Pressure Freescale Semiconductor + MPXV4006 Rev 3, 1/2009 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPXV4006 series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors designed for the appliance, consumer, health care and industrial market. The analog output can be read directly into the A/D input of Freescale microcontrollers. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. The axial port has been modified to accommodate industrial grade tubing. Features • • • • • MPXV4006 Series Integrated Pressure Sensor 0 to 6 kPa (0 to 0.87 psi) 0.2 to 4.8 V Output Application Examples • • • 2.5% Maximum Error over +10°C to +60°C with Auto Zero 5% Maximum Error over +10°C to +60°C without Auto Zero Durable Thermoplastic (PPS) Package Available in Surface Mount (SMT) or Through-Hole (DIP) Configurations Available with Standard Fluorosilicone Gel or Media Resistant Gel • Washing Machine Water Level Measurement (Reference AN1950) Ideally Suited for Microprocessor or Microcontroller-Based Systems Appliance Liquid Level and Pressure Measurement Respiratory Equipment ORDERING INFORMATION Option Surface ThroughNone Single Dual Gauge Differential Absolute Mount Hole Small Outline Package (Media Resistant Gel) (MPVZ4006 Series) MPVZ4006GW6U Rail 1735 • • • MPVZ4006GW7U Rail 1560 • • • Device Name MPVZ4006G6U Package Options Rail Case No. 482 MPVZ4006G6T1 Tape and 482 Reel MPVZ4006G7U Rail 482B Small Outline Package (MPXV4006 Series) MPXV4006GC6U Rail 482A MPXV4006GC6T1 Tape and 482A Reel MPXV4006GC7U Rail 482C MPXV4006GP Tray 1369 MPXV4006DP Tray # of Ports 1351 Pressure Type • • • • • • • • • • • • • • • © Freescale Semiconductor, Inc., 2006-2009. All rights reserved. MZ4006GW MPVZ4006G • MPVZ4006G MPXV4006G • • MPXV4006G • • MZ4006GW MPVZ4006G • • • • Device Marking MPXV4006G MPXV4006GP MPXV4006DP Pressure SMALL OUTLINE PACKAGE SURFACE MOUNT MPVZ4006G6U/T1 CASE 482-01 MPVZ4006GW6U CASE 1735-01 MPXV4006GC6U/C6T1 CASE 482A-01 MPXV4006DP CASE 1351-01 MPXV4006GP CASE 1369-01 SMALL OUTLINE PACKAGE THROUGH-HOLE J MPVZ4006GW7U CASE 1560-02 MPVZ4006G7U CASE 482B-03 MPXV4006GC7U CASE 482C-03 MPXV4006 2 Sensors Freescale Semiconductor Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range POP 0 — 6.0 612 kPa mm H2O Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Supply Current IS — — 10 mAdc Full Scale Span(2) VFSS — 4.6 — V (3)(5) Offset Voff 0.152 0.265 0.378 V Sensitivity V/P — 766 7.511 — mV/kPa mV/mm H2O — — — ±2.46 — — — ±5.0 %VFSS with auto zero %VFSS without auto zero Accuracy(4)(5) (10 to 60°C) 1. Device is ratiometric within this specified excitation range. 2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: Linearity: Temperature Hysteresis: Pressure Hysteresis: Offset Stability: TcSpan: TcOffset: Output deviation from a straight line relationship with pressure over the specified pressure range. Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure, at 25°C. Output deviation, after 1000 temperature cycles, -30 to 100°C, and 1.5 million pressure cycles, with minimum rated pressure applied. Output deviation over the temperature range of 10° to 60°C, relative to 25°C. Output deviation with minimum pressure applied, over the temperature range of 10° to 60°C, relative to 25°C. 5. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV4006, external mechanical stresses and mounting position can affect the zero pressure output reading. To obtain the 2.46% FSS accuracy, the device output must be “autozeroed'' after installation. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. The specified accuracy assumes a maximum temperature change of ±5°C between autozero and measurement. MPXV4006 Sensors Freescale Semiconductor 3 Pressure Maximum Ratings Table 2. Maximum Ratings(1) Parametrics Symbol Value Units Maximum Pressure (P1 > P2) Pmax 24 kPa Storage Temperature Tstg -30° to +100° °C Operating Temperature TA +10° to +60° °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. VS 2 Thin Film Temperature Compensation and Gain Stage #1 Sensing Element 3 GND Gain Stage #2 and Ground Reference Shift Circuitry 4 Vout Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package device Figure 1. Fully Integrated Pressure Sensor Schematic MPXV4006 4 Sensors Freescale Semiconductor Pressure On-Chip Temperature Compensation and Calibration The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482). A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXV4006/MPVZ4006 series sensor operating characteristics are based on use of dry air as pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Internal reliability and Fluorosilicone Gel Die Coat qualification test for dry air, and other media, are available from the factory. Contact the factory for information regarding media tolerance in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 and Figure 5 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves are shown for operation over a temperature range of 10°C to 60°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range. Stainless Steel Cap Die +5 V P1 Wire Bond Thermoplastic Case OUTPUT Vout Vs IPS Lead Frame 1.0 μF 0.01 μF 470 pF GND P2 Die Bond Differential Sensing Element Figure 3. Recommended Power Supply Decoupling and Output Filtering Recommendations (For additional output filtering, please refer to Application Note AN1646.) Figure 2. Cross Sectional Diagram SOP (not to scale) 5.0 5.0 Transfer Function (kPa): Vout = VS*[(0.1533*P) + 0.053] ± 5.0% VFSS VS = 5.0 Vdc TEMP = 10 to 60°C 4.5 4.0 3.5 4.0 3.5 3.0 2.5 MAX 2.0 Output (V) Output (V) 3.0 TYPICAL 1.5 2.5 TYPICAL MAX 2.0 1.5 MIN 1.0 MIN 1.0 0.5 0 Transfer Function (kPa): Vout = VS*[(0.1533*P) + 0.053] ± 2.46% VFSS VS = 5.0 Vdc TEMP = 10 to 60°C 4.5 0.5 0 2.0 4.0 Differential Pressure (kPa) Figure 4. Output versus Pressure Differential at ±5.0% VFSS (without auto zero, Note 5 in Operating Characteristics) 6.0 0 0 2.0 4.0 6.0 Differential Pressure (kPa) Figure 5. Output versus Pressure Differential at ±2.46% VFSS (with auto zero, Note 5 in Operating Characteristics) MPXV4006 Sensors Freescale Semiconductor 5 Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing a gel die coat which isolates the die from the environment. The pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Table 3. Pressure (P1)/Vacuum (P2) Side Identification Table Part Number Case Type Pressure (P1) Side Identifier MPVZ4006GW6U 1735-01 Vertical Port Attached MPVZ4006GW7U 1560-02 Vertical Port Attached MPVZ4006G6U/T1 482-01 Stainless Steel Cap 482B-03 Stainless Steel Cap MPVZ4006G7U MPXV4006GC6U/T1 482A Vertical Port Attached MPXV4006GC7U 482C-03 Vertical Port Attached MPXV4006GP 1369-01 Side with Port Attached MPXV4006DP 1351-01 Side with Part Marking MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.100 TYP 2.54 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm Figure 6. SOP Footprint (Case 482) MPXV4006 6 Sensors Freescale Semiconductor Pressure CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPXV4006 Sensors Freescale Semiconductor 7 Pressure CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPXV4006 8 Sensors Freescale Semiconductor Pressure CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPXV4006 Sensors Freescale Semiconductor 9 Pressure CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPXV4006 10 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS -A- D 8 PL 0.25 (0.010) 4 5 M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S DIM A B C D G H J K M N S N H C J -TSEATING PLANE PIN 1 IDENTIFIER K M INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 10.29 10.54 18.01 18.41 CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE -ANOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. 4 5 -BG 8 1 0.25 (0.010) M T B D 8 PL S A S DETAIL X S PIN 1 IDENTIFIER N C -T- SEATING PLANE DIM A B C D G J K M N S INCHES MILLIMETERS MIN MAX MIN MAX 0.415 0.425 10.54 10.79 0.415 0.425 10.54 10.79 0.210 0.220 5.33 5.59 0.026 0.034 0.66 0.864 0.100 BSC 2.54 BSC 0.009 0.011 0.23 0.28 0.100 0.120 2.54 3.05 0˚ 15˚ 0˚ 15˚ 0.405 0.415 10.29 10.54 0.540 0.560 13.72 14.22 K M J DETAIL X CASE 482B-03 ISSUE B SMALL OUTLINE PACKAGE MPXV4006 Sensors Freescale Semiconductor 11 Pressure PACKAGE DIMENSIONS –A– D 8 PL 4 0.25 (0.010) 5 M T B S A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. S N –B– G 8 1 S DIM A B C D G H J K M N S V W W V C H J INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 –T– K M PIN 1 IDENTIFIER SEATING PLANE CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MPXV4006 12 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE MPXV4006 Sensors Freescale Semiconductor 13 Pressure PACKAGE DIMENSIONS CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE MPXV4006 14 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE MPXV4006 Sensors Freescale Semiconductor 15 Pressure PACKAGE DIMENSIONS CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE MPXV4006 16 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE MPXV4006 Sensors Freescale Semiconductor 17 Pressure PACKAGE DIMENSIONS CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE MPXV4006 18 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. –A– 4 5 N –B– G 0.25 (0.010) 8 1 M T B D 8 PL S A S DIM A B C D G J K M N S V W DETAIL X S W V PIN 1 IDENTIFIER C –T– INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.026 0.034 0.100 BSC 0.009 0.011 0.100 0.120 0_ 15 _ 0.444 0.448 0.540 0.560 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.66 0.864 2.54 BSC 0.23 0.28 2.54 3.05 0_ 15 _ 11.28 11.38 13.72 14.22 6.22 6.48 2.92 3.17 SEATING PLANE K M J DETAIL X CASE 482C-03 ISSUE A SMALL OUTLINE PACKAGE MPXV4006 Sensors Freescale Semiconductor 19 Pressure PACKAGE DIMENSIONS 2 PLACES 4 TIPS 0.006 (0.15) C A B E A GAGE PLANE e 5 4 e/2 .014 (0.35) θ L D A1 DETAIL G 8 1 b 0.004 (0.1) 8X F M C A B E1 B N GND +Vout Vs -Vout N/C N/C N/C N/C STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8. N/C Vs GND Vout N/C N/C N/C N/C ∅T M A P STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8. 8X 0.004 (0.1) K DETAIL G C SEATING PLANE NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A A1 b D E E1 e F K L M N P T θ INCHES MILLIMETERS MIN MAX MIN MAX 0.370 0.390 9.39 9.91 0.002 0.010 0.05 0.25 0.038 0.042 0.96 1.07 0.465 0.485 11.81 12.32 0.680 0.700 17.27 17.78 0.465 0.485 11.81 12.32 0.100 BSC 2.54 BSC 0.240 0.260 6.10 6.60 0.115 0.135 2.92 3.43 0.040 0.060 1.02 1.52 0.270 0.290 6.86 7.37 0.160 0.180 4.06 4.57 0.009 0.011 0.23 0.28 0.110 0.130 2.79 3.30 0˚ 7˚ 0˚ 7˚ CASE 1351-01 ISSUE O SMALL OUTLINE PACKAGE MPXV4006 20 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS 2 PLACES 4 TIPS 0.008 (0.20) C A B E A GAGE PLANE e 5 4 e/2 .014 (0.35) θ L D A1 DETAIL G 8 1 b 0.004 (0.1) NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. 8X F M E1 B N ∅T K A P C A B 8X M 0.004 (0.1) DETAIL G C SEATING PLANE DIM A A1 b D E E1 e F K L M N P T θ INCHES MILLIMETERS MIN MAX MIN MAX 0.300 0.330 7.11 7.62 0.002 0.010 0.05 0.25 0.038 0.042 0.96 1.07 0.465 0.485 11.81 12.32 0.717 BSC 18.21 BSC 0.465 0.485 11.81 12.32 0.100 BSC 2.54 BSC 0.245 0.255 6.22 6.47 0.120 0.130 3.05 3.30 0.061 0.071 1.55 1.80 0.270 0.290 6.86 7.36 0.080 0.090 2.03 2.28 0.009 0.011 0.23 0.28 0.115 0.125 2.92 3.17 0˚ 7˚ 0˚ 7˚ CASE 1369-01 ISSUE O SMALL OUTLINE PACKAGE MPXV4006 Sensors Freescale Semiconductor 21 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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