LVDS Interface ICs 35bit LVDS Transmitter 35:5 Serializer BU8254GUW No.13057EBT10 ●Description LVDS Interface IC of ROHM "Serializer" "Deserializer" operate from 8MHz to 150MHz wide clock range, and number of bits range is from 35 to 70. Data is transmitted seven times (7X) stream and reduce cable number by 3(1/3) or less. The ROHM's LVDS has low swing mode to be able to expect further low EMI. ●Features 1) 35bits data of parallel LVCMOS level inputs are converted to five channels of LVDS data stream. 2) 30bits of RGB data and 5bits of timing and control data(HSYNC,VSYNC,DE,CNTL1,CNTL2) are transmitted up to 784Mbps effective rate per LVDS channel. 3) Support clock frequency from 8MHz up to 112MHz. 4) Support consumer video format including 480i, 480P, 720P and 1080i as well. 5) Clock edge selectable 6) Power down mode 7) Support spread spectrum clock generator. 8) Support reduced swing LVDS for low EMI. 9) 30bit LVDS receiver is recommended to use BU90R104. ●Applications Flat Panel Display ●Precaution ■This chip is not designed to protect from radioactivity. ■The chip is made strictly for the specific application or equipment. Then it is necessary that the unit is measured as need. ■This document may be used as strategic technical data which subjects to COCOM regulations. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. 1/17 2013.06 - Rev.B Technical Note BU8254GUW ●Block Diagram CLKIIN (8～112MHz) PLL ＋ － Parallel to Serial ＋ － TA P/N Parallel to Serial ＋ － TB P/N Parallel to Serial ＋ － TC P/N Parallel to Serial ＋ － TD P/N Parallel to Serial ＋ － TE P/N Data Clocks 7 TA6-TA0 7 TB6-TB0 7 TC6-TC0 7 TD6-TD0 7 TE6-TE0 TCLK P/N (8～112MHz) RS RF XRST Fig.1 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. Block Diagram 2/17 2013.06 - Rev.B Technical Note BU8254GUW ●VBGA099W060 Package Outline and Specification 1PIN MARK 6.0 ±0.1 6 .0 ±0 .1 8254GUW 0.9MAX 0.1 Lot No. S 0. 7 5 ±0 .1 0.08 S P=0.5×9 0.75 ±0 .1 A 0.5 99 -φ 0.295 ±0 .05 0 . 0 5 M S AB K J B G F E P=0.5×9 H 0.5 D C B A 1 2 3 4 5 6 7 8 9 10 (UNIT : mm) number of balls : 99 Fig.2 VBGA099W060 Package Outline and Specification www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. 3/17 2013.06 - Rev.B Technical Note BU8254GUW ●Pin configuration 1 2 3 4 5 6 7 8 9 10 A (NC) TAN TAP TBP TCN TCLKN TDN TEN (NC) (NC) B (NC) (NC) TBN LVDSVDD TCP TCLKP TDP TEP (NC) (NC) C (1PIN) (NC) LVDSGND LVDSGND (NC) (NC) LVDSGND (NC) PLLVDD PLLGND D TA5 TA1 TA0 TA2 (NC) (NC) TE6 (NC) (NC) (NC) E TB0 TA4 TA3 GND TA6 (NC) XRST TE5 GND CLK_IN F TB2 TB1 RS TB3 (NC) TE3 VDD TE1 TE2 TE4 G TB4 (NC) GND TB5 (NC) (NC) TE0 (NC) GND TD6 H (NC) (NC) (NC) (NC) TC4 (NC) (NC) (NC) (NC) TD5 J (NC) TB6 VDD TC2 GND TC6 RF TD2 TD4 (NC) K (NC) TC0 TC1 TC3 TC5 TD0 TD1 TD3 (NC) (NC) Fig.3 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. Pin Diagram (Top View) 4/17 2013.06 - Rev.B Technical Note BU8254GUW ●Pin Description Table 1 : Pin Description Pin Name Pin No. Type Descriptions TAP, TAN A3,A2 LVDS OUT TBP, TBN A4,B3 LVDS OUT TCP, TCN B5,A5 LVDS OUT TDP, TDN B7,A7 LVDS OUT TEP, TEN B8,A8 LVDS OUT TCLKP, TCLKN B6,A6 LVDS OUT TA0～TA6 D3,D2,D4,E3,E2,D1,E5 IN TB0～TB6 E1,F2,F1,F4,G1,G4,J2 IN TC0～TC6 K2,K3,J4,K4,H5,K5,J6 IN TD0～TD6 K6,K7,J8,K8,J9,H10,G10 IN TE0～TE6 G7,F8,F9,F6,F10,E8,D7 IN XRST E7 IN LVDS data out. LVDS clock out. Pixel data inputs. H : Normal operation, L : Power down (all outputs are Hi-Z) *1 LVDS swing mode, VREF select. RS RS F3 IN LVDS Swing Small Swing Input Support VDD 350mV N/A 0.6～1.4V 350mV RS-VREF GND 200mV N/A *1 VREF is Input Reference Voltage. Input clock triggering edge select. H : Rising edge, L : Falling edge. RF J7 IN VDD F7,J3 Power CLKIN E10 IN GND E4,E9,G3,G9,J5 Ground Ground pins for LVCMOS inputs and digital core. LVDS VDD B4 Power Power supply pins for LVDS outputs. LVDS GND C3,C4,C7 Ground Ground pins for LVDS outputs. PLLVDD C9 Power Power supply pin for PLL core. PLLGND C10 Ground Ground pins for PLL core. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. Power supply pins for LVCMOS inputs and digital core. Clock input. 5/17 2013.06 - Rev.B Technical Note BU8254GUW ●Electrical characteristics ■Rating Table 2 : Absolute Maximum Rating Parameter Rating Symbol Min Max Units Supply Voltage VDD -0.3 4.0 V Input Voltage VIN -0.3 VDD+0.3 V Output Voltage VOUT -0.3 VDD+0.3 V Storage Temperature Range Tstg -55 125 ℃ Table 3 : Package Power PACKAGE Power Dissipation (mW) De-rating (mW/℃) 380 *1 3.8 VBGA099W060 880 *1: *2: *2 8.8 *2 At temperature Ta >25℃ Package power when mounting on the PCB board. The size of PCB board :70×70×1.6(mm3) The material of PCB board :The FR4 glass epoxy board.(3% or less copper foil area) (It is recommended to apply the above package power requirement to PCB board when the small swing input mode is used) Table 4 : Recommended Operating Conditions Parameter Supply Voltage Operating Temperature Range www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. Symbol VDD Rating Units Conditions Mi n Typ Max 3.0 3.3 3.6 V VDD,LVDSVDD,PLLVDD -20 - 85 ℃ 0 - 70 ℃ Clock frequency from 8MHz up to 90MHz Cock frequency from 90MHz up to 112MHz Topr 6/17 2013.06 - Rev.B Technical Note BU8254GUW ■DC characteristics Table 5 : LVCMOS DC Specifications(VDD=3.0V～3.6V, Ta=-20℃～85℃) Rating Parameter Symbol Min Typ Max Units Conditions High Level Input Voltage VIH VDD×0.8 - VDD V Low Level Input Voltage VIL GND - VDD×0.2 V High Level Input Voltage VIHRS VDD×0.8 - VDD Low Level Input Voltage VILRS GND - 0.2 1.2 - 2.8 V - VDDQ/2 - - Small Swing(RS=VDDQ/2) *2 VDDQ/2 +200mV - - V VREF=VDDQ/2 *2 - - VDDQ/2 -200mV V VREF=VDDQ/2 -10 - +10 µA 0V≤ VIN≤ VDD exclude RS pin RS pin Small Swing Voltage Input Reference Voltage Small Swing High Level Input Voltage Small Swing Low Level Input Voltage Input Current VDDQ *1 VREF VSH VSL IINC *1: VDDQ voltage defines max voltage of small swing input. It is not an actual input voltage. *2: Small swing signal is applied to TA[6:0], TB[6:0], TC[6:0], TD[6:0] TE[6:0], CLKIN. Table 6 : LVDS Transmitter DC Specifications(VDD=3.0V～3.6V, Ta=-20℃～85℃) Rating Parameter Symbol Min Min Min Units Conditions Normal swing RS=VDD Reduced swing RS=GND 250 350 450 mV 100 200 300 mV ΔVOD - - 35 mV VOC 1.125 1.25 1.375 V Change in VOC between complementary output states ΔVOC - - 35 mV Output Short Circuit Current IOS - - -24 mA VOUT=0V, RL=100Ω Output TRI-STATE Current IOZ -10 - +10 µA XRST=0V, VOUT=0V to VDD Differential Output Voltage Change in VOD between complementary output states Common Mode Voltage www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. VOD RL=100Ω 7/17 RL=100Ω 2013.06 - Rev.B Technical Note BU8254GUW ■Supply Current Table 7 : Supply Current Rating Parameter Transmitter Supply Current Transmitter Supply Current Transmitter Power Down Supply Current Symbol Units Typ Max - 57 - mA - 42 - mA - 62 - mA RL=100Ω,CL=5pF VDD=3.3V,RS=VDD Worst Case pattern f=85MHz - 45 - mA RL=100Ω,CL=5pF VDD=3.3V,RS=GND Worst Case pattern f=85MHz - - 10 µA XRST=L ITCCG ITCCW ITCCS www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. Conditions Min 8/17 RL=100Ω,CL=5pF VDD=3.3V,RS=VDD Gray Scale Pattern RL=100Ω,CL=5pF VDD=3.3V,RS=GND Gray Scale Pattern f=85MHz f=85MHz 2013.06 - Rev.B Technical Note BU8254GUW Gray Scale Pattern CLKOUT Rx0 Rx1 Rx2 Rx3 Rx4 Rx5 Rx6 X=A,B,C,D,E Fig.4 Gray scale pattern Worst Case Pattern (Maximum Power condition) CLKOUT Rx0 Rx1 Rx2 Rx3 Rx4 Rx5 Rx6 X=A,B,C,D,E Fig.5 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. Worst Case Pattern 9/17 2013.06 - Rev.B Technical Note BU8254GUW ■AC characteristics Table 8 : Switching Characteristics Symbol Min Typ Max Units CLK IN Transition time tTCIT - - 5.0 ns CLK IN Period tTCP 8.93 - 125.0 ns CLK IN High Time tTCH 0.35tTCP 0.5tTCP 0.65tTCP ns CLK IN Low Time tTCL 0.35tTCP 0.5tTCP 0.65tTCP ns CLK IN to TCLK+/-Delay tTCD - tTCP - ns LVSMOS Data Set up to CLK IN tTS 2.5 - - ns LVCMOS Data Hold from CLK IN tTH 0 - - ns LVDS Transition Time tLVT - 0.6 1.5 ns Output Data Position 0 tTOP1 -0.2 0.0 +0.2 ns Output Data Position 1 tTOP0 Output Data Position 2 tTOP6 Output Data Position 3 tTOP5 Output Data Position 4 tTOP4 Output Data Position 5 tTOP3 Output Data Position 6 tTOP2 tTCP -0.2 7 tTCP 2 -0.2 7 tTCP 3 -0.2 7 tTCP 4 -0.2 7 tTCP 5 -0.2 7 tTCP 6 -0.2 7 tTCP 7 tTCP 2 7 tTCP 3 7 tTCP 4 7 tTCP 5 7 tTCP 6 7 tTCP +0.2 7 tTCP 2 +0.2 7 tTCP 3 +0.2 7 tTCP 4 +0.2 7 tTCP 5 +0.2 7 tTCP 6 +0.2 7 Phase Locked Loop Set Time tTPLL - - 10.0 Parameter www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. 10/17 ns ns ns ns ns ns ms 2013.06 - Rev.B Technical Note BU8254GUW ●AC Timing ■AC Timing Diagrams LVCMOS Input 90% 90% CLKIN 10% 10% tTCIT tTCIT LVCMOS Output LVDS Output Vdiff=(TAP)-(TAN) TAP 80% RL Vdiff 80% 20% 20% TAN tLVT LVDS Output Load tLVT LVCMOS Input tTCP tTCH CLKIN VDD/2 RF=L VDD/2 VDD/2 RF=H tTCL tTH tTS Tx0-Tx6 VDD/2 VDD/2 tTCD TCLKP VOC TCLKN Fig.6 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. AC Timing Diagrams 11/17 2013.06 - Rev.B Technical Note BU8254GUW ■Small Swing Inputs tTCP tTCH RF=L CLKIN VDDQ/2 VDDQ/2 VDDQ/2 tTCL tTS VREF RF=H tTH VDDQ Tx0-Tx6 VDDQ/2 VDDQ/2 VREF GND tTCD TCLKP VOC TCLKN Fig.7 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. Small Swing Inputs 12/17 2013.06 - Rev.B Technical Note BU8254GUW ■AC Timing Diagrams LVDS Output TCLK OUT (Differential) TAP/N TA6 TA5 TA4 TA3 TA2 TA1 TA0 TBP/N TB6 TB5 TB4 TB3 TB2 TB1 TB0 TCP/N TC6 TC5 TC4 TC3 TC2 TC1 TC0 TDP/N TD6 TD5 TD4 TD3 TD2 TD1 TD0 TEP/N TE6 TE5 TE4 TE3 TE2 TE1 TE0 Previous Cycle tTOP1 tTOP0 tTOP6 tTOP5 tTOP4 tTOP3 tTOP2 Fig.8 AC Timing Diagrams ■Phase Locked Loop Set Time 2.0V XRST 3.6V 3.0V tTPLL VDD CLKIN Vdiff=0V TCLKP/N Fig.9 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. Phase Locked Loop Set Time 13/17 2013.06 - Rev.B Technical Note BU8254GUW ●System Timing Requirement System Timing Requirement is mandatory by following two methods. ①The method of using CR circuit.( In the case that CLK does not stop after power supply) ② The method of using external specific IC. (In the case that CLK turns on/off after power supply) It is recommend to do enough examination for target application. ① The method of using CR circuit.( In the case that CLK does not stop after power supply) PVDD V DD V DD schottky barrier diode 10KΩ LVDD VDD 220Ω Be careful of temperature of the capacitor especially over and again. Recommend after VDD up XRS 2.2μF XRST Recommend after VDD up and before XRST release B characteristic ceramics and polymer aluminum are recommended. CLK If unused connect to GND td is apporoximately equal to 20ms when the left RC coleus applied Fig.10 The method of using CR circuit ②The method of using external specific IC. (In the case that CLK turns on/off after power supply) VDD PVDD VDD external specific IC LVDD XRST VOUT CLK VDD VIN Recommend after VDD up Recommend after CLK input Recommend after VDD up and before XRST release Recommend before XRST release XRST GND CLK (CLK monitor and RST signal generation) Fig.11 The method of using external specific IC. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. 14/17 2013.06 - Rev.B Technical Note BU8254GUW ●10bit LVCMOS Level Input Example: BU8254GUW ： LVCMOS level input/Falling edge/Normal swing BU90R104 ： Falling edge VDD F.Bead *1 VDD GND 0.1uF 0.01uF CLKIN R4 R5 R6 R7 R8 R9 G4 G5 G6 G7 G8 G9 B4 B5 B6 B7 B8 B9 HSYNC VSYNC DE R2 R3 G2 G3 B2 B3 CLKIN TA0 TA1 TA2 TA3 TA4 TA5 TA6 TB0 TB1 TB2 TB3 TB4 TB5 TB6 TC0 TC1 TC2 TC3 TC4 TC5 TC6 TD0 TD1 TD2 TD3 TD4 TD5 TD6 TE0 TE1 TE2 TE3 TE4 TE5 TE6 R0 R1 G0 G1 B0 B1 XRST LVDD LVDS VDD 0.1uF 0.01uF LGND PLL VDD PVDD PLL GND 0.1uF 0.01uF 0.1uF 0.01uF TAN 100Ω TAP TBN 100Ω TBP TCN 100Ω TCP TCLKN 100Ω TCLKP TDN 100Ω TDP TEN 100Ω TEP XRST RS *2 *1 : Recommended Parts: F.Bead : BLM18A-Series (Murata Manufacturing) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. RARA+ RBRB+ RCRC+ RCLKRCLK+ RDRD+ RERE+ CLKOUT RA0 RA1 RA2 RA3 RA4 RA5 RA6 RB0 RB1 RB2 RB3 RB4 RB5 RB6 RC0 RC1 RC2 RC3 RC4 RC5 RC6 RD0 BU90 90R 90R104 RD1 BU RD2 RD3 RD4 RD5 RD6 RE0 RE1 RE2 RE3 RE4 RE5 RE6 0.1uF 0.01uF CLKOUT R4 R5 R6 R7 R8 R9 G4 G5 G6 G7 G8 G9 B4 B5 B6 B7 B8 B9 HSYNC VSYNC DE R2 R3 G2 G3 B2 B3 OPEN R0 R1 G0 G1 B0 B1 OPEN PD OE DK R/F R/F PCB(Transmitter) PGND VDD GND PD OE 100Ωtwist pair Cable or PCB trace VDD 0.1uF 0.1uF 0.01uF LVDS GND BU8254 8254GUW 8254GUW BU VDD F.Bead *1 PCB(Receiver) *2 : 15/17 If RS pin is tied to VDD, LVDS swing is 350m V. If RS pin is tied to GND, LVDS swing is 200m V. 2013.06 - Rev.B Technical Note BU8254GUW ●10bit Small Swing Input Example: BU8254GUW ： LVCMOS level input/Falling edge/Normal swing BU90R104 ： Falling edge VDD F.Bead VDD GND 0.1uF 0.01uF LVDS VCC LVDS VDD 0.1uF 0.01uF CLKIN R4 R5 R6 R7 R8 R9 G4 G5 G6 G7 G8 G9 B4 B5 B6 B7 B8 B9 HSYNC VSYNC DE R2 R3 G2 G3 B2 B3 CLKIN TA0 TA1 TA2 TA3 TA4 TA5 TA6 TB0 TB1 TB2 TB3 TB4 TB5 TB6 TC0 TC1 TC2 TC3 TC4 TC5 TC6 TD0 TD1 TD2 TD3 TD4 TD5 TD6 TE0 TE1 TE2 TE3 TE4 TE5 TE6 R0 R1 G0 G1 B0 B1 XRST VCC F.Bead CLKOUT RA0 RA1 RA2 RA3 PLL VCC RA4 RA5 PLL GND RA6 RB0 RB1 RB2 RARB3 RB4 RA+ RB5 RB6 RBBU90 BU90R 90R104 RC0 RC1 RB+ RC2 RC3 RCRC4 RC5 RC+ RC6 RD0 RCLKRD1 RD2 RCLK+ RD3 RD4 RDRD5 RD6 RD+ RE0 RE1 RERE2 RE3 RE+ RE4 RE5 RE6 LVDS GND PLL VDD 0.1uF 0.01uF 0.1uF 0.01uF TAN 100Ω TAP BU8254 BU8254GUW 8254GUW 0.1uF 0.01uF 0.1uF 0.01uF LVDS GND PLL GND VCC GND TBN 100Ω TBP TCN 100Ω TCP TCLKN 100Ω TCLKP TDN 100Ω TDP TEN 100Ω TEP XRST XRST OE 100Ωtwist pair Cable or PCB trace *2 RS *1 CLKOUT R4 R5 R6 R7 R8 R9 G4 G5 G6 G7 G8 G9 B4 B5 B6 B7 B8 B9 HSYNC VSYNC DE R2 R3 G2 G3 B2 B3 OPEN R0 R1 G0 G1 B0 B1 OPEN XRST OE TEST R/F R/F PCB(Receiver) PCB(Transmitter) *3 : Recommended Parts: F.Bead : BLM18A-Series (Murata Manufacturing) *4 : RS pin acts as VREF input pin when input voltage is set to half of high level signal input. We recommend to locate by-pass condenser near the RS pin. VDD R1 15k R2 5.6k RS pin C1=0.1uF Fig.12 Example for LVCMOS(1.8V input)(R1,R2)=(1.5kΩ,5.6kΩ) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. 16/17 2013.06 - Rev.B Technical Note BU8254GUW ●Ordering Part Number B U 8 Part No. 2 5 4 G Part No. U W Package GUW: VBGA099W060 Packaging and forming specification None:Tray VBGA099W060 1PIN MARK <Tape and Reel information> 0.08 S P=0.5×9 0.5 Tape Embossed carrier tape (with dry pack) Quantity 2500pcs Direction of feed S E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 0.75±0.1 B 1 2 3 4 5 6 7 8 910 0.75± 0.1 K J H G F E D C B A P=0.5× 9 A 0.5 99- φ 0.295± 0.05 φ 0.05 M S AB 0.1 0.9MAX 6.0 ±0.1 6.0±0.1 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. 1pin (Unit : mm) Reel 17/17 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2013.06 - Rev.B Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BU8254GUW - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BU8254GUW VBGA099W060 2000 2000 Taping inquiry Yes