LINER LTC3619BEMSE-PBF 400ma/800ma synchronous step-down dc/dc with average input current limit Datasheet

Features
n
n
n
n
n
n
n
n
n
n
n
n
n
n
Programmable Average Input Current Limit:
±5% Accuracy
Dual Step-Down Outputs: Up to 96% Efficiency
Low Noise Pulse-Skipping Operation at Light Loads
Input Voltage Range: 2.5V to 5.5V
Output Voltage Range: 0.6V to 5V
2.25MHz Constant-Frequency Operation
Power Good Output Voltage Monitor for Each Channel
Low Dropout Operation: 100% Duty Cycle
Independent Internal Soft-Start for Each Channel
Current Mode Operation for Excellent Line and Load
Transient Response
±2% Output Voltage Accuracy
Short-Circuit Protected
Shutdown Current ≤ 1μA
Available in Small Thermally Enhanced 10-Lead MS
and 3mm × 3mm DFN Packages
Applications
n
n
n
n
High Peak Load Current Applications
USB Powered Devices
Supercapacitor Charging
Radio Transmitters and Other Handheld Devices
L, LT, LTC, LTM, Linear Technology, the Linear logo and Burst Mode are registered trademarks
and Hot Swap is a trademark of Linear Technology Corporation. All other trademarks are the
property of their respective owners. Protected by U.S.Patents, including 5481178, 6127815,
6304066, 6498466, 6580258, 6611131.
LTC3619B
400mA/800mA Synchronous
Step-Down DC/DC with
Average Input Current Limit
Description
The LTC®3619B is a dual monolithic synchronous buck
regulator using a constant frequency current mode architecture.
The input supply voltage range is 2.5V to 5.5V, making it
ideal for Li-Ion and USB powered applications. 100% duty
cycle capability provides low dropout operation, extending the run time in battery-operated systems. Low output
voltages are supported with the 0.6V feedback reference
voltage. Channel 1 and channel 2 can supply 400mA and
800mA output current, respectively.
The LTC3619B’s programmable average input current limit
is ideal for USB applications and for point-of-load power
supplies because the LTC3619B’s limited input current
will still allow its output to deliver high peak load currents
without collapsing the input supply. When the sum of
both channels’ currents exceeds the input current limit,
channel 2 is current limited while channel 1 remains regulated. The operating frequency is internally set at 2.25MHz
allowing the use of small surface mount inductors. Internal
soft-start reduces in-rush current during start-up. The
LTC3619B is available in small MSOP and 3mm × 3mm
DFN packages. The LTC3619B is also available in a low
quiescent current, high efficiency Burst Mode® version,
LTC3619.
Typical Application
GSM Pulse Load
Dual Monolithic Buck Regulator in 10-Lead 3mm × 3mm DFN
VIN
3.4V TO 5.5V
10µF
VOUT
200mV/DIV
RUN2 VIN RUN1
PGOOD2 PGOOD1
1.5µH
VOUT2
3.4V AT
800mA
LTC3619B
SW2
+
1190k
2.2mF
s2
SuperCap
SW1
22pF
VFB1
VFB2
255k
3.3µH
RLIM GND
255k
511k
VOUT1
1.8V AT
400mA
10µF
VIN
AC-COUPLED
1V/DIV
IOUT
500mA/DIV
IIN
500mA/DIV
1ms/DIV
3619B TA01
1000pF
116k
3619B TA01b
VIN = 5V, 500mA COMPLIANT
ILOAD = 0A to 2.2A, CHANNEL 1 UNLOADED
ILIM = 475mA
3619bfa
LTC3619B
Absolute Maximum Ratings
(Note 1)
Input Supply Voltage (VIN).............................. –0.3 to 6V
VFB1, VFB2......................................... –0.3V to VIN + 0.3V
RUN1, RUN2, RLIM........................... –0.3V to VIN + 0.3V
SW1, SW2......................................... –0.3V to VIN + 0.3V
PGOOD1, PGOOD2............................ –0.3V to VIN + 0.3V
P-channel SW Source Current (DC) (Note 2)
Channel 1......................................................... 600mA
Channel 2.................................................................1A
N-channel SW Source Current (DC) (Note 2)
Channel 1......................................................... 600mA
Channel 2.................................................................1A
Peak SW Source and Sink Current (Note 2)
Channel 1......................................................... 900mA
Channel 2.............................................................. 2.7A
Operating Junction Temperature Range
(Notes 3, 6, 8).........................................–40 to 125°C
Storage Temperature Range................... –65°C to 125°C
Lead Temperature (Soldering, 10 sec)
MSOP Package.................................................. 300°C
Reflow Peak Body Temperature............................. 260°C
Pin Configuration
TOP VIEW
VFB1
1
RUN1
2
RLIM
3
PGOOD1
4
SW1
5
TOP VIEW
10 VFB2
11
GND
VFB1
RUN1
RLIM
PGOOD1
SW1
9 RUN2
8 PGOOD2
7 SW2
6 VIN
1
2
3
4
5
11
GND
10
9
8
7
6
VFB2
RUN2
PGOOD2
SW2
VIN
MSE PACKAGE
10-LEAD PLASTIC MSOP
TJMAX = 125°C, θJA = 45°C/W
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB
DD PACKAGE
10-LEAD (3mm s 3mm) PLASTIC DFN
TJMAX = 125°C, θJA = 40°C/W
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB
Order Information
LEAD FREE FINISH
TAPE AND REEL
PART MARKING*
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LTC3619BEDD#PBF
LTC3619BEDD#TRPBF
LFFH
10-Lead (3mm × 3mm) Plastic DFN
–40°C to 125°C
LTC3619BIDD#PBF
LTC3619BIDD#TRPBF
LFFH
10-Lead (3mm × 3mm) Plastic DFN
–40°C to 125°C
LTC3619BEMSE#PBF
LTC3619BEMSE#TRPBF
LTFFJ
10-Lead Plastic MSOP
–40°C to 125°C
LTC3619BIMSE#PBF
LTC3619BIMSE#TRPBF
LTFFJ
10-Lead Plastic MSOP
–40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
Electrical Characteristics
The l denotes the specifications which apply over the full operating
junction temperature range, otherwise specifications are at TA = 25°C (Note 3)
SYMBOL
PARAMETER
VIN
VIN Operating Voltage Range
VUV
VIN Undervoltage Lockout
CONDITIONS
MIN
l
VIN Low to High
l
TYP
2.5
2.1
MAX
UNITS
5.5
V
2.5
V
3619bfa
LTC3619B
Electrical Characteristics
The l denotes the specifications which apply over the full operating
junction temperature range, otherwise specifications are at TA = 25°C (Note 3)
SYMBOL
PARAMETER
IFB
Feedback Pin Input Current
MAX
UNITS
±30
nA
VFBREG
Feedback Voltage (Channels 1, 2)
LTC3619BE, –40°C < TJ < 85°C (Note 7)
LTC3619BI, –40°C < TJ < 125°C (Note 7)
0.600
0.600
0.612
0.618
V
V
ΔVLINEREG
VFB Line Regulation
VIN = 2.5V to 5.5V (Note 7)
0.01
0.25
%/V
ΔVLOADREG
VFB Load Regulation (Channel 1)
VFB Load Regulation (Channel 2)
ILOAD = 0mA to 400mA (Note 7)
ILOAD = 0mA to 800mA (Note 7)
0.5
0.5
IS
Supply Current
Active Mode (Note 4)
Shutdown
VFB1 = VFB2 = 0.95 × VFBREG
VRUN1 = VRUN2 = 0V, VIN = 5.5V
600
875
1
µA
µA
fOSC
Oscillator Frequency
VFB = VFBREG
1.8
2.25
2.7
MHz
ILIM(PEAK)
Peak Switch Current Limit
Channel 1 (400mA)
Channel 2 (800mA)
VIN = 5V, VFB < VFBREG , Duty Cycle <35%
550
1800
800
2400
IINLIM
Input Average Current Limit
RLIM = 116k
RLIM = 116k, LTC3619BE
RLIM = 116k, LTC3619BI
450
437
427
475
475
475
RDS(ON)
Channel 1 (Note 5)
Top Switch On-Resistance
Bottom Switch On-Resistance
Channel 2 (Note 5)
Top Switch On-Resistance
Bottom Switch On-Resistance
CONDITIONS
MIN
mA
mA
mA
0.27
0.25
Ω
Ω
0.01
1
µA
0.95
1.3
ms
1
1.2
V
0.01
1
µA
VFB from 0.06V to 0.54V
VRUN
RUN Threshold High
IRUN
RUN Leakage Current
0V ≤ VRUN ≤ 5V
PGOOD
Power Good Threshold
Entering Window
VFB Ramping Up
VFB Ramping Down
Leaving Window
VFB Ramping Up
VFB Ramping Down
PGOOD Leakage Current
500
513
523
VIN = 5V, ISW = 100mA
VIN = 5V, ISW = 100mA
Soft-Start Time
IPGOOD
mA
mA
Ω
Ω
tSOFTSTART
Power Good Pull-Down On-Resistance
%
%
0.45
0.35
VIN = 5V, VRUN = 0V
RPGOOD
l
l
0.588
0.582
VIN = 5V, ISW = 100mA
VIN = 5V, ISW = 100mA
Switch Leakage Current
Power Good Blanking Time
l
l
l
ISW(LKG)
PGOOD Blanking
TYP
l
0.3
l
0.4
l
–5
5
9
–9
PGOOD Rising and Falling, VIN = 5V
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: Guaranteed by long term current density limitations.
Note 3: The LTC3619B is tested under pulsed load conditions such that
TJ ≈ TA. The LTC3619BE is guaranteed to meet performance specifications
from 0°C to 85°C. Specifications over the –40°C to 125°C operating
junction temperature range are assured by design, characterization and
correlation with statistical process controls. The LTC3619BI is guaranteed
to meet specified performance over the full –40°C to 125°C operating
junction temperature range. Note that the maximum ambient temperature
is determined by specific operating conditions in conjunction with board
layout, the rated package thermal resistance and other environmental
factors.
11
–11
90
8
VPGOOD = 5V
%
%
–7
7
15
%
%
µs
30
Ω
±1
µA
Note 4: Dynamic supply current is higher due to the internal gate charge
being delivered at the switching frequency.
Note 5: The switch on-resistance is guaranteed by correlation to wafer
level measurements.
Note 6: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 125°C when overtemperature protection is active.
Continuous operation above the specified maximum operating junction
temperature may impair device reliability.
Note 7: The converter is tested in a proprietary test mode that connects
the output of the error amplifier to the SW pin, which is connected to an
external servo loop.
Note 8: TJ is calculated from the ambient temperature TA and the power
dissipation as follows: TJ = TA + (PD)(θJA°C/W)
3619bfa
LTC3619B
Typical Performance Characteristics
Supply Current vs Temperature
Pulse-Skipping Mode Operation
900
SUPPLY CURRENT (µA)
800
VOUT
50mV/DIV
ACCOUPLED
IL
100mA/DIV
VIN = 5V
VOUT = 3.3V
ILOAD = 5mA
Efficiency vs Input Voltage
100
RUN1 = RUN2 = VIN
ILOAD = 0A
90
80
VIN = 5.5V
700
600
EFFICIENCY (%)
SW
2V/DIV
5µs/DIV
TA = 25°C, VIN = 5V, unless otherwise noted.
VIN = 2.7V
500
400
60
50
30
10
200
–50
0
25
50
75
TEMPERATURE (°C)
–25
100
VOUT = 3.3V
CHANNEL 2
0
3.5
125
4
Oscillator Frequency
vs Temperature
1.0
2.4
0.5
0
–0.5
–1.0
–25
0
25
50
75
TEMPERATURE (°C)
100
2.2
2.1
2.0
1.8
–50
125
VIN = 2.7V
VIN = 3.6V
VIN = 4.2V
VIN = 5V
–25
3619B G04
0.7
100
0.5
5.5
3619B G07
3.5
0.5
0.4
0.2
–50
VIN = 2.7V
VIN = 3.6V
VIN = 5V
0.4
0.3
5
3
4
VIN (V)
4.5
5
5.5
3619B G06
Switch On-Resistance
vs Temperature, Channel 2
PFET RDS(ON) (Ω)
RDS(ON) (Ω)
350
SYNCHRONOUS SWITCH
0.7
MAIN SWITCH
0.6
0.3
0.5
0.2
0.4
0.1
0.3
0
SYNCHRONOUS SWITCH
–25
0
25
50
75
TEMPERATURE (°C)
100
125
3619B G08
–0.1
–50
NFET RDS(ON) (Ω)
MAIN SWITCH
450
4.5
400
0
2.5
125
MAIN SWITCH
550
SYNCHRONOUS SWITCH
250
2.5
3
3.5
4
VIN (V)
MAIN SWITCH
200
VIN = 2.7V
VIN = 3.6V
VIN = 5V
0.6
RDS(ON) (mΩ)
0
25
50
75
TEMPERATURE (°C)
600
Switch On-Resistance
vs Temperature, Channel 1
CHANNEL 1
CHANNEL 2
650
CHANNEL 1
CHANNEL 2
3619B G05
Switch On-Resistance
vs Input Voltage
3619B G03
800
2.3
1.9
–1.5
–50
5.5
Switch Leakage vs Input Voltage
1000
LEAKAGE CURRENT (pA)
2.5
FREQUENCY (MHz)
VFB ERROR (%)
1.5
5
4.5
VIN (V)
3619B G02
Regulated Voltage vs Temperature
IOUT = 10mA
IOUT = 1mA
IOUT = 0.1mA
IOUT = 100mA
IOUT = 400mA
IOUT = 800mA
40
20
300
3619B G01
70
0.2
SYNCHRONOUS SWITCH
–25
0
25
50
75
TEMPERATURE (°C)
100
0.1
125
3619B G09
3619bfa
LTC3619B
Typical Performance Characteristics
Efficiency vs Load Current
Efficiency vs Load Current
100
100
80
80
80
70
70
70
VOUT = 3.3V
90 CHANNEL 2
60
50
40
30
20
0
0.0001
60
50
40
30
20
VIN = 3.6V
VIN = 4.2V
VIN = 5V
10
0.001
0.01
0.1
OUTPUT CURRENT (A)
VOUT = 1.2V
90 CHANNEL 1
EFFICIENCY (%)
EFFICIENCY (%)
EFFICIENCY (%)
Efficiency vs Load Current
100
VOUT = 3.3V
90 CHANNEL 1
10
0
0.0001
1
0.001
0.01
0.1
OUTPUT CURRENT (A)
Efficiency vs Load Current
70
VOUT ERROR (%)
EFFICIENCY (%)
80
60
50
40
0
0.0001
0.001
0.01
0.1
OUTPUT CURRENT (A)
CHANNEL 1
2.0
2.0
1.5
1.0
0.5
–1.0
0
100
200
300
LOAD CURRENT (mA)
400
1.0
0.5
VOUT = 1.8V
VOUT = 2.5V
VOUT = 3.3V
–0.5
–1.0
3619B G14
0
100 200 300 400 500 600 700 800
LOAD CURRENT (mA)
3619B G15
Start-Up from Shutdown
RUN
2V/DIV
RUN
2V/DIV
VOUT
2V/DIV
0.2
0
VOUT
1V/DIV
RLIM
1V/DIV
–0.2
IL
250mA/DIV
IIN
500mA/DIV
–0.4
–0.6
2.5
CHANNEL 2
1.5
Start-Up from Shutdown
VOUT = 1.8V
ILOAD = 100mA
1
0
VOUT = 1.8V
VOUT = 2.5V
VOUT = 3.3V
–0.5
1
0.001
0.01
0.1
OUTPUT CURRENT (A)
Load Regulation
3.0
0
VIN = 2.7V
VIN = 3.6V
VIN = 4.2V
VIN = 5V
VIN = 2.7V
VIN = 3.6V
VIN = 4.2V
VIN = 5V
3619B G12
2.5
Line Regulation
0.4
0
0.0001
1
2.5
3619B G13
0.6
30
10
VOUT ERROR (%)
VOUT = 1.2V
90 CHANNEL 2
10
40
Load Regulation
3.0
20
50
3619B G11
100
30
60
20
VIN = 3.6V
VIN = 4.2V
VIN = 5V
3619B G10
VOUT ERROR (%)
TA = 25°C, VIN = 5V, unless otherwise noted.
3.0
3.5
4.0
VIN (V)
4.5
5.0
5.5
200µs/DIV
VIN = 5V, VOUT = 3.3V
RLOAD = 7Ω
CLOAD = 4.7µF
3619B G17
CHANNEL 2
2ms/DIV
3619B G18
VIN = 5V, VOUT = 3.4V
RL = NO LOAD, CL = 4.4mF
CLIM = 2200pF, ILIM = 500mA
3619B G16
3619bfa
LTC3619B
Typical Performance Characteristics
Average Input Current Limit
vs Temperature
TA = 25°C, VIN = 5V, unless otherwise noted.
Load Step
Load Step
8
VIN = 5V
6 ILIM = 475mA
VOUT
200mV/DIV
AC-COUPLED
IINLIM ERROR (%)
4
VOUT
200mV/DIV
AC-COUPLED
2
0
–2
–4
IL
500mA/DIV
IL
500mA/DIV
ILOAD
500mA/DIV
ILOAD
500mA/DIV
20µs/DIV
–6
–8
–50
–25
0
25
50
75
TEMPERATURE (°C)
100
125
VIN = 5V, VOUT = 3.3V
ILOAD = 0A TO 400mA
CL = 4.7µF
3619B G20
20µs/DIV
3619B G21
VIN = 5V, VOUT = 1.8V
ILOAD = 40mA TO 400mA
CL = 4.7µF
3619B G19
Pin Functions
(DD/MSE)
VFB1 (Pin 1/Pin 1): Regulator 1 Output Feedback. Receives
the feedback voltage from the external resistive divider
across the regulator 1 output. Nominal voltage for this
pin is 0.6V.
RUN1 (Pin 2/Pin 2): Regulator 1 Enable. Forcing this pin
to VIN enables regulator 1, while forcing it to GND causes
regulator 1 to shut down.
RLIM (Pin 3/Pin 3): Average Input Current Limit Program
Pin. Place a resistor and capacitor in parallel from this
pin to ground.
PGOOD1 (Pin 4/Pin 4): Open-Drain Logic Output. PGOOD1
is pulled to ground if the voltage on the VFB1 pin is not
within power good threshold.
SW1 (Pin 5/Pin 5): Regulator 1 Switch Node Connection
to the Inductor. This pin swings from VIN to GND.
VIN (Pin 6/Pin 6): Main Power Supply. Must be closely
de-coupled to GND.
SW2 (Pin 7/Pin 7): Regulator 2 Switch Node Connection
to the Inductor. This pin swings from VIN to GND.
PGOOD2 (Pin 8/Pin 8): Open-Drain Logic Output. PGOOD2
is pulled to ground if the voltage on the VFB2 pin is not
within power good threshold.
RUN2 (Pin 9/Pin 9): Regulator 2 Enable. Forcing this pin
to VIN enables regulator 2, while forcing it to GND causes
regulator 2 to shut down.
VFB2 (Pin 10/Pin 10): Regulator 2 Output Feedback.
Receives the feedback voltage from the external resistive
divider across the regulator 2 output. Nominal voltage for
this pin is 0.6V.
GND (Pin 11/Pin 11): Ground. Bottom Exposed Pad. Connect to the (–) terminal of COUT, and the (–) terminal of
CIN. The Exposed Pad must be soldered to PCB.
3619bfa
LTC3619B
Functional Diagram
REGULATOR 1
+
–
8
+
–
PGOOD1
0.654V
VFB1
0.546V
–
VFB1 10
6 VIN
SLOPE
COMP
ITH
EA
0.6V
MIN
CLAMP
–
VSLEEP
RS
LATCH
R
+
ICOMP
+
S
SOFT-START
–
SLEEP
+
Q
+
Q
SWITCHING
LOGIC
AND
BLANKING
CIRCUIT
ICOMP
–
ANTI
SHOOTTHRU
7 SW1
+
IRCMP
SHUTDOWN
11 GND
–
RUN1
RUN2
2
9
SLEEP2
0.6V REF
SLEEP1
OSC
TO REGULATOR 2 ONLY
+
–
3 RLIM
1V
OSC
MIN
CLAMP
6 VIN
SLOPE
COMP
1
0.6V
–
–
+
EA
ITH
–
VSLEEP
+
–
4
+
–
Q
+
Q
SWITCHING
LOGIC
AND
BLANKING
CIRCUIT
0.654V
+
ICOMP
–
ANTI
SHOOTTHRU
5 SW2
VFB2
0.546V
+
PGOOD2
R
RS
LATCH
–
ICOMP
+
S
SOFT-START
SLEEP
IRCMP
SHUTDOWN
–
VFB2
11 GND
REGULATOR 2
3619B FD
3619bfa
LTC3619B
Operation
The LTC3619B uses a constant-frequency, current mode
architecture. The operating frequency is set at 2.25MHz.
Both channels share the same clock and run in-phase.
The output voltage is set by an external resistor divider
returned to the VFB pins. An error amplifier compares the
divided output voltage with a reference voltage of 0.6V and
regulates the peak inductor current accordingly.
The LTC3619B continuously monitors the input current
of both channels. When the sum of the currents of both
channels exceeds the programmed input current limit set
by an external resistor, RLIM , channel 2 is current limited
while channel 1 remains regulated.
Main Control Loop
During normal operation, the top power switch (P-channel
MOSFET) is turned on at the beginning of a clock cycle
when the VFB voltage is below the reference voltage. The
current into the inductor and the load increases until the
peak inductor current (controlled by ITH) is reached. The
RS latch turns off the synchronous switch and energy
stored in the inductor is discharged through the bottom
switch (N-channel MOSFET) into the load until the next
clock cycle begins, or until the inductor current begins to
reverse (sensed by the IRCMP comparator).
The peak inductor current is controlled by the internally
compensated ITH voltage, which is the output of the error amplifier. This amplifier regulates the VFB pin to the
internal 0.6V reference by adjusting the peak inductor
current accordingly.
When the input current limit is engaged, the peak inductor
current will be lowered, which then reduces the switching
duty cycle and VOUT. This allows the input voltage to stay
regulated when its programmed current output capability
is met.
Light Load Operation
The LTC3619B will automatically transition from continuous
operation to the pulse-skipping operation when the load
current is low. The inductor current is not fixed during the
pulse-skipping mode which allows the LTC3619B to switch
at constant-frequency down to very low currents, where it
will begin skipping pulses to maintain output regulation.
This mode of operation exhibits low output ripple as well
as low audio noise and reduced RF interference while
providing reasonable low current efficiency.
Dropout Operation
When the input supply voltage decreases toward the
output voltage the duty cycle increases to 100%, which
is the dropout condition. In dropout, the PMOS switch is
turned on continuously with the output voltage being equal
to the input voltage minus the voltage drops across the
internal P-channel MOSFET and the inductor.
An important design consideration is that the RDS(ON) of the
P-channel switch increases with decreasing input supply
voltage (see the Typical Performance Characteristics section). Therefore, the user should calculate the worst-case
power dissipation when the LTC3619B is used at 100% duty
cycle with low input voltage (see Thermal Considerations
in the Applications Information section).
Soft-Start
In order to minimize the inrush current on the input bypass
capacitor, the LTC3619B slowly ramps up the output voltage during start-up. Whenever the RUN1 or RUN2 pin is
pulled high, the corresponding output will ramp from zero
to full-scale over a time period of approximately 750µs. This
prevents the LTC3619B from having to quickly charge the
output capacitor and thus supplying an excessive amount
of instantaneous current.
When the output is loaded heavily, for example, with millifarad of capacitance, it may take longer than 750µs to
charge the output to regulation. If the output is still low
after the soft-start time, the LTC3619B will try to quickly
charge the output capacitor. In this case, the input current
limit (after it engages) can prevent excessive amount of
instantaneous current that is required to quickly charge
the output. See the Channel 2 Start-Up from Shutdown
curve in the Typical Performance Characteristics section.
After input current limit is engaged, the output slowly
ramps up to regulation while limited by its 500mA of
input current.
3619bfa
LTC3619B
Operation
Short-Circuit Protection
Programming Input Current Limit
When either regulator output is shorted to ground, the
corresponding internal N-channel switch is forced on for
a longer time period for each cycle in order to allow the
inductor to discharge, thus preventing inductor current
runaway. This technique has the effect of decreasing
switching frequency. Once the short is removed, normal
operation resumes and the regulator output will return to
its nominal voltage.
Selection of one external RLIM resistor will program the
input current limit. The current limit can be programmed
from 200mA up to IPEAK current. As the input current
increases, RLIM voltage will follow. When RLIM reaches
the internal comparator threshold of 1V, channel 2’s
power PFET on-time will be shortened, thereby, limiting
the input current.
Input Current Limit
Internal current sense circuitry in each channel measures
the inductor current through the voltage drop across the
power PFET switch and forces the same voltage across
the small sense PFET. The voltage across the small sense
PFET generates a current representing 1/55,000th of the
inductor current during the on-cycle. The current out of
RLIM pin is the summed representation of the inductor
currents from both channels, which can be expressed in
the following equation.
IRLIM = IOUT1 • D1 • K1 + IOUT2 • D2 • K2,
Use the following equation to select the RLIM resistance
that corresponds to the input current limit.
RLIM =
55kΩ − A
IDC ( A)
IDC is the input current (at VIN) to be limited. The following are some RLIM values with the corresponding current
limit.
RLIM
IDC
91.6k
600mA
110k
500mA
137.5k
400mA
where D1 = VOUT1/VIN and D2 = VOUT2 /VIN are the duty
cycle of channel 1 and 2, respectively.
Selection of CLIM Capacitance
K1 is the ratio RDS(ON) (power PFET)/RDS(ON)(sense PFET)
of channel 1, and K2 is the ratio RDS(ON)(power PFET)/
RDS(ON) (sense PFET) of channel 2. The ratio of the power
PFET to the sense PFET is trimmed to within 2%.
Since IRLIM current is a function of the inductor current,
its dependency on the duty cycle cannot be ignored. Thus,
a CLIM capacitor is needed to integrate the IRLIM current
and smooth out transient currents. The LTC3619B is stable
with any size capacitance >100pF at the RLIM pin.
Given that both PFETs are carefully laid out and matched,
their temperature and voltage coefficient effects will be
similar and their terms be canceled out in the equation. In
that case, the constants K1 and K2 will only be dependent
on area scaling, which is trimmed to within 2%. Thus, the
IRLIM current will track the input current very well over
varying temperature and VIN.
The RLIM pin can be grounded to disable input current
limit function.
Each application input current limit will call for different
CLIM value to optimize its response time. Using a large CLIM
capacitor requires longer time for the RLIM pin voltage to
charge. For example, consider the application 500mA input
current limit, 5V input and 1A, 2.5V output with a 50% duty
cycle. When an instantaneous 1A output pulse is applied,
the current out of the RLIM pin becomes 1A/55k = 18.2µA
during the 50% on-time or 9.1µA full duty cycle. With a
CLIM capacitor of 1µF, RLIM of 116k, and using I = CdV/dt,
it will take 110ms for CLIM to charge from 0V to 1V. This is
the time after which the LTC3619B will start input current
3619bfa
LTC3619B
Operation
limiting. Any current within this time must be considered
in each application to determine if it is tolerable.
Figure 1a shows VIN (IIN) current below input current limit
with a CLIM capacitor of 0.1µF. Channel 1 is unloaded to
simplify calculations. When the load pulse is applied,
under the specified condition, ILIM current is 1.1A/55k •
0.66 = 13.2µA, where 0.66 is the duty cycle. It will take a
little more than 7.5ms to charge the CLIM capacitor from
0V to 1V, after which the LTC3619B begins to limit input
current. The IIN current is not limited during this 7.5ms
time and is more than 725mA. This current transient may
cause the input supply to temporarily droop if the supply
current compliance is exceeded, but recovers after the
input current limit engages. The output will continue to
deliver the required current load while the output voltage
droops to allow the input voltage to remain regulated
during input current limit.
For applications with short load pulse duration, a smaller
CLIM capacitor may be the better choice as in the example
shown in Figure 1b. Channel 1 is unloaded for simplification. In this example, a 577µs, 0A to 2A output pulse
is applied once every 4.7ms. A CLIM capacitor of 2.2nF
requires 92µs for VRLIM to charge from 0V to 1V. During
this 92µs, the input current limit is not yet engaged and
the output must deliver the required current load. This
may cause the input voltage to droop if the current compliance is exceeded. Depending on how long this time is,
the VIN supply decoupling capacitor can provide some of
this current before VIN droops too much. In applications
with a bigger VIN supply decoupling capacitor and where
VIN supply is allow to droop closer to dropout, the CLIM
capacitor can be increased slightly. This will delay the
start of input current limit and artificially regulated VOUT
before input current limit is engaged. In this case, within
the 577µs load pulse, the VOUT voltage will stay artificially
regulated for 92µs out of the total 577µs before the input
current limit activates. This approach may be used if a
faster recovery on the output is desired.
Selecting a very small CLIM will speed up response time
but it can put the device within threshold of interfering
with normal operation and input current limit in every
few switching cycles. This may be undesirable in terms
of noise. Use 2πRC >> 100/clock frequency (2.25MHz) as
VOUT
2V/DIV
VOUT
200mV/DIV
IIN
500mA/DIV
VIN
AC-COUPLED
1V/DIV
VRLIM
1V/DIV
IOUT
500mA/DIV
IIN
500mA/DIV
IL
1A/DIV
50ms/DIV
3619B F01a
VIN = 5V, 500mA COMPLIANT
RLIM = 116k, CLIM = 0.1µF
ILOAD = 0A to 1.1A, COUT = 2.2mF, VOUT = 3.3V
ILIM = 475mA, CHANNEL 1 NOT LOADED
Figure 1a. Input Current Limit Within 100ms Load Pulses
1ms/DIV
3619B F01b
VIN = 5V, 500mA COMPLIANT
RLIM = 116k, CLIM = 2200pF
ILOAD = 0A to 2A, COUT = 2.2mF, VOUT = 3.3V
ILIM = 475mA, CHANNEL 1 NOT LOADED
Figure 1b. Input Current Limit Within
577µs, 2A Repeating Load Pulses
3619bfa
10
LTC3619B
Applications Information
A general LTC3619B application circuit is shown in Figure 2.
External component selection is driven by the load requirement, and begins with the selection of the inductor L. Once
the inductor is chosen, CIN and COUT can be selected.
Inductor Selection
Although the inductor does not influence the operating frequency, the inductor value has a direct effect on
ripple current. The inductor ripple current DIL decreases
with higher inductance and increases with higher VIN or
VOUT :
VOUT  VOUT 
• 1−
fO • L 
VIN 
ΔIL =
(1)
Accepting larger values of DIL allows the use of low
inductances, but results in higher output voltage ripple,
greater core losses, and lower output current capability.
A reasonable starting point for setting ripple current is
40% of the maximum output load current. So, for a 800mA
regulator, DIL = 320mA (40% of 800mA).
The inductor value will also have an effect on Burst Mode
operation. The transition to low current operation begins
when the peak inductor current falls below a level set by
the internal burst clamp. Lower inductor values result in
higher ripple current which causes the transition to occur
at lower load currents. This causes a dip in efficiency in
the upper range of low current operation. Furthermore,
lower inductance values will cause the bursts to occur
with increased frequency.
VIN
2.5V TO 5.5V
C1
RUN2 VIN RUN1
L2
VOUT2
SW2
CF2
COUT2
R4
R3
SW1
VFB2
RLIM
CLIM
VFB1
GND
Different core materials and shapes will change the size/current and price/current relationship of an inductor. Toroid
or shielded pot cores in ferrite or permalloy materials are
small and do not radiate much energy, but generally cost
more than powdered iron core inductors with similar
electrical characteristics. The choice of which style inductor to use often depends more on the price versus size
requirements, and any radiated field/EMI requirements,
than on what the LTC3619B requires to operate. Table 1
shows some typical surface mount inductors that work
well in LTC3619B applications.
Table 1. Representative Surface Mount Inductors
MANUFACTURER
L1
CF1
R1
R2
RLIM
VOUT1
COUT1
3619B F02
PART NUMBER
MAX DC
VALUE CURRENT
DCR
HEIGHT
Coilcraft
LPS4012-152ML
LPS4012-222ML
LPS4012-332ML
LPS4012-472ML
LPS4018-222ML
LPS4018-332ML
LPS4018-472ML
1.5µH
2.2µH
3.3µH
4.7µH
2.2µH
3.3µH
4.7µH
2200mA
1750mA
1450mA
1450mA
2300mA
2000mA
1800mA
0.070Ω
0.100Ω
0.100Ω
0.170Ω
0.070Ω
0.080Ω
0.125Ω
1.2mm
1.2mm
1.2mm
1.2mm
1.8mm
1.8mm
1.8mm
FDK
FDKMIPF2520D
FDKMIPF2520D
FDKMIPF2520D
4.7µH
3.3µH
2.2µH
1100mA
1200mA
1300mA
0.11Ω
0.1Ω
0.08Ω
1mm
1mm
1mm
LQH32CN4R7M23 4.7µH
450mA
0.2Ω
2mm
ELT5KT4R7M
4.7µH
950mA
0.2Ω
1.2mm
CDRH2D18/LD
CDH38D11SNP3R3M
CDH38D11SNP2R2M
4.7µH
3.3μH
630mA
1560mA
0.086Ω
0.115Ω
2mm
1.2mm
2.2μH
1900mA
0.082Ω
1.2mm
2.2µH
2.2µH
3.3µH
2.2µH
4.7µH
510mA
530mA
410mA
1100mA
750mA
0.13Ω
0.33Ω
0.27Ω
0.1Ω
0.19Ω
1.6mm
1.25mm
1.6mm
1mm
1mm
4.7µH
700mA
0.28Ω
1mm
3.3µH
870mA
0.17Ω
1mm
2.2µH
1000mA
0.12Ω
1mm
2.2µH
1500mA
0.076Ω
1.2mm
3.3μH
1700mA
0.095Ω
1.2mm
2.2µH
2300mA
0.059Ω
1.4mm
Murata
Panasonic
Sumida
Taiyo Yuden CB2016T2R2M
CB2012T2R2M
CB2016T3R3M
NR30102R2M
NR30104R7M
TDK
PGOOD2 PGOOD1
LTC3619B
Inductor Core Selection
VLF3010AT4R7MR70
VLF3010AT3R3MR87
VLF3010AT2R2M1R0
VLF4012AT-2R2
M1R5
VLF5012ST-3R3
M1R7
VLF5014ST-2R2
M2R3
Figure 2. LTC3619B General Schematic
3619bfa
11
LTC3619B
Applications Information
Input Capacitor (CIN) Selection
In continuous mode, the input current of the converter is a
square wave with a duty cycle of approximately VOUT / VIN .
To prevent large voltage transients, a low equivalent series
resistance (ESR) input capacitor sized for the maximum
RMS current must be used. The maximum RMS capacitor
current is given by:
IRMS ≈IMAX
VOUT (VIN − VOUT )
VIN
Where the maximum average output current IMAX equals
the peak current minus half the peak-to-peak ripple current, IMAX = ILIM – DIL /2. This formula has a maximum at
VIN = 2VOUT, where IRMS = IOUT/2. This simple worst-case
is commonly used to design because even significant
deviations do not offer much relief. Note that capacitor
manufacturer’s ripple current ratings are often based on
only 2000 hours lifetime. This makes it advisable to further
derate the capacitor, or choose a capacitor rated at a higher
temperature than required. Several capacitors may also be
paralleled to meet the size or height requirements of the
design. An additional 0.1µF to 1µF ceramic capacitor is
also recommended on VIN for high frequency decoupling
when not using an all-ceramic capacitor solution.
Output Capacitor (COUT) Selection
The selection of COUT is driven by the required effective
series resistance (ESR). Typically, once the ESR requirement for COUT has been met, the RMS current rating
generally far exceeds the IRIPPLE(P-P) requirement. The
output ripple DVOUT is determined by:

1 
ΔVOUT ≈ ΔIL  ESR +
8fOCOUT 

capacitor types include Sanyo POSCAP, Kemet T510 and
T495 series, and Sprague 593D and 595D series. Consult
the manufacturer for other specific recommendations.
Using Ceramic Input and Output Capacitors
Higher values, lower cost ceramic capacitors are now
becoming available in smaller case sizes. Their high ripple
current, high voltage rating and low ESR make them
ideal for switching regulator applications. Because the
LTC3619B control loop does not depend on the output
capacitor’s ESR for stable operation, ceramic capacitors
can be used freely to achieve very low output ripple and
small circuit size.
However, care must be taken when ceramic capacitors are
used at the input. When a ceramic capacitor is used at the
input and the power is supplied by a wall adapter through
long wires, a load step at the output can induce ringing at
the input, VIN. At best, this ringing can couple to the output
and be mistaken as loop instability. At worst, a sudden
inrush of current through the long wires can potentially
cause a voltage spike at VIN, large enough to damage the
part. For more information, see Application Note 88.
When choosing the input and output ceramic capacitors,
choose the X5R or X7R dielectric formulations. These
dielectrics have the best temperature and voltage characteristics of all the ceramics for a given value and size.
Setting the Output Voltage
The LTC3619B regulates the VFB1 and VFB2 pins to 0.6V during regulation. Thus, the output voltage is set by a resistive
divider, Figure 2, according to the following formula:
 R2 
VOUT = 0.6V  1+ 
 R1
(2)
where fO = operating frequency, COUT = output capacitance
and DIL = ripple current in the inductor. For a fixed output
voltage, the output ripple is highest at maximum input
voltage since DIL increases with input voltage.
Keeping the current small (< 10µA) in these resistors
maximizes efficiency, but making it too small may allow
stray capacitance to cause noise problems or reduce the
phase margin of the error amp loop.
If tantalum capacitors are used, it is critical that the capacitors are surge tested for use in switching power supplies.
An excellent choice is the AVX TPS series of surface mount
tantalum. These are specially constructed and tested for low
ESR so they give the lowest ESR for a given volume. Other
To improve the frequency response of the main control
loop, a feedback capacitor (CF) may also be used. Great
care should be taken to route the VFB line away from noise
sources, such as the inductor or the SW line.
3619bfa
12
LTC3619B
Applications Information
Checking Transient Response
The regulator loop response can be checked by looking
at the load transient response. Switching regulators take
several cycles to respond to a step in load current. When
a load step occurs, VOUT immediately shifts by an amount
equal to DILOAD • ESR, where ESR is the effective series
resistance of COUT. DILOAD also begins to charge or discharge COUT generating a feedback error signal used by the
regulator to return VOUT to its steady-state value. During
this recovery time, VOUT can be monitored for overshoot
or ringing that would indicate a stability problem.
The initial output voltage step may not be within the
bandwidth of the feedback loop, so the standard second
order overshoot/DC ratio cannot be used to determine the
phase margin. In addition, feedback capacitors (CF1 and
CF2) can be added to improve the high frequency response,
as shown in Figure 2. Capacitor CF provides phase lead by
creating a high frequency zero with R2 which improves
the phase margin.
The output voltage settling behavior is related to the stability
of the closed-loop system and will demonstrate the actual
overall supply performance. For a detailed explanation of
optimizing the compensation components, including a review of control loop theory, refer to Application Note 76.
In some applications, a more severe transient can be caused
by switching in loads with large (>1µF) input capacitors.
The discharged input capacitors are effectively put in parallel with COUT, causing a rapid drop in VOUT. No regulator
can deliver enough current to prevent this problem if the
switch connecting the load has low resistance and is driven
quickly. The solution is to limit the turn-on speed of the
load switch driver. A Hot Swap™ controller is designed
specifically for this purpose and usually incorporates current limiting, short-circuit protection, and soft-starting.
Efficiency Considerations
The percent efficiency of a switching regulator is equal to
the output power divided by the input power times 100%.
It is often useful to analyze individual losses to determine
what is limiting the efficiency and which change would
produce the most improvement. Percent efficiency can
be expressed as:
% Efficiency = 100% – (L1 + L2 + L3 + ...)
where L1, L2, etc., are the individual losses as a percentage of input power.
Although all dissipative elements in the circuit produce
losses, four sources usually account for the losses in
LTC3619B circuits: 1) VIN quiescent current, 2) switching
losses, 3) I2R losses, 4) other system losses.
1. The VIN current is the DC supply current given in the
Electrical Characteristics which excludes MOSFET
driver and control currents. VIN current results in a
small (<0.1%) loss that increases with VIN, even at
no load.
2. The switching current is the sum of the MOSFET driver
and control currents. The MOSFET driver current results from switching the gate capacitance of the power
MOSFETs. Each time a MOSFET gate is switched from
low to high to low again, a packet of charge dQ moves
from VIN to ground. The resulting dQ/dt is a current
out of VIN that is typically much larger than the DC bias
current. In continuous mode, IGATECHG = fO(QT + QB),
where QT and QB are the gate charges of the internal
top and bottom MOSFET switches. The gate charge
losses are proportional to VIN and thus their effects
will be more pronounced at higher supply voltages.
3. I2R losses are calculated from the DC resistances of
the internal switches, RSW , and external inductor, RL.
In continuous mode, the average output current flows
through inductor L, but is “chopped” between the internal
top and bottom switches. Thus, the series resistance
looking into the SW pin is a function of both top and
bottom MOSFET RDS(ON) and the duty cycle (DC) as
follows:
RSW = (RDS(ON)TOP) • (DC) + (RDS(ON)BOT) • (1– DC)
The RDS(ON) for both the top and bottom MOSFETs can be
obtained from the Typical Performance Characteristics
curves. Thus, to obtain I2R losses:
I2R losses = IOUT 2 • (RSW + RL)
3619bfa
13
LTC3619B
Applications Information
4. Other “hidden” losses, such as copper trace and internal
battery resistances, can account for additional efficiency
degradations in portable systems. It is very important
to include these “system” level losses in the design of a
system. The internal battery and fuse resistance losses
can be minimized by making sure that CIN has adequate
charge storage and very low ESR at the switching frequency. Other losses, including diode conduction losses
during dead-time, and inductor core losses, generally
account for less than 2% total additional loss.
Thermal Considerations
In a majority of applications, the LTC3619B does not dissipate much heat due to its high efficiency. In the unlikely
event that the junction temperature somehow reaches approximately 150°C, both power switches will be turned off
and the SW node will become high impedance. The goal
of the following thermal analysis is to determine whether
the power dissipated causes enough temperature rise to
exceed the maximum junction temperature (125°C) of the
part. The temperature rise is given by:
TRISE = PD • θJA
where PD is the power dissipated by the regulator and θJA
is the thermal resistance from the junction of the die to
the ambient temperature. The junction temperature, TJ,
is given by:
TJ = TRISE + TAMBIENT
As a worst-case example, consider the case when the
LTC3619B is in dropout on both channels at an input
voltage of 2.7V with a load current of 400mA and 800mA
and an ambient temperature of 70°C. From the Typical
Performance Characteristics graph of Switch Resistance,
the RDS(ON) of the switch is 0.56Ω and 0.33Ω. Therefore,
power dissipated by each channel is:
PD1 = IOUT 2 • RDS(ON) = 90mV
PD2 = IOUT 2 • RDS(ON) = 212mV
Given that the thermal resistance of a properly soldered
DFN package is approximately 40°C/W, the junction
temperature of an LTC3619B device operating in a 70°C
ambient temperature is approximately:
TJ = (0.302W • 40°C/W) + 70°C = 82.1°C
which is well below the absolute maximum junction temperature of 125°C.
PC Board Layout Considerations
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the LTC3619B. These items are also illustrated graphically
in the layout diagrams of Figures 3a and 3b. Check the
following in your layout:
1. Does the capacitor CIN connect to the power VIN (Pin 6)
and GND (Pin 11) as closely as possible? This capacitor
provides the AC current of the internal power MOSFETs
and their drivers.
2. Are the respective COUT and L closely connected? The
(–) plate of COUT returns current to GND and the (–)
plate of CIN.
3. The resistor divider, R1 and R2, must be connected
between the (+) plate of COUT1 and a ground sense
line terminated near GND (Pin 11). The feedback signals VFB1 and VFB2 should be routed away from noisy
components and traces, such as the SW lines (Pins 5
and 7), and their trace length should be minimized.
4. Keep sensitive components away from the SW pins, if
possible. The input capacitor CIN, CLIM and the resistors
R1, R2, R3 and R4 and RLIM should be routed away
from the SW traces and the inductors.
5. A ground plane is preferred, but if not available, keep
the signal and power grounds segregated with small
signal components returning to the GND pin at a single
point. These ground traces should not share the high
current path of CIN or COUT.
6. Flood all unused areas on all layers with copper.
Flooding with copper will reduce the temperature rise
of power components. These copper areas should be
connected to VIN or GND.
3619bfa
14
LTC3619B
Applications Information
VIN
2.5V TO 5.5V
RUN2 VIN RUN1
C1
PGOOD2 PGOOD1
L2
SW2
CF2
VOUT2
R4
COUT2
L1
SW1
VFB1
VFB2
RLIM
R3
RLIM
VOUT1
CF1
LTC3619B
GND
R1
R2
COUT1
CLIM
3619B F03a
BOLD LINES INDICATE HIGH CURRENT PATHS
Figure 3a. LTC3619B Layout Diagram (See Board Layout Checklist)
VIN
VOUT1
GND
VIN VIA
COUT1
GND VIA
CIN
L2
VOUT2
VIN
SW2
PGOOD2
RUN2
VFB2
COUT2
L1
SW1
PGD1
RLIM
RUN1
VFB1
R3
R1
R4
R2
CF2
CF1
RLIM
CLIM
VIA TO VOUT1
VIA TO VOUT2
GND
3619B F03b
Figure 3b. LTC3619B Suggested Layout
3619bfa
15
LTC3619B
Applications Information
Design Example
As a design example, consider using the LTC3619B in a
USB-GSM application, with VIN = 5V, IINMAX = 500mA, with
the output of channel 2 charging a SuperCap of 4.4mF. The
load on each channel requires a maximum of 400mA and
800mA in active mode and 2mA in standby mode. The
output voltages are VOUT1 = 1.8V and VOUT2 = 3.4V.
Start with channel 1. First, calculate the inductor value
for about 40% ripple current (160mA in this example) at
maximum VIN. Using a derivation of Equation 1:
resistors should be kept small. Choosing 10µA with the
0.6V feedback voltage makes R1~60k. A close standard
1% resistor is 59k. Using Equation 2.
V

R2 =  OUT − 1 • R1= 118k
 0.6

An optional 22pF feedback capacitor (CF1) may be used
to improve transient response.
Using the same analysis for channel 2 (VOUT2 = 3.4V),
the results are:
1.8V
 1.8V 
•  1−
 = 3.2µH
2.25MHz • (160mA) 
5V 
L2 = 1.5µH
For the inductor, use the closest standard value of
3.3µH.
R4 = 276k
L1=
R3 = 59k
A 10µF ceramic capacitor should be more than sufficient
for this output capacitor. As for the input capacitor, a
typical value of CIN = 10µF should suffice, if the source
impedance is very low.
The feedback resistors program the output voltage. To
maintain high efficiency at light loads, the current in these
VIN
USB INPUT 5V
CIN
10µF
RUN2 VIN RUN1
PGOOD2 PGOOD1
L2
1.5µH
VOUT2
3.4V AT
800mA
+
L1
3.3µH
LTC3619B
SW2
SW1
R4
276k
COUT2
2.2mF
s2
SuperCap
A feed forward capacitor is not used on channel 2 since
the 4.4mF SuperCap will inhibit any fast output voltage
transients. Figure 4 shows the complete schematic for
this example, along with the efficiency curve and transient
response. Input current limit is set at 475mA average current, RLIM = 116k, CLIM = 2200pF. See Programming Input
Current Limit section for selecting RLIM and Selection of
CLIM Capacitance section for CLIM.
R3
59k
VFB2
RLIM
RLIM
116k
CF1, 22pF
VFB1
R1
R2
59k 118k
GND
VOUT1
1.8V AT
400mA
COUT1
10µF
3619B F04a
CLIM
2200pF
ILIM = 475mA
CIN, COUT1: AVX 08056D106KAT2A
COUT2: VISHAY 592D228X96R3X2T20H
L1: COILCRAFT LPS4012-332ML
L2: COILCRAFT LPS4012-152ML
Figure 4a. Design Example Circuit
3619bfa
16
LTC3619B
Applications Information
80
1
60
0.1
50
40
30
0.01
20
10
0
0.0001
1
70
60
0.1
50
40
30
0.01
20
VIN = 3.6V
VIN = 4.2V
VIN = 5V
10
VOUT = 1.8V
0.001
0.01
0.1
OUTPUT CURRENT (A)
10
VOUT = 3.4V
1
0.001
POWER LOSS (W)
70
90
POWER LOSS (W)
EFFICIENCY (%)
80
100
10
VIN = 2.7V
VIN = 3.6V
VIN = 4.2V
VIN = 5V
90
EFFICIENCY (%)
100
0
0.0001
0.001
0.01
0.1
OUTPUT CURRENT (A)
1
0.001
3619B F04b
Figure 4b. Efficiency vs Output Current
VOUT
200mV/DIV
VOUT
100mV/DIV
AC-COUPLED
VIN
1V/DIV
AC-COUPLED
IL
500mA/DIV
IOUT
500mA/DIV
ILOAD
500mA/DIV
IIN
500mA/DIV
1ms/DIV
20µs/DIV
VIN = 5V, 500mA COMPLIANT
RLIM = 116kΩ, CLIM = 2200pF
ILOAD = 0A TO 2A, COUT = 4.4mF, VOUT = 3.4V
ILIM = 475mA, CHANNEL 1 NOT LOADED
VIN = 5V, VOUT = 1.8V
ILOAD = 40mA TO 400mA
CL = 10µF
3619B F04c
Figure 4c. Transient Response
3619bfa
17
LTC3619B
Package Description
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699 Rev B)
R = 0.125
TYP
0.40 p 0.10
6
10
5
1
0.70 p0.05
3.55 p0.05
1.65 p0.05
2.15 p0.05 (2 SIDES)
3.00 p0.10
(4 SIDES)
PACKAGE
OUTLINE
0.25 p 0.05
1.65 p 0.10
(2 SIDES)
PIN 1
TOP MARK
(SEE NOTE 6)
0.75 p0.05
0.200 REF
0.50
BSC
2.38 p0.05
(2 SIDES)
0.00 – 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
(DD) DFN REV B 0309
0.25 p 0.05
0.50 BSC
2.38 p0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
MSE Package
10-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev C)
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.794 p 0.102
(.110 p .004)
5.23
(.206)
MIN
0.889 p 0.127
(.035 p .005)
1
0.05 REF
10
3.00 p 0.102
(.118 p .004)
(NOTE 3)
DETAIL “B”
CORNER TAIL IS PART OF
DETAIL “B” THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
10 9 8 7 6
DETAIL “A”
0o – 6o TYP
1 2 3 4 5
GAUGE PLANE
0.53 p 0.152
(.021 p .006)
DETAIL “A”
0.18
(.007)
0.497 p 0.076
(.0196 p .003)
REF
3.00 p 0.102
(.118 p .004)
(NOTE 4)
4.90 p 0.152
(.193 p .006)
0.254
(.010)
0.29
REF
1.83 p 0.102
(.072 p .004)
2.083 p 0.102 3.20 – 3.45
(.082 p .004) (.126 – .136)
0.50
0.305 p 0.038
(.0197)
(.0120 p .0015)
BSC
TYP
RECOMMENDED SOLDER PAD LAYOUT
2.06 p 0.102
(.081 p .004)
SEATING
PLANE
0.86
(.034)
REF
1.10
(.043)
MAX
0.17 – 0.27
(.007 – .011)
TYP
0.50
(.0197)
BSC
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.1016 p 0.0508
(.004 p .002)
MSOP (MSE) 0908 REV C
3619bfa
18
LTC3619B
Revision History
REV
DATE
DESCRIPTION
PAGE NUMBER
A
4/10
Changes to Temperature Range in Order Information Section
2
Updates in the Electrical Characteristics Table
3
Edit on Y-Axis on Graph G18
5
Updated DD Package Drawing
18
3619bfa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
19
LTC3619B
Typical Applications
Dual 400mA/800mA Buck Converter, ILIM = 500mA
VIN
3.3V TO 5.5V
C1
10µF
RUN2 VIN RUN1
L2
1.5µH
VOUT2
3.3V AT
800mA
R4
1150k
+
COUT2
2.2mF
s2
SuperCap
PGOOD2 PGOOD1
L1
3.3µH
LTC3619B
SW2
SW1
VFB2
R3
RLIM
255k
RLIM
110k
CF1, 22pF
VFB1
R2
R1
255k 511k
GND
VOUT1
1.8V AT
400mA
COUT1
10µF
3619B TA02
CLIM
1000pF
L1: COILCRAFT LPS4012-332ML
L2: COILCRAFT LPS4012-152ML
C1, COUT1: AVX 08056D106KAT2A
COUT2: VISHAY 592D228X96R3X2T20H
Dual 400mA/800mA Buck Converter, ILIM = 475mA or Disabled
VIN
3.3V TO 5.5V
C1
10µF
RUN2 VIN RUN1
L2
1.5µH
VOUT2
3.3V AT
800mA
R4
1150k
+
COUT2
2.2mF
s2
SuperCap
ILIM
DISABLE
PGOOD2 PGOOD1
L1
3.3µH
LTC3619B
SW2
SW1
VFB2
R3
RLIM
255k
RLIM
116k
C1, COUT1: AVX 08056D106KAT2A
COUT2: VISHAY 592D228X96R3X2T20H
CF1, 22pF
VFB1
R2
R1
255k 511k
GND
CLIM
2200pF
VOUT1
1.8V AT
400mA
COUT1
10µF
3619B TA03
L1: COILCRAFT LPS4012-332ML
L2: COILCRAFT LPS4012-152ML
Related Parts
PART NUMBER
LTC3619
LTC3127
LTC3125
LTC3417A/
LTC3417A-2
LTC3407A/
LTC3407A-2
LTC3548/LTC3548-1/
LTC3548-2
LTC3546
DESCRIPTION
Dual 400mA and 800mA IOUT, 2.25MHz,
Synchronous Step-Down DC/DC Converter
1.2A IOUT, 1.6MHz, Synchronous Buck-Boost DC/DC
Converter with Adjustable Input Current Limit
1.2A IOUT, 1.6MHz, Synchronous Boost DC/DC
Converter with Adjustable Input Current Limit
Dual 1.5A/1A, 4MHz, Synchronous Step-Down
DC/DC Converter
Dual 600mA/600mA, 1.5MHz, Synchronous
Step-Down DC/DC Converter
Dual 400mA and 800mA IOUT, 2.25MHz,
Synchronous Step-Down DC/DC Converter
Dual 3A/1A, 4MHz, Synchronous Step-Down
DC/DC Converter
COMMENTS
95% Efficiency, VIN(MIN) = 2.5V, VIN(MAX) = 5.5V, VOUT(MIN) = 0.6V,
IQ = 50µA, ISD < 1µA, MS10E, 3mm × 3mm DFN-10
94% Efficiency, VIN(MIN) = 1.8V, VIN(MAX) = 5.5V, VOUT(MAX) = 5.25V,
IQ = 18µA, ISD < 1µA, 3mm × 3mm DFN-MSOP10E
94% Efficiency, VIN(MIN) = 1.8V, VIN(MAX) = 5.5V, VOUT(MAX) = 5.25V,
IQ = 15µA, ISD < 1µA, 2mm × 3mm DFN-8
95% Efficiency, VIN(MIN) = 2.3V, VIN(MAX) = 5.5V, VOUT(MIN) = 0.8V,
IQ = 125µA, ISD = <1µA, TSSOP-16E, 3mm × 5mm DFN-16
95% Efficiency, VIN(MIN) = 2.5V, VIN(MAX) = 5.5V, VOUT(MIN) = 0.6V,
IQ = 40µA, ISD = <1µA, MS10E, 3mm × 3mm DFN-10
95% Efficiency, VIN(MIN) = 2.5V, VIN(MAX) = 5.5V, VOUT(MIN) = 0.6V,
IQ = 40µA, ISD = <1µA, MS10E, 3mm × 3mm DFN-10
95% Efficiency, VIN(MIN) = 2.3V, VIN(MAX) = 5.5V, VOUT(MIN) = 0.6V,
IQ = 160µA, ISD = <1µA, 4mm × 5mm QFN-28
3619bfa
20 Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com
LT 0410 REV A • PRINTED IN USA
 LINEAR TECHNOLOGY CORPORATION 2009