ON NCP1654BD200R2G Power factor controller for compact and robust, continuous conduction mode pre-converter Datasheet

NCP1654
Power Factor Controller for
Compact and Robust,
Continuous Conduction
Mode Pre-Converters
The NCP1654 is a controller for Continuous Conduction Mode
(CCM) Power Factor Correction step−up pre−converters. It controls
the power switch conduction time (PWM) in a fixed frequency mode
and in dependence on the instantaneous coil current.
Housed in a SO8 package, the circuit minimizes the number of
external components and drastically simplifies the PFC
implementation. It also integrates high safety protection features that
make the NCP1654 a driver for robust and compact PFC stages like
an effective input power runaway clamping circuitry.
MARKING
DIAGRAM
8
SO−8
D SUFFIX
CASE 751
8
1
IEC61000−3−2 Compliant
Average Current Continuous Conduction Mode
Fast Transient Response
Very Few External Components
Very Low Startup Currents (<75 mA)
Very Low Shutdown Currents (< 400 mA)
Low Operating Consumption
±1.5 A Totem Pole Gate Drive
Accurate Fully Integrated 65/133/200 kHz Oscillator
Latching PWM for cycle−by−cycle Duty−Cycle Control
Internally Trimmed Internal Reference
Undervoltage Lockout with Hysteresis
Soft−Start for Smoothly Startup Operation
Shutdown Function
Pin to Pin Compatible with Industry Standard
This is a Pb−Free Device
= 65, 133 or 200
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
PIN CONNECTIONS
Ground 1
8 Driver
VM 2
7 VCC
CS 3
6 Feedback
Brown−Out 4
5 Vcontrol
(Top View)
ORDERING INFORMATION
Device
Package
Shipping†
NCP1654BD65R2G
SO−8
(Pb−Free)
2500 / Tape &
Reel
NCP1654BD133R2G
SO−8
(Pb−Free)
2500 / Tape &
Reel
NCP1654BD200R2G
SO−8
(Pb−Free)
2500 / Tape &
Reel
Safety Features
•
•
•
•
•
•
•
54Bxx
ALYW
G
1
xx
A
L
Y
W
G
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
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Inrush Currents Detection
Overvoltage Protection
Undervoltage Detection for Open Loop Detection or Shutdown
Brown−Out Detection
Soft−Start
Accurate Overcurrent Limitation
Overpower Limitation
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Typical Applications
• Flat TVs, PC Desktops
• AC Adapters
• White Goods, other Off−line SMPS
© Semiconductor Components Industries, LLC, 2009
June, 2009 − Rev. 3
1
Publication Order Number:
NCP1654/D
NCP1654
MAXIMUM RATINGS TABLE
Symbol
Pin
DRV
8
Output Drive Capability − Source
Output Drive Capability − Sink
VCC
7
Power Supply Voltage, VCC pin, continuous voltage
7
Transient Power Supply Voltage, duration < 10 ms, IVCC < 10 mA
Vin
2, 3, 4, 5, 6
PD(SO)
RqJA(SO)
TJ
Rating
Input Voltage
Power Dissipation and Thermal Characteristics
D suffix, Plastic Package, Case 751
Maximum Power Dissipation @ TA = 70°C
Thermal Resistance Junction−to−Air
Operating Junction Temperature Range
TJmax
Maximum Junction Temperature
TSmax
Storage Temperature Range
TLmax
Lead Temperature (Soldering, 10 s)
Value
Unit
−1.5
+1.5
A
−0.3, +20
V
+25
V
−0.3, +10
V
450
178
mW
°C/W
−40 to +125
°C
150
°C
−65 to +150
°C
300
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series contains ESD protection and exceeds the following tests:
Pins 1 – 8: Human Body Model 2000 V per MIL−STD−883, Method 3015.
Pins 1 – 8: Machine Model Method 200 V (except pin#7 which complies 150 V)
2. This device contains Latch−up Protection and exceeds ±100 mA per JEDEC Standard JESD78.
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NCP1654
TYPICAL ELECTRICAL CHARACTERISTICS TABLE (VCC = 15 V, TJ from −40°C to +125°C, unless otherwise specified) (Note 3)
Rating
Symbol
Min
Typ
Max
Unit
GATE DRIVE SECTION
ROH
Source Resistance @ Isource = 100 mA
−
9.0
20
W
ROL
Sink Resistance @ Isink = −100 mA
−
6.6
18
W
Tr
Gate Drive Voltage Rise Time from 1.5 V to 13.5 V (CL = 2.2 nF)
−
60
−
ns
Tf
Gate Drive Voltage Fall Time from 13.5 V to 1.5 V (CL = 2.2 nF)
−
40
−
ns
2.425
2.5
2.575
V
−
±28
−
mA
REGULATION BLOCK
VREF
Voltage Reference
IEA
Error Amplifier Current Capability
GEA
Error Amplifier Gain
100
200
300
mS
IBpin6
Pin 6 Bias Current @ VFB = VREF
−500
−
500
nA
Vcontrol
Pin5 Voltage
Maximum Control Voltage @ VFB = 2 V
Minimum Control Voltage @ VFB = 3 V
DVcontrol = Vcontrol(max) − Vcontrol(min)
−
−
2.7
3.6
0.6
3.0
−
−
3.3
VOUTL / VREF
Ratio (VOUT Low Detect Thresold / VREF)
94
95
96
%
HOUTL / VREF
Ratio (VOUT Low Detect Hysteresis / VREF)
−
0.5
−
%
190
228
260
mA
−
10
−
mV
185
200
215
mA
Vcontrol(max)
Vcontrol(min)
DVcontrol
IBOOST
V
Pin 5 Source Current when (VOUT Low Detect) is activated
CURRENT SENSE BLOCK
VS
IS(OCP)
Current Sense Pin Offset Voltage, (ICS = 100 mA)
Overcurrent Protection Threshold
POWER LIMITATION BLOCK
ICS x VBO
Overpower Limitation Threshold
200
ICS(OPL1)
ICS(OPL2)
Overpower Current Threshold (VBO = 0.9 V, VM = 3 V)
Overpower Current Threshold (VBO = 2.67 V, VM = 3 V)
186
62
222
75
mVA
308
110
mA
PWM BLOCK
Dcycle
Duty Cycle Range
0−97
%
OSCILLATOR / RAMP GENERATOR BLOCK
fsw
Switching Frequency
65 kHz
133 kHz
200 kHz
58
120
180
65
133
200
72
146
220
kHz
BROWN−OUT DETECTION BLOCK
VBOH
Brown−Out Voltage Threshold (rising)
1.22
1.30
1.38
V
VBOL
Brown−Out Voltage Threshold (falling)
0.65
0.7
0.75
V
IIB
Pin 4 Input Bias Current @ VBO = 1 V
−500
−
500
nA
−
2.1
2.1
1.5
−
−
1.9
5.6
5.6
5.6
28.1
84.4
−
8.1
8.1
8.5
−
−
mA
CURRENT MODULATION BLOCK
IM1
IM2
IM3
IM4
Multiplier Output Current (Vcontrol = Vcontrol(max), VBO = 0.9 V, ICS = 25 mA)
Multiplier Output Current (Vcontrol = Vcontrol(max), VBO = 0.9 V, ICS = 75 mA, 65 kHz)
Multiplier Output Current (133 kHz, 200 kHz @ 0 125°C)
Multiplier Output Current (133 kHz, 200 kHz @ −40 125°C)
Multiplier Output Current (Vcontrol = Vcontrol(min) + 0.2 V, VBO = 0.9 V, ICS = 25 mA
Multiplier Output Current (Vcontrol = Vcontrol(min) + 0.2 V, VBO = 0.9 V, ICS = 75 mA
3. The above specification gives the targeted values of the parameters. The final specification will be available once the complete circuit characterization has been performed.
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NCP1654
TYPICAL ELECTRICAL CHARACTERISTICS TABLE (VCC = 15 V, TJ from −40°C to +125°C, unless otherwise specified) (Note 3)
Symbol
Rating
Min
Typ
Max
Unit
103
105
107
%
−
500
−
ns
OVERVOLTAGE PROTECTION
VOVP / VREF
Ratio (Overvoltage Threshold / VREF)
TOVP
Propagation Delay (VFB – 107% VREF) to Drive Low
UNDERVOLTAGE PROTECTION / SHUTDOWN
VUVP(on)/VREF
UVP Activate Threshold Ratio (TJ = 0°C to +105°C)
4
8
12
%
VUVP(off)/VREF
UVP Deactivate Threshold Ratio (TJ = 0°C to +105°C)
6
12
18
%
UVP Lockout Hysteresis
−
4
−
%
Propagation Delay (VFB < 8% VREF) to Drive Low
−
500
−
ns
VUVP(H)
TUVP
THERMAL SHUTDOWN
TSD
Thermal Shutdown Threshold
150
−
−
°C
HSD
Thermal Shutdown Hysteresis
−
30
−
°C
VCC UNDERVOLTAGE LOCKOUT SECTION
VCC(on)
Start−Up Threshold (Undervoltage Lockout Threshold, VCC rising)
9.6
10.5
11.4
V
VCC(off)
Disable Voltage after Turn−On (Undervoltage Lockout Threshold, VCC falling)
8.25
9.0
9.75
V
VCC(H)
Undervoltage Lockout Hysteresis
1.0
1.5
−
V
−
−
−
−
−
3.7
4.7
300
75
5.0
6.0
400
mA
mA
mA
mA
DEVICE CONSUMPTION
Power Supply Current:
Start−Up (@ VCC = 9.4 V)
Operating (@ VCC = 15 V, no load, no switching)
Operating (@ VCC = 15 V, no load, switching)
Shutdown Mode (@ VCC = 15 V and VFB = 0 V)
ISTUP
ICC1
ICC2
ISTDN
3. The above specification gives the targeted values of the parameters. The final specification will be available once the complete circuit characterization has been performed.
NOTE:
IM +
Ics
4
V BO
ǒVcontrol * Vcontrol(min)Ǔ
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NCP1654
DETAILED PIN DESCRIPTIONS
Pin
Symbol
Name
Function
1
GND
Ground
2
Vin
Multiplier
Voltage
This pin provides a voltage VM for the PFC duty cycle modulation. The input impedance of the
PFC circuits is proportional to the resistor RM externally connected to this pin. The device operates in average current mode if an external capacitor CM is connected to the pin. Otherwise,
it operates in peak current mode.
3
CS
Current Sense
Input
This pin sources a current ICS which is proportional to the inductor current IL. The sense current ICS is for overcurrent protection (OCP), overpower limitation (OPL) and PFC duty cycle
modulation. When ICS goes above 200 mA, OCP is activated and the Drive Output is disabled.
4
VBO
Brown−Out / In
Connect a resistor network among the rectified input voltage, BO pin, and ground. And connect
a capacitor between BO pin and ground. BO pin detects a voltage signal proportional to the
average input voltage.
When VBO goes below VBOL, the circuit that detects too low input voltage conditions (brown−
out), turns off the output driver and keeps it in low state until VBO exceeds VBOH.
This signal which is proportional to the RMS input voltage Vac is also for overpower limitation
(OPL) and PFC duty cycle modulation.
5
Vcontrol
Control Voltage /
Soft−Start
The voltage of this pin Vcontrol directly controls the input impedance. This pin is connected to
external type−2 compensation components to limit the Vcontrol bandwidth typically below 20 Hz
to achieve near unity power factor.
The device provides no output when Vcontrol < Vcontrol(min). When it starts operation, the power
increases slowly (soft−start).
6
VFB
Feed−Back /
Shutdown
This pin receives a feedback signal VFB that is proportional to the PFC circuits output voltage.
This information is used for both the output regulation, the overvoltage protection (OVP), and
output undervoltage protection (UVP) to protect the system from damage at feedback abnormal situation.
When VFB goes above 105% VREF, OVP is activated and the Drive Output is disabled.
When VFB goes below 8% VREF, the device enters a low−consumption shutdown mode.
7
VCC
Supply Voltage
This pin is the positive supply of the IC. The circuit typically starts to operate when VCC exceeds 10.5 V and turns off when VCC goes below 9 V. After start−up, the operating range is 9 V
up to 20 V.
8
DRV
Drive Output
The high current capability of the totem pole gate drive (±1.5 A) makes it suitable to effectively
drive high gate charge power MOSFET.
−
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NCP1654
IN
EMI
Filter
AC
Input
Iin Vin
+
L
IL
Cfilter
Cbulk
Output
Voltage
(VOUT)
+
−
IL
RSENSE
OVP
+
105% Vref
UVP
+
RboU
RfbU
BO
Vdd
OPL
8% Vref with 4% Vref
Hysteresis
Vdd
UVLO
200 mA
Soft Start
Undervoltage
Lock−Out
S
FB
6
Reference
Block
Q
R
Vref
RfbL
95% Vref
+
Vref
+
Vcontrol
Off
Vout Low Detect
Iref
OTA
Vcc
7
+
Output
Buffer
Vcontrol(min)
CP
Vdd
±28 mA
5
RZ
Bias Block
UVP BO
CZ
8
1
GND
Thermal
Shutdown
BO
BO
+
CBO
VboH / VboL
VboH = 1.3 V, VboL = 0.7 V
OL OVP
Vref
Vdd
Vramp
Ics
Ics
Vref/10% Vref
Vm
+
C1
Ics*Vbo > 200 mVA
Ics > 200 mA
S
Iref
Vbo
Division
OPL
R
+ -
CS
3
PWM
Latch
Vdd
Current Mirror
Ics
R
+
Vdd
RCS
Q
Fault
4
RboL
DRV
S1
2
65/133/200 kHz
Oscillator
OL
Im = (Ics*Vbo) / (4*(Vcontrol − Vcontrol(min))
OCP
Figure 1. Functional Block Diagram
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RM
CM
NCP1654
TYPICAL CHARACTERISTICS
2.60
8
6
4
ROL
−25
0
25
2.50
2.45
2
0
−50
50
75
100
2.40
−50
125
0
25
50
75
100
125
TJ, JUNCTION TEMPERATURE (°C)
Figure 2. Gate Drive Resistance vs.
Temperature
Figure 3. Reference Voltage vs. Temperature
32
−20
30
−22
28
−24
26
−26
24
−28
22
−30
20
−50
−25
TJ, JUNCTION TEMPERATURE (°C)
IEA_sink (A)
IEA_source (A)
2.55
ROH
VREF (V)
ROH & ROL, GATE DRIVE
RESISTANCE (W)
10
−25
0
25
50
75
100
−32
−50
125
−25
0
25
50
75
100
125
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 4. Source Current Capability of the
Error Amplifier vs. Temperature
Figure 5. Sink Current Capability of the Error
Amplifier vs. Temperature
300
150
100
IBpin6 (nA)
GEA (mS)
250
200
50
0
−50
150
−100
100
−50
−25
0
25
50
75
100
−150
−50
125
−25
0
25
50
75
100
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 6. Error Amplifier Gain vs. Temperature
Figure 7. Feedback Pin Current vs.
Temperature (@Vfb = VREF)
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NCP1654
4.0
3.3
3.9
3.2
3.8
DVCONTROL (V)
VCONTROL(max) (V)
TYPICAL CHARACTERISTICS
3.7
3.6
3.5
3.3
−50
−25
0
25
50
75
100
2.9
2.7
−50
125
−25
0
25
50
75
100
125
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 8. Vcontrol Maximum Voltage vs.
Temperature
Figure 9. Vcontrol Maximum Swing (DVCONTROL)
vs. Temperature
95.1
260
95.0
250
94.9
240
94.8
IBoost (mA)
VoutL / VREF (%)
3.0
2.8
3.4
94.7
94.6
230
220
210
94.5
200
94.4
94.3
−50
−25
0
25
50
75
100
190
−50
125
−25
0
25
50
75
100
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 10. Ratio (VOUT Low Detect Threshold /
VREF) vs. Temperature
Figure 11. Pin 5 Source Current when (VOUT
Low Detect) is Activated vs. Temperature
215
306
210
286
205
266
ICS(OPL1) (mA)
IS(OCP) (mA)
3.1
200
195
190
125
246
226
206
185
−50
−25
0
25
50
75
100
186
−50
125
−25
0
25
50
75
100
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 12. Over−Current Protection Threshold
vs. Temperature
Figure 13. Over−Power Current Threshold
(@VBO = 0.9 V & Vm = 3 V) vs. Temperature
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NCP1654
TYPICAL CHARACTERISTICS
100
MAXIMUM DUTY CYCLE (%)
110
ICS(OPL2) (mA)
100
90
80
70
−25
0
25
50
75
100
98
97
96
95
−50
125
0
25
50
75
100
TJ, JUNCTION TEMPERATURE (°C)
Figure 14. Over−Power Current Threshold
(@VBO = 2.67 V & Vm = 3 V) vs. Temperature
Figure 15. Maximum Duty Cycle vs.
Temperature
140
70
138
68
136
fSW (kHz)
72
66
64
132
130
60
128
−25
0
25
50
75
100
126
−50
125
−25
TJ, JUNCTION TEMPERATURE (°C)
0
205
200
195
190
185
0
50
75
100
Figure 17. Switching Frequency vs.
Temperature (133 kHz Version)
210
−25
25
TJ, JUNCTION TEMPERATURE (°C)
Figure 16. Switching Frequency vs.
Temperature (65 kHz Version)
180
−50
25
50
75
100
TJ, JUNCTION TEMPERATURE (°C)
Figure 18. Switching Frequency vs.
Temperature (200 kHz Version)
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125
134
62
58
−50
−25
TJ, JUNCTION TEMPERATURE (°C)
fSW (kHz)
fSW (kHz)
60
−50
99
125
125
NCP1654
TYPICAL CHARACTERISTICS
1.40
0.75
VBOL (L)
VBOH (V)
1.35
1.30
0.70
1.25
1.20
−50
−25
0
25
50
75
100
0.65
−50
125
25
50
75
100
TJ, JUNCTION TEMPERATURE (°C)
Figure 19. Brown−Out Voltage Threshold
(Rising) vs. Temperature
Figure 20. Brown−Out Voltage Threshold
(Falling) vs. Temperature
125
2.66
6.5
2.64
5.5
VOVP (V)
Im2 (mA)
0
TJ, JUNCTION TEMPERATURE (°C)
7.5
4.5
2.62
2.60
3.5
2.5
−50
−25
0
25
50
75
100
2.58
−50
125
−25
0
25
50
75
100
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 21. Multiplier Output Current (Vcontrol =
VCONTROL(max), Vbo = 0.9 V, ICS = 75 mA) vs.
Temperature
Figure 22. Over Voltage Threshold vs.
Temperature
VUVP(on) / VREF and VUVP(off) / VREF (%)
107
106
VOVP / VREF (%)
−25
105
104
103
−50
−25
0
25
50
75
100
125
16
14
12
10
8
6
4
2
0
−50
−25
0
25
50
75
100
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 23. Ratio (Over Voltage Threshold /
VREF) vs. Temperature
Figure 24. UVP Activate and Deactivate
Threshold Ratio vs. Temperature
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125
125
NCP1654
TYPICAL CHARACTERISTICS
11.4
9.7
11.2
9.5
9.3
10.8
VCC(off) (V)
VCC(on) (V)
11.0
10.6
10.4
10.2
8.9
8.7
10.0
8.5
9.8
9.6
−50
−25
0
25
50
75
100
8.3
−50
125
0
25
50
75
100
125
TJ, JUNCTION TEMPERATURE (°C)
Figure 25. VCC Start−Up Threshold (VCC
Rising) vs. Temperature
Figure 26. VCC Disable Voltage after Turn−On
(VCC Falling) vs. Temperature
2.0
50
1.8
40
1.6
30
1.4
20
10
1.2
1.0
−50
−25
0
25
50
75
100
0
−50
125
−25
TJ, JUNCTION TEMPERATURE (°C)
0
25
50
75
100
125
TJ, JUNCTION TEMPERATURE (°C)
Figure 27. VCC UVLO Hysteresis vs.
Temperature
Figure 28. Supply Current in Startup Mode vs.
Temperature
4
OPERATING CURRENT (mA)
400
350
ISTDN (mA)
−25
TJ, JUNCTION TEMPERATURE (°C)
ISTUP (mA)
VCC(H) (V)
9.1
300
250
200
−50
−25
0
25
50
75
100
3
2
ICC1, No Load, No Switching
1
0
−50
125
ICC2, No Load, Switching
−25
0
25
50
75
100
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 29. Supply Current in Shutdown Mode
vs. Temperature
Figure 30. Operating Supply Current vs.
Temperature
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NCP1654
Detailed Operating Description
Introduction
The NCP1654 is a PFC driver designed to operate in
fixed frequency, continuous conduction mode. The fixed
frequency operation eases the compliance with EMI
standard and the limitation of the possible radiated noise
that may pollute surrounding systems. In addition,
continuous conduction operation reduces the application
di/dt and their resulting interference. More generally, the
NCP1654 is an ideal candidate in systems where
cost−effectiveness, reliability and high power factor are the
key parameters. It incorporates all the necessary features to
build a compact and rugged PFC stage:
• Compactness and Flexibility: housed in a SO8
package, the NCP1654 requires a minimum of
external components. In particular, the circuit scheme
simplifies the PFC stage design and eliminates the
need for any input voltage sensing. In addition, the
circuit offers some functions like the Brown−Out or
the true power limiting that enable the optimizations
of the PFC design,
• Low Consumption and Shutdown Capability: the
NCP1654 is optimized to exhibit consumption as
small as possible in all operation modes. The
consumed current is particularly reduced during the
start−up phase and in shutdown mode so that the PFC
stage power losses are extremely minimized when the
circuit is disabled. This feature helps meet the more
stringent stand−by low power specifications. Just
ground the Feed−back pin to force the NCP1654 in
shutdown mode,
• Safety Protections: the NCP1654 permanently monitors
the output voltage, the coil current and the die
temperature to protect the system from possible
over−stresses. Integrated protections (Overvoltage
protection, coil current limitation, thermal shutdown...)
make the PFC stage extremely robust and reliable:
− Maximum Current Limit: the circuit permanently
senses the coil current and immediately turns off the
power switch if it is higher than the set current limit.
The NCP1654 also prevents any turn on of the
power switch as long as the coil current is not below
its maximum permissible level. This feature protects
the MOSFET from possible excessive stress that
could result from the switching of a current higher
than the one the power switch is dimensioned for. In
particular, this scheme effectively protects the PFC
stage during the start−up phase when large in−rush
currents charge the output capacitor.
− Undervoltage Protection for Open Loop Protection
or Shut−down: the circuit detects when the
feed−back voltage goes below than about 8% of the
•
regulation level. In this case, the circuit turns off and
its consumption drops to a very low value. This
feature protects the PFC stage from starting
operation in case of low AC line conditions or in
case of a failure in the feed−back network (i.e. bad
connection).
− Fast Transient Response: given the low bandwidth
of the regulation block, the output voltage of PFC
stages may exhibit excessive over or under−shoots
because of abrupt load or input voltage variations
(e.g. at start up). If the output voltage is too far from
the regulation level:
Overvoltage Protection: NCP1654 turns off the
power switch as soon as Vout exceeds the OVP
threshold (105% of the regulation level). Hence
a cost & size effective bulk capacitor of lower
voltage rating is suitable for this application,
Dynamic Response Enhancer: NCP1654
drastically speeds up the regulation loop by its
internal 200ĂmA enhanced current source when the
output voltage is below 95% of its regulation level.
− Brown−Out Detection: the circuit detects low AC
line conditions and disables the PFC stage in this
case. This protection mainly protects the power
switch from the excessive stress that could damage it
in such conditions,
− Over−Power Limitation: the NCP1654 computes the
maximum permissible current in dependence of the
average input voltage measured by the brown−out
block. It is the second OCP with a threshold that is
line dependent. When the circuit detects an
excessive power transfer, it resets the driver output
immediately,
− Thermal Shutdown: an internal thermal circuitry
disables the circuit gate drive and then keeps the
power switch off when the junction temperature
exceeds 150°C typically. The circuit resumes
operation once the temperature drops below about
120°C (30°C hysteresis),
− Soft Start: Vcontrol is pulled low brown−out detection
activates, or Undervoltage protection activates, and
no drive is provided.
At start up, the “200 mA enhanced current source” is
disabled. So there is only 28 mA to charge the
compensation components, and makes Vcontrol raise
gradually. This is to obtain a slow increasing duty
cycle and hence reduce the voltage and current
stress on the MOSFET. Hence it provides a soft−start
feature.
Output Stage Totem Pole: the NCP1654 incorporates
a ±1.5A gate driver to efficiently drive TO220 or
TO247 power MOSFETs.
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12
NCP1654
PRINCIPLE OF NCP1654 SCHEME
The input filter capacitor Cfilter and the front−ended EMI
filter absorbs the high−frequency component of inductor
current IL. It makes the input current Iin a low−frequency
signal only of the inductor current.
CCM PFC Boost
A CCM PFC boost converter is shown in Figure 31. The
input voltage is a rectified 50 ro 60 Hz sinusoidal signal.
The MOSFET is switching at a high frequency (typically
65/133/200 kHz in NCP1654) so that the inductor current
IL basically consists of high and low−frequency
components.
Filter capacitor Cfilter is an essential and very small value
capacitor in order to eliminate the high−frequency
component of the inductor IL. This filter capacitor cannot
be too bulky because it can pollute the power factor by
distorting the rectified sinusoidal input voltage.
L
Iin
IL
Iin + I L*50
where
Iin is the input AC current.
IL is the inductor current.
IL−50 supposes a 50 Hz operation. The suffix 50 means
it is with a 50 Hz bandwidth of the original IL.
From (Equation 1) and (Equation 2), the input
impedance Zin is formulated.
Zin +
Vout
Vin
+
Cfilter
(eq. 2)
Output
Voltage
V in
T * t1 Vout
+
Iin
T
IL*50
(eq. 3)
where Zin is input impedance.
Power factor is corrected when the input impedance Zin
in (Equation 3) is constant or varies slowly in the 50 or 60
Hz bandwidth.
Cbulk
RSENSE
VM
Figure 31. CCM PFC Boost Converter
Ich
PFC Methodology
+
The NCP1654 uses a proprietary PFC methodology
particularly designed for CCM operation. The PFC
methodology is described in this section.
0
Cramp
1
Vref
PFC Modulation
+
R
Vramp
S
Q
Clock
IL
Iin
Vref
Vramp
t1
t2
VM
VM without
Filtering
Time
T
Clock
Figure 32. Inductor Current in CCM
Latch Set
Latch Reset
As shown in Figure 32, the inductor current IL in a
switching period T includes a charging phase for duration
t1 and a discharging phase for duration t2. The voltage
conversion ratio is obtained in (Equation 1).
Output
Inductor
Current
t ) t2
Vout
+ 1
+ T
t2
Vin
T * t1
Vin +
T * t1
Vout
T
Figure 33. PFC Duty Modulation and Timing Diagram
(eq. 1)
The PFC modulation and timing diagram is shown in
Figure 33. The MOSFET on time t1 is generated by the
intersection of reference voltage VREF and ramp voltage
Vramp. A relationship in (Equation 4) is obtained.
where
Vout is the output voltage of PFC stage,
Vin is the rectified input voltage,
T is the switching period,
t1 is the MOSFET on time, and
t2 is the MOSFET off time.
Vramp + V m )
where
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13
Icht1
+ V REF
C ramp
(eq. 4)
NCP1654
Vramp is the internal ramp voltage, the positive input of the
PFC modulation comparator,
Vm +
Vm is the multiplier voltage appearing on Vm pin,
Ich is the internal charging current,
Cramp is the internal ramp capacitor, and
Vm + V REF *
Im
2
CM
PFC Duty
Modulation
C rampVREF
T
Figure 35. External Connection on the Multiplier
Voltage Pin
The multiplier voltage Vm is generated according to
(Equation 8).
Vm +
CrampV REF
T * t1
+ VREF
C ramp
T
T
t1
(eq. 6)
Vout
V
Zin + m
V REF IL*50
RMI csVbo
4(V control * V CONTROL(min))
(eq. 8)
Where,
RM is the external multiplier resistor connected to Vm pin,
which is constant.
Vbo is the input voltage signal appearing on the BO pin,
which is proportional to the rms input voltage,
(eq. 5)
From (Equation 3) and (Equation 6), the input impedance
Zin is re−formulated in (Equation 7).
Ics is the sense current proportional to the inductor current
IL as described in (Equation 11).
(eq. 7)
Vcontrol is the control voltage signal, the output voltage of
Operational Trans−conductance Amplifier (OTA), as
described in (Equation 12).
RM directly limits the maximum input power capability
and hence its value affects the NCP1654 to operate in either
“follower boost mode” or “constant output voltage mode”.
Because VREF and Vout are roughly constant versus time,
the multiplier voltage Vm is designed to be proportional to
the IL−50 in order to have a constant Zin for PFC purpose.
It is illustrated in Figure 34.
Vin
Vin
+
Iin
Time
RboU
IL
Vbo
Time
VM
Vm
RM
VREF is the internal reference voltage, the negative input of
the PFC modulation comparator.
Ich, Cramp, and VREF also act as the ramp signal of
switching frequency. Hence the charging current Ich is
specially designed as in (Equation 5). The multiplier
voltage Vm is therefore expressed in terms of t1 in
(Equation 6).
Ich +
R MIcsVbo
4(Vcontrol * VCONTROL(min))
4
RboL
CBO
Time
+
BO
VboH / VboL
VboH = 1.3 V, VboL = 0.7 V
Figure 34. Multiplier Voltage Timing Diagram
Figure 36. External Connection on the Brown Out Pin
It can be seen in the timing diagram in Figure 33 that Vm
originally consists of a switching frequency ripple coming
from the inductor current IL. The duty ratio can be
inaccurately generated due to this ripple. This modulation
is the so−called “peak current mode”. Hence, an external
capacitor CM connected to the multiplier voltage Vm pin is
essential to bypass the high−frequency component of Vm.
The modulation becomes the so−called “average current
mode” with a better accuracy for PFC.
Refer to Figure 36,
2 Ǹ2
Vbo + K BO(Vin) + KBO @ p V ac
KBO +
RboL
R boU ) R boL
(eq. 9)
(eq. 10)
where
Vbo is the voltage on BO pin.
KBO is the decay ratio of Vin to Vbo.
<Vin> is the average voltage signal of Vin, the voltage
appearing on Cfilter.
Vac is the RMS input voltage.
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14
NCP1654
RboL is low side resistor of the dividing resistors between
Vin and BO pin.
Refer to Figure 37, sense current Ics is proportional to the
inductor current IL as described in (Equation 11). IL
consists of the high−frequency component (that depends on
di/dt or inductor L) and low−frequency component (that is
IL−50).
RboU is upper side resistor of the dividing resistors between
Vin and BO pin.
IL
Ics +
ICS
CS
+
VCS
−
RCS
RSENSE
+
R SENSE
I
RCS L
(eq. 11)
where
NCP1654
RSENSE is the sense resistor to sense IL.
RCS is the offset resistor between CS pin and RSENSE.
Gnd
IL
Figure 37. Current Sensing
Vin
Vout
+
RfbU
Vfb
6
RfbL
Vcontrol
CP
+
VREF
±20 mA
+
OTA
VCONTROL(min)
5
RZ
CZ
To Vm Pin
Figure 38. Vcontrol Low−Pass Filtering
Refer to Figure 38, the Operational Trans−conductance
Amplifier (OTA) senses Vout via the feedback resistor
dividers, RfbU and RfbL. The OTA constructs a control
voltage, Vcontrol, depending on the output power and hence
Vout. The operating range of Vcontrol is from
VCONTROL(min) to VCONTROL(max). The signal used for
PFC duty modulation is after decreasing a offset voltage,
VCONTROL(min), i.e. Vcontrol−VCONTROL(min).
This control current Icontrol is a roughly constant current
that comes from the PFC output voltage Vout that is a slowly
varying signal. The bandwidth of Icontrol can be
additionally limited by inserting the external type−2
compensation components (that are RZ, CZ, and CP as
shown in Figure 38). It is recommended to limit fcontrol, that
is the bandwidth of Vcontrol (or Icontrol), below 20 Hz
typically to achieve power factor correction purpose.
The transformer of Vout to Vcontrol is as described in
(Equation 12) if CZ is >> CP. GEA is the error amplifier gain.
R @ G EARZ
Vcontrol
1 ) sRZC Z
+ fbL
@
V out
RfbL ) RfbU sRZC Z(1 ) sR ZCP)
From (Equation 7) − (Equation 11), the input impedance
Zin is re−formulated in (Equation 13).
Zin +
Ǹ2 R R
(eq. 13)
M SENSEV outV acK BOI L
2pR CS @ (V control * V CONTROL(min)) @ V REFIL*50
When IL is equal to IL−50, (Equation 13) is re−formulated
in (Equation 14)
Zin +
Ǹ2 R R
M SENSEV outV acK BO
2pR CS @ (V control * V CONTROL(min)) @ V REF
(eq. 14)
The multiplier capacitor CM is the one to filter the
high−frequency component of the multiplier voltage Vm.
The high−frequency component is basically coming from
the inductor current IL. On the other hand, the filter
capacitor Cfilter similarly removes the high−frequency
component of inductor current IL. If the capacitors CM and
Cfilter match with each other in terms of filtering capability,
IL becomes IL−50. Input impedance Zin is roughly constant
over the bandwidth of 50 or 60 Hz and power factor is
corrected.
(eq. 12)
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NCP1654
Input and output power (Pin and Pout) are derived in (Equation 15) when the circuit efficiency η is obtained or assumed.
The variable Vac stands for the rms input voltage.
Pin +
T
2pRCS @ (V control * V CONTROL(min)) @ V REF @ V ac
V ac 2
+
Ǹ2 R R
Z in
V K
(V control * V CONTROL(min))Vac
V out
Pout + h P in + h
T
(eq. 15)
M SENSE out BO
2pRCS @ (Vcontrol * VCONTROL(min)) @ VREF @ Vac
Ǹ2 R R
V K
(eq. 16)
M SENSE out BO
(V control * V CONTROL(min))Vac
V out
Follower Boost
VCONTROL(max). Re−formulate (Equation 16) to become
(Equation 17) and (Equation 18) by replace Vcontrol by
VCONTROL(max). If Vcontrol is constant based on
(Equation 15), for a constant load or power demand the
output voltage Vout of the converter is proportional to the
rms input voltage Vac. It means the output voltage Vout
becomes lower when the rms input voltage Vac becomes
lower. On the other hand, the output voltage Vout becomes
lower when the load or power demand becomes higher.
The “Follower Boost” is an operation mode where the
pre−converter output voltage stabilizes at a level that varies
linearly versus the ac line amplitude. This technique aims
at reducing the gap between the output and input voltages
to optimize the boost efficiency and minimize the cost of
the PFC stage (refer to MC33260 data sheet for more
details at http://www.onsemi.com ).
The NCP1654 operates in follower boost mode when
Vcontrol is constant, i.e. Vcontrol raises to its maximum value
Pout + h
+h
2pR CS @ (VCONTROL(max) * VCONTROL(min)) @ VREF @ Vac
Ǹ2 R R
V K
(eq. 17)
M SENSE out BO
2pRCS @ DVCONTROL @ VREF @ Vac
Ǹ2 R R
V K
M SENSE out BO
Vout + h
2pR CS @ DVCONTROL @ VREF V ac
@
Ǹ2 R R
Pout
K
(eq. 18)
M SENSE BO
where
VCONTROL(max) is the maximum control voltage.
DVCONTROL is the gap between VCONTROL(max) and
VCONTROL(min).
It is illustrated in Figure 39.
the output voltage Vout will always be higher than the input
voltage Vin even though Vout is reduced in follower boost
operation. As a result, the on time t1 is reduced. Reduction
of on time makes the loss of the inductor and power
MOSFET smaller. Hence, it allows cheaper cost in the
inductor and power MOSFET or allows the circuit
components to operate at a lower stress condition in most
of the time.
Vout (Traditional Boost)
Reference Section
Vout (Follower Boost)
The internal reference voltage (VREF) is trimmed to be
±2% accurate over the temperature range (the typical value
is 2.5 V). VREF is the reference used for the regulation.
VREF also serves to build the thresholds of the fast transient
response, Overvoltage (OVP), brown out (BO), and
Undervoltage protections (UVP).
Vin
Time
Pout
Time
Output Feedback
The output voltage Vout of the PFC circuits is sensed at
Vfb pin via the resistor divider (RfbL and RfbU) as shown in
Figure 38. Vout is regulated as described in (Equation 19).
Figure 39. Follower Boost Characteristics
Follower Boost Benefits
The follower boost circuit offers and opportunity to
reduce the output voltage Vout whenever the rms input
voltage Vac is lower or the power demand Pout is higher.
Because of the step−up characteristics of boost converter,
Vout + V REF
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16
RfbU ) RfbL
R fbL
(eq. 19)
NCP1654
Fast Transient Response
The feedback signal Vfb represents the output voltage
Vout and will be used in the output voltage regulation,
Overvoltage protection (OVP), fast transient response, and
Undervoltage protection (UVP)
Given the low bandwidth of the regulation block, the
output voltage of PFC stages may exhibit excessive over or
under−shoots because of abrupt load or input voltage
variations (such as start−up duration). As shown in
Figure 40, if the output voltage is out of regulation,
NCP1654 has 2 functions to maintain the output voltage
regulation.
Output Voltage Regulation
NCP1654 uses a high gain Operational Trans−
conductance Amplifier (OTA) as error amplifier. Refer to
Figure 38, the output of OTA Vcontrol operating range is
from VCONTROL(min) to VCONTROL(max).
Vout
+
Vdd
OVP
RfbU
Vfb
6
CFB
RfbL
Vcontrol
105%
VREF
95%
VREF
VREF
200 mA
+
+
+
Vout Low Detect
±20 mA
OTA
5
Figure 40. OVP and Fast Transient Response
• Overvoltage Protection: When Vfb is higher than
105% of VREF (i.e. Vout > 105% of nominal output
voltage), the Driver output of the device goes low for
protection. The circuit automatically resumes
operation when Vfb becomes lower than 105% of
VREF. If the nominal Vout is set at 390 V, then the
maximum output voltage is 105% of 390 V = 410 V.
Hence a cost & size effective bulk capacitor of lower
voltage rating is suitable for this application,
Dynamic response enhancer: NCP1654 drastically
speeds up the regulation loop by its internal 200 mA
enhanced current source when the output voltage is
below 95% of its regulation level. Under normal
VCONTROL PIN CURRENT (mA)
•
condition, the maximum sink and source of output
current capability of OTA is around 28 mA. Thanks to
the “Vout low detect” block, when the Vfb is below
95% VREF, an extra 200 mA current source will raise
Vcontrol rapidly. Hence prevent the PFC output from
dropping too low and improve the transient response
performance. The relationship between current
flowing in/out Vcontrol pin and Vfb is as shown in
Figure 41.
It is recommended to add a typical 100 pF capacitor CFB
decoupling capacitor next to feedback pin to prevent from
noise impact.
50
200 mA raises
Vcontrol rapidly
when Vfb is below
95% VREF
0
−50
−100
No DRV when
Vfb is above
105% VREF
−150
−200
−250
2
2.2
2.4
Vfb
2.6
2.8
3
Figure 41. Vfb vs. Current Flowing in/out from Vcontrol Pin
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NCP1654
Soft Start
The block diagram and timing diagram of soft start
function are as shown in Figure 42 and Figure 43. The
device provides no output (or no duty ratio) when the
Vcontrol is lower than VCONTROL(min). Vcontrol is pulled low
when:
• Brown−out, or
• Undervoltage Protection
When the IC recovers from one of the following
conditions; Undervoltage Lockout, Brown−out or
Undervoltage Protection, the 200 mA current source block
keeps off. Hence only the Operating Trans−conductance
Amplifier (OTA) raises the Vcontrol. And Vcontrol rises
slowly. This is to obtain a slow increasing duty cycle and
hence reduce the voltage and current stress on the
MOSFET. A soft−start operation is obtained.
BO
Off
Vdd
UVLO
Bias
S
Q
R
Q
Vfb
6
Vcontrol
5
95%
VREF
VREF
+
+
Vdd
200 mA
Vout Low Detect
±20 mA
OTA
BO
Figure 42. Soft Start Block Diagram
UVLO, BO, or UVP
UVP
Period I
Period II
Vdd
Vdd Rising
Vfb
95% VREF
Vout Low Detect
Set
Reset
Q
Figure 43. Soft Start Timing Diagram
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UVLO
NCP1654
Undervoltage Protection (UVP) for Open Loop
Protection or Shutdown
PFC duty modulation to generate the multiplier voltage
Vm, Over−Power Limitation (OPL), and Over−Current
Protection. (Equation 11) would insist in the fact that it
provides the flexibility in the RSENSE choice and that it
allows to detect in−rush currents.
ISTDN
Shutdown
Over−Current Protection (OCP)
Operating
Over−Current Protection is reached when Ics is larger
than IS(OCP) (200 mA typical). The offset voltage of the CS
pin is typical 10 mV and it is neglected in the calculation.
Hence, the maximum OCP inductor current threshold
IL(OCP) is obtained in (Equation 20).
ICC2
Vfb
8% VREF
12% VREF
Figure 44. Undervoltage Protection
IL(OCP) +
As shown in Figure 44, when Vfb is less than 8% of VREF,
the device is shut down and consumes less than 400 mA.
The device automatically starts operation when the output
voltage goes above 12% of VREF. In normal situation of
boost converter configuration, the output voltage Vout is
always greater than the input voltage Vin and the feedback
signal Vfb is always greater than 8% and 12% of VREF to
enable NCP1654 to operate.
This Undervoltage Protection function has 2 purposes.
• Open Loop Protection − Protect the power stage from
damage at feedback loop abnormal, such as Vfb is
shorted to ground or the feedback resistor RfbU is
open.
• Shutdown mode − Disables the PFC stage and forces a
low consumption mode. This feature helps to meet
stringent stand−by specifications. Power Factor being
not necessary in stand−by, the PFC stage is generally
inhibited to save the pre−converter losses. To further
improve the stand−by performance, the PFC controller
should consume minimum current in this mode.
R SENSE
+
R CS
@ 200 mA (eq. 20)
RSENSE
When over−current protection threshold is reached, the
Drive Output of the device goes low. The device
automatically resumes operation when the inductor current
goes below the threshold.
Input Voltage Sense
The device senses the rms input voltage Vac by the
sensing scheme in Figure 45. Vbo senses the average
rectified input voltage Vin via the resistor divider. An
external capacitor CBO is to maintain the Vbo the average
value of Vin. Vbo is used for Brown−Out Protection, PFC
duty modulation and over−power limitation (OPL).
Brown−Out Protection
The device uses the Vbo signal to protect the PFC stage
from operating as the input voltage is lower than expected.
Re−formulate (Equation 9) to get (Equation 21). Refer to
Figure 45, Vin is different before and after the device
operating.
• Before the device operates, Vin is equal to the peak
value of rms input voltage, Vac. Hence Vbo is as
described in (Equation 21).
Current Sense
The device senses the inductor current IL by the current
sense scheme in Figure 37. The device maintains the
voltage at CS pin to be zero voltage (i.e., Vcs ≈ 0 V) so that
(Equation 11),
Ics
R CSIS(OCP)
Vbo +
RboL
RboL
Ǹ2 V
(V ) +
ac (eq. 21)
R boL ) R boU in
R boL ) R boU
• After device operates, Vin is the rectified sinusoidal
R
+ SENSE IL ,
RCS
input voltage. Thanks to CBO, Vbo is the average of
rectified input voltage. Hence Vbo decays to 2/p of the
peak value of rms input voltage Vac as described in
(Equation 22).
can be formulated.
This scheme has the advantage of the minimum number
of components for current sensing. The sense current Ics
represents the inductor current IL and will be used in the
Vbo +
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19
RboL
2 Ǹ2
Vac
R boL ) R boU p
(eq. 22)
NCP1654
Before Device Operates
Vac
Vin
+
IN
After Device Operates
+
−
RboU
Vbo
+
4
RboL
CBO
BO
VboH / VboL
VboH = 1.3 V, VboL = 0.7 V
Figure 45. Brown−Out Protection
Overpower Limitation (OPL)
Hence a larger hysteresis of the brown out comparator is
needed, which is 0.7 V typical in this device. When Vbo
goes below than VBOL (0.7 V typical), the device turns off
the Drive output and keeps it off till Vbo exceeds VBOH
(1.3 V typical). When the device awakes after an off−state
(Undervoltage lockout or shutdown), the default threshold
is VBOH.
This is a second OCP with a threshold that is line
dependent. Sense current Ics represents the inductor current
IL and hence represents the input current approximately.
Input voltage signal Vbo represents the rms input voltage.
The product (Ics ⋅ Vbo) represents an approximated input
power (IL ⋅ Vac). It is illustrated in Figure 46.
Vin
+
RSENSE
RCS
IL
ICS + I L
CS
ICS
RSENSE
R CS
OPL
Current Mirror
3
4
>200 mVA?
Vbo
Figure 46. Over−Power Limitation
Bias the Controller
When the product (Ics ⋅ Vbo) is greater than a permissible
level 200 mVA, the device turns off the drive output so that
the input power is limited. The OPL is automatically
deactivated when the product (Ics ⋅ Vbo) is lower than the
200 mVA level. This 200 mVA level corresponds to the
approximated input power (IL ⋅ Vac) to be smaller than the
particular expression in (Equation 23).
IcsV bo t 200 mVA
ǒ
IL
Ǔǒ
RSENSE
@
R CS
IL @ V ac t
2 Ǹ2 K BO
@ V ac
p
Ǔ
It is recommended to add a typical 1 nF to 100 nF
decoupling capacitor next to the Vcc pin for proper
operation. When the NCP1654 operates in follower boost
mode, the PFC output voltage is not always regulated at a
particular level under all application range of input voltage
and load power. It is not recommended to make a
low−voltage bias supply voltage by adding an auxiliary
winding on the PFC boost inductor. Alternatively, it is
recommended to get the Vcc biasing supply from the
2nd−stage power conversion stage.
(eq. 23)
t 200 mVA
RCS @ p
@ 50 Ǹ2 mVA
R SENSE @ K BO
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20
NCP1654
Vcc Undervoltage LockOut (UVLO)
comparator incorporates some hysteresis (1.5 V) to prevent
erratic operation as the Vcc crosses the threshold. When Vcc
goes below the UVLO comparator lower threshold (9 V
typically), the circuit turns off. It is illustrated in Figure 47.
After startup, the operating range is between 9 V and 20 V.
The device incorporates an Undervoltage Lockout block
to prevent the circuit from operating when Vcc is too low
in order to ensure a proper operation. An UVLO
comparator monitors Vcc pin voltage to allow the NCP1654
to operate when Vcc exceeds 10.5 V typically. The
ON
State
OFF
VCC
6 mA
ICC
<75 mA
VCC
VCC(OFF)
VCC(ON)
Figure 47. Vcc Undervoltage LockOut (UVLO)
Thermal Shutdown
enabled once the temperature drops below typically 120°C
(i.e., 30°C hysteresis). The thermal shutdown is provided
to prevent possible device failures that could result from an
accidental overheating.
An internal thermal circuitry disables the circuit gate
drive and then keeps the power switch off when the junction
temperature exceeds 150°C. The output stage is then
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21
NCP1654
TB2
1
390 V
2
C4
180 mF, 450 V
+
D1
TB3
1
MSR860G
2
SPP20N60S5
Q1
R1
C9
D2
10 k
R2
C8
+
+15 V
1N4148
R4
1.8 M
1.8 M
R5
22 mF
0.1 mF
10
C10
100 pF
R3
8
R6
R12 C12
12 k C5
5
220 nF
NCP1654
IC1
0.1
2
2
VM
GND
1
3
4
BO
650 mH
6
CS
L1
7
Vcontrol
5
FB
DRV
VCC
23.2 k
2.2 mF
R8
47 k
R7
1 nF
3.6 k
0.1 mF
GBU8J
600 V
+
8A
R9
R13
R10
R11
3.3 M
3.3 M
0
82.5 k
C7
C3
0.47 mF
−
DB1
C2
0.47 mF
L2
L3
2 x 6.8 mH
150 mH
C1
0.47 mF
5 A Fuse
F1
1
2
L
AC Inlet
C6
3
N
TB1
Figure 48. Application Schematic − 300 W 65 kHz
Power Factor Correction Circuit
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22
NCP1654
PACKAGE DIMENSIONS
SO−8
D SUFFIX
CASE 751−07
ISSUE AJ
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
8
5
S
B
0.25 (0.010)
M
Y
M
1
4
−Y−
K
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
0.10 (0.004)
H
D
0.25 (0.010)
M
Z Y
S
X
M
J
S
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0 _
8 _
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
The product described herein (NCP1654), may be covered by the following U.S. patents: 6,362,067; and 7,447,601. There may be other patents pending.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
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23
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NCP1654/D