TI1 ADC12040CIVY/NOPB 12-bit, 40 msps, 340mw a/d converter with internal sample-and-hold Datasheet

ADC12040
www.ti.com
SNAS135G – FEBRUARY 2001 – REVISED MARCH 2013
ADC12040 12-Bit, 40 MSPS, 340mW A/D Converter with Internal Sample-and-Hold
Check for Samples: ADC12040
FEATURES
DESCRIPTION
•
•
•
•
The ADC12040 is a monolithic CMOS analog-todigital converter capable of converting analog input
signals into 12-bit digital words at 40 Megasamples
per second (MSPS), minimum. This converter uses a
differential, pipeline architecture with digital error
correction and an on-chip sample-and-hold circuit to
minimize die size and power consumption while
providing excellent dynamic performance. Operating
on a single 5V power supply, this device consumes
just 340 mW at 40 MSPS, including the reference
current. The Power Down feature reduces power
consumption to 40 mW.
1
2
•
•
Single +5V Supply Operation
Internal Sample-and-Hold
Outputs 2.35V to 5V Compatible
Pin Compatible with ADC12010, ADC12020,
ADC12L063, ADC12L066
Power Down Mode
On-Chip Reference Buffer
APPLICATIONS
•
•
•
•
•
•
•
•
Ultrasound and Imaging
Instrumentation
Cellular Base Stations/Communications
Receivers
Sonar/Radar
xDSL
Wireless Local Loops/Cable Modems
HDTV/DTV
DSP Front Ends
KEY SPECIFICATIONS
•
•
•
•
•
The differential inputs provide a full scale differential
input swing equal to 2VREF with the possibility of a
single-ended input, although full use of the differential
input is required for optimum performance. For ease
of use, the buffered, high impedance, single-ended
reference input is converted on-chip to a differential
reference for use by the processing circuitry. Output
data format is 12-bit offset binary.
This device is available in the 32-lead LQFP package
and will operate over the industrial temperature range
of −40°C to +85°C.
Supply Voltage: +5V ±5%
DNL: ±0.4 LSB (typ)
SNR (fIN = 10MHz): 69 dB (typ)
ENOB (fIN = 10MHz): 11.2 bits (typ)
Power Consumption, 40 MHz: 340 mW (typ)
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2013, Texas Instruments Incorporated
ADC12040
SNAS135G – FEBRUARY 2001 – REVISED MARCH 2013
www.ti.com
Connection Diagram
Block Diagram
2
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: ADC12040
ADC12040
www.ti.com
SNAS135G – FEBRUARY 2001 – REVISED MARCH 2013
PIN DESCRIPTIONS AND EQUIVALENT CIRCUITS
Pin No.
Symbol
Equivalent Circuit
Description
ANALOG I/O
2
VIN+
Non-Inverting analog signal Input. With a 2.0V reference voltage, the
ground-referenced input signal level is 2.0 VP-P centered on VCM.
3
VIN−
Inverting analog signal Input. With a 2.0V reference voltage the
ground-referenced input signal level is 2.0 VP-P centered on VCM.
This pin may be connected to VCM for single-ended operation, but a
differential input signal is required for best performance.
VA
1
Reference input. This pin should be bypassed to ground with a 0.1
µF monolithic capacitor. VREF is 2.0V nominal and should be
between 1.0V to 2.4V.
VREF
AGND
31
VRP
32
VRM
30
These pins are high impedance reference bypass pins. Connect a
0.1 µF capacitor from each of these pins to AGND. DO NOT load
these pins.
VRN
DIGITAL I/O
VD
10
CLK
Digital clock input. The input is sampled on the rising edge of CLK.
11
OE
OE is the output enable pin that, when low, enables the TRI-STATE
data output pins. When this pin is high, the outputs are in a high
impedance state.
8
PD
PD is the Power Down input pin. When high, this input puts the
converter into the power down mode. When this pin is low, the
converter is in the active mode.
DGND
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: ADC12040
3
ADC12040
SNAS135G – FEBRUARY 2001 – REVISED MARCH 2013
www.ti.com
PIN DESCRIPTIONS AND EQUIVALENT CIRCUITS (continued)
Pin No.
Symbol
Equivalent Circuit
Description
14–19,
22–27
D0–D11
Digital data output pins that make up the 12-bit conversion results.
D0 is the LSB, while D11 is the MSB of the offset binary output
word. Output levels are TTL/CMOS compatible.
5, 6, 29
VA
Positive analog supply pins. These pins should be connected to a
quiet +5V voltage source and bypassed to ground with 0.1 µF
monolithic capacitors located within 1 cm of these power pins, and
with a 10 µF capacitor.
4, 7, 28
AGND
ANALOG POWER
The ground return for the analog supply.
DIGITAL POWER
13
VD
9, 12
DGND
Positive digital supply pin. This pin should be connected to the same
quiet +5V source as is VA and bypassed to ground with a 0.1 µF
monolithic capacitor in parallel with a 10 µF capacitor, both located
within 1 cm of the power pin.
The ground return for the digital supply.
21
VDR
Positive digital supply pin for the ADC12040's output drivers. This
pin should be connected to a voltage source of +2.35V to +5V and
be bypassed to DR GND with a 0.1 µF monolithic capacitor. If the
supply for this pin is different from the supply used for VA and VD, it
should also be bypassed with a 10 µF tantalum capacitor. VDR
should never exceed the voltage on VD. All bypass capacitors should
be located within 1 cm of the supply pin.
20
DR GND
The ground return for the digital supply for the ADC12040's output
drivers. This pin should be connected to the system ground, but not
be connected in close proximity to the ADC12040's DGND or AGND
pins. See LAYOUT AND GROUNDING for more details.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
4
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: ADC12040
ADC12040
www.ti.com
SNAS135G – FEBRUARY 2001 – REVISED MARCH 2013
Absolute Maximum Ratings
(1) (2) (3)
VA, VD, VDR
6.5V
≤ 100 mV
|VA–VD|
−0.3V to (VA or VD +0.3V)
Voltage on Any Input or Output Pin
Input Current at Any Pin
(4)
±25 mA
(4)
Package Input Current
±50 mA
Package Dissipation at TA = 25°C
See
(5)
ESD Susceptibility
Human Body Model
Machine Model
(6)
2500V
(6)
Soldering Temperature,
250V
Infrared, 10 sec.
(7)
235°C
−65°C to +150°C
Storage Temperature
(1)
(2)
(3)
(4)
(5)
(6)
(7)
All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified.
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND, or VIN > VA), the current at that pin should be
limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies
with an input current of 25 mA to two. This note does not apply to any power or ground pin.
The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by
TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature, (TA), and can be calculated using the formula
PDMAX = (TJmax - TA )/θJA. The values for maximum power dissipation listed above will be reached only when the device is operated in
a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is
reversed). Obviously, such conditions should always be avoided.
Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through 0Ω.
The 235°C reflow temperature refers to infrared reflow. For Vapor Phase Reflow (VPR), the following Conditions apply: Maintain the
temperature at the top of the package body above 183°C for a minimum 60 seconds. The temperature measured on the package body
must not exceed 220°C. Only one excursion above 183°C is allowed per reflow cycle.
Operating Ratings
(1) (2)
Operating Temperature
−40°C ≤ TA ≤ +85°C
Supply Voltage (VA, VD)
+4.75V to +5.25V
Output Driver Supply (VDR)
+2.35V to VD
VREF Input
1.0V to 2.2V
VCM Input
0.5V to 3.0V
−0.05V to (VD + 0.05V)
CLK, PD, OE
−0V to (VA − 1.0V)
VIN Input
≤100mV
|AGND–DGND|
(1)
(2)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified.
Package Thermal Resistance
Package
θJA
32-Lead LQFP
79°C / W
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: ADC12040
5
ADC12040
SNAS135G – FEBRUARY 2001 – REVISED MARCH 2013
www.ti.com
Converter Electrical Characteristics
Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +5V, VDR =
+3.0V, PD = 0V, VREF = +2.0V, fCLK = 40 MHz, tr = tf = 3 ns, CL = 20 pF/pin. Boldface limits apply for TA = TJ = TMIN to TMAX:
all other limits TA = TJ = 25°C (1) (2) (3)
Symbol
Parameter
Conditions
Typical
(4)
Limits
(4)
Units
(Limits)
STATIC CONVERTER CHARACTERISTICS
12
Bits (min)
INL
Resolution with No Missing Codes
Integral Non Linearity
(5)
±0.7
±1.8
LSB (max)
DNL
Differential Non Linearity
±0.4
±1.0
LSB (max)
GE
Gain Error
±0.1
±2.1
%FS (max)
Offset Error (VIN+ = VIN−)
%FS (max)
−0.1
±0.9
Under Range Output Code
0
0
Over Range Output Code
4095
4095
DYNAMIC CONVERTER CHARACTERISTICS
FPBW
SNR
Full Power Bandwidth
Signal-to-Noise Ratio
SINAD
Signal-to-Noise and Distortion
ENOB
Effective Number of Bits
THD
Total Harmonic Distortion
SFDR
Spurious Free Dynamic Range
IMD
Intermodulation Distortion
0 dBFS Input, Output at −3 dB
100
MHz
fIN 1 MHz, VIN−0.5 dBFS
70
dB
fIN = 10 MHz, VIN = −0.5 dBFS
69.5
fIN = 1 MHz, VIN = −0.5 dBFS
69.5
fIN = 10 MHz, VIN = −0.5 dBFS
69
fIN = 1 MHz, VIN = −0,5 dBFS
11.2
fIN = 10 MHz, VIN = −0,5 dBFS
11.2
fIN = 1 MHz, VIN = −0,5 dBFS
−82
fIN = 10 MHz, VIN = −0,5 dBFS
−80
fIN = 1 MHz, VIN = −0,5 dBFS
86
fIN = 10 MHz, VIN = −0.5 dBFS
84
fIN = 9.5 MHz and 10.5 MHz, each = −8
dBFS
−75
66.5
dB (min)
66
dB (min)
dB
Bits
10.7
Bits (min)
−67
dB (max)
68
dB (min)
dB
dB
dBFS
REFERENCE AND ANALOG INPUT CHARACTERISTICS
VCM
Common Mode Input Voltage
CIN
VIN Input Capacitance (each pin to GND)
VREF
Reference Voltage
VIN = 2.5 Vdc + 0.7 Vrms
VA/2
V
(CLK LOW)
8
pF
(CLK HIGH)
7
(6)
2.00
Reference Input Resistance
(1)
(2)
(3)
(4)
(5)
(6)
6
100
pF
1.0
V (min)
2.2
V (max)
MΩ (min)
The inputs are protected as shown below. Input voltage magnitudes above VA or below GND will not damage this device, provided
current is limited per (). However, errors in the A/D conversion can occur if the input goes above VA or below GND by more than 100
mV. As an example, if VA is 4.75V, the full-scale input voltage must be ≤4.85V to ensure accurate conversions. See Figure 1
To ensure accuracy, it is required that |VA–VD| ≤ 100 mV and separate bypass capacitors are used at each power supply pin.
With the test condition for VREF = +2.0V (4VP-P differential input), the 12-bit LSB is 977 µV.
Typical figures are at TA = TJ = 25°C, and represent most likely parametric norms. Test limits are specified to TI's AOQL (Average
Outgoing Quality Level).
Integral Non Linearity is defined as the deviation of the analog value, expressed in LSBs, from the straight line that passes through
positive and negative full-scale.
Optimum performance will be obtained by keeping the reference input in the 1.8V to 2.2V range. The LM4051CIM3-ADJ (SOT-23
package) is recommended for this application.
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: ADC12040
ADC12040
www.ti.com
SNAS135G – FEBRUARY 2001 – REVISED MARCH 2013
DC and Logic Electrical Characteristics
Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +5V, VDR =
+3.0V, PD = 0V, VREF = +2.0V, fCLK = 40 MHz, tr = tf = 3 ns, CL = 20 pF/pin. Boldface limits apply for TA = TJ = TMIN to TMAX:
all other limits TA = TJ = 25°C (1) (2) (3)
Symbol
Parameter
Conditions
Typical
(4)
Limits
(5)
Units
(Limits)
CLK, PD, OE DIGITAL INPUT CHARACTERISTICS
VIN(1)
Logical “1” Input Voltage
VD = 5.25V
2.0
V (min)
VIN(0)
Logical “0” Input Voltage
VD = 4.75V
1.0
V (max)
IIN(1)
Logical “1” Input Current
VIN = 5.0V
10
µA
IIN(0)
Logical “0” Input Current
VIN = 0V
−10
µA
CIN
Digital Input Capacitance
5
pF
D0–D11 DIGITAL OUTPUT CHARACTERISTICS
VOUT(1)
Logical “1” Output Voltage
IOUT = −0.5 mA
VOUT(0)
Logical “0” Output Voltage
IOUT = 1.6 mA, VDR = 3V
IOZ
TRI-STATE Output Current
+ISC
Output Short Circuit Source Current
−ISC
Output Short Circuit Sink Current
VDR = 2.5V
2.3
V (min)
VDR = 3V
2.7
V (min)
0.4
V (max)
VOUT = 2.5V or 5V
100
nA
VOUT = 0V
−100
nA
VOUT = 0V
−20
mA (min)
VOUT = VDR
20
mA (min)
POWER SUPPLY CHARACTERISTICS
IA
Analog Supply Current
PD Pin = DGND, VREF = 2.0V
PD Pin = VDR
59
8
66
mA (max)
mA
ID
Digital Supply Current
PD Pin = DGND
PD Pin = VDR, fCLK = 0
6
0
7.3
mA (max)
mA
Digital Output Supply Current
PD Pin = DGND, CL = 0 pF
PD Pin = VDR, fCLK = 0
(6)
IDR
3
0
PD Pin = DGND, CL = 0 pF
PD Pin = VDR, fCLK = 0
(7)
Total Power Consumption
340
40
PSRR1
Power Supply Rejection
Rejection of Full-Scale Error with
VA = 4.75V vs. 5.25V
58
dB
PSRR2
Power Supply Rejection
SNR Degradation w/10 MHz,
200 mVP-P riding on VA
50
dB
(1)
(2)
(3)
(4)
(5)
(6)
(7)
mA (max)
mA
366
mW
mW
The inputs are protected as shown below. Input voltage magnitudes above VA or below GND will not damage this device, provided
current is limited per (). However, errors in the A/D conversion can occur if the input goes above VA or below GND by more than 100
mV. As an example, if VA is 4.75V, the full-scale input voltage must be ≤4.85V to ensure accurate conversions. See Figure 1
To ensure accuracy, it is required that |VA–VD| ≤ 100 mV and separate bypass capacitors are used at each power supply pin.
With the test condition for VREF = +2.0V (4VP-P differential input), the 12-bit LSB is 977 µV.
Typical figures are at TA = TJ = 25°C, and represent most likely parametric norms. Test limits are specified to TI's AOQL (Average
Outgoing Quality Level).
Typical figures are at TA = TJ = 25°C, and represent most likely parametric norms. Test limits are specified to TI's AOQL (Average
Outgoing Quality Level).
IDR is the current consumed by the switching of the output drivers and is primarily determined by load capacitance on the output pins,
the supply voltage, VDR, and the rate at which the outputs are switching (which is signal dependent). IDR=VDR(C0 x f0 + C1 x f1 +....C11 x
f11) where VDR is the output driver power supply voltage, Cn is total capacitance on the output pin, and fn is the average frequency at
which that pin is toggling.
Excludes IDR. See previous note.
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: ADC12040
7
ADC12040
SNAS135G – FEBRUARY 2001 – REVISED MARCH 2013
www.ti.com
AC Electrical Characteristics
Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +5V, VDR =
+3.0V, PD = 0V, VREF = +2.0V, fCLK = 40 MHz, tr = tf = 3 ns, CL = 20 pF/pin. Boldface limits apply for TA = TJ = TMIN to TMAX:
all other limits TA = TJ = 25°C (1) (2) (3) (4)
Symbol
Parameter
Conditions
Typical
Limits
(5)
Units
(Limits)
40
MHz (min)
ns (min)
(5)
fCLK1
Maximum Clock Frequency
50
fCLK
Minimum Clock Frequency
100
tCH
Clock High Time
11.25
tCL
Clock Low Time
11.25
ns (min)
tCONV
Conversion Latency
6
Clock Cycles
16.3
ns (max)
15.9
ns (max)
15.7
ns (max)
14.9
ns (max)
2
VDR = 2.5V, −45°C < TA < +85°C
VDR = 2.5V, TA = +25°C
12
kHz
tOD
Data Output Delay after Rising CLK Edge
tAD
Aperture Delay
1.2
ns
tAJ
Aperture Jitter
1.2
ps rms
tDIS
Data outputs into TRI-STATE Mode
4
ns
tEN
Data Outputs Active after TRI-STATE
4
ns
tPD
Power Down Mode Exit Cycle
20
tCLK
VDR = 3.0V, −45°C < TA < +85°C
VDR = 3.0V, TA = +25°C
(1)
(2)
(3)
(4)
(5)
11
The inputs are protected as shown below. Input voltage magnitudes above VA or below GND will not damage this device, provided
current is limited per (). However, errors in the A/D conversion can occur if the input goes above VA or below GND by more than 100
mV. As an example, if VA is 4.75V, the full-scale input voltage must be ≤4.85V to ensure accurate conversions. See Figure 1
To ensure accuracy, it is required that |VA–VD| ≤ 100 mV and separate bypass capacitors are used at each power supply pin.
With the test condition for VREF = +2.0V (4VP-P differential input), the 12-bit LSB is 977 µV.
Timing specifications are tested at TTL logic levels, VIL = 0.4V for a falling edge and VIH = 2.4V for a rising edge.
Typical figures are at TA = TJ = 25°C, and represent most likely parametric norms. Test limits are specified to TI's AOQL (Average
Outgoing Quality Level).
Figure 1.
Specification Definitions
APERTURE DELAY is the time after the rising edge of the clock to when the input signal is acquired or held for
conversion.
APERTURE JITTER (APERTURE UNCERTAINTY) is the variation in aperture delay from sample to sample.
Aperture jitter manifests itself as noise in the output.
CLOCK DUTY CYCLE is the ratio of the time during one cycle that a repetitive digital waveform is high to the
total time of one period. The specification here refers to the ADC clock input signal.
COMMON MODE VOLTAGE (VCM) is the d.c. potential present at both signal inputs to the ADC.
8
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: ADC12040
ADC12040
www.ti.com
SNAS135G – FEBRUARY 2001 – REVISED MARCH 2013
CONVERSION LATENCY See PIPELINE DELAY.
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1
LSB.
EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE BITS) is another method of specifying Signal-to-Noise
and Distortion or SINAD. ENOB is defined as (SINAD - 1.76) / 6.02 and says that the converter is equivalent to a
perfect ADC of this (ENOB) number of bits.
FULL POWER BANDWIDTH is a measure of the frequency at which the reconstructed output fundamental
drops 3 dB below its low frequency value for a full scale input.
GAIN ERROR is the deviation from the ideal slope of the transfer function. It is the difference between the
Positive Full Scale Error and the Negative Full Scale Error:
Gain Error = Pos. Full Scale Error − Neg. Full Scale Error
(1)
INTEGRAL NON LINEARITY (INL) is a measure of the deviation of each individual code from a line drawn from
negative full scale (½ LSB below the first code transition) through positive full scale (½ LSB above the last code
transition). The deviation of any given code from this straight line is measured from the center of that code value.
INTERMODULATION DISTORTION (IMD) is the creation of additional spectral components as a result of two
sinusoidal frequencies being applied to the ADC input at the same time. It is defined as the ratio of the power in
the intermodulation products to the total power in the original frequencies. IMD is usually expressed in dBFS.
MISSING CODES are those output codes that will never appear at the ADC outputs. The ADC12040 is ensured
not to have any missing codes.
NEGATIVE FULL SCALE ERROR is the difference between the actual first code transition and its ideal value of
½ LSB above negative full scale (−VREF).
OFFSET ERROR is the difference between the two input voltages [ (VIN+) – (VIN−) ] required to cause a
transition from code 2047 to 2048.
OUTPUT DELAY is the time delay after the rising edge of the clock before the data update is presented at the
output pins.
PIPELINE DELAY (LATENCY) is the number of clock cycles between initiation of conversion and when that data
is presented to the output driver stage. Data for any given sample is available at the output pins the Pipeline
Delay plus the Output Delay after the sample is taken. New data is available at every clock cycle, but the data
lags the conversion by the pipeline delay.
POSITIVE FULL SCALE ERROR is the difference between the actual last code transition and its ideal value of
1½ LSB below the reference voltage.
POWER SUPPLY REJECTION RATIO (PSRR) is a measure of how well the ADC rejects a change in the power
supply voltage. For the ADC12040, PSRR1 is the ratio of the change in Full-Scale Error that results from a
change in the d.c. power supply voltage, expressed in dB. PSRR2 is a measure of how well an a.c. signal riding
upon the power supply is rejected at the output.
SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in dB, of the rms value of the input signal to the rms
value of the sum of all other spectral components below one-half the sampling frequency, not including
harmonics or d.c.
SIGNAL TO NOISE PLUS DISTORTION (S/N+D or SINAD) Is the ratio, expressed in dB, of the rms value of the
input signal to the rms value of all of the other spectral components below half the clock frequency, including
harmonics but excluding d.c.
SPURIOUS FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the desired signal
amplitude to the amplitude of the peak spurious spectral component, where a spurious spectral component is
any signal present in the output spectrum that is not present at the input and may or may not be a harmonic.
TOTAL HARMONIC DISTORTION (THD) is the ratio, expressed in dB or dBc, of the rms total of the first nine
harmonic components to the rms value of the input signal. THD is calculated as
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: ADC12040
9
ADC12040
SNAS135G – FEBRUARY 2001 – REVISED MARCH 2013
www.ti.com
where
•
•
F1 is the RMS power of the fundamental (output) frequency
f2 through f10 are the RMS power of the first 9 harmonic frequencies in the output spectrum
(2)
Timing Diagram
Output Timing
Transfer Characteristic
Figure 2. Transfer Characteristic
10
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: ADC12040
ADC12040
www.ti.com
SNAS135G – FEBRUARY 2001 – REVISED MARCH 2013
Typical Performance Characteristics
VA = VD = 5V, VDR = 3V, fCLK = 40 MHz, fIN = 10 MHz unless otherwise stated
DNL
DNL
vs.
VA
Figure 3.
Figure 4.
DNL
vs.
Temperature
DNL
vs.
Clock Duty Cycle
Figure 5.
Figure 6.
INL
INL
vs.
VA
Figure 7.
Figure 8.
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: ADC12040
11
ADC12040
SNAS135G – FEBRUARY 2001 – REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics (continued)
VA = VD = 5V, VDR = 3V, fCLK = 40 MHz, fIN = 10 MHz unless otherwise stated
12
INL
vs.
Temperature
INL
vs.
Clock Duty Cycle
Figure 9.
Figure 10.
SNR
vs.
Temperature
THD
vs.
Temperature
Figure 11.
Figure 12.
SINAD
vs.
Temperature
SNR
vs.
Clock Duty Cycle
Figure 13.
Figure 14.
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: ADC12040
ADC12040
www.ti.com
SNAS135G – FEBRUARY 2001 – REVISED MARCH 2013
Typical Performance Characteristics (continued)
VA = VD = 5V, VDR = 3V, fCLK = 40 MHz, fIN = 10 MHz unless otherwise stated
THD
vs.
Clock Duty Cycle
SINAD and ENOB
vs.
Clock Duty Cycle
Figure 15.
Figure 16.
Spectral Response
IMD @ F1 = 9.5MHz, F2 = 10.5MHz
Figure 17.
Figure 18.
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: ADC12040
13
ADC12040
SNAS135G – FEBRUARY 2001 – REVISED MARCH 2013
www.ti.com
FUNCTIONAL DESCRIPTION
Operating on a single +5V supply, the ADC12040 uses a pipeline architecture and has error correction circuitry
to help ensure maximum performance. The differential analog input signal is digitized to 12 bits.
The reference input is buffered to ease the task of driving that pin and the output word rate is the same as the
clock frequency. The analog input voltage is acquired at the rising edge of the clock and the digital data for a
given sample is delayed by the pipeline for 6 clock cycles.
A logic high on the power down (PD) pin reduces the converter power consumption to 40 mW.
Applications Information
OPERATING CONDITIONS
We recommend that the following conditions be observed for operation of the ADC12040:
4.75V ≤ VA ≤ 5.25V
VD = VA
2.35V ≤ VDR ≤ VD
100 kHz ≤ fCLK ≤ 50 MHz
1.0V ≤ VREF ≤ 2.2V
0.5V ≤ VCM ≤ 3.0V
0V ≤ VIN ≤ (VA − 1.0V)
VREF and VCM must be such that the signal swing remains within the limits of 0V to VA.
Analog Inputs
The ADC12040 has two signal input pins, VIN+ and VIN−, forming a differential input pair, and one reference input
pin, VREF.
Reference Pins
The ADC12040 is designed to operate with a 2.0V reference, but performs well with reference voltages in the
range of 1.0V to 2.2V. Lower reference voltages will decrease the signal-to-noise ratio (SNR). Increasing the
reference voltage (and the input signal swing) beyond 2.2V will degrade THD for a full-scale input
It is important that all grounds associated with the reference voltage and the input signal make connection to the
ground plane at a single point to minimize the effects of noise currents in the ground path.
The three Reference Bypass Pins (VRP, VRM and VRN) are made available for bypass purposes only. These pins
should each be bypassed to ground with a 0.1 µF capacitor. Smaller capacitor values will allow faster recovery
from the power down mode, but may result in degraded noise performance. DO NOT LOAD these pins.
Signal Inputs
The signal inputs are VIN+ and VIN−. The input signal, VIN, is defined as
VIN = (VIN+) – (VIN−)
(3)
Figure 19 shows the expected input signal range.
Note that the common mode input voltage range is 1V to 3V with a nominal value of VA/2. The input signals
should remain between ground and 4V.
The Peaks of the individual input signals (VIN+ and VIN−) should each never exceed the voltage described as
VIN+, VIN− = VREF + VCM ≤ 4V
(4)
to maintain THD and SINAD performance.
14
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: ADC12040
ADC12040
www.ti.com
SNAS135G – FEBRUARY 2001 – REVISED MARCH 2013
Figure 19. Expected Input Signal Range
The ADC12040 performs best with a differential input with each input centered around a VCM. The peak-to-peak
voltage swing at VIN+ and VIN− each should not exceed the value of the reference voltage or the output data will
be clipped. The two input signals should be exactly 180° out of phase from each other and of the same
amplitude. For single frequency inputs, angular errors result in a reduction of the effective full scale input. For a
complex waveform, however, angular errors will result in distortion.
For angular deviations of up to 10 degrees from these two signals being 180 out of phase, the full scale error in
LSB can be described as approximately
EFS = 4096 ( 1 - sin (90° + dev))
where
•
Where dev is the angular difference, in degrees, between the two signals having a 180° relative phase
relationship to each other (see Figure 20)
(5)
Drive the analog inputs with a source impedance less than 100Ω.
Figure 20. Angular Errors Between the Two Input Signals Will Reduce the Output Level
For differential operation, each analog input signal should have a peak-to-peak voltage equal to the input
reference voltage, VREF, and be centered around a common mmode voltage, VCM.
Table 1. Input to Output Relationship – Differential Input
VIN+
VIN−
Output
VCM − VREF/2
VCM + VREF/2
0000 0000 0000
VCM − VREF/4
VCM + VREF/4
0100 0000 0000
VCM
VCM
1000 0000 0000
VCM + VREF/2
VCM − VREF/4
1100 0000 0000
VCM + VREF/2
VCM − VRE/2F
1111 1111 1111
Table 2. Input to Output Relationship – Single-Ended Input
VIN
VIN−
Output
VCM − VREF
VCM
0000 0000 0000
VCM − VREF/2
VCM
0100 0000 0000
VCM
VCM
1000 0000 0000
VCM + VREF/2
VCM
1100 0000 0000
VCM +VREF
VCM
1111 1111 1111
+
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: ADC12040
15
ADC12040
SNAS135G – FEBRUARY 2001 – REVISED MARCH 2013
www.ti.com
Single-Ended Operation
Single-ended performance is lower than with differential input signals. For this reason, single-ended operation is
not recommended. However, if single-ended operation is required, and the resulting performance degradation is
acceptable, one of the analog inputs should be connected to the d.c. common mode voltage of the driven input.
The peak-to-peak differential input signal should be twice the reference voltage to maximize SNR and SINAD
performance (Figure 19(b)). For example, set VREF to 1.0V and bias VIN− to 1.0V and drive VIN+ with a signal
range of 0V to 2.0V.
Because very large input signal swings can degrade distortion performance, better performance with a singleended input can be obtained by reducing the reference voltage while maintaining a full-range output. and indicate
the input to output relationship of the ADC12040.
Driving the Analog Inputs
The VIN+ and the VIN− inputs of the ADC12040 consist of an analog switch followed by a switched-capacitor
amplifier. The capacitance seen at the analog input pins changes with the clock level, appearing as 8 pF when
the clock is low, and 7 pF when the clock is high. Although this difference is small, a dynamic capacitance is
more difficult to drive than is a fixed capacitance, so choose the driving amplifier carefully. The LMH6550, the
LMH6702 and the LMH6628 are a good amplifiers for driving the ADC12040.
The internal switching action at the analog inputs causes energy to be output from the input pins. As the driving
source tries to compensate for this, it adds noise to the signal. To prevent this, use an RC at each of the inputs,
as shown in Figure 22 and Figure 23. These components should be placed close to the ADC because the input
pins of the ADC is the most sensitive part of the system and this is the last opportunity to filter the input. The
capacitors are for Nyquist applications and should be eliminated for undersampling applications.
The LMH6550 and the LMH6552 are excellent devices for driving the ADC12040, especially when single-ended
to differential conversion with d.c. coupling is necessary. An example of the use of the LMH6550 to drive the
analog input of the ADC12040 is shown in Figure 22.
For high frequency, narrow band applications, a transformer is generally the recommended way to drive the
analog inputs, as shown in Figure 23.
Input Common Mode Voltage
The input common mode voltage, VCM, should be in the range indicated in OPERATING CONDITIONS and be of
a value such that the peak excursions of the analog input signal do not go more negative than ground or more
positive than the VA supply voltage. The nominal VCM should generally be equal to VREF/2, but VRM can be used
as a VCM source as long as VRM need not supply more than 10 µA of current. Figure 22 shows the use of the VRM
output to drive the VCM input of the LMH6550. The common mode output voltage of the LMH6550 is equal to the
VCM input input voltage.
DIGITAL INPUTS
The digital TTL/CMOS compatible inputs consist of CLK, OE and PD.
The CLK Input
The CLK signal controls the timing of the sampling process. Drive the clock input with a stable, low jitter clock
signal in the range of 100 kHz to 50 MHz with rise and fall times of less than 3ns. The trace carrying the clock
signal should be as short as possible and should not cross any other signal line, analog or digital, not even at
90°.
If the CLK is interrupted, or its frequency too low, the charge on internal capacitors can dissipate to the point
where the accuracy of the output data will degrade. This is what limits the lowest sample rate to 100 ksps.
The duty cycle of the clock signal can affect the performance of the A/D Converter. Because achieving a precise
duty cycle is difficult, the ADC12040 is designed to maintain performance over a range of duty cycles. While it is
specified and performance is ensured with a 50% clock duty cycle, performance is typically maintained over a
clock duty cycle range of 45% to 55%.
16
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: ADC12040
ADC12040
www.ti.com
SNAS135G – FEBRUARY 2001 – REVISED MARCH 2013
The clock line should be terminated at its source in the characteristic impedance of that line. It is highly desirable
that the the source driving the ADC CLK input only drive that pin. However, if that source is used to drive other
things, each driven pin should be a.c. terminated with a series RC to ground, as shown in Figure 21, such that
the resistor value is equal to the characteristic impedance of the clock line and the capacitor value is
where
•
•
•
tPD is the signal propagation rate down the clock line
"L" is the line length
ZO is the characteristic impedance of the clock line
(6)
This termination should be as close as possible to the ADC clock pin but beyond it as seen from the clock
source. Typical tPD is about 150 ps/inch (60 ps/cm) on FR-4 board material. The units of "L" and tPD should be
the same (inches or centimeters).
Take care to maintain a constant clock line impedance throughout the length of the line. Refer to Application
Note AN-905 (SNLA035) or AN-1113 (SNLA011) for information on setting and determining characteristic
impedance
The OE Input
The OE input, when high, puts the output pins into a high impedance state. When this pin is low the outputs are
in the active state. The ADC12040 will continue to convert whether this input is high or low, but the output can
not be read while the OE pin is high.
The OE input should NOT be used to multiplex devices together to drive a common bus as this will result in
excessive capacitance on the data output pins, reducing SNR and SINAD performance of the converter. See
DATA OUTPUTS.
The PD Input
The PD input, when high, holds the ADC12040 in a power-down mode to conserve power when the converter is
not being used. The power consumption in this state is 70 mW with a 40MHz clock and 40mW if the clock is
stopped. The output data pins are undefined in this mode. The data in the pipeline is corrupted while in the
power down mode.
The Power Down Mode Exit Cycle time is determined by the value of the capacitors on pins 30, 31 and 32.
These capacitors loose their charge in the Power Down mode and must be charged by on-chip circuitry before
conversions can be accurate.
DATA OUTPUTS
The ADC12040 has 12 TTL/CMOS compatible Data Output pins. Valid offset binary data is present at these
outputs while the OE and PD pins are low. While the tOD time provides information about output timing, a simple
way to capture a valid output is to latch the data on the edge of the conversion clock (pin 10). Which edge to use
will depend upon the clock frequency and duty cycle. If the rising edge is used, the tOD time can be used to
determine maximum hold time acceptable of the driven device data inputs. If the falling edge of the clock is used,
care must be taken to be sure that adequate setup and hold times are allowed for capturing the ADC output
data.
Be very careful when driving a high capacitance bus. The more capacitance the output drivers must charge for
each conversion, the more instantaneous digital current flows through VDR and DR GND. These large charging
current spikes can cause on-chip noise that can couple into the analog circuitry, degrading dynamic
performance. Adequate power supply bypassing and careful attention to the ground plane will reduce this
problem. Additionally, bus capacitance beyond that specified will cause tOD to increase, making it difficult to
properly latch the ADC output data. The result could be an apparent reduction in dynamic performance.
To minimize noise due to output switching, minimize the load currents at the digital outputs. This can be done by
connecting buffers (74AC541, for example) between the ADC outputs and any other circuitry. Only one driven
input should be connected to each output pin. Additionally, inserting series 100Ω resistors at the digital outputs,
close to the ADC pins, will isolate the outputs from trace and other circuit capacitances and limit the output
currents, which could otherwise result in performance degradation. See Figure 21.
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: ADC12040
17
ADC12040
SNAS135G – FEBRUARY 2001 – REVISED MARCH 2013
www.ti.com
While the ADC12040 will operate with VDR voltages down to 1.8V, tOD increases with reduced VDR. Be careful of
external timing when using reduced VDR.
CHOKE
+5V
10 PF
330
499
1%
MF
VREF
0.1 PF
5
2.00k
1%
MF
LM4040-2.5
*
29
0.1 PF
0.1 PF
13
VA
21
VD
DRVD
1
*
PD
VREF
31
0.1 PF
*
0.1 mF bypass capacitor, the ground
pin for the LM4040-2.5, the bypass
capacitors on pins 30, 31 and 32 of
the ADC12040 and pin 28 of the
ADC12040 should be connected to
a common point in the analog
ground plane.
6
10 PF
30
0.1 PF
*
VRP
D11 (MSB)
D10
VRN
D9
D8
32
0.1 PF
D7
VRM
*
D6
ADC12040
VCM
D5
2
D4
VIN+
D3
Differential
Drive(A)
SIGNAL
INPUT
D2
D1
3
VIN-
D0 (LSB)
CLK
OE
10
CLOCK
INPUT
Power Down
1 PF
*
* Ground for the 2.00k resistor, the
10 PF
8
27
12 x 100:
26
25
24
74ACQ541
23
22
19
CLK
17
16
15
14
11
74ACQ541
47
AGND
See
Text
4
7
DGND
28
1/4
See 74ACQ04
Text
DRGND
9 12
12 BIT
DATA
OUTPUT
18
20
47
CLK
*
LE
OE
INPUT
See
Figure 21. Simple Application Circuit with Single-Ended to Differential Buffer
511, 1%
47
255, 1%
50:
SIGNAL
INPUT
49.9,
1%
75 pF
VCM
280, 1%
To ADC
VIN-
+
Amplifier:
LMH6550
-
75 pF
511, 1%
To ADC
VIN+
47
+
LMV321
From ADC
VRM Pin
511, 1%
Figure 22. Differential Drive Circuit of Figure 21
18
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: ADC12040
ADC12040
www.ti.com
SNAS135G – FEBRUARY 2001 – REVISED MARCH 2013
Figure 23. Driving the Signal Inputs with a Transformer
POWER SUPPLY CONSIDERATIONS
The power supply pins should be bypassed with a 10 µF capacitor and with a 0.1 µF ceramic chip capacitor
within a centimeter of each power pin. Leadless chip capacitors are preferred because they have low series
inductance.
As is the case with all high-speed converters, the ADC12040 is sensitive to power supply noise. Accordingly, the
noise on the analog supply pin should be kept below 150 mVP-P.
No pin should ever have a voltage on it that is in excess of the supply voltages, not even on a transient basis. Be
especially careful of this during turn on and turn off of power.
The VDR pin provides power for the output drivers and may be operated from a supply in the range of 2.35V to
VD (nominal 5V). This can simplify interfacing to 3V devices and systems. DO NOT operate the VDR pin at a
voltage higher than VD.
LAYOUT AND GROUNDING
Proper grounding and proper routing of all signals are essential to ensure accurate conversion. Maintaining
separate analog and digital areas of the board, with the ADC12040 between these areas, is required to achieve
specified performance.
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: ADC12040
19
ADC12040
SNAS135G – FEBRUARY 2001 – REVISED MARCH 2013
www.ti.com
The ground return for the data outputs (DR GND) carries the ground current for the output drivers. The output
current can exhibit high transients that could add noise to the conversion process. To prevent this from
happening, the DR GND pins should NOT be connected to system ground in close proximity to any of the
ADC12040's other ground pins.
Capacitive coupling between the typically noisy digital circuitry and the sensitive analog circuitry can lead to poor
performance. The solution is to keep the analog circuitry separated from the digital circuitry, and to keep the
clock line as short as possible.
Digital circuits create substantial supply and ground current transients. The logic noise thus generated could
have significant impact upon system noise performance. The best logic family to use in systems with A/D
converters is one which employs non-saturating transistor designs, or has low noise characteristics, such as the
74LS, 74HC(T) and 74AC(T)Q families. The worst noise generators are logic families that draw the largest
supply current transients during clock or signal edges, like the 74F and the 74AC(T) families. In high speed
circuits, however, it is often necessary to use these higher speed devices. Best performance requires careful
attention to PC board layout and to proper signal integrity techniques.
The effects of the noise generated from the ADC output switching can be minimized through the use of 47Ω to
100Ω resistors in series with each data output line. Locate these resistors as close to the ADC output pins as
possible.
Figure 24. Example of a Suitable Layout
Since digital switching transients are composed largely of high frequency components, total ground plane copper
weight will have little effect upon the logic-generated noise. This is because of the skin effect. Total surface area
is more important than is total ground plane volume.
Generally, analog and digital lines should cross each other at 90° to avoid crosstalk. To maximize accuracy in
high speed, high resolution systems, however, avoid crossing analog and digital lines altogether. It is important to
keep clock lines as short as possible and isolated from ALL other lines, including other digital lines. Even the
generally accepted 90° crossing should be avoided with the clock line as even a little coupling can cause
problems at high frequencies. This is because other lines can introduce jitter into the clock line, which can lead to
degradation of SNR. Also, the high speed clock can introduce noise into the analog chain.
Best performance at high frequencies and at high resolution is obtained with a straight signal path. That is, the
signal path through all components should form a straight line wherever possible.
Be especially careful with the layout of inductors. Mutual inductance can change the characteristics of the circuit
in which they are used. Inductors should not be placed side by side, even with just a small part of their bodies
beside each other.
20
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: ADC12040
ADC12040
www.ti.com
SNAS135G – FEBRUARY 2001 – REVISED MARCH 2013
The analog input should be isolated from noisy signal traces to avoid coupling of spurious signals into the input.
Any external component (e.g., a filter capacitor) connected between the converter's input pins and ground or to
the reference input pin and ground should be connected to a very clean point in the ground plane.
Figure 24 gives an example of a suitable layout. A single ground plane is recommended with separate analog
and digital power planes. The analog and digital power planes should NOT overlap each other. All analog
circuitry (input amplifiers, filters, reference components, etc.) should be placed over the analog power plane. All
digital circuitry and I/O lines should be placed over the digital power plane. Furthermore, all components in the
reference circuitry and the input signal chain that are connected to ground should be connected together with
short traces and enter the ground plane at a single point. All ground connections should have a low inductance
path to ground.
DYNAMIC PERFORMANCE
To achieve the best dynamic performance, the clock source driving the CLK input must be free of jitter. Isolate
the ADC clock from any digital circuitry with buffers, as with the clock tree shown in Figure 25.
As mentioned in LAYOUT AND GROUNDING, it is good practice to keep the ADC clock line as short as possible
and to keep it well away from any other signals. Other signals can introduce jitter into the clock signal, which can
lead to reduced SNR performance, and the clock can introduce noise into other lines. Even lines with 90°
crossings have capacitive coupling, so try to avoid even these 90° crossings of the clock line.
Figure 25. Isolating the ADC Clock from other Circuitry with a Clock Tree
COMMON APPLICATION PITFALLS
Driving the inputs (analog or digital) beyond the power supply rails. For proper operation, all inputs should
not go more than 300 mV beyond the supply rails (more than 300 mV below the ground pins or 300 mV above
the supply pins). Exceeding these limits on even a transient basis may cause faulty or erratic operation. It is not
uncommon for high speed digital components (e.g., 74F and 74AC devices) to exhibit overshoot or undershoot
that goes above the power supply or below ground when their output lines are not properly terminated. A resistor
of about 33Ω to 47Ω in series with any offending digital input, close to the signal source, should eliminate the
problem.
Do not allow input voltages to exceed the supply voltage, even on a transient basis. Not even during power up or
power down.
Be careful not to overdrive the inputs of the ADC12040 with a device that is powered from supplies outside the
range of the ADC12040 supply. Such practice may lead to conversion inaccuracies and even to device damage.
Attempting to drive a high capacitance digital data bus. The more capacitance the output drivers must
charge for each conversion, the more instantaneous digital current flows through VDR and DR GND. These large
charging current spikes can couple into the analog circuitry, degrading dynamic performance. Adequate
bypassing and maintaining separate analog and digital areas on the pc board will reduce this problem.
Additionally, bus capacitance beyond that specified will cause tOD to increase, making it difficult to properly latch
the ADC output data. The result could, again, be an apparent reduction in dynamic performance.
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: ADC12040
21
ADC12040
SNAS135G – FEBRUARY 2001 – REVISED MARCH 2013
www.ti.com
The digital data outputs should be buffered (with 74AC541, for example). Dynamic performance can also be
improved by adding series resistors at each digital output, close to the ADC12040, which reduces the energy
coupled back into the converter output pins by limiting the output current. A reasonable value for these resistors
is 100Ω.
Using an inadequate amplifier to drive the analog input. As explained in Signal Inputs, the capacitance seen
at the input alternates between 8 pF and 7 pF, depending upon the phase of the clock. This dynamic load is
more difficult to drive than is a fixed capacitance.
If the amplifier exhibits overshoot, ringing, or any evidence of instability, even at a very low level, it will degrade
performance. A small series resistor and shunt capacitor at each amplifier output (as shown in Figure 22 and
Figure 23) will improve performance. The LMH6550, the LMH6702 and the LMH6628 have been successfully
used to drive the analog inputs of the ADC12040.
Also, it is important that the signals at the two inputs have exactly the same amplitude and be exactly 180º out of
phase with each other. Board layout, especially equality of the length of the two traces to the input pins, will
affect the effective phase between these two signals. Remember that an operational amplifier operated in the
non-inverting configuration will exhibit more time delay than will the same device operating in the inverting
configuration.
Operating with the reference pins outside of the specified range. As mentioned in Reference Pins, VREF
should be in the range of
1.0V ≤ VREF ≤ 2.2V
(7)
Operating outside of these limits could lead to performance degradation.
Using a clock source with excessive jitter, using excessively long clock signal trace, or having other
signals coupled to the clock signal trace. This will cause the sampling interval to vary, causing excessive
output noise and a reduction in SNR and SINAD performance.
22
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: ADC12040
ADC12040
www.ti.com
SNAS135G – FEBRUARY 2001 – REVISED MARCH 2013
REVISION HISTORY
Changes from Revision F (March 2013) to Revision G
•
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 22
Submit Documentation Feedback
Copyright © 2001–2013, Texas Instruments Incorporated
Product Folder Links: ADC12040
23
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
ADC12040CIVY/NOPB
ACTIVE
LQFP
NEY
32
250
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
ADC12040
CIVY
ADC12040CIVYX/NOPB
ACTIVE
LQFP
NEY
32
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
ADC12040
CIVY
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2015
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Dec-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
ADC12040CIVYX/NOPB
Package Package Pins
Type Drawing
LQFP
NEY
32
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
1000
330.0
16.4
Pack Materials-Page 1
9.3
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
9.3
2.2
12.0
16.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Dec-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ADC12040CIVYX/NOPB
LQFP
NEY
32
1000
367.0
367.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
NEY0032A
VF0032A
TYPICAL
VBE32A (Rev F)
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated