Material Content Data Sheet Sales Product Name IPB60R299CPA MA# MA000779604 Package PG-TO263-3-2 Issued 29. August 2013 Weight* 1559.17 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7439-89-6 7440-50-8 4.944 0.32 0.304 0.02 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.32 3171 3171 195 0.091 0.01 304.026 19.50 19.53 194992 59 195246 1.462 0.09 0.09 938 938 10.295 0.66 6603 113.245 7.26 562.792 36.09 44.01 360957 440191 9.657 0.62 0.62 6193 6193 0.228 0.01 0.001 0.00 0.094 0.01 0.075 0.00 3.576 0.23 0.165 0.01 0.548 0.04 547.666 35.13 72631 147 0.01 0 48 0.24 2293 2. 3. 352 35.18 351255 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 2401 106 Important Remarks: 1. 147 60 351713 1000000