CALMIRCO CM1423-01CS Secure digital (sd) card emi filter array with esd protection Datasheet

CM1423
Secure Digital (SD) Card EMI Filter Array with ESD Protection
Features
Product Description
•
California Micro Devices's CM1423 is an EMI filter
array with ESD protection, which integrates six Pi- filters (C-R-C) and four channels of ESD protection. The
CM1423’s filters have component values of 12pF100Ω-12pF. The part includes ESD protection diodes
on every pin, which provide a very high level of protection for sensitive electronic components that may be
subjected to electrostatic discharge (ESD). All the
ESD diodes are designed and characterized to safely
dissipate ESD strikes of ±15kV, beyond the maximum
requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are
protected for contact discharges at greater than ±30kV.
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•
•
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•
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Provides EMI filtering and ESD protection for an
SD port on a mobile device
Six channels of EMI filtering with ESD protection
Four channels of ESD protection
±15kV ESD protection on all I/O pins (IEC 610004-2, contact discharge)
±30kV ESD protection (HBM)
Better than 25dB of attenuation at 1GHz for 12pF100Ω -12pF filter configuration
Integrates 34 components into small form factor
CSP solution
20-bump, 4.000mm x 1.458mm footprint
Chip Scale Package
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
Available with OptiGuard™ coated version for
improved reliability at assembly
Lead-free version available
Applications
•
•
•
•
Secure Digital (SD) Card data lines in mobile
handsets
SD Card interface protection for other mobile electronics such as MP3 players, PDAs and digital
cameras
I/O port protection for mobile handsets, notebook
computers, PDAs etc.
EMI filtering for data ports in cell phones, PDAs or
notebook computers.
This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package format and easyto-use pin assignments. In particular, the CM1423 is
ideal for EMI filtering and protecting data lines from
ESD for the Secure Digital (SD) Card interface slot in
mobile handsets. The CM1423 is an all-inclusive solution for the SD card interface since its EMI filters provide the proper cut-off frequency to attenuate
unwanted signals.
The CM1423 is manufactured in a space-saving, lowprofile, chip-scale package, and is optionally available
with OptiGuard™ coating for improved reliability. It is
also available with lead-free finishing.
Electrical Schematic
DAT 2
100Ω
A1
12pF
DAT 3
100Ω
A2
12pF
CLK
100Ω
A5
12pF
C2
DAT 3
DAT 0
CMD
DAT 1
12pF
C7
12pF
VSS1*
A4
C4
A6
C6
VDD*
DAT 0
ESD*
VSS2*
12pF
100Ω
A8
CLK
12pF
12pF
C3
C5
100Ω
A7
12pF
100Ω
A3
DAT 2
12pF
12pF
CMD
C1
C8
12pF
DAT 1
* In a typical SD Card application, A4 (A6)
is connected to C4 (C6). See example
given in applications section.
© 2005 California Micro Devices Corp. All rights reserved.
01/12/05
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
1
CM1423
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
TOP VIEW
(Bumps Up View)
(Bumps Down View)
Orientation
Marking
(see note 2)
1
2
3
4
5
6
7
8
A
DAT2
DAT3
CMD
VDD
CLK
VSS2
DAT0
C1
C2
C3
C4
C5
C6
C7
N231
B
Orientation
Marking
C
DAT1
C8
GND
GND
GND
GND
B1
B2
B3
B4
A1
A2
A3
A4
A5
A6
A7
A8
A1 DAT2
DAT3
CMD
VSS1
CLK
ESD
DAT0
DAT1
DAT1
CM1423-01 Chip Scale Package (non-coated)
Orientation
Marking
(see note 2)
1
2
3
4
5
6
7
8
A
DAT2
DAT3
CMD
VDD
CLK
VSS2
DAT0
C1
C2
C3
C4
C5
C6
C7
N233
B
Orientation
Marking
C
C8
GND
GND
GND
GND
B1
B2
B3
B4
A1
A2
A3
A4
A5
A6
A7
A8
A1 DAT2
DAT3
CMD
VSS1
CLK
ESD
DAT0
DAT1
CM1423-03 Chip Scale Package (OptiGuard™ coated)
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN(s)
NAME
DESCRIPTION
PIN(s)
NAME
DESCRIPTION
A1
DAT2
DATA2 Filter+ESD Channel, System Side
C1
DAT2
DATA2 Filter+ ESD Channel, SD Card Side
A2
DAT3
DATA3 Filter+ESD Channel, System Side
C2
DAT3
DATA3 Filter+ ESD Channel, SD Card Side
A3
CMD
CMD Signal Filter+ESD Channel, System
Side
C3
CMD
CMD Signal Filter+ESD Channel, SD Card Side
A4
VSS1
ESD-only Channel, Supply Voltage Ground
C4
VDD
ESD-only Channel, Supply Voltage
A5
CLK
Clock Filter + ESD Channel
C5
CLK
Clock Filter + ESD Channel
A6
ESD
ESD-only Channel
C6
VSS2
Supply Voltage Ground
A7
DAT0
DATA0 Filter+ ESD Channel, System Side
C7
DAT0
DATA0 Filter+ ESD Channel, SD Card Side
A8
DAT1
DATA1 Filter+ ESD Channel, System Side
C8
DAT1
DATA1 Filter+ ESD Channel, SD Card Side
B1-B4
GND
Device Ground
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish2
Standard Finish
OptiguardTM Coated
No Coating
Ordering Part
OptiguardTM Coated
No Coating
Number1
Number1
Part
Marking
Ordering Part
Number1
Part
Marking
Ordering Part
PKG
Part
Marking
Ordering Part
Bumps
Number1
Part
Marking
20
CSP
CM1423-01CS
N231
CM1423-03CS
N233
CM1423-01CP
N231
CM1423-03CP
N233
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2005 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
01/12/05
CM1423
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
-65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
500
mW
RATING
UNITS
-40 to +85
°C
Storage Temperature Range
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)
SYMBOL
PARAMETER
CONDITIONS
R
Resistance
C
Capacitance
At 2.5V DC, 1MHz, 30mV
AC
Diode Standoff Voltage
IDIODE = 10µA
ILEAK
Diode Leakage Current (reverse bias)
VDIODE = 3.3V
VSIG
Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
ILOAD = -10mA
VESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Notes 2,4 and 5
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2,3,4 and 5
Cut-off Frequency
ZSOURCE=50Ω, ZLOAD=50Ω
R = 100Ω, C = 12pF;
Note 5
VDIODE
VCL
fC
MIN
TYP
MAX
UNITS
80
100
120
Ω
9
12
15
pF
5.5
V
100
5.6
-1.5
6.8
-0.8
nA
9.0
-0.4
V
V
±30
kV
±15
kV
+12
-7
V
V
145
MHz
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open
Note 5: These parameters are guaranteed by design and characterization.
© 2005 California Micro Devices Corp. All rights reserved.
01/12/05
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
3
CM1423
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. A1-C1 EMI Filter Performance
Figure 2. A2-C2 EMI Filter Performance
© 2005 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
01/12/05
CM1423
Performance Information (cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 3. A3-C3 EMI Filter Performance
Figure 4. A5-C5 EMI Filter Performance
© 2005 California Micro Devices Corp. All rights reserved.
01/12/05
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
5
CM1423
Performance Information (cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 5. A7-C7 EMI Filter Performance
Figure 6. A8-C8 EMI Filter Performance
© 2005 California Micro Devices Corp. All rights reserved.
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430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
01/12/05
CM1423
Performance Information
Figure 7. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5VDC and 25°C)
© 2005 California Micro Devices Corp. All rights reserved.
01/12/05
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
7
CM1423
Application Information
CHIPSET SIDE
CM1423
100k
A1
DAT2
FILTER+ESD
CONNECTOR SIDE
C1
DAT2
100k
A2
DAT3
FILTER+ESD
C2
CD/DAT3
10k
A3
CMD
FILTER+ESD
A4
VSS1
C3
C4
SD Memory Card
CMD
VDD
100k
A5
CLK
FILTER+ESD
A6
ESD
C5
C6
(top view, card contacts
are on the bottom side)
CLK
VSS2
9 = DAT2
1 = CD/DAT3
2 = CMD
3 = VSS1 (GND)
4 = VDD
5 = CLK
6 = VSS2 (GND)
7 = DAT0
8 = DAT1
100k
A7
DAT0
FILTER+ESD
C7
DAT0
100k
DAT1
A8
FILTER+ESD
C8
DAT1
Note: 100kΩ and 10kΩ pull-up resistors are not included in CM1423. Designer will
need to determine the appropriate pull-up resistor value for each design.
Figure 8. Typical SD Card Application
© 2005 California Micro Devices Corp. All rights reserved.
8
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
01/12/05
CM1423
Application Information (cont’d)
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50µm
Solder Ball Side Coplanarity
+20µm
Maximum Dwell Time Above Liquidous
60 seconds
Soldering Maximum Temperature
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 9. Recommended Non-Solder Mask Defined Pad Illustration
Temperature (°C)
250
200
150
100
50
0
Figure 10. Eutectic (SnPb) Solder
Ball Reflow Profile
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 11. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2005 California Micro Devices Corp. All rights reserved.
01/12/05
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
9
CM1423
Mechanical Details
CM1423Mechanical Specifications
Mechanical Package Diagrams
The package dimensions for the CM1423-01 and the
CM1423-03 are presented below.
CM1423-01 (non-coated CSP)
BOTTOM VIEW
A1
PACKAGE DIMENSIONS
Custom CSP
Bumps
20
C
Min
Nom
B
Inches
Max
Min
Nom
A
Max
3.955 4.000 4.045 0.1557 0.1575 0.1593
A2
1.413 1.458 1.503 0.0556 0.0574 0.0592
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.245 0.250 0.255 0.0096 0.0098 0.0100
B3
0.430 0.435 0.440 0.0169 0.0171 0.0173
B4
0.430 0.435 0.440 0.0169 0.0171 0.0173
C1
0.200 0.250 0.300 0.0079 0.0098 0.0118
C2
0.244 0.294 0.344 0.0096 0.0116 0.0135
D1
0.561 0.605 0.649 0.0221 0.0238 0.0255
D3
0.600 0.670 0.739 0.0236 0.0264 0.0291
D4
0.394 0.445 0.495 0.0155 0.0175 0.0195
# per tape and
reel
2
3
4
5
7
6
8
D1
D2
CM1423-03 (OptiGuard™-coated CSP)
OptiGuardTM
Coating
BOTTOM VIEW
A1
C1
B2
B1
C
B
A
A
1
2
3
4
5
7
6
8
D3
D4
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
3500 pieces
Controlling dimension: millimeters
A2
0.355 0.380 0.405 0.0140 0.0150 0.0159
1
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
C2
D2
A
B4
B3
A1
A2
Millimeters
C2
Dim
SIDE
VIEW
B2
B1
B4
B3
Package
C1
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for CM1423
Chip Scale Package
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1423-01
4.00 X 1.46 X 0.60
4.11 X 1.57 X 0.76
12mm
330mm (13")
3500
4mm
4mm
CM1423-03
4.00 X 1.46 X 0.67
4.11 X 1.57 X 0.76
12mm
330mm (13")
3500
4mm
4mm
Po
Top
Cover
Tape
10 Pitches Cumulative
Tolerance On Tape
±0.2 mm
Ao
W
Bo
Ko
For Tape Feeder Reference
Only including Draft.
Concentric Around B.
Embossment
P1
Center Lines
of Cavity
User Direction of Feed
Figure 12. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
10
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214 ▲ Fax: 408.263.7846 ▲ www.calmicro.com
01/12/05
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