NL27WZ00 Dual 2-Input NAND Gate The NL27WZ00 is a high performance dual 2−input NAND Gate operating from a 1.65 V to 5.5 V supply. Features • • • • • • • • • • • Extremely High Speed: tPD 2.4 ns (typical) at VCC = 5.0 V Designed for 1.65 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs LVTTL Compatible − Interface Capability With 5.0 V TTL Logic with VCC = 3.0 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Replacement for NC7WZ00 Chip Complexity: FET = 112 NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant http://onsemi.com MARKING DIAGRAM 8 L1 M G G US8 US SUFFIX CASE 493 L1 M G 1 = Specific Device Code = Date Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. PIN ASSIGNMENT A1 8 1 VCC B1 2 7 Y1 Y2 3 6 B2 GND 4 5 Pin Function 1 A1 2 B1 3 Y2 4 GND 5 A2 6 B2 7 Y1 8 VCC A2 FUNCTION TABLE Y = AB Inputs Figure 1. Pinout IEEE/IEC A1 B1 & A2 B2 Y1 Y2 Output A B Y L L H L H H H L H H H L H = HIGH Logic Level L = LOW Logic Level Figure 2. Logic Symbol ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2013 July, 2013 − Rev. 12 1 Publication Order Number: NL27WZ00/D NL27WZ00 MAXIMUM RATINGS Parameter Symbol Value Units VCC −0.5 to +7.0 V DC Input Voltage VI −0.5 to +7.0 V DC Output Voltage VO −0.5 to +7.0 V VI < GND IIK −50 mA VO < GND IOK −50 mA DC Supply Voltage DC Input Diode Current DC Output Diode Current DC Output Sink Current IO ±50 mA DC Supply Current per Supply Pin ICC ±100 mA DC Ground Current per Ground Pin IGND ±100 mA Storage Temperature Range TSTG −65 to +150 °C Lead Temperature, 1 mm from Case for 10 Seconds TL 260 °C Junction Temperature under Bias TJ +150 °C Thermal Resistance (Note 1) qJA 250 °C/W Power Dissipation in Still Air at 85°C PD 250 mW MSL Level 1 FR UL 94 V−0 @ 0.125 in Moisture Sensitivity Flammability Rating Oxygen Index: 28 to 34 ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) VESD Latchup Performance Above VCC and Below GND at 85°C (Note 5) V > 2000 > 200 N/A ILatchup mA ±500 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Parameter Symbol Min Max 1.65 1.5 5.5 5.5 Units Supply Voltage Operating Data Retention Only VCC Input Voltage (Note 6) VI 0 5.5 V Output Voltage (HIGH or LOW State) VO 0 5.5 V Operating Free−Air Temperature TA −55 +125 °C Input Transition Rise or Fall Rate VCC = 2.5 V ±0.2 V VCC = 3.0 V ±0.3 V VCC = 5.0 V ±0.5 V Dt/DV 0 0 0 20 10 5 6. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level. http://onsemi.com 2 V ns/V NL27WZ00 DC ELECTRICAL CHARACTERISTICS Parameter Condition Symbol TA = 255C VCC (V) Min 0.75 VCC 0.7 VCC High−Level Input Voltage VIH 1.65 2.3 to 5.5 Low−Level Input Voltage VIL 1.65 2.3 to 5.5 High−Level Output Voltage VIN = VIL or VIH IOH = −100 mA IOH = −4 mA IOH = −8 mA IOH = −12 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA VOH 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 Low−Level Output Voltage VIN = VIH or VOH IOL = 100 mA IOL = 4 mA IOL = 8 mA IOL = 12 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA VOL 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 Input Leakage Current VIN = 5.5 V or GND IIN Quiescent Supply Current VIN = 5.5 V or GND Power Off Leakage Current VIN = 5.5 V or VOUT = 5.5 V Typ −555C 3 TA 3 1255C Max Min Max 0.75 VCC 0.7 VCC V 0.25 VCC 0.3 VCC VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 VCC 1.5 2.1 2.4 2.7 2.5 4.0 0.0 0.08 0.20 0.22 0.28 0.38 0.42 Units 0.25 0.3 VCC VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 V V 0.1 0.24 0.3 0.4 0.4 0.55 0.55 0.1 0.24 0.3 0.4 0.4 0.55 0.55 V 0 to 5.5 ±0.1 ±1.0 mA ICC 5.5 1.0 10 mA IOFF 0 1.0 10 mA AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns TA = 255C VCC Condition Symbol (V) Min Typ Max Min Max Units RL = 1 MW, CL = 15 pF tPLH tPHL 1.8 ± 0.15 2.0 5.7 10.5 2.0 11.0 ns 2.5 ± 0.2 1.2 3.2 5.3 1.2 5.7 RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF 3.3 ± 0.3 0.8 1.2 2.4 3.0 3.7 4.6 0.8 1.2 4.0 4.9 RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF 5.0 ± 0.5 0.5 0.8 1.9 2.4 2.9 3.6 0.5 0.8 3.2 3.9 Parameter Propagation Delay (Figure 3 and 4) −555C 3 TA 3 1255C CAPACITIVE CHARACTERISTICS Parameter Condition Symbol Typical Units Input Capacitance VCC = 5.5 V, VI = 0 V or VCC CIN 2.5 pF Power Dissipation Capacitance (Note 7) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC CPD 9 11 pF 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 NL27WZ00 tf = 3 ns tf = 3 ns 90% INPUT A and B 50% VCC VCC 90% 50% 10% 10% tPHL GND RL CL * tPLH VOH OUTPUT Y OUTPUT INPUT *CL includes all probe and jig capacitances. A 1−MHz square input wave is recommended for propagation delay tests. 50% 50% VOL Figure 3. Switching Waveform CAVITY TAPE TOP TAPE Figure 4. Test Circuit TAPE TRAILER (Connected to Reel Hub) NO COMPONENTS 160 mm MIN COMPONENTS TAPE LEADER NO COMPONENTS 400 mm MIN DIRECTION OF FEED Figure 5. Tape Ends for Finished Goods TAPE DIMENSIONS mm 4.00 2.00 4.00 Ğ1.50 TYP 1.75 3.50 $ 0.25 0.30 8.00 + − 0.10 1 Ğ1.00 ± 0.25 TYP DIRECTION OF FEED Figure 6. US8 Reel Configuration/Orientation http://onsemi.com 4 NL27WZ00 t MAX 1.5 mm MIN (0.06 in) A 13.0 mm $0.2 mm (0.512 in $0.008 in) 50 mm MIN (1.969 in) 20.2 mm MIN (0.795 in) FULL RADIUS G Figure 7. Reel Dimensions REEL DIMENSIONS Tape Size T and R Suffix A Max G t Max 8 mm US 178 mm (7 in) 8.4 mm, + 1.5 mm, −0.0 (0.33 in + 0.059 in, −0.00) 14.4 mm (0.56 in) DIRECTION OF FEED BARCODE LABEL POCKET HOLE Figure 8. Reel Winding Direction ORDERING INFORMATION Package Shipping† NL27WZ00USG US8 (Pb−Free) 3000 / Tape & Reel NLV27WZ00USG* US8 (Pb−Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. http://onsemi.com 5 NL27WZ00 PACKAGE DIMENSIONS US8 CASE 493−02 ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055”) PER SIDE. 4. DIMENSION “B” DOES NOT INCLUDE INTER−LEAD FLASH OR PROTRUSION. INTER−LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203 MM. (300−800 “). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002 “). −X− A 8 J −Y− 5 DETAIL E B L 1 4 R S G P U C −T− SEATING PLANE H 0.10 (0.004) T K D N 0.10 (0.004) M R 0.10 TYP T X Y V M F DETAIL E MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 5_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC DIM A B C D F G H J K L M N P R S U V INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0_ 6_ 5_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC SOLDERING FOOTPRINT* 3.8 0.15 0.50 0.0197 1.8 0.07 0.30 0.012 1.0 0.0394 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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