Material Content Data Sheet Sales Product Name BSC190N15NS3 G MA# MA001398098 Package PG-TDSON-8-1 Issued 7. September 2015 Weight* 122.22 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal noble metal non noble metal inorganic material non noble metal non noble metal inorganic material non noble metal < 10% silicon iron phosphorus copper copper carbon black epoxy resin silicondioxide tin silver silver tin lead silver iron phosphorus copper iron phosphorus copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 7440-22-4 7439-89-6 7723-14-0 7440-50-8 7439-89-6 7723-14-0 7440-50-8 4.419 3.62 0.038 0.03 wire encapsulation leadfinish plating solder CLIP plating heatspreader heat sink CLIP *deviation Sum [%] Average Mass [ppm] Sum [ppm] 3.62 36152 36152 309 0.011 0.01 37.762 30.88 30.92 308961 93 309363 0.065 0.05 0.05 536 536 0.080 0.07 652 5.661 4.63 34.125 27.92 32.62 279204 326173 1.470 1.20 1.20 12026 12026 0.166 0.14 0.14 1354 1354 0.087 0.07 0.070 0.06 3.324 2.72 2.85 27199 28481 1.289 1.06 1.06 10550 10550 0.011 0.01 0.003 0.00 11.320 9.26 0.022 0.02 0.007 0.01 22.292 18.24 46317 712 570 93 28 9.27 92619 55 18.27 182387 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 92740 183 182625 1000000