.
Figure 8.
THD + N
vs
Output Power
THD + N
vs
Output Power
Figure 9.
Figure 10.
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Typical Performance Characteristics (continued)
6
THD + N
vs
Frequency
THD + N
vs
Frequency
Figure 11.
Figure 12.
THD + N
vs
Frequency
THD + N
vs
Frequency
Figure 13.
Figure 14.
Output Power vs
Load Resistance
Output Power vs
Load Resistance
Figure 15.
Figure 16.
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Typical Performance Characteristics (continued)
Output Power vs
Supply Voltage
Output Power vs
Supply Voltage
Figure 17.
Figure 18.
Output Power vs
Supply Voltage
Clipping Voltage vs
Supply Voltage
Figure 19.
Figure 20.
Clipping Voltage vs
Supply Voltage
Power Dissipation vs
Output Power
Figure 21.
Figure 22.
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Typical Performance Characteristics (continued)
8
Channel Separation
Output Attenuation in
Shutdown Mode
Figure 23.
Figure 24.
Noise Floor
Power Supply
Rejection Ratio
Figure 25.
Figure 26.
Open Loop
Frequency Response
Supply Current vs
Supply Voltage
Figure 27.
Figure 28.
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Typical Performance Characteristics (continued)
Frequency Response vs
Output Capacitor Size
Frequency Response vs
Output Capacitor Size
Figure 29.
Figure 30.
Frequency Response vs
Input Capacitor Size
Typical Application
Frequency Response
Figure 31.
Figure 32.
Typical Application
Frequency Response
Power Derating Curve
Figure 33.
Figure 34.
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APPLICATION INFORMATION
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the LM4880 contains a shutdown pin to externally turn off
the amplifier's bias circuitry. This shutdown feature turns the amplifier off when a logic high is placed on the
shutdown pin. The trigger point between a logic low and logic high level is typically half supply. It is best to switch
between ground and the supply to provide maximum device performance. By switching the shutdown pin to VDD,
the LM4880 supply current draw will be minimized in idle mode. While the device will be disabled with shutdown
pin voltages less than VDD, the idle current may be greater than the typical value of 0.7 μA. In either case, the
shutdown pin should be tied to a definite voltage because leaving the pin floating may result in an unwanted
shutdown condition.
In many applications, a microcontroller or microprocessor output is used to control the shutdown circuitry which
provides a quick, smooth transition into shutdown. Another solution is to use a single-pole, single-throw switch in
conjunction with an external pull-up resistor. When the switch is closed, the shutdown pin is connected to ground
and enables the amplifier. If the switch is open, then the external pull-up resistor will disable the LM4880. This
scheme ensures that the shutdown pin will not float which will prevent unwanted state changes.
POWER DISSIPATION
Power dissipation is a major concern when using any power amplifier and must be thoroughly understood to
ensure a successful design. Equation 1 states the maximum power dissipation point for a single-ended amplifier
operating at a given supply voltage and driving a specified output load.
PDMAX = (VDD)2/(2π2RL)
(1)
Since the LM4880 has two operational amplifiers in one package, the maximum internal power dissipation point
is twice that of the number which results from Equation 1. Even with the large internal power dissipation, the
LM4880 does not require heat sinking over a large range of ambient temperatures. From Equation 1, assuming a
5V power supply and an 8Ω load, the maximum power dissipation point is 158 mW per amplifier. Thus the
maximum package dissipation point is 317 mW. The maximum power dissipation point obtained must not be
greater than the power dissipation that results from Equation 2:
PDMAX = (TJMAX-TA)/θJA
(2)
For the LM4880 surface mount package, θJA = 170° C/W and TJMAX = 150°C. Depending on the ambient
temperature, TA, of the system surroundings, Equation 2 can be used to find the maximum internal power
dissipation supported by the IC packaging. If the result of Equation 1 is greater than that of Equation 2, then
either the supply voltage must be decreased, the load impedance increased, or the ambient temperature
reduced. For the typical application of a 5V power supply, with an 8Ω load, the maximum ambient temperature
possible without violating the maximum junction temperature is approximately 96°C provided that device
operation is around the maximum power dissipation point. Power dissipation is a function of output power and
thus, if typical operation is not around the maximum power dissipation point, the ambient temperature may be
increased accordingly. Refer to Typical Performance Characteristics for power dissipation information for lower
output powers.
POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is critical for low noise performance and high power supply
rejection. The capacitor location on both the bypass and power supply pins should be as close to the device as
possible. As displayed in Typical Performance Characteristics, the effect of a larger half supply bypass capacitor
is improved low frequency PSRR due to increased half-supply stability. Typical applications employ a 5V
regulator with 10 μF and a 0.1 μF bypass capacitors which aid in supply stability, but do not eliminate the need
for bypassing the supply nodes of the LM4880. The selection of bypass capacitors, especially CB, is thus
dependant upon desired low frequency PSRR, click and pop performance as explained in PROPER SELECTION
OF EXTERNAL COMPONENTS, system cost, and size constraints.
10
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AUTOMATIC SHUTDOWN CIRCUIT
As shown in Figure 3, the LM4880 can be set up to automatically shutdown when a load is not connected. This
circuit is based upon a single control pin common in many headphone jacks. This control pin forms a normally
closed switch with one of the output pins. The output of this circuit (the voltage on pin 5 of the LM4880) has two
states based on the state of the switch. When the switch is open, signifying that headphones are inserted, the
LM4880 should be enabled. When the switch is closed, the LM4880 should be off to minimize power
consumption.
The operation of this circuit is rather simple. With the switch closed, Rp and Ro form a resistor divider which
produces a gate voltage of less than 5 mV. This gate voltage keeps the NMOS inverter off and Rsd pulls the
shutdown pin of the LM4880 to the supply voltage. This places the LM4880 in shutdown mode which reduces the
supply current to 0.7 μA typically. When the switch is open, the opposite condition is produced. Resistor Rp pulls
the gate of the NMOS high which turns on the inverter and produces a logic low signal on the shutdown pin of
the LM4880. This state enables the LM4880 and places the amplifier in its normal mode of operation.
This type of circuit is clearly valuable in portable products where battery life is critical, but is also beneficial for
power conscious designs such as “Green PC's”.
AUTOMATIC SWITCHING CIRCUIT
A circuit closely related to Automatic Shutdown Circuit is Automatic Switching Circuit. Automatic Switching Circuit
utilizes both the input and output of the NMOS inverter to toggle the states of two different audio power
amplifiers. The LM4880 is used to drive stereo single ended loads, while the LM4861 drives bridged internal
speakers.
In this application, the LM4880 and LM4861 are never on at the same time. When the switch inside the
headphone jack is open, the LM4880 is enabled and the LM4861 is disabled since the NMOS inverter is on. If a
headphone jack is not present, it is assumed that the internal speakers should be on and thus the voltage on the
LM4861 shutdown pin is low and the voltage at the LM4880 pin is high. This results in the LM4880 being
shutdown and the LM4861 being enabled.
Only one channel of this circuit is shown in Figure 4 to keep the drawing simple but the typical application would
a LM4880 driving a stereo external headphone jack and two LM4861's driving the internal stereo speakers. If
only one internal speaker is required, a single LM4861 can be used as a summer to mix the left and right inputs
into a single mono channel.
PROPER SELECTION OF EXTERNAL COMPONENTS
Selection of external components when using integrated power amplifiers is critical to optimize device and
system performance. While the LM4880 is tolerant of external component combinations, care must be exercised
when choosing component values.
The LM4880 is unity-gain stable which gives a designer maximum system flexibility. The LM4880 should be used
in low gain configurations to minimize THD + N values, and maximize the signal to noise ratio. Low gain
configurations require large input signals to obtain a given output power. Input signals equal to or greater than 1
Vrms are available from sources such as audio codecs. Please refer to AUDIO POWER AMPLIFIER DESIGN for
a more complete explanation of proper gain selection.
Besides gain, one of the major design considerations is the closed-loop bandwidth of the amplifier. To a large
extent, the bandwidth is dictated by the choice of external components shown in Figure 2. Both the input
coupling capacitor, Ci, and the output coupling capacitor, Co, form first order high pass filters which limit low
frequency response. These values should be chosen based on needed frequency response for a few distinct
reasons.
Selection of Input and Output Capacitor Size
Large input and output capacitors are both expensive and space hungry for portable designs. Clearly a certain
sized capacitor is needed to couple in low frequencies without severe attenuation. But in many cases the
transducers used in portable systems, whether internal or external, have little ability to reproduce signals below
100 Hz–150 Hz. Thus using large input and output capacitors may not increase system performance.
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In addition to system cost and size, click and pop performance is effected by the size of the input coupling
capacitor, Ci. A larger input coupling capacitor requires more charge to reach its quiescent DC voltage (normally
1/2 VDD.) This charge comes from the output via the feedback and is apt to create pops upon device enable.
Thus, by minimizing the capacitor size based on necessary low frequency response, turn-on pops can be
minimized.
Besides minimizing the input and output capacitor sizes, careful consideration should be paid to the bypass
capacitor size. The bypass capacitor, CB, is the most critical component to minimize turn-on pops since it
determines how fast the LM4880 turns on. The slower the LM4880's outputs ramp to their quiescent DC voltage
(nominally 1/2 VDD), the smaller the turn-on pop. Choosing CB equal to 1.0 μF along with a small value of Ci (in
the range of 0.1 μF to 0.39 μF), should produce a virtually clickless and popless shutdown function. While the
device will function properly, (no oscillations or motorboating), with CB equal to 0.1 μF, the device will be much
more susceptible to turn-on clicks and pops. Thus, a value of CB equal to 1.0 μF or larger is recommended in all
but the most cost sensitive designs.
AUDIO POWER AMPLIFIER DESIGN
Design a Dual 200 mW/8Ω Audio Amplifier
Given:
Power Output: 200 mWrms
Load Impedance:
8Ω
Input Level: 1 Vrms (max)
Input Impedance:
20 kΩ
Bandwidth: 100 Hz–20 kHz ± 0.50 dB
A designer must first determine the needed supply rail to obtain the specified output power. Calculating the
required supply rail involves knowing two parameters, Vopeak and also the dropout voltage. As shown in Typical
Performance Characteristics, the dropout voltage is typically 0.5V. Vopeak can be determined from Equation 3.
(3)
For 200 mW of output power into an 8Ω load, the required Vopeak is 1.79V. Since this is a single supply
application, the minimum supply voltage is twice the sum of Vopeak and Vod. Since 5V is a standard supply
voltage in most applications, it is chosen for the supply rail. Extra supply voltage creates headroom that allows
the LM4880 to reproduce peaks in excess of 200 mW without clipping the signal. At this time, the designer must
make sure that the power supply choice along with the output impedance does not violate the conditions
explained in POWER DISSIPATION. Remember that the maximum power dissipation value from Equation 1
must be multiplied by two since there are two independent amplifiers inside the package.
Once the power dissipation equations have been addressed, the required gain can be determined from
Equation 4.
(4)
(5)
AV = −RF/Ri
From Equation 4, the minimum gain is:
AV = −1.26
Since the desired input impedance was 20 kΩ, and with a gain of −1.26, a value of 27 kΩ is designated for Rf,
assuming 5% tolerance resistors. This combination results in a nominal gain of −1.35. The final design step is to
address the bandwidth requirements which must be stated as a pair of −3 dB frequency points. Five times away
from a −3 dB point is 0.17 dB down from passband response assuming a single pole roll-off. As stated in
External Components Description, both Ri in conjunction with Ci, and Co with RL, create first order high pass
filters. Thus to obtain the desired frequency low response of 100 Hz within ± 0.5 dB, both poles must be taken
into consideration. The combination of two single order filters at the same frequency forms a second order
response. This results in a signal which is down 0.34 dB at five times away from the single order filter −3 dB
point. Thus, a frequency of 20 Hz is used in the following equations to ensure that the response if better than 0.5
dB down at 100 Hz.
Ci ≥ 1/(2π*20kΩ*20Hz) = 0.397 μF; use 0.39 μF
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Co ≥ 1/(2π*8Ω*20Hz) = 995 μF; use 1000 μF
The high frequency pole is determined by the product of the desired high frequency pole, fH, and the closed-loop
gain, AV. With a closed-loop gain magnitude of 1.35 and fH = 100 kHz, the resulting GBWP = 135 kHz which is
much smaller than the LM4880 GBWP of 12.5 MHz. This figure displays that if a designer has a need top design
an amplifier with a higher gain, the LM4880 can still be used without running into bandwidth limitations.
LM4880 MDA MWA
DUAL 250 MW AUDIO POWER AMPLIFIER WITH SHUTDOWN MODE
Figure 35. Die Layout (B - Step)
Table 1. Die/Wafer Characteristics
Fabrication Attributes
General Die Information
Physical Die Identification
LM4880B
Bond Pad Opening Size (min)
86µm x 86µm
Die Step
B
Bond Pad Metalization
ALUMINUM
Passivation
NITRIDE
Physical Attributes
Wafer Diameter
150mm
Back Side Metal
Bare Back
Dise Size (Drawn)
952µm x 1283µm
37mils x 51mils
Back Side Connection
GND
Thickness
254µm Nominal
Min Pitch
117µm Nominal
Special Assembly Requirements:
Note: Actual die size is rounded to the nearest micron.
Die Bond Pad Coordinate Locations (B - Step)
(Referenced to die center, coordinates in µm) NC = No Connection
SIGNAL NAME
PAD# NUMBER
X/Y COORDINATES
PAD SIZE
X
Y
X
BYPASS
1
-322
523
86
x
86
Y
GND
2
-359
259
86
x
188
NC
3
-359
5
86
x
86
GND
4
-359
-259
86
x
188
SHUTDOWN
5
-323
-523
86
x
86
INPUT B
6
-109
-523
86
x
86
OUTPUT B
7
8
-523
86
x
86
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VDD
8
358
-78
86
x
188
GND
9
358
141
86
x
188
OUTPUT A
10
359
406
86
x
86
INPUT A
11
323
523
86
x
86
NC
12
8
523
86
x
86
NC
13
-109
523
86
x
86
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REVISION HISTORY
Changes from Revision B (May 2013) to Revision C
•
Page
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PACKAGE OPTION ADDENDUM
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2-May-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LM4880M
ACTIVE
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 85
LM
4880M
LM4880M/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
LM
4880M
LM4880MX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
LM
4880M
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
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Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
8-May-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
LM4880MX/NOPB
Package Package Pins
Type Drawing
SOIC
D
8
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
12.4
Pack Materials-Page 1
6.5
B0
(mm)
K0
(mm)
P1
(mm)
5.4
2.0
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-May-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM4880MX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
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