MX27C512 512K-BIT [64Kx8] CMOS EPROM FEATURES • • • • • • 64K x 8 organization Single +5V power supply +12.5V programming voltage Fast access time: 45/55/70/90/100/120/150ns Totally static operation Completely TTL compatible • Operating current: 30mA • Standby current: 100uA • Package type: - 28 pin plastic DIP - 32 pin PLCC - 28 pin 8 x 13.4 mm TSOP(I) GENERAL DESCRIPTION The MX27C512 is a 5V only, 512K-bit, One-Time Programmable Read Only Memory. It is organized as 64K words by 8 bits per word, operates from a single +5volt supply, has a static standby mode, and features fast single address location programming. All programming signals are TTL levels, requiring a single pulse. For programming outside from the system, existing EPROM programmers may be used. The MX27C512 supports intelligent fast programming algorithm which can result in programming time of less than fifteen seconds. PIN CONFIGURATIONS BLOCK DIAGRAM A6 32 A13 1 A14 VCC A15 4 NC 5 30 29 A9 A11 A2 25 MX27C512 OE/VPP A1 A10 A0 CE 21 20 Q4 Q3 NC GND 17 22 23 24 25 26 27 28 1 2 3 4 5 6 7 P/N: PM0235 MX27C512 Q0~Q7 . . . . . Y-DECODER X-DECODER . . . . . . . . Y-SELECT 512K BIT CELL MAXTRIX Q6 VCC GND Q5 13 14 PIN DESCRIPTION 8 x 13.4mm 28TSOP(I) OE/VPP A11 A9 A8 A13 A14 VCC A15 A12 A7 A6 A5 A4 A3 A0~A15 ADDRESS INPUTS Q7 NC Q0 . . . NC 9 OUTPUT BUFFERS A8 A4 A3 CONTROL LOGIC CE OE/VPP A5 Q2 VCC A14 A13 A8 A9 A11 OE/VPP A10 CE Q7 Q6 Q5 Q4 Q3 A7 28 27 26 25 24 23 22 21 20 19 18 17 16 15 Q1 MX27C512 1 2 3 4 5 6 7 8 9 10 11 12 13 14 A12 PLCC PDIP A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 GND This EPROM is packaged in industry standard 28 pin dual-in-line packages 32 lead PLCC, and 28 lead TSOP(I) packages. 21 20 19 18 17 16 15 14 13 12 11 10 9 8 A10 CE Q7 Q6 Q5 Q4 Q3 GND Q2 Q1 Q0 A0 A1 A2 SYMBOL PIN NAME A0~A15 Address Input Q0~Q7 Data Input/Output CE Chip Enable Input OE/VPP Output Enable Input/Program Supply Voltage 1 NC No Internal Connection VCC Power Supply Pin (+5V) GND Ground Pin REV. 4.8, AUG. 26, 2003 MX27C512 FUNCTIONAL DESCRIPTION AUTO IDENTIFY MODE THE PROGRAMMING OF THE MX27C512 The auto identify mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and device type. This mode is intended for use by programming equipment for the purpose of automatically matching the device to be programmed with its corresponding programming algorithm. This mode is functional in the 25°C ± 5°C ambient temperature range that is required when programming the MX27C512. When the MX27C512 is delivered, or it is erased, the chip has all 512K bits in the "ONE" or HIGH state. "ZEROs" are loaded into the MX27C512 through the procedure of programming. For programming, the data to be programmed is applied with 8 bits in parallel to the data pins. Vcc must be applied simultaneously or before Vpp, and removed simultaneously or after Vpp. When programming an MXIC EPROM, a 0.1uF capacitor is required across Vpp and ground to suppress spurious voltage transients which may damage the device. To activate this mode, the programming equipment must force 12.0 ± 0.5(VH) on address line A9 of the device. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during auto identify mode. FAST PROGRAMMING Byte 0 ( A0 = VIL) represents the manufacturer code, and byte 1 (A0 = VIH), the device identifier code. For the MX27C512, these two identifier bytes are given in the Mode Select Table. All identifiers for manufacturer and device codes will possess odd parity, with the MSB (Q7) defined as the parity bit. The device is set up in the fast programming mode when the programming voltage OE/VPP = 12.75V is applied, with VCC = 6.25 V, (Algorithm is shown in Figure 1). The programming is achieved by applying a single TTL low level 100us pulse to the CE input after addresses and data line are stable. If the data is not verified, an additional pulse is applied for a maximum of 25 pulses. This process is repeated while sequencing through each address of the device. When the programming mode is completed, the data in all address is verified at VCC = 5V ± 10%. READ MODE The MX27C512 has two control functions, both of which must be logically satisfied in order to obtain data at the outputs. Chip Enable (CE) is the power control and should be used for device selection. Output Enable (OE) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that addresses are stable, address access time (tACC) is equal to the delay from CE to output (tCE). Data is available at the outputs tOE after the falling edge of OE, assuming that CE has been LOW and addresses have been stable for at least tACC - tOE. PROGRAM INHIBIT MODE Programming of multiple MX27C512s in parallel with different data is also easily accomplished by using the Program Inhibit Mode. Except for CE and OE, all like inputs of the parallel MX27C512 may be common. A TTL low-level program pulse applied to an MX27C512 CE input with OE/VPP = 12.5 ± 0.5V will program that MX27C512. A high-level CE input inhibits the other MX27C512s from being programmed. STANDBY MODE The MX27C512 has a CMOS standby mode which reduces the maximum VCC current to 100uA . It is placed in CMOS standby when CE is at VCC ± 0.3 V. The MX27C512 also has a TTL-standby mode which reduces the maximum VCC current to 1.5 mA. It is placed in TTL-standby when CE is at VIH. When in standby mode, the outputs are in a high-impedance state, independent of the OE input. PROGRAM VERIFY MODE Verification should be performed on the programmed bits to determine that they were correctly programmed. The verification should be performed with OE/VPP and CE, at VIL. Data should be verified tDV after the falling edge of CE. P/N:PM0235 2 REV. 4.8, AUG. 26, 2003 MX27C512 TWO-LINE OUTPUT CONTROL FUNCTION SYSTEM CONSIDERATIONS To accommodate multiple memory connections, a twoline control function is provided to allow for: During the switch between active and standby conditions, transient current peaks are produced on the rising and falling edges of Chip Enable. The magnitude of these transient current peaks is dependent on the output capacitance loading of the device. At a minimum, a 0.1 uF ceramic capacitor (high frequency, low inherent inductance) should be used on each device between VCC and GND to minimize transient effects. In addition, to overcome the voltage drop caused by the inductive effects of the printed circuit board traces on EPROM arrays, a 4.7 uF bulk electrolytic capacitor should be used between VCC and GND for each eight devices. The location of the capacitor should be close to where the power supply is connected to the array. 1. Low memory power dissipation, 2. Assurance that output bus contention will not occur. It is recommended that CE be decoded and used as the primary device-selecting function, while OE be made a common connection to all devices in the array and connected to the READ line from the system control bus. This assures that all deselected memory devices are in their low-power standby mode and that the output pins are only active when data is desired from a particular memory device. MODE SELECT TABLE PINS MODE CE OE/VPP A0 A9 OUTPUTS Read VIL VIL X X DOUT Output Disable VIL VIH X X High Z Standby (TTL) VIH X X X High Z Standby (CMOS) VCC±0.3V X X X High Z Program VIL VPP X X DIN Program Verify VIL VIL X X DOUT Program Inhibit VIH VPP X X High Z Manufacturer Code(3) VIL VIL VIL VH C2H Device Code(3) VIL VIL VIH VH 91H NOTES: 1. VH = 12.0 V ± 0.5 V 2. X = Either VIH or VIL P/N:PM0235 3. A1 - A8 = A10 - A15 = VIL(For auto select) 4. See DC Programming Characteristics for VPP voltage during programming. 3 REV. 4.8, AUG. 26, 2003 MX27C512 Figure1. FAST PROGRAMMING FLOW CHART START ADDRESS = FIRST LOCATION VCC = 6.25V OE/VPP = 12.75V PROGRAM ONE 100us PULSE NO INCREMENT ADDRESS LAST ADDRESS ? YES ADDRESS = FIRST LOCATION X=0 INCREMENT ADDRESS NO LAST ADDRESS ? PASS VERIFY BYTE FAIL INCREMENT X YES NO PROGRAM ONE 100us PULSE YES VCC = 5.25V OE/VPP = VIL COMPARE ALL BYTES TO ORIGINAL DATA X = 25 ? FAIL DEVICE FAILED PASS DEVICE PASSED P/N:PM0235 4 REV. 4.8, AUG. 26, 2003 MX27C512 SWITCHING TEST CIRCUITS DEVICE UNDER TEST 1.8K ohm +5V DIODES = IN3064 OR EQUIVALENT CL 6.2K ohm CL = 100 pF including jig capacitance (30pF for 45/55/70 ns parts) SWITCHING TEST WAVEFORMS 2.0V 2.0V TEST POINTS AC driving levels 0.8V 0.8V OUTPUT INPUT AC TESTING: AC driving levels are 2.4V/0.4V for commercial grade, 3.0V/0V for industrial grade. Input pulse rise and fall times are < 10ns. 1.5V AC driving levels 1.5V TEST POINTS OUTPUT INPUT AC TESTING: (1) AC driving levels are 3.0V/0V for both commercial grade and industrial grade. Input pulse rise and fall times are < 10ns. (2) For MX27C1000-45, MX27C1000/1001-55, MX27C1000/1001-70. P/N:PM0235 5 REV. 4.8, AUG. 26, 2003 MX27C512 ABSOLUTE MAXIMUM RATINGS RATING VALUE Ambient Operating Temperature -40oC to 125oC Storage Temperature -65oC to 125oC Applied Input Voltage -0.5V to 7.0V Applied Output Voltage -0.5V to VCC + 0.5V VCC to Ground Potential -0.5V to 7.0V A9 & Vpp -0.5V to 13.5V NOTICE: Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended period may affect reliability. NOTICE: Specifications contained within the following tables are subject to change. DC/AC Operating Conditions for Read Operation MX27C512 -45 Operating Commercial 0°C to 55°C Temperature Industrial -55 0°C to 70°C -70 -90 0°C to 70°C -12 0°C to 70°C -15 0°C to 70°C 0°C to 70°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C Automotive Vcc Power Supply 0°C to 70°C -10 -40°C to 125°C -40°C to 125°C -40°C to 125°C -40°C to 125°C 5V ± 5% 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10% DC CHARACTERISTICS SYMBOL PARAMETER MIN. VOH Output High Voltage 2.4 VOL Output Low Voltage VIH Input High Voltage VIL MAX. UNIT CONDITIONS V IOH = -0.4mA 0.4 V IOL = 2.1mA 2.0 VCC + 0.5 V Input Low Voltage -0.2 0.8 V ILI Input Leakage Current -10 10 uA VIN = 0 to 5.5V ILO Output Leakage Current -10 10 uA VOUT = 0 to 5.5V ICC3 VCC Power-Down Current 100 uA CE = VCC ± 0.3V ICC2 VCC Standby Current 1.5 mA CE = VIH ICC1 VCC Active Current 30 mA CE = VIL, f=5MHz, Iout =0mA IPP VPP Supply Current Read 10 uA CE = VIL, VPP = 5.5V CAPACITANCE TA = 25oC, f = 1.0 MHz (Sampled only) SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS CIN Input Capacitance 8 12 pF VIN = 0V COUT Output Capacitance 8 12 pF VOUT = 0V Vpp VPP Capacitance 18 25 pF VPP = 0V P/N:PM0235 6 REV. 4.8, AUG. 26, 2003 MX27C512 AC CHARACTERISTICS SYMBOL PARAMETER 27C512-45 27C512-55 27C512-70 27C512-90 MIN. MIN. MIN. MIN. MAX. UNIT CONDITIONS tACC Address to Output Delay 45 MAX. 55 MAX. 70 MAX. 90 ns CE = OE = VIL tCE Chip Enable to Output Delay 45 55 70 90 ns OE = VIL tOE Output Enable to Output 25 30 35 40 ns CE = VIL 25 ns Delay tDF OE High to Output Float, 0 17 0 20 0 20 0 or CE High to Output Float tOH Output Hold from Address, 0 0 0 0 ns CE or OE which ever occurred first 27C512-10 MIN. MAX. 27C512-12 MIN. SYMBOL PARAMETER tACC Address to Output Delay tCE Chip Enable to Output Delay 100 120 150 ns OE = VIL tOE Output Enable to Output 45 50 65 ns CE = VIL 50 ns 100 MAX. 27C512-15 MIN. 120 MAX. UNIT CONDITIONS 150 ns CE = OE = VIL Delay tDF OE High to Output Float, tOH Output Hold from Address, 0 30 0 35 0 or CE High to Output Float 0 0 0 ns CE or OE which ever occurred first DC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C SYMBOL PARAMETER MIN. VOH Output High Voltage 2.4 VOL Output Low Voltage VIH Input High Voltage VIL UNIT CONDITIONS V IOH = -0.40mA 0.4 V IOL = 2.1mA 2.0 VCC + 0.5 V Input Low Voltage -0.2 0.8 V ILI Input Leakage Current -10 10 uA VH A9 Auto Select Voltage 11.5 12.5 V ICC3 VCC Supply Current(Program & Verify) 40 mA IPP2 VPP Supply Current(Program) 30 mA VCC1 Fast Programming Supply Voltage 6.00 6.50 V VPP1 Fast Programming Voltage 12.5 13.0 V P/N:PM0235 7 MAX. VIN = 0 to 5.5V CE = VIL REV. 4.8, AUG. 26, 2003 MX27C512 AC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C SYMBOL PARAMETER MIN. tAS Address Setup Time 2 us tDS Data Setup Time 2 us tAH Address Hold Time 0 us tDH Data Hold Time 2 us tDFP Chip Enable to Output Float Delay 0 tVPS VPP Setup Time 2 tPW CE Program Pulse Width 95 tVCS Vcc Setup Time 2 tDV Data Valid from CE tOEH OE/VPP Hold Time 2 ns tVR OE/VPP Recovery Time 2 ns P/N:PM0235 MAX. 130 CONDITIONS ns us 105 us us 150 8 UNIT ns REV. 4.8, AUG. 26, 2003 MX27C512 WAVEFORMS READ CYCLE ADDRESS INPUTS DATA ADDRESS tACC CE tCE OE tDF DATA OUT VALID DATA tOE tOH FAST PROGRAMMING ALGORITHM WAVEFORM PROGRAM PROGRAM VERIFY VIH Addresses VIL Hi-z tAS DATA OUT VALID DATA tDV tDS tDH tDFP VPP1 OE/VPP VIL tVPS tVR tPW VIH CE tVPS tAH VIL tVCS VCC1 VCC P/N:PM0235 VCC 9 REV. 4.8, AUG. 26, 2003 MX27C512 ORDERING INFORMATION PLASTIC PACKAGE PART NO. ACCESS TIME OPERATING STANDBY OPERATING (ns) CURRENT MAX.(mA) CURRENT MAX.(uA) TEMPERATURE PACKAGE MX27C512PC-45 45 30 100 0°C to 70°C 28 Pin DIP MX27C512QC-45 45 30 100 0°C to 70°C 32 Pin PLCC MX27C512TC-45 45 30 100 0°C to 70°C 28 PinTSOP(I) MX27C512PC-55 55 30 100 0°C to 70°C 28 Pin DIP MX27C512QC-55 55 30 100 0°C to 70°C 32 Pin PLCC MX27C512TC-55 55 30 100 0°C to 70°C 28 Pin TSOP(I) MX27C512PC-70 70 30 100 0°C to 70°C 28 Pin DIP MX27C512QC-70 70 30 100 0°C to 70°C 32 Pin PLCC MX27C512TC-70 70 30 100 0°C to 70°C 28 Pin TSOP(I) MX27C512PC-90 90 30 100 0°C to 70°C 28 Pin DIP MX27C512QC-90 90 30 100 0°C to 70°C 32 Pin PLCC MX27C512TC-90 90 30 100 0°C to 70°C 28 Pin TSOP(I) MX27C512PC-12 120 30 100 0°C to 70°C 28 Pin DIP MX27C512QC-12 120 30 100 0°C to 70°C 32 Pin PLCC MX27C512TC-12 120 30 100 0°C to 70°C 28 Pin TSOP(I) MX27C512PC-15 150 30 100 0°C to 70°C 28 Pin DIP MX27C512QC-15 150 30 100 0°C to 70°C 32 Pin PLCC MX27C512TC-15 150 30 100 0°C to 70°C 28 Pin TSOP(I) MX27C512PI-45 45 30 100 -40°C to 85°C 28 Pin DIP MX27C512QI-45 45 30 100 -40°C to 85°C 32 Pin PLCC MX27C512TI-45 45 30 100 -40°C to 85°C 28 PinTSOP(I) MX27C512PI-55 55 30 100 -40°C to 85°C 28 Pin DIP MX27C512QI-55 55 30 100 -40°C to 85°C 32 Pin PLCC MX27C512TI-55 55 30 100 -40°C to 85°C 28 Pin TSOP(I) MX27C512PI-70 70 30 100 -40°C to 85°C 28 Pin DIP MX27C512QI-70 70 30 100 -40°C to 85°C 32 Pin PLCC MX27C512TI-70 70 30 100 -40°C to 85°C 28 Pin TSOP(I) MX27C512PI-90 90 30 100 -40°C to 85°C 28 Pin DIP MX27C512QI-90 90 30 100 -40°C to 85°C 32 Pin PLCC MX27C512TI-90 90 30 100 -40°C to 85°C 28 Pin TSOP(I) MX27C512PI-12 120 30 100 -40°C to 85°C 28 Pin DIP MX27C512QI-12 120 30 100 -40°C to 85°C 32 Pin PLCC MX27C512TI-12 120 30 100 -40°C to 85°C 28 Pin TSOP(I) MX27C512PI-15 150 30 100 -40°C to 85°C 28 Pin DIP MX27C512QI-15 150 30 100 -40°C to 85°C 32 Pin PLCC MX27C512TI-15 150 30 100 -40°C to 85°C 28 Pin TSOP(I) MX27C512TA-90 90 30 100 -40°C to 125°C 28 Pin TSOP(I) MX27C512TA-120 120 30 100 -40°C to 125°C 28 Pin TSOP(I) P/N:PM0235 10 REV. 4.8, AUG. 26, 2003 MX27C512 PACKAGE INFORMATION P/N:PM0235 11 REV. 4.8, AUG. 26, 2003 MX27C512 P/N:PM0235 12 REV. 4.8, AUG. 26, 2003 MX27C512 P/N:PM0235 13 REV. 4.8, AUG. 26, 2003 MX27C512 REVISION HISTORY Revision # 3.3 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 P/N:PM0235 Description Programming Flow Chart corrected, programming verify after whole array programmed with 1 pulse. 1) Reduce operating current change from 40mA to 30mA. 2) Add 28-TSOP(I) and 28-SOP packages offering. 3) Eliminate Interactive Programming Mode. IPP 100uA --> 10uA CDIP 70/90/100/120/150ns speed grades deleted from ordering information. Cancel ceramic DIP package type Remove 28-pin SOP Package Package Information format changed Add automotive grade Remove "ultraviolet erasable" wording To modify Package Information To modify 32-PLCC package information A1: from 0.50mm(0.020 inch)/nom. to 0.58mm(0.023 inch)/nom. from 0.66mm(0.026 inch)/nom. to 0.81mm(0.032 inch)/nom. 14 Page Date 08/07/1997 05/07/1998 P1,2,10,12 P1,10 P11~13 P6,10 P1 P11~13 P12 MAR/02/2000 SEP/19/2001 NOV/09/2001 APR/24/2002 NOV/19/2002 AUG/26/2003 REV. 4.8, AUG. 26, 2003 MX27C512 MACRONIX INTERNATIONAL CO., LTD. HEADQUARTERS: TEL:+886-3-578-6688 FAX:+886-3-563-2888 EUROPE OFFICE: TEL:+32-2-456-8020 FAX:+32-2-456-8021 JAPAN OFFICE: TEL:+81-44-246-9100 FAX:+81-44-246-9105 SINGAPORE OFFICE: TEL:+65-348-8385 FAX:+65-348-8096 TAIPEI OFFICE: TEL:+886-2-2509-3300 FAX:+886-2-2509-2200 MACRONIX AMERICA, INC. TEL:+1-408-453-8088 FAX:+1-408-453-8488 CHICAGO OFFICE: TEL:+1-847-963-1900 FAX:+1-847-963-1909 http : //www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.