HLMP-LD63, HLMP-LM63, HLMP-LB63
Precision Optical Performance Red, Green and Blue
New 4mm Standard Oval LEDs
Data Sheet
Description
Features
These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and high
luminous intensity ensure that these devices are excellent
for wide field of view outdoor applications where a wide
viewing angle and readability in sunlight are essential.
• Well defined spatial radiation pattern
The package epoxy contains both UV-A and UV-B inhibitors to reduce the effects of long term exposure to direct
sunlight.
• High brightness material
• Available in red, green and blue color.
Red
AlInGaP 630nm
Green InGaN
525nm
Blue
InGaN
470nm
• Superior resistance to moisture
• Standoff Package
Applications
• Typical viewing angle 50° x100°
• Full color signs
• Tinted and diffused
Package Dimensions
7.26±0.20
0.286±0.008
21.0
MIN.
0.827
1.25±0.20
0.049±0.008
1.0
MIN.
0.039
CATHODE LEAD
NOTE 1
3.00±0.20
0.118±0.008
3.80±0.20
0.1496±0.008
10.00±0.50
0.394±0.020
+0.10
2.54±0.30
0.100±0.012
0.45 - 0.04
0.80
MAX. EPOXY MENISCUS
0.031
+0.004
0.018 - 0.002
Notes:
All dimensions in millimeters (inches).
Tolerance is ± 0.20mm unless other specified
For Blue and Green if heat sinking application is required, the terminal for heat sink is anode.
Caution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Device Selection Guide
Part Number
Color and Dominant Wavelength
ld (nm) Typ
Luminous Intensity Iv
(mcd) at 20 mA-Min
Luminous Intensity Iv
(mcd) at 20 mA-Max
HLMP-LD63-SWTZZ
Red 630
660
1660
HLMP-LM63-X20ZZ
Green 525
1660
4200
HLMP-LB63-PT0ZZ
Blue 470
380
960
Tolerance for each intensity limit is ± 15%.
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
Part Numbering System
HLMP- L x 63 – x x x x x
Packaging Option
ZZ: Flexi Ammopacks
Color Bin Selection
0: Open distribution
T: Red Color, Vf maximum =2.6V
Maximum Intensity Bin
0: No maximum intensity limit
Minimum Intensity Bin
Refer to Device Selection Guide.
Color
B: Blue 470
D: Red 630
M: Green 525
Package
L: 4mm Standard Oval 50° x100°
Note: Please refer to AB 5337 for complete information about part numbering system.
Absolute Maximum Ratings, TA = 25°C
Parameter
Red
Blue and Green
Unit
DC Forward Current [1]
50
30
mA
Peak Forward Current
100 [2]
100 [3, 4]
mA
Power Dissipation
130
111
mW
Reverse Voltage
5 (IR = 100 μA)
5 (IR = 10 μA)
V
LED Junction Temperature
130
110
°C
Operating Temperature Range
-40 to +100
-40 to +85
°C
Storage Temperature Range
-40 to +100
-40 to +100
°C
Notes:
1. Derate linearly as shown in Figure 2 and Figure 8.
2. Duty Factor 30%, frequency 1kHz.
3. Duty Factor 10%, frequency 1KHz.
4. For long term performance with minimal light output degradation, drive current below 15mA is recommended for Blue LED.
Electrical / Optical Characteristics, TA = 25°C
Parameter
Forward Voltage
Red
Green
Blue
Reverse Voltage
Red
Green & blue
Symbol
Min.
Typ.
Max.
Units
Test Conditions
VF
2.0
2.7
2.7
2.3
3.2
3.2
2.6 {1]
3.7
3.7
V
IF = 20 mA
V
IR = 100 mA
IR = 10 mA
VR
Dominant Wavelength [2]
Red
Green
Blue
Peak Wavelength
Red
Green
Blue
Thermal Resistance [3]
Luminous Efficacy [4]
Red
Green
Blue
Luminous Flux
Red
Green
Blue
Luminous Efficiency [5]
Red
Green
Blue
5
5
622
520
460
630
525
470
634
540
480
IF = 20 mA
lPEAK
639
516
464
nm
Peak of Wavelength of Spectral
Distribution at IF = 20 mA
RqJ-PIN
240
°C/W
LED Junction-to pin
hV
155
530
65
lm/W
Emitted Luminous Power/
Emitted
Radiant Power
jV
1300
3700
990
mlm
IF = 20 mA
he
30
60
16
lm/W
Luminous Flux/Electrical Power
IF = 20 mA
Notes:
1. For option –xxTxx, The VF maximum is 2.6V, refer to VF bin table.
2. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp
3. For AlInGaP Red, thermal resistance applied to LED junction to cathode lead. For InGaN blue and green, thermal resistance applied to LED
junction to anode lead.
4. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/hV where IV is the luminous intensity in candelas and hV is
the luminous efficacy in lumens/watt.
5. he = jV / IF x VF, where jV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage.
AlInGaP Red
I F MAX . - MAXIMUM FORWARD CURRENT - mA
RELATIVE INTENSITY
1.0
0.5
0
550
600
650
WAVELENGTH - nm
30
20
10
2.5
40
2.0
30
20
10
0
0.5
1.0
1.5
2.0
V F - FORWARD VOLTAGE - V
Figure 3. Forward Current vs Forward Voltage
0
20
40
60
T A - AMBIENT TEMPERATURE -
80
οC
100
Figure 2. Maximum Forward Current vs Ambient Temperature
RELATIVE INTENSITY
(NORMALIZED AT 20 mA)
IF - FORWARD CURRENT - mA
40
50
0
50
0
700
Figure 1. Relative Intensity vs Wavelength
60
2.5
3.0
1.5
1.0
0.5
0
0
10
30
20
FORWARD CURRENT - mA
Figure 4. Relative Intensity vs Forward Current
40
50
InGaN Blue and Green
1.0
35
0.9
30
FORWARD CURRENT - mA
RELATIVE INTENSITY
Green
Blue
0.8
0.7
0.6
0.5
0.4
0.3
0.2
380
430
480
530
WAVELENGTH - nm
580
IF max. - MAXIMUM FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
- NORMALIZED AT 20mA
1.4
1.2
1
0.8
Green
0.6
0.4
0.2
0
Blue
0
5
10
15
20
FORWARD CURRENT - mA
25
30
7
DOMINANT WAVELENGTH SHIFT- nm
6
5
Green
4
3
Blue
2
1
0
5
10
15
20
25
30
-2
FORWARD CURRENT - mA
Figure 9. Relative dominant wavelength vs Forward Current
0
1
2
FORWARD VOLTAGE - V
3
4
35
30
25
20
15
10
5
0
0
20
40
60
80
T A - AMBIENT TEMPERATURE - °C
100
Figure 8. Maximum Forward Current vs Ambient Temperature
Figure 7. Relative Intensity vs Forward Current
-3
10
Figure 6. Forward Current vs Forward Voltage
1.6
-1
15
0
630
Figure 5. Relative Intensity vs Wavelength
0
20
5
0.1
0.0
25
35
1
0.8
0.6
0.4
0.2
-90
-60
0
-30
0
30
60
90
Figure 10. Radiation pattern-Major Axis
1
0.8
0.6
0.4
0.2
-90
-60
-30
0
0
30
60
90
Figure 11. Radiation pattern-Minor Axis
Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio)
Intensity (mcd) at 20 mA
Bin
Min
Max
P
380
460
Q
460
550
R
550
660
S
660
800
T
800
960
U
960
1150
V
1150
1380
W
1380
1660
X
1660
1990
Y
1990
2400
Z
2400
2900
1
2900
3500
2
3500
4200
Tolerance for each bin limit is ± 15%
VF Bin Table (V at 20mA)
Bin ID
Min
Max
VA
2.0
2.2
VB
2.2
2.4
VC
2.4
2.6
Tolerance for each bin limit is ± 0.05
Red Color Range
Min Dom
Max Dom
Xmin
Ymin
Xmax
Ymax
622
634
0.6904
0.3094
0.6945
0.2888
0.6726
0.3106
0.7135
0.2865
Tolerance for each bin limit is ± 0.5nm.
Green Color Bin Table
Bin
Min Dom
Max Dom
Xmin
Ymin
Xmax
Ymax
1
520.0
524.0
0.0743
0.8338
0.1856
0.6556
0.1650
0.6586
0.1060
0.8292
0.1060
0.8292
0.2068
0.6463
0.1856
0.6556
0.1387
0.8148
0.1387
0.8148
0.2273
0.6344
0.2068
0.6463
0.1702
0.7965
0.1702
0.7965
0.2469
0.6213
0.2273
0.6344
0.2003
0.7764
0.2003
0.7764
0.2659
0.6070
0.2469
0.6213
0.2296
0.7543
2
3
524.0
528.0
528.0
532.0
4
532.0
536.0
5
536.0
540.0
Tolerance for each bin limit is ± 0.5nm
Blue Color Bin Table
Bin
Min Dom
Max Dom
Xmin
Ymin
Xmax
Ymax
1
460.0
464.0
0.1440
0.0297
0.1766
0.0966
0.1818
0.0904
0.1374
0.0374
0.1374
0.0374
0.1699
0.1062
0.1766
0.0966
0.1291
0.0495
0.1291
0.0495
0.1616
0.1209
0.1699
0.1062
0.1187
0.0671
0.1187
0.0671
0.1517
0.1423
0.1616
0.1209
0.1063
0.0945
0.1063
0.0945
0.1397
0.1728
0.1517
0.1423
0.0913
0.1327
2
464.0
468.0
3
468.0
472.0
4
472.0
476.0
5
476.0
480.0
Tolerance for each bin limit is ± 0.5nm
Note:
1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago
representative for further information.
Avago Color Bin on CIE 1931 Chromaticity Diagram
1.000
0.800
1 2 3
4
Green
5
Y
0.600
0.400
Red
0.200
5
4
3
2
0.000
0.000
0.100
Blue
1
0.200
0.300
0.400
X
0.500
0.600
0.700
100
120
RELATIVE LIGHT OUTPUT (NORMALIZED AT TJ = 25˚C
Relative Light Output vs Junction Temperature
10
BLUE
1
0.1
-40
GREEN
RED
-20
0
20
40
60
T J - JUNCTION TEMPERATURE - ˚C
80
0.800
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED
during soldering process might cause premature failure to the LED
due to delamination.
Avago Technologies LED configuration
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
Soldering and Handling:
• Care must be taken during PCB assembly and
soldering process to prevent damage to the LED
component.
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat
source (soldering iron’s tip) to the body is 1.59mm.
Soldering the LED using soldering iron tip closer than
1.59mm might damage the LED.
1.59mm
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature
105 °C Max.
-
Preheat time
60 sec Max
-
Peak temperature
250 °C Max.
260 °C Max.
Dwell time
3 sec Max.
5 sec Max
Anode
Cathode
AllnGaP Device
InGaN Device
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during
wave soldering process.
Note: In order to further assist customer in designing jig accurately
that fit Avago Technologies’ product, 3D model of the product is
available upon request.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
LED component
lead size
Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
• Wave soldering parameters must be set and
maintained according to the recommended
temperature and dwell time. Customer is advised
to perform daily check on the soldering profile to
ensure that it is always conforming to recommended
soldering conditions.
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
TEMPERATURE (°C)
200
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
150
Note: Allow for board to be
sufficiently cooled to room
temperature before exerting
mechanical force.
100
50
PREHEAT
0
10
20
30
40
60
50
TIME (MINUTES)
70
80
90
100
Ammo Packs Drawing
6.35±1.30
0.25±0.0512
12.70±1.00
0.50±0.0394
CATHODE
20.5±1.00
0.8071±0.0394
9.125±0.625
0.3593±0.025
18.00±0.50
0.7087±0.0197
12.70±0.30
0.50±0.0118
Ø
0.70±0.20
0.276±0.0079
VIEW A - A
4.00±0.20
TYP.
0.1575±0.0079
Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff
10
Packaging Box for Ammo Packs
Note: For InGaN device, the ammo pack packaging box contain ESD logo
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
STANDARD LABEL LS0002
RoHS Compliant
e3
max temp 250C
(1T) Lot: Lot Number
(Q) QTY: Quantity
LPN:
CAT: Intensity Bin
(9D)MFG Date: Manufacturing Date
BIN: Refer to below information
(P) Customer Item:
11
(V) Vendor ID:
(9D) Date Code: Date Code
DeptID:
Made In: Country of Origin
Lamps Baby Label
(1P) PART #: Part Number
RoHS Compliant
e3
max temp 250C
DeptID:
Made In: Country of Origin
(ii) Avago Baby Label (Only available on bulk packaging)
Lamps Baby Label
(1P) PART #: Part Number
RoHS Compliant
e3
max temp 250C
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only
(i) Color bin only or VF bin only
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and no
color bin)
OR
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color bin
and VF bin)
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
VB: VF bin “VB”
2: Color bin 2 only
DISCLAIMER
AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR
SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT
OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY
RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS,
DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes AV02-0076EN
AV02-1539EN - September 16, 2008