Material Content Data Sheet Sales Product Name TLE4964-4M Issued MA# MA001069900 Package PG-SOT23-3-15 28. August 2013 Weight* 9.82 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon silicon titanium chromium copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7440-21-3 7440-32-6 7440-47-3 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 0.350 3.56 0.001 0.01 0.004 0.04 367 0.011 0.11 1101 3.590 36.56 36.72 365588 367129 0.019 0.19 0.19 1890 1890 0.054 0.55 1.153 11.75 4.157 42.32 54.62 423369 546283 0.150 1.52 1.52 15240 15240 0.149 1.51 1.51 15132 15132 0.032 0.33 wire encapsulation leadfinish plating glue *deviation 0.152 1.55 Sum [%] Average Mass [ppm] Sum [ppm] 3.56 35595 35595 73 5463 117451 3278 1.88 15453 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 18731 1000000