LM48560 LM48560 High Voltage Class H Ceramic Speaker Driver with Automatic Level Control Literature Number: SNAS513B High Voltage Class H Ceramic Speaker Driver with Automatic Level Control General Description Features The LM48560 is a high voltage, high efficiency, Class H driver for ceramic speakers and piezo actuators. The LM48560’s Class H architecture offers significant power savings compared to traditional Class AB amplifiers. The device provides 30VP-P output drive while consuming just 4mA of quiescent current from a 3.6V supply. The LM48560 features National’s unique automatic level control (ALC) that provides output limiter functionality. The LM48560 features two fully differential inputs with separate gain settings, and a selectable control interface. In software control mode, the gain control and device modes are configured through the I2C interface. In hardware control mode, the gain and input mux are configured through a pair of logic inputs. The LM48560 has a low power shutdown mode that reduces quiescent current consumption to 0.1μA. The LM48560 is a available in an ultra-small 16–bump micro SMD package (1.97mm x 1.97mm). ■ ■ ■ ■ ■ Key Specifications ■ Output Voltage at VDD = 3.6V RL = 1.5μF+10Ω, THD+N ≤ 1% ■ ■ ■ ■ ■ Class H Topology Integrated Boost Converter Bridge-Tied Load (BTL) Output Selectable Differential Inputs Selectable Control Interfaces (Hardware or Software mode) I2C Programmable ALC Low Supply Current Minimum External Components Micro-Power Shutdown Available in Space-Saving micro SMD Package Applications ■ ■ ■ ■ Touch screen Smart Phones Tablet PCs Portable Electronic Devices MP3 Players 30VP-P (typ) ■ Quiescent Power Supply Current at 3.6V (ALC enabled) 4mA (typ) ■ Power Dissipation at 25VP-P 1W (typ) ■ Shutdown current 0.1μA (typ) Typical Application 30150733 FIGURE 1. Typical Application Circuit Boomer® is a registered trademark of National Semiconductor Corporation. © 2011 Texas Instruments Incorporated 301507 www.ti.com LM48560 High Voltage Class H Ceramic Speaker Driver with Automatic Level Control November 10, 2011 LM48560 LM48560 Connection Diagrams TL Package 1.97mm x 1.97mm x 0.6mm 16–Bump micro SMD Marking 30150739 Top View XY = Date code TT = Die traceability G = Boomer Family XX = LM48560TL 30150704 Top View Order Number LM48560TL See NS Package Number TLA16Z1A Ordering Information Ordering Information Table Package Package Drawing Number LM48560TL 16 Bump µSMD LM48560TLX 16 Bump µSMD Order Number www.ti.com Transport Media MSL Level Green Status TLA16Z1A 250 units on tape and reel 1 RoHS & no Sb/Br TLA16Z1A 2500 units on tape and reel 1 RoHS & no Sb/Br 2 LM48560 TABLE 1. Bump Descriptions Bump Name Description A1 OUT+ Amplifier Non-Inverting Output A2 SGND Amplifier Ground A3 IN1– Amplifier Inverting Input 1 A4 IN1+ Amplifier Non-Inverting Input 1 B1 OUT- Amplifier Inverting Output B2 SHDN Active Low Shutdown. Connect SHDN to GND to disable device. Connect SHDN to VDD for normal operation B3 IN2– Amplifier Inverting Input 2 B4 IN2+ Amplifier Non-Inverting Input 2 C1 VBST Boost Converter Output C2 SW/HW Mode Selection Control: SW/HW = 0 → Hardware Mode SW/HW = 1 → Software Mode SCL/GAIN I2C Serial Clock Input (Software Mode) Gain Select Input (Hardware Mode) see (Table 3) C4 SDA/SEL I2C Serial Data Input (Software Mode) Amplifier Input Select (Hardware Mode) see (Table 3) D1 SET ALC Timing Input D2 VDD Power Supply D3 SW Boost Converter Switching Node D4 PGND C3 Boost Converter Ground 3 www.ti.com LM48560 Storage Temperature Junction Temperature Thermal Resistance Absolute Maximum Ratings (Note 1, Note 2) θJA (TLA16Z1A) Soldering Information See AN-1112 "Micro SMD Wafer Level Chip Scale Package." If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. Supply Voltage (Note 1) SW Voltage VBST Voltage Input Voltage Power Dissipation (Note 3) ESD Rating, Human Body Model (Note 4) ESD Rating, Machine Model (Note 5) ESD Rating, Charge Device Model (Note 6) −65°C to + 150°C 150°C 6V 25V 21V −0.3V to VDD + 0.3V Internally limited 55 °C/W Operating Ratings Temperature Range TMIN ≤ TA ≤ TMAX Supply Voltage 2kV −40°C ≤ TA ≤ +85°C 2.7V ≤ VDD ≤ 5.5V VDD 100V 500V Electrical Characteristics VDD = 3.6V (Note 1, Note 2) The following specifications apply for RL = 1.5μF + 10Ω, CBST = 1μF, CIN = 0.47μF, AV = 24dB unless otherwise specified. Limits apply for TA = 25°C. LM48560 Symbol Parameter Conditions VDD Supply Voltage Range IDD Quiescent Power Supply Current ALC Enabled PD Power Consumption Min (Note 8) Typ (Note 7) 2.7 Max (Note 8) Units (Limits) 5.5 V 6 mA VIN = 0V, RL = ∞ 4 ALC Disabled ISD Shutdown Current TWU Wake-up Time VOS Differential Output Offset Voltage Gain (Hardware Mode) AV Gain (Software Mode) 3.6 VOUT = 25VP-P, f = 1kHz www.ti.com Input Resistance W Software Mode 2.5 4.4 Hardware Mode 0.1 2 From Shutdown 15 AV = 24V 10 90 mV AV = 0dB (Boost Disabled) 5 20 mV µA µA ms IN1 GAIN = 0 GAIN = 1 0.5 5.5 0 6 0.5 6.5 dB dB IN2 GAIN = 0 GAIN = 1 23.5 29.5 24 30 24.5 30.5 dB dB Boost Disabled GAIN1 = 0, GAIN0 = 0 GAIN1 = 0, GAIN0 = 1 GAIN1 = 1, GAIN0 = 0 GAIN1 = 1, GAIN0 = 1 –0.5 5.5 11.5 17.5 0 6 12 18 0.5 6.5 12.5 18.5 dB dB dB dB Boost Enabled GAIN1 = 0, GAIN0 = 0 GAIN1 = 0, GAIN0 = 1 GAIN1 = 1, GAIN0 = 0 GAIN1 = 1, GAIN0 = 1 20.5 23.5 26.5 29.5 21 24 27 30 21.5 24.5 27.5 30.5 dB dB dB dB Gain Step Size (Software Mode) RIN mA 1 3 AV = 0dB AV = 30dB 46 46 4 50 50 dB 58 58 kΩ kΩ Parameter Conditions Max (Note 8) Units (Limits) Min (Note 8) Typ (Note 7) 25 30 30 VP-P VP-P 0.08 % 78 dB 76 dB 68 dB fRIPPLE = 1kHz 78 dB Boost Disabled, A-weighted 107 dB Boost Enabled A-weighted 98 dB THD+N = 1% VOUT Output Voltage THD+N Total Harmonic Distortion + Noise VOUT = 18VP-P, f = 1kHz Power Supply Rejection Ratio (Figure 2) PSRR CMRR f = 200Hz f = 1kHz Common Mode Rejection Ratio (Figure 3) VDD = 3.6V + 200mVP-P sine, Inputs = AC GND fRIPPLE = 217Hz 55 fRIPPLE = 1kHz VCM = 200mVP-P sine fRIPPLE = 217Hz SNR Signal-to-Noise-Ratio εOS Output Noise A-weighted AV = 24dB AV = 0dB (Boost Disabled) 134 16 TA Attack Time ATK1:ATK0 = 00 0.75 ms TR Release time RLT1:RLT0 = 00 1 s fSW Boost Converter Switching Frequency 2 MHz ILIMIT Boost Converter Current Limit 1.5 A VIH Logic High Input Threshold SHDN VIL Logic Low Input Threshold SHDN IIN Input Leakage Current SHDN I2C Interface Characteristics μVRMS μVRMS 1.4 V 0.1 0.5 V 0.2 μA (Note 1, Note 2) The following specifications apply for RPU = 1kΩ to VDD, SW/HW = 1 (Software Mode) unless otherwise specified. Limits apply for TA = 25°C. LM48560 Symbol Parameter Conditions VIH Logic Input High Threshold SDA, SCL VIL Logic Input Low Threshold SDA, SCL Min (Note 7) Typ (Note 6) Max (Note 7) 1.1 SCL Frequency Units (Limits) V 0.5 V 400 kHz t1 SCL Period 2.5 μs t2 SDA Setup Time 250 ns t3 SDA Stable Time 250 ns t4 Start Condition Time 250 ns t5 Stop Condition Time 250 ns 5 www.ti.com LM48560 LM48560 Symbol LM48560 Note 1: “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions. All voltages are measured with respect to the ground pin, unless otherwise specified. Note 2: The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed. Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature, TA. The maximum allowable power dissipation is PDMAX = (TJMAX − TA) / θJA or the given in Absolute Maximum Ratings, whichever is lower. Note 4: Human body model, applicable std. JESD22-A114C. Note 5: Machine model, applicable std. JESD22-A115-A. Note 6: Charge device model, applicable std. JESD22-C101-C. Note 7: Typical values represent most likely parametric norms at TA = +25ºC, and at the Recommended Operation Conditions at the time of product characterization and are not guaranteed. Note 8: Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis. 30150737 FIGURE 2. PSRR Test Circuit 30150735 FIGURE 3. CMRR Test Circuit www.ti.com 6 All typical performance curves are taken with conditions seen in Figure 1 (Typical Application Circuit), unless otherwise specified. THD+N vs FREQUENCY CL = 0.6μF, VDD = 3.6V, Boosted, AV = 24dB THD+N vs FREQUENCY CL = 1.0μF, VDD = 3.6V, Boosted, AV = 24dB 30150754 30150755 THD+N vs FREQUENCY CL = 1.5μF, VDD = 3.6V, Boosted, AV = 24dB THD+N vs FREQUENCY VDD = 3.6V, CL = 0.6μF, VOUT = 5VP-P Unboosted, AV = 0dB 30150756 30150773 THD+N vs FREQUENCY VDD = 3.6V, CL = 1μF, VOUT = 5VP-P Unboosted , AV = 0dB THD+N vs FREQUENCY VDD = 3.6V, CL = 1.5μF, VOUT = 5VP-P Unboosted, AV = 0dB 30150775 30150774 7 www.ti.com LM48560 Typical Performance Characteristics LM48560 OUTPUT VOLTAGE vs FREQUENCY CL = 1.5μF, THD+N ≤ 1%, Boosted OUTPUT VOLTAGE vs FREQUENCY CL = 1.5μF, THD+N ≤ 1%, Unboosted 30150778 30150777 THD+N vs OUTPUT VOLTAGE CL = 0.6μF, VDD = 3.6V, Boosted, AV = 24dB THD+N vs OUTPUT VOLTAGE CL = 1.0μF, VDD = 3.6V, Boosted, AV = 24dB 30150760 30150762 THD+N vs OUTPUT VOLTAGE CL = 1.5μF, VDD = 3.6V, Boosted, AV = 24dB THD+N vs OUTPUT VOLTAGE CL = 1.5μF, VDD = 3.6V, Unboosted, AV = 0dB 30150761 30150781 www.ti.com 8 LM48560 INPUT VOLTAGE vs OUTPUT VOLTAGE ALC Enabled, AV = 21dB, VDD = 3.6V SUPPLY CURRENT vs SUPPLY VOLTAGE RL = ∞ 30150749 30150753 TOTAL POWER CONSUMPTION vs OUTPUT VOLTAGE VDD = 3.6V, CL = 0.6μF TOTAL POWER CONSUMPTION vs OUTPUT VOLTAGE VDD = 3.6V, CL = 1.0μF 30150752 30150751 TOTAL POWER CONSUMPTION vs OUTPUT VOLTAGE VDD = 3.6V, CL = 1.5μF COMMON MODE REJECTION RATIO vs FREQUENCY VCM= 200mVP-P, CIN = 10μF, VDD = 3.6V, CL = 1.5μF 30150729 30150750 9 www.ti.com LM48560 POWER SUPPLY REJECTION RATIO vs FREQUENCY VRIPPLE = 200mVP-P, VDD = 3.6V, CL = 1.5μF 30150742 www.ti.com 10 READ/WRITE I2C COMPATIBLE INTERFACE The LM48560 is controlled through an I2C compatible serial interface that consists of a serial data line (SDA) and a serial clock (SCL). The clock line is uni-directional. The data line is bi-directional (open drain). The LM48560 and the master can communicate at clock rates up to 400kHz. Figure 4 shows the I2C interface timing diagram. Data on the SDA line must be I2C BUS FORMAT 30150740 FIGURE 4. I2C Timing Diagram 30150741 FIGURE 5. Start and Stop Diagram 11 www.ti.com LM48560 stable during the HIGH period of SCL. The LM48560 is a transmit/receive slave-only device, reliant upon the master to generate the SCL signal. Each transmission sequence is framed by a START condition and a STOP condition Figure 5. Each data word, device address and data, transmitted over the bus is 8 bits long and is always followed by an acknowledge pulse Figure 6. The LM48560 device address is 1101111. Application Information LM48560 clock pulse is generated by the slave device. If the LM48560 receives the correct address, the device pulls the SDA line low, generating and acknowledge bit (ACK). Once the master device registers the ACK bit, the 8-bit register address word is sent, MSB first. Each data bit should be stable while SCL is HIGH. After the 8-bit register address is sent, the LM48560 sends another ACK bit. Upon receipt of the acknowledge, the 8-bit register data is sent, MSB first. The register data word is followed by an ACK, upon receipt of which, the master issues a STOP bit, allowing SDA to go high while SDA is high. WRITE SEQUENCE The example write sequence is shown in Figure 6. The START signal, the transition of SDA from HIGH to LOW while SDA is HIGH, is generated, altering all devices on the bus that a device address is being written to the bus. The 7-bit device address is written to the bus, most significant bit (MSB) first, followed by the R/W bit (R/W = 0 indicating the master is writing to the LM48560). The data is latched in on the rising edge of the clock. Each address bit must be stable while SDA is HIGH. After the R/W bit is transmitted, the master device releases SDA, during which time, an acknowledge 30150736 FIGURE 6. Example I2C Write Cycle clock pulse is generated by the slave device. If the LM48560 receives the correct address, the device pulls the SDA line low, generating and acknowledge bit (ACK). Once the master device registers the ACK bit, the 8-bit register address word is sent, MSB first, followed by an ACK and selected register data from the LM48560. The register data is sent MSB first. Following the acknowledgement of the register data word [7:0], the master issues a STOP bit, allowing SDA to go high while SDA is high. READ SEQUENCE The example read sequence is shown in Figure 7. The START signal, the transition of SDA from HIGH to LOW while SDA is HIGH, is generated, altering all devices on the bus that a device address is being written to the bus. The 7-bit device address is written to the bus, followed by the R/W = 1 (R/W = 1 indicating the master wants to read data from the LM48560). After the R/W bit is transmitted, the master device releases SDA, during which time, an acknowledge 30150743 FIGURE 7. Example I2C Read Cycle www.ti.com 12 LM48560 TABLE 2. Device Address Device Address B7 B6 B5 B4 B3 B2 B1 B0 (R/W) 1 1 0 1 1 1 1 0 TABLE 3. Mode Selection SW/HW SDA/SEL SCL/GAIN MODE 0 IN1, AV = 0 0 (Boost Disabled) 1 IN1, AV = 6 1 (Boost Enabled) 0 IN2, AV = 24 1 IN2, AV = 30 X X I2C Mode 0 1 TABLE 4. I2C Control Registers REGISTER ADDRESS Register Name B7 B6 B5 B4 B3 B2 B1 B0 0x00h SHUTDOWN CONTROL X X X X TURN _ON IN_SEL BOOST _EN SHDN 0x01h NO CLIP CONTROL X RLT1 RLT0 ATK1 ATK0 PLEV2 PLEV1 PLEV0 0x02h GAIN CONTROL X X X X X X GAIN1 GAIN0 0x03h TEST MODE X X X X X X X X TABLE 5. Shutdown Control Register BIT NAME VALUE DESCRIPTION B7:B4 UNUSED X Unused, set to 0 B3 TURN_ON 0 Normal turn on time, tWU = 15ms 1 Fast turn on time, tWU = 5ms 0 Input 1 selected 1 Input 2 selected 0 Boost disabled B2 B1 B0 IN_SEL BOOST_EN SHDN 1 Boost enabled 0 Device shutdown 1 Device enabled 13 www.ti.com LM48560 TABLE 6. No Clip Control Register BIT NAME VALUE B7 UNUSED X RLT1 (B6) RLT0 (B5) B6:B5 ATK1 (B4) ATK0 (B3) B4:B3 DESCRIPTION Unused, set to 0 B6 B5 Sets Release Time based on CSET. See “Release Time” section. 0 0 TR = 0.5s 0 1 TR = 0.38s 1 0 TR = 0.21s 1 1 TR = 0.17s B4 B3 Sets Attack Time based on CSET. See ”Attack Time” section. 0 0 TA = 0.83ms 0 1 TA = 1.2ms 1 0 TA = 1.5ms 1 PLEV2 (B2) PLEV1 (B1) PLEV0 (B0) B2:B0 TA = 2.2ms 1 B2 B1 B0 Sets output voltage limit level. 0 0 0 Voltage Limit disabled 0 0 1 VTH(VLIM) = 14VP-P 0 1 0 VTH(VLIM) = 17VP-P 0 1 1 VTH(VLIM) = 20VP-P 1 0 0 VTH(VLIM) = 22VP-P 1 0 1 VTH(VLIM) = 25VP-P 1 1 0 VTH(VLIM) = 28VP-P 1 1 1 Voltage Limit disabled TABLE 7. Gain Control Register BIT NAME VALUE DESCRIPTION B7:B2 UNUSED X Unused, set to 0 B1:B0 B1:B0 www.ti.com GAIN1(B1) GAIN0 (B0) GAIN1(B1) GAIN0 (B0) B1 B0 Sets amplifier gain. Boost disabled (BOOST_EN = 0) 0 0 0dB 0 1 6dB 1 0 12dB 1 1 18dB B1 B0 Sets amplifier gain. Boost enabled (BOOST_EN = 1) 0 0 21dB 0 1 24dB 1 0 27dB 1 1 30dB 14 CLASS H OPERATION Class H is a modification of another amplifier class (typically Class B or Class AB) to increase efficiency and reduce power dissipation. To decrease power dissipation, Class H uses a tracking power supply that monitors the output signal and adjusts the supply accordingly. When the amplifier output is below 3VP-P, the nominal boost voltage is 6V. As the amplifier output increases above 3VP-P, the boost voltage tracks the amplifier output as shown in Figure 8. When the amplifier output falls below 3VP-P, the boost converter returns to its nominal output voltage. Power dissipation is greatly reduced compared to conventional Class AB drivers. ATTACK TIME Attack time (tATK) is the time it takes for the gain to be reduced by 6dB once the audio signal exceeds the ALC threshold. Fast attack times allow the ALC to react quickly and prevent transients such as symbol crashes from being distorted. However, fast attack times can lead to volume pumping, where the gain reduction and release becomes noticeable, as the ALC cycles quickly. Slower attack times cause the ALC to ignore the fast transients, and instead act upon longer, louder passages. Selecting an attack time that is too slow can lead to increased distortion in the case of the No Clip function, and possible output overload conditions in the case of the Voltage limiter. The attack time is set by a combination of the value of CSET and the attack time coefficient as given by equation (2): tATK = 20kΩCSET / αATK (1) Where αATK is the attack time coefficient () set by bits B4:B3 in the Voltage Limit Control Register (see ). The attack time coefficient allows the user to set a nominal attack time. The internal 20kΩ resistor is subject to temperature change, and it has tolerance between -11% to +20%. 30150728 FIGURE 8. Class H Operation TABLE 8. Attack Time Coefficient DIFFERENTIAL AMPLIFIER EXPLANATION The LM48560 features a fully differential amplifier. A differential amplifier amplifies the difference between the two input signals. A major benefit of the fully differential amplifier is the improved common mode rejection ratio (CMRR) over single ended input amplifiers. The increased CMRR of the differential amplifier reduces sensitivity to ground offset related noise injection, especially important in noisy systems. B5 B4 αATK 0 0 2.4 0 1 1.7 1 0 1.3 1 1 0.9 AUTOMATIC LEVEL CONTROL (ALC) The ALC is available in software mode only, and only in boosted mode. In hardware mode ALC is always disabled. 15 www.ti.com LM48560 The ALC limits the peak output voltage to the programmed value. Consequently, it limits the peak boost voltage, as this is derived from the output voltage. The ALC is continuous, in that it provides a continuous adjustment of the voltage gain in order to limit the output voltage to the programmed value. The available gain adjustment range is typically 8dB. When the input amplitude is further increased beyond the ALC attenuation range, the output will again increase. This is illustrated in the Typical Performance Graphs, as seen on the 14VPP plot in the Input voltage vs Output Voltage curve. The attack and decay of the ALC is programmed by software and works in conjunction with the external capacitor CSET. Typically CSET is 1μF, although it can be changed from 0.1μF to 4.7μF to select other ranges of attack and decay time. GENERAL AMPLIFIER FUNCTION The LM48560 is a fully differential, Class H piezo driver for ceramic speakers and haptic actuators. The integrated, high efficiency boost converter dynamically adjusts the amplifier’s supply voltage based on the output signal, increasing headroom and improving efficiency compared to a conventional Class AB driver. The fully differential amplifier takes advantage of the increased headroom and bridge-tied load (BTL) architecture, delivering significantly more voltage than a single-ended amplifier. LM48560 internal 20MΩ is subject to temperature change, and it has tolerance between -11% to +20%. RELEASE TIME Release time (tRL) is the time it takes for the gain to return from 6dB to its normal level once the audio signal returns below the ALC threshold. A fast release time allows the ALC to react quickly to transients, preserving the original dynamics of the audio source. However, similar to a fast attack time, a fast release time contributes to volume pumping. A slow release time reduces the effect of volume pumping. The release time is set by a combination of the value of CSET and release time coefficient as given by equation (3): tRL = 20MΩCSET / αRL TABLE 9. Release Time Coefficient B4 0 0 4 0 1 5.3 1 0 9.5 1 1 11.8 BOOST CONVERTER The LM48560 features an integrated boost converter with a dynamic output control. The device monitors the output signal of the amplifier, and adjusts the output voltage of the boost converter to maintain sufficient headroom while improving efficiency. (2) (s) αRL B5 where αRL is the release time coefficient (Table 11) set by bits B4:B3 in the No Clip Control Register. The release time coefficient allows the user to set a nominal release time. The SOFTWARE/HARDWARE MODE Device operation in hardware or software mode is determined by the state of the SW/HW pin. Connect SW/HW to ground for hardware mode, and connect to VDD for software mode. SW/HW 0 1 SDA/SEL SCL/GAIN MODE 0 (Boost Disabled) 0 IN1, Av = 0 1 IN1, Av = 6 1 (Boost Enabled) 0 IN2, Av = 24 1 IN2, Av = 30 SDA SCL I2C Mode GAIN SETTING The LM48560 features four internally configured gain settings 0db, 6dB, and 30dB. The device gain is selected through a single pin (GAIN). The gain settings are shown in Table 10. TABLE 10. Gain Setting GAIN GAIN SETTING IN1 GAIN SETTING IN2 0 0dB 24dB 1 6dB 30dB SHUTDOWN FUNCTION The LM48560 features a low current shutdown mode. Set SD = GND to disable the amplifier and boost converter and reduce supply current to 0.01µA. www.ti.com 16 The LM48560 is compatible with single-ended sources. When configured for single-ended inputs, input capacitors must be used to block and DC component at the input of the device. Figure 9 shows the typical single-ended applications circuit. 30150738 FIGURE 9. Single-Ended Input Configuration the LM48560 (> 1A). This ensures that the inductor does not saturate, preventing excess efficiency loss, over heating and possible damage to the inductor. Additionally, choose an inductor with the lowest possible DCR (series resistance) to further minimize efficiency losses. PROPER SELECTION OF EXTERNAL COMPONENTS ALC Timing (CSET) Capacitor Selection The recommended range value of CSET is between .01μF to 1μF. Lowering the value below .01μF can increase the attack time but LM48560 ALC ability to regulate its output can be disrupted and approaches the hard limiter circuit. This in turn increases the THD+N and audio quality will be severely affected. Diode Selection Use a Schottkey diode as shown in Figure 1. A 20V diode such as the NSR0520V2T1G from On Semiconductor is recommended. The NSR0520V2T1G is designed to handle a maximum average current of 500mA. Power Selection of External Components Proper power supply bypassing is critical for low noise performance and high PSRR. Place the supply bypass capacitors as close to the device as possible. Place a 1µF ceramic capacitor from VDD to GND. Additional bulk capacitance may be added as required. PCB LAYOUT GUIDELINES Minimize trace impedance of the power, ground and all output traces for optimum performance. Voltage loss due to trace resistance between the LM48560 and the load results in decreased output power and efficiency. Trace resistance between the power supply and ground has the same effect as a poorly regulated supply, increased ripple and reduced peak output power. Use wide traces for power supply inputs and amplifier outputs to minimize losses due to trace resistance, as well as route heat away from the device. Proper grounding improves audio performance, minimizes crosstalk between channels and prevents switching noise from interfering with the audio signal. Use of power and ground planes is recommended. Place all digital components and route digital signal traces as far as possible from analog components and traces. Do not run digital and analog traces in parallel on the same PCB layer. If digital and analog signal lines must cross either over or under each other, ensure that they cross in a perpendicular fashion. Boost Converter Capacitor Selection The LM48560 boost converter requires three external capacitors for proper operation: a 1μF supply bypass capacitor, and 1μF + 100pF output reservoir capacitors. Place the supply bypass capacitor as close to VDD as possible. Place the reservoir capacitors as close to VBST and VAMP as possible. Low ESR surface-mount multi-layer ceramic capacitors with X7R or X5R temperature characteristics are recommended. Select output capacitors with voltage rating of 25V or higher. Tantalum, OS-CON and aluminum electrolytic capacitors are not recommended. See Table 4 for suggested capacitor manufacturers. Inductor Selection The LM48560 boost converter is designed for use with a 4.7μH inductor. Choose an inductor with a saturation current rating greater than the maximum operating peak current of 17 www.ti.com LM48560 SINGLE-ENDED INPUT CONFIGURATION LM48560 DEMO BOARD USER GUIDE Quick Start Guide (Hardware Mode): 1. Short pins 1 (VDD) and 2 of JU1 for normal operation. 2. Short pins 2 and 3(GND) of JU7 to set the device in hardware mode. 3. Short pins 2 and 3 (GND) of JU3 to select IN1. 4. Short pins 2 and 3 (GND) of JU2 for 0dB gain. 5. Connect a power supply (2.7V-5.5V) and ground reference respectively to the VDD and GND headers on the demo board. 6. Connect a differential audio input to IN1+ and IN27. Power on the board and observe the output on OUT+ and OUTQuick Start Guide (Software Mode): 1. Short pins 1 (VDD) and 2 of JU1 for normal operation. 2. Short pins 1 (VDD) and 2 of JU7 to set the device in software mode. 3. Short pins 1 (VDD) and 2 of JU3 to select IN2. 4. Short pins 2 and 3 (GND) of JU2 for 24dB gain. 5. Connect a power supply (2.7V-5.5V) and ground reference respectively to the VDD and GND headers on the demo board. 6. Connect a differential audio input to IN1+ and IN27. Connect the USB/I2C board to the LM48560 demo board. 8. Connect the USB/I2C board to a PC 9. Turn on the power supply 10. Launch the LM48560 software GUI 11. Verify that the bottom left corner of the GUI reads “USB Connected ALL ACK” (note 1) 12. Select the following: a. INPUT SELECT = INPUT 1 b. BOOST = ON c. TURN ON TIME = NORMAL d. GAIN = 0dB Note: If the GUI reads “USB I/O error NAK” the device has not been acknowledged, please double check your connections. www.ti.com 18 LM48560 Header Functionality Designator Function VDD VDD Power Supply Notes Ground reference GND GND OUT+ OUTPUT Positive output terminal OUT- OUTPUT Negative output terminal IN1+ INPUT 1 Positive input terminal 1 IN1- INPUT 1 Negative input terminal 1 IN2+ INPUT 2 Positive input terminal 2 IN2- INPUT 2 Negative input terminal 2 JU1 Shutdown Short pin 1 (VDD) and pin 2 for normal operation Short pin 2 and pin 3 (GND) for device shutdown JU2 SCL/Gain Select Hardware mode: Short pin 2 to pin 1 (VDD) for higher gain. Short pin 2 to pin 3(GND) for lower gain. (See Table 10) Software mode: Keep pins 1-3 open. Pin 2 = SCL for I2C communication JU3 SDA/Input Select Hardware mode: Short pin 2 to pin 1 (VDD) to select IN2. Short pin 2 to pin 3 (GND) to select IN1. (See Table 10) Software mode: Keep pins 1-3 open. Pin 2 = SCL for I2C communication JU4 SCL Pullup Short JU4 to connect pullup resistor to VDD. Open to use external I2C supply voltage JU5 SDA pullup Short JU5 to connect pullup resistor to VDD. Open to use external I2C supply voltage JU6 I2C VDD Short JU6 to use VDD as I2C VDD. Open to use external I2C supply voltage JU7 SW/HW Software Mode: Short pins 1 (VDD) and 2 Hardware Mode: Short pins 2 and 3(GND) 19 www.ti.com LM48560 Demo Board Schematic 30150779 www.ti.com 20 LM48560 PC Board Layout 30150771 30150769 Solder Mask Top Top Silk Screen 30150772 30150766 Top Layer Layer 2 30150765 30150764 Layer 3 Drill Drawing 21 www.ti.com LM48560 30150768 30150770 Silk Bottom Solder Mask Bottom 30150763 Bottom Layer www.ti.com 22 LM48560 Revision History Rev Date 1.0 08/16/11 Initial WEB released. Description 1.01 09/21/11 Input edits under CLASS H OPERATION. 1.02 11/01/11 Edited curves 30150753, 54, 55, 56, and Figure 7 (I2C Read Cycle). 1.03 11/10/11 Edited Figure 7. 23 www.ti.com LM48560 Physical Dimensions inches (millimeters) unless otherwise noted Thin micro SMD Order Number LM48560TL NS Package Number TLA16Z1A X1 = 1.970±0.03mm X2 = 1.970±0.03mm X3 = 0.600±0.075mm www.ti.com 24 LM48560 Notes 25 www.ti.com LM48560 High Voltage Class H Ceramic Speaker Driver with Automatic Level Control Notes TI/NATIONAL INTERIM IMPORTANT NOTICE Texas Instruments has purchased National Semiconductor. As of Monday, September 26th, and until further notice, products sold or advertised under the National Semiconductor name or logo, and information, support and interactions concerning such products, remain subject to the preexisting National Semiconductor standard terms and conditions of sale, terms of use of website, and Notices (and/or terms previously agreed in writing with National Semiconductor, where applicable) and are not subject to any differing terms and notices applicable to other TI components, sales or websites. To the extent information on official TI and National websites and business social networking media, etc., pertains to both TI and National-branded products, both companies' instructions, warnings and limitations in the above-referenced terms of use apply. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionicsdefense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com www.ti.com/wireless-apps RF/IF and ZigBee® Solutions www.ti.com/lprf Wireless TI E2E Community Home Page e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright© 2011 Texas Instruments Incorporated www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2011, Texas Instruments Incorporated